WO2012155371A1 - 通过隔热处理的背光模组 - Google Patents
通过隔热处理的背光模组 Download PDFInfo
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- WO2012155371A1 WO2012155371A1 PCT/CN2011/075227 CN2011075227W WO2012155371A1 WO 2012155371 A1 WO2012155371 A1 WO 2012155371A1 CN 2011075227 W CN2011075227 W CN 2011075227W WO 2012155371 A1 WO2012155371 A1 WO 2012155371A1
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- backlight module
- frame assembly
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Definitions
- the invention relates to a backlight module, in particular to a backlight module which is processed by heat insulation.
- the heat generated by the LED backlight is radiated to the outside through the back plate and is radiated into the air to achieve the purpose of heat dissipation.
- the backplane is usually in direct contact with an optical component such as a light guide plate in the backlight cavity, heat generated by a portion of the LED backlight will be conducted to the inside of the backlight cavity through the backplane.
- the optical component When the optical component is exposed to a high temperature for a long period of time, it causes accelerated aging, and the stress caused by the thermal expansion and contraction causes the optical component to be deformed, which further affects the optical properties of the optical component.
- the current heat dissipation design of the backlight module usually only considers the external effect of heat dissipation, ignoring the danger of heat accumulation in the backlight cavity.
- the present invention provides a backlight module that is thermally insulated, and the backlight module includes:
- a frame assembly including a backlight cavity defined inside the frame assembly
- a light source disposed on one side of the frame assembly
- At least one optical component disposed in the backlight cavity
- the heat insulating material is disposed on the inner side surface of the frame assembly to isolate heat from the light source from the inner surface of the frame assembly into the backlight cavity.
- the at least one optical component is a light guide plate.
- the insulating material is plastic or rubber.
- the frame assembly includes a frame body and an aluminum substrate, the aluminum substrate is disposed on one side of the frame body; and the light source is disposed on the aluminum On the substrate.
- the light emitting component is a light emitting diode.
- the invention mainly provides the heat insulating material on the inner surface of the frame assembly to isolate the heat of the light source from the inner surface of the frame assembly to the backlight cavity, thereby effectively reducing the temperature of the backlight cavity and slowing down the aging speed of the optical component in the backlight cavity.
- the invention mainly provides the heat insulating material on the inner surface of the frame assembly to isolate the heat of the light source from the inner surface of the frame assembly to the backlight cavity, thereby effectively reducing the temperature of the backlight cavity and slowing down the aging speed of the optical component in the backlight cavity.
- FIG. 1 is a cross-sectional view showing a first embodiment of a backlight module of the present invention which is insulated by heat treatment.
- FIG. 2 is a perspective view of a first embodiment of a backlight module of the present invention treated by heat insulation.
- FIG 3 is a perspective view of a second embodiment of a backlight module of the present invention through thermal insulation.
- FIG. 1 and FIG. 2 are respectively a cross-sectional view and a perspective view of a first embodiment of a backlight module according to the present invention.
- the backlight module mainly comprises a frame assembly 1, a light source 2, at least one optical component 3, and a heat insulating material 4.
- the heat insulating material 4 is disposed on an inner side surface of the frame assembly 1.
- the heat insulating material 4 is disposed on an inner side surface of the aluminum substrate 12, and the heat insulating material 4 is preferably It is plastic or rubber, but not limited to this.
- the inner surface of the aluminum substrate 12 is provided with the heat insulating material 4, the heat generated by the light source 2 disposed on the aluminum substrate 12 is blocked by the heat insulating material 4, so that heat can be reduced from the inner side of the aluminum substrate 12.
- the surface is emitted to the backlight chamber 10. Therefore, the temperature inside the backlight chamber 10 will not be too high, resulting in aging or deformation of the optical member 3.
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
本发明涉及一种背光模组,特别是有关于一种通过隔热处理的背光模组。
背光模组为液晶显示器的基础零件之一,通过导光板将背光源的光线导引成亮度均匀的平面光源。一般来说,常用于背光模组的背光源包含冷阴极荧光灯以及发光二极管(lighting
emitting diode,LED)。由于发光二极管具有体积小、寿命长等优点,在市场上逐渐取代冷阴极荧光灯。
目前以LED作为背光源的背光模组中,LED背光源产生的热量是通过背板传导至外部而散发到空气中,以达到散热的目的。然而,由于背板通常直接与背光腔内的导光板等光学部材接触,部份LED背光源产生的热量将会通过背板传导至背光腔的内部。光学部材长时间处于高温环境下会导致加速老化,且热涨冷缩导致的应力会导致光学部材变形,进一步会影响光学部材的光学性能。
当前的背光模组的散热设计通常仅考虑热量散发出外部的效果,而忽略了热量在背光腔内累积所带来的危害。
故,有必要提供一种通过隔热处理的背光模组,以解决现有技术所存在的问题。
本发明的主要目的在于提供一种通过隔热处理的背光模组,可隔绝热量传导到框架组件内侧表面而散发至背光腔,进而有效降低背光腔的温度。
为达成本发明的前述目的,本发明提供一种通过隔热处理的背光模组,所述背光模组包含:
一框架组件,包含一定义于框架组件内侧的背光腔;
一发光源,设置于框架组件的一侧;
至少一光学部件,配置于所述背光腔内;以及
隔热材料,设置于框架组件内侧表面而隔绝框架组件内侧表面所传导来自发光源的热量进入所述背光腔。
在本发明的一实施例中,所述至少一光学部件是一导光板。
在本发明的一实施例中,所述隔热材料是塑胶或橡胶。
在本发明的一实施例中,所述框架组件包含一框架本体及一铝质基板,所述铝质基板是设置于所述框架本体的一侧;所述发光源是设置于所述铝质基板上。
在本发明的一实施例中,所述框架组件包含一框架本体及一散热背板,所述散热背板的内侧表面是贴覆于所述框架本体的背面,所述发光源是设置于所述散热背板的内侧表面;所述隔热材料是设置于所述框架本体的内侧表面,并对应所述散热背板与所述框架本体的重迭范围。
在本发明的一实施例中,所述发光源包含一电路板与数个设置于电路板上的发光组件,所述电路板是设置于所述铝质基板上。
在本发明的一实施例中,所述发光源包含一电路板与数个设置于电路板上的发光组件,所述电路板是设置于所述散热背板的内侧表面。
在本发明的一实施例中,所述隔热材料进一步延伸到所述框架本体的内侧表面。
在本发明的一实施例中,所述发光组件是发光二极管。
本发明主要是将隔热材料设置于框架组件内侧表面,以隔绝发光源的热量自框架组件内侧表面传递至背光腔,进而可以有效降低背光腔的温度,减缓背光腔内的光学部件的老化速度。
本发明主要是将隔热材料设置于框架组件内侧表面,以隔绝发光源的热量自框架组件内侧表面传递至背光腔,进而可以有效降低背光腔的温度,减缓背光腔内的光学部件的老化速度。
图1是本发明通过隔热处理的背光模组的第一实施例的剖视图。
图2是本发明通过隔热处理的背光模组的第一实施例的立体图。
图3是本发明通过隔热处理的背光模组的第二实施例的立体图。
图4是本发明通过隔热处理的背光模组的第三实施例的局部立体图。
为让本发明上述目的、特征及优点更明显易懂,下文特举本发明较佳实施例,并配合附图,作详细说明如下。再者,本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。
请一并参照图1及图2所示,图1及图2分别是本发明通过隔热处理的背光模组的第一实施例的剖视图及立体图。所述背光模组主要包含一框架组件1、一发光源2、至少一光学部件3以及隔热材料4。
所述框架组件1具有一背光腔10,所述背光腔10是定义于所述框架组件1的内侧。在本实施例中,所述框架组件1并包含一框架本体11及一铝质基板12,其中所述铝质基板12是设置于所述框架本体11的一侧,而所述发光源2则是设置于所述铝质基板12上。更详细地,所述铝质基板12是呈L状的板体。所述发光源2是包含一电路板20与数个设置于电路板20上的发光组件21,所述电路板20是设置于所述铝质基板12上;所述发光组件21优选为发光二极管。
所述至少一光学部件3是配置于所述背光腔10内,可为一导光板或导光板与其他光学膜片的组合,但不在此限。
所述隔热材料4是设置于框架组件1的内侧表面,在本实施例中,所述隔热材料4是设置于所述铝质基板12的一内侧表面上,所述隔热材料4优选是塑胶或橡胶,但不在此限。
由于铝质基板12的内侧表面设有隔热材料4,设置于铝质基板12上的发光源2所产生的热量将会受到隔热材料4阻隔,可使减少热量从铝质基板12的内侧表面散发到背光腔10。因此,所述背光腔10内的温度将不会过高,而导致光学部材3的老化或是变形。
进一步参考图3所示,图3是本发明通过隔热处理的背光模组的第二实施例的立体图。第二实施例不同于第一实施例之处在于:所述隔热材料4是更进一步延伸到所述框架本体11的内侧表面,以便进一步阻隔传导至框架本体11的热量从其内侧表面散发进入背光腔10。
进一步参考图4所示,图4是本发明通过隔热处理的背光模组的第三实施例的局部立体图。所述第三实施例是揭示背光模组的另一种散热结构。在第三实施例中,所述框架组件1是包含所述框架本体11及一散热背板13,所述散热背板13的内侧表面是贴覆于所述框架本体11的背面;再者,所述发光源2是设置于所述散热背板13的内侧表面;更详细地,所述发光源2的电路板20是设置于所述散热背板13的内侧表面。所述散热背板13用以吸收设置于其上的发光源2的热量,而将热量散逸出背光模组之外。所述隔热材料4是设置于所述框架本体11的内侧表面,并且对应所述散热背板13与所述框架本体11的重迭范围。
所述隔热材料4对应所述散热背板13与所述框架本体11的重迭范围可阻隔热量从散热背板13传至框架本体11,同样有助于降低所述背光腔10内的温度。
综上所述,相较于现有技术并未在框架组件上设置隔热材料,本发明在背光模组的框架组件上,对应可能造成背光腔温度升高的区域设置隔热材料,进而隔绝热量自框架组件内侧表面传递至背光腔。故本发明将可有效降低背光腔的温度,使得背光腔内的温度分布更为平均,减缓背光腔内的光学部件的老化或是避免光学部件因热涨冷缩的应力而变形。
本发明已由上述相关实施例加以描述,然而上述实施例仅为实施本发明的范例。必需指出的是,已公开的实施例并未限制本发明的范围。相反地,包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
Claims (10)
- 一种通过隔热处理的背光模组,其特征在于:所述背光模组包含:一框架组件,包含一定义于框架组件内侧的背光腔、一框架本体及一铝质基板,所述铝质基板是设置于所述框架本体的一侧;一发光源,设置于所述铝质基板上;一导光板,配置于所述背光腔内;以及隔热材料,设置于框架组件内侧表面而隔绝框架组件内侧表面所传导来自发光源的热量进入所述背光腔。
- 一种通过隔热处理的背光模组,其特征在于:所述背光模组包含:一框架组件,包含一定义于框架组件内侧的背光腔;一发光源,设置于框架组件的一侧;至少一光学部件,配置于所述背光腔内;以及隔热材料,设置于框架组件内侧表面而隔绝框架组件内侧表面所传导来自发光源的热量进入所述背光腔。如权利要求2所述的通过隔热处理的背光模组,其特征在于:所述至少一光学部件是一导光板。
- 如权利要求2所述的通过隔热处理的背光模组,其特征在于:所述隔热材料是塑胶或橡胶。
- 如权利要求2所述的通过隔热处理的背光模组,其特征在于:所述框架组件包含一框架本体及一铝质基板,所述铝质基板是设置于所述框架本体的一侧;所述发光源是设置于所述铝质基板上。
- 如权利要求2所述的通过隔热处理的背光模组,其特征在于:所述框架组件包含一框架本体及一散热背板,所述散热背板的内侧表面是贴覆于所述框架本体的背面,所述发光源是设置于所述散热背板的内侧表面;所述隔热材料是设置于所述框架本体的内侧表面,并对应所述散热背板与所述框架本体的重迭范围。
- 如权利要求5所述的通过隔热处理的背光模组,其特征在于:所述发光源包含一电路板与数个设置于电路板上的发光组件,所述电路板是设置于所述铝质基板上。
- 如权利要求6所述的通过隔热处理的背光模组,其特征在于:所述发光源包含一电路板与数个设置于电路板上的发光组件,所述电路板是设置于所述散热背板的内侧表面。
- 如权利要求5所述的通过隔热处理的背光模组,其特征在于:所述隔热材料进一步延伸到所述框架本体的内侧表面。
- 如权利要求7所述的通过隔热处理的背光模组,其特征在于:所述发光组件是发光二极管。
- 如权利要求8所述的通过隔热处理的背光模组,其特征在于:所述发光组件是发光二极管。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/203,644 US20120294041A1 (en) | 2011-05-16 | 2011-06-02 | Backlight module with thermal insulation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120155687.8 | 2011-05-16 | ||
| CN201120155687U CN202140897U (zh) | 2011-05-16 | 2011-05-16 | 通过隔热处理的背光模组 |
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| WO2012155371A1 true WO2012155371A1 (zh) | 2012-11-22 |
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| PCT/CN2011/075227 Ceased WO2012155371A1 (zh) | 2011-05-16 | 2011-06-02 | 通过隔热处理的背光模组 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102799022B (zh) * | 2012-08-14 | 2014-12-10 | 深圳市华星光电技术有限公司 | 用于液晶显示装置的背光模组及其散热部件的制备方法 |
| CN206558500U (zh) * | 2016-09-30 | 2017-10-13 | 深圳市玲涛光电科技有限公司 | 发光元件、背光源模组及电子设备 |
| CN110444111A (zh) | 2019-08-16 | 2019-11-12 | 京东方科技集团股份有限公司 | 背光模组和显示装置 |
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| CN101589267A (zh) * | 2007-01-22 | 2009-11-25 | 夏普株式会社 | 背光装置以及使用背光装置的平面显示装置 |
| CN101893215A (zh) * | 2010-07-14 | 2010-11-24 | 深圳市华星光电技术有限公司 | 背光模块及其灯条定位构造 |
| CN201827771U (zh) * | 2010-09-15 | 2011-05-11 | 康佳集团股份有限公司 | 一种背光模组及液晶电视 |
-
2011
- 2011-05-16 CN CN201120155687U patent/CN202140897U/zh not_active Expired - Lifetime
- 2011-06-02 WO PCT/CN2011/075227 patent/WO2012155371A1/zh not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101589267A (zh) * | 2007-01-22 | 2009-11-25 | 夏普株式会社 | 背光装置以及使用背光装置的平面显示装置 |
| JP2009245882A (ja) * | 2008-03-31 | 2009-10-22 | Sanken Electric Co Ltd | バックライトユニット |
| US20090251634A1 (en) * | 2008-04-03 | 2009-10-08 | Chi Mei Optoelectronics Corp. | Backlight module, application and fabrication method thereof |
| CN101520574A (zh) * | 2009-04-20 | 2009-09-02 | 友达光电股份有限公司 | 具热隔离层的背光模块及显示装置 |
| CN101893215A (zh) * | 2010-07-14 | 2010-11-24 | 深圳市华星光电技术有限公司 | 背光模块及其灯条定位构造 |
| CN201827771U (zh) * | 2010-09-15 | 2011-05-11 | 康佳集团股份有限公司 | 一种背光模组及液晶电视 |
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|---|---|
| CN202140897U (zh) | 2012-02-08 |
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