WO2013127748A1 - Document et procédé pour réaliser un document - Google Patents

Document et procédé pour réaliser un document Download PDF

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Publication number
WO2013127748A1
WO2013127748A1 PCT/EP2013/053735 EP2013053735W WO2013127748A1 WO 2013127748 A1 WO2013127748 A1 WO 2013127748A1 EP 2013053735 W EP2013053735 W EP 2013053735W WO 2013127748 A1 WO2013127748 A1 WO 2013127748A1
Authority
WO
WIPO (PCT)
Prior art keywords
document
film layer
carrier film
film layers
polymer material
Prior art date
Application number
PCT/EP2013/053735
Other languages
German (de)
English (en)
Inventor
Jörg Fischer
Oliver Muth
Manfred Paeschke
Markus Tietke
Joachim Kloeser
Denis DONATH
Alexander Ferber
Stefan TRÖLENBERG
Joao MARQUES
Original Assignee
Bundesdruckerei Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bundesdruckerei Gmbh filed Critical Bundesdruckerei Gmbh
Priority to EP13707604.8A priority Critical patent/EP2819846B1/fr
Publication of WO2013127748A1 publication Critical patent/WO2013127748A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B42D2033/46—

Definitions

  • the present invention relates to a document, in particular a value and / or security document, and to a method for producing the document.
  • the document includes an electrical circuit which is formed by an electrical Porterzug poetic and at least one electrically connected to the electrical Porterzug Quilt electronic component on a one of the film layers of the document forming carrier film layer.
  • a value and / or security document can be, for example, a smartcard and / or an identification document.
  • the document may include an identity card, passport, access pass, driver's license, vehicle registration document, vehicle registration document, ski pass or other authorization card, public transportation ticket, bill, credit card, check card, cash card, entrance ticket, identification card, visa or the like - be.
  • the document may be in the form of a card having a front side and a back side, or may be formed as a book-like document. It can be made essentially of paper or plastic.
  • a card having a front side and a back side, or may be formed as a book-like document. It can be made essentially of paper or plastic.
  • its front bears the photograph and the name of the holder.
  • the reverse side may contain further information, for example the address of the holder.
  • RFID Radio Frequency Identification
  • the transponder unit with an antenna structure for inductive coupling of energy from a reading or writing / reading device.
  • the transponder unit has an antenna structure and a semiconductor circuit element, also called a transponder chip, which is electrically connected to the antenna structure.
  • an electronic semiconductor circuit element is understood in particular to mean semiconductor chips, in particular those which are suitable for the storage and processing of data.
  • the electronic semiconductor circuit elements comprise so-called RFID chips, which are suitable for contactless communication.
  • RFID chips can be designed to be comparatively simple and contain, for example, only one serial number and transmit them contactlessly upon activation, or they can be memory chips Encryption, as used for example in electronic travel documents.
  • the antenna structure can be formed, for example, by placing and fixing a wire, for example on a carrier film layer, wherein the carrier film layer is assembled after completion of the transponder unit together with further film layers to form a document stack, which is subsequently laminated.
  • the antenna structure can also be formed by a Porterzugteil.
  • EP 0 737 935 A2 specifies a contactless chip card and its production method.
  • the antenna is formed by a conductor in the form of a conductor coil.
  • Thenatiuchspule is made by etching and connected to an integrated semiconductor chip by the latter is placed head-on with its contact points on the terminals of the Porterzugspule and connected to them.
  • the semiconductor chip is for this purpose first mounted on a substrate which is mounted together with the chip on the antenna.
  • DE 10 2010 028 444 A1 states that an antenna can be produced by screen-printing a silver-conducting paste onto a substrate and subsequent drying.
  • the antenna described in this document has a plurality of windings circumferentially arranged along the edge of the document in the plane through the substrate. Further, one or more central windings bypass the chip in a bridging region. In this area, the turns have a smaller width than the rest of the turn.
  • the chip is a thinned integrated circuit, i. it has a thickness of at most 200 ⁇ .
  • the chip may be in the form of a flip chip, i. a chip which is contacted with the pads down using an anisotropic conductive adhesive.
  • DE 10 2008 012 419 A1 specifies a polymer layer composite for a security and / or value document.
  • this document has an electrical circuit, which is formed, for example, by a computer chip and an antenna circuit, between polymer layers provided with areal printing areas. It is stated that such electrical circuits are suitable for contactless transmission of information from and to the chip in the area of the radio frequency (RFID).
  • RFID radio frequency
  • the material used for the polymer layers of the document is, inter alia, bisphenol A polycarbonate, which preferably but by no means necessarily also contains a so-called T g material may be, especially if a print layer is to be applied to the polymer layers.
  • Low-T g materials are those which have a glass transition temperature of below 140 ° C.
  • the present invention therefore relates to a document, in particular a value and / or security document, which is obtained from a plurality of film layers by lamination and which contains an electrical circuit on a carrier film layer, which forms one of the film layers of the document.
  • the electrical circuit is formed by an electrical Porterzug réelle and at least one of the electrical Porterzug Quilt electrically connected electronic component.
  • the carrier foil layer with the electrical circuit and at least two further foil layers are arranged one above the other.
  • the present invention further relates to a method for producing the aforementioned document according to the invention.
  • the process comprises the following process steps in the order given below, but in addition additional process steps can be carried out between the steps indicated: (A) providing the electrical circuit on the carrier foil layer, wherein the electrical circuit is formed by the electrical conductor traction structure applied to the carrier foil layer and the electronic component electrically connected to the electrical conductor traction structure;
  • the carrier film layer and the further film layers of the document are formed from polymer materials of which the polymer material of the carrier film layer has a glass transition temperature T g, TF which is at least 20 ° C. higher than the glass transition temperature T g DF of the polymer material at least one the other slides of the document.
  • a polymer material is used for the carrier film layer which has a glass transition temperature T g TF which is at least 30 °, more preferably at least 40 ° C and even better at least 50 ° over the Glass transition temperature T g DF at least one of the other film layers of the document is.
  • the document can be at Laminating temperature T L , which is still below the glass transition temperature T g TF of the polymer material of the carrier film layer or at least in the range of its glass transition temperature T g TF (ie from below T g TF , for example, from a maximum of 40 ' ⁇ below T g TF , to little above T g TF , for example up to a maximum of 10 ° C above T g TF ).
  • the laminating temperature T L should be well above the glass transition temperature T g, DF of the at least one further film layer of the document, ie at least 10 ' ⁇ , better at least 20' ⁇ , even better at least 25 ' ⁇ and best at least 30' ⁇ above of T g DF , to achieve a sufficient flow behavior of the film layers, so that they connect well to form a monolithic composite. Since the carrier film layer has a value for T g TF which is at least 20 ' ⁇ above the value for T g DF , the carrier film layer does not flow during lamination or at least does not substantially flow.
  • the electronic component also remains exactly at the position at which it was originally placed during lamination, and is stabilized there, so that no shear forces are exerted on the contact ments of the device with the terminals of the electrical Porterzug poetic occur.
  • Such shearing forces could be caused in lamination in particular by a leveling in the document, which is arranged on the side of the carrier film layer on which the electronic component is located, and which has a recess or opening for the device at the location of the component, so that Component protrudes into this recess or opening.
  • the leveling layer during lamination could therefore shift with respect to the carrier film layer, since these two layers start to flow.
  • the compensation film layer would exert a lateral pressure on the electronic component, so that this would have to avoid and therefore could tear off the electrical contact connections of the device.
  • the carrier film layer is made of a polymer material with high T g, TF , these and also the compensation film layer are held even in position even when the film material is heated up to the laminating temperature T L and is added under the laminating.
  • the carrier film layer thus acts as a rigid carrier (to some extent as a printed circuit board), which stabilizes the positioning of the electronic component.
  • the carrier film layer combines during the lamination with the other film layers cohesively, resulting in a monolithic composite of all film layers.
  • the carrier film layer and the other film layers of the document, including a leveling film layer may be made of polymeric materials selected from a group comprising polycarbonate (PC), especially bisphenol A polycarbonate, polyethylene terephthalate (PET), their derivatives such as glycol -modified PET (PETG), polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), Polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polyethylene (PE), thermoplastic elastomers (TPE), especially thermoplastic polyurethane (TPU), acrylonitrile-butadiene-styrene copolymer (ABS) and their derivatives, and / or paper.
  • PC polycarbonate
  • PET polyethylene terephthalate
  • PET polyethylene terephthalate
  • PEN glycol -modified
  • the carrier film layer and the further film layers of the document can be produced from polymer materials which originate from the same family of polymers or from different families.
  • the polymer materials of the carrier film layer and of the further film layers of the document preferably originate from the same family of polymers.
  • the carrier film layer and the further film layers of the document preferably consist of PC or of PC7TPU / PC.
  • the polymers of the carrier film layer and of the further film layers of the document can be present either unfilled or filled. In the latter case they are preferably transparent or translucent. If the polymers are filled, they are opaque.
  • the filler may be, for example, a pigment or a filler material which has a particularly high or a particularly low dielectric constant.
  • the individual film layers can contain different fillers, so that they can be transparent, translucent or opaque and can be present in different ways either colored or not colored.
  • the carrier film and the further films preferably consist of identical or similar polymers.
  • Similar polymers are understood to mean that the polymers are composed of identical and / or similar monomers and thus are chemically complete or at least highly miscible with one another, but differ, for example, exclusively by the degree of crosslinking and thus by the proportion of a crosslinking monomer. Furthermore, they can also differ in the degree of polymerization. This ensures that a cohesive bond is achieved in the lamination, so that it can be prevented that the document can be delaminated nondestructive. Thus, a manipulation of the electrical circuit, in particular a security chip is ensured.
  • the polymer material of the carrier film layer contains or consists of polycarbonate.
  • the polymer material may be a polycarbonate based on bis (hydroxyaryl) compounds, in particular dihydroxydiphenylcycloalkanes.
  • the polymer material may be a polycarbonate based on bisphenol A (2,2-bis- (4-hydroxyphenyl) -propane) or one of its derivatives.
  • Bisphenol TMC (1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane), for example, is considered as a derivative.
  • the preparation of such polycarbonates is given for example in DE 10 2008 023 800 A1. Further preferred bis (hydroxyaryl) compounds are described in DE 40 37 401 A1, DE 40 37 402 A1 and DE 10 2008 012 419 A1. In this respect, reference is made to the descriptions of these compounds and the other polymerization components, conditions and additives.
  • the polymer material of all other film layers of the document or one or more further film layers in a further preferred embodiment of the present invention contains polycarbonate or consists of polycarbonate. It is particularly preferred if the polymer material of the further film layers of the document is likewise a polycarbonate based on bis (hydroxyaryl) compounds, in particular of bisphenol A, or one of their derivatives, in particular of dihydroxydiphenylcycloalkanes, for example of bisphenol TMC ( 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane). In that regard, reference is made to the description of the polymer material of the carrier film layer.
  • the glass transition temperature T g DF of the polymer material of the further Folienla- gene of the document just below 150 ° C may, ie within the range of 145 ° C to 149 ⁇ .
  • the glass transition temperature T g TF of the polymer material of the carrier film layer may in this case be at least about 170 ° C, ie for example at 165 ' ⁇ to 169' ⁇ , better at least just under 180 ' ⁇ , ie for example at 175 ° C to 179 ⁇ ⁇ , even better at least just under 190 ' ⁇ , ie, for example at 185' ⁇ to 189 ' ⁇ , and most preferably at least just under 200 ° C, ie, for example 195' ⁇ to 199 ' ⁇ , are.
  • the glass transition temperature T g DF of the polymer material of the other film layers of the document is above or below the above-mentioned value of almost 150 ' ⁇ , the glass transition temperature T g, TF of the polymer material of the carrier film layer would be correspondingly higher or correspondingly lower.
  • the glass transition temperatures T g, TF and T g DF of the carrier film layers and the other film layers in the document can be influenced on the one hand by the degree of crosslinking of the polymer and on the other by further substances which are mixed with the polymer material.
  • the polymerization reaction can be carried out in a targeted manner.
  • the molecular weight distribution of polycarbonate can be specifically adjusted according to DE 10 2008 023 800 A1 and DE 10 2008 008 842 A1, if in the polymerization reaction for this purpose an alkylphenol, for example p-tert. Butylphenol, as a chain terminator, that is used as an end group.
  • alkylphenols in the polymerization of diphenols, for example 2,2-bis (4-hydroxyphenyl) propane (bisphenol A), with carbonic acid derivatives, for example phosgene, and Branching among other things, an improved heat resistance (with increased glass transition temperature) achieved.
  • carbonic acid derivatives for example phosgene, and Branching among other things.
  • fillers for example pigments, in the polymer material alters, preferably increases, the glass transition temperature.
  • the unhoused component for example, a semiconductor circuit element, mounted in flip-chip technology, ie placed head-down with the contact points facing down, mechanically fixed and electrically contacted.
  • the electrical Porterzug MUST are formed by an antenna structure and the electronic component by a preferably unhoused transponder chip.
  • the electrical circuit thus forms a transponder unit.
  • the semiconductor circuit element (electronic chip) forms in this case, together with the antenna, a transponder which is suitable for contactless data transmission by inductive coupling of energy from a read / write device.
  • the semiconductor circuit element and the antenna are electrically connected together in this case, i. in each case one end of the, for example, helical antenna is connected to one of the contact points of the semiconductor circuit element.
  • the semiconductor circuit element may be in the form of a packaged or unhoused device.
  • the semiconductor circuit element in particular in flip-chip technology with its formed in particular in the form of bumps contact points placed upside down on the terminal contacts of the antenna and contacted there.
  • the electronic component in particular semiconductor circuit element, can in particular be placed on the strand of antenna windings in such a way that it bridges them.
  • the antenna as well as the component is located on a mounting side of the carrier film layer and thus in the same plane as the component.
  • the transponder chip and the antenna structure are preferably arranged parallel to the front and back of the security and / or security document into which the contactless transponder unit is integrated.
  • a compensation film layer can also be provided which is arranged on the side of the carrier film layer on which the transponder chip is also located and which has a recess for receiving the transponder chip whose size corresponds to the size of the chip.
  • the thickness of the compensation layer preferably corresponds approximately to the mounting height of the transponder chip. This creates a flat document surface in the finished laminate.
  • the transponder chip may in particular have a processor designed for contactless data transmission and an electronic memory. It may in particular be a thinned semiconductor circuit element. This is to be understood as meaning an integrated circuit which has a thickness of at most 200 ⁇ m, preferably at most 100 ⁇ m, more preferably at most 80 ⁇ m and most preferably at most 60 ⁇ m. Further, this integrated circuit has a thickness of at least 1 ⁇ , preferably of at least 10 ⁇ , more preferably of at least 15 ⁇ , more preferably of at least 20 ⁇ and most preferably of at least 25 ⁇ on.
  • the transponder chip is preferably an unhoused semiconductor circuit element. This ensures a particularly simple and thus cost-effective production of the document. In particular, when the unpackaged semiconductor circuit element is thinned, a very low overall height can be achieved, so that the document produced with this component can also be produced in accordance with standards, ie, for example, according to ISO 7813 (thickness of ID 1 cards of 0.76 mm).
  • the electrical conductor structure is an antenna structure which is electrically connected to the unhoused semiconductor circuit element.
  • the antenna structure may be formed by an antenna conductor track, which, like a coil in the form of antenna windings, extends in a spiral manner, for example in an edge region of the carrier film layer and in a plane on the carrier film layer.
  • the antenna windings can, for example, run at a small distance from one another and in particular parallel to one another.
  • the antenna windings can thus form a strand which contains the antenna windings and extends, for example, along the edges of the carrier film layer.
  • the antenna structure Due to the parallel guidance of the antenna windings in one plane, the antenna structure forms two ends, which also represent connection contacts for the semiconductor circuit element. These ends may, for example, be at the same height on one side of the strand. typically, is the width of the antenna conductor tracks of the antenna structure 100 ⁇ to 2 mm. The width may, however, in principle be lower, for example 50 ⁇ to 500 ⁇ .
  • the electrical conductor structure is formed by printing a conductive paste or a conductive ink on the carrier film layer.
  • the conductive paste or conductive ink contains at least one polymer as binder and at least one metal and / or a conductive metal oxide and / or another conductive material in the polymer.
  • Suitable conductive materials are copper, silver, gold, iron, zinc, tin and / or carbon, in particular graphite, singlewall and / or multiwall nanotubes, fullerenes or graphenes.
  • Suitable metal oxides are ITO (indium tin oxide), IZO, FTO (fluorine-doped tin dioxide), ATO (antimony oxide).
  • the metals / metal oxides may be in the form of flakes, needles, powders (especially nanoscale), platelets or the like. In particular, these are present as aggregated particles.
  • conductive organic materials / polymers such as polyaniline, PEDOT: PSS, into consideration.
  • a screen printing technique can be used, for example, a sheet-fed printing process, or a roll-to-roll printing process.
  • the thickness of the printed paste or the lacquer after hardening can be in particular 1 ⁇ m to 100 ⁇ m and more preferably about 10 ⁇ m.
  • the conductive paste or the conductive ink can either be dried easily or cured by means of heat and / or irradiation with electromagnetic radiation, for example UV radiation.
  • electromagnetic radiation for example UV radiation.
  • the preparation of the electrical Porterzug Quilt with a conductive paste or a conductive ink is simple and therefore inexpensive. It is particularly advantageous if the conductive paste is a composition containing silver particles as an electrically conductive substance.
  • the electrical circuit or the transponder unit (conductor structure or antenna structure and an electronic component or transponder chip electrically connected thereto) on the carrier film layer and further film layers become a film layer stack collected.
  • further film layers can be integrated into the film layer stack which contain additional security features, for example a photograph of the owner of the document.
  • the stack may also be closed by cover sheets (overlays) up and / or down. These cover sheet layers are preferably transparent, thereby allowing the view of underlying film layers.
  • the overlays protect the underlying film layers.
  • the carrier film layer and the further film layers may be added. For example, have additional security features.
  • Conventional devices which are also used for collating sheets in the printing technique can be used for collation.
  • the foil layers can be stapled after assembly, but before laminating, for example by local welding, for example point welding, in order to fix the foil layers against one another.
  • the film layers of the stack are laminated together.
  • the stack is laminated in a hot press, for example, at 190 ° to 200 ° and a pressure of 350 N / cm 2 and in a cold press at a pressure of 600 N / cm 2 , especially when the film layers are made of PC.
  • the document can be equipped with further security features.
  • the film stack is subjected to an increased pressure and an elevated temperature during lamination.
  • an elevated temperature and an elevated pressure are meant respective parameters relative to room temperature and normal pressure.
  • the temperature must be so high that at least a substantial portion of the film layer stack to be laminated begins to flow and the film layers bond together to form a monolithic composite of the film layers.
  • the pressure must be high enough so that any air bubbles are safely expelled and the film layers are thus brought into intimate contact with each other.
  • the security and / or security document may include, for example, an identity card, passport, access card, driving license, vehicle registration document, vehicle registration document, company pass, ski pass, other authorization card, public transport ticket, banknote, credit card, bank card, cash card, entrance ticket, identification card , a visa or the like.
  • the document may be in the form of a card having a front side and a back side, or may be in the form of a book-type document, for example in ID 1, ID 2 or ID 3 format according to ISO 7810. It may be made essentially of paper or of plastic be.
  • an identity card its front bears the photograph and the name of the holder.
  • the reverse side may contain further information, for example the address of the holder.
  • the document may have other security features.
  • the document can be embodied as a transponder, in particular as a passive transponder, for example as an RFID security document.
  • FIG. 1 shows, in several perspective schematic views, the method steps for producing a film layer stack
  • FIG. (a) providing the carrier sheet with an antenna structure formed thereon and mounting a chip thereon to make a transponder unit; (b) providing a further film layer (leveling film layer); (c) collating the backing sheet layer and the leveling sheet layer; (d) collating the stack obtained in process step (c) with a cover film layer and outer cover film layers;
  • Fig. 2 shows the document according to the invention in a section III - III of FIG. 1 d in a schematic representation.
  • FIG. 1 show, in successive process steps according to the inventive method for producing the document, perspectively and schematically a carrier film layer 10 with an antenna structure 12 and a transponder chip 100 (electronic component), a further film layer 20 serving as a compensation film layer for the transponder chip 100 serves a closure film layer 30 and outer cover film layers 40, 50. These films together form a film layer stack 70.
  • the carrier film layer 10 and the compensating film layer 20 may be, for example, film sections having the dimensions of a card with the dimensions according to ISO 7810, for example in the ID-1 card format.
  • foil sheets with a plurality of benefits may also be initially present, which are significantly larger than the aforementioned dimensions, so that, for example, 5 ⁇ 8 such foil sections in card format ID-1 are accommodated on a sheet.
  • Such multiple-use sheets are collected, stapled and laminated with corresponding further film sheets, so that after laminating a multiple-use stack and laminate is obtained, from which the individual benefits, such as cards in the format ID-1, are separated, for example by punching.
  • the backing sheet 10 is preferably made of PC and has a glass transition temperature T g TF of about 200 ° C. (Vicat softening temperature of 205 ° C.).
  • the carrier film layer 10 may be opaque white. Their thickness can be, for example, 100 ⁇ m.
  • the compensation film layer 20 can also be made of PC and can be suitably Neten fillers are white opaque. Their thickness can be 150 ⁇ .
  • the compensating film layer 20 is also preferably made of PC. However, its glass transition temperature g, DF is less than that of the carrier film layer 10. It is for example about 150 ° C.
  • an antenna structure 12 is applied, which consists of a spirally wound antenna conductor with multiple spiral turns.
  • the individual spiral windings each extend at a distance of, for example, about 200 ⁇ m from each other and parallel to one another on the carrier film layer 10.
  • the antenna conductor cable ends. There are its two ends 12.1, 12.2, which also form the connection contacts to a semiconductor circuit element 100.
  • the antenna structure 12 winds parallel to the four edges 10.1, 10.2, 10.3, 10.4 of the carrier film layer 10 and in low order to these.
  • the antenna conductor of the antenna structure 12 may be generated for example with a conductive paste or a conductive ink by screen printing. For this purpose, for example, a conductive paste or a conductive ink with silver particles can be used.
  • the antenna conductor can, for example, have a width of approximately 400 ⁇ m.
  • a semiconductor circuit element in the present case a transponder chip 100, is placed in the mounting area 14 on the carrier film layer 10 and electrically brought into contact with the ends 12.1, 12.2 of the antenna conductor train of the antenna structure 12 as an electronic component (FIG. 1 a).
  • the chip 100 is mounted on the mounting side of the carrier film layer 10.
  • the chip 100 is mounted in flip-chip technology in the mounting area 14, ie pads located on the chip 100 in the form of bumps 1 10.1, 1 10.2 (Fig. 2) are attached pointing down to the ends 12.1, 12.2 of the Antennenleiterzuges glued and contacted there. In this way, the chip 100 bridges the strand formed by the antenna conductor train from spiral windings of the antenna structure 12 arranged parallel to one another.
  • an anisotropic conductive adhesive 120 can be used for chip mounting, which space between the chip located between the contact bumps 10.1, 110.2 100 and the top of the carrier film layer 10 fills in the mounting area 14 and thereby glued the chip with the carrier film layer (Fig. 2). At the same time, this conductive adhesive 120 imparts electrical contact between the contact bumps 10.1, 110.2 of the chip 100 and the ends 12.1, 12.2 of the antenna conductor cable, but without establishing electrical contact between the connection contacts with one another and between the contact bumps of the chip.
  • the transponder chip 100 has, inter alia, a processor suitable for contactless data transmission and an electronic memory.
  • the antenna structure 12 and the transponder chip 100 fixed and electrically contacted on the antenna structure together form an electrical circuit 1, here a transponder unit, which is arranged on the carrier foil layer 10.
  • a further film layer in the form of the compensation film layer 20 is provided on the mounting side of the carrier film layer 10 (FIG. 1 b).
  • the compensation film layer 20 has an opening 22 which is located at the location where the chip 100 is also located on the carrier film layer 10.
  • the aperture 22 further has the shape of the chip 100 and is about as large as this.
  • the compensating film layer 20 has a thickness approximately corresponding to the mounting height of the chip 100, such that the top side of the chip forms a substantially aligned surface after the compensating film layer 20 has been placed on the carrier film layer 10 with the top side of the compensating film layer.
  • the chip 100 therefore fills the aperture 22 approximately completely.
  • the carrier film layer 10 with the transponder chip 100 mounted thereon and the further film layer (compensating film layer) 20 are gathered together (FIG. 1 c).
  • the carrier foil layer 10 and the compensating foil layer 20 can also first be gathered together and the transponder chip 100 can then be mounted in the opening 22.
  • the final film layer 30 is placed, which closes the stack of carrier film layer 10 and compensating film layer 20 upwards and thus the aperture 22 closes (Fig. 1 d).
  • the closure film layer 30 is also preferably made of PC.
  • the polymer material of the closing film 30 may be the same as that of the compensating film layer 20. Therefore, its glass transition temperature T giDF is the same, namely about 150 'C, as the compensation film layer 30.
  • the final film layer 30 may be opaque white by fillers, so that the transponder chip 100th and the antenna structure 12 are no longer visible from the outside.
  • a cover film layer 40, 50 are placed on the two Au od of the film stack thus formed from carrier film layer 10, leveling film layer 20 and cover film 30, which are transparent and underlying structures can be seen (Fig. 1 d).
  • the Cover film layers 40, 50 are preferably made of PC.
  • the polymer material of the cover film layers 40, 50 may be the same as that of the compensating film layer 20 and the final film layer 30. Therefore, its glass transition temperature g, DF is the same, namely about 150 ° C, as those of these film layers.
  • the closure film layer 30 may be provided with a photograph of the owner of the document 200 (not yet finished in FIG. 1d because not yet laminated) that is visible through the overlying transparent cover film layer 50.
  • FIG. 1 A section along III-III through the stack 70 of the document 200 is shown in FIG.
  • the carrier foil layer 10 with the antenna structure 12 applied thereon can be seen with the connection contacts 12.1, 12.2 and the transponder chip 100 contacted thereon. This has contact bumps 10.1, 110.2, which rest on the connection contacts 12.1, 12.2.
  • the chip 100 is mechanically and electrically mounted on the carrier film layer 10 by means of an anisotropic conductive adhesive 120.
  • the compensation film layer 20 can be seen with the opening 22 into which the chip 100 protrudes.
  • On the compensating film layer 20 is the final film layer 30. This stack is completed by the two other transparent cover film layers 40, 50 on both sides.
  • the film layers 10, 20, 30, 40, 50 together form the film layer stack 70.
  • the stack is laminated, ie laminated together in a laminating press, for example a continuous laminating press, under elevated pressure and under the influence of elevated temperature.
  • a laminating press for example a continuous laminating press
  • the stack is exposed in a hot press to a laminating temperature T L of 180 to 190 ° C. and a pressure of 350 N / cm 2 and in a cooling press at a pressure of 600 N / cm 2 .
  • the laminating temperature T L is significantly higher than T giDF but lower than T g, TF , the polymer materials of the compensation film layer 20, the closure film layer 30 and the cover film layers 40, 50, but not the polymer material of the carrier film layer 10 flow the transponder chip 100 stabilizes on the antenna structure 12, so that the contacting of the chip during lamination is not impaired.
  • the laminating produces a monolithic composite that yields the document 200.
  • the document 200 may be equipped with other security features.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Pour éviter l'endommagement des contacts électriques d'un composant électronique (100) présentant une structure de conducteur (12) lors de la réalisation d'un document (200) dans lequel est noyé un composant électronique (100), un document (200) est prévu, lequel est obtenu par laminage à partir de plusieurs couches minces (10, 20, 30, 40, 50) et contient un circuit électrique (1) sur une couche mince de support (10) formant l'une des couches minces (10, 20, 30, 40, 50) du document (200), le circuit électrique (1) étant formé par une structure de conducteur électrique (12) et au moins un composant électronique (100) relié électriquement à la structure de conducteur électrique (12). La couche mince de support (10) présentant le circuit électrique (1) et au moins deux autres couches minces (20, 30, 40, 50) se superposent dans le document (200). La couche mince de support (10) et les autres couches minces (20, 30, 40, 50) du document (200) sont faites de matières polymères, la matière polymère constitutive de la couche mince de support (10) ayant une température de transition vitreuse Tg,DF qui est supérieure d'au moins 20°C à la température de transition vitreuse Tg,DF de la matière polymère d'au moins l'une des autres couches minces (20, 30, 40, 50) du document (200). Pour réaliser le document (200), le circuit électrique (1) est tout d'abord préparé sur la couche mince de support (10), puis le couche mince de support (10) destinée au circuit électrique (1) et au moins deux autres couches minces (20, 30, 40, 50) sont regroupées pour former un empilement de couches minces (70), puis l'empilement de couches minces (70) est laminé sous l'action d'une pression élevée et d'une température élevée pour former le document (200).
PCT/EP2013/053735 2012-03-01 2013-02-25 Document et procédé pour réaliser un document WO2013127748A1 (fr)

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IT202000005278A1 (it) * 2020-03-11 2021-09-11 Paolo Alessiato Procedimento per produrre un telo elettrificato e telo elettrificato

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EP2819846A1 (fr) 2015-01-07
DE102012203270A1 (de) 2013-09-05

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