WO2013047654A1

WO2013047654A1 - Heater and glow plug provided therewith

Info

Publication number: WO2013047654A1
Application number: PCT/JP2012/074879
Authority: WO
Inventors: 淳米玉利
Original assignee: 京セラ株式会社
Priority date: 2011-09-29
Filing date: 2012-09-27
Publication date: 2013-04-04
Also published as: JPWO2013047654A1; JP5829691B2

Abstract

[Problem] To provide a heater that inhibits short circuiting due to a wire break, abnormal heat generation or the extension of a crack, and to provide a glow plug provided therewith. [Solution] This heater is characterized: by comprising an insulating substrate, a resistor (3) buried in the insulating substrate, and a lead (4) connected to the resistor (3) and buried in the insulating substrate; in that the resistor (3) and lead (4) are connected so as to overlap in the direction perpendicular to the axial direction of the lead (4); and in that the resistor (3) has a part (31) in the area where the resistor (3) and the lead (4) are connected which is thicker than the other parts in areas other than the connection area.

Description

Heater and glow plug equipped with the same

The present invention is, for example, for a heater for ignition or flame detection in a combustion-type in-vehicle heating device, a heater for ignition of various combustion devices such as an oil fan heater, a heater for a glow plug of an automobile engine, and various sensors such as an oxygen sensor. In particular, the present invention relates to a heater used for a heater, a heater for heating a measuring instrument, and a glow plug including the heater.

A heater used for a glow plug used for assisting ignition of a diesel engine includes a resistor having a heat generating portion, a lead, and an insulating base. These materials are selected and designed so that the resistance of the lead is smaller than the resistance of the resistor.

Here, the joint between the resistor and the lead is a point of change in shape or a point of change in material composition, so that it is not affected by the difference in thermal expansion during heat generation or cooling during use. In order to increase the bonding area, it is known that the interface between the resistor and the lead is oblique when viewed in a cross section parallel to the axial direction of the lead (see, for example, Patent Documents 1 and 2). ).

JP 2002-334768 A JP 2003-22889 A

In recent years, it is necessary to pass a large current for further higher temperature and rapid temperature rise. However, in the connection region where the resistance value changes (region where the resistor and the lead coexist), the load due to the thermal expansion difference between the resistor and the lead is large, and microcracks and the like are likely to occur. As a result, the conventional glow plug may cause disconnection, abnormal heat generation, and short-circuit due to crack extension, and tends to fail to satisfy the required performance in terms of insulation and durability.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a heater in which short-circuiting due to disconnection, abnormal heat generation and crack extension is suppressed, and a glow plug including the same.

The heater of the present invention includes an insulating base, a resistor embedded in the insulating base, and a lead embedded in the insulating base and connected to the resistor, and the resistor and the lead are the leads. The resistor is connected so as to overlap in a direction perpendicular to the axial direction of the resistor, and the resistor has a portion that is thicker than a portion of a region other than the connection region in a connection region between the resistor and the lead. It is a feature.

Further, the present invention is a glow plug including the heater having the above-described configuration and a metal holding member that is electrically connected to the lead and holds the heater.

According to the heater of the present invention, since the resistor has a portion that is thicker than the region other than the connection region in the connection region, the cross-sectional area of the thickened portion is large and the resistance value is low. Therefore, the thermal expansion at the time of rapid temperature rise in this portion is reduced, and microcracks and the like are less likely to enter. As a result, a short circuit due to disconnection, abnormal heat generation, and crack extension is suppressed.

It is a longitudinal section showing an example of an embodiment of a heater of the present invention. It is a principal part expanded vertical sectional view of an example of embodiment of the heater of this invention. It is a principal part expanded longitudinal sectional view of the other example of embodiment of the heater of this invention. It is a principal part expanded longitudinal sectional view of the other example of embodiment of the heater of this invention. It is a principal part expanded longitudinal sectional view of the other example of embodiment of the heater of this invention. It is a principal part expanded longitudinal sectional view of the other example of embodiment of the heater of this invention. It is a longitudinal cross-sectional view which shows an example of embodiment of the glow plug of this invention.

An example of an embodiment of the heater of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing an example of an embodiment of a heater of the present invention, and FIG. 2 is an enlarged longitudinal sectional view of a main part of an example of an embodiment of a heater of the present invention.

The heater 1 according to the present embodiment includes an insulating base 2, a resistor 3 embedded in the insulating base 2, and a lead 4 embedded in the insulating base 2 and connected to the resistor 3. The lead 4 is connected so as to overlap in a direction perpendicular to the axial direction of the lead 4, and the resistor 3 is thicker in the connection region between the resistor 3 and the lead 4 than the region other than the connection region. 31.

The insulating base 2 in the heater 1 is formed in a rod shape, for example. A resistor 3 and a lead 4 are embedded in the insulating base 2. Here, it is preferable that the insulating base 2 is made of ceramics, which makes it possible to provide the heater 1 with high reliability at the time of rapid temperature rise. Specifically, ceramics having electrical insulation properties such as oxide ceramics, nitride ceramics, carbide ceramics can be used. In particular, the insulating substrate 2 is preferably made of silicon nitride ceramics. This is because silicon nitride ceramics is superior in terms of high strength, high toughness, high insulation, and heat resistance because silicon nitride, which is a main component, is used. The insulating base 2 made of a silicon nitride ceramic is, for example, 3 to 12% by mass of a rare earth such as Y ₂ O ₃ , Yb ₂ O ₃ , Er ₂ O ₃ as a sintering aid with respect to silicon nitride as a main component. Element oxide, 0.5 to 3% by mass of Al ₂ O ₃ , and SiO ₂ are mixed so that the amount of SiO ₂ contained in the sintered body is 1.5 to 5% by mass, and formed into a predetermined shape. It can be obtained by hot press firing at 1650-1780 ° C. The length of the insulating substrate 2 is formed to 20 to 50 mm, for example, and the diameter of the insulating substrate 2 is formed to 3 to 5 mm, for example.

In the case of using one made of silicon nitride ceramics as the insulating substrate _2, it is preferable to mixing MoSi 2, WSi _2, etc. dispersed. In this case, the thermal expansion coefficient of the silicon nitride ceramic that is the base material can be brought close to the thermal expansion coefficient of the resistor 3, and the durability of the heater 1 can be improved.

In the example shown in FIG. 1, the resistor 3 embedded in the insulating base 2 has a folded shape in the longitudinal cross section, and a heat generating portion 32 that generates heat most near the middle point of the folded. The resistor 3 is embedded at the front end side of the insulating base 2, and the distance from the front end of the resistor 3 (near the center of the folded shape) to the rear end of the resistor 3 (joint end portion with the lead) is 2 for example. Formed to ˜10 mm. The cross-sectional shape of the resistor 3 may be any shape such as a circle, an ellipse, or a rectangle, and is usually formed so that the cross-sectional area is smaller than a lead 4 described later.

As the material for forming the resistor 3, a material mainly composed of carbides such as W, Mo, Ti, nitrides, silicides, and the like can be used. When the insulating base 2 is made of silicon nitride ceramics, tungsten carbide (WC) is one of the above-mentioned materials in that the difference in thermal expansion coefficient from the insulating base 2 is small, the heat resistance is high, and the specific resistance is small. ) Is excellent as a material of the resistor 3. Further, when the insulating substrate 2 is made of silicon nitride ceramic, the resistor 3 is preferably composed mainly of WC of an inorganic conductor, and the content of silicon nitride added thereto is 20% by mass or more. For example, in the insulating substrate 2 made of silicon nitride ceramics, the conductor component serving as the resistor 3 has a higher coefficient of thermal expansion than silicon nitride, and thus is usually in a state where tensile stress is applied. On the other hand, by adding silicon nitride to the resistor 3, the coefficient of thermal expansion of the resistor 3 is brought close to the coefficient of thermal expansion of the insulating base 2, so that the coefficient of thermal expansion when the heater 1 is raised and lowered is lowered. The stress due to the difference can be relaxed. Further, when the content of silicon nitride contained in the resistor 3 is 40% by mass or less, the resistance value of the resistor 3 can be made relatively small and stabilized. Therefore, the content of silicon nitride contained in the resistor 3 is preferably 20% by mass to 40% by mass. More preferably, the silicon nitride content is 25% by mass to 35% by mass. Further, as a similar additive to the resistor 3, boron nitride can be added in an amount of 4% by mass to 12% by mass instead of silicon nitride.

The lead 4 embedded in the insulating base 2 is connected to the resistor 3 on one end side and led out to the surface of the insulating base 2 on the other end side. In the example shown in FIG. 1, leads 4 are respectively joined to both end portions of a resistor 3 having a folded shape from one end portion to the other end portion. One lead 4 is connected to one end portion of the resistor 3 on one end side and led to the rear end portion of the insulating base 2 on the other end side. The other lead 4 is connected to the other end of the resistor 3 at one end side and led out to the side surface near the rear end of the insulating base 2 at the other end side.

The lead 4 is formed using the same material as that of the resistor 3. For example, the lead 4 has a larger cross-sectional area than the resistor 3, and the content of the forming material of the insulating base 2 is less than that of the resistor 3. By doing so, the resistance value per unit length is low. In particular, WC is suitable as a material for the lead 4 in that the difference in coefficient of thermal expansion from the insulating substrate 2 is small, the heat resistance is high, and the specific resistance is small. The lead 4 is preferably composed mainly of WC, which is an inorganic conductor, and silicon nitride is added to the lead 4 so that the content is 15% by mass or more. As the silicon nitride content increases, the thermal expansion coefficient of the lead 4 can be made closer to the thermal expansion coefficient of silicon nitride constituting the insulating base 2. Further, when the content of silicon nitride is 40% by mass or less, the resistance value of the lead 4 becomes small and stable. Accordingly, the silicon nitride content is preferably 15% by mass to 40% by mass. More preferably, the silicon nitride content is 20% by mass to 35% by mass.

As shown in FIG. 2, the resistor 3 and the lead 4 are connected so as to overlap in a direction perpendicular to the axial direction of the lead 4, and the resistor 3 is connected in the connection region between the resistor 3 and the lead 4. The region 31 is thicker than the region other than the connection region. 2 is a main part viewed from the direction perpendicular to the paper surface of FIG. 1, and shows the resistor 3 and the lead 4 included in the region A shown in FIG. Further, “overlapping in the direction perpendicular to the axial direction of the lead 4” means having a portion overlapping in the direction perpendicular to the paper surface of FIG. 1, for example. A region B shown in the figure is a connection region between the resistor 3 and the lead 4.

Here, it is effective that the cross-sectional area of the thickened portion 31 is 5 to 30% larger than the other regions. Further, in the connection region where the resistor 3 and the lead 4 overlap in the direction perpendicular to the axial direction of the lead 4, it is effective that the ratio of the thickened portion 31 in the longitudinal direction is 10 to 50%.

As a result, in the connection region where the load due to the thermal expansion difference between the resistor 3 and the lead 4 is large and the micro crack is likely to occur, the cross-sectional area of the thickened portion 31 is large and the resistance value is low. Thermal expansion during warming is reduced and microcracks are difficult to enter. As a result, a short circuit due to disconnection, abnormal heat generation, and crack extension is suppressed.

Further, in the heater 1 of the present invention, as shown in FIG. 2, it is preferable that the thickened portion 31 in the connection region is located at the end of the resistor 3, so that the junction area is widened and the resistor in the connection region is formed. Since the bonding force between the lead 3 and the lead 4 is increased, the disconnection can be made more difficult.

In FIG. 2, the thickened portion 31 and the other portions have a stepped shape. However, as shown in FIG. 3, the thickened portion 31 faces the end face of the resistor 3. It may be a shape that gradually becomes thicker. Thereby, the change in resistance value between the thickened portion 31 and the other portions can be moderated.

Moreover, as shown in FIG. 4, it is preferable that the outer periphery of the end portion of the resistor 3 has no corner, in other words, the end portion has a curved surface or a rounded corner portion. Thereby, the crack by rapid thermal expansion and electric field concentration in an edge part is suppressed, and it can make it difficult to enter a micro crack. The configuration shown in FIG. 4 is a configuration in which the outer periphery of the end portion of the resistor 3 has no corners, the end portions are curved or the corner portions are rounded, and the thickened portion 31 in the connection region is a resistance. It is also a configuration at the end of the body 3.

Further, as shown in FIG. 5, the resistor 3 has a folded portion, and leads 4 connected to the ends of the resistor 3 extend in the same direction, and include a plane including the axis of each lead 4. When it sees in the cross section when cut | disconnecting by, it has the site | part 31 and the other site | part which became thick, and it is preferable that the site | part 31 which became thick is biased outside the other site | part. Here, the other parts are thin parts other than the thickened part 31 in the connection region, and the thickened part 31 is biased outward from the other parts. The axis (position of the center of gravity) is offset outward from the axis (position of the center of gravity) of the other part (thin part), that is, the pair of thick parts 31 are arranged so as to be separated from each other. As a result, the distance between the connection region and the connection region (distance in the direction perpendicular to the axial direction of the lead 4) is increased, so that the thermal stress applied between the connection region and the connection region is relieved and the dielectric breakdown is further increased. (Short) can be made difficult.

In addition, the present invention includes a case where the lead 4 does not enclose the resistor 3 in the connection region between the resistor 3 and the lead 4 as shown in FIG. 6, but the resistor as shown in FIGS. It is preferable that the lead 4 wraps around the resistor 3 in the connection region between the lead 3 and the lead 4, so that the lead 4 covering the end of the resistor 3 that thermally expands at the time of rapid temperature rise has an insulation with a different linear expansion coefficient. It plays the role of a buffer material with the insulating ceramic (insulating base 2), can reduce the load due to thermal stress, and can make it more difficult to cause dielectric breakdown (short circuit).

2 to 6 are also main portions viewed from the direction perpendicular to the paper surface of FIG. 1, and show the resistor 3 and the lead 4 included in the region A shown in FIG.

The heater 1 described above can be used for a glow plug. That is, as shown in FIG. 7, the glow plug of the present invention is electrically connected to the above-described heater 1 and the lead 4 constituting the heater 1, and a metal holding member 5 (sheath fitting) that holds the heater 1. ). As the metal holding member 5, for example, a cylindrical body having a thickness of 0.3 to 1.0 mm made of a material such as Ni or Fe is employed. This configuration makes it difficult for the heater 1 to break down (short-circuit), thereby realizing a glow plug that can be used for a long time.

Next, an example of a method for manufacturing the heater 1 of the present embodiment will be described.

The heater 1 can be formed by, for example, an injection molding method using a die having the shape of the resistor 3, the lead 4 and the insulating base 2 having the configuration of the present embodiment.

First, a conductive paste to be the resistor 3 and the lead 48 including the conductive ceramic powder and the resin binder, and a ceramic paste to be the insulating base 29 including the insulating ceramic powder and the resin binder are prepared.

Next, a conductive paste molded body (molded body a) having a predetermined pattern to be the resistor 3 is formed by an injection molding method or the like using the conductive paste. With the molded body a held in the mold, the conductive paste is filled into the mold to form a conductive paste molded body (molded body b) having a predetermined pattern to be the leads 4. Thereby, the molded product a and the molded product b connected to the molded product a are held in the mold.

Next, in a state where the molded body a and the molded body b are held in the mold, a part of the mold is replaced with one for molding the insulating base 2, and then the ceramic paste that becomes the insulating base 2 in the mold Fill. Thereby, the molded body (molded body d) of the heater 1 in which the molded body a and the molded body b are covered with the molded body of the ceramic paste (molded body c) is obtained.

Next, the obtained molded body d is fired at, for example, a temperature of 1650 ° C. to 1780 ° C. and a pressure of 30 MPa to 50 MPa, whereby the heater 1 can be manufactured. The firing is preferably performed in a non-oxidizing gas atmosphere such as hydrogen gas.

The heater of the example of the present invention was manufactured as follows.

First, a conductive paste containing 50% by mass of tungsten carbide (WC) powder, 35% by mass of silicon nitride (Si ₃ N ₄ ) powder, and 15% by mass of a resin binder is injection-molded into a mold, as shown in FIG. A molded body a which becomes a resistor having a shape as shown was produced.

Next, with the molded body a held in the mold, the conductive paste is filled into the mold, thereby connecting to the molded body a to obtain a lead having a shape as shown in FIG. Formed body b was formed.

Next, 85% by mass of silicon nitride (Si ₃ N ₄ ) powder and ytterbium (Yb) oxide (Yb ₂ ) as a sintering aid while the molded body a and the molded body b are held in the mold. A ceramic paste containing 10% by mass of O ₃ ) and 5% by mass of tungsten carbide (WC) for bringing the coefficient of thermal expansion close to the resistor and the lead was injection molded into a mold. As a result, a molded body d having a configuration in which the molded body a and the molded body b were embedded in the molded body c serving as an insulating base was formed.

Next, after putting the obtained molded product d into a cylindrical carbon mold, sintering is performed by hot pressing at a temperature of 1700 ° C. and a pressure of 35 MPa in a non-oxidizing gas atmosphere composed of nitrogen gas. Thus, a heater according to an embodiment of the present invention was manufactured. A glow plug was fabricated by brazing a cylindrical metal holding member (sheath fitting) to the lead end exposed on the surface of the obtained sintered body.

The diameter of the insulating base is 3.2 mm, and the cross-sectional shape of the thin part and the thick part in the connection region is an elliptical shape with the long axis in the same direction, the short axis length of the thin part is 0.7 mm, long The length of the shaft is 0.8mm, the length of the short axis of the thickened part is 0.7mm, the length of the long axis is 0.9mm, and the length of the connecting part is 2mm in the longitudinal direction. Met.

A cold cycle test was conducted using this glow plug. The conditions of the thermal cycle test are as follows: First, energize the heater and set the applied voltage so that the temperature of the resistor is 1400 ° C. 1) Energize for 5 minutes, 2) Deenergize for 2 minutes 1), 2) The cycle was 10,000 cycles. Although the change in the resistance value of the heater before and after the thermal cycle test was measured, no change in the resistance value was confirmed, and no dielectric breakdown (short circuit) occurred.

1: Heater 2: Insulating substrate 3: Resistor
31: Thickened part
32: Heat generating part 4: Lead 5: Metal holding member

Claims

An insulating substrate;
A resistor embedded in the insulating substrate;
A lead embedded in the insulating base and connected to the resistor;
The resistor and the lead are connected so as to overlap in a direction perpendicular to the axial direction of the lead, and the resistor is thicker in a connection region between the resistor and the lead than a region other than the connection region. The heater characterized by having the part which became.
The heater according to claim 1, wherein the thickened portion is located at an end of the resistor.
The heater according to claim 1, wherein the outer periphery of the end of the resistor has no corners.
The resistor has a folded portion, and the lead joined to each of the end portions of the resistor extends in the same direction, and is seen in a cross section when cut along a plane including the axis of each lead. 2. The connection region according to claim 1, wherein the connection region has the thickened portion and another portion, and the thickened portion is biased to the outside of the other portion. Heater.
The heater according to claim 1, wherein the lead encloses the resistor in a connection region between the resistor and the lead.
A glow plug comprising: the heater according to claim 1; and a metal holding member that is electrically connected to the lead and holds the heater.