WO2012173287A1 - Pla 수지를 이용한 칩 인레이드 바닥재 - Google Patents
Pla 수지를 이용한 칩 인레이드 바닥재 Download PDFInfo
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- WO2012173287A1 WO2012173287A1 PCT/KR2011/004316 KR2011004316W WO2012173287A1 WO 2012173287 A1 WO2012173287 A1 WO 2012173287A1 KR 2011004316 W KR2011004316 W KR 2011004316W WO 2012173287 A1 WO2012173287 A1 WO 2012173287A1
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/12—Flooring or floor layers made of masses in situ, e.g. seamless magnesite floors, terrazzo gypsum floors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/105—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of organic plastics with or without reinforcements or filling materials
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2471/00—Floor coverings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/2481—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including layer of mechanically interengaged strands, strand-portions or strand-like strips
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/24868—Translucent outer layer
- Y10T428/24876—Intermediate layer contains particulate material [e.g., pigment, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
Definitions
- Embodiments of the present invention relate to chip inlay de flooring using PLA resin.
- Floor materials used in buildings such as houses, apartments, apartments, offices or stores are mainly used for flooring based on petroleum resin such as polyvinyl chloride (PVC).
- PVC polyvinyl chloride
- the flooring material using said polyvinyl chloride etc. is manufactured by extrusion or a calendering method etc. using resin, such as polyvinyl chloride (PVC).
- resin such as polyvinyl chloride (PVC).
- PVC polyvinyl chloride
- the raw material of polyvinyl chloride resin is based on petroleum resources, there may be a big problem in the supply and demand of raw materials in the future due to exhaustion of petroleum resources.
- PVC polyvinyl chloride
- An embodiment of the present invention provides a chip inlay de flooring using a PLA resin that can implement an eco-friendly flooring by forming a chip inlay layer using a PLA resin in the chip inlay de flooring.
- One embodiment of the present invention provides a chip inlay de flooring using PLA resin that can ensure the dimensional stability of the heating through the dimensional stability layer of the glass fiber impregnated structure.
- One embodiment of the present invention provides a chip inlay de flooring material using a PLA resin that can give a natural feeling that was difficult to implement conventionally by adding wood powder, chaff, rosin, etc. to the chip inlay layer and / or the base layer.
- One embodiment of the present invention provides a chip inlay de flooring material using a PLA resin that can secure a fast mounting during construction through a woven fabric layer formed on the back surface of the chip inlay deucheung.
- Chip inlaid flooring using a PLA resin includes a chip inlaid (Chip Inlaid) layer, a dimensionally stable layer, and a base layer from above, at least one of the chip inlaid layer or the base layer
- the binder includes a polylactic acid (PLA) resin.
- Chip inlay de flooring material using a PLA resin includes a chip inlay deucheung layer and a base layer from above, at least one of the chip inlay deucheung layer or the base layer comprises a PLA resin as a binder.
- Chip inlay de flooring using PLA resin includes a chip inlay deucheung layer and a woven fabric layer from above, the chip inlaid layer comprises PLA resin as a binder.
- the chip inlay de flooring in configuring the chip inlay de flooring, it is possible to implement an eco-friendly flooring by forming a chip inlay deucheung using PLA resin.
- the present invention through the dimensional stability layer of the glass fiber impregnated structure it can ensure the dimensional stability of the heating.
- wood powder, rice hulls, rosin, etc. may be added to the chip inlaid layer and / or the base layer to give a natural feeling that was difficult to implement in the past.
- FIG. 1 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 2 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 3 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 4 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 5 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 6 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 7 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- FIG. 8 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- FIG. 10 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- FIG. 11 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- FIG. 12 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Figure 13 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- Polylactic acid (PLA) resin is a thermoplastic polyester of lactide or lactic acid, and may be prepared by polymerizing lactic acid produced by fermenting starch extracted from renewable plant resources such as corn and potato. These PLA resins have significantly less emissions of environmentally harmful substances such as CO 2 during use or disposal than petroleum-based materials such as polyvinyl chloride (PVC), and are environmentally friendly.
- PVC polyvinyl chloride
- PLA resin as described above can be generally divided into D-PLA, L-PLA, D, L-PLA or meso-PLA, etc.
- PLA resin applied to an embodiment of the present invention is limited to the type of PLA resin
- various PLA resins can be produced singly or by mixing two or more kinds.
- the PLA resin may be prepared by polymerizing lactic acid or lactide, and if necessary, glycol compounds such as ethylene glycol or propylene glycol, dicarboxylic acids such as ethanedioic acid or terephthalic acid. Hydroxycarboxylic acids such as glycolic acid or 2-hydroxybenzoic acid; Alternatively, suitable copolymerization components such as lactones such as caprolactone or propiolactone may be further copolymerized.
- glycol compounds such as ethylene glycol or propylene glycol
- dicarboxylic acids such as ethanedioic acid or terephthalic acid.
- Hydroxycarboxylic acids such as glycolic acid or 2-hydroxybenzoic acid
- suitable copolymerization components such as lactones such as caprolactone or propiolactone may be further copolymerized.
- PLA resin may be divided into crystalline PLA (c-PLA) resin and amorphous PLA (a-PLA) resin.
- c-PLA crystalline PLA
- a-PLA amorphous PLA
- the PLA resin is most preferably 100% amorphous PLA resin, and if necessary, PLA resin in which crystalline and amorphous coexist.
- Non-phthalate-based plasticizers soften PLA resin to increase thermoplasticity, thereby facilitating molding at high temperatures, and may be ATBC (Acetyl tributyl citrate).
- the non-phthalate plasticizer when added to less than the reference value relative to 100 parts by weight of the PLA resin, the hardness of the PLA resin may be increased, the workability may be lowered, and if the amount of the non-phthalate plasticizer is added in each layer exceeds the predetermined range, Physical properties such as workability may be deteriorated due to a decrease in compatibility with other components forming each layer.
- the acrylic copolymer used as a processing aid serves to secure workability by reinforcing the strength of the PLA resin which is not good in melt strength or heat resistance during melt extrusion.
- the acrylic copolymer could be usefully applied to the calendering, press processing, etc. of the PLA resin.
- the content of the acrylic copolymer is less than the reference value based on 100 parts by weight of the PLA resin, the improvement of the melting efficiency and the melt strength of the PLA resin is insufficient, and the production of each layer constituting the flooring material when the content of the acrylic copolymer exceeds the reference value
- the cost increases and the overall physical properties of each layer may be lowered due to compatibility problems with other materials constituting each layer.
- the weight average molecular weight (Mw) of the acrylic copolymer is not particularly limited, but considering the improvement in melt strength and the like and compatibility with other materials during processing, it is preferable to use 800,000 to 6 million.
- the PLA resin may further include a lubricant to prevent accumulation of deposits or crosslinked materials in melt extrusion.
- higher fatty acids corresponding to environmentally friendly lubricants are used.
- stearic acid or higher fatty acids which are saturated higher fatty acids having 18 carbon atoms, are used alone or in combination thereof. It can mix and use species or more.
- the amount of lubricant is less than the standard value based on 100 parts by weight of PLA resin, the lubricant may not be effective. If the amount of lubricant is more than the standard value based on 100 parts by weight of PLA resin, the impact resistance, heat resistance, and glossiness of the PLA resin may be reduced. There is a problem that can be degraded.
- an anti-hydrolysis agent may be additionally added to the PLA resin.
- the hydrolysis agent can be used without limitation so long as it is usually used as a hydrolysis agent such as carbodiimide and oxazoline.
- the hydrolysis agent exceeds the standard value based on 100 parts by weight of the PLA resin, the moldability may be reduced.
- a printed layer may be added above the chip inlaid layer, and an intermediate layer having the same composition as the base layer may be inserted under the chip inlaid layer.
- each of the base layer and the chip inlay deucheung layer may be composed of two or more layers, the woven fabric layer can be inserted at the bottom.
- the surface treatment layer may be basically formed on the uppermost part, and the surface treatment layer may not be formed as an option as shown in the drawing.
- the surface treatment layer may be formed for the purpose of improving surface quality such as scratch resistance or abrasion resistance of the flooring material, and improving cleaning resistance to facilitate cleaning.
- Such a surface treatment layer may be formed by applying a general UV curable composition, such as, for example, a urethane acrylate-based UV curable composition on the wood chip layer 200, 201, 202, 204, 205, and curing by UV irradiation, and applying a thermosetting wax. And it may be formed by passing through a hot air oven to cure and can be formed in various ways.
- the resin that can be used may be selected from polyurethane, urethane acrylate or wax.
- the surface treatment layer preferably has a thickness of 0.001 ⁇ 0.1 mm.
- the surface treatment layer is formed to a thickness of less than 0.001 mm, it is difficult to expect an effect of improving physical properties such as scratch resistance, and when the surface treatment layer is formed to a thickness of more than 0.1 mm, an excessive manufacturing cost is required to form the surface treatment layer, and flooring material. Can reduce the appearance quality.
- FIG. 1 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 100 using the PLA resin is a chip inlaid layer 110, a dimension stabilization layer 120, and a base layer from above. 130.
- each layer may be formed of a plurality of layers, and although not shown in the drawings, an intermediate layer may be configured between the chip inlaid layer 110 and the dimensionally stable layer 120.
- the intermediate layer may have the same composition as the base layer 130.
- the chip inlay deucheung 110 has the form of a chip having a natural marble appearance.
- the chip inlaid layer 110 may be formed in various forms.
- the chip inlaid layer 110 may be formed of a PLA resin layer including separate chips such as chips or fragrance chips made of PLA resin.
- the chip inlay deucheung layer 110 is not formed of a separate chip, but formed of a PLA resin layer, assuming that the wood powder and the like chip, when viewed from the surface of the flooring may be a form that looks like a chip embedded.
- the chip inlay deucheung 110 may be a form that is arranged on a separate PLA resin layer by pulverizing after producing a sheet from the PLA resin.
- the chip refers to a product obtained by blending a pigment and the like with PLA, and then crushing the rolled sheet to about 0.5 to 20 mm using a grinder.
- the chip inlaid layer 110 includes a polylactic acid (PLA) resin as a binder.
- the chip inlay deucheung 110 may further include at least one of an acetyl tributyl citrate (ATBC) as a non-phthalate plasticizer, an acrylic copolymer and an anti-hydrolysis agent as a processing aid in the PLA resin. .
- ATBC acetyl tributyl citrate
- the chip inlay deucheung layer 110 is based on 100 parts by weight of the PLA resin, 5 to 100 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, at least one of stearic acid and higher fatty acids as a lubricant 0.01 ⁇ 10 parts by weight, acrylic resin 0.01 ⁇ 10 parts by weight, 10 parts by weight or less of the hydrolysis agent, at least 200 parts by weight of wood flour and chaff, 500 parts by weight or less of calcium carbonate (CaCO 3 ), titanium dioxide (TiO 2 ) And at least 50 parts by weight and at most 20 parts by weight of rosin.
- CaCO 3 calcium carbonate
- TiO 2 titanium dioxide
- the acrylic copolymer may be used in the chip inlay deucheung 110 in a ratio of 0.1 to 20 parts by weight based on 100 parts by weight of the PLA resin.
- the acrylic resin may be added to the chip inlaid layer 110 in a ratio of 0.01 to 10 parts by weight based on 100 parts by weight of the PLA resin.
- the lubricant may be used in the chip inlay deucheung 110, 0.01 to 10 parts by weight based on 100 parts by weight of the PLA resin.
- the hydrolysis agent may be added to the chip inlay deucheung 110, within a range of 10 parts by weight or less based on 100 parts by weight of the PLA resin.
- the chip inlay deucheung 110 may be added to the titanium pigment (TiO 2 ) as a white pigment for the purpose of reinforcing inorganic filler calcium carbonate (CaCO 3 ) or aesthetics, etc., the texture of the natural wood and the unique wood At least one of wood flour, rice husk, and rosin may be added to impart aroma.
- TiO 2 titanium pigment
- CaCO 3 calcium carbonate
- At least one of wood flour, rice husk, and rosin may be added to impart aroma.
- the chip inlaid layer 110 is preferably used in an amount of 500 parts by weight or less relative to 100 parts by weight of the PLA resin.
- the chip inlay deucheung 110 is preferably used in 50 parts by weight or less relative to 100 parts by weight of PLA resin.
- wood flour or chaff is preferably added to the chip inlay deucheung 110, 200 parts by weight or less relative to 100 parts by weight of PLA resin, and in the case of rosin is added to 20 parts by weight or less relative to 100 parts by weight of PLA resin. Do.
- the chip inlay deucheung 110 preferably has a thickness of 0.3 ⁇ 3.0 mm.
- the dimensionally stable layer 120 serves to complement the dimensional stability of the PLA resin.
- the dimension changes due to temperature change due to heating, and the like, and thus, a phenomenon such as connection between floorings may be caused by shrinkage, so that the dimensionally stable layer 120 may provide such dimensional stability. It can be secured to prevent gaps between floorings.
- the dimensionally stable layer 120 has a glass fiber impregnated structure. That is, the dimensionally stable layer 120 is impregnated with glass fibers in at least one of acrylic resin, melamine resin or PLA resin.
- the glass fiber may have a unit mass per area of 30 ⁇ 150 g / m 2 . If the mass per unit area of the glass fiber is less than 30 g / m 2 , the dimensional stability reinforcement effect may be insufficient, and if the mass per unit area of the glass fiber exceeds 150 g / m 2 , the chip inlay layer (110) layer and There is a problem that the adhesion between the dimensionally stable layer 120 may be lowered.
- the dimensional stabilizer layer 120 is a plasticizer in the acrylic resin according to the purpose or shape of use, citric acid-based plasticizers such as ATBC, phthalate-based plasticizers such as DINP, phosphite-based plasticizers and viscosity lowering agent, inorganic fillers for cost reduction Calcium carbonate, white pigment, titanium dioxide, or the like may be included alone or in addition of two or more.
- the materials added to the dimensionally stable layer 120 are preferably added in an amount of 40 to 150 parts by weight based on 100 parts by weight of the acrylic resin in the case of ATBC, 30 parts by weight or less in the case of a viscosity reducing agent, 150 parts by weight in the case of calcium carbonate
- titanium dioxide it is preferably added at 20 parts by weight or less.
- the hardness of the dimensional stability layer 120 may increase the workability may be lowered, on the contrary, if it exceeds 150 parts by weight, compatibility with other components This may impair dimensional stability.
- the viscosity lowering agent when the amount is added in excess of 30 parts by weight based on 100 parts by weight of the acrylic resin, moldability may be reduced due to excessive viscosity decrease.
- the adhesive strength with other components when added in excess of the above range, the adhesive strength with other components may be lowered, thereby lowering the workability.
- the dimensionally stable layer 120 preferably has a thickness of 0.1 ⁇ 1.0 mm. If the thickness of the dimensional stability layer 120 is less than 0.1 mm may be insufficient dimensional stability effect, if the thickness of the dimensional stability layer 120 exceeds 1.0 mm only the thickness without further dimensional stability effect flooring This results in an increase in overall manufacturing costs.
- the base layer 130 serves as the most basic layer of the flooring material to support the dimensional stabilization layer 120 and the chip inlay deucheung 110 of the upper, absorbing the impact of the upper or lower.
- the base layer 130 may include PLA resin as a binder, ATBC as a nonphthalate plasticizer, and an acrylic copolymer as a melt strength enhancer.
- the base layer 130 may include 5 to 100 parts by weight of the non-phthalate plasticizer and 0.1 to 20 parts by weight of the melt strength reinforcing agent based on 100 parts by weight of the PLA resin.
- the base layer 130 is 0.01 to 10 parts by weight of a higher fatty acid, 0.01 to 10 parts by weight of a chain extender, 10 parts by weight or less of a hydrolysis agent, and calcium carbonate (CaCO 3 ) with respect to 100 parts by weight of the PLA resin as a lubricant.
- a higher fatty acid 0.01 to 10 parts by weight of a chain extender, 10 parts by weight or less of a hydrolysis agent, and calcium carbonate (CaCO 3 ) with respect to 100 parts by weight of the PLA resin as a lubricant.
- 1,000 parts by weight or less wood powder 200 parts by weight or less, titanium dioxide (TiO 2 ) 50 parts by weight or less, and may further include one or more of 20 parts by weight or less.
- the base layer 130 preferably has a thickness of 1.00 ⁇ 5.0 mm. If the thickness of the base layer 130 is 1.0 mm or less, the functions cannot be properly performed, and if the thickness of the base layer 130 exceeds 5.0 mm, the use of many PLA resins may cause the flooring manufacturing cost to increase. Becomes
- Figure 2 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlay de flooring material 200 using the PLA resin is a transparent layer 210, a chip inlaid layer 220, a dimensionally stable layer 230, and a substrate layer from above. 240.
- the chip inlaid flooring 200 has the same components except for the chip inlaid flooring 100 and the transparent layer 210 of FIG. 1. Therefore, in the present embodiment, the description of the chip inlaid layer 220, the dimensionally stable layer 230, and the base layer 240 will be omitted, and only the transparent layer 210 will be described.
- the transparent layer 210 is formed on the chip inlay deucheung 220 to impart a three-dimensional feeling, and serves to protect the pattern formed in the chip inlay deucheung 220.
- the transparent layer 210 may include an acrylic resin, PLA resin, or the like as a binder. That is, the transparent layer 210 may include at least one of an acrylic resin and a PLA resin, and a non-phthalate as a first plasticizer, and at least one of an acrylic copolymer and a hydrolysis agent as a processing aid.
- the transparent layer 210 is based on 100 parts by weight of the acrylic resin, 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, at least one of stearic acid and higher fatty acids as a lubricant 0.01 to 10 It can include up to 10 parts by weight, and the hydrolysis agent.
- the transparent layer 210 preferably has a thickness of 0.1 ⁇ 1.0 mm.
- the thickness of the transparent layer 210 is less than 0.1 mm, the print pattern protection effect directly below the transparent layer 210 is insufficient, and if the thickness of the transparent layer 210 exceeds 1.0 mm, the overall flooring cost may increase. have.
- Figure 3 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 300 using the PLA resin according to another embodiment of the present invention includes a chip inlaid layer 310 and a substrate layer 320 from above.
- the chip inlay deucheung 310 has the form of a chip having a natural marble appearance, it may be composed of two or more layers as necessary.
- the chip inlay deucheung 310 may include at least one of PLA resin, non-phthalate non-phthalate plasticizer, acrylic copolymer and anti-hydrolysis agent as a processing aid (binder).
- the chip inlay deucheung 310 is based on 100 parts by weight of the PLA resin, 5 to 100 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, 10 parts by weight or less of the hydrolysis agent, wood flour and chaff It may include one or more of 200 parts by weight or less, 500 parts by weight or less of calcium carbonate (CaCO 3 ), 50 parts by weight or less of titanium dioxide (TiO 2 ), and 20 parts by weight or less of rosin.
- CaCO 3 calcium carbonate
- TiO 2 titanium dioxide
- the chip inlay deucheung 310 preferably has a thickness of 0.3 ⁇ 3.0 mm. If the thickness of the chip inlaid layer 310 is less than 0.3 mm, the functions cannot be properly performed. If the thickness of the chip inlaid layer 310 exceeds 3.0 mm, the flooring manufacturing cost increases due to the use of many PLA resins. Cause.
- the base layer 320 is the most basic layer of the flooring material to support the upper chip inlay deucheung 310, and serves to absorb the impact of the upper or lower.
- the substrate layer 320 may include a PLA resin, a nonphthalate plasticizer, and an acrylic copolymer as a melt strength enhancer as a binder.
- the base layer 320 may include 5 to 100 parts by weight of the non-phthalate plasticizer and 0.1 to 20 parts by weight of the melt strength reinforcing agent based on 100 parts by weight of the PLA resin.
- the base layer 320 is 0.01 to 10 parts by weight of a higher fatty acid, 0.01 to 10 parts by weight of a chain extender, 10 parts by weight or less of a hydrolysis agent, calcium carbonate (CaCO 3 ) with respect to 100 parts by weight of the PLA resin ) 1,000 parts by weight or less, wood powder 200 parts by weight or less, titanium dioxide (TiO 2 ) 50 parts by weight or less, and may further include one or more of 20 parts by weight or less.
- the base layer 320 preferably has a thickness of 1.00 ⁇ 5.0 mm. If the thickness of the base layer 320 is 1.0 mm or less, the functions cannot be performed properly. If the thickness of the base layer 320 exceeds 5.0 mm, the use of many PLA resins may cause the flooring manufacturing cost to increase. Becomes
- Figure 4 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 400 using the PLA resin according to another embodiment of the present invention includes a transparent layer 410, a chip inlaid layer 420, and a base layer 430 from above. .
- the chip inlaid flooring 400 has the same components except for the chip inlaid flooring 300 and the transparent layer 410 of FIG. 3. Therefore, in the present embodiment, the description of the chip inlaid layer 420 and the base layer 430 will be omitted, and only the transparent layer 410 will be described.
- the transparent layer 410 is formed on the chip inlay deucheung layer 420 to impart a three-dimensional feeling, and serves to protect the pattern formed on the chip inlay deucheung 420.
- the transparent layer 410 may include at least one of PLA resin as a binder, ATBC as a nonphthalate plasticizer, an acrylic copolymer as a processing aid, and a hydrolysis agent.
- the transparent layer 410 is based on 100 parts by weight of the PLA resin, 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, at least one of stearic acid and higher fatty acids as a lubricant 0.01 to 10 It may include up to 10 parts by weight of the acrylic resin, 0.01 to 10 parts by weight and hydrolysis agent.
- the transparent layer 410 preferably has a thickness of 0.1 ⁇ 1.0 mm.
- the thickness of the transparent layer 410 is less than 0.1 mm, the effect of protecting the printed pattern directly below the transparent layer 410 is insufficient, and if the thickness of the transparent layer 410 exceeds 1.0 mm, the overall flooring cost may increase. have.
- the transparent layer 410 is the same in detail with the transparent layer 210 of FIG.
- Figure 5 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 500 using the PLA resin may be a chip inlaid layer 510, a base layer 520, an adhesive layer 530, and a woven fabric layer from above. 540.
- the chip inlaid flooring material 500 has the same components except for the chip inlaid flooring material 300, the adhesive layer 530, and the woven fabric layer 540 of FIG. 3. Therefore, in the present embodiment, the description of the chip inlaid layer 510 and the base layer 520 will be omitted, and only the adhesive layer 530 and the woven fabric layer 540 will be described.
- the adhesive layer 530 may include a vinyl acetate adhesive resin, an ethylene vinyl acetate (EVA) adhesive resin, a urethane adhesive resin, a mixture of a urethane adhesive resin and an isocyanate curing agent, an acrylic adhesive resin, and a mixture of an acrylic adhesive resin and an epoxy curing agent. It may be formed of one or more selected from.
- EVA ethylene vinyl acetate
- urethane adhesive resin a mixture of a urethane adhesive resin and an isocyanate curing agent
- acrylic adhesive resin and a mixture of an acrylic adhesive resin and an epoxy curing agent. It may be formed of one or more selected from.
- the adhesive layer ( 530 may be formed.
- the temperature of the drying oven is preferably adjusted appropriately within the range of 50 ⁇ 300 degrees.
- the woven fabric layer 540 may include at least one of jute, white horse, cotton, and polyester.
- the woven fabric layer 540 is a layer made of a woven fabric, and the woven fabric forming the woven fabric layer may use T / C plain weave or maryas.
- As the yarn used to make the woven fabric 100% pure cotton, polyester, a blend of polyester and nylon, and the like may be used.
- Figure 6 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 600 using the PLA resin includes a chip inlaid layer 610, a base layer 620, and a woven fabric layer 630. do.
- the chip inlaid layer 610, the base layer 620, and the woven fabric layer 630 are the same as those of FIG. 5 in the composition, manufacturing method, and the like. Therefore, in the present embodiment, description of the components will be omitted.
- Figure 7 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 700 using the PLA resin according to another embodiment of the present invention includes a chip inlaid layer 710 and a woven fabric layer 720 from above.
- the chip inlaid layer 710 and the woven fabric layer 720 are the same in the composition, manufacturing method, and the like of those of FIG. 6. Therefore, in the present embodiment, description of the components will be omitted.
- FIG. 8 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 800 using the PLA resin according to another embodiment of the present invention includes a transparent layer 210, a chip inlaid layer 220, and a woven fabric layer 540 from above.
- the transparent layer 210 and the chip inlaid layer 220 are the same as those of FIG.
- the woven fabric layer 540 is the same as that of FIG. 5 in composition, manufacturing method, and the like. Therefore, in the present embodiment, description of the components will be omitted.
- FIG. 9 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 900 using the PLA resin according to another embodiment of the present invention includes a surface treatment layer 150, a chip inlaid layer 220, and a woven fabric layer 540 from above. do.
- the chip inlaid layer 220 and the woven fabric layer 540 are the same as those of FIGS. 2 and 5 in the composition, manufacturing method, and the like, respectively. Therefore, in the present embodiment, description of the components will be omitted, and only the surface treatment layer 150 will be described.
- the surface treatment layer 150 may be formed on the chip inlaid layer 220, and may include polyurethane, urethane acrylate, wax, or the like.
- the surface treatment layer 150 may be formed by applying a general ultraviolet curable composition, such as, for example, a urethane acrylate-based UV curable composition, onto the chip inlaid layer 220 and curing through ultraviolet irradiation, and thermosetting. It can be formed by coating with wax and curing by passing through a hot air oven, and can be formed in various ways.
- the surface treatment layer 150 preferably has a thickness of 0.001 ⁇ 0.1 mm.
- the surface treatment layer 150 is formed to a thickness of less than 0.001 mm, it is difficult to expect an effect of improving physical properties such as scratch resistance, and when the surface treatment layer 150 is formed to a thickness of more than 0.1 mm, excessive manufacture of the surface treatment layer 150 is formed. It costs money and can reduce the appearance quality of the flooring.
- FIG. 10 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlay de flooring material 1000 using the PLA resin according to another embodiment of the present invention is a surface treatment layer 150, transparent layer 210, chip inlay deucheung 220 and woven fabric layer from above 540.
- the surface treatment layer 150 is the same as that of FIG. 9, the transparent layer 210 and the chip inlaid layer 220 are the same as those of FIG. 2, and the woven layer 540 is the same as that of FIG. 5. Do. Therefore, in the present embodiment, description of the components will be omitted.
- FIG. 11 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 1100 using PLA resin includes a surface treatment layer 150, a chip inlaid layer 220, and a base layer 240 from above. do.
- the surface treatment layer 150 is the same as that of FIG. 9, and the chip inlaid layer 220 and the base layer 240 are the same as those of FIG. 2. Therefore, in the present embodiment, description of the components will be omitted.
- FIG. 12 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 1200 using the PLA resin may be a surface treatment layer 150, a chip inlaid layer 220, a substrate layer 240, and a woven fabric from above.
- Layer 540 the chip inlaid flooring material 1200 using the PLA resin.
- the surface treatment layer 150 is the same as that of FIG. 9, the chip inlaid layer 220 and the base layer 240 are the same as those of FIG. 2, and the woven layer 540 is the same as that of FIG. 5. same. Therefore, in the present embodiment, description of the components will be omitted.
- Figure 13 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
- the chip inlaid flooring material 1300 using the PLA resin may be a surface treatment layer 150, a transparent layer 210, a chip inlaid layer 220, and a base layer from above. 240 and a woven fabric layer 540.
- the surface treatment layer 150 is the same as that of FIG. 9, the transparent layer 210, the chip inlaid layer 220 and the base layer 240 are the same as those of FIG. 2, and the woven layer 540 is Same as that of FIG. 5. Therefore, in the present embodiment, description of the components will be omitted.
- a sheet having a thickness of about 1 mm consisting of 5 parts by weight of mead, 100 parts by weight of wood powder, 280 parts by weight of calcium carbonate, 20 parts by weight of titanium dioxide and 10 parts by weight of rosin was prepared, pulverized, and rolled at a temperature of 150 degrees to obtain a thickness of about 1.5 mm.
- Phosphorus sheet was prepared.
- An acrylic sol was prepared by combining 100 parts by weight of an acrylic resin, 60 parts by weight of ATBC, 15 parts by weight of a viscosity reducing agent, 50 parts by weight of calcium carbonate and 5 parts by weight of titanium dioxide. Thereafter, the acrylic sol prepared using the roll coater was impregnated with glass fiber (60 g / m 2 ), and then dried at a temperature of 180 ° C. for 3 minutes to prepare a dimensionally stable layer having a thickness of 0.4 mm.
- a general UV curable composition such as a urethane acrylate UV curable composition, may be applied onto a chip inlaid layer, cured through UV irradiation, formed with a thermosetting wax, and cured through a hot air oven.
- the resin that can be used may be selected from polyurethane, urethane acrylate or wax.
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Abstract
Description
Claims (36)
- 위로부터 칩 인레이드(Chip Inlaid)층, 치수안정층, 및 기재층을 포함하고,상기 칩 인레이드층 또는 기재층 중 적어도 하나는 바인더로서 PLA(Polylactic acid) 수지를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 칩 인레이드층의 표면에는 폴리우레탄, 우레탄아크릴레이트 또는 왁스를 포함하는 표면처리층이 형성되어 있는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항 또는 제2항에 있어서,상기 기재층 이면에 직포층이 형성되어 있는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제3항에 있어서,상기 직포층은 황마, 백마, 면, 폴리에스터 중 1종 이상을 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제3항에 있어서,상기 기재층과 상기 직포층 사이에는 접착층이 형성되어 있는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제5항에 있어서,상기 접착층의 소재는 PLA 수지, 아크릴 수지, 우레탄 수지, 초산비닐 수지 중 1종 이상을 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 칩 인레이드층은 상기 PLA 수지에 비프탈레이트계 비프탈레이트계 가소제, 가공조제로서 아크릴계 공중합체 및 내가수분해제(anti-hydrolysis agent) 중에서 1종 이상을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제7항에 있어서,상기 아크릴계 공중합체는 무게평균분자량(Mw)이 80만 ~ 600만인 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제7항에 있어서,상기 내가수분해제는 카보디이미드(Carbodiimide) 또는 옥사졸린인 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제7항에 있어서,상기 칩 인레이드층은 상기 PLA 수지 100 중량부에 대하여, 상기 비프탈레이트계 가소제 5 ~ 100 중량부, 상기 아크릴계 공중합체 0.1 ~ 20 중량부, 활제로서 스테아르산 및 고급지방산 중 1종 이상 0.01 ~ 10 중량부, 아크릴 수지 0.01 ~ 10 중량부, 내가수분해제 10 중량부 이하, 목분과 왕겨 중 1종 이상 200 중량부 이하, 탄산칼슘(CaCO3) 500 중량부 이하, 이산화티타늄(TiO2) 50 중량부 이하 및 송진 20 중량부 이하 중 하나 이상을 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 칩 인레이드층은 0.3 ~ 3.0 mm 의 두께를 갖는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 치수안정층은 아크릴 수지, 멜라민 수지 또는 PLA 수지 중 적어도 하나에 유리섬유가 함침되어 있는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제12항에 있어서,상기 유리섬유는 30 ~ 150 g/m2 의 면적당 단위질량을 갖는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제12항에 있어서,상기 치수안정층은 상기 아크릴 수지 100 중량부에 대하여, 비프탈레이트계 가소제 40 ~ 150 중량부, 점도저하제 30 중량부 이하, 탄산칼슘 150 중량부 이하 및 이산화티타늄 20 중량부 이하 중에서 하나 이상을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 치수안정층은 0.10 ~ 1.0 mm 의 두께를 갖는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 기재층은 비프탈레이트계 가소제, 용융강도 보강제(melt strength enhancer)로서 아크릴계 공중합체를 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제16항에 있어서,상기 기재층은 상기 PLA 수지 100 중량부에 대하여, 상기 비프탈레이트계 가소제 5~100 중량부 및 상기 용융강도 보강제 0.1 ~ 20 중량부를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제17항에 있어서,상기 기재층은 상기 PLA 수지 100 중량부에 대하여, 활제로서 고급지방산 0.01 ~ 10 중량부, 사슬 연장제 0.01 ~ 10 중량부, 내가수분해제 10 중량부 이하, 탄산칼슘(CaCO3) 1,000 중량부 이하, 목분 200 중량부 이하, 이산화티타늄(TiO2) 50 중량부 이하 및 송진 20 중량부 이하 중 하나 이상을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 기재층은 1.00 ~ 5.0 mm 의 두께를 갖는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제1항에 있어서,상기 칩 인레이드층의 상부에 형성되는 투명층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제20항에 있어서,상기 투명층은 바인더로서 PLA 수지 또는 아크릴 수지를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제21항에 있어서,상기 투명층은 상기 PLA 수지 또는 아크릴 수지에 비프탈레이트계 가소제로서 ATBC, 가공조제로서 아크릴계 공중합체 및 내가수분해제 중에서 1종 이상을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제22항에 있어서,상기 투명층은 상기 PLA 수지 100 중량부에 대하여, 상기 비프탈레이트계 가소제 5~50 중량부, 상기 아크릴계 공중합체 0.1 ~ 20 중량부, 활제로서 스테아르산 및 고급지방산 중 1종 이상 0.01 ~ 10 중량부, 아크릴 수지 0.01 ~ 10 중량부 및 내가수분해제 10 중량부 이하를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제20항에 있어서,상기 투명층은 0.1 ~ 1.0 mm 의 두께를 갖는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 위로부터 칩 인레이드층 및 기재층을 포함하고,상기 칩 인레이드층 또는 기재층 중 적어도 하나는 바인더로서 PLA 수지를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제25항에 있어서,상기 칩 인레이드층의 상부에 형성되는 투명층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제25항에 있어서,상기 기재층의 하부에 형성되는 직포층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제27항에 있어서,상기 기재층과 상기 직포층 사이에 형성되는 접착층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 위로부터 칩 인레이드층 및 직포층을 포함하고,상기 칩 인레이드층은 바인더로서 PLA 수지를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제29항에 있어서,상기 칩 인레이드층 상부에 형성되는 투명층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제26항 또는 제30항에 있어서,상기 투명층은 0.1 ~ 1.0 mm 의 두께를 갖는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제26항 또는 제30항에 있어서,상기 투명층은 상기 PLA 수지 또는 아크릴 수지에 비프탈레이트계 가소제로서 ATBC, 가공조제로서 아크릴계 공중합체 및 내가수분해제 중에서 1종 이상을 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제32항에 있어서,상기 투명층은 상기 PLA 수지 100 중량부에 대하여, 상기 비프탈레이트계 가소제 5 ~ 50 중량부, 상기 아크릴계 공중합체 0.1 ~ 20 중량부, 활제로서 스테아르산 및 고급지방산 중 1종 이상 0.01 ~ 10 중량부, 아크릴 수지 0.01 ~ 10 중량부 및 내가수분해제 10 중량부 이하를 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제26항 또는 제30항에 있어서,상기 투명층 상부에 형성되는 폴리우레탄, 우레탄 아크릴레이트, 또는 왁스를 포함하는 표면처리층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제25항 또는 제29항에 있어서,상기 칩 인레이드층 상부에 형성되는 폴리우레탄, 우레탄 아크릴레이트, 또는 왁스를 포함하는 표면처리층을 더 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
- 제27항, 제28항 및 제29항 중 어느 한 항에 있어서,상기 직포층은 황마, 백마, 면, 폴리에스터 중 1종 이상을 포함하는 것을 특징으로 하는 PLA 수지를 이용한 칩 인레이드 바닥재.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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CN201180063669.XA CN103282589B (zh) | 2011-06-13 | 2011-06-13 | 使用pla树脂的碎屑镶嵌地板材料 |
EP11867845.7A EP2719846B1 (en) | 2011-06-13 | 2011-06-13 | Chip-inlaid flooring material using pla resin |
US13/978,498 US9422729B2 (en) | 2011-06-13 | 2011-06-13 | Chip-inlaid flooring material using PLA resin |
JP2013524026A JP5603494B2 (ja) | 2011-06-13 | 2011-06-13 | Pla樹脂を用いたチップインレイド床材 |
PCT/KR2011/004316 WO2012173287A1 (ko) | 2011-06-13 | 2011-06-13 | Pla 수지를 이용한 칩 인레이드 바닥재 |
Applications Claiming Priority (1)
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PCT/KR2011/004316 WO2012173287A1 (ko) | 2011-06-13 | 2011-06-13 | Pla 수지를 이용한 칩 인레이드 바닥재 |
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WO2012173287A1 true WO2012173287A1 (ko) | 2012-12-20 |
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PCT/KR2011/004316 WO2012173287A1 (ko) | 2011-06-13 | 2011-06-13 | Pla 수지를 이용한 칩 인레이드 바닥재 |
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US (1) | US9422729B2 (ko) |
EP (1) | EP2719846B1 (ko) |
JP (1) | JP5603494B2 (ko) |
CN (1) | CN103282589B (ko) |
WO (1) | WO2012173287A1 (ko) |
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KR101404296B1 (ko) * | 2010-06-07 | 2014-06-09 | (주)엘지하우시스 | 직물 표면을 갖는 pla 바닥재 |
KR20140148033A (ko) * | 2013-06-21 | 2014-12-31 | (주)엘지하우시스 | 생분해성 수지 및 목분을 포함하는 판재 및 이의 제조방법 |
WO2016159400A1 (ko) * | 2015-03-30 | 2016-10-06 | 주식회사 엘지하우시스 | 난연성 바닥재 및 이의 제조방법 |
CN109535766A (zh) * | 2018-10-16 | 2019-03-29 | 浙江鹏华新型材料有限公司 | 一种复合角钢的生产工艺 |
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- 2011-06-13 CN CN201180063669.XA patent/CN103282589B/zh not_active Expired - Fee Related
- 2011-06-13 JP JP2013524026A patent/JP5603494B2/ja not_active Expired - Fee Related
- 2011-06-13 WO PCT/KR2011/004316 patent/WO2012173287A1/ko active Application Filing
- 2011-06-13 US US13/978,498 patent/US9422729B2/en not_active Expired - Fee Related
- 2011-06-13 EP EP11867845.7A patent/EP2719846B1/en not_active Not-in-force
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Also Published As
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JP2013533408A (ja) | 2013-08-22 |
EP2719846A1 (en) | 2014-04-16 |
US20130302577A1 (en) | 2013-11-14 |
EP2719846A4 (en) | 2015-04-08 |
CN103282589A (zh) | 2013-09-04 |
EP2719846B1 (en) | 2017-10-18 |
JP5603494B2 (ja) | 2014-10-08 |
US9422729B2 (en) | 2016-08-23 |
CN103282589B (zh) | 2016-06-01 |
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