WO2012172528A1 - Accéléromètre polymère à trois axes et procédé de production - Google Patents

Accéléromètre polymère à trois axes et procédé de production Download PDF

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Publication number
WO2012172528A1
WO2012172528A1 PCT/IB2012/053056 IB2012053056W WO2012172528A1 WO 2012172528 A1 WO2012172528 A1 WO 2012172528A1 IB 2012053056 W IB2012053056 W IB 2012053056W WO 2012172528 A1 WO2012172528 A1 WO 2012172528A1
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WO
WIPO (PCT)
Prior art keywords
accelerometer device
previous
axis
thermal accelerometer
axis thermal
Prior art date
Application number
PCT/IB2012/053056
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English (en)
Inventor
Luís Alexandre MACHADO DA ROCHA
Cátia Samanta RIBEIRO DA SILVA
António José VILELA PONTES
Original Assignee
Universidade Do Minho
MACHADO VIANA, Júlio César
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Universidade Do Minho, MACHADO VIANA, Júlio César filed Critical Universidade Do Minho
Publication of WO2012172528A1 publication Critical patent/WO2012172528A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/006—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of fluid seismic masses
    • G01P15/008—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of fluid seismic masses by using thermal pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions

Definitions

  • the present invention relates to the production of micro- fabricated thermal accelerometers capable of detecting acceleration in multiple axes. More particularly, a 3-axis sensing device based on polymers.
  • Thermal accelerometers based in convection heat present several advantages when compared to piezo and capacitive accelerometers and are known to comprise an enclosure in which a central filament is disposed that is connected to a power supply member delivering electricity, and that is located between two sensors for comparing the temperatures. Without acceleration a symmetrical temperature profile is generated with a maximum value at the heater' s center location while when acceleration is applied, free convection occurs and the sensors measure a temperature difference. The developed signal is then amplified, conditioned and output as either radiometric or an absolute voltage allowing the characterization of the nature and direction of the applied force .
  • Patent documents describing innovations related to the method of production and functioning of thermal accelerometers providing up to three axes of acceleration were found.
  • Prior inventions address silicon based devices and therefore, except for the sensing principle, this invention is completely different regarding the method of production, the 3-axis sensing mechanism and materials used.
  • a thermal accelerometer using a silicon substrate with at least one enclosed chamber formed by micromachining and at least one heat element suspended over the cavity in the X-Y plane and a mechanism for detecting heat transfer including a first and second temperature sensing elements disposed on the X and/or Y axes at equal distances from the heater element and with the possibility of integrating a third and a fourth element in the same conditions is described in Patent US 7,392,703 B2.
  • the accelerometer further includes an amplification circuitry operative capable of receiving signals representing a differential temperature detected by the first and second temperature and producing an output voltage representative of the magnitudes of acceleration along a Z axis perpendicular to the XY plane presenting an increased sensitivity for measuring the acceleration in the Z direction.
  • This circuitry increases the sensitivity to measure the acceleration in the Z direction by being configured to reduce both DC offset and drift input by the internal reference voltage. It is also compatible with CMOS technology and bipolar processes with reduced costs while guaranteeing a high level of reliability.
  • Patent US 6,182,509 Bl describes two implementations where the first provides an accelerometer mainly constituted by a silicon substrate with a cavity formed by micromachining, a metal heater extending across the open space and a metal pair of temperature sensing elements equidistant and parallel to the heater positioned on opposite sides being both formed by micromachining and coated with silicon dioxide. Electrical current is provided to the heater by a conductor connected to an external source of power and the differential resistance between the temperature sensing elements is measured by a bridge circuit.
  • Heat transfer medium may consist of a fluid or a gas .
  • a second accelerometer is described presenting some differences from the previous device such as having a heater and temperature sensing elements of polysilicon being the heater made of a metal and polysilicon coated with dielectric silicon dioxide.
  • the device includes a pair of auxiliary heaters as intermediate symmetrically disposed on either side of and spaced from the primary heater. Conductive lines from an external source of power and operative are coupled to provide electrical current to the auxiliary heaters allowing independent changing of current through each auxiliary heater.
  • a thermopile of a plurality of thermocouples is arrange linearly as in the previous accelerometer device. The thermopiles are electrically connected in series and with opposite polarity producing an electrical potential proportional to the difference in temperature measured by a coupled differential amplifier.
  • thermocouple is made of conductors and semiconductors materials forming a junction physically arranged in a linear pattern between materials generating a plurality of functions.
  • Another approach for a 3-axis thermal accelerometer was introduced by Tsang et Al . in his research work "MONOLI HICALLY FABRICATED POLYMER MEMS 3-AXIS THERMAL ACCELEROMETERS DESIGNED FOR AUTOMATED WIREBONDER ASSEMBLY" presented at MEMS Conference 2008, Arlington, AZ, USA, January 13-17, pp. 880-883.
  • a surface micromachining like process, with silicon as the supporting substrate, is used for the fabrication of the active elements, the heater and temperature sensors (thermocouples) .
  • the fabrication process uses a series of layers, including a supporting mechanical spin-coated photoresist layer, and a release etching process that adds complexity to the process.
  • the accelerometer requires two heaters, one for the XY axis and another one for the Z axis, for full 3-axis measurement as opposed to the single heater requirement presented in this invention.
  • a final external mechanical stimulus is required on the Z-axis heater supporting layer to place it in the vertical position, which strongly limits reproducibility.
  • thermal accelerometer patents US 6,171880 Bl, US 6,795,752 Bl, US 7,096,734 B2, describe silicon micromachined convective accelerometers with one or more cavities therein in which is included the thermal acceleration sensor and associated signal conditioning circuitry. Silicon presents very good thermal conductivity increasing this way the thermal losses and consequently power consumption and the process to fabricate the accelerometer device is rather slow and expensive for small series. Thermal sensors tend to be based on platinum thermistor with a large thermal capacitance causing a reduction of the sensor bandwidth. Although previous inventions demonstrate silicon based thermal accelerometers , it would be desirable to have a lower cost thermal accelerometer configured to provide up to three axes of acceleration sensing with high levels of reliability while avoiding thermal losses and with reduced power consumption .
  • microsystems both functional and economic
  • polymer micromanufacturing technologies towards new fields of application.
  • the micromolding technology is emerging to a new level of complexity and precision and this challenging technique requires improvements in relation to the conventional mould production techniques, as well as changing the extraction and temperature systems and even the product designing to best suit the new processing demands.
  • Advantages are related to size and weight reduction, better performance, lower consumption, greater design flexibility as well as lower manufacturing costs for large scale productions.
  • One object of the present invention is a 3-axis thermal accelerometer device, which comprises:
  • the 3-axis thermal accelerometer device includes membranes (5 and 7) placed equidistant to the central membrane (6) .
  • the 3-axis thermal accelerometer device includes sensors placed above the membranes (5, 6 and 7) at an equal distance from the heating mean .
  • the 3-axis thermal accelerometer device includes gas (8) that is hermetically sealed by the polymer parts by means of adhesives, glues or a welding process .
  • the 3-axis thermal accelerometer device has a central membrane (6) that include the heater and the XY-axis temperature sensors.
  • the 3-axis thermal accelerometer device presents top and bottom membranes (5 and 7) that include the Z-axis temperature sensor.
  • the 3-axis thermal accelerometer device includes a sensing system that consists of low-thermal conductive polymeric membranes with active elements .
  • the 3-axis thermal accelerometer device includes active elements fabricated using metals, polymers or conductive inks by means of deposition methods and/or inkjet printing.
  • the 3-axis thermal accelerometer device has a distance between the temperature sensors and heater within the interval 100-1500 microns and the total length of the heater is within the interval 1000- 3500 microns .
  • the 3-axis thermal accelerometer device has the polymeric membrane (6) geometry defined by laser cutting, wet etching or dry etching.
  • the 3-axis thermal accelerometer device includes X temperature sensor (10), Y temperature sensor (14), Z temperature sensor (12) and the heater (9) which are made of metal or semiconductor or conductive polymer or conductive ink.
  • the 3-axis thermal accelerometer device includes temperature sensors and heater deposited using physical vapor deposition techniques, inkjet printed or spin casted.
  • the construction of the 3- axis thermal accelerometer device includes lithography techniques used to define the temperature sensor and heater geometry .
  • the 3-axis thermal accelerometer device has a central membrane (6) assembled by means of adhesives, glues or ultrasound technologies.
  • the 3-axis thermal accelerometer device has temperature sensors in the Z direction (12 and 13) occupying the largest possible area.
  • Another aspect of the present invention is the method of production of the 3-axis thermal accelerometer device which comprises the following steps:
  • the external parts (1, 2, 3 and 4) are produced by microin ection
  • the membranes (5, 6 and 7) are produced;
  • the method of production of the 3- axis thermal accelerometer device includes membranes (5, 6 and 7) and external parts (1, 2, 3 and 4) assembled by means of adhesives, glues or any welding process usually applied to polymer parts in an automated or manual process.
  • the present invention consists in 3-axis thermal accelerometer and the method of production thereof.
  • Current thermal accelerometer devices are manufactured from a silicon substrate micromachined to form one or several cavities. Although simple, this is a non-effective process when it comes to high rates and series of production and silicon presents disadvantages as heat losses diminishing the device efficiency.
  • Polymer microin ected microparts are used in this invention to produce the structural part of the accelerometer .
  • the microin ection process based in the injection process, has been widely studied and used to produce pieces in the micron scale with low amounts of material and high level of detail, including true 3D geometries, being simultaneously reliable and economic.
  • This technique does feature a wide range of thermoplastics which present a variety of physical and chemical properties combined with low cost, good processing capability, recyclability among other advantages.
  • microinj ected polymeric parts two identical top parts and two identical central parts or four different parts
  • active polymeric membranes two identical z-axis membranes and a central membrane
  • the microinj ected parts provide mechanical support for the active elements that are placed on the membranes (the heater and the temperature sensors) .
  • the invention enables the realization of a 3-axis thermal accelerometer based on polymers.
  • the device operating gas medium is hermetically sealed by the polymer parts by means of adhesives, glues or a welding process and electrical current applied to the heater causes the air to heat and external acceleration imposes a gradient of temperature sensed by the thermal sensing elements.
  • top and bottom membranes can be made larger and with larger sensing area in order to have constant response in case of planar (XY) asymmetries between central and top/bottom membranes.
  • the top and bottom membranes are placed at equidistance from the central membrane to sense acceleration changes on the Z-axes and the central membrane includes the heater and the XY acceleration sensing elements.
  • the low thermal conduction of the polymeric membranes improves the overall power efficiency.
  • the central membrane requires a different design than the top/bottom membranes since both the heater and the XY-axis temperature sensors must be placed in the central membrane while the top/bottom membrane only includes the Z-axis temperature sensor. Since there are no design constraints for the Z-axis temperature sensor, the occupied area of the sensor can be maximized in order to compensate for small asymmetries (between top and bottom membranes and central membrane) that are likely to happen during the assembly process.
  • FIG. 1 represents a 2D cross-section view of the thermal accelerometer device showing the following elements:
  • FIG. 2 depicts the central membrane (6) with preferred configuration consisting in the central heater (9), X temperature sensors (10 and 11) and Y temperature sensors (14 and 15) .
  • FIG. 3 depicts the top/bottom membrane (5, 7), with preferred configuration with Z temperature sensor (12) .
  • FIG. 4 depicts an illustrative embodiment of the elements of the thermal accelerometer prior to final assembly.
  • the top, central and bottom membranes (5, 6 and 7) are placed between the polymeric external parts (1, 2, 3 and 4), followed by the accelerometer assembly.
  • the present application describes the method of production of polymeric based 3-axis thermal accelerometers .
  • the invention takes advantage of the potential of polymeric materials diverse properties and uses microin ection technology to have a both reproducible and economic process suitable for high production series.
  • the sensing system consists of low- thermal conductive polymeric membranes with active elements produced by simple fabrication methods.
  • the active elements, heater and temperature sensors, are fabricated using metals, polymers or conductive inks by means of deposition methods and/or inkjet printing.
  • the method of production of the current invention can be divided in three distinct phases: the microin ection of the external parts, the fabrication of the membranes, and a final assembly process.
  • FIG. 1 depicts an illustrative 2D plane of the parts of the thermal accelerometer device.
  • the gas medium around it (8) will heat up.
  • the XY temperature sensors (10 and 11) and the Z temperature sensors (12 and 13) placed equidistant to the heater will have zero temperature difference.
  • the measured temperature difference is proportional to the external acceleration.
  • the distance between the temperature sensors and heater is within the interval 100-1500 microns and the total length of the heater is within the interval 1000-3500 microns. However, other dimensions may be selected depending on the accelerometer desired specifications.
  • the placement of 3 pairs of temperature sensors enables to measure acceleration in 3 axes.
  • the thermal accelerometer external structure is composed by four polymeric parts (1, 2, 3 and 4) where parts (1 and 4) can be identical (top/bottom) as well as parts (2 and 3) which can also be identical.
  • parts (1 and 4) can be identical (top/bottom) as well as parts (2 and 3) which can also be identical.
  • the fact that the polymeric parts can be made equal in pairs brings advantages such as the use of only two different moldings and simplicity of the assembly process.
  • the active elements, heater (9), XY temperature sensors (10 and 11) and Z temperature sensors (12 and 13) are placed on top of the polymeric membranes (5, 6 and 7) .
  • the Z temperature sensors occupy the largest possible area in manner to compensate asymmetries.
  • FIG. 2 shows a detailed view of the central membrane (6) .
  • the polymeric membrane (6) geometry can be defined by laser cutting, wet etching or dry etching.
  • the heater (9) is placed at the center and can be made of any kind of metal, such as platinum or aluminum, semiconductor, any kind of conductive polymer, such as polyacetylene, polypyrrole and their copolymers or any kind of conductive inks, such as inks with silver nano-particles . According to the material, the heater can be deposited using physical vapor deposition techniques such as thermal evaporation or electron beam evaporation, inkjet printed or spin casted. Lithography techniques may be used to further define the heater geometry.
  • the X temperature sensors and the Y temperature sensors (10, 11, 14 and 15) are placed equidistant to the heater and can be made of metal, semiconductor, conductive polymer or conductive ink. Both Pyroelectric and resistive transduction mechanisms can be used to measure the temperature and depending on the material, the temperature sensors can be deposited using physical vapor deposition techniques, inkjet printed or spin casted. Lithography techniques may be used to further define the temperature sensors geometry.
  • FIG. 3 shows a detailed view of the top (5) and bottom (7) membrane.
  • Membranes (5 and 7) are placed equidistant to the central membrane (6) .
  • the polymeric membrane (5) geometry can be defined by laser cutting, wet etching or dry etching.
  • the Z temperature sensor (12) can be made of metal, semiconductor, conductive polymer or conductive ink. Both pyroelectric and resistive transduction mechanisms can be used to measure the temperature and depending on the material, the temperature sensors can be deposited using physical vapor deposition techniques, inkjet printed or spin casted. Lithography techniques may be used to further define the temperature sensor geometry.
  • FIG. 4 depicts the final assembly process.
  • Top and bottom equal membranes (5 and 7) are placed between external polymeric parts (1, 2 and 3, 4) and are assembled by means of any kind of adhesives/glues such as epoxy and UV curing adhesives, ultrasound technologies or other welding process usually applied to polymer parts.
  • the central membrane (6) is placed between external polymeric parts (2 and 3) and is assembled by means of adhesives, glues or ultrasound technologies.
  • the order of assembling of the parts (1, 2, 3 and 4), and the membranes (5, 6 and 7) can be arbitrary and should be selected in such a way to minimize the number of required steps. Both manual and automatic assembly can be used .

Abstract

La présente invention concerne un accéléromètre thermique qui est capable de détecter une accélération sur plusieurs axes. L'accéléromètre est constitué de quatre parties polymères microinjectées (1, 2, 3, 4), qui peuvent être deux parties supérieures identiques et deux parties centrales identiques ou quatre parties différentes. Les parties sont assemblées avec des membranes polymères actives (5, 6, 7) pour fabriquer le dispositif de détection d'accélération à trois axes. Les parties microinjectées procurent un support mécanique pour le dispositif de chauffage et les capteurs de température placés sur les membranes. Le dispositif contenant un milieu gazeux est hermétiquement scellé par les parties polymères, l'air est chauffé par le dispositif de chauffage alimenté en courant et un gradient de température induit par une accélération externe est détecté par les éléments de détection thermique.
PCT/IB2012/053056 2011-06-17 2012-06-18 Accéléromètre polymère à trois axes et procédé de production WO2012172528A1 (fr)

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PT105759 2011-06-17
PT10575911 2011-06-17

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Cited By (3)

* Cited by examiner, † Cited by third party
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WO2016174588A1 (fr) * 2015-04-28 2016-11-03 Valmet, Lda. Feutre et système et procédé de surveillance de l'environnement
JP2017067643A (ja) * 2015-09-30 2017-04-06 ミツミ電機株式会社 流量センサ
US9696339B2 (en) 2014-09-18 2017-07-04 Sagatek Co., Ltd. Three-axis accelerometer

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US6171880B1 (en) 1999-06-14 2001-01-09 The United States Of America As Represented By The Secretary Of Commerce Method of manufacture of convective accelerometers
US6182509B1 (en) 1996-06-26 2001-02-06 Simon Fraser University Accelerometer without proof mass
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US7096734B2 (en) 2003-12-22 2006-08-29 Sagem Sa Thermal accelerometer with reduced sensitivity to external magnetic fields
US20070101813A1 (en) * 2005-11-10 2007-05-10 Memsic, Inc. Single chip tri-axis accelerometer
US7392703B2 (en) 2004-06-09 2008-07-01 Memsic, Inc. Z-axis thermal accelerometer
WO2008096936A1 (fr) * 2007-02-09 2008-08-14 Hankuk Sensys Co., Ltd. Appareil mems pour mesurer une accélération suivant trois axes

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EP0664456A1 (fr) * 1994-01-20 1995-07-26 Honda Giken Kogyo Kabushiki Kaisha Capteur d'accélération
US6182509B1 (en) 1996-06-26 2001-02-06 Simon Fraser University Accelerometer without proof mass
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US6795752B1 (en) 2000-11-03 2004-09-21 Memsic, Inc. Thermal convection accelerometer with closed-loop heater control
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US7096734B2 (en) 2003-12-22 2006-08-29 Sagem Sa Thermal accelerometer with reduced sensitivity to external magnetic fields
US7392703B2 (en) 2004-06-09 2008-07-01 Memsic, Inc. Z-axis thermal accelerometer
US20060179940A1 (en) * 2005-02-11 2006-08-17 Finemems Inc. Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level Packaging
US20070101813A1 (en) * 2005-11-10 2007-05-10 Memsic, Inc. Single chip tri-axis accelerometer
WO2008096936A1 (fr) * 2007-02-09 2008-08-14 Hankuk Sensys Co., Ltd. Appareil mems pour mesurer une accélération suivant trois axes

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Title
TSANG ET AL.: "MONOLITHICALLY FABRICATED POLYMER MEMS 3-AXIS THERMAL ACCELEROMETERS DESIGNED FOR AUTOMATED WIREBONDER ASSEMBLY", MEMS CONFERENCE 2008, TUCSON, AZ, USA, 13 January 2008 (2008-01-13), pages 880 - 883

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9696339B2 (en) 2014-09-18 2017-07-04 Sagatek Co., Ltd. Three-axis accelerometer
WO2016174588A1 (fr) * 2015-04-28 2016-11-03 Valmet, Lda. Feutre et système et procédé de surveillance de l'environnement
US10663940B2 (en) 2015-04-28 2020-05-26 Valmet, Lda. Felt and environment monitoring system and method
JP2017067643A (ja) * 2015-09-30 2017-04-06 ミツミ電機株式会社 流量センサ
CN108027267A (zh) * 2015-09-30 2018-05-11 三美电机株式会社 流量传感器
EP3339816A4 (fr) * 2015-09-30 2018-10-17 Mitsumi Electric Co., Ltd. Capteur de débit
CN108027267B (zh) * 2015-09-30 2020-08-04 三美电机株式会社 流量传感器
US10739176B2 (en) 2015-09-30 2020-08-11 Mitsumi Electric Co., Ltd. Flow rate sensor having temperature detectors and heat element provided on different insulator layers of diaphragm part

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