WO2013083528A3 - Luminaire à semi-conducteur - Google Patents

Luminaire à semi-conducteur Download PDF

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Publication number
WO2013083528A3
WO2013083528A3 PCT/EP2012/074273 EP2012074273W WO2013083528A3 WO 2013083528 A3 WO2013083528 A3 WO 2013083528A3 EP 2012074273 W EP2012074273 W EP 2012074273W WO 2013083528 A3 WO2013083528 A3 WO 2013083528A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor luminaire
light
emitting diode
carrier substrate
diode chips
Prior art date
Application number
PCT/EP2012/074273
Other languages
German (de)
English (en)
Other versions
WO2013083528A2 (fr
Inventor
Axel Kaltenbacher
Dirk Becker
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2013083528A2 publication Critical patent/WO2013083528A2/fr
Publication of WO2013083528A3 publication Critical patent/WO2013083528A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Abstract

Dans au moins un mode de réalisation du luminaire à semi-conducteur (1), ledit luminaire comprend au moins un substrat support (4) pourvu d'une face de montage (40). Une pluralité de puces LED (2) sont fixées sur la face de montage (40). Le luminaire à semi-conducteur (1) comporte des dispositifs de contact électrique (3), qui sont situés au moins indirectement sur le substrat support (4) et par l'intermédiaire desquels les puces LED (2) sont mises en contact électrique. Le substrat support (4) est transparent à un rayonnement produit par les puces LED (2) lorsque le luminaire est en fonctionnement.
PCT/EP2012/074273 2011-12-07 2012-12-03 Luminaire à semi-conducteur WO2013083528A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011087886.6 2011-12-07
DE102011087886A DE102011087886A1 (de) 2011-12-07 2011-12-07 Halbleiterleuchte

Publications (2)

Publication Number Publication Date
WO2013083528A2 WO2013083528A2 (fr) 2013-06-13
WO2013083528A3 true WO2013083528A3 (fr) 2013-08-01

Family

ID=47429769

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/074273 WO2013083528A2 (fr) 2011-12-07 2012-12-03 Luminaire à semi-conducteur

Country Status (2)

Country Link
DE (1) DE102011087886A1 (fr)
WO (1) WO2013083528A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035532A (ja) * 2013-08-09 2015-02-19 シチズン電子株式会社 Ｌｅｄ集合プレート及びこれを用いた発光装置
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
DE102015101143A1 (de) 2015-01-27 2016-07-28 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
DE102015102699A1 (de) 2015-02-25 2016-08-25 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
DE102015107588B4 (de) 2015-05-13 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung optoelektronischer Bauelemente und oberflächenmontierbares optoelektronisches Bauelement
DE102015107586B4 (de) 2015-05-13 2023-10-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung optoelektronischer Bauelemente und oberflächenmontierbares optoelektronisches Bauelement
DE102015109852A1 (de) 2015-06-19 2016-12-22 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
FR3063129B1 (fr) * 2017-02-17 2019-04-12 Valeo Vision Module lumineux a encombrement reduit
DE102017107226A1 (de) 2017-04-04 2018-10-04 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl strahlungsemittierender Halbleiterbauelemente und strahlungsemittierendes Halbleiterbauelement
DE102017130764B4 (de) * 2017-12-20 2024-01-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Vorrichtung mit Halbleiterchips auf einem Primärträger und Verfahren zur Herstellung einer solchen Vorrichtung
DE102019219016A1 (de) * 2019-12-05 2021-06-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische vorrichtung und verfahren zur herstellung einer optoelektronischen vorrichtung

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
JPH11186590A (ja) * 1997-12-25 1999-07-09 Rohm Co Ltd チップ型ｌｅｄ
EP1119058A1 (fr) * 1999-07-29 2001-07-25 Citizen Electronics Co., Ltd. Diode electroluminescente
US6310364B1 (en) * 1998-08-03 2001-10-30 Toyoda Gosei Co., Ltd. Light-emitting apparatus
US20070263384A1 (en) * 2006-05-15 2007-11-15 Epistar Corporation Light-mixing type light-emitting apparatus
JP2007335731A (ja) * 2006-06-16 2007-12-27 Sony Corp 発光ダイオード搭載基板、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器
EP2159780A2 (fr) * 2008-08-29 2010-03-03 Oki Data Corporation Dispositif d'affichage
WO2010074288A1 (fr) * 2008-12-28 2010-07-01 有限会社Ｍｔｅｃ Module à diodes électroluminescentes alimenté à haute tension
WO2011039691A1 (fr) * 2009-09-30 2011-04-07 Koninklijke Philips Electronics N.V. Autocollant lumineux

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US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
DE602006011458D1 (de) * 2005-05-25 2010-02-11 Koninkl Philips Electronics Nv BELEUCHTUNGSSYSTEM MIT LEDs
TWI319504B (en) * 2005-06-28 2010-01-11 Chi Mei Optoelectronics Corp Planar light source device and fabricating method thereof and liquid crystal display with the same
EP2142841A1 (fr) * 2007-04-03 2010-01-13 Koninklijke Philips Electronics N.V. Dispositif d'émission de lumière
TW200941761A (en) * 2008-03-27 2009-10-01 Liung Feng Ind Co Ltd Packaging process of a light emitting component
TW201115779A (en) * 2009-10-26 2011-05-01 Gio Optoelectronics Corp Light emitting apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
JPH11186590A (ja) * 1997-12-25 1999-07-09 Rohm Co Ltd チップ型ｌｅｄ
US6310364B1 (en) * 1998-08-03 2001-10-30 Toyoda Gosei Co., Ltd. Light-emitting apparatus
EP1119058A1 (fr) * 1999-07-29 2001-07-25 Citizen Electronics Co., Ltd. Diode electroluminescente
US20070263384A1 (en) * 2006-05-15 2007-11-15 Epistar Corporation Light-mixing type light-emitting apparatus
JP2007335731A (ja) * 2006-06-16 2007-12-27 Sony Corp 発光ダイオード搭載基板、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器
EP2159780A2 (fr) * 2008-08-29 2010-03-03 Oki Data Corporation Dispositif d'affichage
WO2010074288A1 (fr) * 2008-12-28 2010-07-01 有限会社Ｍｔｅｃ Module à diodes électroluminescentes alimenté à haute tension
WO2011039691A1 (fr) * 2009-09-30 2011-04-07 Koninklijke Philips Electronics N.V. Autocollant lumineux

Also Published As

Publication number Publication date
DE102011087886A1 (de) 2013-06-13
WO2013083528A2 (fr) 2013-06-13

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