WO2013005708A1 - Illumination device, display device, and television reception device - Google Patents

Illumination device, display device, and television reception device Download PDF

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Publication number
WO2013005708A1
WO2013005708A1 PCT/JP2012/066849 JP2012066849W WO2013005708A1 WO 2013005708 A1 WO2013005708 A1 WO 2013005708A1 JP 2012066849 W JP2012066849 W JP 2012066849W WO 2013005708 A1 WO2013005708 A1 WO 2013005708A1
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WO
WIPO (PCT)
Prior art keywords
light
guide plate
led
light guide
light source
Prior art date
Application number
PCT/JP2012/066849
Other languages
French (fr)
Japanese (ja)
Inventor
良武 石元
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2013005708A1 publication Critical patent/WO2013005708A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/66Transforming electric information into light information
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086Positioning aspects
    • G02B6/0091Positioning aspects of the light source relative to the light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133322Mechanical guidance or alignment of LCD panel support components
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133615Edge-illuminating devices, i.e. illuminating from the side
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means

Definitions

  • the present invention relates to a lighting device, a display device, and a television receiver.
  • the display elements of image display devices such as television receivers are shifting from conventional cathode ray tubes to thin display panels such as liquid crystal panels and plasma display panels, which enables thinning of image display devices.
  • a backlight device is separately required as a lighting device, and the backlight device is roughly classified into a direct type and an edge light type according to the mechanism.
  • an edge light type backlight device it is preferable to use an edge light type backlight device, and an example described in Patent Document 1 below is known.
  • the light guide plate is provided with a light incident surface facing the light source and receiving light from the light source. If the distance between the light incident surface and the light source varies, the light incident efficiency varies. At the same time, since the luminance of the emitted light varies, the display quality may be deteriorated.
  • the present invention has been completed based on the above circumstances, and an object thereof is to obtain high positioning accuracy.
  • the illumination device of the present invention includes a light source, a light guide plate that is arranged to face the light source and receives a light incident surface on which light from the light source is incident, and a light emitting surface that emits the incident light.
  • a light source substrate having a light source mounting portion on which a light source is mounted and a heat radiating plate portion extending from the light source mounting portion toward the light guide plate, and the light source substrate and the light guide plate, By forming a chassis parallel to the plate surface of the light guide plate and having a bottom plate that sandwiches the heat radiating plate portion between the light guide plate and the heat radiating plate portion and the light guide plate, respectively, and engaging with each other in an uneven manner.
  • a positioning structure that positions the light source substrate and the light guide plate at least in a direction from the light source toward the light incident surface.
  • the light emitted from the light source is incident on the light incident surface of the light guide plate arranged opposite to the light source, and is then propagated through the light guide plate and then emitted from the light exit surface.
  • the heat radiating plate portion constituting the light source substrate extends from the light source mounting portion toward the light guide plate side and is sandwiched between the light guide plate and the bottom plate of the chassis, the heat radiating plate portion is temporarily guided from the light source mounting portion. Compared to a case where the light source is extended toward the side opposite to the light plate side, it is preferable in reducing the size of the lighting device. Further, the heat generated from the light source by the heat radiating plate portion can be efficiently transmitted to the bottom plate of the chassis via the light source mounting portion.
  • the light source substrate and the light guide plate are directly positioned at least in the direction from the light source to the light incident surface by the positioning structure that is formed on the heat dissipation plate portion and the light guide plate, respectively, and is fitted to the concave and convex portions, Compared to the conventional configuration in which the light source board and light guide plate are positioned indirectly via a part of the chassis, the effect of assembly errors is reduced by the amount of inclusions, so positioning Such accuracy is higher. This makes it difficult for variations in the incident efficiency of light incident on the light incident surface from the light source and the luminance of the emitted light from the light emitting surface of the light guide plate, thereby stabilizing the light utilization efficiency and the luminance of the emitted light. be able to.
  • the positioning structure is provided by using the heat radiating plate portion extending from the light source mounting portion to the light guide plate side of the light source substrate, it is temporarily directed to the light guide plate side separately from the heat radiating plate portion. Compared to the case where an extending structure is provided and a positioning structure is provided there, it is preferable for simplifying the entire structure.
  • the positioning structure includes a positioning concave portion formed on a surface of the light guide plate facing the heat radiating plate portion, a positioning concave portion formed on the heat radiating plate portion and protruding toward the light guide plate. It is comprised from the positioning convex-shaped part fitted by the part. If it does in this way, since it can be set as the structure by which a protrusion is not formed in the board surface facing the heat sink part in a light-guide plate, it is excellent in the handleability of a light-guide plate.
  • the light source substrate is provided with the light source mounting portion and the light source in the first place, although the positioning convex portion is formed on the heat radiating plate portion, the presence of the positioning convex portion immediately improves the handleability of the light source substrate. It is less likely to cause damage.
  • the positioning concave portion is configured to penetrate the light guide plate in the plate thickness direction.
  • the optical member is formed with a second positioning concave portion into which the positioning convex portion is fitted. In this way, the positioning convex portion passing through the positioning concave portion formed in the light guide plate is fitted to the second positioning concave portion formed in the optical member, so that the optical member together with the light guide plate is also used. Positioning can be achieved.
  • the light source side end portion of the optical member is provided with a light shielding portion that protrudes toward the light source side and is disposed closer to the light source side than the light incident surface and blocks light from the light source. ing.
  • the light emitted from the light source is blocked by the light shielding portion, so that, for example, it directly enters the end of the optical member on the light source side or in a gap that may be generated between the light guide plate and the optical member. It is prevented from entering. Thereby, it can prevent that the light from a light source radiate
  • the positioning convex portion when the positioning convex portion is fitted to the second positioning concave portion, the light source mounted on the light source substrate and the light shielding portion provided on the optical member are highly accurate in the direction from the light source toward the light incident surface. Therefore, since the positioning is performed, the light shielding performance by the above-described light shielding portion can be stably exhibited.
  • the light shielding portion has light reflectivity for reflecting light. If it does in this way, the light from a light source can be reflected by the light-shielding part, and can be made to go to a light-incidence surface. Thereby, the utilization efficiency of light can be improved.
  • the second positioning concave portion has a hole shape penetrating the optical member in the thickness direction, and the hole edge is supported in the vertical direction by the positioning convex portion.
  • the hole edge of the second positioning concave portion is supported in the vertical direction by the positioning convex portion.
  • the positioning structure is arranged at a position that does not overlap the light source in a direction from the light source toward the light incident surface. In this way, light incident on the light incident surface of the light guide plate from the light source is less likely to hit the positioning structure, so that unevenness due to the positioning structure is less likely to occur in the emitted light from the light exit surface.
  • a plurality of the light sources are intermittently arranged along the light incident surface, and the positioning structure is closer to the end than the light source arranged at the end in the arrangement direction of the light sources. It is arranged at a position shifted to. In this way, it is possible to further reduce the unevenness of the emitted light caused by the positioning structure, as compared with the case where the positioning structure is arranged between adjacent light sources.
  • the light source substrates are arranged in a pair with the light guide plate interposed therebetween, whereas the light guide plates are opposed to the light sources mounted on the pair of light source substrates.
  • a pair of the light incident surfaces is provided, and the positioning structure is provided on each of the heat radiating plate portions and the light guide plate of the pair of light source substrates.
  • the light source mounting portion rises from the heat radiating plate portion and is arranged to face the light incident surface
  • the light source is positioned on the opposite side of the mounting surface with respect to the light source mounting portion. It consists of a top-emitting LED whose surface is the light emitting surface.
  • the top light emitting type LED is provided as the light source in the light source mounting portion that stands up from the heat radiating plate and faces the light incident surface, the rising direction of the heat radiating plate portion
  • the degree of freedom of LED arrangement is increased. Thereby, it becomes possible to arrange
  • the light source mounting portion is configured to extend along the heat radiating plate portion
  • the light source has side light emission in which a side surface adjacent to the mounting surface with respect to the light source mounting portion is a light emitting surface. It consists of a type of LED. In this way, since the side light emitting type LED is provided as the light source in the light source mounting portion that is configured to extend along the heat radiating plate portion, it is suitable for using a thin light guide plate, Therefore, it is also suitable for reducing the thickness of the entire lighting device.
  • a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.
  • the illumination device that supplies light to the display panel has high positioning accuracy between the light source substrate and the light guide plate, and the brightness of the emitted light is stable. It is possible to realize display with excellent display quality.
  • a liquid crystal panel can be exemplified as the display panel.
  • Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
  • FIG. 1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention.
  • Exploded perspective view showing schematic configuration of liquid crystal display device The top view which shows arrangement
  • the top view which shows the arrangement configuration of a chassis and an LED board Bottom view of light guide plate Sectional drawing which shows the cross-sectional structure of LED which concerns on Embodiment 2 of this invention, and an LED board.
  • Xi-xi sectional view of FIG. The top view which shows the arrangement configuration of the chassis which concerns on Embodiment 4 of this invention, a light-guide plate, and an LED board.
  • the top view which shows the arrangement configuration of the chassis which concerns on Embodiment 7 the optical member which has a light-shielding part, and an LED board.
  • FIGS. 1 A first embodiment of the present invention will be described with reference to FIGS.
  • the liquid crystal display device 10 is illustrated.
  • a part of each drawing shows an X axis, a Y axis, and a Z axis
  • each axis direction is drawn to be a direction shown in each drawing.
  • the Y-axis direction coincides with the vertical direction
  • the X-axis direction coincides with the horizontal direction.
  • the vertical direction is used as a reference for upper and lower descriptions.
  • the upper side shown in FIGS. 4-6 be a front side
  • the lower side of the figure be a back side.
  • the television receiver TV includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power source P, a tuner T,
  • the liquid crystal display device 10 is supported by the stand S in a state where the display surface of the liquid crystal display device 10 is along the vertical direction (Y-axis direction).
  • the liquid crystal display device (display device) 10 has a horizontally long rectangular shape (rectangular shape, longitudinal shape) as a whole, and is accommodated in a vertically placed state. As shown in FIG.
  • the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and a backlight device (illumination device) 12 that is an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained.
  • the display surface of the liquid crystal display device 10 is along the vertical direction” as referred to in the present embodiment is not limited to an aspect in which the display surface of the liquid crystal display device 10 is parallel to the vertical direction, but from a direction along the horizontal direction. Also, it means that it is installed in a direction relatively along the vertical direction, and includes, for example, those inclined by 0 ° to 45 °, preferably 0 ° to 30 ° with respect to the vertical direction.
  • the liquid crystal panel 11 has a horizontally long rectangular shape (rectangular shape, longitudinal shape) in a plan view, and a pair of glass substrates having excellent translucency are separated by a predetermined gap.
  • the liquid crystal is sealed between both substrates.
  • One substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like.
  • a color filter in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, a counter electrode, and an alignment film.
  • the liquid crystal panel 11 has a display area AA on the center side of the screen where an image can be displayed and a frame shape (frame shape) surrounding the display area AA on the outer peripheral edge side of the screen. It is divided into a non-display area NAA.
  • the inner area surrounded by the alternate long and short dash line indicates the display area AA
  • the outer area indicates the non-display area NAA.
  • a polarizing plate is disposed on the outside of both substrates.
  • the backlight device 12 includes a chassis 14 having a substantially box shape having a light emitting portion 14 c that opens toward the front side (light emitting side, liquid crystal panel 11 side), and light emitting from the chassis 14. And an optical member 15 arranged to cover the portion 14c. Furthermore, in the chassis 14, an LED (Light Emitting Diode) 17 that is a light source, an LED substrate 18 on which the LED 17 is mounted, and light from the LED 17 are guided to the optical member 15 (liquid crystal panel 11). And a frame (pressing member) 16 for pressing the light guide plate 19 and the optical member 15 from the front side.
  • LED Light Emitting Diode
  • the backlight device 12 includes LED substrates 18 having LEDs 17 at both ends on the short side thereof, and a light guide plate 19 disposed at the center between the LED substrates 18 on both sides.
  • the so-called edge light type (side light type) is used. Below, each component of the backlight apparatus 12 is demonstrated in detail.
  • the chassis 14 is made of, for example, a metal plate such as an aluminum plate or an electrogalvanized steel plate (SECC), and as shown in FIGS. It consists of a side plate 14b that rises one by one from each outer end on the long side and the short side in 14a.
  • the long side direction of the chassis 14 (bottom plate 14a) coincides with the X-axis direction (horizontal direction), and the short side direction coincides with the Y-axis direction (vertical direction).
  • the frame 16 and the bezel 13 can be screwed to the side plate 14b.
  • the optical member 15 has a horizontally long rectangular shape when viewed in a plane, like the liquid crystal panel 11 and the chassis 14.
  • the optical member 15 is placed on the front side (light emitting side) of the light guide plate 19 and is interposed between the liquid crystal panel 11 and the light guide plate 19.
  • the optical member 15 includes a diffusion plate 15a disposed on the back side and an optical sheet 15b disposed on the front side.
  • the diffusing plate 15a has a structure in which a large number of diffusing particles are dispersed in a base material made of a substantially transparent synthetic resin having a predetermined thickness and has a function of diffusing transmitted light.
  • the optical sheet 15b has a sheet shape that is thinner than the diffusion plate 15a, and two optical sheets 15b are laminated. Specific types of the optical sheet 15b include, for example, a diffusion sheet, a lens sheet, a reflective polarizing sheet, and the like, which can be appropriately selected and used.
  • the frame 16 is formed in a frame shape (frame shape) extending along the outer peripheral edge portions of the optical member 15 and the light guide plate 19, and the outer peripheral edge of the optical member 15 and the light guide plate 19. It can be pressed from the front side over almost the entire circumference while facing the part.
  • the frame 16 is made of a synthetic resin and has a light shielding property by having a surface with, for example, a black color.
  • a first reflection sheet 20 for reflecting light is attached to the back surface of both short sides of the frame 16, that is, the surface facing the light guide plate 19 and the LED substrate 18 (LED 17). It has been.
  • the first reflection sheet 20 has a size extending over almost the entire length of the short side portion of the frame 16, and covers the LED 17 side end portion and LED 17 group of the light guide plate 19 from the front side collectively. Is done. Further, the frame 16 can receive the outer peripheral edge of the liquid crystal panel 11 from the back side.
  • the LED 17 has a configuration in which an LED chip is sealed with a resin material on a substrate portion fixed to the LED substrate 18.
  • the LED chip mounted on the substrate unit has one main emission wavelength, and specifically, one that emits blue light in a single color is used.
  • the resin material that seals the LED chip is dispersed and blended with a phosphor that emits a predetermined color when excited by the blue light emitted from the LED chip, and generally emits white light as a whole. It is said.
  • the phosphor for example, a yellow phosphor that emits yellow light, a green phosphor that emits green light, and a red phosphor that emits red light are used in appropriate combination, or any one of them is used. It can be used alone.
  • This LED 17 is of a so-called top surface light emitting type in which the top surface opposite to the mounting surface with respect to the LED substrate 18 is the light emitting surface 17a.
  • the LED board 18 is composed of an LED mounting portion 18a on which the LED 17 is mounted, and a heat radiating plate portion 18b extending from the LED mounting portion 18a toward the light guide plate 19 side.
  • the mounting portion 18a and the heat radiating plate portion 18b are connected to each other in such a manner that their plate surfaces are orthogonal to each other, thereby forming a substantially L-shaped cross section as a whole.
  • the LED board 18 has a posture in which the plate surface of the LED mounting portion 18 a is parallel to the Y-axis direction and the Z-axis direction, that is, the side plate 14 b on the short side of the chassis 14 and the light incident surface 19 b of the light guide plate 19.
  • the posture of the heat radiating plate portion 18b is parallel to the X-axis direction and the Y-axis direction, that is, the chassis. 14 is accommodated in the chassis 14 while being in a posture parallel to the plate surfaces of the bottom plate 14 a and the light guide plate 19 (orientation perpendicular to the side plates 14 b of the chassis 14 and the light incident surface 19 b of the light guide plate 19).
  • the LED mounting portion 18 a is directed to the inner surface of the side plate 14 b on the short side of the chassis 14 and has a predetermined interval with respect to the light incident surface 19 b of the light guide plate 19.
  • the heat dissipation plate portion 18b is directed to the inner surface of the bottom plate 14a of the chassis 14 and is located between the bottom plate 14a on the back side and the light guide plate 19 (light guide reflection sheet 22) on the front side. Sandwiched between.
  • the heat generated from each LED 17 by the heat radiating plate portion 18b can be efficiently transmitted to the bottom plate 14a of the chassis 14 to radiate heat.
  • the LED mounting portion 18a is substantially perpendicular to the side plate 14b from the end opposite to the light guide plate 19 side of the heat radiating plate portion 18b parallel to the bottom plate 14a of the chassis 14.
  • the heat radiating plate portion 18b extends from the end of the LED mounting portion 18a opposite to the frame 16 side (bottom plate 14a side) toward the light guide plate 19 side, and the end portion of the light guide plate 19 on the LED 17 side. Support from the back side.
  • the light guide plate 19 is slightly supported from the bottom plate 14a of the chassis 14 by supporting both ends on the short side, that is, both ends on the LED 17 side, from the back side by the heat radiating plate portions 18b of the pair of LED substrates 18, respectively. It is kept in a floating position.
  • the dimensions in the Y-axis direction of the LED mounting portion 18a and the heat radiating plate portion 18b are substantially the same as each other as shown in FIGS. It is said.
  • the extension dimension in the X-axis direction from the LED mounting portion 18a in the heat radiating plate portion 18b is larger than the width dimension in the short side portion of the frame 16 and the width dimension of the second reflection sheet 21 described later.
  • the surface of the LED mounting portion 18a facing the light guide plate 19 (the surface facing the light incident surface 19b) is surface-mounted with the LED 17 having the above-described configuration as shown in FIGS.
  • the mounting surface A plurality of LEDs 17 are arranged in a line (linearly) in parallel on the mounting surface of the LED mounting portion 18a along the length direction (Y-axis direction) with a predetermined interval. That is, it can be said that a plurality of LEDs 17 are intermittently arranged in parallel along the short side direction at both ends on the short side of the backlight device 12.
  • the interval between the LEDs 17 adjacent to each other in the Y-axis direction, that is, the arrangement pitch of the LEDs 17 is substantially equal.
  • the arrangement direction of the LEDs 17 coincides with the length direction (Y-axis direction) of the LED mounting portion 18a and the light incident surface 19b.
  • a wiring pattern (not shown) made of a metal film (not shown) extends in the Y-axis direction and connects the adjacent LEDs 17 in series across the LED 17 group.
  • the terminal portions formed at both ends of the wiring pattern are connected to an external LED driving circuit, so that driving power can be supplied to each LED 17.
  • the pair of LED substrates 18 are housed in the chassis 14 in such a manner that the LED mounting portions 18a face each other, so that each LED 17 mounted on each of the LED mounting portions 18a.
  • the light emitting surfaces 17a are opposed to each other, and the optical axes of the LEDs 17 substantially coincide with the X-axis direction.
  • the LEDs 17 mounted on the LED mounting portions 18 a of the pair of LED substrates 18 are respectively arranged in opposed relation to both end portions on the short side of the light guide plate 19.
  • the LED board 18 is made of metal (for example, aluminum) similarly to the chassis 14, and the wiring pattern (not shown) described above is formed on the surface of the LED mounting portion 18 a via an insulating layer. ing.
  • insulating materials such as a ceramic, can also be used as a material used for the base material of LED board 18.
  • the light guide plate 19 is made of a synthetic resin material (for example, acrylic resin such as PMMA or polycarbonate) having a refractive index sufficiently higher than air and substantially transparent (excellent translucency). As shown in FIGS. 2, 3, and 8, the light guide plate 19 has a horizontally long rectangular shape in plan view and is thicker than the optical member 15 as in the case of the liquid crystal panel 11 and the chassis 14. In the main surface (plate surface), the long side direction coincides with the X-axis direction, the short side direction coincides with the Y-axis direction, and the plate thickness direction perpendicular to the main surface coincides with the Z-axis direction. . As shown in FIG.
  • the light guide plate 19 is disposed in the chassis 14 at a position directly below the liquid crystal panel 11 and the optical member 15, and forms a pair of LED substrates disposed at both ends on the short side of the chassis 14. 18 are arranged so as to be sandwiched between 18 in the X-axis direction. Therefore, while the alignment direction of the LED 17 (LED mounting portion 18a) and the light guide plate 19 coincides with the X-axis direction, the alignment direction of the optical member 15 (liquid crystal panel 11) and the light guide plate 19 is the Z-axis direction. It is in agreement and both arrangement directions are orthogonal to each other.
  • the light guide plate 19 has a function of introducing the light emitted from the LED 17 in the X-axis direction and raising and emitting the light toward the optical member 15 side (front side) while propagating the light inside. .
  • the light guide plate 19 has a substantially flat plate shape extending along the bottom plate 14a of the chassis 14 and the main surfaces (each plate surface) of the optical member 15. Are parallel to the X-axis direction and the Y-axis direction.
  • the surface facing the front side is a light emitting surface 19 a that emits internal light toward the optical member 15 and the liquid crystal panel 11.
  • Outer peripheral end surfaces adjacent to the main surface of the light guide plate 19, both end surfaces on the short side that are long along the Y-axis direction are opposed to the LEDs 17 (LED mounting portions 18 a) with a predetermined space therebetween.
  • Each light incident surface 19b is a surface parallel to the Y-axis direction (the LED 17 arrangement direction) and the Z-axis direction, that is, the mounting surface of the LED mounting portion 18a, and is substantially orthogonal to the light emitting surface 19a.
  • the light guide plate 19 propagates through the back side of the light guide plate 19, that is, the bottom surface (the surface facing the bottom plate 14a of the chassis 14) 19c, which is the opposite side of the light emitting surface 19a.
  • a light guide reflection sheet 22 that can reflect the light reaching the bottom surface 19c and rise up toward the front side, that is, the light emitting surface 19a side, is provided so as to cover almost the entire area.
  • the light guide reflection sheet 22 is disposed between the bottom plate 14 a of the chassis 14 and the light guide plate 19.
  • At least one of the light exit surface 19a of the light guide plate 19 and the bottom surface 19c on the opposite side thereof has a reflection portion (not shown) or an internal portion that reflects the internal light and prompts the light exit from the light exit surface 19a.
  • the scattering part (not shown) that scatters the light of the light and promotes the light output from the light output surface 19a is patterned so as to have a predetermined in-plane distribution, so that the light emitted from the light output surface 19a is in-plane It is controlled to have a uniform distribution.
  • the LED substrate 18 and the light guide plate 19 are respectively provided with positioning structures 23 capable of positioning each other by engaging with each other as shown in FIGS. ing.
  • the positioning structure 23 is opposed to the positioning convex portion 23 a formed on the heat radiating plate portion 18 b extending along the bottom plate 14 a of the chassis 14 in the LED substrate 18 and the heat radiating plate portion 18 b in the light guide plate 19.
  • the positioning concave portion 23b is formed on the bottom surface 19c.
  • a pair of positioning structures 23 each including a pair of positioning convex portions 23 a and positioning concave portions 23 b are arranged at two positions separated from each other in the X-axis direction within the bottom surface 19 c of the light guide plate 19.
  • the pair of positioning structures 23 are arranged in the vicinity of the upper end portion in the vertical direction of the light guide plate 19 in the Y-axis direction, and are arranged at substantially the same position.
  • one positioning convex portion 23 a is formed on each heat radiating plate portion 18 b of the pair of LED substrates 18.
  • the positioning convex portion 23a protrudes from the surface of the heat radiating plate portion 18b facing the light guide plate 19 to the front side, that is, toward the light guide plate 19 side, and is integrally formed with the heat radiating plate portion 18b.
  • the positioning convex portion 23a is made of a substantially rectangular block-like protrusion that is horizontally long when viewed in a plane, and the long side direction thereof coincides with the X-axis direction and the short side direction thereof coincides with the Y-axis direction. .
  • the outer surfaces of the four sides constituting the outer peripheral surface of the positioning convex portion 23a are flat surfaces in which both outer surfaces on the long side are parallel to the X-axis direction and both outer surfaces on the short side are parallel to the Y-axis direction.
  • the positioning convex portion 23a is arranged in the vicinity of the extending tip portion from the LED mounting portion 18a in the heat radiating plate portion 18b in the X-axis direction (position slightly closer to the extending proximal end than the extending tip position),
  • the Y-axis direction is arranged near the upper end portion in the vertical direction (a position slightly below the upper end position in the vertical direction).
  • a pair of positioning concave portions 23 b are formed on the light guide plate 19.
  • the positioning concave portion 23b is formed by partially denting the bottom surface 19c of the light guide plate 19 facing the heat radiating plate portion 18b, and is open only toward the back side of the light guide plate 19. It has a concave shape that does not penetrate 19 in the thickness direction.
  • the positioning concave portion 23b has a substantially rectangular shape that is horizontally long when viewed in a plane, and the long side direction thereof coincides with the X-axis direction, and the short side direction thereof coincides with the Y-axis direction.
  • the inner surfaces of the four sides constituting the inner peripheral surface of the positioning concave portion 23b are flat surfaces in which both inner surfaces on the long side are parallel to the X-axis direction and both inner surfaces on the short side are parallel to the Y-axis direction.
  • the pair of positioning concave portions 23b are disposed at two positions spaced apart in the X-axis direction on the light guide plate 19, and more specifically, are disposed closer to the LED 17 side end than the central portion in the X-axis direction. ing.
  • the pair of positioning concave portions 23b are arranged at the upper end portion in the vertical direction of the light guide plate 19 in the Y-axis direction (a position slightly lower than the upper end position in the vertical direction).
  • the LED substrate 18 and the light guide plate 19 can be positioned in both the X-axis direction and the Y-axis direction. Since the pair of positioning structures 23 are arranged at the upper end portion in the vertical direction of the light guide plate 19, the light guide plate 19 is configured so that the liquid crystal display device 10 has a posture in which the display surface of the liquid crystal panel 11 is along the vertical direction. Further, the positioning structure 23 is supported in a state suspended from the upper side in the vertical direction.
  • the positioning structure 23 overlaps the LED 17 in a position shifted from the LED 17 in the Y-axis direction (LED 17 arrangement direction), in other words, in the X-axis direction (direction from the LED 17 toward the light incident surface 19b). There are no positions.
  • the positioning structure 23 is further arranged on the upper side in the vertical direction, that is, closer to the end (the adjacent LED 17 side) than the LED 17 disposed on the uppermost side in the vertical direction among the LED 17 group intermittently arranged in parallel in the Y-axis direction. It is arranged at a position shifted to the opposite side.
  • the positioning structure 23 includes a positioning concave portion 23b formed by recessing a part of the light guide plate 19 and a positioning convex portion 23a fitted therein, the inside of the light guide plate 19 is provided. For propagating light, it can be a hindrance to progress. Since the positioning structure 23 is arranged so as not to be opposed (offset) with respect to the LED 17 in the direction along the optical axis (X-axis direction), the light incident from the LED 17 into the light guide plate 19 is positioned. 23, and the optical path of the light propagating through the light guide plate 19 is hardly disturbed by the positioning structure 23. Moreover, the positioning structure 23 is arranged in the non-display area NAA so as not to exist in the display area AA in the liquid crystal panel 11.
  • the positioning structure 23 is arranged at a position overlapping the long side portion arranged on the upper end side in the vertical direction in the frame 16 in a plan view, and the long side portion of the frame 16. Thus, it is hidden from the eyes of the user of the liquid crystal display device 10.
  • This embodiment has the structure as described above, and its operation will be described next.
  • the separately manufactured liquid crystal panel 11, backlight device 12, bezel 13 and the like are assembled.
  • the manufacturing procedure of the backlight device 12 will be described mainly with respect to the manufacturing procedure of the liquid crystal display device 10.
  • the backlight device 12 When manufacturing the backlight device 12, first, a work of assembling a pair of LED substrates 18 on which the LEDs 17 are mounted in the chassis 14 is performed.
  • the LED board 18 is accommodated from the front side at the end on the short side in the chassis 14 with the heat radiation plate portion 18b parallel to the bottom plate 14a of the chassis 14 and the LED mounting portion 18a parallel to the side plate 14b. Is done.
  • the assembling directions of the LED substrates 18 are aligned so that the positioning convex portion 23a is positioned on the upper side in the vertical direction when the liquid crystal display device 10 is used.
  • the LED board 18 is fixed to the chassis 14 with screws or the like in a state where the heat radiating plate portion 18b is in contact with the inner surface of the bottom plate 14a of the chassis 14 and the LED mounting portion 18a is in contact with the inner surface of the side plate 14b.
  • the light guide plate 19 has a long side and a short side parallel to the long side and the short side of the chassis 14, and is positioned between the pair of LED boards 18 already attached to the chassis 14. From the front side. At this time, the assembly direction of the light guide plate 19 is adjusted so that the pair of positioning concave portions 23b are positioned on the upper side in the vertical direction when the liquid crystal display device 10 is used.
  • the pair of positioning convex portions 23 a At least one of the light guide plates 19 abuts against the plate surface 19c on the back side of the light guide plate 19 without fitting into the positioning concave portion 23b, so that the light guide plate 19 is inclined in the chassis 14. In that case, alignment is performed by adjusting the position of the light guide plate 19 in at least one of the X-axis direction and the Y-axis direction with respect to the pair of LED substrates 18.
  • the light guide plate 19 is fitted into a pair of positioning concave portions 23b formed on the back plate surface 19c of the light guide plate 19, so that the light guide plate 19 has its plate surface (main surface) as the bottom plate 14a and the heat radiating plate portion of the chassis 14. It is accommodated in the chassis 14 in a posture parallel to 18b. That is, whether or not the light guide plate 19 is accurately aligned with the pair of LED substrates 18 can be determined based on whether or not the surface of the light guide plate 19 accommodated in the chassis 14 is inclined.
  • the light guide plate 19 accommodated in the chassis 14 in the aligned state has the circumferential surfaces of the positioning convex portion 23 a and the positioning concave portion 23 b forming the positioning structure 23.
  • the X-axis direction and the Y-axis direction are not shaken with respect to the chassis 14 and the LED board 18 (LED 17), and are held in an appropriate position in a positioning state.
  • the light guide plate 19 is assembled in the chassis 14 in this way, the three optical members 15 are sequentially stacked on the light emitting surface 19 a of the light guide plate 19, and then the frame 16 is attached to the chassis 14.
  • the backlight device 12 is manufactured by mounting.
  • the liquid crystal display device 10 is manufactured by assembling the liquid crystal panel 11 and the bezel 13 to the backlight device 12 (see FIG. 4).
  • the drive of the liquid crystal panel 11 is controlled by a control circuit (not shown), and the drive power from the LED drive circuit (not shown) is applied to each LED 17 on the LED substrate 18.
  • the drive is controlled by being supplied to.
  • the light from each LED 17 is guided by the light guide plate 19, so that the liquid crystal panel 11 is irradiated through the optical member 15, and a predetermined image is displayed on the liquid crystal panel 11.
  • the operation of the backlight device 12 will be described in detail.
  • each LED 17 When each LED 17 is turned on, the light emitted from each LED 17 enters the light incident surface 19b of the light guide plate 19 as shown in FIG.
  • the space is sandwiched between the first reflective sheet 20 on the front side and the second reflective sheet 21 on the back side.
  • the light from the LED 17 is repeatedly reflected by both the reflection sheets 20 and 21, so that it is efficiently incident on the light incident surface 19b.
  • the light incident on the light incident surface 19b is totally reflected at the interface with the external air layer in the light guide plate 19 or is reflected by the light guide reflection sheet 22 and is propagated through the light guide plate 19.
  • the light is emitted from the light exit surface 19a by being reflected or scattered by a reflection part or a scattering part (not shown).
  • the incident efficiency when the light from the LED 17 is incident on the light incident surface 19b is held in the positional relationship in the X-axis direction between the LED 17 and the light incident surface 19b, that is, between the LED 17 and the light incident surface 19b. It fluctuates according to the interval (distance), and as the interval increases, the incidence efficiency decreases. Conversely, as the interval decreases, the incidence efficiency tends to improve.
  • the LED substrate 18 and the light guide plate 19 are arranged in the X-axis direction and the Y-axis direction by providing the LED substrate 18 and the light guide plate 19 with the positioning structures 23, respectively. Since the LED board and the light guide plate are positioned indirectly via a part of the chassis as in the conventional case, the assembly error, etc.
  • the LED substrate 18 and the light guide plate 19 are positioned with high accuracy in the X-axis direction and the Y-axis direction by the positioning structure 23, so that the positional relationship in the X-axis direction between the LED 17 and the light incident surface 19b. Variation is extremely difficult to occur. Therefore, the incidence efficiency of the light incident on the light incident surface 19b from the LED 17 is less likely to vary, and the luminance of the outgoing light from the light incident on the light guide plate 19 is less likely to vary. . As described above, since the light incident efficiency to the light guide plate 19 and the luminance of the light emitted from the light guide plate 19 can be stabilized, the display quality of the image displayed on the liquid crystal panel 11 can be kept high.
  • the positioning convex portion 23a forming the positioning structure 23 is provided using the heat radiating plate portion 18b for radiating heat to the bottom plate 14a of the chassis 14 in the LED board 18, the heat radiating plate portion 18b Compared to the case where a structure that extends separately from the LED mounting portion 18a toward the light guide plate 19 is provided and the positioning convex portion 23a is provided there, the structure of the LED substrate 18 is simplified. In addition, the overall structure of the backlight device 12 can be simplified, the assembling work efficiency can be improved, and the manufacturing cost can be reduced.
  • the positioning structure 23 is arranged so as not to overlap the LEDs 17 in the X-axis direction, and is closest to the end of the group of LEDs 17 intermittently arranged in parallel in the Y-axis direction. Therefore, it is difficult to interfere with the light emitted from the LED 17 and incident on the light incident surface 19b, and a situation that obstructs the optical path is avoided. Accordingly, luminance unevenness due to the positioning structure 23 is less likely to occur in the light emitted from the light emitting surface 19 a of the light guide plate 19.
  • the positioning structure 23 is disposed in the non-display area NAA in the liquid crystal panel 11 and is disposed at a position overlapping the long side portion of the frame 16 in plan view (see FIG. 6). It is difficult for the user of the display device 10 to visually recognize the positioning structure 23, thereby further improving the display quality.
  • each LED 17 when each LED 17 emits light, each LED 17 generates heat. As shown in FIG. 4, the generated heat is transmitted from the LED 17 to the heat radiating plate 18b via the LED mounting portion 18a, and further to the bottom plate 14a of the chassis 14 in contact with the heat radiating plate 18b. Since the heat radiating plate portion 18b is arranged over a range covering most of the short side direction at both ends on the short side of the bottom plate 14a of the chassis 14, heat is efficiently transferred to the bottom plate 14a. Therefore, high heat dissipation performance can be obtained. The heat from the LED 17 is also dissipated by being transmitted from the LED mounting portion 18 a to the side plate 14 b on the short side of the chassis 14.
  • the light guide plate 19 may thermally expand with the heat storage.
  • the light guide plate 19 is positioned at two positions separated in the X-axis direction by the pair of positioning structures 23 as shown in FIGS.
  • the relative displacement with respect to the LED substrate 18 is regulated. Therefore, with the thermal expansion of the light guide plate 19, the amount of displacement of the light incident surface 19b in the direction approaching the LED 17 can be made very small, and the light incident surface 19b contacts the LED 17. Can be prevented.
  • the temperature in the chassis 14 decreases as the LEDs 17 are turned off, the light guide plate 19 that has been thermally expanded thermally contracts. Even in this case, since the light guide plate 19 is positioned by the pair of positioning structures 23, the light guide plate 19 is prevented from being displaced with respect to the LED substrates 18 due to thermal contraction.
  • the backlight device (illumination device) 12 includes the LED (light source) 17, the light incident surface 19 b that is arranged to face the LED 17 and receives light from the LED 17, and the incident light.
  • a light guide plate 19 having a light emitting surface 19a for emitting the emitted light, an LED mounting portion (light source mounting portion) 18a on which the LED 17 is mounted, and a heat radiating plate portion 18b extending from the LED mounting portion 18a toward the light guide plate 19 side.
  • the LED board (light source board) 18 including the LED board 18 and the light guide plate 19 is accommodated, and is parallel to the plate surface of the light guide plate 19 and sandwiches the heat radiating plate portion 18b with the light guide plate 19.
  • the LED board 18 and the light guide plate 19 are formed on the chassis 14 having the bottom plate 14a, the heat radiating plate portion 18b, and the light guide plate 19, respectively, and are engaged with each other.
  • the light emitted from the LED 17 enters the light incident surface 19b of the light guide plate 19 arranged to face the LED 17, and then propagates through the light guide plate 19 and then from the light emitting surface 19a. Emitted. Since the heat radiating plate portion 18b constituting the LED substrate 18 extends from the LED mounting portion 18a toward the light guide plate 19 and is sandwiched between the light guide plate 19 and the bottom plate 14a of the chassis 14, the heat radiating plate is temporarily provided. Compared to the case where the portion extends from the LED mounting portion 18a toward the side opposite to the light guide plate 19 side, this is preferable in reducing the size of the backlight device 12 and the like. Further, the heat generated from the LED 17 by the heat radiating plate portion 18b can be efficiently transmitted to the bottom plate 14a of the chassis 14 via the LED mounting portion 18a.
  • the LED substrate 18 and the light guide plate 19 are directly formed at least in the direction from the LED 17 toward the light incident surface 19b by the positioning structures 23 formed on the heat radiating plate portion 18b and the light guide plate 19 and fitted to each other.
  • the assembly error is as much as there is no inclusion.
  • the accuracy of positioning is higher. This makes it difficult for the incident efficiency of the light incident from the LED 17 to the light incident surface 19b and the luminance of the light emitted from the light emitting surface 19a of the light guide plate 19 to vary, and thus the light utilization efficiency and the luminance of the emitted light. Can be stabilized.
  • the positioning structure 23 is provided by using the heat radiating plate portion 18b extending from the LED mounting portion 18a toward the light guide plate 19 side in the LED substrate 18, it is temporarily separated from the heat radiating plate portion 18b. Compared with the case where a structure extending toward the light guide plate 19 is provided and the positioning structure 23 is provided there, it is preferable to simplify the entire structure.
  • the positioning structure 23 includes a positioning concave portion 23b formed on a plate surface of the light guide plate 19 facing the heat radiating plate portion 18b, and a positioning concave portion formed on the heat radiating plate portion 18b and projecting toward the light guide plate 19. It is comprised from the positioning convex-shaped part 23a fitted by 23b. In this way, since the protrusions are not formed on the plate surface of the light guide plate 19 facing the heat radiating plate portion 18b, the light guide plate 19 is excellent in handleability.
  • the LED board 18 is provided with the LED mounting part 18a and the LED 17 in the first place, although the positioning convex part 23a is formed on the heat radiating plate part 18b, the presence of the positioning convex part 23a is immediately It is difficult to become a cause of impairing the handleability of the substrate 18.
  • the positioning structure 23 is arranged at a position that does not overlap with the LED 17 in the direction from the LED 17 toward the light incident surface 19b. In this way, the light incident on the light incident surface 19b of the light guide plate 19 from the LED 17 is less likely to hit the positioning structure 23, so that unevenness due to the positioning structure 23 is less likely to occur in the emitted light from the light emitting surface 19a. Become.
  • a plurality of LEDs 17 are intermittently arranged along the light incident surface 19b, and the positioning structure 23 is a position that is shifted further to the end than the LED 17 that is arranged at the end most in the arrangement direction of the LEDs 17. It is arranged in. In this way, the unevenness of the emitted light due to the positioning structure 23 can be made more unlikely to occur as compared with the case where the positioning structure is arranged so as to be positioned between the adjacent LEDs 17.
  • a pair of LED substrates 18 are arranged so as to sandwich the light guide plate 19, whereas the light guide plates 19 are incident on the LEDs 17 mounted on the pair of LED substrates 18 so as to face each other.
  • a pair of surfaces 19b is provided, and the positioning structure 23 is provided on each of the heat radiating plate portions 18b and the light guide plate 19 included in the pair of LED substrates 18.
  • each of the heat radiating plate portions 18b and the light guide plate 19 included in the pair of LED substrates 18 arranged so as to sandwich the light guide plate 19 are positioned relative to each other by the positioning structures 23 provided respectively. Incidence efficiencies of light incident from the LEDs 17 mounted on the pair of LED substrates 18 to the opposing light incident surfaces 19b are less likely to vary. Therefore, the brightness of the light emitted from the light exit surface 19a is less likely to be uneven.
  • the LED mounting portion 18a rises from the heat radiating plate portion 18b and is arranged to face the light incident surface 19b, whereas the LED 17 has a top surface located on the opposite side of the mounting surface with respect to the LED mounting portion 18a.
  • the light emitting surface 17a is a top surface emitting type.
  • the top surface light emitting type LED 17 is provided on the LED mounting portion 18a that rises from the heat radiating plate portion 18b and is opposed to the light incident surface 19b, so that the heat radiating plate portion 18b rises.
  • positioning of LED17 about a direction becomes high. Thereby, it becomes possible to arrange
  • Embodiment 2 A second embodiment of the present invention will be described with reference to FIG. In this Embodiment 2, what changed the structure of LED117 and LED board 118 is shown. In addition, the overlapping description about the same structure, an effect
  • the LED board 118 is configured such that the LED mounting portion 118 a extends along the heat radiating plate portion 118 b and the bottom plate 114 a of the chassis 114. That is, the LED substrate 118 has a single flat plate shape along the X-axis direction and the Y-axis direction as a whole. Specifically, the LED mounting portion 118a is housed in the chassis 114 with its plate surface parallel to the X-axis direction and the Y-axis direction in the same manner as the heat radiating plate portion 118b. It has been broken.
  • LED117 mounted in this LED mounting part 118a is made into the side light emission type by which the side surface adjacent to the mounting surface with respect to LED mounting part 118a is made into the light emission surface 117a.
  • the LED 117 is configured to rise from the surface (mounting surface) facing the front side in the LED mounting portion 118a along the Z-axis direction, and the light emitting surface 117a is opposed to the light incident surface 119b of the light guide plate 119. Yes.
  • a wiring pattern (not shown) extending along the Y-axis direction is formed on the mounting surface of the LED 117 in the LED mounting portion 118a.
  • the LED board 118 is configured such that the LED mounting part 118a having the wiring pattern is parallel to the heat radiating plate part 118b, as compared with the LED board 18 (see FIG. 4) described in the first embodiment.
  • the light guide plate 119 can also be thinned in accordance with the rising height of the LED 117, and the backlight device 112 and the liquid crystal display device 110 as a whole can be thinned.
  • the LED mounting portion 118a is configured to extend along the heat dissipation plate portion 118b, while the LED 117 is a side surface adjacent to the mounting surface with respect to the LED mounting portion 118a.
  • the side surface light emitting type LED 117 is provided on the LED mounting portion 118a that is configured to extend along the heat radiating plate portion 118b, which is preferable in using the thin light guide plate 119. Therefore, it is also suitable for reducing the thickness of the backlight device 112 as a whole.
  • FIG. 10 shows a planar configuration in a state where the optical member 215 is stacked on the light guide plate 219.
  • the optical member 215 is provided with a light shielding portion 24 that is disposed closer to the LED 217 than the light incident surface 219 b of the light guide plate 219 and shields light from the LED 217. Is included.
  • a pair of light shielding portions 24 are provided at both ends of the optical member 215 on the short side, that is, both ends on the LED 217 side.
  • the light shielding portion 24 is a separate component from the optical member 215, and is integrated by being attached to the optical member 215 with an adhesive or the like.
  • the light shielding portion 24 is made of a synthetic resin, and the surface of the light shielding portion 24 exhibits a white color with excellent light reflectivity, similar to the reflective sheets 220 and 222.
  • the light shielding unit 24 is manufactured by using a reflection sheet that is generally used for the backlight device 212. Therefore, the light-shielding part 24 has extremely high light reflectivity and light-shielding property, the light reflectivity is set to a value close to 100% (for example, a range of 90% to 100%), and the light transmittance is 0. % (For example, a range of 0% to 10%).
  • the light-shielding part 24 is disposed so as to protrude from the light incident surface 219b of the light guide plate 219 to the LED 217 side, and is disposed opposite to the first reflection sheet 220 disposed on the back side.
  • the light emitted from the light can be efficiently incident on the light incident surface 219b while being repeatedly reflected between the first reflective sheet 220 and the light. Since the light-shielding part 24 has sufficient light-shielding property in addition to light reflectivity as described above, the light from the LED 217 is restricted from directly entering the end of the optical member 215 on the LED 217 side. It is possible to do.
  • the second reflection sheet 21 described in the first embodiment is omitted as the light shielding unit 24 is installed.
  • the light shielding unit 24 is attached to a light diffusing plate 215a closest to the light guide plate 219, that is, the optical member 215 in which a plurality of sheets are stacked on each other, which is directly mounted on the light emitting surface 219a of the light guide plate 219. .
  • the light from the LED 217 is blocked by the light shielding portion 24, so that it directly enters at least the end portion on the LED 217 side of each optical sheet 215b laminated on the front side of the diffusion plate 215a, or each optical sheet Entering each gap that may occur between 215b is prevented.
  • the light shielding part 24 is attached to the back side of the pair of front and back main surfaces of the diffusion plate 215a, that is, the main surface on the light guide plate 119 side. As a result, the light from the LED 217 is blocked by the light blocking unit 24 and thus directly enters the end of the diffuser plate 215a on the LED 217 side or enters a gap that may occur between the diffuser plate 215a and the light guide plate 219. Is prevented.
  • the light-shielding portion 24 includes a portion disposed on the LED 217 side with respect to the light incident surface 219b of the light guide plate 219 and a portion disposed on the side opposite to the LED 217 side with respect to the light incident surface 219b.
  • the former is arranged over a range where the former overlaps the LED 217 in a plan view. That is, the light-shielding portion 24 is disposed in a range extending over the LED 217 side and the light emission surface 219a side while straddling the light incident surface 219b. As shown in FIG.
  • the light-shielding portion 24 has a vertically long rectangular shape with a constant width and extending along the short side direction of the optical member 215, that is, the LED 217 arrangement direction (Y-axis direction). Therefore, the light-shielding portion 24 crosses the area where the LEDs 217 are arranged (light source arrangement area) and the area where the LEDs 217 are not arranged (light source non-arrangement area) in the arrangement direction of the LEDs 217 and is arranged over almost the entire range. Yes.
  • the light emitted from the LEDs 217 arranged intermittently along the Y-axis direction can be generated between the end of the optical member 215 on the LED 217 side or between the stacked optical members 215, It is possible to more reliably block the gap that may occur between the optical member 215 and the light guide plate 219.
  • the positioning structure 223 is formed on the positioning convex portion 223a formed on the heat radiating plate portion 218b of the LED substrate 218 and the light guide plate 219 and positioned.
  • the positioning concave portion 223b is formed in a hole shape penetrating the light guide plate 219 in the plate thickness direction, and opens to the heat radiating plate portion 218b side and the optical member 215 side, respectively.
  • the second positioning concave portion 223c is formed in a hole shape penetrating each optical member 215 in the thickness direction, and communicates with and aligns with the positioning concave portion 223b in the plane of each optical member 215. Arranged in position.
  • a pair of second positioning concave portions 223c are arranged at two positions separated from each other in the X-axis direction at the upper end portion in the vertical direction of each optical member 215.
  • the positioning convex portion 223a has a projecting dimension from the heat radiating plate 218b larger than the sum of the thickness of the light guide plate 219 and the thickness of each optical member 215.
  • the positioning convex portion 223a When assembled, when the light guide plate 219 is accommodated in the chassis 214 with the LED substrate 218 attached to the chassis 214, the positioning convex portion 223a is fitted into the positioning concave portion 223b, so that the light guide plate 219 with respect to the LED substrate 218 is obtained. Are positioned. Thereafter, when the optical members 215 are sequentially stacked on the light guide plate 219, the positioning convex portions 223a are fitted into the second positioning concave portions 223c, thereby positioning the optical members 215 with respect to the LED substrate 218.
  • the light shielding part 24 integrally provided on the diffusion plate 215a which is the optical member 215 is also positioned with high accuracy in the X-axis direction and the Y-axis direction with respect to the LED 217.
  • the performance can be exhibited stably.
  • the assembled liquid crystal display device 210 is used with the display surface of the liquid crystal panel 211 along the vertical direction.
  • each optical member 215 is positioned with the light guide plate 219 and the positioning convex portion. It will be supported in the state suspended from the upper side of the vertical direction by 223a.
  • the optical member 215 is provided so as to face the light emitting surface 219a of the light guide plate 219, and the positioning concave portion 223b includes the light guide plate 219 and the plate.
  • the optical member 215 is formed with a second positioning concave portion 223c into which the positioning convex portion 223a is fitted, whereas the optical member 215 is formed to penetrate in the thickness direction.
  • the positioning convex portion 223a penetrating the positioning concave portion 223b formed in the light guide plate 219 is fitted into the second positioning concave portion 223c formed in the optical member 215, whereby the light guide plate
  • the optical member 215 can be positioned together with the 219.
  • a light shielding portion 24 that protrudes toward the LED 217 side and is disposed closer to the LED 217 than the light incident surface 219b and blocks light from the LED 217.
  • the light emitted from the LED 217 is blocked by the light blocking unit 24, for example, directly incident on the end of the optical member 215 on the LED 217 side, or between the light guide plate 219 and the optical member 215. It is prevented from entering the possible gap. Accordingly, it is possible to prevent the light from the LED 217 from being emitted outside without entering the light incident surface 219b of the light guide plate 219.
  • the LED 217 mounted on the LED substrate 218 and the light shielding portion 24 provided on the optical member 215 are connected from the LED 217 to the light incident surface 219b. Therefore, the light shielding performance by the above-described light shielding portion 24 can be stably exhibited.
  • the light shielding portion 24 has light reflectivity for reflecting light. In this way, the light from the LED 217 can be reflected by the light shielding portion 24 and directed toward the light incident surface 219b. Thereby, the utilization efficiency of light can be improved.
  • the second positioning concave portion 223c has a hole shape penetrating the optical member 215 in the thickness direction, and the hole edge is supported in the vertical direction by the positioning convex portion 223a.
  • the hole edge of the second positioning concave portion 223c is supported in the vertical direction by the positioning convex portion 223a. That is, since the optical member 215 can be suspended and supported by the positioning convex portion 223a, for example, even when the optical member 215 undergoes thermal expansion or contraction, the optical member 215 itself is wrinkled. It is assumed that deformation such as bending hardly occurs. Accordingly, luminance unevenness can be more effectively suppressed.
  • Embodiment 4 A fourth embodiment of the present invention will be described with reference to FIG. In this Embodiment 4, what changed arrangement
  • a pair of LED substrates 318 are arranged at positions where the light guide plate 319 is sandwiched from both sides in the short side direction (Y-axis direction, vertical direction).
  • the LED board 318 includes an LED mounting portion 318a extending along the side plate 314b on the long side of the chassis 314, and a heat radiating plate extending from the LED mounting portion 318a toward the light guide plate 319 along the Y-axis direction. Part 318b.
  • both end surfaces on the long side are light incident surfaces 319b that are opposed to the LEDs 317, respectively.
  • a pair of positioning convex portions 323a constituting the positioning structure 323 is provided on the heat dissipation plate portion 318b of the LED substrate 318 disposed on the upper side in the vertical direction.
  • the positioning convex portion 323a is arranged at a position further shifted closer to the end than the LED 317 located at the end of the LEDs 317 intermittently arranged in parallel along the X-axis direction. That is, the positioning structure 323 according to the present embodiment is disposed at the upper corner of the light guide plate 319 in the vertical direction.
  • Embodiment 5 of the present invention will be described with reference to FIG.
  • the fifth embodiment should be called a further modification of the above-described fourth embodiment, and shows an LED substrate 418 arranged only on one end side of the light guide plate 419.
  • action, and effect as above-mentioned Embodiment 4 is abbreviate
  • only one LED substrate 418 according to this embodiment is disposed on the lower side in the vertical direction with respect to the light guide plate 419.
  • a pair of positioning convex portions 423a constituting the positioning structure 423 is formed on the heat radiating plate portion 418b constituting the LED substrate 418, and the arrangement thereof is a lower corner portion in the vertical direction of the light guide plate 419. .
  • Embodiment 6 of the present invention will be described with reference to FIG.
  • LED substrates 518 are provided corresponding to the four sides of the light guide plate 519, respectively.
  • action, and effect as above-mentioned Embodiment 1 is abbreviate
  • the LED substrate 518 includes a pair of first LED substrates 518 ⁇ / b> A disposed at positions where the light guide plate 519 is sandwiched from both sides in the long side direction (X-axis direction), and the light guide plate 519. And a pair of second LED substrates 518B arranged at positions sandwiched from both sides in the short side direction (Y-axis direction, vertical direction). Since the configuration of the pair of first LED boards 518A is the same as that of the LED board 18 described in the first embodiment including the positioning structure 523, overlapping description is omitted.
  • the LED mounting portion 518Ba of the second LED substrate 518B has a length equivalent to the long side dimension of the light guide plate 519, and a plurality of LEDs 517 are intermittently arranged in parallel along the length direction (X-axis direction).
  • the heat dissipation plate portion 518Bb of the second LED substrate 518B has a shorter dimension in the X-axis direction than the LED mounting portion 518Ba, and the difference is the extension length dimension of the heat dissipation plate portion 518Aa of the pair of first LED substrates 518A. It is about a minute.
  • the heat dissipation plate portion 518Ba of the second LED substrate 518B is sized so as not to overlap the heat dissipation plate portion 518Aa of the first LED substrate 518A.
  • both end surfaces on the short side are the first light incident surfaces 519Ab facing each LED 517 mounted on the first LED substrate 518A, respectively.
  • Both end surfaces on the long side are second light incident surfaces 519Bb that face each LED 517 mounted on the second LED substrate 518B.
  • a seventh embodiment will be described with reference to FIG. 15 or FIG.
  • the seventh embodiment shows a configuration in which only the optical member 615 is positioned.
  • the positioning structure 623 includes a positioning convex portion 623 a formed on the heat radiating plate portion 618 b of the LED substrate 618 and a positioning concave portion formed on each optical member 615. 623b, and is not formed on the light guide plate 619.
  • the optical member 615 has a size wider than that of the light guide plate 619 in a plan view, and the positioning concave portion 623b described above penetrates in the thickness direction in a non-overlapping portion that does not overlap with the light guide plate 619. Is formed.
  • the LED substrate 618 has a heat radiating plate portion 618b having a size over a wider range than the light guide plate 619 in a plan view, and the positioning convex portion 623a described above is formed on a non-overlapping portion that does not overlap the light guide plate 619. Is formed.
  • the projecting dimension from the heat sink plate 618b is larger than the sum of the thickness of the light guide plate 619 and the thickness of each optical member 615.
  • each positioning concave portion 623b is fitted in the side position of the light guide plate 619.
  • the same light shielding portion 624 as that described in the third embodiment is provided at the end of the optical member 615 on the LED 617 side. Therefore, the light shielding performance of the light shielding portion 624 can be stably exhibited by accurately positioning the optical member 615, the LED substrate 618, and the LED 617 in the X-axis direction by the positioning structure 623.
  • the positioning structure is shown in which the positioning convex portion is formed on the LED substrate side and the positioning concave portion is formed on the light guide plate side. You may make it form a concave-shaped part and a positioning convex-shaped part in the light-guide plate side, respectively.
  • the positioning convex portion is provided, the first positioning convex portion is fitted into the positioning concave portion of the heat radiating plate portion, and the second positioning convex portion is fitted into the second positioning concave portion of each optical member.
  • the positioning concave portion is formed in a concave shape that does not penetrate the light guide plate in the plate thickness direction.
  • the positioning concave portion has the thickness of the light guide plate. It is also possible to adopt a configuration that is formed in a hole shape penetrating in the direction. In that case, the positioning convex portion is sized so as to protrude from the light emitting surface to the front side in a state of being fitted in the hole-shaped positioning concave portion, or not to protrude from the light emitting surface (the light emitting surface and (A size that is flush or a size that retracts more than the light exit surface).
  • the arrangement of the positioning structure can be changed as appropriate.
  • the positioning structure can be arranged near the lower end portion in the vertical direction of the light guide plate, near the central portion in the vertical direction, or the like.
  • the LED substrate can be arranged on the upper side in the vertical direction, and the positioning structure can be arranged in the vicinity of the upper end portion in the vertical direction or the central portion in the vertical direction on the light guide plate.
  • the positioning structure when changing the arrangement of the positioning structure, for example, can be arranged between adjacent LEDs arranged intermittently in parallel. It is also possible to arrange the positioning structure so as to face the light emitting surface of the LED.
  • the specific shape of the positioning structure can be changed as appropriate.
  • the positioning convex portion and the positioning concave portion may have a circular shape, an elliptical shape, a square shape, a trapezoidal shape, a rhombus shape, a triangular shape, a pentagonal or more polygonal shape in a plan view. Is possible.
  • the formation range of the heat sink portion of the LED substrate can be changed as appropriate.
  • the second positioning concave portion is formed on the optical member not having the light shielding portion, and the positioning is performed. It is also possible to form the second positioning concave portion only in the optical member having the portion and not to form the second positioning concave portion in the optical member not having the light shielding portion.
  • Embodiments 1 to 6 described above the case where three optical members are used has been exemplified.
  • the number of optical members used can be appropriately changed to other than three (two or less, four or more). Is possible.
  • the specific kind of optical member to be used can be changed as appropriate.
  • the present invention also includes a configuration in which a total of three are arranged one by one with respect to both end portions on the side and one end portion on the long side.
  • the color portion of the color filter included in the liquid crystal panel is exemplified as three colors of R, G, and B.
  • the color portion may be four or more colors.
  • an LED is used as the light source.
  • other light sources such as an organic EL can be used.
  • a TFT is used as a switching element of a liquid crystal display device.
  • the present invention can also be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)).
  • a switching element other than TFT for example, a thin film diode (TFD)
  • the present invention can also be applied to a liquid crystal display device for monochrome display.
  • liquid crystal display device using the liquid crystal panel as the display panel has been exemplified.
  • present invention can also be applied to display devices using other types of display panels.
  • the television receiver provided with the tuner is exemplified, but the present invention is also applicable to a display device that does not include the tuner.
  • LED mounting part (light source mounting part), 18b, 118b, 218b, 318b, 418b, 518Ab, 518Bb ... heat dissipation Plate part, 19, 119, 219, 319, 419, 519 ... light guide plate, 19a, 219a ... light emitting surface, 19b, 219b, 319b ... light incident surface, 19c ... bottom surface (plate surface) ), 3, 223, 323, 423, 523 ... positioning structure, 23a, 223a, 323a, 423a ... positioning convex part, 23b, 223b ... positioning concave part, 215 ... optical member, 223c ... Second positioning concave portion, 518A ... first LED substrate (light source substrate), 518B ... second LED substrate (light source substrate), 519Ab ... first light incident surface (light incident surface), 519Bb ... Second light incident surface (light incident surface), TV ... TV receiver

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Abstract

This backlight device is provided with: an LED (17); a light guide plate (19) having a light exit surface (19a) and a light entrance surface (19b) disposed facing the LED (17); an LED substrate (18) having an LED mounting section (18a) to which the LED (17) is mounted and a radiator plate section (18b) extending from the LED mounting section (18a) towards the light guide plate (19) side; a chassis (14) that houses the LED substrate (18) and the light guide plate (19) and that has a bottom plate (14a) parallel to the plate surface of the light guide plate (19) and sandwiching the radiator plate section (18b) with respect to the light guide plate (19); and a positioning structure (23) that, by means of being formed at the radiator plate section (18b) and the light guide plate (19), causing the fitting together thereof by means of a protrusion/recession, positions the LED substrate (18) and the light guide plate (19) at least with respect to the direction from the LED (17) towards the light entrance surface (19b).

Description

照明装置、表示装置、及びテレビ受信装置Lighting device, display device, and television receiver
 本発明は、照明装置、表示装置、及びテレビ受信装置に関する。 The present invention relates to a lighting device, a display device, and a television receiver.
 近年、テレビ受信装置をはじめとする画像表示装置の表示素子は、従来のブラウン管から液晶パネルやプラズマディスプレイパネルなどの薄型の表示パネルに移行しつつあり、画像表示装置の薄型化を可能としている。液晶表示装置は、これに用いる液晶パネルが自発光しないため、別途に照明装置としてバックライト装置を必要としており、バックライト装置はその機構によって直下型とエッジライト型とに大別されている。液晶表示装置の一層の薄型化を実現するには、エッジライト型のバックライト装置を用いるのが好ましく、その一例として下記特許文献1に記載されたものが知られている。 In recent years, the display elements of image display devices such as television receivers are shifting from conventional cathode ray tubes to thin display panels such as liquid crystal panels and plasma display panels, which enables thinning of image display devices. Since the liquid crystal panel used for the liquid crystal display device does not emit light by itself, a backlight device is separately required as a lighting device, and the backlight device is roughly classified into a direct type and an edge light type according to the mechanism. In order to further reduce the thickness of the liquid crystal display device, it is preferable to use an edge light type backlight device, and an example described in Patent Document 1 below is known.
特開2010-276628号公報JP 2010-276628 A
(発明が解決しようとする課題)
 上記した特許文献1に記載されたものでは、バックライト装置を構成するシャーシに切り起こし片を形成して、その切り起こし片に、光源を実装した光源基板を取り付けるようにしている。その上で、導光板に凸部を形成しておき、その凸部を切り起こし片に接触させつつ固定している。
(Problems to be solved by the invention)
In what is described in Patent Document 1 described above, a cut-and-raised piece is formed in the chassis constituting the backlight device, and a light source substrate on which a light source is mounted is attached to the cut-and-raised piece. Then, a convex portion is formed on the light guide plate, and the convex portion is cut and raised and fixed in contact with the piece.
 しかしながら、上記した構成では、切り起こし片に対する光源基板の組み付け誤差が生じ得るのに加えて、切り起こし片に対する導光板の組み付け誤差もが生じ得ることとなるため、光源基板と導光板との位置関係がばらつき易くなっており、位置決め精度が低いものとなっていた。導光板には、光源と対向状をなすとともに光源からの光が入射される光入射面が備えられており、この光入射面と光源との間の間隔が変動すると、光の入射効率がばらつくとともに出射光の輝度もばらつくため、表示品位が悪化するおそれがあった。 However, in the above configuration, in addition to the error in assembling the light source substrate with respect to the cut and raised pieces, an error in assembling the light guide plate with respect to the cut and raised pieces may also occur. The relationship is easy to vary, and the positioning accuracy is low. The light guide plate is provided with a light incident surface facing the light source and receiving light from the light source. If the distance between the light incident surface and the light source varies, the light incident efficiency varies. At the same time, since the luminance of the emitted light varies, the display quality may be deteriorated.
 本発明は上記のような事情に基づいて完成されたものであって、高い位置決め精度を得ることを目的とする。 The present invention has been completed based on the above circumstances, and an object thereof is to obtain high positioning accuracy.
(課題を解決するための手段)
 本発明の照明装置は、光源と、前記光源と対向状に配されるとともに前記光源からの光が入射される光入射面、及び入射した光を出射させる光出射面を有する導光板と、前記光源が実装される光源実装部と前記光源実装部から前記導光板側に向けて延在する放熱板部とを有する光源基板と、前記光源基板及び前記導光板を収容するものであって、前記導光板の板面に並行するとともに前記導光板との間で前記放熱板部を挟み込む底板を有するシャーシと、前記放熱板部と前記導光板とにそれぞれ形成されるとともに互いに凹凸嵌合することで、前記光源基板と前記導光板とを、少なくとも前記光源から前記光入射面に向かう方向について位置決めする位置決め構造と、を備える。
(Means for solving the problem)
The illumination device of the present invention includes a light source, a light guide plate that is arranged to face the light source and receives a light incident surface on which light from the light source is incident, and a light emitting surface that emits the incident light. A light source substrate having a light source mounting portion on which a light source is mounted and a heat radiating plate portion extending from the light source mounting portion toward the light guide plate, and the light source substrate and the light guide plate, By forming a chassis parallel to the plate surface of the light guide plate and having a bottom plate that sandwiches the heat radiating plate portion between the light guide plate and the heat radiating plate portion and the light guide plate, respectively, and engaging with each other in an uneven manner. And a positioning structure that positions the light source substrate and the light guide plate at least in a direction from the light source toward the light incident surface.
 このようにすれば、光源から発せられた光は、光源と対向状に配される導光板の光入射面に入射してから、導光板内を伝播された後に光出射面から出射される。光源基板を構成する放熱板部は、光源実装部から導光板側に向けて延在するとともに導光板とシャーシの底板との間に挟み込まれているから、仮に放熱板部が光源実装部から導光板側とは反対側に向けて延びる形態とされた場合に比べると、当該照明装置の小型化などを図る上で好適とされる。また、放熱板部によって光源から発せられた熱を、光源実装部を介してシャーシの底板に対して効率的に伝達させることができる。 In this way, the light emitted from the light source is incident on the light incident surface of the light guide plate arranged opposite to the light source, and is then propagated through the light guide plate and then emitted from the light exit surface. Since the heat radiating plate portion constituting the light source substrate extends from the light source mounting portion toward the light guide plate side and is sandwiched between the light guide plate and the bottom plate of the chassis, the heat radiating plate portion is temporarily guided from the light source mounting portion. Compared to a case where the light source is extended toward the side opposite to the light plate side, it is preferable in reducing the size of the lighting device. Further, the heat generated from the light source by the heat radiating plate portion can be efficiently transmitted to the bottom plate of the chassis via the light source mounting portion.
 そして、光源基板と導光板とは、放熱板部と導光板とにそれぞれ形成されるとともに互いに凹凸嵌合する位置決め構造によって、少なくとも光源から光入射面に向かう方向について直接的に位置決めされるから、従来のように光源基板と導光板とがシャーシの一部を介して間接的に位置決めされる構成のものに比べると、介在物が存在しない分だけ組み付け誤差などの影響が少なくなり、もって位置決めに係る精度がより高いものとなる。これにより、光源から光入射面に入射される光の入射効率、並びに導光板の光出射面からの出射光の輝度にばらつきが生じ難くなり、もって光の利用効率及び出射光の輝度を安定させることができる。しかも、位置決め構造が、光源基板のうち光源実装部から導光板側に向けて延在する放熱板部を利用して設けられているから、仮に放熱板部とは別途に導光板側に向けて延在する構造物を設けてそこに位置決め構造を設けた場合に比べると、全体の構造の簡素化を図る上で好適となる。 And since the light source substrate and the light guide plate are directly positioned at least in the direction from the light source to the light incident surface by the positioning structure that is formed on the heat dissipation plate portion and the light guide plate, respectively, and is fitted to the concave and convex portions, Compared to the conventional configuration in which the light source board and light guide plate are positioned indirectly via a part of the chassis, the effect of assembly errors is reduced by the amount of inclusions, so positioning Such accuracy is higher. This makes it difficult for variations in the incident efficiency of light incident on the light incident surface from the light source and the luminance of the emitted light from the light emitting surface of the light guide plate, thereby stabilizing the light utilization efficiency and the luminance of the emitted light. be able to. In addition, since the positioning structure is provided by using the heat radiating plate portion extending from the light source mounting portion to the light guide plate side of the light source substrate, it is temporarily directed to the light guide plate side separately from the heat radiating plate portion. Compared to the case where an extending structure is provided and a positioning structure is provided there, it is preferable for simplifying the entire structure.
 本発明の実施態様として、次の構成が好ましい。
(1)前記位置決め構造は、前記導光板における前記放熱板部と対向する板面に形成される位置決め凹状部と、前記放熱板部に形成されるとともに前記導光板に向けて突出して前記位置決め凹状部に嵌合される位置決め凸状部とから構成されている。このようにすれば、導光板における放熱板部と対向する板面に突起物が形成されない構成とすることができるから、導光板の取り扱い性に優れる。なお、光源基板は、放熱板部に位置決め凸状部が形成されているものの、そもそも光源実装部及び光源が備えられたものであるから、位置決め凸状部の存在が直ちに光源基板の取り扱い性を損なう原因とはなり難くなっている。
The following configuration is preferable as an embodiment of the present invention.
(1) The positioning structure includes a positioning concave portion formed on a surface of the light guide plate facing the heat radiating plate portion, a positioning concave portion formed on the heat radiating plate portion and protruding toward the light guide plate. It is comprised from the positioning convex-shaped part fitted by the part. If it does in this way, since it can be set as the structure by which a protrusion is not formed in the board surface facing the heat sink part in a light-guide plate, it is excellent in the handleability of a light-guide plate. In addition, although the light source substrate is provided with the light source mounting portion and the light source in the first place, although the positioning convex portion is formed on the heat radiating plate portion, the presence of the positioning convex portion immediately improves the handleability of the light source substrate. It is less likely to cause damage.
(2)前記導光板における前記光出射面に対して対向状に配される光学部材が備えられており、前記位置決め凹状部は、前記導光板をその板厚方向に貫通する形態とされるのに対し、前記光学部材には、前記位置決め凸状部が嵌合される第2位置決め凹状部が形成されている。このようにすれば、導光板に形成された位置決め凹状部を貫通する位置決め凸状部が、光学部材に形成された第2位置決め凹状部に嵌合されることで、導光板と共に光学部材についても位置決めを図ることができる。 (2) An optical member arranged opposite to the light exit surface of the light guide plate is provided, and the positioning concave portion is configured to penetrate the light guide plate in the plate thickness direction. On the other hand, the optical member is formed with a second positioning concave portion into which the positioning convex portion is fitted. In this way, the positioning convex portion passing through the positioning concave portion formed in the light guide plate is fitted to the second positioning concave portion formed in the optical member, so that the optical member together with the light guide plate is also used. Positioning can be achieved.
(3)前記光学部材における前記光源側の端部には、前記光源側に向けて突出して前記光入射面よりも前記光源側に配されるとともに前記光源からの光を遮る遮光部が設けられている。このようにすれば、光源から発せられた光は、遮光部によって遮られることで、例えば光学部材における光源側の端部に直接入射したり、導光板と光学部材との間に生じ得る隙間に入るのが防がれる。これにより、光源からの光が導光板の光入射面に入射することなく外部に出射するのを防ぐことができる。ここで、第2位置決め凹状部に位置決め凸状部が嵌合されると、光源基板に実装された光源と光学部材に設けられた遮光部とが、光源から光入射面に向かう方向について高い精度でもって位置決めされるから、上記した遮光部による遮光性能を安定的に発揮させることができる。 (3) The light source side end portion of the optical member is provided with a light shielding portion that protrudes toward the light source side and is disposed closer to the light source side than the light incident surface and blocks light from the light source. ing. In this way, the light emitted from the light source is blocked by the light shielding portion, so that, for example, it directly enters the end of the optical member on the light source side or in a gap that may be generated between the light guide plate and the optical member. It is prevented from entering. Thereby, it can prevent that the light from a light source radiate | emits outside, without entering into the light-incidence surface of a light-guide plate. Here, when the positioning convex portion is fitted to the second positioning concave portion, the light source mounted on the light source substrate and the light shielding portion provided on the optical member are highly accurate in the direction from the light source toward the light incident surface. Therefore, since the positioning is performed, the light shielding performance by the above-described light shielding portion can be stably exhibited.
(4)前記遮光部は、光を反射する光反射性を有している。このようにすれば、光源からの光を遮光部によって反射して光入射面に向かわせることができる。これにより、光の利用効率を向上させることができる。 (4) The light shielding portion has light reflectivity for reflecting light. If it does in this way, the light from a light source can be reflected by the light-shielding part, and can be made to go to a light-incidence surface. Thereby, the utilization efficiency of light can be improved.
(5)前記第2位置決め凹状部は、前記光学部材をその厚さ方向に貫通する孔状をなしており、その孔縁が前記位置決め凸状部により鉛直方向について支持される。このようにすれば、第2位置決め凹状部に位置決め凸状部を嵌合させると、第2位置決め凹状部の孔縁が位置決め凸状部により鉛直方向について支持される。つまり、位置決め凸状部により光学部材を吊り下げて支持することが可能とされるから、例えば光学部材に熱膨張または熱収縮が生じた場合でも、光学部材自身の重量によりしわや撓みなどの変形が生じ難いものとされる。もって、輝度ムラをより効果的に抑制することができる。 (5) The second positioning concave portion has a hole shape penetrating the optical member in the thickness direction, and the hole edge is supported in the vertical direction by the positioning convex portion. In this way, when the positioning convex portion is fitted to the second positioning concave portion, the hole edge of the second positioning concave portion is supported in the vertical direction by the positioning convex portion. In other words, since the optical member can be suspended and supported by the positioning convex portion, for example, even when the optical member is thermally expanded or contracted, deformation such as wrinkles or deflection is caused by the weight of the optical member itself. Is unlikely to occur. Accordingly, luminance unevenness can be more effectively suppressed.
(6)前記位置決め構造は、前記光源から前記光入射面に向かう方向について前記光源とは重なり合わない位置に配されている。このようにすれば、光源から導光板の光入射面に入射した光が、位置決め構造に当たり難くなるから、光出射面からの出射光に、位置決め構造に起因するムラが生じ難くなる。 (6) The positioning structure is arranged at a position that does not overlap the light source in a direction from the light source toward the light incident surface. In this way, light incident on the light incident surface of the light guide plate from the light source is less likely to hit the positioning structure, so that unevenness due to the positioning structure is less likely to occur in the emitted light from the light exit surface.
(7)前記光源は、前記光入射面に沿って複数が間欠的に並んで配されており、前記位置決め構造は、前記光源の並び方向について最も端に配された前記光源よりもさらに端寄りにずれた位置に配されている。このようにすれば、仮に位置決め構造が隣り合う光源の間に位置するよう配された場合に比べると、位置決め構造に起因する出射光のムラを一層生じ難くすることができる。 (7) A plurality of the light sources are intermittently arranged along the light incident surface, and the positioning structure is closer to the end than the light source arranged at the end in the arrangement direction of the light sources. It is arranged at a position shifted to. In this way, it is possible to further reduce the unevenness of the emitted light caused by the positioning structure, as compared with the case where the positioning structure is arranged between adjacent light sources.
(8)前記光源基板は、前記導光板を挟み込む形で一対配されているのに対して、前記導光板は、一対の前記光源基板に実装された各前記光源とそれぞれ対向状をなす形で前記光入射面を一対有しており、前記位置決め構造は、一対の前記光源基板が有する各前記放熱板部と前記導光板とにそれぞれ設けられている。このようにすれば、導光板を挟み込む形で配される一対の光源基板が有する各放熱板部と導光板とがそれぞれに設けられた位置決め構造によって相互に位置決めされるから、一対の光源基板に実装された各光源から、対向する各光入射面にそれぞれ入射される光の入射効率がそれぞればらつき難くなる。従って、光出射面からの出射光の輝度に一層ムラが生じ難くなる。 (8) The light source substrates are arranged in a pair with the light guide plate interposed therebetween, whereas the light guide plates are opposed to the light sources mounted on the pair of light source substrates. A pair of the light incident surfaces is provided, and the positioning structure is provided on each of the heat radiating plate portions and the light guide plate of the pair of light source substrates. In this way, since each heat radiating plate part and the light guide plate of the pair of light source substrates arranged so as to sandwich the light guide plate are positioned relative to each other by the positioning structure provided respectively, Incidence efficiencies of light incident on the respective light incident surfaces facing each other from the mounted light sources are difficult to vary. Therefore, the brightness of the light emitted from the light exit surface is less likely to be uneven.
(9)前記光源実装部は、前記放熱板部から立ち上がって前記光入射面と対向状に配されるのに対し、前記光源は、前記光源実装部に対する実装面とは反対側に位置する頂面が発光面とされる頂面発光型のLEDからなる。このようにすれば、放熱板部から立ち上がって光入射面と対向状に配される光源実装部に、光源として頂面発光型のLEDを設けるようにしているから、放熱板部の立ち上がり方向についてのLEDの配置の自由度が高くなる。これにより、LEDを導光板の光入射面に対して、光の入射効率が良好になるような適切な位置に配することが可能となる。 (9) Whereas the light source mounting portion rises from the heat radiating plate portion and is arranged to face the light incident surface, the light source is positioned on the opposite side of the mounting surface with respect to the light source mounting portion. It consists of a top-emitting LED whose surface is the light emitting surface. In this way, since the top light emitting type LED is provided as the light source in the light source mounting portion that stands up from the heat radiating plate and faces the light incident surface, the rising direction of the heat radiating plate portion The degree of freedom of LED arrangement is increased. Thereby, it becomes possible to arrange | position LED in the suitable position where the incident efficiency of light becomes favorable with respect to the light-incidence surface of a light-guide plate.
(10)前記光源実装部は、前記放熱板部に沿って延在する形態とされるのに対し、前記光源は、前記光源実装部に対する実装面に隣り合う側面が発光面とされる側面発光型のLEDからなる。このようにすれば、放熱板部に沿って延在する形態とされる光源実装部に、光源として側面発光型のLEDを設けるようにしているから、薄型の導光板を用いる上で好適となり、もって当該照明装置全体の薄型化を図る上でも好適となる。 (10) Whereas the light source mounting portion is configured to extend along the heat radiating plate portion, the light source has side light emission in which a side surface adjacent to the mounting surface with respect to the light source mounting portion is a light emitting surface. It consists of a type of LED. In this way, since the side light emitting type LED is provided as the light source in the light source mounting portion that is configured to extend along the heat radiating plate portion, it is suitable for using a thin light guide plate, Therefore, it is also suitable for reducing the thickness of the entire lighting device.
 次に、上記課題を解決するために、本発明の表示装置は、上記記載の照明装置と、前記照明装置からの光を利用して表示を行う表示パネルとを備える。 Next, in order to solve the above problem, a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.
 このような表示装置によると、表示パネルに対して光を供給する照明装置が、光源基板と導光板との位置決め精度が高くなっていて、出射光の輝度が安定したものとなっているから、表示品質の優れた表示を実現することが可能となる。 According to such a display device, the illumination device that supplies light to the display panel has high positioning accuracy between the light source substrate and the light guide plate, and the brightness of the emitted light is stable. It is possible to realize display with excellent display quality.
 前記表示パネルとしては液晶パネルを例示することができる。このような表示装置は液晶表示装置として、種々の用途、例えばテレビやパソコンのディスプレイ等に適用でき、特に大型画面用として好適である。 A liquid crystal panel can be exemplified as the display panel. Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
(発明の効果)
 本発明によれば、高い位置決め精度を得ることができる。
(The invention's effect)
According to the present invention, high positioning accuracy can be obtained.
本発明の実施形態1に係るテレビ受信装置の概略構成を示す分解斜視図1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention. 液晶表示装置の概略構成を示す分解斜視図Exploded perspective view showing schematic configuration of liquid crystal display device 液晶表示装置に備わるバックライト装置におけるシャーシと導光板とLED基板との配置構成を示す平面図The top view which shows arrangement | positioning structure of the chassis in the backlight apparatus with which a liquid crystal display device is equipped, a light-guide plate, and an LED board. 図3のiv-iv線断面図Sectional view taken along line iv-iv in FIG. 図3のv-v線断面図V-v sectional view of FIG. 図3のvi-vi線断面図Sectional view along line vi-vi in FIG. シャーシとLED基板との配置構成を示す平面図The top view which shows the arrangement configuration of a chassis and an LED board 導光板の底面図Bottom view of light guide plate 本発明の実施形態2に係るLED及びLED基板の断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of LED which concerns on Embodiment 2 of this invention, and an LED board. 本発明の実施形態3に係るシャーシと遮光部を有する光学部材とLED基板との配置構成を示す平面図The top view which shows the arrangement structure of the optical member and LED board which have the chassis which concerns on Embodiment 3 of this invention, and a light-shielding part. 図10のxi-xi線断面図Xi-xi sectional view of FIG. 本発明の実施形態4に係るシャーシと導光板とLED基板との配置構成を示す平面図The top view which shows the arrangement configuration of the chassis which concerns on Embodiment 4 of this invention, a light-guide plate, and an LED board. 本発明の実施形態5に係るシャーシと導光板とLED基板との配置構成を示す平面図The top view which shows the arrangement configuration of the chassis which concerns on Embodiment 5 of this invention, a light-guide plate, and an LED board. 本発明の実施形態6に係るシャーシと導光板とLED基板との配置構成を示す平面図The top view which shows the arrangement configuration of the chassis which concerns on Embodiment 6 of this invention, a light-guide plate, and an LED board. 実施形態7に係るシャーシと遮光部を有する光学部材とLED基板との配置構成を示す平面図The top view which shows the arrangement configuration of the chassis which concerns on Embodiment 7, the optical member which has a light-shielding part, and an LED board. 図15のxvi-xvi線断面図Xvi-xvi sectional view of FIG.
 <実施形態1>
 本発明の実施形態1を図1から図8によって説明する。本実施形態では、液晶表示装置10について例示する。なお、各図面の一部にはX軸、Y軸及びZ軸を示しており、各軸方向が各図面で示した方向となるように描かれている。このうちY軸方向は、鉛直方向と一致し、X軸方向は、水平方向と一致している。また、特に断りがない限りは、上下の記載については鉛直方向を基準とする。また、図4から図6に示す上側を表側とし、同図下側を裏側とする。
<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the liquid crystal display device 10 is illustrated. In addition, a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing. Among these, the Y-axis direction coincides with the vertical direction, and the X-axis direction coincides with the horizontal direction. In addition, unless otherwise noted, the vertical direction is used as a reference for upper and lower descriptions. Moreover, let the upper side shown in FIGS. 4-6 be a front side, and let the lower side of the figure be a back side.
 本実施形態に係るテレビ受信装置TVは、図1に示すように、液晶表示装置10と、当該液晶表示装置10を挟むようにして収容する表裏両キャビネットCa,Cbと、電源Pと、チューナーTと、スタンドSとを備えて構成されており、スタンドSによって液晶表示装置10の表示面を鉛直方向(Y軸方向)に沿わせた状態で支持されている。液晶表示装置(表示装置)10は、全体として横長の方形(矩形状、長手状)をなし、縦置き状態で収容されている。この液晶表示装置10は、図2に示すように、表示パネルである液晶パネル11と、外部光源であるバックライト装置(照明装置)12とを備え、これらが枠状のベゼル13などにより一体的に保持されるようになっている。なお、本実施形態に言う「液晶表示装置10の表示面が鉛直方向に沿う」とは、液晶表示装置10の表示面が鉛直方向に平行となる態様に限定されず、水平方向に沿う方向よりも相対的に鉛直方向に沿う方向に設置されたものを意味し、例えば鉛直方向に対して0°~45°、好ましくは0°~30°傾いたものを含むことを意味するものである。 As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power source P, a tuner T, The liquid crystal display device 10 is supported by the stand S in a state where the display surface of the liquid crystal display device 10 is along the vertical direction (Y-axis direction). The liquid crystal display device (display device) 10 has a horizontally long rectangular shape (rectangular shape, longitudinal shape) as a whole, and is accommodated in a vertically placed state. As shown in FIG. 2, the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and a backlight device (illumination device) 12 that is an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained. Note that “the display surface of the liquid crystal display device 10 is along the vertical direction” as referred to in the present embodiment is not limited to an aspect in which the display surface of the liquid crystal display device 10 is parallel to the vertical direction, but from a direction along the horizontal direction. Also, it means that it is installed in a direction relatively along the vertical direction, and includes, for example, those inclined by 0 ° to 45 °, preferably 0 ° to 30 ° with respect to the vertical direction.
 液晶パネル11は、図2に示すように、平面に視て横長の方形(矩形状、長手状)をなしており、透光性に優れた一対のガラス製の基板が所定のギャップを隔てた状態で貼り合わせられるとともに、両基板間に液晶が封入された構成とされる。一方の基板には、互いに直交するソース配線とゲート配線とに接続されたスイッチング素子(例えばTFT)と、そのスイッチング素子に接続された画素電極、さらには配向膜等が設けられ、他方の基板には、R(赤色),G(緑色),B(青色)等の各着色部が所定配列で配置されたカラーフィルタや対向電極、さらには配向膜等が設けられている。この液晶パネル11は、図3に示すように、画面中央側にあって画像が表示可能な表示領域AAと、画面外周端側にあって表示領域AAの周りを取り囲む枠状(額縁状)をなす非表示領域NAAとに区分されている。なお、図3において一点鎖線で囲った内側の領域が表示領域AAを示し、外側の領域が非表示領域NAAを示している。また、両基板の外側には偏光板が配されている。 As shown in FIG. 2, the liquid crystal panel 11 has a horizontally long rectangular shape (rectangular shape, longitudinal shape) in a plan view, and a pair of glass substrates having excellent translucency are separated by a predetermined gap. In addition, the liquid crystal is sealed between both substrates. One substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. Are provided with a color filter in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, a counter electrode, and an alignment film. As shown in FIG. 3, the liquid crystal panel 11 has a display area AA on the center side of the screen where an image can be displayed and a frame shape (frame shape) surrounding the display area AA on the outer peripheral edge side of the screen. It is divided into a non-display area NAA. In FIG. 3, the inner area surrounded by the alternate long and short dash line indicates the display area AA, and the outer area indicates the non-display area NAA. A polarizing plate is disposed on the outside of both substrates.
 バックライト装置12は、図2に示すように、表側(光出射側、液晶パネル11側)に向けて開口する光出射部14cを有した略箱型をなすシャーシ14と、シャーシ14の光出射部14cを覆うようにして配される光学部材15とを備える。さらに、シャーシ14内には、光源であるLED(Light Emitting Diode:発光ダイオード)17と、LED17が実装されたLED基板18と、LED17からの光を導光して光学部材15(液晶パネル11)へと導く導光板19と、導光板19及び光学部材15を表側から押さえるフレーム(押さえ部材)16とが備えられる。そして、このバックライト装置12は、その短辺側の両端部に、LED17を有するLED基板18をそれぞれ備えるとともに、両側のLED基板18間に挟まれた中央側に導光板19を配置してなる、いわゆるエッジライト型(サイドライト型)とされている。以下では、バックライト装置12の各構成部品について詳しく説明する。 As shown in FIG. 2, the backlight device 12 includes a chassis 14 having a substantially box shape having a light emitting portion 14 c that opens toward the front side (light emitting side, liquid crystal panel 11 side), and light emitting from the chassis 14. And an optical member 15 arranged to cover the portion 14c. Furthermore, in the chassis 14, an LED (Light Emitting Diode) 17 that is a light source, an LED substrate 18 on which the LED 17 is mounted, and light from the LED 17 are guided to the optical member 15 (liquid crystal panel 11). And a frame (pressing member) 16 for pressing the light guide plate 19 and the optical member 15 from the front side. The backlight device 12 includes LED substrates 18 having LEDs 17 at both ends on the short side thereof, and a light guide plate 19 disposed at the center between the LED substrates 18 on both sides. The so-called edge light type (side light type) is used. Below, each component of the backlight apparatus 12 is demonstrated in detail.
 シャーシ14は、例えばアルミニウム板や電気亜鉛めっき綱板(SECC)などの金属板からなり、図2及び図3に示すように、液晶パネル11と同様に横長の方形状をなす底板14aと、底板14aにおける長辺側及び短辺側の各外端からそれぞれ一対ずつ立ち上がる側板14bとからなる。シャーシ14(底板14a)は、その長辺方向がX軸方向(水平方向)と一致し、短辺方向がY軸方向(鉛直方向)と一致している。また、側板14bには、フレーム16及びベゼル13がねじ止め可能とされる。 The chassis 14 is made of, for example, a metal plate such as an aluminum plate or an electrogalvanized steel plate (SECC), and as shown in FIGS. It consists of a side plate 14b that rises one by one from each outer end on the long side and the short side in 14a. The long side direction of the chassis 14 (bottom plate 14a) coincides with the X-axis direction (horizontal direction), and the short side direction coincides with the Y-axis direction (vertical direction). Further, the frame 16 and the bezel 13 can be screwed to the side plate 14b.
 光学部材15は、図2に示すように、液晶パネル11及びシャーシ14と同様に平面に視て横長の方形状をなしている。光学部材15は、導光板19の表側(光出射側)に載せられていて液晶パネル11と導光板19との間に介在して配される。光学部材15は、裏側に配される拡散板15aと、表側に配される光学シート15bとから構成される。拡散板15aは、所定の厚みを持つほぼ透明な合成樹脂製で板状をなす基材内に拡散粒子を多数分散して設けた構成とされ、透過する光を拡散させる機能を有する。光学シート15bは、拡散板15aと比べると板厚が薄いシート状をなしており、2枚が積層して配されている。具体的な光学シート15bの種類としては、例えば拡散シート、レンズシート、反射型偏光シートなどがあり、これらの中から適宜に選択して使用することが可能である。 As shown in FIG. 2, the optical member 15 has a horizontally long rectangular shape when viewed in a plane, like the liquid crystal panel 11 and the chassis 14. The optical member 15 is placed on the front side (light emitting side) of the light guide plate 19 and is interposed between the liquid crystal panel 11 and the light guide plate 19. The optical member 15 includes a diffusion plate 15a disposed on the back side and an optical sheet 15b disposed on the front side. The diffusing plate 15a has a structure in which a large number of diffusing particles are dispersed in a base material made of a substantially transparent synthetic resin having a predetermined thickness and has a function of diffusing transmitted light. The optical sheet 15b has a sheet shape that is thinner than the diffusion plate 15a, and two optical sheets 15b are laminated. Specific types of the optical sheet 15b include, for example, a diffusion sheet, a lens sheet, a reflective polarizing sheet, and the like, which can be appropriately selected and used.
 フレーム16は、図2に示すように、光学部材15及び導光板19の外周縁部に沿って延在する枠状(額縁状)に形成されており、光学部材15及び導光板19の外周縁部に対して対向状をなすとともにほぼ全周にわたって表側から押さえることが可能とされる。このフレーム16は、合成樹脂製とされるとともに、表面が例えば黒色を呈する形態とされることで、遮光性を有するものとされる。フレーム16のうち両短辺部分における裏側の面、つまり導光板19及びLED基板18(LED17)との対向面には、図4に示すように、光を反射させる第1反射シート20がそれぞれ取り付けられている。第1反射シート20は、フレーム16の短辺部分におけるほぼ全長にわたって延在する大きさを有しており、導光板19におけるLED17側の端部やLED17群などを一括して表側から覆うものとされる。また、フレーム16は、液晶パネル11における外周縁部を裏側から受けることができる。 As shown in FIG. 2, the frame 16 is formed in a frame shape (frame shape) extending along the outer peripheral edge portions of the optical member 15 and the light guide plate 19, and the outer peripheral edge of the optical member 15 and the light guide plate 19. It can be pressed from the front side over almost the entire circumference while facing the part. The frame 16 is made of a synthetic resin and has a light shielding property by having a surface with, for example, a black color. As shown in FIG. 4, a first reflection sheet 20 for reflecting light is attached to the back surface of both short sides of the frame 16, that is, the surface facing the light guide plate 19 and the LED substrate 18 (LED 17). It has been. The first reflection sheet 20 has a size extending over almost the entire length of the short side portion of the frame 16, and covers the LED 17 side end portion and LED 17 group of the light guide plate 19 from the front side collectively. Is done. Further, the frame 16 can receive the outer peripheral edge of the liquid crystal panel 11 from the back side.
 LED17は、図3及び図4に示すように、LED基板18に固着される基板部上にLEDチップを樹脂材により封止した構成とされる。基板部に実装されるLEDチップは、主発光波長が1種類とされ、具体的には、青色を単色発光するものが用いられている。その一方、LEDチップを封止する樹脂材には、LEDチップから発せられた青色の光により励起されて所定の色を発光する蛍光体が分散配合されており、全体として概ね白色光を発するものとされる。なお、蛍光体としては、例えば黄色光を発光する黄色蛍光体、緑色光を発光する緑色蛍光体、及び赤色光を発光する赤色蛍光体の中から適宜組み合わせて用いたり、またはいずれか1つを単独で用いることができる。このLED17は、LED基板18に対する実装面とは反対側の頂面が発光面17aとなる、いわゆる頂面発光型とされている。 3 and 4, the LED 17 has a configuration in which an LED chip is sealed with a resin material on a substrate portion fixed to the LED substrate 18. The LED chip mounted on the substrate unit has one main emission wavelength, and specifically, one that emits blue light in a single color is used. On the other hand, the resin material that seals the LED chip is dispersed and blended with a phosphor that emits a predetermined color when excited by the blue light emitted from the LED chip, and generally emits white light as a whole. It is said. In addition, as the phosphor, for example, a yellow phosphor that emits yellow light, a green phosphor that emits green light, and a red phosphor that emits red light are used in appropriate combination, or any one of them is used. It can be used alone. This LED 17 is of a so-called top surface light emitting type in which the top surface opposite to the mounting surface with respect to the LED substrate 18 is the light emitting surface 17a.
 LED基板18は、図2,図3及び図7に示すように、導光板19をその長辺方向(X軸方向)の両側から挟み込む形で一対が、シャーシ14における短辺側の両端部にそれぞれ配されている。LED基板18は、図4に示すように、LED17が実装されるLED実装部18aと、LED実装部18aから導光板19側に向けて延在する放熱板部18bとから構成されており、LED実装部18aと放熱板部18bとが互いの板面を直交させる形で連ねられることで、全体として断面略L字型をなしている。詳しくは、LED基板18は、LED実装部18aの板面が、Y軸方向及びZ軸方向に並行する姿勢、つまりシャーシ14の短辺側の側板14b及び導光板19の光入射面19bに並行する姿勢(シャーシ14の底板14a及び導光板19の板面と直交する姿勢)とされるのに対し、放熱板部18bの板面が、X軸方向及びY軸方向に並行した姿勢、つまりシャーシ14の底板14a及び導光板19の板面に並行する姿勢(シャーシ14の側板14b及び導光板19の光入射面19bと直交する姿勢)とされつつ、シャーシ14内に収容されている。LED基板18がシャーシ14内に収容された状態では、LED実装部18aが、シャーシ14の短辺側の側板14bの内面に宛われるとともに導光板19の光入射面19bに対して所定の間隔を保有しつつ対向状をなしているのに対し、放熱板部18bが、シャーシ14の底板14aの内面に宛われるとともに裏側の底板14aと表側の導光板19(導光反射シート22)との間に挟み込まれる。この放熱板部18bによって各LED17から発せられた熱をシャーシ14の底板14aに対して効率よく伝達して放熱を図ることができるものとされる。 As shown in FIGS. 2, 3, and 7, a pair of LED boards 18 sandwich the light guide plate 19 from both sides in the long side direction (X-axis direction), and the pair of LED boards 18 are at both ends of the short side of the chassis 14. Each is arranged. As shown in FIG. 4, the LED board 18 is composed of an LED mounting portion 18a on which the LED 17 is mounted, and a heat radiating plate portion 18b extending from the LED mounting portion 18a toward the light guide plate 19 side. The mounting portion 18a and the heat radiating plate portion 18b are connected to each other in such a manner that their plate surfaces are orthogonal to each other, thereby forming a substantially L-shaped cross section as a whole. Specifically, the LED board 18 has a posture in which the plate surface of the LED mounting portion 18 a is parallel to the Y-axis direction and the Z-axis direction, that is, the side plate 14 b on the short side of the chassis 14 and the light incident surface 19 b of the light guide plate 19. The posture of the heat radiating plate portion 18b is parallel to the X-axis direction and the Y-axis direction, that is, the chassis. 14 is accommodated in the chassis 14 while being in a posture parallel to the plate surfaces of the bottom plate 14 a and the light guide plate 19 (orientation perpendicular to the side plates 14 b of the chassis 14 and the light incident surface 19 b of the light guide plate 19). In a state where the LED board 18 is accommodated in the chassis 14, the LED mounting portion 18 a is directed to the inner surface of the side plate 14 b on the short side of the chassis 14 and has a predetermined interval with respect to the light incident surface 19 b of the light guide plate 19. The heat dissipation plate portion 18b is directed to the inner surface of the bottom plate 14a of the chassis 14 and is located between the bottom plate 14a on the back side and the light guide plate 19 (light guide reflection sheet 22) on the front side. Sandwiched between. The heat generated from each LED 17 by the heat radiating plate portion 18b can be efficiently transmitted to the bottom plate 14a of the chassis 14 to radiate heat.
 より詳しくは、LED実装部18aは、図4に示すように、シャーシ14の底板14aに並行する放熱板部18bにおける導光板19側とは反対側の端部から、側板14bに沿うようほぼ直角に立ち上がっている。一方、放熱板部18bは、LED実装部18aにおけるフレーム16側とは反対側(底板14a側)の端部から導光板19側に向けて延在するとともに導光板19におけるLED17側の端部を裏側から支持している。従って、導光板19は、短辺側の両端部、つまりLED17側の両端部が、それぞれ一対のLED基板18の各放熱板部18bによって裏側から支持されることで、シャーシ14の底板14aから僅かに浮いた位置に保たれている。また、LED実装部18a及び放熱板部18bにおけるY軸方向についての寸法は、図3及び図7に示すように、互いにほぼ同じ大きさであって、導光板19の短辺寸法とほぼ同じ大きさとされている。放熱板部18bにおけるLED実装部18aからのX軸方向についての延出寸法は、フレーム16の短辺部分における幅寸法や後述する第2反射シート21の幅寸法よりも大きなものとされる。 More specifically, as shown in FIG. 4, the LED mounting portion 18a is substantially perpendicular to the side plate 14b from the end opposite to the light guide plate 19 side of the heat radiating plate portion 18b parallel to the bottom plate 14a of the chassis 14. Standing up to. On the other hand, the heat radiating plate portion 18b extends from the end of the LED mounting portion 18a opposite to the frame 16 side (bottom plate 14a side) toward the light guide plate 19 side, and the end portion of the light guide plate 19 on the LED 17 side. Support from the back side. Therefore, the light guide plate 19 is slightly supported from the bottom plate 14a of the chassis 14 by supporting both ends on the short side, that is, both ends on the LED 17 side, from the back side by the heat radiating plate portions 18b of the pair of LED substrates 18, respectively. It is kept in a floating position. In addition, the dimensions in the Y-axis direction of the LED mounting portion 18a and the heat radiating plate portion 18b are substantially the same as each other as shown in FIGS. It is said. The extension dimension in the X-axis direction from the LED mounting portion 18a in the heat radiating plate portion 18b is larger than the width dimension in the short side portion of the frame 16 and the width dimension of the second reflection sheet 21 described later.
 LED実装部18aにおける導光板19側を向いた面(光入射面19bとの対向面)には、図3及び図4に示すように、上記した構成のLED17が表面実装されており、ここが実装面とされる。LED17は、LED実装部18aの実装面において、その長さ方向(Y軸方向)に沿って複数が所定の間隔を空けつつ一列に(直線的に)並列配置されている。つまり、LED17は、バックライト装置12における短辺側の両端部においてそれぞれ短辺方向に沿って複数ずつ間欠的に並列配置されていると言える。Y軸方向について隣り合うLED17間の間隔、つまりLED17の配列ピッチは、ほぼ等しいものとされている。なお、LED17の並び方向は、LED実装部18a及び光入射面19bの長さ方向(Y軸方向)と一致していることになる。また、LED実装部18aの実装面には、Y軸方向に沿って延在するとともにLED17群を横切って隣り合うLED17同士を直列接続する、金属膜(銅箔など)からなる配線パターン(図示せず)が形成されており、この配線パターンの両端部に形成された端子部が外部のLED駆動回路に接続されることで、駆動電力を各LED17に供給することが可能とされる。一対のLED基板18は、図3及び図7に示すように、LED実装部18aが互いに対向状をなす姿勢でシャーシ14内に収容されるので、両LED実装部18aにそれぞれ実装された各LED17の発光面17aが対向状をなすとともに、各LED17における光軸がX軸方向とほぼ一致する。言い換えると、一対のLED基板18の各LED実装部18aに実装された各LED17は、それぞれ導光板19における短辺側の両端部に対してそれぞれ対向状に配されている。また、LED基板18は、シャーシ14と同様に金属製(例えばアルミニウム製)とされており、そのうちLED実装部18aの表面に絶縁層を介して既述した配線パターン(図示せず)が形成されている。なお、LED基板18の基材に用いる材料としては、セラミックなどの絶縁材料を用いることも可能である。 The surface of the LED mounting portion 18a facing the light guide plate 19 (the surface facing the light incident surface 19b) is surface-mounted with the LED 17 having the above-described configuration as shown in FIGS. The mounting surface. A plurality of LEDs 17 are arranged in a line (linearly) in parallel on the mounting surface of the LED mounting portion 18a along the length direction (Y-axis direction) with a predetermined interval. That is, it can be said that a plurality of LEDs 17 are intermittently arranged in parallel along the short side direction at both ends on the short side of the backlight device 12. The interval between the LEDs 17 adjacent to each other in the Y-axis direction, that is, the arrangement pitch of the LEDs 17 is substantially equal. Note that the arrangement direction of the LEDs 17 coincides with the length direction (Y-axis direction) of the LED mounting portion 18a and the light incident surface 19b. Further, on the mounting surface of the LED mounting portion 18a, a wiring pattern (not shown) made of a metal film (not shown) extends in the Y-axis direction and connects the adjacent LEDs 17 in series across the LED 17 group. And the terminal portions formed at both ends of the wiring pattern are connected to an external LED driving circuit, so that driving power can be supplied to each LED 17. As shown in FIGS. 3 and 7, the pair of LED substrates 18 are housed in the chassis 14 in such a manner that the LED mounting portions 18a face each other, so that each LED 17 mounted on each of the LED mounting portions 18a. The light emitting surfaces 17a are opposed to each other, and the optical axes of the LEDs 17 substantially coincide with the X-axis direction. In other words, the LEDs 17 mounted on the LED mounting portions 18 a of the pair of LED substrates 18 are respectively arranged in opposed relation to both end portions on the short side of the light guide plate 19. Further, the LED board 18 is made of metal (for example, aluminum) similarly to the chassis 14, and the wiring pattern (not shown) described above is formed on the surface of the LED mounting portion 18 a via an insulating layer. ing. In addition, as a material used for the base material of LED board 18, insulating materials, such as a ceramic, can also be used.
 導光板19は、屈折率が空気よりも十分に高く且つほぼ透明な(透光性に優れた)合成樹脂材料(例えばPMMAなどのアクリル樹脂やポリカーボネートなど)からなる。導光板19は、図2,図3及び図8に示すように、液晶パネル11及びシャーシ14と同様に平面に視て横長の方形状をなすとともに光学部材15よりも厚みが大きな板状をなしており、その主面(板面)における長辺方向がX軸方向と、短辺方向がY軸方向とそれぞれ一致し、且つ主面と直交する板厚方向がZ軸方向と一致している。導光板19は、図4に示すように、シャーシ14内において液晶パネル11及び光学部材15の直下位置に配されており、シャーシ14における短辺側の両端部に配された対をなすLED基板18間にX軸方向について挟み込まれる形で配されている。従って、LED17(LED実装部18a)と導光板19との並び方向がX軸方向と一致するのに対して、光学部材15(液晶パネル11)と導光板19との並び方向がZ軸方向と一致しており、両並び方向が互いに直交するものとされる。そして、導光板19は、LED17からX軸方向に向けて発せられた光を導入するとともに、その光を内部で伝播させつつ光学部材15側(表側)へ向くよう立ち上げて出射させる機能を有する。 The light guide plate 19 is made of a synthetic resin material (for example, acrylic resin such as PMMA or polycarbonate) having a refractive index sufficiently higher than air and substantially transparent (excellent translucency). As shown in FIGS. 2, 3, and 8, the light guide plate 19 has a horizontally long rectangular shape in plan view and is thicker than the optical member 15 as in the case of the liquid crystal panel 11 and the chassis 14. In the main surface (plate surface), the long side direction coincides with the X-axis direction, the short side direction coincides with the Y-axis direction, and the plate thickness direction perpendicular to the main surface coincides with the Z-axis direction. . As shown in FIG. 4, the light guide plate 19 is disposed in the chassis 14 at a position directly below the liquid crystal panel 11 and the optical member 15, and forms a pair of LED substrates disposed at both ends on the short side of the chassis 14. 18 are arranged so as to be sandwiched between 18 in the X-axis direction. Therefore, while the alignment direction of the LED 17 (LED mounting portion 18a) and the light guide plate 19 coincides with the X-axis direction, the alignment direction of the optical member 15 (liquid crystal panel 11) and the light guide plate 19 is the Z-axis direction. It is in agreement and both arrangement directions are orthogonal to each other. The light guide plate 19 has a function of introducing the light emitted from the LED 17 in the X-axis direction and raising and emitting the light toward the optical member 15 side (front side) while propagating the light inside. .
 導光板19は、図3及び図8に示すように、シャーシ14の底板14a及び光学部材15の各主面(各板面)に沿って延在する略平板状をなしており、その主面がX軸方向及びY軸方向に並行するものとされる。導光板19の主面のうち、表側を向いた面(光学部材15との対向面)が内部の光を光学部材15及び液晶パネル11に向けて出射させる光出射面19aとなっている。導光板19における主面に対して隣り合う外周端面のうち、Y軸方向に沿って長手状をなす短辺側の両端面は、それぞれLED17(LED実装部18a)と所定の空間を空けて対向状をなしており、これらがLED17から発せられた光が入射される一対の光入射面19bとなっている。LED17と光入射面19bとの間に保有される空間の表側には、図4に示すように、既述した第1反射シート20が配されているのに対し、同空間の裏側には、第1反射シート20との間で同空間を挟み込む形で第2反射シート21が配されている。これにより、LED17からの光を両反射シート20,21間で繰り返し反射することで、光入射面19bに対して効率的に入射させることができる。また、各光入射面19bは、Y軸方向(LED17の並び方向)及びZ軸方向、つまりLED実装部18aの実装面に沿って並行する面とされ、光出射面19aに対して略直交する面とされる。また、LED17と光入射面19bとの並び方向は、X軸方向と一致しており、光出射面19aに並行している。 As shown in FIGS. 3 and 8, the light guide plate 19 has a substantially flat plate shape extending along the bottom plate 14a of the chassis 14 and the main surfaces (each plate surface) of the optical member 15. Are parallel to the X-axis direction and the Y-axis direction. Of the main surface of the light guide plate 19, the surface facing the front side (the surface facing the optical member 15) is a light emitting surface 19 a that emits internal light toward the optical member 15 and the liquid crystal panel 11. Outer peripheral end surfaces adjacent to the main surface of the light guide plate 19, both end surfaces on the short side that are long along the Y-axis direction are opposed to the LEDs 17 (LED mounting portions 18 a) with a predetermined space therebetween. These form a pair of light incident surfaces 19b on which the light emitted from the LEDs 17 is incident. On the front side of the space held between the LED 17 and the light incident surface 19b, as shown in FIG. 4, the first reflection sheet 20 described above is arranged, whereas on the back side of the space, A second reflection sheet 21 is disposed so as to sandwich the same space with the first reflection sheet 20. Thereby, the light from LED17 can be made to inject efficiently with respect to the light-incidence surface 19b by repeatedly reflecting between both the reflective sheets 20 and 21. FIG. Each light incident surface 19b is a surface parallel to the Y-axis direction (the LED 17 arrangement direction) and the Z-axis direction, that is, the mounting surface of the LED mounting portion 18a, and is substantially orthogonal to the light emitting surface 19a. The surface Further, the alignment direction of the LED 17 and the light incident surface 19b coincides with the X-axis direction and is parallel to the light emitting surface 19a.
 導光板19における裏側、つまり光出射面19aとは反対側の板面である底面(シャーシ14の底板14aとの対向面)19cには、図4に示すように、導光板19内を伝播して底面19cに達した光を反射して表側、つまり光出射面19a側へ向けて立ち上げることが可能な導光反射シート22がそのほぼ全域を覆う形で設けられている。言い換えると、導光反射シート22は、シャーシ14の底板14aと導光板19との間に挟まれた形で配されている。なお、導光板19における光出射面19aまたはその反対側の底面19cの少なくともいずれか一方には、内部の光を反射させて光出射面19aからの出光を促す反射部(図示せず)または内部の光を散乱させて光出射面19aからの出光を促す散乱部(図示せず)が所定の面内分布を持つようパターニングされており、それにより光出射面19aからの出射光が面内において均一な分布となるよう制御されている。 As shown in FIG. 4, the light guide plate 19 propagates through the back side of the light guide plate 19, that is, the bottom surface (the surface facing the bottom plate 14a of the chassis 14) 19c, which is the opposite side of the light emitting surface 19a. A light guide reflection sheet 22 that can reflect the light reaching the bottom surface 19c and rise up toward the front side, that is, the light emitting surface 19a side, is provided so as to cover almost the entire area. In other words, the light guide reflection sheet 22 is disposed between the bottom plate 14 a of the chassis 14 and the light guide plate 19. Note that at least one of the light exit surface 19a of the light guide plate 19 and the bottom surface 19c on the opposite side thereof has a reflection portion (not shown) or an internal portion that reflects the internal light and prompts the light exit from the light exit surface 19a. The scattering part (not shown) that scatters the light of the light and promotes the light output from the light output surface 19a is patterned so as to have a predetermined in-plane distribution, so that the light emitted from the light output surface 19a is in-plane It is controlled to have a uniform distribution.
 さて、本実施形態に係るLED基板18と導光板19とには、図3,図5及び図6に示すように、互いに凹凸嵌合することで相互を位置決め可能な位置決め構造23がそれぞれ設けられている。位置決め構造23は、LED基板18のうちシャーシ14の底板14aに沿って延在する放熱板部18bに形成される位置決め凸状部23aと、導光板19のうち放熱板部18bと対向状をなす底面19cに形成される位置決め凹状部23bとから構成されている。位置決め凸状部23aと位置決め凹状部23bとの組からなる位置決め構造23は、導光板19における底面19cの面内においてX軸方向について離間した2位置にそれぞれ一対が配されている。一対の位置決め構造23は、Y軸方向については導光板19における鉛直方向の上端部付近に配されていて、ほぼ同じ位置に配されている。 Now, the LED substrate 18 and the light guide plate 19 according to the present embodiment are respectively provided with positioning structures 23 capable of positioning each other by engaging with each other as shown in FIGS. ing. The positioning structure 23 is opposed to the positioning convex portion 23 a formed on the heat radiating plate portion 18 b extending along the bottom plate 14 a of the chassis 14 in the LED substrate 18 and the heat radiating plate portion 18 b in the light guide plate 19. The positioning concave portion 23b is formed on the bottom surface 19c. A pair of positioning structures 23 each including a pair of positioning convex portions 23 a and positioning concave portions 23 b are arranged at two positions separated from each other in the X-axis direction within the bottom surface 19 c of the light guide plate 19. The pair of positioning structures 23 are arranged in the vicinity of the upper end portion in the vertical direction of the light guide plate 19 in the Y-axis direction, and are arranged at substantially the same position.
 位置決め凸状部23aは、図5から図7に示すように、一対のLED基板18における各放熱板部18bに1つずつ形成されている。位置決め凸状部23aは、放熱板部18bのうち導光板19と対向状をなす板面から表側、つまり導光板19側に向けて突出する形態とされ、放熱板部18bに一体形成されている。位置決め凸状部23aは、平面に視て横長な略長方形状のブロック状の突起からなるものとされ、その長辺方向がX軸方向と、短辺方向がY軸方向とそれぞれ一致している。位置決め凸状部23aの外周面を構成する4辺の外面は、長辺側の両外面がX軸方向に、短辺側の両外面がY軸方向にそれぞれ並行するフラットな面とされる。位置決め凸状部23aは、放熱板部18bにおいてX軸方向についてはLED実装部18aからの延出先端部付近(延出先端位置よりはやや延出基端寄りの位置)に配されるとともに、Y軸方向については鉛直方向の上端部付近(鉛直方向の上端位置よりはやや下寄りの位置)に配されている。 As shown in FIGS. 5 to 7, one positioning convex portion 23 a is formed on each heat radiating plate portion 18 b of the pair of LED substrates 18. The positioning convex portion 23a protrudes from the surface of the heat radiating plate portion 18b facing the light guide plate 19 to the front side, that is, toward the light guide plate 19 side, and is integrally formed with the heat radiating plate portion 18b. . The positioning convex portion 23a is made of a substantially rectangular block-like protrusion that is horizontally long when viewed in a plane, and the long side direction thereof coincides with the X-axis direction and the short side direction thereof coincides with the Y-axis direction. . The outer surfaces of the four sides constituting the outer peripheral surface of the positioning convex portion 23a are flat surfaces in which both outer surfaces on the long side are parallel to the X-axis direction and both outer surfaces on the short side are parallel to the Y-axis direction. The positioning convex portion 23a is arranged in the vicinity of the extending tip portion from the LED mounting portion 18a in the heat radiating plate portion 18b in the X-axis direction (position slightly closer to the extending proximal end than the extending tip position), The Y-axis direction is arranged near the upper end portion in the vertical direction (a position slightly below the upper end position in the vertical direction).
 位置決め凹状部23bは、図5,図6及び図8に示すように、導光板19に一対形成されている。位置決め凹状部23bは、導光板19のうち放熱板部18bと対向状をなす底面19cを部分的に凹ませることで形成されており、導光板19の裏側に向けてのみ開口していて導光板19を板厚方向について貫通することがない、凹陥状をなしている。位置決め凹状部23bは、平面に視て横長な略長方形状をなしており、その長辺方向がX軸方向と、短辺方向がY軸方向とそれぞれ一致している。位置決め凹状部23bの内周面を構成する4辺の内面は、長辺側の両内面がX軸方向に、短辺側の両内面がY軸方向にそれぞれ並行するフラットな面とされる。一対の位置決め凹状部23bは、導光板19においてX軸方向について離間した2位置に配されており、詳しくはX軸方向についての中央部よりは相対的にLED17側の端部の近くに配されている。また、一対の位置決め凹状部23bは、Y軸方向については導光板19における鉛直方向の上端部(鉛直方向の上端位置よりはやや下寄りの位置)に配されている。 As shown in FIGS. 5, 6 and 8, a pair of positioning concave portions 23 b are formed on the light guide plate 19. The positioning concave portion 23b is formed by partially denting the bottom surface 19c of the light guide plate 19 facing the heat radiating plate portion 18b, and is open only toward the back side of the light guide plate 19. It has a concave shape that does not penetrate 19 in the thickness direction. The positioning concave portion 23b has a substantially rectangular shape that is horizontally long when viewed in a plane, and the long side direction thereof coincides with the X-axis direction, and the short side direction thereof coincides with the Y-axis direction. The inner surfaces of the four sides constituting the inner peripheral surface of the positioning concave portion 23b are flat surfaces in which both inner surfaces on the long side are parallel to the X-axis direction and both inner surfaces on the short side are parallel to the Y-axis direction. The pair of positioning concave portions 23b are disposed at two positions spaced apart in the X-axis direction on the light guide plate 19, and more specifically, are disposed closer to the LED 17 side end than the central portion in the X-axis direction. ing. In addition, the pair of positioning concave portions 23b are arranged at the upper end portion in the vertical direction of the light guide plate 19 in the Y-axis direction (a position slightly lower than the upper end position in the vertical direction).
 位置決め構造23を構成する位置決め凸状部23aと位置決め凹状部23bとが凹凸嵌合されるのに伴って、図5及び図6に示すように、互いの内外周面同士が当接されることで、LED基板18と導光板19とをX軸方向及びY軸方向の両方向について位置決めを図ることが可能とされている。一対の位置決め構造23は、導光板19における鉛直方向の上端部に配されていることから、導光板19は、液晶表示装置10を、液晶パネル11の表示面が鉛直方向に沿う姿勢とした場合に、位置決め構造23によって鉛直方向の上側から吊り下げられた状態で支持されるようになっている。 As the positioning convex portion 23a and the positioning concave portion 23b constituting the positioning structure 23 are unevenly fitted, the inner and outer peripheral surfaces of each other are brought into contact with each other as shown in FIGS. Thus, the LED substrate 18 and the light guide plate 19 can be positioned in both the X-axis direction and the Y-axis direction. Since the pair of positioning structures 23 are arranged at the upper end portion in the vertical direction of the light guide plate 19, the light guide plate 19 is configured so that the liquid crystal display device 10 has a posture in which the display surface of the liquid crystal panel 11 is along the vertical direction. Further, the positioning structure 23 is supported in a state suspended from the upper side in the vertical direction.
 ここで、位置決め構造23の詳しい配置について説明する。位置決め構造23は、図3に示すように、Y軸方向(LED17の並び方向)についてLED17とずれた位置、言い換えるとX軸方向(LED17から光入射面19bに向かう方向)についてLED17とは重なり合わない位置に配されている。しかも、位置決め構造23は、Y軸方向について間欠的に並列配置されたLED17群のうち、最も鉛直方向の上端側に配されたLED17よりもさらに鉛直方向の上側、つまり端寄り(隣り合うLED17側とは反対側)にずれた位置に配されている。この位置決め構造23は、導光板19の一部を凹ませて形成される位置決め凹状部23bと、そこに嵌合される位置決め凸状部23aとから構成されていることから、導光板19内を伝播する光にとっては進行の障害となり得るものである。そして、この位置決め構造23が、LED17に対してその光軸に沿う方向(X軸方向)について対向しない(オフセットした)配置とされているから、LED17から導光板19内に入射した光が位置決め構造23に当たり難くなっており、位置決め構造23によって導光板19内を伝播する光の光路が乱され難くなっている。しかも、位置決め構造23は、液晶パネル11において表示領域AAには存在することがないよう、非表示領域NAAに配されている。これにより、位置決め構造23が液晶表示装置10の使用者から直接視認される、といった事態が生じるのを防ぐことができる。また、位置決め構造23は、図6に示すように、フレーム16のうち鉛直方向の上端側に配される長辺部分と平面に視て重畳する位置に配されており、フレーム16の長辺部分によって液晶表示装置10の使用者の目線から隠されるようになっている。 Here, the detailed arrangement of the positioning structure 23 will be described. As shown in FIG. 3, the positioning structure 23 overlaps the LED 17 in a position shifted from the LED 17 in the Y-axis direction (LED 17 arrangement direction), in other words, in the X-axis direction (direction from the LED 17 toward the light incident surface 19b). There are no positions. In addition, the positioning structure 23 is further arranged on the upper side in the vertical direction, that is, closer to the end (the adjacent LED 17 side) than the LED 17 disposed on the uppermost side in the vertical direction among the LED 17 group intermittently arranged in parallel in the Y-axis direction. It is arranged at a position shifted to the opposite side. Since the positioning structure 23 includes a positioning concave portion 23b formed by recessing a part of the light guide plate 19 and a positioning convex portion 23a fitted therein, the inside of the light guide plate 19 is provided. For propagating light, it can be a hindrance to progress. Since the positioning structure 23 is arranged so as not to be opposed (offset) with respect to the LED 17 in the direction along the optical axis (X-axis direction), the light incident from the LED 17 into the light guide plate 19 is positioned. 23, and the optical path of the light propagating through the light guide plate 19 is hardly disturbed by the positioning structure 23. Moreover, the positioning structure 23 is arranged in the non-display area NAA so as not to exist in the display area AA in the liquid crystal panel 11. Thereby, it is possible to prevent a situation in which the positioning structure 23 is directly visually recognized by the user of the liquid crystal display device 10. Further, as shown in FIG. 6, the positioning structure 23 is arranged at a position overlapping the long side portion arranged on the upper end side in the vertical direction in the frame 16 in a plan view, and the long side portion of the frame 16. Thus, it is hidden from the eyes of the user of the liquid crystal display device 10.
 本実施形態は以上のような構造であり、続いてその作用を説明する。液晶表示装置10を製造するには、それぞれ別途に製造した液晶パネル11、バックライト装置12及びベゼル13などを組み付けるようにする。以下、バックライト装置12の製造手順を主として液晶表示装置10の製造手順について説明する。 This embodiment has the structure as described above, and its operation will be described next. In order to manufacture the liquid crystal display device 10, the separately manufactured liquid crystal panel 11, backlight device 12, bezel 13 and the like are assembled. Hereinafter, the manufacturing procedure of the backlight device 12 will be described mainly with respect to the manufacturing procedure of the liquid crystal display device 10.
 バックライト装置12の製造に際しては、まず、シャーシ14内にLED17を実装した一対のLED基板18を組み付ける作業を行う。LED基板18は、その放熱板部18bをシャーシ14の底板14aに並行させるとともに、LED実装部18aを側板14bに並行させた姿勢でもって、シャーシ14内における短辺側の端部に表側から収容される。このとき、位置決め凸状部23aが、当該液晶表示装置10の使用時における鉛直方向の上側に位置するよう、各LED基板18の組み付け向きを合わせておく。LED基板18は、放熱板部18bがシャーシ14の底板14aの内面に当接し、且つLED実装部18aが側板14bの内面に当接した状態で、ビスなどによってシャーシ14に固定される。 When manufacturing the backlight device 12, first, a work of assembling a pair of LED substrates 18 on which the LEDs 17 are mounted in the chassis 14 is performed. The LED board 18 is accommodated from the front side at the end on the short side in the chassis 14 with the heat radiation plate portion 18b parallel to the bottom plate 14a of the chassis 14 and the LED mounting portion 18a parallel to the side plate 14b. Is done. At this time, the assembling directions of the LED substrates 18 are aligned so that the positioning convex portion 23a is positioned on the upper side in the vertical direction when the liquid crystal display device 10 is used. The LED board 18 is fixed to the chassis 14 with screws or the like in a state where the heat radiating plate portion 18b is in contact with the inner surface of the bottom plate 14a of the chassis 14 and the LED mounting portion 18a is in contact with the inner surface of the side plate 14b.
 続いて、シャーシ14内に導光板19を組み付ける作業を行う。導光板19は、その長辺及び短辺をシャーシ14の長辺及び短辺に並行した姿勢とされつつ、既にシャーシ14に取り付けられた一対のLED基板18の間に位置するよう、シャーシ14内に表側から収容される。このとき、一対の位置決め凹状部23bが、当該液晶表示装置10の使用時における鉛直方向の上側に位置するよう、導光板19の組み付け向きを合わせておく。導光板19がシャーシ14内に収容される際には、一対のLED基板18に対して導光板19がX軸方向及びY軸方向について位置ずれしていれば、一対の位置決め凸状部23aの少なくともいずれか1つが位置決め凹状部23bには嵌合することなく、導光板19の裏側の板面19cに突き当たるため、導光板19はシャーシ14内にて傾いた姿勢となる。その場合は、一対のLED基板18に対してX軸方向とY軸方向との少なくともいずれか一方向について導光板19の位置を調整する、位置合わせを行う。そして、一対のLED基板18に対して導光板19がX軸方向及びY軸方向について正確に位置合わせされていれば、各放熱板部18bから表側に向けて立ち上がる一対の位置決め凸状部23aが、導光板19における裏側の板面19cに形成された一対の位置決め凹状部23b内に嵌合されることで、導光板19がその板面(主面)をシャーシ14の底板14a及び放熱板部18bに並行させた姿勢でシャーシ14内に収容される。つまり、シャーシ14内に収容した導光板19の板面に傾きが生じているか否かによって導光板19が一対のLED基板18に対して正確に位置合わせされたか否かを判別することができる。 Subsequently, the work of assembling the light guide plate 19 in the chassis 14 is performed. The light guide plate 19 has a long side and a short side parallel to the long side and the short side of the chassis 14, and is positioned between the pair of LED boards 18 already attached to the chassis 14. From the front side. At this time, the assembly direction of the light guide plate 19 is adjusted so that the pair of positioning concave portions 23b are positioned on the upper side in the vertical direction when the liquid crystal display device 10 is used. When the light guide plate 19 is accommodated in the chassis 14, if the light guide plate 19 is displaced with respect to the pair of LED substrates 18 in the X-axis direction and the Y-axis direction, the pair of positioning convex portions 23 a At least one of the light guide plates 19 abuts against the plate surface 19c on the back side of the light guide plate 19 without fitting into the positioning concave portion 23b, so that the light guide plate 19 is inclined in the chassis 14. In that case, alignment is performed by adjusting the position of the light guide plate 19 in at least one of the X-axis direction and the Y-axis direction with respect to the pair of LED substrates 18. And if the light-guide plate 19 is correctly aligned with respect to a pair of LED board 18 about the X-axis direction and the Y-axis direction, a pair of positioning convex-shaped part 23a which stands | starts up from each heat sink part 18b toward the front side will become. The light guide plate 19 is fitted into a pair of positioning concave portions 23b formed on the back plate surface 19c of the light guide plate 19, so that the light guide plate 19 has its plate surface (main surface) as the bottom plate 14a and the heat radiating plate portion of the chassis 14. It is accommodated in the chassis 14 in a posture parallel to 18b. That is, whether or not the light guide plate 19 is accurately aligned with the pair of LED substrates 18 can be determined based on whether or not the surface of the light guide plate 19 accommodated in the chassis 14 is inclined.
 位置合わせされた状態でシャーシ14内に収容された導光板19は、図5及び図6に示すように、位置決め構造23をなす位置決め凸状部23aと位置決め凹状部23bとの周面同士が互いに当接することで、シャーシ14及びLED基板18(LED17)に対してX軸方向及びY軸方向についてがたつくことなく、適切な位置に位置決め状態で保持される。このようにして導光板19をシャーシ14内に組み付けたら、導光板19の光出射面19a上に3枚の光学部材15を順次に積層して配置し、その後、フレーム16をシャーシ14に対して取り付けることでバックライト装置12が製造される。それから、バックライト装置12に対して、液晶パネル11及びベゼル13を組み付けることで、液晶表示装置10が製造される(図4を参照)。 As shown in FIGS. 5 and 6, the light guide plate 19 accommodated in the chassis 14 in the aligned state has the circumferential surfaces of the positioning convex portion 23 a and the positioning concave portion 23 b forming the positioning structure 23. By abutting, the X-axis direction and the Y-axis direction are not shaken with respect to the chassis 14 and the LED board 18 (LED 17), and are held in an appropriate position in a positioning state. When the light guide plate 19 is assembled in the chassis 14 in this way, the three optical members 15 are sequentially stacked on the light emitting surface 19 a of the light guide plate 19, and then the frame 16 is attached to the chassis 14. The backlight device 12 is manufactured by mounting. Then, the liquid crystal display device 10 is manufactured by assembling the liquid crystal panel 11 and the bezel 13 to the backlight device 12 (see FIG. 4).
 上記のようにして製造された液晶表示装置10の電源をONすると、図示しない制御回路により液晶パネル11の駆動が制御されるとともに、図示しないLED駆動回路からの駆動電力がLED基板18の各LED17に供給されることでその駆動が制御される。各LED17からの光は、導光板19により導光されることで、光学部材15を介して液晶パネル11に照射され、もって液晶パネル11に所定の画像が表示される。以下、バックライト装置12に係る作用について詳しく説明する。 When the power supply of the liquid crystal display device 10 manufactured as described above is turned on, the drive of the liquid crystal panel 11 is controlled by a control circuit (not shown), and the drive power from the LED drive circuit (not shown) is applied to each LED 17 on the LED substrate 18. The drive is controlled by being supplied to. The light from each LED 17 is guided by the light guide plate 19, so that the liquid crystal panel 11 is irradiated through the optical member 15, and a predetermined image is displayed on the liquid crystal panel 11. Hereinafter, the operation of the backlight device 12 will be described in detail.
 各LED17を点灯させると、各LED17から出射した光は、図4に示すように、導光板19における光入射面19bに入射する。ここで、LED17と光入射面19bとの間には、所定の空間が保有されているものの、その空間が表側の第1反射シート20と裏側の第2反射シート21とにより挟み込まれているから、LED17からの光は両反射シート20,21により繰り返し反射されることで、効率的に光入射面19bに入射される。光入射面19bに入射した光は、導光板19における外部の空気層との界面にて全反射されたり、導光反射シート22により反射されるなどして導光板19内を伝播される過程で、図示しない反射部または散乱部によって反射または散乱されることで光出射面19aから出射される。 When each LED 17 is turned on, the light emitted from each LED 17 enters the light incident surface 19b of the light guide plate 19 as shown in FIG. Here, although a predetermined space is held between the LED 17 and the light incident surface 19b, the space is sandwiched between the first reflective sheet 20 on the front side and the second reflective sheet 21 on the back side. The light from the LED 17 is repeatedly reflected by both the reflection sheets 20 and 21, so that it is efficiently incident on the light incident surface 19b. The light incident on the light incident surface 19b is totally reflected at the interface with the external air layer in the light guide plate 19 or is reflected by the light guide reflection sheet 22 and is propagated through the light guide plate 19. The light is emitted from the light exit surface 19a by being reflected or scattered by a reflection part or a scattering part (not shown).
 ところで、LED17からの光が光入射面19bに入射する際の入射効率は、LED17と光入射面19bとのX軸方向についての位置関係、つまりLED17と光入射面19bとの間に保有される間隔(距離)に応じて変動し、上記間隔が広がるほど入射効率が低下し、逆に間隔が狭まるほど入射効率が向上する傾向にある。そして、LED17と光入射面19bとの間に保有される間隔が僅かにばらついたとしても、LED17からの光が光入射面19bに入射する際の入射効率は大きく変動してしまい、特に当該液晶表示装置10の狭額縁化が進行するのに伴って上記間隔の設定値が小さくなるほど、その間隔にばらつきが生じたときの上記入射効率の変動率もより大きくなる傾向にある。本実施形態では、図5及び図6に示すように、LED基板18と導光板19とにそれぞれ位置決め構造23を設けることで、LED基板18と導光板19とがX軸方向及びY軸方向について直接的に位置決めされているから、従来のようにLED基板と導光板とがシャーシの一部を介して間接的に位置決めされる構成のものに比べると、介在物が存在しない分だけ組み付け誤差などの影響が少なくなっていて、位置決めに係る精度がより高いものとなっている。このように、位置決め構造23によってLED基板18と導光板19とが高い精度でもってX軸方向及びY軸方向について位置決めされることで、LED17と光入射面19bとのX軸方向についての位置関係にもばらつきが極めて生じ難くなっている。従って、LED17から光入射面19bに入射する光の入射効率にも変動が生じ難くなるとともに、導光板19に入射した光が光出射面19aから出射する出射光の輝度にも変動が生じ難くなる。以上により、導光板19への光の入射効率及び導光板19からの出射光の輝度を安定化させることができるので、液晶パネル11に表示される画像の表示品位を高く保つことができる。 By the way, the incident efficiency when the light from the LED 17 is incident on the light incident surface 19b is held in the positional relationship in the X-axis direction between the LED 17 and the light incident surface 19b, that is, between the LED 17 and the light incident surface 19b. It fluctuates according to the interval (distance), and as the interval increases, the incidence efficiency decreases. Conversely, as the interval decreases, the incidence efficiency tends to improve. And even if the space | interval held between LED17 and the light-incidence surface 19b varies slightly, the incident efficiency at the time of the light from LED17 injecting into the light-incidence surface 19b will fluctuate | variate greatly, especially the said liquid crystal As the set value of the interval becomes smaller as the display device 10 becomes narrower, the variation rate of the incident efficiency when the interval is varied tends to increase. In the present embodiment, as shown in FIGS. 5 and 6, the LED substrate 18 and the light guide plate 19 are arranged in the X-axis direction and the Y-axis direction by providing the LED substrate 18 and the light guide plate 19 with the positioning structures 23, respectively. Since the LED board and the light guide plate are positioned indirectly via a part of the chassis as in the conventional case, the assembly error, etc. is as much as there are no inclusions. Is less affected, and the positioning accuracy is higher. As described above, the LED substrate 18 and the light guide plate 19 are positioned with high accuracy in the X-axis direction and the Y-axis direction by the positioning structure 23, so that the positional relationship in the X-axis direction between the LED 17 and the light incident surface 19b. Variation is extremely difficult to occur. Therefore, the incidence efficiency of the light incident on the light incident surface 19b from the LED 17 is less likely to vary, and the luminance of the outgoing light from the light incident on the light guide plate 19 is less likely to vary. . As described above, since the light incident efficiency to the light guide plate 19 and the luminance of the light emitted from the light guide plate 19 can be stabilized, the display quality of the image displayed on the liquid crystal panel 11 can be kept high.
 しかも、位置決め構造23をなす位置決め凸状部23aは、LED基板18のうちシャーシ14の底板14aに対する放熱を図るための放熱板部18bを利用して設けられているから、仮に放熱板部18bとは別途にLED実装部18aから導光板19側に向けて延在する形態の構造物を設けてそこに位置決め凸状部23aを設けるようにした場合に比べると、LED基板18の構造を簡素にできるとともにバックライト装置12全体の構造も簡素化を図ることができて組み付け作業効率が良好になり、また製造コストの低減を図る上でも有用となる。 Moreover, since the positioning convex portion 23a forming the positioning structure 23 is provided using the heat radiating plate portion 18b for radiating heat to the bottom plate 14a of the chassis 14 in the LED board 18, the heat radiating plate portion 18b Compared to the case where a structure that extends separately from the LED mounting portion 18a toward the light guide plate 19 is provided and the positioning convex portion 23a is provided there, the structure of the LED substrate 18 is simplified. In addition, the overall structure of the backlight device 12 can be simplified, the assembling work efficiency can be improved, and the manufacturing cost can be reduced.
 さらには、位置決め構造23は、図3に示すように、X軸方向についてLED17とは重なり合うことがない配置とされ、且つY軸方向について間欠的に並列配置されたLED17群のうちの最も端寄りのLED17からさらに端寄りにずれた位置に配されているから、LED17から発せられて光入射面19bに入射した光に対して干渉し難く、その光路の妨げとなる事態が避けられている。従って、導光板19の光出射面19aからの出射光に、位置決め構造23に起因する輝度ムラが生じ難くなっている。その上、位置決め構造23は、液晶パネル11における非表示領域NAAに配され、且つフレーム16の長辺部分と平面に視て重畳する位置に配されている(図6を参照)ことから、液晶表示装置10の使用者から位置決め構造23が直接視認され難くなっており、それにより表示品位に一層優れるものとされる。 Furthermore, as shown in FIG. 3, the positioning structure 23 is arranged so as not to overlap the LEDs 17 in the X-axis direction, and is closest to the end of the group of LEDs 17 intermittently arranged in parallel in the Y-axis direction. Therefore, it is difficult to interfere with the light emitted from the LED 17 and incident on the light incident surface 19b, and a situation that obstructs the optical path is avoided. Accordingly, luminance unevenness due to the positioning structure 23 is less likely to occur in the light emitted from the light emitting surface 19 a of the light guide plate 19. In addition, the positioning structure 23 is disposed in the non-display area NAA in the liquid crystal panel 11 and is disposed at a position overlapping the long side portion of the frame 16 in plan view (see FIG. 6). It is difficult for the user of the display device 10 to visually recognize the positioning structure 23, thereby further improving the display quality.
 ここで、液晶表示装置10の使用に伴って、各LED17を発光させると各LED17が発熱する。生じた熱は、図4に示すように、LED17からLED実装部18aを介して放熱板部18bに伝達され、さらに放熱板部18bに接するシャーシ14の底板14aへと伝達される。放熱板部18bは、シャーシ14の底板14aにおける短辺側の両端部において、短辺方向についての大部分に及ぶ範囲にわたって配されるものであるから、底板14aに対して効率的に伝熱させることができ、もって高い放熱性能を得ることができる。なお、LED17からの熱は、LED実装部18aからシャーシ14の短辺側の側板14bにも伝達されるなどすることでも放熱が図られている。このようにしてLED17からの放熱が図られるものの、シャーシ14内にある程度の蓄熱が生じるのを回避するのは困難であり、その蓄熱に伴って導光板19が熱膨張する場合がある。その場合でも、導光板19は、図3,図5及び図6に示すように、一対の位置決め構造23によってX軸方向について離間した2位置にて位置決めが図られているから、熱膨張に伴うLED基板18に対する相対変位が規制されている。従って、導光板19の熱膨張に伴って、光入射面19bがLED17に近づく方向に変位する変位量をごく僅かなものとすることができ、もって光入射面19bがLED17に接触するといった事態を防ぐことができる。一方、各LED17を消灯するのに伴い、シャーシ14内の温度が低下すると、熱膨張していた導光板19が熱収縮する。この場合でも、導光板19は、一対の位置決め構造23によって位置決めが図られているから、熱収縮に伴って導光板19が各LED基板18に対して位置ずれするのが回避されている。 Here, with the use of the liquid crystal display device 10, when each LED 17 emits light, each LED 17 generates heat. As shown in FIG. 4, the generated heat is transmitted from the LED 17 to the heat radiating plate 18b via the LED mounting portion 18a, and further to the bottom plate 14a of the chassis 14 in contact with the heat radiating plate 18b. Since the heat radiating plate portion 18b is arranged over a range covering most of the short side direction at both ends on the short side of the bottom plate 14a of the chassis 14, heat is efficiently transferred to the bottom plate 14a. Therefore, high heat dissipation performance can be obtained. The heat from the LED 17 is also dissipated by being transmitted from the LED mounting portion 18 a to the side plate 14 b on the short side of the chassis 14. Although heat radiation from the LED 17 is achieved in this way, it is difficult to avoid a certain amount of heat storage in the chassis 14, and the light guide plate 19 may thermally expand with the heat storage. Even in that case, the light guide plate 19 is positioned at two positions separated in the X-axis direction by the pair of positioning structures 23 as shown in FIGS. The relative displacement with respect to the LED substrate 18 is regulated. Therefore, with the thermal expansion of the light guide plate 19, the amount of displacement of the light incident surface 19b in the direction approaching the LED 17 can be made very small, and the light incident surface 19b contacts the LED 17. Can be prevented. On the other hand, when the temperature in the chassis 14 decreases as the LEDs 17 are turned off, the light guide plate 19 that has been thermally expanded thermally contracts. Even in this case, since the light guide plate 19 is positioned by the pair of positioning structures 23, the light guide plate 19 is prevented from being displaced with respect to the LED substrates 18 due to thermal contraction.
 以上説明したように本実施形態のバックライト装置(照明装置)12は、LED(光源)17と、LED17と対向状に配されるとともにLED17からの光が入射される光入射面19b、及び入射した光を出射させる光出射面19aを有する導光板19と、LED17が実装されるLED実装部(光源実装部)18aとLED実装部18aから導光板19側に向けて延在する放熱板部18bとを有するLED基板(光源基板)18と、LED基板18及び導光板19を収容するものであって、導光板19の板面に並行するとともに導光板19との間で放熱板部18bを挟み込む底板14aを有するシャーシ14と、放熱板部18bと導光板19とにそれぞれ形成されるとともに互いに凹凸嵌合することで、LED基板18と導光板19とを、少なくともLED17から光入射面19bに向かう方向について位置決めする位置決め構造23と、を備える。 As described above, the backlight device (illumination device) 12 according to the present embodiment includes the LED (light source) 17, the light incident surface 19 b that is arranged to face the LED 17 and receives light from the LED 17, and the incident light. A light guide plate 19 having a light emitting surface 19a for emitting the emitted light, an LED mounting portion (light source mounting portion) 18a on which the LED 17 is mounted, and a heat radiating plate portion 18b extending from the LED mounting portion 18a toward the light guide plate 19 side. The LED board (light source board) 18 including the LED board 18 and the light guide plate 19 is accommodated, and is parallel to the plate surface of the light guide plate 19 and sandwiches the heat radiating plate portion 18b with the light guide plate 19. The LED board 18 and the light guide plate 19 are formed on the chassis 14 having the bottom plate 14a, the heat radiating plate portion 18b, and the light guide plate 19, respectively, and are engaged with each other. Comprises a positioning structure 23 to position the direction toward the light entrance surface 19b at least LED 17, a.
 このようにすれば、LED17から発せられた光は、LED17と対向状に配される導光板19の光入射面19bに入射してから、導光板19内を伝播された後に光出射面19aから出射される。LED基板18を構成する放熱板部18bは、LED実装部18aから導光板19側に向けて延在するとともに導光板19とシャーシ14の底板14aとの間に挟み込まれているから、仮に放熱板部がLED実装部18aから導光板19側とは反対側に向けて延びる形態とされた場合に比べると、当該バックライト装置12の小型化などを図る上で好適とされる。また、放熱板部18bによってLED17から発せられた熱を、LED実装部18aを介してシャーシ14の底板14aに対して効率的に伝達させることができる。 In this way, the light emitted from the LED 17 enters the light incident surface 19b of the light guide plate 19 arranged to face the LED 17, and then propagates through the light guide plate 19 and then from the light emitting surface 19a. Emitted. Since the heat radiating plate portion 18b constituting the LED substrate 18 extends from the LED mounting portion 18a toward the light guide plate 19 and is sandwiched between the light guide plate 19 and the bottom plate 14a of the chassis 14, the heat radiating plate is temporarily provided. Compared to the case where the portion extends from the LED mounting portion 18a toward the side opposite to the light guide plate 19 side, this is preferable in reducing the size of the backlight device 12 and the like. Further, the heat generated from the LED 17 by the heat radiating plate portion 18b can be efficiently transmitted to the bottom plate 14a of the chassis 14 via the LED mounting portion 18a.
 そして、LED基板18と導光板19とは、放熱板部18bと導光板19とにそれぞれ形成されるとともに互いに凹凸嵌合する位置決め構造23によって、少なくともLED17から光入射面19bに向かう方向について直接的に位置決めされるから、従来のようにLED基板18と導光板19とがシャーシ14の一部を介して間接的に位置決めされる構成のものに比べると、介在物が存在しない分だけ組み付け誤差などの影響が少なくなり、もって位置決めに係る精度がより高いものとなる。これにより、LED17から光入射面19bに入射される光の入射効率、並びに導光板19の光出射面19aからの出射光の輝度にばらつきが生じ難くなり、もって光の利用効率及び出射光の輝度を安定させることができる。しかも、位置決め構造23が、LED基板18のうちLED実装部18aから導光板19側に向けて延在する放熱板部18bを利用して設けられているから、仮に放熱板部18bとは別途に導光板19側に向けて延在する構造物を設けてそこに位置決め構造23を設けた場合に比べると、全体の構造の簡素化を図る上で好適となる。 The LED substrate 18 and the light guide plate 19 are directly formed at least in the direction from the LED 17 toward the light incident surface 19b by the positioning structures 23 formed on the heat radiating plate portion 18b and the light guide plate 19 and fitted to each other. Compared to the conventional configuration in which the LED substrate 18 and the light guide plate 19 are indirectly positioned through a part of the chassis 14 as in the conventional case, the assembly error is as much as there is no inclusion. Thus, the accuracy of positioning is higher. This makes it difficult for the incident efficiency of the light incident from the LED 17 to the light incident surface 19b and the luminance of the light emitted from the light emitting surface 19a of the light guide plate 19 to vary, and thus the light utilization efficiency and the luminance of the emitted light. Can be stabilized. Moreover, since the positioning structure 23 is provided by using the heat radiating plate portion 18b extending from the LED mounting portion 18a toward the light guide plate 19 side in the LED substrate 18, it is temporarily separated from the heat radiating plate portion 18b. Compared with the case where a structure extending toward the light guide plate 19 is provided and the positioning structure 23 is provided there, it is preferable to simplify the entire structure.
 また、位置決め構造23は、導光板19における放熱板部18bと対向する板面に形成される位置決め凹状部23bと、放熱板部18bに形成されるとともに導光板19に向けて突出して位置決め凹状部23bに嵌合される位置決め凸状部23aとから構成されている。このようにすれば、導光板19における放熱板部18bと対向する板面に突起物が形成されない構成とすることができるから、導光板19の取り扱い性に優れる。なお、LED基板18は、放熱板部18bに位置決め凸状部23aが形成されているものの、そもそもLED実装部18a及びLED17が備えられたものであるから、位置決め凸状部23aの存在が直ちにLED基板18の取り扱い性を損なう原因とはなり難くなっている。 The positioning structure 23 includes a positioning concave portion 23b formed on a plate surface of the light guide plate 19 facing the heat radiating plate portion 18b, and a positioning concave portion formed on the heat radiating plate portion 18b and projecting toward the light guide plate 19. It is comprised from the positioning convex-shaped part 23a fitted by 23b. In this way, since the protrusions are not formed on the plate surface of the light guide plate 19 facing the heat radiating plate portion 18b, the light guide plate 19 is excellent in handleability. In addition, although the LED board 18 is provided with the LED mounting part 18a and the LED 17 in the first place, although the positioning convex part 23a is formed on the heat radiating plate part 18b, the presence of the positioning convex part 23a is immediately It is difficult to become a cause of impairing the handleability of the substrate 18.
 また、位置決め構造23は、LED17から光入射面19bに向かう方向についてLED17とは重なり合わない位置に配されている。このようにすれば、LED17から導光板19の光入射面19bに入射した光が、位置決め構造23に当たり難くなるから、光出射面19aからの出射光に、位置決め構造23に起因するムラが生じ難くなる。 Further, the positioning structure 23 is arranged at a position that does not overlap with the LED 17 in the direction from the LED 17 toward the light incident surface 19b. In this way, the light incident on the light incident surface 19b of the light guide plate 19 from the LED 17 is less likely to hit the positioning structure 23, so that unevenness due to the positioning structure 23 is less likely to occur in the emitted light from the light emitting surface 19a. Become.
 また、LED17は、光入射面19bに沿って複数が間欠的に並んで配されており、位置決め構造23は、LED17の並び方向について最も端に配されたLED17よりもさらに端寄りにずれた位置に配されている。このようにすれば、仮に位置決め構造が隣り合うLED17の間に位置するよう配された場合に比べると、位置決め構造23に起因する出射光のムラを一層生じ難くすることができる。 Further, a plurality of LEDs 17 are intermittently arranged along the light incident surface 19b, and the positioning structure 23 is a position that is shifted further to the end than the LED 17 that is arranged at the end most in the arrangement direction of the LEDs 17. It is arranged in. In this way, the unevenness of the emitted light due to the positioning structure 23 can be made more unlikely to occur as compared with the case where the positioning structure is arranged so as to be positioned between the adjacent LEDs 17.
 また、LED基板18は、導光板19を挟み込む形で一対配されているのに対して、導光板19は、一対のLED基板18に実装された各LED17とそれぞれ対向状をなす形で光入射面19bを一対有しており、位置決め構造23は、一対のLED基板18が有する各放熱板部18bと導光板19とにそれぞれ設けられている。このようにすれば、導光板19を挟み込む形で配される一対のLED基板18が有する各放熱板部18bと導光板19とがそれぞれに設けられた位置決め構造23によって相互に位置決めされるから、一対のLED基板18に実装された各LED17から、対向する各光入射面19bにそれぞれ入射される光の入射効率がそれぞればらつき難くなる。従って、光出射面19aからの出射光の輝度に一層ムラが生じ難くなる。 Also, a pair of LED substrates 18 are arranged so as to sandwich the light guide plate 19, whereas the light guide plates 19 are incident on the LEDs 17 mounted on the pair of LED substrates 18 so as to face each other. A pair of surfaces 19b is provided, and the positioning structure 23 is provided on each of the heat radiating plate portions 18b and the light guide plate 19 included in the pair of LED substrates 18. In this way, each of the heat radiating plate portions 18b and the light guide plate 19 included in the pair of LED substrates 18 arranged so as to sandwich the light guide plate 19 are positioned relative to each other by the positioning structures 23 provided respectively. Incidence efficiencies of light incident from the LEDs 17 mounted on the pair of LED substrates 18 to the opposing light incident surfaces 19b are less likely to vary. Therefore, the brightness of the light emitted from the light exit surface 19a is less likely to be uneven.
 また、LED実装部18aは、放熱板部18bから立ち上がって光入射面19bと対向状に配されるのに対し、LED17は、LED実装部18aに対する実装面とは反対側に位置する頂面が発光面17aとされる頂面発光型とされる。このようにすれば、放熱板部18bから立ち上がって光入射面19bと対向状に配されるLED実装部18aに、頂面発光型のLED17を設けるようにしているから、放熱板部18bの立ち上がり方向についてのLED17の配置の自由度が高くなる。これにより、LED17を導光板19の光入射面19bに対して、光の入射効率が良好になるような適切な位置に配することが可能となる。 Further, the LED mounting portion 18a rises from the heat radiating plate portion 18b and is arranged to face the light incident surface 19b, whereas the LED 17 has a top surface located on the opposite side of the mounting surface with respect to the LED mounting portion 18a. The light emitting surface 17a is a top surface emitting type. In this way, the top surface light emitting type LED 17 is provided on the LED mounting portion 18a that rises from the heat radiating plate portion 18b and is opposed to the light incident surface 19b, so that the heat radiating plate portion 18b rises. The freedom degree of arrangement | positioning of LED17 about a direction becomes high. Thereby, it becomes possible to arrange | position LED17 in the appropriate position with respect to the light-incidence surface 19b of the light-guide plate 19 so that the incident efficiency of light may become favorable.
 <実施形態2>
 本発明の実施形態2を図9によって説明する。この実施形態2では、LED117及びLED基板118の構成を変更したものを示す。なお、上記した実施形態1と同様の構造、作用及び効果について重複する説明は省略する。
<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIG. In this Embodiment 2, what changed the structure of LED117 and LED board 118 is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
 本実施形態に係るLED基板118は、図9に示すように、LED実装部118aが放熱板部118b及びシャーシ114の底板114aに沿って延在する形態とされている。つまり、LED基板118は、全体としてX軸方向及びY軸方向に沿う一枚の平板状をなしている。詳しくは、LED実装部118aは、その板面が放熱板部118bと同様にX軸方向及びY軸方向に並行する姿勢でシャーシ114内に収容されており、収容状態では底板114aの内面に宛われている。そして、このLED実装部118aに実装されたLED117は、LED実装部118aに対する実装面に隣り合う側面が発光面117aとされる側面発光型とされている。LED117は、LED実装部118aにおける表側を向いた面(実装面)からZ軸方向に沿って立ち上がる形態とされており、その発光面117aが導光板119の光入射面119bと対向状をなしている。LED実装部118aにおけるLED117の実装面には、Y軸方向に沿って延在する配線パターン(図示せず)が形成されている。本実施形態に係るLED基板118は、上記した実施形態1に記載したLED基板18(図4を参照)に比べると、配線パターンを有するLED実装部118aが放熱板部118bに並行する形態とされ、且つLED117のみがZ軸方向に立ち上がる形態とされているから、Z軸方向について低背化が図られている。従って、導光板119についてもLED117の立ち上がり高さに合わせて薄型化を図ることができ、もってバックライト装置112及び液晶表示装置110の全体を薄型化することができる。 As shown in FIG. 9, the LED board 118 according to the present embodiment is configured such that the LED mounting portion 118 a extends along the heat radiating plate portion 118 b and the bottom plate 114 a of the chassis 114. That is, the LED substrate 118 has a single flat plate shape along the X-axis direction and the Y-axis direction as a whole. Specifically, the LED mounting portion 118a is housed in the chassis 114 with its plate surface parallel to the X-axis direction and the Y-axis direction in the same manner as the heat radiating plate portion 118b. It has been broken. And LED117 mounted in this LED mounting part 118a is made into the side light emission type by which the side surface adjacent to the mounting surface with respect to LED mounting part 118a is made into the light emission surface 117a. The LED 117 is configured to rise from the surface (mounting surface) facing the front side in the LED mounting portion 118a along the Z-axis direction, and the light emitting surface 117a is opposed to the light incident surface 119b of the light guide plate 119. Yes. A wiring pattern (not shown) extending along the Y-axis direction is formed on the mounting surface of the LED 117 in the LED mounting portion 118a. The LED board 118 according to the present embodiment is configured such that the LED mounting part 118a having the wiring pattern is parallel to the heat radiating plate part 118b, as compared with the LED board 18 (see FIG. 4) described in the first embodiment. In addition, since only the LED 117 rises in the Z-axis direction, the height is reduced in the Z-axis direction. Therefore, the light guide plate 119 can also be thinned in accordance with the rising height of the LED 117, and the backlight device 112 and the liquid crystal display device 110 as a whole can be thinned.
 以上説明したように本実施形態によれば、LED実装部118aは、放熱板部118bに沿って延在する形態とされるのに対し、LED117は、LED実装部118aに対する実装面に隣り合う側面が発光面117aとされる側面発光型とされる。このようにすれば、放熱板部118bに沿って延在する形態とされるLED実装部118aに、側面発光型のLED117を設けるようにしているから、薄型の導光板119を用いる上で好適となり、もって当該バックライト装置112全体の薄型化を図る上でも好適となる。 As described above, according to the present embodiment, the LED mounting portion 118a is configured to extend along the heat dissipation plate portion 118b, while the LED 117 is a side surface adjacent to the mounting surface with respect to the LED mounting portion 118a. Is a side light emitting type in which the light emitting surface 117a is used. In this case, the side surface light emitting type LED 117 is provided on the LED mounting portion 118a that is configured to extend along the heat radiating plate portion 118b, which is preferable in using the thin light guide plate 119. Therefore, it is also suitable for reducing the thickness of the backlight device 112 as a whole.
 <実施形態3>
 本発明の実施形態3を図10または図11によって説明する。この実施形態3では、光学部材215に遮光部24を設けるとともに、位置決め構造223の構成を変更したものを示す。なお、上記した実施形態1と同様の構造、作用及び効果について重複する説明は省略する。また、図10では、導光板219上に光学部材215を積層配置した状態の平面構成を示している。
<Embodiment 3>
A third embodiment of the present invention will be described with reference to FIG. 10 or FIG. In the third embodiment, the optical member 215 is provided with the light shielding portion 24 and the configuration of the positioning structure 223 is changed. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted. FIG. 10 shows a planar configuration in a state where the optical member 215 is stacked on the light guide plate 219.
 本実施形態に係る光学部材215には、図10及び図11に示すように、導光板219の光入射面219bよりもLED217側に配され、LED217からの光を遮光する遮光部24が設けられたものが含まれている。遮光部24は、一対が、光学部材215における短辺側の両端部、つまりLED217側の両端部にそれぞれ設けられている。遮光部24は、光学部材215とは別部品とされており、光学部材215に対して接着材などによって貼り付けられることで一体化が図られている。遮光部24は、合成樹脂製とされ、各反射シート220,222と同様に、表面が光の反射性に優れた白色を呈するものとされる。言い換えると、遮光部24は、バックライト装置212に汎用的に用いられる反射シートを利用して製造されている。従って、遮光部24は、極めて高い光反射性及び遮光性を有しており、光反射率が100%に近い値(例えば90%~100%の範囲)とされるとともに、光透過率が0%に近い値(例えば0%~10%の範囲)とされる。そして、遮光部24は、導光板219の光入射面219bからLED217側に突出する形で配されるとともに、裏側に配された第1反射シート220と対向状に配されていることから、LED217から発せられた光を第1反射シート220との間で繰り返し反射しつつ光入射面219bに対して効率的に入射させることが可能とされている。この遮光部24は、既述した通り光反射性に加えて十分な遮光性を有していることから、LED217からの光が各光学部材215におけるLED217側の端部に直接入射するのを規制することが可能とされている。なお、本実施形態では、遮光部24を設置するのに伴って、上記した実施形態1に記載した第2反射シート21が省略されている。 As shown in FIGS. 10 and 11, the optical member 215 according to the present embodiment is provided with a light shielding portion 24 that is disposed closer to the LED 217 than the light incident surface 219 b of the light guide plate 219 and shields light from the LED 217. Is included. A pair of light shielding portions 24 are provided at both ends of the optical member 215 on the short side, that is, both ends on the LED 217 side. The light shielding portion 24 is a separate component from the optical member 215, and is integrated by being attached to the optical member 215 with an adhesive or the like. The light shielding portion 24 is made of a synthetic resin, and the surface of the light shielding portion 24 exhibits a white color with excellent light reflectivity, similar to the reflective sheets 220 and 222. In other words, the light shielding unit 24 is manufactured by using a reflection sheet that is generally used for the backlight device 212. Therefore, the light-shielding part 24 has extremely high light reflectivity and light-shielding property, the light reflectivity is set to a value close to 100% (for example, a range of 90% to 100%), and the light transmittance is 0. % (For example, a range of 0% to 10%). The light-shielding part 24 is disposed so as to protrude from the light incident surface 219b of the light guide plate 219 to the LED 217 side, and is disposed opposite to the first reflection sheet 220 disposed on the back side. The light emitted from the light can be efficiently incident on the light incident surface 219b while being repeatedly reflected between the first reflective sheet 220 and the light. Since the light-shielding part 24 has sufficient light-shielding property in addition to light reflectivity as described above, the light from the LED 217 is restricted from directly entering the end of the optical member 215 on the LED 217 side. It is possible to do. In the present embodiment, the second reflection sheet 21 described in the first embodiment is omitted as the light shielding unit 24 is installed.
 遮光部24は、複数枚が互いに積層された光学部材215のうち、導光板219の光出射面219a上に直接載せられるもの、つまり最も導光板219に近い拡散板215aに対して取り付けられている。これにより、LED217からの光は、遮光部24によって遮られることで、少なくとも拡散板215aよりも表側に積層された各光学シート215bにおけるLED217側の端部に対して直接入射したり、各光学シート215b間に生じ得る各隙間に入るのが防止される。遮光部24は、拡散板215aにおける表裏一対の主面のうち、裏側、つまり導光板119側の主面に対して取り付けられている。これにより、LED217からの光は、遮光部24によって遮られることで、拡散板215aにおけるLED217側の端部に直接入射したり、拡散板215aと導光板219との間に生じ得る隙間に入るのが防止される。 The light shielding unit 24 is attached to a light diffusing plate 215a closest to the light guide plate 219, that is, the optical member 215 in which a plurality of sheets are stacked on each other, which is directly mounted on the light emitting surface 219a of the light guide plate 219. . As a result, the light from the LED 217 is blocked by the light shielding portion 24, so that it directly enters at least the end portion on the LED 217 side of each optical sheet 215b laminated on the front side of the diffusion plate 215a, or each optical sheet Entering each gap that may occur between 215b is prevented. The light shielding part 24 is attached to the back side of the pair of front and back main surfaces of the diffusion plate 215a, that is, the main surface on the light guide plate 119 side. As a result, the light from the LED 217 is blocked by the light blocking unit 24 and thus directly enters the end of the diffuser plate 215a on the LED 217 side or enters a gap that may occur between the diffuser plate 215a and the light guide plate 219. Is prevented.
 遮光部24は、図11に示すように、導光板219の光入射面219bよりもLED217側に配される部分と、光入射面219bよりもLED217側とは反対側に配される部分とから構成されており、特に前者がLED217に対して平面に視て重畳する範囲にわたって配されている。つまり、遮光部24は、光入射面219bを跨ぎつつそのLED217側と光出射面219a側とにわたる範囲に配されている。遮光部24は、図10に示すように、一定幅でもって光学部材215の短辺方向、つまりLED217の並び方向(Y軸方向)に沿って延在する縦長な方形状をなしている。従って、遮光部24は、LED217の並び方向について、LED217が配置された領域(光源配置領域)と、LED217が配置されない領域(光源非配置領域)とを横切るとともにこれらのほぼ全範囲にわたって配されている。これにより、Y軸方向に沿って間欠的に並んで配された各LED217から発せられた光が、光学部材215におけるLED217側の端部や、積層された光学部材215間に生じ得る隙間や、光学部材215と導光板219との間に生じ得る隙間に入るのをより確実に遮ることができるものとされる。 As shown in FIG. 11, the light-shielding portion 24 includes a portion disposed on the LED 217 side with respect to the light incident surface 219b of the light guide plate 219 and a portion disposed on the side opposite to the LED 217 side with respect to the light incident surface 219b. In particular, the former is arranged over a range where the former overlaps the LED 217 in a plan view. That is, the light-shielding portion 24 is disposed in a range extending over the LED 217 side and the light emission surface 219a side while straddling the light incident surface 219b. As shown in FIG. 10, the light-shielding portion 24 has a vertically long rectangular shape with a constant width and extending along the short side direction of the optical member 215, that is, the LED 217 arrangement direction (Y-axis direction). Therefore, the light-shielding portion 24 crosses the area where the LEDs 217 are arranged (light source arrangement area) and the area where the LEDs 217 are not arranged (light source non-arrangement area) in the arrangement direction of the LEDs 217 and is arranged over almost the entire range. Yes. Thereby, the light emitted from the LEDs 217 arranged intermittently along the Y-axis direction can be generated between the end of the optical member 215 on the LED 217 side or between the stacked optical members 215, It is possible to more reliably block the gap that may occur between the optical member 215 and the light guide plate 219.
 そして、本実施形態に係る位置決め構造223は、図10及び図11に示すように、LED基板218の放熱板部218bに形成された位置決め凸状部223aと、導光板219に形成されるとともに位置決め凸状部223aが嵌合される位置決め凹状部223bと、各光学部材215にそれぞれ形成されるとともに位置決め凸状部223aが嵌合される第2位置決め凹状部223cとから構成されている。このうち、位置決め凹状部223bは、導光板219を板厚方向に貫通する孔状に形成されており、放熱板部218b側と光学部材215側とにそれぞれ開口している。第2位置決め凹状部223cは、各光学部材215をそれぞれ板厚方向に貫通する孔状に形成されており、各光学部材215の面内において上記した位置決め凹状部223bに連通し且つ整合するような位置に配されている。第2位置決め凹状部223cは、各光学部材215のうち鉛直方向の上端部においてX軸方向について離間した2位置に一対が配されている。位置決め凸状部223aは、放熱板部218bからの突出寸法が導光板219の板厚寸法と、各光学部材215の板厚寸法とを足し合わせた大きさよりもさらに大きなものとされており、それにより位置決め凹状部223b及び各第2位置決め凹状部223c内に一括して嵌合されるようになっている。 As shown in FIGS. 10 and 11, the positioning structure 223 according to the present embodiment is formed on the positioning convex portion 223a formed on the heat radiating plate portion 218b of the LED substrate 218 and the light guide plate 219 and positioned. A positioning concave portion 223b to which the convex portion 223a is fitted and a second positioning concave portion 223c that is formed on each optical member 215 and to which the positioning convex portion 223a is fitted. Among these, the positioning concave portion 223b is formed in a hole shape penetrating the light guide plate 219 in the plate thickness direction, and opens to the heat radiating plate portion 218b side and the optical member 215 side, respectively. The second positioning concave portion 223c is formed in a hole shape penetrating each optical member 215 in the thickness direction, and communicates with and aligns with the positioning concave portion 223b in the plane of each optical member 215. Arranged in position. A pair of second positioning concave portions 223c are arranged at two positions separated from each other in the X-axis direction at the upper end portion in the vertical direction of each optical member 215. The positioning convex portion 223a has a projecting dimension from the heat radiating plate 218b larger than the sum of the thickness of the light guide plate 219 and the thickness of each optical member 215. Thus, the positioning concave portions 223b and the second positioning concave portions 223c are collectively fitted.
 組み付け時には、LED基板218をシャーシ214に取り付けた状態で導光板219をシャーシ214内に収容すると、位置決め凸状部223aが位置決め凹状部223bに嵌合されることで、LED基板218に対する導光板219の位置決めが図られる。その後、各光学部材215を順次に導光板219上に積層設置すると、位置決め凸状部223aが各第2位置決め凹状部223cに嵌合されることで、LED基板218に対する各光学部材215の位置決めが図られる。このとき、光学部材215である拡散板215aに一体的に設けられた遮光部24についても、LED217に対してX軸方向及びY軸方向について高い精度でもって位置決めされるから、遮光部24による遮光性能を安定的に発揮させることができる。組み付けが完了した液晶表示装置210は、液晶パネル211の表示面が鉛直方向に沿う姿勢で使用されることになるのであるが、このとき、各光学部材215は、導光板219と共に位置決め凸状部223aによって鉛直方向の上側から吊り下げられた状態で支持されることになる。従って、熱環境の変化に伴って各光学部材215に熱膨張や熱収縮が生じた場合でも、光学部材215自身の重量によってしわや撓みなどの変形が生じ難くなっている。これにより、バックライト装置212からの出射光に輝度ムラが生じ難くなるとともに、液晶パネル211に表示される画像の表示品位をより高いものとすることができる。 When assembled, when the light guide plate 219 is accommodated in the chassis 214 with the LED substrate 218 attached to the chassis 214, the positioning convex portion 223a is fitted into the positioning concave portion 223b, so that the light guide plate 219 with respect to the LED substrate 218 is obtained. Are positioned. Thereafter, when the optical members 215 are sequentially stacked on the light guide plate 219, the positioning convex portions 223a are fitted into the second positioning concave portions 223c, thereby positioning the optical members 215 with respect to the LED substrate 218. Figured. At this time, the light shielding part 24 integrally provided on the diffusion plate 215a which is the optical member 215 is also positioned with high accuracy in the X-axis direction and the Y-axis direction with respect to the LED 217. The performance can be exhibited stably. The assembled liquid crystal display device 210 is used with the display surface of the liquid crystal panel 211 along the vertical direction. At this time, each optical member 215 is positioned with the light guide plate 219 and the positioning convex portion. It will be supported in the state suspended from the upper side of the vertical direction by 223a. Therefore, even when each optical member 215 undergoes thermal expansion or contraction due to a change in the thermal environment, deformation such as wrinkles or deflection is less likely to occur due to the weight of the optical member 215 itself. Thereby, luminance unevenness hardly occurs in the light emitted from the backlight device 212, and the display quality of the image displayed on the liquid crystal panel 211 can be improved.
 以上説明したように本実施形態によれば、導光板219における光出射面219aに対して対向状に配される光学部材215が備えられており、位置決め凹状部223bは、導光板219をその板厚方向に貫通する形態とされるのに対し、光学部材215には、位置決め凸状部223aが嵌合される第2位置決め凹状部223cが形成されている。このようにすれば、導光板219に形成された位置決め凹状部223bを貫通する位置決め凸状部223aが、光学部材215に形成された第2位置決め凹状部223cに嵌合されることで、導光板219と共に光学部材215についても位置決めを図ることができる。 As described above, according to the present embodiment, the optical member 215 is provided so as to face the light emitting surface 219a of the light guide plate 219, and the positioning concave portion 223b includes the light guide plate 219 and the plate. The optical member 215 is formed with a second positioning concave portion 223c into which the positioning convex portion 223a is fitted, whereas the optical member 215 is formed to penetrate in the thickness direction. By doing so, the positioning convex portion 223a penetrating the positioning concave portion 223b formed in the light guide plate 219 is fitted into the second positioning concave portion 223c formed in the optical member 215, whereby the light guide plate The optical member 215 can be positioned together with the 219.
 また、光学部材215におけるLED217側の端部には、LED217側に向けて突出して光入射面219bよりもLED217側に配されるとともにLED217からの光を遮る遮光部24が設けられている。このようにすれば、LED217から発せられた光は、遮光部24によって遮られることで、例えば光学部材215におけるLED217側の端部に直接入射したり、導光板219と光学部材215との間に生じ得る隙間に入るのが防がれる。これにより、LED217からの光が導光板219の光入射面219bに入射することなく外部に出射するのを防ぐことができる。ここで、第2位置決め凹状部223cに位置決め凸状部223aが嵌合されると、LED基板218に実装されたLED217と光学部材215に設けられた遮光部24とが、LED217から光入射面219bに向かう方向について高い精度でもって位置決めされるから、上記した遮光部24による遮光性能を安定的に発揮させることができる。 Further, at the end of the optical member 215 on the LED 217 side, there is provided a light shielding portion 24 that protrudes toward the LED 217 side and is disposed closer to the LED 217 than the light incident surface 219b and blocks light from the LED 217. In this way, the light emitted from the LED 217 is blocked by the light blocking unit 24, for example, directly incident on the end of the optical member 215 on the LED 217 side, or between the light guide plate 219 and the optical member 215. It is prevented from entering the possible gap. Accordingly, it is possible to prevent the light from the LED 217 from being emitted outside without entering the light incident surface 219b of the light guide plate 219. Here, when the positioning convex portion 223a is fitted to the second positioning concave portion 223c, the LED 217 mounted on the LED substrate 218 and the light shielding portion 24 provided on the optical member 215 are connected from the LED 217 to the light incident surface 219b. Therefore, the light shielding performance by the above-described light shielding portion 24 can be stably exhibited.
 また、遮光部24は、光を反射する光反射性を有している。このようにすれば、LED217からの光を遮光部24によって反射して光入射面219bに向かわせることができる。これにより、光の利用効率を向上させることができる。 Further, the light shielding portion 24 has light reflectivity for reflecting light. In this way, the light from the LED 217 can be reflected by the light shielding portion 24 and directed toward the light incident surface 219b. Thereby, the utilization efficiency of light can be improved.
 また、第2位置決め凹状部223cは、光学部材215をその厚さ方向に貫通する孔状をなしており、その孔縁が位置決め凸状部223aにより鉛直方向について支持される。このようにすれば、第2位置決め凹状部223cに位置決め凸状部223aを嵌合させると、第2位置決め凹状部223cの孔縁が位置決め凸状部223aにより鉛直方向について支持される。つまり、位置決め凸状部223aにより光学部材215を吊り下げて支持することが可能とされるから、例えば光学部材215に熱膨張または熱収縮が生じた場合でも、光学部材215自身の重量によりしわや撓みなどの変形が生じ難いものとされる。もって、輝度ムラをより効果的に抑制することができる。 The second positioning concave portion 223c has a hole shape penetrating the optical member 215 in the thickness direction, and the hole edge is supported in the vertical direction by the positioning convex portion 223a. In this way, when the positioning convex portion 223a is fitted to the second positioning concave portion 223c, the hole edge of the second positioning concave portion 223c is supported in the vertical direction by the positioning convex portion 223a. That is, since the optical member 215 can be suspended and supported by the positioning convex portion 223a, for example, even when the optical member 215 undergoes thermal expansion or contraction, the optical member 215 itself is wrinkled. It is assumed that deformation such as bending hardly occurs. Accordingly, luminance unevenness can be more effectively suppressed.
 <実施形態4>
 本発明の実施形態4を図12によって説明する。この実施形態4では、一対のLED基板318の配置を変更したものを示す。なお、上記した実施形態1と同様の構造、作用及び効果について重複する説明は省略する。
<Embodiment 4>
A fourth embodiment of the present invention will be described with reference to FIG. In this Embodiment 4, what changed arrangement | positioning of a pair of LED board 318 is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
 本実施形態に係るLED基板318は、図12に示すように、導光板319を短辺方向(Y軸方向、鉛直方向)について両側から挟み込む位置に一対配されている。LED基板318は、シャーシ314の長辺側の側板314bに沿って延在する形のLED実装部318aと、LED実装部318aからY軸方向に沿って導光板319に向けて延在する放熱板部318bとから構成されている。これに対して、導光板319の外周端面のうち、長辺側の両端面がそれぞれLED317と対向状をなす光入射面319bとされる。一対のLED基板318のうち、鉛直方向の上側に配されたLED基板318における放熱板部318bには、位置決め構造323を構成する位置決め凸状部323aが一対設けられている。位置決め凸状部323aは、X軸方向に沿って間欠的に並列配置されたLED317のうちの最も端に位置するLED317よりもさらに端寄りにずれた位置に配されている。つまり、本実施形態に係る位置決め構造323は、導光板319における鉛直方向の上側の角部に配されている。 As shown in FIG. 12, a pair of LED substrates 318 according to the present embodiment are arranged at positions where the light guide plate 319 is sandwiched from both sides in the short side direction (Y-axis direction, vertical direction). The LED board 318 includes an LED mounting portion 318a extending along the side plate 314b on the long side of the chassis 314, and a heat radiating plate extending from the LED mounting portion 318a toward the light guide plate 319 along the Y-axis direction. Part 318b. On the other hand, among the outer peripheral end surfaces of the light guide plate 319, both end surfaces on the long side are light incident surfaces 319b that are opposed to the LEDs 317, respectively. Among the pair of LED substrates 318, a pair of positioning convex portions 323a constituting the positioning structure 323 is provided on the heat dissipation plate portion 318b of the LED substrate 318 disposed on the upper side in the vertical direction. The positioning convex portion 323a is arranged at a position further shifted closer to the end than the LED 317 located at the end of the LEDs 317 intermittently arranged in parallel along the X-axis direction. That is, the positioning structure 323 according to the present embodiment is disposed at the upper corner of the light guide plate 319 in the vertical direction.
 <実施形態5>
 本発明の実施形態5を図13によって説明する。この実施形態5では、上記した実施形態4のさらなる変形例とも言うべきものであって、LED基板418を導光板419の片端側のみに配したものを示す。なお、上記した実施形態4と同様の構造、作用及び効果について重複する説明は省略する。
<Embodiment 5>
Embodiment 5 of the present invention will be described with reference to FIG. The fifth embodiment should be called a further modification of the above-described fourth embodiment, and shows an LED substrate 418 arranged only on one end side of the light guide plate 419. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 4 is abbreviate | omitted.
 本実施形態に係るLED基板418は、図13に示すように、導光板419に対して鉛直方向の下側に1つのみ配されている。LED基板418を構成する放熱板部418bには、位置決め構造423を構成する位置決め凸状部423aが一対形成されており、その配置は導光板419における鉛直方向の下側の角部となっている。 As shown in FIG. 13, only one LED substrate 418 according to this embodiment is disposed on the lower side in the vertical direction with respect to the light guide plate 419. A pair of positioning convex portions 423a constituting the positioning structure 423 is formed on the heat radiating plate portion 418b constituting the LED substrate 418, and the arrangement thereof is a lower corner portion in the vertical direction of the light guide plate 419. .
 <実施形態6>
 本発明の実施形態6を図14によって説明する。この実施形態6では、LED基板518を導光板519の4辺にそれぞれ対応して設けたものを示す。なお、上記した実施形態1と同様の構造、作用及び効果について重複する説明は省略する。
<Embodiment 6>
Embodiment 6 of the present invention will be described with reference to FIG. In the sixth embodiment, LED substrates 518 are provided corresponding to the four sides of the light guide plate 519, respectively. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
 本実施形態に係るLED基板518は、図14に示すように、導光板519を長辺方向(X軸方向)について両側から挟み込む位置に配される一対の第1LED基板518Aと、導光板519を短辺方向(Y軸方向、鉛直方向)について両側から挟み込む位置に配される一対の第2LED基板518Bとを備える。一対の第1LED基板518Aの構成は、位置決め構造523を含めて上記した実施形態1に記載したLED基板18と同様であるから、重複する説明は割愛する。第2LED基板518BのLED実装部518Baは、導光板519の長辺寸法と同等の長さを有しており、その長さ方向(X軸方向)に沿って複数のLED517が間欠的に並列配置されている。第2LED基板518Bの放熱板部518Bbは、そのX軸方向についての寸法がLED実装部518Baよりも短くなっており、その差は一対の第1LED基板518Aの放熱板部518Aaの延出長さ寸法分程度とされる。つまり、第2LED基板518Bの放熱板部518Baは、第1LED基板518Aの放熱板部518Aaと重なり合わないような大きさとされている。これに対して、導光板519の外周端面のうち、短辺側の両端面がそれぞれ第1LED基板518Aに実装された各LED517と対向状をなす第1光入射面519Abとされるのに対し、長辺側の両端面がそれぞれ第2LED基板518Bに実装された各LED517と対向状をなす第2光入射面519Bbとされる。 As shown in FIG. 14, the LED substrate 518 according to the present embodiment includes a pair of first LED substrates 518 </ b> A disposed at positions where the light guide plate 519 is sandwiched from both sides in the long side direction (X-axis direction), and the light guide plate 519. And a pair of second LED substrates 518B arranged at positions sandwiched from both sides in the short side direction (Y-axis direction, vertical direction). Since the configuration of the pair of first LED boards 518A is the same as that of the LED board 18 described in the first embodiment including the positioning structure 523, overlapping description is omitted. The LED mounting portion 518Ba of the second LED substrate 518B has a length equivalent to the long side dimension of the light guide plate 519, and a plurality of LEDs 517 are intermittently arranged in parallel along the length direction (X-axis direction). Has been. The heat dissipation plate portion 518Bb of the second LED substrate 518B has a shorter dimension in the X-axis direction than the LED mounting portion 518Ba, and the difference is the extension length dimension of the heat dissipation plate portion 518Aa of the pair of first LED substrates 518A. It is about a minute. That is, the heat dissipation plate portion 518Ba of the second LED substrate 518B is sized so as not to overlap the heat dissipation plate portion 518Aa of the first LED substrate 518A. On the other hand, among the outer peripheral end surfaces of the light guide plate 519, both end surfaces on the short side are the first light incident surfaces 519Ab facing each LED 517 mounted on the first LED substrate 518A, respectively. Both end surfaces on the long side are second light incident surfaces 519Bb that face each LED 517 mounted on the second LED substrate 518B.
 <実施形態7>
 実施形態7を図15または図16によって説明する。この実施形態7では、光学部材615のみを位置決めする構成としたものを示す。
<Embodiment 7>
A seventh embodiment will be described with reference to FIG. 15 or FIG. The seventh embodiment shows a configuration in which only the optical member 615 is positioned.
 本実施形態では、図15及び図16に示すように、位置決め構造623が、LED基板618の放熱板部618bに形成された位置決め凸状部623aと、各光学部材615に形成された位置決め凹状部623bとから構成されており、導光板619には形成されていない。光学部材615は、平面に視て導光板619よりも広範囲にわたる大きさを有しており、導光板619とは重畳しない非重畳部に上記した位置決め凹状部623bが板厚方向に貫通する形態で形成されている。LED基板618も同様に、放熱板部618bが平面に視て導光板619よりも広範囲にわたる大きさを有しており、導光板619とは重畳しない非重畳部に上記した位置決め凸状部623aが形成されている。位置決め凸状部623aは、放熱板部618bからの突出寸法が導光板619の板厚寸法と、各光学部材615の板厚寸法とを足し合わせた大きさよりもさらに大きなものとされており、それにより導光板619の側方位置にて各位置決め凹状部623b内に嵌合されるようになっている。光学部材615におけるLED617側の端部には、上記した実施形態3にて説明したものと同じ遮光部624が設けられている。従って、位置決め構造623によって光学部材615とLED基板618及びLED617とをX軸方向について精度良く位置決めすることで、遮光部624の遮光性能を安定的に発揮させることができる。 In this embodiment, as shown in FIGS. 15 and 16, the positioning structure 623 includes a positioning convex portion 623 a formed on the heat radiating plate portion 618 b of the LED substrate 618 and a positioning concave portion formed on each optical member 615. 623b, and is not formed on the light guide plate 619. The optical member 615 has a size wider than that of the light guide plate 619 in a plan view, and the positioning concave portion 623b described above penetrates in the thickness direction in a non-overlapping portion that does not overlap with the light guide plate 619. Is formed. Similarly, the LED substrate 618 has a heat radiating plate portion 618b having a size over a wider range than the light guide plate 619 in a plan view, and the positioning convex portion 623a described above is formed on a non-overlapping portion that does not overlap the light guide plate 619. Is formed. In the positioning convex portion 623a, the projecting dimension from the heat sink plate 618b is larger than the sum of the thickness of the light guide plate 619 and the thickness of each optical member 615. Thus, each positioning concave portion 623b is fitted in the side position of the light guide plate 619. The same light shielding portion 624 as that described in the third embodiment is provided at the end of the optical member 615 on the LED 617 side. Therefore, the light shielding performance of the light shielding portion 624 can be stably exhibited by accurately positioning the optical member 615, the LED substrate 618, and the LED 617 in the X-axis direction by the positioning structure 623.
 <他の実施形態>
 本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
 (1)上記した実施形態1~6では、位置決め構造として、LED基板側に位置決め凸状部を、導光板側に位置決め凹状部をそれぞれ形成した場合を示したが、逆にLED基板側に位置決め凹状部を、導光板側に位置決め凸状部をそれぞれ形成するようにしても構わない。なお、上記した技術事項を実施形態3に適用する場合には、導光板に放熱板部側に向けて突出する第1位置決め凸状部を設けるとともに、各光学部材側に向けて突出する第2位置決め凸状部を設けるようにし、第1位置決め凸状部を放熱板部が有する位置決め凹状部に嵌合させ、第2位置決め凸状部を各光学部材が有する第2位置決め凹状部に嵌合させるようにすればよい。
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the first to sixth embodiments described above, the positioning structure is shown in which the positioning convex portion is formed on the LED substrate side and the positioning concave portion is formed on the light guide plate side. You may make it form a concave-shaped part and a positioning convex-shaped part in the light-guide plate side, respectively. In addition, when applying the above-mentioned technical matter to Embodiment 3, while providing the 1st positioning convex part which protrudes toward the heat radiating plate part side in a light-guide plate, it protrudes 2nd toward each optical member side. A positioning convex portion is provided, the first positioning convex portion is fitted into the positioning concave portion of the heat radiating plate portion, and the second positioning convex portion is fitted into the second positioning concave portion of each optical member. What should I do?
 (2)上記した実施形態1,2,4~6では、位置決め凹状部が導光板を板厚方向について貫通しない凹陥状に形成されたものを示したが、位置決め凹状部が導光板を板厚方向に貫通する孔状に形成される構成とすることも可能である。その場合、位置決め凸状部は、孔状の位置決め凹状部に嵌合した状態で、光出射面から表側に突出する大きさとしたり、光出射面から突出することがない大きさ(光出射面と面一状となる大きさ、または光出射面よりも引っ込む大きさ)とすることができる。 (2) In Embodiments 1, 2, 4 to 6 described above, the positioning concave portion is formed in a concave shape that does not penetrate the light guide plate in the plate thickness direction. However, the positioning concave portion has the thickness of the light guide plate. It is also possible to adopt a configuration that is formed in a hole shape penetrating in the direction. In that case, the positioning convex portion is sized so as to protrude from the light emitting surface to the front side in a state of being fitted in the hole-shaped positioning concave portion, or not to protrude from the light emitting surface (the light emitting surface and (A size that is flush or a size that retracts more than the light exit surface).
 (3)上記した実施形態1~6以外にも、位置決め構造の配置は適宜に変更可能である。例えば、実施形態1~4,6において、位置決め構造を、導光板における鉛直方向の下端部付近や鉛直方向の中央部付近などに配することができる。また、実施形態5において、LED基板を鉛直方向の上側に配するとともに、位置決め構造を導光板における鉛直方向の上端部付近や鉛直方向の中央部付近などに配することができる。 (3) In addition to the first to sixth embodiments described above, the arrangement of the positioning structure can be changed as appropriate. For example, in the first to fourth and sixth embodiments, the positioning structure can be arranged near the lower end portion in the vertical direction of the light guide plate, near the central portion in the vertical direction, or the like. Further, in the fifth embodiment, the LED substrate can be arranged on the upper side in the vertical direction, and the positioning structure can be arranged in the vicinity of the upper end portion in the vertical direction or the central portion in the vertical direction on the light guide plate.
 (4)上記した(3)以外にも、位置決め構造の配置を変更するに際しては、例えば位置決め構造を、間欠的に並列配置された隣り合うLEDの間に配することも可能である。また、位置決め構造をLEDの発光面と対向状をなす配置とすることも可能である。 (4) In addition to the above (3), when changing the arrangement of the positioning structure, for example, the positioning structure can be arranged between adjacent LEDs arranged intermittently in parallel. It is also possible to arrange the positioning structure so as to face the light emitting surface of the LED.
 (5)上記した実施形態1~6以外にも、位置決め構造の具体的な形状は適宜に変更可能である。例えば、位置決め凸状部及び位置決め凹状部(第2位置決め凹状部)が平面に視て円形状、楕円形状、正方形状、台形状、菱形状、三角形状、五角形以上の多角形状などとすることも可能である。 (5) In addition to the first to sixth embodiments described above, the specific shape of the positioning structure can be changed as appropriate. For example, the positioning convex portion and the positioning concave portion (second positioning concave portion) may have a circular shape, an elliptical shape, a square shape, a trapezoidal shape, a rhombus shape, a triangular shape, a pentagonal or more polygonal shape in a plan view. Is possible.
 (6)上記した実施形態1~6では、位置決め構造を一対設けるようにしたものを示したが、位置決め構造の設置数は3つ以上に変更することも勿論可能である。 (6) In the first to sixth embodiments described above, a pair of positioning structures is shown, but it is of course possible to change the number of positioning structures to three or more.
 (7)上記した実施形態1~6以外にも、LED基板の放熱板部の形成範囲は適宜に変更可能である。例えば、LED基板の放熱板部が導光板の底面を全域にわたって覆う範囲にわたって形成される構成としてもよく、その場合は位置決め構造の配置の自由度がさらに高まる。また、LED基板の放熱板部の平面形状を方形状以外に変更することも可能である。 (7) Besides the first to sixth embodiments described above, the formation range of the heat sink portion of the LED substrate can be changed as appropriate. For example, it is good also as a structure formed in the range which the heat sink part of an LED board covers the bottom face of a light-guide plate over the whole region, In that case, the freedom degree of arrangement | positioning of a positioning structure further increases. Moreover, it is also possible to change the planar shape of the heat sink part of an LED board other than a square shape.
 (8)上記した実施形態3では、遮光部を有する光学部材に加えて、遮光部を有さない光学部材にも第2位置決め凹状部を形成してその位置決めを図る構成を示したが、遮光部を有する光学部材にのみ第2位置決め凹状部を形成して、遮光部を有さない光学部材については第2位置決め凹状部を形成しない構成とすることも可能である。 (8) In the above-described third embodiment, in addition to the optical member having the light shielding portion, the second positioning concave portion is formed on the optical member not having the light shielding portion, and the positioning is performed. It is also possible to form the second positioning concave portion only in the optical member having the portion and not to form the second positioning concave portion in the optical member not having the light shielding portion.
 (9)上記した実施形態3では、遮光部を有する光学部材に第2位置決め凹状部を形成することで、その位置決めを図る構成を示したが、全ての光学部材が遮光部を有さない構成(例えば上記した実施形態1のような構成)において、各光学部材に第2位置決め凹状部を形成してその位置決めを図る構成とすることも可能である。 (9) In the third embodiment described above, the configuration in which the positioning is achieved by forming the second positioning concave portion in the optical member having the light shielding portion has been described, but the configuration in which all the optical members do not have the light shielding portion. In (for example, the configuration as in the first embodiment described above), it is also possible to form a second positioning concave portion in each optical member so as to position the optical member.
 (10)上記した実施形態2に記載した構成を、実施形態3~6に記載した構成に適用することも可能である。 (10) The configuration described in the second embodiment can be applied to the configurations described in the third to sixth embodiments.
 (11)上記した実施形態3に記載した構成を、実施形態4~6に記載した構成に適用することも可能である。 (11) The configuration described in the third embodiment can be applied to the configurations described in the fourth to sixth embodiments.
 (12)上記した実施形態1~6では、光学部材を3枚用いた場合を例示したが、光学部材の使用枚数は3枚以外(2枚以下、4枚以上)に適宜に変更することが可能である。また、使用する光学部材の具体的な種類は適宜に変更可能である。 (12) In Embodiments 1 to 6 described above, the case where three optical members are used has been exemplified. However, the number of optical members used can be appropriately changed to other than three (two or less, four or more). Is possible. Moreover, the specific kind of optical member to be used can be changed as appropriate.
 (13)上記した実施形態4~6以外にも、LED基板を導光板における長辺側の両端部及び短辺側の一端部に対して1つずつ、合計3つ配したものや、短辺側の両端部及び長辺側の一端部に対して1つずつ、合計3つ配したものも本発明に含まれる。 (13) In addition to the above-described Embodiments 4 to 6, a total of three LED substrates, one for each of the long-side ends and the short-side ends of the light guide plate, The present invention also includes a configuration in which a total of three are arranged one by one with respect to both end portions on the side and one end portion on the long side.
 (14)上記した各実施形態では、液晶パネルが有するカラーフィルタの着色部をR,G,Bの3色としたものを例示したが、着色部を4色以上とすることも可能である。 (14) In each of the above-described embodiments, the color portion of the color filter included in the liquid crystal panel is exemplified as three colors of R, G, and B. However, the color portion may be four or more colors.
 (15)上記した各実施形態では、光源としてLEDを用いたものを示したが、有機ELなどの他の光源を用いることも可能である。 (15) In each of the above-described embodiments, an LED is used as the light source. However, other light sources such as an organic EL can be used.
 (16)上記した各実施形態では、液晶表示装置のスイッチング素子としてTFTを用いたが、TFT以外のスイッチング素子(例えば薄膜ダイオード(TFD))を用いた液晶表示装置にも適用可能であり、カラー表示する液晶表示装置以外にも、白黒表示する液晶表示装置にも適用可能である。 (16) In each of the embodiments described above, a TFT is used as a switching element of a liquid crystal display device. However, the present invention can also be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)). In addition to the liquid crystal display device for display, the present invention can also be applied to a liquid crystal display device for monochrome display.
 (17)上記した各実施形態では、表示パネルとして液晶パネルを用いた液晶表示装置を例示したが、他の種類の表示パネルを用いた表示装置にも本発明は適用可能である。 (17) In each of the above-described embodiments, the liquid crystal display device using the liquid crystal panel as the display panel has been exemplified. However, the present invention can also be applied to display devices using other types of display panels.
 (18)上記した各実施形態では、チューナーを備えたテレビ受信装置を例示したが、チューナーを備えない表示装置にも本発明は適用可能である。 (18) In each of the above-described embodiments, the television receiver provided with the tuner is exemplified, but the present invention is also applicable to a display device that does not include the tuner.
 10,110...液晶表示装置(表示装置)、11...液晶パネル(表示パネル)、12,112...バックライト装置(照明装置)、14,114,214,314...シャーシ、14a,114a...底板、17,117,217,317,517...LED(光源)、17a,117a...発光面、18,118,218,318,418,518...LED基板(光源基板)、18a,118a,218a,318a,418a,518a,518Aa,518Ba...LED実装部(光源実装部)、18b,118b,218b,318b,418b,518Ab,518Bb...放熱板部、19,119,219,319,419,519...導光板、19a,219a...光出射面、19b,219b,319b...光入射面、19c...底面(板面)、23,223,323,423,523...位置決め構造、23a,223a,323a,423a...位置決め凸状部、23b,223b...位置決め凹状部、215...光学部材、223c...第2位置決め凹状部、518A...第1LED基板(光源基板)、518B...第2LED基板(光源基板)、519Ab...第1光入射面(光入射面)、519Bb...第2光入射面(光入射面)、TV...テレビ受信装置 10, 110 ... Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12, 112 ... Backlight device (illumination device), 14, 114, 214, 314 ... Chassis , 14a, 114a ... bottom plate, 17, 117, 217, 317, 517 ... LED (light source), 17a, 117a ... light emitting surface, 18, 118, 218, 318, 418, 518 ... LED Board (light source board), 18a, 118a, 218a, 318a, 418a, 518a, 518Aa, 518Ba ... LED mounting part (light source mounting part), 18b, 118b, 218b, 318b, 418b, 518Ab, 518Bb ... heat dissipation Plate part, 19, 119, 219, 319, 419, 519 ... light guide plate, 19a, 219a ... light emitting surface, 19b, 219b, 319b ... light incident surface, 19c ... bottom surface (plate surface) ), 3, 223, 323, 423, 523 ... positioning structure, 23a, 223a, 323a, 423a ... positioning convex part, 23b, 223b ... positioning concave part, 215 ... optical member, 223c ... Second positioning concave portion, 518A ... first LED substrate (light source substrate), 518B ... second LED substrate (light source substrate), 519Ab ... first light incident surface (light incident surface), 519Bb ... Second light incident surface (light incident surface), TV ... TV receiver

Claims (14)

  1.  光源と、
     前記光源と対向状に配されるとともに前記光源からの光が入射される光入射面、及び入射した光を出射させる光出射面を有する導光板と、
     前記光源が実装される光源実装部と前記光源実装部から前記導光板側に向けて延在する放熱板部とを有する光源基板と、
     前記光源基板及び前記導光板を収容するものであって、前記導光板の板面に並行するとともに前記導光板との間で前記放熱板部を挟み込む底板を有するシャーシと、
     前記放熱板部と前記導光板とにそれぞれ形成されるとともに互いに凹凸嵌合することで、前記光源基板と前記導光板とを、少なくとも前記光源から前記光入射面に向かう方向について位置決めする位置決め構造と、を備える照明装置。
    A light source;
    A light guide plate disposed opposite to the light source and having a light incident surface on which light from the light source is incident, and a light emitting surface for emitting the incident light;
    A light source board having a light source mounting part on which the light source is mounted and a heat radiating plate part extending from the light source mounting part toward the light guide plate,
    A chassis that houses the light source substrate and the light guide plate, and has a bottom plate that is parallel to the plate surface of the light guide plate and sandwiches the heat radiating plate portion with the light guide plate;
    A positioning structure for positioning the light source substrate and the light guide plate at least in the direction from the light source toward the light incident surface by being formed on the heat radiating plate portion and the light guide plate, respectively, and engaging with each other. A lighting device comprising:
  2.  前記位置決め構造は、前記導光板における前記放熱板部と対向する板面に形成される位置決め凹状部と、前記放熱板部に形成されるとともに前記導光板に向けて突出して前記位置決め凹状部に嵌合される位置決め凸状部とから構成されている請求項1記載の照明装置。 The positioning structure includes a positioning concave portion formed on a surface of the light guide plate facing the heat dissipation plate portion, a positioning concave portion formed on the heat dissipation plate portion, and projecting toward the light guide plate to fit into the positioning concave portion. The illuminating device according to claim 1, wherein the illuminating device comprises a positioning convex portion to be joined.
  3.  前記導光板における前記光出射面に対して対向状に配される光学部材が備えられており、
     前記位置決め凹状部は、前記導光板をその板厚方向に貫通する形態とされるのに対し、前記光学部材には、前記位置決め凸状部が嵌合される第2位置決め凹状部が形成されている請求項2記載の照明装置。
    An optical member disposed opposite to the light exit surface of the light guide plate is provided;
    The positioning concave portion is configured to penetrate the light guide plate in the plate thickness direction, whereas the optical member is formed with a second positioning concave portion into which the positioning convex portion is fitted. The lighting device according to claim 2.
  4.  前記光学部材における前記光源側の端部には、前記光源側に向けて突出して前記光入射面よりも前記光源側に配されるとともに前記光源からの光を遮る遮光部が設けられている請求項3記載の照明装置。 The light source side end portion of the optical member is provided with a light shielding portion that protrudes toward the light source side and is disposed closer to the light source side than the light incident surface and blocks light from the light source. Item 4. The lighting device according to Item 3.
  5.  前記遮光部は、光を反射する光反射性を有している請求項4記載の照明装置。 The illuminating device according to claim 4, wherein the light shielding part has light reflectivity for reflecting light.
  6.  前記第2位置決め凹状部は、前記光学部材をその厚さ方向に貫通する孔状をなしており、その孔縁が前記位置決め凸状部により鉛直方向について支持される請求項3から請求項5のいずれか1項に記載の照明装置。 The second positioning concave portion has a hole shape penetrating the optical member in the thickness direction, and a hole edge of the second positioning concave portion is supported in the vertical direction by the positioning convex portion. The lighting device according to any one of the above.
  7.  前記位置決め構造は、前記光源から前記光入射面に向かう方向について前記光源とは重なり合わない位置に配されている請求項1から請求項6のいずれか1項に記載の照明装置。 The lighting device according to any one of claims 1 to 6, wherein the positioning structure is arranged at a position that does not overlap the light source in a direction from the light source toward the light incident surface.
  8.  前記光源は、前記光入射面に沿って複数が間欠的に並んで配されており、
     前記位置決め構造は、前記光源の並び方向について最も端に配された前記光源よりもさらに端寄りにずれた位置に配されている請求項7記載の照明装置。
    A plurality of the light sources are arranged intermittently along the light incident surface,
    The lighting device according to claim 7, wherein the positioning structure is arranged at a position further shifted toward the end than the light source arranged at the end in the arrangement direction of the light sources.
  9.  前記光源基板は、前記導光板を挟み込む形で一対配されているのに対して、前記導光板は、一対の前記光源基板に実装された各前記光源とそれぞれ対向状をなす形で前記光入射面を一対有しており、
     前記位置決め構造は、一対の前記光源基板が有する各前記放熱板部と前記導光板とにそれぞれ設けられている請求項1から請求項8のいずれか1項に記載の照明装置。
    The light source substrates are arranged in a pair so as to sandwich the light guide plate, whereas the light guide plates are opposed to the light sources mounted on the pair of light source substrates, respectively. A pair of surfaces,
    The lighting device according to any one of claims 1 to 8, wherein the positioning structure is provided on each of the heat radiating plate portions and the light guide plate of the pair of light source substrates.
  10.  前記光源実装部は、前記放熱板部から立ち上がって前記光入射面と対向状に配されるのに対し、前記光源は、前記光源実装部に対する実装面とは反対側に位置する頂面が発光面とされる頂面発光型のLEDからなる請求項1から請求項9のいずれか1項に記載の照明装置。 The light source mounting portion rises from the heat radiating plate portion and is arranged to face the light incident surface, whereas the light source has a top surface located on the opposite side of the mounting surface with respect to the light source mounting portion. The lighting device according to any one of claims 1 to 9, comprising a top-emitting LED that is a surface.
  11.  前記光源実装部は、前記放熱板部に沿って延在する形態とされるのに対し、前記光源は、前記光源実装部に対する実装面に隣り合う側面が発光面とされる側面発光型のLEDからなる請求項1から請求項9のいずれか1項に記載の照明装置。 The light source mounting portion is configured to extend along the heat radiating plate portion, whereas the light source is a side-emitting LED whose side surface adjacent to the mounting surface with respect to the light source mounting portion is a light emitting surface. The lighting device according to claim 1, comprising:
  12.  請求項1から請求項11のいずれか1項に記載の照明装置と、前記照明装置からの光を利用して表示を行う表示パネルとを備える表示装置。 A display device comprising: the illumination device according to any one of claims 1 to 11; and a display panel that performs display using light from the illumination device.
  13.  前記表示パネルは、一対の基板間に液晶を封入してなる液晶パネルとされる請求項12記載の表示装置。 13. The display device according to claim 12, wherein the display panel is a liquid crystal panel in which liquid crystal is sealed between a pair of substrates.
  14.  請求項12または請求項13に記載された表示装置を備えるテレビ受信装置。 A television receiver comprising the display device according to claim 12 or claim 13.
PCT/JP2012/066849 2011-07-07 2012-07-02 Illumination device, display device, and television reception device WO2013005708A1 (en)

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