WO2013091166A1 - Dispositif de polissage par vibrations - Google Patents

Dispositif de polissage par vibrations Download PDF

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Publication number
WO2013091166A1
WO2013091166A1 PCT/CN2011/084252 CN2011084252W WO2013091166A1 WO 2013091166 A1 WO2013091166 A1 WO 2013091166A1 CN 2011084252 W CN2011084252 W CN 2011084252W WO 2013091166 A1 WO2013091166 A1 WO 2013091166A1
Authority
WO
WIPO (PCT)
Prior art keywords
vibration
polishing
unit
generating unit
connecting member
Prior art date
Application number
PCT/CN2011/084252
Other languages
English (en)
Chinese (zh)
Inventor
王君林
刘健
马占龙
王绍治
张玲花
Original Assignee
中国科学院长春光学精密机械与物理研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中国科学院长春光学精密机械与物理研究所 filed Critical 中国科学院长春光学精密机械与物理研究所
Priority to PCT/CN2011/084252 priority Critical patent/WO2013091166A1/fr
Publication of WO2013091166A1 publication Critical patent/WO2013091166A1/fr

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor

Definitions

  • the present invention relates to a vibration polishing apparatus for polishing a surface to be polished. Background technique
  • the removal function plays a very important role in the convergence of the surface error. Different polishing head motion modes will produce different removal functions. When the removal function deviates from the ideal removal function, more mid-high frequency errors will be generated to affect the surface convergence effect.
  • the ideal removal function should have one or several of the following characteristics: the removal function has rotational symmetry; the center of the removal function has the largest removal, and the removal function has a single peak and approaches zero as the radius of action decreases
  • the radius of action of the removal function is a variable to accommodate different removal scenarios; there is no material removal capability outside the scope of the removal function. Summary of the invention
  • the present invention provides a vibration polishing apparatus which, according to the present invention, provides a vibration polishing apparatus which can obtain an ideal removal function and a processing parameter which is easy to control the polishing process.
  • the vibration polishing apparatus includes: a rigid connector, a flexible connector, a vibration generating unit, a polishing unit, the rigid connector connecting the vibration polishing device to an actuator of a numerically controlled machine tool; One end of the flexible connecting member is fixedly connected to the rigid connecting member; the other end of the flexible connecting member is fixedly connected to the vibration generating unit; the polishing unit is fixedly connected to the vibration generating unit, and the vibration generating unit generates The vibration of the polishing unit is moved so that the polishing unit performs a polishing operation on the workpiece.
  • the flexible connecting member and the rigid connecting member and the flexible connecting member and the vibration generating unit are fixedly connected by a flange.
  • a displacement sensor is disposed in the flexible connector, and the displacement sensor detects a change in a distance between an upper end surface and a lower end surface of the flexible connecting member, thereby determining according to the change A change in contact state between the polishing unit and the member to be processed and a distance.
  • the rigid connector, the flexible connector, the vibration generating unit, and the polishing unit are coaxially arranged.
  • the flexible connector is an elastic member.
  • the vibration generating unit includes a motor and an eccentric block disposed on an output shaft of the motor, and the motor drives the eccentric block to rotate to generate vibration.
  • the two motors are two, and the output shaft of each motor is provided with the same eccentric block.
  • the output shafts of the two motors are arranged symmetrically with respect to a central axis of the vibration generating unit.
  • the frequency of the vibration is adjusted by changing the frequency of the two motors; the amplitude of the vibration is adjusted by changing the phase difference of the two motors.
  • the main body of the polishing unit is made of a metal material
  • a polishing mold is provided on the main body where the polishing unit is in contact with the workpiece to be processed, and the polishing mold is made of a polymer material.
  • the polishing apparatus provided in accordance with the present invention has at least one of the following advantageous effects: it can remove the continuous superposition of the material of the polishing zone, thereby obtaining a more desirable removal function in the processing area, facilitating convergence of the processing error;
  • two sets of motors and eccentric blocks can be used to realize continuous on-line control of vibration amplitude and frequency, so that the action radius of the removal function and the center removal peak can be accurately controlled;
  • the displacement sensor realizes the detection and control of the working distance between the polishing unit and the workpiece, so that the polishing pressure of the polishing unit can be controlled.
  • FIG. 1 is a schematic view of a preferred embodiment of a vibration polishing apparatus according to the present invention
  • FIG. 2 is a schematic view showing a movement path of a polishing unit according to a preferred embodiment of the vibration polishing apparatus of the present invention, and showing an action radius and a removal depth The relationship between the curves.
  • Figure 1 is a schematic view of a preferred embodiment of a vibrating and polishing apparatus according to the present invention
  • Figure 2 is an illustration of a vibrating and polishing apparatus according to the present invention.
  • a vibration polishing apparatus comprises: a rigid connecting member 1, a flexible connecting member 2, a vibration generating unit 3, a polishing unit 4, and a rigid connecting member 1 connecting the vibration polishing device to a numerical control machine tool
  • the actuator is fixedly connected to one end of the flexible connecting member 2; the other end of the flexible connecting member 2 is fixedly connected to the vibration generating unit 3; the polishing unit 4 is fixedly connected to the vibration generating unit 3, and the vibration generating unit 3 generates The vibration of the movement of the unit is polished, so that the polishing unit 4 performs a polishing operation on the workpiece.
  • the rigid connector 1 is mounted on the headstock of the numerically controlled machine tool, so that the rigid connector 1 can be made in the form of a standard BT40 shank, or the rigid connector 1 can also be flanged.
  • the way is mounted on the headstock of the CNC machine.
  • the flexible connecting member 2 and the rigid connecting member 1 and the flexible connecting member 2 and the vibration generating unit 3 are fixedly connected by a flange.
  • the flexible connecting member 2 functions as a flexible connection between the above two, and in the case where the vibration generating unit 3 generates vibration, the flexible connecting member 2 is deformed accordingly.
  • the flexible connector 2 may be an elastic member having an elastic modulus which may be selected in the range of from 1 to 50 N/mm.
  • the above polishing apparatus performs polishing processing on each of the resident points of the workpiece under the control of the computer.
  • the vibration generating unit 3 drives the polishing unit 4 to generate mechanical vibration to continuously remove the workpiece.
  • a vibration path 5 (dashed circle in Fig. 2) is shown, and the vibration path 5 is a path generated by the vibration generating unit 3 to drive the circumferential vibration of the polishing unit 4.
  • Figure 2 also shows the action area 6, which is the circular contact area of the polishing unit 4 with the surface of the part to be machined.
  • the vibration unit 4 is continuously removed in accordance with the vibration path 5 by the vibration generating unit 3 under the excitation of the vibration generating unit 3.
  • a displacement sensor 21 is disposed in the flexible connecting member 2, and the displacement sensor 21 detects a change in the distance between the upper end surface and the lower end surface of the flexible connecting member 2, thereby changing according to the change.
  • the contact state between the polishing unit 4 and the member to be processed and the change in the distance are determined.
  • the rigid connector 1, the flexible connector 2, the vibration generating unit 3 and the polishing unit 4 are arranged coaxially.
  • Rigid connector 1, flexible connector 2, vibration The motion generating unit 3 can be provided with a straight port so that the three are coaxial.
  • the polishing unit 4 is attached to the vibration generating unit 3 by screwing.
  • the main body of the polishing unit 4 is made of a metal material, and a polishing die 41 is provided on the main body where the polishing unit 4 is in contact with the member to be processed, and the polishing die 41 is made of a polymer material.
  • the polishing die 41 can also be made of asphalt or polyurethane material.
  • the polishing unit 4 may be formed as a flat surface, a convex surface or a concave surface, or a convex spherical surface or a concave spherical surface, according to actual needs.
  • the vibration generating unit 3 includes a motor and an eccentric block disposed on the output shaft of the motor, and the motor drives the eccentric block to rotate, thereby generating vibration.
  • the motor drives the eccentric block to rotate, thereby generating vibration.
  • two motors 31 and 32 may be provided, and the output shaft of each motor is provided with the same eccentric block 33 or 34.
  • the mass of the eccentric mass is selected in the range of l-100g.
  • the output shafts of the two motors 31, 32 are arranged symmetrically with respect to the central axis of the vibration generating unit 3.
  • the radius of the vibration path 5 of the polishing unit 4 that is, the vibration amplitude of the polishing unit 4 is E, and the radius of the effective action region 6 of the polishing unit 4 is r.
  • the polishing unit 4 continuously polishes the vibrating path 5 with the dwell point as a center. Since the central region of the active region 6 is superposed more, the amount of removal is larger, and the closer to the edge, the less the amount of removal, resulting in a removal rate curve 7.
  • the effective radius of action of the vibration polishing device to remove the function R and the peak removal amount (depth of removal) H are important process parameters.
  • the effective radius of action of the removal function R is the sum of the radius of action r of the polishing unit 4 and its amplitude of vibration E. Since the vibration amplitude E of the polishing unit 4 depends on the centrifugal force, the vibration generating unit 3 according to the preferred embodiment of the present invention is internally provided with two motors mounted with eccentric blocks, and the polishing unit 4 can be adjusted by adjusting the phase difference of the motor. The amplitude of the vibration, thereby adjusting the effective radius R of the removal function and the peak removal amount H.
  • the rotational angular velocity of the motor 31 is ⁇
  • the phase angle is ⁇
  • the eccentricity of the eccentric block 33 is
  • the eccentric mass is the rotational angular velocity of the motor 32
  • the phase angle is %
  • the eccentricity of the eccentric block 34 is ⁇
  • the eccentric mass is .
  • the resultant force generated when the two motors rotate in the same direction can be simplified.
  • the combined force of the centrifugal force generated by the two vibration motors is the largest, polishing
  • the adjustment of the amplitude is further adjusted to remove the function radius R and the center removal amount H.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

La présente invention concerne un dispositif de polissage par vibrations comprenant une pièce de liaison rigide (1), une pièce de liaison souple (2), une unité génératrice de vibrations (3) et une unité de polissage (4). La pièce de liaison rigide lie le dispositif de polissage par vibrations à un mécanisme d'exécution d'un outil de machine à commande numérique ; une extrémité de la pièce de liaison souple est liée fixement à la pièce de liaison rigide, et l'autre extrémité de la pièce de liaison souple est liée fixement à l'unité génératrice de vibrations ; l'unité de polissage est liée fixement à l'unité génératrice de vibrations, et l'unité génératrice de vibrations génère des vibrations permettant le mouvement de l'unité de polissage, de façon à amener l'unité de polissage à exécuter une opération de polissage sur la pièce à usiner. Par l'intermédiaire du polissage assuré par le dispositif de polissage par vibrations, on atteint une fonction d'élimination souhaitable, et la commande les paramètres d'usinage pendant le polissage est facile.
PCT/CN2011/084252 2011-12-20 2011-12-20 Dispositif de polissage par vibrations WO2013091166A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/084252 WO2013091166A1 (fr) 2011-12-20 2011-12-20 Dispositif de polissage par vibrations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/084252 WO2013091166A1 (fr) 2011-12-20 2011-12-20 Dispositif de polissage par vibrations

Publications (1)

Publication Number Publication Date
WO2013091166A1 true WO2013091166A1 (fr) 2013-06-27

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PCT/CN2011/084252 WO2013091166A1 (fr) 2011-12-20 2011-12-20 Dispositif de polissage par vibrations

Country Status (1)

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WO (1) WO2013091166A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214116A (zh) * 2018-01-22 2018-06-29 集美大学 一种超声振动抛光加工装置
US20230029755A1 (en) * 2021-07-28 2023-02-02 Zhejiang University Floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593121A (en) * 1979-01-09 1980-07-15 Toray Ind Inc Method and apparatus for processing peripheral edge of soft contact lens
JPS6445558A (en) * 1987-08-10 1989-02-20 Mitsubishi Electric Corp Polishing tool
US5738568A (en) * 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
CN1373698A (zh) * 2000-07-13 2002-10-09 机械设计有限公司 采用超声振动的微抛光装置
CN100503159C (zh) * 2004-01-15 2009-06-24 钱远强 振动式研磨抛光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593121A (en) * 1979-01-09 1980-07-15 Toray Ind Inc Method and apparatus for processing peripheral edge of soft contact lens
JPS6445558A (en) * 1987-08-10 1989-02-20 Mitsubishi Electric Corp Polishing tool
US5738568A (en) * 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
CN1373698A (zh) * 2000-07-13 2002-10-09 机械设计有限公司 采用超声振动的微抛光装置
CN100503159C (zh) * 2004-01-15 2009-06-24 钱远强 振动式研磨抛光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214116A (zh) * 2018-01-22 2018-06-29 集美大学 一种超声振动抛光加工装置
US20230029755A1 (en) * 2021-07-28 2023-02-02 Zhejiang University Floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method
US11839944B2 (en) * 2021-07-28 2023-12-12 Zhejiang University Floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method

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