WO2013066058A2 - Magnetic substance layer and composition for removing residue from a magnetic substance layer - Google Patents

Magnetic substance layer and composition for removing residue from a magnetic substance layer Download PDF

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Publication number
WO2013066058A2
WO2013066058A2 PCT/KR2012/009093 KR2012009093W WO2013066058A2 WO 2013066058 A2 WO2013066058 A2 WO 2013066058A2 KR 2012009093 W KR2012009093 W KR 2012009093W WO 2013066058 A2 WO2013066058 A2 WO 2013066058A2
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magnetic film
glycol
ether
composition
acid
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PCT/KR2012/009093
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French (fr)
Korean (ko)
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WO2013066058A3 (en
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명중재
권기진
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동우 화인켐 주식회사
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Priority claimed from KR1020110114578A external-priority patent/KR20130049501A/en
Priority claimed from KR1020110114579A external-priority patent/KR20130049502A/en
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Publication of WO2013066058A3 publication Critical patent/WO2013066058A3/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material

Definitions

  • the present invention relates to a magnetic film and a composition for removing magnetic film residue.
  • Magnetic Random Access Memory is a memory device capable of storing nonvolatile data at low power consumption.
  • the magnetic random access memory is a nonvolatile data storage device using a plurality of thin film magnetic bodies formed in a semiconductor integrated circuit. And a random access to each of the plurality of thin film magnetic bodies.
  • the performance of the magnetic memory device was improved by using a thin film magnetic material using a magnetic tunnel junction as a memory cell.
  • Korean Patent Registration No. 10-0512180 describes the magnetoresistance ratio and resistance of a magnetic tunnel junction (MTJ).
  • MTJ magnetic tunnel junction
  • the fixed layer including at least a seed layer, an antiferromagnetic layer, and a first ferromagnetic layer on the oxide film.
  • a tunneling barrier oriented in the same crystal direction as the maximum dense surface direction of a layer and crystal grown in the largest dense surface, a magnetic tunnel junction in which a free layer including at least a second ferromagnetic layer is sequentially stacked and a method of forming the same.
  • the magnetic film (100, 120) and the barrier oxide film 110 is laminated on the lower electrode, wherein the barrier oxide film 110 is Lamination to be located between the magnetic film (100, 120)
  • the structure of FIG. 2 is ideal. However, in the case of the actual dry etching, the residue 140 of the magnetic film component is present around the laminate. In the process of etching the magnetic layer, the tunneling barrier, etc. by dry etching, when the magnetic components remain as residues on the sidewalls, the magnetic components of the residues remaining on the sidewalls cause a decrease in yield of the magnetic memory device. Is creating a problem.
  • a dry etching method was mainly used.
  • a wet process using an etchant is being developed.
  • the residues of the magnetic components are not effectively removed, they can be effectively removed. There is a need for development of a composition that can be used.
  • Korean Patent Laid-Open Publication No. 10-2003-0092310 provides a dry etching method using a carbonyl group-containing gas and a halogen element-containing gas as a dry etching method of a multilayer film material including a metal thin film.
  • the etching method is dry etching using gas, and thus is not suitable when a wet etching method is required.
  • Korean Patent Laid-Open Publication No. 10-2004-0061227 provides an etching solution containing an organic acid as an etching solution for etching a magnetic film of a magnetic memory device, but the organic acid is limited to an organic acid having a carboxyl group and a hydroxyl group. The scope of use is narrow.
  • U.S. Patent No. 6426012 also provides a composition for use in magnetic film laser etching, but this also limits the organic acid to a composition containing dicarboxylic acid.
  • the present invention is to solve the problems of the prior art as described above, the magnetic film and the magnetic film excellent in the ability to remove the magnetic components remaining in the process of etching the magnetic layer, tunneling barrier, etc. during the manufacture of the magnetic memory device It is an object to provide a composition for removing residues.
  • the present invention provides a composition for removing magnetic film and magnetic film residue, comprising (a) at least one compound selected from sulfonic acid, aliphatic amine or aromatic amine and (b) solvent.
  • the present invention after immersing the substrate having the magnetic residue in the magnetic film and the composition for removing the magnetic film residue, the magnetic film comprising the step of immersing for 10 to 30 minutes at a temperature of 30 ⁇ 80 °C and Provided is a method for removing magnetic film residue.
  • the magnetic film and the composition for removing the magnetic film residue of the present invention is excellent in the ability to remove the magnetic components, it can effectively remove the magnetic film and the magnetic film residue used in the magnetic memory device manufacturing process.
  • FIG. 1 is a diagram illustrating a basic stacked structure of a magnetic random access memory.
  • FIG. 2 is a diagram illustrating an ideal structure after dry etching of a magnetic random access memory.
  • FIG. 3 is a diagram illustrating a structure in which residues appear around a stacked layer after dry etching of a magnetic random access memory.
  • FIG. 4 is a diagram showing an ideal structure after the residue around the magnetic random access memory laminate is removed using a wet process.
  • composition for removing the magnetic film residue of the present invention comprises (a) at least one of sulfonic acid, aliphatic amine or aromatic amine, and (b) at least one selected from alcohol, glycol or glycol ether as solvents.
  • sulfonic acid aliphatic amine or aromatic amine
  • alcohol glycol or glycol ether
  • the sulfonic acid is a generic name of a compound having a sulfonic acid group (-SO3H), and is a kind of organic acid having a functional group different from an organic acid having a carboxylic acid group (-COOH). And difference.
  • organic acids are classified as weak acids because they are not completely dissociated in water, but sulfonic acids have relatively strong acid groups compared to organic acids having carboxylic acid groups.
  • acid dissociation constants pKa
  • pKa acid dissociation constants
  • the acid dissociation constants (pKa) are -2.8 and -1.9.
  • the sulfonic acid group is an organic acid and has a relatively strong acidic property, an excellent etching ability to the magnetic film can be expected as compared to organic acids having a carboxylic acid group.
  • the etching effect of the magnetic film can be realized by adding to the composition for removing the magnetic film.
  • the sulfonic acid include methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, minomethanesulfonic acid, benzenesulfonic acid, toluene sulfonic acid (4-methylbenzenesulfonic acid), phenolsulfonic acid, pyridine sulfonic acid, dodecylbenzene sulfonic acid, 0-cresolsulfonic acid (2- Methylphenol sulfonic acid), cresol sulfonic acid (methylphenol sulfonic acid), and the like, and these may be used alone or in combination of two or more thereof.
  • aromatic amine included in the composition include aniline, o-toluidine, 2,4,6-trimethylaniline, anisidine, N-methylaniline, and the like, which may be used alone or in combination of two or more thereof. Can be.
  • the content of one or more compounds selected from the above (a) sulfonic acid, aliphatic amines or aromatic amines is not particularly limited and may be adjusted by varying the content depending on the process conditions, but 5 wt% to 40 wt% based on the total amount of the composition. It is preferred to include, more preferably 20% to 30% by weight. In case of less than 5% by weight, the etching ability of the magnetic body film is difficult to obtain, so that the etching amount of the desired magnetic film is difficult to obtain, and in the case of more than 40% by weight, the etching amount of the magnetic body film is not increased due to the increase of the content, so that the composition of the magnetic film increases compared to the etching amount. It is not desirable in terms of cost.
  • the alcohol (b), glycol or glycol ether has the effect of preventing the etching of the barrier oxide.
  • the oxide is corroded by the water contained in the composition, by using one or more of alcohol, glycol or glycol ether as a solvent to prevent the possibility of etching of the barrier oxide that may occur by contact with water.
  • the alcohol contained in the composition may be a high boiling point alcohols, preferably tetrahydrofurfuryl alcohol (THFA; tetrahydrofurfuryl alcohol), furfuryl alcohol and the like, these may be used alone or two or more It can be mixed and used.
  • THFA tetrahydrofurfuryl alcohol
  • furfuryl alcohol and the like these may be used alone or two or more It can be mixed and used.
  • the glycol contained in the composition includes ethylene glycol, trimethylene glycol, tetramethylene glycol, 1,3-butanediol, propylene glycol, butylene glycol, dimethylene glycol, pentylene glycol, and the like, which are used alone or in combination. The above can be mixed and used.
  • glycol ethers contained in the composition include ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monopropyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, diethylene glycol monoethyl Ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol Dipropyl ether, diethylene glycol dibutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, dipropylene glycol dibutyl ether, triethylene glycol monomethyl ether It is mentioned, and these may be used individually or in combination of two
  • At least one selected from the group (b) alcohol, glycol, or glycol ether is a solvent, and is not particularly limited with respect to the total weight of the composition.
  • the amount of the solvent is small, the viscosity of the composition is high, so that it is difficult to apply the process, or sulfonic acid It may be a problem that does not dissolve, it is preferred to include 60% by weight to 95% by weight.
  • the above-mentioned magnetic film removing method may be performed by a method commonly known in the art.
  • deposition, spraying, or a method using deposition and spraying may be used, in which case, as the temperature conditions, the temperature is usually 30 to 80 ° C, preferably 50 to 70 ° C, and deposition, spraying, or deposition and spraying
  • the time is usually 5 seconds to 30 minutes, preferably 5 minutes to 20 minutes.
  • these conditions are not strictly applied and can be selected as easy or suitable conditions by those skilled in the art.
  • Example-1 95 - 5 - - - Example-2 85 - 15 - - - Example-3 - 80 20 - - - Example-4 60 - 40 - - - Example-5 95 - - 5 - - Example-6 85 - - 15 - - Example-7 - 85 - 15 - - Example-8 - 80 20 - - - Example-9 95 - - - 5 - Example-10 85 - - - 15 - Example-11 - 80 - - 20 - Example-12 60 - - - 40 - Example-13 - 85 - - 15 - Example-14 - 70 - - 30 - Example-15 - 90 - - - 10 Example-16 - 60 - - - 40 Example-17 - 60 - - 40 - Comparative Example-1 100 Comparative Example-2 100 Comparative Example-3 98 2 Comparative Example-4 98 2 Comparative Example-5 98 2
  • the evaluation of the etching ability of the magnetic film and the composition for removing the magnetic film residue on the magnetic film was performed using a substrate in which CoFe was laminated to a thickness of 200 GPa.
  • the CoFe-laminated substrate was immersed for 10 minutes at 60 ° C. in the magnetic film and the magnetic film residue removal composition prepared in Examples 1 to 17 and Comparative Examples 1 to 5, and then washed and dried using isopropanol.
  • the substrate was etched through.
  • the thickness of the CoFe layer etched on the substrate was evaluated using a 4-point probe (Changmin Tech, CMT series). The results are shown in the etching amount of CoFe in Table 2 below.
  • the magnetic film and the composition for removing the magnetic film residue of the present invention not only have excellent etching ability of the magnetic film but also no etching effect of the barrier oxide.

Abstract

The present invention relates to a magnetic substance layer and to a composition for removing the residue of a magnetic substance layer, which comprises: (a) at least one of sulfonic acid, an aliphatic amine or an aromatic amine; and (b) a solvent.

Description

자성체막 및 자성체막 잔류물 제거용 조성물Magnetic film and composition for removing magnetic film residue
본 발명은 자성체막 및 자성체막 잔류물 제거용 조성물에 관한 것이다.The present invention relates to a magnetic film and a composition for removing magnetic film residue.
자기 랜덤 엑세스 메모리(자기 기억 소자; Magnetic Random Access Memory 이하, MRAM)는 저소비 전력으로 비휘발적인 데이터의 기억이 가능한 기억 장치로서, 반도체 집적 회로에 형성된 복수의 박막 자성체를 사용하여 비휘발적인 데이터 기억을 실행하고, 복수의 박막 자성체 각각에 대해 랜덤 액세스가 가능한 메모리 소자이다. 자기 터널 접합(Magnetic Tunnel Junction)을 이용한 박막 자성체를 메모리 셀로서 사용함으로써 자기 기억 소자 의 성능을 향상시켰었는데, 특히 대한민국 특허등록 제10-0512180호는 자기 터널 접합(MTJ)의 자기저항비와 저항 특성이 우수한 자기 기억 소자의 자기 터널 접합을 위하여, 도 1에서와 같이 하부전극상에 산화막을 형성하고, 상기 산화막상에 적어도 씨드층과 반강자성체층과 제1강자성체층을 포함하는 고정층, 상기 씨드층의 최대밀집면 방향과 동일한 결정방향으로 배향되어 최대밀집면으로 결정성장된 터널링 배리어, 적어도 제2강자성체층을 포함하는 자유층이 순차로 적층된 자기 터널 접합 및 그의 형성방법을 제공하고 있다.Magnetic Random Access Memory (MRAM) is a memory device capable of storing nonvolatile data at low power consumption. The magnetic random access memory (MRAM) is a nonvolatile data storage device using a plurality of thin film magnetic bodies formed in a semiconductor integrated circuit. And a random access to each of the plurality of thin film magnetic bodies. The performance of the magnetic memory device was improved by using a thin film magnetic material using a magnetic tunnel junction as a memory cell. In particular, Korean Patent Registration No. 10-0512180 describes the magnetoresistance ratio and resistance of a magnetic tunnel junction (MTJ). In order to form a magnetic tunnel junction of a magnetic memory device having excellent characteristics, an oxide film is formed on a lower electrode as shown in FIG. 1, and the fixed layer including at least a seed layer, an antiferromagnetic layer, and a first ferromagnetic layer on the oxide film. Provided are a tunneling barrier oriented in the same crystal direction as the maximum dense surface direction of a layer and crystal grown in the largest dense surface, a magnetic tunnel junction in which a free layer including at least a second ferromagnetic layer is sequentially stacked and a method of forming the same.
상기 MRAM의 구체적인 적층구조에 대하여 보다 구체적으로 살펴보면, 도 1에서와 같이 하부의 전극의 위에 자성체막(100, 120)과 배리어 산화막(110)이 적층하고, 이 때 상기 배리어 산화막(110)이 상기 자성체막(100, 120)들 사이에 위치하도록 적층 한다In more detail with respect to the specific stacked structure of the MRAM, as shown in FIG. 1, the magnetic film (100, 120) and the barrier oxide film 110 is laminated on the lower electrode, wherein the barrier oxide film 110 is Lamination to be located between the magnetic film (100, 120)
상기 적층된 MRAM를 드라이 에칭하는 경우 이상적인 형태로는 도 2의 구조를 이루게 되나, 실제 드라이 에칭을 하는 경우 적층막 주변에 자성체막 성분의 잔류물(140)이 존재하게 된다. 이렇게 드라이 에칭(dry etching)으로 자성체층, 터널링 배리어 등을 에칭하는 과정에서 자성체 성분들이 측벽에 잔류물로 남게 되는 경우, 측벽에 잔류하는 잔류물의 자성체 성분들이 자기 기억 소자의 수율 저하를 초래하는 등의 문제를 만들고 있다.In the case of dry etching the stacked MRAM, the structure of FIG. 2 is ideal. However, in the case of the actual dry etching, the residue 140 of the magnetic film component is present around the laminate. In the process of etching the magnetic layer, the tunneling barrier, etc. by dry etching, when the magnetic components remain as residues on the sidewalls, the magnetic components of the residues remaining on the sidewalls cause a decrease in yield of the magnetic memory device. Is creating a problem.
따라서, 상기와 같이 드라이 에칭 공정 중 완전히 제거되지 못하고 소자의 측벽에 잔류하는 잔류하는 자성체막의 잔류물(140)을 제거해야 할 필요가 있으며, 이와 같이 소자의 측벽에 잔류하는 자성체막의 잔류물(140)을 제거하는 공정으로 드라이 에칭에 의한 방법이 주로 사용 되었으며, 이 외에 식각액 등을 이용하여 제거하는 습식공정 등도 개발이 진행되고 있으나, 자성체 성분들의 잔류물을 효과적으로 제거시키지 못하기 때문에 이들을 효과적으로 제거시킬 수 있는 조성물의 개발이 요구되고 있다. Therefore, it is necessary to remove the residue 140 of the magnetic film remaining on the sidewall of the device that cannot be completely removed during the dry etching process as described above, and thus the residue 140 of the magnetic film remaining on the sidewall of the device. ), A dry etching method was mainly used. In addition, a wet process using an etchant is being developed. However, since the residues of the magnetic components are not effectively removed, they can be effectively removed. There is a need for development of a composition that can be used.
상기와 같은 필요에 의하여, 대한민국 공개특허 제10-2003-0092310호는 금속박막을 포함하는 다층막 재료의 드라이 에칭방법으로서 카르보닐기를 함유 가스 및 할로겐 원소 함유가스를 이용한 드라이 에칭방법을 제공하고 있으나, 상기 에칭방법은 가스를 이용한 드라이 에칭이므로 습식 에칭방법이 필요한 경우에는 적절하지 아니하다. 또한, 대한민국 공개특허 제10-2004-0061227호는 자기 기억 소자의 자성체막을 식각하기 위한 식각 용액으로서 유기산을 포함하는 식각 용액을 제공하고 있으나, 유기산을 카르복실기 및 수산기를 갖는 유기산에 대해서 한정하고 있어 그 활용범위가 좁다. 미국 등록특허 제6426012호에서도 자성체 막 레이져 에칭에 사용하는 조성물을 제공하고 있으나 이 역시 디카르복실산을 포함하는 조성물로 유기산을 한정하고 있다.By such a need, Korean Patent Laid-Open Publication No. 10-2003-0092310 provides a dry etching method using a carbonyl group-containing gas and a halogen element-containing gas as a dry etching method of a multilayer film material including a metal thin film. The etching method is dry etching using gas, and thus is not suitable when a wet etching method is required. In addition, Korean Patent Laid-Open Publication No. 10-2004-0061227 provides an etching solution containing an organic acid as an etching solution for etching a magnetic film of a magnetic memory device, but the organic acid is limited to an organic acid having a carboxyl group and a hydroxyl group. The scope of use is narrow. U.S. Patent No. 6426012 also provides a composition for use in magnetic film laser etching, but this also limits the organic acid to a composition containing dicarboxylic acid.
본 발명은, 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로서, 자기 기억 소자의 제조시에 자성체층, 터널링 배리어 등을 에칭하는 과정에서 잔류하게되는 자성체 성분들의 제거 능력이 우수한 자성체막 및 자성체막 잔류물 제거용 조성물을 제공하는 것을 목적으로 한다.The present invention is to solve the problems of the prior art as described above, the magnetic film and the magnetic film excellent in the ability to remove the magnetic components remaining in the process of etching the magnetic layer, tunneling barrier, etc. during the manufacture of the magnetic memory device It is an object to provide a composition for removing residues.
본 발명은, (a) 술폰산, 지방족 아민 또는 방향족 아민 중 선택된 1종 이상의 화합물 및 (b) 용매를 포함하는 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물을 제공한다.The present invention provides a composition for removing magnetic film and magnetic film residue, comprising (a) at least one compound selected from sulfonic acid, aliphatic amine or aromatic amine and (b) solvent.
또한 본 발명은, 상기 자성체막 및 자성체막 잔류물 제거용 조성물에 자성체 잔류물이 존재하는 기판을 침지한 후, 30~80℃의 온도에서 10분 내지 30분간 침적시키는 단계를 포함하는 자성체막 및 자성체막 잔류물의 제거방법을 제공한다.In another aspect, the present invention, after immersing the substrate having the magnetic residue in the magnetic film and the composition for removing the magnetic film residue, the magnetic film comprising the step of immersing for 10 to 30 minutes at a temperature of 30 ~ 80 ℃ and Provided is a method for removing magnetic film residue.
본 발명의 자성체막 및 자성체막 잔류물 제거용 조성물은 자성체 성분들의 제거 능력이 우수하며, 자기기억소자 제조공정 중 사용 되는 자성체막 및 자성체막 잔류물을 효과적으로 제거시킬 수 있다.The magnetic film and the composition for removing the magnetic film residue of the present invention is excellent in the ability to remove the magnetic components, it can effectively remove the magnetic film and the magnetic film residue used in the magnetic memory device manufacturing process.
도 1은 자기 랜덤 엑세스 메모리의 기본 적층 구조를 나타낸 도면이다.1 is a diagram illustrating a basic stacked structure of a magnetic random access memory.
도 2는 자기 랜덤 엑세스 메모리의 드라이 에칭 이후의 이상적 구조를 나타낸 도면이다.2 is a diagram illustrating an ideal structure after dry etching of a magnetic random access memory.
도 3은 자기 랜덤 엑세스 메모리의 드라이 에칭 이후 적층막 주변에 잔류물이 나타난 구조를 나타낸 도면이다.3 is a diagram illustrating a structure in which residues appear around a stacked layer after dry etching of a magnetic random access memory.
도 4는 자기 랜덤 엑세스 메모리 적층막 주변의 잔류물이 습식공정을 이용하여 제거된 이후의 이상적인 구조를 나타낸 도면이다.4 is a diagram showing an ideal structure after the residue around the magnetic random access memory laminate is removed using a wet process.
이하, 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.
본 발명의 자성체막 잔류물 제거용 조성물은 (a) 술폰산, 지방족 아민 또는 방향족 아민 중 1종 이상 및 (b) 알코올, 글리콜 또는 글리콜에테르 중 선택된 1종 이상을 용매로 포함하는 것이며, 이하 각 성분에 대해 설명한다.The composition for removing the magnetic film residue of the present invention comprises (a) at least one of sulfonic acid, aliphatic amine or aromatic amine, and (b) at least one selected from alcohol, glycol or glycol ether as solvents. Explain about.
(a) 술폰산, 지방족 아민 또는 방향족 아민(a) sulfonic acids, aliphatic amines or aromatic amines
상기 술폰산은 술폰산기(-SO3H)를 가진 화합물의 총칭으로서, 카르본산기(-COOH)를 갖는 유기산과는 다른 관능기를 가지는 유기산의 한 종류로서, 이러한 관능기의 차이에 의하여 산성도에 있어서 다른 유기산들과 차이를 나타낸다. 일반적으로 유기산은 물속에서 완전히 해리되는 않기 때문에 약산으로 분류되고 있으나, 술폰산은 카르본산기를 가지는 유기산에 비하여 상대적으로 강한 산성기를 가지고 있다. 예를들어 구연산이나 젖산(락트산)의 경우 산해리 상수값(pKa)은 각각 3.09와 3.86의 값을 가지는 반면 술폰산기를 가지는 p-톨루엔술폰산이나 메탄술폰산의 경우 산해리 상수값(pKa)은 각각 -2.8과 -1.9이다. 이와 같이, 술폰산기는 유기산임에도 비교적 강한 산성의 성질을 가지고 있기 때문에, 카르본산기를 가지는 유기산들에 비하여 자성체 막에 대한 우수한 식각능력을 기대할 수 있다. 본 발명에서 자성체막 제거용 조성물에 첨가됨으로써 자성체 막의 식각 효과를 구현 할 수 있는 것을 확인하였다. The sulfonic acid is a generic name of a compound having a sulfonic acid group (-SO3H), and is a kind of organic acid having a functional group different from an organic acid having a carboxylic acid group (-COOH). And difference. In general, organic acids are classified as weak acids because they are not completely dissociated in water, but sulfonic acids have relatively strong acid groups compared to organic acids having carboxylic acid groups. For example, for citric acid or lactic acid (lactic acid), acid dissociation constants (pKa) have values of 3.09 and 3.86, respectively. For p-toluenesulfonic acid and methanesulfonic acid with sulfonic acid groups, the acid dissociation constants (pKa) are -2.8 and -1.9. As such, since the sulfonic acid group is an organic acid and has a relatively strong acidic property, an excellent etching ability to the magnetic film can be expected as compared to organic acids having a carboxylic acid group. In the present invention, it was confirmed that the etching effect of the magnetic film can be realized by adding to the composition for removing the magnetic film.
상기 술폰산의 구체적인 예로는 메탄술폰산, 에탄술폰산, 프로판술폰산, 미노메탄술폰산, 벤젠술폰산, 톨루엔 술폰산(4-메틸벤젠술폰산), 페놀술폰산, 피리딘술폰산, 도데실벤젠 술폰산, 0-크레졸술폰산(2-메틸페놀술폰산), 크레졸술폰산(메틸페놀술폰산) 등을 들 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.Specific examples of the sulfonic acid include methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, minomethanesulfonic acid, benzenesulfonic acid, toluene sulfonic acid (4-methylbenzenesulfonic acid), phenolsulfonic acid, pyridine sulfonic acid, dodecylbenzene sulfonic acid, 0-cresolsulfonic acid (2- Methylphenol sulfonic acid), cresol sulfonic acid (methylphenol sulfonic acid), and the like, and these may be used alone or in combination of two or more thereof.
상기 지방족 아민 또는 방향족 아민은 질소(N)원자를 포함하는 화합물로서, 강한 염기성 성질을 나타내며, 질소원자에 있는 비공유 전자쌍에 의하여 주변의 원소들과 전자를 주고 받는 것이 용이하며, 전자의 이동에 의하여 금속성분과 반응하여 금속을 산화 또는 환원시킬 수 있는 효과를 나타낼 수 있으며, 이러한 산화환원효과 때문에 알루미늄 등과 같은 금속 등을 부식시키는 효과를 가지고 있다. 이와 같이 아민의 경우, 아민에 포함되어 있는 질소원자의 비공유 전자쌍에 의한 전자를 주고 받는 성질을 이용하여 자성체막 및 자성체막 잔류물을 식각시키는 효과를 기대할 수 있다. 본 발명에서 자성체막 및 자성체막 잔류물 제거용 조성물에 첨가됨으로써 자성체 막의 식각 효과를 구현 할 수 있는 것을 확인하였다. The aliphatic amine or aromatic amine is a compound containing a nitrogen (N) atom, has a strong basic properties, it is easy to exchange electrons with surrounding elements by the unshared electron pair in the nitrogen atom, by the movement of electrons Reaction with the metal component may exhibit an effect of oxidizing or reducing the metal, and due to the redox effect, the metal has an effect of corroding a metal such as aluminum. As described above, in the case of the amine, the magnetic film and the magnetic film residue may be etched by using the property of transmitting and receiving electrons by the unshared electron pair of the nitrogen atom included in the amine. In the present invention, it was confirmed that the etching effect of the magnetic film can be realized by adding the magnetic film and the magnetic film residue removal composition.
상기 조성물에 포함되는 지방족 아민으로는 알킬 아민 또는 알칸올 아민을 사용할 수 있는데, 알킬 아민의 구체적인 예로는 메틸아민, 프로필아민, 디메틸아민, 트리메틸아민, 에틸렌디아민 등을 들 수 있고, 알칸올 아민의 구체적인 예로는 모노에탄올아민, 디에탄올아민, 트리에탄올아민, 프로판올아민, 디프로판올아민, 트리프로판올아민, 모노이소프로판올아민, 디이소프로판올아민, 트리이소프로판올아민, 부탄올아민, 부틸모노에탄올아민, N-메틸에탄올아민, 에틸디에탄올아민 등을 들 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.As the aliphatic amine included in the composition, an alkyl amine or an alkanol amine can be used. Specific examples of the alkyl amine include methylamine, propylamine, dimethylamine, trimethylamine, ethylenediamine, and the like. Specific examples include monoethanolamine, diethanolamine, triethanolamine, propanolamine, dipropanolamine, tripropanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, butanolamine, butyl monoethanolamine, N-methylethanolamine And ethyl diethanolamine; these may be used alone or in combination of two or more thereof.
상기 조성물에 포함되는 방향족 아민의 구체적인 예로는 아닐린, o-톨루이딘, 2,4,6-트리메틸아닐린, 아니시딘, N-메틸아닐린 등을 들 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.Specific examples of the aromatic amine included in the composition include aniline, o-toluidine, 2,4,6-trimethylaniline, anisidine, N-methylaniline, and the like, which may be used alone or in combination of two or more thereof. Can be.
상기 (a) 술폰산, 지방족 아민 또는 방향족 아민 중 선택된 1종 이상의 화합물의 함량은 특별히 한정되어 있지는 않으며, 공정조건에 따라 함량을 달리하여 조절할 수 있으나, 조성물 총량에 대하여 5 중량% 내지 40 중량%로 포함하는 것이 바람직하며, 20 중량% 내지 30 중량%가 더욱 바람직하다. 5 중량%이하의 경우 자성체막의 식각능력이 떨어져 원하는 자성체막의 식각량을 얻기가 어려우며, 40중량%이상으로 하는 경우 함량 증가에 따른 자성체막의 식각량 증가가 크지 않기 때문에 자성체막의 식각량 증가효과 대비 조성물의 비용적인 측면에서 바람직 하지 않다.The content of one or more compounds selected from the above (a) sulfonic acid, aliphatic amines or aromatic amines is not particularly limited and may be adjusted by varying the content depending on the process conditions, but 5 wt% to 40 wt% based on the total amount of the composition. It is preferred to include, more preferably 20% to 30% by weight. In case of less than 5% by weight, the etching ability of the magnetic body film is difficult to obtain, so that the etching amount of the desired magnetic film is difficult to obtain, and in the case of more than 40% by weight, the etching amount of the magnetic body film is not increased due to the increase of the content, so that the composition of the magnetic film increases compared to the etching amount. It is not desirable in terms of cost.
(b) 알코올, 글리콜 또는 글리콜에테르 (b) alcohols, glycols or glycol ethers
상기 (b) 알코올, 글리콜 또는 글리콜에테르는 배리어 산화물의 식각을 예방하는 효과를 갖는다. 조성물 중 포함되는 물에 의해 산화물이 부식되는 문제가 있는데 알코올, 글리콜 또는 글리콜에테르 중 1종 이상을 용매로 사용하여 물과의 접촉에 의하여 발생할 수 있는 배리어 산화물의 식각 가능성을 예방할 수 있다. The alcohol (b), glycol or glycol ether has the effect of preventing the etching of the barrier oxide. There is a problem that the oxide is corroded by the water contained in the composition, by using one or more of alcohol, glycol or glycol ether as a solvent to prevent the possibility of etching of the barrier oxide that may occur by contact with water.
상기 조성물에 포함되는 알코올로는 비점이 높은 알코올류가 사용될 수 있으며, 바람직하게는 테트라히드로 푸르푸릴 알코올(THFA; tetrahydrofurfuryl alcohol), 푸르푸릴 알코올 등을 들 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.The alcohol contained in the composition may be a high boiling point alcohols, preferably tetrahydrofurfuryl alcohol (THFA; tetrahydrofurfuryl alcohol), furfuryl alcohol and the like, these may be used alone or two or more It can be mixed and used.
상기 조성물에 포함되는 글리콜로는 에틸렌 글리콜, 트리메틸렌글리콜, 테트라메틸렌글리콜, 1,3-부탄디올, 프로필렌글리콜, 부틸렌글리콜, 디메틸렌글리콜, 펜틸렌글리콜,등이 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.The glycol contained in the composition includes ethylene glycol, trimethylene glycol, tetramethylene glycol, 1,3-butanediol, propylene glycol, butylene glycol, dimethylene glycol, pentylene glycol, and the like, which are used alone or in combination. The above can be mixed and used.
상기 조성물에 포함되는 글리콜에테르로는 에틸렌글리콜 모노메틸에테르, 에틸렌글리콜 모노메틸에테르, 에틸렌글리콜 모노프로필에테르, 에틸렌글리콜 모노프로필에테르, 에틸렌글리콜 모노부틸에테르, 에틸렌글리콜 모노메틸에테르, 디에틸렌글리콜 모노에틸에테르, 디에틸렌글리콜 모노프로필에테르, 디에틸렌글리콜 모노부틸에테르, 트리에틸렌글리콜 모노메틸에테르, 프로필렌글리콜 모노에틸에테르, 프로필렌글리콜 모노프로필에테르, 프로필렌글리콜 모노부틸에테르, 디에틸렌글리콜 디메틸에테르, 디에틸렌글리콜 디프로필에테르, 디에틸렌글리콜 디부틸에테르, 디프로필렌글리콜 디메틸에테르, 디프로필렌글리콜 디에틸에테르, 디프로필렌글리콜 디프로필에테르, 디프로필렌글리콜 디부틸에테르, 트리에틸렌글리콜모노메틸에테르 등을 들 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.The glycol ethers contained in the composition include ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monopropyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, diethylene glycol monoethyl Ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol Dipropyl ether, diethylene glycol dibutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, dipropylene glycol dibutyl ether, triethylene glycol monomethyl ether It is mentioned, and these may be used individually or in combination of two or more.
상기 (b) 알코올, 글리콜 또는 글리콜에테르 중 선택된 1종 이상은 용매로서, 조성물 총 중량에 대해 특별히 한정하지 않으나 상기 용매의 양이 적은 경우 조성물의 점도가 높아져 공정적용에 어려움이 많거나, 술폰산이 용해되지 않는 문제가 발생할 수 있어 60중량% 내지 95중량%로 포함하는 것이 바람직하다. At least one selected from the group (b) alcohol, glycol, or glycol ether is a solvent, and is not particularly limited with respect to the total weight of the composition. However, when the amount of the solvent is small, the viscosity of the composition is high, so that it is difficult to apply the process, or sulfonic acid It may be a problem that does not dissolve, it is preferred to include 60% by weight to 95% by weight.
상기에서 언급된 자성체막 제거방법은 당 업계에 통상적으로 알려진 방법에 의하여 수행될 수 있다. 예컨대, 침적, 분무, 또는 침적 및 분무를 이용한 방법 등이 사용될 수 있으며, 이 경우, 온도 조건으로서 온도는 대개 30~80℃, 바람직하게는 50~70℃이고, 침적, 분무, 또는 침적 및 분무 시간은 대개 5초 내지 30분, 바람직하게는 5분 내지 20분이다. 그러나, 이러한 조건은 엄밀하게 적용되지는 않으며, 당업자에 의해 용이하거나 적합한 조건으로 선택될 수 있다.The above-mentioned magnetic film removing method may be performed by a method commonly known in the art. For example, deposition, spraying, or a method using deposition and spraying may be used, in which case, as the temperature conditions, the temperature is usually 30 to 80 ° C, preferably 50 to 70 ° C, and deposition, spraying, or deposition and spraying The time is usually 5 seconds to 30 minutes, preferably 5 minutes to 20 minutes. However, these conditions are not strictly applied and can be selected as easy or suitable conditions by those skilled in the art.
또한, 자성체막을 제거한 후, 세정하는 경우, 물로 세정하면 산화알루미늄 등의 배리어 막질이 제거될 수 있기 때문에 세정용액으로 알코올 등을 사용하는 것이 바람직하며, 이 경우 이소프로판올을 이용하여 세정하는 것이 특히 바람직하다.In addition, in the case of washing after removing the magnetic body film, it is preferable to use alcohol or the like as the cleaning solution, since it is possible to remove the barrier film such as aluminum oxide when washing with water, and in this case, washing with isopropanol is particularly preferable. .
이하, 본 발명을 실시예, 비교예 및 실험예를 이용하여 더욱 상세하게 설명한다. 그러나 하기 실시예, 비교예 및 실험예는 본 발명을 예시하기 위한 것으로서, 본 발명은 하기 실시예, 비교예 및 실험예에 의해 한정되지 않고 다양하게 수정 및 변경될 수 있다.Hereinafter, the present invention will be described in more detail using examples, comparative examples, and experimental examples. However, the following Examples, Comparative Examples and Experimental Examples are for illustrating the present invention, the present invention is not limited to the following Examples, Comparative Examples and Experimental Examples can be variously modified and changed.
실시예 1~17 및 비교예 1~5: 자성체막 및 자성체막 잔류물 제거용 조성물의 제조Examples 1-17 and Comparative Examples 1-5: Preparation of magnetic film and composition for removing magnetic film residue
하기의 표 1에 기재된 성분과 함량을 혼합하여 자성체막 및 자성체막 잔류물 제거용 조성물을 제조하였다. 표 1에서 함량의 단위는 모두 중량%이다.By mixing the components and contents shown in Table 1 below to prepare a magnetic film and a composition for removing the magnetic film residue. All of the units of content in Table 1 are by weight.
표 1
THFA MTG DBSA p-TSA MIPA DETA
실시예-1 95 - 5 - - -
실시예-2 85 - 15 - - -
실시예-3 - 80 20 - - -
실시예-4 60 - 40 - - -
실시예-5 95 - - 5 - -
실시예-6 85 - - 15 - -
실시예-7 - 85 - 15 - -
실시예-8 - 80 20 - - -
실시예-9 95 - - - 5 -
실시예-10 85 - - - 15 -
실시예-11 - 80 - - 20 -
실시예-12 60 - - - 40 -
실시예-13 - 85 - - 15 -
실시예-14 - 70 - - 30 -
실시예-15 - 90 - - - 10
실시예-16 - 60 - - - 40
실시예-17 - 60 - - 40 -
비교예-1 100
비교예-2 100
비교예-3 98 2
비교예-4 98 2
비교예-5 98 2
Table 1
THFA MTG DBSA p-TSA MIPA DETA
Example-1 95 - 5 - - -
Example-2 85 - 15 - - -
Example-3 - 80 20 - - -
Example-4 60 - 40 - - -
Example-5 95 - - 5 - -
Example-6 85 - - 15 - -
Example-7 - 85 - 15 - -
Example-8 - 80 20 - - -
Example-9 95 - - - 5 -
Example-10 85 - - - 15 -
Example-11 - 80 - - 20 -
Example-12 60 - - - 40 -
Example-13 - 85 - - 15 -
Example-14 - 70 - - 30 -
Example-15 - 90 - - - 10
Example-16 - 60 - - - 40
Example-17 - 60 - - 40 -
Comparative Example-1 100
Comparative Example-2 100
Comparative Example-3 98 2
Comparative Example-4 98 2
Comparative Example-5 98 2
주) THFA: 테트라히드로 푸르푸릴 알코올THFA: tetrahydrofurfuryl alcohol
MTG: 트리에틸렌 글리콜 모노메틸 에테르MTG: Triethylene Glycol Monomethyl Ether
DBSA: 도데실벤젠 술폰산DBSA: dodecylbenzene sulfonic acid
p-TSA: p-톨루엔 술폰산p-TSA: p-toluene sulfonic acid
MIPA: 모노이소프로판올아민MIPA: monoisopropanolamine
DETA: 디에탄올아민DETA: diethanolamine
<실험예 1> 자성체 막 및 자성체막 잔류물의 식각 능력 평가Experimental Example 1 Evaluation of Etching Ability of Magnetic Film and Magnetic Film Residue
자성체막 및 자성체막 잔류물 제거용 조성물의 자성체 막에 대한 식각능력 평가는 CoFe가 200Å의 두께로 적층된 기판을 사용하여 수행하였다. 먼저 상기 CoFe가 적층된 기판에 대하여 실시예 1 내지 17 및 비교예 1 내지 5에서 제조한 자성체막 및 자성체막 잔류물 제거용 조성물에 60℃에서 10분간 침적시킨 후, 이소프로판올을 이용하여 세정 및 건조를 거쳐 상기 기판의 식각을 하였다. 상기 기판에서 식각된 CoFe 층의 두께를 4-point probe(창민테크, CMT series)를 이용하여 평가하였다. 그 결과를 하기의 표 2의 CoFe의 식각량에 기재하였다. The evaluation of the etching ability of the magnetic film and the composition for removing the magnetic film residue on the magnetic film was performed using a substrate in which CoFe was laminated to a thickness of 200 GPa. First, the CoFe-laminated substrate was immersed for 10 minutes at 60 ° C. in the magnetic film and the magnetic film residue removal composition prepared in Examples 1 to 17 and Comparative Examples 1 to 5, and then washed and dried using isopropanol. The substrate was etched through. The thickness of the CoFe layer etched on the substrate was evaluated using a 4-point probe (Changmin Tech, CMT series). The results are shown in the etching amount of CoFe in Table 2 below.
표 2
CoFeB의 식각량(Å for 10min)
실시예-1 5.1
실시예-2 10.2
실시예-3 11.1
실시예-4 10.4
실시예-5 6.8
실시예-6 9.2
실시예-7 8
실시예-8 10
실시예-9 5
실시예-10 5.8
실시예-11 6
실시예-12 5.1
실시예-13 5.5
실시예-14 7
실시예-15 2
실시예-16 7
실시예-17 7.2
비교예-1 0.4
비교예-2 0.1
비교예-3 1.0
비교예-4 0.9
비교예-5 0.7
TABLE 2
Etching amount of CoFeB (min for 10min)
Example-1 5.1
Example-2 10.2
Example-3 11.1
Example-4 10.4
Example-5 6.8
Example-6 9.2
Example-7 8
Example-8 10
Example-9 5
Example-10 5.8
Example-11 6
Example-12 5.1
Example-13 5.5
Example-14 7
Example-15 2
Example-16 7
Example-17 7.2
Comparative Example-1 0.4
Comparative Example-2 0.1
Comparative Example-3 1.0
Comparative Example-4 0.9
Comparative Example-5 0.7
상기 표 2에서 확인되는 바와 같이, 조성물 총 중량에 대해, 술폰산, 지방족 아민 또는 방향족 아민 중 1종 이상을 5 중량% 내지 40 중량%로 포함하는 실시예 1 내지 17의 자성체막 및 자성체막 잔류물 제거용 조성물은 자성체막에 대해 우수한 식각 성능을 나타내는 반면, 상기 범위를 만족하지 못하는 비교예 1 내지 5의 자성체막 및 자성체막 잔류물 제거용 조성물의 경우 불량한 식각 성능을 나타낸다. 모든 조성에서 배리어 산화물에 대한 식각영향은 확인되지 않았다.As confirmed in Table 2 above, the magnetic film and the magnetic film residues of Examples 1 to 17, which include 5 wt% to 40 wt% of at least one of sulfonic acid, aliphatic amine or aromatic amine, based on the total weight of the composition. While the removal composition exhibits excellent etching performance with respect to the magnetic body film, the compositions for removing the magnetic body film and the magnetic body film residues of Comparative Examples 1 to 5, which do not satisfy the above range, exhibit poor etching performance. Etching effects on barrier oxides were not found in all compositions.
이러한 결과로부터 본 발명의 자성체막 및 자성체막 잔류물 제거용 조성물은 우수한 자성체 막의 식각 능력을 가질 뿐만 아니라, 배리어 산화물의 식각효과도 확인되지 않음을 알 수 있다.From these results, it can be seen that the magnetic film and the composition for removing the magnetic film residue of the present invention not only have excellent etching ability of the magnetic film but also no etching effect of the barrier oxide.

Claims (12)

  1. (a) 술폰산, 지방족 아민 또는 방향족 아민 중 선택된 1종 이상의 화합물 및 (b) 용매를 포함하는 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.A composition for removing magnetic film and magnetic film residues, comprising (a) at least one compound selected from sulfonic acids, aliphatic amines or aromatic amines, and (b) a solvent.
  2. 청구항 1에 있어서, The method according to claim 1,
    조성물 총량에 있어서,In the total amount of the composition,
    상기 (a) 술폰산, 지방족 아민 또는 방향족 아민 중 선택된 1종 이상의 화합물 5 중량% 내지 40 중량%; 및(A) 5% to 40% by weight of at least one compound selected from sulfonic acids, aliphatic amines or aromatic amines; And
    상기 (b) 용매 60 중량% 내지 95 중량%를 포함하는 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The magnetic film and the composition for removing the magnetic film residues, characterized in that (b) comprising 60% to 95% by weight of the solvent.
  3. 청구항 1 또는 청구항 2에 있어서, The method according to claim 1 or 2,
    상기 (a) 술폰산은 메탄술폰산, 에탄술폰산, 프로판술폰산, 미노메탄술폰산, 벤젠술폰산, 톨루엔 술폰산(4-메틸벤젠술폰산), 페놀술폰산, 피리딘술폰산, 도데실벤젠 술폰산, 0-크레졸술폰산(2-메틸페놀술폰산), 크레졸술폰산(메틸페놀술폰산)로 이루어진 군에서 선택되는 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The sulfonic acid (m) is methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, minomethanesulfonic acid, benzenesulfonic acid, toluene sulfonic acid (4-methylbenzenesulfonic acid), phenolsulfonic acid, pyridine sulfonic acid, dodecylbenzene sulfonic acid, 0-cresolsulfonic acid (2- Methylphenolsulfonic acid), cresolsulfonic acid (methylphenolsulfonic acid) is any one selected from the group consisting of or mixtures thereof.
  4. 청구항 1 또는 청구항 2에 있어서, The method according to claim 1 or 2,
    상기 (a) 지방족 아민은 알킬 아민 또는 알칸올 아민 중 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The (a) aliphatic amine is any one or a mixture of alkyl amines and alkanol amines, characterized in that the magnetic film and the composition for removing the magnetic film residue.
  5. 청구항 4에 있어서, The method according to claim 4,
    상기 알킬 아민은 메틸아민, 프로필아민, 디메틸아민, 트리메틸아민, 에틸렌디아민으로 이루어진 군에서 선택되는 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The alkyl amine is a composition for removing the magnetic film and magnetic film residues, characterized in that any one or a mixture thereof selected from the group consisting of methylamine, propylamine, dimethylamine, trimethylamine, ethylenediamine.
  6. 청구항 4에 있어서, The method according to claim 4,
    상기 알칸올 아민은 모노에탄올아민, 디에탄올아민, 트리에탄올아민, 프로판올아민, 디프로판올아민, 트리프로판올아민, 모노이소프로판올아민, 디이소프로판올아민, 트리이소프로판올아민, 부탄올아민, 부틸모노에탄올아민, N-메틸에탄올아민, 에틸디에탄올아민으로 이루어진 군에서 선택되는 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The alkanol amines are monoethanolamine, diethanolamine, triethanolamine, propanolamine, dipropanolamine, tripropanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, butanolamine, butyl monoethanolamine, N-methyl A composition for removing a magnetic film and magnetic film residues, characterized in that any one or a mixture thereof selected from the group consisting of ethanolamine, ethyl diethanolamine.
  7. 청구항 1 또는 청구항 2에 있어서, The method according to claim 1 or 2,
    상기 (a) 방향족 아민은 아닐린, o-톨루이딘, 2,4,6-트리메틸아닐린, 아니시딘, N-메틸아닐린으로 이루어진 군에서 선택되는 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The (a) aromatic amine is any one or a mixture thereof selected from the group consisting of aniline, o-toluidine, 2,4,6-trimethylaniline, anisidine, N-methylaniline, and a magnetic body thereof. Membrane residue removal composition.
  8. 청구항 1 또는 청구항 2에 있어서, The method according to claim 1 or 2,
    상기 (b) 용매는 알코올, 글리콜 또는 글리콜에테르 중 선택된 1종 이상인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The solvent (b) is a composition for removing the magnetic film and the magnetic film residues, characterized in that at least one selected from alcohol, glycol or glycol ether.
  9. 청구항 8에 있어서, The method according to claim 8,
    상기 알코올은 테트라히드로 푸르푸릴 알코올 및 푸르푸릴 알코올 중 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.Wherein the alcohol is any one of tetrahydrofurfuryl alcohol and furfuryl alcohol or a mixture thereof.
  10. 청구항 8에 있어서,The method according to claim 8,
    상기 글리콜은 에틸렌 글리콜, 트리메틸렌글리콜, 테트라메틸렌글리콜, 1,3-부탄디올, 프로필렌글리콜, 부틸렌글리콜, 디메틸렌글리콜, 펜틸렌글리콜로 이루어진 군에서 선택되는 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The glycol is any one selected from the group consisting of ethylene glycol, trimethylene glycol, tetramethylene glycol, 1,3-butanediol, propylene glycol, butylene glycol, dimethylene glycol, pentylene glycol, or a mixture thereof. Magnetic film and the composition for removing the magnetic film residue.
  11. 청구항 8에 있어서,The method according to claim 8,
    상기 글리콜에테르는 에틸렌글리콜 모노메틸에테르, 에틸렌글리콜 모노메틸에테르, 에틸렌글리콜 모노프로필에테르, 에틸렌글리콜 모노프로필에테르, 에틸렌글리콜 모노부틸에테르, 에틸렌글리콜 모노메틸에테르, 디에틸렌글리콜 모노에틸에테르, 디에틸렌글리콜 모노프로필에테르, 디에틸렌글리콜 모노부틸에테르, 트리에틸렌글리콜 모노메틸에테르, 프로필렌글리콜 모노에틸에테르, 프로필렌글리콜 모노프로필에테르, 프로필렌글리콜 모노부틸에테르, 디에틸렌글리콜 디메틸에테르, 디에틸렌글리콜 디프로필에테르, 디에틸렌글리콜 디부틸에테르, 디프로필렌글리콜 디메틸에테르, 디프로필렌글리콜 디에틸에테르, 디프로필렌글리콜 디프로필에테르, 디프로필렌글리콜 디부틸에테르, 트리에틸렌글리콜모노메틸에테르로 이루어진 군에서 선택되는 어느 하나 또는 이들의 혼합물인 것을 특징으로 하는 자성체막 및 자성체막 잔류물 제거용 조성물.The glycol ether is ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monopropyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol Monopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol dipropyl ether, di Ethylene glycol dibutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, dipropylene glycol dibutyl ether, triethylene glycol monomethyl ether Either or magnetic films and magnetic films, the residue removal composition, characterized in that mixtures which.
  12. 청구항 1 또는 청구항 2에 기재된 자성체막 및 자성체막 잔류물 제거용 조성물에 자성체 잔류물이 존재하는 기판을 침지한 후, 30~80℃의 온도에서 10분 내지 30분간 침적시키는 단계를 포함하는 자성체막 및 자성체막 잔류물의 제거방법.Magnetic film comprising the step of immersing the substrate in which the magnetic residue is present in the magnetic film and the composition for removing the magnetic film residues according to claim 1 or 2, and then immersing for 10 to 30 minutes at a temperature of 30 ~ 80 ℃ And a method of removing the magnetic film residue.
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US5292445A (en) * 1990-03-09 1994-03-08 Amoco Corporation Wet-etch process and composition
JP2002062669A (en) * 2000-08-22 2002-02-28 Tosoh Corp Resist removing agent
US7252774B2 (en) * 2005-06-08 2007-08-07 International Business Machines Corporation Selective chemical etch method for MRAM soft layers
US7258809B2 (en) * 2005-06-08 2007-08-21 International Business Machines Corporation MRAM wet etch method
JP2007328338A (en) * 2006-05-26 2007-12-20 Air Products & Chemicals Inc Composition and method for photoresist

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292445A (en) * 1990-03-09 1994-03-08 Amoco Corporation Wet-etch process and composition
JP2002062669A (en) * 2000-08-22 2002-02-28 Tosoh Corp Resist removing agent
US7252774B2 (en) * 2005-06-08 2007-08-07 International Business Machines Corporation Selective chemical etch method for MRAM soft layers
US7258809B2 (en) * 2005-06-08 2007-08-21 International Business Machines Corporation MRAM wet etch method
JP2007328338A (en) * 2006-05-26 2007-12-20 Air Products & Chemicals Inc Composition and method for photoresist

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