WO2013008481A1

WO2013008481A1 - Panel heating device

Info

Publication number: WO2013008481A1
Application number: PCT/JP2012/051918
Authority: WO
Inventors: 上田　滋之
Original assignee: パナソニック株式会社
Priority date: 2011-07-13
Filing date: 2012-01-30
Publication date: 2013-01-17
Also published as: JP5793664B2; JP2013019645A

Abstract

A panel heating device (1) comprising a pipe (3) through which a heating medium flows, a panel (2) having a groove (20) for pipe arrangement wherein said pipe is arranged formed in the upper surface thereof, and a surface heat equalizing plate (4) made from metal and arranged on the upper surface of said panel; and characterized by a plurality of high heat conducting sheets (5) comprising a material of higher heat conductivity than the surface heat equalizing plate being arranged between the panel and the surface heat equalizing plate, and the high heat conducting sheets having at least one end thereof being connected to the pipe and being arranged in a direction orthogonal to the pipe arrangement direction.

Description

Panel heating device

The present invention relates to a panel heating device.

Conventionally, the upper surface of the panel has been provided with a groove for arranging a pipe through which a heat medium such as hot water, antifreeze, gas, and steam circulates, and the pipe is provided in the groove, and a heat equalizing plate is provided so as to cover the upper surface of the panel. The provided panel heating apparatus is known. According to this, the heat of the heat medium passing through the pipe is transmitted to the soaking plate, and the floor surface can be uniformly warmed through the soaking plate.
In such a panel heating apparatus, the heat of the heat medium can be efficiently transmitted to the floor surface, but there is a problem.

As such a panel heating apparatus, for example, there is Patent Document 1 below. Here, a groove (concave groove) for pipe placement is provided in the panel (base material), a pipe is placed in the concave groove in a state where a graphite sheet is laminated below the pipe, and the surface is soaked on the upper surface of the panel. A floor heating panel provided with a plate (metal foil) has been proposed.
According to this structure, since the graphite sheet having a high thermal conductivity is present, heat can be more efficiently transferred to the floor surface.

JP 2010-38470 A

However, as disclosed in Patent Document 1 and FIG. 1 described above, pipes arranged in a meandering manner on the panel surface have a long pipe route, so the amount of pipe material used is large, A large amount of heat medium is required. Moreover, it may be time-consuming to arrange the pipes in a meandering manner on the panel.

Accordingly, there is a need for the development of a panel heating device that can perform efficient heating with a reduced amount of pipes and a simplified pipe arrangement.
There is also a need for the development of a panel heating device that effectively uses a high thermal conductive sheet such as a graphite sheet.

The present invention has been made in view of the above points, and an object of the present invention is to provide a panel heating device that can efficiently transfer heat of a heat medium to a floor surface.

In order to achieve the above object, a panel heating apparatus according to the present invention includes a pipe through which a heat medium flows, a panel in which a pipe disposition groove in which the pipe is disposed is formed on an upper surface, and an upper surface of the panel. A panel heating device provided with a metal surface soaking plate laid on the surface, and made of a material having a higher thermal conductivity than the surface soaking plate between the panel and the surface soaking plate. A plurality of high heat conductive sheets are arranged, and at least one end of the high heat conductive sheet is connected to the pipe, and is arranged in a direction orthogonal to the arrangement direction of the pipe.
In the present invention, the panel may have a substantially square shape, and the pipe disposition groove may be formed along the four peripheral portions of the panel.
Moreover, in this invention, the both ends of the said high heat conductive sheet may be connected to both of the pipes arrange | positioned at the both sides of the four peripheral parts of the said panel.
Furthermore, in the present invention, only one end of the high thermal conductive sheet may be alternately connected to the pipes disposed on both sides of the four peripheral portions of the panel.
Furthermore, in this invention, the said high heat conductive sheet may be connected only to the pipe arrange | positioned in one side part of the four peripheral parts of the said panel.

The panel heating device according to the present invention can efficiently transfer the heat of the heat medium to the floor surface.

(A) It is a typical top view which shows the panel heating apparatus which concerns on one Embodiment of this invention. (B) is an exploded sectional view taken along line XX in (a). It is a typical top view which shows other embodiment of the panel heating apparatus. It is a typical top view which shows other embodiment of the panel heating apparatus.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 3 are conceptual diagrams for explaining the panel heating device 1 according to the present embodiment. FIG. 1 (a) shows an embodiment in which both ends 50 a and 50 b of the high thermal conductive sheet 5 are connected to the pipes 3 disposed on both

side portions

21 and 23 of the panel 2. FIG. 1B is an exploded cross-sectional view taken along the line XX in FIG. 1A and illustrates the configuration of each member of the panel heating device 1. FIG. 2 shows an embodiment in which only one end 50 a of the high thermal conductive sheet 5 is alternately connected to the pipes 3 disposed on the

side portions

21 and 23 of the panel 2. FIG. 3 shows an embodiment in which the high thermal conductive sheet 5 is connected only to the pipe 3 disposed on one side 23 of the panel 2.
The panel heating apparatus 1 includes a pipe 3 through which a heat medium flows, a panel 2 in which a pipe disposition groove 20 in which the pipe 3 is disposed is formed on an upper surface, and a metal surface leveling laid on the upper surface of the panel 2. And a hot plate 4. Between the panel 2 and the surface soaking plate 4, a plurality of high heat conducting sheets 5 made of a material having a higher thermal conductivity than the surface soaking plate 4 are disposed, and the high heat conducting sheet 5 has at least one end (50a). Alternatively, 50b) is connected to the pipe 3 and arranged in a direction orthogonal to the arrangement direction of the pipe 3.

This will be described in detail below.
First, the whole structure of the panel heating apparatus 1 is demonstrated. As shown in FIG.1 (b), the panel heating apparatus 1 has the main body comprised by the panel 2, and the upper surface of the panel 2 is covered with the surface soaking plate 4. As shown in FIG. Although the panel heating apparatus 1 is not particularly limited, the example shown in the figure is a separation type in which the panel 2 as a main body and the floor finishing material 6 are separated, and the panel heating apparatus 1 is a floor base material (not shown) or the like. The floor finishing material 6 is laid on the upper surface of the panel heating device 1. Thus, the floor finishing material 6 laid on the upper surface of the surface soaking plate 4 can be selected according to the user's preference by adopting a separation type configuration in which the panel 2 and the floor finishing material 6 are separated. .
The floor finish 6 is not particularly limited, and for example, a wood floor, a floor heating tatami mat, a cushion floor, a carpet, a cork tile, or the like is used.

The surface soaking plate 4 is a metal heat transfer member, and is composed of a metal having high thermal conductivity such as aluminum, copper, iron, etc., and can be a thin plate or sheet. The thickness of the surface soaking plate 4 can be about 0.1 mm to 0.2 mm, for example, in the case of an aluminum plate. Since it is made of a material having a high thermal conductivity, the heat supplied from the heat medium can be efficiently and uniformly transferred to the floor finish 6 side. The surface soaking plate 4 is attached to the surface of the panel 2. Examples of the attaching method include a method using an acrylic pressure-sensitive adhesive, a method using a double-sided tape, and a method using an adhesive. There is no particular limitation.

As shown in FIG. 1A, the panel 2 is formed in a substantially rectangular shape. In the figure, two side portions in the longitudinal direction of the four

peripheral portions

21, 22, 23, 24 of the panel 2 are formed. 21 and 23, and two sides in the width direction are 22 and 24. The panel 2 is preferably made of a material having a heat insulating property so that the heat of the heat medium flowing through the pipe 3 does not escape to the floor base material side. For example, what consists of foaming urethane, foaming styrene, etc. is used, and the surface of the floor finishing material 6 is efficiently warmed quickly by the heat | fever from a heat medium by this. A pipe disposing groove 20 is formed on the upper surface of the panel 2, and the pipe 3 is fitted into this groove. The width of the pipe disposing groove 20 is preferably set to be the same as or slightly smaller than the outer diameter of the pipe 3, and the pipe 3 is disengaged from the pipe disposing groove 20 by this diameter dimension setting. It is held firmly. Examples of the method for forming the pipe disposing groove 20 include a method using a press and a method using a router, but are not particularly limited.

The pipe 3 may be made of a hollow tubular body, and is preferably flexible so that it can be easily arranged according to the shape of the pipe arranging groove 20 of the panel 2. The material of the pipe 3 is desirably a material that does not corrode and can withstand the heat of the heat medium to be used. For example, a resin pipe or a copper pipe made of crosslinked polyethylene is used. The diameter of the pipe 3 is not particularly limited, but, for example, 7.0 mm to 7.4 mm is used.

As the heat medium, for example, warm water, antifreeze, gas, steam or the like is used. The heat medium is heated to about 40 ° C. to 60 ° C. by a heat source device 7 provided outside the room, and the heated heat medium is sent into the pipe 3 in one direction by a pump (not shown) or the like, and the panel 2 It is configured to circulate inside. That is, as shown in FIG. 1A, the heat medium is sent from the heat source unit 7 in the direction d1, flows through the panel 2, and then returns to the heat source unit 7 (the direction indicated by d2). It is sent to and circulates. Since the pipe 3 is at least close to the surface soaking plate 4 covering the upper surface of the pipe 3, the heat of the heat medium is transferred to the surface soaking plate 4 in the process of moving the heat medium in the pipe 3. Then, the floor finish 6 is heated by the heat, thereby heating the room.

Next, the arrangement | positioning style to the panel 2 of the pipe 3 is demonstrated.
As shown in FIG. 1A, a pipe disposing groove 20 is formed along the four

peripheral portions

21, 22, 23, 24 of the panel 2, and the pipe 3 is disposed in the groove. The location where the groove 20 for pipe arrangement | positioning is formed should just be several cm inside from each four

peripheral part

21, 22, 23, 24 of the panel 2, for example.
According to this configuration, the pipe 3 can be configured using only the members of the straight portion and the 90-degree bent portion, and the path length of the entire pipe 3 can be shortened. Can be reduced, and the number of processing steps can be reduced. Moreover, since the structure of the pipe 3 is simplified in this way, the work of arranging the pipe 3 on the panel 2 can be simplified. Furthermore, the amount of heat medium used can be reduced, and the apparatus for circulating the heat medium can be reduced in size.

Next, the configuration of the high thermal conductive sheet 5 will be described.
As shown in FIGS. 1A and 1B, a plurality of high thermal conductive sheets 5 are fixed so as to be in close contact between the panel 2 and the surface soaking plate 4 and disposed on the upper surface of the panel 2. Is done. The high thermal conductive sheet 5 is formed in a substantially band shape, and is made of a material having a higher thermal conductivity than the surface soaking plate 4. For example, graphite (graphite) or the like is used as the material. The thermal conductivity is preferably 400 W / mK or more in the horizontal plane direction and 5 W / mK or more in the thickness direction. When the heat conductivity in the horizontal plane direction is equal to or higher than a predetermined value, after the high heat conductive sheet 5 receives heat from the heat medium, the heat is quickly transmitted in the horizontal direction in the high heat conductive sheet 5 and the high heat conductive sheet 5 Heat is transferred to almost the entire area. Further, since the heat conductivity in the thickness direction is equal to or higher than a predetermined value, heat from the heat medium in the pipe 3 is quickly transmitted to the high heat conductive sheet 5 through the contact portion between the pipe 3 and the high heat conductive sheet 5. It is done. Further, the thickness of the high thermal conductive sheet 5 is not limited, but, for example, a sheet having a thickness of 10 μm to 300 μm can be used.

Next, the arrangement | positioning style of the high heat conductive sheet 5 is demonstrated.
In FIG. 1 (a), both ends 50a, 50b of the high thermal conductive sheet 5 are connected to the pipes 3 disposed on both

side portions

21, 23 of the four

peripheral portions

21, 22, 23, 24, respectively. In this state, four high thermal conductive sheets 5 are disposed.
Specifically, as shown in FIG. 1 (b), both ends 50a, 50b of the high heat conductive sheet 5 are connected to the pipe 3 in a state of being wound around the pipe 3 from the surface heat-uniforming plate 4 side of the pipe 3, The high heat conductive sheet 5 is disposed in a direction orthogonal to the direction in which the pipe 3 is disposed. In other words, the

contact portions

51a and 51b of the both ends 50a and 50b of the high thermal conductive sheet 5 with the pipe surface 31 are wound around the pipe 3 so as to be in contact with portions corresponding to about three-fourths of the circumferential direction of the pipe surface 31, It arrange | positions in the state which contacted both between the pipe 3 and the groove | channel 20 for pipe arrangement | positioning.

In addition, the connection mode of the high heat conductive sheet 5 and the pipe 3 is not limited to the example in the figure, and the heat from the heat medium flowing through the pipe 3 passes through the contact portion between the two because they are in contact with each other. Any structure may be used as long as heat is transferred to the high thermal conductive sheet 5.
For example, as another mode, the high heat conductive sheet 5 is first arranged on the surface of the panel 2 so that both ends 50a, 50b of the high heat conductive sheet 5 are located in the pipe arranging groove 20, and in that state You may make it arrange | position the pipe 3 to the groove | channel 20 for pipe arrangement | positioning. In this way, the high heat conductive sheet 5 is sandwiched between the pipe 3 and the surface of the pipe disposing groove 20 so that the three members come into close contact with each other, so that the heat from the pipe 3 is applied to the contact portion between the pipe 3 and the high heat conductive sheet 5. Thus, the heat is transferred to the high thermal conductive sheet 5.
1B shows an example in which about three quarters of the circumferential direction of the pipe surface 31 is in contact with the high thermal conductive sheet 5 as described above, but the area of the contact portion is limited to this. Instead, for example, about a quarter or about half of the pipe surface 31 may be in contact.

Next, the mechanism of heat conduction in the panel heating device 1 will be described.
In FIG. 1A, the flow of the heat medium is indicated by thick arrows d1 and d2, the heat conduction direction from the pipe 3 to the periphery thereof is t1, and the heat conduction direction from the pipe 3 to the high heat conduction sheet 5 is t2. The heat conduction direction from the high heat conduction sheet 5 to the periphery thereof is indicated by t3. This will be specifically described below.
First, in the process in which a high-temperature heat medium of about 40 ° C. to 60 ° C. flows into the panel 2 from the heat source unit 7 and flows through the pipe 3, the heat of the heat medium from the pipe 3 is near the surface where the pipe 3 is disposed. Heat is transferred to the soaking plate 4 (the heat conduction direction is indicated by t1).
Furthermore, the heat of the heat medium is transferred from the pipe 3 into the high heat conductive sheet 5 through the connection portion of the high heat conductive sheet 5 with the pipe 3 (both ends 50a and 50b of the high heat conductive sheet 5). indicated by t2). At this time, heat is transferred to the vicinity of the central portion of the high heat conductive sheet 5 that is away from the connection portion with the pipe 3, and the heat spreads quickly throughout the high heat conductive sheet 5.
Furthermore, heat is transferred from the high heat conductive sheet 5 that receives heat from the pipe 3 to the surface heat equalizing plate 4 in the vicinity of the location of the pipe 3 (the heat conduction direction is indicated by t3).

According to the above configuration, the surface soaking plate 4 having high thermal conductivity is in contact with the pipe 3 or the high heat conducting sheet 5, so that the heat from the pipe 3 and the high heat conducting sheet 5 is transferred to the surface soaking plate 4. Heat is transferred, and the surface soaking plate 4 is warmed almost uniformly and quickly.
In addition, since the high heat conductive sheet 5 is made of a material having a higher thermal conductivity than the surface soaking plate 4, heat from the heat medium flowing through the pipe 3 is quickly transferred to the high heat conductive sheet 5. And the heat from the high heat conductive sheet 5 is transferred to the surface heat-uniforming plate 4 in the vicinity of the location where the high heat conductive sheet 5 is disposed, and the contacting floor finish 6 can be warmed quickly and uniformly.
Further, the both ends 50a and 50b of the high thermal conductive sheet 5 are connected to the pipes 3 disposed on both

side portions

21 and 23, and are disposed in a direction orthogonal to the direction in which the pipes 3 are disposed. . Therefore, heat is also transferred from the pipe 3 to the place where the pipe 3 is not disposed via the high heat conductive sheet 5, so that substantially the entire installation place of the panel heating device 1 can be uniformly heated. The heating effect to the place where the pipe 3 is not provided by the high heat conductive sheet 5 is, so to speak, due to heat transfer from the pipe 3 in a state where the pipe 3 is provided at the place where the high heat conductive sheet 5 is provided. Some are close to the heating effect.
Further, by appropriately adjusting the installation position, width dimension, length, thickness, and the like of the high thermal conductive sheet 5, the temperature distribution and temperature rise time of the surface soaking plate can be freely adjusted.

Next, an embodiment of another arrangement mode of the high thermal conductive sheet 5 will be described.
As shown in FIG. 2, a plurality of high thermal conductive sheets 5 are provided at one end of the pipe 3 disposed on the

opposite side portions

21, 23 of the four

peripheral portions

21, 22, 23, 24 of the panel 2. Only 50a is connected. In addition, the plurality of high heat conductive sheets 5 are alternately connected to the

opposite side portions

21 and 23 in a so-called zigzag manner. In this case, the connection mode of the high thermal conductive sheet 5 to the pipe 3 is the same as that shown in FIG. Specifically, one end 50a of the high thermal conductive sheet 5 is connected to the pipe 3 in the manner shown in FIG. 1B, and the other end 50b is not connected to the pipe 3 and is disposed on the upper surface of the panel 3. It will be in the state.

In this example, three high heat conductive sheets 5 are alternately connected to the

opposite side portions

21 and 23. Further, for the two

sides

22 and 24 other than the

side portions

21 and 23, the two high thermal conductive sheets 5 are arranged with only one end 50a connected to each side. It is installed. In this example, the high thermal conductive sheet 5 connected to both

side portions

21 and 23 has a substantially elongated shape, and the length is about one third of the distance between the

opposite side portions

21 and 23. It may be a length of about. Also, the high heat conductive sheet 5 connected to the two

side parts

22 and 24 other than the

side parts

21 and 23 is longer than the high heat conductive sheet 5 connected to the

side parts

21 and 23. The shape is shorter and wider, and two high thermal conductive sheets 5 are connected to each side portion. The positions of the leading end portions 50b of these high heat conductive sheets 5 are set at positions that maintain a certain distance from the locations where the high heat conductive sheets 5 are connected to the

side portions

21 and 23.

According to this configuration, due to the heat transfer effect of the high heat conductive sheet 5 connected to the both

side parts

21 and 23 in a so-called zigzag manner, both

side parts

21 and 23 facing each other in the vicinity of the locations where the high heat conductive sheets 5 are disposed. It is possible to heat substantially the entire region sandwiched between the two. Moreover, the vicinity of those arrangement | positioning locations is also warmed by the high heat conductive sheet 5 connected to the two

side parts

22 and 24. FIG. As described above, by arranging the high heat conductive sheet 5 so as to make the best use of the heat transfer effect of the high heat conductive sheet 5, it is possible to efficiently uniformly heat substantially the entire area of the panel 2.
In addition, the arrangement | positioning location of each high heat conductive sheet 5, a shape, an arrangement | positioning space | interval, etc. are not limited to this example of a figure, The structure which can heat uniformly the whole installation location of the panel heating apparatus 1 If it is. For example, the high heat conductive sheet 5 may not be connected to the two

side portions

22 and 24, and the high heat conductive sheet 5 may be connected in a so-called zigzag manner across the

entire side portions

21 and 23. Or the structure by which the high heat conductive sheet 5 was connected to the two

side parts

22 and 24 only in the so-called zigzag form over the whole region may be sufficient.
Moreover, it is the same as that of FIG. 1 that the temperature distribution and temperature rise time of the surface heat plate can be freely adjusted by appropriately adjusting the width dimension, length, thickness and the like of the high thermal conductive sheet 5.

Next, an embodiment of yet another arrangement mode of the high thermal conductive sheet will be described.
As shown in FIG. 3, seven high heat conductive sheets 5 having a substantially elongated shape are formed only on the pipe 3 disposed on one of the four

peripheral portions

21, 22, 23, 24 of the panel 2. The one end 50a is connected. The length of the high heat conductive sheet 5 may be about half of the distance between the

opposite side portions

21 and 23, and the connection mode of the high heat conductive sheet 5 to the pipe 3 is the same as in FIG. It is.
Since all of the seven high heat conductive sheets 5 are disposed on the substantially half surface A of the panel 2, this portion is selectively warmed. On the other hand, the half surface B where the high heat conductive sheet 5 is not disposed is heated at a lower temperature than the half surface A because the heat transfer from the high heat conductive sheet 5 and the pipe 3 is low.

According to this structure, since the arrangement | positioning location of the high heat conductive sheet 5 can be selectively limited to the side of one side, the location which wants to heat at high temperature (high temperature part) and the location which wants to heat at low temperature (low temperature part) ), And a different temperature distribution can be intentionally given to each part.
In addition, the arrangement | positioning location, shape, arrangement | positioning space | interval, etc. of each high heat conductive sheet 5 are not limited to this example, What is necessary is just a structure which can implement | achieve a predetermined temperature distribution. For example, the figure shows an example in which the high heat conductive sheet 5 is connected only to the pipe 2 on the side 23, but the pipe 3 on one side of the four

peripheral parts

21, 22, 23, 24 is connected. The structure to which the high heat conductive sheet 5 was connected may be sufficient. Moreover, although the high heat conductive sheet 5 may be connected over the whole area of one side part, the high heat conductive sheet 5 may be connected only to one part of one side part, and high heat conductivity is according to the location which wants to heat at high temperature. The sheet 5 may be provided.
In addition, as described above, the temperature distribution and temperature rise time of the surface soaking plate can be freely adjusted by appropriately adjusting the width dimension, length, thickness and the like of the high thermal conductive sheet 5.

In the present embodiment, the separated panel heating apparatus 1 in which the floor finishing material 6 and the panel 2 are separated has been described. However, the integrated panel heating apparatus in which the floor finishing material 6 and the panel 2 are integrally formed. 1 can also be applied.
Further, the pipe disposing groove 20 is illustrated as being formed in a substantially U shape in a cross-sectional view along the diameter of the pipe 2, but the shape is not limited to this, for example, approximately It may have a concave shape.
Moreover, although the panel heating apparatus 1 was demonstrated as what is installed in the upper surface of a floor base material in the figure, an installation place is not limited to this, For example, it installs in the wall surface, ceiling, etc. of a house etc. You can also.
Further, the shape and configuration of the panel 2 are not limited to the illustrated example, and may be configured to be divided into a plurality of parts, such as three, and to combine the components when used to complete the panel 2. Further, the shapes and configurations of the pipe 2 and the surface soaking plate 4 are not limited to the illustrated examples.

DESCRIPTION OF SYMBOLS 1 Panel heating apparatus 2 Panel 20 Pipe installation groove | channel 3 Pipe 4 Surface soaking plate 5 High heat

conductive sheet

21, 22, 23, 24 Four peripheral parts

Claims

A panel heating comprising: a pipe through which a heat medium flows; a panel in which a pipe disposition groove in which the pipe is disposed is formed on an upper surface; and a metal surface heat equalizing plate laid on the upper surface of the panel A device,
Between the panel and the surface soaking plate, a plurality of high thermal conductive sheets made of a material having a higher thermal conductivity than the surface soaking plate are disposed,
The high heat conduction sheet has at least one end connected to the pipe, and is disposed in a direction orthogonal to the direction in which the pipe is disposed.
In the panel heating apparatus of Claim 1,
The panel heating device according to claim 1, wherein the panel has a substantially square shape, and the groove for arranging the pipe is formed along four peripheral portions of the panel.
In the panel heating apparatus of Claim 2,
Both ends of the high heat conductive sheet are connected to both pipes disposed on both sides of the four peripheral portions of the panel.
In the panel heating apparatus of Claim 2,
Only the one end of the said high heat conductive sheet is alternately connected to the pipe arrange | positioned at the both sides of the four peripheral parts of the said panel, The panel heating apparatus characterized by the above-mentioned.
In the panel heating apparatus of Claim 2,
The panel heating device, wherein the high thermal conductive sheet is connected only to a pipe disposed on one side of the four peripheral portions of the panel.