WO2013133574A1 - Dispositif de refroidissement de composants électroniques incorporé dans un avion - Google Patents

Dispositif de refroidissement de composants électroniques incorporé dans un avion Download PDF

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Publication number
WO2013133574A1
WO2013133574A1 PCT/KR2013/001621 KR2013001621W WO2013133574A1 WO 2013133574 A1 WO2013133574 A1 WO 2013133574A1 KR 2013001621 W KR2013001621 W KR 2013001621W WO 2013133574 A1 WO2013133574 A1 WO 2013133574A1
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WO
WIPO (PCT)
Prior art keywords
refrigerant
cooling
fuel
condenser
coolant
Prior art date
Application number
PCT/KR2013/001621
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English (en)
Korean (ko)
Inventor
이하송
Original Assignee
Lee Ha Song
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Ha Song filed Critical Lee Ha Song
Publication of WO2013133574A1 publication Critical patent/WO2013133574A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Definitions

  • the present invention relates to a cooling device for maintaining the normal operation of electronic components embedded in the aircraft, such as an electro-optical (EO) camera, infrared (IR) camera, radar, and more specifically, the fuel and the coolant used in the aircraft, Cooling electronic components by using heat transfer media such as oil to reduce the space occupied parts, miniaturizing the device, and eliminating the installation location and space constraints of the device, and reducing the design capacity of the device by reducing the required cooling capacity.
  • the present invention relates to an onboard electronic component cooling device that exhibits optimal cooling performance according to various driving loads.
  • the conventional cooling apparatus includes a refrigerant compressor 10 for compressing a refrigerant as shown in FIG. 1, a condenser 11 for releasing heat of the compressed refrigerant to condense the refrigerant, and an expansion valve 12 for expanding the condensed refrigerant. ), An evaporator 13 which takes away heat from the surroundings while evaporating the expanded refrigerant, and a blower 14 for circulating air in the cooling target space 16 in which the electronic components are installed.
  • a refrigerant compressor 10 for compressing a refrigerant as shown in FIG. 1
  • a condenser 11 for releasing heat of the compressed refrigerant to condense the refrigerant
  • an expansion valve 12 for expanding the condensed refrigerant.
  • An evaporator 13 which takes away heat from the surroundings while evaporating the expanded refrigerant
  • a blower 14 for circulating air in the cooling target space 16 in which the electronic components are installed.
  • the condenser 11 and the evaporator 13 use a fin tube method and use a capillary tube as the expansion valve 12.
  • the evaporator 13 and the blower 14 are installed inside the heat exchange duct 15, and air is exchanged between the heat exchange duct 15 and the cooling target space 16 in which the cooling target electronic component is located.
  • An air intake duct 15a suctioned inside and an air outlet duct 15b for flowing air cooled in the heat exchange duct 15 into the cooling target space 16 are connected.
  • the change in the condensation load is severe according to the temperature change of the outside air, so the performance of the cooling system is large. That is, when the condensation pressure is high, the load in the refrigerant compressor 10 is increased, so the amount of refrigerant circulation in the cooling device is reduced, thereby reducing the cooling performance.
  • the condensation pressure is excessively low, the expansion valve 12 at the inlet This decreases the pressure of the refrigerant and also reduces the refrigerant circulation. Therefore, in order to achieve the proper performance of the cooling apparatus, it is necessary to be provided with means for maintaining a constant condensation pressure.
  • the conventional cooling device is a method of circulating and cooling cold air to the cooling target space 16 in which the electronic components are mounted, the entire cooling space must be cooled, and thus the load of the cooling device is relatively increased. That is, both the capacity of the cooling device and its installation space increase.
  • the evaporator blower 14 since the evaporator blower 14 must overcome the resistance of the curved transfer line and provide the desired blowing amount, the evaporator blower 14 must be designed at a relatively high pressure and the capacity and volume of the blower 14 also increase.
  • the installation space since the evaporator 13 and the condenser 11 both use a fin tube type heat exchanger using air as a medium, the installation space must be relatively large. Because the air itself has a small specific heat, a relatively large amount of air flow and heat transfer area is required.
  • a capillary tube having a constant opening and a length is used as the expansion valve 12.
  • the capillary tube has a problem in that it does not adequately control the amount of refrigerant circulating in response to the load of the apparatus and thus does not exhibit optimal cooling performance in response to various loads.
  • the present invention has been made to solve the problems of the prior art as described above, the present invention achieves miniaturization of the device by removing the blower and duct device mounted in the conventional cooling device, and instead of using air as a heat transfer medium
  • the volume of the heat exchanger is reduced, the condensing pressure is controlled to keep the performance of the cooling system constant, and the refrigerant circulation volume is controlled in response to various operating loads to achieve optimal cooling system performance.
  • an on-aircraft electronic component cooling apparatus includes a compressor for compressing a refrigerant, a condenser for releasing heat from the compressed refrigerant to condense the refrigerant, an expansion valve for expanding the condensed refrigerant, and an evaporation of the expanded refrigerant.
  • An on-aircraft electronic component cooling apparatus including an evaporator which deprives heat of fuel, comprising: a fuel connected between the fuel tank and the condenser to condense the refrigerant supplied from the refrigerant compressor to the condenser using the fuel of the aircraft fuel tank as a cooling medium; A circulation passage, a fuel pump installed on the fuel circulation passage to circulate fuel between the fuel tank and the condenser, and an electronic component to be cooled, and a cooling panel having a cooling liquid passage formed therein, between the evaporator and the cooling panel.
  • a coolant circulation passage connected to the coolant and the coolant It is provided on the ring passage, and is characterized in that it comprises a cooling liquid pump for circulating the cooling liquid.
  • the on-vehicle electronic component cooling apparatus is also characterized in that the cooling liquid is any one selected from antifreeze, oil, and refrigerant.
  • the on-vehicle electronic component cooling apparatus further includes a solenoid valve installed on the fuel circulation passage, a pressure gauge for measuring a refrigerant pressure between the refrigerant compressor outlet and an inlet of the condenser, and the refrigerant pressure measured by the pressure gauge. It characterized in that it comprises a condensation pressure control unit including a controller for controlling the opening and closing of the furnace solenoid valve.
  • the on-aircraft electronic component cooling apparatus further includes an expansion valve, which is an electronic expansion valve, is installed in the coolant circulation passage to measure a temperature sensor for measuring the temperature of the coolant, and expands the coolant based on the coolant temperature measured by the temperature sensor. And a controller for controlling the opening degree of the valve.
  • an expansion valve which is an electronic expansion valve, is installed in the coolant circulation passage to measure a temperature sensor for measuring the temperature of the coolant, and expands the coolant based on the coolant temperature measured by the temperature sensor.
  • a controller for controlling the opening degree of the valve.
  • the on-aircraft electronic component cooling apparatus removes two blowers and the transport ducts attached to the conventional cooling apparatus, and replaces the heat exchanger of a fin tube method using a conventional air as a medium. Since a fuel larger than this air and a coolant such as an antifreeze, an oil, a coolant, etc. are used as the heat transfer medium, the volume of the evaporator and the condenser can be reduced, thereby miniaturizing the apparatus.
  • a fuel larger than this air and a coolant such as an antifreeze, an oil, a coolant, etc.
  • the present invention can also reduce the design capacity and thereby achieve miniaturization of the device by directly contacting and locally cooling the electronic component to be cooled to cool the surrounding space and reducing heat loss to the outside in the cooling space.
  • the present invention can also exert optimum cooling performance under any operating conditions by actively controlling the condensation pressure and the refrigerant circulation in response to various operation loads.
  • the present invention is also a device that is connected only through a pipe without mounting a duct as in the prior art, so there is no restriction in the installation position or space of the cooling device.
  • the cooling panel directly contacts and cools the electronic component to be cooled, the heat transfer efficiency is higher than that of the air circulation method, and thus the cooling performance is improved at the same cooling capacity.
  • FIG. 1 is a block diagram of a conventional aircraft built-in electronic component cooling device
  • FIG. 2 is a block diagram of an aircraft interior electronic component cooling apparatus according to the present invention
  • 3A is a side view of a state of an embodiment in which an electronic component to be cooled is mounted on a cooling panel of the cooling device of the present invention
  • 3B is a cross-sectional view of a cooling panel according to one embodiment in which an electronic component to be cooled is mounted as a component of the cooling device of the present invention
  • Figure 4 is a graph showing the opening and closing state of the solenoid valve according to the refrigerant condensation pressure of the cooling apparatus according to an embodiment of the present invention
  • FIG. 5 is a graph showing a change in the opening degree of the electromagnetic expansion valve according to the coolant temperature of the evaporator inlet of the cooling apparatus according to an embodiment of the present invention.
  • This cooling device is developed for cooling electronic components mounted on an aircraft, and is mounted inside an aircraft.
  • the principle of the cooling device is based on a refrigerant cycle of compression, condensation, expansion, and evaporation.
  • aircraft means not only a normal aircraft but also all vehicles such as a helicopter.
  • the cooling apparatus of the present invention includes a compressor 20 for compressing a refrigerant, a condenser 21 for releasing heat of the compressed refrigerant to condense the refrigerant, and an expansion valve 22 for expanding the condensed refrigerant. ), And the evaporator 23 to take the heat of the surroundings while evaporating the expanded refrigerant.
  • the present invention also provides a cooling medium between the fuel tank 30 and the condenser 21 in order to condense the refrigerant supplied from the refrigerant compressor 20 in the condenser 21 using the fuel of the aircraft fuel tank 30 as a cooling medium.
  • the connected fuel circulation passage 31, the fuel pump 32 installed on the fuel circulation passage 31 to circulate the fuel, and the electronic component 1 as a cooling target are mounted therein, and the cooling liquid flow passage 33a is formed therein.
  • the condenser 21 and the evaporator 23 are heat exchangers in which heat is exchanged between a liquid and a liquid, and various types of heat exchangers such as a shell tube type and a plate type may be used.
  • the case where the condenser 21 and the evaporator 23 is a shell tube system is demonstrated, for example.
  • Low temperature fuel flows through the tube of the condenser 21, and a refrigerant flows inside the cell.
  • a refrigerant flows and a coolant flows inside the cell.
  • the coolant may be any one selected from antifreeze, oil, and refrigerant, and other liquids may be used.
  • the fuel used in the combustion of the aircraft engine is used as the cooling medium in the condenser 21, the evaporator 23 cools the coolant, and the cooled coolant is directly connected to the electronic component 1 by the coolant pump 35. It is circulated to the cooling panel 33 in contact with the local cooling action.
  • FIG. 3A illustrates a state in which an electronic component 1 to be cooled is mounted on the cooling panel 33, and the electronic component 1 may be attached to the cooling panel 33 in another form.
  • the present invention also provides a solenoid valve 41 installed on the fuel circulation passage 31, a pressure gauge 42 for measuring the refrigerant pressure between the outlet of the refrigerant compressor 20 and the inlet of the condenser 21,
  • a condensation pressure control unit 40 including a controller 43 for controlling the opening and closing of the solenoid valve 41 on the basis of the refrigerant pressure measured by the pressure gauge 42 is provided.
  • the expansion valve 22 uses an electronic expansion valve and is installed in the cooling liquid circulation passage 34 to measure the temperature of the cooling liquid 36, and the The controller 22a which controls the opening degree of the expansion valve 22 based on the coolant temperature measured by the temperature sensor 36 is provided.
  • the aircraft built-in electronic component cooling apparatus of the present invention configured as described above functions as follows.
  • the refrigerant gas is compressed in the refrigerant compressor 20 and is transferred to the condenser 21 in the state of the refrigerant gas of high temperature and high pressure.
  • the refrigerant gas of high temperature and high pressure is changed into a refrigerant liquid of relatively low temperature and high pressure through heat exchange with low temperature fuel circulated from the fuel tank 30 mounted inside the aircraft.
  • the condensed refrigerant accumulates at the bottom of the cell and is transferred to the expansion valve 22, and the excess refrigerant liquid is stored at the bottom of the shell. Since the constant pressure specific heat is used as a heat radiating medium, the heat exchanger heat transfer area can be reduced, so that the volume of the condenser 21 can be reduced.
  • the fuel temperature inside the fuel tank 30 is determined by the ambient temperature conditions, the fuel temperature supplied to the condenser 21 also becomes inconsistent. Therefore, since the temperature of the inlet fuel is changed under the same fuel flow conditions, the condensation pressure is changed by the fuel temperature conditions. That is, the condensation pressure of the condenser 21 is to be changed by the outdoor air condition.
  • the condensation pressure is formed low, the refrigerant circulation of the cooling device is reduced and the performance of the cooling device is reduced.
  • the condensation pressure is increased to increase the power required of the refrigerant compressor 20, and the amount of refrigerant circulating in the cooling device is also reduced by increasing the load of the refrigerant compressor 20.
  • the performance of the chiller is reduced. Therefore, it is necessary to keep the condensation pressure constant to maintain proper performance of the system.
  • the condensation pressure control unit 40 is attached to the cooling device of the present invention.
  • the condensation pressure control unit 40 is composed of an on / off solenoid valve 41, a pressure gauge 42, and a controller 43.
  • the supply flow rate of fuel per hour is controlled by the duty ratio of the solenoid valve 41.
  • the pressure gauge 42 measures the pressure between the outlet of the refrigerant compressor 20 and the inlet of the condenser 21, and transmits the measured value to the controller 43.
  • the controller 43 determines on / off conditions of the solenoid valve 41 based on the measured value by the algorithm of FIG.
  • Cooling apparatus is a system using a replacement refrigerant HFC-134a as the proper condensation pressure is 16kgf / cm2. That is, when the condensation pressure is 17 kgf / cm 2 or more, the solenoid valve 41 is opened, and at 15 kgf / cm 2 or less, the solenoid valve 41 is closed.
  • the on / off duty ratio of the solenoid valve 41 is determined by the operating characteristics of the cooling device, and the condensation pressure can be maintained at a desired pressure.
  • the solenoid valve 41 may linearly control the condensation pressure more precisely as indicated by the dotted line in FIG. 4 using the solenoid valve for proportional control.
  • the liquid refrigerant condensed in the condenser 21 is transferred to the expansion valve 22.
  • Expansion valve 22 is adiabatic expansion of the liquid refrigerant to form a low temperature low pressure liquid gas mixture.
  • the gas is maintained at about 30% and the liquid at about 70% by mass, and the liquid refrigerant evaporates through heat exchange with the cooling liquid while flowing through the evaporator 23, and the refrigerant in the vapor phase at the outlet of the evaporator 23. Only remains.
  • the degree of cooling of the cooling liquid is determined by the amount of refrigerant circulating through the expansion valve 22. Since the operating speed of the coolant pump 35 is constant, the flow rate of the coolant supplied to the evaporator 23 is constant.
  • the required refrigerant circulation amount is increased.
  • the required refrigerant circulation amount is reduced. That is, in order to secure the optimum performance of the cooling device, it is necessary to appropriately control the refrigerant circulation amount according to the load amount in the evaporator.
  • an electronic expansion valve is used to appropriately control the amount of refrigerant circulating according to the load conditions in the evaporator 23, and a controller 22a for controlling this is mounted.
  • the controller 22a opens the electromagnetic expansion valve according to the algorithm of FIG. 5 based on the measured temperature value. Will be determined. Since the electromagnetic expansion valve is composed of an orifice, a needle valve and a step motor, the amount of refrigerant circulating is controlled by adjusting the orifice opening area by vertical movement of the needle valve in accordance with the input pulse supplied to the step motor. Although the solid line of FIG. 5 shows a stepped control, it can be controlled linearly as shown by the dotted line using the electronic expansion valve which carries out proportional control.
  • the evaporator 23 used in the cooling apparatus of the present invention can reduce the heat transfer area of the evaporator 23 by using a coolant having a large constant pressure specific heat value without using air as a heat transfer medium, and accordingly, Can reduce the volume.
  • the coolant cooled in the evaporator 23 is transferred to the cooling panel 33 to which the electronic component 1 is attached as shown in FIG. 3A through the coolant pump 35.
  • the cooling panel 33 is a plate heat exchanger in which a cooling liquid flow path 33a is formed, as shown in FIG. 3B, and directly contacts the substrate of the electronic component 1 to cool the heat generated in the electronic component 1.
  • the cooling liquid whose temperature is raised by heat exchange with the electronic component 1 is transferred to the evaporator 23 and cooled.
  • the cooling apparatus of the present invention does not cool the entire space in which the cooling target electronic component 1 is installed, but directly contacts the cooling target electronic component 1 itself and locally cools the capacity of the cooling apparatus. In addition, the volume of the device can be reduced.
  • the condensation efficiency is reduced because the temperature rise of the fuel is large.
  • a fuel shortage situation occurs at the time of return of the aircraft. At this time, since the operation of the cooling target electronic component 1 is stopped and there is almost no cooling load, no big problem occurs.
  • Heat exchange duct 15a Air suction duct

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention porte sur un dispositif de refroidissement de composants électroniques qui est incorporé dans un avion, ledit dispositif utilisant un milieu de transfert de chaleur liquide, tel que le carburant, un agent de refroidissement liquide ou une huile utilisée dans l'avion, pour refroidir des composants électroniques incorporés dans l'avion, de façon à éliminer des composants qui prennent de la place et à miniaturiser des dispositifs, à diminuer des restrictions concernant les positions où des dispositifs peuvent être installés ou des restrictions spatiales, à réduire la capacité de refroidissement requise et à réduire la capacité nominale des dispositifs, et à atteindre une efficacité de refroidissement optimisée selon différentes charges de fonctionnement. Selon la présente invention, le dispositif de refroidissement de composants électroniques incorporé dans un avion comporte : un compresseur (20) pour comprimer un fluide frigorigène ; un condenseur (21) pour dissiper de la chaleur dans le fluide frigorigène comprimé et pour condenser celui-ci ; une soupape de détente (22) pour détendre le fluide frigorigène condensé ; un évaporateur (23) pour évaporer le fluide frigorigène détendu et absorber la chaleur de l'environnement, et comporte de plus : un passage de circulation de carburant (31) relié au réservoir de carburant (30) de l'avion, à partir duquel un carburant est extrait comme milieu de refroidissement, et pour condenser le fluide frigorigène distribué par le compresseur de fluide frigorigène (20) dans le condenseur (21) ; une pompe à carburant installée sur le passage de circulation de carburant (31), pour faire circuler le carburant entre le réservoir de carburant (30) et le condenseur (21) ; un panneau de refroidissement (33) sur lequel un composant électronique (1) à refroidir est monté, et définissant un passage de liquide de refroidissement (33a) à l'intérieur de celui-ci ; un passage de circulation de liquide de refroidissement (34) relié entre l'évaporateur (23) et le panneau de refroidissement (33) ; une pompe de liquide de refroidissement (35) installée sur le passage de circulation de liquide de refroidissement (34) pour faire circuler le liquide de refroidissement.
PCT/KR2013/001621 2012-03-06 2013-02-28 Dispositif de refroidissement de composants électroniques incorporé dans un avion WO2013133574A1 (fr)

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KR10-2012-0023070 2012-03-06
KR1020120023070A KR101181511B1 (ko) 2012-03-06 2012-03-06 항공기 내장 전자부품 냉각장치

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636404A (zh) * 2014-10-31 2016-06-01 中国航空工业集团公司西安飞机设计研究所 一种航空电子设备液体冷却系统
KR20190103804A (ko) * 2018-02-28 2019-09-05 주식회사 뉴파워 프라즈마 공냉 구조와 수냉 구조가 병합된 플라즈마 처리용 고주파 전력 발생장치
CN114562839A (zh) * 2021-11-17 2022-05-31 中国航空工业集团公司沈阳飞机设计研究所 一种飞机周期性热载荷的环控系统

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Publication number Priority date Publication date Assignee Title
KR101654857B1 (ko) * 2015-12-08 2016-09-06 주식회사 비에이솔루션즈 전자장비용 오일 쿨러 및 이를 이용한 전자장비 냉각 방법
TWI756618B (zh) * 2020-01-15 2022-03-01 緯穎科技服務股份有限公司 浸沒式冷卻設備
KR102402441B1 (ko) 2021-08-31 2022-05-26 한화시스템 주식회사 항공기 방열냉각 구조 설계장치 및 설계방법

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JPH11139398A (ja) * 1997-11-14 1999-05-25 Shimadzu Corp 航空機用冷却装置
JP2001010595A (ja) * 1999-06-30 2001-01-16 Shimadzu Corp 冷却システム
JP2001074320A (ja) * 1999-09-02 2001-03-23 Shimadzu Corp 冷却システム
JP2004256051A (ja) * 2003-02-27 2004-09-16 Sumitomo Precision Prod Co Ltd 航空機用液冷装置

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH11139398A (ja) * 1997-11-14 1999-05-25 Shimadzu Corp 航空機用冷却装置
JP2001010595A (ja) * 1999-06-30 2001-01-16 Shimadzu Corp 冷却システム
JP2001074320A (ja) * 1999-09-02 2001-03-23 Shimadzu Corp 冷却システム
JP2004256051A (ja) * 2003-02-27 2004-09-16 Sumitomo Precision Prod Co Ltd 航空機用液冷装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636404A (zh) * 2014-10-31 2016-06-01 中国航空工业集团公司西安飞机设计研究所 一种航空电子设备液体冷却系统
KR20190103804A (ko) * 2018-02-28 2019-09-05 주식회사 뉴파워 프라즈마 공냉 구조와 수냉 구조가 병합된 플라즈마 처리용 고주파 전력 발생장치
CN114562839A (zh) * 2021-11-17 2022-05-31 中国航空工业集团公司沈阳飞机设计研究所 一种飞机周期性热载荷的环控系统

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