WO2013150593A1 - Organic electroluminescent panel and method for producing same - Google Patents

Organic electroluminescent panel and method for producing same Download PDF

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WO2013150593A1
WO2013150593A1 PCT/JP2012/058962 JP2012058962W WO2013150593A1 WO 2013150593 A1 WO2013150593 A1 WO 2013150593A1 JP 2012058962 W JP2012058962 W JP 2012058962W WO 2013150593 A1 WO2013150593 A1 WO 2013150593A1
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organic
transparent conductive
layer
conductive film
film
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PCT/JP2012/058962
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French (fr)
Japanese (ja)
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田中 洋平
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パイオニア株式会社
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • H10K59/80515Anodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/341Short-circuit prevention
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30Coordination compounds
    • H10K85/341Transition metal complexes, e.g. Ru(II)polypyridine complexes
    • H10K85/342Transition metal complexes, e.g. Ru(II)polypyridine complexes comprising iridium

Definitions

  • the present invention relates to an organic EL panel including an organic electroluminescence (hereinafter referred to as organic EL) material in a light emitting layer and a method for manufacturing the same.
  • organic EL organic electroluminescence
  • Organic EL elements are used in display devices as light emitters in which a plurality of functional layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sandwiched between an anode and a cathode.
  • An organic EL panel is a surface light emitter in which an organic EL element is enlarged.
  • a display device composed of a plurality of organic EL elements arranged in a matrix is provided with insulating films such as partition walls and banks in order to partition each element (see Patent Documents 1 to 4).
  • the anode of the organic EL element is often patterned on the substrate by an etching method such as photolithography, and in this case, the edge shape of the anode becomes steep and unstable. Therefore, an insulating film covering the anode edge is necessary for preventing a short circuit between the anode and the cathode and suppressing cathode disconnection.
  • an insulating film covering the anode edge is necessary for preventing a short circuit between the anode and the cathode and suppressing cathode disconnection.
  • the number of steps for forming the insulating film increases, and accordingly, there is a problem that the cost of the organic EL panel cannot be reduced due to an increase in the yield deterioration factor.
  • the present invention has been made in view of such problems, and the problem to be solved by the present invention is to provide an organic EL panel that can be manufactured at low cost and a method for manufacturing the same as an example of the problem. .
  • the organic EL panel of the present invention includes a substrate, a transparent conductive film laminated on the substrate, a functional laminate including at least one light emitting layer laminated on the transparent conductive film, and the functional laminate.
  • the manufacturing method of the present invention for manufacturing the organic EL panel includes a substrate, a transparent conductive film laminated on the substrate, and at least one light emitting layer laminated on the transparent conductive film.
  • At least one layer of the functional laminate is formed by a wet coating method so as to cover the side surface of the film.
  • FIG. 2 is a partial cross-sectional view taken along line AA in FIG. 1. It is sectional drawing which shows the board
  • FIG. 1 is a perspective partially cutaway plan view of a portion of the organic EL panel of the embodiment as viewed from the upper surface on the cathode side
  • FIG. 2 is a partial cross-sectional view showing a cross section of the organic EL panel taken along line AA in FIG. is there.
  • the organic EL panel includes a transparent anode 2 (a so-called transparent conductive film) formed on a flat transparent substrate 1 made of glass or resin on the light extraction side, And a cathode 9 (so-called counter electrode film) laminated thereon.
  • a transparent anode 2 a so-called transparent conductive film
  • a cathode 9 a cathode 9 laminated thereon.
  • the functional layer of the functional laminate FLB capable of emitting white light for example, hole injection layer 3 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7 / electron injection layer 8 Lamination is mentioned.
  • a transparent anode 2 and a cathode 9 extending in the XY direction on the panel plane are formed on the substrate 1 so as to sandwich the functional laminate FLB.
  • a portion where the anode 2 of the transparent conductive film such as ITO, the functional laminate FLB, and the cathode 9 of the counter electrode film overlap is a light emitting portion, and light is extracted from the substrate 1 side.
  • the organic EL panel of the embodiment achieves smoothing of the anode itself as well as low resistance.
  • a smooth main surface by increasing the thickness of the anode contributes to smoothing of the functional layer of the functional laminate FLB to be formed in a later process and to reducing film thickness unevenness.
  • thickening the anode can be expected to reduce interference on the light extraction side.
  • the degree of freedom of the film thickness width that can be made a non-integer multiple of 1/4 of the peak wavelength of each extracted emission color can be expanded.
  • the thickness of the transparent anode 2 is preferably 1 ⁇ m to 5 ⁇ m in order to maintain the transmittance of the transparent anode 2 and ensure panel characteristics.
  • the thickness of the anode 2 gradually decreases toward the edge 2B (most edge) of the anode 2 on the smooth main surface 2A and the main surface of the substrate 1 at the interface with the functional laminate FLB.
  • the film is formed so as to have a tapered side surface 2C.
  • patterning of the anode is usually performed by a photolithography process, and the edge of the ITO anode manufactured by the above process is unstable, and thus needs to be covered with an insulating film.
  • This insulating film process is one of the factors that increase the panel cost and decrease the yield.
  • the anode is preferably patterned by a wet coating method such as screen printing, plateless printing or plate printing, or a sputtering method using a non-contact or contact mask.
  • the functional layer of the functional laminate FLB is preferably formed by coating.
  • the functional laminate FLB is formed on the tapered side surface 2C of the anode 2, the tapered side surface is also formed on the functional laminate FLB, and disconnection of the cathode formed in a later process can be prevented. Therefore, with the above configuration, an organic EL panel suitable for illumination or the like can be manufactured without requiring an insulating film.
  • the functional layer of the functional laminate FLB is formed by coating in order to improve the coverage of the anode 2 and the edge 2B.
  • the first layer (the hole injection layer 3 or the hole transport layer 4) is preferably applied thickly.
  • the total film thickness of the laminated film from the anode 2 to the light emitting layer 5 of the functional laminated body FLB is preferably at least 100 nm in order to ensure embedding with respect to foreign matter on the anode.
  • An example of the organic EL panel of the present embodiment is, as shown in FIG. 2, an anode 2 / hole injection layer 3 / hole transport layer 4 / red-green, which are sequentially laminated on a transparent substrate 1 such as glass.
  • the mixed light-emitting layer 5 / blue light-emitting layer 6 / electron transport layer 7 / electron injection layer 8 / cathode 9 / are configured.
  • the hole transport layer of anode 2 / hole injection layer 3 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7 / electron transport layer 8 / cathode 9 / 4 is omitted, and although not shown, hole injection layer of anode 2 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7 / electron injection layer 8 / cathode 9 / 3 is omitted, and although not shown, anode 2 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron injection layer 8 / cathode 9 / hole injection layer 3 and electron transport layer A configuration in which 7 is omitted is also included in the present invention.
  • a configuration in which a diffusion preventing layer is provided between the red-green mixed light emitting layer 5 and the blue light emitting layer
  • a method for forming a functional layer of an organic EL panel there are dry coating methods such as a sputtering method and a vacuum deposition method, and wet coating methods such as a screen printing, a spray method, an ink jet method, a spin coater method, a gravure printing, and a roll coater method.
  • dry coating methods such as a sputtering method and a vacuum deposition method
  • wet coating methods such as a screen printing, a spray method, an ink jet method, a spin coater method, a gravure printing, and a roll coater method.
  • the hole injection layer, the hole transport layer, and the light emitting layer are uniformly formed as a solid film by a wet coating method
  • the electron transport layer and the electron injection layer are uniformly formed as a solid film by a dry coating method, respectively. You may form into a film sequentially.
  • all the functional layers may be uniformly and sequentially formed as a solid film by a wet coating method.
  • substrate As the substrate 1, a quartz or glass plate, a metal plate or a metal foil, a resin substrate to be bent, a plastic film, a sheet, or the like is used. In particular, a glass plate or a transparent plate made of a synthetic resin such as polyester, polymethacrylate, polycarbonate, or polysulfone is preferable.
  • a synthetic resin substrate it is necessary to pay attention to gas barrier properties. If the gas barrier property of the substrate is too small, the organic EL panel may be deteriorated by the outside air that has passed through the substrate, which is not preferable. Therefore, a method of securing a gas barrier property by providing a dense silicon oxide film or the like on at least one surface of the synthetic resin substrate is also a preferable method.
  • the cheap glass substrate which is not an expensive polishing glass substrate for displays can also be used for an organic EL panel substrate.
  • the anode 2 for supplying holes to the functional layers up to the light emitting layer is usually composed of a composite oxide (so-called ITO) of indium oxide and tin oxide.
  • the anode 2 may be ZnO, ZnO—Al 2 O 3 (so-called AZO), In 2 O 3 —ZnO (so-called IZO), SnO 2 —Sb 2 O 3 (so-called ATO), RuO 2, etc.
  • the transparent conductive film of the anode 2 it is preferable to select a material having a transmittance of at least 10% at the emission wavelength obtained from the organic EL material.
  • the anode usually has a single-layer structure, but it can also have a laminated structure made of a plurality of materials if desired.
  • the surface of the anode is treated with ultraviolet (UV) / ozone, oxygen plasma, or argon plasma for the purpose of removing impurities adhering to the anode and adjusting the ionization potential to improve hole injection. Is preferred.
  • the material of the cathode 9 for supplying electrons to the functional layers up to the light emitting layer is preferably a metal having a low work function in order to perform electron injection efficiently, for example, tin, magnesium, indium, calcium, aluminum, silver, etc. New metals or their alloys are used. Specific examples include low work function alloy electrodes such as magnesium-silver alloy, magnesium-indium alloy, and aluminum-lithium alloy.
  • a metal layer having a high work function and stable to the atmosphere on the cathode because the stability of the organic EL panel is increased.
  • metals such as aluminum, silver, copper, nickel, chromium, gold and platinum are used.
  • these materials may be used only by 1 type and may use 2 or more types together by arbitrary combinations and a ratio.
  • the hole injection layer 3 is preferably a layer containing an electron accepting compound.
  • the composition for forming a hole injection layer usually contains a hole transporting compound and a solvent as a constituent material of the hole injection layer.
  • the solvent include, but are not limited to, ether solvents, ester solvents, aromatic hydrocarbon solvents, amide solvents, and the like.
  • ether solvents include aliphatic ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether acetate (so-called PGMEA), 1,2-dimethoxybenzene, 1,3-dimethoxybenzene, anisole, and phenetole.
  • Aromatic ethers such as 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,3-dimethylanisole, and 2,4-dimethylanisole.
  • ester solvent examples include aromatic esters such as phenyl acetate, phenyl propionate, methyl benzoate, ethyl benzoate, propyl benzoate, and n-butyl benzoate.
  • aromatic hydrocarbon solvent examples include toluene, xylene, cyclohexylbenzene, 3- isopropylpropylphenyl, 1,2,3,4-tetramethylbenzene, 1,4-diisopropylbenzene, cyclohexylbenzene, methylnaphthalene and the like. Can be mentioned.
  • amide solvent examples include N, N-dimethylformamide and N, N-dimethylacetamide.
  • dimethyl sulfoxide and the like can also be used. These solvent may use only 1 type and may use 2 or more types by arbitrary combinations and a ratio.
  • a polymer or the like may be a monomer or the like. Although it may be a low molecular compound, it is preferably a low molecular compound.
  • the hole transporting compound is preferably a compound having an ionization potential of 4.5 eV to 6.0 eV from the viewpoint of a charge injection barrier from the anode to the hole injection layer.
  • hole transporting compounds include aromatic amine derivatives, phthalocyanine derivatives represented by phthalocyanine copper (so-called CuPc), porphyrin derivatives, oligothiophene derivatives, polythiophene derivatives, benzylphenyl derivatives, tertiary amines with fluorene groups.
  • Examples include linked compounds, hydrazone derivatives, silazane derivatives, silanamine derivatives, phosphamine derivatives, quinacridone derivatives, polyaniline derivatives, polypyrrole derivatives, polyphenylene vinylene derivatives, polythienylene vinylene derivatives, polyquinoline derivatives, polyquinoxaline derivatives, and carbon.
  • the derivative includes, for example, an aromatic amine derivative, and includes an aromatic amine itself and a compound having an aromatic amine as a main skeleton. There may be.
  • a conductive polymer obtained by polymerizing 3,4-ethylenedioxythiophene, which is a polythiophene derivative, in high molecular weight polystyrene sulfonic acid is also preferable.
  • the end of the polymer of PEDOT / PSS may be capped with methacrylate or the like.
  • the hole transporting compound used as the material for the hole injection layer may contain any one of these compounds alone, or may contain two or more.
  • the combination is arbitrary, but one or more kinds of aromatic tertiary amine polymer compounds and one or two kinds of other hole transporting compounds.
  • an aromatic amine compound is preferable for the hole injection layer, and an aromatic tertiary amine compound is particularly preferable.
  • the aromatic tertiary amine compound is a compound having an aromatic tertiary amine structure, and includes a compound having a group derived from an aromatic tertiary amine.
  • the concentration of the hole transporting compound in the composition for forming a hole injection layer is usually 0.01% by weight or more, preferably 0.1% by weight or more, and more preferably 0.00% by weight in terms of film thickness uniformity. 5% by weight or more, usually 70% by weight or less, preferably 60% by weight or less, more preferably 50% by weight or less. If this concentration is too high, film thickness unevenness may occur, and if it is too low, defects may occur in the formed hole injection layer.
  • the composition for forming a hole injection layer preferably contains an electron-accepting compound, and may further contain other components in addition to the hole-transporting compound and the electron-accepting compound.
  • other components include various organic EL materials, electron transport compounds, binder resins, coatability improvers, and the like.
  • only 1 type may be used for another component and it may use 2 or more types together by arbitrary combinations and ratios.
  • the material for forming the hole injection layer is usually mixed with an appropriate solvent (solvent for the hole injection layer) to form a composition for film formation (hole injection).
  • an appropriate solvent solvent for the hole injection layer
  • a composition for forming a layer is prepared, and this composition for forming a hole injection layer is coated on the anode by an appropriate technique to form a film and dried to form a hole injection layer.
  • the film thickness of the hole injection layer is usually 5 nm or more, preferably 10 nm or more, and usually 1000 nm or less, preferably 500 nm or less.
  • the material for the hole transport layer 4 may be any material that has been conventionally used as a constituent material for the hole transport layer. Things.
  • polyvinylcarbazole derivatives polyarylamine derivatives, polyvinyltriphenylamine derivatives, polyfluorene derivatives, polyarylene derivatives, polyarylene ether sulfone derivatives containing tetraphenylbenzidine, polyarylene vinylene derivatives, polysiloxane derivatives, polythiophenes Derivatives, poly (p-phenylene vinylene) derivatives, and the like.
  • These may be any of an alternating copolymer, a random polymer, a block polymer, or a graft copolymer. Further, it may be a polymer having a branched main chain and three or more terminal portions, or a so-called dendrimer.
  • a composition for forming a hole transport layer is prepared in the same manner as the formation of the hole injection layer, and then dried after wet film formation.
  • the hole transporting layer forming composition contains a solvent.
  • the solvent used is the same as that used for the composition for forming the hole injection layer.
  • the film forming conditions, the drying conditions, and the like are the same as in the case of forming the hole injection layer.
  • the hole transport layer may contain various organic EL materials, electron transport compounds, binder resins, coatability improvers, and the like in addition to the hole transport compound.
  • the film thickness of the hole transport layer is usually 5 nm or more, preferably 10 nm or more, and usually 300 nm or less, preferably 100 nm or less.
  • the film thickness of the hole injection layer 3 and / or the hole transport layer 4 from the anode 2 to the light emitting layer 5 Is preferably at least 100 nm.
  • the light-emitting layers of the red-green mixed light-emitting layer and the blue light-emitting layer contain an organic EL material, and preferably a compound having a hole transport property (hole transport compound) or a compound having an electron transport property (electron transport) A functional compound).
  • An organic EL material may be used as a dopant material, and a hole transporting compound, an electron transporting compound, or the like may be appropriately used as a host material.
  • the organic EL material There is no particular limitation on the organic EL material, and a substance that emits light at a desired emission wavelength and has good emission efficiency may be used.
  • the organic EL material may be a fluorescent material or a phosphorescent material, but it is preferable to use a phosphorescent material from the viewpoint of internal quantum efficiency.
  • the light emitting layer may have a single layer structure or a multilayer structure made of a plurality of materials as desired.
  • a fluorescent material may be used for the blue light emitting layer
  • a phosphorescent material may be used for the green and red light emitting layers.
  • a diffusion preventing layer can be provided between the light emitting layers.
  • fluorescent materials blue fluorescent dyes
  • examples of fluorescent materials that emit blue light include naphthalene, perylene, pyrene, chrysene, anthracene, coumarin, p-bis (2-phenylethenyl) benzene, and derivatives thereof.
  • fluorescent material green fluorescent dye
  • examples of the fluorescent material (green fluorescent dye) that emits green light include aluminum complexes such as quinacridone derivatives, coumarin derivatives, and Alq3 (tris (8-hydroxy-quinoline) aluminum).
  • Examples of fluorescent materials that give yellow light emission include rubrene and perimidone derivatives.
  • red fluorescent dyes examples include DCM (4- (dicyanomethylene) -2-methyl-6- (p-dimethylaminostyryl) -4H-pyran) compounds, benzopyran derivatives, rhodamine derivatives, benzoates. Examples thereof include thioxanthene derivatives and azabenzothioxanthene.
  • the phosphorescent material is selected from, for example, the long-period periodic table (hereinafter referred to as the long-period periodic table when referring to “periodic table” unless otherwise specified).
  • An organometallic complex containing a metal can be given.
  • Preferred examples of the metal selected from Groups 7 to 11 of the periodic table include ruthenium, rhodium, palladium, silver, rhenium, osmium, iridium, platinum, and gold.
  • a ligand in which a (hetero) aryl group such as a (hetero) arylpyridine ligand or a (hetero) arylpyrazole ligand and a pyridine, pyrazole, phenanthroline, or the like is connected is preferable.
  • a pyridine ligand and a phenylpyrazole ligand are preferable.
  • (hetero) aryl represents an aryl group or a heteroaryl group.
  • phosphorescent materials include tris (2-phenylpyridine) iridium (so-called Ir (ppy) 3), tris (2-phenylpyridine) ruthenium, tris (2-phenylpyridine) palladium, and bis (2-phenyl).
  • Pyridine) platinum tris (2-phenylpyridine) osmium, tris (2-phenylpyridine) rhenium, octaethylplatinum porphyrin, octaphenylplatinum porphyrin, octaethyl palladium porphyrin, octaphenyl palladium porphyrin, and the like.
  • the molecular weight of the compound used as the organic EL material is usually 10,000 or less, preferably 5000 or less, more preferably 4000 or less, still more preferably 3000 or less, and usually 100 or more, preferably 200 or more, more preferably 300 or more, still more preferably. Is in the range of 400 or more. If the molecular weight of the organic EL material is too small, the heat resistance will be significantly reduced, gas generation will be caused, the film quality will be deteriorated when the film is formed, or the morphology of the functional layer will be changed due to migration, etc. There is a case. On the other hand, if the molecular weight of the organic EL material is too large, it tends to be difficult to purify the organic compound, or it may take time to dissolve the organic EL material in a solvent when formed by a wet coating method.
  • the proportion of the organic EL material in the light emitting layer is usually 0.05% by weight or more and usually 35% by weight or less. If the amount of the organic EL material is too small, uneven light emission may occur, and if the amount is too large, the light emission efficiency may be reduced. In addition, when using together 2 or more types of organic EL material, it is made for the total content of these to be contained in the said range.
  • the component having the highest content in the light emitting layer is called a host material, and the component having a smaller content is called a guest material.
  • the light emitting layer may contain a hole transporting compound as a constituent material.
  • examples of the low molecular weight hole transporting compound include various compounds exemplified as the hole transporting compound in the hole injection layer 3 described above, for example, 2 'or more condensed aromatic rings containing 2 or more tertiary amines represented by 4'-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (so-called ⁇ -NPD) are nitrogen From aromatic diamines substituted with atoms, aromatic amine compounds having a starburst structure such as 4,4 ′, 4 ′′ -tris (1-naphthylphenylamino) triphenylamine, and tetramers of triphenylamine And spiro compounds such as 2,2 ′, 7,7′-tetrakis- (diphenylamino) -9,9′-spirobifluorene.
  • a hole transportable compound in a light emitting layer, only 1 type may be used for a hole transportable compound, and it may use 2 or more types together by arbitrary combinations and a ratio.
  • the proportion of the hole transporting compound in the light emitting layer is usually 0.1% by weight or more and usually 65% by weight or less. If the amount of the hole transporting compound is too small, it may be easily affected by a short circuit, and if it is too large, the film thickness may be uneven. In addition, when using together 2 or more types of hole transportable compounds, it is made for the total content of these to be contained in the said range.
  • the light emitting layer may contain an electron transporting compound as a constituent material.
  • examples of low molecular weight electron transporting compounds include 2,5-bis (1-naphthyl) -1,3,4-oxadiazole (so-called BND), 2 , 5-bis (6'- (2 ′, 2 ′′ -bipyridyl))-1,1-dimethyl-3,4-diphenylsilole (so-called PyPySPyPy), bathophenanthroline (so-called BPhen), 2,9-dimethyl-4,7-diphenyl 1,10-phenanthroline (so-called BCP, bathocuproin), 2- (4-biphenylyl) -5- (p-tert-butylphenyl) -1,3,4-oxadiazole (so-called tBu-PBD), 4,4′-bis (9H-carbazol-9-yl) biphenyl (so-called C
  • the proportion of the electron transporting compound in the light emitting layer is usually 0.1% by weight or more and usually 65% by weight or less. If the amount of the electron transporting compound is too small, it may be easily affected by a short circuit, and if it is too large, the film thickness may be uneven. In addition, when using together 2 or more types of electron transport compounds, it is made for the total content of these to be contained in the said range.
  • the light emitting layer is prepared by dissolving the above light emitting layer material in an appropriate solvent to prepare a composition for forming a light emitting layer. Is formed. Therefore, in the case of forming by a wet coating method, the light emitting layer coating solution is prepared by dispersing or dissolving at least two kinds of solid contents (host material and guest material) to be the light emitting layer as a solute in a solvent.
  • the solvent to be used can be selected from the solvents that can be used for the composition for forming a hole injection layer.
  • the ratio of the light emitting layer solvent to the light emitting layer forming composition for forming the light emitting layer is usually 0.01% by weight or more and usually 70% by weight or less.
  • the film thickness of the light emitting layer is usually 3 nm or more, preferably 5 nm or more, and usually 200 nm or less, preferably 100 nm or less. If the light emitting layer is too thin, defects may occur in the film, and if it is too thick, the driving voltage may increase.
  • the electron transport layer 7 is provided for the purpose of further improving the light emission efficiency of the organic EL panel, and efficiently transports electrons injected from the cathode between the electrodes to which an electric field is applied in the direction of the light emitting layer. Formed from a compound capable of
  • the electron transporting compound used for the electron transport layer usually, the electron injection efficiency from the cathode 9 or the electron injection layer 8 is high, and the injected electrons having high electron mobility can be efficiently transported.
  • Use possible compounds include metal complexes of Alq3 and 10-hydroxybenzo [h] quinoline, oxadiazole derivatives, distyrylbiphenyl derivatives, silole derivatives, 3-hydroxyflavone metal complexes, and 5-hydroxyflavones.
  • Metal complex benzoxazole metal complex, benzothiazole metal complex, trisbenzimidazolylbenzene, quinoxaline compound, phenanthroline derivative, 2-t-butyl-9,10-N, N′-dicyanoanthraquinonediimine, n-type hydrogenated amorphous Quality silicon carbide, n-type zinc sulfide, n-type zinc selenide and the like.
  • the formation method of the electron transport layer is not limited, and can be formed by a wet coating method or a dry coating method.
  • the electron transport layer is prepared by dissolving the electron transport layer material in an appropriate solvent to prepare a composition for forming an electron transport layer. It is formed by removing.
  • the solvent to be used can be selected from the solvents that can be used for the composition for forming a hole injection layer.
  • the film thickness of the electron transport layer is usually 1 nm or more, preferably 5 nm or more, and usually 300 nm or less, preferably 100 nm or less.
  • the electron injection layer 8 plays a role of efficiently injecting electrons injected from the cathode into the light emitting layer.
  • the material for forming the electron injection layer is preferably a metal having a low work function. Examples include alkali metals such as sodium and cesium, alkaline earth metals such as barium and calcium, and their compounds (CsF, Cs 2 CO 3 , Li 2 O, LiF) and the like. .1 nm or more and 5 nm or less are preferable.
  • an organic electron transport compound represented by a metal complex such as a nitrogen-containing heterocyclic compound such as bathophenanthroline or an aluminum complex of 8-hydroxyquinoline is doped with an alkali metal such as sodium, potassium, cesium, lithium, or rubidium.
  • an alkali metal such as sodium, potassium, cesium, lithium, or rubidium.
  • the film thickness is usually 5 nm or more, preferably 10 nm or more, and is usually 200 nm or less, preferably 100 nm or less.
  • 1 type may be used for the material of an electron injection layer, and 2 or more types may be used together by arbitrary combinations and a ratio.
  • the formation method of the electron injection layer is not limited, and can be formed by a wet coating method or a dry coating method.
  • the electron injection layer is prepared by dissolving the electron injection layer material in a suitable solvent to prepare a composition for forming an electron injection layer. It is formed by removing.
  • the solvent to be used can be selected from the solvents that can be used for the composition for forming a hole injection layer.
  • 3 to 10 are cross-sectional views showing a substrate and a structure formed thereon in the manufacturing process of the organic EL panel manufacturing method to which the present invention is applied.
  • This manufacturing process will be described in the order of the following (a) cleaning step, (b) anode forming step, (c) hole transport layer forming step, (d) coating light emitting layer forming step, and (e) vapor deposition light emitting layer forming step. To do.
  • FIG. 3 for example, a transparent substrate 1 made of a cleaned glass plate having a thickness of 0.7 mm is prepared.
  • FIG. 3 the cross section along the juxtaposition direction Y orthogonal to the direction X is shown, and this also applies to the following drawings.
  • an IZO (In 2 O 3) layer is formed on the main surface of the substrate 1 by sputtering using a non-contact or contact mask disposed away from the main surface of the substrate 1.
  • a transparent anode 2 of -ZnO) is formed.
  • a spray material of an IZO target is deposited on the substrate 1 through the pattern opening of the mask, and an IZO film having a predetermined pattern with a tapered edge is obtained as the anode 2 (transparent conductive film). Since the splash material wraps around between the mask opening and the mask substrate, a tapered side surface 2C in which the film thickness gradually decreases from the smooth main surface 2A of the main surface of the transparent anode 2 toward the edge portion 2B is formed.
  • the thickness of the anode 2 is 1000 nm, for example.
  • UV / O 3 ultraviolet / ozone
  • an aqueous dispersion having a fixed concentration of 1 wt% using PEDOT (poly 3,4-ethylenedioxythiophene) as a host and PSS (polystyrene sulfonic acid) as a dopant is prepared.
  • the droplet Lq for the hole injection layer material is applied onto the entire surface of the anode 2 by the inkjet head 12 using an inkjet apparatus.
  • the inkjet head 12 is raster-scanned on the XY plane on the anode 2, a droplet film that covers the edges of the anode 2 by connecting the edges of the applied droplets OG is formed.
  • the droplet film is vacuum-dried at a gas pressure of 0.1 to 50 Pa for 2 minutes using a vacuum drying apparatus, and baked by heat treatment at 230 ° C. for 1 hour.
  • the solvent of the droplets evaporates to obtain a cured hole injection layer 3 that covers the edge of the anode 2.
  • the hole transport layer 4 is formed by using an organic solvent droplet having a predetermined concentration of 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane by an inkjet method. As shown in FIG. 2, the entire surface of the hole injection layer 3 is applied and dried. Each of the hole injection layer 3 and the hole transport layer 4 has a thickness of 50 nm, for example.
  • Balq Bis- (2-methyl-8-quinolinolato) (p-phenylphenolato) aluminum
  • Hex-Ir (phq) 3 An organic solution having a fixed concentration of 6 wt% using Tris [2- (4-n-hexylphenyl) quinoline)] iridium (III) is prepared in advance.
  • the red / green mixed light emitting layer material droplet Lq is applied onto the entire surface of the hole transport layer 4 by the inkjet head 12 in the same manner as the inkjet method described above.
  • the droplet film is vacuum-dried for 2 minutes at a gas pressure of 0.1 to 50 Pa using a vacuum drying apparatus, and baked by heat treatment at 130 ° C. for 10 minutes.
  • a cured red-green mixed light emitting layer 5 covering the hole transport layer 4 is obtained.
  • the thickness of the red / green mixed light emitting layer 5 is, for example, 40 nm.
  • the dopant 4,4′-bis (2,2′-diphenylvinyl) biphenyl (so-called DPVBi) is vacuum-deposited together, whereby the blue light emitting layer 6 is formed with a thickness of, for example, 15 nm.
  • Alq3 is vacuum-deposited on the blue light emitting layer 6 by a vacuum deposition method, whereby an Alq3 electron transport layer 7 is formed to a thickness of, for example, 30 nm.
  • LiF lithium fluoride
  • the electron injection layer 8 is formed with a thickness of, for example, 1 nm.
  • the cathode 9 is formed with a thickness of, for example, 80 nm.
  • the functional laminate FLB is formed from the hole injection layer 3 to the electron injection layer 8 here.
  • the cathode 9 is formed in a strip shape so as to cross the transparent anode 2 along the juxtaposed direction Y orthogonal to the direction X. A portion where the anode 2 and the cathode 9 overlap with each other to sandwich the functional laminate FLB defines a light emitting area of the organic EL panel. Thereafter, a sealed organic EL panel can be obtained through a sealing step.
  • the functional laminate FLB covers at least the side surface of the anode 2 in the light emitting area where the anode 2 and the cathode 9 overlap, even if there is no insulating film, the short circuit between the anode 2 and the cathode 9 and the cathode disconnection are suppressed. Is possible.
  • a cleaning step (b) anode forming step, (c) hole transport layer forming step, (d) coating light emitting layer forming step, and (e) vapor deposition light emitting layer forming step.
  • An organic EL panel is manufactured.
  • the blue light-emitting layer 6 is formed by vacuum deposition, but all the light-emitting layers are formed by a combination of an ink jet coating process and a drying process, and coating and drying are performed for each functional layer that performs each function.
  • a multilayer functional laminate FLB (hole injection layer 3 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7) is formed. May be.
  • an insulating bank material is used, and since the bank material generally uses a material that absorbs in the visible region such as a polyimide material, the color of the cathode is a metallic color. May damage the appearance. Moreover, since there is an absorbing material in the visible region, the emitted light may be lost in the bank.
  • there is no insulating film such as a bank material and the organic EL panel emits, so that a higher aperture ratio can be obtained than before. As described above, since the emitted light can be emitted more efficiently for increasing the aperture ratio, the power consumption can be reduced as compared with the conventional element in order to obtain a desired light amount.
  • two layers of the hole injection layer 3 and the hole transport layer 4 are formed on the anode 2 (transparent conductive film), but it is not limited to the formation of two layers, Only one layer of the hole injection layer or the hole transport layer, or three or more layers obtained by adding an electron blocking layer (not shown) to the hole injection layer and the hole transport layer may be formed by the light emitting layer.
  • the anode 2 is patterned by a sputtering method using a non-contact or close contact mask.
  • the anode 2 can be formed by a wet coating method such as a screen printing method, an ink jet method, a spray coating method, a roll coating method, and a plate printing method in addition to the sputtering method.
  • an IZO paste is applied on a substrate by inkjet printing to form an IZO paste coating film.
  • droplets Iq of IZO paste are applied in a predetermined pattern onto the substrate 1 by the inkjet head 12.
  • the substrate 1 is dried (for example, 150 to 200 ° C.) and then fired (for example, 400 to 600 ° C.) to form the anode 2 having a predetermined pattern on the substrate 1 as shown in FIG.
  • the film formation of the anode 2 is simplified.
  • an IZO anode 2 transparent conductive film having a smooth main surface 2A and a tapered side surface 2C whose thickness gradually decreases toward the edge 2B can be easily obtained by sagging by printing.

Abstract

This organic electroluminescent panel comprises a transparent conductive film, a functional laminate containing at least one light-emitting layer, and a counter electrode film laminated, in that order, on a substrate. At least a portion of the transparent conductive film has a tapered side, the thickness of which gradually decreases toward the outer edge. The functional laminate covers the tapered side of the transparent conductive film.

Description

有機エレクトロルミネッセンスパネル及びその製造方法Organic electroluminescence panel and manufacturing method thereof
 本発明は、有機エレクトロルミネッセンス(以下、有機ELという)材料を発光層に含む有機ELパネル及びその製造方法に関する。 The present invention relates to an organic EL panel including an organic electroluminescence (hereinafter referred to as organic EL) material in a light emitting layer and a method for manufacturing the same.
 有機EL素子は陽極と陰極の間に正孔注入層、正孔輸送層、発光層、電子輸送層及び電子注入層などの複数の機能層を挟持させた発光体として表示装置に利用されている。有機ELパネルは有機EL素子を大面積化した面発光体である。 Organic EL elements are used in display devices as light emitters in which a plurality of functional layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sandwiched between an anode and a cathode. . An organic EL panel is a surface light emitter in which an organic EL element is enlarged.
 マトリックス状に配置された複数の有機EL素子からなる表示装置には、各素子を区画するために隔壁やバンクなどの絶縁膜が設けられている(特許文献1~4参照)。 A display device composed of a plurality of organic EL elements arranged in a matrix is provided with insulating films such as partition walls and banks in order to partition each element (see Patent Documents 1 to 4).
特開2007-149578号公報JP 2007-149578 A 特開2011-216317号公報JP 2011-216317 A 特開2005-157312号公報Japanese Patent Laid-Open No. 2005-157312 特開2006-12768号公報JP 2006-12768 A
 かかる従来の表示装置の製造工程において有機EL素子の陽極がフォトリソグラフィなどのエッチング法により基板上にパタニングされている場合が多く、その場合は陽極のエッジ形状が急峻となるなど不安定になる。それ故に、陽極エッジを覆う絶縁膜は陽極及び陰極間の短絡防止や陰極断線の抑制のために必要である。しかしながら、絶縁膜があると絶縁膜形成工程が増える故に、その分、歩留まり悪化要因も増えることにより有機ELパネルのコストを低減できないという問題があった。 In the manufacturing process of such a conventional display device, the anode of the organic EL element is often patterned on the substrate by an etching method such as photolithography, and in this case, the edge shape of the anode becomes steep and unstable. Therefore, an insulating film covering the anode edge is necessary for preventing a short circuit between the anode and the cathode and suppressing cathode disconnection. However, if there is an insulating film, the number of steps for forming the insulating film increases, and accordingly, there is a problem that the cost of the organic EL panel cannot be reduced due to an increase in the yield deterioration factor.
 そこで、本発明はかかる問題点に鑑みて為されたもので、本発明が解決しようとする課題は、低コストで製造できる有機ELパネル及びその製造方法を提供することが課題の一例としてあげられる。 Therefore, the present invention has been made in view of such problems, and the problem to be solved by the present invention is to provide an organic EL panel that can be manufactured at low cost and a method for manufacturing the same as an example of the problem. .
 本発明の有機ELパネルは、基板と、前記基板上に積層された透明導電性膜と、前記透明導電性膜上に積層された少なくとも1層の発光層を含む機能積層体と、前記機能積層体上に積層された対向電極膜とを含む有機ELパネルであって、前記機能積層体は前記透明導電性膜及び前記対向電極膜が重なる交差部の内の少なくとも前記透明導電性膜の側面を被覆していることを特徴とする。 The organic EL panel of the present invention includes a substrate, a transparent conductive film laminated on the substrate, a functional laminate including at least one light emitting layer laminated on the transparent conductive film, and the functional laminate. An organic EL panel including a counter electrode film laminated on a body, wherein the functional laminate includes at least a side surface of the transparent conductive film in an intersecting portion where the transparent conductive film and the counter electrode film overlap each other. It is characterized by being coated.
 上記の有機ELパネルを製造する本発明の製造方法は、基板と、前記基板上に積層された透明導電性膜と、前記透明導電性膜上に積層された少なくとも1層の発光層を含む機能積層体と、前記機能積層体上に積層された対向電極膜とを含む有機ELパネルの製造方法であって、前記基板上に透明導電性膜を形成するステップと、前記透明導電性膜を被覆する機能積層体を形成するステップと、を含み、前記機能積層体を形成するステップにおいて、前記機能積層体が前記透明導電性膜及び前記対向電極膜が重なる交差部の内の少なくとも前記透明導電性膜の側面を被覆するように、湿式塗布法により、前記機能積層体の内の少なくとも1つの層を形成することを特徴とする。 The manufacturing method of the present invention for manufacturing the organic EL panel includes a substrate, a transparent conductive film laminated on the substrate, and at least one light emitting layer laminated on the transparent conductive film. A method of manufacturing an organic EL panel including a laminate and a counter electrode film laminated on the functional laminate, the step of forming a transparent conductive film on the substrate, and covering the transparent conductive film Forming a functional laminate, wherein in the step of forming the functional laminate, the functional laminate has at least the transparent conductive layer at the intersection where the transparent conductive film and the counter electrode film overlap. At least one layer of the functional laminate is formed by a wet coating method so as to cover the side surface of the film.
本発明の実施形態の有機ELパネルの構造を示す上面透視部分切欠平面図である。It is an upper surface see-through | perspective partial notch top view which shows the structure of the organic electroluminescent panel of embodiment of this invention. 図1のA-A線に沿って切り取った部分的断面図である。FIG. 2 is a partial cross-sectional view taken along line AA in FIG. 1. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacturing process of the organic electroluminescent panel of embodiment of this invention, and the structure formed on it. 本発明の他の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacture process of the organic electroluminescent panel of other embodiment of this invention, and the structure formed on it. 本発明の他の実施形態の有機ELパネルの製造過程における基板とその上に形成された構造物を示す断面図である。It is sectional drawing which shows the board | substrate in the manufacture process of the organic electroluminescent panel of other embodiment of this invention, and the structure formed on it.
 以下、本発明の実施形態の有機ELパネルについて、図面を参照しつつ説明する。 Hereinafter, an organic EL panel according to an embodiment of the present invention will be described with reference to the drawings.
 図1は、実施形態の有機ELパネルの一部分を陰極側上面から眺めた透視部分切欠平面図であり、図2は図1のA-A線における有機ELパネルの断面を示す部分的断面図である。 FIG. 1 is a perspective partially cutaway plan view of a portion of the organic EL panel of the embodiment as viewed from the upper surface on the cathode side, and FIG. 2 is a partial cross-sectional view showing a cross section of the organic EL panel taken along line AA in FIG. is there.
 有機ELパネルは、図2に示すように、光取り出し側のガラスや樹脂などからなる平板状の透明な基板1上に形成された透明な陽極2(所謂、透明導電性膜)と、この上に積層された機能積層体FLBと、この上に積層された陰極9(所謂、対向電極膜)とから構成される。白色発光可能な機能積層体FLBの機能層としては、例えば、正孔注入層3/正孔輸送層4/赤緑混合発光層5/青発光層6/電子輸送層7/電子注入層8の積層が挙げられる。 As shown in FIG. 2, the organic EL panel includes a transparent anode 2 (a so-called transparent conductive film) formed on a flat transparent substrate 1 made of glass or resin on the light extraction side, And a cathode 9 (so-called counter electrode film) laminated thereon. As the functional layer of the functional laminate FLB capable of emitting white light, for example, hole injection layer 3 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7 / electron injection layer 8 Lamination is mentioned.
 図1及び図2に示すように、基板1上には、パネル平面におけるXY方向に拡がる透明な陽極2と陰極9が機能積層体FLBを挟むように形成されている。ITOなどの透明導電性膜の陽極2と機能積層体FLBと対向電極膜の陰極9が重なる部分が発光部となり、基板1側から光が取り出される。 As shown in FIGS. 1 and 2, a transparent anode 2 and a cathode 9 extending in the XY direction on the panel plane are formed on the substrate 1 so as to sandwich the functional laminate FLB. A portion where the anode 2 of the transparent conductive film such as ITO, the functional laminate FLB, and the cathode 9 of the counter electrode film overlap is a light emitting portion, and light is extracted from the substrate 1 side.
 透明陽極2の膜厚を1μmを超えるμmオーダと厚くすることにより、実施形態の有機ELパネルでは、低抵抗化と共に陽極自体の平滑化を達成している。かかる陽極の厚膜化による平滑主面は、後工程で成膜される機能積層体FLBの機能層の平滑化、膜厚ムラの軽減に貢献する。平滑化の他に陽極の厚膜化は光取り出し側の干渉低減効果にも期待できる。例えば、陽極の膜厚設定において、それぞれの取り出し発光色のピーク波長の1/4の非整数倍にできる膜厚幅の自由度が拡大できる。陽極の厚膜化のために、透明陽極2の膜厚は透明陽極2の透過率を維持しかつパネル特性を確保するために1μm~5μmであることが好ましい。 By increasing the film thickness of the transparent anode 2 to the order of μm exceeding 1 μm, the organic EL panel of the embodiment achieves smoothing of the anode itself as well as low resistance. Such a smooth main surface by increasing the thickness of the anode contributes to smoothing of the functional layer of the functional laminate FLB to be formed in a later process and to reducing film thickness unevenness. In addition to smoothing, thickening the anode can be expected to reduce interference on the light extraction side. For example, when setting the film thickness of the anode, the degree of freedom of the film thickness width that can be made a non-integer multiple of 1/4 of the peak wavelength of each extracted emission color can be expanded. In order to increase the thickness of the anode, the thickness of the transparent anode 2 is preferably 1 μm to 5 μm in order to maintain the transmittance of the transparent anode 2 and ensure panel characteristics.
 陽極2は、図2に示すように、機能積層体FLBとの界面に平滑主面2Aと基板1の主面上の陽極2の縁部2B(最縁端)に向けて膜厚が漸次減少するテーパ側面2Cとを有するように成膜される。ここで、陽極のパタニングは通常フォトリソグラフィプロセスにて行われ、上記プロセスで作製したITO陽極のエッジは不安定であるため絶縁膜でカバーする必要がある。この絶縁膜工程がパネルのコストアップ、歩留まり低下の要因の一つになっている。この問題を解決するため陽極はスクリーン印刷や無版印刷若しくは有版印刷などの湿式塗布法又は非密着若しくは密着のマスクを用いたスパッタリング法にてパタニングすることが好ましい。また、機能積層体FLBの機能層は塗布にて形成することが好ましい。陽極2のテーパ側面2C上に機能積層体FLBがされると、機能積層体FLBにもテーパ側面が形成され、後工程で形成される陰極の断線を防止することができる。よって、以上の構成により、絶縁膜を必要とすることなく照明などに適した有機ELパネルを作製することが可能になる。 As shown in FIG. 2, the thickness of the anode 2 gradually decreases toward the edge 2B (most edge) of the anode 2 on the smooth main surface 2A and the main surface of the substrate 1 at the interface with the functional laminate FLB. The film is formed so as to have a tapered side surface 2C. Here, patterning of the anode is usually performed by a photolithography process, and the edge of the ITO anode manufactured by the above process is unstable, and thus needs to be covered with an insulating film. This insulating film process is one of the factors that increase the panel cost and decrease the yield. In order to solve this problem, the anode is preferably patterned by a wet coating method such as screen printing, plateless printing or plate printing, or a sputtering method using a non-contact or contact mask. The functional layer of the functional laminate FLB is preferably formed by coating. When the functional laminate FLB is formed on the tapered side surface 2C of the anode 2, the tapered side surface is also formed on the functional laminate FLB, and disconnection of the cathode formed in a later process can be prevented. Therefore, with the above configuration, an organic EL panel suitable for illumination or the like can be manufactured without requiring an insulating film.
 陽極2の及び縁部2Bのカバレッジを良化するため機能積層体FLBの機能層は塗布にて形成する。特に1層目(正孔注入層3又は正孔輸送層4)が厚く塗布されることが好ましい。機能積層体FLBにもテーパ側面を厚膜にするほど陽極2の及び縁部2Bのカバレッジ性が上昇するのでリーク抑制効果が上がる。具体的には、陽極2から機能積層体FLBの発光層5までの積層膜の膜厚の合計は陽極上の異物に対する埋包性を確保するため少なくとも100nmであることが好ましい。 The functional layer of the functional laminate FLB is formed by coating in order to improve the coverage of the anode 2 and the edge 2B. In particular, the first layer (the hole injection layer 3 or the hole transport layer 4) is preferably applied thickly. As the tapered side surface of the functional laminate FLB becomes thicker, the coverage of the anode 2 and the edge 2B increases, so that the effect of suppressing leakage increases. Specifically, the total film thickness of the laminated film from the anode 2 to the light emitting layer 5 of the functional laminated body FLB is preferably at least 100 nm in order to ensure embedding with respect to foreign matter on the anode.
 本実施形態の有機ELパネルの一例は、図2に示すように、ガラスなどの透明基板1上にて、順に、積層された陽極2/正孔注入層3/正孔輸送層4/赤緑混合発光層5/青発光層6/電子輸送層7/電子注入層8/陰極9/の構成である。この積層構成の他に、図示しないが、陽極2/正孔注入層3/赤緑混合発光層5/青発光層6/電子輸送層7/電子注入層8/陰極9/の正孔輸送層4を省いた構成や、図示しないが、陽極2/正孔輸送層4/赤緑混合発光層5/青発光層6/電子輸送層7/電子注入層8/陰極9/の正孔注入層3を省いた構成や、図示しないが、陽極2/正孔輸送層4/赤緑混合発光層5/青発光層6/電子注入層8/陰極9/の正孔注入層3、電子輸送層7を省いた構成も本発明に含まれる。上記いずれの積層構造において赤緑混合発光層5と青発光層6上記の間に拡散防止層を設ける構成も本発明に含まれる。 An example of the organic EL panel of the present embodiment is, as shown in FIG. 2, an anode 2 / hole injection layer 3 / hole transport layer 4 / red-green, which are sequentially laminated on a transparent substrate 1 such as glass. The mixed light-emitting layer 5 / blue light-emitting layer 6 / electron transport layer 7 / electron injection layer 8 / cathode 9 / are configured. In addition to this laminated structure, although not shown, the hole transport layer of anode 2 / hole injection layer 3 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7 / electron transport layer 8 / cathode 9 / 4 is omitted, and although not shown, hole injection layer of anode 2 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7 / electron injection layer 8 / cathode 9 / 3 is omitted, and although not shown, anode 2 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron injection layer 8 / cathode 9 / hole injection layer 3 and electron transport layer A configuration in which 7 is omitted is also included in the present invention. In any of the above laminated structures, a configuration in which a diffusion preventing layer is provided between the red-green mixed light emitting layer 5 and the blue light emitting layer 6 is also included in the present invention.
 有機ELパネルの機能層を成膜する手法として、スパッタリング法や真空蒸着法などの乾式塗布法や、スクリーン印刷、スプレイ法、インクジェット法、スピンコータ法、グラビア印刷、ロールコータ法などの湿式塗布法が知られている。例えば、正孔注入層、正孔輸送層、発光層を湿式塗布法でベタ膜として一様に成膜して、電子輸送層及び電子注入層を、それぞれ乾式塗布法でベタ膜として一様に順次成膜してもよい。また、すべての機能層を湿式塗布法でベタ膜として一様に順次成膜してもよい。 As a method for forming a functional layer of an organic EL panel, there are dry coating methods such as a sputtering method and a vacuum deposition method, and wet coating methods such as a screen printing, a spray method, an ink jet method, a spin coater method, a gravure printing, and a roll coater method. Are known. For example, the hole injection layer, the hole transport layer, and the light emitting layer are uniformly formed as a solid film by a wet coating method, and the electron transport layer and the electron injection layer are uniformly formed as a solid film by a dry coating method, respectively. You may form into a film sequentially. Further, all the functional layers may be uniformly and sequentially formed as a solid film by a wet coating method.
 [基板]
 基板1としては、石英やガラスの板、金属板や金属箔、曲げられる樹脂基板、プラスチックフィルムやシートなどが用いられる。特にガラス板や、ポリエステル、ポリメタクリレート、ポリカーボネート、ポリスルホンなどの合成樹脂の透明板が好ましい。合成樹脂基板を使用する場合にはガスバリア性に留意する必要がある。基板のガスバリア性が小さすぎると、基板を通過した外気により有機ELパネルが劣化することがあるので好ましくない。よって、合成樹脂基板の少なくとも片面に緻密なシリコン酸化膜などを設けてガスバリア性を確保する方法も好ましい方法の一つである。
[substrate]
As the substrate 1, a quartz or glass plate, a metal plate or a metal foil, a resin substrate to be bent, a plastic film, a sheet, or the like is used. In particular, a glass plate or a transparent plate made of a synthetic resin such as polyester, polymethacrylate, polycarbonate, or polysulfone is preferable. When using a synthetic resin substrate, it is necessary to pay attention to gas barrier properties. If the gas barrier property of the substrate is too small, the organic EL panel may be deteriorated by the outside air that has passed through the substrate, which is not preferable. Therefore, a method of securing a gas barrier property by providing a dense silicon oxide film or the like on at least one surface of the synthetic resin substrate is also a preferable method.
 なお、湿式塗布法にて透明陽極を厚膜で形成する場合、基板表面の凹凸を緩和できるので、高価なディスプレイ用研磨ガラス基板でない廉価なガラス基板も有機ELパネル基板に用いることができる。 In addition, when forming a transparent anode with a thick film by a wet coating method, since the unevenness | corrugation of a board | substrate surface can be eased, the cheap glass substrate which is not an expensive polishing glass substrate for displays can also be used for an organic EL panel substrate.
 [陽極及び陰極]
 発光層までの機能層に正孔を供給する陽極2は、通常、インジウム酸化物とスズ酸化物の複合酸化物(所謂、ITO)などにより構成される。ITOの他に、陽極2はZnO、ZnO-Al23(所謂、AZO)、In23-ZnO(所謂、IZO)、SnO2-Sb23(所謂、ATO)、RuO2などにより構成され得る。さらに、陽極2の透明導電性膜は、有機EL材料から得られる発光波長において少なくとも10%以上の透過率を持つ材料を選択することが好ましい。
[Anode and cathode]
The anode 2 for supplying holes to the functional layers up to the light emitting layer is usually composed of a composite oxide (so-called ITO) of indium oxide and tin oxide. In addition to ITO, the anode 2 may be ZnO, ZnO—Al 2 O 3 (so-called AZO), In 2 O 3 —ZnO (so-called IZO), SnO 2 —Sb 2 O 3 (so-called ATO), RuO 2, etc. Can be configured. Furthermore, as the transparent conductive film of the anode 2, it is preferable to select a material having a transmittance of at least 10% at the emission wavelength obtained from the organic EL material.
 陽極は通常は単層構造であるが、所望により複数の材料からなる積層構造とすることも可能である。 The anode usually has a single-layer structure, but it can also have a laminated structure made of a plurality of materials if desired.
 陽極に付着した不純物を除去し、イオン化ポテンシャルを調整して正孔注入性を向上させることを目的に、陽極表面を紫外線(UV)/オゾン処理したり、酸素プラズマ、アルゴンプラズマ処理したりすることが好ましい。 The surface of the anode is treated with ultraviolet (UV) / ozone, oxygen plasma, or argon plasma for the purpose of removing impurities adhering to the anode and adjusting the ionization potential to improve hole injection. Is preferred.
 発光層までの機能層に電子を供給する陰極9の材料としては、効率良く電子注入を行う為に仕事関数の低い金属が好ましく、例えば、スズ、マグネシウム、インジウム、カルシウム、アルミニウム、銀などの適当な金属又はそれらの合金が用いられる。具体例としては、マグネシウム-銀合金、マグネシウム-インジウム合金、アルミニウム-リチウム合金などの低仕事関数合金電極が挙げられる。 The material of the cathode 9 for supplying electrons to the functional layers up to the light emitting layer is preferably a metal having a low work function in order to perform electron injection efficiently, for example, tin, magnesium, indium, calcium, aluminum, silver, etc. New metals or their alloys are used. Specific examples include low work function alloy electrodes such as magnesium-silver alloy, magnesium-indium alloy, and aluminum-lithium alloy.
 なお、陰極9の材料は、1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。 In addition, only 1 type may be used for the material of the cathode 9, and 2 or more types may be used together by arbitrary combinations and a ratio.
 さらに、低仕事関数金属から成る陰極を保護する目的で、陰極の上に更に、仕事関数が高く大気に対して安定な金属層を積層すると、有機ELパネルの安定性が増すので好ましい。この目的のために、例えば、アルミニウム、銀、銅、ニッケル、クロム、金、白金などの金属が使われる。なお、これらの材料は、1種のみで用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。 Further, for the purpose of protecting the cathode made of a low work function metal, it is preferable to further stack a metal layer having a high work function and stable to the atmosphere on the cathode because the stability of the organic EL panel is increased. For this purpose, for example, metals such as aluminum, silver, copper, nickel, chromium, gold and platinum are used. In addition, these materials may be used only by 1 type and may use 2 or more types together by arbitrary combinations and a ratio.
 [機能積層体の機能層]
 [正孔注入層]
 正孔注入層3は、電子受容性化合物を含有する層とすることが好ましい。
[Functional layer of functional laminate]
[Hole injection layer]
The hole injection layer 3 is preferably a layer containing an electron accepting compound.
 湿式塗布法で形成する場合、正孔注入層形成用組成物は通常、正孔注入層の構成材料として正孔輸送性化合物及び溶媒を含有する。溶媒としては、限定されるものではないが、例えば、エーテル系溶媒、エステル系溶媒、芳香族炭化水素系溶媒、アミド系溶媒などが挙げられる。エーテル系溶媒としては、例えば、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、プロピレングリコールモノメチルエーテルアセテート(所謂、PGMEA)などの脂肪族エーテル、1,2-ジメトキシベンゼン、1,3-ジメトキシベンゼン、アニソール、フェネトール、2-メトキシトルエン、3-メトキシトルエン、4-メトキシトルエン、2,3-ジメチルアニソール、2,4-ジメチルアニソールなどの芳香族エーテル、などが挙げられる。 When forming by a wet coating method, the composition for forming a hole injection layer usually contains a hole transporting compound and a solvent as a constituent material of the hole injection layer. Examples of the solvent include, but are not limited to, ether solvents, ester solvents, aromatic hydrocarbon solvents, amide solvents, and the like. Examples of ether solvents include aliphatic ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether acetate (so-called PGMEA), 1,2-dimethoxybenzene, 1,3-dimethoxybenzene, anisole, and phenetole. , Aromatic ethers such as 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,3-dimethylanisole, and 2,4-dimethylanisole.
 エステル系溶媒としては、例えば、酢酸フェニル、プロピオン酸フェニル、安息香酸メチル、安息香酸エチル、安息香酸プロピル、安息香酸n-ブチルなどの芳香族エステル、などが挙げられる。 Examples of the ester solvent include aromatic esters such as phenyl acetate, phenyl propionate, methyl benzoate, ethyl benzoate, propyl benzoate, and n-butyl benzoate.
 芳香族炭化水素系溶媒としては、例えば、トルエン、キシレン、シクロヘキシルベンゼン、3-イロプロピルビフェニル、1,2,3,4-テトラメチルベンゼン、1,4-ジイソプロピルベンゼン、シクロヘキシルベンゼン、メチルナフタレンなどが挙げられる。 Examples of the aromatic hydrocarbon solvent include toluene, xylene, cyclohexylbenzene, 3- isopropylpropylphenyl, 1,2,3,4-tetramethylbenzene, 1,4-diisopropylbenzene, cyclohexylbenzene, methylnaphthalene and the like. Can be mentioned.
 アミド系溶媒としては、例えば、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、などが挙げられる。その他、ジメチルスルホキシド、なども用いることができる。これらの溶媒は1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で用いてもよい。 Examples of the amide solvent include N, N-dimethylformamide and N, N-dimethylacetamide. In addition, dimethyl sulfoxide and the like can also be used. These solvent may use only 1 type and may use 2 or more types by arbitrary combinations and a ratio.
 正孔輸送性化合物は、通常、有機ELパネルの正孔注入層に使用される、正孔輸送性を有する化合物であれば、重合体などの高分子化合物であっても、単量体などの低分子化合物であってもよいが、低分子化合物であることが好ましい。 As long as the hole transporting compound is a compound having a hole transporting property that is usually used in a hole injection layer of an organic EL panel, a polymer or the like may be a monomer or the like. Although it may be a low molecular compound, it is preferably a low molecular compound.
 正孔輸送性化合物としては、陽極から正孔注入層への電荷注入障壁の観点から4.5eV~6.0eVのイオン化ポテンシャルを有する化合物が好ましい。正孔輸送性化合物の例としては、芳香族アミン誘導体、フタロシアニン銅(所謂、CuPc)に代表されるフタロシアニン誘導体、ポルフィリン誘導体、オリゴチオフェン誘導体、ポリチオフェン誘導体、ベンジルフェニル誘導体、フルオレン基で3級アミンを連結した化合物、ヒドラゾン誘導体、シラザン誘導体、シラナミン誘導体、ホスファミン誘導体、キナクリドン誘導体、ポリアニリン誘導体、ポリピロール誘導体、ポリフェニレンビニレン誘導体、ポリチエニレンビニレン誘導体、ポリキノリン誘導体、ポリキノキサリン誘導体、カーボンなどが挙げられる。ここで誘導体とは、例えば、芳香族アミン誘導体を例にするならば、芳香族アミンそのもの及び芳香族アミンを主骨格とする化合物を含むものであり、重合体であっても、単量体であってもよい。 The hole transporting compound is preferably a compound having an ionization potential of 4.5 eV to 6.0 eV from the viewpoint of a charge injection barrier from the anode to the hole injection layer. Examples of hole transporting compounds include aromatic amine derivatives, phthalocyanine derivatives represented by phthalocyanine copper (so-called CuPc), porphyrin derivatives, oligothiophene derivatives, polythiophene derivatives, benzylphenyl derivatives, tertiary amines with fluorene groups. Examples include linked compounds, hydrazone derivatives, silazane derivatives, silanamine derivatives, phosphamine derivatives, quinacridone derivatives, polyaniline derivatives, polypyrrole derivatives, polyphenylene vinylene derivatives, polythienylene vinylene derivatives, polyquinoline derivatives, polyquinoxaline derivatives, and carbon. Here, the derivative includes, for example, an aromatic amine derivative, and includes an aromatic amine itself and a compound having an aromatic amine as a main skeleton. There may be.
 また、正孔輸送性化合物としては、ポリチオフェンの誘導体である3,4-エチレンジオキシチオフェンを高分子量ポリスチレンスルホン酸中で重合してなる導電性ポリマー(所謂、PEDOT/PSS)もまた好ましい。さらに、PEDOT/PSSのポリマーの末端をメタクリレートなどでキャップしたものであってもよい。 As the hole transporting compound, a conductive polymer obtained by polymerizing 3,4-ethylenedioxythiophene, which is a polythiophene derivative, in high molecular weight polystyrene sulfonic acid (so-called PEDOT / PSS) is also preferable. Furthermore, the end of the polymer of PEDOT / PSS may be capped with methacrylate or the like.
 正孔注入層の材料として用いられる正孔輸送性化合物は、このような化合物のうち何れか1種を単独で含有していてもよく、2種以上を含有していてもよい。2種以上の正孔輸送性化合物を含有する場合、その組み合わせは任意であるが、芳香族三級アミン高分子化合物1種又は2種以上と、その他の正孔輸送性化合物1種又は2種以上とを併用することもできる。非晶質性、可視光の透過率の点から、正孔注入層には芳香族アミン化合物が好ましく、特に芳香族三級アミン化合物が好ましい。ここで、芳香族三級アミン化合物とは、芳香族三級アミン構造を有する化合物であって、芳香族三級アミン由来の基を有する化合物も含む。 The hole transporting compound used as the material for the hole injection layer may contain any one of these compounds alone, or may contain two or more. In the case of containing two or more kinds of hole transporting compounds, the combination is arbitrary, but one or more kinds of aromatic tertiary amine polymer compounds and one or two kinds of other hole transporting compounds. The above can also be used together. From the viewpoints of amorphousness and visible light transmittance, an aromatic amine compound is preferable for the hole injection layer, and an aromatic tertiary amine compound is particularly preferable. Here, the aromatic tertiary amine compound is a compound having an aromatic tertiary amine structure, and includes a compound having a group derived from an aromatic tertiary amine.
 正孔注入層形成用組成物中の、正孔輸送性化合物の濃度は、膜厚の均一性の点で通常0.01重量%以上、好ましくは0.1重量%以上、さらに好ましくは0.5重量%以上、また、通常70重量%以下、好ましくは60重量%以下、さらに好ましくは50重量%以下である。この濃度が高すぎると膜厚ムラが生じる可能性があり、また、低すぎると成膜された正孔注入層に欠陥が生じる可能性がある。 The concentration of the hole transporting compound in the composition for forming a hole injection layer is usually 0.01% by weight or more, preferably 0.1% by weight or more, and more preferably 0.00% by weight in terms of film thickness uniformity. 5% by weight or more, usually 70% by weight or less, preferably 60% by weight or less, more preferably 50% by weight or less. If this concentration is too high, film thickness unevenness may occur, and if it is too low, defects may occur in the formed hole injection layer.
 正孔注入層形成用組成物は電子受容性化合物を含有することが好ましく、また、正孔輸送性化合物や電子受容性化合物に加えて、さらに、その他の成分を含有させてもよい。その他の成分の例としては、各種の有機EL材料、電子輸送性化合物、バインダー樹脂、塗布性改良剤などが挙げられる。なお、その他の成分は、1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。 The composition for forming a hole injection layer preferably contains an electron-accepting compound, and may further contain other components in addition to the hole-transporting compound and the electron-accepting compound. Examples of other components include various organic EL materials, electron transport compounds, binder resins, coatability improvers, and the like. In addition, only 1 type may be used for another component and it may use 2 or more types together by arbitrary combinations and ratios.
 湿式塗布法により正孔注入層を形成する場合、通常は、正孔注入層を構成する材料を適切な溶媒(正孔注入層用溶媒)と混合して成膜用の組成物(正孔注入層形成用組成物)を調製し、この正孔注入層形成用組成物を適切な手法により、陽極上に塗布して成膜し、乾燥することにより正孔注入層を形成する。 When forming a hole injection layer by a wet coating method, the material for forming the hole injection layer is usually mixed with an appropriate solvent (solvent for the hole injection layer) to form a composition for film formation (hole injection). A composition for forming a layer) is prepared, and this composition for forming a hole injection layer is coated on the anode by an appropriate technique to form a film and dried to form a hole injection layer.
 正孔注入層の膜厚は、通常5nm以上、好ましくは10nm以上、また、通常1000nm以下、好ましくは500nm以下の範囲である。 The film thickness of the hole injection layer is usually 5 nm or more, preferably 10 nm or more, and usually 1000 nm or less, preferably 500 nm or less.
 [正孔輸送層]
 正孔輸送層4の材料としては、従来、正孔輸送層の構成材料として用いられている材料であればよく、例えば、前述の正孔注入層に使用される正孔輸送性化合物として例示したものが挙げられる。また、アリールアミン誘導体、フルオレン誘導体、スピロ誘導体、カルバゾール誘導体、ピリジン誘導体、ピラジン誘導体、ピリミジン誘導体、トリアジン誘導体、キノリン誘導体、フェナントロリン誘導体、フタロシアニン誘導体、ポルフィリン誘導体、シロール誘導体、オリゴチオフェン誘導体、縮合多環芳香族誘導体、金属錯体などが挙げられる。また、例えば、ポリビニルカルバゾール誘導体、ポリアリールアミン誘導体、ポリビニルトリフェニルアミン誘導体、ポリフルオレン誘導体、ポリアリーレン誘導体、テトラフェニルベンジジンを含有するポリアリーレンエーテルサルホン誘導体、ポリアリーレンビニレン誘導体、ポリシロキサン誘導体、ポリチオフェン誘導体、ポリ(p-フェニレンビニレン)誘導体などが挙げられる。これらは、交互共重合体、ランダム重合体、ブロック重合体又はグラフト共重合体のいずれであってもよい。また、主鎖に枝分かれがあり末端部が3つ以上ある高分子や、所謂デンドリマーであってもよい。
[Hole transport layer]
The material for the hole transport layer 4 may be any material that has been conventionally used as a constituent material for the hole transport layer. Things. In addition, arylamine derivatives, fluorene derivatives, spiro derivatives, carbazole derivatives, pyridine derivatives, pyrazine derivatives, pyrimidine derivatives, triazine derivatives, quinoline derivatives, phenanthroline derivatives, phthalocyanine derivatives, porphyrin derivatives, silole derivatives, oligothiophene derivatives, condensed polycyclic aromatics Group derivatives, metal complexes and the like. Also, for example, polyvinylcarbazole derivatives, polyarylamine derivatives, polyvinyltriphenylamine derivatives, polyfluorene derivatives, polyarylene derivatives, polyarylene ether sulfone derivatives containing tetraphenylbenzidine, polyarylene vinylene derivatives, polysiloxane derivatives, polythiophenes Derivatives, poly (p-phenylene vinylene) derivatives, and the like. These may be any of an alternating copolymer, a random polymer, a block polymer, or a graft copolymer. Further, it may be a polymer having a branched main chain and three or more terminal portions, or a so-called dendrimer.
 湿式塗布法で正孔輸送層を形成する場合は、正孔注入層の形成と同様にして、正孔輸送層形成用組成物を調製した後、湿式成膜後、乾燥させる。 When the hole transport layer is formed by a wet coating method, a composition for forming a hole transport layer is prepared in the same manner as the formation of the hole injection layer, and then dried after wet film formation.
 正孔輸送層形成用組成物に、正孔輸送性化合物の他、溶媒を含有する。用いる溶媒は正孔注入層形成用組成物に用いたものと同様である。また、成膜条件、乾燥条件なども正孔注入層の形成の場合と同様である。 In addition to the hole transporting compound, the hole transporting layer forming composition contains a solvent. The solvent used is the same as that used for the composition for forming the hole injection layer. The film forming conditions, the drying conditions, and the like are the same as in the case of forming the hole injection layer.
 正孔輸送層は、正孔輸送性化合物の他、各種の有機EL材料、電子輸送性化合物、バインダー樹脂、塗布性改良剤などを含有していてもよい。 The hole transport layer may contain various organic EL materials, electron transport compounds, binder resins, coatability improvers, and the like in addition to the hole transport compound.
 正孔輸送層の膜厚は、通常5nm以上、好ましくは10nm以上であり、また通常300nm以下、好ましくは100nm以下である。 The film thickness of the hole transport layer is usually 5 nm or more, preferably 10 nm or more, and usually 300 nm or less, preferably 100 nm or less.
 上記したように少なくとも正孔注入層3又は正孔輸送層4は厚く塗布されることが好ましいので、陽極2から発光層5までの正孔注入層3及び/又は正孔輸送層4の膜厚の合計は少なくとも100nmであることが好ましい。 Since at least the hole injection layer 3 or the hole transport layer 4 is preferably applied thickly as described above, the film thickness of the hole injection layer 3 and / or the hole transport layer 4 from the anode 2 to the light emitting layer 5 Is preferably at least 100 nm.
 [発光層]
 赤緑混合発光層と青発光層の発光層は有機EL材料を含み、好ましくは、正孔輸送の性質を有する化合物(正孔輸送性化合物)、或いは、電子輸送の性質を有する化合物(電子輸送性化合物)を含有させることもできる。有機EL材料をドーパント材料として使用し、正孔輸送性化合物や電子輸送性化合物などをホスト材料として適宜使用してもよい。有機EL材料については特に限定はなく、所望の発光波長で発光し、発光効率が良好である物質を用いればよい。
[Light emitting layer]
The light-emitting layers of the red-green mixed light-emitting layer and the blue light-emitting layer contain an organic EL material, and preferably a compound having a hole transport property (hole transport compound) or a compound having an electron transport property (electron transport) A functional compound). An organic EL material may be used as a dopant material, and a hole transporting compound, an electron transporting compound, or the like may be appropriately used as a host material. There is no particular limitation on the organic EL material, and a substance that emits light at a desired emission wavelength and has good emission efficiency may be used.
 有機EL材料としては、任意の公知の材料を適用可能である。例えば、蛍光材料であってもよく、燐光材料であってもよいが、内部量子効率の観点から燐光材料を用いることが好ましい。発光層は単層構造としても、或いは所望により複数の材料からなる多層構造とすることもできる。例えば、青色発光層は蛍光材料を用い、緑色や赤色の発光層は燐光材料を用いるなど、様々な組み合わせで用いてもよい。また、発光層の間に拡散防止層を設けることもできる。 Any known material can be applied as the organic EL material. For example, it may be a fluorescent material or a phosphorescent material, but it is preferable to use a phosphorescent material from the viewpoint of internal quantum efficiency. The light emitting layer may have a single layer structure or a multilayer structure made of a plurality of materials as desired. For example, a fluorescent material may be used for the blue light emitting layer, and a phosphorescent material may be used for the green and red light emitting layers. Further, a diffusion preventing layer can be provided between the light emitting layers.
 青色発光を与える蛍光材料(青色蛍光色素)としては、例えば、ナフタレン、ペリレン、ピレン、クリセン、アントラセン、クマリン、p-ビス(2-フェニルエテニル)ベンゼン及びそれらの誘導体などが挙げられる。 Examples of fluorescent materials (blue fluorescent dyes) that emit blue light include naphthalene, perylene, pyrene, chrysene, anthracene, coumarin, p-bis (2-phenylethenyl) benzene, and derivatives thereof.
 緑色発光を与える蛍光材料(緑色蛍光色素)としては、例えば、キナクリドン誘導体、クマリン誘導体、Alq3(tris (8-hydroxy-quinoline) aluminum) などのアルミニウム錯体などが挙げられる。 Examples of the fluorescent material (green fluorescent dye) that emits green light include aluminum complexes such as quinacridone derivatives, coumarin derivatives, and Alq3 (tris (8-hydroxy-quinoline) aluminum).
 黄色発光を与える蛍光材料(黄色蛍光色素)としては、例えば、ルブレン、ペリミドン誘導体などが挙げられる。 Examples of fluorescent materials that give yellow light emission (yellow fluorescent dyes) include rubrene and perimidone derivatives.
 赤色発光を与える蛍光材料(赤色蛍光色素)としては、例えば、DCM(4-(dicyanomethylene)-2-methyl-6-(p-dimethylaminostyryl)-4H-pyran)系化合物、ベンゾピラン誘導体、ローダミン誘導体、ベンゾチオキサンテン誘導体、アザベンゾチオキサンテンなどが挙げられる。 Examples of fluorescent materials that give red light emission (red fluorescent dyes) include DCM (4- (dicyanomethylene) -2-methyl-6- (p-dimethylaminostyryl) -4H-pyran) compounds, benzopyran derivatives, rhodamine derivatives, benzoates. Examples thereof include thioxanthene derivatives and azabenzothioxanthene.
 燐光材料としては、例えば、長周期型周期表(以下、特に断り書きの無い限り「周期表」という場合には、長周期型周期表を指すものとする。)第7~11族から選ばれる金属を含む有機金属錯体が挙げられる。周期表第7~11族から選ばれる金属として、好ましくは、ルテニウム、ロジウム、パラジウム、銀、レニウム、オスミウム、イリジウム、白金、金などが挙げられる。錯体の配位子としては、(ヘテロ)アリールピリジン配位子、(ヘテロ)アリールピラゾール配位子などの(ヘテロ)アリール基とピリジン、ピラゾール、フェナントロリンなどが連結した配位子が好ましく、特にフェニルピリジン配位子、フェニルピラゾール配位子が好ましい。ここで、(ヘテロ)アリールとは、アリール基又はヘテロアリール基を表す。 The phosphorescent material is selected from, for example, the long-period periodic table (hereinafter referred to as the long-period periodic table when referring to “periodic table” unless otherwise specified). An organometallic complex containing a metal can be given. Preferred examples of the metal selected from Groups 7 to 11 of the periodic table include ruthenium, rhodium, palladium, silver, rhenium, osmium, iridium, platinum, and gold. As the ligand of the complex, a ligand in which a (hetero) aryl group such as a (hetero) arylpyridine ligand or a (hetero) arylpyrazole ligand and a pyridine, pyrazole, phenanthroline, or the like is connected is preferable. A pyridine ligand and a phenylpyrazole ligand are preferable. Here, (hetero) aryl represents an aryl group or a heteroaryl group.
 燐光材料として、具体的には、トリス(2-フェニルピリジン)イリジウム(所謂、Ir(ppy)3)、トリス(2-フェニルピリジン)ルテニウム、トリス(2-フェニルピリジン)パラジウム、ビス(2-フェニルピリジン)白金、トリス(2-フェニルピリジン)オスミウム、トリス(2-フェニルピリジン)レニウム、オクタエチル白金ポルフィリン、オクタフェニル白金ポルフィリン、オクタエチルパラジウムポルフィリン、オクタフェニルパラジウムポルフィリンなどが挙げられる。 Specific examples of phosphorescent materials include tris (2-phenylpyridine) iridium (so-called Ir (ppy) 3), tris (2-phenylpyridine) ruthenium, tris (2-phenylpyridine) palladium, and bis (2-phenyl). Pyridine) platinum, tris (2-phenylpyridine) osmium, tris (2-phenylpyridine) rhenium, octaethylplatinum porphyrin, octaphenylplatinum porphyrin, octaethyl palladium porphyrin, octaphenyl palladium porphyrin, and the like.
 有機EL材料として用いる化合物の分子量は、通常10000以下、好ましくは5000以下、より好ましくは4000以下、更に好ましくは3000以下、また、通常100以上、好ましくは200以上、より好ましくは300以上、更に好ましくは400以上の範囲である。有機EL材料の分子量が小さ過ぎると、耐熱性が著しく低下したり、ガス発生の原因となったり、膜を形成した際の膜質の低下を招いたり、或いはマイグレーションなどによる機能層のモルフォロジー変化を招来する場合がある。一方、有機EL材料の分子量が大き過ぎると、有機化合物の精製が困難となってしまったり、湿式塗布法で形成する場合の溶媒に溶解させる際に時間を要したりする傾向がある。 The molecular weight of the compound used as the organic EL material is usually 10,000 or less, preferably 5000 or less, more preferably 4000 or less, still more preferably 3000 or less, and usually 100 or more, preferably 200 or more, more preferably 300 or more, still more preferably. Is in the range of 400 or more. If the molecular weight of the organic EL material is too small, the heat resistance will be significantly reduced, gas generation will be caused, the film quality will be deteriorated when the film is formed, or the morphology of the functional layer will be changed due to migration, etc. There is a case. On the other hand, if the molecular weight of the organic EL material is too large, it tends to be difficult to purify the organic compound, or it may take time to dissolve the organic EL material in a solvent when formed by a wet coating method.
 なお、有機EL材料は、いずれか1種のみを用いてもよく、2種以上を任意の組み合わせと比率で併用してもよい。発光層における有機EL材料の割合は、通常0.05重量%以上、通常35重量%以下である。有機EL材料が少なすぎると発光ムラを生じる可能性があり、多すぎると発光効率が低下する可能性がある。なお、2種以上の有機EL材料を併用する場合には、これらの合計の含有量が上記範囲に含まれるようにする。発光層における含有量が最も多い成分をホスト材料とより少ない成分をゲスト材料と呼ぶ。 In addition, only 1 type may be used for an organic EL material, and 2 or more types may be used together by arbitrary combinations and a ratio. The proportion of the organic EL material in the light emitting layer is usually 0.05% by weight or more and usually 35% by weight or less. If the amount of the organic EL material is too small, uneven light emission may occur, and if the amount is too large, the light emission efficiency may be reduced. In addition, when using together 2 or more types of organic EL material, it is made for the total content of these to be contained in the said range. The component having the highest content in the light emitting layer is called a host material, and the component having a smaller content is called a guest material.
 発光層には、その構成材料として、正孔輸送性化合物を含有させてもよい。ここで、正孔輸送性化合物のうち、低分子量の正孔輸送性化合物の例としては、前述の正孔注入層3における正孔輸送性化合物として例示した各種の化合物のほか、例えば、4,4’-ビス
[N-(1-ナフチル)-N-フェニルアミノ]ビフェニル(所謂、α-NPD)に代表される、2個以上の3級アミンを含み2個以上の縮合芳香族環が窒素原子に置換した芳香族ジアミン類や、4,4’,4”-トリス(1-ナフチルフェニルアミノ)トリフェニル
アミンなどのスターバースト構造を有する芳香族アミン化合物や、トリフェニルアミンの四量体から成る芳香族アミン化合物や、2,2’,7,7’-テトラキス-(ジフェニル
アミノ)-9,9’-スピロビフルオレンなどのスピロ化合物などが挙げられる。
The light emitting layer may contain a hole transporting compound as a constituent material. Here, among the hole transporting compounds, examples of the low molecular weight hole transporting compound include various compounds exemplified as the hole transporting compound in the hole injection layer 3 described above, for example, 2 'or more condensed aromatic rings containing 2 or more tertiary amines represented by 4'-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (so-called α-NPD) are nitrogen From aromatic diamines substituted with atoms, aromatic amine compounds having a starburst structure such as 4,4 ′, 4 ″ -tris (1-naphthylphenylamino) triphenylamine, and tetramers of triphenylamine And spiro compounds such as 2,2 ′, 7,7′-tetrakis- (diphenylamino) -9,9′-spirobifluorene.
 なお、発光層において、正孔輸送性化合物は、1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。 In addition, in a light emitting layer, only 1 type may be used for a hole transportable compound, and it may use 2 or more types together by arbitrary combinations and a ratio.
 発光層における正孔輸送性化合物の割合は、通常0.1重量%以上、通常65重量%以下である。正孔輸送性化合物が少なすぎると短絡の影響を受けやすくなる可能性があり、多すぎると膜厚ムラを生じる可能性がある。なお、2種以上の正孔輸送性化合物を併用する場合には、これらの合計の含有量が上記範囲に含まれるようにする。 The proportion of the hole transporting compound in the light emitting layer is usually 0.1% by weight or more and usually 65% by weight or less. If the amount of the hole transporting compound is too small, it may be easily affected by a short circuit, and if it is too large, the film thickness may be uneven. In addition, when using together 2 or more types of hole transportable compounds, it is made for the total content of these to be contained in the said range.
 発光層には、その構成材料として、電子輸送性化合物を含有させてもよい。ここで、電子輸送性化合物のうち、低分子量の電子輸送性化合物の例としては、2,5-ビス(1-ナフチル)-1,3,4-オキサジアゾール(所謂、BND)や、2,5-ビス(6’-
(2’,2”-ビピリジル))-1,1-ジメチル-3,4-ジフェニルシロール(所謂
、PyPySPyPy)や、バソフェナントロリン(所謂、BPhen)や、2,9-ジメチル-4,7-ジフェニル-1,10-フェナントロリン(所謂、BCP、バソクプロイン)、2-(4-ビフェニリル)-5-(p-ターシャルブチルフェニル)-1,3,4-オキサジアゾール(所謂、tBu-PBD)や、4,4’-ビス(9H-カルバゾー
ル-9-イル)ビフェニル(所謂、CBP)などが挙げられる。なお、発光層において、電子輸送性化合物は、1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。
The light emitting layer may contain an electron transporting compound as a constituent material. Here, among the electron transporting compounds, examples of low molecular weight electron transporting compounds include 2,5-bis (1-naphthyl) -1,3,4-oxadiazole (so-called BND), 2 , 5-bis (6'-
(2 ′, 2 ″ -bipyridyl))-1,1-dimethyl-3,4-diphenylsilole (so-called PyPySPyPy), bathophenanthroline (so-called BPhen), 2,9-dimethyl-4,7-diphenyl 1,10-phenanthroline (so-called BCP, bathocuproin), 2- (4-biphenylyl) -5- (p-tert-butylphenyl) -1,3,4-oxadiazole (so-called tBu-PBD), 4,4′-bis (9H-carbazol-9-yl) biphenyl (so-called CBP), etc. In the light emitting layer, only one kind of electron transporting compound may be used. The above may be used in any combination and ratio.
 発光層における電子輸送性化合物の割合は、通常0.1重量%以上、通常65重量%以下である。電子輸送性化合物が少なすぎると短絡の影響を受けやすくなる可能性があり、多すぎると膜厚ムラを生じる可能性がある。なお、2種以上の電子輸送性化合物を併用する場合には、これらの合計の含有量が上記範囲に含まれるようにする。 The proportion of the electron transporting compound in the light emitting layer is usually 0.1% by weight or more and usually 65% by weight or less. If the amount of the electron transporting compound is too small, it may be easily affected by a short circuit, and if it is too large, the film thickness may be uneven. In addition, when using together 2 or more types of electron transport compounds, it is made for the total content of these to be contained in the said range.
 湿式塗布法で形成する場合、発光層は、上記発光層材料を適切な溶媒に溶解させて発光層形成用組成物を調製し、それを用いて湿式成膜後、乾燥させ、溶媒を除去することにより、形成される。よって、湿式塗布法で形成する場合、発光層塗布液には、発光層となるべき少なくとも2種類の固形分(ホスト材料とゲスト材料)が溶質として溶媒に分散又は溶解されて、調製される。用いる溶媒は正孔注入層形成用組成物に用い得る上記溶媒から選択され得る。 In the case of forming by a wet coating method, the light emitting layer is prepared by dissolving the above light emitting layer material in an appropriate solvent to prepare a composition for forming a light emitting layer. Is formed. Therefore, in the case of forming by a wet coating method, the light emitting layer coating solution is prepared by dispersing or dissolving at least two kinds of solid contents (host material and guest material) to be the light emitting layer as a solute in a solvent. The solvent to be used can be selected from the solvents that can be used for the composition for forming a hole injection layer.
 発光層を形成するための発光層形成用組成物に対する発光層用溶媒の比率は、通常0.01重量%以上、通常70重量%以下、である。なお、発光層用溶媒として2種以上の溶媒を混合して用いる場合には、これらの溶媒の合計がこの範囲を満たすようにする。 The ratio of the light emitting layer solvent to the light emitting layer forming composition for forming the light emitting layer is usually 0.01% by weight or more and usually 70% by weight or less. In addition, when using 2 or more types of solvents mixed as a solvent for light emitting layers, it is made for the sum total of these solvents to satisfy | fill this range.
 発光層の膜厚は通常3nm以上、好ましくは5nm以上、また、通常200nm以下、好ましくは100nm以下の範囲である。発光層の膜厚が、薄すぎると膜に欠陥が生じる可能性があり、厚すぎると駆動電圧が上昇する可能性がある。 The film thickness of the light emitting layer is usually 3 nm or more, preferably 5 nm or more, and usually 200 nm or less, preferably 100 nm or less. If the light emitting layer is too thin, defects may occur in the film, and if it is too thick, the driving voltage may increase.
 [電子輸送層]
 電子輸送層7は、有機ELパネルの発光効率を更に向上させることを目的として設けられるもので、電界を与えられた電極間において陰極から注入された電子を効率よく発光層の方向に輸送することができる化合物より形成される。
[Electron transport layer]
The electron transport layer 7 is provided for the purpose of further improving the light emission efficiency of the organic EL panel, and efficiently transports electrons injected from the cathode between the electrodes to which an electric field is applied in the direction of the light emitting layer. Formed from a compound capable of
 電子輸送層に用いられる電子輸送性化合物としては、通常、陰極9又は電子注入層8からの電子注入効率が高く、且つ、高い電子移動度を有し注入された電子を効率よく輸送することができる化合物を用いる。このような条件を満たす化合物としては、例えば、Alq3や10-ヒドロキシベンゾ[h]キノリンの金属錯体、オキサジアゾール誘導体、ジスチリルビフェニル誘導体、シロール誘導体、3-ヒドロキシフラボン金属錯体、5-ヒドロキシフラボン金属錯体、ベンズオキサゾール金属錯体、ベンゾチアゾール金属錯体、トリスベンズイミダゾリルベンゼン、キノキサリン化合物、フェナントロリン誘導体、2-t-ブチル-9,10-N,N’-ジシアノアントラキノンジイミン、n型水素化非晶
質炭化シリコン、n型硫化亜鉛、n型セレン化亜鉛などが挙げられる。
As the electron transporting compound used for the electron transport layer, usually, the electron injection efficiency from the cathode 9 or the electron injection layer 8 is high, and the injected electrons having high electron mobility can be efficiently transported. Use possible compounds. Examples of compounds that satisfy such conditions include metal complexes of Alq3 and 10-hydroxybenzo [h] quinoline, oxadiazole derivatives, distyrylbiphenyl derivatives, silole derivatives, 3-hydroxyflavone metal complexes, and 5-hydroxyflavones. Metal complex, benzoxazole metal complex, benzothiazole metal complex, trisbenzimidazolylbenzene, quinoxaline compound, phenanthroline derivative, 2-t-butyl-9,10-N, N′-dicyanoanthraquinonediimine, n-type hydrogenated amorphous Quality silicon carbide, n-type zinc sulfide, n-type zinc selenide and the like.
 なお、電子輸送層の材料は、1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。 In addition, only 1 type may be used for the material of an electron carrying layer, and 2 or more types may be used together by arbitrary combinations and a ratio.
 電子輸送層の形成方法に制限はなく、湿式塗布法または乾式塗布法で形成することができる。湿式塗布法で形成する場合、電子輸送層は、上記電子輸送層材料を適切な溶媒に溶解させて電子輸送層形成用組成物を調製し、それを用いて湿式成膜後、乾燥させ、溶媒を除去することにより、形成される。用いる溶媒は正孔注入層形成用組成物に用い得る上記溶媒から選択され得る。 The formation method of the electron transport layer is not limited, and can be formed by a wet coating method or a dry coating method. In the case of forming by a wet coating method, the electron transport layer is prepared by dissolving the electron transport layer material in an appropriate solvent to prepare a composition for forming an electron transport layer. It is formed by removing. The solvent to be used can be selected from the solvents that can be used for the composition for forming a hole injection layer.
 電子輸送層の膜厚は、通常1nm以上、好ましくは5nm以上、また、通常300nm以下、好ましくは100nm以下の範囲である。 The film thickness of the electron transport layer is usually 1 nm or more, preferably 5 nm or more, and usually 300 nm or less, preferably 100 nm or less.
 [電子注入層]
 電子注入層8は、陰極から注入された電子を効率良く発光層へ注入する役割を果たす。電子注入を効率よく行うには、電子注入層を形成する材料は、仕事関数の低い金属が好ましい。例としては、ナトリウムやセシウムなどのアルカリ金属、バリウムやカルシウムなどのアルカリ土類金属、それらの化合物(CsF、Cs2CO3、Li2O、LiF)などが用いられ、その膜厚は通常0.1nm以上、5nm以下が好ましい。
[Electron injection layer]
The electron injection layer 8 plays a role of efficiently injecting electrons injected from the cathode into the light emitting layer. In order to perform electron injection efficiently, the material for forming the electron injection layer is preferably a metal having a low work function. Examples include alkali metals such as sodium and cesium, alkaline earth metals such as barium and calcium, and their compounds (CsF, Cs 2 CO 3 , Li 2 O, LiF) and the like. .1 nm or more and 5 nm or less are preferable.
 更に、バソフェナントロリンなどの含窒素複素環化合物や8-ヒドロキシキノリンのアルミニウム錯体などの金属錯体に代表される有機電子輸送化合物に、ナトリウム、カリウム、セシウム、リチウム、ルビジウムなどのアルカリ金属をドープすることにより、電子注入輸送性が向上し優れた膜質を両立させることが可能となる。この場合の膜厚は、通常、5nm以上、中でも10nm以上が好ましく、また、通常200nm以下、中でも100nm以下が好ましい。 Further, an organic electron transport compound represented by a metal complex such as a nitrogen-containing heterocyclic compound such as bathophenanthroline or an aluminum complex of 8-hydroxyquinoline is doped with an alkali metal such as sodium, potassium, cesium, lithium, or rubidium. As a result, the electron injecting and transporting properties can be improved and excellent film quality can be achieved at the same time. In this case, the film thickness is usually 5 nm or more, preferably 10 nm or more, and is usually 200 nm or less, preferably 100 nm or less.
 なお、電子注入層の材料は、1種のみを用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。 In addition, only 1 type may be used for the material of an electron injection layer, and 2 or more types may be used together by arbitrary combinations and a ratio.
 電子注入層の形成方法に制限はなく、湿式塗布法または乾式塗布法で形成することができる。湿式塗布法で形成する場合、電子注入層は、上記電子注入層材料を適切な溶媒に溶解させて電子注入層形成用組成物を調製し、それを用いて湿式成膜後、乾燥させ、溶媒を除去することにより、形成される。用いる溶媒は正孔注入層形成用組成物に用い得る上記溶媒から選択され得る。 The formation method of the electron injection layer is not limited, and can be formed by a wet coating method or a dry coating method. In the case of forming by a wet coating method, the electron injection layer is prepared by dissolving the electron injection layer material in a suitable solvent to prepare a composition for forming an electron injection layer. It is formed by removing. The solvent to be used can be selected from the solvents that can be used for the composition for forming a hole injection layer.
 以下、本発明の実施例の一例を図面を参照しつつ詳細に説明する。 Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings.
 図3~図10は本発明が適用された有機ELパネルの製造方法の製造過程における基板とその上に形成された構造物を示す断面図である。かかる製造過程を下記の(a)洗浄工程、(b)陽極形成工程、(c)正孔輸送層形成工程、(d)塗布発光層形成工程、及び(e)蒸着発光層形成工程の順に説明する。 3 to 10 are cross-sectional views showing a substrate and a structure formed thereon in the manufacturing process of the organic EL panel manufacturing method to which the present invention is applied. This manufacturing process will be described in the order of the following (a) cleaning step, (b) anode forming step, (c) hole transport layer forming step, (d) coating light emitting layer forming step, and (e) vapor deposition light emitting layer forming step. To do.
 (a)洗浄工程
 先ず、例えば、図3に示すように、洗浄された厚さ0.7mmのガラス板からなる透明な基板1を用意する。図3においては、方向Xに直交する並置方向Yに沿った断面を示しており、このことは以下の図においても同様である。
(A) Cleaning Step First, as shown in FIG. 3, for example, a transparent substrate 1 made of a cleaned glass plate having a thickness of 0.7 mm is prepared. In FIG. 3, the cross section along the juxtaposition direction Y orthogonal to the direction X is shown, and this also applies to the following drawings.
 (b)陽極形成工程
 図4に示すように、基板1の主面から離れて配置された非密着若しくは密着のマスクを用いたスパッタリング法によって、基板1の主面上にIZO(In23-ZnO)の透明陽極2が形成される。基板1上にマスクのパターン開口を介してIZOターゲットの飛沫材料を付着させて、エッジにテーパが付いた所定パターンのIZO膜が陽極2(透明導電性膜)として得られる。該飛沫材料がマスク開口からマスク基板間に回り込むために、透明陽極2の主面の平滑主面2Aからその縁部2Bに向けて膜厚が漸次減少するテーパ側面2Cが形成される。
(B) Anode formation step As shown in FIG. 4, an IZO (In 2 O 3) layer is formed on the main surface of the substrate 1 by sputtering using a non-contact or contact mask disposed away from the main surface of the substrate 1. A transparent anode 2 of -ZnO) is formed. A spray material of an IZO target is deposited on the substrate 1 through the pattern opening of the mask, and an IZO film having a predetermined pattern with a tapered edge is obtained as the anode 2 (transparent conductive film). Since the splash material wraps around between the mask opening and the mask substrate, a tapered side surface 2C in which the film thickness gradually decreases from the smooth main surface 2A of the main surface of the transparent anode 2 toward the edge portion 2B is formed.
 陽極2の厚さは例えば、1000nmである。 The thickness of the anode 2 is 1000 nm, for example.
 (c)正孔注入・輸送層形成工程
 先ず、エキシマ光照射装置(図示せず)を用いて前処理として、陽極2上にUV/O3(紫外線/オゾン)が照射され、IZO表面を洗浄する。
(C) Hole Injection / Transport Layer Formation Step First, as a pretreatment using an excimer light irradiation device (not shown), UV / O 3 (ultraviolet / ozone) is irradiated on the anode 2 to clean the IZO surface. To do.
 正孔注入層材料として、ホストとしてPEDOT(ポリ3,4-エチレンジオキシチオフェン)とドーパントとしてPSS(ポリスチレンスルホン酸)を用いた固定分濃度1wt%の水分散溶液を調製しておく。 As the hole injection layer material, an aqueous dispersion having a fixed concentration of 1 wt% using PEDOT (poly 3,4-ethylenedioxythiophene) as a host and PSS (polystyrene sulfonic acid) as a dopant is prepared.
 前処理後、図5に示すようにインクジェット装置にて正孔注入層材料用の液滴Lqがインクジェットヘッド12により陽極2の全面上へ塗布される。例えば、インクジェットヘッド12を陽極2上のXY平面においてラスタスキャン移動させることにより、塗布された液滴OGの縁部同士が繋がって陽極2の縁部をも覆う液滴膜が成膜される。 After the pretreatment, as shown in FIG. 5, the droplet Lq for the hole injection layer material is applied onto the entire surface of the anode 2 by the inkjet head 12 using an inkjet apparatus. For example, when the inkjet head 12 is raster-scanned on the XY plane on the anode 2, a droplet film that covers the edges of the anode 2 by connecting the edges of the applied droplets OG is formed.
 次に、真空乾燥装置を用いてかかる液滴膜は気体圧力0.1~50Paにて2分間に亘り真空乾燥され、230℃での1時間に亘る加熱処理により焼成される。図6に示すように液滴の溶媒が蒸発して陽極2の縁部をも覆う硬化した正孔注入層3が得られる。 Next, the droplet film is vacuum-dried at a gas pressure of 0.1 to 50 Pa for 2 minutes using a vacuum drying apparatus, and baked by heat treatment at 230 ° C. for 1 hour. As shown in FIG. 6, the solvent of the droplets evaporates to obtain a cured hole injection layer 3 that covers the edge of the anode 2.
 かかる正孔注入層と同様に、インクジェット法により、1,1-ビス(4-ジ-p-トリルアミノフェニル)シクロヘキサンの所定濃度の有機溶媒液滴を用いて、正孔輸送層4が図7に示すように正孔注入層3の全面上に塗布、乾燥される。これら正孔注入層3及び正孔輸送層4の厚さは例えば、それぞれ50nmである。
(d)塗布発光層形成工程
 赤緑混合発光層材料として、ホストとしてBalq(Bis-(2-methyl-8- quinolinolato)(p-phenylphenolato)aluminum)を、ドーパントとしてHex-Ir(phq)3(Tris[2-(4-n-hexylphenyl)quinoline)]iridium(III))を用いた固定分濃度6wt%の有機溶液を調製しておく。
Similarly to the hole injection layer, the hole transport layer 4 is formed by using an organic solvent droplet having a predetermined concentration of 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane by an inkjet method. As shown in FIG. 2, the entire surface of the hole injection layer 3 is applied and dried. Each of the hole injection layer 3 and the hole transport layer 4 has a thickness of 50 nm, for example.
(D) Coating light emitting layer forming step As a red / green mixed light emitting layer material, Balq (Bis- (2-methyl-8-quinolinolato) (p-phenylphenolato) aluminum) is used as a host, and Hex-Ir (phq) 3 ( An organic solution having a fixed concentration of 6 wt% using Tris [2- (4-n-hexylphenyl) quinoline)] iridium (III)) is prepared in advance.
 上述のインクジェット法と同様にインクジェットヘッド12により、図8に示すように、かかる赤緑混合発光層材料液滴Lqが正孔輸送層4の全面上へ塗布される。 As shown in FIG. 8, the red / green mixed light emitting layer material droplet Lq is applied onto the entire surface of the hole transport layer 4 by the inkjet head 12 in the same manner as the inkjet method described above.
 次に、真空乾燥装置を用いて液滴膜は気体圧力0.1~50Paにて2分間に亘って真空乾燥され、そして、10分間に亘る130℃での加熱処理により焼成される。この結果、図9に示すように、正孔輸送層4を覆う硬化した赤緑混合発光層5が得られる。赤緑混合発光層5の厚さは例えば、40nmである。
(e)蒸着発光層形成工程
 真空蒸着装置を用いて、赤緑混合発光層5上に、ホストの9,10-ジ(2-ナフチル)アントラセン(所謂、ADN)と、濃度6wt%となるようにドーパントの4,4’-ビス(2、2’-ジフェニルビニル)ビフェニル(所謂、DPVBi)とが共に真空蒸着され、これにより青発光層6が例えば、15nmの厚さで形成される。
Next, the droplet film is vacuum-dried for 2 minutes at a gas pressure of 0.1 to 50 Pa using a vacuum drying apparatus, and baked by heat treatment at 130 ° C. for 10 minutes. As a result, as shown in FIG. 9, a cured red-green mixed light emitting layer 5 covering the hole transport layer 4 is obtained. The thickness of the red / green mixed light emitting layer 5 is, for example, 40 nm.
(E) Vapor Deposition Layer Formation Step Using a vacuum deposition apparatus, the host 9,10-di (2-naphthyl) anthracene (so-called ADN) and the concentration of 6 wt% are formed on the red-green mixed light-emitting layer 5. The dopant 4,4′-bis (2,2′-diphenylvinyl) biphenyl (so-called DPVBi) is vacuum-deposited together, whereby the blue light emitting layer 6 is formed with a thickness of, for example, 15 nm.
 次に、青発光層6上に真空蒸着法にてAlq3が真空蒸着され、これによりAlq3の電子輸送層7が例えば、30nmの厚さで形成される。 Next, Alq3 is vacuum-deposited on the blue light emitting layer 6 by a vacuum deposition method, whereby an Alq3 electron transport layer 7 is formed to a thickness of, for example, 30 nm.
 次いで、電子輸送層7上に真空蒸着法にてLiF(フッ化リチウム)が真空蒸着され、これにより電子注入層8が例えば、1nmの厚さで形成される。 Next, LiF (lithium fluoride) is vacuum-deposited on the electron transport layer 7 by a vacuum deposition method, whereby the electron injection layer 8 is formed with a thickness of, for example, 1 nm.
 最後に、電子注入層8上に真空蒸着法にて所定パターン開口のマスクを用いてAl(アルミニウム)が真空蒸着され、これにより陰極9が例えば、80nmの厚さで形成される。図10に示すように、ここで正孔注入層3から電子注入層8まで機能積層体FLBが形成される。陰極9は、方向Xに直交する並置方向Yに沿って透明陽極2と交差するように帯状に成膜される。機能積層体FLBを挟む陽極2と陰極9が重なる部分は有機ELパネルの発光エリアを画定する。その後、封止工程を経て、封止された有機ELパネルを得ることができる。機能積層体FLBは陽極2及び陰極9が重なる交差部の発光エリア内の少なくとも陽極2の側面を被覆しているので、絶縁膜が無くとも陽極2及び陰極9間の短絡防止や陰極断線の抑制が可能となる。 Finally, Al (aluminum) is vacuum-deposited on the electron injection layer 8 by a vacuum deposition method using a mask having a predetermined pattern opening, whereby the cathode 9 is formed with a thickness of, for example, 80 nm. As shown in FIG. 10, the functional laminate FLB is formed from the hole injection layer 3 to the electron injection layer 8 here. The cathode 9 is formed in a strip shape so as to cross the transparent anode 2 along the juxtaposed direction Y orthogonal to the direction X. A portion where the anode 2 and the cathode 9 overlap with each other to sandwich the functional laminate FLB defines a light emitting area of the organic EL panel. Thereafter, a sealed organic EL panel can be obtained through a sealing step. Since the functional laminate FLB covers at least the side surface of the anode 2 in the light emitting area where the anode 2 and the cathode 9 overlap, even if there is no insulating film, the short circuit between the anode 2 and the cathode 9 and the cathode disconnection are suppressed. Is possible.
 このように実施例によれば、(a)洗浄工程、(b)陽極形成工程、(c)正孔輸送層形成工程、(d)塗布発光層形成工程及び(e)蒸着発光層形成工程によって有機ELパネルが製造されている。上記実施例では、青発光層6を真空蒸着法により成膜したが、発光層すべてをインクジェット塗布工程と乾燥工程の組で成膜して、それぞれの機能を果たす機能層ごとに塗布と乾燥を順次繰り返して、図10に示すように、多層の機能積層体FLB(正孔注入層3/正孔輸送層4/赤緑混合発光層5/青発光層6/電子輸送層7)が形成されてもよい。 Thus, according to the embodiment, (a) cleaning step, (b) anode forming step, (c) hole transport layer forming step, (d) coating light emitting layer forming step, and (e) vapor deposition light emitting layer forming step. An organic EL panel is manufactured. In the above embodiment, the blue light-emitting layer 6 is formed by vacuum deposition, but all the light-emitting layers are formed by a combination of an ink jet coating process and a drying process, and coating and drying are performed for each functional layer that performs each function. Repeatedly, as shown in FIG. 10, a multilayer functional laminate FLB (hole injection layer 3 / hole transport layer 4 / red / green mixed light emitting layer 5 / blue light emitting layer 6 / electron transport layer 7) is formed. May be.
 例えば、従来の有機LEDでは絶縁性のバンク材が用いられており、そのバンク材は一般的にポリイミド材質など可視域に吸収がある材料の使用が多いため、陰極の金属色である色合いに対して外観を損ねる場合がある。また、可視域に吸収材料があるため、発光した光がバンクで損失する可能性がある。これに対し、上記した実施例においてはバンク材などの絶縁膜がなく、有機ELパネルから放出されるので従来よりも高開口率を得ることができる。上記したように開口率の増加のために発光した光を効率より放出させることができるので、所望の光量を得るために従来の素子より消費電力を低減させることができる。 For example, in the conventional organic LED, an insulating bank material is used, and since the bank material generally uses a material that absorbs in the visible region such as a polyimide material, the color of the cathode is a metallic color. May damage the appearance. Moreover, since there is an absorbing material in the visible region, the emitted light may be lost in the bank. On the other hand, in the above-described embodiments, there is no insulating film such as a bank material and the organic EL panel emits, so that a higher aperture ratio can be obtained than before. As described above, since the emitted light can be emitted more efficiently for increasing the aperture ratio, the power consumption can be reduced as compared with the conventional element in order to obtain a desired light amount.
 上記した実施例においては、陽極2(透明導電性膜)上に正孔注入層3及び正孔輸送層4の2層が形成されているが、2層が形成されることに限定されず、正孔注入層又は正孔輸送層の1層だけ、或いは正孔注入層と正孔輸送層に電子阻止層(図示せず)を加えた3層以上が発光層までに形成されても良い。 In the above-described embodiment, two layers of the hole injection layer 3 and the hole transport layer 4 are formed on the anode 2 (transparent conductive film), but it is not limited to the formation of two layers, Only one layer of the hole injection layer or the hole transport layer, or three or more layers obtained by adding an electron blocking layer (not shown) to the hole injection layer and the hole transport layer may be formed by the light emitting layer.
 また、上記した実施例において示した各工程での各膜の形成方法、各膜の幅及び厚さ、加熱温度、加熱時間などの条件は一例に過ぎず、本発明はこれに限定されない。 In addition, the conditions such as the formation method of each film, the width and thickness of each film, the heating temperature, and the heating time in each step shown in the above-described embodiments are merely examples, and the present invention is not limited thereto.
 [他の実施例]
 上記の実施例においては、陽極2は、非密着若しくは密着のマスクを用いたスパッタリング法にてパタニングされている。陽極2はスパッタリング法の他、スクリーン印刷、インクジェット法、スプレーコート法、ロールコート法、有版印刷法など湿式塗布法により形成することもできる。
[Other embodiments]
In the above-described embodiment, the anode 2 is patterned by a sputtering method using a non-contact or close contact mask. The anode 2 can be formed by a wet coating method such as a screen printing method, an ink jet method, a spray coating method, a roll coating method, and a plate printing method in addition to the sputtering method.
 例えば、インクジェット法の印刷により、基板上にIZOペーストを塗布してIZOペースト塗布膜を成膜する。図11に示すようにIZOペーストの液滴Lqがインクジェットヘッド12により基板1上へ所定パターンで塗布される。そして基板1を乾燥(例えば150~200℃)後に、焼成(例えば400~600℃)を施して、図12に示すように基板1上に所定パターンの陽極2を形成できる。この製造方法の場合には、陽極2がマスクやエッチング工程なしで形成できる故に、陽極2の成膜が簡単になる。さらに、印刷によるダレによって容易に、平滑主面2Aと縁部2Bに向けて膜厚が漸次減少するテーパ側面2Cとを有するIZOの陽極2(透明導電性膜)が得られる。 For example, an IZO paste is applied on a substrate by inkjet printing to form an IZO paste coating film. As shown in FIG. 11, droplets Iq of IZO paste are applied in a predetermined pattern onto the substrate 1 by the inkjet head 12. Then, the substrate 1 is dried (for example, 150 to 200 ° C.) and then fired (for example, 400 to 600 ° C.) to form the anode 2 having a predetermined pattern on the substrate 1 as shown in FIG. In the case of this manufacturing method, since the anode 2 can be formed without a mask or an etching process, the film formation of the anode 2 is simplified. Furthermore, an IZO anode 2 (transparent conductive film) having a smooth main surface 2A and a tapered side surface 2C whose thickness gradually decreases toward the edge 2B can be easily obtained by sagging by printing.
 1 基板
 2 陽極
 3 正孔注入層
 4 正孔輸送層
 5 赤緑混合発光層
 6 青発光層
 7 電子輸送層
 8 電子注入層
 9 陰極
DESCRIPTION OF SYMBOLS 1 Substrate 2 Anode 3 Hole injection layer 4 Hole transport layer 5 Red-green mixed light emission layer 6 Blue light emission layer 7 Electron transport layer 8 Electron injection layer 9 Cathode

Claims (6)

  1.  基板と、前記基板上に積層された透明導電性膜と、前記透明導電性膜上に積層された少なくとも1層の発光層を含む機能積層体と、前記機能積層体上に積層された対向電極膜とを含む有機ELパネルであって、
     前記機能積層体は前記透明導電性膜及び前記対向電極膜が重なる交差部の内の少なくとも前記透明導電性膜の側面を被覆していることを特徴とする有機ELパネル。
    A substrate, a transparent conductive film laminated on the substrate, a functional laminate including at least one light emitting layer laminated on the transparent conductive film, and a counter electrode laminated on the functional laminate An organic EL panel including a film,
    The organic EL panel, wherein the functional laminate covers at least a side surface of the transparent conductive film in an intersecting portion where the transparent conductive film and the counter electrode film overlap.
  2.  前記透明導電性膜の少なくとも一部はその最縁端に向けて膜厚が漸次減少するテーパ側面を有し、
     前記機能積層体は前記透明導電性膜の前記テーパ側面を被覆していることを特徴とする請求項1記載の有機ELパネル。
    At least a part of the transparent conductive film has a tapered side surface in which the film thickness gradually decreases toward the outermost edge,
    The organic EL panel according to claim 1, wherein the functional laminate covers the tapered side surface of the transparent conductive film.
  3.  前記機能積層体の端部の少なくとも一部が前記基板に達していることを特徴とする請求項2記載の有機ELパネル。 3. The organic EL panel according to claim 2, wherein at least a part of an end portion of the functional laminate reaches the substrate.
  4.  前記対向電極膜の端部の少なくとも一部が前記基板に達していることを特徴とする請求項2記載の有機ELパネル。 3. The organic EL panel according to claim 2, wherein at least a part of the end portion of the counter electrode film reaches the substrate.
  5.  前記透明導電性膜は湿式塗布法又はマスクを用いたスパッタリング法で形成されていることを特徴とする請求項1記載の有機ELパネル。 2. The organic EL panel according to claim 1, wherein the transparent conductive film is formed by a wet coating method or a sputtering method using a mask.
  6.  基板と、前記基板上に積層された透明導電性膜と、前記透明導電性膜上に積層された少なくとも1層の発光層を含む機能積層体と、前記機能積層体上に積層された対向電極膜とを含む有機ELパネルの製造方法であって、
     前記基板上に透明導電性膜を形成するステップと、
     前記透明導電性膜を被覆する機能積層体を形成するステップと、を含み、
     前記機能積層体を形成するステップにおいて、前記機能積層体が前記透明導電性膜及び前記対向電極膜が重なる交差部の内の少なくとも前記透明導電性膜の側面を被覆するように、湿式塗布法により、前記機能積層体の内の少なくとも1つの層を形成することを特徴とする有機ELパネルの製造方法。
    A substrate, a transparent conductive film laminated on the substrate, a functional laminate including at least one light emitting layer laminated on the transparent conductive film, and a counter electrode laminated on the functional laminate A method of manufacturing an organic EL panel including a film,
    Forming a transparent conductive film on the substrate;
    Forming a functional laminate that covers the transparent conductive film, and
    In the step of forming the functional laminate, a wet coating method is used so that the functional laminate covers at least a side surface of the transparent conductive film in an intersection where the transparent conductive film and the counter electrode film overlap. A method for producing an organic EL panel, comprising forming at least one layer of the functional laminate.
PCT/JP2012/058962 2012-04-02 2012-04-02 Organic electroluminescent panel and method for producing same WO2013150593A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105449116A (en) * 2015-11-18 2016-03-30 Tcl集团股份有限公司 ITO substrate and manufacturing method, OLED device and manufacturing method
WO2018097156A1 (en) * 2016-11-25 2018-05-31 コニカミノルタ株式会社 Organic electroluminescent element and composition for organic materials

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055453A (en) * 2002-07-23 2004-02-19 Canon Inc Organic el device and manufacturing method
WO2011001567A1 (en) * 2009-07-01 2011-01-06 シャープ株式会社 Organic el light emitter, organic el lighting device, and process for production of organic el light emitter
WO2011126097A1 (en) * 2010-04-08 2011-10-13 旭硝子株式会社 Organic led element, translucent substrate, and method for manufacturing organic led element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055453A (en) * 2002-07-23 2004-02-19 Canon Inc Organic el device and manufacturing method
WO2011001567A1 (en) * 2009-07-01 2011-01-06 シャープ株式会社 Organic el light emitter, organic el lighting device, and process for production of organic el light emitter
WO2011126097A1 (en) * 2010-04-08 2011-10-13 旭硝子株式会社 Organic led element, translucent substrate, and method for manufacturing organic led element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105449116A (en) * 2015-11-18 2016-03-30 Tcl集团股份有限公司 ITO substrate and manufacturing method, OLED device and manufacturing method
WO2018097156A1 (en) * 2016-11-25 2018-05-31 コニカミノルタ株式会社 Organic electroluminescent element and composition for organic materials
JPWO2018097156A1 (en) * 2016-11-25 2019-10-17 コニカミノルタ株式会社 Organic electroluminescence device and composition for organic material

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