WO2013026764A3 - Method for the electrical passivation of electromechanical components - Google Patents

Method for the electrical passivation of electromechanical components Download PDF

Info

Publication number
WO2013026764A3
WO2013026764A3 PCT/EP2012/066008 EP2012066008W WO2013026764A3 WO 2013026764 A3 WO2013026764 A3 WO 2013026764A3 EP 2012066008 W EP2012066008 W EP 2012066008W WO 2013026764 A3 WO2013026764 A3 WO 2013026764A3
Authority
WO
WIPO (PCT)
Prior art keywords
electromechanical components
components
electrical passivation
ceramic
layers
Prior art date
Application number
PCT/EP2012/066008
Other languages
German (de)
French (fr)
Other versions
WO2013026764A2 (en
Inventor
Stefan Denneler
Carsten Schuh
Thorsten Steinkopff
Andreas Wolff
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2013026764A2 publication Critical patent/WO2013026764A2/en
Publication of WO2013026764A3 publication Critical patent/WO2013026764A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention relates to a method for the electrical passivation of electromechanical components which comprise at least one electrode (20), a ceramic layer (80) being applied to the surface to be passivated by way of aerosol deposition of ceramic particles. Preferably, the components are piezoelectric multilayer components having passivating ceramic layers of 5 to 20 μm thickness of a material that corresponds to the piezoelectric layers.
PCT/EP2012/066008 2011-08-19 2012-08-16 Method for the electrical passivation of electromechanical components WO2013026764A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011081279.2 2011-08-19
DE102011081279A DE102011081279A1 (en) 2011-08-19 2011-08-19 Process for the electrical passivation of electromechanical components

Publications (2)

Publication Number Publication Date
WO2013026764A2 WO2013026764A2 (en) 2013-02-28
WO2013026764A3 true WO2013026764A3 (en) 2013-05-16

Family

ID=46845701

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/066008 WO2013026764A2 (en) 2011-08-19 2012-08-16 Method for the electrical passivation of electromechanical components

Country Status (2)

Country Link
DE (1) DE102011081279A1 (en)
WO (1) WO2013026764A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3341979A1 (en) * 2015-08-26 2018-07-04 CeramTec GmbH Moisture-repellent protective layer
DE102016119340A1 (en) * 2016-10-11 2018-04-12 Heraeus Sensor Technology Gmbh Method for producing a sensor, sensor and use of a sensor
DE102019206018B4 (en) * 2019-04-26 2022-08-25 Pi Ceramic Gmbh Electromechanical actuator with ceramic insulation, method for its production and method for controlling such an actuator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050179345A1 (en) * 2004-02-18 2005-08-18 Fuji Photo Film Co., Ltd. Piezoelectric element and method of manufacturing the same
EP1808906A2 (en) * 2006-01-12 2007-07-18 Robert Bosch Gmbh Piezo actuator with improved protection against short-circuits
US20070247782A1 (en) * 2006-04-19 2007-10-25 Ngk Insulators, Ltd. Dielectric device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19827574A1 (en) * 1998-06-20 1999-12-23 Philips Patentverwaltung Ceramic passive electronic component useful as a multilayer capacitor, actuator, coil or ferrite ceramic for a video head
DE10234787C1 (en) 2002-06-07 2003-10-30 Pi Ceramic Gmbh Keramische Tec Manufacturing method for monolithic multi-layer piezoceramic actuator with microfaults provided in actuator joints parallel to inner electrodes
US7466067B2 (en) * 2004-11-01 2008-12-16 Brother Kogyo Kabushiki Kaisha Piezoelectric actuator, method for producing piezoelectric actuator, liquid transporting apparatus, and method for producing liquid transporting apparatus
JP4748978B2 (en) * 2004-12-02 2011-08-17 日本碍子株式会社 Piezoelectric / electrostrictive element and manufacturing method thereof
JP5044902B2 (en) * 2005-08-01 2012-10-10 日立電線株式会社 Piezoelectric thin film element
JP5559687B2 (en) * 2008-07-22 2014-07-23 コニカミノルタ株式会社 Manufacturing method of organic piezoelectric material film and manufacturing method of ultrasonic vibrator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050179345A1 (en) * 2004-02-18 2005-08-18 Fuji Photo Film Co., Ltd. Piezoelectric element and method of manufacturing the same
EP1808906A2 (en) * 2006-01-12 2007-07-18 Robert Bosch Gmbh Piezo actuator with improved protection against short-circuits
US20070247782A1 (en) * 2006-04-19 2007-10-25 Ngk Insulators, Ltd. Dielectric device

Also Published As

Publication number Publication date
WO2013026764A2 (en) 2013-02-28
DE102011081279A1 (en) 2013-02-21

Similar Documents

Publication Publication Date Title
WO2010049771A3 (en) Composite material, method for producing a composite material and adhesive or binding material
WO2013040423A3 (en) Abrasive article and method of forming
WO2013083600A3 (en) Novel adhesion promoting agents for metallization of substrate surfaces
WO2012159608A3 (en) Composite structure having an ice protection device, and production method
UA108014C2 (en) Abrasive product and method of its formation
WO2014102131A3 (en) Method for producing a galvanic element and galvanic element
WO2014009927A3 (en) Composition for forming a seed layer
EP2226934A4 (en) Composite piezoelectric substrate manufacturing method
WO2012138671A3 (en) Highly porous ceramic material and method of use and forming same
WO2013032626A3 (en) Methods of forming wear resistant layers on metallic surfaces
MY173532A (en) Semiconductor device and manufacturing method for the semiconductor device
WO2011124205A3 (en) Package for metal-ceramic substrate, and method for packaging such substrates
WO2013078494A3 (en) Tipping paper for a smoking article
WO2012055881A3 (en) Anti-wear coating
MX2016005564A (en) Oxidation barrier layer.
WO2015150071A3 (en) Method for producing a hollow body by cold spraying and mould core suitable for carrying out said method
WO2014080310A3 (en) Capacitive micro-machined transducer and method of manufacturing the same
WO2013056831A3 (en) Drill having a coating
WO2013026764A3 (en) Method for the electrical passivation of electromechanical components
WO2012073009A3 (en) Nanopore devices
PH12014502394A1 (en) Aluminium coated copper bond wire and method of making the same
ZA201105812B (en) Method for the ion beam treatment of a metal layer deposited on a substrate
WO2009098099A3 (en) Multifunctional coating of aluminium pieces
EP3859971A4 (en) Composite substrate, piezoelectric element, and method for manufacturing composite substrate
WO2015090991A3 (en) Method for producing patterned metallic coatings

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12758785

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12758785

Country of ref document: EP

Kind code of ref document: A2