WO2013009050A2

WO2013009050A2 - Metal card and manufacturing method thereof

Info

Publication number: WO2013009050A2
Application number: PCT/KR2012/005388
Authority: WO
Inventors: 서희용; 박영진
Original assignee: (주)바이오스마트
Priority date: 2011-07-08
Filing date: 2012-07-06
Publication date: 2013-01-17
Also published as: WO2013009050A3

Abstract

According to the present invention, the metal card comprises: a metal card sheet material made of a duraluminium material; and an anodized layer formed by anodizing the surface of the metal card sheet material, wherein the anodized layer is characterized in that the composition of an electrolyte when anodizing is determined according to the background color or pattern of the metal card.

Description

【Specification】

[Name of invention]

Metal card and its manufacturing method

Technical Field

The present invention relates to a metal card, and more particularly, to a metal card capable of attaching a contact IC chip having a beautiful outer surface and insulating surface, and a manufacturing method thereof.

Background Art

Credit cards are used for identification purposes, payments, credit grants, etc., and their shapes and designs are becoming more ornate in order to provide artistic value and accessory functions. In addition, the shape and design of the credit card, together with the service, discounts and points of the credit card, is an essential element of the credit card selection. Accordingly, card manufacturers are striving to satisfy customers' various needs by devising cards that differ not only in appearance and design but also in function. Such efforts include Korean Patent Application No. 10-200 No. 0121197 filed with the Korean Intellectual Property Office. The disclosed technology is a technical gist of the present invention comprises a metal sheet body for a metal card and a fixing piece coupled to the metal sheet body, and discloses a card that makes it possible to feel the quality of a card more enhanced by the metal-specific gloss. Doing. 、

However, the metal card was able to provide a gloss unique to the metal, but the surface of the metal pattern was monotonous, so there was a limit to satisfy various needs of customers. In addition, the metal card has a problem that it is impossible to employ a contact IC chip because the insulation is not guaranteed. However, in order to limit the illegal copying of credit cards through the magnetic stripe, it is required to provide a contact IC chip, and thus research on the insulation guarantee in the metal card is continued.

In addition, the metal card is provided with a high strength, for this reason there was a problem that the stable attachment of the rear attachment, such as magnetic film and sign plate is difficult. This is because an adhesive medium, which has strong adhesion to plastic materials, is reduced in metal cards of metal materials. [Detailed Description of the Invention]

[Technical problem]

The present invention provides a metal card sheet material manufactured from a flat plate made of duralumin, a metal card forming a background and a pattern of various colors on the surface of the metal card through anodizing and etching a plurality of times. It aims at providing the manufacturing method of the same.

In addition, another object of the present invention is to anodize the surface of the plate of the Duralumin material, and then apply the adhesive resin between the contact IC chip and the metal card to attach the contact IC chip to the metal card to the metal card and contact IC chip Insulation between the parts and the anodized portion of the anodized portion by laser-sanding the contacted portion of the contact IC chip, the surface is roughened, and then the adhesive resin is applied to increase the adhesion by the adhesive resin to increase the adhesion It is to provide a metal card and a manufacturing method thereof that can be stably attached to the metal card.

In addition, another object of the present invention is to etch a region for attaching the rear attachment member on the flat surface of the durral aluminum material, and to attach the rear attachment member through the adhesive to the etched region, the rear attachment member is It is to provide a metal card and a method of manufacturing the same to be stably attached to the metal card.

In addition, another object of the present invention is to apply a primer after laser sanding the area for attaching the rear attachment to the surface of the flat plate of Duralumin material, and transfer the rear attachment to the region where the primer is applied It is to provide a metal card and a method of manufacturing the same that allows the attachment to be stably attached to the metal card. ᅳ

【Technical Solution】

Metal card according to the present invention for achieving the above object, the metal card sheet material of durral aluminum material; An anodizing layer formed by anodizing the surface of the metal card sheet material, the anodizing layer is characterized in that the composition of the electrolyte solution during anodizing is determined according to the background color or pattern of the metal card.

Advantageous Effects According to the present invention, a metal card sheet material is manufactured from a flat plate made of duralumin, and the background and pattern of various colors are formed on the surface of the metal card through anodizing and etching processes on the metal card sheet material many times. There is an effect that can provide a metal card.

In addition, the present invention is a contact type after anodizing the surface of the plate

Adhesive resin is applied between the IC chip and the metal card to attach the contact IC chip to the metal card to insulate between the metal card and the contact IC chip, and the part where the contact IC chip is in contact with the anodized part. After the surface is roughened by laser sanding, the adhesive resin is coated to increase the adhesive force by the adhesive resin, thereby stably attaching the contact IC chip to the metal card.

In another aspect, the present invention is to etch a region for attaching the rear attachment member to the flat surface of the duralumin material, and to attach the rear attachment member to the etched area via an adhesive, the rear attachment member to the metal card There is an effect to be attached stably.

In addition, another object of the present invention is to apply a primer after laser sanding the area for attaching the rear attachment to the surface of the plate of the Duralumin material, transfer the rear attachment to the region to which the primer is applied, There is an effect that the attachment is stably attached to the metal card.

[Brief Description of Drawings]

1 is a view showing a metal card manufacturing process according to a first embodiment of the present invention.

2 is a view showing a process of forming a background and a pattern on the surface of a metal card according to a first embodiment of the present invention.

3 to 4 illustrate a process of forming a background and a pattern on a surface of a metal card according to a first embodiment of the present invention.

5 is a view showing a process of attaching a contact IC chip to a metal card according to an embodiment of the present invention. 6 and 7 illustrate a process of attaching a contact IC chip to a metal card according to a first preferred embodiment of the present invention.

8 is a view showing a first process of attaching a magnetic film and a sign plate to a metal card according to a first embodiment of the present invention.

9 is a view illustrating a manufacturing process of the magnetic film and the sign attachment according to the first embodiment of the present invention.

10 is a view illustrating a process of attaching a magnetic film and a sign attachment to a metal card according to an embodiment of the present invention.

11 is a view showing a second process of attaching a magnetic film and a sign plate to a metal card according to a first embodiment of the present invention.

12 and 13 illustrate a process of attaching a magnetic film and a sign plate to a metal card according to a first embodiment of the present invention.

14 is a view showing the top and back of the metal card according to the first and second preferred embodiments of the present invention.

15 is a view showing a metal card manufacturing process according to a second embodiment of the present invention.

【Mode for Carrying Out the Invention】

According to the present invention, a metal card sheet is manufactured from a flat plate made of duralumin, and the background and pattern of various colors are formed on the surface of the metal card through a number of anodizing and etching processes. Provide a metal card. In addition, the present invention anodizes the surface of the plate of the Duralumin material, and then apply the adhesive resin between the contact IC chip and the metal card to attach the contact IC chip to the metal card to insulate between the metal card and the contact IC chip. In addition, after the surface is roughened by laser sanding to the contact portion of the anodized portion of the contact IC chip, the adhesive resin is applied to increase the adhesive force by the adhesive resin so that the contact IC chip is the metal. Make sure that it is securely attached to the card.

In addition, the present invention is to attach the rear attachment member to the surface of the flat plate And etching the area for attaching the rear attachment member to the etched region through an adhesive, so that the rear attachment member is stably attached to the metal card.

In addition, another object of the present invention is to apply a primer after laser sanding the area for attaching the rear attachment to the surface of the plate of the Duralumin material, transfer the rear attachment to the region to which the primer is applied, Make sure that the deposit is stably attached to the metal card. A metal card and a metal card manufacturing method according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, which briefly illustrates a metal card manufacturing process according to a first preferred embodiment of the present invention, a metal card sheet material made of duralumin is first manufactured to manufacture a metal card (step 100).

Anodizing and etching a plurality of times on the surface of the metal card sheet material of the duralumin material to form an anodizing layer to form a background color and pattern, and to insulate the surface of the metal card sheet material (102). step).

In step 104, a contact enhancement IC chip attaching region of the upper surface of the metal card sheet material having the background color and pattern is formed and the contact IC chip attaching region is attached to the contact IC chip attaching region.

Thereafter, the magnetic film and the sign plate attaching region are formed among the lower surfaces of the metal card sheet material, and the bottom attaching material such as the magnetic film and the sign plate is attached to the magnetic film and the sign plate attaching region (step 106).

This completes the manufacture of the metal card according to the first preferred embodiment of the present invention. Now, the background and pattern formation process (step 102), contact IC needle attachment process (step 104), magnetic film and sign plate attachment process (step 106) of the metal card manufacturing step are performed. Explain in more detail.

A process of forming a background and a pattern on the surface of a metal card according to a preferred embodiment of the present invention will be described with reference to FIGS.

Figure 3 (a) shows the front and back of the metal card sheet material of the duralumin material, the metal card sheet material of the duralumin material is not only high strength but also good elasticity to return to the original state after the bending of the card Improve dignity

The first anodizing is performed using the first electrolyte to form the background of the surface of the metal card sheet material of the duralumin (step 200). FIG. 3B illustrates that the background color is formed by the first anodizing.

As described above, the portion of the first pattern is etched with respect to the metal card sheet member having the background color formed on the entire surface (step 202). Accordingly, as illustrated in FIG. 3C, the anodizing layers of the portions 300 and 302 formed in the first pattern are etched to expose the duralumin to the outside.

With respect to the metal card sheet material in which the portions 300 and 302 etched in the first pattern are etched, a second anodizing is performed by using a second electrolyte different from the first anodizing time to form the first pattern ( 204 steps), yiettara a first pattern of a different color and the background color is formed only to part (300 302) corresponding to the first pattern as shown in Fig. 4 (d) is ^"by the second anodizing electrolyte.

The portion corresponding to the second pattern is etched with respect to the metal card sheet member on which the first pattern is formed (step 206), and thus the portions 308 and 310 are formed on the second pattern as shown in FIG. Anodizing worms are etched to expose durual aluminum. ^'

The third card anodizing is performed using a third electrolyte different from the first and second crab secondary anodizing to form the second pattern for the metal card sheet material having the portions 308 and 310 corresponding to the second pattern. (step 208), so that in Figure 4 (f) ^'part (308 310) which Daewoong to the second pattern, as shown, only the anodizing by the third electrolyte to the background color and the first color is different from the color of the pattern Second glyphs 312 and 314 are formed. As described above, the present invention repeats anodizing and etching a plurality of times using electrolytes of various compositions to form a beautiful pattern on the surface of the metal card and to perform insulation treatment on the surface of the metal card.

Also, in the above example, only three times of anodizing and two times of etching are illustrated, but a large number of times of anodizing and etching may be performed according to the number of colors of the pattern to be formed on the metal card.

The electrolyte used during anodizing is determined according to the color and texture of the pattern to be formed.

In more detail, the anodizing of the present invention is to anodize a durual aluminum plate after receiving it in a bath containing an electrolyte, and the surface of the durluminum according to the composition and concentration, additive, temperature, voltage, current, and treatment time of the electrolyte solution. The color and texture of the oxide formed on the substrate are formed differently. Accordingly, the present invention allows a pattern of desired color and texture to be formed on the surface of the duralumin plate while changing one or more of the composition and concentration of the electrolyte, additives, temperature, voltage, current, and treatment time. The electrolyte used for anodizing includes sodium hydroxide (SODIUM HYDROXIDE), sulfuric acid (SULFURIC ACID), ANOD AL CLEAN-J, ANOD BLACK MLW (903), ANOD BRIGHT # 800, ANOD SEALING HL-568, etc. may be employed.

Now, the process of attaching the contact IC chip to the surface of the metal card according to the preferred embodiment of the present invention will be described with reference to FIGS.

A predetermined area of the front surface of the patterned metal card sheet material is etched through a plurality of anodizing and etching to form a contact IC chip attaching region (step 400). Referring to FIG. Etching is on the size of the contact IC chip 508 It has a large edge, low edge, and a deep staircase shape, so that the contact IC chip 508 provided with the circuit portion 512 can be limitedly accommodated.

The etched portion 500 described above is anodized to expose anodizing layer 502 since the duralumin is exposed. 6B, an anodizing layer 502 is formed on the upper surface of the etching portion 500.

The anodizing layer 502 is processed to be roughened by laser sanding the edge of the anodizing layer 501 abutting the adhesive surface 514 formed at the back edge of the contact IC chip 508 (step 404), as shown in FIG. As shown in (c), the edge 504 of the anodizing layer 502 abutting the adhesive surface 514 formed at the back edge of the contact IC chip 508 is roughened. ^'

Thereafter, adhesive resins 516 and 518 are applied to the roughened edge 504 and the back edge of the contact IC chip 508 (step 406), and the contact IC chip 508 and the metal card sheet material After laminating, the contact IC chip 508 and the metal card sheet material are bonded to each other by thermocompression bonding (step 408). The present invention described above implements the insulation between the metal card sheet member and the metal contact terminal 510 of the contact IC chip 508 through the anodizing layer 502 and roughly treats the anodizing layer 502. Increase adhesion.

In addition, a primer may be further applied to the roughened portion to increase adhesion between the anodizing layer 502 and the contact IC chip 508.

The present invention proposes a metal U method and a crab 2 method for stably attaching back attachments such as magnetic films and sign plates to metal card sheet materials.

The first method is formed by etching the magnetic film and the sign plate attaching region of the metal card sheet material, and attaching the magnetic film and the sign plate attaching member to the etched region. In the second method, after the laser sanding is performed to roughen the areas of the magnetic film and the sign plate of the metal card sheet by roughening, the back attachments such as the magnetic film and the sign plate are transferred.

A process of attaching the magnetic film and the sign plate according to the first method will be described with reference to FIGS. 8 and 10.

First, the magnetic film and the sign plate attaching member are manufactured (step 600), and the magnetic film and the sign plate attaching member are manufactured as shown in FIG. 9.

As shown in FIG. 9A, the magnetic film 700 and the sign plate 702 are laminated on the upper surface of the base sheet 704, and the release paper 706 and the core are disposed on the lower surface of the base sheet 704. The core paper 708 is laminated. As the base sheet 704, transparent paper, white paper, or colored paper may be employed.

Thereafter, the laminate is thermally compressed as shown in FIG. 9 (b).

Then, as shown in FIG. 9C, the release paper 706 is separated from the base sheet 704, whereby the magnetic film 700 and the sign plate 702 are laminated with the base sheet 704.

Thereafter, the magnetic film 700 and the sign plate 702 are punched out in a large area, and the manufacturing of the magnetic film and the sign plate attaching members 710 and 712 is completed by the biasing. That is, the magnetic film and the sign plate attaching members 710 and 712 are formed by laminating the magnetic film and the sign plates 700 and 702 with the sheet 704 by thermocompression bonding.

After the manufacture of the magnetic film and the sign plate attaching members 710 and 712 as described above is completed, the magnetic film and the sign plate attaching region are formed by etching the bottom surface of the metal card sheet material, which is predetermined (step 602), which is illustrated in FIG. 10. As shown in (a) of the magnetic film and sign plate attaching areas 800 and 802 are etched with respect to the size and thickness of the magnetic film and sign plate attaching members ₇₁₀ and 712, and the magnetic film and sign plate attaching members ₇₁₀ and 712. ) Can be accommodated in the magnetic film and sign plate attachment areas 800, 802.

Increasing the adhesion to the magnetic film and the sign plate attachment area (800,802) For example, the primer 810 may be applied after the laser sanding is roughly treated 808 as shown in FIG. 10 (b), which may be optionally performed.

Then, after applying the adhesive to the magnetic film and the sign plate attachment area (800, 802), the magnetic film and the sign plate attachment (710,712) is inserted, and thermally press-bonded the magnetic film and the sign plate attachment member (710,712) to the metal card sheet material Attach.

And the magnetic film and the sign plate attaching process according to the second method will be described with reference to FIGS.

The magnetic film and the sign plate transfer film are prepared (step 900). The magnetic film and the sign plate transfer film are those in which a magnetic film and a sign plate are attached to a film that can be released after thermocompression bonding.

Thereafter, the surface of the metal card sheet material is roughened by laser sanding a predetermined area, thereby forming a magnetic film and a sign plate attaching area. In step 902, the magnetic film and the sign plate attaching areas 00 and a02 are roughened by laser sanding of the magnetic film and the sign plate attaching areas 00 and a02. A primer is applied to an upper surface of the anodizing layer of the magnetic film and the sign plate attaching area 00, a02 (step 904), and the laser sanded magnetic film and the sign plate attaching area (a00, Primers (a04, a06) are applied to the upper surface of a02).

After the application of the primers (a04, a06), the magnetic film and the sign plate transfer film (a08) are magnified in the magnetic film and the sign plate attaching areas (a00, a02) as shown in FIGS. 13C to 13E. , al0) is added and thermo-compressed.

Thereafter, the release film al4 is removed from the magnetic film and the sign plate transfer film a08 and al0 so that the magnetic film and the sign plate _a 16 and al2 are transferred to the magnetic film and the sign plate attaching area of the lower surface of the metal card sheet material. .

〈Structure of Metal Card〉

The structure of the metal card manufactured in the manner described above in detail with reference to FIG. Explain.

An anodizing layer is formed on the surface of the metal card (bOO), which is repeated anodizing and etching using electrolytic solutions having different compositions over a plurality of times. The background color (b02) and the first and second patterns (b04, b06).

In addition, a contact IC chip attaching region is located on an upper surface of the metal card bOO, and the contact IC chip attaching region is anodized with an etched etching region to have a space for accommodating the contact IC patch and insulated therefrom. A contact IC chip b08 is attached to the insulated contact IC attaching region.

In addition, a magnetic film and a sign plate attaching region are positioned on a lower surface of the metal card bOO, and the magnetic film and the sign plate attaching region are etched regions formed by etching, and a magnetic film and a sign plate are formed on the magnetic film and the sign plate attaching region. Magnetics manufactured by laminating with. The film and sign plate attachments (bl0, bl2) are attached via an adhesive.

In contrast, the magnetic film and the sign plate attaching region positioned on the bottom surface of the metal card bOO are laser sanded to be roughly processed sanding regions, and the magnetic film and the sign plate may be transferred to the magnetic film and the sign plate attaching region. In the first preferred embodiment of the present invention described above, as the back attachment attached to the back of the metal card, only the magnetic film and the sign plate are described, but various back attachments such as hologram films may be added according to the type of the card. Since it is apparent from the present invention that the additional attachment is performed, detailed description thereof will be omitted.

In addition, in the first preferred embodiment of the present invention described above, only the rear attachment is attached to the back of the metal card, but the front attachment may be added according to the type of the card, the front attachment is attached to the rear attachment according to the present invention It may be attached according to the manner, which will be apparent from the present invention, so a detailed description thereof will be omitted. In addition, in the preferred embodiment of the present invention described above, after performing background and pattern formation through anodizing on the surface of the metal card sheet material, an area for inserting and attaching a contact IC chip is etched, and according to the etching Anodizing is again exemplified for the exposed duraluminium.

However, after etching the area for attaching the contact IC chip prior to the background and pattern formation through the anodization for the purpose of simplifying the metal card manufacturing process, the anodized portion is anodized at the time of anodizing for the background and pattern formation. This may be further described through the second embodiment.

Second Embodiment

Referring to FIG. 15 illustrating a metal card manufacturing process according to a second preferred embodiment of the present invention, a metal card sheet material of duralumin is first manufactured to manufacture a metal card (step cOO).

Step-type etching having a width and a depth in which the contact IC chip can be accommodated is performed on the region of the upper surface of the metal card sheet to which the contact IC chip is attached (step c02).

The anodizing layer is formed by performing anodizing and etching a plurality of times on the surface of the metallic card sheet material and the step etched region of the duralumin material to form an anodizing layer to form a background color and a pattern, and on the surface of the metal card sheet material. Perform insulation treatment (step c04).

After the adhesive resin is applied to the etched region of the upper surface of the metal card sheet member having the background color and pattern formed thereon, a contact IC chip is inserted and then thermally compressed to contact the contact IC chip with the metal card sheet member. Attach to the IC attachment area (step c06).

Thereafter, the rear surface of the magnetic film and the sign plate is attached to the magnetic film and the sign plate attachment area of the lower surface of the metal card sheet material (step c08).

This completes the manufacture of the metal card according to the second embodiment of the present invention. Industrial Applicability

The present invention is used in the manufacture of metal cards.

Claims

[Range of request]

[Claim 1]

In metal card,

Metal card sheet material made of duralumin;

And an anodizing layer formed by anodizing the surface of the metal card sheet material.

Anodizing the metal charge card of that composition is determined dwan characteristics for an electrolyte during the anodizing according to the background color or pattern of the ^"metallic card.

[Claim 2]

The method of claim 1,

And a contact type IC chip attached to the first etching area formed on the front surface of the metal card sheet material on which the anodizing layer is formed via an adhesive resin. Etched into a shape that can accommodate the chip,

After the anodization is etched into a shape that can accommodate the contact IC chip, anodized to the etched portion,

The shape is a metal card, characterized in that the edge is low and the center portion is deep staircase shape.

[Claim 3]

The method of claim 2,

The portion of the first etching region where the contact IC chip abuts is roughened by laser sanding, or-The portion of the first etching region that the contact IC chip abuts is roughened by laser sanding, roughened, and then a primer is applied. Metal card characterized in that.

[Claim 4]

The method of claim 1,

And a rear attachment member attached to the second etching region formed on the rear surface of the metal card sheet member on which the anodizing layer is formed by an adhesive.

The second etching region may have a size and a thickness that can accommodate the rear attachment member. Etched to have,

The back attachment member is a metal card, characterized in that at least one of the magnetic film and the base sheet is laminated, the sign plate and the base sheet is laminated, and the hologram film and the base sheet is laminated.

[Claim 5]

The method of claim 4,

The second etching area is,

Laser sanded to rough,

A metal card, characterized in that the primer is applied after the laser sanding is roughened.

[Claim 6]

The method of claim 1,

Further comprising a back attachment transferred to a san ¾ region formed on a rear surface of the metal card sheet member on which the anodizing layer is formed;

The sanding area is a roughened area by laser sanding the area corresponding to the size of the back attachment,

The back attachment is a metal card, characterized in that the transfer film formed by the magnetic film and at least one of the sign plate and hologram film is laminated by the sanding area and then thermally compressed.

[Claim 7]

According to claim 16,

The metal card, characterized in that the primer is further applied to the sanding area.

[Claim 8]

In the metal card manufacturing method,

Manufacturing a metal card sheet material of duralumin;

And anodizing the surface of the metal card sheet with an electrolyte having a composition determined according to the background color and pattern of the metal card.

[Claim 9] According to claim 8,

Etching the first region of the front surface of the metal card sheet material on which the anodizing layer is formed to form a first etching region, anodizing the first etching region, and then applying a resin to the anodized first etching region. Attaching the type IC chip;

The first etching region is a metal card manufacturing method, characterized in that the edge is low to accommodate the contact IC chip, the center portion has a deep step shape.

[Claim 10]

The method of claim 8,

Etching the first area of the front surface of the metal card sheet material before the anodizing to form a roughly U-etched area;

After the anodizing, applying a resin to the first etching region and then attaching a contact IC chip.

The first etching region is a metal card manufacturing method, characterized in that the edge is low and the central portion has a deep step shape to accommodate the contact ic chip.

[Claim 11]

The method according to claim 9 or 10,

And roughening the laser-sanded portion of the first etching region to be in contact with the contact IC chip before attaching the contact IC chip.

[Claim 12]

The method of claim 11,

And applying a primer to the roughened portion of the first etching region before attaching the contact IC chip.

[Claim 13]

The method of claim 8,

Etching a second area of the back surface of the metal card sheet material on which the anodizing layer is formed to form a second etching area; And attaching a rear attachment member to the second etching region through an adhesive.

The second etching region is formed to have a size and a thickness that can accommodate the back attachment member,

The back attachment member is a metal card manufacturing method characterized in that at least one of the magnetic film and the base sheet is laminated, the sign plate and the base sheet is laminated, and the hologram film and the base sheet is laminated.

[Claim 14]

The method of claim 13,

Before the attachment of the rear attachment member,

And laser sanding the second etching region to roughen the second etching region.

[Claim 15]

The method of claim 14,

Before the attachment of the rear attachment member,

And applying a primer to the roughened second etched region.

[Claim 16]

The method of claim 8,

Forming a sanding area by roughening a second area of the back surface of the metal card sheet material on which the anodizing layer is formed through laser sanding;

And laminating a transfer film having a rear attachment formed on the sanding area and then thermally compressing the transfer film to transfer the rear attachment.

The sanding area is based on the size of the back attachment;

The rear attachment is a metal card manufacturing method, characterized in that the magnetic film and the sign plate and holographic film at least one.

[Claim 17]

The method of claim 16,

Before the transfer of the back attachment, ^L in card manufacturing method, characterized by further comprising a; applying a primer to the sanded area.