WO2012165801A3 - Copper particulate complex for printed electronics, and copper paste - Google Patents

Copper particulate complex for printed electronics, and copper paste Download PDF

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Publication number
WO2012165801A3
WO2012165801A3 PCT/KR2012/004083 KR2012004083W WO2012165801A3 WO 2012165801 A3 WO2012165801 A3 WO 2012165801A3 KR 2012004083 W KR2012004083 W KR 2012004083W WO 2012165801 A3 WO2012165801 A3 WO 2012165801A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper
particulate complex
printed electronics
paste
copper paste
Prior art date
Application number
PCT/KR2012/004083
Other languages
French (fr)
Korean (ko)
Other versions
WO2012165801A2 (en
Inventor
정인범
이병윤
정순철
Original Assignee
(주)창성
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)창성 filed Critical (주)창성
Publication of WO2012165801A2 publication Critical patent/WO2012165801A2/en
Publication of WO2012165801A3 publication Critical patent/WO2012165801A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed is a copper particulate complex used for preparation of a copper paste, wherein the copper particulate complex is obtained by reacting a copper salt, as a precursor, and formic acid; and the copper particulate complex comprises copper (Cu) and anhydrous copper (II) formate (Cu(COOH)2) having a particle size of 1 μm or less.
PCT/KR2012/004083 2011-05-27 2012-05-23 Copper particulate complex for printed electronics, and copper paste WO2012165801A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110050737A KR101258402B1 (en) 2011-05-27 2011-05-27 Copper Particulate Complex And Copper Paste for Printed Electronics
KR10-2011-0050737 2011-05-27

Publications (2)

Publication Number Publication Date
WO2012165801A2 WO2012165801A2 (en) 2012-12-06
WO2012165801A3 true WO2012165801A3 (en) 2013-01-24

Family

ID=47260030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004083 WO2012165801A2 (en) 2011-05-27 2012-05-23 Copper particulate complex for printed electronics, and copper paste

Country Status (2)

Country Link
KR (1) KR101258402B1 (en)
WO (1) WO2012165801A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102233293B1 (en) * 2014-01-15 2021-03-29 (주)창성 Method for preparing ink composition containing copper formate-amine complex
KR101782799B1 (en) 2015-08-11 2017-09-28 (주)창성 Method for preparation of copper-amine co-complex and conductive ion ink comprising the same and the fine pattern electrode using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100109A (en) * 1989-09-12 1991-04-25 Mitsubishi Gas Chem Co Inc Manufacture of fine copper powder
KR100693970B1 (en) * 2003-02-06 2007-03-12 뷜러 파르텍 게엠베하 Chemomechanical production of functional colloids
JP2007258123A (en) * 2006-03-27 2007-10-04 Sumitomo Metal Mining Co Ltd Conductive composition and conductive film forming method
KR20080032625A (en) * 2007-11-12 2008-04-15 삼성전기주식회사 Method for manufacturing cupper nanoparticles and cupper nanoparticles manufactured using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100109A (en) * 1989-09-12 1991-04-25 Mitsubishi Gas Chem Co Inc Manufacture of fine copper powder
KR100693970B1 (en) * 2003-02-06 2007-03-12 뷜러 파르텍 게엠베하 Chemomechanical production of functional colloids
JP2007258123A (en) * 2006-03-27 2007-10-04 Sumitomo Metal Mining Co Ltd Conductive composition and conductive film forming method
KR20080032625A (en) * 2007-11-12 2008-04-15 삼성전기주식회사 Method for manufacturing cupper nanoparticles and cupper nanoparticles manufactured using the same

Also Published As

Publication number Publication date
KR20120132115A (en) 2012-12-05
WO2012165801A2 (en) 2012-12-06
KR101258402B1 (en) 2013-05-02

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