WO2013047634A1

WO2013047634A1 - Barrier laminate, gas-barrier film, and device using said barrier laminate and gas-barrier film

Info

Publication number: WO2013047634A1
Application number: PCT/JP2012/074820
Authority: WO
Inventors: 信也鈴木; 青島　俊栄; 向井　厚史
Original assignee: 富士フイルム株式会社
Priority date: 2011-09-30
Filing date: 2012-09-27
Publication date: 2013-04-04
Also published as: JP2013075460A; JP5763493B2

Abstract

Provided is a barrier laminate having few defects and exhibiting high barrier properties. The barrier laminate has at least one organic layer and at least one inorganic barrier layer, wherein at least one layer of the organic layers is an organic layer (1) obtained by hardening a polymerizable composition, and the viscosity of a polypropylene glycol 1-monomethyl ether 2-acetate solution containing 60 mass% of the polymerizable composition is 1000 mPa·s or more.

Description

Barrier laminate, gas barrier film and device using the same

The present invention relates to a barrier laminate and a gas barrier film using the same. Furthermore, the present invention relates to various devices and sealing bags using a barrier laminate or a gas barrier film.

Conventionally, a gas barrier film in which a metal oxide thin film such as aluminum oxide, magnesium oxide, oxidation, nitridation, or silicon oxynitride is formed on the surface of a plastic film is used for packaging of articles that require blocking of various gases such as water vapor and oxygen. It is widely used in packaging applications to prevent the deterioration of food, industrial products and pharmaceuticals.
In recent years, in the field of organic devices (organic EL elements, organic solar cell elements, organic TFT elements, etc.), there is an increasing need to employ a gas barrier film instead of a glass substrate. Since the gas barrier film is lightweight and applicable to a roll-to-roll system, it is advantageous in terms of cost. However, there is a problem that the gas barrier film is inferior in water vapor barrier property as compared with the glass substrate.

In order to solve this problem, Patent Document 1 realizes a water vapor transmission rate of less than 0.005 g / m ² / day by using an alternate laminate (barrier laminate) of an organic layer and an inorganic barrier layer. Technology is disclosed. According to Patent Document 1, when only one organic layer and one inorganic barrier layer are laminated, the water vapor permeability is 0.011 g / m ² / day, and the technical value of multilayer lamination is It is clearly shown. A gas barrier film in which a barrier laminate is placed on a film is expected to be used as a substrate for organic devices.

Patent Document 2 discloses a layer obtained by curing a polymerizable composition containing a trifunctional or higher functional (meth) acrylate in a laminate of an organic layer and an inorganic barrier layer.

US Pat. No. 6,413,645 JP 2010-6040 A

Here, when this inventor examined the said patent document 2, as shown in FIG. 1, on a base film, an inorganic barrier layer, etc. which become a lower layer of the organic layer at the time of forming an organic layer, When 1 etc. existed, even if the polymeric composition 2 was apply | coated on this, it turned out that the polymeric composition 2 is repelled about the foreign material 1. FIG. And it turned out that a polymerizable composition hardens | cures with the state, and a defect arises in an organic layer. This defect leads to a defect in the barrier laminate.
The object of the present invention is to solve the problems of such a barrier laminate, and to provide a barrier laminate having a high number of defects and a high barrier property.

Under such circumstances, the inventor of the present application diligently studied. As a result, the organic layer was formed by curing the polymerizable composition, and as the polymerizable composition, 60% by mass of the polymerizable composition. It has been found that such a problem can be solved by using a polymerizable composition having a viscosity of 1000 mPa · s or more in the propylene glycol 1-monomethyl ether 2-acetate solution. That is, as shown in FIG. 2, when the polymerizable composition in the present invention is used, the polymerizable composition 2 is formed on the lower layer of the organic layer even when the foreign material 1 exists on the lower layer of the organic layer. It is possible to exist so as to cover. And if it hardens | cures in this state, an organic layer will also be formed on a foreign material. As a result, no defects occur on the surface of the organic layer, and as a result, a barrier laminate having a high barrier property can be provided. Furthermore, when the inventors of the present application have studied, by forming an organic layer using a polymerizable composition containing a polymerizable compound having a specific structure, defects are remarkably reduced and a high barrier property is obtained. The inventors have found that this can be achieved and have completed the present invention. Specifically, the above problem has been achieved by the following means <1>, and further by <2> to <16>.

<1> It has at least one organic layer and at least one inorganic barrier layer, and at least one of the organic layers is an organic layer (1) obtained by curing a polysynthetic composition, and the polymerization A barrier laminate having a viscosity of 1000 mPa · s or more in a propylene glycol 1-monomethyl ether 2-acetate solution containing 60% by mass of a functional composition.
<2> The barrier laminate according to <1>, wherein the polymerizable composition is a polyfunctional (meth) acrylate compound containing an aromatic ring.
<3> The barrier laminate according to <1>, wherein the polymerizable composition includes a polymerizable compound represented by the following general formula (1).

(In the general formula (1), R ¹ , R ² , and R ³ each represent a hydrogen atom or a methyl group, and R ⁴ , R ⁵ , and R ⁶ represent a hydrogen atom, a halogen atom, or an alkyl group, respectively. L ¹ , L ² and L ³ each represent a divalent linking group, n represents an integer of 2 or more, and m1 and m3 each represents an integer of 0 to 4 M2 represents an integer of 0 to 3.)
<4> The barrier laminate according to any one of <1> to <3>, wherein L ¹ , L ² , and L ³ in the general formula (1) each have 2 or 3 total carbon atoms body.
<5> The barrier laminate according to any one of <1> to <4>, wherein at least two organic layers and at least two inorganic barrier layers are alternately laminated.
<6> The barrier laminate according to any one of <1> to <5>, wherein the inorganic barrier layer contains at least one of an oxide, a nitride, and a carbide containing silicon and / or aluminum.
<7> A gas barrier film having the barrier laminate according to any one of <1> to <6> on a base film.
<8> The gas barrier film according to <7>, which has at least one anchor layer on the base film, and the organic layer (1) is provided on the surface of the inorganic barrier layer.
<9> The gas barrier film according to <7>, having the organic layer (1) on the surface of the substrate film.
<10> The gas barrier film according to <7>, having at least one anchor layer on the base film, and having the organic layer (1) on the surface of the anchor coat layer.
<11> A device using the gas barrier film according to any one of <7> to <10> as a substrate.
<12> A device sealed with the barrier laminate according to any one of <1> to <6> or the gas barrier film according to any one of <7> to <10>.
<13> The device according to <11> or <12>, wherein the device is an electronic device.
<14> The device according to any one of <11> to <13>, wherein the device is an organic EL element or a solar electronic element.
<15> A sealing bag using the barrier laminate according to any one of <1> to <6> or the gas barrier film according to any one of <7> to <10>.
<16> The barrier laminate according to any one of <1> to <6>, comprising applying the polymerizable composition in a layer form and then curing to form the organic layer (1). A manufacturing method or a manufacturing method of a gas barrier film according to any one of <7> to <10>.

According to the present invention, it is possible to provide a barrier laminate having fewer defects and improved barrier performance.

FIG. 1 is a schematic cross-sectional view showing a step of providing an organic layer in a conventional barrier laminate. FIG. 2 is a schematic cross-sectional view showing a step of providing an organic layer in the barrier laminate of the present invention. FIG. 3 is a schematic cross-sectional view showing an example of a preferred form of the gas barrier film of the present invention.

Hereinafter, the contents of the present invention will be described in detail. In the present specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value. The organic EL element in the present invention refers to an organic electroluminescence element. In this specification, (meth) acrylate is used in the meaning including both acrylate and methacrylate.
The viscosity in this specification is measured using a tuning fork type vibration viscometer SV-10 (manufactured by A & D), and indicates a viscosity at 25 ° C. unless otherwise specified.

<Barrier laminate>
The barrier laminate of the present invention has at least one organic layer and at least one inorganic barrier layer,
At least one of the organic layers is an organic layer (1) obtained by curing a polysynthetic composition, and has a viscosity in a propylene glycol 1-monomethyl ether 2-acetate solution containing 60% by mass of the polymerizable composition of 1000 mPa -It is more than s.
Here, the viscosity of the propylene glycol 1-monomethyl ether 2-acetate solution containing 60% by mass of the polymerizable composition is preferably 1000 mPa · s or more, and more preferably 2000 mPa · s or more. The upper limit is not particularly defined, and is not particularly defined as much as possible in the form of a layer. For example, it is 10,000 mPa · s or less.

(Organic layer)
The organic layer in the present invention is a layer formed by curing a polymerizable composition. The polymerizable composition includes at least a polymerizable compound and may further include other components such as a polymerization initiator.

(Polymerizable compound)
The polymerizable compound in the present invention is preferably a radical polymerizable compound, and more preferably a (meth) acrylate compound. Furthermore, it is preferable that it is polyfunctional (meth) acrylate containing an aromatic ring.
As the compound constituting the organic layer of the barrier film laminate, a polymerizable compound containing an aromatic ring at a high density can provide heat resistance, and can maintain high surface smoothness during film formation of the inorganic layer, resulting in a high barrier. It is more preferable because of the property. A polyfunctional compound having three or more functional groups is preferable because an organic layer having a high glass transition point or excellent in heat resistance that does not exhibit a glass transition phenomenon can be obtained. In addition to these properties, the present inventors have found that the structure of the general formula (1) is particularly effective as a structure for satisfying the property of high viscosity according to the present invention.

(In the general formula (1), R ¹ , R ² , and R ³ each represent a hydrogen atom or a methyl group, and R ⁴ , R ⁵ , and R ⁶ represent a hydrogen atom, a halogen atom, or an alkyl group, respectively. L ¹ , L ² and L ³ each represent a divalent linking group, n represents an integer of 2 or more, and m1 and m3 each represents an integer of 0 to 4 M2 represents an integer of 0 to 3.)

The halogen atom as R ⁴ , R ⁵ and R ⁶ is preferably a chlorine atom or a fluorine atom.
The alkyl group as R ⁴ , R ⁵ , and R ⁶ is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably an alkyl group having 1 to 3 carbon atoms. The alkyl group may be linear, branched or cyclic, but is preferably linear or branched, more preferably linear. Specific examples of the alkyl group include (methyl group, ethyl group, isopropyl group, butyl group, heptyl group, dodecyl group and the like.
R ⁴ , R ⁵ , and R ⁶ are each preferably a methyl group, an ethyl group, or an isopropyl group, and more preferably a methyl group.

L ¹ , L ² , and L ³ each represent a divalent linking group. The divalent linking group is an alkylene group (for example, 1,3-propylene group, 2,2-dimethyl-1,3-propylene group, 2-butyl-2-ethyl-1,3-propylene group, 1, 6-hexylene group, 1,9-nonylene group, 1,12-dodecylene group, 1,16-hexadecylene group, etc.), arylene group (for example, phenylene group, naphthylene group), ether group, imino group, carbonyl group, sulfonyl group A divalent residue in which a plurality of these divalent groups are connected in series (for example, an alkyleneoxyoxy group, an aryleneoxy group, an alkyleneoxycarbonyl group, an alkylenecarboxy group, an alkylenecarbonylimino group, an alkyleneaminocarbonyl group, etc. ). Among these, an alkylene group and an alkyleneaminocarbonyl group are preferable, and an alkylene group is more preferable.
L ¹ , L ² , and L ³ may each have a substituent, and examples of the substituent that can substitute L ¹ , L ² , and L ³ include a hydroxyl group and an alkyl group (for example, Methyl group, ethyl group, isopropyl group, t-butyl group, n-octyl group, n-decyl group, n-hexadecyl group, cyclopropyl group, cyclopentyl group, cyclohexyl group, etc.), alkenyl group (for example, vinyl group, Allyl, 2-butenyl, 3-pentenyl, etc.), aryl groups (eg, phenyl, p-methylphenyl, naphthyl, anthryl), halogen atoms (eg, fluorine, chlorine, bromine, iodine) An acyl group (for example, acetyl group, benzoyl group, formyl group, pivaloyl group, etc.), an acyloxy group (for example, acetoxy group, propionoxy group, benzoyloxy group) Si group etc.), alkoxycarbonyl groups (eg methoxycarbonyl group, ethoxycarbonyl group etc.), aryloxycarbonyl groups (eg phenyloxycarbonyl group etc.) and the like. These substituents may be further substituted.

Among these linking groups, an alkylene group and an alkyleneaminocarbonyl group are preferable, and an alkylene group is more preferable.
With respect to the length of the linking group, the total carbon number is preferably 1 to 3, and more preferably 2 or 3. This is a particularly preferable embodiment in order to maintain plasma resistance which is a characteristic of the compound of the general formula (1). That is, by setting the linking group to 3 or less, the effect of the aromatic ring in the general formula (1) is more effectively exhibited, and the plasma resistance tends to be improved. For these reasons, in the present invention, L ¹ to L ³ are particularly preferably an alkylene group having 1 to 3 carbon atoms or an alkyleneaminocarbonyl group having 1 to 3 carbon atoms, respectively. Most preferred is an alkylene group of .about.3.
n relates to the viscosity at the time of application, which is an important physical property. If the viscosity is small, the effect of the present invention is difficult to obtain, and if it is too large, it is difficult to apply. Therefore, n is preferably 2 to 20, more preferably 2 to 11, and further preferably 4 to 11.
m1 and m3 are preferably 0 to 2, and more preferably 0 or 1.
m2 is preferably 0 to 2, more preferably 0 or 1.

The molecular weight of the compound represented by the general formula (1) is preferably 500 or more, and more preferably 1000 or more.

Examples of the compound represented by the general formula (1) used in the present invention are shown below. However, it goes without saying that the present invention is not limited to these examples.

(Polymerization initiator)
The polymerizable composition in the present invention may contain a polymerization initiator. The content of the photopolymerization initiator is preferably 0.1 mol% or more of the total amount of the polymerizable compounds, and more preferably 0.5 to 2 mol%. By setting it as such a composition, the polymerization reaction via an active component production | generation reaction can be controlled appropriately. Examples of the photopolymerization initiator include Irgacure series (for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure, commercially available from Ciba Specialty Chemicals. 819), Darocure series (eg, Darocur TPO, Darocur 1173, etc.), Quantacure PDO, Ezacure series (eg, Ezacure TZM, Ezacure, commercially available from Lamberti) TZT, Ezacure KTO46, etc.).

(solvent)
The polymerizable composition in the present invention preferably contains a solvent. The type of the solvent is not particularly defined unless departing from the gist of the present invention. An example is 2-butanone.

The polymerizable composition of the present invention may contain other components without departing from the spirit of the present invention, and examples thereof include silane coupling agents and other polymerizable compounds. Specifically, compounds described in JP-A-2009-172986, paragraph numbers 0021 to 0027 and 0032 to 0034 are exemplified.

The polymerizable composition of the present invention preferably contains the compound represented by the general formula (1) in the composition in a proportion of 50% by mass or more, and more preferably in a proportion of 70% by mass.
Moreover, it is preferable that the main component of the polymeric compound contained in a polymeric composition is a compound represented by General formula (1).

(Formation method of organic layer)
The organic layer is formed by applying the polymerizable composition in a layer form on a base such as an inorganic barrier layer, a base film, or another device, and curing it. There is no particular application method. For example, a dip coating method, an air knife coating method, a curtain coating method, a roller coating method, a wire bar coating method, a gravure coating method, a slide coating method, or an extruder using a hopper described in US Pat. No. 2,681,294 -It can be applied by the John coat method.

In the present invention, a polymerizable composition containing a polymerizable compound is cured by irradiation with light, but it is preferable that the irradiation light is usually ultraviolet light from a high-pressure mercury lamp or a low-pressure mercury lamp. The radiation energy is preferably 0.1 J / cm ² or more, 0.5 J / cm ² or more is more preferable. When a (meth) acrylate compound is employed as the polymerizable compound, it is preferably inhibited by the oxygen concentration or oxygen partial pressure during the polymerization because it is inhibited by the oxygen in the air. When the oxygen concentration during polymerization is lowered by the nitrogen substitution method, the oxygen concentration is preferably 2% or less, and more preferably 0.5% or less. When the oxygen partial pressure during polymerization is reduced by the decompression method, the total pressure is preferably 1000 Pa or less, and more preferably 100 Pa or less. Further, it is particularly preferable to perform ultraviolet polymerization by irradiating energy of 0.5 J / cm ² or more under a reduced pressure condition of 100 Pa or less.

The organic layer in the present invention is preferably smooth and has high film hardness.
The polymerization rate of the polymerizable compound constituting the organic layer is preferably 85% or more, more preferably 88% or more, further preferably 90% or more, and particularly preferably 92% or more. . The polymerization rate here means the ratio of the reacted polymerizable group among all the polymerizable groups (for example, acryloyl group and methacryloyl group) in the polymerizable composition. The polymerization rate can be quantified by an infrared absorption method.

The film thickness of the organic layer is not particularly limited, but if it is too thin, it is difficult to obtain film thickness uniformity, and if it is too thick, cracks are generated due to external force and the barrier property is lowered. From this viewpoint, the thickness of the organic layer is preferably 50 nm to 2000 nm, and more preferably 200 nm to 1500 nm.
The organic layer is preferably smooth as described above. The smoothness of the organic layer is preferably less than 1 nm and more preferably less than 0.5 nm as an average roughness (Ra value) of 1 μm square. As described above, the surface of the organic layer is required to be free of foreign matters such as particles and protrusions. For this reason, it is preferable that the organic layer is formed in a clean room. The degree of cleanness is preferably class 10000 or less, more preferably class 1000 or less.
It is preferable that the organic layer has a high hardness. It has been found that when the hardness of the organic layer is high, the inorganic barrier layer is formed smoothly and as a result, the barrier ability is improved. The hardness of the organic layer can be expressed as a microhardness based on the nanoindentation method. The microhardness of the organic layer is preferably 100 N / mm or more, and more preferably 150 N / mm or more.

(Inorganic barrier layer)
The inorganic barrier layer is a layer containing an inorganic compound and having a water vapor barrier property, and preferably contains at least one of oxide, nitride and carbide containing silicon and / or aluminum. More preferably, it is a thin film layer. As a method for forming the inorganic barrier layer, any method can be used as long as it can form a target thin film. For example, there are a physical vapor deposition method (PVD) such as a vapor deposition method, a sputtering method, and an ion plating method, various chemical vapor deposition methods (CVD), and a liquid phase growth method such as plating and a sol-gel method. In the present invention, a high barrier property can be maintained even when a CVD method or a sputtering method is used.
In the present invention, even when a metal oxide is used as a material for the inorganic barrier layer and a film is formed by a plasma process, it is extremely significant in that a barrier laminate having a high barrier property can be obtained.
The smoothness of the inorganic barrier layer formed according to the present invention is preferably less than 1 nm as an average roughness (Ra value) of 1 μm square, and more preferably 0.5 nm or less. For this reason, the inorganic barrier layer is preferably formed in a clean room. The degree of cleanness is preferably class 10000 or less, more preferably class 1000 or less.

The thickness of the inorganic barrier layer is not particularly limited, but is usually in the range of 5 to 500 nm, preferably 15 to 100 nm, per layer.

(Lamination of organic layer and inorganic barrier layer)
Lamination of the organic layer and the inorganic barrier layer can be performed by sequentially and repeatedly forming the organic layer and the inorganic barrier layer according to a desired layer configuration.
A configuration in which at least two organic layers and at least two inorganic barrier layers are alternately laminated is preferable.
The number of layers of the barrier laminate is preferably 2 to 30 layers, more preferably 3 to 20 layers.

(Functional layer)
The device of the present invention may have a functional layer on the barrier laminate or at other positions. The functional layer is described in detail in paragraph numbers 0036 to 0038 of JP-A-2006-289627. Examples of functional layers other than these include matting agent layers, protective layers, antistatic layers, smoothing layers, adhesion improving layers, light shielding layers, antireflection layers, hard coat layers, stress relaxation layers, antifogging layers, and antifouling layers. , Printing layer, easy adhesion layer and the like.

Applications of Barrier Laminate The barrier laminate of the present invention is usually provided on a support, and can be used for various applications by selecting this support. In addition to the base film, the support includes various devices, optical members, and the like. Specifically, the barrier laminate of the present invention can be used as a barrier layer of a gas barrier film. The barrier laminate and gas barrier film of the present invention can be used for sealing devices that require barrier properties. The barrier laminate and gas barrier film of the present invention can also be applied to optical members. Hereinafter, these will be described in detail.

<Gas barrier film>
The gas barrier film has a base film and a barrier laminate formed on the base film. In the gas barrier film, the barrier laminate of the present invention may be provided only on one side of the base film, or may be provided on both sides. The barrier laminate of the present invention may be laminated in the order of the inorganic barrier layer and the organic layer from the base film side, or may be laminated in the order of the organic layer and the inorganic barrier layer. The uppermost layer of the laminate of the present invention may be an inorganic barrier layer or an organic layer. Furthermore, you may have another structure layer.

An example of an embodiment of the gas barrier film of the present invention is an embodiment shown in FIG. 3, wherein the organic layer 4 and the inorganic barrier layer 5 are alternately laminated on the base film 3 in this order. In the present embodiment, the organic layer 4 is provided on the surface of the base film 3, but any layer may be provided between the base film and the organic layer. For example, an anchor layer is mentioned. An anchor layer consists of at least 1 layer provided between a base film and an organic layer or an inorganic barrier layer, for example, and is a layer which provides an easily bonding function etc.
In FIG. 3, the number of the organic layers 4 and the inorganic barrier layers 5 is two, but may be three or more. In the present embodiment, both of the two organic layers 4 may be the organic layer (1) in the present invention, or one of them may be the organic layer (1) in the present invention. Preferably, it is an embodiment in which all organic layers are organic layers (1).
In the present invention, preferred examples of the layer structure of the gas barrier film include the following.
Base film / anchor layer / inorganic barrier layer / organic layer (in addition, a structure in which inorganic barrier layers / organic layers are alternately laminated)
Base film / anchor layer / organic layer / inorganic barrier layer (in addition, a structure in which organic layers / inorganic barrier layers are alternately laminated)

(Plastic film)
The gas barrier film in the present invention usually uses a plastic film as the base film. The plastic film to be used is not particularly limited in material, thickness and the like as long as it can hold a laminate such as an organic layer and an inorganic barrier layer, and can be appropriately selected according to the purpose of use. For details, the description of paragraph numbers 0047 to 0049 of JP-A-2009-172986 can be referred to.

The thickness of the plastic film used for the gas barrier film of the present invention is not particularly limited because it is appropriately selected depending on the application, but is typically 1 to 800 μm, preferably 10 to 200 μm. These plastic films may have functional layers such as a transparent conductive layer and a primer layer. The functional layer is described in detail in paragraph numbers 0036 to 0038 of JP-A-2006-289627. Examples of functional layers other than these include matting agent layers, protective layers, antistatic layers, smoothing layers, adhesion improving layers, light shielding layers, antireflection layers, hard coat layers, stress relaxation layers, antifogging layers, and antifouling layers. , Printing layer, easy adhesion layer and the like.

<Device>
The barrier laminate and gas barrier film of the present invention can be preferably used for devices whose performance is deteriorated by chemical components in the air (oxygen, water, nitrogen oxide, sulfur oxide, ozone, etc.). As an example of the said device, electronic devices, such as an organic EL element, a liquid crystal display element, a thin-film transistor, a touch panel, electronic paper, a solar cell, can be mentioned, for example, It is preferably used for an organic EL element.

The barrier laminate of the present invention can also be used for device film sealing. That is, it is a method of providing the barrier laminate of the present invention on the surface of the device itself as a support. The device may be covered with a protective layer before providing the barrier laminate.

The gas barrier film of the present invention can also be used as a device substrate or a film for sealing by a solid sealing method. The solid sealing method is a method in which after forming a protective layer on the device, an adhesive layer and a gas barrier film are stacked and cured. Although there is no restriction | limiting in particular in an adhesive agent, A thermosetting epoxy resin, a photocurable acrylate resin, etc. are illustrated.

When the conventional barrier laminate and gas barrier film are incorporated in a device and heated at a temperature of 100 ° C. or higher in that state, the alcohol gas derived from the silane coupling agent is released and the device is damaged. It was. However, since the barrier laminate and the gas barrier film of the present invention do not release a large amount of alcohol gas even when heated at a temperature of 100 ° C. or higher (for example, 100 to 200 ° C.), it is effective to damage the device. Can be suppressed.

(Organic EL device)
Examples of organic EL elements using a gas barrier film are described in detail in JP-A-2007-30387. Since the manufacturing process of the organic EL device includes a drying process after the ITO etching process and a process under high humidity conditions, it is extremely advantageous to use the gas barrier film of the present invention.

(Liquid crystal display element)
The reflective liquid crystal display device has a configuration including a lower substrate, a reflective electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, a transparent electrode, an upper substrate, a λ / 4 plate, and a polarizing film in order from the bottom. The gas barrier film in the present invention can be used as the transparent electrode substrate and the upper substrate. In the case of color display, it is preferable to further provide a color filter layer between the reflective electrode and the lower alignment film, or between the upper alignment film and the transparent electrode. The transmissive liquid crystal display device includes a backlight, a polarizing plate, a λ / 4 plate, a lower transparent electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, an upper transparent electrode, an upper substrate, a λ / 4 plate, and a polarization in order from the bottom It has a structure consisting of a film. Of these, the substrate of the present invention can be used as the upper transparent electrode and the upper substrate. In the case of color display, it is preferable to further provide a color filter layer between the lower transparent electrode and the lower alignment film, or between the upper alignment film and the transparent electrode. The type of the liquid crystal cell is not particularly limited, but more preferably TN type (Twisted Nematic), STN type (Super Twisted Nematic), HAN type (Hybrid Aligned Nematic), VA type (Vertically Alignment), ECB type (Electrically Controlled Birefringence) OCB type (Optically Compensated Bend), CPA type (Continuous Pinwheel Alignment), and IPS type (In Plane Switching) are preferable.

(Solar cell)
The barrier laminate and gas barrier film of the present invention can also be used as a sealing film for solar cell elements. Here, the barrier laminate and the gas barrier film of the present invention are preferably sealed so that the adhesive layer is closer to the solar cell element. The solar cell is required to withstand a certain amount of heat and humidity, but the barrier laminate and the gas barrier film of the present invention are suitable. The solar cell element in which the barrier laminate and the gas barrier film of the present invention are preferably used is not particularly limited, and for example, a single crystal silicon solar cell element, a polycrystalline silicon solar cell element, a single junction type, or a tandem Amorphous silicon solar cell elements composed of structural types, III-V compound semiconductor solar cell elements such as gallium arsenide (GaAs) and indium phosphorus (InP), II-VI group compound semiconductors such as cadmium telluride (CdTe) Solar cell element, copper / indium / selenium system (so-called CIS system), copper / indium / gallium / selenium system (so-called CIGS system), copper / indium / gallium / selenium / sulfur system (so-called CIGS system), etc. Group I-III-VI compound semiconductor solar cell element, dye-sensitized solar cell element, organic solar cell Child, and the like. Among these, in the present invention, the solar cell element is made of a copper / indium / selenium system (so-called CIS system), a copper / indium / gallium / selenium system (so-called CIGS system), copper / indium / gallium / selenium / sulfur. A group I-III-VI compound semiconductor solar cell element such as a system (so-called CIGSS system) is preferable.

(Other)
As other application examples, the thin film transistor described in JP-T-10-512104, the touch panel described in JP-A-5-127822, JP-A-2002-48913, etc., and described in JP-A-2000-98326 Electronic paper, solar cells described in JP-A-9-18042, and the like.
Moreover, resin films, such as a polyethylene film and a polypropylene film, and the barriering laminated body or gas barrier film of this invention can be laminated | stacked, and it can use as a bag for sealing. For details of these, descriptions in JP-A-2005-247409, JP-A-2005-335134, and the like can be referred to.

<Optical member>
Examples of the optical member using the gas barrier film of the present invention include a circularly polarizing plate.
(Circularly polarizing plate)
A circularly polarizing plate can be produced by laminating a λ / 4 plate and a polarizing plate using the gas barrier film of the present invention as a substrate. In this case, the lamination is performed so that the slow axis of the λ / 4 plate and the absorption axis of the polarizing plate are 45 °. As such a polarizing plate, one that is stretched in a direction of 45 ° with respect to the longitudinal direction (MD) is preferably used. For example, those described in JP-A-2002-865554 can be suitably used. .

The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

Synthesis Example The compound represented by the general formula (1) is prepared by dissolving the following epoxy compound in a solvent such as cellosolve acetate, propylene glycol monomethyl ether acetate, methyl ethyl ketone, and using 2-ethyl-4-imidazole or triethylbenzylammonium chloride as a catalyst. It was synthesized by reacting with acrylic acid or methacrylic acid at 50 to 120 ° C. in the presence of a polymerization inhibitor such as hydroquinone.

<Production of gas barrier film>
On a polyethylene naphthalate film (manufactured by Teijin DuPont, Teonex Q65FA, thickness 100 μm), 50 g of a polymerizable compound shown in the following table, 1 g of a polymerization initiator (Lamberti, Esacure KTO46), a silane coupling agent (Shin-Etsu Chemical Co., Ltd.) , KBM5103) and a polymerizable composition containing 10 g of 2-butanone 400 g was applied to form a dry film thickness of 1000 nm, and an ultraviolet ray irradiation dose of 0.5 J / cm ² under a nitrogen atmosphere having an oxygen content of 100 ppm or less. The organic layer was produced by irradiation and curing.
In Examples 1 to 6 and Comparative Examples 1 and 2, an inorganic barrier layer of silicon nitride was formed on the organic layer by plasma CVD. The film thickness was 40 nm. In Example 7 and Comparative Example 3, an inorganic barrier layer of aluminum oxide was formed on the organic layer using a sputtering apparatus. The film thickness was 60 nm. In Example 8, the organic layer and the inorganic layer were formed twice by the same method as described above to form two layers each.
In this way, a gas barrier film in which an inorganic barrier layer was laminated on the organic layer was produced. About the obtained gas barrier film, count of the number of defects and evaluation of barrier performance were performed with the following method.

<Defect count>
Using the HITACHI S-4100 scanning electron microscope, 100 gas 1 mm square regions were randomly extracted from each of the produced gas barrier films at an acceleration voltage of 5 KV and an enlargement magnification of 500 times. The number of defects in the selected area was counted and an average value was obtained. The defects that can be counted at this time are defects having a maximum length of 1 μm or more. The average value was converted per 1 cm ² and used as the number of defects.

<Barrier performance>
G. NISATO, P.I. C. P. BOUTEN, P.M. J. et al. The water vapor transmission rate (g / m ² / day) was measured using the method described in SLIKKERVEER et al. SID Conference Record of the International Display Research Conference pages 1435-1438. The temperature at this time was 40 ° C. and the relative humidity was 90%. The results are shown in the table below.

<Viscosity measurement>
Several compounds were selected from the compounds in which the difference in the number of defects and the barrier performance was observed, and the viscosity was measured at 25 ° C. using a tuning fork type vibration viscometer SV-10 (manufactured by A & D).

The compound contained in the said polymeric composition respond | corresponds to the above-mentioned exemplary compound.

As is clear from the above results, it was found that the gas barrier film of the present invention can reduce the number of defects and obtain excellent barrier properties.

(Example 9) Evaluation in organic EL light-emitting device In order to evaluate the barrier property, an organic EL device that produces a black spot (dark spot) defect with water vapor or oxygen was prepared and evaluated. First, a conductive glass substrate having an ITO film (surface resistance value 10Ω / □ (Ω / sq., Ohms per square)) was washed with 2-propanol and then subjected to UV-ozone treatment for 10 minutes. The following compound layers were sequentially deposited on this substrate (anode) by vacuum deposition.
(First hole transport layer)
Copper phthalocyanine: film thickness 10nm
(Second hole transport layer)
N, N′-diphenyl-N, N′-dinaphthylbenzidine: film thickness 40 nm
(Light emitting layer and electron transport layer)
Tris (8-hydroxyquinolinato) aluminum: film thickness 60nm
(Electron injection layer)
Lithium fluoride: film thickness 1nm
On top of this, metal aluminum was deposited to a thickness of 100 nm to form a cathode, and a 3 μm thick silicon nitride film was attached thereon by a parallel plate CVD method to produce an organic EL device.
Next, using the thermosetting adhesive (Epotech 310, Daizonitomoly Co., Ltd.), each gas barrier film produced in Example 1 on the produced organic EL element, and the barrier layer is on the organic EL element side. The adhesive was cured by heating at 65 ° C. for 3 hours. 20 organic EL elements sealed in this way were produced.
The organic EL device immediately after fabrication was made to emit light by applying a voltage of 7 V using a source measure unit (SMU 2400 type, manufactured by Keithley). When the surface of the light emitting surface was observed using a microscope, it was confirmed that all the elements gave uniform light emission without dark spots.
Finally, each element was allowed to stand in a dark room at 60 ° C. and 90% relative humidity for 24 hours, and then the light emitting surface was observed. The ratio of elements in which dark spots larger than 300 μm in diameter were observed was defined as the failure rate, and the failure rate of each element was calculated. The failure rate was as good as 5% or less for all the elements of the present invention.

Example 10 Production of Solar Cell Using the gas barrier film produced in Example 1 above, a solar cell module was produced. Specifically, a standard cure type ethylene-vinyl acetate copolymer was used as a filler for a solar cell module. A solar cell module was fabricated by sandwiching and filling amorphous silicon solar cells with 450 μm thick ethylene-vinyl acetate copolymer on a 10 cm square tempered glass and further installing a gas barrier film thereon. As installation conditions, vacuuming was performed at 150 ° C. for 3 minutes, and then pressure bonding was performed for 9 minutes. The solar cell module produced by this method operated well and exhibited good electrical output characteristics even in an environment of 85 ° C. and 85% relative humidity.

Example 11 Production of Sealing Bag Using the gas barrier film produced in Example 1 above, a sealing bag was produced. The base film side of the gas barrier film and a back (polyethylene bag) made of a resin film were fused by a heat seal method to produce a sealing bag. Cefazolin sodium (manufactured by Otsuka Pharmaceutical Factory) was encapsulated in the obtained sealing bag as a drug, stored for 6 months at 40 ° C. and 75% relative humidity, and evaluated for changes in color. It was hardly seen.

Since the gas barrier film of the present invention has a high barrier performance, it can be widely used in various devices that require barrier properties.

DESCRIPTION OF SYMBOLS 1 Foreign material 2 Polymerizable composition 3 Base film 4 Organic layer 5 Inorganic barrier layer

Claims

It has at least one organic layer and at least one inorganic barrier layer, and at least one of the organic layers is an organic layer (1) obtained by curing a polysynthetic composition, and the polymerizable composition A barrier laminate having a viscosity in a propylene glycol 1-monomethyl ether 2-acetate liquid containing 60% by mass of 1000 mPa · s or more.
The barrier laminate according to claim 1, wherein the polymerizable composition is a polyfunctional (meth) acrylate compound containing an aromatic ring.
The barrier laminate according to claim 1, wherein the polymerizable composition contains a polymerizable compound represented by the following general formula (1).

(In the general formula (1), R 1 , R 2 , and R 3 each represent a hydrogen atom or a methyl group, and R 4 , R 5 , and R 6 represent a hydrogen atom, a halogen atom, or an alkyl group, respectively. L 1 , L 2 and L 3 each represent a divalent linking group, n represents an integer of 2 or more, and m1 and m3 each represents an integer of 0 to 4 M2 represents an integer of 0 to 3.)
The barrier laminate according to any one of claims 1 to 3, wherein L 1 , L 2 , and L 3 in the general formula (1) each have 2 or 3 total carbon atoms.
The barrier laminate according to any one of claims 1 to 4, wherein at least two organic layers and at least two inorganic barrier layers are alternately laminated.
The barrier laminate according to any one of claims 1 to 5, wherein the inorganic barrier layer contains at least one of an oxide, a nitride, and a carbide containing silicon and / or aluminum.
A gas barrier film having the barrier laminate according to any one of claims 1 to 6 on a base film.
The gas barrier film according to claim 7, which has at least one anchor layer on a base film, and the organic layer (1) is provided on a surface of the inorganic barrier layer.
The gas barrier film of Claim 7 which has the said organic layer (1) on the surface of a base film.
The gas barrier film according to claim 7, which has at least one anchor layer on the base film, and has the organic layer (1) on the surface of the anchor coat layer.
A device using the gas barrier film according to any one of claims 7 to 10 as a substrate.
A device sealed with the barrier laminate according to any one of claims 1 to 6 or the gas barrier film according to any one of claims 7 to 10.
The device according to claim 11 or 12, wherein the device is an electronic device.
The device according to any one of claims 11 to 13, wherein the device is an organic EL element or a solar electronic element.
A sealing bag using the barrier laminate according to any one of claims 1 to 6 or the gas barrier film according to any one of claims 7 to 10.
The method for producing a barrier laminate according to any one of claims 1 to 6, comprising applying the polymerizable composition in a layer form and then curing to form the organic layer (1). The method for producing a gas barrier film according to any one of 7 to 10.