WO2012153443A1 - Illumination light source - Google Patents

Illumination light source Download PDF

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Publication number
WO2012153443A1
WO2012153443A1 PCT/JP2012/000486 JP2012000486W WO2012153443A1 WO 2012153443 A1 WO2012153443 A1 WO 2012153443A1 JP 2012000486 W JP2012000486 W JP 2012000486W WO 2012153443 A1 WO2012153443 A1 WO 2012153443A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
light emitting
optical member
emitting module
light source
Prior art date
Application number
PCT/JP2012/000486
Other languages
French (fr)
Japanese (ja)
Inventor
由雄 真鍋
甲斐 誠
洋介 藤巻
堀内 誠
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2012529995A priority Critical patent/JP5082026B1/en
Publication of WO2012153443A1 publication Critical patent/WO2012153443A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light source for illumination using a light emitting module, and more particularly to a technology for improving light distribution characteristics.
  • the base 901 is an inverted pyramid from the first base portion 902 and a partial region of the upper surface of the first base portion 902.
  • the first LED 904 is disposed on the upper surface of the first pedestal portion 902
  • the second LED 905 is disposed on the upper surface of the second pedestal portion 903.
  • the light emitting surface of the first LED 904 exists in the projection area, and the side surface of the second base portion 903 is the light reflecting surface 906 It is assumed that it has become With this configuration, the emitted light from the first LED 904 is reflected obliquely downward by the light reflecting surface 906, thereby compensating for the narrowness of the irradiation angle of the LED and realizing relatively good light distribution characteristics.
  • the upper surface of the first base portion 902 and the upper surface of the second base portion 903 are the mounting surfaces of the LEDs, and the two mounting surfaces separately include the LED 904, Since the 905 has to be mounted, the assembling operation is more complicated than the case where the mounting surface of the LED is only one. That is, for example, when mounting LEDs using a robot, if all LEDs are arranged in a plane, setting in the height direction is unnecessary, but if two mounting surfaces having different heights are present This requires setting in the height direction to correspond to each height, resulting in complicated robot operation and reduced working speed.
  • the present invention has been made in view of the problems as described above, and it is an object of the present invention to provide a light source for illumination having good light distribution characteristics and easy assembly work.
  • An illumination light source includes an inside of an envelope including a cylindrical case having an opening on the upper side which is an illumination direction, and a glove attached to the upper side of the case so as to close the opening.
  • a light source for illumination containing one or more light emitting modules as a light source, wherein all the light emitting modules in the envelope are flatly arranged with the main emission direction facing upward, At the upper side of the light emitting module, one or more diffuses the emitted light so that the light emitted from the light emitting module reaches the inner surface of the globe with maximum luminous intensity in the range of the emission angle of 30 ° to 60 °
  • the optical member of the present invention is disposed.
  • the light source for illumination according to the present invention has a configuration in which all the light emitting modules in the envelope are flatly arranged with the main emission direction facing upward, the mounting of the light emitting modules is easy, and hence the illumination
  • the assembly work of the light source is simple.
  • one or more of the emitted light is diffused so that the light emitted from the light emitting module reaches the inner surface of the globe with maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. Because the above optical members are disposed, the light distribution characteristics of the illumination light source are excellent even if the light emitting module having a narrow irradiation angle is disposed in a plane.
  • FIG. 1 Partially broken perspective view showing the illumination light source according to the first embodiment Sectional drawing which shows the light source for illumination which concerns on 1st Embodiment.
  • a plan view for explaining a light emitting module and an optical member according to a first embodiment Light distribution curve for explaining the light distribution characteristic of the illumination light source according to the first embodiment
  • Light distribution curve for explaining the influence of the outer diameter of the optical member on the light distribution characteristics of the illumination light source A plan view for explaining a light emitting module and an optical member according to a modification
  • a plan view for explaining a light emitting module and an optical member according to a modification A plan view for explaining a light emitting module and an optical member according to a modification
  • a plan view for explaining a light emitting module and an optical member according to a modification A plan view for explaining a light emitting
  • FIG. 1 An enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
  • Light distribution curve for explaining the light distribution characteristic of the optical member according to the sixth embodiment Sectional drawing for demonstrating the optical member which concerns on the modification of 6th Embodiment Cross section showing a conventional light source for illumination
  • FIG. 1 is a partially broken perspective view showing the illumination light source according to the first embodiment.
  • FIG. 2 is a cross-sectional view showing the illumination light source according to the first embodiment.
  • the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J of the light source for illumination, and the upper side of the drawing is the upper direction which is the illumination direction of the illumination light source Below the light source.
  • the illumination light source 1 is an LED lamp that is a substitute for an incandescent lamp, and is provided with a light emitting module 10 as a light source and a light emitting module 10.
  • Base 20 globe 30 covering light emitting module 10, circuit unit 40 for lighting light emitting module 10, circuit holder 50 accommodating circuit unit 40, case 60 covering circuit holder 50, circuit unit 40 and an optical member 80 for diffusing the light emitted from the light emitting module 10.
  • the envelope 2 of the illumination light source 1 is configured of a glove 30 and a case 60, and the light emitting module 10 and the optical member 80 are accommodated in the envelope 2.
  • the light emitting module 10 is provided on the mounting substrate 11 so as to cover the mounting substrate 11, the semiconductor light emitting device 12 mounted on the mounting substrate 11, and the semiconductor light emitting device 12.
  • the semiconductor light emitting module includes the sealed body 13 and is disposed on the lamp axis J.
  • the semiconductor light emitting element 12 is an LED
  • the light emitting module 10 is an LED module.
  • the semiconductor light emitting element 12 may be, for example, an LD (laser diode). It may be a luminescent element).
  • the mounting substrate 11 is, for example, a substantially square plate shape (in plan view) when viewed from above (in plan view), and is attached to the upper surface 21 of the base 20.
  • looking from the upper side means looking at the lower side along the lamp axis J from the upper side, and in FIG. 2, for example, from the upper side to the paper lower side along the lamp axis J It is the meaning of looking at.
  • the semiconductor light emitting elements 12 are mounted on the upper surface of the mounting substrate 11, for example, in a total of 25 rows of 5 rows and 5 columns, and the semiconductor light emitting elements 12 are point symmetrical about the lamp axis J It is arranged flat. Each semiconductor light emitting element 12 is mounted in a posture in which each main emission direction is directed upward along the lamp axis J.
  • the number of semiconductor light emitting elements 12 is not limited to 25.
  • the number of semiconductor light emitting elements 12 may be one or plural other than 25.
  • the arrangement of the semiconductor light emitting elements 12 is not limited to a matrix, and may be arranged in an annular shape such as an annular shape.
  • the attitude of the semiconductor light emitting element 12 is such that all the semiconductor light emitting elements 12 do not have to be directed upward along the lamp axis J direction, and a part is directed obliquely to the lamp axis J It may be mounted in an attitude, whereby controllability of light distribution is further improved, and more preferable light distribution can be obtained.
  • the sealing body 13 has, for example, a block shape, and seals all 25 semiconductor light emitting elements 12.
  • the upper surface 13a of the sealing body 13 is a substantially square plane when viewed from above, and constitutes the upper side light emitting surface of the light emitting module 10.
  • the upper surface 13a and the lamp axis J are orthogonal to each other at the center of the upper surface 13a. doing.
  • the upper surface 13a and the lamp axis J do not necessarily have to be orthogonal to each other at the center of the upper surface 13a. However, in order to obtain uniform light distribution over the entire circumference around the lamp axis J, the upper surface 13a Preferably, they intersect at the center of and more preferably orthogonal.
  • the sealing body 13 is mainly made of a translucent material, but when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength of the light of the translucent material is used.
  • the wavelength conversion material is mixed to convert the
  • a silicone resin can be used as the translucent material
  • phosphor particles can be used as the wavelength conversion material, for example.
  • semiconductor light emitting element 12 emitting blue light and sealing body 13 formed of a translucent material mixed with phosphor particles for wavelength converting blue light to yellow light are adopted.
  • a part of the blue light emitted from the semiconductor light emitting element 12 is wavelength-converted to yellow light by the sealing body 13 and white light generated by mixing of unconverted blue light and converted yellow light is emitted. It is emitted from module 10.
  • the light emitting module 10 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and each color phosphor particle emitting light in three primary colors (red, green and blue). Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
  • the base 20 is, for example, a substantially disc shape, and the upper surface 21 and the lower surface 22 are both substantially circular flat surfaces, and are orthogonal to the lamp axis J, respectively.
  • the light emitting module 10 is disposed on the upper surface 21 of the base 20 in a plan view, and is fixed to the base 20 by, for example, screwing, bonding, and engagement.
  • the upper surface 21 is not limited to a substantially circular shape, and may have any shape. Moreover, as long as the top surface 21 can arrange the light emitting module 10 in a plane, the whole does not necessarily have to be a plane.
  • the lower surface 22 is not limited to a flat surface.
  • a pair of through holes 23 penetrating in the vertical direction is formed in the base 20, and the pair of wires 41 of the circuit unit 40 are led out to the upper side of the base 20 through the through holes 23.
  • the wires 41 are respectively connected to the mounting substrate 11 of the light emitting module 10, whereby the light emitting module 10 and the circuit unit 40 are electrically connected.
  • the base 20 is made of, for example, a metal material, and as the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, etc. can be considered. .
  • a metal material has good thermal conductivity, so that the heat generated by the light emitting module 10 can be efficiently conducted to the case 60.
  • Glove Glove 30 in the present embodiment, has a shape that simulates a bulb of A-type bulb which is a general bulb shape, and the opening side end 31 of the glove 30 is press-fit into the upper side opening of the case 60
  • the upper side opening 61 of the case 60 is attached to the upper side end 61 of the case 60 so as to close the upper side opening of the case 60 while covering the upper side of the light emitting module 10 and the optical member 80.
  • globe 30 is not limited to the shape which imitated the bulb
  • the glove 30 may be fixed to the case 60 by an adhesive or the like.
  • the inner surface 32 of the globe 30 is subjected to a diffusion process for diffusing light emitted from the light emitting module 10, for example, a diffusion process using silica, a white pigment, or the like.
  • the light incident on the inner surface 32 of the globe 30 passes through the globe 30 and is extracted to the outside of the globe 30.
  • the maximum outer diameter W1 of the glove 30 is larger than the outer diameter W2 of the upper end 61 of the case 60. Therefore, the light extracted to the outside of the globe 30 can easily move downward and a larger light distribution angle can be obtained.
  • the circuit unit 40 is for lighting the semiconductor light emitting element, and includes the circuit board 42 and various electronic components 43 and 44 mounted on the main surface 42 a of the circuit board 42. And. In FIG. 2, only some electronic components are denoted by reference numerals.
  • the circuit unit 40 is accommodated in the circuit holder 50, and is fixed to the circuit holder 50 by, for example, screwing, bonding, and engagement.
  • the circuit board 42 is disposed such that its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored more compactly in the circuit holder 50.
  • the circuit unit 40 is disposed such that the heat-sensitive electronic component 43 is located on the lower side far from the light emitting module 10 and the heat-resistant electronic component 44 is located on the upper side closer to the light emitting module 10. In this way, the heat-resistant electronic component 44 is less likely to be thermally destroyed by the heat generated by the light emitting module 10.
  • the circuit unit 40 and the base 70 are electrically connected by electrical wires 45 and 46.
  • the electrical wiring 45 is connected to the shell portion 71 of the base 70 through the through hole 51 provided in the circuit holder 50. Further, the electrical wiring 46 is connected to the eyelet portion 73 of the base 70 through the lower opening 54 of the circuit holder 50.
  • the circuit holder 50 has, for example, a substantially cylindrical shape with both sides open, and is configured of a large diameter portion 52 and a small diameter portion 53.
  • the large diameter portion 52 located on the upper side accommodates most of the circuit unit 40.
  • a base 70 is externally fitted to the small diameter portion 53 located on the lower side, whereby the lower side opening 54 of the circuit holder 50 is closed.
  • the circuit holder 50 is preferably made of, for example, an insulating material such as a resin.
  • the base 20 is located above the circuit holder 50, the upper end 55 of the circuit holder 50 and the base 20 are not in contact with each other, and a gap is provided.
  • the outer surface 56 of 50 and the inner circumferential surface 62 of the case 60 are not in contact with each other, and a gap is provided. Therefore, the heat generated in the light emitting module 10 is difficult to propagate to the circuit holder 50 through the base 20 and the case 60, and the circuit holder 50 does not easily have a high temperature, so the circuit unit 40 is unlikely to be thermally destroyed.
  • FIG. 3 is a perspective view showing a circuit holder.
  • a pair of rail grooves 57 for fixing the circuit board 42 of the circuit unit 40 to the circuit holder 50 is provided on the inner circumferential surface 52 a of the large diameter portion 52 of the circuit holder 50 so as to face each other.
  • the pair of rail grooves 57 is for fixing the circuit unit 40 to the circuit holder 50 in a posture in which the circuit board 42 is parallel to the lamp axis J (see FIG. 2), that is, in a vertical posture.
  • the rail groove 57 extends in the vertical direction along the inner circumferential surface 52 of the large diameter portion 52, and the circuit unit 40 is placed vertically when the side edges of the circuit board 42 are fitted into the pair of rail grooves 57. It is fixed by the posture of.
  • the pair of rail grooves 57 do not face each other across the lamp axis J, but face each other without sandwiching the lamp axis J. With respect to the lamp axis J, both rail grooves 57 are biased to one side It is arranged to be in position. In other words, when the inside of the large diameter portion 52 is divided into two spaces in an imaginary plane including the lamp axis J, both rail grooves 57 are arranged to be accommodated in one space. Therefore, when the circuit board 42 is fixed to the rail grooves 57, the circuit board 42 is not disposed on the lamp axis J, that is, at the central position of the large diameter portion 52, and is shifted to one side with respect to the lamp axis J. Be placed.
  • the inside of the large diameter portion 52 is divided by the circuit board 42 into a wide space on the one main surface 42 a side and a narrow space on the other main surface 42 b side.
  • taller electronic components can be disposed on the one main surface 42 a side.
  • Each rail groove 57 is composed of a base portion 57a and a first wall portion 57b and a second wall portion 57c provided on the base portion 57a.
  • Each base portion 57a is an elongated portion extending in the vertical direction along the inner peripheral surface 52 of the large diameter portion 52, and bulges a part of the inner peripheral surface 52a of the large diameter portion 52 inward. It is formed by.
  • the base portions 57a have long surfaces 57d facing each other, and the long surfaces 57d are kept parallel to each other in a cross section cut by a virtual plane orthogonal to the lamp axis J, and the long surfaces 57d are each The bottom surface of the rail groove 57 is configured.
  • the first wall 57 b and the second wall 57 c are provided upright on the long surface 57 d of the base 57 a along the long direction.
  • the first wall portion 57b is erected on the long side of the long surface 57d far from the lamp axis J, and is erected on the long side of the long surface 57d near the lamp axis J
  • the second wall portion 57c is located.
  • the first wall portion 57b and the second wall portion 57c face each other, and constitute side surfaces of the rail groove 57.
  • the first wall portion 57b is formed over the entire longitudinal direction of the long surface 57d of the base portion 57a, and the height of the wall is low (the amount of protrusion from the long surface 57d is small) and the upper side portion 57e , And the lower side portion 57f having a high wall height (a large amount of protrusion from the long surface 57d). That is, in the first wall portion 57b, the height of the wall changes in two steps, and the wall is higher on the lower side than the upper side. The height of the wall of the first wall 57 b may be changed in three or more steps.
  • the second wall portion 57c is not formed over the entire longitudinal direction of the long surface 57d of the base portion 57a, and is formed only near the lower end portion of the long surface 57d.
  • the area in which the second wall 57c is formed is narrower than the area in which the lower portion 57f of the first wall 57b is formed, and the lower side of the lower portion 57f and the second wall 57c face each other.
  • the second wall portion 57c does not exist in the region facing the upper side of the lower side portion 57f.
  • the second wall 57 c has the same height as the lower portion 57 f of the first wall 57 b.
  • both lower corners of the circuit board 42 are abutted against the first wall portion 57b, and are abutted.
  • the posture of the circuit board 42 is gradually raised to be parallel to the rail groove 57, and finally the first wall portion 57b
  • the process is completed by fitting lower corner portions between the lower portion 57f and the second wall 57c, and further aligning the side edges of the circuit board 42 with the first wall 57b.
  • the rail groove 57 Since the upper end of the first wall portion 57b is located above the upper end of the second wall portion 57c in the extending direction of the rail groove 57, the rail groove 57 is inclined while the circuit board 42 is inclined.
  • the lower corner portions of the circuit board 42 can be easily inserted into the rail groove 57. Further, when inserting the lower side corner portions of the circuit board 42 into the upper end of the rail groove 57, it is visually grasped which side the main surface 42a of the circuit board 42 should be directed to. easy.
  • the height of the wall is lower at the upper side portion 57e than at the lower side portion 57f, so the electronic components 43 and 44 of the circuit unit 40, the solder, etc. It is difficult to hit the first wall 57b. Therefore, the electronic components 43 and 44 can be mounted in a wide range on the circuit board 42.
  • the second wall 57c is provided only at the minimum necessary for fixing the circuit board 42. Therefore, the electronic components 43 and 44, solder and the like do not easily come in contact with the second wall 57c.
  • the electronic components 43 and 44 can be mounted in a wide range on the substrate 42.
  • the base portion 57 a is not necessarily required, and the rail groove 57 may have a configuration in which the first wall portion 57 b and the second wall portion 57 c are directly extended from the inner circumferential surface 52 of the large diameter portion 52. In that case, the rail groove 57 is configured by the first wall 57 b and the second wall 57 c.
  • the rail groove of the conventional circuit case has a pair of opposing wall portions provided in the same region in the extending direction of the rail groove, so the upper end portions of the wall portions are aligned, and the rail groove upper side It was not easy to insert the lower corners of the circuit board at the end. Therefore, the attachment work of the circuit unit was complicated.
  • the circuit holder 50 since the positions of the upper side end portions of the pair of opposing wall portions (the first wall portion 57 b and the second wall portion 57 c) are shifted, specifically, The upper end of the second wall 57c closer to the lamp axis J is positioned lower than the upper end of the first wall 57b farther from the lamp axis J Therefore, in a posture in which the circuit board 42 is inclined to the rail groove 57, the lower side corner portions of the circuit board 42 can be inserted into the upper end of the rail groove 57. Therefore, the fixing workability of the circuit unit 40 is easy.
  • the electronic components 43 and 44 of the circuit unit 40 and solder are formed in the portion where the height of the wall is lowered. Etc. are less likely to interfere with the first wall 57b.
  • Case 60 has, for example, a substantially cylindrical shape which is open at both ends and reduced in diameter from the upper side to the lower side.
  • the base 20 and the opening end 31 of the glove 30 are accommodated in the upper opening of the case 60, and the case 60 is fixed to the base 20 by caulking, for example.
  • the case 60 may be fixed to the base 20 by pouring an adhesive into a space 63 surrounded by the case 60, the base 20, and the globe 30, for example.
  • the outer peripheral edge of the lower side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface 62 of the case 60. Since the tapered surface 24 is in surface contact with the inner circumferential surface 62 of the case 60, the heat transmitted from the light emitting module 10 to the base 20 is more easily conducted to the case 60.
  • the heat generated by the semiconductor light emitting element 12 is conducted to the base 70 mainly through the base 20 and the case 60 and further through the small diameter portion 53 of the circuit holder 50, and from the base 70 to the lighting equipment (not shown) side Heat is dissipated.
  • the case 60 is made of, for example, a metal material, and the metal material may be, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, or an alloy of Cu and Ag.
  • a metal material has good thermal conductivity, so the heat transmitted to the case 60 can be efficiently transmitted to the base 70 side.
  • the material of case 60 is not limited to a metal, For example, resin with high heat conductivity, etc. may be sufficient.
  • Base A base 70 is a member for receiving power from the socket of the lighting apparatus when the illumination light source 1 is attached to the lighting apparatus and turned on.
  • the type of the base 70 is not particularly limited, and examples thereof include an Edison type E26 base and an E17 base.
  • the base 70 includes a shell portion 71 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72.
  • An insulating member 74 is interposed between the shell portion 71 and the case 60.
  • the optical member 80 diffuses the emitted light so that the emitted light from the light emitting module 10 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °.
  • the light emitting module 10 is disposed on the upper side of the light emitting module 10. The emission angle is defined as 0 ° above the lamp axis J and 180 ° below the lamp axis J.
  • the optical member 80 is, for example, substantially columnar and disposed on the lamp axis J, and the column axis of the optical member 80 and the lamp axis J coincide with each other.
  • the column axis of the optical member 80 does not have to be the same as the lamp axis J.
  • the column axis is a lamp It is preferable to be parallel to the axis J, and it is more preferable that the column axis and the lamp axis J coincide with each other.
  • the optical member 80 is formed, for example, of an outer portion 81 which is cylindrical and whose cylindrical axis is parallel to the lamp axis J, and a columnar inner portion 82 packed in the cylinder of the outer portion 81. More specifically, the optical member 80 has a cylindrical shape, and the outer side portion 81 has a cylindrical shape having a cylindrical axis coinciding with the lamp axis J, and the inner side 82 is tightly packed in the cylinder of the outer side 81 It has a cylindrical shape.
  • FIG. 4 is a schematic view for explaining an aspect of diffusion of outgoing light by the optical member.
  • the upper surface 80 a of the optical member 80 is composed of the upper surface 81 a of the outer side portion 81 and the upper surface 82 a of the inner side portion 82.
  • the lower surface 80 b of the optical member 80 is composed of the lower surface 81 b of the outer side portion 81 and the lower surface 82 b of the inner side portion 82.
  • the upper surface 80a and the lower surface 80b of the optical member 80 are each flat.
  • the upper surface 80a and the lower surface 80b of the optical member 80 are not limited to flat surfaces.
  • the degree of diffusion of light emitted from the optical member 80 may be adjusted by setting the upper surface 80a of the optical member 80 as a concave surface such as a conical surface or a convex surface such as a conical surface.
  • the lower surface 80b of the optical member 80 is a flat surface so that a gap can not be easily formed between the lower surface 80b and the upper surface 13a of the sealing body 13 from the viewpoint that the outgoing light from the light emitting module 10 is easily incident into the optical member 80. Is preferred.
  • An outer peripheral surface 80 c of the optical member 80 is constituted by an outer peripheral surface 81 c of the outer side portion 81.
  • the outer peripheral surface 81 c of the outer portion 81 may be subjected to mirror surface processing. In this way, light can be prevented from entering the optical member 80 from the outer peripheral surface 80c.
  • a method of mirror-finishing the outer peripheral surface 81c for example, it is considered to form a reflective film such as a metal thin film or a dielectric multilayer film by a method such as a thermal evaporation method, an electron beam evaporation method, a sputtering method or plating.
  • the inner peripheral surface 81 d of the outer portion 81 is in contact with the entire outer surface 82 c of the inner portion 82, and there is no gap between the outer portion 81 and the inner portion 82. That is, the inner peripheral surface 81 d of the outer side portion 81 and the outer peripheral surface 82 c of the inner side portion 82 are the same surface, and the interface between the outer side portion 81 and the inner side portion 82. There may be a gap between the outer side portion 81 and the inner side portion 82, but if there is a gap, light loss will occur, so it is preferable that there is no gap.
  • FIG. 5 is a plan view for explaining the light emitting module and the optical member according to the first embodiment.
  • the optical member 80 is smaller than the upper surface 13 a of the sealing body 13 of the light emitting module 10 as viewed from above. That is, the areas of the upper surface 80 a and the lower surface 80 b of the optical member 80 are smaller than the area of the upper surface 13 a of the sealing body 13. In this way, the entire upper surface 13 a of the sealing body 13 is not hidden by the optical member 80. That is, part of the upper surface 13a can be exposed. Therefore, as shown by an optical path L1 in FIG. 4A, a part of the emitted light from the light emitting module 10 can be directly delivered to the inner surface 32 of the glove 30 without being incident into the optical member 80.
  • the area of the area hidden by the optical member 80 on the upper surface 13a of the sealing body 13 is preferably 40% to 78% of the entire area of the upper surface 13a.
  • the outer diameter (which is also the outer diameter of the outer portion 81) R1 of the optical member 80 is 15 mm
  • the length W3 of one side of the upper surface 13a of the sealing body 13 is 21 mm.
  • the area of is 40% of the area of the entire top surface 13a.
  • the optical member 80 is simply disposed so as not to protrude from the upper surface 13a.
  • the column axis of the member 80 can be aligned with the lamp axis J, and the positioning of the optical member 80 is easy.
  • the height (length in the vertical direction) T of the optical member 80 shown in FIG. 2 is 15 mm, and the outer diameter R2 of the inner portion 82 shown in FIG. 5 is 10 mm.
  • the outer diameter R2 of the inner portion 82 is uniform over the entire vertical direction.
  • the optical member 80 is disposed at a position where the entire optical member 80 overlaps the upper surface 13 a of the sealing body 13 when viewed from the upper side. In this way, the entire lower surface 80 b of the optical member 80 contacts the upper surface 13 a of the sealing body 13, and thus the light emitted from the light emitting module 10 can be efficiently incident into the optical member 80.
  • the outer side portion 81 and the inner side portion 82 are each made of a translucent material.
  • the material of the inner portion 82 has a lower refractive index than the material of the outer portion 81.
  • resin materials such as a silicone and a polycarbonate, glass, a ceramic, etc. are mentioned, respectively.
  • the outer part 81 is made of glass having a refractive index of 1.50
  • the inner part 82 is made of silicone having a refractive index of 1.41.
  • a light scatterer may be included in one or both of the outer side portion 81 and the inner side portion 82 for internally scattering the incident light.
  • the light scatterer for example, colorless and transparent or colored and transparent particles composed of silica, alumina, zinc oxide, titania or the like can be considered.
  • the shape of the particles may be, for example, a substantially spherical shape, and the diameter is preferably in the range of 0.1 ⁇ m to 40 ⁇ m in situ.
  • the amount of the light scatterer added is preferably in the range of 10 wt% to 60 wt%.
  • the light emitted from the upper surface 13a of the sealing body 13 of the light emitting module 10 and incident from the lower surface 81b of the outer portion 81 into the outer portion 81 is the outer periphery of the outer portion 81 as shown by the light path L2 in FIG.
  • the reflection is repeated between the surface 81 c and the inner peripheral surface 81 d, and the light is emitted from the upper surface 81 a of the outer portion 81 to the outside of the optical member 80.
  • the light is reflected by the outer peripheral surface 81 c because the material of the outer portion 81 has a refractive index higher than that of air, and the light is reflected by the inner peripheral surface 81 d because the material of the outer portion 81 is the inner portion This is because the refractive index is higher than that of the 82 material.
  • the light that has entered the outer portion 81 once is unlikely to leak to the outside from the outer peripheral surface 81c or the inner peripheral surface 81d, and thus is guided to the upper surface 81a and emitted from the upper surface 81a.
  • the light incident from the inner portion 82 into the outer portion 81 is repeatedly reflected between the outer peripheral surface 81 c and the inner peripheral surface 81 d of the outer portion 81 and, as shown by the light path L 3, the optical member 80 from the upper surface 81 a of the outer portion 81.
  • light incident on the optical member 80 is collected at the outer portion 81 formed of a material having a higher refractive index, and is mainly emitted from the upper surface 81 a of the outer portion 81.
  • the light emitted from the upper surface 81a of the outer portion 81 is not mainly emitted upward along the lamp axis J, but is emitted mainly at an emission angle in the range of 30 ° to 60 ° with respect to the lamp axis J Be done.
  • the reason why the emission angle does not become 0 ° but does not become 0 ° is that most of the light incident in the outer part 81 does not travel straight along the lamp axis J in the outer part 81 and in the outer part 81 It is because it advances while internally reflecting in a zigzag.
  • light collected from the inner part 82 to the outer part 81 enters the outer part 81 at an angle not parallel to the lamp axis J, and therefore travels in a zigzag in the outer part 81.
  • the light traveling in the zigzag direction does not go straight in the direction along the lamp axis J even after being emitted from the upper surface 81a, but goes in the diagonally upward direction inclined with respect to the lamp axis J. Since there are a large amount of emitted light directed obliquely upward, the light is emitted mainly at an emission angle in the range of 30 ° to 60 ° with respect to the lamp axis J as a whole.
  • the light emitted from the light emitting module 10 is diffused by the optical member 80 so as to reach the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. Ru. Therefore, more light will reach the lower region of the inner surface 32 of the globe 30, and the light distribution angle of the illumination light source 1 is broadened. The light that has reached the globe 30 is further diffused by the globe 30.
  • the upper surface 80 a of the optical member 80 be positioned above the upper end 61 of the case 60 in the direction along the lamp axis J. Furthermore, it is more preferable that the upper surface 13 a of the sealing body 13 be positioned above the upper side end 61 of the case 60 in the direction along the lamp axis J.
  • the light source 1 for illumination can expand the irradiation angle by the optical member 80, so the light distribution characteristic is excellent. Further, since the outer portion 81 is cylindrical and exists over the entire outer periphery of the optical member 80, the irradiation angle can be expanded over the entire periphery centering on the lamp axis J, The light distribution characteristic is good throughout.
  • FIG. 6 is a light distribution curve diagram for explaining light distribution characteristics of the illumination light source according to the first embodiment.
  • the light distribution curve represents the magnitude of the luminous intensity in each direction of 360 ° including the vertical direction of the illumination light source 1, and the upper side of the illumination light source 1 along the lamp axis J is shown. Clockwise and counterclockwise, tick marks are formed at intervals of 10 ° with 0 ° and 180 ° downward along the lamp axis J, respectively.
  • the scale in the radial direction of the light distribution curve represents the light intensity, and the light intensity is represented by a relative magnitude with the maximum value in each light distribution curve as 100%.
  • the dashed-two dotted line in FIG. 6 shows the light distribution curve A of an incandescent lamp.
  • the broken line indicates a light distribution curve B when the globe 30 and the optical member 80 are removed from the illumination light source 1 according to the first embodiment.
  • An alternate long and short dash line indicates a light distribution curve C when the optical member 80 is removed from the illumination light source 1 according to the first embodiment.
  • a thick solid line indicates a light distribution curve D when the globe 30 is removed from the illumination light source 1 according to the first embodiment.
  • a thin solid line indicates a light distribution curve E of the illumination light source 1 according to the first embodiment.
  • the light distribution characteristics were evaluated based on the light distribution angle.
  • the light distribution angle refers to the size of an angular range in which a light intensity of half or more of the maximum value of the light intensity in the illumination light source is emitted. In the case of the light distribution curve shown in FIG. 6, it is the magnitude
  • the light distribution angle of the light distribution curve A is about 310 °
  • the light distribution angle of the light distribution curve B is about 120 °
  • the light distribution angle of the light distribution curve C is about 240 °
  • the light distribution angle of the light distribution curve D is about 170 °
  • the light distribution angle of the light distribution curve E is about 285 °.
  • the light distribution curve B shows how the light distribution curve changes depending on the presence or absence of the optical member 80 in the state without the glove 30.
  • the maximum light intensity is obtained at an exit angle of 0 ° when there is no optical member 80, while the light emission angle is 40 ° when there is an optical member 80, as seen from the light distribution curve D.
  • Maximum brightness at the From this it can be seen that the light emitted from the light emitting module 10 is diffused by the optical member 80 and the light distribution angle is spread.
  • the light distribution curve C It can be understood by comparing the light distribution curve C with the light distribution curve E how the light distribution curve changes depending on the presence or absence of the optical member 80 in the state where the glove 30 is attached.
  • the light distribution angle is 240 ° when the optical member 80 is not present, while the light distribution angle is 285 when the optical member 80 is present as seen from the light distribution curve E.
  • Spreads to ° As described above, it was confirmed that the light distribution angle spreads and the light distribution characteristic is improved by installing the optical member 80.
  • the light distribution characteristic of the illumination light source 1 according to the first embodiment has a light distribution characteristic more similar to an incandescent lamp.
  • the light emitted from the light emitting module 10 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 ° by the optical member 80. If the exit angle is less than 30 °, the spread of the light distribution angle is not sufficient, and good light distribution characteristics can not be obtained. If the exit angle exceeds 60 °, the amount of light directed upward along the lamp axis J And the upper part becomes dim.
  • FIG. 7 is a light distribution curve diagram for explaining the influence of the height of the optical member on the light distribution characteristics of the illumination light source.
  • FIG. 8 is a light distribution curve diagram for explaining the influence of the outer diameter of the optical member on the light distribution characteristics of the illumination light source.
  • the height T of the optical member 80 was fixed at 22 mm, and various changes were made to the outer diameter R1 of the optical member 80 to confirm the light distribution characteristics of the illumination light source 1. As shown in FIG. The light distribution angle for 5 mm (outer diameter R2 is 4 mm) is 175 °, the light distribution angle for outer diameter R1 is 10 mm (outer diameter R2 is 9 mm) is 210 °, and outer diameter R1 is 15 mm (outer diameter R2 is The light distribution angle in the case of 14 mm was 230 °.
  • the light distribution characteristic is better as the outer diameter R1 of the optical member 80 is larger, as long as it does not protrude at least from the upper surface 13a of the sealing body 13 (if it is smaller than the length W3 of one side of the upper surface 13a). It is guessed. And if outer diameter R1 is 5 mm or more, about 180 degrees of light distribution angles are realizable.
  • the outer diameter R1 of the optical member 80 is fixed to 10 mm (the outer diameter R2 is 9 mm) and various changes are made to the height T of the optical member 80 to confirm the light distribution characteristics of the illumination light source 1, FIG.
  • the light distribution angle when the height T is 22 mm is 205 °
  • the light distribution angle when the height T is 25 mm is 235 °
  • the light distribution angle when the height T is 35 mm is 230 °
  • the light distribution angle was 235 ° when the height T was 45 mm. From this result, it was found that the height T of the optical member 80 had little influence on the light distribution characteristic.
  • FIG. 6, FIG. 7, and FIG. 8 are different from each other in the experimental system (the positional relationship between the optical member 80 and the globe 30 is different, etc.). Even, the comparison of light distribution angles between different experimental systems is not effective.
  • the optical member 80 according to the first embodiment is substantially cylindrical, but the optical member according to the present invention is not limited to substantially cylindrical.
  • it may be an approximately square prism-shaped optical member 180 configured by a substantially square tubular outer portion 181 and a substantially prismatic inner portion 182.
  • it may be columnar other than substantially cylindrical shape and substantially regular square prism shape, and shapes other than columnar shape may be sufficient.
  • making the optical member cylindrical is a preferred example for achieving uniform light distribution over the entire circumference centered on the lamp axis J.
  • the upper surface 13a of the sealing body 13 serving as the upper side light emitting surface is substantially square, but the upper surface of the sealing body according to the present invention is not limited to substantially square.
  • the upper surface 213a of the sealing body 213 of the light emitting module 210 may be substantially circular with the center located on the lamp axis J. In this way, the lamp axis J and the center It is easy to obtain uniform light distribution over the entire circumference.
  • the optical member 80 according to the first embodiment is smaller than the upper surface 13a of the sealing body 13 of the light emitting module 10 when viewed from the upper side, but, for example, like the optical member 380 shown in FIG. In view of the above, it may be larger than the upper surface 13 a of the sealing body 13 of the light emitting module 10. In this way, the light emitted from the light emitting module 10 can be diffused further by the optical member 380, but the light emitted upward does not reach the inner surface 32 of the glove 30 directly, thus reducing the amount of light upward.
  • the outer diameter R1 is uniform throughout the vertical direction, but may not be uniform.
  • the shape may be a drum shape in which the outer diameter is reduced (the outer diameter of the middle portion is reduced) in the middle portion in the vertical direction, and a substantially truncated cone shape in which the outer diameter R1 increases toward the lower side. It may be a substantially truncated cone shape in which the outer diameter R1 increases toward the upper side.
  • the optical member 80 includes the outer portion 81 and the inner portion 82 and has a two-layer structure in the radial direction, but may have three or more layers in the radial direction. Even in that case, if all the layers are formed of the translucent material and the refractive index of the translucent material is higher as the outer layer is, the emission light from the light emitting module 10 has an emission angle in the range of 30 ° to 60 °. And the emitted light can be diffused to reach the inner surface 32 of the globe 30 with the maximum luminous intensity.
  • FIG. 12 is a plan view for explaining the light emitting module and the optical member according to the second embodiment.
  • the illumination light source according to the second embodiment is different from the illumination light source 1 according to the first embodiment in that there are a plurality of light emitting modules 410 and a plurality of optical members 480. It is different.
  • the other configuration is basically the same as that of the illumination light source 1 according to the first embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted.
  • the same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
  • the number of light emitting modules 410 is, for example, five, and is arranged on the upper surface 21 of the base 20 in a plane plane symmetrical with respect to the lamp axis J. Specifically, one light emitting module 410 is disposed on the lamp axis J and one on each of the four sides. As described above, even in the case where there are a plurality of light emitting modules 410, mounting on the base 20 is easy as long as the light emitting modules 410 are arranged in a plane.
  • Each light emitting module 410 includes a mounting substrate 411, a semiconductor light emitting element (not shown), and a sealing body 413, and the size is different from that of the light emitting module 10 according to the first embodiment. It is the same.
  • the number of optical members 480 is also five, for example, and each includes an outer side portion 481 and an inner side portion 482, and the size is different from that of the optical member 80 according to the first embodiment. It is.
  • the pillar axis of each optical member 480 is positioned at the center of the upper surface 413a of the sealing body 413 of each light emitting module 410 on the upper side of each light emitting module 410 in a one-to-one relationship with the light emitting module 410. To be arranged.
  • the emitted light from each light emitting module 410 is emitted at an emission angle of 30 ° by each optical member 480
  • the emitted light is diffused so as to reach the inner surface 32 of the globe 30 with the maximum light intensity in the range of ⁇ 60 °, so the light distribution of the illumination light source even if the light emitting module 410 with a narrow illumination angle is arranged The characteristics are good.
  • FIG. 13 is a plan view for explaining the light emitting module and the optical member according to the third embodiment.
  • the illumination light source according to the third embodiment is different from the illumination light source 1 according to the first embodiment in that a plurality of optical members 580 are provided.
  • the other configuration is basically the same as that of the illumination light source 1 according to the first embodiment.
  • the number of optical members 580 is, for example, five, and each of them is composed of an outer portion 581 and an inner portion 582.
  • Each optical member 580 has substantially the same configuration as the optical member 80 according to the first embodiment. However, the outer diameter R1 is smaller than that of the optical member 80.
  • the light emitting module 10 is disposed on the lamp axis J of the upper surface 21 of the base 20, and all the optical members 580 overlap the upper surface 13a of the sealing body 13 of the light emitting module 10 as viewed from above. They are arranged point-symmetrically with respect to the lamp axis J.
  • one optical member 580 is disposed such that the column axis thereof is positioned at the center of the upper surface 13 a of the sealing body 13, and the upper surface 13 a of the sealing body 13 with respect to the optical member 580.
  • Four optical members 580 are disposed in four directions directed to the four corners of.
  • the light emitted from the light emitting module 10 is maximized in the range of the emission angle of 30 ° to 60 ° by the optical members 580 Since the emitted light is diffused so as to reach the inner surface 32 of the globe 30 as the luminous intensity, the light distribution characteristic of the light source for illumination is excellent even if the light emitting module 10 having a narrow irradiation angle is disposed in plane.
  • FIG. 14 is a view for explaining the light emitting module and the optical member according to the fourth embodiment, wherein (a) is a plan view and (b) is a sectional view taken along line AA in (a).
  • the illumination light source according to the fourth embodiment is a first embodiment in that there are a plurality of light emitting modules 610 and there is one optical member 680 for them. This is different from the illumination light source 1 according to.
  • the other configuration is basically the same as that of the illumination light source 1 according to the first embodiment.
  • each light emitting module 610 includes a mounting substrate 611, a semiconductor light emitting element (not shown), and a sealing body 613.
  • the configuration is substantially the same as the light emitting module 10 according to the first embodiment. Less than.
  • the optical member 680 includes an outer portion 681 and an inner portion 682 and has substantially the same configuration as the optical member 80 according to the first embodiment, but the outer diameter R1 is larger than that of the optical member 80.
  • the optical member 680 is disposed on the upper side of the light emitting module 610 with the column axis thereof aligned with the lamp axis J, and the upper surface 613a of the sealing body 613 of the light emitting module 610 disposed on the lamp axis J And covers approximately half of the top surface 613a of the sealing body 613 of each of the light emitting modules 610 arranged in the four directions on the lamp axis J side.
  • a light transmissive material such as a resin is filled in the gap 603 between the sealing bodies 613 of the adjacent light emitting modules 610, and the light emitted from each light emitting module 610 is optically The light is efficiently incident into the member 680.
  • the optical members 680 make the light emitted from each light emitting module 610 have a maximum emission angle in the range of 30 ° to 60 °. Since the emitted light is diffused so as to reach the inner surface 32 of the globe 30 as light intensity, the light distribution characteristic of the light source for illumination is good even if the light emitting module 610 having a narrow irradiation angle is arranged in a plane.
  • FIG. 15 is a partially broken perspective view showing the illumination light source according to the fifth embodiment.
  • FIG. 16 is a cross-sectional view showing the illumination light source according to the fifth embodiment.
  • FIG. 17 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
  • the illumination light source 700 includes a light emitting module 710, a base 720, a globe 30, a circuit unit 40, a circuit holder 750, a case 60, a base 70, an optical member. 780 and a cap member 790.
  • the same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
  • the light emitting module 710 is mounted so as to cover the substantially annular mounting substrate 711, a plurality of semiconductor light emitting devices 712 as light sources mounted on the mounting substrate 711, and the semiconductor light emitting devices 712. And a sealing body 713 provided on the substrate 711.
  • the mounting substrate 711 has a substantially circular hole 714 at the center, and a tongue piece 715 extends from one point on the inner peripheral edge toward the center of the hole 714.
  • a connector 716 to which the wiring 41 of the circuit unit 40 is connected is provided on the lower surface of the tongue piece 715, and the light emitting module 710 and the circuit unit 40 are electrically connected by connecting the wiring 41 to the connector 716. It is connected (see FIG. 16).
  • 32 semiconductor light emitting elements 712 are annularly mounted on the top surface of the mounting substrate 711.
  • 16 sets of semiconductor light emitting elements 712 arranged along the radial direction of the mounting substrate 711 are arranged in an annular shape, with 16 pairs at equal intervals along the circumferential direction of the mounting substrate 711 It is arranged.
  • the term "annular” includes not only annular, but also polygonal annular rings such as triangles, squares, and pentagons. Therefore, the semiconductor light emitting device 712 may be mounted in, for example, an elliptical or polygonal ring shape.
  • the semiconductor light emitting elements 712 are individually sealed by a substantially rectangular parallelepiped sealing body 713 for each set. Therefore, the number of sealing bodies 713 is 16 in all.
  • the longitudinal direction of each sealing body 713 coincides with the radial direction of the mounting substrate 711, and when the lower side is viewed from the upper side along the lamp axis J (in plan view), the lamp axis J is the center It is arranged radially.
  • the base 720 is, for example, a substantially cylindrical shape having a substantially cylindrical through hole 721, and the cylinder axis of the base 720 is disposed in a posture in which it coincides with the lamp axis J.
  • a light emitting module 710 is mounted on the upper surface 722 of the base 720 with the semiconductor light emitting elements 712 directed upward in the main emission direction. Since the through hole 721 is provided in the base 720, the illumination light source 700 is lightweight. Moreover, since a part of the circuit unit 40 is disposed in the through hole 721 and in the globe 30 via the through hole 721, the illumination light source 700 is compact.
  • the circuit holder 750 has, for example, a substantially cylindrical shape opened on both sides, and is constituted by a large diameter portion 752 penetrating the through hole 721 of the base 720 and a small diameter portion 753 to which the mouthpiece 70 is externally fitted. Be done.
  • a bottomed cylindrical cap member 790 is attached to the upper end portion 755 of the large diameter portion 752, and the circuit unit 40 is accommodated inside the large diameter portion 752 and the cap member 790.
  • the circuit holder 750 is provided with a through hole 757 at a position corresponding to the tongue piece 715 of the light emitting module 710.
  • the tip of the tongue portion 715 is inserted into the circuit holder 750 through the through hole 757, and the connector 716 provided on the tongue portion 715 is located in the circuit holder 750.
  • the circuit holder 750 and the base 720 are not in contact with each other, and a gap is provided between the outer surface 756 of the circuit holder 750 and the peripheral surface 723 of the through hole 721 of the base 720. There is. Therefore, the heat generated in the light emitting module 710 is less likely to propagate to the circuit holder 750, and the circuit holder 750 is less likely to have a high temperature, so the circuit unit 40 is less likely to be thermally destroyed.
  • the cap member 790 is a bottomed cylindrical tube that is closed at the upper side and opened at the lower side, and has an upper portion 791 with a gradually decreasing diameter toward the upper side and a cylindrical lower with uniform diameter in the vertical direction.
  • the upper portion 791 is located in the glove 30, and the lower portion 792 is located in the through hole 783 of the optical member 780.
  • a gap is provided between the lower portion 792 and the optical member 780. Therefore, the heat generated in the light emitting module 710 is not easily transmitted to the circuit holder 750 through the optical member 780, and the circuit holder 750 does not easily have a high temperature, so the circuit unit 40 is unlikely to be thermally destroyed.
  • the optical member 780 is a member for diffusing the emitted light so that the emitted light from the light emitting module 710 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. , And the upper side of the light emitting module 710.
  • the optical member 780 is, for example, a substantially frusto-conical shape having a substantially cylindrical through hole 783 at the center (a substantially frusto-conical shape whose outer diameter increases toward the upper side).
  • the lamp axis J is also coincident with the central axis of the portion 781 and the inner portion 782).
  • the central axis of the optical member 780 does not necessarily have to coincide with the lamp axis J, but in order to obtain uniform light distribution over the entire circumference around the lamp axis J, the central axis is a lamp
  • the axis is preferably parallel to the axis J, and more preferably, the central axis and the lamp axis J coincide with each other.
  • the optical member 780 has an inner portion 782 having a substantially truncated conical shape (a substantially conical shape in which the outer diameter increases toward the upper side) having a substantially cylindrical through hole at the center, as shown in FIG. It is comprised by the lower part 782b of 782, and the outer side part 781 which covers the outer peripheral surface 782c.
  • the outer side portion 781 and the inner side portion 782 are made of the same translucent material as the outer side portion 81 and the inner side portion 82 according to the first embodiment.
  • the upper surface 780 a of the optical member 780 is composed of the upper surface 781 a of the outer side portion 781 and the upper surface 782 a of the inner side portion 782.
  • the lower surface 780 b of the optical member 780 is composed of the lower surface 781 b of the outer side portion 781.
  • An outer peripheral surface 780 c of the optical member 780 is constituted by an outer peripheral surface 781 c of the outer side portion 781. There is no gap between the outer side 781 and the inner side 782.
  • the upper surface 780a and the lower surface 780b of the optical member 780 are planes orthogonal to the lamp axis J, respectively, and the outer peripheral surface 780c of the optical member 780 is a slope inclined with respect to the lamp axis J.
  • the upper surface 780a and the lower surface 780b of the optical member 780 are not limited to flat surfaces, and for example, the upper surface 780a of the optical member 780 is emitted from the optical member 780 as a concave surface such as a conical surface or a convex surface such as a conical surface. The degree of diffusion of light may be adjusted.
  • the lower surface 780 b of the optical member 780 to be in contact with the upper surface 713 a of the sealing body 713 is preferably a flat surface.
  • the light emitted from the sealing body 713 of the light emitting module 710 is incident from the lower surface 781 b of the outer portion 781 into the outer portion 781 and is further reflected by the outer peripheral surface 782 c of the inner portion 782 as shown by an optical path L6 in FIG.
  • the light is repeatedly reflected internally in the outer side 781 and emitted from the upper surface 781a of the outer side 781 to the outside of the optical member 780.
  • the light emitted from the sealing body 713 of the light emitting module 710 enters the outer portion 781 from the lower surface 781 b of the outer portion 781 and further enters the lower surface 782 b of the inner portion 782 as shown by an optical path L7 in FIG.
  • the light passes through the inner portion 782 and is emitted from the upper surface 782 a of the inner portion 782 to the outside of the optical member 780.
  • the light is scattered in the inner portion 782 and is incident on the outer portion 781.
  • the light incident on the outer side 781 repeats internal reflection in the outer side 781 and exits the optical member 780 from the upper surface 781 a of the outer side 781.
  • the light emitted from the sealing body 713 of the light emitting module 710 and reflected by the outer peripheral surface 781 c of the outer side portion 781 travels obliquely downward as shown by, for example, an optical path L9 in FIG.
  • the outer peripheral surface 781 c of the outer side portion 781 may be subjected to mirror surface processing. In this way, it is possible to prevent light from entering the outer portion 781 from the outer peripheral surface 781 c.
  • a method of mirror-finishing the outer peripheral surface 781c for example, it is considered to form a reflective film such as a metal thin film or a dielectric multilayer film by a method such as a thermal evaporation method, an electron beam evaporation method, a sputtering method or plating.
  • the light emitted from the light emitting module 710 is diffused by the optical member 780 so as to reach the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. Therefore, more light will reach the lower region of the inner surface 32 of the globe 30, and the light distribution angle of the illumination light source 700 is broadened.
  • the light that has reached the glove 30 is further diffused by the glove 30.
  • the illumination light source 700 can realize a light distribution angle of 270 ° to 310 °.
  • the light distribution angle when the optical member 780 was not present was about 220 °.
  • the upper surface 780a and the outer peripheral surface 780c of the optical member 780 are positioned above the upper end 61 of the case 60 in the direction along the lamp axis J. Is preferred. Furthermore, it is more preferable that the upper surface 713a of the sealing body 713 be positioned above the upper side end 61 of the case 60 in the direction along the lamp axis J.
  • the illumination angle of the light source 700 for illumination can be expanded by the optical member 780 even if the light emitting module 710 having a narrow illumination angle is disposed in a plane, the light distribution characteristic is excellent.
  • the outer side portion 781 exists over the entire outer periphery of the optical member 780, the irradiation angle can be extended over the entire periphery around the lamp axis J, and the light distribution characteristic over the entire periphery Is good.
  • FIG. 18 is a view for explaining an optical member according to a sixth embodiment, wherein (a) is a cross-sectional view, and (b) is a schematic view for explaining a diffusion mode of outgoing light by the optical member. It is.
  • members other than the optical member and the light emitting module are omitted.
  • the illumination light source 800 has a point in which the upper surface 880a and the lower surface 880b of the optical member 880 are not flat, and between the optical member 880 and the light emitting module 10.
  • the light source 1 differs from the light source 1 for illumination according to the first embodiment in that a gap 801 is provided.
  • the other configuration is basically the same as that of the illumination light source 1 according to the first embodiment.
  • the optical member 880 is a member for diffusing the emitted light so that the emitted light from the light emitting module 10 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. 18A, supported by a pair of supporting members 890 attached to the upper surface 21 of the base 20, and disposed above the light emitting module 10 in a state of being separated from the light emitting module 10, ing.
  • Each support member 890 includes a pedestal 891 screwed to the base 20, and a post 892 extended to the pedestal 891.
  • the light emitting module 10 is fixed to the base 20 at the base end of the post 892
  • a hook-shaped fixing portion 893 is provided, and a grip portion 894 having a substantially U-shaped cross section for gripping and fixing the optical member 880 from above and below is provided at the tip of the support 892.
  • the optical member 880 has, for example, a cylindrical outer portion 881 whose cylindrical axis is parallel to the lamp axis J, and a columnar inner portion 882 packed in the cylinder of the outer portion 881. More specifically, the optical member 880 has a cylindrical shape, and the outer side portion 881 has a cylindrical shape having a cylindrical axis coincident with the lamp axis J, and the inner side 882 is tightly packed in the cylinder of the outer side portion 881. It has a cylindrical shape, and its column axis coincides with the lamp axis J.
  • the upper surface 880a of the optical member 880 is composed of the upper surface 881a of the outer side portion 881 and the upper surface 882a of the inner side portion 882.
  • the lower surface 880 b of the optical member 880 is composed of the lower surface 881 b of the outer side portion 881 and the lower surface 882 b of the inner side portion 882.
  • the upper surface 880a and the lower surface 880b of the optical member 880 are curved surfaces, respectively.
  • the outer side portion 881 and the inner side portion 882 are each made of a translucent material. However, the material of the inner portion 882 has a lower refractive index than the material of the outer portion 881.
  • the light emitted from the upper side light emitting surface 13a of the light emitting module 10 and incident on the optical member 880 is collected at the outer portion 881 formed of a material having a higher refractive index, as shown by an optical path L10 in FIG. The light is emitted mainly from the upper surface 881 a of the outer side portion 881.
  • the light emitted from the upper surface 881a of the outer portion 881 is not mainly emitted upward along the lamp axis J, but is emitted mainly at an emission angle in the range of 30 ° to 60 ° with respect to the lamp axis J. Be done.
  • the upper surface 880a of the optical member 880 is a light collecting surface that condenses light emitted from the inside of the optical member 880 through the upper surface 880a to the outside toward the top 33 of the globe 30.
  • the upper surface 880a has a concave surface shape which is recessed toward the light emitting module 10, and emits light on a cut surface (hereinafter referred to as "longitudinal surface") when cut by a virtual plane including the lamp axis J It has a substantially elliptical arc shape recessed to the module 10 side.
  • the light emitted from the upper surface 880a of the optical member 880 converges on the top 33 of the globe 30, as shown by the optical path L11 in FIG. 18 (b). Therefore, the top 33 of the glove 30 can be brightened, and the light distribution characteristic can be further improved.
  • the lower surface 880 b of the optical member 880 is a reflecting surface that reflects part of the light emitted from the light emitting module 10 toward the skirt 34 of the glove 30.
  • the lower surface 880b has a convex curved surface shape that protrudes to the light emitting module 10 side, and has a substantially elliptical arc shape that bulges to the light emitting module 10 side in the longitudinal cross section.
  • a part of the light emitted from the light emitting module 10 and incident on the lower surface 880b of the optical member 880 is reflected obliquely downward and reaches the skirt portion 34 of the glove 30, as shown by an optical path L12 in FIG. Therefore, the skirt 34 of the glove 30 can be brightened, and the light distribution characteristic can be made better.
  • a gap 801 is provided between the optical member 880 and the light emitting module 10. Since the optical member 880 is disposed apart from the light emitting module 10, the optical member 880 and the light emitting module 10 are not in contact with each other. Therefore, the lower surface 880b of the optical member 880 is not in contact with the upper side light emitting surface 13a of the light emitting module 10, and the lower surface 880b of the optical member 880 and the upper side light emitting surface 13a of the light emitting module 10 are separated. The light reflected by 880 b does not go to the light emitting module 10 or the base 20 and easily reaches the skirt 34 of the glove 30. In addition, since the optical member 80 is not in contact with the light emitting module 10, it is difficult for a load or stress to be applied to the upper side light emitting surface 13a of the light emitting module 10.
  • FIG. 19 is a light distribution curve diagram for explaining the light distribution characteristic of the optical member according to the sixth embodiment.
  • the light distribution characteristic of the optical member 880 according to the sixth embodiment is compared with the light distribution characteristic of the optical member 80 according to the first embodiment, as shown in FIG. It is the same in that the incident light reaches the inner surface 32 of the glove 30 with the maximum luminous intensity in the range of the output angle of 30 ° to 60 °.
  • the optical member 880 according to the sixth embodiment since the upper surface 880a is a light collecting surface, the light intensity near the emission angle of 0 ° is higher than that of the optical member 80 according to the first embodiment. .
  • the lower surface 880b is a reflective surface, the light intensity near the emission angle of 90 ° is higher than that of the optical member 80 according to the first embodiment.
  • the upper surface 880a is a light condensing surface
  • the lower surface 880b is a reflective surface
  • a gap 801 is provided between the optical member 880 and the light emitting module 10.
  • the configuration is not limited to the configuration that satisfies all three points, and it is sufficient to satisfy at least one of the three points.
  • FIG. 20 is a cross-sectional view for explaining an optical member according to a modification of the sixth embodiment.
  • the upper surface 880Aa of the optical member 880A is a flat surface and is not a condensing surface, but the lower surface 880Ab is a reflective surface.
  • a gap 801A is provided. In this case, although it is not easy to collect light on the top portion 33 of the glove 30, light easily reaches the skirt portion 34 of the glove 30.
  • the upper surface 880 Ba of the optical member 880 B is a condensing surface, but the lower surface 880 Bb is not a reflecting surface, and a gap 801 B is formed between the optical member 880 B and the light emitting module 10. Is provided. In this case, although it is easy to collect light on the top portion 33 of the glove 30, light does not easily reach the skirt portion 34 of the glove 30.
  • the upper surface 880Ca is a light collecting surface
  • the lower surface 880Cb is also a reflecting surface
  • a gap 801C is also provided between the light emitting module 10 It is done.
  • the optical member 880C is in contact with the light emitting module 10 near the lamp axis J, and there is no gap on the lamp axis J, and the gap 801C exists in the outer peripheral region of the lower surface 880Cb and the upper light emitting surface 13a Between the peripheral region of In this case, it is easy to collect light on the top 33 of the glove 30 and light can easily reach the skirt 34 of the glove 30.
  • At least the outer peripheral region of the lower surface 880Cb of the optical member 880C is a reflective surface, and a gap 801C is provided between the outer peripheral region of the lower surface 880Cb of the optical member 880C and the upper light emitting surface of the light emitting module 10. If it is made, the emitted light from the outer peripheral region of the upper side light emitting surface 13a can be efficiently delivered to the skirt portion 34 of the glove 30. Further, it is possible to fix the optical member 880C to the light emitting module 10 at a position where the optical member 880C on the lamp axis J is in contact with the light emitting module 10.
  • the light collecting surface of the upper surface of the optical member is not limited to a substantially elliptical arc shape recessed on the side of the light emitting module 10 in the vertical cross section, as long as the light collecting surface can collect light on the top 33 of the globe 30.
  • the light collecting surface of the upper surface 880Da may be substantially V-shaped recessed toward the light emitting module 10 in the longitudinal cross section. Also in this case, the effect of brightening the top 33 of the glove 30 is achieved.
  • the reflecting surface of the lower surface of the optical member is not limited to the substantially elliptical arc shape projecting to the light emitting module 10 side in the longitudinal cross section, as long as the light easily reaches the skirt portion 34 of the globe 30.
  • the reflecting surface of the lower surface 880Db may have a substantially V shape protruding toward the light emitting module 10 in the vertical cross section. Also in this case, an effect of brightening the skirt portion 34 of the glove 30 is exerted.
  • the entire upper surface does not have to be a light collecting surface, and only a part of the upper surface may be a light collecting surface.
  • the upper surface 880Ea of the optical member 880E shown in FIG. 20 (e) it is a plane that is not a light collecting surface near the lamp axis J, and an annular light collecting surface is formed in the outer peripheral region outside the plane. Also good.
  • the entire lower surface does not have to be a reflective surface, and only a part of the lower surface may be a reflective surface.
  • the lower surface 880Eb of the optical member 880E shown in FIG. 20 (e) it is a plane that is not a condensing surface near the lamp axis J, and an annular reflective surface is formed in the outer peripheral region outside that plane. good. Also in this case, the light emitted from the outer peripheral region of the upper side light emitting surface 13a can be efficiently delivered to the skirt portion 34 of the glove 30.
  • the optical members may have different types of shapes of the light collecting surface on the upper surface and the reflecting surface on the lower surface.
  • the upper surface 880Fa has a substantially elliptical arc shape projecting toward the light emitting module 10 in the longitudinal cross section, but the lower surface 880Fb is a plane near the lamp axis J
  • an annular light collecting surface may be formed on the outside of the flat surface, and the flat surface portion of the lower surface 880Fb may be fixed to the light emitting module 10.
  • the configuration of the present invention has been described above based on the first to sixth embodiments and their modifications, but the present invention is not limited to the above embodiments.
  • the illumination light source may be configured by partially combining the configurations according to the first to sixth embodiments and the configurations according to the modifications thereof.
  • the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and are not limited thereto.
  • the present invention can be widely used in lighting in general.

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  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract

The purpose of the present invention is to provide an illumination light source that has favorable light distribution properties and is simple to assemble. An illumination light source (1) having one or a plurality of light-emitting modules (10) which serve as light sources accommodated in an outer enclosure (2) constituted by a cylindrical case (60) having an opening at the top, which is the illumination direction, and a globe (30) mounted above the case (60) so as to close the opening, wherein all of the light-emitting modules (10) within the outer enclosure (2) are disposed flat with the primary emission direction directed upwards; above the light-emitting modules (10) one or a plurality of optical members (80) for diffusing emitted light from the light-emitting modules (10) are disposed so that the emitted light attains a maximum luminosity at an emission angle in the range of 30° to 60° when it reaches an inner surface (32) of the globe (30).

Description

照明用光源Lighting light source
 本発明は、発光モジュールを利用した照明用光源に関し、特に配光特性の改良技術に関する。 The present invention relates to a light source for illumination using a light emitting module, and more particularly to a technology for improving light distribution characteristics.
 近年、白熱電球の代替品として、LED(Light Emitting Diode)などの半導体発光素子を有する発光モジュールを利用した電球形の照明用光源が普及しつつある。 2. Description of the Related Art In recent years, a bulb-shaped illumination light source using a light emitting module having a semiconductor light emitting element such as a light emitting diode (LED) as a substitute for an incandescent lamp has been widely used.
 このような照明用光源は、照射角の狭いLEDを光源としているため、白熱電球と比べて配光特性が狭いという課題を有している。そこで、図21に示すように、特許文献1に記載の照明用光源900は、基台901が、第1基台部902と、第1基台部902の上面の一部の領域から逆錐台状に突出する第2基台部903とからなり、第1基台部902の上面には第1のLED904が配置され、第2基台部903の上面には第2のLED905が配置され、第2基台部903を上方から第1基台部902へ投影した場合においてその投影域内に第1のLED904の発光面が存在し、第2基台部903の側面が光反射面906となった構成としている。この構成によって、第1のLED904からの出射光を光反射面906によって斜め下方へ反射させることで、LEDの照射角の狭さを補って、比較的良好な配光特性を実現している。 Such a light source for illumination has a problem that the light distribution characteristic is narrower than that of an incandescent lamp, because the light source is an LED with a narrow irradiation angle. Therefore, as shown in FIG. 21, in the illumination light source 900 described in Patent Document 1, the base 901 is an inverted pyramid from the first base portion 902 and a partial region of the upper surface of the first base portion 902. The first LED 904 is disposed on the upper surface of the first pedestal portion 902, and the second LED 905 is disposed on the upper surface of the second pedestal portion 903. When the second base portion 903 is projected from above onto the first base portion 902, the light emitting surface of the first LED 904 exists in the projection area, and the side surface of the second base portion 903 is the light reflecting surface 906 It is assumed that it has become With this configuration, the emitted light from the first LED 904 is reflected obliquely downward by the light reflecting surface 906, thereby compensating for the narrowness of the irradiation angle of the LED and realizing relatively good light distribution characteristics.
特開2010-86946号公報JP, 2010-86946, A
 しかしながら、特許文献1に記載の照明用光源900の場合、第1基台部902の上面と第2基台部903の上面とがLEDの搭載面であり、それら2つの搭載面に別途LED904,905を搭載しなければならないため、LEDの搭載面が1つだけの場合と比べて組立作業が煩雑である。すなわち、例えば、ロボットを用いてLEDを搭載する場合に、全てのLEDを平面配置するのであれば高さ方向のセッティングが不要であるが、高さの違う搭載面が2つ存在していると、それぞれの高さに対応するための高さ方向のセッティングが必要であり、その結果、ロボット操作が複雑化したり作業速度が低下したりする。 However, in the case of the illumination light source 900 described in Patent Document 1, the upper surface of the first base portion 902 and the upper surface of the second base portion 903 are the mounting surfaces of the LEDs, and the two mounting surfaces separately include the LED 904, Since the 905 has to be mounted, the assembling operation is more complicated than the case where the mounting surface of the LED is only one. That is, for example, when mounting LEDs using a robot, if all LEDs are arranged in a plane, setting in the height direction is unnecessary, but if two mounting surfaces having different heights are present This requires setting in the height direction to correspond to each height, resulting in complicated robot operation and reduced working speed.
 本発明は、上記のような課題に鑑みてなされたものであって、配光特性が良好かつ組立作業が簡単な照明用光源を提供することを目的とする。 The present invention has been made in view of the problems as described above, and it is an object of the present invention to provide a light source for illumination having good light distribution characteristics and easy assembly work.
 本発明に係る照明用光源は、照明方向である上方側に開口を有する筒状のケースと、前記ケースの上方側に前記開口を塞ぐように取り付けられたグローブとで構成される外囲器内に、光源としての1または複数の発光モジュールが収容された照明用光源であって、前記外囲器内の全ての発光モジュールは、主出射方向を上方に向けた姿勢で平面配置されており、前記発光モジュールの上方側には、前記発光モジュールからの出射光が出射角30°~60°の範囲で最大光度となって前記グローブの内面に届くように、前記出射光を拡散させる1または複数の光学部材が配置されていることを特徴とする。 An illumination light source according to the present invention includes an inside of an envelope including a cylindrical case having an opening on the upper side which is an illumination direction, and a glove attached to the upper side of the case so as to close the opening. A light source for illumination containing one or more light emitting modules as a light source, wherein all the light emitting modules in the envelope are flatly arranged with the main emission direction facing upward, At the upper side of the light emitting module, one or more diffuses the emitted light so that the light emitted from the light emitting module reaches the inner surface of the globe with maximum luminous intensity in the range of the emission angle of 30 ° to 60 ° The optical member of the present invention is disposed.
 本発明に係る照明用光源は、外囲器内の全ての発光モジュールが主出射方向を上方に向けた姿勢で平面配置されている構成であるため、発光モジュールの取り付けが容易であり、ひいては照明用光源の組立作業が簡単である。さらに、発光モジュールの上方側には、前記発光モジュールからの出射光が出射角30°~60°の範囲で最大光度となって前記グローブの内面に届くように前記出射光を拡散させる1または複数の光学部材が配置されているため、照射角が狭い発光モジュールが平面配置されていても照明用光源の配光特性が良好である。 Since the light source for illumination according to the present invention has a configuration in which all the light emitting modules in the envelope are flatly arranged with the main emission direction facing upward, the mounting of the light emitting modules is easy, and hence the illumination The assembly work of the light source is simple. Furthermore, on the upper side of the light emitting module, one or more of the emitted light is diffused so that the light emitted from the light emitting module reaches the inner surface of the globe with maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. Because the above optical members are disposed, the light distribution characteristics of the illumination light source are excellent even if the light emitting module having a narrow irradiation angle is disposed in a plane.
第1の実施形態に係る照明用光源を示す一部破断斜視図Partially broken perspective view showing the illumination light source according to the first embodiment 第1の実施形態に係る照明用光源を示す断面図Sectional drawing which shows the light source for illumination which concerns on 1st Embodiment. 回路ホルダを示す斜視図Perspective view showing the circuit holder 光学部材による出射光の拡散の態様を説明するための概略図Schematic for explaining the aspect of diffusion of emitted light by an optical member 第1の実施形態に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a first embodiment 第1の実施形態に係る照明用光源の配光特性を説明するための配光曲線図Light distribution curve for explaining the light distribution characteristic of the illumination light source according to the first embodiment 光学部材の高さが照明用光源の配光特性に与える影響を説明するための配光曲線図Light distribution curve for explaining the influence of the height of the optical member on the light distribution characteristics of the light source for illumination 光学部材の外径が照明用光源の配光特性に与える影響を説明するための配光曲線図Light distribution curve for explaining the influence of the outer diameter of the optical member on the light distribution characteristics of the illumination light source 変形例に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a modification 変形例に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a modification 変形例に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a modification 第2の実施形態に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a second embodiment 第3の実施形態に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a third embodiment 第4の実施形態に係る発光モジュールおよび光学部材を説明するための平面図A plan view for explaining a light emitting module and an optical member according to a fourth embodiment 第5の実施形態に係る照明用光源を示す一部破断斜視図Partially broken perspective view showing the illumination light source according to the fifth embodiment 第5の実施形態に係る照明用光源を示す断面図Sectional drawing which shows the light source for illumination which concerns on 5th Embodiment. 図16において二点鎖線で囲んだ部分を示す拡大断面図An enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG. 第6の実施形態に係る光学部材を説明するための図A figure for explaining an optical member concerning a 6th embodiment 第6の実施形態に係る光学部材の配光特性を説明するための配光曲線図Light distribution curve for explaining the light distribution characteristic of the optical member according to the sixth embodiment 第6の実施形態の変形例に係る光学部材を説明するための断面図Sectional drawing for demonstrating the optical member which concerns on the modification of 6th Embodiment 従来の照明用光源を示す断面図Cross section showing a conventional light source for illumination
 以下、本発明の実施の形態に係る照明用光源について、図面を参照しながら説明する。なお、各図面における部材の縮尺は実際のものとは異なる。また、本願において、数値範囲を示す際に用いる符号「~」は、その両端の数値を含む。 Hereinafter, a light source for illumination according to an embodiment of the present invention will be described with reference to the drawings. The scale of members in each drawing is different from the actual one. Further, in the present application, the symbol “to” used to indicate a numerical range includes the numerical values at both ends thereof.
 <第1の実施形態>
 [概略構成]
 図1は、第1の実施形態に係る照明用光源を示す一部破断斜視図である。図2は、第1の実施形態に係る照明用光源を示す断面図である。なお、図2において紙面上下方向に沿って描かれた一点鎖線は照明用光源のランプ軸Jを示しており、紙面上方が照明用光源の照明方向である上方であって、紙面下方が照明用光源の下方である。
First Embodiment
[Schematic configuration]
FIG. 1 is a partially broken perspective view showing the illumination light source according to the first embodiment. FIG. 2 is a cross-sectional view showing the illumination light source according to the first embodiment. In FIG. 2, the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J of the light source for illumination, and the upper side of the drawing is the upper direction which is the illumination direction of the illumination light source Below the light source.
 図1および図2に示すように、第1の実施形態に係る照明用光源1は、白熱電球の代替品となるLEDランプであって、光源としての発光モジュール10と、発光モジュール10が搭載された基台20と、発光モジュール10を覆うグローブ30と、発光モジュール10を点灯させるための回路ユニット40と、回路ユニット40を収容した回路ホルダ50と、回路ホルダ50を覆うケース60と、回路ユニット40と電気的に接続された口金70と、発光モジュール10からの出射光を拡散させるための光学部材80とを備える。照明用光源1の外囲器2は、グローブ30とケース60とで構成され、外囲器2内に発光モジュール10および光学部材80が収容されている。 As shown in FIGS. 1 and 2, the illumination light source 1 according to the first embodiment is an LED lamp that is a substitute for an incandescent lamp, and is provided with a light emitting module 10 as a light source and a light emitting module 10. Base 20, globe 30 covering light emitting module 10, circuit unit 40 for lighting light emitting module 10, circuit holder 50 accommodating circuit unit 40, case 60 covering circuit holder 50, circuit unit 40 and an optical member 80 for diffusing the light emitted from the light emitting module 10. The envelope 2 of the illumination light source 1 is configured of a glove 30 and a case 60, and the light emitting module 10 and the optical member 80 are accommodated in the envelope 2.
 [各部構成]
 (1)発光モジュール
 図2に示すように、発光モジュール10は、実装基板11と、実装基板11に実装された半導体発光素子12と、半導体発光素子12を被覆するように実装基板11上に設けられた封止体13とを備える半導体発光モジュールであって、ランプ軸J上に配置されている。なお、本実施の形態では、半導体発光素子12はLEDであり、発光モジュール10はLEDモジュールであるが、半導体発光素子12は、例えば、LD(レーザダイオード)であっても良く、EL素子(エレクトリックルミネッセンス素子)であっても良い。
[Part configuration]
(1) Light Emitting Module As shown in FIG. 2, the light emitting module 10 is provided on the mounting substrate 11 so as to cover the mounting substrate 11, the semiconductor light emitting device 12 mounted on the mounting substrate 11, and the semiconductor light emitting device 12. The semiconductor light emitting module includes the sealed body 13 and is disposed on the lamp axis J. In the present embodiment, the semiconductor light emitting element 12 is an LED, and the light emitting module 10 is an LED module. However, the semiconductor light emitting element 12 may be, for example, an LD (laser diode). It may be a luminescent element).
 実装基板11は、例えば、上方から見て(平面視において)略正方形の板状であって、基台20の上面21に取り付けられている。なお、本願において、上方側から見てとは、上方側からランプ軸Jに沿って下方側を見ての意味であり、例えば図2においては、紙面上側からランプ軸Jに沿って紙面下側を見ての意味である。 The mounting substrate 11 is, for example, a substantially square plate shape (in plan view) when viewed from above (in plan view), and is attached to the upper surface 21 of the base 20. In the present application, looking from the upper side means looking at the lower side along the lamp axis J from the upper side, and in FIG. 2, for example, from the upper side to the paper lower side along the lamp axis J It is the meaning of looking at.
 半導体発光素子12は、実装基板11の上面に、例えばマトリクス状に5行5列の計25個が実装されており、それら半導体発光素子12は、ランプ軸Jを中心として点対称となるように平面配置されている。また、各半導体発光素子12は、それぞれの主出射方向がランプ軸Jに沿った上方に向けた姿勢で実装されている。 The semiconductor light emitting elements 12 are mounted on the upper surface of the mounting substrate 11, for example, in a total of 25 rows of 5 rows and 5 columns, and the semiconductor light emitting elements 12 are point symmetrical about the lamp axis J It is arranged flat. Each semiconductor light emitting element 12 is mounted in a posture in which each main emission direction is directed upward along the lamp axis J.
 なお、半導体発光素子12の数は25個に限定されず、例えば1個であっても良いし25個以外の複数であっても良い。また、半導体発光素子12の配置もマトリックス状に限定されず、例えば円環状などの環状に配置されていても良い。さらに、半導体発光素子12の姿勢は、半導体発光素子12の全てがランプ軸J方向に沿った上方に向いている必要はなく、一部がランプ軸Jに対して斜めに傾いた方向に向けた姿勢で実装されていても良く、これにより配光の制御性がより向上して、より好ましい配光を得ることができる。 The number of semiconductor light emitting elements 12 is not limited to 25. For example, the number of semiconductor light emitting elements 12 may be one or plural other than 25. Further, the arrangement of the semiconductor light emitting elements 12 is not limited to a matrix, and may be arranged in an annular shape such as an annular shape. Furthermore, the attitude of the semiconductor light emitting element 12 is such that all the semiconductor light emitting elements 12 do not have to be directed upward along the lamp axis J direction, and a part is directed obliquely to the lamp axis J It may be mounted in an attitude, whereby controllability of light distribution is further improved, and more preferable light distribution can be obtained.
 封止体13は、例えばブロック状であって、25個全ての半導体発光素子12を封止している。封止体13の上面13aは、上方から見て略正方形の平面であって、発光モジュール10の上方側発光面を構成しており、上面13aとランプ軸Jとは、上面13aの中心において直交している。なお、上面13aとランプ軸Jとは、必ずしも上面13aの中心において直交している必要はないが、ランプ軸Jを中心とする全周に亘って均一な配光を得るためには、上面13aの中心において交差していることが好ましく、直交していることがより好ましい。 The sealing body 13 has, for example, a block shape, and seals all 25 semiconductor light emitting elements 12. The upper surface 13a of the sealing body 13 is a substantially square plane when viewed from above, and constitutes the upper side light emitting surface of the light emitting module 10. The upper surface 13a and the lamp axis J are orthogonal to each other at the center of the upper surface 13a. doing. The upper surface 13a and the lamp axis J do not necessarily have to be orthogonal to each other at the center of the upper surface 13a. However, in order to obtain uniform light distribution over the entire circumference around the lamp axis J, the upper surface 13a Preferably, they intersect at the center of and more preferably orthogonal.
 封止体13は、主として透光性材料からなるが、半導体発光素子12から発せられた光の波長を所定の波長へと変換する必要がある場合には、前記透光性材料に光の波長を変換する波長変換材料が混入される。透光性材料としては、例えばシリコーン樹脂を利用することができ、波長変換材料としては、例えば蛍光体粒子を利用することができる。 The sealing body 13 is mainly made of a translucent material, but when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength of the light of the translucent material is used. The wavelength conversion material is mixed to convert the For example, a silicone resin can be used as the translucent material, and phosphor particles can be used as the wavelength conversion material, for example.
 本実施の形態では、青色光を出射する半導体発光素子12と、青色光を黄色光に波長変換する蛍光体粒子が混入された透光性材料で形成された封止体13とが採用されており、半導体発光素子12から出射された青色光の一部が封止体13によって黄色光に波長変換され、未変換の青色光と変換後の黄色光との混色により生成される白色光が発光モジュール10から出射される。 In the present embodiment, semiconductor light emitting element 12 emitting blue light and sealing body 13 formed of a translucent material mixed with phosphor particles for wavelength converting blue light to yellow light are adopted. A part of the blue light emitted from the semiconductor light emitting element 12 is wavelength-converted to yellow light by the sealing body 13 and white light generated by mixing of unconverted blue light and converted yellow light is emitted. It is emitted from module 10.
 なお、発光モジュール10は、例えば、紫外線発光の半導体発光素子と三原色(赤色、緑色、青色)に発光する各色蛍光体粒子とを組み合わせたものでも良い。さらに、波長変換材料として半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を利用しても良い。 The light emitting module 10 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and each color phosphor particle emitting light in three primary colors (red, green and blue). Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
 (2)基台
 基台20は、例えば略円板状であり、その上面21および下面22は、いずれも略円形の平面であって、それぞれランプ軸Jと直交している。基台20の上面21には、発光モジュール10が平面配置されており、例えば、ねじ止め、接着、係合などにより基台20に固定されている。なお、上面21は略円形に限定されず、どのような形状であっても良い。また、上面21は、発光モジュール10を平面配置できるのであれば、必ずしも全体が平面である必要はない。さらに、下面22も平面に限定されない。
(2) Base The base 20 is, for example, a substantially disc shape, and the upper surface 21 and the lower surface 22 are both substantially circular flat surfaces, and are orthogonal to the lamp axis J, respectively. The light emitting module 10 is disposed on the upper surface 21 of the base 20 in a plan view, and is fixed to the base 20 by, for example, screwing, bonding, and engagement. The upper surface 21 is not limited to a substantially circular shape, and may have any shape. Moreover, as long as the top surface 21 can arrange the light emitting module 10 in a plane, the whole does not necessarily have to be a plane. Furthermore, the lower surface 22 is not limited to a flat surface.
 基台20には、上下方向に貫通する一対の貫通孔23が形成されており、これら貫通孔23を介して回路ユニット40の一対の配線41が基台20の上方側に導出されている。それら配線41は、それぞれ発光モジュール10の実装基板11に接続されており、これにより発光モジュール10と回路ユニット40とが電気的に接続されている。 A pair of through holes 23 penetrating in the vertical direction is formed in the base 20, and the pair of wires 41 of the circuit unit 40 are led out to the upper side of the base 20 through the through holes 23. The wires 41 are respectively connected to the mounting substrate 11 of the light emitting module 10, whereby the light emitting module 10 and the circuit unit 40 are electrically connected.
 基台20は、例えば金属材料からなり、金属材料としては、例えばAl、Ag、Au、Ni、Rh、Pd、またはそれらの内の2以上からなる合金、またはCuとAgの合金などが考えられる。このような金属材料は、熱伝導性が良好であるため、発光モジュール10で発生した熱をケース60に効率良く伝導させることができる。 The base 20 is made of, for example, a metal material, and as the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, etc. can be considered. . Such a metal material has good thermal conductivity, so that the heat generated by the light emitting module 10 can be efficiently conducted to the case 60.
 (3)グローブ
 グローブ30は、本実施の形態では、一般電球形状であるA型の電球のバルブを模した形状であり、グローブ30の開口側端部31をケース60の上方側開口内に圧入することにより、発光モジュール10および光学部材80の上方を覆った状態で、ケース60の上方側開口を塞ぐようにして、ケース60の上方側端部61に取り付けられている。なお、グローブ30の形状は、A型の電球のバルブを模した形状に限定されず、どのような形状であっても良い。また、グローブ30は接着剤などによりケース60に固定されていても良い。
(3) Glove Glove 30, in the present embodiment, has a shape that simulates a bulb of A-type bulb which is a general bulb shape, and the opening side end 31 of the glove 30 is press-fit into the upper side opening of the case 60 Thus, the upper side opening 61 of the case 60 is attached to the upper side end 61 of the case 60 so as to close the upper side opening of the case 60 while covering the upper side of the light emitting module 10 and the optical member 80. In addition, the shape of the glove | globe 30 is not limited to the shape which imitated the bulb | bulb of a A-type light bulb, What kind of shape may be sufficient. In addition, the glove 30 may be fixed to the case 60 by an adhesive or the like.
 グローブ30の内面32には、発光モジュール10から発せられた光を拡散させる拡散処理、例えば、シリカや白色顔料等による拡散処理が施されている。グローブ30の内面32に入射した光はグローブ30を透過しグローブ30の外部へと取り出される。グローブ30の最大外径W1は、ケース60の上方側端部61の外径W2よりも大きい。したがって、グローブ30の外部へ取り出される光が下方側へ回り込み易く、より大きな配光角を得ることができる。 The inner surface 32 of the globe 30 is subjected to a diffusion process for diffusing light emitted from the light emitting module 10, for example, a diffusion process using silica, a white pigment, or the like. The light incident on the inner surface 32 of the globe 30 passes through the globe 30 and is extracted to the outside of the globe 30. The maximum outer diameter W1 of the glove 30 is larger than the outer diameter W2 of the upper end 61 of the case 60. Therefore, the light extracted to the outside of the globe 30 can easily move downward and a larger light distribution angle can be obtained.
 (4)回路ユニット
 回路ユニット40は、半導体発光素子を点灯させるためのものであって、回路基板42と、当該回路基板42の一方の主面42a側に実装された各種の電子部品43,44とを有している。なお、図2では一部の電子部品にのみ符号を付している。回路ユニット40は、回路ホルダ50内に収容されており、例えば、ネジ止め、接着、係合などにより回路ホルダ50に固定されている。
(4) Circuit Unit The circuit unit 40 is for lighting the semiconductor light emitting element, and includes the circuit board 42 and various electronic components 43 and 44 mounted on the main surface 42 a of the circuit board 42. And. In FIG. 2, only some electronic components are denoted by reference numerals. The circuit unit 40 is accommodated in the circuit holder 50, and is fixed to the circuit holder 50 by, for example, screwing, bonding, and engagement.
 回路基板42は、その主面がランプ軸Jと平行する姿勢で配置されている。このようにすれば、回路ホルダ50内に回路ユニット40をよりコンパクトに格納することができる。また、回路ユニット40は、熱に弱い電子部品43が発光モジュール10から遠い下方側に位置し、熱に強い電子部品44が発光モジュール10に近い上方側に位置するように配置されている。このようにすれば、熱に弱い電子部品44が発光モジュール10で発生する熱によって熱破壊され難い。 The circuit board 42 is disposed such that its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored more compactly in the circuit holder 50. The circuit unit 40 is disposed such that the heat-sensitive electronic component 43 is located on the lower side far from the light emitting module 10 and the heat-resistant electronic component 44 is located on the upper side closer to the light emitting module 10. In this way, the heat-resistant electronic component 44 is less likely to be thermally destroyed by the heat generated by the light emitting module 10.
 回路ユニット40と口金70とは、電気配線45,46によって電気的に接続されている。電気配線45は、回路ホルダ50に設けられた貫通孔51を通って、口金70のシェル部71と接続されている。また、電気配線46は、回路ホルダ50の下方側開口54を通って、口金70のアイレット部73と接続されている。 The circuit unit 40 and the base 70 are electrically connected by electrical wires 45 and 46. The electrical wiring 45 is connected to the shell portion 71 of the base 70 through the through hole 51 provided in the circuit holder 50. Further, the electrical wiring 46 is connected to the eyelet portion 73 of the base 70 through the lower opening 54 of the circuit holder 50.
 (5)回路ホルダ
 回路ホルダ50は、例えば、両側が開口した略円筒状であって、大径部52と小径部53とで構成される。上方側に位置する大径部52には回路ユニット40の大半が収容されている。一方、下方側に位置する小径部53には口金70が外嵌されており、これによって回路ホルダ50の下方側開口54が塞がれている。回路ホルダ50は、例えば、樹脂などの絶縁性材料で形成されていることが好ましい。
(5) Circuit Holder The circuit holder 50 has, for example, a substantially cylindrical shape with both sides open, and is configured of a large diameter portion 52 and a small diameter portion 53. The large diameter portion 52 located on the upper side accommodates most of the circuit unit 40. On the other hand, a base 70 is externally fitted to the small diameter portion 53 located on the lower side, whereby the lower side opening 54 of the circuit holder 50 is closed. The circuit holder 50 is preferably made of, for example, an insulating material such as a resin.
 回路ホルダ50の上方側には基台20が位置しているが、回路ホルダ50の上方側端部55と基台20とは接触しておらず、隙間が設けられている、また、回路ホルダ50の外面56とケース60の内周面62とは接触しておらず、隙間が設けられている。したがって、発光モジュール10で発生した熱が、基台20やケース60を介して回路ホルダ50へ伝搬し難く、回路ホルダ50が高温になり難いため、回路ユニット40が熱破壊し難い。 Although the base 20 is located above the circuit holder 50, the upper end 55 of the circuit holder 50 and the base 20 are not in contact with each other, and a gap is provided. The outer surface 56 of 50 and the inner circumferential surface 62 of the case 60 are not in contact with each other, and a gap is provided. Therefore, the heat generated in the light emitting module 10 is difficult to propagate to the circuit holder 50 through the base 20 and the case 60, and the circuit holder 50 does not easily have a high temperature, so the circuit unit 40 is unlikely to be thermally destroyed.
 図3は、回路ホルダを示す斜視図である。回路ホルダ50の大径部52の内周面52aには、回路ユニット40の回路基板42を回路ホルダ50に固定するための一対のレール溝57が、互いに対向するように設けられている。一対のレール溝57は、回路基板42がランプ軸J(図2参照)と平行になる姿勢、すなわち縦置きの姿勢で、回路ユニット40を回路ホルダ50に固定するためのものであって、各レール溝57は、大径部52の内周面52に沿って上下方向に延出しており、回路基板42の両側縁部をそれら一対のレール溝57に嵌め込むと、回路ユニット40が縦置きの姿勢で固定される。 FIG. 3 is a perspective view showing a circuit holder. A pair of rail grooves 57 for fixing the circuit board 42 of the circuit unit 40 to the circuit holder 50 is provided on the inner circumferential surface 52 a of the large diameter portion 52 of the circuit holder 50 so as to face each other. The pair of rail grooves 57 is for fixing the circuit unit 40 to the circuit holder 50 in a posture in which the circuit board 42 is parallel to the lamp axis J (see FIG. 2), that is, in a vertical posture. The rail groove 57 extends in the vertical direction along the inner circumferential surface 52 of the large diameter portion 52, and the circuit unit 40 is placed vertically when the side edges of the circuit board 42 are fitted into the pair of rail grooves 57. It is fixed by the posture of.
 一対のレール溝57は、ランプ軸Jを挟んで対向しておらず、ランプ軸Jを挟まずに対向しており、ランプ軸Jに対しては、両方のレール溝57が一方側に偏った位置となるよう配置されている。別の表現をすれば、ランプ軸Jを含む仮想面で大径部52内を2つの空間に区切った場合に、一方の空間内に両方のレール溝57が収まるよう配置されている。したがって、それらレール溝57に回路基板42を固定すると、回路基板42はランプ軸J上、すなわち大径部52の中央位置には配置されず、ランプ軸Jに対して一方側にずれた位置に配置される。そのため、回路基板42によって大径部52内は、一方の主面42a側の広い空間と、他方の主面42b側の狭い空間とに区切られる。これにより、一方の主面42a側には、より背の高い電子部品を配置することができる。 The pair of rail grooves 57 do not face each other across the lamp axis J, but face each other without sandwiching the lamp axis J. With respect to the lamp axis J, both rail grooves 57 are biased to one side It is arranged to be in position. In other words, when the inside of the large diameter portion 52 is divided into two spaces in an imaginary plane including the lamp axis J, both rail grooves 57 are arranged to be accommodated in one space. Therefore, when the circuit board 42 is fixed to the rail grooves 57, the circuit board 42 is not disposed on the lamp axis J, that is, at the central position of the large diameter portion 52, and is shifted to one side with respect to the lamp axis J. Be placed. Therefore, the inside of the large diameter portion 52 is divided by the circuit board 42 into a wide space on the one main surface 42 a side and a narrow space on the other main surface 42 b side. As a result, taller electronic components can be disposed on the one main surface 42 a side.
 各レール溝57は、基礎部57a並びに、当該基礎部57aに設けられた第1壁部57bおよび第2壁部57cにより構成されている。 Each rail groove 57 is composed of a base portion 57a and a first wall portion 57b and a second wall portion 57c provided on the base portion 57a.
 各基礎部57aは、大径部52の内周面52に沿って上下方向に延伸する長尺状の部位であって、大径部52の内周面52aの一部を内側に膨出させることによって形成されている。それら基礎部57aは互いに対向する長尺面57dを有し、それら長尺面57dは、ランプ軸Jと直交する仮想面で切断した断面において互いに平行を保っており、それら長尺面57dが各レール溝57の底面を構成している。 Each base portion 57a is an elongated portion extending in the vertical direction along the inner peripheral surface 52 of the large diameter portion 52, and bulges a part of the inner peripheral surface 52a of the large diameter portion 52 inward. It is formed by. The base portions 57a have long surfaces 57d facing each other, and the long surfaces 57d are kept parallel to each other in a cross section cut by a virtual plane orthogonal to the lamp axis J, and the long surfaces 57d are each The bottom surface of the rail groove 57 is configured.
 第1壁部57bおよび第2壁部57cは、基礎部57aの長尺面57dに、長尺方向に沿って立設されている。長尺面57dのランプ軸Jから遠い側の長辺に立設されているのが第1壁部57bであって、長尺面57dのランプ軸Jに近い側の長辺に立設されているのが第2壁部57cである。それら第1壁部57bおよび第2壁部57cは、互いに対向しており、レール溝57の側面を構成している。 The first wall 57 b and the second wall 57 c are provided upright on the long surface 57 d of the base 57 a along the long direction. The first wall portion 57b is erected on the long side of the long surface 57d far from the lamp axis J, and is erected on the long side of the long surface 57d near the lamp axis J The second wall portion 57c is located. The first wall portion 57b and the second wall portion 57c face each other, and constitute side surfaces of the rail groove 57.
 第1壁部57bは、基礎部57aの長尺面57dの長手方向全体に亘って形成されており、壁の高さが低い(長尺面57dからの突出量が小さい)上方側部分57eと、壁の高さが高い(長尺面57dからの突出量が大きい)下方側部分57fとからなる。すなわち、第1壁部57bは、壁の高さが2段階に変化しており、上方側よりも下方側で、壁が高くなっている。なお、第1壁部57bは、壁の高さが3段階以上に変化していても良い。 The first wall portion 57b is formed over the entire longitudinal direction of the long surface 57d of the base portion 57a, and the height of the wall is low (the amount of protrusion from the long surface 57d is small) and the upper side portion 57e , And the lower side portion 57f having a high wall height (a large amount of protrusion from the long surface 57d). That is, in the first wall portion 57b, the height of the wall changes in two steps, and the wall is higher on the lower side than the upper side. The height of the wall of the first wall 57 b may be changed in three or more steps.
 一方、第2壁部57cは、基礎部57aの長尺面57dの長手方向全体に亘っては形成されておらず、長尺面57dの下方側端部付近にのみ形成されている。第2壁部57cが形成されている領域は、第1壁部57bの下方側部分57fが形成されている領域よりも狭く、下方側部分57fの下方側と第2壁部57cとは対向しているが、下方側部分57fの上方側と対向する領域には第2壁部57cは存在しない。そして、第2壁部57cは、第1壁部57bの下方側部分57fと壁の高さが同じである。 On the other hand, the second wall portion 57c is not formed over the entire longitudinal direction of the long surface 57d of the base portion 57a, and is formed only near the lower end portion of the long surface 57d. The area in which the second wall 57c is formed is narrower than the area in which the lower portion 57f of the first wall 57b is formed, and the lower side of the lower portion 57f and the second wall 57c face each other. However, the second wall portion 57c does not exist in the region facing the upper side of the lower side portion 57f. The second wall 57 c has the same height as the lower portion 57 f of the first wall 57 b.
 回路基板42のレール溝57への嵌め込み作業は、回路基板42をレール溝57に対して斜めに傾けながら、回路基板42の下方側両コーナー部分を第1壁部57bに当接させ、当接させた状態で下方側両コーナー部分を第1壁部57bに沿って下方に滑らせながら、同時に回路基板42の姿勢をレール溝57と平行になるよう徐々に起こし、最後は第1壁部57bの下方側部分57fと第2壁部57cとの間に下方側両コーナー部分を嵌め込み、さらに回路基板42の両側縁部を第1壁部57bに沿わせることによって完了する。 In fitting the circuit board 42 into the rail groove 57, while the circuit board 42 is inclined obliquely to the rail groove 57, both lower corners of the circuit board 42 are abutted against the first wall portion 57b, and are abutted. In this state, while sliding the lower side corner portions downward along the first wall portion 57b, at the same time, the posture of the circuit board 42 is gradually raised to be parallel to the rail groove 57, and finally the first wall portion 57b The process is completed by fitting lower corner portions between the lower portion 57f and the second wall 57c, and further aligning the side edges of the circuit board 42 with the first wall 57b.
 レール溝57の延伸方向において、第1壁部57bの上方側端部が第2壁部57cの上方側端部よりも上方側に位置するため、回路基板42を斜めに傾けたままレール溝57に対して位置決めすることができ、回路基板42の下方側両コーナー部分をレール溝57に差し込み易い。また、回路基板42の下方側両コーナー部分をレール溝57の上方側端部に差し込む際に、回路基板42の一方の主面42aをどちら側に向けておけば良いのか、視覚的に把握し易い。 Since the upper end of the first wall portion 57b is located above the upper end of the second wall portion 57c in the extending direction of the rail groove 57, the rail groove 57 is inclined while the circuit board 42 is inclined. The lower corner portions of the circuit board 42 can be easily inserted into the rail groove 57. Further, when inserting the lower side corner portions of the circuit board 42 into the upper end of the rail groove 57, it is visually grasped which side the main surface 42a of the circuit board 42 should be directed to. easy.
 第1壁部57bは、上方側部分57eが下方側部分57fよりも、壁の高さが低くなっているため、その低くなっている分だけ回路ユニット40の電子部品43,44や半田等が第1壁部57bに当たり難い。したがって、回路基板42上の広い範囲に電子部品43,44を実装することができる。第2壁部57cについても同様に、回路基板42を固定するために必要最小限となる部分にしか設けられていないため、電子部品43,44や半田等が第2壁部57cに当たり難く、回路基板42上の広い範囲に電子部品43,44を実装することができる。 In the first wall portion 57b, the height of the wall is lower at the upper side portion 57e than at the lower side portion 57f, so the electronic components 43 and 44 of the circuit unit 40, the solder, etc. It is difficult to hit the first wall 57b. Therefore, the electronic components 43 and 44 can be mounted in a wide range on the circuit board 42. Similarly, the second wall 57c is provided only at the minimum necessary for fixing the circuit board 42. Therefore, the electronic components 43 and 44, solder and the like do not easily come in contact with the second wall 57c. The electronic components 43 and 44 can be mounted in a wide range on the substrate 42.
 なお、基礎部57aは必ずしも必要はなく、レール溝57は、第1壁部57bおよび第2壁部57cを大径部52の内周面52から直接延出させた構成であっても良い。その場合は、レール溝57は第1壁部57bおよび第2壁部57cで構成されることとなる。 The base portion 57 a is not necessarily required, and the rail groove 57 may have a configuration in which the first wall portion 57 b and the second wall portion 57 c are directly extended from the inner circumferential surface 52 of the large diameter portion 52. In that case, the rail groove 57 is configured by the first wall 57 b and the second wall 57 c.
 従来の回路ケースのレール溝は、対向する一対の壁部がレール溝の延伸方向において同じ領域に設けられていたため、各壁部の上方側端部の位置が揃っており、レール溝の上方側端部に回路基板の下方側両コーナー部分を差し込むのが容易ではなかった。そのため、回路ユニットの取り付け作業が煩雑であった。 The rail groove of the conventional circuit case has a pair of opposing wall portions provided in the same region in the extending direction of the rail groove, so the upper end portions of the wall portions are aligned, and the rail groove upper side It was not easy to insert the lower corners of the circuit board at the end. Therefore, the attachment work of the circuit unit was complicated.
 しかしながら、本実施の形態に係る回路ホルダ50は、対向する一対の壁部(第1壁部57bおよび第2壁部57c)の上方側端部の位置がずれているため、具体的には、ランプ軸Jから遠い側である第1壁部57bの上方側端部よりも、ランプ軸Jに近い側である第2壁部57cの上方側端部の方が、下方側に位置しているため、回路基板42をレール溝57に対して傾けた姿勢で、レール溝57の上方側端部に回路基板42の下方側両コーナー部分を差し込むことができる。したがって、回路ユニット40の固定作業性が容易である。また、レール溝57の第1壁部57bの壁の高さは一定ではなく段差が設けられているため、壁の高さが低くなった部分では、回路ユニット40の電子部品43,44や半田等が第1壁部57bに当たって邪魔になり難い。 However, in the circuit holder 50 according to the present embodiment, since the positions of the upper side end portions of the pair of opposing wall portions (the first wall portion 57 b and the second wall portion 57 c) are shifted, specifically, The upper end of the second wall 57c closer to the lamp axis J is positioned lower than the upper end of the first wall 57b farther from the lamp axis J Therefore, in a posture in which the circuit board 42 is inclined to the rail groove 57, the lower side corner portions of the circuit board 42 can be inserted into the upper end of the rail groove 57. Therefore, the fixing workability of the circuit unit 40 is easy. Further, since the height of the wall of the first wall portion 57b of the rail groove 57 is not constant but a step is provided, the electronic components 43 and 44 of the circuit unit 40 and solder are formed in the portion where the height of the wall is lowered. Etc. are less likely to interfere with the first wall 57b.
 (6)ケース
 ケース60は、例えば、両端が開口し上方から下方へ向けて縮径した略円筒状を有する。ケース60の上方側開口内には基台20とグローブ30の開口側端部31とが収容されており、例えばカシメによりケース60が基台20に固定されている。なお、ケース60、基台20およびグローブ30で囲まれた空間63に接着剤を流し込むなどしてケース60が基台20に固定されていても良い。
(6) Case The case 60 has, for example, a substantially cylindrical shape which is open at both ends and reduced in diameter from the upper side to the lower side. The base 20 and the opening end 31 of the glove 30 are accommodated in the upper opening of the case 60, and the case 60 is fixed to the base 20 by caulking, for example. The case 60 may be fixed to the base 20 by pouring an adhesive into a space 63 surrounded by the case 60, the base 20, and the globe 30, for example.
 基台20の下方側端部の外周縁は、ケース60の内周面62の形状にあわせてテーパ形状となっている。そのテーパ面24がケース60の内周面62と面接触しているため、発光モジュール10から基台20へ伝搬した熱が、さらにケース60へ伝導し易くなっている。半導体発光素子12で発生した熱は、主に、基台20およびケース60を介し、さらに回路ホルダ50の小径部53を介して口金70へ伝導し、口金70から照明器具(不図示)側へ放熱される。 The outer peripheral edge of the lower side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface 62 of the case 60. Since the tapered surface 24 is in surface contact with the inner circumferential surface 62 of the case 60, the heat transmitted from the light emitting module 10 to the base 20 is more easily conducted to the case 60. The heat generated by the semiconductor light emitting element 12 is conducted to the base 70 mainly through the base 20 and the case 60 and further through the small diameter portion 53 of the circuit holder 50, and from the base 70 to the lighting equipment (not shown) side Heat is dissipated.
 ケース60は、例えば金属材料からなり、金属材料としては、例えばAl、Ag、Au、Ni、Rh、Pd、またはそれらの内の2以上からなる合金、またはCuとAgの合金などが考えられる。このような金属材料は、熱伝導性が良好であるため、ケース60に伝搬した熱を効率良く口金70側に伝搬させることができる。なお、ケース60の材料は、金属に限定されず、例えば熱伝導率の高い樹脂などであっても良い。 The case 60 is made of, for example, a metal material, and the metal material may be, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, or an alloy of Cu and Ag. Such a metal material has good thermal conductivity, so the heat transmitted to the case 60 can be efficiently transmitted to the base 70 side. In addition, the material of case 60 is not limited to a metal, For example, resin with high heat conductivity, etc. may be sufficient.
 (7)口金
 口金70は、照明用光源1が照明器具に取り付けられ点灯された際に、照明器具のソケットから電力を受けるための部材である。口金70の種類は、特に限定されるものではないが、例えばエジソンタイプであるE26口金やE17口金が挙げられる。口金70は、略円筒状であって外周面が雄ネジとなっているシェル部71と、シェル部71に絶縁部72を介して装着されたアイレット部73とを備える。シェル部71とケース60との間には絶縁部材74が介在している。
(7) Base A base 70 is a member for receiving power from the socket of the lighting apparatus when the illumination light source 1 is attached to the lighting apparatus and turned on. The type of the base 70 is not particularly limited, and examples thereof include an Edison type E26 base and an E17 base. The base 70 includes a shell portion 71 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72. An insulating member 74 is interposed between the shell portion 71 and the case 60.
 (8)光学部材
 光学部材80は、発光モジュール10からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光を拡散させるための部材であって、発光モジュール10の上方側に配置されている。なお、出射角は、ランプ軸Jに沿った上方を0°、ランプ軸Jに沿った下方を180°として定義する。
(8) Optical member The optical member 80 diffuses the emitted light so that the emitted light from the light emitting module 10 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. The light emitting module 10 is disposed on the upper side of the light emitting module 10. The emission angle is defined as 0 ° above the lamp axis J and 180 ° below the lamp axis J.
 光学部材80は、例えば、略柱状であってランプ軸J上に配置されており、光学部材80の柱軸とランプ軸Jとは一致している。なお、光学部材80の柱軸は必ずしもランプ軸Jと一致している必要はないが、ランプ軸Jを中心とする全周に亘って均一な配光を得るためには、前記柱軸がランプ軸Jと平行であることが好ましく、前記柱軸とランプ軸Jとが一致していることがより好ましい。 The optical member 80 is, for example, substantially columnar and disposed on the lamp axis J, and the column axis of the optical member 80 and the lamp axis J coincide with each other. The column axis of the optical member 80 does not have to be the same as the lamp axis J. However, in order to obtain uniform light distribution over the entire circumference around the lamp axis J, the column axis is a lamp It is preferable to be parallel to the axis J, and it is more preferable that the column axis and the lamp axis J coincide with each other.
 光学部材80は、例えば、筒状であってその筒軸がランプ軸Jと平行である外側部81と、外側部81の筒内に詰められた柱状の内側部82とで構成される。より具体的には、光学部材80は円柱状であって、外側部81はランプ軸Jと一致する筒軸を有する円筒状であって、内側部82は外側部81の筒内に隙間なく詰められた円柱状である。 The optical member 80 is formed, for example, of an outer portion 81 which is cylindrical and whose cylindrical axis is parallel to the lamp axis J, and a columnar inner portion 82 packed in the cylinder of the outer portion 81. More specifically, the optical member 80 has a cylindrical shape, and the outer side portion 81 has a cylindrical shape having a cylindrical axis coinciding with the lamp axis J, and the inner side 82 is tightly packed in the cylinder of the outer side 81 It has a cylindrical shape.
 図4は、光学部材による出射光の拡散の態様を説明するための概略図である。図4(a)に示すように、光学部材80の上面80aは、外側部81の上面81aと内側部82の上面82aとで構成されている。光学部材80の下面80bは、外側部81の下面81bと内側部82の下面82bとで構成されている。光学部材80の上面80aおよび下面80bはそれぞれ平面である。 FIG. 4 is a schematic view for explaining an aspect of diffusion of outgoing light by the optical member. As shown in FIG. 4A, the upper surface 80 a of the optical member 80 is composed of the upper surface 81 a of the outer side portion 81 and the upper surface 82 a of the inner side portion 82. The lower surface 80 b of the optical member 80 is composed of the lower surface 81 b of the outer side portion 81 and the lower surface 82 b of the inner side portion 82. The upper surface 80a and the lower surface 80b of the optical member 80 are each flat.
 なお、光学部材80の上面80aおよび下面80bは平面に限定されない。例えば、光学部材80の上面80aを、倒円錐面などの凹面や、円錐面などの凸面として、光学部材80から出射される光の拡散度合いを調整しても良い。光学部材80の下面80bは、発光モジュール10からの出射光が光学部材80内に入射し易いという観点からは、封止体13の上面13aとの間に隙間ができ難いように平面であることが好ましい。 The upper surface 80a and the lower surface 80b of the optical member 80 are not limited to flat surfaces. For example, the degree of diffusion of light emitted from the optical member 80 may be adjusted by setting the upper surface 80a of the optical member 80 as a concave surface such as a conical surface or a convex surface such as a conical surface. The lower surface 80b of the optical member 80 is a flat surface so that a gap can not be easily formed between the lower surface 80b and the upper surface 13a of the sealing body 13 from the viewpoint that the outgoing light from the light emitting module 10 is easily incident into the optical member 80. Is preferred.
 光学部材80の外周面80cは、外側部81の外周面81cで構成されている。なお、外側部81の外周面81cには鏡面処理が施されていても良い。このようにすれば、外周面80cから光学部材80内へ光が入射するのを防止できる。外周面81cに鏡面処理を施す方法としては、例えば金属薄膜や誘電体多層膜などの反射膜を、例えば熱蒸着法、電子ビーム蒸着法、スパッタ法、メッキ、などの方法により形成することが考えられる。 An outer peripheral surface 80 c of the optical member 80 is constituted by an outer peripheral surface 81 c of the outer side portion 81. The outer peripheral surface 81 c of the outer portion 81 may be subjected to mirror surface processing. In this way, light can be prevented from entering the optical member 80 from the outer peripheral surface 80c. As a method of mirror-finishing the outer peripheral surface 81c, for example, it is considered to form a reflective film such as a metal thin film or a dielectric multilayer film by a method such as a thermal evaporation method, an electron beam evaporation method, a sputtering method or plating. Be
 外側部81の内周面81dは内側部82の外周面82cと全面に亘って接触しており、外側部81と内側部82との間に隙間はない。すなわち、外側部81の内周面81dと内側部82の外周面82cとは同一面であって、外側部81と内側部82の界面である。なお、外側部81と内側部82との間には隙間があっても良いが、隙間があると光のロスが生じるため、隙間はない方が好ましい。 The inner peripheral surface 81 d of the outer portion 81 is in contact with the entire outer surface 82 c of the inner portion 82, and there is no gap between the outer portion 81 and the inner portion 82. That is, the inner peripheral surface 81 d of the outer side portion 81 and the outer peripheral surface 82 c of the inner side portion 82 are the same surface, and the interface between the outer side portion 81 and the inner side portion 82. There may be a gap between the outer side portion 81 and the inner side portion 82, but if there is a gap, light loss will occur, so it is preferable that there is no gap.
 図5は、第1の実施形態に係る発光モジュールおよび光学部材を説明するための平面図である。図5に示すように、光学部材80は、上方側から見て、発光モジュール10の封止体13の上面13aよりも小さい。すなわち、光学部材80の上面80aおよび下面80bの面積は、封止体13の上面13aの面積よりも小さい。このようにすれば、封止体13の上面13a全体が光学部材80によって隠れることがない。すなわち、上面13aの一部を露出させることができる。そのため、図4(a)において光路L1で示すように、発光モジュール10からの出射光の一部を、光学部材80内に入射させることなく、直接グローブ30の内面32に届けることができる。 FIG. 5 is a plan view for explaining the light emitting module and the optical member according to the first embodiment. As shown in FIG. 5, the optical member 80 is smaller than the upper surface 13 a of the sealing body 13 of the light emitting module 10 as viewed from above. That is, the areas of the upper surface 80 a and the lower surface 80 b of the optical member 80 are smaller than the area of the upper surface 13 a of the sealing body 13. In this way, the entire upper surface 13 a of the sealing body 13 is not hidden by the optical member 80. That is, part of the upper surface 13a can be exposed. Therefore, as shown by an optical path L1 in FIG. 4A, a part of the emitted light from the light emitting module 10 can be directly delivered to the inner surface 32 of the glove 30 without being incident into the optical member 80.
 封止体13の上面13aにおける光学部材80で隠れる領域の面積は、上面13a全体の面積40%~78%であることが好ましい。本実施の形態では、光学部材80の外径(外側部81の外径でもある)R1は15mmであり、封止体13の上面13aの一辺の長さW3は21mmであるため、前記隠れる領域の面積は上面13a全体の面積の40%である。 The area of the area hidden by the optical member 80 on the upper surface 13a of the sealing body 13 is preferably 40% to 78% of the entire area of the upper surface 13a. In the present embodiment, the outer diameter (which is also the outer diameter of the outer portion 81) R1 of the optical member 80 is 15 mm, and the length W3 of one side of the upper surface 13a of the sealing body 13 is 21 mm. The area of is 40% of the area of the entire top surface 13a.
 なお、光学部材80の外径R1と封止体13の上面13aの一辺の長さW3とを同じ大きさにすれば、光学部材80を上面13a上からはみ出ないように設置するだけで、光学部材80の柱軸をランプ軸Jと一致させることができ、光学部材80の位置決めが容易である。 If the outer diameter R1 of the optical member 80 and the length W3 of one side of the upper surface 13a of the sealing body 13 are the same, the optical member 80 is simply disposed so as not to protrude from the upper surface 13a. The column axis of the member 80 can be aligned with the lamp axis J, and the positioning of the optical member 80 is easy.
 なお、図2に示す光学部材80の高さ(上下方向の長さ)Tは15mmであり、図5に示す内側部82の外径R2は10mmであって、光学部材80の外径R1および内側部82の外径R2は、それぞれ上下方向全体に亘って均一である。 The height (length in the vertical direction) T of the optical member 80 shown in FIG. 2 is 15 mm, and the outer diameter R2 of the inner portion 82 shown in FIG. 5 is 10 mm. The outer diameter R2 of the inner portion 82 is uniform over the entire vertical direction.
 図4に戻って、光学部材80は、上方側から見て、光学部材80の全体が封止体13の上面13aと重なる位置に配置されている。このようにすれば、光学部材80の下面80bの全体が封止体13の上面13aと接触するため、発光モジュール10からの出射光を光学部材80内に効率良く入射させることができる。 Referring back to FIG. 4, the optical member 80 is disposed at a position where the entire optical member 80 overlaps the upper surface 13 a of the sealing body 13 when viewed from the upper side. In this way, the entire lower surface 80 b of the optical member 80 contacts the upper surface 13 a of the sealing body 13, and thus the light emitted from the light emitting module 10 can be efficiently incident into the optical member 80.
 外側部81および内側部82は、それぞれ透光性材料からなる。ただし、内側部82の材料は、外側部81の材料よりも屈折率が低い。外側部81および内側部82を構成する透光性材料としては、それぞれ、シリコーンやポリカーボネート等の樹脂材料、ガラス、セラミックなどが挙げられる。例えば、外側部81を屈折率1.50のガラスで構成し、内側部82を屈折率1.41のシリコーンで構成することが考えられる。 The outer side portion 81 and the inner side portion 82 are each made of a translucent material. However, the material of the inner portion 82 has a lower refractive index than the material of the outer portion 81. As a translucent material which comprises the outer side part 81 and the inner side part 82, resin materials, such as a silicone and a polycarbonate, glass, a ceramic, etc. are mentioned, respectively. For example, it is conceivable that the outer part 81 is made of glass having a refractive index of 1.50 and the inner part 82 is made of silicone having a refractive index of 1.41.
 なお、外側部81および内側部82のいずれか一方または両方の内部に、入射した光を内部散乱させるための光散乱体が含まれていても良い。光散乱体としては、例えば、シリカ、アルミナ、酸化亜鉛やチタニアなどで構成された無色透明または有色透明の粒体が考えられる。そして、粒体の形状としては例えば略球形状が考えられ、その場に直径は0.1μm~40μmの範囲であることが好ましい。また、光散乱体の添加量は、10wt%~60wt%の範囲であることが好ましい。 A light scatterer may be included in one or both of the outer side portion 81 and the inner side portion 82 for internally scattering the incident light. As the light scatterer, for example, colorless and transparent or colored and transparent particles composed of silica, alumina, zinc oxide, titania or the like can be considered. The shape of the particles may be, for example, a substantially spherical shape, and the diameter is preferably in the range of 0.1 μm to 40 μm in situ. The amount of the light scatterer added is preferably in the range of 10 wt% to 60 wt%.
 発光モジュール10の封止体13の上面13aから出射され、外側部81の下面81bから外側部81内に入射した光は、図4(a)において光路L2で示すように、外側部81の外周面81cおよび内周面81dの間で反射を繰り返し、外側部81の上面81aから光学部材80外へ出射する。光が外周面81cで反射されるのは、外側部81の材料が空気よりも屈折率が高いからであり、光が内周面81dで反射されるのは、外側部81の材料が内側部82の材料よりも屈折率が高いからである。このように、一旦外側部81内へ入射した光は、外周面81cや内周面81dから外へ漏れ難いため、上面81aまで導かれて上面81aから出射される。 The light emitted from the upper surface 13a of the sealing body 13 of the light emitting module 10 and incident from the lower surface 81b of the outer portion 81 into the outer portion 81 is the outer periphery of the outer portion 81 as shown by the light path L2 in FIG. The reflection is repeated between the surface 81 c and the inner peripheral surface 81 d, and the light is emitted from the upper surface 81 a of the outer portion 81 to the outside of the optical member 80. The light is reflected by the outer peripheral surface 81 c because the material of the outer portion 81 has a refractive index higher than that of air, and the light is reflected by the inner peripheral surface 81 d because the material of the outer portion 81 is the inner portion This is because the refractive index is higher than that of the 82 material. As described above, the light that has entered the outer portion 81 once is unlikely to leak to the outside from the outer peripheral surface 81c or the inner peripheral surface 81d, and thus is guided to the upper surface 81a and emitted from the upper surface 81a.
 一方、発光モジュール10の封止体13の上面13aから出射され、内側部82の下面82bから内側部82内に入射した光は、内側部82の対向する外周面82c間で反射を繰り返し、一部は、図4(a)において光路L3で示すように、内側部82の上面82aから光学部材80外へ出射するが、残りは、光路L4,L5で示すように、内側部82の外周面82c(外側部81の内周面81d)を透過して外側部81内へ入射する。光が外周面82cで反射せず外周面82cを透過するのは、内側部82の材料が外側部81の材料の屈折率よりも低いからである。 On the other hand, light emitted from the upper surface 13a of the sealing body 13 of the light emitting module 10 and entering the inner portion 82 from the lower surface 82b of the inner portion 82 is repeatedly reflected between the opposing outer peripheral surfaces 82c of the inner portion 82. The part is emitted from the upper surface 82a of the inner part 82 to the outside of the optical member 80 as shown by the optical path L3 in FIG. 4A, but the rest is the outer peripheral surface of the inner part 82 as shown by the optical paths L4 and L5. The light passes through 82 c (the inner peripheral surface 81 d of the outer portion 81) and enters the outer portion 81. The light is not reflected by the outer circumferential surface 82 c but transmitted through the outer circumferential surface 82 c because the material of the inner portion 82 is lower than the refractive index of the material of the outer portion 81.
 内側部82から外側部81内に入射した光は、外側部81の外周面81cおよび内周面81dの間で反射を繰り返し、光路L3で示すように、外側部81の上面81aから光学部材80外へ出射する。このように、光学部材80に入射した光は、より屈折率の高い材料で形成された外側部81に集まり、主として外側部81の上面81aから出射される。 The light incident from the inner portion 82 into the outer portion 81 is repeatedly reflected between the outer peripheral surface 81 c and the inner peripheral surface 81 d of the outer portion 81 and, as shown by the light path L 3, the optical member 80 from the upper surface 81 a of the outer portion 81. Outgoing. As described above, light incident on the optical member 80 is collected at the outer portion 81 formed of a material having a higher refractive index, and is mainly emitted from the upper surface 81 a of the outer portion 81.
 また、外側部81の上面81aから出射される光は、主としてランプ軸Jに沿って上方へ出射されるのではなく、主としてランプ軸Jに対して30°~60°の範囲の出射角で出射される。出射角が0°にならずこのような角度になるのは、外側部81内に入射した光の多くは、外側部81内をランプ軸Jに沿って真っ直ぐに進まず、外側部81内をジグザグに内部反射しながら進むからである。特に、内側部82から外側部81へ集まる光は、ランプ軸Jと平行でない角度で外側部81内へ入射してくるため、外側部81内をジグザグに進む。ジグザグに進んだ光は、上面81aから出射された後も、真っ直ぐランプ軸Jに沿った方向に向かわず、ランプ軸Jに対して傾斜した斜め上方の方向へ向かう。このような斜め上方へ向かう出射光が多いために、全体として、主としてランプ軸Jに対して30°~60°の範囲の出射角で出射されることになる。 Further, the light emitted from the upper surface 81a of the outer portion 81 is not mainly emitted upward along the lamp axis J, but is emitted mainly at an emission angle in the range of 30 ° to 60 ° with respect to the lamp axis J Be done. The reason why the emission angle does not become 0 ° but does not become 0 ° is that most of the light incident in the outer part 81 does not travel straight along the lamp axis J in the outer part 81 and in the outer part 81 It is because it advances while internally reflecting in a zigzag. In particular, light collected from the inner part 82 to the outer part 81 enters the outer part 81 at an angle not parallel to the lamp axis J, and therefore travels in a zigzag in the outer part 81. The light traveling in the zigzag direction does not go straight in the direction along the lamp axis J even after being emitted from the upper surface 81a, but goes in the diagonally upward direction inclined with respect to the lamp axis J. Since there are a large amount of emitted light directed obliquely upward, the light is emitted mainly at an emission angle in the range of 30 ° to 60 ° with respect to the lamp axis J as a whole.
 図4(b)に示すように、発光モジュール10からの出射光は、出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、光学部材80によって拡散される。したがって、グローブ30の内面32における下方寄りの領域に光がより多く届くことになり、照明用光源1の配光角が広がる。なお、グローブ30に届いた光は、さらにグローブ30によって拡散される。 As shown in FIG. 4B, the light emitted from the light emitting module 10 is diffused by the optical member 80 so as to reach the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. Ru. Therefore, more light will reach the lower region of the inner surface 32 of the globe 30, and the light distribution angle of the illumination light source 1 is broadened. The light that has reached the globe 30 is further diffused by the globe 30.
 なお、広い配光角を得るためには、光学部材80の上面80aが、ケース60の上方側端部61よりも、ランプ軸Jに沿った方向における上方側に位置していることが好ましい。さらに、封止体13の上面13aが、ケース60の上方側端部61よりも、ランプ軸Jに沿った方向における上方側に位置していることがより好ましい。 In order to obtain a wide light distribution angle, it is preferable that the upper surface 80 a of the optical member 80 be positioned above the upper end 61 of the case 60 in the direction along the lamp axis J. Furthermore, it is more preferable that the upper surface 13 a of the sealing body 13 be positioned above the upper side end 61 of the case 60 in the direction along the lamp axis J.
 以上のことから、照明用光源1は、照射角が狭い発光モジュール10が平面配置されていても、光学部材80によってその照射角を広げることができるため、配光特性が良好である。また、外側部81が筒状であって光学部材80の外周全体に亘って存在しているため、ランプ軸Jを中心とする全周に亘って照射角を広げることができ、その全周に亘って配光特性が良好である。 From the above, even if the light emitting module 10 having a narrow irradiation angle is disposed on a plane, the light source 1 for illumination can expand the irradiation angle by the optical member 80, so the light distribution characteristic is excellent. Further, since the outer portion 81 is cylindrical and exists over the entire outer periphery of the optical member 80, the irradiation angle can be expanded over the entire periphery centering on the lamp axis J, The light distribution characteristic is good throughout.
 [照明用光源の配光特性]
 図6は、第1の実施形態に係る照明用光源の配光特性を説明するための配光曲線図である。図6に示すように、配光曲線図は、照明用光源1の上下方向を含む360°の各方向に対する光度の大きさを表しており、照明用光源1のランプ軸Jに沿った上方を0°、ランプ軸Jに沿った下方を180°として、時計回りおよび反時計回りにそれぞれ10°間隔に目盛を刻んでいる。配光曲線図の径方向に付した目盛は光度を表しており、光度は各配光曲線における最大値を100%とする相対的な大きさで表されている。
[Light distribution characteristic of light source for illumination]
FIG. 6 is a light distribution curve diagram for explaining light distribution characteristics of the illumination light source according to the first embodiment. As shown in FIG. 6, the light distribution curve represents the magnitude of the luminous intensity in each direction of 360 ° including the vertical direction of the illumination light source 1, and the upper side of the illumination light source 1 along the lamp axis J is shown. Clockwise and counterclockwise, tick marks are formed at intervals of 10 ° with 0 ° and 180 ° downward along the lamp axis J, respectively. The scale in the radial direction of the light distribution curve represents the light intensity, and the light intensity is represented by a relative magnitude with the maximum value in each light distribution curve as 100%.
 図6における二点鎖線は、白熱電球の配光曲線Aを示す。破線は、第1の実施形態に係る照明用光源1からグローブ30および光学部材80を取り除いた場合の配光曲線Bを示す。一点鎖線は、第1の実施形態に係る照明用光源1から光学部材80を取り除いた場合の配光曲線Cを示す。太い実線は、第1の実施形態に係る照明用光源1からグローブ30を取り除いた場合の配光曲線Dを示す。細い実線は、第1の実施形態に係る照明用光源1の配光曲線Eを示す。 The dashed-two dotted line in FIG. 6 shows the light distribution curve A of an incandescent lamp. The broken line indicates a light distribution curve B when the globe 30 and the optical member 80 are removed from the illumination light source 1 according to the first embodiment. An alternate long and short dash line indicates a light distribution curve C when the optical member 80 is removed from the illumination light source 1 according to the first embodiment. A thick solid line indicates a light distribution curve D when the globe 30 is removed from the illumination light source 1 according to the first embodiment. A thin solid line indicates a light distribution curve E of the illumination light source 1 according to the first embodiment.
 配光特性は、配光角に基づき評価した。配光角とは、照明用光源における光度の最大値の半分以上の光度が出射される角度範囲の大きさをいう。図6に示す配光曲線の場合は、光度が50%以上となる角度範囲の大きさである。 The light distribution characteristics were evaluated based on the light distribution angle. The light distribution angle refers to the size of an angular range in which a light intensity of half or more of the maximum value of the light intensity in the illumination light source is emitted. In the case of the light distribution curve shown in FIG. 6, it is the magnitude | size of the angle range which becomes 50% or more in luminous intensity.
 図6に示すように、配光曲線Aの配光角は約310°であり、配光曲線Bの配光角は約120°であり、配光曲線Cの配光角は約240°であり、配光曲線Dの配光角は約170°であり、配光曲線Eの配光角は約285°である。 As shown in FIG. 6, the light distribution angle of the light distribution curve A is about 310 °, the light distribution angle of the light distribution curve B is about 120 °, and the light distribution angle of the light distribution curve C is about 240 ° The light distribution angle of the light distribution curve D is about 170 °, and the light distribution angle of the light distribution curve E is about 285 °.
 グローブ30が無い状態において、光学部材80の有無により配光曲線がどのように変化するのかは、配光曲線Bと配光曲線Dとを比べれば分かる。配光曲線Bから分かるように、光学部材80が無い場合は出射角0°において最大光度となるのに対して、配光曲線Dから分かるように、光学部材80が有る場合は出射角40°において最大光度となる。このことから、光学部材80によって、発光モジュール10からの出射光は拡散され、配光角が広がっているのが分かる。 It can be understood by comparing the light distribution curve B and the light distribution curve D how the light distribution curve changes depending on the presence or absence of the optical member 80 in the state without the glove 30. As can be seen from the light distribution curve B, the maximum light intensity is obtained at an exit angle of 0 ° when there is no optical member 80, while the light emission angle is 40 ° when there is an optical member 80, as seen from the light distribution curve D. Maximum brightness at the From this, it can be seen that the light emitted from the light emitting module 10 is diffused by the optical member 80 and the light distribution angle is spread.
 グローブ30を取り付けた状態において、光学部材80の有無により配光曲線がどのように変化するのかは、配光曲線Cと配光曲線Eとを比べれば分かる。配光曲線Cから分かるように、光学部材80が無い場合は配光角が240°であるのに対して、配光曲線Eから分かるように、光学部材80が有る場合は配光角が285°にまで広がる。このように、光学部材80を設置することによって、配光角が広がり配光特性が良好になることが確認できた。 It can be understood by comparing the light distribution curve C with the light distribution curve E how the light distribution curve changes depending on the presence or absence of the optical member 80 in the state where the glove 30 is attached. As can be seen from the light distribution curve C, the light distribution angle is 240 ° when the optical member 80 is not present, while the light distribution angle is 285 when the optical member 80 is present as seen from the light distribution curve E. Spreads to °. As described above, it was confirmed that the light distribution angle spreads and the light distribution characteristic is improved by installing the optical member 80.
 さらに、配光曲線Aと配光曲線Eとを比べれば、第1の実施形態に係る照明用光源1の配光特性がより白熱電球に近似した配光特性を有することが分かる。 Furthermore, when the light distribution curve A and the light distribution curve E are compared, it can be seen that the light distribution characteristic of the illumination light source 1 according to the first embodiment has a light distribution characteristic more similar to an incandescent lamp.
 発光モジュール10からの出射光は、光学部材80によって、出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くことが好ましい。出射角が30°未満であると、配光角の広がりが十分でないため良好な配光特性が得られず、出射角が60°を超えると、ランプ軸Jに沿って上方へ向かう光の量が不足して上方が薄暗くなる。 It is preferable that the light emitted from the light emitting module 10 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 ° by the optical member 80. If the exit angle is less than 30 °, the spread of the light distribution angle is not sufficient, and good light distribution characteristics can not be obtained. If the exit angle exceeds 60 °, the amount of light directed upward along the lamp axis J And the upper part becomes dim.
 次に、光学部材の高さおよび外径が照明用光源の配光特性に与える影響について調べた。図7は、光学部材の高さが照明用光源の配光特性に与える影響を説明するための配光曲線図である。図8は、光学部材の外径が照明用光源の配光特性に与える影響を説明するための配光曲線図である。 Next, it investigated about the influence which the height and outer diameter of an optical member give to the light distribution characteristic of the light source for illumination. FIG. 7 is a light distribution curve diagram for explaining the influence of the height of the optical member on the light distribution characteristics of the illumination light source. FIG. 8 is a light distribution curve diagram for explaining the influence of the outer diameter of the optical member on the light distribution characteristics of the illumination light source.
 光学部材80の高さTを22mmに固定し、光学部材80の外径R1に種々変更を加えて照明用光源1の配光特性を確認したところ、図7に示すように、外径R1が5mm(外径R2は4mm)の場合の配光角は175°、外径R1が10mm(外径R2は9mm)の場合の配光角は210°、外径R1が15mm(外径R2は14mm)の場合の配光角は230°であった。この結果から、少なくとも封止体13の上面13aからはみ出さない限り(上面13aの一辺の長さW3以下であれば)、光学部材80の外径R1を大きくするほど配光特性が良いことが推測される。そして、外径R1が5mm以上であれば配光角約180°を実現できる。 The height T of the optical member 80 was fixed at 22 mm, and various changes were made to the outer diameter R1 of the optical member 80 to confirm the light distribution characteristics of the illumination light source 1. As shown in FIG. The light distribution angle for 5 mm (outer diameter R2 is 4 mm) is 175 °, the light distribution angle for outer diameter R1 is 10 mm (outer diameter R2 is 9 mm) is 210 °, and outer diameter R1 is 15 mm (outer diameter R2 is The light distribution angle in the case of 14 mm was 230 °. From this result, it is preferable that the light distribution characteristic is better as the outer diameter R1 of the optical member 80 is larger, as long as it does not protrude at least from the upper surface 13a of the sealing body 13 (if it is smaller than the length W3 of one side of the upper surface 13a). It is guessed. And if outer diameter R1 is 5 mm or more, about 180 degrees of light distribution angles are realizable.
 また、光学部材80の外径R1を10mm(外径R2は9mm)に固定し、光学部材80の高さTに種々変更を加えて照明用光源1の配光特性を確認したところ、図8に示すように、高さTが22mmの場合の配光角は205°、高さTが25mmの場合の配光角は235°、高さTが35mmの場合の配光角は230°、高さTが45mmの場合の配光角は235°であった。この結果から、光学部材80の高さTは配光特性にはあまり影響がないことが分かった。 Further, when the outer diameter R1 of the optical member 80 is fixed to 10 mm (the outer diameter R2 is 9 mm) and various changes are made to the height T of the optical member 80 to confirm the light distribution characteristics of the illumination light source 1, FIG. As shown in the figure, the light distribution angle when the height T is 22 mm is 205 °, the light distribution angle when the height T is 25 mm is 235 °, and the light distribution angle when the height T is 35 mm is 230 °, The light distribution angle was 235 ° when the height T was 45 mm. From this result, it was found that the height T of the optical member 80 had little influence on the light distribution characteristic.
 なお、図6、図7、図8に示す結果は、それぞれ実験系が異なるため(光学部材80とグローブ30との位置関係などが異なる)、同一実験系内での配光角の比較は有効であっても、異なる実験系間での配光角の比較は有効でない。 The results shown in FIG. 6, FIG. 7, and FIG. 8 are different from each other in the experimental system (the positional relationship between the optical member 80 and the globe 30 is different, etc.). Even, the comparison of light distribution angles between different experimental systems is not effective.
 [第1の実施形態の変形例]
 第1の実施形態に係る照明用光源1の変形例として以下の構成が挙げられる。なお、第1の実施形態と同じ部材については、そのまま第1の実施形態と同じ符号を用いている。
[Modification of First Embodiment]
The following configuration is given as a modification of the illumination light source 1 according to the first embodiment. The same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
 第1の実施形態に係る光学部材80は略円柱状であったが、本発明に係る光学部材は略円柱状に限定されない。例えば、図9に示すように、略角筒状の外側部181と略角柱状の内側部182とで構成される略正四角柱状の光学部材180であっても良い。また、略円柱状および略正四角柱状以外の柱状であっても良く、柱状以外の形状であっても良い。但し、光学部材を円柱状にすることは、ランプ軸Jと中心とする全周に亘って均一な配光とするための好ましい一例となる。 The optical member 80 according to the first embodiment is substantially cylindrical, but the optical member according to the present invention is not limited to substantially cylindrical. For example, as shown in FIG. 9, it may be an approximately square prism-shaped optical member 180 configured by a substantially square tubular outer portion 181 and a substantially prismatic inner portion 182. Moreover, it may be columnar other than substantially cylindrical shape and substantially regular square prism shape, and shapes other than columnar shape may be sufficient. However, making the optical member cylindrical is a preferred example for achieving uniform light distribution over the entire circumference centered on the lamp axis J.
 第1の実施形態に係る発光モジュール10は、上方側発光面となる封止体13の上面13aが略正方形であったが、本発明に係る封止体の上面は略正方形に限定されない。例えば、図10に示すように、発光モジュール210の封止体213の上面213aは、中心がランプ軸J上に位置する略円形であっても良く、このようにすれば、ランプ軸Jと中心とする全周に亘って均一な配光を得易い。 In the light emitting module 10 according to the first embodiment, the upper surface 13a of the sealing body 13 serving as the upper side light emitting surface is substantially square, but the upper surface of the sealing body according to the present invention is not limited to substantially square. For example, as shown in FIG. 10, the upper surface 213a of the sealing body 213 of the light emitting module 210 may be substantially circular with the center located on the lamp axis J. In this way, the lamp axis J and the center It is easy to obtain uniform light distribution over the entire circumference.
 第1の実施形態に係る光学部材80は、上方側から見て、発光モジュール10の封止体13の上面13aよりも小さかったが、例えば、図11に示す光学部材380のように、上方側から見て、発光モジュール10の封止体13の上面13aよりも大きくても良い。このようにすれば、発光モジュール10からの出射光を光学部材380によってより拡散させることができるが、前記出射光が直接グローブ30の内面32に届くことがないため上方への光量は低減する。 The optical member 80 according to the first embodiment is smaller than the upper surface 13a of the sealing body 13 of the light emitting module 10 when viewed from the upper side, but, for example, like the optical member 380 shown in FIG. In view of the above, it may be larger than the upper surface 13 a of the sealing body 13 of the light emitting module 10. In this way, the light emitted from the light emitting module 10 can be diffused further by the optical member 380, but the light emitted upward does not reach the inner surface 32 of the glove 30 directly, thus reducing the amount of light upward.
 第1の実施形態に係る光学部材80は、外径R1が上下方向全体に亘って均一であったが、均一でなくても良い。例えば、上下方向における中間部において外径が小さくなった(中間部の外径が絞られた)鼓形の形状であっても良く、下方側に向かって外径R1が大きくなる略円錐台状であっても良く、上方側に向かって外径R1が大きくなる略円錐台状であっても良い。 In the optical member 80 according to the first embodiment, the outer diameter R1 is uniform throughout the vertical direction, but may not be uniform. For example, the shape may be a drum shape in which the outer diameter is reduced (the outer diameter of the middle portion is reduced) in the middle portion in the vertical direction, and a substantially truncated cone shape in which the outer diameter R1 increases toward the lower side. It may be a substantially truncated cone shape in which the outer diameter R1 increases toward the upper side.
 第1の実施形態に係る光学部材80は、外側部81と内側部82とで構成され、径方向に2層の構造であったが、径方向に3層以上の構造であっても良い。その場合でも、全ての層が透光性材料で形成されており、外側の層ほど透光性材料の屈折率が高ければ、発光モジュール10からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光を拡散させることができる。 The optical member 80 according to the first embodiment includes the outer portion 81 and the inner portion 82 and has a two-layer structure in the radial direction, but may have three or more layers in the radial direction. Even in that case, if all the layers are formed of the translucent material and the refractive index of the translucent material is higher as the outer layer is, the emission light from the light emitting module 10 has an emission angle in the range of 30 ° to 60 °. And the emitted light can be diffused to reach the inner surface 32 of the globe 30 with the maximum luminous intensity.
 <第2の実施形態>
 図12は、第2の実施形態に係る発光モジュールおよび光学部材を説明するための平面図である。図12に示すように、第2の実施の形態に係る照明用光源は、発光モジュール410が複数であって光学部材480も複数である点において、第1の実施形態に係る照明用光源1と相違する。その他の構成については基本的に第1の実施形態に係る照明用光源1と略同様である。したがって、上記相違点についてのみ詳細に説明し、その他の構成については説明を簡略若しくは省略する。なお、第1の実施形態と同じ部材については、そのまま第1の実施形態と同じ符号を用いている。
Second Embodiment
FIG. 12 is a plan view for explaining the light emitting module and the optical member according to the second embodiment. As shown in FIG. 12, the illumination light source according to the second embodiment is different from the illumination light source 1 according to the first embodiment in that there are a plurality of light emitting modules 410 and a plurality of optical members 480. It is different. The other configuration is basically the same as that of the illumination light source 1 according to the first embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted. The same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
 発光モジュール410は、例えば5つであって、基台20の上面21にランプ軸Jを中心に点対称で平面配置されている。具体的には、発光モジュール410は、ランプ軸J上に1つ配置されていると共に、その四方に1つずつ配置されている。このように発光モジュール410が複数の場合でも、平面配置されていれば基台20への取り付けは容易である。なお、各発光モジュール410は、実装基板411、半導体発光素子(不図示)、および封止体413を備え、第1の実施形態に係る発光モジュール10とはサイズが異なるが、その他の構成は略同じである。 The number of light emitting modules 410 is, for example, five, and is arranged on the upper surface 21 of the base 20 in a plane plane symmetrical with respect to the lamp axis J. Specifically, one light emitting module 410 is disposed on the lamp axis J and one on each of the four sides. As described above, even in the case where there are a plurality of light emitting modules 410, mounting on the base 20 is easy as long as the light emitting modules 410 are arranged in a plane. Each light emitting module 410 includes a mounting substrate 411, a semiconductor light emitting element (not shown), and a sealing body 413, and the size is different from that of the light emitting module 10 according to the first embodiment. It is the same.
 光学部材480も、例えば5つであって、それぞれ外側部481と内側部482とで構成されており、第1の実施形態に係る光学部材80とはサイズが異なるが、その他の構成は略同じである。各光学部材480は、発光モジュール410と1対1の関係で、各発光モジュール410の上方側に、各光学部材480の柱軸が各発光モジュール410の封止体413の上面413aの中心に位置するように、配置されている。 The number of optical members 480 is also five, for example, and each includes an outer side portion 481 and an inner side portion 482, and the size is different from that of the optical member 80 according to the first embodiment. It is. In each optical member 480, the pillar axis of each optical member 480 is positioned at the center of the upper surface 413a of the sealing body 413 of each light emitting module 410 on the upper side of each light emitting module 410 in a one-to-one relationship with the light emitting module 410. To be arranged.
 このように複数の発光モジュール410に複数の光学部材480が1対1の関係で配置されている構成の場合も、それぞれの光学部材480によって、各発光モジュール410からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光が拡散されるため、照射角が狭い発光モジュール410が平面配置されていても照明用光源の配光特性が良好である。 As described above, also in the configuration in which the plurality of optical members 480 are arranged in a one-to-one relationship with the plurality of light emitting modules 410, the emitted light from each light emitting module 410 is emitted at an emission angle of 30 ° by each optical member 480 The emitted light is diffused so as to reach the inner surface 32 of the globe 30 with the maximum light intensity in the range of ̃60 °, so the light distribution of the illumination light source even if the light emitting module 410 with a narrow illumination angle is arranged The characteristics are good.
 <第3の実施形態>
 図13は、第3の実施形態に係る発光モジュールおよび光学部材を説明するための平面図である。図13に示すように、第3の実施の形態に係る照明用光源は、複数の光学部材580を備える点において、第1の実施形態に係る照明用光源1と相違する。その他の構成については基本的に第1の実施形態に係る照明用光源1と略同様である。
Third Embodiment
FIG. 13 is a plan view for explaining the light emitting module and the optical member according to the third embodiment. As shown in FIG. 13, the illumination light source according to the third embodiment is different from the illumination light source 1 according to the first embodiment in that a plurality of optical members 580 are provided. The other configuration is basically the same as that of the illumination light source 1 according to the first embodiment.
 光学部材580は、例えば5つであって、それぞれが外側部581と内側部582とで構成されており、各光学部材580は、第1の実施形態に係る光学部材80と構成が略同じであるが、外径R1が光学部材80のよりも小さい。発光モジュール10は、基台20の上面21のランプ軸J上に配置されており、全ての光学部材580は、上方から見て、発光モジュール10の封止体13の上面13aと重なる位置に、ランプ軸Jを中心に点対称で配置されている。具体的には、1つの光学部材580が、その柱軸が封止体13の上面13aの中心に位置するように配置されており、その光学部材580に対して、封止体13の上面13aの四隅に向けた四方に4つの光学部材580が配置されている。 The number of optical members 580 is, for example, five, and each of them is composed of an outer portion 581 and an inner portion 582. Each optical member 580 has substantially the same configuration as the optical member 80 according to the first embodiment. However, the outer diameter R1 is smaller than that of the optical member 80. The light emitting module 10 is disposed on the lamp axis J of the upper surface 21 of the base 20, and all the optical members 580 overlap the upper surface 13a of the sealing body 13 of the light emitting module 10 as viewed from above. They are arranged point-symmetrically with respect to the lamp axis J. Specifically, one optical member 580 is disposed such that the column axis thereof is positioned at the center of the upper surface 13 a of the sealing body 13, and the upper surface 13 a of the sealing body 13 with respect to the optical member 580. Four optical members 580 are disposed in four directions directed to the four corners of.
 このように1つの発光モジュール10の上方側に複数の光学部材580が配置されている場合も、それら光学部材580によって、発光モジュール10からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光が拡散されるため、照射角が狭い発光モジュール10が平面配置されていても照明用光源の配光特性が良好である。 As described above, even when the plurality of optical members 580 are disposed on the upper side of one light emitting module 10, the light emitted from the light emitting module 10 is maximized in the range of the emission angle of 30 ° to 60 ° by the optical members 580 Since the emitted light is diffused so as to reach the inner surface 32 of the globe 30 as the luminous intensity, the light distribution characteristic of the light source for illumination is excellent even if the light emitting module 10 having a narrow irradiation angle is disposed in plane.
 <第4の実施形態>
 図14は、第4の実施形態に係る発光モジュールおよび光学部材を説明するための図であって、(a)は平面図、(b)は(a)におけるA-A線断面図である。図14(a)に示すように、第4の実施の形態に係る照明用光源は、発光モジュール610が複数であり、それらに対し光学部材680が1つである点において、第1の実施形態に係る照明用光源1と相違する。その他の構成については基本的に第1の実施形態に係る照明用光源1と略同様である。
Fourth Embodiment
FIG. 14 is a view for explaining the light emitting module and the optical member according to the fourth embodiment, wherein (a) is a plan view and (b) is a sectional view taken along line AA in (a). As shown in FIG. 14A, the illumination light source according to the fourth embodiment is a first embodiment in that there are a plurality of light emitting modules 610 and there is one optical member 680 for them. This is different from the illumination light source 1 according to. The other configuration is basically the same as that of the illumination light source 1 according to the first embodiment.
 発光モジュール610は、例えば5つであって、基台20の上面21にランプ軸を中心に点対称で平面配置されている。具体的には、発光モジュール610は、ランプ軸J上に1つ配置されていると共に、その四方に1つずつ配置されている。このように発光モジュール610が複数の場合でも、平面配置されていれば基台20への取り付けは容易である。各発光モジュール610は、実装基板611、半導体発光素子(不図示)、および封止体613を備え、第1の実施形態に係る発光モジュール10と構成は略同じであるが、サイズが光学部材80よりも小さい。 For example, five light emitting modules 610 are arranged on the upper surface 21 of the base 20 so as to be plane-symmetrical about the lamp axis. Specifically, one light emitting module 610 is disposed on the lamp axis J and one on each of the four sides. As described above, even in the case where there are a plurality of light emitting modules 610, mounting on the base 20 is easy as long as the light emitting modules 610 are disposed flat. Each light emitting module 610 includes a mounting substrate 611, a semiconductor light emitting element (not shown), and a sealing body 613. The configuration is substantially the same as the light emitting module 10 according to the first embodiment. Less than.
 光学部材680は、外側部681と内側部682とで構成されており、第1の実施形態に係る光学部材80と構成が略同じであるが、外径R1が光学部材80のよりも大きい。光学部材680は、その柱軸とランプ軸Jとが一致した状態で、発光モジュール610の上方側に配置されており、ランプ軸J上に配置された発光モジュール610の封止体613の上面613aを完全に覆っていると共に、その四方に配置された各発光モジュール610の封止体613の上面613aのランプ軸J側の約半分を覆っている。 The optical member 680 includes an outer portion 681 and an inner portion 682 and has substantially the same configuration as the optical member 80 according to the first embodiment, but the outer diameter R1 is larger than that of the optical member 80. The optical member 680 is disposed on the upper side of the light emitting module 610 with the column axis thereof aligned with the lamp axis J, and the upper surface 613a of the sealing body 613 of the light emitting module 610 disposed on the lamp axis J And covers approximately half of the top surface 613a of the sealing body 613 of each of the light emitting modules 610 arranged in the four directions on the lamp axis J side.
 図14(b)に示すように、隣り合う発光モジュール610の封止体613間の隙間603には、樹脂などの透光性材料が充填されており、各発光モジュール610からの出射光が光学部材680内に効率良く入射するようになっている。 As shown in FIG. 14 (b), a light transmissive material such as a resin is filled in the gap 603 between the sealing bodies 613 of the adjacent light emitting modules 610, and the light emitted from each light emitting module 610 is optically The light is efficiently incident into the member 680.
 このように複数の発光モジュール610に対して1つの光学部材680が配置された構成の場合も、光学部材680によって、各発光モジュール610からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光が拡散されるため、照射角が狭い発光モジュール610が平面配置されていても照明用光源の配光特性が良好である。 Even in the case where one optical member 680 is disposed for a plurality of light emitting modules 610 in this manner, the optical members 680 make the light emitted from each light emitting module 610 have a maximum emission angle in the range of 30 ° to 60 °. Since the emitted light is diffused so as to reach the inner surface 32 of the globe 30 as light intensity, the light distribution characteristic of the light source for illumination is good even if the light emitting module 610 having a narrow irradiation angle is arranged in a plane.
 <第5の実施形態>
 図15は、第5の実施形態に係る照明用光源を示す一部破断斜視図である。図16は、第5の実施形態に係る照明用光源を示す断面図である。図17は、図16において二点鎖線で囲んだ部分を示す拡大断面図である。
Fifth Embodiment
FIG. 15 is a partially broken perspective view showing the illumination light source according to the fifth embodiment. FIG. 16 is a cross-sectional view showing the illumination light source according to the fifth embodiment. FIG. 17 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
 図15および図16に示すように、第5の実施形態に係る照明用光源700は、発光モジュール710、基台720、グローブ30、回路ユニット40、回路ホルダ750、ケース60、口金70、光学部材780およびキャップ部材790を備える。なお、第1の実施形態と同じ部材については、そのまま第1の実施形態と同じ符号を用いている。 As shown in FIGS. 15 and 16, the illumination light source 700 according to the fifth embodiment includes a light emitting module 710, a base 720, a globe 30, a circuit unit 40, a circuit holder 750, a case 60, a base 70, an optical member. 780 and a cap member 790. The same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
 図15に示すように、発光モジュール710は、略円環状の実装基板711と、実装基板711に実装された光源としての複数の半導体発光素子712と、それら半導体発光素子712を被覆するように実装基板711上に設けられた封止体713とを備える。 As shown in FIG. 15, the light emitting module 710 is mounted so as to cover the substantially annular mounting substrate 711, a plurality of semiconductor light emitting devices 712 as light sources mounted on the mounting substrate 711, and the semiconductor light emitting devices 712. And a sealing body 713 provided on the substrate 711.
 実装基板711は、中央に略円形の孔部714を有し、内周縁の一箇所から孔部714の中心へ向けて舌片部715が延設されている。そして、舌片部715の下面に、回路ユニット40の配線41が接続されるコネクタ716が設けられており、配線41をコネクタ716に接続することによって発光モジュール710と回路ユニット40とが電気的に接続される(図16参照)。 The mounting substrate 711 has a substantially circular hole 714 at the center, and a tongue piece 715 extends from one point on the inner peripheral edge toward the center of the hole 714. A connector 716 to which the wiring 41 of the circuit unit 40 is connected is provided on the lower surface of the tongue piece 715, and the light emitting module 710 and the circuit unit 40 are electrically connected by connecting the wiring 41 to the connector 716. It is connected (see FIG. 16).
 半導体発光素子712は、例えば32個が実装基板711の上面に環状に実装されている。具体的には、実装基板711の径方向に沿って並べられた半導体発光素子712を2個で1組として、16組が実装基板711の周方向に沿って等間隔を空けて並べて円環状に配置されている。なお、本願において環状とは、円環状だけでなく、三角形、四角形、五角形など多角形の環状も含まれる。したがって、半導体発光素子712は、例えば楕円や多角形の環状に実装されていても良い。 For example, 32 semiconductor light emitting elements 712 are annularly mounted on the top surface of the mounting substrate 711. Specifically, 16 sets of semiconductor light emitting elements 712 arranged along the radial direction of the mounting substrate 711 are arranged in an annular shape, with 16 pairs at equal intervals along the circumferential direction of the mounting substrate 711 It is arranged. In the present application, the term "annular" includes not only annular, but also polygonal annular rings such as triangles, squares, and pentagons. Therefore, the semiconductor light emitting device 712 may be mounted in, for example, an elliptical or polygonal ring shape.
 半導体発光素子712は、1組ごと個別に略直方体形状の封止体713によって封止されている。したがって、封止体713は全部で16個である。各封止体713の長手方向は、実装基板711の径方向と一致しており、上方側からランプ軸Jに沿って下方側を見た場合において(平面視において)、ランプ軸Jを中心として放射状に配置されている。 The semiconductor light emitting elements 712 are individually sealed by a substantially rectangular parallelepiped sealing body 713 for each set. Therefore, the number of sealing bodies 713 is 16 in all. The longitudinal direction of each sealing body 713 coincides with the radial direction of the mounting substrate 711, and when the lower side is viewed from the upper side along the lamp axis J (in plan view), the lamp axis J is the center It is arranged radially.
 基台720は、例えば、略円柱状の貫通孔721を有する略円筒状であり、その筒軸がランプ軸Jと一致する姿勢で配置されている。そして、基台720の上面722には発光モジュール710が、各半導体発光素子712がそれぞれの主出射方向を上方に向いた状態で搭載されている。基台720に貫通孔721が設けられているため、照明用光源700は軽量である。また、貫通孔721内と、貫通孔721を介してグローブ30内とに、回路ユニット40の一部が配置されているため、照明用光源700は小型である。 The base 720 is, for example, a substantially cylindrical shape having a substantially cylindrical through hole 721, and the cylinder axis of the base 720 is disposed in a posture in which it coincides with the lamp axis J. A light emitting module 710 is mounted on the upper surface 722 of the base 720 with the semiconductor light emitting elements 712 directed upward in the main emission direction. Since the through hole 721 is provided in the base 720, the illumination light source 700 is lightweight. Moreover, since a part of the circuit unit 40 is disposed in the through hole 721 and in the globe 30 via the through hole 721, the illumination light source 700 is compact.
 回路ホルダ750は、例えば、両側が開口した略円筒状であって、基台720の貫通孔721を貫通している大径部752と、口金70が外嵌されている小径部753とで構成される。大径部752の上方側端部755には有底筒状のキャップ部材790が取り付けられており、大径部752およびキャップ部材790の内部に回路ユニット40が収容されている。 The circuit holder 750 has, for example, a substantially cylindrical shape opened on both sides, and is constituted by a large diameter portion 752 penetrating the through hole 721 of the base 720 and a small diameter portion 753 to which the mouthpiece 70 is externally fitted. Be done. A bottomed cylindrical cap member 790 is attached to the upper end portion 755 of the large diameter portion 752, and the circuit unit 40 is accommodated inside the large diameter portion 752 and the cap member 790.
 回路ホルダ750には、発光モジュール710の舌片部715に対応した位置に貫通孔757が設けられている。舌片部715の先端は、貫通孔757を介して回路ホルダ750内に挿入されており、舌片部715に設けられたコネクタ716は、回路ホルダ750内に位置している。 The circuit holder 750 is provided with a through hole 757 at a position corresponding to the tongue piece 715 of the light emitting module 710. The tip of the tongue portion 715 is inserted into the circuit holder 750 through the through hole 757, and the connector 716 provided on the tongue portion 715 is located in the circuit holder 750.
 図17に示すように、回路ホルダ750と基台720とは接触しておらず、回路ホルダ750の外面756と基台720の貫通孔721の周面723との間には隙間が設けられている。したがって、発光モジュール710で発生した熱が回路ホルダ750へ伝搬し難く、回路ホルダ750が高温になり難いため、回路ユニット40が熱破壊し難い。 As shown in FIG. 17, the circuit holder 750 and the base 720 are not in contact with each other, and a gap is provided between the outer surface 756 of the circuit holder 750 and the peripheral surface 723 of the through hole 721 of the base 720. There is. Therefore, the heat generated in the light emitting module 710 is less likely to propagate to the circuit holder 750, and the circuit holder 750 is less likely to have a high temperature, so the circuit unit 40 is less likely to be thermally destroyed.
 図16に戻って、キャップ部材790は、上方側が閉塞し下方が開口した有底筒状であり、上方へ向かって漸次縮径した上方部分791と、上下方向に径が均一な円筒状の下方部分792とで構成され、上方部分791はグローブ30内に位置し、下方部分792は光学部材780の貫通孔783内に位置する。下方部分792と光学部材780と間には隙間が設けられている。したがって、発光モジュール710で発生した熱が光学部材780を介して回路ホルダ750へ伝搬し難く、回路ホルダ750が高温になり難いため、回路ユニット40が熱破壊し難い。 Returning to FIG. 16, the cap member 790 is a bottomed cylindrical tube that is closed at the upper side and opened at the lower side, and has an upper portion 791 with a gradually decreasing diameter toward the upper side and a cylindrical lower with uniform diameter in the vertical direction. The upper portion 791 is located in the glove 30, and the lower portion 792 is located in the through hole 783 of the optical member 780. A gap is provided between the lower portion 792 and the optical member 780. Therefore, the heat generated in the light emitting module 710 is not easily transmitted to the circuit holder 750 through the optical member 780, and the circuit holder 750 does not easily have a high temperature, so the circuit unit 40 is unlikely to be thermally destroyed.
 光学部材780は、発光モジュール710からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光を拡散させるための部材であって、発光モジュール710の上方側に配置されている。 The optical member 780 is a member for diffusing the emitted light so that the emitted light from the light emitting module 710 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. , And the upper side of the light emitting module 710.
 光学部材780は、例えば、中央に略円筒状の貫通孔783を有する略円錐台状(上方側に向かって外径が大きくなる略円錐台状)であって、光学部材780の中心軸(外側部781および内側部782の中心軸でもある)とランプ軸Jとは一致している。なお、光学部材780の中心軸は必ずしもランプ軸Jと一致している必要はないが、ランプ軸Jを中心とする全周に亘って均一な配光を得るためには、前記中心軸がランプ軸Jと平行であることが好ましく、前記中心軸とランプ軸Jとが一致していることがより好ましい。 The optical member 780 is, for example, a substantially frusto-conical shape having a substantially cylindrical through hole 783 at the center (a substantially frusto-conical shape whose outer diameter increases toward the upper side). The lamp axis J is also coincident with the central axis of the portion 781 and the inner portion 782). The central axis of the optical member 780 does not necessarily have to coincide with the lamp axis J, but in order to obtain uniform light distribution over the entire circumference around the lamp axis J, the central axis is a lamp The axis is preferably parallel to the axis J, and more preferably, the central axis and the lamp axis J coincide with each other.
 光学部材780は、中央に略円筒状の貫通孔を有する略円錐台状(上方側に向かって外径が大きくなる略円錐台状)の内側部782と、図17に示すように、内側部782の下面782bおよび外周面782cを覆う外側部781とで構成されている。外側部781および内側部782は、それぞれ第1の実施形態に係る外側部81および内側部82と同様の透光性材料で構成されている。 The optical member 780 has an inner portion 782 having a substantially truncated conical shape (a substantially conical shape in which the outer diameter increases toward the upper side) having a substantially cylindrical through hole at the center, as shown in FIG. It is comprised by the lower part 782b of 782, and the outer side part 781 which covers the outer peripheral surface 782c. The outer side portion 781 and the inner side portion 782 are made of the same translucent material as the outer side portion 81 and the inner side portion 82 according to the first embodiment.
 光学部材780の上面780aは、外側部781の上面781aと内側部782の上面782aとで構成されている。光学部材780の下面780bは、外側部781の下面781bで構成されている。光学部材780の外周面780cは、外側部781の外周面781cで構成されている。なお、外側部781と内側部782との間には隙間がない。 The upper surface 780 a of the optical member 780 is composed of the upper surface 781 a of the outer side portion 781 and the upper surface 782 a of the inner side portion 782. The lower surface 780 b of the optical member 780 is composed of the lower surface 781 b of the outer side portion 781. An outer peripheral surface 780 c of the optical member 780 is constituted by an outer peripheral surface 781 c of the outer side portion 781. There is no gap between the outer side 781 and the inner side 782.
 光学部材780の上面780aおよび下面780bは、それぞれランプ軸Jと直交する平面であり、光学部材780の外周面780cはランプ軸Jに対して傾斜した斜面である。なお、光学部材780の上面780aおよび下面780bは平面に限定されず、例えば、光学部材780の上面780aを、倒円錐面などの凹面や、円錐面などの凸面として、光学部材780から出射される光の拡散度合いを調整しても良い。封止体713の上面713aに接触させる光学部材780の下面780bは、平面であることが好ましい。 The upper surface 780a and the lower surface 780b of the optical member 780 are planes orthogonal to the lamp axis J, respectively, and the outer peripheral surface 780c of the optical member 780 is a slope inclined with respect to the lamp axis J. The upper surface 780a and the lower surface 780b of the optical member 780 are not limited to flat surfaces, and for example, the upper surface 780a of the optical member 780 is emitted from the optical member 780 as a concave surface such as a conical surface or a convex surface such as a conical surface. The degree of diffusion of light may be adjusted. The lower surface 780 b of the optical member 780 to be in contact with the upper surface 713 a of the sealing body 713 is preferably a flat surface.
 発光モジュール710の封止体713から出射され、外側部781の下面781bから外側部781内に入射し、さらに内側部782の外周面782cで反射した光は、例えば図17において光路L6で示すように、外側部781内で内部反射を繰り返し、外側部781の上面781aから光学部材780外へ出射する。 The light emitted from the sealing body 713 of the light emitting module 710 is incident from the lower surface 781 b of the outer portion 781 into the outer portion 781 and is further reflected by the outer peripheral surface 782 c of the inner portion 782 as shown by an optical path L6 in FIG. The light is repeatedly reflected internally in the outer side 781 and emitted from the upper surface 781a of the outer side 781 to the outside of the optical member 780.
 発光モジュール710の封止体713から出射され、外側部781の下面781bから外側部781内に入射し、さらに内側部782の下面782bに入射した光は、例えば図17において光路L7で示すように、内側部782を透過して内側部782の上面782aから光学部材780外へ出射する。また、例えば図17において光路L8で示すように、内側部782内で散乱して外側部781に入射する。外側部781に入射した光は、外側部781内で内部反射を繰り返し、外側部781の上面781aから光学部材780外へ出射する。 The light emitted from the sealing body 713 of the light emitting module 710 enters the outer portion 781 from the lower surface 781 b of the outer portion 781 and further enters the lower surface 782 b of the inner portion 782 as shown by an optical path L7 in FIG. The light passes through the inner portion 782 and is emitted from the upper surface 782 a of the inner portion 782 to the outside of the optical member 780. For example, as shown by an optical path L8 in FIG. 17, the light is scattered in the inner portion 782 and is incident on the outer portion 781. The light incident on the outer side 781 repeats internal reflection in the outer side 781 and exits the optical member 780 from the upper surface 781 a of the outer side 781.
 発光モジュール710の封止体713から出射され、外側部781の外周面781cで反射した光は、例えば図17において光路L9で示すように、斜め下方に向かう。なお、外側部781の外周面781cには鏡面処理が施されていても良い。このようにすれば、外周面781cから外側部781内へ光が入射するのを防止できる。外周面781cに鏡面処理を施す方法としては、例えば金属薄膜や誘電体多層膜などの反射膜を、例えば熱蒸着法、電子ビーム蒸着法、スパッタ法、メッキ、などの方法により形成することが考えられる。 The light emitted from the sealing body 713 of the light emitting module 710 and reflected by the outer peripheral surface 781 c of the outer side portion 781 travels obliquely downward as shown by, for example, an optical path L9 in FIG. The outer peripheral surface 781 c of the outer side portion 781 may be subjected to mirror surface processing. In this way, it is possible to prevent light from entering the outer portion 781 from the outer peripheral surface 781 c. As a method of mirror-finishing the outer peripheral surface 781c, for example, it is considered to form a reflective film such as a metal thin film or a dielectric multilayer film by a method such as a thermal evaporation method, an electron beam evaporation method, a sputtering method or plating. Be
 以上のようにして、発光モジュール710からの出射光は、出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、光学部材780によって拡散される。したがって、グローブ30の内面32における下方寄りの領域に光がより多く届くことになり、照明用光源700の配光角が広がる。グローブ30に届いた光は、さらにグローブ30によって拡散される。このような構成とすることで、照明用光源700は配光角270°~310°を実現できた。なお、光学部材780がない場合の配光角は約220°であった。 As described above, the light emitted from the light emitting module 710 is diffused by the optical member 780 so as to reach the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. Therefore, more light will reach the lower region of the inner surface 32 of the globe 30, and the light distribution angle of the illumination light source 700 is broadened. The light that has reached the glove 30 is further diffused by the glove 30. With such a configuration, the illumination light source 700 can realize a light distribution angle of 270 ° to 310 °. The light distribution angle when the optical member 780 was not present was about 220 °.
 なお、広い配光角を得るためには、光学部材780の上面780aおよび外周面780cが、ケース60の上方側端部61よりも、ランプ軸Jに沿った方向における上方側に位置していることが好ましい。さらに、封止体713の上面713aが、ケース60の上方側端部61よりも、ランプ軸Jに沿った方向における上方側に位置していることがより好ましい。 In order to obtain a wide light distribution angle, the upper surface 780a and the outer peripheral surface 780c of the optical member 780 are positioned above the upper end 61 of the case 60 in the direction along the lamp axis J. Is preferred. Furthermore, it is more preferable that the upper surface 713a of the sealing body 713 be positioned above the upper side end 61 of the case 60 in the direction along the lamp axis J.
 照明用光源700は、照射角が狭い発光モジュール710が平面配置されていても、光学部材780によってその照射角を広げることができるため、配光特性が良好である。また、外側部781が光学部材780の外周全体に亘って存在しているため、ランプ軸Jを中心とする全周に亘って照射角を広げることができ、その全周に亘って配光特性が良好である。 Since the illumination angle of the light source 700 for illumination can be expanded by the optical member 780 even if the light emitting module 710 having a narrow illumination angle is disposed in a plane, the light distribution characteristic is excellent. In addition, since the outer side portion 781 exists over the entire outer periphery of the optical member 780, the irradiation angle can be extended over the entire periphery around the lamp axis J, and the light distribution characteristic over the entire periphery Is good.
 <第6の実施形態>
 図18は、第6の実施形態に係る光学部材を説明するための図であって、(a)は断面図、(b)は光学部材による出射光の拡散の態様を説明するための概略図である。なお、図18(b)では、光学部材および発光モジュール以外の部材は省略している。
Sixth Embodiment
FIG. 18 is a view for explaining an optical member according to a sixth embodiment, wherein (a) is a cross-sectional view, and (b) is a schematic view for explaining a diffusion mode of outgoing light by the optical member. It is. In FIG. 18B, members other than the optical member and the light emitting module are omitted.
 図18(a)に示すように、第6の実施の形態に係る照明用光源800は、光学部材880の上面880aおよび下面880bが平面でない点、および、光学部材880と発光モジュール10との間に隙間801が設けられている点において、第1の実施形態に係る照明用光源1と相違する。その他の構成については基本的に第1の実施形態に係る照明用光源1と略同様である。 As shown in FIG. 18A, the illumination light source 800 according to the sixth embodiment has a point in which the upper surface 880a and the lower surface 880b of the optical member 880 are not flat, and between the optical member 880 and the light emitting module 10. The light source 1 differs from the light source 1 for illumination according to the first embodiment in that a gap 801 is provided. The other configuration is basically the same as that of the illumination light source 1 according to the first embodiment.
 光学部材880は、発光モジュール10からの出射光が出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届くように、前記出射光を拡散させるための部材であって、図18(a)に示すように、基台20の上面21に取り付けられた一対の支持部材890によって支持されており、発光モジュール10の上方側に、発光モジュール10から離した状態で配置されている。 The optical member 880 is a member for diffusing the emitted light so that the emitted light from the light emitting module 10 reaches the inner surface 32 of the globe 30 with the maximum luminous intensity in the range of the emission angle of 30 ° to 60 °. 18A, supported by a pair of supporting members 890 attached to the upper surface 21 of the base 20, and disposed above the light emitting module 10 in a state of being separated from the light emitting module 10, ing.
 各支持部材890は、基台20にねじ止めされる台座891と、当該台座891に延設された支柱892とを備え、当該支柱892の基端には、発光モジュール10を基台20に固定するための爪状の固定部893が設けられ、当該支柱892の先端には、光学部材880を上下から掴んで固定する断面略コ字形の把持部894が設けられている。 Each support member 890 includes a pedestal 891 screwed to the base 20, and a post 892 extended to the pedestal 891. The light emitting module 10 is fixed to the base 20 at the base end of the post 892 A hook-shaped fixing portion 893 is provided, and a grip portion 894 having a substantially U-shaped cross section for gripping and fixing the optical member 880 from above and below is provided at the tip of the support 892.
 光学部材880は、例えば、筒状であってその筒軸がランプ軸Jと平行である外側部881と、外側部881の筒内に詰められた柱状の内側部882とで構成される。より具体的には、光学部材880は円柱状であって、外側部881はランプ軸Jと一致する筒軸を有する円筒状であって、内側部882は外側部881の筒内に隙間なく詰められた円柱状であってその柱軸がランプ軸Jと一致する。 The optical member 880 has, for example, a cylindrical outer portion 881 whose cylindrical axis is parallel to the lamp axis J, and a columnar inner portion 882 packed in the cylinder of the outer portion 881. More specifically, the optical member 880 has a cylindrical shape, and the outer side portion 881 has a cylindrical shape having a cylindrical axis coincident with the lamp axis J, and the inner side 882 is tightly packed in the cylinder of the outer side portion 881. It has a cylindrical shape, and its column axis coincides with the lamp axis J.
 図18(b)に示すように、光学部材880の上面880aは、外側部881の上面881aと内側部882の上面882aとで構成されている。光学部材880の下面880bは、外側部881の下面881bと内側部882の下面882bとで構成されている。光学部材880の上面880aおよび下面880bはそれぞれ曲面である。 As shown in FIG. 18B, the upper surface 880a of the optical member 880 is composed of the upper surface 881a of the outer side portion 881 and the upper surface 882a of the inner side portion 882. The lower surface 880 b of the optical member 880 is composed of the lower surface 881 b of the outer side portion 881 and the lower surface 882 b of the inner side portion 882. The upper surface 880a and the lower surface 880b of the optical member 880 are curved surfaces, respectively.
 外側部881および内側部882は、それぞれ透光性材料からなる。ただし、内側部882の材料は、外側部881の材料よりも屈折率が低い。発光モジュール10の上方側発光面13aから出射され、光学部材880に入射した光は、より屈折率の高い材料で形成された外側部881に集まり、図18(b)において光路L10で示すように、主として外側部881の上面881aから出射される。なお、外側部881の上面881aから出射される光は、主としてランプ軸Jに沿って上方へ出射されるのではなく、主としてランプ軸Jに対して30°~60°の範囲の出射角で出射される。 The outer side portion 881 and the inner side portion 882 are each made of a translucent material. However, the material of the inner portion 882 has a lower refractive index than the material of the outer portion 881. The light emitted from the upper side light emitting surface 13a of the light emitting module 10 and incident on the optical member 880 is collected at the outer portion 881 formed of a material having a higher refractive index, as shown by an optical path L10 in FIG. The light is emitted mainly from the upper surface 881 a of the outer side portion 881. The light emitted from the upper surface 881a of the outer portion 881 is not mainly emitted upward along the lamp axis J, but is emitted mainly at an emission angle in the range of 30 ° to 60 ° with respect to the lamp axis J. Be done.
 光学部材880の上面880aは、光学部材880内から上面880aを透過して外部へ出射する光を、グローブ30の頂部33へ向けて集光させる集光面となっている。具体的には、上面880aは、発光モジュール10側に凹んだ凹曲面形状であって、ランプ軸Jを含む仮想面で切断した場合の切断面(以下、「縦断面」と称する)において、発光モジュール10側に凹んだ略楕円弧形状である。光学部材880の上面880aから出射する光は、図18(b)において光路L11で示すように、グローブ30の頂部33に集束する。したがって、グローブ30の頂部33を明るくすることができ、配光特性をより良好にすることができる。 The upper surface 880a of the optical member 880 is a light collecting surface that condenses light emitted from the inside of the optical member 880 through the upper surface 880a to the outside toward the top 33 of the globe 30. Specifically, the upper surface 880a has a concave surface shape which is recessed toward the light emitting module 10, and emits light on a cut surface (hereinafter referred to as "longitudinal surface") when cut by a virtual plane including the lamp axis J It has a substantially elliptical arc shape recessed to the module 10 side. The light emitted from the upper surface 880a of the optical member 880 converges on the top 33 of the globe 30, as shown by the optical path L11 in FIG. 18 (b). Therefore, the top 33 of the glove 30 can be brightened, and the light distribution characteristic can be further improved.
 光学部材880の下面880bは、発光モジュール10からの出射光の一部をグローブ30の裾部34へ向けて反射させる反射面となっている。具体的には、下面880bは、発光モジュール10側に突出した凸曲面形状であって、縦断面において、発光モジュール10側に膨らんだ略楕円弧形状である。発光モジュール10から出射され、光学部材880の下面880bに入射した光の一部は、図18(b)において光路L12で示すように、斜め下方に反射してグローブ30の裾部34に届く。したがって、グローブ30の裾部34を明るくすることができ、配光特性をより良好にすることができる。 The lower surface 880 b of the optical member 880 is a reflecting surface that reflects part of the light emitted from the light emitting module 10 toward the skirt 34 of the glove 30. Specifically, the lower surface 880b has a convex curved surface shape that protrudes to the light emitting module 10 side, and has a substantially elliptical arc shape that bulges to the light emitting module 10 side in the longitudinal cross section. A part of the light emitted from the light emitting module 10 and incident on the lower surface 880b of the optical member 880 is reflected obliquely downward and reaches the skirt portion 34 of the glove 30, as shown by an optical path L12 in FIG. Therefore, the skirt 34 of the glove 30 can be brightened, and the light distribution characteristic can be made better.
 光学部材880と発光モジュール10との間には隙間801が設けられている。光学部材880は、発光モジュール10から離した状態で配置されているため、光学部材880と発光モジュール10は接触していない。したがって、光学部材880の下面880bと発光モジュール10の上方側発光面13aも接触しておらず、光学部材880の下面880bと発光モジュール10の上方側発光面13aとは離間しているので、下面880bで反射した光が、発光モジュール10や基台20には向かわず、グローブ30の裾部34に届き易い。また、光学部材80が発光モジュール10に接触していないため、発光モジュール10の上方側発光面13aに荷重や応力がかかり難い。 A gap 801 is provided between the optical member 880 and the light emitting module 10. Since the optical member 880 is disposed apart from the light emitting module 10, the optical member 880 and the light emitting module 10 are not in contact with each other. Therefore, the lower surface 880b of the optical member 880 is not in contact with the upper side light emitting surface 13a of the light emitting module 10, and the lower surface 880b of the optical member 880 and the upper side light emitting surface 13a of the light emitting module 10 are separated. The light reflected by 880 b does not go to the light emitting module 10 or the base 20 and easily reaches the skirt 34 of the glove 30. In addition, since the optical member 80 is not in contact with the light emitting module 10, it is difficult for a load or stress to be applied to the upper side light emitting surface 13a of the light emitting module 10.
 図19は、第6の実施形態に係る光学部材の配光特性を説明するための配光曲線図である。第6の実施形態に係る光学部材880の配光特性を、第1の実施形態に係る光学部材80の配光特性と比較してみると、図19に示すように、発光モジュール10からの出射光が、出射角30°~60°の範囲で最大光度となってグローブ30の内面32に届く点においては同じである。しかしながら、第6の実施形態に係る光学部材880は、上面880aが集光面となっているため、第1の実施形態に係る光学部材80よりも、出射角0°付近の光度が増している。また、第6の実施形態に係る光学部材880は、下面880bが反射面となっているため、第1の実施形態に係る光学部材80よりも、出射角90°付近の光度が増している。 FIG. 19 is a light distribution curve diagram for explaining the light distribution characteristic of the optical member according to the sixth embodiment. When the light distribution characteristic of the optical member 880 according to the sixth embodiment is compared with the light distribution characteristic of the optical member 80 according to the first embodiment, as shown in FIG. It is the same in that the incident light reaches the inner surface 32 of the glove 30 with the maximum luminous intensity in the range of the output angle of 30 ° to 60 °. However, in the optical member 880 according to the sixth embodiment, since the upper surface 880a is a light collecting surface, the light intensity near the emission angle of 0 ° is higher than that of the optical member 80 according to the first embodiment. . Further, in the optical member 880 according to the sixth embodiment, since the lower surface 880b is a reflective surface, the light intensity near the emission angle of 90 ° is higher than that of the optical member 80 according to the first embodiment.
 なお、第6の実施形態に係る光学部材880は、上面880aが集光面になっている点、下面880bが反射面となっている点、発光モジュール10との間に隙間801が設けられている点の3点全てを満たす構成に限定されず、それら3点の内の少なくとも1点を満たしていれば良い。 In the optical member 880 according to the sixth embodiment, the upper surface 880a is a light condensing surface, the lower surface 880b is a reflective surface, and a gap 801 is provided between the optical member 880 and the light emitting module 10. The configuration is not limited to the configuration that satisfies all three points, and it is sufficient to satisfy at least one of the three points.
 図20は、第6の実施形態の変形例に係る光学部材を説明するための断面図である。例えば、図20(a)に示す例では、光学部材880Aは、上面880Aaが平面であり集光面となっていないが、下面880Abは反射面となっており、発光モジュール10との間には隙間801Aが設けられている。この場合、グローブ30の頂部33には集光し易くなっていないが、グローブ30の裾部34には光が届き易くなっている。 FIG. 20 is a cross-sectional view for explaining an optical member according to a modification of the sixth embodiment. For example, in the example shown in FIG. 20A, the upper surface 880Aa of the optical member 880A is a flat surface and is not a condensing surface, but the lower surface 880Ab is a reflective surface. A gap 801A is provided. In this case, although it is not easy to collect light on the top portion 33 of the glove 30, light easily reaches the skirt portion 34 of the glove 30.
 また、図20(b)に示す例では、光学部材880Bは、上面880Baが集光面となっているが、下面880Bbは反射面となっておらず、発光モジュール10との間には隙間801Bが設けられている。この場合、グローブ30の頂部33には集光し易くなっているがが、グローブ30の裾部34には光が届き易くなっていない。 Further, in the example shown in FIG. 20 (b), the upper surface 880 Ba of the optical member 880 B is a condensing surface, but the lower surface 880 Bb is not a reflecting surface, and a gap 801 B is formed between the optical member 880 B and the light emitting module 10. Is provided. In this case, although it is easy to collect light on the top portion 33 of the glove 30, light does not easily reach the skirt portion 34 of the glove 30.
 また、図20(c)に示す例では、光学部材880Cは、上面880Caが集光面となっており、下面880Cbも反射面となっており、発光モジュール10との間にも隙間801Cが設けられている。但し、光学部材880Cは、ランプ軸J付近では発光モジュール10と接触しており、ランプ軸J上には隙間はなく、隙間801Cが存在するのは、下面880Cbの外周領域と上方側発光面13aの外周領域との間である。この場合、グローブ30の頂部33には集光し易くなっており、グローブ30の裾部34にも光が届き易くなっている。このように、少なくとも光学部材880Cの下面880Cbの外周領域が反射面となっており、且つ、光学部材880Cの下面880Cbの外周領域と発光モジュール10の上方側発光面との間に隙間801Cが設けられていれば、上方側発光面13aの外周領域からの出射光を効率良くグローブ30の裾部34へ届けることができる。また、ランプ軸J上の光学部材880Cと発光モジュール10とが接触している箇所において、光学部材880Cを発光モジュール10に固定することが可能である。 Further, in the example shown in FIG. 20C, in the optical member 880C, the upper surface 880Ca is a light collecting surface, the lower surface 880Cb is also a reflecting surface, and a gap 801C is also provided between the light emitting module 10 It is done. However, the optical member 880C is in contact with the light emitting module 10 near the lamp axis J, and there is no gap on the lamp axis J, and the gap 801C exists in the outer peripheral region of the lower surface 880Cb and the upper light emitting surface 13a Between the peripheral region of In this case, it is easy to collect light on the top 33 of the glove 30 and light can easily reach the skirt 34 of the glove 30. As described above, at least the outer peripheral region of the lower surface 880Cb of the optical member 880C is a reflective surface, and a gap 801C is provided between the outer peripheral region of the lower surface 880Cb of the optical member 880C and the upper light emitting surface of the light emitting module 10. If it is made, the emitted light from the outer peripheral region of the upper side light emitting surface 13a can be efficiently delivered to the skirt portion 34 of the glove 30. Further, it is possible to fix the optical member 880C to the light emitting module 10 at a position where the optical member 880C on the lamp axis J is in contact with the light emitting module 10.
 また、光学部材の上面の集光面は、縦断面において発光モジュール10側に凹んだ略楕円弧形状に限定されず、グローブ30の頂部33に集光可能な形状であれば良い。例えば、図20(d)に示す光学部材880Dのように、上面880Daの集光面が、縦断面において発光モジュール10側に凹んだ略V字状であっても良い。この場合も、グローブ30の頂部33を明るくする効果を奏する。 The light collecting surface of the upper surface of the optical member is not limited to a substantially elliptical arc shape recessed on the side of the light emitting module 10 in the vertical cross section, as long as the light collecting surface can collect light on the top 33 of the globe 30. For example, as in an optical member 880D shown in FIG. 20 (d), the light collecting surface of the upper surface 880Da may be substantially V-shaped recessed toward the light emitting module 10 in the longitudinal cross section. Also in this case, the effect of brightening the top 33 of the glove 30 is achieved.
 さらに、光学部材の下面の反射面は、縦断面において発光モジュール10側に突出した略楕円弧形状に限定されず、グローブ30の裾部34に光が届き易い形状であれば良い。例えば、図20(d)に示す光学部材880Dのように、下面880Dbの反射面が、縦断面において発光モジュール10側に突出した略V字状であっても良い。この場合も、グローブ30の裾部34を明るくする効果を奏する。 Furthermore, the reflecting surface of the lower surface of the optical member is not limited to the substantially elliptical arc shape projecting to the light emitting module 10 side in the longitudinal cross section, as long as the light easily reaches the skirt portion 34 of the globe 30. For example, as in an optical member 880D shown in FIG. 20 (d), the reflecting surface of the lower surface 880Db may have a substantially V shape protruding toward the light emitting module 10 in the vertical cross section. Also in this case, an effect of brightening the skirt portion 34 of the glove 30 is exerted.
 また、光学部材は、上面の全体が集光面となっている必要はなく、上面の一部のみが集光面となっていても良い。例えば、図20(e)に示す光学部材880Eの上面880Eaように、ランプ軸J付近では集光面ではない平面であり、その平面の外側の外周領域に環状の集光面が形成されていても良い。 In the optical member, the entire upper surface does not have to be a light collecting surface, and only a part of the upper surface may be a light collecting surface. For example, like the upper surface 880Ea of the optical member 880E shown in FIG. 20 (e), it is a plane that is not a light collecting surface near the lamp axis J, and an annular light collecting surface is formed in the outer peripheral region outside the plane. Also good.
 同様に、光学部材は、下面の全体が反射面となっている必要はなく、下面の一部のみが反射面となっていても良い。例えば、図20(e)に示す光学部材880Eの下面880Ebように、ランプ軸J付近では集光面ではない平面であり、その平面の外側の外周領域に環状の反射面が形成されていても良い。この場合でも、上方側発光面13aの外周領域からの出射光を効率良くグローブ30の裾部34へ届けることができる。 Similarly, in the optical member, the entire lower surface does not have to be a reflective surface, and only a part of the lower surface may be a reflective surface. For example, as in the lower surface 880Eb of the optical member 880E shown in FIG. 20 (e), it is a plane that is not a condensing surface near the lamp axis J, and an annular reflective surface is formed in the outer peripheral region outside that plane. good. Also in this case, the light emitted from the outer peripheral region of the upper side light emitting surface 13a can be efficiently delivered to the skirt portion 34 of the glove 30.
 さらに、光学部材は、上面の集光面と下面の反射面の形状の種類が違っていても良い。例えば、図20(f)に示す光学部材880Fのように、上面880Faは、縦断面において発光モジュール10側に突出した略楕円弧形状であるが、下面880Fbは、ランプ軸J付近では平面であって、且つ、その平面の外側に環状の集光面が形成されており、下面880Fbの平面の部分が発光モジュール10に固定されている態様であっても良い。 Furthermore, the optical members may have different types of shapes of the light collecting surface on the upper surface and the reflecting surface on the lower surface. For example, as in an optical member 880F shown in FIG. 20 (f), the upper surface 880Fa has a substantially elliptical arc shape projecting toward the light emitting module 10 in the longitudinal cross section, but the lower surface 880Fb is a plane near the lamp axis J In addition, an annular light collecting surface may be formed on the outside of the flat surface, and the flat surface portion of the lower surface 880Fb may be fixed to the light emitting module 10.
 <その他>
 以上、本発明の構成を第1~第6の実施の形態およびそれらの変形例に基づいて説明したが、本発明は上記実施の形態に限られない。例えば、第1~第6の実施形態に係る構成、およびそれらの変形例に係る構成を、部分的に適宜組み合わせてなる照明用光源であっても良い。また、上記実施の形態に記載した材料、数値等は好ましいものを例示しているだけであり、それに限定されることはない。さらに、本発明の技術的思想の範囲を逸脱しない範囲で、照明用光源の構成に適宜変更を加えることは可能である。
<Others>
The configuration of the present invention has been described above based on the first to sixth embodiments and their modifications, but the present invention is not limited to the above embodiments. For example, the illumination light source may be configured by partially combining the configurations according to the first to sixth embodiments and the configurations according to the modifications thereof. In addition, the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the illumination light source without departing from the scope of the technical idea of the present invention.
 本発明は、照明一般に広く利用することができる。 The present invention can be widely used in lighting in general.
 1,700 照明用光源
 2 外囲器
 10,210,410,610,710 発光モジュール
 13a,213a,413a,613a,713a 上方側発光面
 30 グローブ
 32 内面
 33 頂部
 34 裾部
 60 ケース
 61 上方側端部
 80,180,380,480,580,680,780 光学部材
 80b,780b 下面
 81,181,381,481,581,681,781 外側部
 82,182,382,482,582,682,782 内側部
1,700 light source for illumination 2 envelope 10, 210, 410, 610, 710 light emitting module 13a, 213a, 413a, 613a, 713a upper side light emitting surface 30 globe 32 inner surface 33 top 34 skirt portion 60 case 61 upper side end 80, 180, 380, 480, 580, 680, 780 Optical member 80b, 780b Bottom surface 81, 181, 381, 481, 581, 681, 781 Outer portion 82, 182, 382, 482, 582, 682, 782 Inner portion

Claims (14)

  1.  照明方向である上方側に開口を有する筒状のケースと、前記ケースの上方側に前記開口を塞ぐように取り付けられたグローブとで構成される外囲器内に、光源としての1または複数の発光モジュールが収容された照明用光源であって、
     前記外囲器内の全ての発光モジュールは、主出射方向を上方に向けた姿勢で平面配置されており、前記発光モジュールの上方側には、前記発光モジュールからの出射光が出射角30°~60°の範囲で最大光度となって前記グローブの内面に届くように、前記出射光を拡散させる1または複数の光学部材が配置されていることを特徴とする照明用光源。
    One or more light sources as light sources in an envelope constituted by a cylindrical case having an opening on the upper side which is an illumination direction, and a glove attached to the upper side of the case so as to close the opening. A light source for illumination in which a light emitting module is housed,
    All of the light emitting modules in the envelope are flatly arranged with the main emission direction facing upward, and the emission angle of the light emitted from the light emitting modules is 30 ° to the upper side of the light emitting modules. One or more optical members for diffusing the emitted light are disposed to reach the inner surface of the globe at maximum light intensity in the range of 60 °.
  2.  前記光学部材は、筒状であってその筒軸がランプ軸と平行である外側部と、当該外側部の筒内に詰められた柱状の内側部とで構成され、前記外側部は透光性材料からなると共に、前記内側部は前記外側部の透光性材料よりも屈折率の低い透光性材料からなることを特徴とする請求項1に記載の照明用光源。 The optical member has a cylindrical shape, and an outer portion whose cylinder axis is parallel to the lamp axis, and a columnar inner portion packed in the cylinder of the outer portion, and the outer portion is translucent The illumination light source according to claim 1, wherein the inner side portion is made of a material, and the inner side portion is made of a translucent material having a lower refractive index than the translucent material of the outer side portion.
  3.  前記外側部は、筒軸がランプ軸と一致した円筒状であって、前記内側部は、前記外側部の筒内に隙間なく詰められた円柱状であることを特徴とする請求項2記載の照明用光源。 The outer side portion is a cylindrical shape in which a cylinder axis coincides with a lamp axis, and the inner side portion is a cylindrical shape packed in a cylinder of the outer side portion without a gap. Light source for illumination.
  4.  前記光学部材の下面の少なくとも一部は、前記発光モジュールからの出射光の一部を前記グローブの裾部へ向けて反射させる反射面となっていることを特徴とする請求項1~3のいずれかに記載の照明用光源。 4. At least a part of the lower surface of the optical member is a reflecting surface that reflects a part of the light emitted from the light emitting module toward the skirt of the glove. Lighting source for lighting.
  5.  前記光学部材の上面の少なくとも一部は、前記光学部材内から前記上面を透過して外部へ出射する光を、前記グローブの頂部へ向けて集光させる集光面となっていることを特徴とする請求項1~4のいずれかに記載の照明用光源。 At least a part of the upper surface of the optical member is a light collecting surface which condenses light emitted from the inside of the optical member through the upper surface to the outside toward the top of the globe. An illumination light source according to any one of claims 1 to 4.
  6.  前記光学部材は、円錐台状であってその中心軸がランプ軸と平行である内側部と、当該内側部の下面および外周面を覆う外側部とで構成され、前記外側部は透光性材料からなると共に、前記内側部は前記外側部の透光性材料よりも屈折率の低い透光性材料からなることを特徴とする請求項1に記載の照明用光源。 The optical member is formed of an inner part which is frusto-conical and whose central axis is parallel to the lamp axis, and an outer part which covers the lower surface and the outer peripheral surface of the inner part, and the outer part is a translucent material The illumination light source according to claim 1, wherein the inner portion is made of a translucent material having a lower refractive index than the translucent material of the outer portion.
  7.  前記光学部材は、上方側から見て、前記発光モジュールの上方側発光面よりも小さく、かつ、前記光学部材全体が前記上方側発光面と重なる位置に配置されていることを特徴とする請求項1~6のいずれかに記載の照明用光源。 The said optical member is smaller than the upper side light emission surface of the said light emitting module seen from the upper side, and the said optical member is arrange | positioned in the position which overlaps with the said upper side light emission surface. The illumination light source according to any one of 1 to 6.
  8.  前記光学部材の下面は、前記発光モジュールの上方側発光面と面接触していることを特徴とする請求項1~7のいずれかに記載の照明用光源。 The illumination light source according to any one of claims 1 to 7, wherein the lower surface of the optical member is in surface contact with the upper side light emitting surface of the light emitting module.
  9.  前記光学部材と前記発光モジュールとの間に隙間が設けられている請求項1~7のいずれかに記載の照明用光源。 The illumination light source according to any one of claims 1 to 7, wherein a gap is provided between the optical member and the light emitting module.
  10.  前記グローブの最大外径は、前記ケースの上方側端部の外径よりも大きいことを特徴とする請求項1~9のいずれかに記載の照明用光源。 The illumination light source according to any one of claims 1 to 9, wherein the maximum outer diameter of the globe is larger than the outer diameter of the upper end of the case.
  11.  前記発光モジュールは1つであって、ランプ軸上に配置されており、前記光学部材も1つであって、ランプ軸上に配置されていることを特徴とする請求項1~10のいずれかに記載の照明用光源。 11. The light emitting module according to any one of claims 1 to 10, wherein one light emitting module is disposed on the lamp axis and one optical member is disposed on the lamp axis. The illumination light source described in.
  12.  前記発光モジュールは複数であって、ランプ軸を中心に点対称で配置されており、前記光学部材も複数であって、前記各発光モジュールの上方側に1対1の関係で配置されていることを特徴とする請求項1~10のいずれかに記載の照明用光源。 The plurality of light emitting modules are disposed point-symmetrically with respect to a lamp axis, and the plurality of optical members are disposed in a one-to-one relationship above the light emitting modules. The illumination light source according to any one of claims 1 to 10, characterized in that
  13.  前記発光モジュールは1つであって、ランプ軸上に配置されており、前記光学部材は複数であって、上方から見て、前記発光モジュールの上方側発光面と重なる位置に全ての光学部材が配置されていることを特徴とする請求項1~10のいずれかに記載の照明用光源。 The light emitting module is one and disposed on the lamp axis, and the optical members are plural, and all the optical members are at positions overlapping with the upper side light emitting surface of the light emitting module when viewed from above The illumination light source according to any one of claims 1 to 10, wherein the light source is disposed.
  14.  前記発光モジュールは複数であって、ランプ軸を中心に点対称で配置されており、前記光学部材は1つであって、ランプ軸上に配置されていることを特徴とする請求項1~10のいずれかに記載の照明用光源。 11. The light emitting module according to claim 1, wherein a plurality of the light emitting modules are disposed point-symmetrically with respect to a lamp axis, and the one optical member is disposed on the lamp axis. The illumination light source according to any one of the above.
PCT/JP2012/000486 2011-05-12 2012-01-26 Illumination light source WO2012153443A1 (en)

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