KR101782799B1 - Method for preparation of copper-amine co-complex and conductive ion ink comprising the same and the fine pattern electrode using the same - Google Patents

Abstract

The present invention relates to a conductive ion ink including a copper-amine co-complex and a method for producing a fine pattern electrode using the same, wherein the copper-amine co-complex has a solubility in a solvent to a copper foamate particle whose surface oxide film is controlled The present invention relates to a conductive ion ink having a structure in which a primary amine to be provided and a secondary amine to control a thermal decomposition rate are complexed with a ligand and has excellent dispersion stability and low temperature sintering property, The present invention provides a technique relating to a method for manufacturing a semiconductor device.

Description

TECHNICAL FIELD The present invention relates to a copper-amine co-complex, a conductive ion ink containing the copper-amine co-complex, and a method for manufacturing a fine pattern electrode using the copper-amine co-complex and the conductive ion ink. same}

The present invention relates to a conductive ion ink including a copper-amine co-complex and a method for producing a fine pattern electrode using the same, and more particularly, to a method for producing a copper-amine co-complex dissolved in a solvent for a conductive ink, A conductive ion ink prepared by using the conductive ion ink, and a method of manufacturing a fine electrode pattern using the same.

BACKGROUND ART [0002] Small electronic devices such as portable telephones, which are rapidly developing in recent years, have become smaller and lighter, and electronic components used in devices are becoming smaller and smaller. Accordingly, the size of the electrode pattern for mounting in the electronic component is gradually reduced, and the line width of the electrode pattern and the pitch between the wirings are also becoming narrow. In addition, the introduction of an electronic device manufacturing process, which is difficult to use a high-temperature heat treatment process such as a plastic substrate in recent years, increases the necessity of a material that can be easily formed by conducting a heat treatment at a low temperature.

Until now, a photo etching method has been widely used to form an electrode pattern. However, the method of forming the electrode pattern by the photolithography method is accompanied by a high manufacturing cost since expensive process steps must be used and complicated process steps must be used. On the other hand, printing electronic technology using conductive ink does not require simple and expensive equipment, so it is possible to reduce the manufacturing cost of the product, and the interest is increasing as a method of replacing the photo etching method.

In order to realize printing technology, the role of metallic ink is important. Particularly, the electrode pattern has the most important characteristic of electric conductivity, and research using silver having excellent electrical characteristics has been carried out. However, it is known that there are many restrictions on the industrial utilization due to the high cost of the raw material itself and migration phenomenon easily occurs.

Therefore, alternatives to copper with low cost and high quality characteristics are required as electronic devices become more sophisticated. However, copper has a problem of being easily oxidized in the atmosphere, and the oxidation film formed by oxidation thereof has a problem in that it is difficult to apply to a flexible substrate such as a plastic by increasing electric resistance and sintering temperature.

In order to improve the low oxidation stability of copper, a method of coating polymer or noble metal material on the surface of the particles has been proposed. However, due to the characteristics of the polymer having a high thermal decomposition temperature, a sintering temperature of 400 ° C or more is required to realize high conductivity , The high unit price of precious metals causes problems in terms of economy. Further, in the production of conductive ink, an organic matter such as a surfactant, a polymer binder and the like is excessively added in order to prevent aggregation of the conductive filler, thereby increasing production cost and resistance.

To solve these problems, a conductive copper ink containing no solid particles has been proposed. In this connection, Korean Patent Laid-Open No. 10-2012-0036476 (hereinafter referred to as " method for producing an ink composition containing copper (II) formate complex ", hereinafter referred to as prior art 1) A copper formate complex which is a copper precursor having excellent acidity is prepared by complexing a copper formate and an amine compound at room temperature under an organic solvent and discloses a technique for producing a copper ink composition containing the complex.

KR 10-2012-0036476

The prior art 1 is characterized in that a copper formate complex prepared by the complexation reaction of a copper formate and an amine-based compound in a copper ink composition is contained as a conductive filler. However, since the copper foil can not sufficiently be dispersed in the above-described constitution, the copper filler may precipitate, and it may be difficult to form a dense copper film under the low-temperature sintering condition, There is a problem.

Accordingly, it is an object of the present invention to provide a novel copper-amine co-complex and a method for producing a conductive copper ink using the copper-amine co-complex. It is another object of the present invention to provide a method for manufacturing a pattern electrode of high quality under low-temperature sintering conditions by controlling a decomposition rate of a copper-amine co-complex.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided a method for preparing a copper compound, comprising: preparing a first solution by mixing a first amine with a polar solvent; adding a copper formate powder to the first solution to form a copper formate- Complexing a copper amine-primary amine with a secondary amine to form a copper-amine co-complex, wherein the primary amine is an alkanolamine, characterized in that the copper- A process for producing an amine co-complex is provided.

Also, the secondary amine of the present invention may include at least one amine selected from the group consisting of primary amines having 1 to 10 carbon atoms and secondary amines having 1 to 10 carbons, The polar solvent may be one or more kinds selected from the group consisting of an alcohol solvent, a glycol solvent and a polyol solvent.

The present invention also relates to a process for producing a copper-amine co-complex comprising, in an amount of 0.1 to 1 part by weight, based on 100 parts by weight of a copper-amine co- complex and 50 to 80% by weight of a copper-amine co- complex, 20 to 50 wt% , A viscosity of 10 to 30000 CPs, and sintering at a temperature ranging from 100 to 300 ° C.

The solvent of the present invention may be one solvent selected from the group consisting of an alcohol solvent, a glycol solvent and a polyol solvent, or a mixture of two or more solvents. The copper-amine co- , And the carboxylic acid may be characterized by containing a carboxylic acid having 1 to 20 carbon atoms.

In addition, the present invention relates to a method of manufacturing a patterned electrode by applying a conductive ion ink to a roll, printing a pattern on one side of the substrate in a roll-to-roll manner, and heat treating the pattern printed substrate in a temperature range of 100 to 300 ° C Wherein the line width is 5 to 20 占 퐉 and the electrical resistance is 10 to 50 占 cm.

The first effect of the present invention is to reduce the cost of the conductive ink by replacing expensive silver particles used as a conventional metal filler for conductive ink. The first effect is that the metal filler of the conductive ink is composed of alkanolamine and secondary amine The second effect is that the oxidation stability of the copper particles and the dispersion stability with respect to the solvent can be sufficiently secured by applying the complexed copper-amine co-complex, the sintering at a constant decomposition rate at a low temperature and a high filling density The third effect is that a high-quality electrode can be manufactured by forming a copper thin film having a desired thickness and a physical property suitable for a roll-to-roll process.

The copper-amine co-complex according to the present invention is present in a state dissolved in the composition for a conductive ink, so that it does not cause aggregation between the copper particles and has excellent wettability with the roll-to-roll printing blanket. In addition, since the ligands complexed with copper formate (primary amines and secondary amine complexes) are thermally decomposed at a constant rate under low-temperature sintering conditions, a copper thin film having a high filling density after reduction and sintering is formed, Which is advantageous.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a graph showing a TGA analysis result of a copper-amine co-complex prepared according to an embodiment of the present invention.
2 is a SEM photograph of a conductive ion ink prepared according to an embodiment of the present invention after heat treatment.
3 is a 3D micrograph of a fine pattern electrode prepared by reverse offset printing of a conductive ion ink prepared according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" (connected, connected, coupled) with another part, it is not only the case where it is "directly connected" "Is included. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, the present invention will be described in detail with reference to the drawings. Also, in this specification, a form in which compounds having different characteristics are complexed to copper formate is defined as " co-complex ".

The present invention relates to a process for producing a copper-amine co-complex for a conductive ion ink, comprising the steps of: i) mixing a first amine with a polar solvent to prepare a first solution, ii) adding a copper formate powder to the first solution To form a copper-amine-complex; and iii) complexing the copper-formate-first amine complex with a second amine to form a copper-amine co-complex.

Hereinafter, a method for producing a copper-amine co-complex for a conductive ion ink will be described in detail in a step-by-step manner.

In the step i) of the present invention, the polar solvent may be one solvent selected from the group consisting of an alcohol solvent, a glycol solvent and a polyol solvent, or a mixed solvent containing two or more solvents. Specific examples thereof include, but are not limited to, isopropyl alcohol, methanol, ethanol, propanol, butanol, ethylene glycol, polyethylene glycol, butyl carbitol acetate, terpineol and the like.

Also, in the present invention, the primary amine may be an alkanolamine. Specific examples of the alkanolamine include 1-amino-2-methylpropan-2-ol, N-methylethanolamine, N-ethylethanolamine, N-propylethanolamine, N-butylethanolamine, Diisopropanolamine, diisopropanolamine, triisopropanolamine, N-methylisopropanolamine, N-ethylisopropanolamine, N-propylisopropanolamine, 2-aminopropane-1-ol, N-methyl- 1-ol, N-methyl-1-aminopropane-3-ol, N-ethyl-1-amino 2-ol, N-methyl-1-aminobutan-2-ol, N-ethyl-1-aminobutan- 1-ol, N-methyl-3-aminobutan-1-ol, N- 1-aminobutan-4-ol, N-methyl-1-aminobutan-4-ol, N-ethyl- 2-methylpropan-1-ol, 2-amino-4-methylpentan-1-ol, 2-aminohexan- Ol, 1-aminopropane-1,3-diol, tris (oxymethyl) aminomethane, 1,2-diaminopropane-3-ol, 1,3-diaminopropane-2-ol, and 2- (2-aminoethoxy) ethanol.

Next, step ii) of the present invention is a step of preparing a complex with copper formate-primary amine by adding copper formate powder to the first solution. In the present invention, the copper formate powder can be produced by reacting a copper salt including copper oxide, copper hydroxide, copper nitrate, copper sulfate, copper chloride, and copper acetate with a formic acid. At this time, the average particle diameter of the copper formate particles may be preferably 1 占 퐉 or less. In order to ensure the oxidation stability of the copper particles which are easily oxidized in the air, the copper formate particles are encapsulated particles. In addition, in the present invention, in order to provide solubility in the solvent for the conductive ink, alkanolamines are added to the copper formate particles as ligands To prepare a copper formate-primary amine complex. The amino group contained in the alkanolamine combines with the copper formate to form a copper formate-primary amine complex. In addition, the alcoholic hydroxyl group contained in the alkanolamine can provide an affinity with a polar solvent, thereby making it possible to manufacture a conductive ink having ensured dispersion stability.

Next, step iii) of the present invention is a step of preparing a copper-amine co-complex by complexing a copper amine-first amine complex with a second amine. In the present invention, the second amine is sintered at a constant decomposition rate under low temperature conditions, thereby contributing to formation of a copper thin film having a high filling density. The copper-amine co-complex in which the decomposition rate is controlled by the complexation of the second amine can be reduced to copper particles having a smaller particle size during sintering at 100 to 300 ° C to lower the interface resistance between the copper particles, So that it is possible to form electrodes having uniform and excellent electrical characteristics.

In the present invention, the secondary amine may be at least one selected from the group consisting of primary amines having 1 to 10 carbons and secondary amines having 1 to 10 carbons, But are not limited to, hexylamine, octylamine, dibutylamine, triethylamine, ethylenediamine, cyclohexylamine. However, in the case of an amine compound having 10 or more carbon atoms, the dispersion stability of the copper-amine co-complex may be deteriorated, and the electrode may not be completely sintered at a low temperature, so that it may be difficult to produce a high quality electrode. In addition, step iii) of the present invention may be carried out at a temperature ranging from 20 to 60 占 폚. If the reaction temperature is lower than 20 ° C, the reaction time may become longer and the complexation reaction may be difficult. If the reaction temperature is higher than 60 ° C, the stability of the reaction product can not be secured and volatilization of the solvent may be accelerated, .

In addition, the present invention may further comprise, after the step iii), drying the copper-amine co-complex in the solution phase to obtain a copper-amine co-complex powder, Any method can be used for. Unreacted materials may be removed from the solution through the drying process, which may enable the production of conductive ink of high purity and high quality.

Next, the present invention provides a conductive ion ink comprising a copper-amine co-complex prepared by the above method, comprising 50 to 80 wt% of a copper-amine co-complex, 20 to 50 wt% of a solvent, Amine co-complex and 0.1 to 1 part by weight of carboxylic acid as a main component with respect to 100 parts by weight of the solvent, and may further include a binder resin to increase the adhesiveness to the substrate. Hereinafter, the conductive ion ink of the present invention will be described in detail with respect to each composition in the manner described above.

The copper-amine co-complex of the present invention is characterized in that the first amine and the second amine are complexed and soluble in a polar solvent. Therefore, no agglomeration phenomenon of the metal filler occurs and no separate pulverization process such as milling and a dispersant are required. In addition, the conductive ion ink of the present invention may include, but is not limited to, a copper-amine co-complex of 50 to 80 wt%. However, when the copper-amine co-complex is contained in an amount of less than 50 wt%, the amount of the copper filler that provides the coating film property is insufficient and it may be difficult to achieve the desired electrical conductivity. When the amount exceeds 80 wt% The amount is relatively decreased and the viscosity is excessively increased, which may make the roll-to-roll printing process difficult.

In the present invention, the solvent may be one solvent selected from the group consisting of an alcohol solvent, a glycol solvent and a polyol solvent, or a mixture of two or more solvents. However, the solvent is not limited to the above-mentioned specific solvent, and any solvent may be used as long as it is a solvent capable of dissolving the copper-amine co-complex and excellent in wettability to the roll ruple printing blanket. When the solvent content is less than 20 wt%, the ink may not be sufficiently wetted with respect to the blanket during the roll-to-roll printing process, so that printing may be difficult. When the solvent content is less than 50 wt% , The content of the copper filler is relatively low and it may be difficult to realize the desired electrical conductivity.

The conductive ion ink of the present invention may further contain 0.1 to 1 part by weight of carboxylic acid per 100 parts by weight of the copper-amine co-complex and the solvent. The carboxylic acid may be a carboxylic acid having 1 to 20 carbon atoms, and specific examples thereof include formic acid, acetic acid, propionic acid, butyric acid, and lauric acid. The carboxylic acid has a high solubility in a solvent and maintains a liquid state at room temperature, thereby improving the dispersion stability of the conductive ink and forming a dense copper thin film. However, if the number of carbon atoms of the carboxylic acid exceeds 20, the length of the hydrophobic chain may increase, and the thermal decomposition temperature may increase, so that the low temperature sintering may be difficult, and the dispersibility to the polar solvent may be deteriorated. When the content of the carboxylic acid in the conductive ink is less than 0.1 parts by weight, the effect of adding the carboxylic acid may be insufficient. When the content of the carboxylic acid exceeds 1 part by weight, the content of the organic material increases, As the density is lowered, it may be difficult to realize excellent conductivity.

In addition, the composition of the conductive ion ink comprising the copper-amine co-complex according to the present invention has properties suitable for a roll-to-roll printing process. One of the physical properties to be given priority in the roll-to-roll printing process is viscosity, and the viscosity of the conductive ion ink according to the present invention is 10 to 30000 CPs. The viscosity of the conductive ion ink may vary depending on the content of the composition. However, when the viscosity is less than 10 Cps, it means that the content of the conductive filler is relatively low, so that it is difficult to realize a high electric conductivity and the viscosity exceeds 30000 Cps It is difficult to uniformly apply the ink, and the pattern formed on the roll may not be completely printed on the substrate. The conductive ion ink according to the present invention is characterized in that it is sintered at a temperature of 100 to 300 ° C to form a copper thin film having a high filling density. In the prior art, when the metal filler dispersed in the ink is sintered, the high-temperature firing at 400 DEG C or more is required to completely decompose the organic substances added to the ink. However, the conductive ion ink according to the present invention is sintered at a relatively low temperature, In addition, it can be applied to plastic substrates.

In addition, the conductive ion ink of the present invention may further comprise a polymer binder at a predetermined ratio. By adding a polymer binder, a viscosity suitable for various types of roll-to-roll printing processes such as a gravure printing method, a gravure offset printing method, a reverse printing method, a reverse offset printing method and the like can be given, It is possible to induce an effect of improving the durability of the battery. The binder may be added in an amount of less than 10 parts by weight based on 100 parts by weight of the total ink composition in consideration of the rheology characteristic suitable for the printing method, the electrical conductivity of the conductive ink, and the manufacturing cost. However, It is specified that the binder resin may not be added according to the embodiment.

 Further, the present invention provides a method for producing a fine pattern electrode using a conductive ion ink including the copper-amine co-complex. The present invention relates to a method of manufacturing a fine pattern electrode, comprising the steps of applying a conductive ion ink to a roll, printing a pattern on one side of the substrate in a roll-to-roll manner, heat treating the substrate on which the pattern is printed, Wherein the line width of the pattern formed on the pattern electrode according to the present manufacturing method is 5 to 20 占 퐉 and the electrical resistance of the pattern electrode is 10 to 50 占 cm. In addition, the step of heat treatment in the present production method may be performed for a predetermined time at a temperature range of 100 to 300 ° C.

In one embodiment of the present invention, the roll-to-roll process may be a reverse offset printing method, and a method of manufacturing a fine pattern electrode using a reverse offset printing method will be described in detail. First, a step of applying a conductive ion ink to a blanket for reverse offset, a step of patterning the blanket applied with ink onto a cliche provided with an inverted shape of the pattern, and printing the pattern on a substrate, Can be manufactured. At this time, the method of applying ink is not limited to the slit die coating method, the doctor blade method, and the like.

Hereinafter, the effect induced by the addition of the second amine for controlling the decomposition rate will be described with reference to Examples and Experimental Examples.

[Example 1]

≪ Preparation of Cu-formate / AMP + (i) amine >

After 260 mmol of 2-amino-2-methylpropanol (AMP) was completely dissolved in 1 L of methanol, 130 mmol of anhydrous copper formate powder (molar ratio of amine to copper = 2: 1) was added and stirred for 3 hours. Respectively. Then, the second amine (I) was added at the same mole number (260 mmol) as the AMP, and the complexation reaction was carried out by stirring at 40 ° C for 3 hours. The copper-amine co-complex on the solution prepared through the above reaction was dried in a vacuum oven set at 60 캜 for 8 hours to prepare a copper-amine co-complex powder. Wherein the secondary amine (I) is a primary amine compound having 1 to 5 carbon atoms.

≪ Preparation of conductive ion ink including copper-amine co-complex >

300 g of the copper-amine co-complex (Cu formate / AMP + (i) amine) powder prepared by the above method was added to 130 g of isopropyl alcohol as a solvent and stirred to prepare a mixed solution. Thereafter, 0.3 part by weight of citric acid was mixed with 100 parts by weight of the mixed solution to prepare a conductive ion ink.

[Example 2]

≪ Preparation of Cu-formate / AMP + (ii) amine >

A copper-amine co-complex was prepared under the same conditions as in Example 1 except that the second amine (II) (primary amine compound having 6 to 10 carbon atoms) was used.

& Lt; Preparation of conductive ion ink including copper-amine co-complex >

A conductive ion ink was prepared under the same conditions as in the method of producing the conductive ion ink of Example 1, except that the copper-amine co-complex (Cu formate / AMP + (ii) amine) .

≪ Preparation of fine pattern electrode using conductive ion ink >

The conductive ion ink prepared by the above method was printed on a substrate by a reverse offset printing method to produce a pattern electrode. First, a conductive ion ink was applied to a blanket using a spin coater, printed on a polyimide substrate, and heat treated at 300 ° C for 30 minutes under a nitrogen atmosphere to prepare a patterned electrode.

[Example 3]

Preparation of copper-amine-complex (Cu formate / AMP + (iii) amine)

A copper-amine co-complex was prepared under the same conditions as in Example 1, except that the secondary amine (III) (secondary amine compound having 6 to 10 carbon atoms) was used.

≪ Preparation of conductive ion ink including copper-amine co-complex >

Conductive ion inks were prepared under the same conditions as those of the conductive ion ink of Example 1, except that the copper-amine co-complex (Cu formate / AMP + (iii) amine) prepared in Example 3 was used .

[Comparative Example 1]

≪ Preparation of copper formate-primary amine complex (Cu formate / AMP) >

A first amine complex was prepared under the same conditions as in Example 1, except that the second amine was not added to perform the complexation reaction.

≪ Preparation of conductive ion ink containing copper formate-primary amine complex >

Conductive ion inks were prepared under the same conditions as in the preparation of the conductive ion ink of Example 1, except that the complex (Cu formate / AMP) prepared according to Comparative Example 1 was used.

[Experimental Example 1]

< Analysis of Pyrolysis Behavior of Copper Complex>

TGA analysis was performed to evaluate the pyrolysis behavior of the copper-amine co-complexes prepared according to Examples 1 to 3 and the copper formate-first amine complexes prepared according to Comparative Example 1. The results are shown in FIG. 1, and the effect of the second amine will be described with reference to FIG. Referring to FIG. 1, it can be seen that the weight loss of the complex (Cu formate / AMP) according to Comparative Example 1 occurs rapidly from around 150 ° C. Compared with this, the copper-amine co-complex according to Examples 1 and 3 was found to start pyrolysis starting from a lower temperature of around 60 ° C, and it was confirmed that weight loss occurred more slowly than Comparative Example 1 . In addition, the copper complexes of Comparative Example 1 and Examples 1 and 2 showed almost no weight loss at 170 ° C, indicating complete reduction at around 170 ° C. The copper-amine co-complex according to Example 3 was found to exhibit pyrolysis behaviors different from those of Examples 1 and 2 in that the primary amine was reacted with the secondary amine in Examples 1 and 2, Example 3 can be seen as a result of complexation of a secondary amine.

& Lt; Analysis of sintering characteristics of conductive ion ink &

In order to evaluate the sintering characteristics of the conductive ion ink prepared according to Comparative Examples 1 and 2, the conductive ion ink was coated on the substrate and then heat-treated at 300 DEG C for 30 minutes under a nitrogen atmosphere. . FIG. 2 (a) is an SEM photograph of Comparative Example 1, and FIG. 2 (b) is an SEM photograph of Example 2. FIG. Referring to these results, it can be seen that Comparative Example 1 has a large particle size distribution and a large number of defects between copper particles. On the other hand, it can be confirmed that the copper particles having small and uniform particle size are formed in Example 2, and that void spaces between the particles are much smaller than those in Comparative Example 1. When the conductive ion ink is sintered, the organic substances added to the copper and the organic substances added to the conductive ion ink are decomposed to form a copper thin film. At this time, the empty space between the particles means that the electrical path is disconnected, which may cause a decrease in the electrical conductivity. In order to confirm this, the electrical resistance of the copper film according to Comparative Examples 1 and 2 was measured. The electrical resistance of Comparative Example 1 was found to be 1.3 * 10 ² μΩcm, and the electrical resistance of Example 2 was found to be 12.7 μΩcm.

<Microscopic Analysis of Pattern Electrode>

A 3D microscopic observation was carried out to analyze the surface of the pattern electrode manufactured in accordance with Example 2. 3D microscopic observation was performed using KEYENCE (VK-X200 Series), and the results are shown in FIG. 3 is an image showing a part of the pattern electrode output through 3D microscopic observation. Referring to this, it was confirmed that the line width of the pattern electrode according to the second embodiment is about 13 mu m.

According to the above experimental results, it is possible to sinter at a low temperature by preparing a copper-amine co-complex by complexing a second amine with a copper-formate-first amine complex secured with oxidation stability and dispersion stability, Can be reduced to smaller and uniform copper particles, thereby contributing to formation of a copper thin film having a high filling density, and it is possible to manufacture a high quality electrode and electrode pattern.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

Claims (17)

A method for producing a copper-amine co-complex for a conductive ion ink,
i) mixing a first amine with a polar solvent to produce a first solution;
ii) adding a copper formate powder to the first solution to produce a copper formate-primary amine complex;
iii) complexing the copper formate-primary amine complex with a secondary amine to produce a copper-amine co-complex; Lt; / RTI &gt;
Wherein the first amine is an alkanolamine. &Lt; Desc / Clms Page number 20 &gt;
The method according to claim 1,
Wherein said second amine comprises at least one amine selected from the group consisting of primary amines having 1 to 10 carbons and secondary amines having 1 to 10 carbons. For the production of copper - amine co - complexes.
The method according to claim 1,
Wherein the second amine comprises at least one amine compound selected from the group consisting of butylamine, hexylamine, octylamine, dibutylamine, triethylamine, ethylenediamine, cyclohexylamine, For the production of copper - amine co - complexes.
The method according to claim 1,
The alkanolamine may be selected from the group consisting of 1-amino-2-methylpropan-2-ol, N-methylethanolamine, N-ethylethanolamine, N-propylethanolamine, N-butylethanolamine, N-methyldiethanolamine, N Diisopropanolamine, triisopropanolamine, N-methylisopropanolamine, N-ethylisopropanolamine, N-propylisopropanolamine, 2-aminopropane-1-ol, N-methyl- 1-ol, N-methyl-1-aminopropane-3-ol, N-ethyl-1-aminopropane Ol, N-methyl-1-aminobutan-2-ol, N-ethyl-1-aminobutan- 2-aminobutan-1-ol, N-methyl-3-aminobutan-1-ol, N- ethyl Aminobutan-4-ol, N-methyl-1-aminobutan-4-ol, N-ethyl- Ol, 2-amino-4-methylpentan-1-ol, 2-aminohexan-1-ol, 3-aminoheptan- 1-aminopropane-1,3-diol, tris (oxymethyl) aminomethane, 1, 2-diaminopropane-3-ol, 1,3-diaminopropane-2-ol and 2- (2-aminoethoxy) ethanol. A process for producing copper-amine co-complexes for inks.
The method according to claim 1,
Wherein the polar solvent includes one solvent selected from the group consisting of an alcohol solvent, a glycol solvent, and a polyol solvent, or a mixed solvent composed of two or more kinds of copper-amine co-complexes &Lt; / RTI &gt;
The method according to claim 1,
Wherein the step iii) is performed at a temperature ranging from 20 to 60 &lt; 0 &gt; C.
The method according to claim 1,
Further comprising, after the step iii), drying the solution of step iii) to obtain a copper-amine co-complex powder.
In a conductive ion ink comprising a copper-amine co-complex produced by the process of claim 1,
50 to 80 wt% copper-amine co-complex; And
20 to 50 wt% of a solvent,
Wherein the copper-amine co-complex further comprises 0.1 to 1 part by weight of carboxylic acid based on 100 parts by weight of the copper-amine co-complex and the solvent.
The method of claim 8,
Wherein the conductive ion ink has a viscosity of 10 to 30,000 CPs.
The method of claim 8,
Wherein the conductive ion ink further comprises a binder resin for enhancing adhesion. &Lt; RTI ID = 0.0 &gt; 11. &lt; / RTI &gt;
The method of claim 8,
Wherein the solvent comprises at least one solvent selected from the group consisting of an alcohol solvent, a glycol solvent and a polyol solvent, or a mixed solvent composed of two or more kinds thereof, and the conductive ion ink including a copper-amine co- .
The method of claim 8,
Wherein the copper-amine co-complex is soluble in the solvent. &Lt; RTI ID = 0.0 &gt; 11. &lt; / RTI &gt;
The method of claim 8,
Wherein the carboxylic acid comprises a carboxylic acid having from 1 to 20 carbon atoms. &Lt; RTI ID = 0.0 &gt; 11. &lt; / RTI &gt;
The method of claim 8,
Wherein the conductive ion ink is sintered at 100 to 300 占 폚.
A method of manufacturing a fine pattern electrode using a conductive ion ink according to any one of claims 8 to 14,
i) applying the conductive ion ink to a roll;
ii) printing a pattern on one side of the substrate by a roll-to-roll method;
iii) heat treating the substrate on which the pattern is printed to produce a patterned electrode; , &Lt; / RTI &gt;
Wherein the line width of the pattern formed on the pattern electrode is 5 to 20 占 퐉.
16. The method of claim 15,
Wherein the step iii) is performed at a temperature of 100 to 300 &lt; 0 &gt; C for a predetermined period of time.
16. The method of claim 15,
Wherein the fine pattern electrode has an electrical resistance of 10 to 50 mu OMEGA cm.

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