WO2012164631A1

WO2012164631A1 - Semiconductor print test method, program, and device for same

Info

Publication number: WO2012164631A1
Application number: PCT/JP2011/003162
Authority: WO
Inventors: 弘平佐藤; 白石　一成
Original assignee: 上野精機株式会社
Priority date: 2011-06-03
Filing date: 2011-06-03
Publication date: 2012-12-06
Also published as: JPWO2012164631A1; JP5881087B2

Abstract

The present invention contributes to improving yield during print testing by using, as an original image, a model print prepared from a plurality of print images. A model-print-preparing unit (35) prepares a model print by performing an image-averaging process or a standard-deviation process using a plurality of print images arranged in print positions by a repositioning unit (34). A determination-data-calculating unit (37) compares image data of test prints acquired by a print-image-acquiring unit (33) and image data of model prints registered by a model-print-registering unit (36), and thereby calculates determination data of individual test prints. A print-determining unit (38) holds a determination-reference threshold in association with the determination data, the determination data on each test print is contrasted with the threshold, and an evaluation is made as to whether or not a test print is satisfactory.

Description

Semiconductor print inspection method, program, and apparatus

The present invention relates to a semiconductor print inspection method, a program, and an apparatus thereof for judging good / bad prints engraved on a surface of a semiconductor element by a laser or the like.

Generally, in a semiconductor manufacturing apparatus, a marking unit is provided as a processing unit for marking a surface of a semiconductor element. Since the marking unit imprints the type, product number, and the like with a laser or the like, if there is variation in the orientation of the semiconductor element or the laser emission angle, the shape or position of the printing will be shifted accordingly. Therefore, conventionally, a print inspection has been performed in which the appearance of a print such as the shape and position of the print is inspected to determine whether the stamped print is good or bad (for example, Patent Document 1).

In recent years, semiconductor devices have become smaller in size, and the size of printed marks has also become smaller. When the print size is small, the appearance of the print is easily affected by variations in the orientation of the semiconductor element and the laser emission angle. Therefore, the print inspection technology is in a situation of increasing difficulty. For this reason, there is a need for a print inspection technique with excellent inspection accuracy and efficiency.

Here, a conventional semiconductor printing inspection apparatus will be specifically described with reference to FIGS. FIG. 3 is a schematic plan view of the semiconductor manufacturing apparatus, and FIG. 4 is a conceptual diagram for explaining the semiconductor printing inspection apparatus. A print stamped on a semiconductor package usually consists of a plurality of character strings, but in FIG. 4, it is simplified and represented by only one letter “A”.

[Outline of semiconductor manufacturing equipment]
First, an outline of a semiconductor manufacturing apparatus will be described with reference to FIG. As shown in FIG. 3, the semiconductor manufacturing apparatus is provided with a turntable 11 for transporting the semiconductor package 1 in the circumferential direction. In the vicinity of the outer periphery of the turntable 11, a marking unit 2 for marking printing on the semiconductor package 1 by a laser is disposed.

Further, a print inspection unit 3 is arranged on the outer periphery of the turntable 11 adjacent to the marking unit 2. The print inspection unit 3 is a semiconductor print inspection apparatus that determines whether the marking printed on the semiconductor package 1 by the marking unit 2 is good or bad. In addition to these

units

2 and 3, a plurality of processing units for the semiconductor package 1 such as an inspection processing unit for energization performance are arranged on the outer periphery of the turntable 11, but illustration is omitted here.

[Configuration of print inspection unit]
As shown in FIG. 4, the print inspection unit 3 is provided with a print image acquisition unit 30 and an original image registration unit 31. The print image acquisition unit 30 is a part that acquires a print image on each semiconductor package 1 via a camera or the like. The original image registration unit 31 is a part that registers a print image selected by the inspector from among the prints imprinted by the marking unit 2 in a predetermined storage area as an original image. Hereinafter, the print to be inspected is referred to as inspection print, and the image of the inspection print is referred to as inspection image. The image data in the original image and the inspection image includes information such as a printing area and range, a printing position on the semiconductor package 1 and the like.

A determination data calculation unit 32 is connected to the print image acquisition unit 30 and the original image registration unit 31, and a print determination unit 33 is connected to the determination data calculation unit 32. The determination data calculation unit 32 is a part that calculates determination data (specific examples will be described later) for inspection printing. The determination data is data that is a determination material for inspection printing, and compares the print image data acquired by the print image acquisition unit 30 with the image data of the original image registered in the original image registration unit 31. Is calculated by The print determination unit 33 has a threshold value serving as a determination criterion for the determination data, and is a portion that determines whether the inspection print is good or bad by comparing the determination data in each inspection print with the threshold value. .

[Pre-processing for print inspection]
Before starting the actual print inspection work, the following pre-processing is performed. First, the person inspecting the inspection selects one print to be the original image from the prints engraved by the marking unit 2. The print that is the original image is a print that the inspection person thinks is appropriate as a print that is a reference for good / bad. The original image registration unit 31 registers the original image selected by the person in charge of inspection before the actual print inspection.

The determination data calculation unit 32 calculates the determination data at the time of actual print inspection work. As preparation, the image data of the original image registered in the original image registration unit 31 is read into a predetermined work area. deep. Further, a threshold value corresponding to the determination data calculated by the determination data calculation unit 32 is set in the print determination unit 33 in advance. After the original image registration unit 31 registers the original image selected by the inspector and the determination data calculation unit 32 reads the image data of the original image into a predetermined work area, the print image acquisition unit 30 The acquired print image is sent to the determination data calculation unit 32 without going through the original image registration unit 31.

[Print inspection]
In the actual print inspection, first, the print image acquisition unit 30 acquires an image of each inspection print stamped on the semiconductor package 1. Subsequently, the determination data calculation unit 32 takes in the image data of the inspection print acquired by the print image acquisition unit 30, and uses this image data and the image data of the original image read in advance for each inspection print. Data for determination is calculated.

As specific determination data, there are a difference area of the inspection image with respect to the original image, a shift amount of the position of the inspection image with respect to the original image (X-axis direction, Y-axis direction, rotation angle θ), and the like. Further, in a technique called correlation matching (shading matching), the similarity of pixel luminance at the same position in the original image and the inspection image is scored and used as determination data. That is, the similarity score is obtained by scoring the similarity of the pixel brightness of the inspection image with respect to the pixel brightness of the original image to 0 to 100 (%).

Since the print determination unit 33 has a threshold value corresponding to the determination data, the print determination unit 33 checks the inspection print determination data to determine whether the inspection print is good or bad. For example, if the similarity score threshold is 50 (%), the print determination unit 32 determines that the test print is a non-defective print if the similarity score exceeds 50 (%), and the similarity score is 50 ( %), The inspection print is judged as defective print.

The print determination unit 33 as described above can determine the inspection print similar to the print that has become the original image as the non-defective print. For this reason, the shape and position of the print determined to be non-defective printing have little difference from the original image, and the non-defective print is uniform. Therefore, stable print inspection accuracy can be ensured.

FIG. 4 shows four examples in which the print determination unit 33 determines that the print is defective and three examples in which it is determined that the print is good. In the example of the printing failure shown in FIG. 4, “printing is faint and the difference area is large”, “similarity score regarding the luminance of each pixel at the same position”, “printing position is shifted in order from the left side. "Inspection printing is determined to be a printing failure for reasons such as" the lines constituting the printing are thin ". The semiconductor package 1 that is determined to be defective by the print determination unit 33 is discharged as a defective product from the conveyance line of the turntable 11 and is automatically discarded.

Japanese Patent Publication No. 2007-184658

As already described, since there is a variation in the posture of the semiconductor element, it is inevitable that the marking printed on the semiconductor element will vary. In the conventional print inspection technology, the inspector selects one print as the original image from among the prints with variations. Therefore, the variation in the original image selected by the inspector greatly increases the quality of the print. It can't be denied that it depends. In other words, the print selected by the inspector is the basis for determining good / bad, so the determination rate of good / bad changes depending on the original image selected by the inspector, and the yield may vary. was there.

Therefore, conventionally, in order to ensure a desired yield, it is important to select an original image by an inspector or to set a threshold value as a judgment criterion, and adjustment work for the print inspection including the above-described work is indispensable. It has become. However, in the process of adjustment work for print inspection, several tens to several hundreds of semiconductor elements must be discarded because of defect determination due to insufficient adjustment. Therefore, the yield was reduced. In addition, since adjustment work for the print inspection is performed by the inspector, the print to be selected may be different if the inspector changes, and the subjective judgment of the inspector has a great influence on the yield.

The present invention has been proposed in order to solve the above-mentioned problems, and the object of the present invention is to perform a high-quality print inspection by creating an original image that is located at the center of variation from a plurality of print images. An object of the present invention is to provide a semiconductor printing inspection method and program that can be performed stably and contribute to an improvement in yield, and an apparatus therefor.

In order to achieve the above object, according to the present invention, in a semiconductor print inspection method for inspecting a print imprinted on a surface of a semiconductor element, an image of the print is obtained from a plurality of semiconductor elements before performing the print inspection. Print image acquisition step, and model print creation step of performing model processing that is a virtual print from the plurality of print images by performing averaging processing or standard deviation processing of the plurality of print images acquired in the print image acquisition step And a model print registration step for registering the model print created in the model print creation step as an original image, and at the time of print inspection, the print image data acquired in the print image acquisition step and the model print registration step Data for each inspection print to be inspected by comparing with the image data of the model print registered in A determination data calculating step of calculating for and is characterized in that it comprises a printing determination step determines the good or defective of the inspection printing based on the determination data for each test print. The present invention can also be understood as a semiconductor print inspection apparatus or a semiconductor print inspection program that implements the above-described print inspection method.

In the present invention as described above, an average process or a standard deviation process is performed on a plurality of print images to create a model print that cancels the variation of each print image, and this is used as an original image. For model printing with little variation, there are many inspection printings that are close to this, and defective products are reduced and yield is improved.

Further, in the present invention, since the yield is high, adjustment work is not required only by using the model print image as the original image. Therefore, the semiconductor element is not discarded for the reason of defect determination due to insufficient adjustment, thereby further improving the yield. Moreover, there is no room for the subjectivity of the inspector to enter when determining the original image. Accordingly, it is possible to suppress a problem that the yield varies for each person in charge of inspection.

According to the semiconductor print inspection method and program and apparatus therefor according to the present invention, the yield during print inspection is determined by determining whether the print is good or bad with the model print subjected to the averaging process or the standard deviation process as the original image. The yield can be greatly improved and the yield can be stabilized.

The conceptual diagram of typical embodiment of this invention. The flowchart of this embodiment. The top view of the conventional semiconductor manufacturing apparatus. The conceptual diagram of the conventional semiconductor printing inspection apparatus.

(1) Representative Embodiments Hereinafter, representative embodiments according to the present invention will be specifically described with reference to FIGS. 1 and 2. FIG. 1 is a conceptual diagram of this embodiment, and FIG. 2 is a flowchart of this embodiment. Further, the same members as those in the conventional example shown in FIGS. 3 and 4 are denoted by the same reference numerals, and the description thereof is omitted.

[Constitution]
As shown in FIG. 1, the print inspection unit 3 according to the present embodiment includes a print image acquisition unit 30, a position correction unit 34, a model print creation unit 35, a model print registration unit 36, and a determination data calculation unit. 37, a print determination unit 38, and a defective product discharge control unit 39. Among these, the print image acquisition unit 30 acquires print images for one turn (ten to several tens) of the turntable 11 before starting the actual print inspection work, and sends the image data to the position correction unit 34. To send.

The position correction unit 34 is a part that performs a process of correcting the position of the print position and aligning the print position for each print image acquired by the print image acquisition unit 30 before starting the actual print inspection work. By aligning the print positions by the position correction unit 34, it is possible to smoothly perform the averaging process or standard deviation process of the image by the model print creation unit 35.

The model print creation unit 35 is the main part of the present embodiment, and the position correction unit 34 actually performs image averaging processing or standard deviation processing on a plurality of print images whose print positions are aligned. It is a part that creates model prints that are virtual prints, not stamped prints.

The image averaging process is a process of adding all the luminances of pixels at the same position in the image and averaging them. The standard deviation process is a process for emphasizing only the central area of the image by the standard deviation. The model print creation by the model print creation unit 35 is performed before the print inspection.

The model print registration unit 36 is a part for registering the model print created by the model print creation unit 35 as an original image. The original image data registered in the model print registration unit 36 includes information such as the print area and print range of model print, and the print position of model print on the semiconductor package 1. Registration by the model print registration unit 36 is also performed before the print inspection.

That is, in this embodiment, before carrying out the actual print inspection, a print image acquisition step by the print image acquisition unit 30, a position correction step by the position correction unit 34, and a model print generation step by the model print generation unit 35 A model print registration step is performed by the model print registration unit 36.

The determination data calculation unit 37 is a part for calculating determination data for inspection printing, as in the prior art. The determination data calculation unit 37 calculates the determination data at the time of the actual print inspection work. In preparation, the determination data calculation unit 37 reads the model print image data registered in the model print registration unit 36 into a predetermined work area. After the model print registration unit 36 registers the model print created by the model print creation unit 35 as an original image and the determination data calculation unit 37 reads the image data of the model print into a predetermined work area, the print image The acquisition unit 30 sends the acquired print image to the determination data calculation unit 37 without passing through the position correction unit 34 and the model print creation unit 35.

When the actual print inspection is performed, the determination data calculation unit 37 uses the inspection print image data acquired by the print image acquisition unit 30 and the model print image data registered in the model print registration unit 36. By comparison, the following four determination data are calculated for each inspection print. As the determination data, the similarity score in the correlation matching (shading matching) method, the difference area between the model print and the test print, the amount of deviation of the test print position from the model print (X-axis direction and Y-axis direction), the model The presence / absence of a discolored portion in the area outside the print range is calculated. Note that the area of the discolored portion may be measured for the presence or absence of the discolored portion.

The print determination unit 38 has a threshold value serving as a determination criterion for the determination data, and is a part for determining whether the inspection print is good or bad by comparing the determination data in each inspection print with this threshold value. . More specifically, the print determination unit 38 sequentially determines the quality of the inspection print for the four determination data, and only when all the determination data satisfies the corresponding threshold, the inspection print Is determined as non-defective printing.

In the print determination unit 38, the threshold value serving as a determination criterion in the determination data is 50 (%) for the similarity score, ± 30% for the difference area between the model print and the inspection print, and X for the amount of deviation of the inspection print position. In the axial direction and the Y-axis direction, within ± 100 μm, the presence or absence of a discolored portion. Note that, when the area of the discolored portion is measured by the determination data calculation unit 37, the reference discoloration area is set in the print determination unit 38. However, it goes without saying that these values can be adjusted as appropriate by the person in charge of inspection.

As described above, in this embodiment, a print image for creating a model print is acquired for one turn (ten to several tens) of the turntable 11. Therefore, if the defective semiconductor package 1 is discharged from the transport line during the image acquisition process, the influence on the yield is great. Therefore, in the present embodiment, the defective product discharge control unit 39 prohibits the discharge of defective products from the transport line until the registration of the model print is completed from the acquisition of the print image, and the transport after the start of the actual print inspection. Resume defective products from the line. *

[Action]
Next, an example of the print inspection process according to the present embodiment will be specifically described with reference to the flowchart of FIG.
(A) Before the actual print inspection process is started In this embodiment, before starting the actual print inspection process, the defective product discharge control unit 39 for model printing controls the conveyance line so that the defective product is not discharged. Defective product discharge from the transfer line is prohibited (non-discharge step of defective product by defective product discharge control, ST101).

Therefore, the turntable 11 transports the semiconductor package 1 without discharging it while holding the semiconductor package 1. In this state, the print image acquisition unit 33 acquires the print images of all the semiconductor packages 1 for one turn held by the turntable 11 (print image acquisition step, ST102).

Next, the position correction unit 34 aligns the print positions of the print image acquired by the print image acquisition unit 30 (print position correction step, ST103), and a model print creation unit for a plurality of print images having the same print position. 35 performs image averaging processing or standard deviation processing to create a model print (model print creation step, ST104). Further, the model print registration unit 36 registers the model print as an original image (model print registration step, ST105).

(B) Actual Print Inspection As described above, the print image acquisition step by the print image acquisition unit 30, the position correction step by the position correction unit 34, the model print creation step by the model print creation unit 35, and the model print registration After performing the model print registration step by the unit 36, the actual print inspection process is started. At this time, the defective product discharge control unit 39 resumes the discharge of defective products from the transfer line, and the turntable 11 becomes the normal transfer (normal transfer step by defective product discharge control, ST106).

Subsequently, the determination data calculation unit 37 sequentially calculates a similarity score, a difference area, a discolored portion, and a positional deviation amount for each model print for each inspection print (determination data calculation step, ST107). The print determination unit 38 determines whether the inspection print is good or bad for each determination data (print determination step, ST108 to ST113).

In the print determination step, first, if the similarity score of the inspection print with respect to the model print is 50% or more (Yes in ST108), the print determination unit 38 proceeds to step ST109. On the other hand, if the similarity score of the test print with respect to the model print does not reach 50% or more (No in ST108), the print determination unit 38 determines that the test print is defective print (step ST113).

In step ST109, the print determination unit 38 determines the difference area in each inspection print, and if the difference area with respect to the model print is within ± 30% (Yes in ST109), the process proceeds to step ST110. When the difference area from the model print exceeds ± 30% (No in ST109), the print determination unit 38 has fading or protrusion in the inspection print, or there is a difference in the line thickness. Then, the inspection printing is determined as defective printing (step ST113).

Next, in step ST110, if the print determination unit 38 determines that there is no discolored portion in the area outside the model print range (Yes in ST110), the process proceeds to step ST111. On the other hand, if the print determination unit 38 determines that there is a discolored portion in the area outside the model print range (No in ST110), it is determined that the surface of the semiconductor package 1 on which the inspection print is engraved has dirt and scratches. The printing is determined to be defective printing (ST113).

In step ST111, if the print determination unit 38 determines that the positional deviation amount (X, Y) of each test print with respect to the model print is within ± 100 μm (Yes in ST111), the print determination is determined to be a non-defective print. (ST112). Further, if the print determination unit 38 determines that the positional deviation amount (X, Y) of the inspection print with respect to the model print exceeds ± 100 μm (No in ST111), the inspection print is determined as a defective print (ST113).

As described above, the print determination unit 38 does not perform the non-defective print until the determination data for the similarity score, the difference area, the color change area, and the positional deviation amount have cleared all the predetermined threshold values for each inspection print. judge. Further, for the semiconductor package 1 that the print determination unit 38 has determined to be defective in printing, the turntable 11 that has been normally transported discharges it from the transport line (defective product discharge step by defective product discharge control, ST114).

[effect]
According to the present embodiment described above, a model print is created from a plurality of print images, and this is used as an original image serving as a reference at the time of print inspection. For model printing, averaging processing or standard deviation processing is performed. Therefore, the image data is obtained by canceling a variation portion for each marked print. Therefore, a large number of inspection prints can be similar to model prints, and the semiconductor package 1 is determined as non-defective print compared to a case where a single print arbitrarily selected by each individual inspector is used as an original image. Increases and the yield improves.

For example, FIG. 1 shows two examples of printing defects. The reason why these printings are determined to be defective is that the printing is faint or the printing position is shifted in order from the printing at the left end. The determination that these prints are defective prints can be sufficiently understood by any person in charge of inspection.

On the other hand, the other two prints, which were regarded as defective prints in the conventional example of FIG. 4, that is, the prints with “low similarity score” and the prints with “thin lines constituting the prints” are different in charge of inspection. If the person selected another print as the original image, there was a possibility that the print would not be defective.

In other words, in the conventional technology, the case where “similarity score low” printing or “thin line” printing is judged as a printing failure is because the image data of these prints happens to be different from the image data of the original image. Therefore, there may be no problem even if it is determined as non-defective printing.

In contrast to such a conventional technique, in this embodiment, a model print subjected to averaging processing or standard deviation processing is created and used as an original image, so that the model print approximates many inspection prints. Is possible. That is, in view of the overall distribution of image data, there are many prints that approximate the model print that is the original image. As a result, the inspection print is easily determined as a good print, the number of defective products is reduced, and the yield is improved.

Furthermore, since the original image that is the judgment standard for the print inspection is not determined by the subjective judgment of the individual inspector, individual differences in print selection by the inspector can be eliminated. Therefore, the yield does not fluctuate for each person in charge of inspection, and the yield can be stabilized.

Conventionally, all of the inspection prints during the print inspection adjustment have been judged as defective printing because the print inspection adjustment is insufficient, so a considerable number of semiconductor packages have been discarded, and the yield has been increased. It was a factor to decrease. Therefore, in this embodiment, the defective product discharge control unit 39 prohibits the discharge of defective products from the acquisition of the print image by the print image acquisition unit 33 to the completion of the model print generation by the model print generation unit 35.

Thus, the turntable 11 does not discharge the semiconductor package 1 from the transport line until the determination for the print inspection is sufficiently prepared. That is, a uniform print inspection can be performed on all the semiconductor packages 1, and it is possible to prevent a decrease in yield.

(2) Other Embodiments The present invention is not limited to the above-described embodiment, and the type of determination data calculated by the determination data calculation unit and the determination criterion by the print determination unit. The threshold value and the like can be appropriately changed. In addition to the semiconductor print inspection apparatus and method, the present embodiment can be grasped as a print inspection program and a computer-readable recording medium on which the program is recorded. Other embodiments include, for example, the following inspection methods.

(A) A plurality of print images acquired by the print image acquisition unit may be stored in a storage unit, and the model print generation unit may generate a model print using the stored plurality of print images. At this time, if model printing is created using only those determined as non-defective printing, the variation in model printing can be further reduced, and the accuracy of printing inspection can be further increased. The number of print images acquired by the print image acquisition unit can be arbitrarily set. If the model print creating section normally has about 10 print images, the print image averaging process or standard deviation process can be carried out without any problem.

(B) The number of print images acquired when creating a model print is not limited to the number of semiconductor packages for one turn of the turntable, and can be set to an arbitrary number. By reducing the number of print images to be acquired, it is not necessary to wait for the model print creation until the semiconductor package 1 finishes around one turn on the turntable 11, and quick and efficient model print creation becomes possible.

(C) In the above embodiment, the defective product discharge from the transport line is limited before the start of print image acquisition and after the completion of the model print creation. The semiconductor package may be discharged from the transfer line, or the semiconductor package may be discharged from the transfer line while creating a model print.

(D) In FIG. 1, the printing is only one character “A”, but even if there are a plurality of engraved printings, the printed area is treated as one image, so that the determination is made regardless of the number of characters. Processing is the same. Further, the image may be divided for each character to be printed, and the determination data may be calculated for each character image. In this case, when the determination data for all characters exceeds a threshold value that is a criterion, it is determined that the print is good, and if even one character in the print character string does not satisfy the threshold, it is determined that the print is defective. May be. Further, the inspection print rotation angle may be added as the inspection print determination data. In this case, the determination data calculation unit 37 calculates the rotation angle θ (°) of the inspection print, and the print determination unit 38 sets the calculated rotation angle θ (°) using the preset angle as a determination reference. It is possible to determine.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor package 2 ... Marking unit 3 ... Printing test | inspection unit 11 ... Turntable 30 ... Print image acquisition part 31 ... Original image registration part 32, 37 ... Data calculation part 33, 38 for determination ... Print determination part 34 ... Position correction part 35 ... Model print creation unit 36 ... Model print registration unit 39 ... Defective product discharge control unit

Claims

In a semiconductor print inspection method for inspecting a print engraved on the surface of a semiconductor element,
Before conducting a print inspection,
A print image obtaining step for obtaining an image of the print from a plurality of semiconductor elements;
A model print creating step for creating a model print which is a virtual print from a plurality of print images by performing an averaging process or a standard deviation process of the plurality of print images obtained in the print image obtaining step;
A model print registration step of registering the model print created in the model print creation step as an original image, and
During print inspection,
For determination to calculate determination data for each inspection print to be inspected by comparing the print image data acquired in the print image acquisition step with the model print image data registered in the model print registration step A data calculation step;
A semiconductor print inspection method, comprising: a print determination step for determining whether the inspection print is good or defective based on determination data for each inspection print.
2. The semiconductor print inspection method according to claim 1, further comprising a print position correction step for aligning the print position with a predetermined position for the print image acquired in the print image acquisition step.
In the determination data calculation step, as the determination data, the similarity score of pixel luminance at the same position of the model print and the inspection print, the difference area of the inspection print with respect to the model print, the print range of the model print 3. The semiconductor print inspection method according to claim 1, wherein at least one of an area of a discolored portion located outside and a displacement amount of the inspection print with respect to the model print is calculated.
Until the model print registration step is completed from the print image acquisition step, discharging of the defective semiconductor element from the transfer line is prohibited, and after the actual print inspection is started, the defective semiconductor element from the transfer line is 4. The semiconductor print inspection method according to claim 1, further comprising a defective product discharge control step for restarting discharge.
A print image storing step for storing the print image;
5. The semiconductor print inspection method according to claim 1, wherein in the model print creation step, a model print is created using the print image stored in the print image storage step.
In a program for inspecting semiconductor printing, which allows a computer to inspect the marking engraved on the surface of a semiconductor element,
By using a computer
A print image acquisition function for acquiring an image of the print from a plurality of semiconductor elements;
A model print creation function for creating a model print which is a virtual print from a plurality of print images by performing an averaging process or a standard deviation process of a plurality of print images obtained by the print image obtaining function;
A model print registration function for registering the model print created by the model print creation function as an original image;
Determination data for calculating inspection print determination data to be inspected by comparing the print image data acquired by the print image acquisition function with the model print image data registered by the model print registration function A calculation function;
A program for semiconductor print inspection, which causes a computer to realize a print determination function for determining whether the inspection print is good or defective based on determination data for each inspection print.
In a semiconductor printing inspection device that inspects the printing imprinted on the surface of a semiconductor element,
Print image acquisition means for acquiring an image of the print from a plurality of semiconductor elements;
A model print creating means for performing an averaging process or a standard deviation process of a plurality of print images acquired by the print image acquiring means to create a model print that is a virtual print from the plurality of print images;
Model print registration means for registering the model print created by the model print creation means as an original image;
Determination data calculation means for calculating determination data for each inspection print to be inspected by comparing the print image data acquired by the print image acquisition means with the model print image data registered by the model print registration means When,
A semiconductor print inspection apparatus comprising: a print determination unit that determines whether the inspection print is good or defective based on determination data for each inspection print.