WO2012176566A1

WO2012176566A1 - Defect correction device and defect correction method

Info

Publication number: WO2012176566A1
Application number: PCT/JP2012/062908
Authority: WO
Inventors: 清水　茂夫
Original assignee: Ntn株式会社
Priority date: 2011-06-20
Filing date: 2012-05-21
Publication date: 2012-12-27
Also published as: JP2013003437A; JP5775374B2

Abstract

In the present invention, a defect correction device (1) corrects the defects of a fine pattern on a substrate (2) by using a correction needle (11) to remove foreign matter (3) on the substrate. In the defect correction device (1), a linear ridge portion (11d) is formed at the tip of the correction needle (11) that removes foreign matter.

Description

Defect correction apparatus and defect correction method

The present invention relates to a defect correction apparatus and a defect correction method, and more specifically, a defect correction apparatus that corrects a fine pattern defect on a substrate by removing foreign matter on the substrate using a correction needle and The present invention relates to a defect correction method.

A substrate used for a flat panel display is manufactured by laminating a pattern or a thin film on a substrate such as glass or resin. 23 and 24, for example, a color filter substrate 200 used in a flat panel display is manufactured by laminating a colored layer 200b and a protective layer 200c on a glass substrate 200a.

In the production of the color filter substrate 200, in the thin film of the colored layer 200b and the protective layer 200c, a mass contained in a liquid material such as a resist, which is a material for forming the colored layer 200b and the protective layer 200c, or in the air In some cases, dust or the like is mixed in as the foreign object 300. It is difficult to remove the foreign material 300 mixed in the thin film by a method such as cleaning or air blowing, and the foreign material 300 is removed by a method such as laser irradiation or polishing. Further, as another method for removing the foreign material 300, a method for removing the foreign material 300 by operating a correction needle has been proposed (for example, Japanese Patent Laid-Open No. 2002-131527 (Patent Document 1), Japanese Patent Laid-Open No. 2008-2008). No. 261995 (patent document 2), JP 2009-272484 A (patent document 3), JP 2010-152078 (patent document 4) and JP 2005-107318 (patent document 5)).

JP 2002-131527 A JP 2008-261995 A JP 2009-272484 A JP 2010-152078 A JP 2005-107318 A

Referring to FIGS. 25 to 27, the methods proposed in Patent Documents 1 to 5 have a conical shape as a correction needle for removing foreign matter 300, and a flat surface or a spherical surface at the tip. The formed correction needle 110 is used. The radii of the flat surface and the spherical surface formed at the tip of the correction needle 110 are several μm to several tens of μm. In the removal of the foreign matter 300 by the correction needle 110, an external force is applied to the colored layer 200b and the protective layer 200c formed on the glass substrate 200a or the glass substrate 200a by the contact of the correction needle 110, and the color filter substrate 200 is damaged. There is a problem of receiving.

If the foreign object 300 is small, the foreign object 300 can be easily removed by operating the correction needle 110. Specifically, if the foreign material 300 is several μm in size, for example, the radius of the flat surface of the tip of the correction needle 110 is 2 μm, and the angle formed by the correction needle 110 and the color filter substrate 200 is 10 degrees. By operating 110, the foreign material 300 can be easily removed. However, when the foreign material 300 is large, for example, when the size is several tens of μm to several hundreds of μm, it is necessary to repeatedly operate the correction needle 110 to remove the foreign material 300, and the color filter substrate 200 receives this. Damage is even greater.

On the other hand, referring to FIG. 28 to FIG. 30, according to the correction needle 110 whose radius of the flat surface of the tip portion is several tens μm to several hundreds μm, the number of times of repeatedly operating the correction needle 110 is reduced. Can do. However, the correction needle 110 and the color filter substrate 200 are in point contact. For this reason, the pressure applied to the color filter substrate 200 due to the contact of the correction needle 110 cannot be reduced, and damage to the color filter substrate 200 cannot be effectively suppressed.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a defect correction apparatus and a defect correction method capable of suppressing damage to a substrate due to contact with a correction needle.

The defect correction apparatus according to the present invention is a defect correction apparatus that corrects a fine pattern defect on a substrate by removing foreign matter on the substrate using a correction needle. A straight ridge line portion is formed at the tip of the correction needle of the defect correction apparatus.

In the defect correction apparatus according to the present invention, a straight ridge line portion is formed at the tip of the correction needle. Therefore, the correction needle can be in line contact with the substrate at the ridge line portion. Therefore, according to the defect correction apparatus according to the present invention, the load on the substrate due to the contact of the correction needle is reduced compared to the case where the correction needle and the substrate are in point contact, and the damage to the substrate due to the contact of the correction needle is suppressed. can do.

In the above defect correction apparatus, the ridge line portion is constituted by a line of intersection between the first flat surface formed on the correction needle and the second flat surface that intersects the first flat surface and faces the substrate. May be. Thereby, an ridgeline part can be easily formed by providing arbitrary two flat surfaces which cross | intersect in a correction needle | hook. In the defect correction apparatus, the angle formed by the intersection of the first flat surface and the second flat surface may be an acute angle.

In the defect correcting apparatus, the correction needle is the second flat surface viewed from the first flat surface so that the contact state between the tip of the correction needle and the foreign substance can be observed from above the correction needle. A third flat surface may be further formed on the opposite side. Accordingly, the foreign matter can be removed by the correction needle while observing the contact state between the tip of the correction needle and the foreign matter.

The above defect correction apparatus may include a plurality of correction needles. Thereby, the said defect correction apparatus can be provided with several correction needles from which the shape of a front-end | tip part differs. As a result, the correction work can be made efficient.

The above-described defect correction apparatus may further include a holding member that holds the correction needle so that the distance from the substrate can be changed. Accordingly, when the correction needle and the substrate come into contact with each other, the correction needle moves in a direction in which the external force applied to the correction needle is reduced. As a result, damage to the substrate due to contact with the correction needle is suppressed.

In the above defect correction apparatus, the holding member may include an elastic member that can be deformed by an external force to be applied to the correction needle. Thereby, when the correction needle and the substrate come into contact with each other, the elastic member is deformed by an external force applied to the correction needle, that is, a drag force from the substrate, and the force that the substrate receives from the correction needle is alleviated. As a result, damage to the substrate due to contact with the correction needle is suppressed.

In the above defect correction apparatus, the holding member may further include a base member connected to the correction needle and a support member that supports the base member. The base member may include a first magnetic member for generating a magnetic force between the base member and the support member. The support member may include a second magnetic member for generating a magnetic force between the support member and the base member. Thereby, the support member can support the base member by magnetic force. When the correction needle and the substrate come into contact with each other, a minute gap is formed between the base member and the support member by an external force applied to the correction needle, or the base member slides with respect to the support member. By doing so, the force which a board | substrate receives from a correction needle | hook is relieve | moderated. As a result, damage to the substrate due to contact with the correction needle is suppressed.

In the above defect correction apparatus, the holding member may be capable of arbitrarily changing the angle formed by the surface of the substrate and the longitudinal direction of the correction needle by holding the correction needle in a rotatable manner. Thereby, the angle at which the correction needle is brought into contact with the substrate can be selected so as to be suitable for removing foreign substances.

The defect correcting apparatus may further include a detection member that detects contact between the correction needle and the substrate. Thereby, the contact between the correction needle and the substrate can be confirmed.

The above defect correction apparatus may further include a recovery member that recovers the foreign matter removed by the correction needle. Thereby, the removal of the foreign matter can be completed without leaving the foreign matter removed by the correction needle on the substrate.

The defect correction method according to the present invention is a defect correction method for correcting a fine pattern defect on a substrate by removing foreign matter on the substrate using a correction needle. In the defect correction method, the linear ridge line portion formed at the tip of the correction needle is brought into contact with the substrate to remove foreign matters.

In the defect correcting method according to the present invention, the foreign matter is removed while bringing the linear ridge line portion formed at the tip of the correction needle into contact with the substrate. Therefore, the foreign matter can be removed while the correction needle is in line contact with the substrate. Therefore, according to the defect correction method according to the present invention, the load on the substrate due to the contact of the correction needle is reduced, and damage to the substrate due to the contact of the correction needle can be suppressed.

The defect correcting method described above may include a step of heating a local area including the foreign matter on the substrate before the correction needle is brought into contact with the substrate to remove the foreign matter. Thereby, since the adhesion between the substrate and the foreign matter is weakened, the foreign matter can be easily removed.

As is apparent from the above description, according to the defect correcting apparatus and the defect correcting method of the present invention, it is possible to suppress damage to the substrate due to contact with the correction needle.

It is a schematic perspective view which shows the structure of the defect correction apparatus which concerns on Embodiment 1. FIG. It is the schematic which shows the structure of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 1 was equipped. It is the schematic which shows the modification of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 1 was equipped. It is the schematic which shows the modification of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 1 was equipped. It is the schematic which shows the modification of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 1 was equipped. It is the schematic which shows the modification of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 1 was equipped. It is the schematic for demonstrating the removal method of the foreign material using the correction needle | hook concerning Embodiment 1. FIG. It is the schematic for demonstrating the removal method of the foreign material using the correction needle | hook concerning Embodiment 1. FIG. FIG. 9 is a schematic end view showing the structure of the correction needle according to Embodiment 1 as viewed from the direction indicated by arrow A in FIG. 8. FIG. 6 is a schematic diagram illustrating a structure of a modification of the correction needle according to the first embodiment. FIG. 6 is a schematic diagram illustrating a structure of a modification of the correction needle according to the first embodiment. It is the schematic which shows the structure of the modification of the correction needle | hook which concerns on Embodiment 1 seen from the direction shown by the arrow B in FIG. It is the schematic which shows the structure of the foreign material collection | recovery apparatus which concerns on Embodiment 1. FIG. It is the schematic which shows the other structure of the foreign material collection | recovery apparatus which concerns on Embodiment 1. FIG. It is the schematic which shows the other structure of the foreign material collection | recovery apparatus which concerns on Embodiment 1. FIG. It is the schematic which shows the other structure of the foreign material collection | recovery apparatus which concerns on Embodiment 1. FIG. It is the schematic which shows the aspect which confirms the displacement of the correction needle | hook which concerns on Embodiment 1 with a laser displacement meter. It is the schematic which shows the aspect which heat-processes the foreign material contained in a board | substrate with the baking apparatus with which the defect correction apparatus which concerns on Embodiment 1 was equipped. It is the schematic which shows the aspect which observes the correction needle | hook contained in the foreign material removal apparatus which concerns on Embodiment 1 with an oblique observation optical system. It is the schematic which shows the structure of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 2 was equipped. It is the schematic which shows the structure of the foreign material removal apparatus with which the defect correction apparatus which concerns on Embodiment 2 seen from the direction shown by the arrow C in FIG. 6 is a schematic diagram for explaining a foreign matter collecting method by the foreign matter removing apparatus according to Embodiment 2. FIG. It is the schematic which shows the structure of the color filter board | substrate in a prior art, and the foreign material contained in the said color filter board | substrate. It is the schematic which shows the structure of the color filter board | substrate in a prior art, and the foreign material contained in the said color filter board | substrate. It is the schematic for demonstrating the removal method of the foreign material using the correction needle | hook in a prior art. It is the schematic for demonstrating the removal method of the foreign material using the correction needle | hook in a prior art. FIG. 27 is a schematic end view showing the structure of a correction needle in the prior art viewed from the direction of arrow D in FIG. 26. It is the schematic which shows the structure of the other correction needle | hook in a prior art. It is the schematic which shows the structure of the other correction needle | hook in a prior art. FIG. 30 is a schematic end view showing the structure of another correction needle in the prior art viewed from the direction of arrow E in FIG. 29.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

(Embodiment 1)
Embodiment 1 of the present invention will be described below. First, the configuration of the defect correction apparatus 1 according to the first embodiment will be described with reference to FIG. The defect correction apparatus 1 according to Embodiment 1 is a defect correction apparatus that corrects a fine pattern defect on a substrate by removing foreign matter on the substrate using a correction needle. The defect correcting apparatus 1 includes a chuck 30A, an XY stage 30B, an observation optical system 40, an image processing unit 50, a monitor 51, a foreign substance removing device 10, a coating device 60, a Z stage 70, and a laser unit 80. And a control computer 90A and a host computer 90B.

The chuck 30A holds the substrate 2 including the foreign matter to be removed. The XY stage 30B holds the chuck 30A holding the substrate 2 so as to be movable in the XY plane in FIG. The observation optical system 40 is disposed at a position where the substrate 2 can be observed from above. The monitor 51 displays an image of the substrate 2 observed by the observation optical system 40. The image processing unit 50 recognizes a defect in the substrate 2.

The foreign matter removing device 10 removes foreign matter contained in the substrate 2 with a correction needle contained in the foreign matter removing device 10. Further, the defect correcting apparatus 1 includes a detection member that detects contact between the correction needle and the substrate 2, a foreign material recovery device as a recovery member that recovers the foreign material removed by the correction needle, and a heating process for the substrate 2. And a heating device. The detection member, the foreign material recovery device, and the heating device will be described later.

The laser unit 80 shapes the portion of the substrate 2 from which foreign matter has been removed by irradiating laser light after the foreign matter has been removed by the correction needle. After the foreign matter is removed by the correction needle, the coating device 60 applies an appropriate repair agent to the substrate 2 to correct the portion where the thin film or pattern is peeled off.

The Z stage 70 holds the observation optical system 40, the coating device 60, and the laser unit 80 so as to be movable in the Z-axis direction in FIG. The control computer 90 </ b> A controls the operation of the defect correction apparatus 1. The host computer 90B controls the entire defect correction apparatus 1.

Next, the configuration of the foreign matter removing apparatus 10 will be described. Referring to FIG. 2, the foreign matter removing apparatus 10 includes a correction needle 11 for removing foreign matter, a correction needle holder 12 as a holding member for holding the correction needle 11, a Z table 13, a slider 15, and an XYZ stage 16. And a Z table displacement meter 13b as a detection member. The correction needle holder 12 fixes the correction needle 11. The correction needle holder 12 is fixed to the Z table 13. The Z table 13 is held so as to be movable along a slider shaft portion 15 a formed on the slider 15. The Z table 13 is in contact with a stopper 15b formed at the lower end of the slider shaft 15a due to its own weight. The slider 15 is fixed to the XYZ stage 16. The XYZ stage 16 may be movable in the Z-axis direction in FIG. 1 and may be movable in the XY plane in FIG.

The correction needle 11 is held by a correction needle holder 12 as a holding member, a Z table 13 and a slider 15 so that the distance from the substrate 2 can be changed. Specifically, the Z table 13 is movable in the Z-axis direction in FIG. 1 along the slider shaft portion 15a. Therefore, when the correction needle 11 and the substrate 2 come into contact with each other, the Z table 13 can move in a direction to retract from the substrate 2 by an external force applied to the correction needle 11. Thereby, the force applied to the substrate 2 by the correction needle 11 is alleviated, and damage to the substrate 2 due to the contact of the correction needle 11 can be suppressed. The movement of the Z table 13 along the slider shaft portion 15a is detected by the Z table displacement meter 13b. Thereby, it is possible to grasp the contact between the correction needle 11 and the substrate 2 and the pushing amount of the correction needle 11 into the substrate 2.

Referring to FIG. 3, the XYZ stage 16 may include an XYZ stage displacement meter 16a for detecting the movement of the XYZ stage 16 in the Z-axis direction in FIG. Thereby, by monitoring the output from the XYZ stage displacement meter 16a, the contact between the correction needle 11 and the substrate 2 and the pushing amount of the correction needle 11 to the substrate 2 can be grasped. As a result, damage to the substrate 2 due to contact of the correction needle 11 can be suppressed.

Referring to FIG. 4, in foreign matter removing apparatus 10, first needle magnet 12 for generating a magnetic force between correction needle holder 12 as a base member connected to correction needle 11 and Z table 13 as a support member. The member 12a may be included. Further, the Z table 13 may include a second magnetic member 13 a for generating a magnetic force with the correction needle holder 12.

The correction needle holder 12 can be attached to and detached from the Z table 13 from above by a magnetic force generated between the first magnetic member 12a and the second magnetic member 13a. For this reason, when the correction needle 11 and the substrate 2 come into contact with each other, a minute gap is formed between the correction needle holder 12 and the Z table 13 due to an external force applied to the correction needle 11, or the correction needle holder 12 is moved to the Z position. Slide slightly against the table 13. Thereby, the force which the correction needle | hook 11 loads to the board | substrate 2 is relieve | moderated, and the damage of the board | substrate 2 can be suppressed.

Referring to FIG. 5, the foreign substance removing device 10 may include an elastic member 18 that can be deformed by an external force to be applied to the correction needle 11 as a holding member. Specifically, in the foreign matter removing apparatus 10, the slider 15 and the Z table 13 may be omitted, and a fixing base 17 for fixing the correction needle holder 12 and an elastic member 18 may be included. The elastic member 18 may be, for example, a leaf spring or a rubber member.

The elastic member 18 bends due to an external force applied to the correction needle 11 when the correction needle 11 and the substrate come into contact with each other, and relaxes the force applied to the substrate by the correction needle 11. Thereby, the damage of the board | substrate by the contact of the correction needle | hook 11 can be suppressed. In FIG. 5, the foreign matter removing apparatus 10 in which the slider 15 and the Z table 13 are omitted has been described. However, even if the elastic member 18 is included in the Z table 13 of the foreign matter removing apparatus 10 shown in FIGS. 2 and 4. Good.

With reference to FIG. 6, the holding member included in the foreign substance removing apparatus 10 can arbitrarily change the angle formed between the surface of the substrate and the longitudinal direction of the correction needle 11 by holding the correction needle 11 rotatably. It is good. Specifically, the foreign matter removing apparatus 10 includes a rotating member 19 that is fixed to the Z table 13 at a support point 19a and holds the correction needle 11 so as to be rotatable in the R direction in the figure around the support point 19a. Also good. Thereby, the angle which makes the correction needle | hook 11 contact a board | substrate can be selected so that it may be suitable for removal of a foreign material.

Next, the structure of the correction needle 11 included in the foreign matter removing apparatus 10 will be described with reference to FIGS. 7 to 9, the correction needle 11 according to the first embodiment intersects the first flat surface 11a perpendicular to the longitudinal direction of the correction needle 11, the first flat surface 11a, and the substrate 2 And a third flat surface formed on the opposite side of the second flat surface 11b when viewed from the first flat surface 11a. The first flat surface 11a may have a rectangular shape, but may have another polygonal shape.

A straight ridge portion 11 d is formed at the tip of the correction needle 11. More specifically, the ridge line portion 11d is formed by a first flat surface 11a that is a tip surface of the correction needle 11 and a second flat surface 11b that intersects the first flat surface 11a and faces the substrate 2. It consists of intersection lines. In this manner, the ridge line portion 11d can be easily formed by providing the correction needle 11 with any two flat surfaces (here, the first flat surface 11a and the second flat surface 11b) that intersect each other. . The state where two flat surfaces intersect each other means a state where two flat surfaces are adjacent so as to share one line segment.

As described above, a straight ridge line portion 11 d is formed at the tip of the correction needle 11. Therefore, the correction needle 11 can be in line contact with the substrate 2 by the ridge line portion 11d. Therefore, the area where the correction needle 11 and the substrate 2 are in contact with each other is wider than when the correction needle 11 is in point contact with the substrate 2. Thereby, the load to the board | substrate 2 by the contact of the correction needle | hook 11 is reduced, and damage to the board | substrate 2 can be suppressed. The region where the correction needle 11 and the substrate 2 are in contact with each other is determined by the length of the ridge line portion 11d. The length of the ridge line portion 11d may be several μm to several tens of μm, for example. When the purpose is to remove large foreign matters, it may be several hundred μm to several mm.

In the correction needle 11, the third flat surface 11 c may be formed so that the contact state between the tip of the correction needle 11 and the foreign material 3 can be observed from above the correction needle 11. Specifically, the correction needle 11 may have a tapered shape (conical shape) that becomes narrower toward the tip. As a result, the shade of the first flat surface 11a viewed from above the substrate 2 is reduced. Therefore, the foreign matter 3 can be removed by the correction needle 11 while observing the contact state between the tip of the correction needle 11 and the foreign matter 3 from above the correction needle 11.

Further, in the correction needle 11, the angle formed by the intersection of the first flat surface 11a and the second flat surface 11b may be an acute angle. Specifically, with reference to FIGS. 10 to 12, the correction needle 11 may have a flea-like shape. That is, the tip of the correction needle 11 may have a quadrangular prism shape or a quadrangular pyramid shape that becomes thinner toward the tip, and the first flat surface 11a may be formed at the tip. The correction needle 11 having a flea shape can be more easily produced than the correction needle 11 having the taper shape. Further, when the flea shape is adopted as the correction needle 11, the thickness of the correction needle 11 is increased as compared with the case where the taper shape as shown in FIGS. 7 to 9 is adopted, so that the strength of the correction needle 11 is improved. be able to.

Next, the foreign material recovery apparatus will be described with reference to FIGS. As the foreign material collecting device, a stylus type foreign material collecting device 22, a roller type foreign material collecting device 23, a tape type foreign material collecting device 24, or the like can be adopted. Referring to FIG. 13, the stylus-type foreign material recovery device 22 has basically the same configuration as that of the foreign material removal device 10, but instead of the correction needle 11 and the correction needle holder 12, The configuration of the foreign matter removing apparatus 10 is different in that it includes an adhesive member 22a and a rod-like adhesive member holder 22b. The rod-like adhesive member 22a may be made of, for example, silicon, but is not limited thereto.

According to the stylus-type foreign matter collecting apparatus 22, the foreign matter peeled off from the substrate by the correction needle and remaining on the substrate is collected by adhering to the stick-like adhesive member 22a using the stickiness of the stick-like adhesive member 22a. Can do. In addition, the said foreign material adhering to the rod-shaped adhesive member 22a is transcribe | transferred to the other adhesive member (not shown) which has stronger adhesiveness than the rod-shaped adhesive member 22a. Moreover, the foreign material adhering to the rod-shaped adhesive member 22a may be removed by suction or air blow, or by using these together.

Referring to FIGS. 14 and 15, roller type foreign material recovery apparatus 23 includes a support portion 23 a, a roller shaft portion 23 b, and a roller-like adhesive member 23 c that is rotatably held around the roller shaft portion 23 b. It is out. According to the roller-type foreign material recovery device 23, the foreign material can be recovered by rotating the roller-like adhesive member 23c around the roller shaft 23b on the surface of the substrate and attaching the foreign material to the roller-like adhesive member 23c. it can. The foreign matter adhered to the roller-like adhesive member 23c is removed in the same manner as the stylus-type foreign matter collecting device 22 when the roller-like adhesive member 23c makes one rotation or when an arbitrary time has elapsed. .

Referring to FIG. 16, the tape-type foreign matter collecting device 24 includes a supply reel 24b, a take-up reel 24c, a tape-like adhesive member 24a wound around the supply reel 24b and the take-up reel 24c, and a press. Member 24d. According to the tape-type foreign matter collecting device 24, the pressing member 24d makes the tape-like adhesive member 24a contact the foreign matter to be collected, and the foreign matter is attached to the tape-like adhesive member 24a supplied from the supply reel 24b. The foreign matter can be collected. The tape-like adhesive member 24a to which the foreign matter is adhered is wound and collected by the take-up reel 24c.

Next, the operation of the defect correction apparatus 1 according to the first embodiment will be described. With reference to FIG. 1, first, a substrate 2 containing foreign matter to be removed is carried into a defect correction apparatus 1. Next, the substrate 2 is placed on the chuck 30A. The substrate 2 is fixed on the chuck 30A by, for example, vacuum suction.

Next, the XY stage 30B is operated based on the information on the occurrence position of the foreign matter acquired in advance, and the substrate 2 is moved to a position where the foreign matter can be observed by the observation optical system 40. Further, the Z stage 70 is operated to focus the observation optical system 40 on the substrate 2.

Referring to FIG. 2, next, the XYZ stage 16 is operated to position the correction needle 11 above the foreign matter. Next, the XYZ stage 16 is operated to move the correction needle 11 closer to the substrate while checking the image displayed on the monitor.

Referring to FIG. 3, the displacement of the XYZ stage 16 may be confirmed by an XYZ stage displacement meter 16a. Referring to FIG. 17, the displacement of the correction needle 11 is confirmed by irradiating the correction needle 11 with a laser beam indicated by a broken line 20a in the drawing by a laser displacement meter 20 provided in the defect correction apparatus 1. Also good.

Next, after the correction needle 11 contacts or approaches the substrate 2, the operation of the XYZ stage 16 is stopped. Thereafter, the correction needle 11 may be further moved closer to the substrate 2 or retracted from the substrate 2 to adjust the pushing amount of the correction needle 11. The contact load due to the correction needle 11 is adjusted in consideration of the strength of the thin film and pattern formed on the substrate 2 and is set to, for example, about a dozen g.

In addition, when the correction needle 11 comes into contact with the substrate 2, the slider 15 can effectively function to avoid damage to the substrate 2. That is, as described above, the Z table 13 is moved along the slider shaft portion 15a in the direction of retreating from the substrate 2, so that the damage to the substrate 2 is suppressed.

7 to 12, next, the foreign matter 3 is removed by operating the correction needle 11. The operation of the correction needle 11 is performed while bringing the linear ridge line portion 11d formed at the tip of the correction needle 11 into contact with the substrate 2, and is repeated until the foreign matter 3 is completely removed.

Further, before the correction needle 11 is brought into contact with the substrate 2 and the foreign matter 3 is removed, a step of heating a local range including the foreign matter 3 on the substrate 2 may be performed. Specifically, referring to FIG. 18, light indicated by a broken line 21 a in the drawing may be irradiated near the foreign material 3 by the heating device 21. As the heating device 21, a semiconductor laser, a halogen lamp, a device for discharging heat air, or the like can be used. The semiconductor laser can be irradiated through an observation optical system. The heating temperature is adjusted according to the material used for the substrate 2 and is set to, for example, several tens to several hundreds of degrees Celsius. Thereby, even when the foreign matter 3 cannot be completely removed by the operation of the correction needle 11, the sticking between the substrate 2 and the foreign matter 3 is weakened by the above heat treatment, and therefore the foreign matter 3 can be easily removed. it can.

Referring to FIG. 1, a solvent may be applied using a coating device 60 in order to weaken the adhesion between the foreign matter and the substrate 2. As the solvent, for example, a main solvent contained in a liquid material that forms a thin film or a pattern, a solvent that softens foreign matter, or the like is used. By applying a solvent in the vicinity of the foreign matter by the coating device 60 and leaving it for a certain period of time, the foreign matter can be easily removed by operating the correction needle.

Referring to FIG. 19, next, the correction needle 11 is observed by the oblique observation optical system 40 </ b> A provided in the defect correction apparatus 1, and the presence or absence of foreign matter attached to the tip of the correction needle 11, or the correction needle 11. Check the condition (wear condition, damage, etc.).

Referring to FIG. 1, next, the substrate 2 is observed by the observation optical system 40, and it is confirmed whether or not the foreign matter removed by the correction needle remains on the substrate 2. If foreign matter remaining on the substrate 2 is confirmed, it is collected by a foreign matter collection device.

Next, a laser beam is irradiated by the laser unit 80 to shape the thin film and the pattern where the foreign matter has been removed. Next, an appropriate repair agent is applied to the portion where the thin film or pattern is peeled off by the coating device 60.

Referring to FIG. 19, finally, the XYZ stage 16 is operated to retract the correction needle 11 from the substrate 2. When the substrate 2 contains other foreign matter to be removed, the above steps are repeated to remove the foreign matter. After the removal of all the foreign matters to be removed included in the substrate 2 is completed, the substrate 2 is discharged from the defect correction apparatus 1 and the correction of the defect of the substrate 2 is completed.

(Embodiment 2)
Hereinafter, the defect correction apparatus according to the second embodiment will be described. The defect correction apparatus according to the second embodiment basically has the same configuration as the defect correction apparatus 1 according to the first embodiment. However, the defect correction apparatus according to the second embodiment is different from the defect correction apparatus 1 according to the first embodiment in that the foreign substance removal apparatus 10 includes a plurality of correction needles.

20 to 22, the foreign matter removing apparatus 10 includes a plurality of correction needles 11, a correction needle holder 12, a Z table 13, a slider 15, a linear motion actuator 25, and an XYZ stage 16. Each correction needle holder 12 fixes one correction needle 11. Each correction needle holder 12 is fixed to a corresponding Z table 13. Each Z table 13 is held movably along a slider shaft portion 15 a formed on the corresponding slider 15. Each slider 15 is held by a corresponding linear actuator 25 so as to be movable in the Z-axis direction in FIG. For example, an air cylinder is used as the direct acting actuator 25. Each slider 15 is fixed to one XYZ stage 16. The XYZ stage 16 may be movable in the Z-axis direction in FIG. 1, and may be movable in the XY plane in FIG.

As the plurality of correction needles 11, needles having different tip shapes may be used. Thereby, when removing foreign substances having various shapes or sizes, it is possible to appropriately select the correction needle 11 having a tip shape suitable for removing each foreign substance. As a result, the correction work can be made efficient. Moreover, it replaces with the one correction needle | hook 11 of the some correction needle | hooks 11, and the rod-shaped adhesion member 22a may be used.

Next, the operation of the defect correction apparatus according to the second embodiment will be described. First, as in the case of the first embodiment, the substrate 2 is carried in and a foreign object can be observed. Referring to FIGS. 20 and 21, next, one correction suitable for removing the foreign matter 3 from the plurality of correction needles 11 in consideration of the shape or size of the foreign matter 3 observed by the observation optical system. The needle 11 is selected. Next, the XYZ stage 16 is operated to position the selected correction needle 11 above the foreign material 3. Next, the XYZ stage 16 is operated to bring one correction needle 11 closer to the substrate 2. Next, after one correction needle 11 approaches the substrate 2, the operation of the XYZ stage 16 is stopped.

Next, the linear actuator 25 that holds one correction needle 11 is operated to bring the one correction needle 11 closer to the substrate 2. Next, after one correction needle 11 contacts or further approaches the substrate 2, the operation of the linear actuator 25 is stopped. Next, the foreign matter 3 is removed by operating one correction needle 11. As in the first embodiment, a process for weakening the adhesion between the foreign material 3 and the substrate 2 such as a heat process by the heating device 21 may be performed in advance.

Next, referring to FIG. 19, as in the first embodiment, one correcting needle 11 is observed by the oblique observation optical system 40A. Next, with reference to FIG. 1, the substrate 2 is observed by the observation optical system 40, and it is confirmed whether or not the foreign matter 3 removed by one correction needle 11 remains on the substrate 2.

Referring to FIG. 22, when the foreign matter 3 remaining on the substrate 2 is confirmed, the foreign matter 3 is collected as shown below. First, the linear actuator 25 that holds one correction needle 11 is operated to retract one correction needle 11 from the substrate 2. Next, the XYZ stage 16 is operated to position the stick-shaped adhesive member 22 a above the foreign material 3. Next, the linear actuator 25 that holds the rod-shaped adhesive member 22 a is operated to bring the rod-shaped adhesive member 22 a closer to the foreign material 3. After the foreign matter 3 is attached to the stick adhesive member 22a, the stick adhesive member 22a is retracted from the substrate 2. As described above, the collection of the foreign matter 3 is completed. In addition, when the foreign material 3 remaining on the board | substrate 2 is not confirmed, said process is abbreviate | omitted.

Thereafter, in the same manner as in the first embodiment, the thin film and the pattern are shaped by laser light irradiation, and the repair agent is applied. Referring to FIGS. 20 and 21, next, the linear actuator 25 and the XYZ stage 16 are operated to retract one correction needle 11 from the substrate 2. In the case where the substrate 2 contains foreign matters other than the foreign matter 3, the above steps are repeated in order to remove the foreign matters. After the removal of all the foreign matter to be removed included in the substrate 2 is completed, the substrate 2 is discharged from the defect correction device, and the correction of the defect of the substrate 2 is completed.

It should be considered that the embodiment disclosed this time is illustrative in all respects and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

The defect correction apparatus and the defect correction method of the present invention can be applied particularly advantageously in a defect correction apparatus and a defect correction method that are required to suppress damage to the substrate due to contact with a correction needle.

DESCRIPTION OF SYMBOLS 1 Defect correction apparatus, 2 board | substrate, 3 foreign material, 10 foreign material removal apparatus, 11 correction needle, 11a 1st flat surface, 11b 2nd flat surface, 11c 3rd flat surface, 12 correction needle holder, 12a 1st magnetism Member, 13 Z table, 13a second magnetic member, 13b Z table displacement meter, 15 slider, 15a slider shaft, 15b stopper, 16 XYZ stage, 16a XYZ stage displacement meter, 17 fixed base, 18 elastic member, 19 rotating member , 19a support point, 20 laser displacement meter, 20a, 21a broken line, 21 heating device, 22 stylus type foreign material recovery device, 22a stick adhesive member, 22b stick adhesive member holder, 23 roller type foreign material recovery device, 23a support part, 23b Roller shaft, 23c, roller-like adhesive member, 24, tape-type foreign material recovery device 24a tape-like adhesive member, 24b supply reel, 24c take-up reel, 24d pressing member, 25 linear motion actuator, 30A chuck, 30B XY stage, 40 observation optical system, 40A oblique observation optical system, 50 image processing unit, 51 monitor, 60 coating device, 70 Z stage, 80 laser unit, 90A control computer, 90B host computer.

Claims

A defect correction device (1) for correcting a defect of a fine pattern on the substrate (2) by removing foreign matter (3) on the substrate (2) using a correction needle (11),
A defect correcting device (1), wherein a straight ridge line portion (11d) is formed at the tip of the correcting needle (11).
The ridge line portion (11d) intersects the first flat surface (11a) formed on the correction needle (11) and the first flat surface (11a) and faces the substrate (2). The defect correcting device (1) according to claim 1, wherein the defect correcting device (1) is constituted by a line of intersection with two flat surfaces (11b).
The correction needle (11) has a first flat surface so that the contact state between the tip of the correction needle (11) and the foreign object (3) can be observed from above the correction needle (11). The defect correction apparatus (1) according to claim 2, wherein a third flat surface (11c) is further formed on the side opposite to the second flat surface (11b) when viewed from the surface (11a).
The defect correction device (1) according to claim 1, comprising a plurality of said correction needles (11).
The defect correction according to claim 1, further comprising a holding member (12, 13, 15, 16, 17, 18, 19) that holds the correction needle (11) so that the distance from the substrate (2) can be changed. Device (1).
The said holding member (12, 13, 15, 16, 17, 18, 19) includes an elastic member (18) that can be deformed by an external force to be applied to the correction needle (11). Defect correction device.
The holding member (12, 13, 15, 16, 17, 18, 19)
A base member (12) coupled to the correction needle (11);
A support member (13) for supporting the base member (12);
The base member (12) includes a first magnetic member (12a) for generating a magnetic force with the support member (13),
The defect correction apparatus (1) according to claim 5, wherein the support member (13) includes a second magnetic member (13a) for generating a magnetic force between the support member (13) and the base member (12).
The holding member (12, 13, 15, 16, 17, 18, 19) holds the correction needle (11) in a rotatable manner, whereby the surface of the substrate (2) and the correction needle (11). The defect correction apparatus (1) according to claim 7, wherein an angle formed by the longitudinal direction of the defect correction apparatus can be arbitrarily changed.
The defect correction device (1) according to claim 1, further comprising a detection member (13b) for detecting contact between the correction needle (11) and the substrate (2).
The defect correction device (1) according to claim 1, further comprising a recovery member (22, 23, 24) for recovering the foreign matter (3) removed by the correction needle (11).
A defect correction method for correcting a defect in a fine pattern on the substrate (2) by removing foreign matter (3) on the substrate (2) using a correction needle (11),
The defect correction method of removing the said foreign material (3) by making the linear ridgeline part (11d) formed in the front-end | tip part of the said correction needle | hook (11) contact the said board | substrate (2).
Before the correction needle (11) is brought into contact with the substrate (2) to remove the foreign matter (3), the method includes a step of heating a local area including the foreign matter (3) of the substrate (2). The defect correction method according to claim 11.