WO2013109870A1 - Matériau blanc argenté pour utilisation dans des applications de frappe de pièces et de jetons - Google Patents

Matériau blanc argenté pour utilisation dans des applications de frappe de pièces et de jetons Download PDF

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Publication number
WO2013109870A1
WO2013109870A1 PCT/US2013/022120 US2013022120W WO2013109870A1 WO 2013109870 A1 WO2013109870 A1 WO 2013109870A1 US 2013022120 W US2013022120 W US 2013022120W WO 2013109870 A1 WO2013109870 A1 WO 2013109870A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
tin
copper
thickness
planchet
Prior art date
Application number
PCT/US2013/022120
Other languages
English (en)
Inventor
Paul Mcdaniel
Randy Beets
Johnny Smelcer
Original Assignee
Jarden Zinc Products, LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jarden Zinc Products, LLC filed Critical Jarden Zinc Products, LLC
Publication of WO2013109870A1 publication Critical patent/WO2013109870A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins

Definitions

  • NPS nickel-plated- steel
  • U.S. Patent 5,151,167 which is incorporated herein by reference.
  • U.S. Patent 5,151,167 which is incorporated herein by reference.
  • some other cost drawbacks include the following:
  • the plated coinage blanks must be burnished to produce a bright, lustrous finish prior to coining.
  • This invention addresses all of these concerns in a cost-effective manner, without sacrificing the performance and service life of the finished coin.
  • the US 1-cent coin has been produced from copper-plated zinc (CPZ) blanks since 1982. Nearly 300 billion coins have been produced in this configuration. A copper plating thickness of only 7-8 ⁇ has proven to be sufficient to protect the zinc blanks from corrosion in service. Annealing and burnishing are not required; as-plated blanks are shipped directly to US Mint facilities for coining. Coining die life is far superior to that obtained with plated steel blanks. Although zinc is more expensive than low-carbon steel, these processing advantages continue to make copper-plated zinc an economically sound choice for low-denomination coins.
  • Acid tin is plated from the +2 valence, versus the +4 valence in alkaline tin baths.
  • alkaline tin takes approximately twice as long to plate as acid tin
  • Acid tin can be plated with a bright finish without polishing or burnishing, while alkaline tin has a matte appearance. Matte tin would require burnishing to achieve a bright finish. Acid tin plating can be used with brighteners which makes the tin deposit even shinier, as desirable for coinage appiclations.
  • Alkaline cyanide copper plating is a preferred type of plating to serve as a base for tin plating when plating over zinc.
  • a laboratory plating barrel load of coin blanks (approximately 8 pounds), was tin-plated for three-minute intervals. Approximately 50 blanks were removed from the barrel at the end of each interval. A total of nine 3 -minute cycles resulted in average tin plating thicknesses (measured in the center of the blank) ranging from 0.4 to 3.8 ⁇ .
  • the underlying copper plating on all blanks measured 7-8 ⁇ .
  • the wear resistance of the finish on coined tokens was then assessed at three different levels of tin thickness: 0.8, 1.2, and 2.0 ⁇ . The intention was to keep the tin thickness to a practical minimum. Details of the wear test are as follows:
  • Test media was prepared and assembled for each set of tokens:
  • a target tin plating thickness of 1 ⁇ was chosen for this test, over the usual 7-8 ⁇ of copper plating.
  • FIG 3 shows that two embodiments of this disclosure actually outperformed solid cupronickel, in the form of US 5-cent coins, in a wear test.
  • the zinc samples were the same size as a 5-cent blank (planchet), but wasn't coined. It should be noted that this test revealed that a 5 ⁇ copper plating thickness is insufficient to protect the base zinc alloy from the acid tin plating bath. There was evidence of zinc attack in the form of pits. This is the reason why the zinc samples with only 1 ⁇ of tin actually outperformed those with 3 ⁇ of tin in this test.
  • Another feature of this electroplating process that suggests its use in higher-denomination coinage is its ability to be tailored to produce a range of electromagnetic signatures (EMS).
  • EMS electromagnetic signatures
  • the copper layer is the more influential of the two, due to its high conductivity ( ⁇ 100% IACS) in comparison to tin ( ⁇ 15% IACS).
  • the effect of copper plating thickness over a zinc substrate on conductivity is demonstrated in Table 1. As the measurement frequency is increased, the effect of the copper plating thickness becomes more pronounced.
  • this plating process is also applicable to copper-plated steel coinage.
  • a thin layer of tin plating over the copper plating would create the same silvery-white appearance, but the total plating thickness would need to be sufficient to protect the steel, approximately 25 ⁇ .
  • Such blanks would have to be annealed prior to plating, because the low- melting tin deposit would not be able to withstand the required temperatures.
  • the additional copper plating thickness, the required annealing, and the reduction in coining die life are all drawbacks compared to the zinc-based configuration. Nonetheless, many countries continue to use copper-plated steel, and the addition of the tin layer would provide a low-cost silvery-white coin for those not comfortable with switching to zinc-based coinage.
  • the plating process described herein builds upon proven technology for low- denomination coinage (copper-plated zinc or steel) by adding a thin layer of tin. Tin is not normally considered for coinage applications, due to its softness, but a thin layer over copper plating shows excellent wear and corrosion resistance. This enables the production of silvery- white coins at a price point far below that of nickel-plated steel, and with the inherent advantages of improved die life at the mint. It has also been demonstrated that the applicability of this process goes beyond the lowest denominations. Performance enhancements are available by increasing the copper and/or tin plating thicknesses, to improve wear and corrosion characteristics and to produce unique EMS properties.
  • Zinc substrate 7-10 ⁇ copper plating, 3- 7 ⁇ tin plating.
  • Circulation coinage Steel substrate, 15-20 ⁇ copper plating, 3-7 ⁇ tin plating.

Abstract

La présente invention concerne un substrat de zinc ou d'acier sous la forme d'un flan ou d'une planchette doté(e) d'une finition blanche argentée durable. Une première couche de cuivre est appliquée sur le substrat suivie d'une seconde couche électro-plaquée d'étain acide. Le flan ou la planchette argenté(e) obtenu(e) est particulièrement approprié(e) pour la frappe de jetons ou de pièces.
PCT/US2013/022120 2012-01-20 2013-01-18 Matériau blanc argenté pour utilisation dans des applications de frappe de pièces et de jetons WO2013109870A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261588709P 2012-01-20 2012-01-20
US61/588,709 2012-01-20

Publications (1)

Publication Number Publication Date
WO2013109870A1 true WO2013109870A1 (fr) 2013-07-25

Family

ID=48799681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/022120 WO2013109870A1 (fr) 2012-01-20 2013-01-18 Matériau blanc argenté pour utilisation dans des applications de frappe de pièces et de jetons

Country Status (1)

Country Link
WO (1) WO2013109870A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106544707A (zh) * 2016-12-09 2017-03-29 济南大学 钢芯酸性亚铜亚锡电镀阶梯仿金青铜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869261A (en) * 1974-05-22 1975-03-04 Usui Kokusai Sangyo Kk Corrosion-resistant composite coating to be formed on steel materials and method of forming the same
KR0139222B1 (ko) * 1990-04-02 1998-05-15 프랭크아이. 피퍼 주화, 메달 또는 토큰용 전기 도금 블랭크와 이의 제조방법
KR100270349B1 (ko) * 1995-12-07 2000-11-01 하루타 히로시 장식부재
US20060286400A1 (en) * 2005-06-17 2006-12-21 Jarden Zinc Products, Inc. Substrate with alloy finish and method of making
KR20070054258A (ko) * 2004-09-24 2007-05-28 자덴 징크 프로덕츠, 인코포레이티드 은백색 외관을 갖는 전기도금된 금속 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869261A (en) * 1974-05-22 1975-03-04 Usui Kokusai Sangyo Kk Corrosion-resistant composite coating to be formed on steel materials and method of forming the same
KR0139222B1 (ko) * 1990-04-02 1998-05-15 프랭크아이. 피퍼 주화, 메달 또는 토큰용 전기 도금 블랭크와 이의 제조방법
KR100270349B1 (ko) * 1995-12-07 2000-11-01 하루타 히로시 장식부재
KR20070054258A (ko) * 2004-09-24 2007-05-28 자덴 징크 프로덕츠, 인코포레이티드 은백색 외관을 갖는 전기도금된 금속 및 그 제조방법
US20060286400A1 (en) * 2005-06-17 2006-12-21 Jarden Zinc Products, Inc. Substrate with alloy finish and method of making

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106544707A (zh) * 2016-12-09 2017-03-29 济南大学 钢芯酸性亚铜亚锡电镀阶梯仿金青铜
CN106544707B (zh) * 2016-12-09 2018-10-02 济南大学 钢芯酸性亚铜亚锡电镀阶梯仿金青铜

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