WO2013104775A1

WO2013104775A1 - Radiation-emitting device having an acoustically adjustable effect and method for producing same

Info

Publication number: WO2013104775A1
Application number: PCT/EP2013/050519
Authority: WO
Inventors: Klaus Sedlbauer; Horst Drotleff; Philip Leistner; Xiaoru Zhou; Jan De Boer
Original assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
Priority date: 2012-01-12
Filing date: 2013-01-11
Publication date: 2013-07-18
Also published as: DE102012000412A1

Abstract

The invention relates to a planar arrangement comprising a radiation-emitting device having at least one radiation-emitting component (9), wherein the component (9) comprises a substrate (1), an anode (2), a cathode (4) and at least one active layer (3) arranged between the anode (2) and the cathode (4). The arrangement is distinguished by the fact that a plurality of cutouts (7) are present in the planar arrangement, such that the planar arrangement is embodied acoustically as a microperforated absorber or as part of a microperforated absorber.

Description

Patent Application: Radiation-emitting component with acoustically adjustable effect and method for producing the same

Applicant: Fraunhofer-Gesellschaft for the promotion of applied research e.V.

Technical area

The present invention relates to radiation-emitting components with acoustically adjustable effect, and a method for producing the same. These are predominantly radiation-emitting components with light-emitting diodes (LED), in particular with organic light-emitting diodes (OLED).

State of the art

In the professional planning of buildings, the lighting design,

Lighting technology and acoustics play a significant role. With regard to one

Sustainable use of resources and energy and the increasing demands of users of buildings with regard to comfortable and functional lighting and acoustics will further increase the importance of lighting design, lighting technology and acoustics. In addition, there are a host of other technical and design variants in the planning of, especially through the OLED technology

Lighting systems opened. According to the current state of the art, to fulfill the

lighting technology and acoustic functions used indoors mostly different components. Lighting functionality is provided by lamps and lights, acoustic functionality by special absorbers or by acoustically enhanced components such as ceiling panels, etc. The principle of microperforation, which is known, for example, from WO 94/26995, makes it possible in particular to acoustically reinforce building materials that can be used for lighting technology. For example, perforated, transparent light-deflecting surfaces (eg prismatic structures) or diffused Plexiglas for guiding light and glare in luminaires and as a protective element against direct interference with luminaires can be used (see article Zeitschrift "Licht" 7) -8, 2009).

The perforation can be introduced by drilling or lasers in the building materials. Hole diameter, hole depth and hole spacing determine the acoustic effect. The photometric effect is not significantly influenced by the usual perforation required for the acoustic effectiveness.

At the moment, new light sources are being developed on the basis of organic semiconductor elements (Organic Light Emitting Diode OLEDs). Work is also underway to further develop the already well-established LED technology (light emitting diode, LED). OLEDs are characterized by a very flat design and a flat light output. The moderate luminances of about 1 000-2000 cd / m ² allow the operation of the elements without classical glare designs such as Blendraster. In order to obtain the luminous flux required in the work areas, OLEDs have to be brought into the room considerably larger. They therefore prove significantly more

Space (enclosing) surface as conventional lights. This area is no longer available for other trades, such as silencers.

From WO2004 / 0141 02 A1, a ceiling element is known, which has light-emitting modules and has an acoustic damping effect. The ceiling elements have a rear panel, a cover and a fixed spacer. The

Spacer extends between the back panel and the cover. In the modules, light-emitting elements such as LEDs are arranged. The covering, which also covers the light emitting diodes, may be a translucent solid material which is microperforated for sound absorption.

EP 2 01 5 291 B 1 describes microperforated acoustic elements. It also dimensions are specified. It is an object of the present invention to provide an improved possibility of allowing sound absorption even when using semiconductor-based lamps which have a large area requirement.

The solution to this problem is described below and can be found in particular in the independent claims. Further embodiments are shown in particular in the dependent claims. According to the invention, a planar arrangement with a radiation-emitting component is provided. This component contains at least one radiation-emitting component. The device comprises a substrate, an anode, a cathode and at least one active layer disposed between the anode and the cathode. This planar arrangement is characterized in that a plurality of recesses is present in it, so that the planar arrangement is formed acoustically as a microperforated absorber or as part of a microperforated absorber. As will become clearer later, the recesses are found in the radiation-emitting component. In this way is a large area

Radiation-emitting arrangement possible, which also fulfills the function of a micro-perforated absorber, ie an efficient sound absorber. In view of the often limited space enclosing surfaces and the increasing space requirement for large-area radiation-emitting arrangements, in particular arrangements for lighting, it is advantageous to combine the two aspects, the radiation emission and the sound attenuation. Since the microperforation relatively small holes, that is, small recesses are needed, usually the diameter is about 0, 1 mm to 2 mm, and a hole area content of less than 5% is sufficient, the

Microperforation without compromising on the visual appearance of the

Radiation-emitting component can be realized. In this case, an acoustically as microperforated is basically already by the areal arrangement with the recesses

Absorber-acting component created. Microperforated absorbers often have superstructures with a microperforated surface and one behind it

Thus, the planar arrangement with the recesses can also be regarded as part of such a microperforated absorber. The above-mentioned planar arrangement differs significantly from previously known devices, which also serve the lighting and soundproofing.

Protective devices and / or glare-proofing devices of lamps designed as sound absorbers have hitherto been known. For example, microperforated acrylic glass elements arranged in front of a lamp are known. But it is the

Sound absorber not shining itself. It is thus possible to arrange the acoustically effective cavity, which dampens the sound waves excited in the recesses, behind the light-emitting surface.

Usually, the radiation-emitting components according to the invention are relatively large, they can reach the size of square meters. Such a component normally contains at least one radiation-emitting component, as a rule there are very many components which emit radiation.

Conventional radiation-emitting components are usually encapsulated, that is surrounded on all sides by a protective layer. In particular, the protective layer causes the active layer and the further functional layers to be protected from environmental influences such as water or oxygen. The encapsulation can for example consist of a

transparent ceramic, a glass or the like may be formed, but it may also be formed by a plastic. In this case, corresponding films can be used. In many cases, it will therefore be necessary that the lateral surfaces of the

Recesses have a protective layer for the radiation-emitting component, in particular for the radiation-emitting components. To avoid

It should be explained that the lateral surfaces are those surfaces which form as interfaces between the component or the individual components and the recesses.

In most cases, the protective layer is formed by an additional lateral encapsulation, in particular by an adhesive and / or a dispersion. But there are also ceramic protective layers conceivable. In this case, the lateral encapsulation may be part of an encapsulation which also covers horizontal surfaces of the component. One way to provide the protective layer results from the fact that a device is introduced into the recess in the manner of an eyelet. This allows to produce the device outside of the component and then simply insert this device in the manner of an eyelet in the component. By producing outside of the component, the production can be simplified since it is not necessary to take into account the radiation-emitting component and the radiation-emitting components contained in the component. The eyelet can be glued to the actual encapsulation. The required adhesive may generally include a getter material that absorbs undesirable substances such as water or oxygen. One way to provide the recesses results from the fact that a

A plurality of juxtaposed radiation-emitting components is present, and the recesses adjacent to two, three or more, in particular already completely encapsulated, radiation-emitting components are arranged. In this way, the recesses need not be located within the radiation-emitting components, so that they are not impaired in their functionality by the recesses. Since, as a rule, a component is constructed from a plurality of components anyway, an acoustically desired amount of recesses can be provided without problems in this way. In this solution, the

Microperforation often does not conform to the classic pattern with always equal intervals. Rather, the microperforation pattern will be based on the widespread shape of the components, at the edge of which the recesses are located. Thus, currently available components on hexagonal components. Accordingly, the

Recesses arranged along the hexagons. This creates a new, equally useful microperforation pattern. In one embodiment, the recesses are formed according to the type of holes. Thus, the recesses can be formed simply by drilling into the planar arrangement and then applying a protective layer. The diameter of the hole should first be chosen so that there is still room left for the protective layer. For the frequencies usually to be damped in rooms, the recesses should have a diameter or, if they are not geometrical arrangements, in which the term diameter makes sense, have a corresponding extent, from 0, 1 to 2 mm and a distance from each other from 0, 1 2 to 50 mm. In this way results in the desired acoustic absorption effect, as it is known in microperforated absorbers. The area of the active layer of one component amounts to a further one

Embodiment at least 1 mm ² , in particular at least 1 cm ² , for example at least 10 cm ² ; According to one embodiment, it is in the range of 1 mm ² to 1 cm ² . It is understood that such limits are usually not very keen to look at. It will usually be based on the usual, increasingly available on the market components.

Although various embodiments of a radiation-emitting component are conceivable, according to the current view it will as a rule be an OLED. Such components have proved their worth so far and, despite currently still high costs, a significant cost reduction and a market breakthrough in the next few years can be expected.

An alternative embodiment could be an LED-based panel. Here you have a slightly different structure than OLEDs. Rather, a board is formed with LEDs, are placed on the diffusers.

The planar arrangement may also arise if at least a part of the

Components is geometrically designed so that when joining the

Components can form the desired recesses to the component between the components. In this case already encapsulated components can be used.

As already indicated above, a useful sound absorber results in which a planar arrangement as described above is arranged at a distance from a wall and / or a ceiling and / or other room enclosing surface. This wall, ceiling or other Raumumschließungsfläche limits a rear space behind the planar arrangement, so that in the recesses by the incident and to be damped sound forming vibrations can be damped. In this way, a classic micro-perforated sound absorber is created. The planar arrangement described above can be produced by producing continuous recesses in a radiation-emitting component, in particular in a component in which a plurality of OLEDs are contained as components. For this purpose, especially a mechanical hole of these holes or offers a

Providing these recesses by a laser. Thus, it is possible to use conventional planar arrangements, as are commercially available, and only have to be adapted with a manageable outlay. When producing the holes with a laser, a welding of the substrate and the encapsulation can additionally take place. As already explained above, a protective layer is generally to be applied after the recesses have been produced. There are two variants. It can be one

Radiation-emitting component, which already contains an encapsulation for the components can be used. Then it is sufficient to apply the destroyed by the introduction of bores protective layer in the region of the lateral surfaces of the recesses. This can be achieved together with the existing protective layers on the horizontal surfaces encapsulation of the components.

Alternatively, it is possible to introduce the bores into a radiation-emitting component, which still contains no protective layers and no encapsulation.

Subsequently, the protective layer can be applied to the lateral surfaces of the recesses and to the horizontal surfaces of the component and of the individual components. Thus, the encapsulation of the components can be done in one go.

In a further embodiment, the recesses are produced in a region which is formed from the material of the protective layer. This is the case in particular if one chooses for the recesses an area in which there is no active layer of a component, but is arranged in the material for the protection of the components, in particular for the protection of the active areas of the components. In the case of a large number of components, as is normally the case with the components, such areas are found in the region between the individual components.

As also already mentioned, the recesses can also be formed by the fact that the components from which the component is constructed geometrically so are that arise when joining the components to the component, the recesses. This can be done so that components which have a protective layer, and are also provided on the lateral surfaces, ie with an encapsulation, are geometrically designed so that when assembling the components to a component, the planar arrangement results with the recesses. In such a case, the application of a further lateral protective layer could either be completely dispensed with or at least made much simpler.

The invention will be described in more detail below with reference to Figures 1 to 6. Showing:

Figure 1 shows an embodiment in which a hole is introduced into individual OLEDs and then a protective layer is applied

Figure 2 shows a variant in which in a region containing material of the protective layer, a bore is introduced.

FIG. 3 shows the insertion of an eyelet forming the protective layer.

FIG. 4 shows a variant in which the microperforation in printed conductors (separating structure)

is introduced between a plurality of individual OLED components.

FIG. 5 shows a variant in which geometrically specially designed OLED elements are joined together in such a way that acoustically effective

Recesses result.

Figure 6 is a schematic side view of an OLED

FIG. 1 shows a component which is formed from an OLED. The outermost layer is e substrate 1, which is a glass or a foil. This is followed by an anode 2 made of indium tin oxide (indium tin oxide, ITO). This is followed by the active organic layer 3. This is bordered on the side facing away from the anode 2 of the cathode 4, which preferably consists of aluminum. This is followed by an encapsulation 5 Enclosure. In the edge regions between substrate 1 and encapsulation 5 instead of anode 2, organic layer 3 and cathode 4, an adhesive 6, usually made of epoxy resin, arranged as an edge seal.

To produce such an OLED, the cathode 4 is perforated according to the required microperforation structure. On this perforated cathode 4 is the

Cathode layer applied. Then the active organic layer 3, so the OLED layer is applied. For this purpose, the so-called C losed Coupled Showerhead method is used. The holes 7 are recessed. Subsequently, the present as a dispersion adhesive 6 of epoxy resin is introduced into the edge regions. Likewise, the procedure at the holes 7. This is followed by curing of the adhesive 6 by the action of UV radiation.

This results in hole areas 7, which are protected by the adhesive 6. These areas will now be drilled. The hole can be created either mechanically or by laser. Due to the existing adhesive, the bore does not damage the areas relevant to the function of the OLED.

The structure shown in Figure 2 is similar to the structure shown in Figure 1. The main difference lies in the manufacturing process. Here is first in

conventionally made an OLED. It is therefore dispensed with the perforation of the cathode 4 and made according to the above-described method, an OLED without holes. In the finished OLED are then according to the acoustically desired

Micro perforation structure holes 7 introduced. This can be done by mechanical drilling or by lasering. The holes 7 initially have a larger diameter than desired for the acoustic function. In the holes 7 now present as a dispersion of adhesive 6 epoxy resin is introduced. This in turn follows a curing of the adhesive 6 by the action of UV radiation. Subsequently, the acoustically desired holes 7 are drilled in the cured adhesive 6, mechanically or by laser. Thus, you get holes 7 without damaging the relevant for the function of the OLED areas.

In the structure shown in FIG. 3, an OLED is first of all fabricated as described above and, in turn, holes 7 are introduced, which are larger than those acoustically desired. In these holes 7 a prefabricated eyelet 8 is introduced. Of the

Outer diameter corresponds to these eyelets corresponds to the diameter of the

introduced holes 7. As the inner diameter of the desired diameter for the acoustically effective holes 7 is selected. The eyelets 8 are thermally fused with the OLED and thus protect the relevant areas for the function of the OLED areas.

FIG. 4 shows a further construction. For this purpose, an OLED lamp is used as a component. This contains a plurality of individual OLEDs 9 as components. These are separated from one another by a conductor track structure or separating structure 10. This separation serves e.g. to avoid inhomogeneities in larger OLED lamps. It also serves to protect against electrical defects between the poles of the OLED. In such a lamp, the holes 7 in the area between the individual OLEDs, which serve as components. This creates a micro-perforation structure in this area.

FIG. 5 schematically shows two OLED components 9, which have semicircular incisions on one side. If these components 9 joined together, so round recesses, which for the desired

Micro perforation structure with the holes 7 serve. The components 9 are finally encapsulated before assembly. So there is no need for aftertreatment. To understand the background, the function of an OLED will be explained briefly with reference to the schematic side view of an OLED shown in FIG. The exemplary layer sequence comprises on an substrate 1 an anode 2, a

Hole transport layer 1 1, an organic emission layer 3 as a functional layer, an electron transport layer 12 and a cathode 4. It can, among others

functional organic layers also have an electron injection layer in the

Layer sequence to be present. This can be arranged between the electron transport layer 12 and the cathode 4 (not shown here). For example, as known to those skilled in the art, the substrate 1 may be a glass substrate, the anode may include indium tin oxide, and the cathode may be a metal cathode. The encapsulation of the OLED is not shown here. This exemplary layer sequence 13 can be characterized by successive Zesse be deposited and structured, so that produced an OLED

LIST OF REFERENCE NUMBERS

1 substrate

2 anodes

3 Active organic layer

4 cathode

5 encapsulation

6 glue

7 holes

8 eyelet

9 OLED device

1 0 Track structure / separation structure

1 1 hole transport layer

1 2 electron transport layer

1 3 Layer sequence of the individual OLED layers

Claims

claims

1 . Flat arrangement with a radiation-emitting component which has at least one radiation-emitting component (9), wherein the component (9) comprises a substrate (1), an anode (2), a cathode (4) and at least one between the anode (2) and the cathode (3) arranged active layer (3), characterized in that in the component a plurality of recesses (7) is present, so that the planar arrangement is formed acoustically as a microperforated absorber or as part of a microperforated absorber.

2. A planar arrangement according to claim 1, characterized in that the lateral surfaces of the recesses (7) has a protective layer (6) for the

Have radiation-emitting device (9).

3. A planar arrangement according to claim 2, characterized in that the

Protective layer is formed by a lateral encapsulation, in particular by an adhesive (6) and / or a dispersion and / or part of a

Encapsulation is that also covers horizontal surfaces of the device (9).

4. A planar arrangement according to one of claims 2 or 3, characterized

in that the protective layer is formed by a device (8) introduced into the recess (7) in the manner of an eyelet (8).

5. Areal arrangement according to one of the preceding claims, characterized

characterized in that the planar arrangement has a plurality of radiation-emitting components (9) arranged next to one another and the

Recesses (7) adjacent to two, three or more radiation-emitting components (9) are arranged.

6. Flat arrangement according to one of the preceding claims, characterized

characterized in that the recesses (7) are formed in the manner of holes.

7. A planar arrangement according to one of the preceding claims, characterized in that the recesses (7) have a diameter or a corresponding extension of 0, 1 mm to 2 mm and a distance from each other from 0, 12 mm to 50 mm.

8. A planar arrangement according to one of the preceding claims, characterized in that the at least one radiation-emitting component (9) is an OLED.

9. The planar arrangement according to claim 1, wherein at least a part of the components is geometrically configured such that recesses can be formed between the components when the components are joined together.

1 0. Sound absorber, characterized in that a planar arrangement according to one of the preceding claims spaced from a wall and / or a ceiling and / or other Raumumschließungsfläche is arranged.

1 1. Method for producing a planar arrangement according to one of Claims 1 to 8, characterized in that continuous recesses (7) are produced in an optoelectronic component, in particular in a component in which a plurality of OLEDs are contained as components (9), in particular by mechanical drilling or by lasering.

1 2. The method of claim 1 1, characterized in that after generating the recesses (7) an encapsulation for lateral and horizontal surfaces of the device (9) is applied.

1 3. A method according to claim 1 1, characterized in that after generating the recesses (7) an additional encapsulation (6) for the lateral surfaces of the component (9).

14. The method according to claim 1 1, characterized in that the

Recesses (7) are generated in a region which is formed from the material of the protective layer.

1 5. A method for producing a planar arrangement with a

Radiation-emitting component according to one of Claims 1 to 9, in which the component is composed of a plurality of components (9), characterized in that at least a part of the components (9) is geometrically designed so that when assembling the components (9 ) to the component between the components (9) recesses (7) form, so that the planar arrangement is acoustically designed so that it can serve as a microperforated absorber or as part of a microperforated absorber.