WO2013035613A1 - Bonded ceramic and process for producing same - Google Patents

Bonded ceramic and process for producing same Download PDF

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WO2013035613A1
WO2013035613A1 PCT/JP2012/071952 JP2012071952W WO2013035613A1 WO 2013035613 A1 WO2013035613 A1 WO 2013035613A1 JP 2012071952 W JP2012071952 W JP 2012071952W WO 2013035613 A1 WO2013035613 A1 WO 2013035613A1
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joined
silicon nitride
materials
bonded
bonding
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PCT/JP2012/071952
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French (fr)
Japanese (ja)
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井筒 靖久
峻 有馬
近藤 直樹
幹則 堀田
英紀 北
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三井金属鉱業株式会社
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Priority to CN201280027506.0A priority Critical patent/CN103596903A/en
Priority to KR1020137031993A priority patent/KR20140071279A/en
Publication of WO2013035613A1 publication Critical patent/WO2013035613A1/en

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Definitions

  • the present invention relates to a ceramic joined body and a manufacturing method thereof.
  • Patent Document 1 discloses silicon nitride ceramics containing Y 2 O 3 and Yb 2 O 3 as sintering aids, Y 2 O 3 , Al 2 O 3 , SiO 2 and Si 3 N 4. Joining with an oxynitride glass consisting of
  • Patent Document 2 a silicon nitride rod is inserted into a hole of a disk-shaped silicon nitride perforated plate, and CeO 2 , SrCO 3 , MgO, Al 2 O 3 , SiO is inserted into a circular joint formed by the both. After applying a bonding agent composed of 2 and Si 3 N 4 , heating at 1500 ° C. for 1 hour is described.
  • Patent Document 3 includes (a) a step of preparing a first raw material containing silicon particles, (b) a step of forming a molded body from the first raw material, and (c) silicon particles in the molded body.
  • a step of reactive sintering (d) a step of preparing a second raw material similar to the first raw material, (e) a step of preparing a slurry from the second raw material, and (f) a bonding material after The step of injecting the slurry into the gap between the formed members to be formed to form a bonding material, and (g) the silicon particles in the bonding material by the reaction sintering process similar to step (c).
  • a joining method having a step of reactive sintering is described.
  • Patent Document 4 a bonding agent mainly composed of glass containing aluminum, silicon, and yttrium is applied to one or both main surfaces of a pair of plate-like substrates made of a silicon nitride sintered body containing lutetium.
  • a method for manufacturing a ceramic joined body is described, which includes a step and a step of joining the main surfaces of a pair of bases by heat treatment in a non-oxidizing atmosphere.
  • an object of the present invention is to provide a ceramic joined body that can eliminate the various drawbacks of the above-described prior art and a method for manufacturing the same.
  • the present invention is a ceramic joined body in which silicon nitride ceramics joined materials are joined via a joining part containing silicon nitride particles and silicon oxynitride glass, In the two-dimensional cross-sectional observation of the microstructure of the bonding site, the ratio of silicon nitride particles to silicon oxynitride glass is 97: 3 to 60:40, In addition, the present invention provides a ceramic joined body in which the silicon nitride particles contained in the joining portion are columnar.
  • the present invention provides a method for producing a ceramic joined body as described above, wherein a silicon nitride ceramic material to be joined is joined to each other via a joining portion containing silicon nitride particles and silicon oxynitride glass.
  • a method Between the materials to be bonded, a bonding material including a mixed powder having a composition capable of forming a bonding portion including silicon nitride particles and silicon oxynitride glass after heating is interposed, The present invention provides a method for producing a ceramic joined body, in which the joining parts are heated under a state where the joining parts of the materials to be joined are pressurized.
  • the ceramic bonded body of the present invention has a bonding portion having a high bonding strength close to the strength of the material to be bonded.
  • the bonded ceramic body of the present invention can maintain bonding strength even after it is exposed to a high-temperature oxidizing atmosphere.
  • FIG. 1 is a schematic diagram illustrating a state in which a material to be bonded is bonded using a bonding material made of a green sheet.
  • 2A and 2B are schematic views showing a state in which the materials to be joined having a fitting structure are joined together.
  • FIG. 2 is a schematic view showing a state in which the materials to be joined are joined using the inner sleeve.
  • 4 (a) to 4 (d) are schematic views sequentially showing steps for producing a ceramic joined body using an apparatus suitably used for carrying out the production method of the present invention.
  • the ceramic joined body of the present invention is formed by joining silicon nitride ceramic materials to be joined to each other through a joining portion.
  • the two materials to be bonded that are bonded via the bonding site can take various shapes depending on the intended use of the ceramic bonded body. For example, it can take the shape of a hexahedron such as a rectangular parallelepiped or a cube, a rod-like body having a smooth end face, a tubular body, or the like. Further, the material to be joined may be either a solid body or a hollow body. However, it is preferable that the two materials to be joined have portions that are in surface contact with each other. By having the said part, the intensity
  • the two materials to be joined that are joined via the joining site may have the same shape or different shapes.
  • Examples of the material to be joined having the same shape include a rod shape and a tubular shape.
  • As the materials to be joined having different shapes for example, as described in the background section, a disc-like shape having a perforated portion in the center and a rod-like shape having a cross-sectional shape that can be inserted into the perforated portion. Is mentioned.
  • the two materials to be bonded to each other through the bonding site may be of the same composition, or may contain a small amount of a third component such as a sintering aid. May be different.
  • the ceramic joined body of the present invention may be obtained by joining three or more materials to be joined according to the specific application.
  • the ceramic bonded body may have two or more bonding sites.
  • the joining portion has a chemical composition and a microstructure that are continuous from a material to be joined that is a base material.
  • the bonding portion has silicon nitride, which is the main material of the material to be bonded, as the main material of the crystal phase. It is known that at least one of ⁇ -silicon nitride and ⁇ -silicon nitride, which are two types of compounds having different crystal structures, is present in the silicon nitride contained in the bonding site.
  • ⁇ -sialon which is a substance in which a part of Si in ⁇ -silicon nitride is replaced by Al and a part of O is replaced by N may be present as a crystalline phase at the bonding site.
  • one or more kinds of ⁇ -silicon nitride, ⁇ -silicon nitride, and ⁇ -sialon are present as crystal phases at the bonding site.
  • silicon nitride means one or more of ⁇ -silicon nitride, ⁇ -silicon nitride, and ⁇ -sialon.
  • the bonded portion contains at least a ⁇ -sialon crystal phase.
  • the proportion of ⁇ -sialon present in the bonding portion is lower than the proportion of silicon nitride present in the portion.
  • the proportion of ⁇ -sialon present at the bonding site and the proportion of silicon nitride are not so important in achieving the object of the present invention.
  • the joining site may contain a small amount of a third component such as a sintering aid.
  • Whether or not the bonding site contains ⁇ -silicon nitride, ⁇ -silicon nitride or ⁇ -sialon can be determined by identifying the crystal phase included in the bonding site, for example, by X-ray diffraction.
  • silicon nitride contained in the bonding site is a hardly sintered material, it is advantageous to add an oxide such as glass to the bonding site so that the glass fills the space between the silicon nitride crystal particles. is there.
  • the glass existing between the silicon nitride crystal particles is silicon oxynitride glass in which a part of O in the SiO 2 glass is incorporated into the silicon nitride crystal.
  • the bonding site has a structure in which silicon nitride, which is the main material of the material to be bonded, is used as the main material of the crystal phase, and silicon oxynitride glass is filled between the crystal particles.
  • silicon nitride which is the main material of the material to be bonded
  • silicon oxynitride glass is filled between the crystal particles.
  • silicon nitride which is the main material of the material to be bonded
  • silicon oxynitride glass is filled between the crystal particles.
  • silicon oxynitride glass may contain one or more metal elements commonly used as a sintering aid for silicon nitride, such as Al, Y, Mg, Zr, and Yb.
  • the ratio of silicon nitride particles to silicon oxynitride glass is preferably 97: 3 to 60:40, and more preferably 95: 5 to 65:35.
  • the ratio between the silicon nitride particles and the silicon oxynitride glass is obtained, for example, by image analysis of a two-dimensional cross-sectional structure observation image obtained by a scanning electron microscope (SEM) in which the bonding portion is enlarged by about 500 to 5000 times. be able to.
  • SEM scanning electron microscope
  • the ceramic joined body has one of the characteristics in the microstructure of the joining portion. Specifically, columnar particles and spherical particles are observed as crystal grains at the bonding site when the bonding site is observed with a microscope. As described above, the joining portion is configured to include silicon nitride and ⁇ -sialon, and the columnar particles and spherical particles are configured to include silicon nitride and ⁇ -sialon as a crystal phase. Specifically, the columnar particles mainly contain ⁇ -silicon nitride and ⁇ -sialon as crystal phases. On the other hand, the spherical particles mainly contain ⁇ -silicon nitride as a crystal phase.
  • the columnar particles mainly containing ⁇ -silicon nitride and ⁇ -sialon greatly contribute to the improvement of the strength of the bonded portion.
  • the balance between the presence of the columnar particles and the spherical particles in the joining site greatly affects the joining strength of the joining site.
  • the joining portion includes columnar particles and spherical particles in a predetermined balance, the joining portion has a high joining strength close to the strength of the material to be joined.
  • the columnar particles contained in the bonding part mean particles having an aspect ratio (major axis / minor axis) of 2 or more in the structure observation of the cross section of the bonding part.
  • ⁇ -silicon nitride and ⁇ -sialon present at the bonding site are mainly contained in the columnar particles, and the average aspect ratio (major axis / minor axis) of the columnar particles is preferably 2 to 30, and more preferably 2. It is 7 to 20, more preferably 2.7 to 15.
  • the long axis of the columnar particles refers to the line segment that has the longest line segment that crosses the columnar particles in a two-dimensional image of the columnar particles obtained by observing the bonding site with a microscope.
  • the short axis refers to the component that is perpendicular to the long axis and has the shortest line segment across the columnar particle.
  • the aspect ratio of the columnar particles can be determined by, for example, performing a two-dimensional cross-sectional structure observation with a scanning electron microscope (SEM) in which the bonding site is enlarged by about 500 to 5,000 times, and arbitrarily selecting particles within the observation field. Measure aspect ratio. Among the measured particles, the arithmetic average of the aspect ratio is obtained for 1000 or more particles having an aspect ratio of 2 or more.
  • the spherical particles present at the bonding site do not require that the two-dimensional image of the spherical particles obtained by observing the bonding site under a microscope is a perfect circle, but may be a circle that can be regarded as a perfect circle.
  • the aspect ratio (major axis / minor axis) of the spherical particles may be less than 2.
  • the balance between the columnar particles and the spherical particles at the bonding site may be set such that the ratio of the columnar particles to the total amount of the columnar particles and the spherical particles in the observation field is preferably 10 to 30%, more preferably 15 to 30%.
  • This ratio is calculated by calculating the total area of the area of the two-dimensional image of the columnar particles and the area of the two-dimensional image of the spherical particles, which is measured by microscopic observation of the bonding site at a magnification of about 500 to 5000 times. Is divided by the total area and multiplied by 100. This ratio can be calculated, for example, by image analysis of a microscope observation image of the bonded portion.
  • the size of the silicon nitride particles present at the bonding site depends on the particle size of the mixed powder constituting the bonding material described later, and is generally equal to or larger than the particle size of the particles constituting the mixed powder. In particular, it is desirable that those having a particle diameter of 0.7 ⁇ m or more exist in an amount of 15% or more on a volume basis.
  • the thickness of the bonding site that is, the distance between the two materials to be bonded should be 50 to 500 ⁇ m, particularly 50 to 300 ⁇ m, especially 50 to 100 ⁇ m, so that a uniform and high bonding strength bonding site can be formed. It is preferable from the viewpoint.
  • the ceramic bonded body of the present invention may be manufactured, for example, by the method described below.
  • two silicon nitride ceramics that are materials to be joined are arranged so that their joint surfaces face each other.
  • a bonding material having a composition capable of forming a bonded portion including silicon nitride particles and silicon oxynitride glass after heating is interposed between the two bonded materials.
  • the mixed powder described above preferably contains silicon nitride particles. From the viewpoint of production of silicon oxynitride glass, we are also preferred to include particles of silicon dioxide (SiO 2). From the viewpoint of production of sialon, it is also preferred to include particles of alumina (Al 2 O 3).
  • the proportion of silicon nitride contained in the mixed powder is generally preferably 20 to 35% by mass.
  • the proportion of silicon dioxide is generally preferably 10 to 20% by mass.
  • the proportion of alumina is generally preferably 5 to 15% by mass.
  • the above-mentioned mixed powder may contain various oxides known as sintering aids, such as Y 2 O 3 , CaO, MgO, ZrO 2 , Yb 2 O 3 and the like. Good.
  • Y is an element having a high effect of extending silicon nitride crystal grains in a columnar shape.
  • These various oxides are generally preferably contained in the mixed powder in an amount of 35 to 55% by mass as a
  • the bonding material contains silicon nitride particles in excess relative to the amount of silicon oxynitride glass formed under high temperature heating for bonding, and part of the silicon nitride particles remain as solid phase particles in the silicon oxynitride glass. It is desirable to make such a composition. The remaining silicon nitride particles that are not completely dissolved in the silicon oxynitride glass change into columnar particles in the glass during heating and holding during bonding.
  • ⁇ -silicon nitride As will be described later, when ⁇ -silicon nitride is used as the silicon nitride particles, almost all is converted to ⁇ -silicon nitride or ⁇ -sialon, but when the temperature is low and the holding time is short, a part of ⁇ -silicon nitride is used. May remain. Although ⁇ -silicon nitride may remain, ⁇ -silicon nitride has an equiaxed particle shape and is not advantageous for obtaining the strength of the binding site.
  • nitrogen is contained in the mixed powder in an amount of 25 equivalent% or more, particularly 25 to 60 equivalent%, particularly 35 to 55 equivalent%. It is desirable. “Equivalent%” is a notation method that takes into account the valence of ions in the glass, and is often used to indicate the composition of silicon oxynitride glass. For each of the cation and the anion in the glass, the sum of the product of the number of atoms and the valence is expressed as 100%, and the total is 200%.
  • silicon nitride includes ⁇ -silicon nitride and ⁇ -silicon nitride, which are two types of compounds having different crystal structures. Of these two types of silicon nitride, In the present invention, it is advantageous to use ⁇ -silicon nitride because it is possible to easily form the joint portion composed of the microstructure including both the columnar particles and the spherical particles described above.
  • the average particle size of the mixed powder used to form the bonded site is preferably 0.4 to 5.0 ⁇ m, more preferably 0.4 to 3.0 ⁇ m, and still more preferably 0.4 to It is also advantageous to use 2.0 ⁇ m.
  • the fluidity of the mixed powder becomes moderately high and exhibits good wettability when forming a bonded portion by heating.
  • it was found that the mixed powder spreads sufficiently between the two materials to be joined and the generation of gaps was reduced. If a mixed powder having a particle size smaller than the range of the average particle size is used, the fluidity of the mixed powder may not be sufficiently high, and the wettability may be low. Further, when a mixed powder having a particle size larger than the average particle size range is used, the bonded portion may not be sufficiently densified and the strength may not be obtained.
  • the average particle diameter of the mixed powder is measured using, for example, a particle size distribution measuring device by a laser diffraction method.
  • the mixed powder may be subjected to a treatment such as pulverization by a mill or the like using ceramic balls or the like as a medium.
  • silicon nitride or silicon oxynitride glass decomposes and evaporates at a high temperature, and this occurs remarkably when the temperature exceeds 1750 ° C. in an atmospheric pressure nitrogen atmosphere.
  • mechanical pressure is applied in a direction orthogonal to the bonding surfaces of the bonded materials, It is effective to bring the bonding material into close contact.
  • the mixed powder used for forming the bonding site can be mixed with a liquid such as water or an organic solvent to prepare a slurry having a predetermined concentration, and the slurry can be applied to the bonding surface of the materials to be bonded.
  • a green sheet can be formed from the slurry, and the green sheet can be disposed on the joining surface of the materials to be joined. It is advantageous to use a green sheet from the viewpoints of ease of work, reliability of arrangement, and the like, and from the viewpoint of forming a joint portion having a uniform thickness.
  • the joining material 2 An annular green sheet can be used.
  • the end surface 11a of one material to be bonded 1a is tapered, and the end surface 11b of the other material to be bonded 1b corresponds to the inclination angle of the tapered shape. It can be formed into a mortar shape having an inclination.
  • the end surface 11a of one material to be bonded 1a has a stepped shape having a convex portion, and the end surface 11b of the other material to be bonded 1b corresponds to the shape of the convex portion. It can be made into the shape which has the recessed part made.
  • illustration of the bonding material is omitted.
  • an inner sleeve for aligning the axis of the material to be joined can also be interposed at the joining site. Even if it does in this way, since the axial center alignment of two to-be-joined materials can be made easy, it is preferable.
  • the inner sleeve also has a role as a reinforcing material for the joint portion. For example, as shown in FIG. 3, when the two materials to be joined 1a and 1b are tubular bodies, the inner sleeve 3 that can be inserted into the materials to be joined 1a and 1b is joined to both the materials to be joined 1a and 1b.
  • the inner sleeve 3 is tubular or rod-shaped, and has a protrusion 3a on the side surface in a substantially central region along the longitudinal direction.
  • the protrusion 3 a is continuously formed over the entire area of the inner sleeve 3 in the circumferential direction.
  • the end surfaces of the materials to be bonded 1a and 1b have a first end surface 12 located on the outer peripheral side and a second end surface 13 located on the inner peripheral side and lower than the first end surface 12. It has a step structure.
  • the material of the inner sleeve 3 may be the same as or different from the material of the base material. Further, the inner sleeve 3 may be made of a material that remains even after the joining portion is formed by heating, or may be made of a material that disappears by heating.
  • fitting structure shown in FIG. 2A or 2B and the inner sleeve 3 shown in FIG. 3 can be used in combination.
  • the heating of the bonding material disposed between the two bonded materials 1a and 1b is preferably performed in the range of 1500 to 1750 ° C., particularly 1550 to 1730 ° C., particularly 1600 to 1700 ° C. By heating at a temperature in this range, a bonded portion having a dense structure can be generated.
  • the heating atmosphere is preferably a nitrogen atmosphere.
  • the heating time is preferably set to 0.5 to 12 hours, particularly 1 to 6 hours.
  • the compositional difference between the bonded portion and the material to be bonded around the bonded portion decreases due to diffusion of the silicon oxynitride glass, and the ⁇ -silicon nitride or ⁇ -sialon columnar particles in the bonded portion are reduced.
  • a desired balance is achieved, and a bonded portion having a composition and structure closer to the material to be bonded can be successfully formed.
  • the pressurizing pressure is set to 0.01 to 5 MPa, particularly 0.1 to 5 MPa, particularly 1 to 5 MPa.
  • the two materials to be joined are rotated in the same direction around the axis perpendicular to the joining surface of the materials to be joined, and the two materials are rotated at the same speed. It is preferable to keep it.
  • This operation is effective when joining materials to be joined that are long in one direction in series in the longitudinal direction.
  • the downward sag due to the gravity of the bonding material at a high temperature during heating is suppressed, and the bending of the bonded body can be prevented.
  • it can suppress that a joining material flows out to the lower part side of a joined part. From the viewpoint of making this effect even more remarkable, it is preferable to set the rotational speed to a low speed of 1 to 5 rpm, particularly 3 to 5 rpm. If rotation is not performed, the bonding material may flow out, resulting in a defect of insufficient strength due to insufficient bonding material.
  • the formation of the bonding site by heating the bonding material may be completed by only one heating, or may be performed two or more times as necessary. In general, it is possible to form a bonded portion having a microstructure that is satisfactory only by one heating.
  • the strength of the joined portion is close to the strength of the workpiece to be joined.
  • the four-point bending strength of the joined portion is preferably 50% or more with respect to the four-point bending strength (JIS-R1601) of the material to be joined. More preferably, it is 60% or more, more preferably 70% or more.
  • the ceramic joined body obtained by the manufacturing method of the present invention even when this is repeated in an air atmosphere at 900 ° C. for 1 hour a plurality of times, a joining strength equivalent to that before the exposure is maintained at the joining site.
  • the four-point bending strength after exposure is preferably 70% or more, more preferably 80% or more, and even more preferably 85% or more with respect to the four-point bending strength (JIS R1601) before exposure. Yes.
  • FIG. 4 (a) to 4 (d) schematically show steps of manufacturing a ceramic joined body in order by an apparatus suitably used for carrying out the manufacturing method of the present invention.
  • the apparatus shown in the figure is particularly preferably used for joining tubular or rod-like materials to be joined.
  • the two materials to be bonded 1a and 1b to be bonded are each gripped by the chuck 20.
  • the gripping by the chuck 20 is performed so that the two workpieces 1a and 1b are held horizontally.
  • Each chuck 20 is slidably mounted on the pedestal 21.
  • the end surfaces of the materials to be bonded 1a and 1b are opposed to each other at a predetermined distance and the bonding material 2 is disposed between the end surfaces, one chuck 20 is moved in the direction indicated by the arrow in FIG.
  • the bonding material 2 is sandwiched between the bonded materials 1a and 1b.
  • the outer diameter thereof is 5 to 60 mm, particularly 10 to 45 mm, especially 10 to 30 mm. It is preferable from the point of reliable joining.
  • the joining can be performed even if the upper limit value of the length is 2000 mm. There is no limit to the lower limit of the length, and the shorter the length, the easier the joining.
  • the workpieces 1a and 1b are rotated around the axis by a rotation mechanism (not shown) provided in the chuck 20.
  • the two chucks 20 are moved in the direction indicated by the arrows in the drawing, and the contact portions of the two materials to be joined 1 a and 1 b are introduced into the heating furnace 22.
  • the heating furnace 22 is heated while continuing to rotate the materials to be bonded 1a and 1b as shown in FIG. Starting, the bonding material 2 located at the contact portion is heated. During heating, the materials 1a and 1b are continuously rotated. Further, during heating, the bonded materials 1a and 1b are pressurized in a direction facing each other in the axial direction. By holding the materials to be bonded 1a and 1b horizontally and heating them while rotating around their axes, it is possible to form a bonded portion having a desired microstructure.
  • ⁇ Heating is performed at a desired temperature and time, and when the target joining portion is formed, heating by the heating furnace 22 is stopped. However, the rotation of the materials to be joined 1a and 1b is continued even after the heating is stopped.
  • the heating furnace 22 is cooled to room temperature, the rotation of the materials 1a and 1b to be joined is stopped, the chuck 20 is moved, and the joining portion is taken out of the heating furnace 22. In this way, a ceramic joined body is obtained.
  • a material to be joined 1c is prepared, and the end surface of the material to be joined 1c and the end surface of the material to be joined 1b are predetermined.
  • the bonding material 2 is disposed between both end faces so as to face each other at a distance. Thereafter, an operation similar to the above-described operation is performed to obtain a long ceramic joined body in which three materials to be joined 1a, 1b, and 1c are connected in series along their longitudinal directions. By repeating the above operation, a long ceramic joined body having a desired length can be obtained.
  • a material to be joined having a long shape extending in one direction such as a tubular shape or a rod shape can be easily manufactured with a compact facility.
  • the ceramic joined body thus obtained includes, for example, firing furnace members such as heater tubes, thermocouple protection tubes, rotary kiln furnace core tubes, roller hearth kiln rollers, lining materials, liners, stirring blade materials, steel plates It is useful in many applications such as wear-resistant mechanical device members such as transport rollers, and pipe members for transporting chemicals and slurries.
  • firing furnace members such as heater tubes, thermocouple protection tubes, rotary kiln furnace core tubes, roller hearth kiln rollers, lining materials, liners, stirring blade materials, steel plates
  • wear-resistant mechanical device members such as transport rollers, and pipe members for transporting chemicals and slurries.
  • heating the target materials 1a and 1b while rotating the materials 1a and 1b around the axis orthogonal to the joining surfaces of the materials 1a and 1b succeeds.
  • heating may be performed while rotating in other directions.
  • the materials to be bonded 1 a and 1 b are rotated so that the axes of the materials to be bonded 1 a and 1 b are located in a horizontal plane. You may rotate so that the axis
  • Example 1 As a material to be joined, two silicon nitride pipes having an outer diameter of 28 mm, an inner diameter of 22 mm, and a length of 1000 mm were prepared. These two pipes had a fitting structure shown in FIG. Moreover, the inner sleeve shown in FIG. 3 was also used. The inner sleeve was made of silicon nitride, which is the same material as the pipe. As a bonding material, a mixed powder having the composition and average particle size shown in Table 1 below was used. This mixed powder was mixed with ethanol to prepare a slurry, and a green sheet was produced from the slurry by a conventional method.
  • the green sheet was annular, and had an outer diameter of 30 mm, an inner diameter of 20 mm, and a thickness of 80 ⁇ m.
  • a ceramic joined body was manufactured according to the apparatus and process shown in FIGS. 4 (a) to 4 (d). The manufacturing conditions are as shown in Table 2 below. And the evaluation shown in the following Table 3 was performed about the obtained ceramic joined body.
  • Examples 2 to 12 A ceramic joined body was obtained in the same manner as in Example 1 except that the conditions shown in Table 2 were used. The same evaluation as Example 1 was performed about the obtained ceramic joined body. The results are shown in Table 3.
  • Example 13 and 14 As a material to be joined, a silicon nitride block having a length of 30 mm, a width of 20 mm, and a height of 20 mm was used. The 30 mm ⁇ 20 mm surfaces of the block were opposed to each other and heated under the condition that a bonding material was interposed between the surfaces to obtain a ceramic bonded body. Details of the manufacturing conditions are as shown in Table 2. The same evaluation as Example 1 was performed about the obtained ceramic joined body. The results are shown in Table 3.
  • the bonded parts of the ceramics obtained in each example have a high bonding strength close to that of the material to be bonded. It can be seen that the ceramic joined body obtained in each example can maintain the joining strength even after the ceramic joined body is exposed to a high-temperature oxidizing atmosphere.

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Abstract

A bonded ceramic obtained by bonding silicon nitride ceramic adherends to each other through a bonding portion comprising both silicon nitride particles and a silicon oxynitride glass. The bonding portion has a fine structure in which silicon nitride particles and a silicon oxynitride glass are observed. When a cross-section of the bonding portion is examined two-dimensionally, the ratio of the amount of the silicon oxynitride glass to the total amount of the silicon nitride particles and the silicon oxynitride glass, in the field of view, is 97:3 to 60:40. The silicon nitride particles contained in the bonding portion are columnar.

Description

セラミックス接合体及びその製造方法Ceramic bonded body and manufacturing method thereof
 本発明は、セラミックス接合体及びその製造方法に関する。 The present invention relates to a ceramic joined body and a manufacturing method thereof.
 窒化ケイ素系セラミックスからなる被接合材どうしを接合する方法が種々提案されている。例えば(1)数種類の酸化物ガラス組成である低融点接合材を用いる方法、(2)同じ窒化ケイ素組成接合材を用いる場合には、ホットプレス等の物理的圧着を併用する方法、(3)シリコン金属を直接窒化して母材と一体化させるか、又は低融点金属をろう材とした方法が提案されている。 Various methods for joining materials to be joined made of silicon nitride ceramics have been proposed. For example, (1) a method using a low-melting-point bonding material having several kinds of oxide glass compositions, (2) a method using physical pressing such as hot pressing in combination when using the same silicon nitride composition bonding material, (3) There has been proposed a method in which silicon metal is directly nitrided and integrated with a base material, or a low melting point metal is used as a brazing material.
 具体的には、特許文献1には、焼結助剤としてY23及びYb23を含有する窒化ケイ素セラミックスを、Y23、Al23、SiO2及びSi34からなるオキシナイトライドガラスによって接合することが記載されている。 Specifically, Patent Document 1 discloses silicon nitride ceramics containing Y 2 O 3 and Yb 2 O 3 as sintering aids, Y 2 O 3 , Al 2 O 3 , SiO 2 and Si 3 N 4. Joining with an oxynitride glass consisting of
 特許文献2には、円盤状の窒化ケイ素孔あき板の孔部に、窒化ケイ素棒を挿入し、両者のなす円形状の接合部に、CeO2、SrCO3、MgO、Al23、SiO2及びSi34からなる接合剤を塗布した後、1500℃で1時間加熱し処理することが記載されている。 In Patent Document 2, a silicon nitride rod is inserted into a hole of a disk-shaped silicon nitride perforated plate, and CeO 2 , SrCO 3 , MgO, Al 2 O 3 , SiO is inserted into a circular joint formed by the both. After applying a bonding agent composed of 2 and Si 3 N 4 , heating at 1500 ° C. for 1 hour is described.
 特許文献3には、(a)シリコン粒子を含む第1の原料を調製するステップと、(b)第1の原料から成形体を形成するステップと、(c)前記成形体中のシリコン粒子を反応焼結処理するステップと、(d)第1の原料と同様の第2の原料を調製するステップと、(e)第2の原料からスラリーを調製するステップと、(f)後に接合材が形成される被接合部材どうしの隙間に、前記スラリーを注入して、接合材を形成させるステップと、(g)ステップ(c)と同様の反応焼結処理により、前記接合材中のシリコン粒子を反応焼結処理するステップとを有する接合方法が記載されている。 Patent Document 3 includes (a) a step of preparing a first raw material containing silicon particles, (b) a step of forming a molded body from the first raw material, and (c) silicon particles in the molded body. A step of reactive sintering, (d) a step of preparing a second raw material similar to the first raw material, (e) a step of preparing a slurry from the second raw material, and (f) a bonding material after The step of injecting the slurry into the gap between the formed members to be formed to form a bonding material, and (g) the silicon particles in the bonding material by the reaction sintering process similar to step (c). A joining method having a step of reactive sintering is described.
 特許文献4には、ルテチウムを含む窒化ケイ素質焼結体からなる一対の板状の基体の一方又は両方の主面に、アルミニウム、シリコン、イットリウムを含むガラスを主成分とする接合剤を塗布する工程と、一対の前記基体の主面を重ね合わせ、非酸化性雰囲気にて熱処理して接合する工程とを含むセラミックス接合体の製造方法が記載されている。 In Patent Document 4, a bonding agent mainly composed of glass containing aluminum, silicon, and yttrium is applied to one or both main surfaces of a pair of plate-like substrates made of a silicon nitride sintered body containing lutetium. A method for manufacturing a ceramic joined body is described, which includes a step and a step of joining the main surfaces of a pair of bases by heat treatment in a non-oxidizing atmosphere.
特開平5-4876号公報Japanese Patent Laid-Open No. 5-4876 特開平5-270933号公報JP-A-5-270933 特開2010-138038号公報JP 2010-138038 A 特開2010-150048号公報JP 2010-150048 A
 以上のとおり、種々の接合方法が提案されているが、低融点接合材を用いると、接合部位の耐熱性や耐化学反応性が劣りやすい傾向にある。ホットプレス等の物理的圧着を用いる場合、長尺の管状部材を製造するには、特殊な大型製造装置が必要となってしまう。シリコン金属を直接窒化する接合材を用いると、窒化不足で耐熱性に劣るシリコン金属が接合材中に残留しやすい。 As described above, various joining methods have been proposed. However, when a low-melting-point joining material is used, the heat resistance and chemical reactivity resistance of the joining portion tend to be inferior. When physical press bonding such as hot pressing is used, a special large-sized manufacturing apparatus is required to manufacture a long tubular member. When a bonding material that directly nitrides silicon metal is used, silicon metal that is poor in heat resistance due to insufficient nitriding tends to remain in the bonding material.
 したがって本発明の課題は、前述した従来技術が有する種々の欠点を解消し得るセラミックス接合体及びその製造方法を提供することにある。 Therefore, an object of the present invention is to provide a ceramic joined body that can eliminate the various drawbacks of the above-described prior art and a method for manufacturing the same.
 本発明は、窒化ケイ素セラミックス被接合材どうしが、窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位を介して接合されてなるセラミックス接合体であって、
 前記接合部位は、その微細構造組織の二次元断面観察において、窒化ケイ素粒子と酸窒化ケイ素ガラスとの割合が97:3~60:40であり、
 且つ、前記接合部位に含まれる窒化ケイ素粒子が柱状である、セラミックス接合体を提供するものである。
The present invention is a ceramic joined body in which silicon nitride ceramics joined materials are joined via a joining part containing silicon nitride particles and silicon oxynitride glass,
In the two-dimensional cross-sectional observation of the microstructure of the bonding site, the ratio of silicon nitride particles to silicon oxynitride glass is 97: 3 to 60:40,
In addition, the present invention provides a ceramic joined body in which the silicon nitride particles contained in the joining portion are columnar.
 また本発明は、前記のセラミックス接合体の好適な製造方法として、窒化ケイ素セラミックス被接合材どうしが、窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位を介して接合されてなるセラミックス接合体の製造方法であって、
 前記被接合材の間に、加熱後に窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位の形成が可能な組成を有する混合粉末を含む接合材を介在させ、
 前記被接合材どうしの接合部位を加圧した状態下に該接合部位を加熱する、セラミックス接合体の製造方法を提供するものである。
Further, the present invention provides a method for producing a ceramic joined body as described above, wherein a silicon nitride ceramic material to be joined is joined to each other via a joining portion containing silicon nitride particles and silicon oxynitride glass. A method,
Between the materials to be bonded, a bonding material including a mixed powder having a composition capable of forming a bonding portion including silicon nitride particles and silicon oxynitride glass after heating is interposed,
The present invention provides a method for producing a ceramic joined body, in which the joining parts are heated under a state where the joining parts of the materials to be joined are pressurized.
 本発明のセラミックス接合体は、接合部位が、被接合材の強度に近い高接合強度を有するものである。また本発明のセラミックス接合体は、これを高温の酸化性雰囲気下に曝露した後であっても、接合強度を維持し得るものである。 The ceramic bonded body of the present invention has a bonding portion having a high bonding strength close to the strength of the material to be bonded. In addition, the bonded ceramic body of the present invention can maintain bonding strength even after it is exposed to a high-temperature oxidizing atmosphere.
図1は、グリーンシートからなる接合材を用いて被接合材を接合する状態を示す模式図である。FIG. 1 is a schematic diagram illustrating a state in which a material to be bonded is bonded using a bonding material made of a green sheet. 図2(a)及び(b)は、嵌合構造を有する被接合材どうしを接合する状態を示す模式図である。2A and 2B are schematic views showing a state in which the materials to be joined having a fitting structure are joined together. 図2は、インナースリーブを用いて被接合材を接合する状態を示す模式図である。FIG. 2 is a schematic view showing a state in which the materials to be joined are joined using the inner sleeve. 図4(a)ないし(d)は、本発明の製造方法の実施に好適に用いられる装置によって、セラミックス接合体を製造する工程を順次示す模式図である。4 (a) to 4 (d) are schematic views sequentially showing steps for producing a ceramic joined body using an apparatus suitably used for carrying out the production method of the present invention.
 以下本発明を、その好ましい実施形態に基づき説明する。本発明のセラミックス接合体は、窒化ケイ素セラミックス被接合材どうしが、接合部位を介して接合されてなるものである。接合部位を介して接合される2つの被接合材は、目的とするセラミックス接合体の用途に応じて種々の形状をとり得る。例えば直方体や立方体等の六面体、平滑な端面を有する棒状体や管状体などの形状をとり得る。また、被接合材は、中実体及び中空体のいずれであってもよい。尤も、接合すべき2つの被接合材は、互いに面接触する部位を有していることが好ましい。当該部位を有していることで、接合部位におけるセラミックス接合体の強度を十分に高めることができる。 Hereinafter, the present invention will be described based on preferred embodiments thereof. The ceramic joined body of the present invention is formed by joining silicon nitride ceramic materials to be joined to each other through a joining portion. The two materials to be bonded that are bonded via the bonding site can take various shapes depending on the intended use of the ceramic bonded body. For example, it can take the shape of a hexahedron such as a rectangular parallelepiped or a cube, a rod-like body having a smooth end face, a tubular body, or the like. Further, the material to be joined may be either a solid body or a hollow body. However, it is preferable that the two materials to be joined have portions that are in surface contact with each other. By having the said part, the intensity | strength of the ceramic joined body in a joining part can fully be raised.
 接合部位を介して接合される2つの被接合材は、その形状が同一でもよく、あるいは異なっていてもよい。同一の形状の被接合材としては、例えば棒状や管状などの形状が挙げられる。異なる形状の被接合材としては、例えば、背景技術の項で述べたとおり、中央に孔あき部を有する円盤状の形状と、該孔あき部に挿入可能な断面形状を有する棒状の形状のものが挙げられる。 The two materials to be joined that are joined via the joining site may have the same shape or different shapes. Examples of the material to be joined having the same shape include a rod shape and a tubular shape. As the materials to be joined having different shapes, for example, as described in the background section, a disc-like shape having a perforated portion in the center and a rod-like shape having a cross-sectional shape that can be inserted into the perforated portion. Is mentioned.
 接合部位を介して接合される2つの被接合材は、主材料が窒化ケイ素セラミックスである限りにおいて同組成のものでもよく、あるいは少量の第三成分、例えば焼結助剤等を含むことで組成が異なっているものでもよい。 As long as the main material is silicon nitride ceramics, the two materials to be bonded to each other through the bonding site may be of the same composition, or may contain a small amount of a third component such as a sintering aid. May be different.
 本発明のセラミックス接合体は、その具体的な用途に応じて、3つ以上の被接合材が接合されたものであってもよい。その場合には、セラミックス接合体には2箇所以上の接合部位が存在してもよい。 The ceramic joined body of the present invention may be obtained by joining three or more materials to be joined according to the specific application. In that case, the ceramic bonded body may have two or more bonding sites.
 前記のセラミックス接合体は、その接合部位が、母材である被接合材から連続した化学組成及び微細構造組織を有していることが好ましい。また、接合部位と接合部位周囲の被接合材との組成差が少ないことが望ましい。これらの観点から、接合部位は、被接合材の主材料である窒化ケイ素を結晶相の主材料としていることが有利である。接合部位に含まれる窒化ケイ素には、結晶構造の異なる2種の化合物であるα-窒化ケイ素及びβ-窒化ケイ素の少なくとも1種が存在することが知られている。また接合部位には、結晶相として、β-窒化ケイ素中のSiの一部がAlに、Oの一部がNに置き換わった物質であるβ-サイアロンが存在することもある。要するに、接合部位には結晶相として、α-窒化ケイ素、β-窒化ケイ素及びβ-サイアロンの1種以上が存在している。以下に述べる接合部位の説明に関し、特に断らない限り「窒化ケイ素」とは、α-窒化ケイ素、β-窒化ケイ素及びβ-サイアロンの1種以上を意味する。 In the ceramic joined body, it is preferable that the joining portion has a chemical composition and a microstructure that are continuous from a material to be joined that is a base material. In addition, it is desirable that there is little compositional difference between the bonding site and the material to be bonded around the bonding site. From these points of view, it is advantageous that the bonding portion has silicon nitride, which is the main material of the material to be bonded, as the main material of the crystal phase. It is known that at least one of α-silicon nitride and β-silicon nitride, which are two types of compounds having different crystal structures, is present in the silicon nitride contained in the bonding site. In addition, β-sialon, which is a substance in which a part of Si in β-silicon nitride is replaced by Al and a part of O is replaced by N may be present as a crystalline phase at the bonding site. In short, one or more kinds of α-silicon nitride, β-silicon nitride, and β-sialon are present as crystal phases at the bonding site. Regarding the description of the bonding sites described below, unless otherwise specified, “silicon nitride” means one or more of α-silicon nitride, β-silicon nitride, and β-sialon.
 接合部位には少なくともβ-サイアロンの結晶相が含まれていることが、接合部位の強度を高める観点から好ましい。一般に、接合部位に存在するβ-サイアロンの割合は、該部位に存在する窒化ケイ素の割合よりも低くなっている。尤も、接合部位に存在するβ-サイアロンの割合や、窒化ケイ素の割合は、本発明の目的を達成する上において、さほど重要な事項ではない。更に接合部位は、少量の第三成分、例えば焼結助剤等を含んでいてもよい。 It is preferable from the viewpoint of increasing the strength of the bonded portion that the bonded portion contains at least a β-sialon crystal phase. In general, the proportion of β-sialon present in the bonding portion is lower than the proportion of silicon nitride present in the portion. However, the proportion of β-sialon present at the bonding site and the proportion of silicon nitride are not so important in achieving the object of the present invention. Furthermore, the joining site may contain a small amount of a third component such as a sintering aid.
 接合部位がα-窒化ケイ素、β-窒化ケイ素又はβ-サイアロンを含んでいる否かは、例えばエックス線回折により、接合部位に含まれる結晶相を同定することによって判断できる。 Whether or not the bonding site contains α-silicon nitride, β-silicon nitride or β-sialon can be determined by identifying the crystal phase included in the bonding site, for example, by X-ray diffraction.
 接合部位に含まれる窒化ケイ素は難焼結材であるため、ガラス等の酸化物を該接合部位に添加して、窒化ケイ素結晶の粒子間をガラスが埋める構造をもつようにすることが有利である。窒化ケイ素結晶の粒子間に存在するガラスは、SiO2ガラス中のOの一部が、窒化ケイ素結晶の中に取り込まれた酸窒化ケイ素ガラスである。 Since silicon nitride contained in the bonding site is a hardly sintered material, it is advantageous to add an oxide such as glass to the bonding site so that the glass fills the space between the silicon nitride crystal particles. is there. The glass existing between the silicon nitride crystal particles is silicon oxynitride glass in which a part of O in the SiO 2 glass is incorporated into the silicon nitride crystal.
 接合部位は、被接合材の主材料である窒化ケイ素を結晶相の主材料とし、その結晶の粒子間を酸窒化ケイ素ガラスが埋める構造を有していることが望ましい。窒化ケイ素結晶相としては、上述のとおりα-窒化ケイ素、β-窒化ケイ素及びβ-サイアロンのいずれか1つ、又は複数が存在してよい。酸窒化ケイ素ガラス中には、他に、Al、Y、Mg、Zr、Ybなど、窒化ケイ素の焼結助剤として一般に用いられる金属元素が同時に1種又は複数種含まれても良い。窒化ケイ素粒子と酸窒化ケイ素ガラスとの割合は97:3~60:40であることが望ましく、95:5~65:35であることが更に望ましい。両者の割合をこの範囲内に設定することで、緻密な接合部位が得られやすく、また、接合部位の劣化、例えば高温酸化雰囲気で所定時間保持した後の強度が劣化しにくくなる。窒化ケイ素粒子と酸窒化ケイ素ガラスとの割合は、例えば、接合部位を、500~5000倍程度に拡大した走査型電子顕微鏡(SEM)による二次元断面の組織観察像を、画像解析することによって求めることができる。画像解析に、例えば市販の各種コンピュータソフトウエアを用いれば、簡便にこの割合を求めることができる。接合部位を組織観察すると、窒化ケイ素結晶相と酸窒化ケイ素ガラスとの相違は明確に区別できる。 It is desirable that the bonding site has a structure in which silicon nitride, which is the main material of the material to be bonded, is used as the main material of the crystal phase, and silicon oxynitride glass is filled between the crystal particles. As described above, one or more of α-silicon nitride, β-silicon nitride, and β-sialon may be present as the silicon nitride crystal phase. In addition, the silicon oxynitride glass may contain one or more metal elements commonly used as a sintering aid for silicon nitride, such as Al, Y, Mg, Zr, and Yb. The ratio of silicon nitride particles to silicon oxynitride glass is preferably 97: 3 to 60:40, and more preferably 95: 5 to 65:35. By setting the ratio between the two in this range, a dense bonded portion can be easily obtained, and deterioration of the bonded portion, for example, strength after holding for a predetermined time in a high-temperature oxidizing atmosphere is hardly deteriorated. The ratio between the silicon nitride particles and the silicon oxynitride glass is obtained, for example, by image analysis of a two-dimensional cross-sectional structure observation image obtained by a scanning electron microscope (SEM) in which the bonding portion is enlarged by about 500 to 5000 times. be able to. For example, if various commercially available computer software are used for image analysis, this ratio can be easily obtained. By observing the structure of the bonding site, the difference between the silicon nitride crystal phase and the silicon oxynitride glass can be clearly distinguished.
 前記のセラミックス接合体は、その接合部位の微細構造組織にも特徴の一つを有する。詳細には、この接合部位には、該接合部位を顕微鏡観察したときに、結晶粒として柱状粒子と球状粒子とが観察される。先に述べたとおり、接合部位は窒化ケイ素やβ-サイアロンを含んで構成されているところ、この柱状粒子及び球状粒子は、結晶相として窒化ケイ素やβ-サイアロンを含んで構成されている。詳細には、柱状粒子には、結晶相として、主としてβ-窒化ケイ素とβ-サイアロンが含まれている。一方、球状粒子には、結晶相として、主としてα-窒化ケイ素が含まれている。柱状粒子及び球状粒子について本発明者らが検討したところ、β-窒化ケイ素とβ-サイアロンを主として含む柱状粒子は、接合部位の強度向上に大きく寄与していることが判明した。本発明者らが更に検討を推し進めたところ、接合部位における柱状粒子と球状粒子の存在のバランスが、該接合部位の接合強度に大きく影響することが判明した。詳細には、接合部位が柱状粒子及び球状粒子を所定のバランスで含む場合には、接合部位が、被接合材の強度に近い高接合強度を有するものとなる。接合部位に含まれる柱状粒子とは、接合部位の断面の組織観察において、アスペクト比(長軸/短軸)が2以上である粒子を意味する。 The ceramic joined body has one of the characteristics in the microstructure of the joining portion. Specifically, columnar particles and spherical particles are observed as crystal grains at the bonding site when the bonding site is observed with a microscope. As described above, the joining portion is configured to include silicon nitride and β-sialon, and the columnar particles and spherical particles are configured to include silicon nitride and β-sialon as a crystal phase. Specifically, the columnar particles mainly contain β-silicon nitride and β-sialon as crystal phases. On the other hand, the spherical particles mainly contain α-silicon nitride as a crystal phase. As a result of studies by the present inventors on columnar particles and spherical particles, it has been found that the columnar particles mainly containing β-silicon nitride and β-sialon greatly contribute to the improvement of the strength of the bonded portion. When the present inventors further advanced the study, it was found that the balance between the presence of the columnar particles and the spherical particles in the joining site greatly affects the joining strength of the joining site. Specifically, when the joining portion includes columnar particles and spherical particles in a predetermined balance, the joining portion has a high joining strength close to the strength of the material to be joined. The columnar particles contained in the bonding part mean particles having an aspect ratio (major axis / minor axis) of 2 or more in the structure observation of the cross section of the bonding part.
 接合部位に存在するβ-窒化ケイ素及びβ-サイアロンは主として柱状粒子に含まれるところ、柱状粒子のアスペクト比(長軸/短軸)平均は、好ましくは2~30であり、更に好ましくは2.7~20であり、一層好ましくは2.7~15である。このようなアスペクト比を有する柱状粒子を接合部位に存在させることで、該接合部位の接合強度や破壊靭性を容易に高めることができる。柱状粒子の長軸とは、接合部位を顕微鏡観察して得られる柱状粒子の二次元像において、該柱状粒子を横切る線分が最も長くなる当該線分のことをいう。短軸とは、長軸に直交し、かつ柱状粒子を横切る線分が最も短くなる当該成分のことをいう。柱状粒子のアスペクト比は、例えば、接合部位を、500~5000倍程度に拡大した走査型電子顕微鏡(SEM)による二次元断面の組織観察を行い、観察視野内の粒子を任意に選択し、そのアスペクト比を測定する。測定された粒子のうち、アスペクト比が2以上の粒子1000個以上についてアスペクト比の算術平均を求める。 Β-silicon nitride and β-sialon present at the bonding site are mainly contained in the columnar particles, and the average aspect ratio (major axis / minor axis) of the columnar particles is preferably 2 to 30, and more preferably 2. It is 7 to 20, more preferably 2.7 to 15. By causing the columnar particles having such an aspect ratio to exist at the bonding site, the bonding strength and fracture toughness of the bonding site can be easily increased. The long axis of the columnar particles refers to the line segment that has the longest line segment that crosses the columnar particles in a two-dimensional image of the columnar particles obtained by observing the bonding site with a microscope. The short axis refers to the component that is perpendicular to the long axis and has the shortest line segment across the columnar particle. The aspect ratio of the columnar particles can be determined by, for example, performing a two-dimensional cross-sectional structure observation with a scanning electron microscope (SEM) in which the bonding site is enlarged by about 500 to 5,000 times, and arbitrarily selecting particles within the observation field. Measure aspect ratio. Among the measured particles, the arithmetic average of the aspect ratio is obtained for 1000 or more particles having an aspect ratio of 2 or more.
 接合部位に存在する球状粒子は、接合部位を顕微鏡観察して得られる該球状粒子の二次元像が真円であることを要せず、真円とみなせる程度の円形であってもよい。球状粒子が真円でない場合、該球状粒子のアスペクト比(長軸/短軸)は2未満であればよい。 The spherical particles present at the bonding site do not require that the two-dimensional image of the spherical particles obtained by observing the bonding site under a microscope is a perfect circle, but may be a circle that can be regarded as a perfect circle. When the spherical particles are not perfect circles, the aspect ratio (major axis / minor axis) of the spherical particles may be less than 2.
 接合部位における柱状粒子と球状粒子とのバランスは、観察視野における柱状粒子と球状粒子との合計量に対する柱状粒子の割合を好ましくは10~30%、更に好ましくは15~30%に設定することが有利であることが、本発明者らの検討の結果判明した。この割合は、接合部位を、500~5000倍程度に拡大した顕微鏡観察で測定される柱状粒子の二次元像の面積及び球状粒子の二次元像の面積の合計面積を算出し、柱状粒子の面積を、該合計面積で除し、100を乗じて算出される。この割合の算出は、例えば接合部位の顕微鏡観察像を画像解析することで行うことができる。 The balance between the columnar particles and the spherical particles at the bonding site may be set such that the ratio of the columnar particles to the total amount of the columnar particles and the spherical particles in the observation field is preferably 10 to 30%, more preferably 15 to 30%. As a result of the examination by the present inventors, it has been found that this is advantageous. This ratio is calculated by calculating the total area of the area of the two-dimensional image of the columnar particles and the area of the two-dimensional image of the spherical particles, which is measured by microscopic observation of the bonding site at a magnification of about 500 to 5000 times. Is divided by the total area and multiplied by 100. This ratio can be calculated, for example, by image analysis of a microscope observation image of the bonded portion.
 接合部位に存在する窒化ケイ素粒子の大きさは、後述する接合材を構成する混合粉末の粒径に依存し、一般には該混合粉末を構成する粒子の粒径と同等又はそれ以上となるが、特に粒径0.7μm以上のものが、体積基準で15%以上存在することが望ましい。 The size of the silicon nitride particles present at the bonding site depends on the particle size of the mixed powder constituting the bonding material described later, and is generally equal to or larger than the particle size of the particles constituting the mixed powder. In particular, it is desirable that those having a particle diameter of 0.7 μm or more exist in an amount of 15% or more on a volume basis.
 接合部位の厚み、すなわち、接合すべき2つの被接合材間の距離は、50~500μm、特に50~300μm、とりわけ50~100μmとすることが、均一かつ高接合強度の接合部位を形成し得る観点から好ましい。 The thickness of the bonding site, that is, the distance between the two materials to be bonded should be 50 to 500 μm, particularly 50 to 300 μm, especially 50 to 100 μm, so that a uniform and high bonding strength bonding site can be formed. It is preferable from the viewpoint.
 以上の微細構造組織を有する接合部位を形成するには、例えば以下に述べる方法によって本発明のセラミックス接合体を製造すればよい。 In order to form a bonded portion having the above microstructure, the ceramic bonded body of the present invention may be manufactured, for example, by the method described below.
 本発明の製造方法を実施するには、被接合材である2つの窒化ケイ素セラミックスを、それらの接合面どうしが対向するように配置する。また、2つの被接合材間に、加熱後に窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位の形成が可能な組成を有する接合材を介在配置する。2つの被接合材によって挟まれた接合材を加熱することにより、窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位を形成させ、被接合材を接合する。 In order to carry out the manufacturing method of the present invention, two silicon nitride ceramics that are materials to be joined are arranged so that their joint surfaces face each other. Further, a bonding material having a composition capable of forming a bonded portion including silicon nitride particles and silicon oxynitride glass after heating is interposed between the two bonded materials. By heating the bonding material sandwiched between the two materials to be bonded, a bonding site including silicon nitride particles and silicon oxynitride glass is formed, and the materials to be bonded are bonded.
 上述した混合粉末は、窒化ケイ素の粒子を含むことが好ましい。また、酸窒化ケイ素ガラスの生成の観点から、二酸化ケイ素(SiO2)の粒子を含むことも好ましい。また、サイアロンの生成の観点から、アルミナ(Al23)の粒子を含むことも好ましい。混合粉末中に含まれる窒化ケイ素の割合は一般に20~35質量%であることが好ましい。二酸化ケイ素の割合は一般に10~20質量%であることが好ましい。アルミナの割合は一般に5~15質量%であることが好ましい。上述した混合粉末は、これらに加えて、焼結助剤として知られている各種の酸化物、例えばY23、CaO、MgO、ZrO2、Yb23などの粉末を含んでいてもよい。特にYは、窒化ケイ素結晶粒を柱状に伸長させる効果が高い元素である。これらの各種の酸化物は、その合計量として、混合粉末中に一般に35~55質量%含まれることが好ましい。 The mixed powder described above preferably contains silicon nitride particles. From the viewpoint of production of silicon oxynitride glass, we are also preferred to include particles of silicon dioxide (SiO 2). From the viewpoint of production of sialon, it is also preferred to include particles of alumina (Al 2 O 3). The proportion of silicon nitride contained in the mixed powder is generally preferably 20 to 35% by mass. The proportion of silicon dioxide is generally preferably 10 to 20% by mass. The proportion of alumina is generally preferably 5 to 15% by mass. In addition to these, the above-mentioned mixed powder may contain various oxides known as sintering aids, such as Y 2 O 3 , CaO, MgO, ZrO 2 , Yb 2 O 3 and the like. Good. In particular, Y is an element having a high effect of extending silicon nitride crystal grains in a columnar shape. These various oxides are generally preferably contained in the mixed powder in an amount of 35 to 55% by mass as a total amount.
 前記の接合材は、接合を行う高温加熱下での酸窒化ケイ素ガラス形成量に対して、窒化ケイ素粒子が過剰に含有され、窒化ケイ素粒子の一部が酸窒化ケイ素ガラスに固相粒子として残存するような配合とすることが望ましい。酸窒化ケイ素ガラス中に溶解しきらず、残存した窒化ケイ素粒子は、接合時の加熱保持中に、ガラス中で柱状粒子へと変化する。後述するとおり、窒化ケイ素粒子としてα-窒化ケイ素を用いる場合、ほぼすべてがβ-窒化ケイ素又はβ-サイアロンに転化するが、温度が低く保持時間が短い場合には、α-窒化ケイ素として一部が残存することがある。α-窒化ケイ素が残存しても差し支えないが、α-窒化ケイ素は等軸状の粒子形状を有し、結合部位の強度を得るには有利とは言えない。 The bonding material contains silicon nitride particles in excess relative to the amount of silicon oxynitride glass formed under high temperature heating for bonding, and part of the silicon nitride particles remain as solid phase particles in the silicon oxynitride glass. It is desirable to make such a composition. The remaining silicon nitride particles that are not completely dissolved in the silicon oxynitride glass change into columnar particles in the glass during heating and holding during bonding. As will be described later, when α-silicon nitride is used as the silicon nitride particles, almost all is converted to β-silicon nitride or β-sialon, but when the temperature is low and the holding time is short, a part of α-silicon nitride is used. May remain. Although α-silicon nitride may remain, α-silicon nitride has an equiaxed particle shape and is not advantageous for obtaining the strength of the binding site.
 特に、酸窒化ケイ素ガラスの生成の観点及び柱状の窒化ケイ素粒子の生成の観点から、窒素が混合粉末中に25当量%以上、特に25~60当量%、とりわけ35~55当量%含有されていることが望ましい。「当量%」とは、ガラス中のイオンの価数を考慮した表記方法であり、酸窒化ケイ素ガラスの組成を示す場合にしばしば用いられる。ガラス中の陽イオン及び陰イオンのそれぞれについて、原子数と価数との積の合計が100%となるように表記され、合計で200%となる。 In particular, from the viewpoint of forming silicon oxynitride glass and from the viewpoint of generating columnar silicon nitride particles, nitrogen is contained in the mixed powder in an amount of 25 equivalent% or more, particularly 25 to 60 equivalent%, particularly 35 to 55 equivalent%. It is desirable. “Equivalent%” is a notation method that takes into account the valence of ions in the glass, and is often used to indicate the composition of silicon oxynitride glass. For each of the cation and the anion in the glass, the sum of the product of the number of atoms and the valence is expressed as 100%, and the total is 200%.
 特に本製造方法においては、窒化ケイ素としてα-窒化ケイ素を用いることが有利である。先に述べたとおり、窒化ケイ素には、結晶構造の異なる2種の化合物であるα-窒化ケイ素とβ-窒化ケイ素が存在することが知られているところ、この2種類の窒化ケイ素のうち、本発明においてはα-窒化ケイ素を用いることが、先に述べた柱状粒子及び球状粒子の双方を含む微細構造組織からなる接合部位を、容易に形成し得る点から有利である。この理由は、窒化ケイ素としてα-窒化ケイ素を用いると、β-窒化ケイ素を用いた場合に比較して、緻密な構造の接合部位を形成し得るという本発明者らの知見に基づいている。また、窒化ケイ素としてα-窒化ケイ素を用いると、β-窒化ケイ素を用いた場合に比較して、低温で加熱しても高接合強度の接合部位を形成し得るという本発明者らの知見にも基づいている。尤も、本発明において、窒化ケイ素としてβ-窒化ケイ素を用いることは妨げられない。 Particularly in this production method, it is advantageous to use α-silicon nitride as silicon nitride. As described above, it is known that silicon nitride includes α-silicon nitride and β-silicon nitride, which are two types of compounds having different crystal structures. Of these two types of silicon nitride, In the present invention, it is advantageous to use α-silicon nitride because it is possible to easily form the joint portion composed of the microstructure including both the columnar particles and the spherical particles described above. The reason for this is based on the knowledge of the present inventors that when α-silicon nitride is used as silicon nitride, a bonded portion having a dense structure can be formed as compared with the case where β-silicon nitride is used. In addition, the inventors' knowledge that when α-silicon nitride is used as silicon nitride, a bonded portion having a high bonding strength can be formed even when heated at a lower temperature than when β-silicon nitride is used. Is also based. However, in the present invention, it is not hindered to use β-silicon nitride as silicon nitride.
 本製造方法では、接合部位を形成するために用いられる混合粉末として、平均粒径が好ましくは0.4~5.0μm、更に好ましくは0.4~3.0μm、一層好ましくは0.4~2.0μmのものを用いることも有利である。平均粒径がこの範囲の混合粉末を用いると、加熱によって接合部位を形成するときに、該混合粉末の流動性が適度に高くなり、良好な濡れ性を示すようになるので、流動状態の該混合粉末が2つの被接合材間に十分にいきわたり、隙間の発生が低減されることが本発明者らの検討の結果判明した。この平均粒径の範囲よりも小粒径の混合粉末を用いると、該混合粉末の流動性が十分に高くならず、濡れ性の低いものとなってしまう場合がある。また、この平均粒径の範囲よりも大粒径の混合粉末を用いると、接合部位の緻密化が十分でなく、強度が得られないことがある。 In this production method, the average particle size of the mixed powder used to form the bonded site is preferably 0.4 to 5.0 μm, more preferably 0.4 to 3.0 μm, and still more preferably 0.4 to It is also advantageous to use 2.0 μm. When a mixed powder having an average particle size within this range is used, the fluidity of the mixed powder becomes moderately high and exhibits good wettability when forming a bonded portion by heating. As a result of the study by the present inventors, it was found that the mixed powder spreads sufficiently between the two materials to be joined and the generation of gaps was reduced. If a mixed powder having a particle size smaller than the range of the average particle size is used, the fluidity of the mixed powder may not be sufficiently high, and the wettability may be low. Further, when a mixed powder having a particle size larger than the average particle size range is used, the bonded portion may not be sufficiently densified and the strength may not be obtained.
 前記の混合粉末の平均粒径は、例えばレーザー回折式による粒度分布測定器を用いて測定される。前記の混合粉末の平均粒径を上述した範囲に設定するためには、該混合粉末に対してセラミックスボール等を媒体として、ミル等による粉砕などの処理を施せばよい。 The average particle diameter of the mixed powder is measured using, for example, a particle size distribution measuring device by a laser diffraction method. In order to set the average particle diameter of the mixed powder within the above-described range, the mixed powder may be subjected to a treatment such as pulverization by a mill or the like using ceramic balls or the like as a medium.
 接合を行う高温加熱下において、接合部位に含有される余分な酸窒化ケイ素ガラスが被接合材中に拡散される。また、高温加熱によって接合部位に生じたβ-窒化ケイ素又はβ-サイアロンの結晶相は、接合時の高温下での加熱保持によって伸長し、粒成長することで、柱状粒子となることが、接合部位の強度を得る観点から望ましい。接合部位と接合部位周囲の被接合材との組成差を減少させ、接合部位中のβ-窒化ケイ素又はβ-サイアロンの柱状粒子を伸長・粒成長させるには、加熱温度を高くすることや、保持時間を長くすることが有効である。一方で、窒化ケイ素や酸窒化ケイ素ガラスは高温において、分解蒸発が生じ、これは大気圧窒素雰囲気中では1750℃を超えると顕著に起こる。また、接合を行う際に、接合不良を生じにくくし、加えて短時間で接合を完了させるには、被接合材どうしの接合面と直交する方向に機械的に圧力を加え、被接合材と接合材とを密着させることが有効である。 高温 Excess silicon oxynitride glass contained in the bonded portion is diffused into the material to be bonded under high temperature heating for bonding. In addition, the β-silicon nitride or β-sialon crystal phase generated at the bonding site by high-temperature heating is elongated by the heating and holding under high temperature during bonding, and grain growth results in columnar particles. It is desirable from the viewpoint of obtaining the strength of the part. In order to reduce the composition difference between the bonding site and the material to be bonded around the bonding site and to elongate and grow β-silicon nitride or β-sialon columnar particles in the bonding site, the heating temperature can be increased, It is effective to increase the holding time. On the other hand, silicon nitride or silicon oxynitride glass decomposes and evaporates at a high temperature, and this occurs remarkably when the temperature exceeds 1750 ° C. in an atmospheric pressure nitrogen atmosphere. In addition, when performing bonding, in order to make it difficult for defective bonding to occur and to complete the bonding in a short time, mechanical pressure is applied in a direction orthogonal to the bonding surfaces of the bonded materials, It is effective to bring the bonding material into close contact.
 接合部位を形成するために用いられる混合粉末は、例えばこれを水や有機溶媒等の液体と混合して所定濃度のスラリーを調製し、該スラリーを被接合材の接合面に塗布することができる。あるいは、該スラリーからグリーンシートを形成し、該グリーンシートを被接合材の接合面に配置することもできる。作業の容易さや配置の確実性等の観点、及び均一な厚みの接合部位の形成の観点からは、グリーンシートを用いることが有利である。例えば、図1に示すように、同一形状の管状体からなる被接合材1a、1bの端面どうしを対向させて、端面間に混合粉末からなる接合材2を介在させる場合には、接合材2として、円環状のグリーンシートを用いることができる。 The mixed powder used for forming the bonding site can be mixed with a liquid such as water or an organic solvent to prepare a slurry having a predetermined concentration, and the slurry can be applied to the bonding surface of the materials to be bonded. . Alternatively, a green sheet can be formed from the slurry, and the green sheet can be disposed on the joining surface of the materials to be joined. It is advantageous to use a green sheet from the viewpoints of ease of work, reliability of arrangement, and the like, and from the viewpoint of forming a joint portion having a uniform thickness. For example, as shown in FIG. 1, when joining the joining materials 2 made of mixed powder between the end faces with the end faces of the joined materials 1a and 1b made of tubular bodies having the same shape facing each other, the joining material 2 An annular green sheet can be used.
 また、図2(a)及び(b)に示すとおり、管状体や棒状体などの一方向に長い形状を有する2つの被接合材1a、1bを接合する場合、被接合材1a、1bの端面が、該端面どうしを当接させたときに嵌り合って、被接合材1a,1bの軸心の位置が合うようになっていると、両被接合材1a,1bの軸心合わせを容易にできるので好ましい。具体的には、図2(a)に示すとおり、一方の被接合材1aの端面11aをテーパー状にするとともに、他方の被接合材1bの端面11bを、該テーパー形状の傾斜角に対応した傾斜を有するすり鉢状にすることができる。また、図2(b)に示すとおり、一方の被接合材1aの端面11aを、凸部を有する段差状にするとともに、他方の被接合材1bの端面11bを、該凸部の形状に対応した凹部を有する形状にすることができる。なお図2(a)及び(b)においては、接合材の図示は省略されている。 In addition, as shown in FIGS. 2 (a) and 2 (b), when joining two materials to be joined 1a, 1b having a long shape in one direction such as a tubular body or a rod-like body, end faces of the materials to be joined 1a, 1b. However, when the end surfaces are brought into contact with each other so that the positions of the axes of the materials to be bonded 1a and 1b are aligned, it is easy to align the axes of the materials to be bonded 1a and 1b. It is preferable because it is possible. Specifically, as shown in FIG. 2 (a), the end surface 11a of one material to be bonded 1a is tapered, and the end surface 11b of the other material to be bonded 1b corresponds to the inclination angle of the tapered shape. It can be formed into a mortar shape having an inclination. Further, as shown in FIG. 2B, the end surface 11a of one material to be bonded 1a has a stepped shape having a convex portion, and the end surface 11b of the other material to be bonded 1b corresponds to the shape of the convex portion. It can be made into the shape which has the recessed part made. In FIGS. 2A and 2B, illustration of the bonding material is omitted.
 更に、被接合材が管状体や棒状体などの一方向に長い形状を有する場合には、該被接合材の軸心の位置合わせを行うためのインナースリーブを接合部位に介在させることもできる。このようにしても、2つの被接合材の軸心合わせを容易にできるので好ましい。また、インナースリーブには、接合部位の補強材としての役割もある。例えば図3に示すように、2つの被接合材1a,1bが管状体である場合には、該被接合材1a,1bに挿入可能なインナースリーブ3を、両被接合材1a,1bの接合部位に介在させる。インナースリーブ3は、管状又は棒状のものであり、長手方向に沿った略中央域の側面に、突起部3aを有している。突起部3aは、インナースリーブ3の周方向の全域にわたって連続して形成されている。一方、各被接合材1a,1bの端面は、その外周側に位置する第1端面12と、内周側に位置し、かつ第1端面12よりも低い位置にある第2端面13とを有する段差構造になっている。そして、両被接合材1a,1bの第1端面12どうしを当接させると、第1端面12と第2端面13との段差に起因して、被接合材1a,1bの内壁に薄肉部が形成される。その薄肉部に、インナースリーブ3の突起部3aが嵌合することで、2つの被接合材1a,1bの軸心合わせが容易に行われる。なお図3においても、接合材の図示は省略されている。 Furthermore, when the material to be joined has a shape that is long in one direction, such as a tubular body or a rod-like body, an inner sleeve for aligning the axis of the material to be joined can also be interposed at the joining site. Even if it does in this way, since the axial center alignment of two to-be-joined materials can be made easy, it is preferable. The inner sleeve also has a role as a reinforcing material for the joint portion. For example, as shown in FIG. 3, when the two materials to be joined 1a and 1b are tubular bodies, the inner sleeve 3 that can be inserted into the materials to be joined 1a and 1b is joined to both the materials to be joined 1a and 1b. Intervene in the site. The inner sleeve 3 is tubular or rod-shaped, and has a protrusion 3a on the side surface in a substantially central region along the longitudinal direction. The protrusion 3 a is continuously formed over the entire area of the inner sleeve 3 in the circumferential direction. On the other hand, the end surfaces of the materials to be bonded 1a and 1b have a first end surface 12 located on the outer peripheral side and a second end surface 13 located on the inner peripheral side and lower than the first end surface 12. It has a step structure. When the first end surfaces 12 of the materials to be bonded 1a and 1b are brought into contact with each other, a thin portion is formed on the inner walls of the materials to be bonded 1a and 1b due to the step between the first end surface 12 and the second end surface 13. It is formed. By fitting the protruding portion 3a of the inner sleeve 3 into the thin portion, the two materials 1a and 1b can be easily aligned with each other. Also in FIG. 3, illustration of the bonding material is omitted.
 インナースリーブ3の材質は、母材である被接合材の材質と同じでもよく、あるいは異なっていてもよい。またインナースリーブ3は、加熱によって接合部位を形成した後も残存している材質のものでもよく、あるいは加熱によって消失する材質のものでもよい。 The material of the inner sleeve 3 may be the same as or different from the material of the base material. Further, the inner sleeve 3 may be made of a material that remains even after the joining portion is formed by heating, or may be made of a material that disappears by heating.
 なお、図2(a)又は(b)に示す嵌合構造と、図3に示すインナースリーブ3とは、これらを組み合わせて用いることもできる。 It should be noted that the fitting structure shown in FIG. 2A or 2B and the inner sleeve 3 shown in FIG. 3 can be used in combination.
 2つの被接合材1a,1b間に配置された接合材の加熱は、1500~1750℃、特に1550~1730℃、とりわけ1600~1700℃の範囲で行うことが好ましい。この範囲の温度で加熱を行うことで、緻密な構造を有する接合部位を生じさせることができる。加熱雰囲気は、窒素雰囲気とすることが好ましい。 The heating of the bonding material disposed between the two bonded materials 1a and 1b is preferably performed in the range of 1500 to 1750 ° C., particularly 1550 to 1730 ° C., particularly 1600 to 1700 ° C. By heating at a temperature in this range, a bonded portion having a dense structure can be generated. The heating atmosphere is preferably a nitrogen atmosphere.
 加熱時間は、加熱温度が上述の範囲内である場合には、0.5~12時間、とりわけ1~6時間に設定することが好ましい。この時間にわたって加熱を行うことで、酸窒化ケイ素ガラスの拡散により接合部位と接合部位周囲の被接合材との組成差が減少し、接合部位中のβ-窒化ケイ素又はβ-サイアロンの柱状粒子のバランスが所望のものとなり、被接合材により近い組成と組織を有する接合部位を首尾良く形成することができる。 When the heating temperature is within the above range, the heating time is preferably set to 0.5 to 12 hours, particularly 1 to 6 hours. By heating for this time, the compositional difference between the bonded portion and the material to be bonded around the bonded portion decreases due to diffusion of the silicon oxynitride glass, and the β-silicon nitride or β-sialon columnar particles in the bonded portion are reduced. A desired balance is achieved, and a bonded portion having a composition and structure closer to the material to be bonded can be successfully formed.
 加熱中は、当接した状態にある2つの被接合材を、互いに向き合う方向に加圧しておくことが有利である。こうすることで、緻密な構造を有する接合部位を首尾良く形成することができる。この観点から、加圧の圧力は0.01~5MPa、特に0.1~5MPa、とりわけ1~5MPaに設定することが好ましい。 During heating, it is advantageous to pressurize the two materials to be joined that are in contact with each other in a direction facing each other. By doing so, it is possible to successfully form a bonded portion having a dense structure. From this point of view, it is preferable that the pressurizing pressure is set to 0.01 to 5 MPa, particularly 0.1 to 5 MPa, particularly 1 to 5 MPa.
 また、加熱中は、当接した状態にある2つの被接合材を、該被接合材どうしの接合面に直交する軸まわりに同方向に、2つの接合材を同速度で連動させて回転させておくことが好ましい。この操作は、一方向に長い被接合材を、その長手方向に直列に接合する場合に有効である。この回転によって、加熱中における高温下での接合材の重力による下方への垂れが抑制され、接合体の曲がりを防ぐことができる。加えて、接合材が接合部位の下部側に流れ出すことを抑えることができる。この効果を一層顕著なものとする観点から、回転数は1~5rpm、とりわけ3~5rpmという低速にすることが好ましい。回転を行わない場合、接合材が流れ出し、それに起因して接合材の不足によって強度不足という不良を生じることがある。 Further, during heating, the two materials to be joined are rotated in the same direction around the axis perpendicular to the joining surface of the materials to be joined, and the two materials are rotated at the same speed. It is preferable to keep it. This operation is effective when joining materials to be joined that are long in one direction in series in the longitudinal direction. By this rotation, the downward sag due to the gravity of the bonding material at a high temperature during heating is suppressed, and the bending of the bonded body can be prevented. In addition, it can suppress that a joining material flows out to the lower part side of a joined part. From the viewpoint of making this effect even more remarkable, it is preferable to set the rotational speed to a low speed of 1 to 5 rpm, particularly 3 to 5 rpm. If rotation is not performed, the bonding material may flow out, resulting in a defect of insufficient strength due to insufficient bonding material.
 接合材の加熱による接合部位の形成は、1回の加熱のみで完了させてもよく、あるいは必要に応じ2回以上の複数回の加熱を行ってもよい。一般には、1回の加熱のみで満足すべき微細構造組織を有する接合部位を形成することができる。 The formation of the bonding site by heating the bonding material may be completed by only one heating, or may be performed two or more times as necessary. In general, it is possible to form a bonded portion having a microstructure that is satisfactory only by one heating.
 本発明の製造方法によって得られたセラミックス接合体では、接合部位の強度が、母材である被接合材の強度に近いものとなる。詳細には、本発明の製造方法によって得られたセラミックス接合体では、被接合材の四点曲げ強度(JIS-R1601)に対して、接合部位の四点曲げ強度が、好ましくは50%以上、更に好ましくは60%以上、一層好ましくは70%以上になっている。 In the ceramic joined body obtained by the manufacturing method of the present invention, the strength of the joined portion is close to the strength of the workpiece to be joined. Specifically, in the ceramic joined body obtained by the manufacturing method of the present invention, the four-point bending strength of the joined portion is preferably 50% or more with respect to the four-point bending strength (JIS-R1601) of the material to be joined. More preferably, it is 60% or more, more preferably 70% or more.
 更に本発明の製造方法によって得られたセラミックス接合体では、これを900℃の大気雰囲気下に1時間曝露を複数回繰り返した後にも、接合部位において、曝露前と同等の接合強度が維持される。詳細には、曝露後の四点曲げ強度は、曝露前の四点曲げ強度(JIS R1601)に対して、好ましくは70%以上、更に好ましくは80%以上、一層好ましくは85%以上になっている。 Furthermore, in the ceramic joined body obtained by the manufacturing method of the present invention, even when this is repeated in an air atmosphere at 900 ° C. for 1 hour a plurality of times, a joining strength equivalent to that before the exposure is maintained at the joining site. . Specifically, the four-point bending strength after exposure is preferably 70% or more, more preferably 80% or more, and even more preferably 85% or more with respect to the four-point bending strength (JIS R1601) before exposure. Yes.
 図4(a)ないし(d)には、本発明の製造方法の実施に好適に用いられる装置によって、セラミックス接合体を製造する工程が順次模式的に示されている。同図に示す装置は、管状又は棒状の被接合材の接合に特に好適に用いられるものである。 4 (a) to 4 (d) schematically show steps of manufacturing a ceramic joined body in order by an apparatus suitably used for carrying out the manufacturing method of the present invention. The apparatus shown in the figure is particularly preferably used for joining tubular or rod-like materials to be joined.
 まず、図4(a)に示すとおり、接合すべき2つの被接合材1a,1bをそれぞれチャック20によって把持する。チャック20による把持は、2つの被接合材1a,1bが水平に保持されるように行う。各チャック20は、台座21上を摺動自在に該台座21に設置されている。被接合材1a,1bの端面どうしを、所定距離隔てて対向させて、端面間に接合材2を配置したら、一方のチャック20を図4(a)、矢印で示す方向に移動させ、2つの被接合材1a,1bによって接合材2を挟持する。 First, as shown in FIG. 4A, the two materials to be bonded 1a and 1b to be bonded are each gripped by the chuck 20. The gripping by the chuck 20 is performed so that the two workpieces 1a and 1b are held horizontally. Each chuck 20 is slidably mounted on the pedestal 21. When the end surfaces of the materials to be bonded 1a and 1b are opposed to each other at a predetermined distance and the bonding material 2 is disposed between the end surfaces, one chuck 20 is moved in the direction indicated by the arrow in FIG. The bonding material 2 is sandwiched between the bonded materials 1a and 1b.
 被接合材1a,1bが例えば丸管や丸棒などの形状である場合、その外径は5~60mm、特に10~45mm、とりわけ10~30mmであることが、両被接合材1a,1bの確実な接合の点から好ましい。また、被接合材1a,1bが例えば丸管や丸棒などの形状である場合、その長さの上限値が2000mmという長尺物であっても、接合を行うことができる。長さの下限値に制限はなく、短いほど容易に接合を行える。 When the materials 1a and 1b to be joined have a shape such as a round tube or a round bar, the outer diameter thereof is 5 to 60 mm, particularly 10 to 45 mm, especially 10 to 30 mm. It is preferable from the point of reliable joining. In addition, when the materials to be joined 1a and 1b have a shape such as a round tube or a round bar, the joining can be performed even if the upper limit value of the length is 2000 mm. There is no limit to the lower limit of the length, and the shorter the length, the easier the joining.
 次いで図4(b)に示すとおり、チャック20に備えられている回転機構(図示せず)によって被接合材1a,1bをその軸まわりに回転させる。この回転とともに、2つのチャック20を、同図中、矢印で示す方向に移動させて、2つの被接合材1a,1bの当接部位を、加熱炉22内に導入する。このとき、接合材2の脱落が生じないようにするために、被接合材1a,1bをその軸線方向において互いに向き合う方向に加圧しておくことが有利である。 Next, as shown in FIG. 4B, the workpieces 1a and 1b are rotated around the axis by a rotation mechanism (not shown) provided in the chuck 20. Along with this rotation, the two chucks 20 are moved in the direction indicated by the arrows in the drawing, and the contact portions of the two materials to be joined 1 a and 1 b are introduced into the heating furnace 22. At this time, in order to prevent the joining material 2 from falling off, it is advantageous to pressurize the materials to be joined 1a and 1b in directions facing each other in the axial direction.
 2つの被接合材1a,1bの当接部位が加熱炉22内に導入されたら、図4(c)に示すとおり、被接合材1a,1bの回転を継続しつつ、加熱炉22の加熱を開始して、当接部位に位置している接合材2を加熱する。加熱中は、被接合材1a,1bの回転を継続して行う。また加熱中は、被接合材1a,1bをその軸線方向において互いに向き合う方向に加圧しておく。被接合材1a,1bを水平に保持し、その軸まわりに回転させながら加熱することで、所望の微細構造組織を有する接合部位を形成することができる。 When the contact portions of the two materials to be bonded 1a and 1b are introduced into the heating furnace 22, the heating furnace 22 is heated while continuing to rotate the materials to be bonded 1a and 1b as shown in FIG. Starting, the bonding material 2 located at the contact portion is heated. During heating, the materials 1a and 1b are continuously rotated. Further, during heating, the bonded materials 1a and 1b are pressurized in a direction facing each other in the axial direction. By holding the materials to be bonded 1a and 1b horizontally and heating them while rotating around their axes, it is possible to form a bonded portion having a desired microstructure.
 所望の温度及び時間で加熱を行い、目的とする接合部位が形成されたら、加熱炉22による加熱を停止する。しかし、加熱停止後も、被接合材1a,1bの回転は継続しておく。加熱炉22が室温まで冷却されたら、被接合材1a,1bの回転を停止し、チャック20を移動させて、接合部位を加熱炉22外へ取り出す。このようにして、セラミックス接合体が得られる。このセラミックス接合体の長さを増やしたい場合には、図4(d)に示すように、被接合材1cを用意し、被接合材1cの端面と、被接合材1bの端面とを、所定距離隔てて対向させて両端面間に接合材2を配置する。その後は、上述した操作と同様の操作を行い、3つの被接合材1a,1b,1cが、それらの長手方向に沿って直列に接続された長尺のセラミックス接合体が得られる。以上の操作を繰り返し行うことで、所望の長さの長尺のセラミックス接合体が得られる。 ¡Heating is performed at a desired temperature and time, and when the target joining portion is formed, heating by the heating furnace 22 is stopped. However, the rotation of the materials to be joined 1a and 1b is continued even after the heating is stopped. When the heating furnace 22 is cooled to room temperature, the rotation of the materials 1a and 1b to be joined is stopped, the chuck 20 is moved, and the joining portion is taken out of the heating furnace 22. In this way, a ceramic joined body is obtained. When it is desired to increase the length of the ceramic joined body, as shown in FIG. 4 (d), a material to be joined 1c is prepared, and the end surface of the material to be joined 1c and the end surface of the material to be joined 1b are predetermined. The bonding material 2 is disposed between both end faces so as to face each other at a distance. Thereafter, an operation similar to the above-described operation is performed to obtain a long ceramic joined body in which three materials to be joined 1a, 1b, and 1c are connected in series along their longitudinal directions. By repeating the above operation, a long ceramic joined body having a desired length can be obtained.
 以上のとおり、図4に示す方法によれば、管状や棒状などの一方向に延びる長尺状の形状を有する被接合材を、コンパクトな設備によって容易に製造することができる。 As described above, according to the method shown in FIG. 4, a material to be joined having a long shape extending in one direction such as a tubular shape or a rod shape can be easily manufactured with a compact facility.
 このようにして得られたセラミックス接合体は、例えばヒーターチューブや熱電対用保護管、ロータリーキルン用炉芯管、ローラーハースキルン用ローラー等の焼成炉部材や、内張り材、ライナー、撹拌羽根材、鋼板の搬送用ローラー等の耐摩耗性機械装置部材、薬品やスラリー等搬送用パイプ部材等の多くの用途に有用である。 The ceramic joined body thus obtained includes, for example, firing furnace members such as heater tubes, thermocouple protection tubes, rotary kiln furnace core tubes, roller hearth kiln rollers, lining materials, liners, stirring blade materials, steel plates It is useful in many applications such as wear-resistant mechanical device members such as transport rollers, and pipe members for transporting chemicals and slurries.
 以上、本発明をその好ましい実施形態に基づき説明したが、本発明は前記実施形態に制限されない。例えば図4に示す装置においては、被接合材1a,1bどうしの接合面に直交する軸まわりに該被接合材1a,1bを回転させながら加熱を行うことが、目的とするセラミックス接合体を首尾良く形成する観点から有利ではあるが、それ以外の方向に回転させながら加熱を行ってもよい。 As mentioned above, although this invention was demonstrated based on the preferable embodiment, this invention is not restrict | limited to the said embodiment. For example, in the apparatus shown in FIG. 4, heating the target materials 1a and 1b while rotating the materials 1a and 1b around the axis orthogonal to the joining surfaces of the materials 1a and 1b succeeds. Although it is advantageous from the viewpoint of forming well, heating may be performed while rotating in other directions.
 また、図4に示す装置においては、被接合材1a,1bの軸が水平面内に位置するように、該被接合材1a,1bを回転させたが、これに代えて例えば被接合材1a,1bの軸が鉛直面内に位置するように回転を行ってもよい。 Further, in the apparatus shown in FIG. 4, the materials to be bonded 1 a and 1 b are rotated so that the axes of the materials to be bonded 1 a and 1 b are located in a horizontal plane. You may rotate so that the axis | shaft of 1b may be located in a vertical plane.
 以下、実施例により本発明を更に詳細に説明する。しかしながら本発明の範囲は、かかる実施例に制限されない。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention is not limited to such examples.
  〔実施例1〕
 被接合材として、外径28mm、内径22mm、長さ1000mmの窒化ケイ素製パイプを2本用意した。これら2本のパイプは図2(b)に示す嵌合構造を有するものであった。また、図3に示すインナースリーブも用いた。インナースリーブはパイプと同材質である窒化ケイ素製のものであった。接合材として、以下の表1に示す組成及び平均粒径を有する混合粉末を用いた。この混合粉末をエタノールと混合してスラリーを調製し、そのスラリーからグリーンシートを常法によって作製した。グリーンシートは円環状のものであり、外径30mm、内径20mm、厚さ80μmであった。これらを用い、図4(a)ないし(d)に示す装置及び工程にしたがいセラミックス接合体を製造した。製造条件は、以下の表2に示すとおりである。そして、得られたセラミックス接合体について、以下の表3に示す評価を行った。
[Example 1]
As a material to be joined, two silicon nitride pipes having an outer diameter of 28 mm, an inner diameter of 22 mm, and a length of 1000 mm were prepared. These two pipes had a fitting structure shown in FIG. Moreover, the inner sleeve shown in FIG. 3 was also used. The inner sleeve was made of silicon nitride, which is the same material as the pipe. As a bonding material, a mixed powder having the composition and average particle size shown in Table 1 below was used. This mixed powder was mixed with ethanol to prepare a slurry, and a green sheet was produced from the slurry by a conventional method. The green sheet was annular, and had an outer diameter of 30 mm, an inner diameter of 20 mm, and a thickness of 80 μm. Using these, a ceramic joined body was manufactured according to the apparatus and process shown in FIGS. 4 (a) to 4 (d). The manufacturing conditions are as shown in Table 2 below. And the evaluation shown in the following Table 3 was performed about the obtained ceramic joined body.
  〔実施例2ないし実施例12〕
 表2に示す条件を用いる以外は、実施例1と同様にしてセラミックス接合体を得た。得られたセラミックス接合体について、実施例1と同様の評価を行った。その結果を表3に示す。
[Examples 2 to 12]
A ceramic joined body was obtained in the same manner as in Example 1 except that the conditions shown in Table 2 were used. The same evaluation as Example 1 was performed about the obtained ceramic joined body. The results are shown in Table 3.
  〔実施例13及び14〕
 被接合材として、縦30mm、横20mm、高さ20mmの窒化ケイ素製ブロックを用いた。このブロックにおける30mm×20mmの面どうしを対向させて、その面の間に接合材を介在させた状態下に加熱を行い、セラミックス接合体を得た。製造条件の詳細は表2に示すとおりである。得られたセラミックス接合体について、実施例1と同様の評価を行った。その結果を表3に示す。
[Examples 13 and 14]
As a material to be joined, a silicon nitride block having a length of 30 mm, a width of 20 mm, and a height of 20 mm was used. The 30 mm × 20 mm surfaces of the block were opposed to each other and heated under the condition that a bonding material was interposed between the surfaces to obtain a ceramic bonded body. Details of the manufacturing conditions are as shown in Table 2. The same evaluation as Example 1 was performed about the obtained ceramic joined body. The results are shown in Table 3.
  〔比較例1ないし4〕
 表2及び表3に示す条件を用いる以外は、前記の実施例と同様にしてセラミックス接合体を得た。得られたセラミックス接合体について、実施例1と同様の評価を行った。その結果を表3に示す。
[Comparative Examples 1 to 4]
A ceramic joined body was obtained in the same manner as in the above example except that the conditions shown in Tables 2 and 3 were used. The same evaluation as Example 1 was performed about the obtained ceramic joined body. The results are shown in Table 3.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
 以上の表に示す結果から明らかなとおり、各実施例で得られたセラミックス接合体は、接合部位が、被接合材の強度に近い高接合強度を有するものであることが判る。各実施例で得られたセラミックス接合体は、これを高温の酸化性雰囲気下に曝露した後であっても、接合強度を維持し得るものであることが判る。 As is clear from the results shown in the above table, it can be seen that the bonded parts of the ceramics obtained in each example have a high bonding strength close to that of the material to be bonded. It can be seen that the ceramic joined body obtained in each example can maintain the joining strength even after the ceramic joined body is exposed to a high-temperature oxidizing atmosphere.

Claims (9)

  1.  窒化ケイ素セラミックス被接合材どうしが、窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位を介して接合されてなるセラミックス接合体であって、
     前記接合部位は、その微細構造組織の二次元断面観察において、窒化ケイ素粒子と酸窒化ケイ素ガラスとの割合が97:3~60:40であり、
     且つ、前記接合部位に含まれる窒化ケイ素粒子が柱状である、セラミックス接合体。
    A ceramic joined body in which silicon nitride ceramics joined materials are joined via a joining portion containing silicon nitride particles and silicon oxynitride glass,
    In the two-dimensional cross-sectional observation of the microstructure of the bonding site, the ratio of silicon nitride particles to silicon oxynitride glass is 97: 3 to 60:40,
    A ceramic joined body in which the silicon nitride particles contained in the joining portion are columnar.
  2.  前記接合部位における前記柱状粒子のアスペクト比(長軸/短軸)が2~30である請求項1に記載のセラミックス接合体。 The ceramic joined body according to claim 1, wherein an aspect ratio (major axis / minor axis) of the columnar particles in the joining portion is 2 to 30.
  3.  窒化ケイ素セラミックス被接合材どうしが、窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位を介して接合されてなるセラミックス接合体の製造方法であって、
     前記被接合材の間に、加熱後に窒化ケイ素粒子と酸窒化ケイ素ガラスを含む接合部位の形成が可能な組成を有する混合粉末を含む接合材を介在させ、
     前記被接合材どうしの接合部位を加圧した状態下に該接合部位を加熱する、セラミックス接合体の製造方法。
    A method for producing a ceramic joined body in which silicon nitride ceramics joined materials are joined via a joining portion containing silicon nitride particles and silicon oxynitride glass,
    Between the materials to be bonded, a bonding material including a mixed powder having a composition capable of forming a bonding portion including silicon nitride particles and silicon oxynitride glass after heating is interposed,
    A method for manufacturing a ceramic joined body, comprising heating a joining part under a state where the joining parts of the materials to be joined are pressurized.
  4.  前記混合粉末として、平均粒径0.4~5.0μmである窒化ケイ素粒子を含むものを用いる請求項3に記載のセラミックス接合体の製造方法。 4. The method for producing a ceramic joined body according to claim 3, wherein the mixed powder includes silicon nitride particles having an average particle diameter of 0.4 to 5.0 μm.
  5.  前記被接合材どうしの接合面に直交する軸まわりに該被接合材を回転させながら加熱を行い、
     且つ、前記軸が水平面内に位置するように前記被接合材を回転させる請求項3又は4に記載の製造方法。
    Heating while rotating the material to be joined around an axis perpendicular to the joining surfaces of the materials to be joined,
    And the manufacturing method of Claim 3 or 4 which rotates the said to-be-joined material so that the said axis | shaft may be located in a horizontal surface.
  6.  前記接合材として、前記混合粉末を含んで形成されたグリーンシートを用いる請求項3ないし5のいずれか一項に記載の製造方法。 The manufacturing method according to any one of claims 3 to 5, wherein a green sheet including the mixed powder is used as the bonding material.
  7.  前記被接合材が管状又は棒状のものであり、該被接合材の端面間に前記接合材を介在させ、該被接合材の軸まわりに該被接合材を回転させながら加熱を行う請求項3ないし6のいずれか一項に記載の製造方法。 The said to-be-joined material is a pipe | tube or rod-shaped thing, The said joining material is interposed between the end surfaces of this to-be-joined material, and it heats, rotating this to-be-joined material around the axis | shaft of this to-be-joined material. The manufacturing method as described in any one of thru | or 6.
  8.  前記被接合材の端面が、該端面どうしを当接させたときに嵌り合って、該被接合材の軸心の位置が合う形状となっている請求項7に記載の製造方法。 The manufacturing method according to claim 7, wherein the end surfaces of the materials to be bonded are fitted to each other when the end surfaces are brought into contact with each other, and the positions of the axes of the materials to be bonded are matched.
  9.  前記被接合材の軸心の位置合わせを行うためのインナースリーブを前記接合部位に介在させる請求項7に記載の製造方法。 The manufacturing method according to claim 7, wherein an inner sleeve for performing alignment of the axis of the material to be joined is interposed in the joining portion.
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