WO2012134147A1 - Visual inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light - Google Patents

Visual inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light Download PDF

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Publication number
WO2012134147A1
WO2012134147A1 PCT/KR2012/002220 KR2012002220W WO2012134147A1 WO 2012134147 A1 WO2012134147 A1 WO 2012134147A1 KR 2012002220 W KR2012002220 W KR 2012002220W WO 2012134147 A1 WO2012134147 A1 WO 2012134147A1
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WO
WIPO (PCT)
Prior art keywords
grid pattern
unit
light
grid
visible light
Prior art date
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PCT/KR2012/002220
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French (fr)
Korean (ko)
Inventor
박찬화
김성현
구자명
김태준
안보혁
Original Assignee
주식회사 미르기술
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Publication of WO2012134147A1 publication Critical patent/WO2012134147A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/245Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815Controlling of component placement on the substrate during or after manufacturing

Definitions

  • the present invention relates to a vision inspection apparatus, and more particularly, by performing a vision inspection using a grid pattern of visible light and a grid pattern of invisible light such as infrared rays or ultraviolet rays, the height of the inspection object can be measured quickly and accurately.
  • the present invention relates to a vision inspection apparatus using multiple grids of different colors.
  • SMT Surface Mounting Technology
  • PCB printed circuit board
  • SMD surface-mounting components
  • Surface mount lines consist of equipment such as surface mounters and vision inspection equipment.
  • the surface mounter is a device for mounting surface-mounted parts on a printed circuit board.
  • the surface mounter receives various surface-mounted parts supplied in the form of tape, stick, and tray from a feeder and places them on the mounting position on the printed circuit board. Perform.
  • the vision inspection apparatus inspects the mounting state of the surface mount component before or after the soldering process of the surface mount component is completed and transfers the printed circuit board to the next process according to the inspection result.
  • a typical vision inspection apparatus includes a lighting unit to which light is irradiated using a lamp or the like, a camera unit for photographing image information of various components mounted on an inspection unit and reflecting light from the lighting unit. It comprises a half mirror for transmitting the shape of the inspection object to the camera unit while being reflected on the inspection object.
  • the lighting unit is arranged in the housing by arranging a plurality of lamps in a plurality, when the illumination of the inspection object to supply power to the plurality of lamps to irradiate light.
  • All of the above inspection methods measure the two-dimensional shadow shape and calculate the three-dimensional height by using a trigonometric function.
  • the conventional vision inspection apparatus includes an illumination unit 110 to which light is irradiated using a lamp and the like, and an image of various components installed on the inspection object by being installed on the illumination unit 110. And a half mirror 130 for reflecting the light from the illumination unit 110 to capture information and transmitting the shape of the inspection object to the camera while reflecting light from the illumination unit 110.
  • the lighting unit 110 is arranged in the housing 140 by arranging a plurality of lamps, and, when irradiating the light to the inspection object to supply power to the plurality of lamps to irradiate light.
  • a half mirror provided for capturing an image while reflecting light is disposed in front of the central camera unit, thereby preventing a clearer image.
  • the present invention has been made to solve the above problems, to provide a vision inspection apparatus capable of measuring the height of the inspection object quickly and accurately.
  • Still another object of the present invention is to provide a vision inspection apparatus capable of improving the uniformity of light irradiated onto a surface of an inspection object.
  • Still another object of the present invention is to provide a vision inspection apparatus capable of capturing a clearer image by removing a half mirror disposed in front of a central camera unit.
  • Vision inspection apparatus for achieving the above object is to determine the good or bad of the inspection object by comparing the photographed image with the pre-input target image after taking the inspection object assembled or mounted during the assembly of the parts with the camera
  • An apparatus for vision inspection comprising: a stage unit for fixing or transferring an inspection object to an inspection position, an illumination unit positioned at an upper portion of the stage unit and providing illumination to the inspection object, and positioned at a center of the illumination unit
  • a central camera unit for acquiring a two-dimensional shape of the camera, a side camera unit disposed in a plurality of sides of the central camera unit, and a plurality of lattice pattern irradiation units disposed between the camera and the camera of the side camera unit at the side of the central camera unit; And, by reading the image taken by the central camera unit the inspection object And a control unit for controlling the stage unit, the grid pattern irradiation unit, and the camera unit.
  • the grid pattern irradiation unit of one of the grid pattern irradiation units includes a predetermined period (interval) size. Irradiating the grid pattern of visible light having a, and another grid pattern irradiation unit is characterized in that configured to irradiate the grid pattern of invisible light having another predetermined period (interval) size.
  • the invisible light may be infrared or ultraviolet light.
  • the grid pattern irradiation unit comprises any one of a liquid crystal panel or a micromirror module.
  • the grid pattern of the visible light and the grid pattern of the invisible light are configured to be irradiated at the same time.
  • a light diffusing unit may be disposed in front of the lighting unit.
  • the lighting unit may include a horizontal lighting unit for irradiating light in the vertical downward direction and an inclined lighting unit for irradiating light in the oblique direction.
  • the plurality of grid pattern irradiation units may be disposed to face each other with respect to the central camera unit.
  • the side camera parts may be disposed to face each other with respect to the center camera part.
  • the light diffusing unit is disposed in front of both the horizontal lighting unit and the inclined lighting unit.
  • the central camera unit may be a positioning camera unit for positioning the inspection object.
  • the positioning lighting unit and the half mirror may be disposed in front of the positioning camera unit.
  • the angle between the central camera portion and the grid pattern irradiation portion on the side view is 25 degrees to 45 degrees.
  • the height of the inspection object can be calculated quickly and accurately.
  • the uniformity of the light irradiated on the surface of the inspection object can be improved.
  • Fig. 1A is a perspective view showing a state in which a lattice pattern is irradiated to the part.
  • FIG.1 (b) is a top view which shows the state which irradiated the grid with a component.
  • FIG. 2 is a side cross-sectional view of a conventional vision inspection apparatus.
  • FIG. 3 is a schematic side view of a vision inspection apparatus according to the present invention.
  • FIG. 4 is a schematic plan view of a vision inspection apparatus according to the present invention.
  • 5 is a conceptual diagram showing the relationship between the period of the lattice pattern and the height of the parts.
  • FIG 3 is a schematic side view of a vision inspection apparatus according to the present invention
  • Figure 4 is a schematic plan view of the vision inspection apparatus according to the present invention.
  • the vision inspection apparatus is a good or bad object of the inspection object by comparing the photographed image with a pre-input target image after taking the inspection object assembled or mounted in the assembly process with the camera
  • a vision inspection apparatus with improved image clarity for discriminating an image comprising: a stage unit 10 for fixing or transferring the inspection object 5 to an inspection position, and an upper portion of the stage unit 10, wherein the inspection object A lighting unit 20 for providing illumination to the (5), a central camera unit 30 for obtaining a two-dimensional shape of the inspection object 5 is located in the center of the lighting unit 20, and the central camera unit (
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8, which are arranged in a plurality of sides on the side, and the image photographed by the central camera unit 30 are read and the inspection object is good.
  • the vision processor 60 for determining a defect and And a control unit 70 for controlling a tab part 10, the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8, and the central camera unit 30.
  • One of the grid pattern irradiation units (50-2, 50-4, 50-6, 50-8) irradiates a grid pattern of visible light having a predetermined period (interval) size, and another grid pattern
  • the irradiator is configured to irradiate a grid pattern of invisible light rays having another predetermined period (interval) size.
  • Vision inspection apparatus of the present invention is installed to perform the vision inspection before moving to the next process through the conveyor of the preceding equipment, when inspecting the surface-mounted parts of the printed circuit board after the surface mounting work in the surface mounting line .
  • Such vision inspection apparatus can be installed in a manner that is arranged in the space formed between the conveyor of the line, trailing equipment and the conveyor, can also be used in the form of a single table without being connected to the line, trailing equipment.
  • the stage unit 10 is a component that provides a space in which the inspected object 5 to be inspected is seated, and a position adjusting unit (not shown) and a high position for adjusting and fixing the position of the inspected object 5. It may be configured to include a government (not shown).
  • the lighting unit 20 is installed on the upper portion of the stage unit 10 continuously or intermittently along the circumferential direction around the central camera unit 30.
  • the lighting unit 20 is a component that provides illumination to the inspection object 5 in order to secure accurate image information of the inspection object 5, by placing a plurality of lamps or LED bulbs to the inspection object (5) ) Can be arranged to illuminate from side to side.
  • the lighting unit 20 includes a horizontal lighting unit 22 and the inclined lighting unit 23.
  • the horizontal lighting unit 22 is installed on the upper portion of the stage 10 serves to provide the light incident to the inspection object (5) perpendicularly.
  • the inclined light unit 23 is disposed at the side of the vertical light unit 22 to provide light in the oblique direction.
  • the central camera unit 30 is a component for photographing the inspection object 5 in a planar manner, and preferably includes a CCD (charge coupled device) camera or a CMOS image sensor camera to have sensitivity even in an infrared or ultraviolet region. It is provided, but is configured to shoot the visible light and invisible light image at the same time.
  • CCD charge coupled device
  • CMOS image sensor camera to have sensitivity even in an infrared or ultraviolet region. It is provided, but is configured to shoot the visible light and invisible light image at the same time.
  • the degree of deformation of the pattern can be measured the height of the inspection object.
  • a half mirror is disposed in front of the center camera unit, and reflects the light from the lighting unit, and is configured to capture an image through the camera.
  • the center camera unit 30 No half mirror is placed in front.
  • a plurality of side camera units 40-2, 40-4, 40-6, and 40-8 are arranged symmetrically with respect to the center camera unit 30 on the side of the central camera unit 30, thereby providing an image. Eliminate blind spots and take pictures quickly.
  • the four side camera parts 40-2, 40-4, 40-6, and 40-8 are symmetrically arranged with respect to the center camera part 30, such as a substrate. Examine the lifting and uninsertion of the parts placed on the inspection object.
  • the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) is a configuration for measuring the height by irradiating the grid pattern on the inspection object 5, a liquid crystal panel or a digital micromirror display ( DMD: Digital Micromirror Display and light source.
  • DMD Digital Micromirror Display and light source.
  • the shadow of the grid-shaped shadow is irradiated onto the inspection object 5 under the control of the control unit 70, and the degree of deformation of the grid-shaped shadow through the central camera unit 30, We can calculate the height of.
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 also has four grid pattern irradiation units 50-2, 50-4, 50-6, centered on the central camera unit 30. 50-8) are arranged symmetrically, and are configured to irradiate the grid 5 with the inspection object 5 simultaneously or sequentially.
  • any one of the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) of the grid pattern irradiation unit irradiates a grid pattern of visible light having a predetermined period (interval) size
  • Another grid pattern irradiation unit is configured to irradiate the grid pattern of invisible light beams having another predetermined period (interval) size.
  • the larger intervals of the grid are irradiated with visible light such as red, wave, green, etc., and the smaller intervals of the grid are simultaneously irradiated with infrared or ultraviolet rays, thereby reducing the time required for measuring the height of the component. This allows more accurate height measurements.
  • the arrangement angle a between the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 and the central camera unit 30 is arranged in an angle range of 25 degrees to 45 degrees. .
  • the angle (a) When the angle (a) is smaller than 25 degrees, the degree of deformation of the grid pattern according to the height of the component is small, which may cause an error in the height calculation.
  • the angle (a) is larger than 45 degrees, the grid pattern irradiation unit ( 50-2, 50-4, 50-6, 50-8), the difference in the width of the grid pattern irradiated on the near and far sides is too large, which may cause errors in the height calculation.
  • the vision processing unit 60 calculates the image information of the inspection object 5 obtained from the camera unit through a mathematical process such as Fourier transform (Fourier Transform), and compares with the reference value input in advance The good or bad of the object 5 is determined.
  • a mathematical process such as Fourier transform (Fourier Transform)
  • control unit 70 is a component including a motion controller for controlling the driving and operation of the stage unit 10 and the camera unit, and may be provided to control driving of the entire vision inspection apparatus according to the present invention.
  • the controller 70 is responsible for physical control such as photographing position control of the vision inspection apparatus, processing of photographed images, and lighting unit control according to a system control program, as well as performing inspection task and data calculation task.
  • control unit 70 is in charge of the overall control of the vision inspection apparatus, such as output device control for outputting the work contents and inspection results to the monitor and input device control for the operator to input the settings and all the details.
  • the light diffusion unit 25 such as a light diffusion plate is disposed in front of the illumination unit 20, so that the light from the illumination unit 20 is evenly irradiated to the entire area of the inspection object.
  • the light diffusion unit 25 is configured to be bent in a side cross-section so that the light diffusion unit 25 can be disposed in front of both the horizontal light unit 22 and the inclined light unit 23.
  • a positioning camera unit 80 for checking the position of the inspection object.
  • the positioning lighting unit 84 and the half mirror 82 is disposed in front of the positioning camera unit 80.
  • the configuration for positioning is accommodated in the housing of the separate positioning camera unit 80, thereby reducing the housing diameter of the central camera unit 30 It can be reduced and management is easy even in case of accessory failure.
  • 5 is a conceptual diagram showing the relationship between the period of the lattice pattern and the height of the parts.
  • the straight lines connecting the points a, b, c and d conceptually show the height that can be measured by the lattice pattern having a large period.
  • a large periodic grid has a resolution of 500 micrometers, so all heights from 0 to 500 micrometers are recognized as the same height, and another height from 500 to 1000 micrometers.
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, and 50-8 may first measure the approximate height of the component by irradiating the grid pattern with a large gap.
  • the height of the hexahedral shaped part illustrated in FIG. 5 is 1680 micrometers, the height of the part is primarily measured in the range of 1500 and 2000 micrometers through the lattice of a large period.
  • the grid pattern with a small period is examined to determine that the height from point d to point R is 180 micrometers.
  • the total height of the part is 1500 + 180, measured 1680 micrometers.
  • the lattice pattern corresponding to the first lattice pattern on the left in FIG. 1 Plaid, 2-1 Plaid, 3-1 Plaid that is, whether the plaid on the top of the part and the plaid on the bottom coincide after several cycles (lattice spacing) Cannot be judged.
  • the large cycle plaid and the small cycle plaid may be photographed by irradiating the large cycle plaid and the small cycle plaid once, or irradiating the large cycle plaid once according to the requirements of the height inspection device. Photographed by a small period, the grid may be configured to enable a more accurate height measurement by photographing while moving between the grid of a large period.
  • the grid pattern of the visible light and invisible light such as red, blue, green, etc. according to the period size of the grid irradiated by the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) Investigating the grid pattern separately allows you to measure the height of components more clearly and quickly.
  • the lattice of large periods can be irradiated with visible light
  • the lattice of smaller periods can be irradiated with infrared rays or ultraviolet rays.
  • the grid pattern irradiated by the grid pattern irradiation units 50-2, 50-4, 50-6, and 50-8 may irradiate the grid pattern of a large period and the grid pattern of a small period simultaneously or sequentially.
  • each grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) through the first check the lattice of a large period, and then the lattice of the small period, or Smaller grids can be irradiated at the same time.
  • the larger plaid spacing is preferably comprised three to six times larger than the smaller plaid spacing.
  • the lattice spacing of a large period is less than three times, the difference in measurement resolution due to the difference of the period size is not large, which is not desirable for more accurate height measurement. If the lattice spacing of a large period exceeds six times, The difference between the spacing and the small spacing becomes so large that it has an undesirable effect on the sharpness of the grid shape finally reflected on the inspection object.

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Abstract

According to the present invention, a visual inspection apparatus captures an object to be inspected using a camera, wherein said object is being assembled or mounted during a part-assembling process, and compares the captured image with a previously inputted image in order to determine whether to pass or fail the object to be inspected. The visual inspection apparatus comprises: a stage unit for fixing the object to be inspected to an inspection location or transferring the object to be inspected; a lighting unit, which is arranged above the stage unit to illuminate the object to be inspected; a central camera unit arranged at the center of the lighting unit so as to acquire the two-dimensional shape of the object to be inspected; a plurality of side camera units arranged at the side of the central camera unit; a plurality of units for irradiating a grid pattern arranged among the cameras of the side camera units at the side of the central camera unit; a visual processing unit which reads the image captured by the central camera unit to determine whether to pass or fail the object to be inspected; and a control unit for controlling the stage unit, the units for irradiating a grid pattern, and the camera units. Any one of the units for irradiating a grid pattern is configured to irradiate a grid pattern of visible light having a predetermined period, and another unit for irradiating a grid pattern is configured to irradiate a grid pattern of invisible light having another predetermined period.

Description

가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치Vision Inspection System Using Grid Pattern of Visible Light and Grid Pattern of Invisible Light
본 발명은 비전검사장치에 관한 것으로서, 보다 상세하게는 가시광선의 격자무늬와 적외선 또는 자외선과 같은 비가시광선의 격자 무늬를 이용하여 비전 검사를 수행함으로써, 검사대상물의 높이를 신속하고도 정확히 측정할 수 있는 서로 다른 색깔의 다중 격자 무늬를 이용한 비전검사장치에 관한 것이다.The present invention relates to a vision inspection apparatus, and more particularly, by performing a vision inspection using a grid pattern of visible light and a grid pattern of invisible light such as infrared rays or ultraviolet rays, the height of the inspection object can be measured quickly and accurately. The present invention relates to a vision inspection apparatus using multiple grids of different colors.
일반적으로, 인쇄회로기판(PCB) 등에 표면실장부품을 조립하는 표면실장기술(SMT; Surface Mounting Technology)은 표면실장부품(SMD; Surface Mounting Device)을 소형화/집적화하는 기술과, 이러한 표면실장부품을 정밀하게 조립하기 위한 정밀조립장비의 개발 및 각종 조립장비를 운용하는 기술을 포함한다.In general, Surface Mounting Technology (SMT) for assembling surface-mounted components to a printed circuit board (PCB) or the like is a technique for miniaturizing / integrating surface-mounting components (SMD) and such surface-mounted components. Development of precision assembly equipment for precise assembly and technology for operating various assembly equipment.
표면실장라인은 표면실장기와 비전검사장치와 같은 장비로 구성된다. 상기 표면실장기는 표면실장부품을 인쇄회로기판상에 실장하는 장비로서 Tape, Stick, Tray 형태로 공급되는 각종 표면실장부품을 부품공급기(Feeder)로부터 공급받아 인쇄회로기판 상의 실장위치에 올려놓는 작업을 수행한다.Surface mount lines consist of equipment such as surface mounters and vision inspection equipment. The surface mounter is a device for mounting surface-mounted parts on a printed circuit board. The surface mounter receives various surface-mounted parts supplied in the form of tape, stick, and tray from a feeder and places them on the mounting position on the printed circuit board. Perform.
그리고, 상기 비전검사장치는 표면실장부품의 납땜공정 완료전 또는 완료 후, 표면실장부품의 실장상태를 검사하며 검사결과에 따라 다음공정으로 인쇄회로기판을 이송시키게 된다.The vision inspection apparatus inspects the mounting state of the surface mount component before or after the soldering process of the surface mount component is completed and transfers the printed circuit board to the next process according to the inspection result.
통상적인 비전검사장치는 램프 등을 이용하여 광이 조사되는 조명부와, 상기 조명부의 상부에 설치되어 검사대상물에 실장된 각종 부품의 영상정보를 촬영하기 위한 카메라부와 상기 조명부로부터의 광을 반사하여 검사대상물에 비추면서도 검사대상물의 형상을 상기 카메라부에 전달하기 위한 하프 미러를 포함하여 구성된다.A typical vision inspection apparatus includes a lighting unit to which light is irradiated using a lamp or the like, a camera unit for photographing image information of various components mounted on an inspection unit and reflecting light from the lighting unit. It comprises a half mirror for transmitting the shape of the inspection object to the camera unit while being reflected on the inspection object.
여기서, 상기 조명부는 각종의 램프를 복수 개 배열하여 하우징 내에 배치되며, 검사 대상물에 조명을 조사할 경우에는 상기 복수 개의 램프에 전원을 공급하여 빛을 조사하게 된다.Here, the lighting unit is arranged in the housing by arranging a plurality of lamps in a plurality, when the illumination of the inspection object to supply power to the plurality of lamps to irradiate light.
통상적인 비전검사방법은, 컨베이어를 통해 검사대상물이 수평 이송되면 위치조절장치에서 초기 위치를 조절하고, 조절이 완료된 후 엘이디 부품 또는 인쇄회로기판 상에 격자를 통해 광을 조사하면, 조사된 광이 검사대상물의 표면에 비쳐 형성된 그림자 형상을 분석함으로써, 3차원적 높이를 측정하게 된다.Conventional vision inspection method, when the inspection object is transported horizontally through the conveyor, adjusts the initial position in the positioning device, and after the adjustment is completed and irradiated with light through the grid on the LED component or printed circuit board, the irradiated light is By analyzing the shadow shape formed on the surface of the inspection object, the three-dimensional height is measured.
이후 촬영 부분을 연산하고 기준값과 비교함으로써, 높이와 연관되는 부품 실장의 양호/불량을 검사하거나, 표면실장부품의 실장 유/무를 검사하게 된다. Then, by calculating the photographing part and comparing with the reference value, the inspection of the good / bad of the component mounting associated with the height, or the presence / absence of the mounting of the surface mounting component.
상기와 같은 검사방법은 모두 2차원적 그림자 형상을 측정하여 삼각함수를 이용함으로써 3차원적 높이를 계산한다. All of the above inspection methods measure the two-dimensional shadow shape and calculate the three-dimensional height by using a trigonometric function.
따라서, 조사된 광에 의해 형성된 그림자 패턴을 명확히 촬영 구분하는 것이 구조광을 이용한 비전검사장치에 있어서는 매우 중요한 요소이다.Therefore, clearly photographing and distinguishing the shadow pattern formed by the irradiated light is a very important factor in the vision inspection apparatus using the structured light.
그런데, 도 1 에서와 같이, 높이를 가지는 검사대상물에 격자 무늬 광을 조사하고 이를 평면적으로 촬영할 경우, 상기 검사대상물의 높이가 격자 무늬의 간격보다 상대적으로 매우 높으면, 검사대상물 상부에 조사된 격자무늬(1, 2, 3)와 바닥면의 격자무늬(1-1, 2-1, 3-1) 중 어느 것이 애초 동일한 격자 무늬인지를 구분할 수 없게 된다.However, as shown in FIG. 1, when the grid object is irradiated with a plaid light on a test object having a height and is photographed in plan view, if the height of the test object is relatively very high than the spacing of the grid pattern, the grid pattern is irradiated on the test object. It is not possible to distinguish which of (1, 2, 3) and the bottom lattice 1-1, 2-1, 3-1 are the same lattice in the first place.
따라서, 이러한 요인은 높이 검사에 있어 오차를 유발할 수 있는 요인으로서, 이러한 오차의 제거를 위해 높이 측정에 요구되는 영상 사진의 수를 증가시키고, 영상 사진를 기초로한 높이 계산 과정을 복잡하게 하여 검사에 소요되는 전체 시간을 지연시키는 요인이 된다.Therefore, such a factor may cause an error in height inspection, which increases the number of image photographs required for height measurement to eliminate such an error, and complicates the height calculation process based on the image photograph. This delays the overall time spent.
한편, 상기와 같은 검사방법은 모두 2차원적 그림자 형상을 측정하여 삼각함수를 이용함으로써 3차원적 높이를 계산한다. On the other hand, all of the above inspection method to calculate the three-dimensional height by measuring the two-dimensional shadow shape using a trigonometric function.
따라서, 조사된 광에 의해 형성된 그림자 패턴을 명확히 촬영 구분하는 것이 구조광을 이용한 비전검사장치에 있어서는 매우 중요한 요소이다.Therefore, clearly photographing and distinguishing the shadow pattern formed by the irradiated light is a very important factor in the vision inspection apparatus using the structured light.
그런데, 도 2 에 도시된 바와 같이, 통상적인 비전검사장치는 램프 등을 이용하여 광이 조사되는 조명부(110)와, 상기 조명부(110)의 상부에 설치되어 검사대상물에 실장된 각종 부품의 영상정보를 촬영하기 위한 카메라부(120)와 상기 조명부(110)로부터의 광을 반사하여 검사대상물에 비추면서도 검사대상물의 형상을 상기 카메라부에 전달하기 위한 하프 미러(130)를 포함하여 구성된다.However, as shown in FIG. 2, the conventional vision inspection apparatus includes an illumination unit 110 to which light is irradiated using a lamp and the like, and an image of various components installed on the inspection object by being installed on the illumination unit 110. And a half mirror 130 for reflecting the light from the illumination unit 110 to capture information and transmitting the shape of the inspection object to the camera while reflecting light from the illumination unit 110.
여기서, 상기 조명부(110)는 각종의 램프를 복수 개 배열하여 하우징(140) 내에 배치되며, 검사 대상물에 조명을 조사할 경우에는 상기 복수 개의 램프에 전원을 공급하여 빛을 조사하게 된다.Here, the lighting unit 110 is arranged in the housing 140 by arranging a plurality of lamps, and, when irradiating the light to the inspection object to supply power to the plurality of lamps to irradiate light.
상기 종래 비전검사장치에서는 광을 반사시키면서도 영상을 촬영하기 위해 제공되는 하프 미러가 중앙의 카메라부 전방에 배치됨으로써, 보다 선명한 영상의 촬영에 방해가 되었다.In the conventional vision inspection apparatus, a half mirror provided for capturing an image while reflecting light is disposed in front of the central camera unit, thereby preventing a clearer image.
또한, 조명부로부터의 광이 직접 검사대상물의 표면에 조사되므로, 광이 중첩되어 직접 조사되는 부분은 상대적으로 매우 밝은 반면 광밀도가 낮은 부분은 상대적으로 어둡게 되는 문제점이 있다.In addition, since the light from the lighting unit is directly irradiated on the surface of the inspection object, there is a problem that the portion of the light is directly irradiated by overlapping the light is relatively dark while the portion of the light density is relatively dark.
또한, 상기 중앙의 카메라부 내에 검사대상 기판이 올바른 위치에 장착되었는지의 여부를 인식하기 위한 레이저, 카메라 등의 구성이 수용되므로, 상기 중앙의 카메라를 수용하기 위한 하우징에 수용되는 전체 구성의 종류, 크기 및 무게가 증가되어 유지 보수에 불편함을 유발하게 된다.In addition, since a configuration such as a laser or a camera for recognizing whether the inspection target substrate is mounted in the correct position is accommodated in the central camera portion, the type of the overall configuration accommodated in the housing for accommodating the central camera; The increase in size and weight causes inconvenience in maintenance.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 검사대상물의 높이를 신속하고도 정확하게 측정가능한 비전검사장치를 제공하는 것이다.The present invention has been made to solve the above problems, to provide a vision inspection apparatus capable of measuring the height of the inspection object quickly and accurately.
본 발명의 또 다른 목적은, 검사대상물의 표면에 조사되는 광의 균일도를 향상시킬 수 있는 비전검사장치를 제공하는 것이다.Still another object of the present invention is to provide a vision inspection apparatus capable of improving the uniformity of light irradiated onto a surface of an inspection object.
본 발명의 또 다른 목적은, 중앙의 카메라부 전방에 배치되는 하프 미러를 제거함으로써, 보다 선명한 영상의 촬영이 가능한 비전검사장치를 제공하는 것이다.Still another object of the present invention is to provide a vision inspection apparatus capable of capturing a clearer image by removing a half mirror disposed in front of a central camera unit.
상기 목적을 달성하기 위한 본 발명에 따른 비전검사장치는 부품 조립과정에서 조립 또는 실장된 검사대상물을 카메라로 촬영한 후 촬영된 이미지를 미리 입력된 대상 이미지와 비교하여 검사대상물의 양호 또는 불량을 판별하기 위한 비전검사장치로서, 상기 검사대상물을 검사위치에 고정 또는 이송시키는 스테이지부와, 상기 스테이지부의 상부에 위치하며, 상기 검사대상물에 조명을 제공하는 조명부와, 상기 조명부의 중심에 위치되어 검사대상물의 2차원 형상을 획득하기 위한 중앙카메라부와, 상기 중앙카메라부의 측부에 복수 개 배치되는 측부카메라부와, 상기 중앙카메라부의 측부에서 상기 측부카메라부의 카메라와 카메라 사이에 배치되는 복수 개의 격자무늬조사부와, 상기 중앙카메라부에서 촬영된 영상을 판독하여 상기 검사대상물의 양호 또는 불량을 판별하는 비전처리부와, 상기 스테이지부와 상기 격자무늬조사부 및 상기 카메라부를 제어하는 제어부를 포함하며, 상기 격자무늬조사부 중의 어느 하나의 격자무늬조사부는 미리 정해진 하나의 주기(간격) 크기를 가지는 가시광선의 격자무늬를 조사하고, 또 다른 하나의 격자무늬조사부는 미리 정해진 또 다른 주기(간격) 크기를 가지는 비가시광선의 격자무늬를 조사하도록 구성되는 것을 특징으로 한다.Vision inspection apparatus according to the present invention for achieving the above object is to determine the good or bad of the inspection object by comparing the photographed image with the pre-input target image after taking the inspection object assembled or mounted during the assembly of the parts with the camera An apparatus for vision inspection, comprising: a stage unit for fixing or transferring an inspection object to an inspection position, an illumination unit positioned at an upper portion of the stage unit and providing illumination to the inspection object, and positioned at a center of the illumination unit A central camera unit for acquiring a two-dimensional shape of the camera, a side camera unit disposed in a plurality of sides of the central camera unit, and a plurality of lattice pattern irradiation units disposed between the camera and the camera of the side camera unit at the side of the central camera unit; And, by reading the image taken by the central camera unit the inspection object And a control unit for controlling the stage unit, the grid pattern irradiation unit, and the camera unit. The grid pattern irradiation unit of one of the grid pattern irradiation units includes a predetermined period (interval) size. Irradiating the grid pattern of visible light having a, and another grid pattern irradiation unit is characterized in that configured to irradiate the grid pattern of invisible light having another predetermined period (interval) size.
여기서, 상기 비가시광선은 적외선 또는 자외선일 수 있다.Here, the invisible light may be infrared or ultraviolet light.
바람직하게는, 상기 격자무늬조사부는 액정 패널 또는 마이크로미러모듈 중의 어느 하나를 포함하여 구성된다.Preferably, the grid pattern irradiation unit comprises any one of a liquid crystal panel or a micromirror module.
바람직하게는, 상기 가시광선의 격자무늬와 비가시광선의 격자무늬는 동시에 조사되도록 구성된다.Preferably, the grid pattern of the visible light and the grid pattern of the invisible light are configured to be irradiated at the same time.
한편, 상기 조명부의 전방에는 광확산부가 배치될 수 있다.Meanwhile, a light diffusing unit may be disposed in front of the lighting unit.
여기서, 상기 조명부는 수직하방향으로 광을 조사하기 위한 수평조명부와 경사 방향으로 광을 조사하기 위한 경사조명부를 포함하여 구성될 수 있다.Here, the lighting unit may include a horizontal lighting unit for irradiating light in the vertical downward direction and an inclined lighting unit for irradiating light in the oblique direction.
또한, 상기 복수 개의 격자무늬조사부는 상기 중앙카메라부를 중심으로 상호 대향 배치될 수 있다.The plurality of grid pattern irradiation units may be disposed to face each other with respect to the central camera unit.
또한, 상기 측부카메라부는 상기 중앙카메라부를 중심으로 상호 대향 배치될 수 있다.The side camera parts may be disposed to face each other with respect to the center camera part.
바람직하게는, 상기 광확산부는 상기 수평조명부와 경사조명부 모두의 전면에 배치된다.Preferably, the light diffusing unit is disposed in front of both the horizontal lighting unit and the inclined lighting unit.
한편, 상기 중앙카메라부의 일측부에는 검사대상물의 위치 확인을 위한 위치확인카메라부가 배치될 수 있다.On the other hand, at one side of the central camera unit may be a positioning camera unit for positioning the inspection object.
여기서, 상기 위치확인카메라부의 전방에는 위치확인조명부와 하프미러가 배치될 수 있다.Here, the positioning lighting unit and the half mirror may be disposed in front of the positioning camera unit.
바람직하게는, 측면도 상 상기 중앙카메라부와 상기 격자무늬조사부 사이의 각도는 25도 내지 45도이다.Preferably, the angle between the central camera portion and the grid pattern irradiation portion on the side view is 25 degrees to 45 degrees.
본 발명에 의해, 검사대상물의 높이를 신속하고도 정확히 계산할 수 있다.According to the present invention, the height of the inspection object can be calculated quickly and accurately.
또한, 검사대상물의 표면에 조사되는 광의 균일도를 향상시킬 수 있다.In addition, the uniformity of the light irradiated on the surface of the inspection object can be improved.
또한, 중앙의 카메라부 전방에 배치되는 하프 미러를 제거함으로써, 보다 선명한 영상의 촬영이 가능하다.In addition, by removing the half mirror disposed in front of the center camera portion, it is possible to capture a clearer image.
도 1(a) 는 부품에 격자 무늬를 조사한 상태를 도시한 사시도이다.Fig. 1A is a perspective view showing a state in which a lattice pattern is irradiated to the part.
도 1(b) 는 부품에 격자 무늬를 조사한 상태를 도시한 평면도이다.FIG.1 (b) is a top view which shows the state which irradiated the grid with a component.
도 2 는 종래 비전검사장치의 측단면도이다.2 is a side cross-sectional view of a conventional vision inspection apparatus.
도 3 은 본 발명에 따른 비전검사장치의 개략 측면도이다.3 is a schematic side view of a vision inspection apparatus according to the present invention.
도 4 는 본 발명에 따른 비전검사장치의 개략 평면도이다. 4 is a schematic plan view of a vision inspection apparatus according to the present invention.
도 5 는 격자무늬의 주기와 부품의 높이 관계를 나타내는 개념도이다.5 is a conceptual diagram showing the relationship between the period of the lattice pattern and the height of the parts.
이하, 첨부된 도면을 참조하여 본 발명의 구성을 상세히 설명하기로 한다. Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the present invention.
이에 앞서, 본 명세서 및 청구범위에 사용된 용어는 사전적인 의미로 한정 해석되어서는 아니되며, 발명자는 자신의 발명을 최선의 방법으로 설명하기 위해 용어의 개념을 적절히 정의할 수 있다는 원칙에 입각하여, 본 발명의 기술적 사상에 부합되는 의미와 개념으로 해석되어야 한다.Prior to this, the terms used in this specification and claims should not be construed in a dictionary sense, and the inventors may properly define the concept of terms in order to explain their invention in the best way. It should be construed as meaning and concept consistent with the technical spirit of the present invention.
따라서, 본 명세서에 기재된 실시예 및 도면에 도시된 구성은 본 발명의 바람직한 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 표현하는 것은 아니므로, 본 출원 시점에 있어 이들을 대체할 수 있는 다양한 균등물과 변형예들이 존재할 수 있음을 이해하여야 한다.Therefore, the configurations shown in the embodiments and drawings described herein are only preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, and various equivalents may be substituted for them at the time of the present application. It is to be understood that water and variations may exist.
도 3 은 본 발명에 따른 비전검사장치의 개략 측면도이며, 도 4 는 본 발명에 따른 비전검사장치의 개략 평면도이다.3 is a schematic side view of a vision inspection apparatus according to the present invention, Figure 4 is a schematic plan view of the vision inspection apparatus according to the present invention.
도 3 과 4 를 참조하면, 본 발명에 따른 비전검사장치는 부품 조립과정에서 조립 또는 실장된 검사대상물을 카메라로 촬영한 후 촬영된 이미지를 미리 입력된 대상 이미지와 비교하여 검사대상물의 양호 또는 불량을 판별하기 위한 영상 선명도가 개선된 비전검사장치로서, 상기 검사대상물(5)을 검사위치에 고정 또는 이송시키는 스테이지부(10)와, 상기 스테이지부(10)의 상부에 위치하며, 상기 검사대상물(5)에 조명을 제공하는 조명부(20)와, 상기 조명부(20)의 중심에 위치되어 검사대상물(5)의 2차원 형상을 획득하기 위한 중앙카메라부(30)와, 상기 중앙카메라부(30)의 측부에 복수 개 배치되는 격자무늬조사부(50-2, 50-4, 50-6, 50-8)와, 상기 중앙카메라부(30)에서 촬영된 영상을 판독하여 상기 검사대상물의 양호 또는 불량을 판별하는 비전처리부(60)와, 상기 스테이지부(10)와 상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8) 및 상기 중앙카메라부(30)를 제어하는 제어부(70)를 포함하며, 상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8) 중의 어느 하나의 격자무늬조사부는 미리 정해진 하나의 주기(간격) 크기를 가지는 가시광선의 격자무늬를 조사하고, 또 다른 하나의 격자무늬조사부는 미리 정해진 또 다른 주기(간격) 크기를 가지는 비가시광선의 격자무늬를 조사하도록 구성되는 것을 특징으로 한다.3 and 4, the vision inspection apparatus according to the present invention is a good or bad object of the inspection object by comparing the photographed image with a pre-input target image after taking the inspection object assembled or mounted in the assembly process with the camera A vision inspection apparatus with improved image clarity for discriminating an image, comprising: a stage unit 10 for fixing or transferring the inspection object 5 to an inspection position, and an upper portion of the stage unit 10, wherein the inspection object A lighting unit 20 for providing illumination to the (5), a central camera unit 30 for obtaining a two-dimensional shape of the inspection object 5 is located in the center of the lighting unit 20, and the central camera unit ( The grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8, which are arranged in a plurality of sides on the side, and the image photographed by the central camera unit 30 are read and the inspection object is good. Or the vision processor 60 for determining a defect, and And a control unit 70 for controlling a tab part 10, the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8, and the central camera unit 30. One of the grid pattern irradiation units (50-2, 50-4, 50-6, 50-8) irradiates a grid pattern of visible light having a predetermined period (interval) size, and another grid pattern The irradiator is configured to irradiate a grid pattern of invisible light rays having another predetermined period (interval) size.
본 발명의 비전검사장치는 표면실장라인에서 표면실장작업을 마친 인쇄회로기판의 표면실장부품을 검사할 경우, 선행장비의 컨베이어를 통해 다음 공정으로 이동되기 이전에 비전검사를 실시할 수 있도록 설치된다.Vision inspection apparatus of the present invention is installed to perform the vision inspection before moving to the next process through the conveyor of the preceding equipment, when inspecting the surface-mounted parts of the printed circuit board after the surface mounting work in the surface mounting line .
이와 같은 비전검사장치는 선, 후행 장비의 컨베이어와 컨베이어 사이에 형성되는 공간에 배치되는 방식으로 설치될 수 있고, 선, 후행장비와 연계시키지 않고 단독 테이블 형태로도 사용될 수 있다.Such vision inspection apparatus can be installed in a manner that is arranged in the space formed between the conveyor of the line, trailing equipment and the conveyor, can also be used in the form of a single table without being connected to the line, trailing equipment.
여기서, 상기 스테이지부(10)는 검사될 검사대상물(5)이 착좌되는 공간을 제공하는 구성요소로서, 상기 검사대상물(5)의 위치를 조절 및 고정시키기 위한 위치조절부(미도시) 및 고정부(미도시) 등을 포함하여 구성될 수 있다.Here, the stage unit 10 is a component that provides a space in which the inspected object 5 to be inspected is seated, and a position adjusting unit (not shown) and a high position for adjusting and fixing the position of the inspected object 5. It may be configured to include a government (not shown).
여기서, 상기 스테이지부(10)의 상부에는 조명부(20)가 상기 중앙카메라부(30)를 중심으로 원주 방향을 따라 연속적 또는 단속적으로 설치된다.Here, the lighting unit 20 is installed on the upper portion of the stage unit 10 continuously or intermittently along the circumferential direction around the central camera unit 30.
상기 조명부(20)는 상기 검사대상물(5)의 정확한 영상정보를 확보하기 위하여 검사대상물(5)에 조명을 제공하는 구성요소로써, 복수의 램프 또는 엘이디 전구를 다수개 배치하여 상기 검사대상물(5)을 사방에서 조명하도록 마련될 수 있다.The lighting unit 20 is a component that provides illumination to the inspection object 5 in order to secure accurate image information of the inspection object 5, by placing a plurality of lamps or LED bulbs to the inspection object (5) ) Can be arranged to illuminate from side to side.
상기 조명부(20)는 수평조명부(22)와 경사조명부(23)를 포함하여 구성된다.The lighting unit 20 includes a horizontal lighting unit 22 and the inclined lighting unit 23.
여기서, 상기 수평조명부(22)는 상기 스테이지(10)의 상부에 설치되어 상기 검사대상물(5)에 수직으로 입사되는 광을 제공하는 역할을 수행한다.Here, the horizontal lighting unit 22 is installed on the upper portion of the stage 10 serves to provide the light incident to the inspection object (5) perpendicularly.
상기 경사조명부(23)는 상기 수직조명부(22)의 측부에 배치되어 경사 방향의광을 제공하는 역할을 수행한다.The inclined light unit 23 is disposed at the side of the vertical light unit 22 to provide light in the oblique direction.
상기 중앙카메라부(30)는 검사대상물(5)을 평면적으로 촬영하기 위한 구성요소로써, 바람직하게는 적외선 또는 자외선 영역에서도 감도를 가지도록 CCD(charge coupled device) 카메라 또는 시모스 이미지 센서 카메라를 포함하여 마련되되, 가시광선과 비가시광선 영상을 동시에 촬영할 수 있도록 구성된다.The central camera unit 30 is a component for photographing the inspection object 5 in a planar manner, and preferably includes a CCD (charge coupled device) camera or a CMOS image sensor camera to have sensitivity even in an infrared or ultraviolet region. It is provided, but is configured to shoot the visible light and invisible light image at the same time.
상기 중앙카메라부(30)에 의해 검사대상물(5)의 2차원적 검사를 수행함과 동시에, 상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)에 의해 조사된 격자 무늬가 변형된 정도를 촬영하여 검사대상물의 높이를 측정할 수 있다.The grid irradiated by the grid pattern irradiation unit 50-2, 50-4, 50-6, and 50-8 while performing the two-dimensional inspection of the inspection object 5 by the central camera unit 30. By measuring the degree of deformation of the pattern can be measured the height of the inspection object.
종래 비전검사장치의 경우, 통상 중앙카메라부의 전방에 하프미러가 배치되어 조명부로부터의 조명을 반사하면서도, 상기 카메라를 통한 영상의 촬영이 가능하도록 구성되는데, 본원 발명의 경우 상기 중앙카메라부(30) 전방에 하프미러가 배치되지 않는다.In the case of the conventional vision inspection apparatus, a half mirror is disposed in front of the center camera unit, and reflects the light from the lighting unit, and is configured to capture an image through the camera. In the present invention, the center camera unit 30 No half mirror is placed in front.
따라서, 상기 중앙카메라부(30)를 통해 보다 선명한 영상의 촬영이 가능해진다. Therefore, it is possible to capture a clearer image through the central camera unit 30.
상기 중앙카메라부(30)의 측부에는 복수 개의 측부카메라부(40-2, 40-4, 40-6, 40-8)가 상기 중앙카메라부(30)에 대해 대칭적으로 배치됨으로써, 영상의 사각 지역을 제거함과 동시에 영상의 촬영을 신속히 수행할 수 있다.A plurality of side camera units 40-2, 40-4, 40-6, and 40-8 are arranged symmetrically with respect to the center camera unit 30 on the side of the central camera unit 30, thereby providing an image. Eliminate blind spots and take pictures quickly.
도 4 에 도시된 바와 같이, 네개의 상기 측부카메라부(40-2, 40-4, 40-6, 40-8)가 상기 중앙카메라부(30)에 대해 대칭적으로 배치되어, 기판 등의 검사대상물에 배치되는 부품의 들뜸, 미삽 등을 검사한다.As shown in FIG. 4, the four side camera parts 40-2, 40-4, 40-6, and 40-8 are symmetrically arranged with respect to the center camera part 30, such as a substrate. Examine the lifting and uninsertion of the parts placed on the inspection object.
상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)는 상기 검사대상물(5)에 격자무늬를 조사하여 높이를 측정하기 위한 구성으로서, 액정패널 또는 디지털 마이크로미러 디스플레이(DMD: Digital Micromirror Display)과 광원을 포함하여 구성된다.The grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) is a configuration for measuring the height by irradiating the grid pattern on the inspection object 5, a liquid crystal panel or a digital micromirror display ( DMD: Digital Micromirror Display and light source.
그리하여, 상기 제어부(70)의 제어에 의해 격자 형상의 그림자가 검사대상물(5) 상에 조사되도록 하고, 상기 격자 형상의 그림자가 변형된 정도를 상기 중앙카메라부(30)를 통해 촬영함으로써, 부품의 높이를 계산할 수 있다.Thus, the shadow of the grid-shaped shadow is irradiated onto the inspection object 5 under the control of the control unit 70, and the degree of deformation of the grid-shaped shadow through the central camera unit 30, We can calculate the height of.
상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8) 역시 상기 중앙카메라부(30)를 중심으로 네 개의 격자무늬조사부(50-2, 50-4, 50-6, 50-8)가 대칭적으로 배치되어, 검사대상물(5)에 동시 또는 순차적으로 격자 무늬를 조사하도록 구성된다.The grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 also has four grid pattern irradiation units 50-2, 50-4, 50-6, centered on the central camera unit 30. 50-8) are arranged symmetrically, and are configured to irradiate the grid 5 with the inspection object 5 simultaneously or sequentially.
여기서, 상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8) 중의 어느 하나의 격자무늬조사부는 미리 정해진 하나의 주기(간격) 크기를 가지는 가시광선의 격자무늬를 조사하고, 또 다른 하나의 격자무늬조사부는 미리 정해진 또 다른 주기(간격) 크기를 가지는 비가시광선의 격자무늬를 조사하도록 구성된다.Here, any one of the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) of the grid pattern irradiation unit irradiates a grid pattern of visible light having a predetermined period (interval) size, Another grid pattern irradiation unit is configured to irradiate the grid pattern of invisible light beams having another predetermined period (interval) size.
그리하여, 예를 들어 보다 큰 간격의 격자 무늬는 빨강, 파량, 초록 등의 가시광선으로 조사하고, 보다 작은 간격의 격자 무늬는 적외선 또는 자외선으로 동시에 조사함으로써, 부품의 높이 측정에 소요되는 시간을 감소시키면서 보다 정확한 높이 측정이 가능하도록 한다.Thus, for example, the larger intervals of the grid are irradiated with visible light such as red, wave, green, etc., and the smaller intervals of the grid are simultaneously irradiated with infrared or ultraviolet rays, thereby reducing the time required for measuring the height of the component. This allows more accurate height measurements.
상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)와 상기 중앙카메라부(30) 사이의 배치 각도(a) 는 25도 내지 45도의 각도 범위로 배치되는 것이 바람직하다.Preferably, the arrangement angle a between the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 and the central camera unit 30 is arranged in an angle range of 25 degrees to 45 degrees. .
상기 각도(a)가 25도보다 작을 경우에는 부품의 높이에 따른 격자무늬의 변형 정도가 작아 높이 계산에 오차를 야기할 있으며, 상기 각도(a)가 45도보다 클 경우에는 상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)에 가까운쪽과 먼쪽에 조사되는 격자무늬 폭의 차이가 지나치게 커져 높이 계산에 오차를 야기할 수 있다. When the angle (a) is smaller than 25 degrees, the degree of deformation of the grid pattern according to the height of the component is small, which may cause an error in the height calculation. When the angle (a) is larger than 45 degrees, the grid pattern irradiation unit ( 50-2, 50-4, 50-6, 50-8), the difference in the width of the grid pattern irradiated on the near and far sides is too large, which may cause errors in the height calculation.
상기 각도 범위로 배치될 경우, 조사된 격자무늬를 상기 중앙카메라부(30)를 통해 촬영하면, 검사 대상물의 높이에 따라 격자 무늬가 적절히 변형되기 때문이다.This is because, when disposed in the angular range, when the irradiated grid pattern is photographed through the central camera unit 30, the grid pattern is properly deformed according to the height of the inspection object.
한편, 상기 비전처리부(60)는 상기 카메라부로부터 획득된 검사대상물(5)의 영상정보를 푸리에 변환(Fourier Transform) 등의 수학적인 처리를 통해 계산하여, 미리 입력된 기준 값과 비교함으로써 상기 검사대상물(5)의 양호 불량을 판단한다.On the other hand, the vision processing unit 60 calculates the image information of the inspection object 5 obtained from the camera unit through a mathematical process such as Fourier transform (Fourier Transform), and compares with the reference value input in advance The good or bad of the object 5 is determined.
또한, 상기 제어부(70)는 상기 스테이지부(10), 카메라부의 구동 및 동작을 제어하는 모션 컨트롤러를 포함하는 구성요소로써, 본 발명에 따른 비전검사장치 전체의 구동을 제어하도록 마련될 수 있다.In addition, the control unit 70 is a component including a motion controller for controlling the driving and operation of the stage unit 10 and the camera unit, and may be provided to control driving of the entire vision inspection apparatus according to the present invention.
상기 제어부(70)는 시스템 제어 프로그램에 따라 비전검사장치의 촬영위치제어와 촬영된 영상의 처리와 조명부 제어 등의 물리적인 제어를 담당함은 물론 검사작업수행 및 데이터 연산 작업을 수행한다. The controller 70 is responsible for physical control such as photographing position control of the vision inspection apparatus, processing of photographed images, and lighting unit control according to a system control program, as well as performing inspection task and data calculation task.
아울러, 상기 제어부(70)는 작업내용 및 검사결과를 모니터에 출력하기 위한 출력장치 제어와 작업자가 설정 및 제반사항을 입력할 수 있는 입력장치 제어 등 비전검사장치의 총괄적인 제어를 담당한다.In addition, the control unit 70 is in charge of the overall control of the vision inspection apparatus, such as output device control for outputting the work contents and inspection results to the monitor and input device control for the operator to input the settings and all the details.
한편, 상기 조명부(20)의 전방에는 광확산판과 같은 광확산부(25)가 배치되어, 상기 조명부(20)로부터의 광이 검사대상물의 전체 영역에 고루 조사되도록 한다.On the other hand, the light diffusion unit 25, such as a light diffusion plate is disposed in front of the illumination unit 20, so that the light from the illumination unit 20 is evenly irradiated to the entire area of the inspection object.
그리하여, 검사대상물(5) 상에서 어두운 부분과 밝은 부분의 차이를 감소시켜 보다 선명한 영상을 촬영할 수 있다.Thus, by reducing the difference between the dark portion and the bright portion on the inspection object (5) can take a clearer image.
상기 광확산부(25)는 상기 수평조명부(22)와 경사조명부(23) 모두의 전방에 배치될 수 있도록 측단면 상 꺽여진 형태로 구성된다.The light diffusion unit 25 is configured to be bent in a side cross-section so that the light diffusion unit 25 can be disposed in front of both the horizontal light unit 22 and the inclined light unit 23.
한편, 상기 중앙카메라부(30)의 일측부에는 검사대상물의 위치 확인을 위한 위치확인카메라부(80)가 배치된다.On the other hand, at one side of the central camera unit 30 is positioned a positioning camera unit 80 for checking the position of the inspection object.
여기서, 상기 위치확인카메라부(80)의 전방에는 위치확인조명부(84)와 하프미러(82)가 배치된다.Here, the positioning lighting unit 84 and the half mirror 82 is disposed in front of the positioning camera unit 80.
그리하여, 종래 중앙 카메라를 통해 검사대상물의 위치를 확인하는 경우에 비해, 위치 확인을 위한 구성들이 별도의 위치확인카메라부(80)의 하우징 내에 수용됨으로써, 상기 중앙카메라부(30)의 하우징 직경을 감소시킬 수 있으며, 부속 고장의 경우에도 관리가 용이해진다.Thus, compared to the case of confirming the position of the inspection object through the conventional central camera, the configuration for positioning is accommodated in the housing of the separate positioning camera unit 80, thereby reducing the housing diameter of the central camera unit 30 It can be reduced and management is easy even in case of accessory failure.
도 5 는 격자무늬의 주기와 부품의 높이 관계를 나타내는 개념도이다.5 is a conceptual diagram showing the relationship between the period of the lattice pattern and the height of the parts.
도 5 를 참조하여, 본 발명에 따른 비전검사장치의 격자 조사 과정을 설명하면 다음과 같다.Referring to Figure 5, when describing the grid irradiation process of the vision inspection apparatus according to the present invention.
먼저, 도 5 에서 a, b, c, d 점을 잇는 계단형상의 직선은 큰 주기를 가지는 격자 무늬에 의해 측정될 수 있는 높이를 개념적으로 도시한다.First, in FIG. 5, the straight lines connecting the points a, b, c and d conceptually show the height that can be measured by the lattice pattern having a large period.
즉, 큰 주기의 격자 무늬는 500 마이크로미터의 해상도를 가지며, 따라서 0에서 500마이크로미터까지의 높이에 대해서는 모두 동일한 높이로 인식하며, 500에서 1000마이크로미터까지는 또 다른 높이로 인식하게 된다.That is, a large periodic grid has a resolution of 500 micrometers, so all heights from 0 to 500 micrometers are recognized as the same height, and another height from 500 to 1000 micrometers.
이것은 큰 주기의 격자 무늬를 이용하여 부품의 높이를 측정할 경우의 해상도를 개념적으로 설명하는 것이며, 구체적인 숫자는 격자 무늬의 주기 크기에 따라 달라질 수 있다.This conceptually describes the resolution when measuring the height of a part using a large periodic grid, and specific numbers may vary depending on the periodic size of the grid.
상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)에 의해 일차적으로 큰 간격의 격자 무늬를 조사하여 부품의 대략적인 높이를 측정하게 된다.The grid pattern irradiation unit 50-2, 50-4, 50-6, and 50-8 may first measure the approximate height of the component by irradiating the grid pattern with a large gap.
즉, 도 5 에 예시된 육면체 형상 부품의 높이가 1680마이크로미터라 할 경우, 큰 주기의 격자무늬를 통해 일차적으로 1500 과 2000 마이크로미터 범위에 부품의 높이가 해당됨을 측정하게 된다.That is, when the height of the hexahedral shaped part illustrated in FIG. 5 is 1680 micrometers, the height of the part is primarily measured in the range of 1500 and 2000 micrometers through the lattice of a large period.
그 다음 순서로서, 작은 주기를 가지는 격자 무늬를 조사하여 d 점으로부터 R 점까지의 높이가 180 마이크로미터인 것을 측정하게 된다.Next, the grid pattern with a small period is examined to determine that the height from point d to point R is 180 micrometers.
따라서, 부품의 총 높이는 1500 + 180 으로서 1680마이크로미터로 측정한다.Thus, the total height of the part is 1500 + 180, measured 1680 micrometers.
만약, 큰 주기의 격자무늬를 통한 높이 측정 과정이 없이 작은 주기의 격자무늬 한가지 만으로서 부품의 높이를 측정하게 된다면, 도 1 에서 좌측의 1번 격자무늬와 애초 일치하는 격자무늬가 우측의 1-1 격자무늬인지, 2-1 격자무늬인지, 3-1 격자무늬인지, 즉 부품의 상면에 있는 격자 무늬와 바닥면에 있는 격자 무늬가 상호 몇번의 주기(격자 간격)를 경과하여 일치되는지의 여부를 판단할 수 없게 된다.If the height of the part is measured by using only one lattice of the small period without the height measurement process through the lattice of the large period, the lattice pattern corresponding to the first lattice pattern on the left in FIG. 1 Plaid, 2-1 Plaid, 3-1 Plaid, that is, whether the plaid on the top of the part and the plaid on the bottom coincide after several cycles (lattice spacing) Cannot be judged.
따라서, 이러한 요인은 높이 검사에 있어 오차를 유발할 수 있는 요인으로서, 이러한 오차의 제거를 위해 높이 검사에 요구되는 계산 과정을 복잡하게 하고 검사에 소요되는 시간을 지연시키는 요인이 된다.Therefore, such a factor may cause an error in the height inspection, which complicates the calculation process required for the height inspection and eliminates the time required for the inspection.
본 발명에서는 상기와 같이, 큰 주기의 격자 무늬와 보다 높은 해상도의 작은 격자 무늬를 함께 이용하되, 큰 주기의 격자 무늬를 통해서는 대략적인 높이의 범위를 측정하고, 작은 주기의 격자 무늬를 이용하여서는 보다 정확한 높이를 측정할 수 있도록 함으로써, 신속하고도 정확히 높이 검사를 수행할 수 있다.In the present invention, as described above, a large period plaid and a smaller resolution plaid with a higher resolution are used together, but through a large period plaid, the approximate height range is measured, and a small period plaid is used. By allowing more accurate height measurements, height checks can be performed quickly and accurately.
상기 큰 주기의 격자 무늬 및 작은 주기의 격자 무늬는 높이 검사장치의 필요 사양에 따라, 큰 주기의 격자 무늬 및 작은 주기의 격자 무늬를 각각 한번 조사하여 이를 촬영하거나, 큰 주기의 격자 무늬를 한번 조사하여 촬영하고, 작은 주기의 격자 무늬는 큰 주기의 격자 무늬 사이를 이동시키면서 촬영함으로써 보다 정확한 높이 측정이 가능하도록 구성될 수도 있다.The large cycle plaid and the small cycle plaid may be photographed by irradiating the large cycle plaid and the small cycle plaid once, or irradiating the large cycle plaid once according to the requirements of the height inspection device. Photographed by a small period, the grid may be configured to enable a more accurate height measurement by photographing while moving between the grid of a large period.
여기서, 상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)에 의해 조사되는 격자의 주기 크기에 따라 빨강, 파랑, 초록 등의 가시광선 및 비가시광선의 격자 무늬로 구분하여 격자 무늬를 조사할 경우 보다 명확하고도 신속히 부품의 높이를 측정할 수 있다.Here, the grid pattern of the visible light and invisible light such as red, blue, green, etc. according to the period size of the grid irradiated by the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) Investigating the grid pattern separately allows you to measure the height of components more clearly and quickly.
즉, 예를 들어 큰 주기의 격자 무늬는 가시광선으로 조사하고, 보다 작은 주기의 격자 무늬는 적외선 또는 자외선으로 조사할 수 있다.That is, for example, the lattice of large periods can be irradiated with visible light, and the lattice of smaller periods can be irradiated with infrared rays or ultraviolet rays.
상기 격자무늬조사부(50-2, 50-4, 50-6, 50-8)에 의해 조사되는 격자 무늬는 큰 주기의 격자무늬와 작은 주기의 격자무늬를 동시 또는 순차적으로 조사할 수 있다.  The grid pattern irradiated by the grid pattern irradiation units 50-2, 50-4, 50-6, and 50-8 may irradiate the grid pattern of a large period and the grid pattern of a small period simultaneously or sequentially.
즉, 각 격자무늬조사부(50-2, 50-4, 50-6, 50-8)를 통해 먼저 큰 주기의 격자무늬를 조사하고 이후 작은 주기의 격자무늬를 조사하거나, 큰 주기의 격자무늬와 작은 주기의 격자무늬를 동시에 조사할 수도 있다.That is, each grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) through the first check the lattice of a large period, and then the lattice of the small period, or Smaller grids can be irradiated at the same time.
상기 보다 큰 주기의 격자 무늬 간격은 보다 작은 격자 무늬 간격에 비해 3배 내지 6배로 구성되는 것이 바람직하다.The larger plaid spacing is preferably comprised three to six times larger than the smaller plaid spacing.
만약 큰 주기의 격자무늬 간격이 3배 미만일 경우에는 주기 크기 차이에 의한 측정 해상도 차이가 크지 않아 보다 정확한 높이 측정에 바람직하지 못하며, 만약, 큰 주기의 격자 무늬 간격이 6배를 초과할 경우에는 큰 간격과 작은 간격 간의 차이가 너무 크게 되어, 최종적으로 검사대상물 상에 비춰진 격자 형상의 선명도에 바람직하지 못한 영향을 미치게 된다. If the lattice spacing of a large period is less than three times, the difference in measurement resolution due to the difference of the period size is not large, which is not desirable for more accurate height measurement.If the lattice spacing of a large period exceeds six times, The difference between the spacing and the small spacing becomes so large that it has an undesirable effect on the sharpness of the grid shape finally reflected on the inspection object.
이상, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명의 기술적 사상은 이러한 것에 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해, 본 발명의 기술적 사상과 하기 될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형 실시가 가능할 것이다.As mentioned above, although the present invention has been described by way of limited embodiments and drawings, the technical idea of the present invention is not limited thereto, and a person having ordinary skill in the art to which the present invention pertains, Various modifications and variations may be made without departing from the scope of the appended claims.

Claims (12)

  1. 부품 조립과정에서 조립 또는 실장된 검사대상물을 카메라로 촬영한 후 촬영된 이미지를 미리 입력된 대상 이미지와 비교하여 검사대상물의 양호 또는 불량을 판별하기 위한 비전검사장치로서,A vision inspection device for determining whether the inspection object is good or bad by taking a photograph of an inspection object assembled or mounted in a component assembly process and comparing the photographed image with a previously input target image.
    상기 검사대상물을 검사위치에 고정 또는 이송시키는 스테이지부와;A stage unit for fixing or transferring the inspection object to an inspection position;
    상기 스테이지부의 상부에 위치하며, 상기 검사대상물에 조명을 제공하는 조명부와;An illumination unit positioned above the stage unit and providing illumination to the inspection object;
    상기 조명부의 중심에 위치되어 검사대상물의 2차원 형상을 획득하기 위한 중앙카메라부와;A central camera unit positioned at the center of the illumination unit to obtain a two-dimensional shape of an inspection object;
    상기 중앙카메라부의 측부에 복수 개 배치되는 측부카메라부와;A side camera unit disposed in a plurality of side portions of the central camera unit;
    상기 중앙카메라부의 측부에서 상기 측부카메라부의 카메라와 카메라 사이에 배치되는 복수 개의 격자무늬조사부와;A plurality of lattice pattern irradiation units disposed between the camera and the camera at the side of the central camera unit;
    상기 중앙카메라부에서 촬영된 영상을 판독하여 상기 검사대상물의 양호 또는 불량을 판별하는 비전처리부와;A vision processing unit which reads the image photographed by the central camera unit and determines whether the inspection object is good or bad;
    상기 스테이지부와 상기 격자무늬조사부 및 상기 카메라부를 제어하는 제어부를 포함하며,A control unit for controlling the stage unit, the grid pattern irradiation unit, and the camera unit,
    상기 격자무늬조사부 중의 어느 하나의 격자무늬조사부는 미리 정해진 하나의 주기 크기를 가지는 가시광선의 격자무늬를 조사하고, 또 다른 하나의 격자무늬조사부는 미리 정해진 또 다른 주기 크기를 가지는 비가시광선의 격자무늬를 조사하도록 구성되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치. One of the grid pattern irradiation unit of the grid pattern irradiation unit irradiates a grid pattern of visible light having a predetermined one cycle size, another grid pattern irradiation unit is a grid pattern of invisible light having another predetermined cycle size Vision inspection apparatus using a grid of visible light and a grid of invisible light, characterized in that configured to irradiate.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 비가시광선은 적외선 또는 자와선인 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치. The invisible light is a vision inspection device using a grid of visible light and a grid of invisible light, characterized in that the infrared ray or a magnetic line.
  3. 제 1 항에 있어서,The method of claim 1,
    상기 격자무늬조사부는 액정 패널 또는 마이크로미러모듈 중의 어느 하나를 포함하여 구성되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.The grid pattern irradiator includes a liquid crystal panel or a micromirror module comprises a grid pattern of visible light and a grid pattern of invisible light, characterized in that the configuration.
  4. 제 1 항에 있어서,The method of claim 1,
    상기 가시광선의 격자무늬와 비가시광선의 격자무늬는 동시에 조사되도록 구성되는 것을 특징으로 하는 비전검사장치.And the grid pattern of the visible light and the grid pattern of the invisible light are irradiated at the same time.
  5. 제 1 항에 있어서,The method of claim 1,
    상기 조명부의 전방에는 광확산부가 배치되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.A light inspection unit using a grid of visible light and a grid of invisible light, characterized in that the light diffusion unit is disposed in front of the lighting unit.
  6. 제 1 항에 있어서,The method of claim 1,
    상기 조명부는 수직하방향으로 광을 조사하기 위한 수평조명부와 경사 방향으로 광을 조사하기 위한 경사조명부를 포함하여 구성되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.The lighting unit is a vision inspection device using a grid pattern of visible light and a grid pattern of invisible light, characterized in that it comprises a horizontal lighting unit for irradiating light in the vertical and downward direction and an inclined lighting unit for irradiating light in the oblique direction .
  7. 제 1 항에 있어서,The method of claim 1,
    상기 복수 개의 격자무늬조사부는 상기 중앙카메라부를 중심으로 상호 대향 배치되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.The plurality of grid pattern irradiation unit is a vision inspection device using a grid pattern of the visible light and a grid pattern of invisible light, characterized in that disposed opposite to each other with respect to the center camera unit.
  8. 제 1 항에 있어서,The method of claim 1,
    상기 측부카메라부는 상기 중앙카메라부를 중심으로 상호 대향 배치되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.The side camera unit is a vision inspection device using a grid pattern of the visible light and a grid pattern of invisible light, characterized in that disposed opposite to each other centered around the central camera.
  9. 제 1 항에 있어서,The method of claim 1,
    상기 광확산부는 상기 수평조명부와 경사조명부 모두의 전면에 배치되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.The light diffusing unit is a vision inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light, characterized in that disposed in front of both the horizontal lighting unit and the inclined lighting unit.
  10. 제 1 항에 있어서,The method of claim 1,
    상기 중앙카메라부의 일측부에는 검사대상물의 위치 확인을 위한 위치확인카메라부가 배치되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.A vision inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light, characterized in that a positioning camera unit is disposed at one side of the central camera unit to check the position of the inspection object.
  11. 제 10 항에 있어서,The method of claim 10,
    상기 위치확인카메라부의 전방에는 위치확인조명부와 하프미러가 배치되는 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.A positioning device and a half mirror are disposed in front of the positioning camera unit, the vision inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light.
  12. 제 1 항에 있어서,The method of claim 1,
    측면도 상 상기 중앙카메라부와 상기 격자무늬조사부 사이의 각도는 25도 내지 45도인 것을 특징으로 하는 가시광선의 격자무늬와 비가시광선의 격자 무늬를 이용한 비전검사장치.Vision inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light, characterized in that the angle between the central camera portion and the grid pattern irradiation section on the side view.
PCT/KR2012/002220 2011-03-31 2012-03-27 Visual inspection apparatus using a grid pattern of visible light and a grid pattern of invisible light WO2012134147A1 (en)

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