CN202797261U - Low-cost mobile payment antenna for mobile phone - Google Patents
Low-cost mobile payment antenna for mobile phone Download PDFInfo
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- CN202797261U CN202797261U CN 201220474067 CN201220474067U CN202797261U CN 202797261 U CN202797261 U CN 202797261U CN 201220474067 CN201220474067 CN 201220474067 CN 201220474067 U CN201220474067 U CN 201220474067U CN 202797261 U CN202797261 U CN 202797261U
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- antenna
- mobile phone
- mobile
- solder resist
- mobile payment
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Abstract
The utility model provides a mobile payment antenna for a mobile phone. The antenna comprises a double-faced copper-clad plate. Antenna coils are etched on two surfaces of the double-faced copper-clad plate respectively, and solder resist coatings are coated on two outermost surfaces of the double-faced copper-clad plate respectively. For some models of mobile phones, a traditional mobile payment antenna with a cover film for a mobile phone is too thick and cannot be matched (filled in) with the mobile phones, so that the mobile phones cannot realize a mobile payment function. Compared with the prior art, the antenna is thin and can realize the mobile payment function on more mobile phones.
Description
Technical field
The application relates to the mobile payment technical field, relates in particular a kind of low-cost mobile payment antenna for mobile phone.
Background technology
The mobile payment antenna for mobile phone of industry all is to etch the coil that needs at two outer surfaces of double face copper usually at present, and then top layer and the bottom in double face copper increases respectively two-layer coverlay again.Adopt the purpose of top layer coverlay and bottom coverlay, its purpose mainly is protection etching coil out on double face copper, avoids simultaneously the short circuit in coil and the mobile phone.
Yet, because the thickness of individual layer coverlay itself reaches 27 microns, when increasing coverlay, carrying out when bonding of coverlay and double face copper, also need to increase hot-setting adhesive, this incites somebody to action so that the gross thickness of the finished product antenna that obtains will increase, and the gross thickness of finished product antenna will reach about 0.13mm usually.
Along with the appearance of smart mobile phone, so that mobile phone seems narrower and small in limited space originally.And in so limited space, increase the mobile payment function of mobile phone, when designing, the thickness of existing finished product antenna is still too thick.This just causes many mobile phones can't realize mobile payment function, allows many people that are away from home feel very inconvenient.
The utility model content
In view of this, the application provides a kind of low-cost mobile payment antenna for mobile phone, the thinner thickness of this mobile payment antenna for mobile phone, with low cost, practical and convenient is to realize allowing more mobile phone can finish the function of mobile payment, the live and work that is convenient for people to.
For solving the problems of the technologies described above, the technical scheme that the embodiment of the present application provides is as follows:
A kind of mobile payment antenna for mobile phone comprises: double face copper, wherein:
Two surfaces of described double face copper are etched with respectively aerial coil;
Be coated with respectively the solder resist coating on two outmost surface of described double face copper.
Preferably, this mobile payment antenna for mobile phone that the embodiment of the present application provides, on each face of described double face copper, described solder resist coating covers on the described aerial coil on this face.
Preferably, this mobile payment antenna for mobile phone that the embodiment of the present application provides, on each face of described double face copper, the area of described solder resist coating is more than or equal to the area of this above aerial coil of face.
Preferably, this mobile payment antenna for mobile phone that the embodiment of the present application provides, the thickness of described solder resist coating is at 10 microns~12 microns.
Preferably, this mobile payment antenna for mobile phone that the embodiment of the present application provides, the solder resist coating of two outer surfaces of described double face copper also is provided with silk-screen layer outward.
Compared with prior art, the beneficial effect of this mobile payment antenna for mobile phone of providing of the embodiment of the present application is:
1, for the mobile phone of certain model, if adopt traditional mobile payment antenna for mobile phone that adds coverlay, can feel that antenna is too thick, can't adaptive (packing into) these mobile phones, these mobile phones also just can't be realized mobile payment function.The described antenna that adopts the application to provide, thickness is less, can realize at more mobile phone the function of mobile payment.
2, this technology that adopts the application to provide can also make mobile payment antenna for mobile phone be significantly reduced to this, shortens the process-cycle, and this is owing to the operation that increases coverlay in the prior art, and is complicated more a lot of than applying the solder resist coating.
3, this technology that adopts the application to provide, can also make antenna surface more smooth, strengthen the visual effect of mobile phone, reduced from another side antenna cost, shortened the process-cycle, improved product percent of pass.
Therefore, this mobile payment antenna for mobile phone that the embodiment of the present application provides, can be realized mobile payment easily at simple in structure, handling ease, good visual effect on more mobile phone, be convenient to promote the use of.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is the application's embodiment, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to the accompanying drawing that provides other accompanying drawing.
The front appearance schematic diagram of a kind of payment antenna for mobile that Fig. 1 provides for the embodiment of the present application;
The reverse side schematic appearance of a kind of payment antenna for mobile that Fig. 2 provides for the embodiment of the present application;
The sectional structure schematic diagram of a kind of mobile payment antenna for mobile phone that Fig. 3 provides for the embodiment of the present application;
The sectional structure schematic diagram of the another kind of mobile payment antenna for mobile phone that Fig. 4 provides for the embodiment of the present application;
The schematic flow sheet of a kind of mobile payment antenna for mobile phone manufacture method that Fig. 5 provides for the embodiment of the present application;
The schematic flow sheet of the another kind of mobile payment antenna for mobile phone manufacture method that Fig. 6 provides for the embodiment of the present application;
The schematic flow sheet of another mobile payment antenna for mobile phone manufacture method that Fig. 7 provides for the embodiment of the present application;
The schematic flow sheet of another mobile payment antenna for mobile phone manufacture method that Fig. 8 provides for the embodiment of the present application.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is clearly and completely described.Obviously, described embodiment only is a part of embodiment of the application, rather than whole embodiment.Based on the embodiment among the application, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the application's protection.
Embodiment one:
The front appearance schematic diagram of a kind of payment antenna for mobile that Fig. 1 provides for the embodiment of the present application.
The reverse side schematic appearance of a kind of payment antenna for mobile that Fig. 2 provides for the embodiment of the present application.
The sectional structure schematic diagram of a kind of mobile payment antenna for mobile phone that Fig. 3 provides for the embodiment of the present application.
As shown in Figure 3, this mobile payment antenna for mobile phone comprises: double face copper 1, aerial coil 2 and solder resist coating 3.
In the embodiment of the present application, the dielectric material of double face copper 1 is PI (polyimides), and wherein: the thickness of dielectric material can be 12.5 microns, and 1 two lip-deep copper thicknesses of double face copper can be 12 microns.In the embodiment of the present application, the double face copper of plastic medium is the main body that realizes antenna performance and structure.
In addition, the solder resist color used of solder resist coating 3 is normally green, yellow or colourless etc.The thickness of solder resist so both can guarantee usually at 10 microns~12 microns that the intensity of solder resist coating was enough, can realize again the function of its isolation.
In other embodiment of the application; solder resist coating 3 can also only cover on the aerial coil 2; and when solder resist coating 3 only covers on the aerial coil 2; can also require the area of solder resist coating 3 greater than the area of aerial coil 2, this is in order to guarantee that solder resist coating 3 can form protection to aerial coil fully.
The sectional structure schematic diagram of the another kind of mobile payment antenna for mobile phone that Fig. 4 provides for the embodiment of the present application.
As shown in Figure 2, in other embodiment of the application, for the ease of identification, can also be provided with silk-screen layer 4 in two outmost surface of double face copper 1.
Here silk-screen layer is not the part of necessity of this antenna, but can be used as with some patterns, literal etc. the sign of this antenna.Silk-screen layer 4 only is sprayed on solder resist coating 3 outer surfaces, and color is white normally, also other color, as long as be different from solder resist color, be convenient to identification.
Compared with prior art, the beneficial effect of this mobile payment antenna for mobile phone of providing of the embodiment of the present application is:
1, for the mobile phone of certain model, if adopt traditional mobile payment antenna for mobile phone that adds coverlay, can feel that antenna is too thick, can't adaptive (packing into) these mobile phones, these mobile phones also just can't be realized mobile payment function.The described antenna that adopts the application to provide, thickness is less, can realize at more mobile phone the function of mobile payment.
2, this technology that adopts the application to provide can also make mobile payment antenna for mobile phone be significantly reduced to this, shortens the process-cycle, and this is owing to the operation that increases coverlay in the prior art, and is complicated more a lot of than applying the solder resist coating.
3, this technology that adopts the application to provide, can also make antenna surface more smooth, strengthen the visual effect of mobile phone, reduced from another side antenna cost, shortened the process-cycle, improved product percent of pass.
Therefore, this mobile payment antenna for mobile phone that the embodiment of the present application provides, can be realized mobile payment easily at simple in structure, handling ease, good visual effect on more mobile phone, be convenient to promote the use of.
Embodiment two:
The schematic flow sheet of a kind of mobile payment antenna for mobile phone manufacture method that Fig. 5 provides for the embodiment of the present application.
As shown in Figure 5, this mobile payment antenna for mobile phone manufacture method may further comprise the steps:
S100: at two surfaces difference etching aerial coils of double face copper.
In the embodiment of the present application, the dielectric material of double face copper 1 is PI (polyimides), and wherein: the thickness of dielectric material can be 12.5 microns, and 1 two lip-deep copper thicknesses of double face copper can be 12 microns.In the embodiment of the present application, the double face copper of plastic medium is the main body that realizes antenna performance and structure.
S200: two of described double face copper surfaces apply respectively the solder resist coating after etching.
In addition, the solder resist color used of solder resist coating 3 is normally green, yellow or colourless etc.The thickness of solder resist so both can guarantee usually at 10 microns~12 microns that the intensity of solder resist coating was enough, can realize again the function of its isolation.
In other embodiment of the application; solder resist coating 3 can also only cover on the aerial coil 2; and when solder resist coating 3 only covers on the aerial coil 2; can also require the area of solder resist coating 3 greater than the area of aerial coil 2, this is in order to guarantee that solder resist coating 3 can form protection to aerial coil fully.As shown in Figure 6, that is, step S200 specifically can comprise:
S201: the aerial coil that two surfaces of described double face copper form after covering described etching applies the solder resist coating, and the area of the described solder resist coating that applies is more than or equal to the area of described aerial coil.
In addition, in other embodiment of the application, after step S200 applied the solder resist coating, for the ease of identification, as shown in Figure 7, the method can also may further comprise the steps:
S300: the outer surface of the described double face copper after coating carries out the silk-screen operation, forms silk-screen layer at two outermosts of described double face copper.
Here silk-screen layer is not the part of necessity of this antenna, but can be used as with some patterns, literal etc. the sign of this antenna.Silk-screen layer 4 only is sprayed on solder resist coating 3 outer surfaces, and color is white normally, also other color, as long as be different from solder resist color, be convenient to identification.
In addition, after step S201 applied the solder resist coating, as shown in Figure 8, the method can also may further comprise the steps:
S400: on the outer surface of described double face copper after the coating, the part of uncoated solder resist coating carries out the silk-screen operation, the part of uncoated solder resist coating forms silk-screen layer on two outermosts of described double face copper.
Which kind of silk-screen mode no matter, its purpose all is for the ease of this mobile payment antenna for mobile phone is identified.
Should be understood that simultaneously the application's scope of asking for protection is illustrated in the appended claims, and can not be with the foregoing description of specification as restriction, every apparent modification within the application's aim is also due within the application's the protection range.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the application.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can in the situation of the spirit or scope that do not break away from the application, realize in other embodiments.Therefore, the application will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (5)
1. a mobile payment antenna for mobile phone is characterized in that, comprising: double face copper, wherein:
Two surfaces of described double face copper are etched with respectively aerial coil;
Be coated with respectively the solder resist coating on two outmost surface of described double face copper.
2. mobile payment antenna for mobile phone according to claim 1 is characterized in that, on each face of described double face copper, described solder resist coating covers on the described aerial coil on this face.
3. mobile payment antenna for mobile phone according to claim 2 is characterized in that, on each face of described double face copper, the area of described solder resist coating is more than or equal to the area of this above aerial coil of face.
4. mobile payment antenna for mobile phone according to claim 1 is characterized in that, the thickness of described solder resist coating is at 10 microns~12 microns.
5. each described mobile payment antenna for mobile phone is characterized in that according to claim 1-4, and the solder resist coating of two outer surfaces of described double face copper also is provided with silk-screen layer outward.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201220474067 CN202797261U (en) | 2012-09-18 | 2012-09-18 | Low-cost mobile payment antenna for mobile phone |
Applications Claiming Priority (1)
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CN 201220474067 CN202797261U (en) | 2012-09-18 | 2012-09-18 | Low-cost mobile payment antenna for mobile phone |
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CN202797261U true CN202797261U (en) | 2013-03-13 |
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CN 201220474067 Expired - Fee Related CN202797261U (en) | 2012-09-18 | 2012-09-18 | Low-cost mobile payment antenna for mobile phone |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109615055A (en) * | 2018-12-13 | 2019-04-12 | 捷德(中国)信息科技有限公司 | Identification card and its manufacturing method |
-
2012
- 2012-09-18 CN CN 201220474067 patent/CN202797261U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109615055A (en) * | 2018-12-13 | 2019-04-12 | 捷德(中国)信息科技有限公司 | Identification card and its manufacturing method |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20160918 |