WO2013080956A1 - Semiconductor element image recognition device and semiconductor element image recognition method - Google Patents

Semiconductor element image recognition device and semiconductor element image recognition method Download PDF

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Publication number
WO2013080956A1
WO2013080956A1 PCT/JP2012/080581 JP2012080581W WO2013080956A1 WO 2013080956 A1 WO2013080956 A1 WO 2013080956A1 JP 2012080581 W JP2012080581 W JP 2012080581W WO 2013080956 A1 WO2013080956 A1 WO 2013080956A1
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Prior art keywords
semiconductor element
resin
light
phosphor
mounting surface
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PCT/JP2012/080581
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French (fr)
Japanese (ja)
Inventor
謙磁 塚田
雅登 鈴木
明宏 川尻
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富士機械製造株式会社
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Publication of WO2013080956A1 publication Critical patent/WO2013080956A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/645—Specially adapted constructive features of fluorimeters
    • G01N21/6456—Spatial resolved fluorescence measurements; Imaging
    • G01N2021/646—Detecting fluorescent inhomogeneities at a position, e.g. for detecting defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/645—Specially adapted constructive features of fluorimeters
    • G01N21/6456—Spatial resolved fluorescence measurements; Imaging
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
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    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
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    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/24247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/245—Material
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7615—Means for depositing
    • H01L2224/76151—Means for direct writing
    • H01L2224/76155—Jetting means, e.g. ink jet
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/82051—Forming additional members
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    • H01L2224/821—Forming a build-up interconnect
    • H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the present invention relates to a semiconductor element image recognition device and a semiconductor element image recognition method for recognizing the shape of a semiconductor element by capturing an image of a semiconductor element mounting object from its mounting surface with an imaging device and processing the captured image. .
  • Patent Document 1 Japanese Patent No. 3920378
  • a mounting member circuit board, lead frame
  • a fluid resin material is discharged around the semiconductor element by a dispenser to form a resin slope connecting the upper surface of the semiconductor element and the surface of the wiring board with an inclined surface
  • a wiring technique has been proposed in which a wiring pattern for connecting between an electrode and a pad of a wiring board is formed on a resin slope by a droplet discharge method.
  • an image pickup apparatus includes a lead frame and one semiconductor element mounted thereon for the purpose of improving the positional accuracy of a wiring pattern formed by a droplet discharge method. It is proposed to form the wiring pattern by the droplet discharge method by recognizing the position of the electrode on the upper surface of the semiconductor element and the position of the lead frame from the captured image, determining the position of the wiring pattern that connects both of them. Yes.
  • a problem to be solved by the present invention is to provide a semiconductor element image recognition apparatus and a semiconductor element image recognition method capable of clearly recognizing a semiconductor element mounted on a mounting member.
  • the present invention provides a semiconductor that recognizes the shape of a semiconductor element by picking up an image of a semiconductor element mounting object mounted so as to surround the periphery of the semiconductor element with a resin from the mounting surface side.
  • the element image recognition device includes a light source that irradiates light on a mounting surface of the semiconductor element mounting object, and a phosphor that emits fluorescence by light emitted from the light source is mixed in the resin surrounding the semiconductor element.
  • the imaging device is equipped with an optical filter that cuts off the reflected light reflected by the mounting surface of the semiconductor element mounting object and transmits fluorescence from the phosphor in the resin, and mounts the semiconductor element from the light source.
  • the mounting surface of the semiconductor element In a state where the mounting surface of the semiconductor element is irradiated with light so that the phosphor in the resin surrounding the periphery of the semiconductor element emits light, the mounting surface of the semiconductor element mounting surface is passed through the optical filter.
  • the imaging device By imaging by the imaging device, the shape of the semiconductor element surrounded by bright since the resin in the fluorescence of the phosphor is obtained so as to image recognition.
  • the phosphor is mixed in the resin surrounding the semiconductor element, and the reflected light reflected by the mounting surface of the semiconductor element mounting object to be imaged is cut to transmit the fluorescence from the phosphor. Since it is mounted on the imaging device, the mounting surface of the semiconductor element mounting object is irradiated with light from the light source to the mounting surface of the semiconductor element mounting object to cause the phosphor in the resin to emit light. If the image is taken, the reflected light that makes image recognition difficult can be cut, and the shape of the semiconductor element surrounded by the resin brightened by the fluorescence of the phosphor (the part that appears dark) can be clearly recognized. . Thereby, even if the semiconductor element mounted on the mounting member is small, it is possible to clearly recognize the image of the semiconductor element.
  • the present invention is applicable to any semiconductor element mounting object in which the periphery of the semiconductor element is surrounded by a resin and the mounting surface of the semiconductor element is exposed.
  • light emission from an LED or the like is possible. It can also be applied to elements.
  • the phosphor may be mixed into the resin only for image recognition of the semiconductor element.
  • the emission color of the light emitting element (the wavelength of light) is added to the transparent resin surrounding the light emitting element. ) Is a means of changing phosphor.
  • the phosphor mixed in the transparent resin in order to change the light emission color of the light emitting element can also be used as a phosphor for image recognition of the light emitting element. The present invention can be applied without increasing the number of manufacturing steps of the element package.
  • the position of the semiconductor element may be image-recognized based on the image obtained by imaging the semiconductor element mounted object by the imaging apparatus.
  • the position of the semiconductor element can be accurately recognized from the shape of the recognized semiconductor element.
  • the shape of the resin surrounding the semiconductor element may be recognized to determine whether or not there is a defective filling of the resin. Since only the resin mixed with the phosphor appears bright in the image captured by the imaging device, the shape of the resin can be clearly recognized, and the presence or absence of a filling failure of the resin can be determined from the shape of the resin.
  • a wiring connected to the electrode part on the mounting surface side of the semiconductor element may be formed on the resin by a droplet discharge method.
  • the shape and position of the semiconductor element and the shape and position of the resin surrounding the semiconductor element can be clearly recognized, even if the semiconductor element is small, the position of the electrode portion on the mounting surface side of the semiconductor element can be accurately determined.
  • the wiring connected to the electrode portion on the mounting surface side of the semiconductor element can be accurately formed on the resin by a droplet discharge method.
  • the semiconductor element mounting object to which the present invention is applied has a structure in which the mounting surface side of the semiconductor element is exposed so that the shape of the semiconductor element can be easily recognized, but the mounting surface side of the semiconductor element is exposed. Even if there is no semiconductor element mounted product, the present invention can be applied as long as the mounting surface side of the semiconductor element is not covered with the phosphor-mixed resin.
  • FIG. 1 is a perspective view of an LED element image recognition apparatus showing an embodiment of the present invention.
  • FIG. 2 is a sectional view showing the LED mounting structure along the line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG.
  • FIG. 4 is a plan view of the LED mounting structure.
  • the mounting member 11 is formed of a lead frame, a circuit board or the like, and an element mounting recess 12 is formed at a predetermined position.
  • An LED element 13 (light emitting element), which is a semiconductor element, is die-bonded (bonded) to the center of the bottom surface of the element mounting recess 12 of the mounting member 11.
  • the depth dimension (height dimension) of the element mounting recess 12 is set to be substantially the same as the height dimension of the LED element 13, and the electrode on the mounting surface side (upper surface side) of the LED element 13 mounted in the element mounting recess 12.
  • the portion 14 has substantially the same height as the electrode portion 15 on the mounting surface side (upper surface side) of the mounting member 11.
  • the transparent insulating resin 16 is filled around the LED element 13 in the element mounting recess 12 of the mounting member 11 by a droplet discharge method such as inkjet or dispenser. Thereby, the LED element 13 mounted in the element mounting recess 12 is surrounded by the insulating resin 16 and only the mounting surface of the LED element 13 is exposed.
  • the transparent insulating resin 16 is mixed with a phosphor that converts light emitted from the periphery of the LED element 13 into light of another wavelength (color).
  • the wiring path connecting the electrode portion 14 on the mounting surface side of the LED element 13 and the electrode portion 15 on the mounting surface side of the mounting member 11 is flattened by the insulating resin 16, and the wiring 17 is placed on the wiring path.
  • the electrode element 14 is formed across the electrode part 14 on the mounting surface side of the LED element 13 and the electrode part 15 on the mounting surface side of the mounting member 11.
  • the wiring 17 is formed by discharging conductive ink (ink containing conductive particles such as Ag) by a droplet discharge method such as inkjet or dispenser.
  • a base layer may be formed between the wiring 17 and the insulating resin 16 to improve the adhesion of the wiring 17 and the like.
  • FIGS. 2 to 4 show only the LED mounting structure for one LED element 13, but when producing on the production line, as shown in FIG.
  • the LED elements 13 are mounted at a predetermined pitch to produce a large number of LED packages integrally. After the production is finished, each LED package is finally divided one by one and mounted on a circuit board or the like.
  • the imaging device 21 When imaging the mounting member 11 of the LED element 13 that is the imaging target, the imaging device 21 is disposed above the mounting member 11 and light (for example, ultraviolet light, etc.) is mounted on the mounting surface of the mounting member 11 of the LED element 13.
  • a light source 23 that emits a phosphor in the insulating resin 16 that irradiates blue light or the like and surrounds the LED element 13 is disposed.
  • An optical filter 22 that cuts the reflected light reflected by the mounting surface of the mounting member 11 of the LED element 13 and transmits the fluorescence from the phosphor in the insulating resin 16 is mounted on the imaging device 21.
  • the mounting member of the LED element 13 is irradiated with light from the light source 23 to the mounting surface of the mounting member 11 of the LED element 13 to cause the phosphor in the insulating resin 16 surrounding the LED element 13 to emit light.
  • 11 is imaged by the imaging device 21 through the optical filter 22, and the image of the shape of the LED element 13 surrounded by the insulating resin 16 brightened by the fluorescence of the phosphor is recognized, and the position of the LED element 13 is determined. Recognize images.
  • the shape of the insulating resin 16 surrounding the LED element 13 is image-recognized based on the captured image of the imaging device 21 to determine whether there is a filling failure of the insulating resin 16.
  • the phosphor is mixed in the insulating resin 16 surrounding the LED element 13, and the reflected light reflected by the mounting surface of the mounting member 11 of the LED element 13 to be imaged is cut. Since the optical filter 22 that transmits the fluorescence from the phosphor is mounted on the imaging device 21, the light in the mounting surface of the mounting member 11 of the LED element 13 is irradiated from the light source 23 to emit fluorescence in the insulating resin 16.
  • the mounting surface of the mounting member 11 of the LED element 13 is imaged by the imaging device 21 through the optical filter 22 with the body emitting light, the reflected light that makes image recognition difficult is cut off, and the fluorescence of the phosphor It is possible to clearly recognize the shape of the LED element 13 surrounded by the insulating resin 16 that has become brighter (a portion that appears darker). Thereby, even if the LED element 13 mounted on the mounting member 11 is small, the LED element 13 can be clearly recognized.
  • the shape of the insulating resin 16 can be clearly recognized, and the insulating resin 16 can be recognized from the shape of the insulating resin 16. The presence or absence of defective filling of the functional resin 16 can be determined.
  • the shape and position of the LED element 13 and the shape and position of the insulating resin 16 surrounding the LED element 13 can be clearly recognized. Therefore, even if the LED element 13 is small, the mounting surface of the LED element 13 Advantages of accurately determining the position of the electrode portion 14 on the side and forming the wiring 17 connected to the electrode portion 14 on the mounting surface side of the LED element 13 on the insulating resin 16 with a droplet discharge method. There is.
  • the present invention is not limited to the configuration in which the wiring 17 is formed by the droplet discharge method, and it goes without saying that the wiring may be performed by wire bonding.
  • a phosphor is mixed in the transparent insulating resin 16 surrounding the LED element 13 as a means for changing the emission color of the LED element 13 so that the LED element 13 is recognized as an image.
  • the phosphor mixed in the transparent insulating resin 16 in order to change the emission color of the LED element 13 can also be used as a phosphor for image recognition of the LED element 13 without increasing the number of manufacturing steps of the LED package. There is an advantage that the present invention can be applied.
  • the present invention may be configured such that a phosphor is mixed into a resin only for image recognition of a semiconductor element such as an LED element.
  • the LED element 13 is mounted in the element mounting recess 12 of the mounting member 11, and the transparent insulating resin 16 is filled around the LED element 13 in the element mounting recess 12.
  • a fluid resin material mixed with a phosphor is discharged around a semiconductor element such as an LED element mounted on a flat surface of a mounting member (circuit board, lead frame, etc.) with a dispenser, and the semiconductor.
  • the semiconductor element such as an LED element mounted on a flat surface of a mounting member (circuit board, lead frame, etc.) with a dispenser, and the semiconductor.
  • the wiring pattern that connects the electrodes on the mounting surface side of the semiconductor element and the pads of the wiring substrate is liquidized. It is good also as a structure formed on the fluorescent substance mixed resin slope by the droplet discharge method. Even in this configuration, the semiconductor element can be clearly recognized because the periphery of the semiconductor element is surrounded by the phosphor-mixed resin slope.
  • the semiconductor element mounting object to which the present invention is applied has a structure in which the mounting surface side of the semiconductor element is exposed so that the shape of the semiconductor element can be easily recognized, but the mounting surface side of the semiconductor element is exposed. Even if there is no semiconductor element mounted product, the present invention can be applied as long as the mounting surface side of the semiconductor element is not covered with the phosphor-mixed resin.
  • the present invention is not limited to the LED element, and the semiconductor element mounting object mounted so as to surround the periphery of the semiconductor element with a resin is applicable regardless of the type of the semiconductor element. Various modifications can be made without departing from the scope.
  • SYMBOLS 11 Mounting member, 12 ... Element mounting recessed part, 13 ... LED element (semiconductor element), 14 ... Electrode part, 15 ... Electrode part, 16 ... Insulating resin, 17 ... Wiring, 21 ... Imaging apparatus, 22 ... Optical filter, 23 ... Light source

Abstract

An LED element (13) is mounted on a mounting member (11), with the surrounding area filled with a clear insulating plastic (16). The insulating plastic (16) contains a fluorescent substance that converts light emitted from a side surface of the LED element (13) to light of another wavelength. During imaging, in a state in which light is shone from a light source (23) to the mounting surface of the mounting member (11) of the LED element (13), causing the fluorescent substance within the insulating plastic (16) surrounding the LED element (13) to emit light: the mounting surface of the mounting member (11) of the LED element (13) is imaged through an optical filter (22), said imaging being done by an imaging device (21); the shape of the LED element (13) surrounded by the insulating plastic (16) made bright by the fluorescence of the fluorescent substance is subjected to image recognition; and the position of the LED element (13) is subjected to image recognition. Moreover, on the basis of the image imaged by the imaging device (21), the shape of the insulating plastic (16) surrounding the LED element (13) is subjected to image recognition, and the existence of a filling defect in the insulating plastic (16) is assessed.

Description

半導体素子画像認識装置及び半導体素子画像認識方法Semiconductor element image recognition apparatus and semiconductor element image recognition method
　本発明は、半導体素子搭載物をその装着面側から撮像装置で撮像してその撮像画像を処理して該半導体素子の形状を認識する半導体素子画像認識装置及び半導体素子画像認識方法に関する発明である。 The present invention relates to a semiconductor element image recognition device and a semiconductor element image recognition method for recognizing the shape of a semiconductor element by capturing an image of a semiconductor element mounting object from its mounting surface with an imaging device and processing the captured image. .
　近年、特許文献１（特許第３９９２０３８号公報）に記載されているように、ワイヤボンディングに代わる接続信頼性の高い配線構造を低コストで実現することを目的として、搭載部材（回路基板、リードフレーム等）に搭載した半導体素子の周囲に流動性の樹脂材料をディスペンサで吐出して、半導体素子の上面と配線基板の表面との間を傾斜面でつなぐ樹脂スロープを形成した後、半導体素子上面の電極と配線基板のパッドとの間を接続する配線パターンを液滴吐出法により樹脂スロープ上に形成する配線技術が提案されている。 In recent years, as described in Patent Document 1 (Japanese Patent No. 392038), a mounting member (circuit board, lead frame) is provided for the purpose of realizing a wiring structure with high connection reliability instead of wire bonding at a low cost. Etc.), a fluid resin material is discharged around the semiconductor element by a dispenser to form a resin slope connecting the upper surface of the semiconductor element and the surface of the wiring board with an inclined surface, A wiring technique has been proposed in which a wiring pattern for connecting between an electrode and a pad of a wiring board is formed on a resin slope by a droplet discharge method.
　更に、特許文献２（特開２００５－５０９１１号公報）では、液滴吐出法により形成する配線パターンの位置精度を向上させることを目的として、リードフレームとこれに搭載した１つの半導体素子を撮像装置で撮像してその撮像画像から半導体素子上面の電極とリードフレームの位置を認識して、両者を接続する配線パターンの位置を決めて、配線パターンを液滴吐出法により形成することが提案されている。 Further, in Patent Document 2 (Japanese Patent Laid-Open No. 2005-50911), an image pickup apparatus includes a lead frame and one semiconductor element mounted thereon for the purpose of improving the positional accuracy of a wiring pattern formed by a droplet discharge method. It is proposed to form the wiring pattern by the droplet discharge method by recognizing the position of the electrode on the upper surface of the semiconductor element and the position of the lead frame from the captured image, determining the position of the wiring pattern that connects both of them. Yes.
特許第３９９２０３８号公報Japanese Patent No. 3992038 特開２００５－５０９１１号公報JP 2005-50911 A
　近年の半導体素子は、益々、小型化が進み、例えばＬＥＤチップ等のように、数１００μｍ程度の超小型の半導体素子が増えてきている。このような超小型の半導体素子を撮像装置で撮像して画像処理しても、該半導体素子が搭載されるリードフレーム等の搭載部材の表面の凹凸によって照明光が乱反射するため、超小型の半導体素子を画像認識することは難しかった。 In recent years, semiconductor elements have been increasingly miniaturized, and ultra-small semiconductor elements of about several hundred μm, such as LED chips, are increasing. Even if such an ultra-small semiconductor element is imaged by an imaging apparatus and processed, illumination light is irregularly reflected by irregularities on the surface of a mounting member such as a lead frame on which the semiconductor element is mounted. It was difficult to recognize the image of the element.
　そこで、本発明が解決しようとする課題は、搭載部材に搭載された半導体素子を明瞭に画像認識できる半導体素子画像認識装置及び半導体素子画像認識方法を提供することである。 Therefore, a problem to be solved by the present invention is to provide a semiconductor element image recognition apparatus and a semiconductor element image recognition method capable of clearly recognizing a semiconductor element mounted on a mounting member.
　上記課題を解決するために、本発明は、半導体素子の周囲を樹脂で取り囲むように搭載した半導体素子搭載物をその装着面側から撮像装置で撮像して該半導体素子の形状を画像認識する半導体素子画像認識装置において、前記半導体素子搭載物の装着面に光を照射する光源を備え、前記半導体素子の周囲を取り囲む樹脂には、前記光源から照射された光により蛍光を発する蛍光体が混入され、前記撮像装置には、前記半導体素子搭載物の装着面で反射された反射光をカットして前記樹脂中の蛍光体からの蛍光を透過させる光学フィルタが装着され、前記光源から前記半導体素子搭載物の装着面に光を照射して前記半導体素子の周囲を取り囲む樹脂中の蛍光体を発光させた状態で、該半導体素子搭載物の装着面を前記光学フィルタを通して前記撮像装置で撮像して、前記蛍光体の蛍光で明るくなった前記樹脂で取り囲まれた前記半導体素子の形状を画像認識するようにしたものである。 In order to solve the above problems, the present invention provides a semiconductor that recognizes the shape of a semiconductor element by picking up an image of a semiconductor element mounting object mounted so as to surround the periphery of the semiconductor element with a resin from the mounting surface side. The element image recognition device includes a light source that irradiates light on a mounting surface of the semiconductor element mounting object, and a phosphor that emits fluorescence by light emitted from the light source is mixed in the resin surrounding the semiconductor element. The imaging device is equipped with an optical filter that cuts off the reflected light reflected by the mounting surface of the semiconductor element mounting object and transmits fluorescence from the phosphor in the resin, and mounts the semiconductor element from the light source. In a state where the mounting surface of the semiconductor element is irradiated with light so that the phosphor in the resin surrounding the periphery of the semiconductor element emits light, the mounting surface of the semiconductor element mounting surface is passed through the optical filter. By imaging by the imaging device, the shape of the semiconductor element surrounded by bright since the resin in the fluorescence of the phosphor is obtained so as to image recognition.
　この構成では、半導体素子の周囲を取り囲む樹脂に蛍光体が混入され、撮像対象となる半導体素子搭載物の装着面で反射された反射光をカットして蛍光体からの蛍光を透過させる光学フィルタが撮像装置に装着されているため、光源から半導体素子搭載物の装着面に光を照射して樹脂中の蛍光体を発光させた状態で、半導体素子搭載物の装着面を光学フィルタを通して撮像装置で撮像すれば、画像認識を難しくする原因となる反射光をカットして、蛍光体の蛍光で明るくなった樹脂で取り囲まれた半導体素子の形状（暗く写る部分）を明瞭に画像認識することができる。これにより、搭載部材に搭載された半導体素子が小さくても、該半導体素子を明瞭に画像認識することができる。 In this configuration, there is an optical filter in which the phosphor is mixed in the resin surrounding the semiconductor element, and the reflected light reflected by the mounting surface of the semiconductor element mounting object to be imaged is cut to transmit the fluorescence from the phosphor. Since it is mounted on the imaging device, the mounting surface of the semiconductor element mounting object is irradiated with light from the light source to the mounting surface of the semiconductor element mounting object to cause the phosphor in the resin to emit light. If the image is taken, the reflected light that makes image recognition difficult can be cut, and the shape of the semiconductor element surrounded by the resin brightened by the fluorescence of the phosphor (the part that appears dark) can be clearly recognized. . Thereby, even if the semiconductor element mounted on the mounting member is small, it is possible to clearly recognize the image of the semiconductor element.
　本発明は、半導体素子の周囲を樹脂で取り囲み、該半導体素子の装着面を露出させた半導体素子搭載物であれば、半導体素子の種類を問わず、適用可能であり、例えば、ＬＥＤ等の発光素子にも適用可能である。 The present invention is applicable to any semiconductor element mounting object in which the periphery of the semiconductor element is surrounded by a resin and the mounting surface of the semiconductor element is exposed. For example, light emission from an LED or the like is possible. It can also be applied to elements.
　この場合、半導体素子の画像認識のためのみに蛍光体を樹脂に混入しても良いが、ＬＥＤ等の発光素子では、発光素子の周囲を取り囲む透明樹脂に、発光素子の発光色（光の波長）を変える手段として蛍光体を混入したものがある。このような発光素子の画像認識に本発明を適用すれば、発光素子の発光色を変えるために透明樹脂に混入した蛍光体を、発光素子の画像認識のための蛍光体としても兼用でき、発光素子パッケージの製造工数を増加させることなく、本発明を適用できる。 In this case, the phosphor may be mixed into the resin only for image recognition of the semiconductor element. However, in the case of a light emitting element such as an LED, the emission color of the light emitting element (the wavelength of light) is added to the transparent resin surrounding the light emitting element. ) Is a means of changing phosphor. If the present invention is applied to image recognition of such a light emitting element, the phosphor mixed in the transparent resin in order to change the light emission color of the light emitting element can also be used as a phosphor for image recognition of the light emitting element. The present invention can be applied without increasing the number of manufacturing steps of the element package.
　また、本発明は、撮像装置で半導体素子搭載物を撮像した画像に基づいて半導体素子の位置を画像認識するようにしても良い。本発明では、半導体素子の形状を明瞭に画像認識できるため、画像認識した半導体素子の形状から該半導体素子の位置を精度良く認識することができる。 In the present invention, the position of the semiconductor element may be image-recognized based on the image obtained by imaging the semiconductor element mounted object by the imaging apparatus. In the present invention, since the shape of the semiconductor element can be clearly recognized, the position of the semiconductor element can be accurately recognized from the shape of the recognized semiconductor element.
　或は、撮像装置で半導体素子搭載物を撮像した画像に基づいて半導体素子の周囲を取り囲む樹脂の形状を画像認識して該樹脂の充填不良の有無を判定するようにしても良い。撮像装置で撮像した画像は、蛍光体が混入された樹脂のみが明るく写るため、樹脂の形状を明瞭に画像認識でき、その樹脂の形状から該樹脂の充填不良の有無を判定することができる。 Alternatively, based on an image obtained by imaging a semiconductor element mounted object with an imaging device, the shape of the resin surrounding the semiconductor element may be recognized to determine whether or not there is a defective filling of the resin. Since only the resin mixed with the phosphor appears bright in the image captured by the imaging device, the shape of the resin can be clearly recognized, and the presence or absence of a filling failure of the resin can be determined from the shape of the resin.
　また、樹脂上に半導体素子の装着面側の電極部と接続する配線を液滴吐出法で形成しても良い。本発明では、半導体素子の形状、位置やその周囲を取り囲む樹脂の形状、位置を明瞭に画像認識できるため、半導体素子が小さくても、半導体素子の装着面側の電極部の位置を精度良く判定して、樹脂上に半導体素子の装着面側の電極部と接続する配線を液滴吐出法で精度良く形成することができる。 Further, a wiring connected to the electrode part on the mounting surface side of the semiconductor element may be formed on the resin by a droplet discharge method. In the present invention, since the shape and position of the semiconductor element and the shape and position of the resin surrounding the semiconductor element can be clearly recognized, even if the semiconductor element is small, the position of the electrode portion on the mounting surface side of the semiconductor element can be accurately determined. Thus, the wiring connected to the electrode portion on the mounting surface side of the semiconductor element can be accurately formed on the resin by a droplet discharge method.
　また、本発明を適用する半導体素子搭載物は、半導体素子の装着面側が露出するように搭載された構造のものが半導体素子の形状を画像認識しやすいが、半導体素子の装着面側が露出していない半導体素子搭載物であっても、半導体素子の装着面側が蛍光体混入樹脂で覆われていなければ、本発明を適用可能である。 In addition, the semiconductor element mounting object to which the present invention is applied has a structure in which the mounting surface side of the semiconductor element is exposed so that the shape of the semiconductor element can be easily recognized, but the mounting surface side of the semiconductor element is exposed. Even if there is no semiconductor element mounted product, the present invention can be applied as long as the mounting surface side of the semiconductor element is not covered with the phosphor-mixed resin.
図１は本発明の一実施例を示すＬＥＤ素子画像認識装置の斜視図である。FIG. 1 is a perspective view of an LED element image recognition apparatus showing an embodiment of the present invention. 図２はＬＥＤ搭載構造を図４のＡ－Ａ線に沿って示す断面図である。FIG. 2 is a sectional view showing the LED mounting structure along the line AA in FIG. 図３は図４のＢ－Ｂ線に沿って示す断面図である。3 is a cross-sectional view taken along line BB in FIG. 図４はＬＥＤ搭載構造の平面図である。FIG. 4 is a plan view of the LED mounting structure.
　以下、本発明を実施するための形態をＬＥＤ素子画像認識装置に適用して具体化した一実施例を説明する。 Hereinafter, an embodiment in which a mode for carrying out the present invention is applied to an LED element image recognition apparatus and embodied will be described.
　まず、図２乃至図４に基づいて撮像対象であるＬＥＤ搭載物（半導体素子搭載物）の構造を説明する。 First, the structure of an LED mounting object (semiconductor element mounting object) to be imaged will be described with reference to FIGS.
　搭載部材１１は、リードフレーム、回路基板等により形成され、その所定位置に素子搭載凹部１２が形成されている。この搭載部材１１の素子搭載凹部１２の底面中央部には、半導体素子であるＬＥＤ素子１３（発光素子）がダイボンディング（接合）されている。素子搭載凹部１２の深さ寸法（高さ寸法）は、ＬＥＤ素子１３の高さ寸法とほぼ同一に設定され、素子搭載凹部１２内に搭載したＬＥＤ素子１３の装着面側（上面側）の電極部１４が搭載部材１１の装着面側（上面側）の電極部１５とほぼ同じ高さとなっている。 The mounting member 11 is formed of a lead frame, a circuit board or the like, and an element mounting recess 12 is formed at a predetermined position. An LED element 13 (light emitting element), which is a semiconductor element, is die-bonded (bonded) to the center of the bottom surface of the element mounting recess 12 of the mounting member 11. The depth dimension (height dimension) of the element mounting recess 12 is set to be substantially the same as the height dimension of the LED element 13, and the electrode on the mounting surface side (upper surface side) of the LED element 13 mounted in the element mounting recess 12. The portion 14 has substantially the same height as the electrode portion 15 on the mounting surface side (upper surface side) of the mounting member 11.
　搭載部材１１の素子搭載凹部１２内のうちのＬＥＤ素子１３の周囲に、透明な絶縁性樹脂１６がインクジェット、ディスペンサ等の液滴吐出法により充填されている。これにより、素子搭載凹部１２内に搭載したＬＥＤ素子１３は、その周囲が絶縁性樹脂１６で取り囲まれ、該ＬＥＤ素子１３の装着面のみが露出した状態となっている。透明な絶縁性樹脂１６には、ＬＥＤ素子１３の周囲から放射される光を他の波長（色）の光に変換する蛍光体が混入されている。 The transparent insulating resin 16 is filled around the LED element 13 in the element mounting recess 12 of the mounting member 11 by a droplet discharge method such as inkjet or dispenser. Thereby, the LED element 13 mounted in the element mounting recess 12 is surrounded by the insulating resin 16 and only the mounting surface of the LED element 13 is exposed. The transparent insulating resin 16 is mixed with a phosphor that converts light emitted from the periphery of the LED element 13 into light of another wavelength (color).
　ＬＥＤ素子１３の装着面側の電極部１４と搭載部材１１の装着面側の電極部１５との間をつなぐ配線経路は、絶縁性樹脂１６で平坦化され、該配線経路上に、配線１７がＬＥＤ素子１３の装着面側の電極部１４と搭載部材１１の装着面側の電極部１５とに跨がって形成されている。この配線１７は、インクジェット、ディスペンサ等の液滴吐出法により導電性のインク（Ａｇ等の導体粒子を含むインク）を吐出して形成されている。尚、配線１７と絶縁性樹脂１６との間に、配線１７の密着性等を高めるための下地層（図示せず）を形成しても良い。 The wiring path connecting the electrode portion 14 on the mounting surface side of the LED element 13 and the electrode portion 15 on the mounting surface side of the mounting member 11 is flattened by the insulating resin 16, and the wiring 17 is placed on the wiring path. The electrode element 14 is formed across the electrode part 14 on the mounting surface side of the LED element 13 and the electrode part 15 on the mounting surface side of the mounting member 11. The wiring 17 is formed by discharging conductive ink (ink containing conductive particles such as Ag) by a droplet discharge method such as inkjet or dispenser. A base layer (not shown) may be formed between the wiring 17 and the insulating resin 16 to improve the adhesion of the wiring 17 and the like.
　図２乃至図４には、ＬＥＤ素子１３の１個分のＬＥＤ搭載構造しか図示されていないが、生産ラインで生産する際には、図１に示すように、１枚の搭載部材１１に多数のＬＥＤ素子１３が所定ピッチで搭載されて多数のＬＥＤパッケージが一体に生産され、生産終了後に、最終的に各ＬＥＤパッケージが１個ずつ分割され、回路基板等に実装される。 FIGS. 2 to 4 show only the LED mounting structure for one LED element 13, but when producing on the production line, as shown in FIG. The LED elements 13 are mounted at a predetermined pitch to produce a large number of LED packages integrally. After the production is finished, each LED package is finally divided one by one and mounted on a circuit board or the like.
　撮像対象物であるＬＥＤ素子１３の搭載部材１１を撮像する際には、撮像装置２１を搭載部材１１の上方に配置すると共に、ＬＥＤ素子１３の搭載部材１１の装着面に光（例えば紫外光、青色光等）を照射してＬＥＤ素子１３の周囲を取り囲む絶縁性樹脂１６中の蛍光体を発光させる光源２３を配置する。撮像装置２１には、ＬＥＤ素子１３の搭載部材１１の装着面で反射された反射光をカットして絶縁性樹脂１６中の蛍光体からの蛍光を透過させる光学フィルタ２２を装着する。 When imaging the mounting member 11 of the LED element 13 that is the imaging target, the imaging device 21 is disposed above the mounting member 11 and light (for example, ultraviolet light, etc.) is mounted on the mounting surface of the mounting member 11 of the LED element 13. A light source 23 that emits a phosphor in the insulating resin 16 that irradiates blue light or the like and surrounds the LED element 13 is disposed. An optical filter 22 that cuts the reflected light reflected by the mounting surface of the mounting member 11 of the LED element 13 and transmits the fluorescence from the phosphor in the insulating resin 16 is mounted on the imaging device 21.
　撮像時には、光源２３からＬＥＤ素子１３の搭載部材１１の装着面に光を照射してＬＥＤ素子１３の周囲を取り囲む絶縁性樹脂１６中の蛍光体を発光させた状態で、ＬＥＤ素子１３の搭載部材１１の装着面を光学フィルタ２２を通して撮像装置２１で撮像して、蛍光体の蛍光で明るくなった絶縁性樹脂１６で取り囲まれたＬＥＤ素子１３の形状を画像認識すると共に、ＬＥＤ素子１３の位置を画像認識する。更に、撮像装置２１の撮像画像に基づいてＬＥＤ素子１３の周囲を取り囲む絶縁性樹脂１６の形状を画像認識して該絶縁性樹脂１６の充填不良の有無を判定する。 At the time of imaging, the mounting member of the LED element 13 is irradiated with light from the light source 23 to the mounting surface of the mounting member 11 of the LED element 13 to cause the phosphor in the insulating resin 16 surrounding the LED element 13 to emit light. 11 is imaged by the imaging device 21 through the optical filter 22, and the image of the shape of the LED element 13 surrounded by the insulating resin 16 brightened by the fluorescence of the phosphor is recognized, and the position of the LED element 13 is determined. Recognize images. Furthermore, the shape of the insulating resin 16 surrounding the LED element 13 is image-recognized based on the captured image of the imaging device 21 to determine whether there is a filling failure of the insulating resin 16.
　以上説明した本実施例によれば、ＬＥＤ素子１３の周囲を取り囲む絶縁性樹脂１６に蛍光体が混入され、撮像対象となるＬＥＤ素子１３の搭載部材１１の装着面で反射された反射光をカットして蛍光体からの蛍光を透過させる光学フィルタ２２が撮像装置２１に装着されているため、光源２３からＬＥＤ素子１３の搭載部材１１の装着面に光を照射して絶縁性樹脂１６中の蛍光体を発光させた状態で、ＬＥＤ素子１３の搭載部材１１の装着面を光学フィルタ２２を通して撮像装置２１で撮像すれば、画像認識を難しくする原因となる反射光をカットして、蛍光体の蛍光で明るくなった絶縁性樹脂１６で取り囲まれたＬＥＤ素子１３の形状（暗く写る部分）を明瞭に画像認識することができる。これにより、搭載部材１１に搭載されたＬＥＤ素子１３が小さくても、該ＬＥＤ素子１３を明瞭に画像認識することができる。 According to the present embodiment described above, the phosphor is mixed in the insulating resin 16 surrounding the LED element 13, and the reflected light reflected by the mounting surface of the mounting member 11 of the LED element 13 to be imaged is cut. Since the optical filter 22 that transmits the fluorescence from the phosphor is mounted on the imaging device 21, the light in the mounting surface of the mounting member 11 of the LED element 13 is irradiated from the light source 23 to emit fluorescence in the insulating resin 16. If the mounting surface of the mounting member 11 of the LED element 13 is imaged by the imaging device 21 through the optical filter 22 with the body emitting light, the reflected light that makes image recognition difficult is cut off, and the fluorescence of the phosphor It is possible to clearly recognize the shape of the LED element 13 surrounded by the insulating resin 16 that has become brighter (a portion that appears darker). Thereby, even if the LED element 13 mounted on the mounting member 11 is small, the LED element 13 can be clearly recognized.
　しかも、撮像装置２１で撮像した画像は、蛍光体が混入された絶縁性樹脂１６のみが明るく写るため、絶縁性樹脂１６の形状を明瞭に画像認識でき、その絶縁性樹脂１６の形状から該絶縁性樹脂１６の充填不良の有無を判定することができる。 Moreover, since only the insulating resin 16 mixed with the phosphor appears bright in the image captured by the imaging device 21, the shape of the insulating resin 16 can be clearly recognized, and the insulating resin 16 can be recognized from the shape of the insulating resin 16. The presence or absence of defective filling of the functional resin 16 can be determined.
　更に、本実施例では、ＬＥＤ素子１３の形状、位置やその周囲を取り囲む絶縁性樹脂１６の形状、位置を明瞭に画像認識できるため、ＬＥＤ素子１３が小さくても、該ＬＥＤ素子１３の装着面側の電極部１４の位置を精度良く判定して、絶縁性樹脂１６上にＬＥＤ素子１３の装着面側の電極部１４と接続する配線１７を液滴吐出法で精度良く形成することができる利点がある。 Furthermore, in the present embodiment, the shape and position of the LED element 13 and the shape and position of the insulating resin 16 surrounding the LED element 13 can be clearly recognized. Therefore, even if the LED element 13 is small, the mounting surface of the LED element 13 Advantages of accurately determining the position of the electrode portion 14 on the side and forming the wiring 17 connected to the electrode portion 14 on the mounting surface side of the LED element 13 on the insulating resin 16 with a droplet discharge method. There is.
　但し、本発明は、液滴吐出法で配線１７を形成する構成に限定されず、ワイヤボンディングで配線しても良いことは言うまでもない。 However, the present invention is not limited to the configuration in which the wiring 17 is formed by the droplet discharge method, and it goes without saying that the wiring may be performed by wire bonding.
　また、本実施例では、ＬＥＤ素子１３の周囲を取り囲む透明な絶縁性樹脂１６に、ＬＥＤ素子１３の発光色を変える手段として蛍光体を混入し、該ＬＥＤ素子１３を画像認識するようにすれば、ＬＥＤ素子１３の発光色を変えるために透明な絶縁性樹脂１６に混入した蛍光体を、ＬＥＤ素子１３の画像認識のための蛍光体としても兼用でき、ＬＥＤパッケージの製造工数を増加させることなく、本発明を適用できる利点がある。 Further, in this embodiment, a phosphor is mixed in the transparent insulating resin 16 surrounding the LED element 13 as a means for changing the emission color of the LED element 13 so that the LED element 13 is recognized as an image. The phosphor mixed in the transparent insulating resin 16 in order to change the emission color of the LED element 13 can also be used as a phosphor for image recognition of the LED element 13 without increasing the number of manufacturing steps of the LED package. There is an advantage that the present invention can be applied.
　但し、本発明は、ＬＥＤ素子等の半導体素子の画像認識のためのみに蛍光体を樹脂に混入した構成としても良い。 However, the present invention may be configured such that a phosphor is mixed into a resin only for image recognition of a semiconductor element such as an LED element.
　また、本実施例では、搭載部材１１の素子搭載凹部１２内にＬＥＤ素子１３を搭載して、該素子搭載凹部１２内のうちのＬＥＤ素子１３の周囲に、透明な絶縁性樹脂１６を充填するようにしたが、搭載部材（回路基板、リードフレーム等）の平坦面上に搭載したＬＥＤ素子等の半導体素子の周囲に、蛍光体を混入した流動性の樹脂材料をディスペンサで吐出して、半導体素子の装着面と配線基板の表面との間を傾斜面でつなぐ蛍光体混入樹脂スロープを形成した後、半導体素子の装着面側の電極と配線基板のパッドとの間を接続する配線パターンを液滴吐出法により蛍光体混入樹脂スロープ上に形成する構成としても良い。この構成でも、半導体素子の周囲が蛍光体混入樹脂スロープで取り囲まれているため、半導体素子を明瞭に認識できる。 In the present embodiment, the LED element 13 is mounted in the element mounting recess 12 of the mounting member 11, and the transparent insulating resin 16 is filled around the LED element 13 in the element mounting recess 12. However, a fluid resin material mixed with a phosphor is discharged around a semiconductor element such as an LED element mounted on a flat surface of a mounting member (circuit board, lead frame, etc.) with a dispenser, and the semiconductor. After forming the phosphor-mixed resin slope that connects the device mounting surface and the surface of the wiring board with an inclined surface, the wiring pattern that connects the electrodes on the mounting surface side of the semiconductor element and the pads of the wiring substrate is liquidized. It is good also as a structure formed on the fluorescent substance mixed resin slope by the droplet discharge method. Even in this configuration, the semiconductor element can be clearly recognized because the periphery of the semiconductor element is surrounded by the phosphor-mixed resin slope.
　また、本発明を適用する半導体素子搭載物は、半導体素子の装着面側が露出するように搭載された構造のものが半導体素子の形状を画像認識しやすいが、半導体素子の装着面側が露出していない半導体素子搭載物であっても、半導体素子の装着面側が蛍光体混入樹脂で覆われていなければ、本発明を適用可能である。 In addition, the semiconductor element mounting object to which the present invention is applied has a structure in which the mounting surface side of the semiconductor element is exposed so that the shape of the semiconductor element can be easily recognized, but the mounting surface side of the semiconductor element is exposed. Even if there is no semiconductor element mounted product, the present invention can be applied as long as the mounting surface side of the semiconductor element is not covered with the phosphor-mixed resin.
　その他、本発明は、ＬＥＤ素子に限定されず、半導体素子の周囲を樹脂で取り囲むように搭載した半導体素子搭載物であれば、半導体素子の種類を問わず、適用可能である等、要旨を逸脱しない範囲内で種々変更して実施できる。 In addition, the present invention is not limited to the LED element, and the semiconductor element mounting object mounted so as to surround the periphery of the semiconductor element with a resin is applicable regardless of the type of the semiconductor element. Various modifications can be made without departing from the scope.
　１１…搭載部材、１２…素子搭載凹部、１３…ＬＥＤ素子（半導体素子）、１４…電極部、１５…電極部、１６…絶縁性樹脂、１７…配線、２１…撮像装置、２２…光学フィルタ、２３…光源 DESCRIPTION OF SYMBOLS 11 ... Mounting member, 12 ... Element mounting recessed part, 13 ... LED element (semiconductor element), 14 ... Electrode part, 15 ... Electrode part, 16 ... Insulating resin, 17 ... Wiring, 21 ... Imaging apparatus, 22 ... Optical filter, 23 ... Light source

Claims (7)

  1. 　半導体素子の周囲を樹脂で取り囲むように搭載した半導体素子搭載物をその装着面側から撮像装置で撮像して該半導体素子の形状を画像認識する半導体素子画像認識装置において、
    　前記半導体素子搭載物の装着面に光を照射する光源を備え、
    　前記半導体素子の周囲を取り囲む樹脂には、前記光源から照射された光により蛍光を発する蛍光体が混入され、
    　前記撮像装置には、前記半導体素子搭載物の装着面で反射された反射光をカットして前記樹脂中の蛍光体からの蛍光を透過させる光学フィルタが装着され、
    　前記光源から前記半導体素子搭載物の装着面に光を照射して前記半導体素子の周囲を取り囲む樹脂中の蛍光体を発光させた状態で、該半導体素子搭載物の装着面を前記光学フィルタを通して前記撮像装置で撮像して、前記蛍光体の蛍光で明るくなった前記樹脂で取り囲まれた前記半導体素子の形状を画像認識することを特徴とする半導体素子画像認識装置。     In a semiconductor element image recognition apparatus for recognizing an image of the shape of a semiconductor element by imaging a semiconductor element mounting object mounted so as to surround the periphery of the semiconductor element with a resin from the mounting surface side,
    A light source for irradiating light on the mounting surface of the semiconductor element mounting object;
    The resin surrounding the periphery of the semiconductor element is mixed with a phosphor that emits fluorescence by light emitted from the light source,
    The imaging device is equipped with an optical filter that cuts off the reflected light reflected by the mounting surface of the semiconductor element mounting object and transmits fluorescence from the phosphor in the resin,
    In a state where the light source emits light from the light source to the mounting surface of the semiconductor element mounting object to cause the phosphor in the resin surrounding the semiconductor element to emit light, the mounting surface of the semiconductor element mounting object is passed through the optical filter. A semiconductor element image recognition apparatus characterized in that an image of the shape of the semiconductor element surrounded by the resin brightened by the fluorescence of the phosphor is image-recognized by an image pickup apparatus.
  2. 　前記半導体素子は、発光素子であり、
    　前記半導体素子の周囲を取り囲む前記樹脂は、透明樹脂であり、該樹脂に混入された前記蛍光体は、前記発光素子の周囲から放射される光を他の波長の光に変換する蛍光体であることを特徴とする請求項１に記載の半導体素子画像認識装置。     The semiconductor element is a light emitting element,
    The resin surrounding the periphery of the semiconductor element is a transparent resin, and the phosphor mixed in the resin is a phosphor that converts light emitted from the periphery of the light emitting element into light of another wavelength. The semiconductor element image recognition apparatus according to claim 1.
  3. 　前記撮像装置で前記半導体素子搭載物を撮像した画像に基づいて前記半導体素子の位置を画像認識する手段を備えていることを特徴とする請求項１又は２に記載の半導体素子画像認識装置。 3. The semiconductor element image recognition apparatus according to claim 1, further comprising means for recognizing a position of the semiconductor element based on an image obtained by imaging the semiconductor element mounted object by the imaging apparatus.
  4. 　前記撮像装置で前記半導体素子搭載物を撮像した画像に基づいて前記半導体素子の周囲を取り囲む前記樹脂の形状を画像認識して該樹脂の充填不良の有無を判定する手段を備えていることを特徴とする請求項１乃至３のいずれかに記載の半導体素子画像認識装置。 The image pickup apparatus includes means for recognizing an image of the shape of the resin surrounding the periphery of the semiconductor element based on an image obtained by picking up the semiconductor element mounted object and determining the presence or absence of the resin filling failure. The semiconductor element image recognition apparatus according to claim 1.
  5. 　前記樹脂上に前記半導体素子の装着面側の電極部と接続する配線が液滴吐出法で形成されていることを特徴とする請求項１乃至４のいずれかに記載の半導体素子画像認識装置。 5. The semiconductor element image recognition apparatus according to claim 1, wherein a wiring connected to the electrode portion on the mounting surface side of the semiconductor element is formed on the resin by a droplet discharge method.
  6. 　前記半導体素子搭載物には、前記半導体素子の装着面側が露出するように搭載されていることを特徴とする請求項１乃至５のいずれかに記載の半導体素子画像認識装置。 6. The semiconductor element image recognition apparatus according to claim 1, wherein the semiconductor element mounted object is mounted so that a mounting surface side of the semiconductor element is exposed.
  7. 　半導体素子の周囲を樹脂で取り囲むように搭載した半導体素子搭載物をその装着面側から撮像装置で撮像して該半導体素子の形状を画像認識する半導体素子画像認識方法において、
    　前記半導体素子の周囲を取り囲む樹脂には、光源から照射された光により蛍光を発する蛍光体を混入すると共に、前記撮像装置には、前記半導体素子搭載物の装着面で反射された反射光をカットして前記樹脂中の蛍光体からの蛍光を透過させる光学フィルタを装着し、
    　前記光源から前記半導体素子搭載物の装着面に光を照射して前記半導体素子の周囲を取り囲む樹脂中の蛍光体を発光させた状態で、該半導体素子搭載物の装着面を前記光学フィルタを通して前記撮像装置で撮像して、前記蛍光体の蛍光で明るくなった樹脂で取り囲まれた前記半導体素子の形状を画像認識することを特徴とする半導体素子画像認識方法。     In a semiconductor element image recognition method for recognizing the shape of a semiconductor element by imaging a semiconductor element mounting object mounted so as to surround the periphery of the semiconductor element with a resin from the mounting surface side with an imaging device,
    The resin surrounding the semiconductor element is mixed with a phosphor that emits fluorescence by light emitted from a light source, and the imaging device cuts off reflected light reflected by the mounting surface of the semiconductor element mounting object. And mounting an optical filter that transmits the fluorescence from the phosphor in the resin,
    In a state where the light source emits light from the light source to the mounting surface of the semiconductor element mounting object to cause the phosphor in the resin surrounding the semiconductor element to emit light, the mounting surface of the semiconductor element mounting object is passed through the optical filter. A method of recognizing a semiconductor element image, comprising: recognizing an image of a shape of the semiconductor element surrounded by a resin brightened by fluorescence of the phosphor after being imaged by an imaging device.
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