WO2012120729A1

WO2012120729A1 - Information acquiring apparatus, and object detecting apparatus having information acquiring apparatus mounted therein

Info

Publication number: WO2012120729A1
Application number: PCT/JP2011/075388
Authority: WO
Inventors: 楳田　勝美; 後藤　陽一郎
Original assignee: 三洋電機株式会社
Priority date: 2011-03-10
Filing date: 2011-11-04
Publication date: 2012-09-13
Also published as: JP2014102073A

Abstract

Provided are an information acquiring apparatus, with which detection efficiency can be improved, and an object detecting apparatus having the information acquiring apparatus mounted therein. An information acquiring apparatus (1) is provided with a laser light source (111), which outputs laser light having a wavelength of approximately 830 nm, a collimator lens (112), a start-up mirror (113), and a DOE (114). The collimator lens is disposed such that the optical axis of the collimator lens is shifted in the Z axis negative direction from the optical axis of the laser light source. Consequently, the direction of the diffraction light (DMP) outputted from the DOE is tilted in the X axis direction from the Z axis direction. Thus, irradiation region of the diffraction light in a pattern of dots is brought close to an image pickup region of a light receiving optical system (12), and an overlapping quantity of the irradiation region and the image pick-up region is increased.

Description

[Name of invention determined by ISA based on Rule 37.2] Information acquisition device and object detection device equipped with information acquisition device

The present invention relates to an object detection apparatus that detects an object in a target area based on the state of reflected light when light is projected onto the target area, and an information acquisition apparatus suitable for use in the object detection apparatus.

Conventionally, an object detection device using light has been developed in various fields. An object detection apparatus using a so-called distance image sensor can detect not only a planar image on a two-dimensional plane but also the shape and movement of the detection target object in the depth direction. In such an object detection device, light in a predetermined wavelength band is projected from a laser light source or LED (Light Emitting Diode) onto a target area, and the reflected light is received (imaged) by a light receiving element such as a CMOS image sensor. . Various types of distance image sensors are known.

In a distance image sensor of a type that irradiates a target area with laser light having a predetermined dot pattern, reflected light from the target area of the laser light at each dot position is received by a light receiving element. Then, based on the light receiving position of the laser light at each dot position on the light receiving element, the distance to each part of the detection target object (each dot position on the detection target object) is detected using triangulation (for example, Non-Patent Document 1).

In the object detection apparatus, the projection optical system and the light receiving optical system are installed so as to be separated from each other by a predetermined distance in a direction perpendicular to the light projection direction. For this reason, in the target area, there is an unused area where the area where the light is projected from the projection optical system and the area that can be imaged by the light receiving optical system do not overlap each other. Due to such a non-use area, the conventional object detection apparatus has a problem that the object detection efficiency is lowered.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an information acquisition apparatus capable of increasing detection efficiency and an object detection apparatus equipped with the information acquisition apparatus.

A 1st aspect of this invention is related with the information acquisition apparatus which acquires the information of a target area | region using light. The information acquisition apparatus according to this aspect is arranged so as to be arranged side by side in a lateral direction by a predetermined distance with respect to the projection optical system, and a projection optical system that projects light of a predetermined dot pattern onto the target area, A light receiving optical system that captures an image of the target area; and a projection displacement unit that displaces the light projection area of the projection optical system from the front of the projection optical system toward the light receiving optical system.
A 2nd aspect of this invention is related with the information acquisition apparatus which acquires the information of a target area | region using light. The information acquisition apparatus according to this aspect includes a projection optical system that projects light of a predetermined dot pattern on the target area, and a predetermined distance away from the projection optical system in a direction parallel to the installation surface of the projection optical system. And a light receiving optical system that images the target area, and a light receiving displacement means that displaces the imaging area formed by the light receiving optical system from the front of the light receiving optical system toward the projection optical system.

The third aspect of the present invention relates to an object detection apparatus. The object detection apparatus according to this aspect includes the information acquisition apparatus according to the first and second aspects.

According to the present invention, it is possible to provide an information acquisition device capable of increasing detection efficiency and an object detection device equipped with the information acquisition device.

The characteristics of the present invention will be further clarified by the description of the embodiments shown below. However, the following embodiment is merely one embodiment of the present invention, and the meaning of the term of the present invention or each constituent element is not limited to that described in the following embodiment. Absent.

It is a figure which shows the structure of the object detection apparatus which concerns on embodiment. It is a figure which shows the structure of the information acquisition apparatus and information processing apparatus which concern on embodiment. It is a figure which shows the irradiation state of the laser beam with respect to the target area | region which concerns on embodiment, and the light reception state of the laser beam on an image sensor. It is a perspective view which shows the external appearance of the projection optical system which concerns on embodiment, and a light-receiving optical system. It is a side view which shows the structure of the projection optical system which concerns on a comparative example, and a light reception optical system, the figure which shows typically the state of the laser beam which permeate | transmitted DOE, and the figure which shows typically the projection state of the dot pattern in a target area | region. It is a figure which shows typically the irradiation range of the laser which concerns on a comparative example, and the light reception range (imaging range) of a CMOS image sensor. FIG. 3 is a side view showing the configurations of a projection optical system and a light receiving optical system according to Example 1, a diagram schematically showing a state of laser light transmitted through a DOE, and a diagram schematically showing a dot pattern projection state in a target region. . The figure which shows typically the irradiation range of the laser which concerns on Example 1, and the light reception range (imaging range) of a CMOS image sensor, the side view which shows the structure of the projection optical system which concerns on Example 2, and permeate | transmits DOE which concerns on Example 2 It is a figure which shows typically the state of the performed laser beam. The side view which shows the structure of the projection optical system which concerns on Example 3, the figure which shows typically the state of the laser beam which permeate | transmitted DOE which concerns on Example 3, the irradiation range of the laser which concerns on Example 3, and light reception of a CMOS image sensor It is a figure which shows a range (imaging range) typically. The side view which shows the structure of the projection optical system which concerns on Example 4, and the structure of a light-receiving optical system, The figure which shows the effect | action of the imaging lens which concerns on Example 4, the irradiation range of the laser which concerns on Example 4, and light reception of a CMOS image sensor It is a figure which shows a range (imaging range) typically. FIG. 10 is a side view showing the configurations of a projection optical system and a light receiving optical system according to Example 4, and a diagram schematically showing a laser irradiation range and a light receiving range (imaging range) of a CMOS image sensor according to Example 4.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, an information acquisition device of a type that irradiates a target area with laser light having a predetermined dot pattern is exemplified.

First, FIG. 1 shows a schematic configuration of the object detection apparatus according to the present embodiment. As illustrated, the object detection device includes an information acquisition device 1 and an information processing device 2. The television 3 is controlled by a signal from the information processing device 2.

The information acquisition device 1 projects infrared light over the entire target area and receives the reflected light with a CMOS image sensor, whereby the distance between each part of the object in the target area (hereinafter referred to as “three-dimensional distance information”). To get. The acquired three-dimensional distance information is sent to the information processing apparatus 2 via the cable 4.

The information processing apparatus 2 is, for example, a controller for TV control, a game machine, a personal computer, or the like. The information processing device 2 detects an object in the target area based on the three-dimensional distance information received from the information acquisition device 1, and controls the television 3 based on the detection result.

For example, the information processing apparatus 2 detects a person based on the received three-dimensional distance information and detects the movement of the person from the change in the three-dimensional distance information. For example, when the information processing device 2 is a television control controller, the information processing device 2 detects the person's gesture from the received three-dimensional distance information, and sends a control signal to the television 3 according to the gesture. An application program to output is installed. In this case, the user can cause the television 3 to execute a predetermined function such as channel switching or volume up / down by making a predetermined gesture while watching the television 3.

Further, for example, when the information processing device 2 is a game machine, the information processing device 2 detects the person's movement from the received three-dimensional distance information, and displays a character on the television screen according to the detected movement. An application program that operates and changes the game battle situation is installed. In this case, the user can experience a sense of realism in which he / she plays a game as a character on the television screen by making a predetermined movement while watching the television 3.

FIG. 2 is a diagram showing the configuration of the information acquisition device 1 and the information processing device 2.

The information acquisition apparatus 1 includes a projection optical system 11 and a light receiving optical system 12 as a configuration of the optical unit. In addition, the information acquisition device 1 includes a CPU (Central Processing Unit) 21, a laser driving circuit 22, an imaging signal processing circuit 23, an input / output circuit 24, and a memory 25 as a circuit unit.

The projection optical system 11 irradiates a target area with laser light having a predetermined dot pattern. The light receiving optical system 12 receives the laser beam reflected from the target area. The configurations of the projection optical system 11 and the light receiving optical system 12 will be described later with reference to FIG.

The CPU 21 controls each unit according to a control program stored in the memory 25. With this control program, the CPU 21 has functions of a laser control unit 21 a for controlling a laser light source 111 (described later) in the projection optical system 11 and a three-dimensional distance calculation unit 21 b for generating three-dimensional distance information. Is granted.

The laser drive circuit 22 drives a laser light source 111 (described later) according to a control signal from the CPU 21. The imaging signal processing circuit 23 controls a CMOS image sensor 123 (described later) in the light receiving optical system 12 and sequentially takes in each pixel signal (charge) generated by the CMOS image sensor 123 for each line. Then, the captured signals are sequentially output to the CPU 21.

CPU21 calculates the distance from the information acquisition apparatus 1 to each part of a detection target based on the signal (imaging signal) supplied from the imaging signal processing circuit 23 by the process by the three-dimensional distance calculation part 21b. The input / output circuit 24 controls data communication with the information processing apparatus 2.

The information processing apparatus 2 includes a CPU 31, an input / output circuit 32, and a memory 33. In addition to the configuration shown in the figure, the information processing apparatus 2 has a configuration for performing communication with the television 3 and for reading information stored in an external memory such as a CD-ROM and installing it in the memory 33. However, the configuration of these peripheral circuits is not shown for the sake of convenience.

The CPU 31 controls each unit according to a control program (application program) stored in the memory 33. With such a control program, the CPU 31 is provided with the function of the object detection unit 31a for detecting an object in the image. Such a control program is read from a CD-ROM by a drive device (not shown) and installed in the memory 33, for example.

For example, when the control program is a game program, the object detection unit 31a detects a person in the image and its movement from the three-dimensional distance information supplied from the information acquisition device 1. Then, a process for operating the character on the television screen according to the detected movement is executed by the control program.

When the control program is a program for controlling the function of the television 3, the object detection unit 31 a detects a person in the image and its movement (gesture) from the three-dimensional distance information supplied from the information acquisition device 1. To do. Then, processing for controlling functions (channel switching, volume adjustment, etc.) of the television 3 is executed by the control program in accordance with the detected movement (gesture).

The input / output circuit 32 controls data communication with the information acquisition device 1.

3A is a diagram schematically showing the irradiation state of the laser light on the target region, and FIG. 3B is a diagram schematically showing the light receiving state of the laser light in the CMOS image sensor 123. FIG. For the sake of convenience, FIG. 6B shows a light receiving state when a flat surface (screen) exists in the target area.

As shown in FIG. 5A, the projection optical system 11 emits laser light having a dot pattern (hereinafter, the entire laser light having this pattern is referred to as “DMP light”) toward the target region. Is done. In FIG. 4A, the projection area of DMP light is indicated by a broken line frame. Each dot in the DMP light schematically shows a region where the intensity of the laser light is scattered in a scattered manner by the diffraction action by the diffractive optical element in the projection optical system 11. In the luminous flux of DMP light, regions where the intensity of the laser light is increased are scattered according to a predetermined dot pattern.

When there is a flat surface (screen) in the target area, the light at each dot position of the DMP light reflected thereby is distributed on the CMOS image sensor 123 as shown in FIG. For example, the light at the P0 dot position on the target area corresponds to the light at the Pp dot position on the CMOS image sensor 123.

The three-dimensional distance calculation unit 21b detects at which position on the CMOS image sensor 123 the light corresponding to each dot is incident, and based on the triangulation method, the respective parts ( The distance to each dot position on the dot pattern is detected. Details of such a detection technique are described in, for example, Non-Patent Document 1 (The 19th Annual Conference of the Robotics Society of Japan (September 18-20, 2001), Proceedings, P1279-1280).

FIG. 4 is a perspective view showing an installation state of the projection optical system 11 and the light receiving optical system 12.

The projection optical system 11 and the light receiving optical system 12 are installed on a base plate 300 having high thermal conductivity. The optical member constituting the projection optical system 11 is installed on the chassis 11a, and this chassis 11a is installed on the installation surface P1 of the base plate 300. Thereby, the projection optical system 11 is installed on the installation surface P <b> 1 on the base plate 300.

The light receiving optical system 12 is installed on the upper surface (installation surface P2) of the two pedestals 300a on the base rate 300 and the upper surface (installation surface P2) of the base plate 300 between the two pedestals 300a. A CMOS image sensor 123 described later is installed on the upper surface (installation surface P2) of the base plate 300 between the two pedestals 300a, and a filter 121 and an imaging lens 122 described later are installed on the upper surface (installation surface P2) of the pedestal 300a. A holding plate 12a to hold is installed. The imaging lens 122 is held by a lens holder 12b attached to the holding plate 12a, and a filter 121 is attached to the front portion of the lens holder 12b.

The projection optical system 11 and the light receiving optical system 12 are arranged with a predetermined distance in the X-axis direction. A circuit board (described later) is installed in the space S between the projection optical system 11 and the light receiving optical system 12.

<Comparative example>
FIG. 5A is a diagram schematically illustrating configurations of the projection optical system 11 and the light receiving optical system 12 according to the comparative example. In this comparative example, the installation surfaces P1 and P2 of the projection optical system 11 and the light receiving optical system 12 are both parallel to the XY plane, and the front direction of the projection optical system 11 and the light receiving optical system 12 is the Z-axis direction. . For convenience, in FIG. 5A, the installation surface P2 is schematically shown as one surface.

The projection optical system 11 includes a laser light source 111, a collimator lens 112, a rising mirror 113, and a diffractive optical element (DOE: Diffractive Optical Element) 114. The light receiving optical system 12 includes a filter 121, an imaging lens 122, and a CMOS image sensor 123.

The laser light source 111 outputs laser light in a narrow wavelength band with a wavelength of about 830 nm. The laser light source 111 is installed so that the optical axis of the laser light is parallel to the X axis. The collimator lens 112 converts the laser light emitted from the laser light source 111 into substantially parallel light. The collimator lens 112 is installed so that its own optical axis is aligned with the optical axis of the laser light emitted from the laser light source 111. The raising mirror 113 reflects the laser beam incident from the collimator lens 112 side. The optical axis of the laser beam is bent 90 ° by the rising mirror 113 and becomes parallel to the Z axis.

The DOE 114 has a diffraction pattern on the incident surface. The diffraction pattern is composed of, for example, a step type hologram. Due to the diffractive action of this diffraction pattern, the laser light reflected by the rising mirror 113 and incident on the DOE 114 is converted into a laser light having a dot pattern and irradiated onto the target area. The diffraction pattern is designed to be a predetermined dot pattern in the target area.

As shown in FIG. 5B, when the laser light passes through the DOE 114, the laser light is diffracted by the diffraction pattern (diffracted light having a diffraction order other than 0) and is not diffracted by the diffraction pattern. Separated into secondary light. In this comparative example, since the optical axis O of the laser beam is in the Z-axis direction, the 0th-order light travels parallel to the Z-axis.

FIG. 5C is a diagram schematically showing the relationship between DMP light (dot pattern) and zero-order light D0 when a virtual plane orthogonal to the Z-axis is set in the target area. The DMP light is converted into light having a rectangular outline that spreads evenly in the vertical and horizontal directions around the optical axis of the laser light when entering the DOE 114. Innumerable dot patterns are scattered in the DMP light. The zero-order light is incident on the center of the DMP light, that is, the position of the optical axis of the laser light.

5A, the laser light reflected from the target area passes through the filter 121 and enters the imaging lens 122.

The filter 121 is a band-pass filter that transmits light in a wavelength band including the emission wavelength (about 830 nm) of the laser light source 111 and cuts other wavelength bands. When the transmission wavelength band of the filter 121 is narrowed, the filter 121 is configured by combining two bandpass filters. The imaging lens 122 condenses the light incident through the filter 121 on the CMOS image sensor 123. The imaging lens 122 includes a plurality of lenses, and an aperture and a spacer are interposed between the predetermined lenses.

The CMOS image sensor 123 receives the light collected by the imaging lens 122 and outputs a signal (charge) corresponding to the amount of received light to the imaging signal processing circuit 23 for each pixel. Here, in the CMOS image sensor 123, the output speed of the signal is increased so that the signal (charge) of the pixel can be output to the imaging signal processing circuit 23 with high response from the light reception in each pixel.

The filter 121 is disposed so that the light receiving surface is orthogonal to the Z axis. The imaging lens 122 is installed so that the optical axis is parallel to the Z axis. The CMOS image sensor 123 is installed such that the light receiving surface is perpendicular to the Z axis. The filter 121, the imaging lens 122, and the CMOS image sensor 123 are arranged so that the center of the filter 121 and the center of the light receiving region of the CMOS image sensor 123 are aligned on the optical axis of the imaging lens 122.

The projection optical system 11 and the light receiving optical system 12 are installed on the base plate 300 as described with reference to FIG. A circuit board 200 is further installed on the base plate 300, and wirings (flexible boards) 201 and 202 are connected from the circuit board 200 to the laser light source 111 and the CMOS image sensor 123. The circuit board 200 is mounted with a circuit unit of an information acquisition device such as the CPU 21 and the laser drive circuit 22 shown in FIG.

FIG. 6A schematically shows the relationship between the irradiation area E1 of the DMP light and the imaging area (light receiving area) R1 by the light receiving optical system 12 when the virtual area Pa parallel to the XY plane is set as the target area. FIG.

In this comparative example, as shown in FIG. 5C, the DMP light spreads evenly in the X-axis direction and the Y-axis direction around the 0th-order light. Therefore, as shown in FIG. 6A, the irradiation area E1 of the DMP light in the X-axis direction spreads evenly in the X-axis direction around the zeroth order light on the virtual plane Pa. On the other hand, in the light receiving optical system 12, the optical axis of the imaging lens 122 and the center of the light receiving region of the CMOS image sensor 123 coincide with each other, and the optical axis of the imaging lens 122 is parallel to the Z axis. The imaging region R1 that can be imaged by the sensor 123 extends equally in the X-axis direction and the Y-axis direction with the optical axis of the imaging lens 122 as the center. Therefore, as shown in FIG. 6A, the imaging region R1 in the X-axis direction extends evenly in the X-axis direction around the optical axis of the imaging lens 122 on the virtual plane Pa.

Here, the projection optical system 11 and the light receiving optical system 12 are separated by a predetermined distance in the X-axis direction. Therefore, as shown in FIG. 6A, on the virtual plane Pa, the irradiation region E1 and the imaging region R1 overlap only in the region A1, and the region A2 of the irradiation region E1 and the region A3 of the imaging region R1 are This is an unused area that is not used for object detection.

When the imaging region R1 is used effectively, for example, as shown in FIG. 6B, the diffraction pattern of the DOE 114 is set so that the right end (end in the positive X-axis direction) of the irradiation region E1 extends to the right end of the imaging region R1. A method of adjusting can be used. In this way, DMP light can be projected onto all the imageable areas R1 of the imaging area R1. However, in this case, the unused area A6 of the irradiation area E1 is remarkably expanded as compared with the case of FIG. 6A, and waste of DMP light irradiation occurs.

As described above, in the comparative example, the irradiation area E1 and the imaging area R1 are not effectively used, and the non-use areas A2, A3, and A6 that are not used for object detection are generated. There's a problem.

The following is an example for solving this problem. In the following examples, the basic configuration of the projection optical system 11 and the light receiving optical system 12 is the same as that of the comparative example. For this reason, in the following example, the same number as the number of the said comparative example is attached | subjected to each member.

<Example 1>
FIG. 7A is a diagram showing the configuration of this embodiment. This figure corresponds to FIG. 5A of the comparative example.

As shown in the figure, in this embodiment, the arrangement position of the collimator lens 112 is shifted downward (Z-axis negative direction) as compared with the comparative example. That is, in the comparative example, the collimator lens 112 is arranged so that the optical axis of the laser light emitted from the laser light source 111 and the optical axis of the collimator lens 112 coincide with each other, but in this embodiment, the optical axis of the laser light is aligned. On the other hand, the optical axis of the collimator lens 112 is shifted downward.

As a result, the optical axis of the laser light after passing through the collimator lens 112 is inclined from the direction parallel to the X axis to the negative direction of the Z axis, and the optical axis of the laser light reflected by the rising mirror 113 is accordingly changed. Inclined from the positive Z-axis direction to the positive X-axis direction, that is, toward the light receiving optical system 12.

FIG. 7B is a diagram schematically showing the state of the laser light after passing through the DOE 114.

When the laser light passes through the DOE 114, the laser light is separated into diffracted light diffracted by the diffraction pattern (diffracted light having a diffraction order other than 0) and zero-order light that is not diffracted by the diffraction pattern. In this embodiment, since the optical axis O of the laser beam is tilted from the Z-axis direction to the X-axis positive direction, the zero-order light travels in a direction tilted from the Z-axis direction to the X-axis positive direction. Further, the traveling direction of the diffracted light is also inclined in the positive direction of the X axis as compared with the case of FIG. That is, the DMP light generally travels in a direction inclined more in the X-axis positive direction than in the case of FIG.

FIG. 7C is a diagram schematically showing the relationship between DMP light (dot pattern) and zero-order light D0 when a virtual plane orthogonal to the Z-axis is set in the target area.

As described above, since the DMP light travels in a direction inclined more in the positive direction of the X axis than in the case of FIG. 5B, the outline of the DMP light on the virtual plane is trapezoidal as shown in FIG. Become. Innumerable dot patterns are scattered in the DMP light, and the density of the dot patterns becomes sparse as it goes in the positive direction of the X axis and becomes dense as it goes in the negative direction of the X axis. The zero-order light is incident on a position shifted in the negative X-axis direction from the center of the DMP light.

In this embodiment, as shown in FIG. 7B, the arrangement of the DOE 114 is left in a state where the incident surface of the DOE 114 is orthogonal to the Z axis, but the optical axis O of the laser beam is the incident surface of the DOE 114. The DOE 114 may be tilted so as to be perpendicular to. Further, the diffraction pattern of the DOE 114 may be adjusted so that the outline of the DMP light approaches a rectangle on the virtual plane.

FIG. 8A schematically shows the relationship between the irradiation area E1 of the DMP light and the imaging area (light receiving area) R1 by the light receiving optical system 12 when the virtual area Pa parallel to the XY plane is set as the target area. FIG.

In the present embodiment, as described above, since the projection direction of the DMP light is tilted from the Z-axis direction to the X-axis positive direction, the irradiation area E1 of the DMP light in the X-axis direction is compared with the comparative example. Overlap the 12 imaging areas. FIG. 8A shows a state in which the projection area E1 and the imaging area R1 completely overlap each other on the virtual plane Pa.

Thus, according to the present embodiment, the unused area that is not used for object detection is reduced, and the irradiation area E1 and the imaging area R1 can be effectively used for object detection, so that the object detection efficiency is increased. Can do.

In this embodiment, the position of the collimator lens 112 is shifted in the Z-axis negative direction relative to the comparative example. However, the position of the collimator lens 112 is the same as that in the comparative example, and the position of the laser light source 111 is set in the Z-axis positive direction. It may be shifted. Further, the arrangement positions of both the collimator lens 112 and the laser light source 111 may be adjusted so that the optical axis of the collimator lens 112 is shifted downward (Z-axis negative direction) from the optical axis of the laser light source 111.

The shift amount of the optical axis of the collimator lens 112 and the optical axis of the laser light source 111 is appropriately set depending on how much the irradiation area E1 shown in FIG. 8A is shifted to the imaging area R1 side.

<Example 2>
FIG. 8B is a diagram illustrating the configuration of the present embodiment. This figure corresponds to the projection optical system 11 shown in FIG. 5A of the comparative example.

As shown in the figure, in this embodiment, the installation surface P1 of the projection optical system 11 is tilted clockwise from a state perpendicular to the Z axis. The installation surface P <b> 1 is set on the upper surface of the pedestal 301 formed on the base plate 300. By tilting the installation surface P1 in this way, the entire projection optical system 11 is tilted clockwise. Thereby, the projection direction of the DMP light is also tilted clockwise.

FIG. 8C is a diagram schematically showing the state of the laser light after passing through the DOE 114.

When the laser light passes through the DOE 114, the laser light is separated into diffracted light diffracted by the diffraction pattern (diffracted light having a diffraction order other than 0) and zero-order light that is not diffracted by the diffraction pattern. In this embodiment, since the optical axis O of the laser beam is tilted from the Z-axis direction to the X-axis positive direction by tilting the entire projection optical system 11 as described above, the zero-order light is transmitted from the Z-axis direction to the X-axis. Proceed in the direction tilted in the positive direction. Further, the traveling direction of the diffracted light is also inclined in the positive direction of the X axis as compared with the case of FIG. That is, the DMP light generally travels in a direction inclined more in the X-axis positive direction than in the case of FIG.

In the present embodiment, the relationship between the irradiation region E1 on the virtual plane Pa and the imaging region R1 is the same as in the case of FIG. That is, in the present embodiment, as described above, since the projection direction of the DMP light is tilted from the Z-axis direction to the X-axis positive direction, the irradiation area E1 of the DMP light in the X-axis direction receives light compared to the comparative example. It overlaps more with the imaging region of the optical system 12.

It should be noted that the inclination angle of the installation surface P1 is appropriately set depending on how much the irradiation area E1 shown in FIG. 8A is shifted to the imaging area R1 side.

<Example 3>
FIG. 9A is a diagram illustrating the configuration of the present embodiment. This figure corresponds to the projection optical system 11 shown in FIG. 5A of the comparative example.

As shown in the figure, the arrangement state of the projection optical system 11 and the arrangement state of each member in the projection optical system 11 in the present embodiment are the same as those in the comparative example (see FIG. 5A). In this embodiment, the diffraction action of the DOE 114 is changed from the comparative example.

FIG. 9C is a diagram schematically showing the state of the laser light after passing through the DOE 114.

When the laser light passes through the DOE 114, the laser light is separated into diffracted light diffracted by the diffraction pattern (diffracted light having a diffraction order other than 0) and zero-order light that is not diffracted by the diffraction pattern. In this embodiment, the diffraction pattern of the DOE 114 is adjusted so that the traveling direction of the diffracted light is inclined in the positive direction of the X axis as compared with the comparative example. As a result, the DMP light generally travels in a direction inclined more in the positive direction of the X axis than in the case of FIG. The zero-order light travels in the Z-axis direction along the optical axis of the laser light.

FIG. 9C schematically shows the relationship between the irradiation area E1 of the DMP light and the imaging area (light receiving area) R1 by the light receiving optical system 12 when a virtual plane Pa parallel to the XY plane is set as the target area. FIG.

In the present embodiment, as described above, since the projection direction of the DMP light is tilted from the Z-axis direction to the X-axis positive direction, the irradiation area E1 of the DMP light in the X-axis direction is compared with the comparative example. Overlap the 12 imaging areas. In this embodiment, since the 0th order light travels along the optical axis of the laser light, the 0th order light is projected to a position in front of the projection optical system 11 on the virtual area Pa.

In this embodiment, the diffraction pattern of the DOE 114 is adjusted so that the traveling direction of the diffracted light is inclined in the positive direction of the X axis as compared with the comparative example, but regardless of the comparative example, FIG. The diffraction pattern of the DOE 114 may be set so that dots are dispersed at a substantially uniform density in the irradiation area E1.

<Example 4>
FIG. 10A is a diagram showing the configuration of this embodiment. This figure corresponds to FIG. 5A of the comparative example.

As shown in the figure, in this embodiment, the arrangement position of the imaging lens 122 is shifted in the left direction (X-axis negative direction) as compared with the comparative example. That is, in the comparative example, the imaging lens 122 is disposed so that the optical axis of the imaging lens 122 coincides with the center of the light receiving region of the CMOS image sensor 123. However, in this embodiment, the optical axis of the imaging lens 122 is the CMOS image. The sensor 123 is shifted leftward from the center of the light receiving area.

As a result, as shown in FIG. 10B, the light capturing direction of the CMOS image sensor 123 via the imaging lens 122 is tilted in the negative X-axis direction, and accordingly, the imaging region R1 of the light receiving optical system 12 is Compared to the case of the comparative example, the X-axis negative direction, that is, the direction of the projection optical system 11 is shifted.

FIG. 10C schematically shows the relationship between the irradiation area E1 of the DMP light and the imaging area (light receiving area) R1 by the light receiving optical system 12 when a virtual plane Pa parallel to the XY plane is set as the target area. FIG.

In the present embodiment, as described above, the imaging region of the light receiving optical system 12 is shifted in the negative direction of the X axis. Therefore, compared to the comparative example, the irradiation region E1 of the DMP light in the X axis direction and the light receiving optical system 12 More overlap with the imaging area. FIG. 10C shows a state in which the projection area E1 and the imaging area R1 are completely overlapped on the virtual plane Pa.

In this embodiment, the position of the imaging lens 122 is shifted in the X-axis negative direction with respect to the comparative example. However, the position of the imaging lens 122 is the same as that in the comparative example, and the position of the CMOS image sensor 123 is set in the X-axis positive direction. It may be shifted to. Further, even if the arrangement positions of both the imaging lens 122 and the CMOS image sensor 123 are adjusted so that the optical axis of the imaging lens 122 is shifted leftward (X-axis negative direction) from the center of the light receiving region of the CMOS image sensor 123. good.

The shift amount between the optical axis of the imaging lens 122 and the center of the light receiving region of the CMOS image sensor 123 is appropriately set depending on how much the imaging region R1 shown in FIG. 10C is shifted to the irradiation region E1 side.

<Example 5>
FIG. 11A is a diagram illustrating the configuration of the present embodiment. This figure corresponds to FIG. 5A of the comparative example.

As shown in the figure, in this embodiment, the installation surface P2 of the light receiving optical system 12 is tilted counterclockwise from a state perpendicular to the Z axis. The installation surface P <b> 2 is set on the upper surface of the pedestal 302 formed on the base plate 300. By tilting the installation surface P2 in this way, the entire light receiving optical system 12 is tilted counterclockwise. Thereby, the imaging direction of the light receiving optical system 12 is also tilted counterclockwise.

FIG. 11B schematically shows the relationship between the irradiation area E1 of the DMP light and the imaging area (light receiving area) R1 by the light receiving optical system 12 when a virtual plane Pa parallel to the XY plane is set as the target area. FIG.

In the present embodiment, as described above, since the imaging direction of the light receiving optical system 12 is tilted from the Z-axis direction to the X-axis negative direction, compared with the comparative example, the irradiation area E1 of the DMP light in the X-axis direction, The imaging area of the light receiving optical system 12 overlaps more. Therefore, according to the present embodiment, the unused area that is not used for object detection is reduced, and the irradiation area E1 and the imaging area R1 can be effectively used for object detection, so that the object detection efficiency can be increased. .

The tilt angle of the light receiving optical system 12 is appropriately set depending on how much the imaging region R1 shown in FIG. 11B is shifted to the irradiation region E1 side.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and the embodiments of the present invention can be variously modified in addition to the above.

For example, in the above embodiment, the CMOS image sensor 123 is used as the light receiving element, but a CCD image sensor may be used instead. In the above embodiment, the laser light source 111 and the collimator lens 112 are arranged in the X-axis direction, and the optical axis of the laser light is bent in the Z-axis direction by the rising mirror 113, but the laser light is emitted in the Z-axis direction. The laser light source 111 may be arranged so that the laser light source 111, the collimator lens 112, and the DOE 114 are arranged in the Z-axis direction. In this case, the rising mirror 113 can be omitted, but the dimension of the projection optical system 11 increases in the Z-axis direction. Furthermore, the configuration of the light receiving optical system 12 can be changed as appropriate.

In addition, although various embodiments have been described as described above, these can be implemented in combination as appropriate.

The embodiment of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the claims.

DESCRIPTION OF SYMBOLS 1 Information acquisition apparatus 2 Information processing apparatus 11 Projection optical system 12 Light reception optical system 111 Laser light source 112 Collimator lens 114 DOE (diffractive optical element)
122 imaging lens 123 CMOS image sensor 301 pedestal (projection displacement means)
302 Base (light receiving displacement means)
P1, P1 installation surface

Claims

In an information acquisition device that acquires information on a target area using light,
A projection optical system that projects light of a predetermined dot pattern onto the target area;
A light receiving optical system that is arranged so as to be laterally separated by a predetermined distance with respect to the projection optical system, and that images the target area;
A projection displacement means for displacing the projection area of the light by the projection optical system from the front of the projection optical system to the light receiving optical system side,
An information acquisition apparatus characterized by that.
The information acquisition device according to claim 1,
The projection optical system includes a laser light source and a collimator lens that converts laser light emitted from the laser light source into parallel light,
The projection displacement means includes a configuration in which the optical axis of the laser light source and the collimator lens are arranged so that the optical axis of the laser light source and the optical axis of the collimator lens are shifted from each other.
An information acquisition apparatus characterized by that.
The information acquisition device according to claim 1,
The projection displacement means includes a configuration in which an installation surface of the projection optical system is tilted from a state parallel to the installation surface of the light receiving optical system to the light receiving optical system side,
An information acquisition apparatus characterized by that.
The information acquisition device according to claim 1,
The projection optical system includes a laser light source, a collimator lens that converts the laser light emitted from the laser light source into parallel light, and the laser light converted into parallel light by the collimator lens into a dot pattern light by diffraction. A diffractive optical element for conversion,
The projection displacement means includes a configuration for adjusting a diffraction action by the diffractive optical element,
An information acquisition apparatus characterized by that.
In an information acquisition device that acquires information on a target area using light,
A projection optical system that projects light of a predetermined dot pattern onto the target area;
A light receiving optical system that is disposed at a predetermined distance from the projection optical system in a direction parallel to the installation surface of the projection optical system, and that captures the target area;
A light receiving displacement means for displacing the imaging region by the light receiving optical system from the front of the light receiving optical system toward the projection optical system,
An information acquisition apparatus characterized by that.
The information acquisition device according to claim 5,
The light receiving optical system includes an imaging device and a condenser lens that collects light from the target area onto the imaging device,
The light receiving displacement means includes a configuration in which the condenser lens and the imaging element are arranged so that the optical axis of the condenser lens is shifted from the center of the light receiving region of the imaging element to the projection optical system side.
An information acquisition apparatus characterized by that.
The information acquisition device according to claim 5,
The projection displacement means includes a configuration in which an installation surface of the light receiving optical system is tilted toward the projection optical system from a state parallel to the installation surface of the projection optical system.
An information acquisition apparatus characterized by that.
An object detection device having the information acquisition device according to any one of claims 1 to 7.