WO2012137543A1 - Magnetic sensor - Google Patents

Magnetic sensor Download PDF

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Publication number
WO2012137543A1
WO2012137543A1 PCT/JP2012/053745 JP2012053745W WO2012137543A1 WO 2012137543 A1 WO2012137543 A1 WO 2012137543A1 JP 2012053745 W JP2012053745 W JP 2012053745W WO 2012137543 A1 WO2012137543 A1 WO 2012137543A1
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Prior art keywords
magnetoresistive element
magnet
magnetic sensor
case
magnets
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PCT/JP2012/053745
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French (fr)
Japanese (ja)
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濱口大輔
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株式会社村田製作所
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Publication of WO2012137543A1 publication Critical patent/WO2012137543A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/091—Constructional adaptation of the sensor to specific applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0047—Housings or packaging of magnetic sensors ; Holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details

Definitions

  • the present invention relates to a long magnetic sensor that detects a magnetic pattern printed on, for example, banknotes.
  • Patent Document 1 is disclosed as a magnetic sensor for discriminating an object to be detected such as a bill or a security printed with a predetermined pattern with magnetic ink or the like.
  • the vibration in the fundamental wave mode is a bending vibration in which both ends of the long magnetic sensor are fixed ends.
  • FIG. 1A shows a state in which no bending stress is applied to the long magnetic sensor.
  • a plurality of magnetoresistive elements 2, a plurality of magnets 5 that apply a magnetic field to the magnetic sensing portions of the plurality of magnetoresistive elements 2, and a case 1 that holds the magnetoresistive elements 2 and the magnets 5 are provided. Yes.
  • the plurality of magnets 5 and the plurality of magnets are arranged such that the position of the facing portion between the magnets 5 of the plurality of magnets 5 is the center position of a certain magnetoresistive element 2 of the plurality of magnetoresistive elements 2.
  • a resistance element 2 is arranged.
  • FIG. 1B is a partial sectional view exaggeratingly showing a state in which bending stress is applied to the long magnetic sensor.
  • the case 1 is a resin molded from a resin mold
  • the magnetoresistive element 2 and the magnet 5 are softer than the case 1. For this reason, when bending stress is applied to the long magnetic sensor, stress distortion occurs in the magnetoresistive element 2 corresponding to the facing portion (magnet joint position) between the magnet 5 and the magnet 5.
  • the magnetoresistive element 2 is made of an n-InSb material, InAs material, GaAs material, Ge material, or Si material having high electron mobility. Such a magnetoresistive element material has a piezoresistive effect. Therefore, when stress strain occurs in the magnetoresistive element 2, a signal due to the piezoresistive effect is superimposed, and this acts as noise (piezonoise).
  • the bending stress applied to the magnetoresistive element 2 can be reduced, but not only the distance accuracy between the magnetic sensor and the object to be detected is lowered, but also the amplitude of the bending vibration is increased. End up. Since the detection sensitivity of the magnetic material is affected by the square of the distance between the magnetic sensing portion of each magnetoresistive element of the magnetic sensor and the magnetic material to be detected, the flexibility of the case of the magnetic sensor cannot be used.
  • the stress strain applied to the magnetoresistive element 2 is reduced.
  • the opposing portion of the magnetoresistive element 2 and the magnetoresistive element 2 naturally has no magnetic sensitive part (disconnected)
  • the detection sensitivity of the magnetic material tends to decrease
  • the magnet 5 and the magnet 5 Since the opposing part has a tendency that the detection sensitivity of the magnetic material is lowered due to the small magnetic flux density, both sensitivity reduction factors overlap. Therefore, it is difficult to adopt a structure in which the magnet facing portion overlaps the magnetoresistive element facing portion.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a magnetic sensor that solves the above-described piezo noise problem caused by bending vibration accompanying the increase in length of the magnetic sensor.
  • the magnetic sensor of the present invention includes a plurality of magnetoresistive elements, a plurality of magnets, and a case for holding the plurality of magnetoresistive elements and the plurality of magnets, and the case includes the plurality of magnetoresistive elements in series. And a magnet holding part for holding the plurality of magnets in series so as to apply a magnetic field to the magnetoresistive element placed on the magnetoresistive element placing part.
  • the plurality of magnets and the plurality of magnetoresistive elements include a magnet facing portion, which is a facing portion between the magnets of the plurality of magnets, and a magnetoresistive element and a magnetoresistive element of the plurality of magnetoresistive elements.
  • the case includes a protrusion formed on a part of the magnetoresistive element mounting portion corresponding to the position of the magnet facing portion, The magnetoresistive element placed on the magnetoresistive element placing part corresponding to the position of the magnet facing part is joined to the protruding part via an adhesive.
  • FIG. 1A is a cross-sectional view of a conventional general long type magnetic sensor in a state where no bending stress is applied.
  • FIG. 1B is a partial cross-sectional view in a state where bending stress is applied to the long magnetic sensor.
  • 2A is an external perspective view in the middle of attaching the cover of the long magnetic sensor 201 according to the first embodiment, and
  • FIG. 2B is an external perspective view in a state in which the cover is attached.
  • FIG. 3 is a front view showing a structure in which the magnetic sensor 201 is incorporated into an installation destination device.
  • FIG. 4A is a partial plan view of the magnetic sensor 201.
  • FIG. 4B is a partial view of the central longitudinal cross section of the magnetic sensor 201 in the longitudinal direction.
  • FIG. 5 is a partial perspective view of the case 1 as viewed from the magnet holding portion 14 side.
  • FIG. 6 is a comparative example of piezo noise generated between the conventional magnetic sensor and the magnetic sensor 201 according to the first embodiment of the present invention.
  • FIG. 7A is a partial plan view of the magnetic sensor 202 of the second embodiment.
  • FIG. 7B is a partial view of the central longitudinal cross section of the magnetic sensor 202 in the longitudinal direction.
  • FIG. 2A is an external perspective view in the middle of attaching the cover of the long magnetic sensor 201 according to the first embodiment
  • FIG. 2B is an external perspective view in a state in which the cover is attached.
  • the case 1 made of synthetic resin has magnetoresistive elements 2a, 2b, 2c, 2d.
  • a terminal pin 6 that conducts to the plurality of magnetoresistive elements 2a, 2b, 2c, 2d,.
  • Claw engaging grooves 3 are provided on both sides of the case 1 along the longitudinal direction.
  • the cover 4 made of metal is provided with a cover fixing claw portion that engages with the claw portion engagement groove 3 of the case. As shown, a cover 4 is covered on top of the case 1.
  • the object to be detected 100 is conveyed in a direction substantially perpendicular to the longitudinal direction of the long magnetic sensor 201 as indicated by an arrow in the figure.
  • FIG. 3 is a front view showing a structure in which the magnetic sensor 201 is incorporated into an installation destination device.
  • the magnetic sensor 201 is mounted on the circuit board 110 via the terminal pins 6.
  • the circuit board 110 is held by a holder 120, and the holder 120 is fixed to a frame or the like of an installation destination device.
  • FIG. 4A is a partial plan view of the magnetic sensor 201. However, the cover 4 shown in FIG. 2 is shown in a removed state.
  • FIG. 4B is a partial view of the central longitudinal section in the longitudinal direction of the magnetic sensor 201.
  • FIG. 5 is a partial perspective view of the case 1 as viewed from the magnet holding portion 14 side.
  • the magnet holding part 14 is a recess formed in the lower part of the case 1, and the magnet 5 is accommodated in the magnet holding part 14.
  • the case 1 is resin-molded.
  • a plurality of magnetoresistive element mounting portions 13i, 13j, 13k and the like are formed on the upper portion of the case 1.
  • the lower surfaces of these magnetoresistive element mounting portions 13i, 13j, 13k and the like are magnetoresistive element facing surfaces.
  • Magnets 5 are housed in a plurality of magnet holding portions 14 formed in the lower part of case 1.
  • the magnet 5 is filled with a filler 8 such as an epoxy resin so that the magnet 5 is embedded in the magnet holding portion 14.
  • a protrusion 11 is formed on a part of the magnetoresistive element mounting portion corresponding to the position of the facing portion between the magnet 5 and the magnet 5 of the case 1.
  • the engraved portion 12 is formed in a region other than the joint portion which is a part of the magnetoresistive element mounting portion (in this example, the portion where the central portion of the magnetoresistive element is opposed).
  • the magnetoresistive element 2j is joined to the protruding portion 11 via the adhesive layer 7.
  • the protrusion part is not formed in the magnetoresistive element mounting part which is not the position of the opposing part of the magnet 5 of the case 1 and the magnet 5.
  • FIG. The magnetoresistive elements 2i and 2k are bonded to the almost entire surface of the magnetoresistive element mounting portion via the adhesive layer 7.
  • the magnetoresistive elements 2i, 2j, 2k, etc. are bonded to the magnetoresistive element mounting portion on the opposite side of the magnetosensitive element so that the magnetosensitive part is on the upper surface side.
  • the electrode pad of the magnetoresistive element is joined to the inner lead of the lead frame, and the outer lead of the lead frame is thermocompression bonded to the terminal pin 6, but in FIG. Illustration of these leads is omitted.
  • the height of the protruding portion 11 is determined so that the height of the magnetically sensitive parts such as the magnetoresistive elements 2i and 2k joined to the magnetoresistive element placement parts 13i and 13k of the case 1 that are not positioned is uniform. Yes. That is, when the thickness of the adhesive layer 7 is constant, the height of the protruding portion 11 is equal to the height of the magnetoresistive element mounting portions 13i, 13k, etc. that are not the positions of the opposing portions of the magnet 5 and the magnet 5. .
  • the magnetoresistive element 2j joined to the magnetoresistive element mounting portion 13j of the case 1 corresponding to the position of the facing portion between the magnet 5 and the magnet 5 is a part of the lower surface of the magnetoresistive element mounting portion 13j. 1B, even if a bending stress as shown in FIG. 1B is applied to the magnetic sensor 201, the magnetoresistive element by bending at the position of the facing portion between the magnet 5 and the magnet 5 of the case 1 is applied. The bending moment to 2j is reduced. That is, the flat state is maintained with almost no influence of bending at the position of the facing portion between the magnet 5 and the magnet 5 of the case 1. This suppresses the generation of piezo noise.
  • FIG. 6 shows a comparative example of piezo noise generated between the conventional magnetic sensor and the magnetic sensor 201 according to the first embodiment of the present invention.
  • Ch.A (before) is piezo noise generated in the channel A of the conventional magnetic sensor
  • Ch.B (before) is piezo noise generated in the channel B of the conventional magnetic sensor.
  • Ch.A (after) is piezo noise generated in the channel A of the magnetic sensor 201 of the first embodiment
  • Ch.B (after) is piezo noise generated in the channel B of the magnetic sensor 201 of the first embodiment. is there.
  • the channel A corresponds to the sixth magnetoresistive element corresponding to the position of the opposing portion of the magnet 5 among the 18 channels (18 magnetoresistive elements) in total.
  • the channel B corresponds to the eleventh magnetoresistive element corresponding to the position of another facing portion between the magnet 5 and the magnet 5.
  • the horizontal axis represents frequency and the vertical axis represents piezo noise voltage. Both are relative value scales. As shown in FIG. 6, since a mountain shape in which piezo noise rises at a predetermined frequency is drawn, it can be seen that bending vibration is generated at the resonance frequency, and large piezo noise is generated at this resonance frequency. Compared to the magnetic sensor having the conventional structure, the piezo noise can be reduced to about 1/6 or less in the magnetic sensor 201 of the first embodiment.
  • a partition 15 of a magnet-like holding part is disposed below the protrusion 11 of the case 1.
  • the partition 15 and the protruding portion 11 of the magnet holding portion are formed of resin that flows in the space of the molding die. Since the mold gate opening is located at a position corresponding to both end positions in the longitudinal direction of the case 1, the resin flows entirely in the longitudinal direction of the case 1 during molding. At that time, the space for forming the partition 15 of the magnet holding portion acts as a resin flow path, and the resin is easily injected into the space for forming the protruding portion 11. Therefore, molding defects such as short shots in resin molding do not easily occur, and the protruding portion 11 is reliably formed.
  • FIG. 7A is a partial plan view of the magnetic sensor 202 of the second embodiment. However, it is shown with the cover removed.
  • FIG. 7B is a partial view of the central longitudinal cross section of the magnetic sensor 202 in the longitudinal direction.
  • Case 1 is resin molded.
  • a plurality of magnetoresistive element mounting portions 13i, 13j, 13k and the like are formed on the upper portion of the case 1.
  • the lower surfaces of these magnetoresistive element mounting portions 13i, 13j, 13k and the like are magnetoresistive element facing surfaces.
  • magnet holders 14 for storing a plurality of magnets 5 are formed in the lower part of the case 1, and the magnets 5 are respectively stored in these magnet holders 14.
  • the periphery of the magnet 5 is filled with a filler 8 such as an epoxy resin.
  • the protrusion assembly 16 is formed on a part of the magnetoresistive element mounting part corresponding to the position of the opposing part between the magnet 5 and the magnet 5 of the case 1 (in this example, the part where the central part of the magnetoresistive element is opposed). Yes.
  • the magnetoresistive element 2j is joined to the protrusion assembly 16 via the adhesive layer 7.
  • the protrusion assembly portion is not formed on the magnetoresistive element mounting portion which is not the position of the facing portion between the magnet 5 and the magnet 5 of the case 1.
  • the magnetoresistive elements 2i and 2k are bonded to the almost entire surface of the magnetoresistive element mounting portion via the adhesive layer 7.
  • the engraved portion is not formed in a region other than the projection assembly portion of the magnetoresistive element mounting portion.
  • the height of the magnetoresistive element joined to the magnetoresistive element mounting portion 13j of the case 1 corresponding to the position of the facing portion between the magnet 5 and the magnet 5 is mainly determined by the height of the protrusion assembly portion 16. Further, the height of the magnetoresistive elements 2i, 2k, etc. joined to the magnetoresistive element mounting portions 13i, 13k, etc. of the case 1 which is not the position of the opposing portion between the magnets 5 and 5 is mainly the thickness of the adhesive layer 7. Stipulated in
  • the magnetoresistive element 2j to be joined to the magnetoresistive element mounting portion 13j of the case 1 corresponding to the position of the opposing portion between the magnet 5 and the magnet 5 is part of the lower surface of the magnetoresistive element mounting portion 13j. Even if a bending stress as shown in FIG. 1B is applied to the magnetic sensor 201 due to the bonding, the magnetoresistive element 2j by bending at the position of the magnet 5 of the case 1 facing the magnet 5 is used. The bending moment is reduced. That is, the flat state is maintained with almost no influence of bending at the position of the facing portion between the magnet 5 and the magnet 5 of the case 1. This suppresses the generation of piezo noise.
  • the piezo noise reduction effect of the magnetic sensor 202 of the second embodiment is substantially the same as that of the magnetic sensor 201 of the first embodiment.
  • the protrusion part 11 is formed in a part of magnetoresistive element mounting part corresponding to the position of the opposing part of the magnet 5 of the case 1 and the magnet 5, and magnetoresistive element mounting part other than that is formed. No protrusion is formed on the.
  • a protruding portion may be formed on the magnetoresistive element mounting portion where stress is hardly applied by bending the magnetic sensor.
  • protrusions may be formed on all the magnetoresistive element mounting parts, and each magnetoresistive element may be bonded to the protrusions via an adhesive.
  • a protrusion assembly portion as shown in the second embodiment may be formed on the magnetoresistive element mounting portion where stress is hardly applied by bending of the magnetic sensor.
  • the protrusion assembly portions may be formed on all the magnetoresistive element mounting portions, and each magnetoresistive element may be bonded to the protrusion assembly portion via an adhesive.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

A plurality of magnetic resistance element mounting sections (13i, 13j, 13k) etc., are formed on the top section of a case (1). Magnet holding sections (14) that house a plurality of magnets (5) are formed in the bottom section of the case (1) and the magnets (5) are housed in each of these magnet holding sections (14). A protruding section (11) is formed in part of the magnetic resistance element mounting section (13j) corresponding to a position facing the magnet (5) and the magnet (5) in the case (1). A magnetic resistance element (2j) is bonded to this protruding section (11) via an adhesive layer (7). As a result, a magnetic sensor is configured that is unlikely to generate piezoelectric noise even if the amplitude of bending vibration caused by sympathetic vibration in conjunction with the lengthening of the magnetic sensor increases.

Description

磁気センサMagnetic sensor
　この発明は例えば紙幣などに印刷されている磁気パターンを検出する長尺型の磁気センサに関するものである。 The present invention relates to a long magnetic sensor that detects a magnetic pattern printed on, for example, banknotes.
　磁性インクなどで所定パターンが印刷された紙幣や証券などの被検知物の鑑別を行う磁気センサとして特許文献１が開示されている。 Patent Document 1 is disclosed as a magnetic sensor for discriminating an object to be detected such as a bill or a security printed with a predetermined pattern with magnetic ink or the like.
特許第３８７９７７７号公報Japanese Patent No. 3879777
　長尺型磁気センサの設置環境によっては、外部から磁気センサに機械的な振動が加わる。例えばＡＴＭ中に備えられているモータやそのモータによって駆動される機構の振動が磁気センサに伝搬される。磁気センサが長尺になる程、その自己共振周波数は低くなるので、磁気センサは前記モータや機構による振動に共振しやすくなる傾向にある。そして、長尺化に伴ってその振動振幅も大きくなる傾向にある。 Depending on the installation environment of the long magnetic sensor, mechanical vibration is applied to the magnetic sensor from the outside. For example, vibrations of a motor provided in the ATM and a mechanism driven by the motor are propagated to the magnetic sensor. The longer the magnetic sensor is, the lower the self-resonant frequency becomes, so the magnetic sensor tends to resonate with vibrations caused by the motor and mechanism. And the vibration amplitude tends to increase with the increase in length.
　長尺型磁気センサは紙幣などの搬送経路を阻害しない状態で装置に保持することが必要であることから、磁気センサの両端部が装置内の保持部に保持される場合が多い。そのとき、基本波モードでの振動は長尺型磁気センサの両端を固定端とする屈曲振動となる。 Since the long magnetic sensor needs to be held in the apparatus without obstructing the conveyance path of bills or the like, both ends of the magnetic sensor are often held by holding parts in the apparatus. At that time, the vibration in the fundamental wave mode is a bending vibration in which both ends of the long magnetic sensor are fixed ends.
　ここで、特許文献１に記載されている長尺型磁気センサの基本的な構成を部分断面図で図１に示す。図１（Ａ）は長尺型磁気センサに対して曲げ応力が掛かっていない状態である。複数の磁気抵抗素子２と、これら複数の磁気抵抗素子２の感磁部に対して磁界を印加する複数の磁石５と、これらの磁気抵抗素子２および磁石５を保持するケース１とを備えている。複数の磁石５のうちの磁石５と磁石５との対向部の位置が複数の磁気抵抗素子２のうちの或る磁気抵抗素子２の中央位置になるように、複数の磁石５および複数の磁気抵抗素子２が配置されている。 Here, the basic configuration of the long magnetic sensor described in Patent Document 1 is shown in FIG. 1 in a partial sectional view. FIG. 1A shows a state in which no bending stress is applied to the long magnetic sensor. A plurality of magnetoresistive elements 2, a plurality of magnets 5 that apply a magnetic field to the magnetic sensing portions of the plurality of magnetoresistive elements 2, and a case 1 that holds the magnetoresistive elements 2 and the magnets 5 are provided. Yes. The plurality of magnets 5 and the plurality of magnets are arranged such that the position of the facing portion between the magnets 5 of the plurality of magnets 5 is the center position of a certain magnetoresistive element 2 of the plurality of magnetoresistive elements 2. A resistance element 2 is arranged.
　図１（Ｂ）は前記長尺型磁気センサに曲げ応力が加わった状態を誇張して表した部分断面図である。ケース１は樹脂モールドによる成型樹脂であるので磁気抵抗素子２および磁石５はケース１より軟質である。そのため、長尺型磁気センサに曲げ応力が加わると、磁石５と磁石５との対向部（磁石の継ぎ目位置）に対応する磁気抵抗素子２に応力歪みが生じる。磁気抵抗素子２は電子移動度の高いn-InSb材やInAs材、GaAs材、Ge材、Si材が用いられる。このような磁気抵抗素子材料はピエゾ抵抗効果を有する。そのため、磁気抵抗素子２に応力歪みが生じるとピエゾ抵抗効果による信号が重畳されることになり、これがノイズ（ピエゾノイズ）として作用する。 FIG. 1B is a partial sectional view exaggeratingly showing a state in which bending stress is applied to the long magnetic sensor. Since the case 1 is a resin molded from a resin mold, the magnetoresistive element 2 and the magnet 5 are softer than the case 1. For this reason, when bending stress is applied to the long magnetic sensor, stress distortion occurs in the magnetoresistive element 2 corresponding to the facing portion (magnet joint position) between the magnet 5 and the magnet 5. The magnetoresistive element 2 is made of an n-InSb material, InAs material, GaAs material, Ge material, or Si material having high electron mobility. Such a magnetoresistive element material has a piezoresistive effect. Therefore, when stress strain occurs in the magnetoresistive element 2, a signal due to the piezoresistive effect is superimposed, and this acts as noise (piezonoise).
　前記ケース１に比較的柔らかい樹脂材料を用いれば、磁気抵抗素子２に掛かる曲げ応力が低減できるが、磁気センサと被検知対象物との距離精度が低下するばかりか屈曲振動の振幅も増大してしまう。磁性体の検知感度は磁気センサの各磁気抵抗素子の感磁部と検知対象の磁性体との距離の二乗で影響を受けるので、磁気センサのケースの柔軟性を利用することはできない。 If a relatively soft resin material is used for the case 1, the bending stress applied to the magnetoresistive element 2 can be reduced, but not only the distance accuracy between the magnetic sensor and the object to be detected is lowered, but also the amplitude of the bending vibration is increased. End up. Since the detection sensitivity of the magnetic material is affected by the square of the distance between the magnetic sensing portion of each magnetoresistive element of the magnetic sensor and the magnetic material to be detected, the flexibility of the case of the magnetic sensor cannot be used.
　また、磁石５と磁石５との対向部の位置を磁気抵抗素子２と磁気抵抗素子２との対向部の位置に一致させれば、磁気抵抗素子２に加わる応力歪みは小さくなる。しかし、磁気抵抗素子２と磁気抵抗素子２との対向部は当然に感磁部が無い（途切れている）ので、磁性体の検知感度が低下する傾向にあり、且つ磁石５と磁石５との対向部は磁束密度が小さいことで磁性体の検知感度が低下する傾向にあるので、双方の感度低下要因が重なる。したがって、磁石対向部が磁気抵抗素子対向部に重なるような構造は採りにくい。 Further, if the position of the facing portion between the magnet 5 and the magnet 5 is matched with the position of the facing portion between the magnetoresistive element 2 and the magnetoresistive element 2, the stress strain applied to the magnetoresistive element 2 is reduced. However, since the opposing portion of the magnetoresistive element 2 and the magnetoresistive element 2 naturally has no magnetic sensitive part (disconnected), the detection sensitivity of the magnetic material tends to decrease, and the magnet 5 and the magnet 5 Since the opposing part has a tendency that the detection sensitivity of the magnetic material is lowered due to the small magnetic flux density, both sensitivity reduction factors overlap. Therefore, it is difficult to adopt a structure in which the magnet facing portion overlaps the magnetoresistive element facing portion.
　本発明は上述の問題に鑑みてなされたものであり、その目的は磁気センサの長尺化に伴う屈曲振動により生じる前記ピエゾノイズの問題を解消した磁気センサを提供することにある。 The present invention has been made in view of the above-described problems, and an object thereof is to provide a magnetic sensor that solves the above-described piezo noise problem caused by bending vibration accompanying the increase in length of the magnetic sensor.
　本発明の磁気センサは、複数の磁気抵抗素子と、複数の磁石と、前記複数の磁気抵抗素子および前記複数の磁石を保持するケースと、を備え、前記ケースは前記複数の磁気抵抗素子を直列に載置する磁気抵抗素子載置部および前記磁気抵抗素子載置部に載置される磁気抵抗素子に対して磁界を印加するように前記複数の磁石を直列状態で保持する磁石保持部を有し、
　前記複数の磁石および前記複数の磁気抵抗素子は、前記複数の磁石のうちの磁石と磁石との対向部である磁石対向部が前記複数の磁気抵抗素子のうちの磁気抵抗素子と磁気抵抗素子との対向部以外の位置に対応するように配置され、
　前記ケースは、前記磁石対向部の位置に対応する前記磁気抵抗素子載置部の一部に形成された突出部を備え、
　前記磁石対向部の位置に対応する前記磁気抵抗素子載置部に載置された前記磁気抵抗素子は前記突出部に接着剤を介して接合されていることを特徴とする。 The magnetic sensor of the present invention includes a plurality of magnetoresistive elements, a plurality of magnets, and a case for holding the plurality of magnetoresistive elements and the plurality of magnets, and the case includes the plurality of magnetoresistive elements in series. And a magnet holding part for holding the plurality of magnets in series so as to apply a magnetic field to the magnetoresistive element placed on the magnetoresistive element placing part. And
The plurality of magnets and the plurality of magnetoresistive elements include a magnet facing portion, which is a facing portion between the magnets of the plurality of magnets, and a magnetoresistive element and a magnetoresistive element of the plurality of magnetoresistive elements. Are arranged so as to correspond to positions other than the opposite part of
The case includes a protrusion formed on a part of the magnetoresistive element mounting portion corresponding to the position of the magnet facing portion,
The magnetoresistive element placed on the magnetoresistive element placing part corresponding to the position of the magnet facing part is joined to the protruding part via an adhesive.
　本発明によれば、磁気センサに屈曲振動が生じてもそれに伴うピエゾノイズが低減された磁気センサを構成できる。 According to the present invention, it is possible to configure a magnetic sensor in which piezo noise associated therewith is reduced even when bending vibration occurs in the magnetic sensor.
図１（Ａ）は曲げ応力が掛かっていない状態での従来の一般的な長尺型磁気センサの断面図である。図１（Ｂ）はその長尺型磁気センサに曲げ応力が加わった状態での部分断面図である。FIG. 1A is a cross-sectional view of a conventional general long type magnetic sensor in a state where no bending stress is applied. FIG. 1B is a partial cross-sectional view in a state where bending stress is applied to the long magnetic sensor. 図２（Ａ）は第１の実施形態に係る長尺型磁気センサ２０１のカバーの取り付け途中の外観斜視図、図２（Ｂ）はそのカバーが取り付けられた状態での外観斜視図である。2A is an external perspective view in the middle of attaching the cover of the long magnetic sensor 201 according to the first embodiment, and FIG. 2B is an external perspective view in a state in which the cover is attached. 図３は組み込み先機器への磁気センサ２０１の組み込み構造を示す正面図である。FIG. 3 is a front view showing a structure in which the magnetic sensor 201 is incorporated into an installation destination device. 図４（Ａ）は磁気センサ２０１の部分平面図である。図４（Ｂ）は磁気センサ２０１の長手方向の中央縦断面の部分図である。FIG. 4A is a partial plan view of the magnetic sensor 201. FIG. 4B is a partial view of the central longitudinal cross section of the magnetic sensor 201 in the longitudinal direction. 図５は、ケース１を磁石保持部１４側から見た部分斜視図である。FIG. 5 is a partial perspective view of the case 1 as viewed from the magnet holding portion 14 side. 図６は従来構造の磁気センサと本発明の第１の実施形態の磁気センサ２０１について発生するピエゾノイズの比較例である。FIG. 6 is a comparative example of piezo noise generated between the conventional magnetic sensor and the magnetic sensor 201 according to the first embodiment of the present invention. 図７（Ａ）は第２の実施形態の磁気センサ２０２の部分平面図である。図７（Ｂ）は磁気センサ２０２の長手方向の中央縦断面の部分図である。FIG. 7A is a partial plan view of the magnetic sensor 202 of the second embodiment. FIG. 7B is a partial view of the central longitudinal cross section of the magnetic sensor 202 in the longitudinal direction.
《第１の実施形態》
　図２（Ａ）は第１の実施形態に係る長尺型磁気センサ２０１のカバーの取り付け途中の外観斜視図、図２（Ｂ）はそのカバーが取り付けられた状態での外観斜視図である。合成樹脂製のケース１にはその上部に磁気抵抗素子２ａ，２ｂ，２ｃ，２ｄ・・・が取り付けられている。ケース１の下部には、複数の磁気抵抗素子２ａ，２ｂ，２ｃ，２ｄ・・・に導通する端子ピン６が突出している。ケース１の両側部には長手方向に沿って爪部係合溝３が設けられている。 << First Embodiment >>
2A is an external perspective view in the middle of attaching the cover of the long magnetic sensor 201 according to the first embodiment, and FIG. 2B is an external perspective view in a state in which the cover is attached. The case 1 made of synthetic resin has magnetoresistive elements 2a, 2b, 2c, 2d. A terminal pin 6 that conducts to the plurality of magnetoresistive elements 2a, 2b, 2c, 2d,. Claw engaging grooves 3 are provided on both sides of the case 1 along the longitudinal direction.
　金属製のカバー４には、ケースの爪部係合溝３に係合するカバー固定爪部が設けられていて、両者の係合状態で長手方向にスライドさせることによって、図２（Ｂ）に示すようにケース１の上部にカバー４が覆われる。被検知物１００は図中矢印で示すように長尺型磁気センサ２０１の長手方向に略直交する向きに搬送される。 The cover 4 made of metal is provided with a cover fixing claw portion that engages with the claw portion engagement groove 3 of the case. As shown, a cover 4 is covered on top of the case 1. The object to be detected 100 is conveyed in a direction substantially perpendicular to the longitudinal direction of the long magnetic sensor 201 as indicated by an arrow in the figure.
　図３は組み込み先機器への前記磁気センサ２０１の組み込み構造を示す正面図である。磁気センサ２０１は前記端子ピン６を介して回路基板１１０に実装されている。回路基板１１０は保持具１２０で保持され、この保持具１２０は組み込み先機器のフレームなどに固定される。 FIG. 3 is a front view showing a structure in which the magnetic sensor 201 is incorporated into an installation destination device. The magnetic sensor 201 is mounted on the circuit board 110 via the terminal pins 6. The circuit board 110 is held by a holder 120, and the holder 120 is fixed to a frame or the like of an installation destination device.
　図４（Ａ）は前記磁気センサ２０１の部分平面図である。但し、図２に示したカバー４は取り除いた状態で示している。図４（Ｂ）は前記磁気センサ２０１の長手方向の中央縦断面の部分図である。 FIG. 4A is a partial plan view of the magnetic sensor 201. However, the cover 4 shown in FIG. 2 is shown in a removed state. FIG. 4B is a partial view of the central longitudinal section in the longitudinal direction of the magnetic sensor 201.
　図５は、ケース１を磁石保持部１４側から見た部分斜視図である。磁石保持部１４はケース１の下部に形成された凹部であり、この磁石保持部１４内に磁石５が収納される。 FIG. 5 is a partial perspective view of the case 1 as viewed from the magnet holding portion 14 side. The magnet holding part 14 is a recess formed in the lower part of the case 1, and the magnet 5 is accommodated in the magnet holding part 14.
　図４（Ａ）、図４（Ｂ）に示すように、ケース１は樹脂モールド成型されたものである。このケース１の上部に複数の磁気抵抗素子載置部１３ｉ，１３ｊ，１３ｋ等が形成されている。これらの磁気抵抗素子載置部１３ｉ，１３ｊ，１３ｋ等の下面が磁気抵抗素子対向面である。ケース１の下部に形成された複数の磁石保持部１４にそれぞれ磁石５が収納されている。これらの磁石保持部１４内に磁石５を埋設するように、磁石５の周囲は例えばエポキシ系樹脂などの充填材８で充填されている。 As shown in FIGS. 4 (A) and 4 (B), the case 1 is resin-molded. A plurality of magnetoresistive element mounting portions 13i, 13j, 13k and the like are formed on the upper portion of the case 1. The lower surfaces of these magnetoresistive element mounting portions 13i, 13j, 13k and the like are magnetoresistive element facing surfaces. Magnets 5 are housed in a plurality of magnet holding portions 14 formed in the lower part of case 1. The magnet 5 is filled with a filler 8 such as an epoxy resin so that the magnet 5 is embedded in the magnet holding portion 14.
　ケース１の磁石５と磁石５との対向部の位置に対応する磁気抵抗素子載置部の一部に突出部１１が形成されている。換言すると、磁気抵抗素子載置部の一部（この例では磁気抵抗素子の中央部が対向する部分）である接合部以外の領域に彫り込み部１２が形成されている。この突出部１１に接着剤層７を介して磁気抵抗素子２ｊが接合されている。 A protrusion 11 is formed on a part of the magnetoresistive element mounting portion corresponding to the position of the facing portion between the magnet 5 and the magnet 5 of the case 1. In other words, the engraved portion 12 is formed in a region other than the joint portion which is a part of the magnetoresistive element mounting portion (in this example, the portion where the central portion of the magnetoresistive element is opposed). The magnetoresistive element 2j is joined to the protruding portion 11 via the adhesive layer 7.
　ケース１の磁石５と磁石５との対向部の位置でない磁気抵抗素子載置部には突出部は形成されていない。この磁気抵抗素子載置部のほぼ全面で接着剤層７を介して磁気抵抗素子２ｉ，２ｋが接合されている。 The protrusion part is not formed in the magnetoresistive element mounting part which is not the position of the opposing part of the magnet 5 of the case 1 and the magnet 5. FIG. The magnetoresistive elements 2i and 2k are bonded to the almost entire surface of the magnetoresistive element mounting portion via the adhesive layer 7.
　磁気抵抗素子２ｉ，２ｊ，２ｋ等は、感磁部が上面側になるように、感磁部とは反対側の面が磁気抵抗素子載置部に接着されている。なお、図２（Ａ）に表れているように、磁気抵抗素子の電極パッドはリードフレームのインナーリードに接合され、このリードフレームのアウターリードが端子ピン６に熱圧着されるが、図４ではこれらのリードの図示を省略している。 The magnetoresistive elements 2i, 2j, 2k, etc. are bonded to the magnetoresistive element mounting portion on the opposite side of the magnetosensitive element so that the magnetosensitive part is on the upper surface side. As shown in FIG. 2A, the electrode pad of the magnetoresistive element is joined to the inner lead of the lead frame, and the outer lead of the lead frame is thermocompression bonded to the terminal pin 6, but in FIG. Illustration of these leads is omitted.
　磁石５と磁石５との対向部の位置に対応するケース１の磁気抵抗素子載置部１３ｊに接合される磁気抵抗素子２ｊの感磁部の高さと、磁石５と磁石５との対向部の位置でないケース１の磁気抵抗素子載置部１３ｉ，１３ｋ等に接合される磁気抵抗素子２ｉ，２ｋ等の感磁部の高さが一定に揃うように、突出部１１の高さが定められている。すなわち、接着剤層７の厚みが一定である場合には、突出部１１の高さは磁石５と磁石５との対向部の位置でない磁気抵抗素子載置部１３ｉ，１３ｋ等の高さに等しい。 The height of the magnetic sensing part of the magnetoresistive element 2j joined to the magnetoresistive element mounting part 13j of the case 1 corresponding to the position of the opposing part of the magnet 5 and the magnet 5, and the opposing part of the magnet 5 and the magnet 5 The height of the protruding portion 11 is determined so that the height of the magnetically sensitive parts such as the magnetoresistive elements 2i and 2k joined to the magnetoresistive element placement parts 13i and 13k of the case 1 that are not positioned is uniform. Yes. That is, when the thickness of the adhesive layer 7 is constant, the height of the protruding portion 11 is equal to the height of the magnetoresistive element mounting portions 13i, 13k, etc. that are not the positions of the opposing portions of the magnet 5 and the magnet 5. .
　このように、磁石５と磁石５との対向部の位置に対応するケース１の磁気抵抗素子載置部１３ｊに接合される磁気抵抗素子２ｊはその下面の一部で磁気抵抗素子載置部１３ｊに接合されていることにより、図１（Ｂ）に示したような曲げ応力が磁気センサ２０１に加わっても、ケース１の磁石５と磁石５との対向部の位置でのベンディングによる磁気抵抗素子２ｊへの曲げモーメントが低減される。すなわち、ケース１の磁石５と磁石５との対向部の位置でのベンディングの影響を殆ど受けずに平坦な状態を保つ。このことによりピエゾノイズの発生は抑えられる。 As described above, the magnetoresistive element 2j joined to the magnetoresistive element mounting portion 13j of the case 1 corresponding to the position of the facing portion between the magnet 5 and the magnet 5 is a part of the lower surface of the magnetoresistive element mounting portion 13j. 1B, even if a bending stress as shown in FIG. 1B is applied to the magnetic sensor 201, the magnetoresistive element by bending at the position of the facing portion between the magnet 5 and the magnet 5 of the case 1 is applied. The bending moment to 2j is reduced. That is, the flat state is maintained with almost no influence of bending at the position of the facing portion between the magnet 5 and the magnet 5 of the case 1. This suppresses the generation of piezo noise.
　ここで、この実施形態によるピエゾノイズの低減効果の例を示す。
　図６は従来構造の磁気センサと本発明の第１の実施形態の磁気センサ２０１について発生するピエゾノイズの比較例である。図６において、Ch.A(before)は従来構造の磁気センサのチャンネルＡに発生するピエゾノイズ、Ch.B(before)は従来構造の磁気センサのチャンネルＢに発生するピエゾノイズである。また、Ch.A(after)は第１の実施形態の磁気センサ２０１のチャンネルＡに発生するピエゾノイズ、Ch.B(after)は第１の実施形態の磁気センサ２０１のチャンネルＢに発生するピエゾノイズである。ここで、チャンネルＡは、全部で１８チャンネル（１８個の磁気抵抗素子）のうち、磁石５と磁石５との対向部の位置に対応する６番目の磁気抵抗素子に相当する。また、チャンネルＢは、磁石５と磁石５との別の対向部の位置に対応する１１番目の磁気抵抗素子に相当する。 Here, an example of the piezo noise reduction effect according to this embodiment will be shown.
FIG. 6 shows a comparative example of piezo noise generated between the conventional magnetic sensor and the magnetic sensor 201 according to the first embodiment of the present invention. In FIG. 6, Ch.A (before) is piezo noise generated in the channel A of the conventional magnetic sensor, and Ch.B (before) is piezo noise generated in the channel B of the conventional magnetic sensor. Ch.A (after) is piezo noise generated in the channel A of the magnetic sensor 201 of the first embodiment, and Ch.B (after) is piezo noise generated in the channel B of the magnetic sensor 201 of the first embodiment. is there. Here, the channel A corresponds to the sixth magnetoresistive element corresponding to the position of the opposing portion of the magnet 5 among the 18 channels (18 magnetoresistive elements) in total. The channel B corresponds to the eleventh magnetoresistive element corresponding to the position of another facing portion between the magnet 5 and the magnet 5.
　図６において横軸は周波数、縦軸はピエゾノイズの電圧である。いずれも相対値目盛りである。図６に表れているように、所定の周波数でピエゾノイズが上昇する山形を描いていることから共振周波数で屈曲振動し、この共振周波数で大きなピエゾノイズが発生することがわかる。従来構造の磁気センサに比較して第１の実施形態の磁気センサ２０１ではピエゾノイズは約１／６以下に低減できている。 In FIG. 6, the horizontal axis represents frequency and the vertical axis represents piezo noise voltage. Both are relative value scales. As shown in FIG. 6, since a mountain shape in which piezo noise rises at a predetermined frequency is drawn, it can be seen that bending vibration is generated at the resonance frequency, and large piezo noise is generated at this resonance frequency. Compared to the magnetic sensor having the conventional structure, the piezo noise can be reduced to about 1/6 or less in the magnetic sensor 201 of the first embodiment.
　ケース１の突出部１１の下部には桟状の、磁石保持部の仕切り１５が配置されている。ケース１の樹脂モールド成型時には、磁石保持部の仕切り１５および突出部１１は成型金型の空間を流動する樹脂によって形成される。ケース１の長手方向の両端位置に相当する位置に金型のゲート口があるので、成型時に樹脂は全体的にケース１の長手方向に流動する。その際、磁石保持部の仕切り１５形成用の空間が樹脂の流路として作用し、突出部１１形成用の空間に樹脂が容易に注入される。したがって、樹脂成型におけるショートショット等の成型不良が起こりにくく、突出部１１が確実に形成される。 A partition 15 of a magnet-like holding part is disposed below the protrusion 11 of the case 1. When the case 1 is molded by resin molding, the partition 15 and the protruding portion 11 of the magnet holding portion are formed of resin that flows in the space of the molding die. Since the mold gate opening is located at a position corresponding to both end positions in the longitudinal direction of the case 1, the resin flows entirely in the longitudinal direction of the case 1 during molding. At that time, the space for forming the partition 15 of the magnet holding portion acts as a resin flow path, and the resin is easily injected into the space for forming the protruding portion 11. Therefore, molding defects such as short shots in resin molding do not easily occur, and the protruding portion 11 is reliably formed.
《第２の実施形態》
　図７（Ａ）は第２の実施形態の磁気センサ２０２の部分平面図である。但し、カバーを取り除いた状態で示している。図７（Ｂ）は磁気センサ２０２の長手方向の中央縦断面の部分図である。 << Second Embodiment >>
FIG. 7A is a partial plan view of the magnetic sensor 202 of the second embodiment. However, it is shown with the cover removed. FIG. 7B is a partial view of the central longitudinal cross section of the magnetic sensor 202 in the longitudinal direction.
　ケース１は樹脂モールド成型されたものである。このケース１の上部に複数の磁気抵抗素子載置部１３ｉ，１３ｊ，１３ｋ等が形成されている。これらの磁気抵抗素子載置部１３ｉ，１３ｊ，１３ｋ等の下面が磁気抵抗素子対向面である。また、ケース１の下部には複数の磁石５を収納する磁石保持部１４が形成されていて、これらの磁石保持部１４にそれぞれ磁石５が収納されている。磁石保持部１４内で、磁石５の周囲は例えばエポキシ系樹脂等の充填材８で充填されている。 Case 1 is resin molded. A plurality of magnetoresistive element mounting portions 13i, 13j, 13k and the like are formed on the upper portion of the case 1. The lower surfaces of these magnetoresistive element mounting portions 13i, 13j, 13k and the like are magnetoresistive element facing surfaces. In addition, magnet holders 14 for storing a plurality of magnets 5 are formed in the lower part of the case 1, and the magnets 5 are respectively stored in these magnet holders 14. In the magnet holding part 14, the periphery of the magnet 5 is filled with a filler 8 such as an epoxy resin.
　ケース１の磁石５と磁石５との対向部の位置に対応する磁気抵抗素子載置部の一部（この例では磁気抵抗素子の中央部が対向する部分）に突起集合部１６が形成されている。この突起集合部１６に接着剤層７を介して磁気抵抗素子２ｊが接合されている。 The protrusion assembly 16 is formed on a part of the magnetoresistive element mounting part corresponding to the position of the opposing part between the magnet 5 and the magnet 5 of the case 1 (in this example, the part where the central part of the magnetoresistive element is opposed). Yes. The magnetoresistive element 2j is joined to the protrusion assembly 16 via the adhesive layer 7.
　ケース１の磁石５と磁石５との対向部の位置でない磁気抵抗素子載置部には突起集合部は形成されていない。この磁気抵抗素子載置部のほぼ全面で接着剤層７を介して磁気抵抗素子２ｉ，２ｋが接合されている。 The protrusion assembly portion is not formed on the magnetoresistive element mounting portion which is not the position of the facing portion between the magnet 5 and the magnet 5 of the case 1. The magnetoresistive elements 2i and 2k are bonded to the almost entire surface of the magnetoresistive element mounting portion via the adhesive layer 7.
　この第２の実施形態では、磁気抵抗素子載置部の突起集合部以外の領域に彫り込み部は形成されていない。磁石５と磁石５との対向部の位置に対応するケース１の磁気抵抗素子載置部１３ｊに接合される磁気抵抗素子の高さは主に突起集合部１６の高さで定められている。また、磁石５と磁石５との対向部の位置でないケース１の磁気抵抗素子載置部１３ｉ，１３ｋ等に接合される磁気抵抗素子２ｉ，２ｋ等の高さは主に接着剤層７の厚みで定められている。 In the second embodiment, the engraved portion is not formed in a region other than the projection assembly portion of the magnetoresistive element mounting portion. The height of the magnetoresistive element joined to the magnetoresistive element mounting portion 13j of the case 1 corresponding to the position of the facing portion between the magnet 5 and the magnet 5 is mainly determined by the height of the protrusion assembly portion 16. Further, the height of the magnetoresistive elements 2i, 2k, etc. joined to the magnetoresistive element mounting portions 13i, 13k, etc. of the case 1 which is not the position of the opposing portion between the magnets 5 and 5 is mainly the thickness of the adhesive layer 7. Stipulated in
　このように磁石５と磁石５との対向部の位置に対応するケース１の磁気抵抗素子載置部１３ｊに接合される磁気抵抗素子２ｊはその下面の一部で磁気抵抗素子載置部１３ｊに接合されていることにより、図１（Ｂ）に示したような曲げ応力が磁気センサ２０１に加わっても、ケース１の磁石５と磁石５との対向部の位置でのベンディングによる磁気抵抗素子２ｊへの曲げモーメントが低減される。すなわち、ケース１の磁石５と磁石５との対向部の位置でのベンディングの影響を殆ど受けずに平坦な状態を保つ。このことによりピエゾノイズの発生は抑えられる。 Thus, the magnetoresistive element 2j to be joined to the magnetoresistive element mounting portion 13j of the case 1 corresponding to the position of the opposing portion between the magnet 5 and the magnet 5 is part of the lower surface of the magnetoresistive element mounting portion 13j. Even if a bending stress as shown in FIG. 1B is applied to the magnetic sensor 201 due to the bonding, the magnetoresistive element 2j by bending at the position of the magnet 5 of the case 1 facing the magnet 5 is used. The bending moment is reduced. That is, the flat state is maintained with almost no influence of bending at the position of the facing portion between the magnet 5 and the magnet 5 of the case 1. This suppresses the generation of piezo noise.
　第２の実施形態の磁気センサ２０２のピエゾノイズの低減効果は第１の実施形態の磁気センサ２０１と実質的に同じであることを確かめている。 It is confirmed that the piezo noise reduction effect of the magnetic sensor 202 of the second embodiment is substantially the same as that of the magnetic sensor 201 of the first embodiment.
《他の実施形態》
　第１の実施形態では、ケース１の磁石５と磁石５との対向部の位置に対応する磁気抵抗素子載置部の一部に突出部１１が形成され、それ以外の磁気抵抗素子載置部には突出部が形成されていない。しかし、磁気センサの曲げによって応力が殆ど掛からない磁気抵抗素子載置部に突出部が形成されていてもよい。例えばすべての磁気抵抗素子載置部に突出部が形成されていて、各磁気抵抗素子がそれらの突出部に接着剤を介して接合されていてもよい。 << Other Embodiments >>
In 1st Embodiment, the protrusion part 11 is formed in a part of magnetoresistive element mounting part corresponding to the position of the opposing part of the magnet 5 of the case 1 and the magnet 5, and magnetoresistive element mounting part other than that is formed. No protrusion is formed on the. However, a protruding portion may be formed on the magnetoresistive element mounting portion where stress is hardly applied by bending the magnetic sensor. For example, protrusions may be formed on all the magnetoresistive element mounting parts, and each magnetoresistive element may be bonded to the protrusions via an adhesive.
　同様に、磁気センサの曲げによって応力が殆ど掛からない磁気抵抗素子載置部に第２の実施形態で示したような突起集合部が形成されていてもよい。例えばすべての磁気抵抗素子載置部に突起集合部が形成されていて、各磁気抵抗素子がそれらの突起集合部に接着剤を介して接合されていてもよい。 Similarly, a protrusion assembly portion as shown in the second embodiment may be formed on the magnetoresistive element mounting portion where stress is hardly applied by bending of the magnetic sensor. For example, the protrusion assembly portions may be formed on all the magnetoresistive element mounting portions, and each magnetoresistive element may be bonded to the protrusion assembly portion via an adhesive.
１…ケース
２…磁気抵抗素子
２ａ，２ｂ，２ｃ，２ｄ…磁気抵抗素子
２ｉ，２ｊ，２ｋ…磁気抵抗素子
３…爪部係合溝
４…カバー
５…磁石
６…端子ピン
７…接着剤層
８…充填材
１１…突出部
１２…彫り込み部
１３ｉ，１３ｊ，１３ｋ…磁気抵抗素子載置部
１４…磁石保持部
１５…仕切り
１６…突起集合部
１００…被検知物
１１０…回路基板
１２０…保持具
２０１，２０２…磁気センサ DESCRIPTION OF SYMBOLS 1 ... Case 2 ... Magnetoresistive element 2a, 2b, 2c, 2d ... Magnetoresistive element 2i, 2j, 2k ... Magnetoresistive element 3 ... Claw part engaging groove 4 ... Cover 5 ... Magnet 6 ... Terminal pin 7 ... Adhesive layer DESCRIPTION OF SYMBOLS 8 ... Filler 11 ... Protrusion part 12 ... Engraving part 13i, 13j, 13k ... Magnetoresistance element mounting part 14 ... Magnet holding part 15 ... Partition 16 ... Protrusion assembly part 100 ... Detected object 110 ... Circuit board 120 ... Holder 201, 202 ... Magnetic sensor

Claims (4)

  1. 　複数の磁気抵抗素子と、複数の磁石と、前記複数の磁気抵抗素子および前記複数の磁石を保持するケースと、を備え、前記ケースは前記複数の磁気抵抗素子を直列に載置する磁気抵抗素子載置部および前記磁気抵抗素子載置部に載置される磁気抵抗素子に対して磁界を印加するように前記複数の磁石を直列状態で保持する磁石保持部を有する磁気センサにおいて、
    　前記複数の磁石および前記複数の磁気抵抗素子は、前記複数の磁石のうちの磁石と磁石との対向部である磁石対向部が前記複数の磁気抵抗素子のうちの磁気抵抗素子と磁気抵抗素子との対向部以外の位置に対応するように配置され、
    　前記ケースは、前記磁石対向部の位置に対応する前記磁気抵抗素子載置部の一部に形成された突出部を備え、
    　前記磁石対向部の位置に対応する前記磁気抵抗素子載置部に載置された前記磁気抵抗素子は前記突出部に接着剤を介して接合されていることを特徴とする磁気センサ。     A plurality of magnetoresistive elements, a plurality of magnets, and a case for holding the plurality of magnetoresistive elements and the plurality of magnets, wherein the case mounts the plurality of magnetoresistive elements in series. In the magnetic sensor having a magnet holding unit for holding the plurality of magnets in series so as to apply a magnetic field to the mounting unit and the magnetoresistive element mounted on the magnetoresistive element mounting unit,
    The plurality of magnets and the plurality of magnetoresistive elements include a magnet facing portion, which is a facing portion between the magnets of the plurality of magnets, and a magnetoresistive element and a magnetoresistive element of the plurality of magnetoresistive elements. Are arranged so as to correspond to positions other than the opposite part of
    The case includes a protrusion formed on a part of the magnetoresistive element mounting portion corresponding to the position of the magnet facing portion,
    The magnetic sensor, wherein the magnetoresistive element placed on the magnetoresistive element placing part corresponding to the position of the magnet facing part is joined to the projecting part via an adhesive.
  2. 　前記突出部は前記磁気抵抗素子載置部の長手方向の中央部に形成された、請求項１に記載の磁気センサ。 2. The magnetic sensor according to claim 1, wherein the protruding portion is formed at a central portion in a longitudinal direction of the magnetoresistive element mounting portion.
  3. 　前記突出部は前記接着剤の塗布による接着剤層の厚みを規制する複数の突起の集合である、請求項１または２に記載の磁気センサ。 3. The magnetic sensor according to claim 1, wherein the protrusion is a set of a plurality of protrusions that regulate the thickness of the adhesive layer by applying the adhesive.
  4. 　前記ケースは前記突出部の下部に前記磁石保持部の仕切りを備え、前記ケースは樹脂モールド成型により形成された、請求項１～３のいずれかに記載の磁気センサ。 The magnetic sensor according to any one of claims 1 to 3, wherein the case includes a partition for the magnet holding portion at a lower portion of the protruding portion, and the case is formed by resin molding.
PCT/JP2012/053745 2011-04-01 2012-02-17 Magnetic sensor WO2012137543A1 (en)

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