WO2013094959A1 - Apparatus for manufacturing ultra-micro structure for preventing corrosion in cylindrical stainless steel - Google Patents

Apparatus for manufacturing ultra-micro structure for preventing corrosion in cylindrical stainless steel Download PDF

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WO2013094959A1
WO2013094959A1 PCT/KR2012/011056 KR2012011056W WO2013094959A1 WO 2013094959 A1 WO2013094959 A1 WO 2013094959A1 KR 2012011056 W KR2012011056 W KR 2012011056W WO 2013094959 A1 WO2013094959 A1 WO 2013094959A1
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ultra
pipe
fine structure
stainless steel
bath
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PCT/KR2012/011056
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French (fr)
Korean (ko)
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이성호
황병준
이낙규
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한국생산기술연구원
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
    • C23F13/04—Controlling or regulating desired parameters

Definitions

  • the present invention relates to an ultra-fine structure manufacturing apparatus, and more particularly to the production of nano and micro structures having a very small surface structure in the cylindrical stainless steel to prevent the formation of biofilm that affects corrosion, such as oxidation corrosion in the cylindrical stainless It relates to an ultra-fine structure manufacturing apparatus for prevention.
  • a process of forming a fine pattern on a substrate is performed when manufacturing a semiconductor, electronic, photoelectric, magnetic, or display device.
  • a typical technique for forming a fine pattern on a substrate is to use light.
  • the photolithography method is a reticle designed by applying a polymer material having a responsiveness to light (for example, a photoresist, etc.) onto a substrate on which a material to be patterned is deposited (or deposited), and having a desired pattern.
  • the light is transmitted through the polymer material through the light, and the polymer material exposed through the developing process is removed to form a pattern mask (or an etching mask) having a target pattern on the material to be patterned.
  • the material laminated on the substrate is patterned into a desired pattern.
  • the circuit line width (or pattern line width) is determined by the wavelength of light used in the exposure process
  • the ultrafine pattern on the substrate using the photolithography process is considered in consideration of the current technology level. For example, it is very difficult to form an ultrafine pattern having a line width of 100 nm or less.
  • a three-dimensional shape through multiple processes can be formed as a pattern on a large-area substrate by using a light method, a pattern formation, an etching process, a cleaning process, and the like are performed every time one pattern is formed in order to perform the multiple processes. Since the process must be performed, it takes a long time and the process becomes very complicated, and this problem leads to a problem that the production cost of the product is increased and productivity is lowered.
  • new techniques for forming ultrafine patterns having line widths of 100 nm or less are being actively conducted, and new techniques include micro-contact printing and imprinting.
  • the micro-contact printing method is a method of obtaining a pattern of a desired shape by imprinting a polymer mold on a substrate, that is, a polymer mold having a shape (or pattern) of a desired shape (for example, a PDMS mold). It is a method of changing the surface state by contacting the substrate, thereby etching or selectively depositing only the desired portion.
  • the fine contact printing method as described above has the advantage of not applying a special external force, while the deformed surface state is permanently maintained unless the surface is scraped off.
  • the stamping method forms a fine pattern on the polymer by pressing a mold having a large hardness having a desired shape (pattern) with a physical force, and using a method such as reactive ion etching, for example. It is a method of transferring to a substrate.
  • the above-described imprinting method has a fatal disadvantage that the polymer thin film and the substrate are deformed or broken because the high pressure is used when pressing.
  • micropattern forming methods are mostly used when manufacturing display devices including semiconductors, electronic and organic light emitting diodes (OLEDs), liquid crystal displays (LCDs), and the like, and for this, photolithography.
  • OLEDs electronic and organic light emitting diodes
  • LCDs liquid crystal displays
  • photolithography photolithography
  • this micropattern forming technology is difficult to carry out the process in the part that is difficult to process the surface because it is difficult to got processing inside the pipe or has a round or curved shape, so it is used for products with actual curvature except the flat plate process. There was a very difficult problem.
  • An object of the present invention for solving the above problems is to provide an ultra-fine structure for preventing corrosion in the cylindrical stainless steel to form an ultra-fine structure in the stainless steel through an electrocoagulation flotation method.
  • Ultra-fine structure manufacturing apparatus for solving the above problems is a hollow bath; A pipe electrode located inside the bath; A stainless pipe positioned inside the pipe electrode; And a power supply unit supplying electric charges to the pipe electrode and the stainless pipe.
  • the power supply unit one side of the cathode wire connected to the pipe electrode; An anode wire connected to one side of the stainless pipe; And a power source connected to the cathode line and the other side of the anode line.
  • the ultra-fine structure is characterized in that it is manufactured by the ultra-fine structure manufacturing apparatus according to the above.
  • the ultra-fine structure is characterized in that it is formed inside the stainless pipe by chemical reaction as the electric charge supplied from the power is applied to the pipe electrode and the stainless pipe.
  • the ultra-fine structure further comprises a circulation pump in communication with the bath adjacent to the bath.
  • the inner surface of the ultra-fine structure is characterized in that the ultra-miniature structure.
  • the present invention as described above has the effect of extending the life of the product by preventing the formation of the biofilm through the ultra-fine hydrophobic surface structure in the stainless steel through the electro-floating flotation method.
  • the water dwells in the muffler, and at the same time, the nitrate ions and sulfate ions dissolved in water are prevented from contacting the surface of the muffler.
  • the present invention produces an effect that can be utilized in related industries by reducing the thickness of stainless steel.
  • FIG. 1 is a perspective view in one direction showing an ultra-fine structure manufacturing apparatus for preventing corrosion in a cylindrical stainless steel according to an embodiment of the present invention
  • FIG. 2 is a perspective view of an ultrafine structure for preventing corrosion in a cylindrical stainless steel according to an embodiment of the present invention.
  • Components constituting the ultra-fine structure manufacturing apparatus for preventing corrosion in the cylindrical stainless steel of the present invention may be used integrally or separately separated as needed. In addition, some components may be omitted depending on the form of use.
  • FIGS. 1-10 A preferred embodiment of the ultra-fine structure manufacturing apparatus 100 for preventing corrosion in the cylindrical stainless steel according to the present invention will be described with reference to FIGS.
  • the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description.
  • terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or convention of a user or an operator. Therefore, definitions of these terms should be described based on the contents throughout the specification.
  • Ultrafine structure manufacturing apparatus 100 for preventing corrosion in a cylindrical stainless steel is a pipe electrode 110, the pipe electrode 110 and the ultrafine structure 160 located inside the bath 130. It includes a power supply unit 120 for supplying electricity, a bath 130 surrounding the pipe electrode 110 and the circulation pump 140 in communication with the bath 130 adjacent to the bath 130.
  • the pipe electrode 110 is located inside the bath 130, and the top and bottom of the pipe electrode 110 are opened in the form of a general pipe.
  • the pipe electrode 110 is connected to the cathode ray 123 to receive a charge.
  • the power supply unit 120 is a power source 121 is connected to the other side of the anode line 122 and the cathode line 123, the anode line 122 is connected to the stainless steel pipe 150 and one side is connected to the pipe electrode 110. Cathode ray 123.
  • the power source 121 is connected to the other side of the anode line 122 and the cathode line 123, and the power source 121 supplies positive charge to the anode line 122, and serves to supply negative charge to the cathode line 123.
  • One side of the anode line 122 is connected to the stainless pipe 150, and the anode line 122 serves to apply the positive charge applied from the power source 121 to the stainless pipe 150.
  • One side of the cathode ray 123 is connected to the pipe electrode 110, and the cathode ray 123 serves to apply the negative charge applied from the power source 121 to the pipe electrode 110.
  • the bath 130 has a hollow hollow shape, and the pipe electrode 110 and the stainless pipe 150 are located therein.
  • the bath 130 is connected to the circulation pump 140.
  • the circulation pump 140 communicates with the bath 130 adjacent to the bath 130.
  • the stainless pipe 150 has a generally open upper and lower tube shape, and the material is preferably stainless steel.
  • the stainless pipe 150 is connected to the anode wire 122 to receive a positive charge supplied from the power source 121.
  • the ultra-fine structure 160 is formed inside the stainless pipe 150 by the above-described ultra-fine structure manufacturing apparatus, the ultra-fine structure 160 is an electric pipe electrode 110 and the electricity supplied from the power 121; As applied to the stainless pipe 150 is a chemical reaction is formed in the stainless pipe 150.
  • the ultra-fine structure 100 for preventing corrosion in the cylindrical stainless steel of the present invention can extend its life when applied to a place where it is easy to be exposed to oxidation of water pipes, automobiles and motorcycles due to the superhydrophobic surface structure. Reducing the thickness of stainless steel has the advantage of reducing the production cost.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Prevention Of Electric Corrosion (AREA)

Abstract

Provided is an ultra-micro structure for preventing corrosion in cylindrical stainless steel. A nano and micro structure having a superhydrophobic surface structure is produced in the cylindrical stainless steel so as to prevent the formation of a biofilm that affects corrosion such as oxidization. In addition, according to the present invention, the formation of the biofilm is prevented using an electric aggregation floatation method and the ultra-micro structure having a superhydrophobic surface structure in the stainless steel, and thus product life can be extended.

Description

원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조 장치Ultra-fine structure manufacturing device for corrosion protection in cylindrical stainless steel
본 발명은 초미세 구조물 제조 장치에 관한 것으로, 보다 상세하게는 원통형 스테인레스 내에 초소수형 표면 구조를 지닌 나노 및 마이크로 구조물을 제작하여 산화 등 부식에 영향을 주는 바이오필름의 형성을 방지하는 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조 장치에 관한 것이다.The present invention relates to an ultra-fine structure manufacturing apparatus, and more particularly to the production of nano and micro structures having a very small surface structure in the cylindrical stainless steel to prevent the formation of biofilm that affects corrosion, such as oxidation corrosion in the cylindrical stainless It relates to an ultra-fine structure manufacturing apparatus for prevention.
기 알려진 바와 같이, 반도체나 전자, 광전, 자기, 표시 소자 등을 제조할 때 기판상에 미세패턴을 형성하는 공정을 수행하게 되는데, 이와 같이 기판상이 미세패턴을 형성하는 대표적인 기법으로는 빛을 이용하여 미세패턴을 형성하는 포토리소그라피(photolithography) 방법이 있다.As is already known, a process of forming a fine pattern on a substrate is performed when manufacturing a semiconductor, electronic, photoelectric, magnetic, or display device. As such, a typical technique for forming a fine pattern on a substrate is to use light. There is a photolithography method for forming a fine pattern.
상기한 포토리소그라피 방법은 빛에 대한 반응성을 갖는 고분자 물질(예를 들면, 포토레지스트 등)을 패터닝하고자 하는 물질이 적층(또는 증착)된 기판상에 도포하고, 목표로 하는 임의의 패턴으로 설계된 레티클을 통해 고분자 물질 상에 빛을 투과시켜 노광하며, 현상 공정을 통해 노광된 고분자 물질을 제거함으로써, 패터닝하고자 하는 물질 위에 목표로 하는 패턴을 갖는 패턴 마스크(또는 식각 마스크)를 형성한다.The photolithography method is a reticle designed by applying a polymer material having a responsiveness to light (for example, a photoresist, etc.) onto a substrate on which a material to be patterned is deposited (or deposited), and having a desired pattern. The light is transmitted through the polymer material through the light, and the polymer material exposed through the developing process is removed to form a pattern mask (or an etching mask) having a target pattern on the material to be patterned.
이후에, 패턴 마스크를 이용하는 식각 공정을 수행함으로써, 기판상에 적층된 물질을 원하는 패턴으로 패터닝한다.Thereafter, by performing an etching process using a pattern mask, the material laminated on the substrate is patterned into a desired pattern.
한편, 상기한 바와 같은 포토리소그라피 방법은 회로 선폭(또는 패턴 선폭)이 노광 공정에 사용되는 빛의 파장에 의해 결정됨에 따라 현재의 기술수준을 고려할 때 포토리소그라피 공정을 이용하여 기판상에 초미세패턴, 예를ㄹ 들면 선폭이 100nm 이하인 초미세패턴을 형성하는 것이 매우 어려운 실정이다.On the other hand, in the photolithography method as described above, since the circuit line width (or pattern line width) is determined by the wavelength of light used in the exposure process, the ultrafine pattern on the substrate using the photolithography process is considered in consideration of the current technology level. For example, it is very difficult to form an ultrafine pattern having a line width of 100 nm or less.
또한, 빛을 이용한 방법으로 다중 공정을 통한 3차원 형상을 대면적 기판 위에 패턴으로 형성할 수는 있으나, 다중 공정을 행하기 위해서는 하나의 패턴을 형성할 때마다 패턴 형성, 식각 공정, 세정 공정 등을 수행하여야만 하기 때문에 시간이 오래 걸리고 공정이 매우 복잡해진다는 문제가 있으며, 이러한 문제는 결국 제품의 제조 비용 상승 및 생산성의 저하를 초래하게 된다는 문제를 야기한다.In addition, although a three-dimensional shape through multiple processes can be formed as a pattern on a large-area substrate by using a light method, a pattern formation, an etching process, a cleaning process, and the like are performed every time one pattern is formed in order to perform the multiple processes. Since the process must be performed, it takes a long time and the process becomes very complicated, and this problem leads to a problem that the production cost of the product is increased and productivity is lowered.
더욱이, 빛을 이용하여 기판상에 미세패턴을 형성하는 종래의 방법에서는 패턴이 형성될 기판의 표면이 편평하지 않으면 빛의 반사나 회절, 세기 변화 등에 의하여 공정이 매우 복잡해지는 문제가 있었다.In addition, in the conventional method of forming a fine pattern on a substrate using light, if the surface of the substrate on which the pattern is to be formed is not flat, there is a problem in that the process is very complicated due to light reflection, diffraction, intensity change, or the like.
따라서, 선폭이 100nm 이하인 초미세패턴을 형성하는 새로운 기법에 대한 연구 개발이 도처에서 활발하게 진행되고 있으며, 새로운 기법으로는 미세 접촉 프린팅(micro-contact printing) 방법과 각인(imprinting) 방법이 있다.Accordingly, research and development of new techniques for forming ultrafine patterns having line widths of 100 nm or less are being actively conducted, and new techniques include micro-contact printing and imprinting.
상기한 방법 중 미세 접촉 프린팅 방법은 고분자 주형(mold)을 기판상에 각인시켜 원하는 형상의 패턴을 얻는 방식, 즉 원하는 모양의 형상(또는 패턴)을 갖는 고분자 주형(예를 들면, PDMS 주형)을 기판 상에 접촉시켜 표면 상태를 변화시키고, 이를 통해 원하는 부분만을 남기고 식각하거나 선택적으로 증착하는 방법이다.Among the above methods, the micro-contact printing method is a method of obtaining a pattern of a desired shape by imprinting a polymer mold on a substrate, that is, a polymer mold having a shape (or pattern) of a desired shape (for example, a PDMS mold). It is a method of changing the surface state by contacting the substrate, thereby etching or selectively depositing only the desired portion.
그러나, 상술한 바와 같은 미세 접촉 프린팅 방법은 특별한 외력을 가하지 않는다는 장점을 갖는 반면에 표면을 깎아내지 않는 이상 변형된 표면 상태가 영구적으로 유지된다는 단점을 갖는다.However, the fine contact printing method as described above has the advantage of not applying a special external force, while the deformed surface state is permanently maintained unless the surface is scraped off.
또한, 각인 방법은 원한 형상(패턴)을 가지고 있는 경도가 큰 주형을 물리적인 힘으로 가압하여 고분자 위에 미세패턴을 형성하고, 예를 들면 반응성 이온 식각(reactive Ion Ething) 등의 방법을 이용하여 이를 기판에 전송하는 방법이다.In addition, the stamping method forms a fine pattern on the polymer by pressing a mold having a large hardness having a desired shape (pattern) with a physical force, and using a method such as reactive ion etching, for example. It is a method of transferring to a substrate.
그러나, 상기한 각인 방법은 가압할 때 높은 압력을 이용하기 때문에 고분자 박막 및 기판이 변형되거나 파손되는 현상이 야기된다는 치명적인 단점을 갖는다.However, the above-described imprinting method has a fatal disadvantage that the polymer thin film and the substrate are deformed or broken because the high pressure is used when pressing.
다시 말해서, 종래에 기 알려진 미세패턴 형성 방식은 대부분 반도체, 전자 및 유기 발광 다이오드(OLED), 액정 표시 장치(LCD)를 비롯한 표시 소자 등을 제조할 때 이용되는 것으로, 이를 위하여 포토 리소그래피 방식(Photolithography : Photo resist 등이 빛을 받으면 화학반응을 일으켜서 성질이 변화하는 원리를 이용하여, 얻고자 하는 패턴의 마크를 사용하여 빛을 선택적으로 포토 레지스트에 조사함으로써 마크의 패턴과 동일한 패턴을 형성시키는 공정) 및 그에 대안 기술인 소프트 리소그라피 등의 기술이 개발되고 있다.In other words, conventionally known micropattern forming methods are mostly used when manufacturing display devices including semiconductors, electronic and organic light emitting diodes (OLEDs), liquid crystal displays (LCDs), and the like, and for this, photolithography. : Process that forms the same pattern as the pattern of the mark by selectively irradiating light to the photoresist using the mark of the pattern to be obtained by using the principle that the property changes when the photoresist receives light. And alternative technologies such as soft lithography have been developed.
그러나, 이러한 미세패턴 형성 기술은 파이프 내부와 가팅 가공이 어렵거나 형상이 원형이나 곡면을 띄고 있어 표면 처리가 어려운 부분에서는 해당 공정을 진행하기에 어려운 점이 많기 때문에 평판 공정 외에는 실제 곡률이 있는 제품에 이용하기 굉장히 힘든 문제점이 있었다.However, this micropattern forming technology is difficult to carry out the process in the part that is difficult to process the surface because it is difficult to got processing inside the pipe or has a round or curved shape, so it is used for products with actual curvature except the flat plate process. There was a very difficult problem.
상기와 같은 문제점을 해결하기 위한 본 발명의 목적은 전기 응집 부상 방식를 통하여 스테인레스 내부에 초미세 구조물을 형성하는 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물을 제공하는 것이다.An object of the present invention for solving the above problems is to provide an ultra-fine structure for preventing corrosion in the cylindrical stainless steel to form an ultra-fine structure in the stainless steel through an electrocoagulation flotation method.
또한, 본 발명의 목적은 초소수성 표면 구조인 초미세 구조물을 물 파이프, 자동차 및 오토바이 등에 적용하여 수명 연장이 가능한 형성하는 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물을 제공하는 것이다.It is also an object of the present invention to provide an ultrafine structure for preventing corrosion in a cylindrical stainless steel which can be applied to an ultrafine structure, which is a superhydrophobic surface structure, for water pipes, automobiles, motorcycles, and the like, to extend its life.
상기와 같은 문제점을 해결하기 위한 본 발명에 따른 초미세 구조물 제조장치는 중공의 배스; 상기 배스의 내부에 위치하는 파이프 전극; 상기 파이프 전극의 내부에 위치하는 스테인레스 파이프; 및 상기 파이프 전극 및 상기 스테인레스 파이프에 전하를 공급하는 전력공급부;를 포함하는 것을 특징으로 한다.Ultra-fine structure manufacturing apparatus according to the present invention for solving the above problems is a hollow bath; A pipe electrode located inside the bath; A stainless pipe positioned inside the pipe electrode; And a power supply unit supplying electric charges to the pipe electrode and the stainless pipe.
바람직하게는, 상기 전력공급부는, 일측이 상기 파이프 전극과 연결되는 음극선; 일측이 상기 스테인레스 파이프와 연결되는 양극선; 및 상기 음극선 및 상기 양극선의 타측과 연결되는 전원;을 더 포함하는 것을 특징으로 한다.Preferably, the power supply unit, one side of the cathode wire connected to the pipe electrode; An anode wire connected to one side of the stainless pipe; And a power source connected to the cathode line and the other side of the anode line.
바람직하게는, 초미세 구조물은 전술한 바에 따른 초미세 구조물 제조 장치에 의해 제조된 것을 특징으로 한다.Preferably, the ultra-fine structure is characterized in that it is manufactured by the ultra-fine structure manufacturing apparatus according to the above.
바람직하게는, 상기 초미세 구조물은, 상기 전원에서 공급되는 전하가 상기 파이프 전극 및 상기 스테인레스 파이프에 인가됨에 따라 화학 반응하여 상기 스테인레스 파이프 내부에 형성되는 것을 특징으로 한다.Preferably, the ultra-fine structure is characterized in that it is formed inside the stainless pipe by chemical reaction as the electric charge supplied from the power is applied to the pipe electrode and the stainless pipe.
바람직하게는, 상기 초미세 구조물은, 상기 배스와 인접하여 상기 배스와 연통하는 순환 펌프;를 더 포함하는 것을 특징으로 한다.Preferably, the ultra-fine structure further comprises a circulation pump in communication with the bath adjacent to the bath.
바람직하게는, 상기 초미세 구조물의 내부 표면은, 초소수형 구조인 것을 특징으로 한다.Preferably, the inner surface of the ultra-fine structure is characterized in that the ultra-miniature structure.
상기한 바와 같은 본 발명은 전기 응집 부상 방식를 통하여 스테인레스 내부에 초소수성 표면 구조인 초미세 구조물을 통하여 바이오필름의 형성을 방지함으로써 제품의 수명을 연장할 수 있는 효과가 있다.The present invention as described above has the effect of extending the life of the product by preventing the formation of the biofilm through the ultra-fine hydrophobic surface structure in the stainless steel through the electro-floating flotation method.
또한, 본 발명은 자동차의 머플러에 적용되는 경우 물이 머플러에 머무는 시간을 단축함과 동시에 물에 녹아 생성된 질산 이온과 황산 이온이 머플러의 표면과의 접촉을 방지하는 효과가 있다.In addition, when the present invention is applied to a muffler of an automobile, the water dwells in the muffler, and at the same time, the nitrate ions and sulfate ions dissolved in water are prevented from contacting the surface of the muffler.
또한, 본 발명은 스테인레스의 두께를 줄임으로써 관련 산업에 활용할 수 있는 효과가 발생한다.In addition, the present invention produces an effect that can be utilized in related industries by reducing the thickness of stainless steel.
도 1은 본 발명의 일 실시예에 따른 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조 장치를 나타낸 일 방향에서의 사시도, 및1 is a perspective view in one direction showing an ultra-fine structure manufacturing apparatus for preventing corrosion in a cylindrical stainless steel according to an embodiment of the present invention, and
도 2는 본 발명의 일 실시예에 따른 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물의 사시도이다.2 is a perspective view of an ultrafine structure for preventing corrosion in a cylindrical stainless steel according to an embodiment of the present invention.
본 발명의 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조 장치를 이루는 구성요소들은 필요에 따라 일체형으로 사용되거나 각각 분리되어 사용될 수 있다. 또한, 사용 형태에 따라 일부 구성요소를 생략하여 사용 가능하다.Components constituting the ultra-fine structure manufacturing apparatus for preventing corrosion in the cylindrical stainless steel of the present invention may be used integrally or separately separated as needed. In addition, some components may be omitted depending on the form of use.
본 발명에 따른 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조장치(100)의 바람직한 실시 예를 도 1 내지 도 2를 참조하여 설명한다. 이 과정에서 도면에 도시된 선들의 두께나 구성요소의 크기 등은 설명의 명료성과 편의상 과장되게 도시되어 있을 수 있다. 또한, 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있다. 그러므로 이러한 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 기술되어야 할 것이다.A preferred embodiment of the ultra-fine structure manufacturing apparatus 100 for preventing corrosion in the cylindrical stainless steel according to the present invention will be described with reference to FIGS. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or convention of a user or an operator. Therefore, definitions of these terms should be described based on the contents throughout the specification.
이하, 도 1 내지 도 2를 참조하여 본 발명의 일 실시예에 따른 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조 장치(100)를 설명하면 다음과 같다.Hereinafter, an ultra-fine structure manufacturing apparatus 100 for preventing corrosion in a cylindrical stainless steel according to an embodiment of the present invention will be described with reference to FIGS. 1 to 2.
본 발명의 일 실시예에 따른 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물 제조 장치(100)는 배스(130)의 내부에 위치하는 파이프 전극(110), 파이프 전극(110)과 초미세 구조물(160)에 전기를 공급하는 전력공급부(120), 파이프 전극(110)을 둘러싸는 배스(130) 및 배스(130)와 인접하여 배스(130)와 연통하는 순환펌프(140)를 포함한다.Ultrafine structure manufacturing apparatus 100 for preventing corrosion in a cylindrical stainless steel according to an embodiment of the present invention is a pipe electrode 110, the pipe electrode 110 and the ultrafine structure 160 located inside the bath 130. It includes a power supply unit 120 for supplying electricity, a bath 130 surrounding the pipe electrode 110 and the circulation pump 140 in communication with the bath 130 adjacent to the bath 130.
파이프 전극(110)은 배스(130)의 내부에 위치하며, 일반적인 관의 형태로 파이프 전극(110)의 상하가 개방된다. 이러한 파이프 전극(110)는 음극선(123)과 연결되어 전하를 인가받는다.The pipe electrode 110 is located inside the bath 130, and the top and bottom of the pipe electrode 110 are opened in the form of a general pipe. The pipe electrode 110 is connected to the cathode ray 123 to receive a charge.
전력공급부(120)는 양극선(122) 및 음극선(123)의 타측과 연결되는 전원(121), 일측이 스테인레스 파이프(150)와 연결되는 양극선(122) 및 일측이 파이프 전극(110)과 연결되는 음극선(123)을 포함한다.The power supply unit 120 is a power source 121 is connected to the other side of the anode line 122 and the cathode line 123, the anode line 122 is connected to the stainless steel pipe 150 and one side is connected to the pipe electrode 110. Cathode ray 123.
전원(121)은 양극선(122) 및 음극선(123)의 타측과 연결되며, 이러한 전원(121)은 양극선(122)에는 양전하를 공급하며, 음극선(123)에는 음전하를 공급하는 역할을 한다.The power source 121 is connected to the other side of the anode line 122 and the cathode line 123, and the power source 121 supplies positive charge to the anode line 122, and serves to supply negative charge to the cathode line 123.
양극선(122)은 일측이 스테인레스 파이프(150)와 연결되며, 이러한 양극선(122)은 전원(121)으로부터 인가된 양전하를 스테인레스 파이프(150)에 인가하는 역할을 한다.One side of the anode line 122 is connected to the stainless pipe 150, and the anode line 122 serves to apply the positive charge applied from the power source 121 to the stainless pipe 150.
음극선(123)은 일측이 파이프 전극(110)과 연결되며, 이러한 음극선(123)은 전원(121)으로부터 인가된 음전하를 파이프 전극(110)에 인가하는 역할을 한다.One side of the cathode ray 123 is connected to the pipe electrode 110, and the cathode ray 123 serves to apply the negative charge applied from the power source 121 to the pipe electrode 110.
배스(130)는 내부가 빈 중공 형상이며, 그 내부에는 파이프 전극(110) 및 스테인레스 파이프(150)가 위치한다. 이러한 배스(130)에는 순환펌프(140)가 연통한다.The bath 130 has a hollow hollow shape, and the pipe electrode 110 and the stainless pipe 150 are located therein. The bath 130 is connected to the circulation pump 140.
순환펌프(140)는 배스(130)와 인접하여 배스(130)와 연통한다.The circulation pump 140 communicates with the bath 130 adjacent to the bath 130.
스테인레스 파이프(150)는 일반적으로 사용되는 상하가 개방된 관 형태를 지니며, 그 재질은 스테인레스강인 것이 바람직하다. 이러한 스테인레스 파이프(150)는 양극선(122)과 연결되어 전원(121)으로부터 공급되는 양전하를 인가받는다.The stainless pipe 150 has a generally open upper and lower tube shape, and the material is preferably stainless steel. The stainless pipe 150 is connected to the anode wire 122 to receive a positive charge supplied from the power source 121.
초미세 구조물(160)은 전술한 초미세 구조물 제조 장치에 의해 스테인레스 파이프(150)의 내부에 형성되며, 이러한 초미세 구조물(160)은 전원(121)에서 공급되는 전기가 파이프 전극(110) 및 스테인레스 파이프(150)에 인가됨에 따라 화학 반응하여 스테인레스 파이프(150) 내부에 형성된다.The ultra-fine structure 160 is formed inside the stainless pipe 150 by the above-described ultra-fine structure manufacturing apparatus, the ultra-fine structure 160 is an electric pipe electrode 110 and the electricity supplied from the power 121; As applied to the stainless pipe 150 is a chemical reaction is formed in the stainless pipe 150.
전술한 바와 같은 본 발명의 원통형 스테인레스 내의 부식 방지를 위한 초미세 구조물(100)은 초소수성 표면 구조로 인하여 물 파이프, 자동차 및 오토바이 등의 산화에 노출되기 쉬운 곳에 적용할 경우 수명 연장이 가능하고, 스테인레스의 두께를 줄임으로써 생산비용을 절감하는 장점이 있다.As described above, the ultra-fine structure 100 for preventing corrosion in the cylindrical stainless steel of the present invention can extend its life when applied to a place where it is easy to be exposed to oxidation of water pipes, automobiles and motorcycles due to the superhydrophobic surface structure. Reducing the thickness of stainless steel has the advantage of reducing the production cost.
상기에서는 본 발명의 바람직한 실시 예를 참조하여 설명하였지만, 당업계에서 통상의 지식을 가진 자라면 이하의 특허 청구범위에 기재된 본 발명의 사상 및 영역을 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although described above with reference to a preferred embodiment of the present invention, those of ordinary skill in the art various modifications and variations of the present invention within the scope and spirit of the present invention described in the claims below It will be appreciated that it can be changed.

Claims (6)

  1. 중공의 배스;Hollow bath;
    상기 배스의 내부에 위치하는 파이프 전극;A pipe electrode located inside the bath;
    상기 파이프 전극의 내부에 위치하는 스테인레스 파이프; 및A stainless pipe positioned inside the pipe electrode; And
    상기 파이프 전극 및 상기 스테인레스 파이프에 전하를 공급하는 전력공급부;를 포함하는 것을 특징으로 하는,And a power supply unit supplying electric charges to the pipe electrode and the stainless pipe.
    초미세 구조물 제조 장치.Ultra-fine structure manufacturing device.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 전력공급부는,The power supply unit,
    일측이 상기 파이프 전극과 연결되는 음극선;A cathode wire having one side connected to the pipe electrode;
    일측이 상기 스테인레스 파이프와 연결되는 양극선; 및An anode wire connected to one side of the stainless pipe; And
    상기 음극선 및 상기 양극선의 타측과 연결되는 전원;을 더 포함하는 것을 특징으로 하는,And a power source connected to the cathode wire and the other side of the anode wire.
    초미세 구조물 제조 장치.Ultra-fine structure manufacturing device.
  3. 제 1 항 내지 제 2 항에 따른 초미세 구조물 제조 장치에 의해 제조된 초미세 구조물.Ultra-fine structure manufactured by the ultra-fine structure manufacturing apparatus according to claim 1.
  4. 제 3 항에 있어서,The method of claim 3, wherein
    상기 초미세 구조물은, 상기 전원에서 공급되는 전하가 상기 파이프 전극 및 상기 스테인레스 파이프에 인가됨에 따라 화학 반응하여 상기 스테인레스 파이프 내부에 형성되는 것을 특징으로 하는,The ultra-fine structure is characterized in that the chemical reaction is formed in the stainless pipe as the electric charge supplied from the power is applied to the pipe electrode and the stainless pipe,
    초미세 구조물.Ultra fine structures.
  5. 제 4 항에 있어서,The method of claim 4, wherein
    상기 초미세 구조물은, 상기 배스와 인접하여 상기 배스와 연통하는 순환 펌프;를 더 포함하는 것을 특징으로 하는,The ultra-fine structure further comprises a circulation pump adjacent to the bath and in communication with the bath;
    초미세 구조물.Ultra fine structures.
  6. 제 5 항에 있어서,The method of claim 5,
    상기 초미세 구조물의 내부 표면은, 초소수형 구조인 것을 특징으로 하는,Inner surface of the ultra-fine structure, characterized in that the ultra-miniature structure,
    초미세 구조물.Ultra fine structures.
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