JP2005308526A - Current sensor - Google Patents

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Publication number
JP2005308526A
JP2005308526A JP2004125355A JP2004125355A JP2005308526A JP 2005308526 A JP2005308526 A JP 2005308526A JP 2004125355 A JP2004125355 A JP 2004125355A JP 2004125355 A JP2004125355 A JP 2004125355A JP 2005308526 A JP2005308526 A JP 2005308526A
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Japan
Prior art keywords
core
current sensor
housing
hall element
magnetic gap
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JP2004125355A
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Japanese (ja)
Inventor
Shinji Ozaki
慎治 尾崎
Takashige Saito
隆重 斉藤
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Denso Corp
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Denso Corp
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Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2004125355A priority Critical patent/JP2005308526A/en
Priority to US11/094,153 priority patent/US7084617B2/en
Priority to FR0503957A priority patent/FR2869417B1/en
Priority to KR1020050032903A priority patent/KR100592978B1/en
Priority to DE102005018357A priority patent/DE102005018357A1/en
Publication of JP2005308526A publication Critical patent/JP2005308526A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive current sensor which can prevent the deformation of a magnetic gap of a core, associated with the curing of a sealing member. <P>SOLUTION: In manufacturing the current sensor 10, articles to be accommodated (a Hall device 12, the core 14, an electronic component 21, wiring members 22-24, and a regulation member 28) are installed inside an accommodation part 17; a liquid having fluidity or the gel-like sealing member 29 is then flown into or dropped into the accommodation part 17 so as to be charged; and the articles to be accommodated are sealed in the accommodation part 17 so as to be fixed in the state in which the articles to be accommodated are positioned in the accommodation part 17, by curing the sealing member 29. Because the regulation member 28 is held in-between in the magnetic gap S of the core 14 without spacing, even when the stress generated associated with the curing of the sealing member 29 is applied to the core 14, the deformation of the magnetic gap S is prevented by the regulation member 28, and the dimensional shape of the magnetic gap S is not varied from the setting value. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は電流センサに係り、詳しくは、磁気ギャップを有するリング状のコアと、そのコアの磁気ギャップ間に配置されたホール素子とを備えた電流センサに関するものである。   The present invention relates to a current sensor, and more particularly, to a current sensor including a ring-shaped core having a magnetic gap and a Hall element disposed between the magnetic gaps of the core.

従来より、リング状のコアと、そのコアの一部分が切断・開放されて形成された磁気ギャップと、その磁気ギャップ間に配置されたホール素子とを備え、コアおよびホール素子が筺体の上方開口した収容部に収容され、その収容部内には合成樹脂材料の封止材が充填され、その封止材の硬化によりコアおよびホール素子が封止されている構造の電流センサが知られている(例えば、特許文献1参照)。   Conventionally, it has a ring-shaped core, a magnetic gap formed by cutting and opening a part of the core, and a Hall element disposed between the magnetic gaps, and the core and the Hall element are opened above the housing. A current sensor is known that is housed in a housing portion, filled with a sealing material of a synthetic resin material in the housing portion, and a core and a Hall element are sealed by curing of the sealing material (for example, , See Patent Document 1).

特許文献1の電流センサは、リング状のコアに挿通された導電部材に流れる電流値を、磁気ギャップ間に配置されたホール素子によって検出する。すなわち、導電部材に流れる電流によってコア内に磁束が生じ、ホール素子は当該磁束に対応したホール効果による電圧(ホール電圧)を発生する。そして、ホール素子が発生するホール電圧は、コア内の磁束に対応するだけでなく、その磁束を発生させた導電部材に流れる電流値にも対応するため、その電流値の検出信号といえる。   The current sensor of Patent Document 1 detects a current value flowing through a conductive member inserted through a ring-shaped core by a Hall element disposed between magnetic gaps. That is, a magnetic flux is generated in the core by the current flowing through the conductive member, and the Hall element generates a voltage (Hall voltage) due to the Hall effect corresponding to the magnetic flux. The Hall voltage generated by the Hall element not only corresponds to the magnetic flux in the core, but also corresponds to the current value flowing through the conductive member that generated the magnetic flux, and can be said to be a detection signal for the current value.

ちなみに、特許文献1の電流センサは、例えば、自動車の車載バッテリと車両電装品とを接続する導電部材(バスバー)に流れる電流値を検出するために用いられる。
特開2002−296305号公報(第4〜6頁 図1、図2)
Incidentally, the current sensor of Patent Document 1 is used to detect the value of a current flowing through a conductive member (bus bar) that connects an in-vehicle battery of an automobile and a vehicle electrical component, for example.
Japanese Patent Laid-Open No. 2002-296305 (Pages 4-6, FIGS. 1 and 2)

特許文献1の電流センサを製造するには、まず、コアおよびホール素子を収容部内に取り付け、次に、流動性を有する液体またはゲル状の封止材を収容部内に流し込むか又は滴下(ポッティング)して充填し、続いて、封止材を硬化させることにより、コアおよびホール素子の収容部内における位置決めを行った状態で、コアおよびホール素子を収容部内に封止して固定する。   In order to manufacture the current sensor of Patent Document 1, first, the core and the Hall element are mounted in the housing portion, and then a liquid or gel-like sealing material having fluidity is poured into the housing portion or dropped (potting). Then, the core and the Hall element are sealed and fixed in the housing part in a state where the core and the Hall element are positioned in the housing part by curing the sealing material.

ここで、コアの磁気ギャップは、コアの一部分が切断・開放されて形成されている。そのため、封止材の硬化に伴って発生する応力がコアに印加され、リング状のコアが変形して磁気ギャップの寸法形状が設定値より変化し、ホール素子による電流検出の精度および感度が低下するという問題があった。
特に、熱硬化性を有する封止材を用いた場合には、その封止材の線膨張係数により封止材の熱硬化時に大きな応力が発生するため、その応力によりコアが変形しやすい。
Here, the magnetic gap of the core is formed by cutting and opening a part of the core. As a result, the stress generated with the hardening of the sealing material is applied to the core, the ring-shaped core is deformed and the dimensional shape of the magnetic gap changes from the set value, and the accuracy and sensitivity of current detection by the Hall element decreases. There was a problem to do.
In particular, when a sealing material having thermosetting properties is used, a large stress is generated when the sealing material is thermally cured due to the linear expansion coefficient of the sealing material, so that the core is easily deformed by the stress.

ところで、封止材の硬化に伴うコアの変形を防止するには、硬化時に発生する応力が小さい封止材を用いればよいが、そのような封止材は高価であるため、電流センサの製造コストが増大するという問題が起こる。   By the way, in order to prevent the deformation of the core accompanying the curing of the sealing material, it is sufficient to use a sealing material with a small stress generated during the curing, but since such a sealing material is expensive, the manufacture of the current sensor The problem of increased costs arises.

本発明は上記問題を解決するためになされたものであって、その目的は、封止材の硬化に伴うコアの磁気ギャップの変形を防止可能な電流センサを低コストに提供することにある。   The present invention has been made to solve the above problems, and an object of the present invention is to provide a current sensor capable of preventing deformation of the magnetic gap of the core accompanying hardening of the sealing material at low cost.

(請求項1)
請求項1に記載の発明は、薄板状のコア断片が複数枚積層一体化されたリング状のコアと、そのコアの一部分に形成された磁気ギャップと、その磁気ギャップ間に配置されたホール素子と、前記コアおよび前記ホール素子を収容する収容部を有する筺体と、その筺体の収容部内に充填されて前記コアおよび前記ホール素子を封止する封止材とを備えた電流センサであって、前記筺体の収容部には、前記磁気ギャップの変形を防止するための変形防止手段が設けられていることを技術的特徴とする。
(Claim 1)
According to the first aspect of the present invention, there is provided a ring-shaped core in which a plurality of thin-plate core pieces are laminated and integrated, a magnetic gap formed in a part of the core, and a Hall element disposed between the magnetic gaps And a current sensor comprising a housing having a housing portion for housing the core and the Hall element, and a sealing material filled in the housing portion of the housing and sealing the core and the Hall element, A technical feature is that the housing accommodating portion is provided with deformation preventing means for preventing deformation of the magnetic gap.

(請求項2)
請求項2に記載の発明は、請求項1に記載の電流センサにおいて、前記磁気ギャップは、前記コアの切断された部分からなり、前記変形防止手段は、前記コアを前記筺体の収容部に収容したとき、前記磁気ギャップ間に隙間無く挟まれる規制部材からなることを技術的特徴とする。
(Claim 2)
According to a second aspect of the present invention, in the current sensor according to the first aspect, the magnetic gap includes a cut portion of the core, and the deformation preventing means accommodates the core in the housing portion of the casing. In this case, it is a technical feature that it comprises a restricting member that is sandwiched between the magnetic gaps without any gap.

(請求項3:第1実施形態または第2実施形態に該当)
請求項3に記載の発明は、請求項2に記載の電流センサにおいて、前記規制部材は、前記磁気ギャップの内側または外側の少なくともいずれかの部分に挟まれることを技術的特徴とする。
(Claim 3: Corresponds to the first embodiment or the second embodiment)
According to a third aspect of the present invention, in the current sensor according to the second aspect, the regulating member is sandwiched between at least one of the inside and the outside of the magnetic gap.

(請求項4:第3実施形態に該当)
請求項4に記載の発明は、請求項2に記載の電流センサにおいて、前記規制部材は、前記ホール素子の周囲を囲んで前記磁気ギャップ間全体に挟まれることを技術的特徴とする。
(Claim 4: corresponds to the third embodiment)
According to a fourth aspect of the present invention, in the current sensor according to the second aspect, the restriction member surrounds the periphery of the Hall element and is sandwiched between the magnetic gaps.

(請求項1)
請求項1の発明の電流センサを製造するには、まず、コアおよびホール素子を収容部内に取り付け、次に、流動性を有する液体またはゲル状の封止材を収容部内に流し込むか又は滴下して充填し、続いて、封止材を硬化させることにより、コアおよびホール素子の収容部内における位置決めを行った状態で、コアおよびホール素子を収容部内に封止して固定する。
(Claim 1)
In order to manufacture the current sensor according to the first aspect of the invention, first, the core and the Hall element are mounted in the housing portion, and then a liquid or gel-like sealing material having fluidity is poured or dropped into the housing portion. Then, the core and the Hall element are sealed and fixed in the accommodating portion in a state where the core and the Hall element are positioned in the accommodating portion by curing the sealing material.

このとき、筺体の収容部には変形防止手段が設けられているため、封止材の硬化に伴って発生する応力がコアに印加されたとしても、磁気ギャップの変形は変形防止手段によって抑制され、磁気ギャップの寸法形状が設定値より変化することはない。
従って、請求項1の発明によれば、筺体の収容部に変形防止手段を設けることにより、封止材の硬化に伴う磁気ギャップの変形を防止し、ホール素子による電流検出の精度および感度の低下を回避できる。
At this time, since the housing accommodating portion is provided with the deformation preventing means, even if the stress generated with the hardening of the sealing material is applied to the core, the deformation of the magnetic gap is suppressed by the deformation preventing means. The dimensional shape of the magnetic gap does not change from the set value.
Therefore, according to the first aspect of the present invention, the deformation prevention means is provided in the housing housing portion to prevent the magnetic gap from being deformed due to the hardening of the sealing material, and the accuracy and sensitivity of the current detection by the Hall element is reduced. Can be avoided.

そして、封止材には、収容部への充填の作業性が良好で、硬化後にコアおよびホール素子を確実に封止可能な非磁性体であれば、どのような使用材料(例えば、シリコン、ウレタン、エポキシなどの各種合成樹脂材料など)を用いてもよい。
特に、熱硬化性を有する封止材を用いた場合には、その封止材の線膨張係数により封止材の熱硬化時に大きな応力が発生するため、その応力によりコアが変形しやすいが、請求項1の発明によれば磁気ギャップの変形を防止可能であるため、熱硬化性を有する封止材を用いることができる。
従って、請求項1の発明によれば、封止材の使用材料に対する限定が少なくなり、硬化時に発生する応力が大きい代わりに安価な封止材料を用いることが可能になるため、電流センサの製造コストを低減できる。
As the sealing material, any material (for example, silicon, etc.) may be used as long as the workability of filling the accommodating portion is good and the core and the Hall element can be reliably sealed after curing. Various synthetic resin materials such as urethane and epoxy may be used.
In particular, when a sealing material having thermosetting properties is used, a large stress is generated when the sealing material is thermally cured due to the linear expansion coefficient of the sealing material. According to the first aspect of the invention, since the deformation of the magnetic gap can be prevented, a thermosetting sealing material can be used.
Therefore, according to the first aspect of the present invention, there is less limitation on the material used for the sealing material, and it becomes possible to use an inexpensive sealing material instead of a large stress generated at the time of curing. Cost can be reduced.

(請求項2)
請求項2の発明の電流センサでは、コアを筺体の収容部に収容したときに磁気ギャップに隙間無く挟まれる規制部材が変形防止手段として設けられているため、封止材の硬化に伴って発生する応力がコアに印加されたとしても、磁気ギャップの変形は規制部材によって抑制され、磁気ギャップの寸法形状が設定値より変化することはない。
(Claim 2)
In the current sensor according to the second aspect of the present invention, since the restricting member that is sandwiched between the magnetic gaps without any gap when the core is accommodated in the housing accommodating portion is provided as the deformation preventing means, it is generated as the sealing material is cured. Even if the stress to be applied is applied to the core, the deformation of the magnetic gap is suppressed by the restricting member, and the dimensional shape of the magnetic gap does not change from the set value.

(請求項3)
請求項3の発明の電流センサでは、規制部材が磁気ギャップの内側または外側の少なくともいずれかの部分に挟まれるため、磁気ギャップの変形を確実に防止できる。
(Claim 3)
In the current sensor according to the third aspect of the invention, since the regulating member is sandwiched between at least one of the inside and the outside of the magnetic gap, the deformation of the magnetic gap can be reliably prevented.

(請求項4)
請求項4の発明の電流センサでは、規制部材がホール素子の周囲を囲んで磁気ギャップ間全体に挟まれるため、磁気ギャップ間の一部分に規制部材が挟まれる請求項3の発明に比べて、磁気ギャップの変形をより確実に抑制可能であるため、請求項1の発明の前記作用・効果を更に高めることができる。
(Claim 4)
In the current sensor according to the fourth aspect of the invention, since the restricting member surrounds the Hall element and is sandwiched between the magnetic gaps, the restricting member is sandwiched between a part of the magnetic gaps. Since the deformation of the gap can be more reliably suppressed, the operation and effect of the invention of claim 1 can be further enhanced.

(用語の説明)
前記変形防止手段は、規制部材28,42,52に該当する。
(Explanation of terms)
The deformation preventing means corresponds to the regulating members 28, 42, 52.

以下、本発明を具体化した各実施形態について図面を参照しながら説明する。尚、各実施形態において、第1実施形態と同一の構成部材については符号を等しくしてその説明を省略してある。   Hereinafter, embodiments embodying the present invention will be described with reference to the drawings. In each embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

(第1実施形態)
図1は、第1実施形態の電流センサ10の概略構成を説明するための要部分解斜視図である。
図2は、電流センサ10の斜視図である。
図3は、電流センサ10の要部平面図である。
(First embodiment)
FIG. 1 is an exploded perspective view of a main part for explaining a schematic configuration of a current sensor 10 according to the first embodiment.
FIG. 2 is a perspective view of the current sensor 10.
FIG. 3 is a plan view of a main part of the current sensor 10.

電流センサ10は、ホール素子12、コア14(コア断片15、磁気ギャップS)、筺体16(収容部17、コネクタ装着部18、回路収容部19、コア収容部20、挿通孔25、外周壁26)、電子部品21、配線材22〜24、取付金具27、規制部材(ストッパ)28、封止材29などから構成されている。   The current sensor 10 includes a Hall element 12, a core 14 (core fragment 15, magnetic gap S), a housing 16 (accommodating portion 17, connector mounting portion 18, circuit accommodating portion 19, core accommodating portion 20, insertion hole 25, outer peripheral wall 26. ), Electronic component 21, wiring members 22 to 24, mounting bracket 27, regulating member (stopper) 28, sealing material 29, and the like.

コア14は、薄板状のコア断片15が複数枚積層一体化されて形成されている。コア断片15は、適宜な導電性磁性材料(例えば、鉄、鉄系合金、パーマロイなど)を剪断加工(プレス加工)して形成されている。
コア14(コア断片15)は、四隅にアールが形成された略矩形のリング状をなし、そのリング状の一部分(図示例では略矩形の短辺の一部分)が切断・開放されて磁気ギャップSが形成されている。
The core 14 is formed by laminating and integrating a plurality of thin core pieces 15. The core piece 15 is formed by shearing (pressing) an appropriate conductive magnetic material (for example, iron, an iron-based alloy, permalloy, or the like).
The core 14 (core fragment 15) has a substantially rectangular ring shape with rounded corners formed at four corners, and a part of the ring shape (a part of a substantially rectangular short side in the illustrated example) is cut and opened to form a magnetic gap S. Is formed.

合成樹脂製で非磁性体の筺体16は、上方開口した収容部17と、側方開口した筒形状のコネクタ装着部18とが射出成形によって一体形成されている。
収容部17は、略箱形状の回路収容部19と、略二重枠形状のコア収容部20とが連結されて構成されている。
A non-magnetic housing 16 made of synthetic resin is integrally formed by injection molding with a housing portion 17 opened upward and a cylindrical connector mounting portion 18 opened laterally.
The housing portion 17 is configured by connecting a substantially box-shaped circuit housing portion 19 and a core housing portion 20 having a substantially double frame shape.

ここで、回路収容部19はコア収容部20よりも浅い形状に形成されており、回路収容部19の底面19aはコア収容部20の底面20aよりも高い位置に配置され、筺体16は高低2段の階段状の構造になっている。
そして、コネクタ装着部18は回路収容部19の側方に連結され、筺体16は全体として略L字形状をなしている。
Here, the circuit housing part 19 is formed in a shallower shape than the core housing part 20, the bottom surface 19 a of the circuit housing part 19 is arranged at a position higher than the bottom surface 20 a of the core housing part 20, and the housing 16 is high and low. It has a stepped structure.
And the connector mounting part 18 is connected with the side of the circuit accommodating part 19, and the housing | casing 16 has comprised the substantially L shape as a whole.

回路収容部19の底面19aには、ホール素子12が取付固定されると共に、ホール素子12の駆動制御回路を構成する各種の電子部品21が複数個取付固定されている。尚、ホール素子12および各電子部品21の接続固定には接着剤が用いられている。   The Hall element 12 is attached and fixed to the bottom surface 19 a of the circuit housing portion 19, and a plurality of various electronic components 21 constituting the drive control circuit of the Hall element 12 are attached and fixed. An adhesive is used for connecting and fixing the Hall element 12 and each electronic component 21.

ホール素子12と各電子部品21とは配線材22を介して接続され、各電子部品21は配線材23を介して接続をされている。また、コネクタ装着部18内に設けられたコネクタ端子(図示略)と各電子部品21とは配線材24を介して接続されている。尚、各配線材22〜24の接続には半田付けでなく電気溶接が用いられている。   The Hall element 12 and each electronic component 21 are connected via a wiring material 22, and each electronic component 21 is connected via a wiring material 23. A connector terminal (not shown) provided in the connector mounting portion 18 and each electronic component 21 are connected via a wiring member 24. The wiring members 22 to 24 are connected not by soldering but by electric welding.

コア収容部20の底面20aの略中央には、後述する導電部材を挿通するための矩形状の挿通孔25が開口されている。尚、挿通孔25の外周壁26の高さは収容部17(回路収容部19およびコア収容部20)の外周壁の高さと同一に形成されている。
コア収容部20の底面20aの裏面側には、取付金具27が取付固定されている。取付金具27には透孔が設けられており、この透孔にボルトを挿通して固定対象(例えば、自動車のエンジンルーム内の部材)に螺合することにより、電流センサ10を固定対象に取付固定することができる。
A rectangular insertion hole 25 for inserting a conductive member, which will be described later, is opened at the approximate center of the bottom surface 20a of the core housing portion 20. The height of the outer peripheral wall 26 of the insertion hole 25 is the same as the height of the outer peripheral wall of the housing portion 17 (the circuit housing portion 19 and the core housing portion 20).
A mounting bracket 27 is attached and fixed to the back surface side of the bottom surface 20 a of the core housing portion 20. The mounting bracket 27 is provided with a through hole, and a bolt is inserted into the through hole and screwed into a fixed object (for example, a member in an automobile engine room) to attach the current sensor 10 to the fixed object. Can be fixed.

収容部17内にはコア14が収容されている。つまり、コア収容部20内における挿通孔25の外周壁26にコア14が嵌合され、挿通孔25をリング状のコア14が取り囲むように、コア収容部20の底面20a上にコア14が載置されている。   The core 14 is accommodated in the accommodating portion 17. That is, the core 14 is mounted on the bottom surface 20 a of the core housing part 20 so that the core 14 is fitted to the outer peripheral wall 26 of the insertion hole 25 in the core housing part 20 and the ring-shaped core 14 surrounds the insertion hole 25. Is placed.

そして、磁気ギャップSが設けられたコア14の短辺部分が回路収容部19内に突出し、磁気ギャップS間の略中央位置にはコア14と接触しないように間隙を空けてホール素子12が配置されている。例えば、磁気ギャップSの間隔が2.5mm、ホール素子12の幅が1.5mm、ホール素子12とコア14との間隙が0.5mmに設定されている。   The short side portion of the core 14 provided with the magnetic gap S protrudes into the circuit housing portion 19, and the Hall element 12 is disposed at a substantially central position between the magnetic gaps S so as not to contact the core 14. Has been. For example, the gap of the magnetic gap S is set to 2.5 mm, the width of the Hall element 12 is set to 1.5 mm, and the gap between the Hall element 12 and the core 14 is set to 0.5 mm.

回路収容部19の底面19aにおけるホール素子12と外周壁26との間には、略矩形状の規制部材28が立設されている。規制部材28は、コア14を収容部17内に収容したとき、コア14の磁気ギャップS間に隙間無く挟設されるように、その配置箇所および寸法形状が設定されている。尚、規制部材28は非磁性体の合成樹脂材料からなり、射出成形によって筺体16と一体形成されている。   Between the Hall element 12 and the outer peripheral wall 26 on the bottom surface 19 a of the circuit housing portion 19, a substantially rectangular regulating member 28 is erected. The restricting member 28 has an arrangement position and a dimensional shape so that when the core 14 is accommodated in the accommodating portion 17, the restricting member 28 is interposed between the magnetic gaps S of the core 14 without a gap. The regulating member 28 is made of a non-magnetic synthetic resin material, and is integrally formed with the casing 16 by injection molding.

収容部17内には封止材29(図2および図3に示す斜線ハッチング部分)が充填され、封止材29の硬化によって収容部17の収容物(ホール素子12、コア14、電子部品21、配線材22〜24、規制部材28)が封止され、収容部17内における当該収容物の位置関係が位置決め固定されている。   The accommodating portion 17 is filled with a sealing material 29 (the hatched portion shown in FIGS. 2 and 3), and the contents (the Hall element 12, the core 14, and the electronic component 21) of the accommodating portion 17 are cured by the hardening of the sealing material 29. In addition, the wiring members 22 to 24 and the regulating member 28) are sealed, and the positional relationship of the accommodated objects in the accommodating portion 17 is positioned and fixed.

このように構成された電流センサ10を使用するには、まず、検出対象の導電部材(図示略)を挿通孔25内に挿通し、次に、電流センサ10の検出信号を入力する外部装置のコネクタ(図示略)をコネクタ装着部18に挿入し、外部装置とコネクタ装着部18内のコネクタ端子(図示略)とを接続する。   In order to use the current sensor 10 configured as described above, first, a conductive member (not shown) to be detected is inserted into the insertion hole 25, and then an external device that inputs a detection signal of the current sensor 10 is used. A connector (not shown) is inserted into the connector mounting portion 18 to connect an external device and a connector terminal (not shown) in the connector mounting portion 18.

そして、導電部材に電流を流すと、その電流によってコア14内に磁束が生じ、その磁束によって磁気ギャップSに形成された磁路中に配置されたホール素子12は、当該磁束に対応したホール効果による電圧(ホール電圧)を発生する。
ここで、ホール素子12が発生するホール電圧は、コア14内の磁束に対応するだけでなく、その磁束を発生させた導電部材に流れる電流値にも対応するため、その電流値の検出信号といえる。そのため、ホール素子12の発生したホール電圧を検出信号として前記外部装置へ出力する。
When a current is passed through the conductive member, a magnetic flux is generated in the core 14 by the current, and the Hall element 12 disposed in the magnetic path formed in the magnetic gap S by the magnetic flux has a Hall effect corresponding to the magnetic flux. Generates a voltage (Hall voltage).
Here, the Hall voltage generated by the Hall element 12 not only corresponds to the magnetic flux in the core 14 but also corresponds to the current value flowing through the conductive member that generated the magnetic flux. I can say that. Therefore, the Hall voltage generated by the Hall element 12 is output as a detection signal to the external device.

従って、電流センサ10は、リング状のコア14に挿通された導電部材に流れる電流値を、コア14の磁気ギャップS間に配置されたホール素子12によって検出することができる。
ちなみに、電流センサ10は、例えば、自動車の車載バッテリと車両電装品とを接続する導電部材(バスバー)に流れる電流値を検出するために用いられる。
Therefore, the current sensor 10 can detect the current value flowing through the conductive member inserted through the ring-shaped core 14 by the Hall element 12 disposed between the magnetic gaps S of the core 14.
Incidentally, the current sensor 10 is used, for example, to detect the value of a current flowing through a conductive member (bus bar) that connects an in-vehicle battery of an automobile and a vehicle electrical component.

[第1実施形態の作用・効果]
第1実施形態によれば、以下の作用・効果を得ることができる。
[Operations and effects of the first embodiment]
According to the first embodiment, the following actions and effects can be obtained.

[1−1]電流センサ10を製造するには、まず、収容物(ホール素子12、コア14、電子部品21、配線材22〜24、規制部材28)を収容部17内に取り付け、次に、流動性を有する液体またはゲル状の封止材29を収容部17内に流し込むか又は滴下(ポッティング)して充填し、続いて、封止材29を硬化させることにより、前記収容物の収容部17内における位置決めを行った状態で、前記収容物を収容部17内に封止して固定する。   [1-1] In order to manufacture the current sensor 10, first, an accommodation object (Hall element 12, core 14, electronic component 21, wiring members 22 to 24, regulation member 28) is attached in the accommodation portion 17, and then Then, a liquid or gel-like sealing material 29 having fluidity is poured into the accommodating portion 17 or dropped (potted) and filled, and then the sealing material 29 is cured to accommodate the accommodation. In a state where the positioning is performed in the portion 17, the storage object is sealed and fixed in the storage portion 17.

このとき、コア14の磁気ギャップS間には規制部材28が隙間無く挟設されているため、封止材29の硬化に伴って発生する応力がコア14に印加されたとしても、磁気ギャップSの変形は規制部材28によって抑制され、磁気ギャップSの寸法形状が設定値より変化することはない。   At this time, since the regulating member 28 is sandwiched between the magnetic gaps S of the core 14 without any gaps, the magnetic gap S is applied even if a stress generated as the sealing material 29 is cured is applied to the core 14. The deformation is suppressed by the restricting member 28, and the dimensional shape of the magnetic gap S does not change from the set value.

従って、第1実施形態によれば、規制部材28を設けることにより、封止材29の硬化に伴うコア14の磁気ギャップSの変形を防止し、ホール素子12による電流検出の精度および感度の低下を回避できる。   Therefore, according to the first embodiment, by providing the regulating member 28, the deformation of the magnetic gap S of the core 14 due to the hardening of the sealing material 29 is prevented, and the accuracy and sensitivity of current detection by the Hall element 12 are reduced. Can be avoided.

[1−2]封止材29には、収容部17への充填の作業性が良好で、硬化後に収容部17の収容物(ホール素子12、コア14、電子部品21、配線材22〜24、規制部材28)を確実に封止可能な非磁性体であれば、どのような使用材料(例えば、シリコン、ウレタン、エポキシなどの各種合成樹脂材料など)を用いてもよい。   [1-2] The sealing material 29 has good filling workability in the housing portion 17, and the contents (the hall element 12, the core 14, the electronic component 21, and the wiring materials 22 to 24) in the housing portion 17 after curing. Any material (for example, various synthetic resin materials such as silicon, urethane, and epoxy) may be used as long as it is a non-magnetic material that can reliably seal the regulating member 28).

特に、熱硬化性を有する封止材29を用いた場合には、その封止材29の線膨張係数により封止材29の熱硬化時に大きな応力が発生するため、その応力によりコア14が変形しやすいが、第1実施形態によれば磁気ギャップSの変形を防止可能であるため、熱硬化性を有する封止材29を用いることができる。   In particular, when the sealing material 29 having thermosetting property is used, a large stress is generated when the sealing material 29 is thermally cured due to the linear expansion coefficient of the sealing material 29, and therefore the core 14 is deformed by the stress. However, since the deformation of the magnetic gap S can be prevented according to the first embodiment, the thermosetting sealing material 29 can be used.

従って、第1実施形態によれば、封止材29の使用材料に対する限定が少なくなり、硬化時に発生する応力が大きい代わりに安価な封止材料を用いることが可能になるため、電流センサ10の製造コストを低減できる。   Therefore, according to the first embodiment, the limitation on the material used for the sealing material 29 is reduced, and an inexpensive sealing material can be used instead of a large stress generated during curing. Manufacturing cost can be reduced.

[1−3]規制部材28は射出成形によって筺体16と一体形成されている。従って、第1実施形態によれば、規制部材28を形成するために特別な製造工程を追加する必要はなく、規制部材28を設けることにより電流センサ10の製造コストが増大することはない。   [1-3] The regulating member 28 is integrally formed with the housing 16 by injection molding. Therefore, according to the first embodiment, it is not necessary to add a special manufacturing process to form the regulating member 28, and the production cost of the current sensor 10 does not increase by providing the regulating member 28.

(第2実施形態)
図4は、第2実施形態の電流センサ40の概略構成を説明するための要部分解斜視図である。
図5は、電流センサ40の斜視図である。
図6は、電流センサ40の要部平面図である。
(Second Embodiment)
FIG. 4 is an exploded perspective view of a main part for explaining a schematic configuration of the current sensor 40 of the second embodiment.
FIG. 5 is a perspective view of the current sensor 40.
FIG. 6 is a main part plan view of the current sensor 40.

第2実施形態において、第1実施形態の電流センサ10と異なるのは、規制部材28が省かれ、その代わりに規制部材28と同一の寸法形状の規制部材42が設けられている点だけである。
つまり、電流センサ40は、ホール素子12、コア14(コア断片15、磁気ギャップS)、筺体16(収容部17、コネクタ装着部18、回路収容部19、コア収容部20、挿通孔25、外周壁26)、電子部品21、配線材22〜24、取付金具27、封止材29、規制部材42などから構成されている。
The second embodiment is different from the current sensor 10 of the first embodiment only in that the regulating member 28 is omitted and a regulating member 42 having the same size and shape as the regulating member 28 is provided instead. .
That is, the current sensor 40 includes the Hall element 12, the core 14 (core piece 15, magnetic gap S), the housing 16 (accommodating portion 17, connector mounting portion 18, circuit accommodating portion 19, core accommodating portion 20, insertion hole 25, outer periphery Wall 26), electronic component 21, wiring members 22 to 24, mounting bracket 27, sealing material 29, regulating member 42, and the like.

回路収容部19の底面19aにおける規制部材42と外周壁26との間には、ホール素子12が取付固定されている。規制部材42は、コア14を収容部17内に収容したとき、コア14の磁気ギャップS間に隙間無く挟設されるように、その配置箇所および寸法形状が設定されている。尚、規制部材42は非磁性体の合成樹脂材料からなり、射出成形によって筺体16と一体形成されている。
つまり、第1実施形態の規制部材28は磁気ギャップS間にてホール素子12の内側部分に挟設されているのに対して、第2実施形態の規制部材42は磁気ギャップS間にてホール素子12の外側部分に挟設されている。
The Hall element 12 is attached and fixed between the regulating member 42 and the outer peripheral wall 26 on the bottom surface 19 a of the circuit housing portion 19. The restricting member 42 has an arrangement position and a dimensional shape so that when the core 14 is accommodated in the accommodating portion 17, the restricting member 42 is interposed between the magnetic gaps S of the core 14 without any gap. The regulating member 42 is made of a non-magnetic synthetic resin material and is integrally formed with the housing 16 by injection molding.
In other words, the restriction member 28 of the first embodiment is sandwiched between the magnetic gaps S in the inner portion of the Hall element 12, whereas the restriction member 42 of the second embodiment has a hole between the magnetic gaps S. It is sandwiched between the outer portions of the element 12.

このように、第2実施形態では、コア14の磁気ギャップS間に規制部材42が隙間無く挟設されているため、封止材29の硬化に伴って発生する応力がコア14に印加されたとしても、磁気ギャップSの変形は規制部材42によって抑制され、磁気ギャップSの寸法形状が設定値より変化することはない。
従って、第2実施形態においても、第1実施形態と同様の作用・効果を得ることができる。
As described above, in the second embodiment, since the regulating member 42 is interposed between the magnetic gaps S of the core 14 without any gap, the stress generated with the hardening of the sealing material 29 is applied to the core 14. Even so, the deformation of the magnetic gap S is suppressed by the restricting member 42, and the dimensional shape of the magnetic gap S does not change from the set value.
Therefore, also in the second embodiment, the same operation and effect as in the first embodiment can be obtained.

(第3実施形態)
図7は、第3実施形態の電流センサ50の概略構成を説明するための要部分解斜視図である。
図8は、電流センサ50の斜視図である。
図9は、電流センサ50の要部平面図である。
(Third embodiment)
FIG. 7 is an exploded perspective view of an essential part for explaining a schematic configuration of the current sensor 50 according to the third embodiment.
FIG. 8 is a perspective view of the current sensor 50.
FIG. 9 is a plan view of the main part of the current sensor 50.

第3実施形態において、第1実施形態の電流センサ10と異なるのは、第1実施形態の規制部材28が省かれ、その代わりに規制部材52が設けられている点だけである。
つまり、電流センサ50は、ホール素子12、コア14(コア断片15、磁気ギャップS)、筺体16(収容部17、コネクタ装着部18、回路収容部19、コア収容部20、挿通孔25、外周壁26)、電子部品21、配線材22〜24、取付金具27、封止材29、規制部材52などから構成されている。
The third embodiment differs from the current sensor 10 of the first embodiment only in that the regulating member 28 of the first embodiment is omitted and a regulating member 52 is provided instead.
That is, the current sensor 50 includes the Hall element 12, the core 14 (core piece 15, magnetic gap S), the housing 16 (accommodating portion 17, connector mounting portion 18, circuit accommodating portion 19, core accommodating portion 20, insertion hole 25, outer periphery. Wall 26), electronic component 21, wiring members 22 to 24, mounting bracket 27, sealing material 29, regulating member 52, and the like.

回路収容部19の底面19aには、中央部に透孔が貫通形成された回字形状の規制部材52が立設されている。規制部材52の透孔にはホール素子12が嵌合されており、規制部材52はホール素子12の周囲を囲んでいる。そして、規制部材52は、コア14を収容部17内に収容したとき、コア14の磁気ギャップS間に隙間無く挟設されるように、その配置箇所および寸法形状が設定されている。尚、規制部材52は非磁性体の合成樹脂材料からなり、射出成形によって筺体16と一体形成されている。   On the bottom surface 19 a of the circuit housing portion 19, a circular-shaped regulating member 52 having a through hole formed in the central portion is erected. The hall element 12 is fitted in the through hole of the regulating member 52, and the regulating member 52 surrounds the hall element 12. And when the core 14 is accommodated in the accommodating part 17, the arrangement | positioning location and dimension shape of the regulating member 52 are set so that it may be pinched | interposed between the magnetic gaps S of the core 14 without a clearance gap. The regulating member 52 is made of a non-magnetic synthetic resin material and is integrally formed with the housing 16 by injection molding.

このように、第3実施形態では、コア14の磁気ギャップS間全体に規制部材52が隙間無く挟設されているため、封止材29の硬化に伴って発生する応力がコア14に印加されたとしても、磁気ギャップSの変形は規制部材52によって抑制され、磁気ギャップSの寸法形状が設定値より変化することはない。   As described above, in the third embodiment, since the regulating member 52 is sandwiched between the magnetic gaps S of the core 14 without any gap, the stress generated as the sealing material 29 is cured is applied to the core 14. Even so, the deformation of the magnetic gap S is suppressed by the restricting member 52, and the dimensional shape of the magnetic gap S does not change from the set value.

そして、コア14の磁気ギャップS間全体に規制部材52が隙間無く挟設されている第3実施形態によれば、コア14の磁気ギャップS間の一部分に規制部材28,42が挟設されている第1実施形態および第2実施形態に比べて、磁気ギャップSの変形をより確実に抑制可能であるため、第1実施形態の前記作用・効果を更に高めることができる。   According to the third embodiment in which the regulating member 52 is sandwiched between the magnetic gaps S of the core 14 without any gaps, the regulating members 28 and 42 are sandwiched between a part of the magnetic gaps S of the core 14. Compared to the first embodiment and the second embodiment, the deformation of the magnetic gap S can be more reliably suppressed, so that the operation and effect of the first embodiment can be further enhanced.

[別の実施形態]
上記各実施形態では規制部材28,42,52と筺体16とが射出成形によって一体形成されている。しかし、筺体16とは別個に形成した規制部材28,42,52を、筺体16(回路収容部19の底面19a)に取付固定してもよい。
[Another embodiment]
In each of the above embodiments, the regulating members 28, 42, 52 and the casing 16 are integrally formed by injection molding. However, the regulating members 28, 42, 52 formed separately from the housing 16 may be attached and fixed to the housing 16 (the bottom surface 19 a of the circuit housing portion 19).

本発明を具体化した第1実施形態の電流センサ10の概略構成を説明するための要部分解斜視図。The principal part disassembled perspective view for demonstrating schematic structure of the current sensor 10 of 1st Embodiment which actualized this invention. 第1実施形態の電流センサ10の斜視図。A perspective view of current sensor 10 of a 1st embodiment. 第1実施形態の電流センサ10の要部平面図。The principal part top view of the current sensor 10 of 1st Embodiment. 本発明を具体化した第2実施形態の電流センサ40の概略構成を説明するための要部分解斜視図。The principal part disassembled perspective view for demonstrating schematic structure of the current sensor 40 of 2nd Embodiment which actualized this invention. 第2実施形態の電流センサ40の斜視図。The perspective view of the current sensor 40 of 2nd Embodiment. 第2実施形態の電流センサ40の要部平面図。The principal part top view of the current sensor 40 of 2nd Embodiment. 本発明を具体化した第3実施形態の電流センサ50の概略構成を説明するための要部分解斜視図。The principal part disassembled perspective view for demonstrating schematic structure of the current sensor 50 of 3rd Embodiment which actualized this invention. 第3実施形態の電流センサ50の斜視図。The perspective view of the current sensor 50 of 3rd Embodiment. 第3実施形態の電流センサ50の要部平面図。The principal part top view of the current sensor 50 of 3rd Embodiment.

符号の説明Explanation of symbols

10,40,50…電流センサ
12…ホール素子
14…コア
15…コア断片
16…筺体
17…収容部
19…回路収容部
20…コア収容部
28,42,52…規制部材
29…封止材
S…磁気ギャップ
DESCRIPTION OF SYMBOLS 10, 40, 50 ... Current sensor 12 ... Hall element 14 ... Core 15 ... Core fragment 16 ... Housing 17 ... Housing part 19 ... Circuit accommodating part 20 ... Core accommodating part 28, 42, 52 ... Restriction member 29 ... Sealing material S ... Magnetic gap

Claims (4)

薄板状のコア断片が複数枚積層一体化されたリング状のコアと、
そのコアの一部分に形成された磁気ギャップと、
その磁気ギャップ間に配置されたホール素子と、
前記コアおよび前記ホール素子を収容する収容部を有する筺体と、
その筺体の収容部内に充填されて前記コアおよび前記ホール素子を封止する封止材と
を備えた電流センサであって、
前記筺体の収容部には、前記磁気ギャップの変形を防止するための変形防止手段が設けられていることを特徴とする電流センサ。
A ring-shaped core in which a plurality of thin-plate core pieces are laminated and integrated;
A magnetic gap formed in a part of the core;
Hall elements arranged between the magnetic gaps,
A housing having an accommodating portion for accommodating the core and the Hall element;
A current sensor comprising a sealing material filled in the housing of the housing and sealing the core and the Hall element,
The current sensor according to claim 1, wherein a deformation preventing means for preventing deformation of the magnetic gap is provided in the housing portion of the housing.
請求項1に記載の電流センサにおいて、
前記磁気ギャップは、前記コアの切断された部分からなり、
前記変形防止手段は、前記コアを前記筺体の収容部に収容したとき、前記磁気ギャップ間に隙間無く挟まれる規制部材からなることを特徴とする電流センサ。
The current sensor according to claim 1.
The magnetic gap comprises a cut portion of the core;
The deformation sensor includes a regulating member that is sandwiched between the magnetic gaps without a gap when the core is housed in the housing of the housing.
請求項2に記載の電流センサにおいて、
前記規制部材は、前記磁気ギャップの内側または外側の少なくともいずれかの部分に挟まれることを特徴とする電流センサ。
The current sensor according to claim 2,
The current sensor according to claim 1, wherein the regulating member is sandwiched between at least one of the inside and the outside of the magnetic gap.
請求項2に記載の電流センサにおいて、
前記規制部材は、前記ホール素子の周囲を囲んで前記磁気ギャップ間全体に挟まれることを特徴とする電流センサ。
The current sensor according to claim 2,
The current sensor according to claim 1, wherein the restricting member surrounds the hall element and is sandwiched between the magnetic gaps.
JP2004125355A 2004-04-21 2004-04-21 Current sensor Pending JP2005308526A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004125355A JP2005308526A (en) 2004-04-21 2004-04-21 Current sensor
US11/094,153 US7084617B2 (en) 2004-04-21 2005-03-31 Electric current sensor having magnetic gap
FR0503957A FR2869417B1 (en) 2004-04-21 2005-04-20 ELECTRICAL CURRENT DETECTOR HAVING A MAGNETIC INTERFER
KR1020050032903A KR100592978B1 (en) 2004-04-21 2005-04-20 Electric current sensor having magnetic gap
DE102005018357A DE102005018357A1 (en) 2004-04-21 2005-04-20 Electric current sensor with a magnetic gap

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006078255A (en) * 2004-09-08 2006-03-23 Yazaki Corp Current sensor
KR100897229B1 (en) 2008-10-08 2009-05-14 태성전장주식회사 Current measuring device using hall sensor
JP2010008179A (en) * 2008-06-26 2010-01-14 Tamura Seisakusho Co Ltd Current detector
JP2013120106A (en) * 2011-12-07 2013-06-17 Sht Corp Ltd Current detector
JP2013130518A (en) * 2011-12-22 2013-07-04 Sumitomo Wiring Syst Ltd Current detector
JP2014035322A (en) * 2012-08-10 2014-02-24 Tokai Rika Co Ltd Core holder and current sensor
JP2017510802A (en) * 2014-03-24 2017-04-13 レム・インテレクチュアル・プロパティ・エスエイLem Intellectual Property Sa Current converter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312971A (en) * 1986-07-03 1988-01-20 Tamura Seisakusho Co Ltd Current detector
JPS63302371A (en) * 1987-06-02 1988-12-09 Yaskawa Electric Mfg Co Ltd Current detector
JPH04282461A (en) * 1991-03-12 1992-10-07 Mitsubishi Electric Corp Current detector
JPH09281152A (en) * 1996-04-16 1997-10-31 Yazaki Corp Current sensor unit and method for assembling the sensor unit
JP2002296305A (en) * 2001-04-02 2002-10-09 Jeco Co Ltd Core for current sensor
JP2004101384A (en) * 2002-09-10 2004-04-02 Yazaki Corp Current detector

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312971A (en) * 1986-07-03 1988-01-20 Tamura Seisakusho Co Ltd Current detector
JPS63302371A (en) * 1987-06-02 1988-12-09 Yaskawa Electric Mfg Co Ltd Current detector
JPH04282461A (en) * 1991-03-12 1992-10-07 Mitsubishi Electric Corp Current detector
JPH09281152A (en) * 1996-04-16 1997-10-31 Yazaki Corp Current sensor unit and method for assembling the sensor unit
JP2002296305A (en) * 2001-04-02 2002-10-09 Jeco Co Ltd Core for current sensor
JP2004101384A (en) * 2002-09-10 2004-04-02 Yazaki Corp Current detector

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006078255A (en) * 2004-09-08 2006-03-23 Yazaki Corp Current sensor
JP2010008179A (en) * 2008-06-26 2010-01-14 Tamura Seisakusho Co Ltd Current detector
KR100897229B1 (en) 2008-10-08 2009-05-14 태성전장주식회사 Current measuring device using hall sensor
JP2013120106A (en) * 2011-12-07 2013-06-17 Sht Corp Ltd Current detector
JP2013130518A (en) * 2011-12-22 2013-07-04 Sumitomo Wiring Syst Ltd Current detector
JP2014035322A (en) * 2012-08-10 2014-02-24 Tokai Rika Co Ltd Core holder and current sensor
JP2017510802A (en) * 2014-03-24 2017-04-13 レム・インテレクチュアル・プロパティ・エスエイLem Intellectual Property Sa Current converter
JP2019207251A (en) * 2014-03-24 2019-12-05 レム・インテレクチュアル・プロパティ・エスエイLem Intellectual Property Sa Current transducer

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