WO2012115001A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2012115001A1
WO2012115001A1 PCT/JP2012/053801 JP2012053801W WO2012115001A1 WO 2012115001 A1 WO2012115001 A1 WO 2012115001A1 JP 2012053801 W JP2012053801 W JP 2012053801W WO 2012115001 A1 WO2012115001 A1 WO 2012115001A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal portion
side terminal
output
power supply
driver
Prior art date
Application number
PCT/JP2012/053801
Other languages
French (fr)
Japanese (ja)
Inventor
裕喜 中濱
塩田　素二
元 長岡
誠 玉木
圭司 青田
清水　行男
松井　隆司
弘規 宮崎
盛司 村岡
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012115001A1 publication Critical patent/WO2012115001A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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Definitions

  • the present invention relates to a display device.
  • Display devices having a display panel such as a liquid crystal panel are used for portable information terminal devices such as mobile phones, smartphones, PDAs, and electronic devices such as computers.
  • a display device includes a display panel having a display unit for displaying an image, and an LSI for driving the display panel by supplying an output signal generated by processing an input signal supplied from a signal supply source to the display unit.
  • a COG (Chip On Glass) mounting technique that directly mounts an LSI in an area outside the display portion of the display panel is used as an LSI mounting method. Is preferred.
  • COG Chip On Glass
  • the present invention has been completed based on the above situation, and an object thereof is to suitably cope with the miniaturization of the terminal portion.
  • the display device of the present invention operates based on a display panel having a display unit capable of displaying an image, drive power and a reference potential supplied from a power source, and receives an input signal supplied from a signal supply source.
  • a drive circuit unit that drives the display panel by outputting an output signal generated by processing to the display unit and a pair formed on the power supply side and the drive circuit unit side are provided directly or mutually.
  • a power supply terminal portion that can supply the driving power by being indirectly contacted, and a pair of the power supply side and the drive circuit portion side are provided and directly or indirectly contact each other By providing a ground terminal part capable of supplying the reference potential, a pair of the signal supply source side and the drive circuit part side, and directly or indirectly contacting each other.
  • the input side terminal portion, the drive circuit portion side and the display portion side are provided in a paired form, and each of them forms a coil shape and is inductively coupled to each other so that the output signal can be transmitted.
  • Output side terminal portion is provided.
  • the input signal supplied from the signal supply source is transmitted to the drive circuit unit by the input side terminal unit and input.
  • the drive circuit unit processes the input signal based on the drive power supplied from the power source and the reference potential to generate and output an output signal.
  • the output signal is transmitted to the display unit of the display panel by the output side terminal unit. Thereby, the display panel is driven and an image is displayed on the display unit.
  • the output side terminal unit tends to handle more signals when the image displayed on the display unit has a higher resolution.
  • the miniaturization of is more strongly required.
  • problems such as a short circuit and a decrease in insulation may occur when the pair of output side terminal portions are brought into contact with each other via an anisotropic conductive agent as in the past. If the particle size of the conductive particles contained in the anisotropic conductive agent is reduced to cope with this, there is a concern that the connection reliability deteriorates.
  • the output side terminal portions are each formed in a coil shape and inductively coupled to each other, the output signal can be transmitted.
  • the output side terminal portions according to the present invention form a pair of coils, when forming the output side terminal portions, for example, a wiring formation process such as a semiconductor can be used. Miniaturization can be easily achieved. Furthermore, since the output terminal is capable of transmitting the output signal by inductively coupling the paired output terminals, the transmitted output signal is less susceptible to parasitic capacitance and the like, Therefore, it is suitable for increasing the transmission speed of the output signal, and further suitable for reducing power consumption and reducing manufacturing costs.
  • the input side terminal part handles a relatively small number of signals even if the resolution of the image is increased. Even in a connection structure that enables transmission of an input signal by contacting the terminal, a signal transmission function can be appropriately exhibited without causing a problem such as a short circuit. Furthermore, since the power supply terminal portion and the ground terminal portion are capable of supplying drive power and reference potential by directly or indirectly contacting each other in pairs, the power supply terminal The drive power of a voltage value much larger than that of each signal can be reliably supplied to the section, and the reference potential can be stably supplied to the ground terminal section.
  • connection structure is different between the input terminal portion, the power terminal portion, and the ground terminal portion as described above, the connection
  • the connection structure of each terminal part is made common as described above, the above-described restriction does not occur, and each terminal part can be laid out freely.
  • the input side terminal unit is configured to transmit signals by inductive coupling, it may be necessary to newly install an input transmission circuit and an input reception circuit. According to that, it is not necessary. Further, the process for forming the power supply terminal portion, the ground terminal portion, and the input side terminal portion and the steps related to the connection can be made common, which is suitable for reducing the manufacturing cost.
  • the output side terminal portions are arranged so that a pair of the terminal portions are opposed to each other.
  • the distance between the output side terminal portions that are paired by the thickness of the drive circuit portion is larger than that in the case where the drive circuit portion is disposed between the pair of output side terminal portions. Since it can be shortened, it is more suitable for increasing the transmission speed of the output signal transmitted and received.
  • the input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged so that each pair of the input side terminal portion, the power supply terminal portion, and the ground terminal portion are opposed to each other. If it does in this way, what makes the pair in an input side terminal part, a power supply terminal part, and a ground terminal part can each be connected easily directly or indirectly.
  • the input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged on the outer edge side of the drive circuit portion. In this way, for example, even when pressure is required to connect the input side terminal portion, the power supply terminal portion, and the ground terminal portion, it is possible to avoid stress from acting on the center side of the drive circuit portion. Thereby, it becomes suitable when forming a circuit in the center side in a drive circuit part.
  • the input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged along at least the outer edge of the drive circuit portion opposite to the display portion side, whereas the output side The side terminal portion is arranged along at least the outer edge of the drive circuit portion on the display portion side.
  • the input side terminal part, the power supply terminal part, and the ground terminal part are not arranged on the outer edge of the display part side in the drive circuit part, the wiring connecting the output side terminal part and the display part is provided. This is suitable for designing.
  • the output side terminal portion includes a portion disposed relatively closer to the center of the drive circuit portion than the input side terminal portion, the power supply terminal portion, and the ground terminal portion. If it does in this way, when the output side terminal part connects what makes a pair, it does not necessarily require pressurization. Therefore, even when this output side terminal portion is arranged near the center of the drive circuit portion, it is possible to avoid the stress from acting on the center side of the drive circuit portion and adversely affect the circuit formed there. Can also be avoided. As a result, the space on the center side in the drive circuit unit can be used effectively, and even when the number of output side terminal units is increased as the resolution of an image increases, it can be easily handled. .
  • a plurality of the output side terminal portions are arranged in parallel in a lattice shape when seen in a plan view. If it does in this way, an output side terminal part can be arranged efficiently and it becomes still more suitable for miniaturization.
  • a plurality of the output side terminal portions are arranged in parallel in a staggered manner as viewed in a plane. In this way, the output side terminal portions can be arranged at a higher density than when arranged in parallel in a grid, for example.
  • the input side terminal portion, the power supply terminal portion, and the ground terminal portion are fixed in contact with each other by the same adhesive material. In this way, by using the same adhesive material, the input side terminal portion, the power supply terminal portion, and the ground terminal portion can be connected together, which is more suitable for reducing the manufacturing cost. .
  • the adhesive material is an anisotropic conductive agent. If it does in this way, what makes a pair in an input side terminal part, a power supply terminal part, and a ground terminal part will contact indirectly via an anisotropic conductive agent.
  • the particle size of the conductive particles contained in the anisotropic conductive agent can be set to an appropriate size regardless of the terminal width and arrangement pitch in the output side terminal portion, so that high connection reliability is achieved. Obtainable.
  • the output side terminal portions are fixed together by the same adhesive material as the input side terminal portion, the power supply terminal portion, and the ground terminal portion. In this way, it is possible to collectively connect the output side terminal portion in addition to the input side terminal portion, the power supply terminal portion, and the ground terminal portion, which is more preferable for reducing the manufacturing cost. Become. Even when an anisotropic conductive agent is used as the adhesive material, the output side terminal portion is capable of transmitting an output signal by inductive coupling. It is extremely unlikely that a short circuit will occur.
  • the adhesive material is disposed in a range extending over the respective arrangement regions of the input side terminal portion, the output side terminal portion, the power supply terminal portion, and the ground terminal portion. In this way, it is possible to shorten the tact time when the adhesive material is arranged, as compared with the case where the adhesive material is divided and arranged for each arrangement region.
  • the input side terminal portion, the power supply terminal portion, and the ground terminal portion are provided with solder bumps that melt by heating. If it does in this way, since an input side terminal part, a power terminal part, and a ground terminal part are joined by melting a solder bump by heating, connection reliability can be raised. In particular, the driving power can be supplied more reliably by the power terminal portion, and the reference potential can be supplied more stably by the ground terminal portion.
  • a spacer for regulating a distance between the pair of output side terminal portions is provided. In this way, since the distance between the output side terminal portions that are paired by the spacer is kept constant, the transmission speed of the transmitted output signal can be stabilized.
  • At least one pair of the spacers is disposed at a position sandwiching the arrangement region of the output side terminal portion in a plan view. In this way, the distance between the pair of output side terminal portions can be more reliably kept constant.
  • the spacer is also arranged on the center side in the arrangement region of the output side terminal portion in a plan view. In this way, even when the drive circuit unit is large or thin, the pair of spacers arranged at the positions sandwiching the arrangement region of the output side terminal unit, the spacer on the center side of the arrangement region, Thus, the deformation of the drive circuit section can be suitably restricted, and the distance between the pair of output side terminal sections can be kept constant.
  • At least one of the paired output side terminal portions is covered with an insulating layer. If it does in this way, it can prevent that the output side terminal parts which make a pair are short-circuited. In addition, since the situation covered with the insulating layer is prevented from being damaged by the interference of foreign substances in the manufacturing process, the operation reliability is high.
  • Both the output side terminal portions forming a pair are covered with the insulating layer. If it does in this way, it can prevent that the output side terminal parts which make a pair are short-circuited. Since both the output side terminal portions forming a pair are prevented from being damaged due to interference of foreign matter or the like in the manufacturing process, the operation reliability is further improved.
  • the drive circuit unit is mounted on the display panel, and the input side terminal unit, the output side terminal unit, the power supply terminal unit, and the ground terminal unit include the display panel, the drive circuit unit, and the like. Are provided in pairs. In this way, the input signal, the driving power and the reference potential are supplied from the signal supply source side and the power supply side to the input side terminal portion, the power supply terminal portion and the ground terminal portion on the display panel side, and then the drive circuit portion side.
  • the drive circuit unit is operated by being transmitted to the input side terminal unit, the power supply terminal unit, and the ground terminal unit.
  • the output signal generated in the drive circuit unit is transmitted from the output side terminal unit on the drive circuit unit side to the output side terminal unit on the display panel side, and then output to the display unit.
  • the drive circuit section is directly mounted on the display panel, it is suitable for performing so-called COG (Chip On Glass) mounting.
  • COG Chip On Glass
  • the input side terminal portion is configured to transmit signals by directly or indirectly contacting a pair of terminals, the input side terminal portion is inductively coupled in the same manner as the output side terminal portion. Therefore, it may be necessary to newly provide a transmission circuit for input on the display panel and a reception circuit for input on the drive circuit unit. Then, the transmission circuit for input on the display panel may be required.
  • COG Chip On Glass
  • a flexible substrate is provided, one end of which is connected to the signal supply source side and the power supply side, while the other end is connected to the display panel, and the drive circuit unit is mounted on the flexible substrate.
  • the input side terminal portion, the output side terminal portion, the power supply terminal portion, and the ground terminal portion are provided in pairs in the drive circuit portion and the flexible substrate, respectively.
  • the input signal, the driving power, and the reference potential are transmitted from the signal supply source side and the power supply side to the drive circuit unit through the flexible substrate by the input side terminal unit, the power supply terminal unit, and the ground terminal unit.
  • This activates the drive circuit unit.
  • the output signal generated in the drive circuit unit is transmitted to the flexible substrate by the output side terminal unit, then supplied to the display panel, and output to the display unit. Since the drive circuit section is mounted on the flexible substrate as described above, it is suitable for performing so-called COF (Chip On On Film) mounting.
  • the display panel is a liquid crystal panel in which liquid crystal is sealed between a pair of substrates. In this way, it can be applied to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
  • An illuminating device that is opposed to the liquid crystal panel and is disposed on a side opposite to the display side and capable of supplying light to the liquid crystal panel is provided. If it does in this way, an image can be displayed on the display part of a liquid crystal panel using the light supplied from an illuminating device. Thereby, the brightness
  • FIG. 1 is a schematic plan view showing a connection configuration of a liquid crystal panel, a flexible board, and a control circuit board on which a driver according to Embodiment 1 of the present invention is mounted.
  • Sectional drawing which shows the cross-sectional structure along the long side direction of a liquid crystal display device Enlarged plan view showing the planar configuration of the array substrate constituting the liquid crystal panel
  • the enlarged plan view which shows the mounting area of the driver and flexible substrate in the array substrate which comprises a liquid crystal panel
  • V-v sectional view of FIG. Vi-vi cross-sectional view of FIG.
  • Schematic perspective view for explaining the principle and circuit configuration of signal transmission by the output side terminal section
  • Block diagram for explaining transmission paths of drive power, reference potential, input signal and output signal FIG.
  • FIG. 4 is an enlarged plan view showing a driver mounting area on an array substrate according to a first modification of the first embodiment.
  • FIG. 6 is an enlarged plan view showing a driver mounting area on an array substrate according to a second modification of the first embodiment.
  • FIG. 6 is an enlarged plan view showing a driver mounting area on an array substrate according to a third modification of the first embodiment.
  • FIG. 6 is an enlarged plan view showing a driver mounting area on an array substrate according to a fourth modification of the first embodiment.
  • the enlarged plan view which shows the mounting area
  • Sectional drawing which shows the cross-sectional structure of the output side terminal part which concerns on Embodiment 3 of this invention.
  • Schematic top view which shows the connection structure of the flexible substrate which mounted the liquid crystal panel and driver which concern on Embodiment 4 of this invention, and a control circuit board Sectional drawing which shows the cross-sectional structure of a power supply terminal part, a ground terminal part, and an input side terminal part
  • Sectional drawing which shows the cross-sectional structure of the output side terminal part
  • Sectional drawing which shows the cross-sectional structure of the power supply terminal part which concerns on Embodiment 5 of this invention, a ground terminal part, and an input side terminal part
  • Sectional view showing the sectional structure of the spacer FIG.
  • FIG. 10 is a block diagram for explaining a transmission path for driving power and reference potential for a gate driving unit and an output signal according to a sixth embodiment of the present invention; Enlarged plan view showing the mounting area of the driver on the array board Xxiii-xxiii sectional view of FIG. Sectional drawing which shows the cross-sectional structure of the output side terminal part which concerns on other embodiment (1) of this invention.
  • FIGS. 1 A first embodiment of the present invention will be described with reference to FIGS.
  • the liquid crystal display device 10 is illustrated.
  • a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing.
  • FIG. 2 and the like are used as a reference, and the upper side of the figure is the front side and the lower side of the figure is the back side.
  • the liquid crystal display device 10 includes a liquid crystal panel (display panel, display element) 11 having a display unit AA capable of displaying an image, and a driver (drive circuit unit) that drives the liquid crystal panel 11. 21, electrically connecting a control circuit board (power source, signal supply source) 12 that supplies driving power, a reference potential, and an input signal related to an image to the driver 21, and the liquid crystal panel 11 and the control circuit board 12.
  • a flexible substrate (connection component) 13 and a backlight device (illumination device) 14 that is an external light source that supplies light to the liquid crystal panel 11 are provided.
  • the liquid crystal display device 10 also includes a pair of front and back exterior members 15 and 16 for housing and holding the liquid crystal panel 11 and the backlight device 14 assembled to each other.
  • the liquid crystal display device 10 includes various electronic devices such as portable information terminals (including electronic books and PDAs), mobile phones (including smartphones), notebook computers, digital photo frames, and portable game machines. (Not shown).
  • the screen size of the liquid crystal panel 11 constituting the liquid crystal display device 10 is about several inches to several tens of inches, such as 3.4 inches, and is generally a size classified as small or medium-sized. ing.
  • the backlight device 14 includes a chassis 14a having a substantially box shape that opens toward the front side (the liquid crystal panel 11 side), and a light source (not shown) such as a cold cathode tube or the like disposed in the chassis 14a. LED, etc.) and an optical member (not shown) arranged to cover the opening of the chassis 14a.
  • the optical member has a function of converting light emitted from the light source into a planar shape.
  • the liquid crystal panel 11 has a vertically long rectangular shape (rectangular shape) as a whole, and is displayed at a position offset toward one end side (the upper side shown in FIG. 1) in the long side direction.
  • a portion (active area) AA is arranged, and a driver 21 and a flexible substrate 13 are mounted at positions offset from the other end (lower side shown in FIG. 1).
  • an area outside the display portion AA is a non-display portion (non-active area) NAA
  • the non-display portion NAA is a frame-like region (a frame portion in a CF substrate 11a described later) surrounding the display portion AA.
  • the long side direction in the liquid crystal panel 11 coincides with the Y-axis direction, and the short side direction coincides with the X-axis direction.
  • the liquid crystal panel 11 is interposed between a pair of transparent (translucent) glass substrates 11 a and 11 b and both the substrates 11 a and 11 b, and has an optical characteristic as the electric field is applied. And a liquid crystal layer (not shown) containing liquid crystal molecules which are changing substances, and both substrates 11a and 11b are bonded together by a sealing agent (not shown) while maintaining a gap corresponding to the thickness of the liquid crystal layer.
  • the front side front side
  • the back side is the array substrate 11b.
  • the CF substrate 11a has a longer side dimension smaller than that of the array substrate 11b as shown in FIGS.
  • the configuration existing in the display unit AA in the array substrate 11b and the CF substrate 11a will be sequentially described in detail.
  • a large number of TFTs (Thin Film Transistors) 17 and pixel electrodes 18 which are switching elements are arranged on the inner surface side of the array substrate 11b (the liquid crystal layer side, the surface facing the CF substrate 11a).
  • a gate wiring 19 and a source wiring 20 having a lattice shape are disposed so as to surround the TFT 17 and the pixel electrode 18.
  • the gate wiring 19 and the source wiring 20 are connected to the gate electrode and the source electrode of the TFT 17, respectively, and the pixel electrode 18 is connected to the drain electrode of the TFT 17. Further, the pixel electrode 18 has a vertically long rectangular shape (rectangular shape) when seen in a plan view, and is made of a transparent electrode material such as ITO (Indium Tin Oxide) or ZnO (Zinc Oxide). On the other hand, many colored portions such as R (red), G (green), and B (blue) are arranged in parallel on the CF substrate 11a so as to overlap each pixel electrode 18 on the array substrate 11b side in a plan view. Arranged color filters (not shown) are provided.
  • a light shielding layer (black matrix: not shown) for preventing color mixture is formed between the colored portions constituting the color filter.
  • a solid counter electrode (not shown) facing the pixel electrode 18 on the array substrate 11b side is provided on the surface of the color filter and the light shielding layer.
  • control circuit board 12 is attached to the rear surface of the chassis 14a (the outer surface opposite to the liquid crystal panel 11 side) of the backlight device 14 with screws or the like.
  • the control circuit board 12 is a paper phenol or glass epoxy resin board, a power supply part that supplies driving power and a reference potential to the driver 21, and an electronic part that controls transmission of an input signal relating to an image to the liquid crystal panel 11.
  • Control circuit is mounted, and wiring (conductive path) having a predetermined pattern (not shown) is routed.
  • One end (one end side) of the flexible substrate 13 is electrically and mechanically connected to the control circuit board 12 via an ACF (Anisotropic Conductive Film) (not shown).
  • the flexible substrate (FPC substrate) 13 includes a base material made of a synthetic resin material (for example, polyimide resin) having insulating properties and flexibility, and a large number of wirings are provided on the base material. It has a pattern (not shown), and one end is connected to the control circuit board 12 arranged on the back side of the chassis 14a as described above, whereas the other end (the other end) ) Is connected to the array substrate 11 b in the liquid crystal panel 11, the cross-sectional shape is bent so as to be a substantially channel type in the liquid crystal display device 10.
  • a synthetic resin material for example, polyimide resin
  • the wiring pattern is exposed to the outside to form terminal portions (not shown), and these terminal portions are electrically connected to the control circuit substrate 12 and the array substrate 11b, respectively. It is connected. Accordingly, it is possible to transmit the driving power, the reference potential, and the input signal related to the image supplied from the control circuit board 12 side to the liquid crystal panel 11 side.
  • the driver 21 is composed of an LSI chip having a drive circuit 21a therein, and operates based on drive power and a reference potential supplied from the control circuit board 12 as a power source.
  • An input signal related to an image supplied from the control circuit board 12 that is a signal supply source is processed to generate an output signal, and the output signal is output to the display unit AA of the liquid crystal panel 11.
  • the driver 21 has a horizontally long rectangular shape when seen in a plan view, and is directly mounted on the array substrate 11b of the liquid crystal panel 11, that is, COG (Chip On Glass).
  • the long side direction of the driver 21 coincides with the X-axis direction, and the short side direction coincides with the Y-axis direction.
  • the driver 21 is COG mounted on the non-overlapping portion of the array substrate 11 b that does not overlap with the CF substrate 11 a, and the end of the flexible substrate 13 is connected to a position adjacent to the driver 21.
  • the end of the flexible substrate 13 is connected to the end edge of the array substrate 11b opposite to the display unit AA in the long side direction, whereas the driver 21 is connected to the flexible substrate connected to the array substrate 11b. It is mounted at a position between the end portion of the substrate 13 and the display portion AA. In the mounting area of the flexible substrate 13 on the array substrate 11b, as shown in FIG.
  • a drive power supply terminal unit 22 that receives supply of drive power, a reference potential, and an input signal from the flexible substrate 13 side, a reference potential supply terminal A portion 23 and a signal supply terminal portion 24 are formed.
  • the mounting area of the driver 21 on the array substrate 11b and the driver 21 include a power terminal 25, a ground terminal 26, and an input terminal 27 for transmitting drive power, reference potential, input signal, and output signal.
  • the output side terminal portions 28 are formed in pairs.
  • the drive power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 will be described in detail. As shown in FIG. 4, the drive power supply terminal portion 22, the reference potential supply terminal portion 23, and the signal supply terminal portion 24 are all made of the same metal material as that of the gate wiring 19 or the source wiring 20, and the surface thereof is the pixel electrode 18. Is coated with a transparent electrode material such as ITO or ZnO, and is patterned on the array substrate 11b at the same time by a known photolithography method when patterning the gate wiring 19 or the source wiring 20 or the pixel electrode 18 in the manufacturing process. ing.
  • a transparent electrode material such as ITO or ZnO
  • the drive power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 are arranged in parallel at substantially equal intervals along the side (short side direction, X-axis direction) of the edge portion of the installed array substrate 11b. It is arranged. Of these, a plurality of signal supply terminal portions 24 are provided.
  • the drive power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 are connected to an end of the flexible substrate 13 opposite to the control circuit substrate 12 side through an ACF (anisotropic conductive agent) 29. It is electrically and mechanically connected to each corresponding terminal part (not shown) formed in the part. As a result, the drive power supply terminal unit 22 can receive drive power from the flexible substrate 13 as shown in FIG.
  • the reference potential supply terminal unit 23 can supply the reference potential from the flexible substrate 13.
  • the signal supply terminal unit 24 can receive an input signal related to an image from the flexible substrate 13.
  • the transmission path of the input signal and output signal related to the image is indicated by an arrow line arranged at the left end
  • the transmission path of the driving power is indicated by an arrow line arranged in the center
  • the transmission path of the reference potential is shown. Is indicated by an arrow line at the right end.
  • the power terminal 25, the ground terminal 26, the input terminal 27, and the output terminal 28 will be described in detail.
  • the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are mounted on the array substrate 11b and on the supply terminal portions 22 to 24 side of the driver 21, that is, on the supply terminal portions 22 to 24 side.
  • the output side terminal portion 28 is disposed on the opposite side to the display portion AA side
  • the output side terminal portion 28 is opposite to the mounting region of the driver 21 on the array substrate 11b and the supply terminal portions 22 to 24 side of the driver 21. Is arranged on the display unit AA side.
  • each of the terminal portions 25 to 28 has a so-called peripheral arrangement located at the outer peripheral edge portion of the driver 21.
  • the power supply terminal unit 25, the ground terminal unit 26, the input side terminal unit 27, and the output side terminal unit 28 are arranged in pairs on the array substrate 11b side and the driver 21 side, and corresponding ones are arranged.
  • the drive power, the reference potential, and the input signal are transferred from the array substrate 11b (drive control substrate 12 that is a power source and a signal supply source) to the driver 21 side, and the output signal is transferred from the driver 21 side to the array substrate.
  • 11b display section AA
  • the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are arranged in parallel at substantially equal intervals along the long side direction (X-axis direction) of the driver 21. In the mounting area, it is located on the outer edge portion on the opposite side to the display portion AA side. Among these, a plurality of input side terminal portions 27 are provided. Note that the width dimension and the arrangement pitch of the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are all larger than those of the output side terminal portion 28.
  • the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are respectively a first power supply terminal portion 25a, a first ground terminal portion 26a, and a first input side terminal formed in the mounting area of the driver 21 on the array substrate 11b. And a second power terminal portion 25b, a second ground terminal portion 26b, and a second input terminal portion 27b formed in the driver 21.
  • the first power supply terminal portion 25a, the first ground terminal portion 26a, and the first input side terminal portion 27a formed on the array substrate 11b side are each supplied as described above as shown in FIGS.
  • the gate wiring 19 or the source wiring 20 is made of the same metal material, and the surface thereof is covered with the same transparent electrode material such as ITO or ZnO as the pixel electrode 18.
  • the gate wiring 19 Alternatively, the source wiring 20 and the pixel electrode 18 are patterned on the array substrate 11b at the same time by a known photolithography method when patterning.
  • the first power terminal 25a corresponds to the drive power supply terminal 22
  • the first ground terminal 26a corresponds to the reference potential supply terminal 23
  • the first input terminal 27a corresponds to the signal supply terminal 24.
  • the relay wiring has the same configuration as each of the terminal portions 22 to 24 and 25a to 27a except that the covering with the transparent electrode material is removed. Made of the same metallic material.
  • the second power terminal portion 25b, the second ground terminal portion 26b, and the second input side terminal portion 27b are respectively formed on the bottom surface of the driver 21, that is, the surface facing the array substrate 11b, as shown in FIG. ing. Therefore, the driver 21 is mounted face down on the array substrate 11b.
  • the second power supply terminal portion 25b, the second ground terminal portion 26b, and the second input side terminal portion 27b are made of a metal film excellent in conductivity such as gold and have a bump shape protruding from the bottom surface of the driver 21,
  • the projecting dimensions are relatively larger than the projecting dimensions of the first power supply terminal portion 25a, the first ground terminal portion 26a, and the first input side terminal portion 27a from the array substrate 11b.
  • the wiring in the driver 21 excluding the terminal portions 25b to 27b is made of a material such as copper or aluminum.
  • the first power terminal portion 25a and the second power terminal portion 25b, the first ground terminal portion 26a and the second ground terminal portion 26b, the first input side terminal portion 27a, and the second input side terminal portion, respectively, are paired.
  • 27b is electrically and mechanically connected through an ACF (anisotropic conductive agent) 30 in a state of being opposed to each other.
  • the ACF 30 is obtained by dispersing and blending conductive particles 30a in an adhesive material made of a thermosetting resin, and the conductive particles 30a contained are conductive on the peripheral surface of synthetic resin beads (plastic beads).
  • the film is coated and has elasticity.
  • the ground terminal portion 26b, the first input side terminal portion 27a, and the second input side terminal portion 27b are indirectly contacted via the conductive particles 30a to achieve electrical connection and the adhesive material is cured.
  • the outer diameter of the conductive particles 30a is, for example, about 3 ⁇ m to 5 ⁇ m.
  • a plurality of output side terminal portions 28 are arranged in parallel at substantially equal intervals along the long side direction (X-axis direction) of the driver 21, and the driver 21 and its mounting area on the display unit AA side. It is located at the outer edge of the.
  • the number of the output side terminal portions 28 installed is relatively larger than that of the input side terminal portion 27, and tends to increase as the resolution of the image displayed on the display portion AA increases.
  • the output side terminal portion 28 includes a first output side terminal portion 28a formed in the driver 21 and a second output side terminal portion 28b formed in the mounting area of the driver 21 on the array substrate 11b. Among these, as shown in FIGS.
  • the second output side terminal portion 28b formed on the array substrate 11b side has the supply terminal portions 22 to 24, the first power supply terminal portion 25a, Similar to the first ground terminal portion 26a and the first input side terminal portion 27a, the gate wiring 19 or the source wiring 20 is made of the same metal material and the surface thereof is covered with the same transparent electrode material such as ITO or ZnO as the pixel electrode 18.
  • the gate wiring 19 or the source wiring 20 and the pixel electrode 18 are patterned in the manufacturing process, they are simultaneously patterned on the array substrate 11b by a known photolithography method.
  • the second output side terminal portion 28b is connected with a routing wiring portion (not shown) routed from the gate wiring 19 and the source wiring 20 arranged in the display portion AA, thereby the second output.
  • the output signal transmitted to the side terminal portion 28b can be supplied to the TFT 17 via the gate wiring 19 and the source wiring 20 of the display portion AA.
  • the output signal includes a scanning signal supplied to the gate wiring 19 and a data signal supplied to the source wiring 20.
  • the first output-side terminal portion 28a is made of a metal material and the driver 21 like the second power supply terminal portion 25b, the second ground terminal portion 26b, and the second input-side terminal portion 27b. Are formed on the bottom surface, that is, the surface facing the array substrate 11b. Therefore, when the driver 21 is mounted face-down on the array substrate 11b, the first output-side terminal portion 28a is arranged to face the second output-side terminal portion 28b.
  • the first output-side terminal portion 28a and the second output-side terminal portion 28b are both coiled and inductively coupled to each other so that an output signal can be transmitted.
  • the second output side terminal portion 28b is formed by patterning a metal film spirally on the plate surface of the array substrate 11b.
  • the first output-side terminal portion 28a is formed by patterning a metal film in a spiral shape on the bottom surface of the driver 21. That is, since the first output side terminal portion 28a and the second output side terminal portion 28b are formed by a photolithography method used in a known semiconductor wiring formation process, the first output side terminal portion 28a and the second output side terminal portion 28b can be easily miniaturized.
  • the film thickness is connected by the ACF 30, the film thickness is extremely thin compared to the power supply terminal portion 25, the ground terminal portion 26, and the input-side terminal portion 27 that form bumps.
  • the width dimension and arrangement pitch of the output side terminal portions 28 are all smaller than those of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, and are, for example, about 15 ⁇ m to 30 ⁇ m.
  • the first output side terminal portion 28a and the second output side terminal portion 28b are opposed to each other while being substantially concentric with each other.
  • the driver 21 is provided with a transmission control unit 31 and a transmission circuit 32 for controlling transmission of output signals, whereas the array substrate 11b is provided with a reception control unit 33 for receiving output signals. And a receiving circuit 34 is provided.
  • the first output side terminal portion 28a and the second output side terminal portion 28b, which are opposed to each other, are bonded to each other by the ACF 30, as shown in FIG. 6, similar to the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27.
  • the ACF 30 is arranged over almost the entire mounting area of the driver 21 on the array substrate 11b.
  • ACF 30 contains the conductive particles 30a, a sufficient distance is provided between the first output side terminal portion 28a and the second output side terminal portion 28b that are opposed to each other by the spacer 35 described below. Therefore, it is possible to prevent a situation in which both the conductors 28a and 28b are short-circuited by the conductive particles 30a.
  • a pair of spacers 35 are arranged at positions that sandwich the output-side terminal portions 28 arranged in parallel from both sides in the parallel direction (X-axis direction).
  • the spacer 35 has a bump shape protruding from the bottom surface of the driver 21, and the protruding tip is directly or indirectly contacted with the array substrate 11 b via the conductive particles 30 a, thereby the driver 21. It is possible to regulate the distance (gap) between the first input side terminal portion 27a and the second output side terminal portion 28b to a certain size.
  • This embodiment has the structure as described above, and its operation will be described next.
  • a method for manufacturing the liquid crystal display device 10 will be described.
  • the ACFs 29 and 30 are respectively attached to the mounting regions of the flexible substrate 13 and the driver 21 in the array substrate 11b.
  • the driver 21 is mounted on the array substrate 11b, and the outer edge portion of the driver 21 opposite to the display portion AA side, that is, the arrangement of the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 is arranged.
  • the power supply terminal portion 25, the ground terminal portion 26, and the input-side terminal portion 27 that make a pair are electrically connected, and the driver 21 is connected to the array substrate.
  • the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 that make a pair are indirectly in contact with each other via the conductive particles 30 a included in the ACF 30.
  • the spacer 35 is brought into contact with the array substrate 11b. Are not short-circuited by the conductive particles 30a and are kept in contact with each other in a non-contact state.
  • the film thickness is extremely thin compared to the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 which are in the form of bumps.
  • the end of the flexible substrate 13 is placed on the mounting region of the array substrate 11b and heated while being pressed via the ACF 29. Electrical connection and mechanical retention are achieved. Accordingly, the driving power, the reference potential, and the input signal can be supplied from the flexible substrate 13 to the driving power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 of the array substrate 11b. Note that the other end of the flexible substrate 13 is connected to the control circuit substrate 12 through the ACF in the same manner as described above. After the liquid crystal panel 11, the control circuit board 12, and the flexible board 13 connected to each other as described above are assembled in the backlight device 14, they are accommodated in the exterior members 15 and 16, so that FIG.
  • the liquid crystal display device 10 is obtained.
  • the order can be appropriately changed.
  • the flexible substrate 12 is connected in a state where the liquid crystal panel 11 and the control circuit substrate 12 are assembled in the backlight device 12 in advance. It doesn't matter.
  • the driving power, the reference potential and the input signal to the driver 21 generated by the control circuit board 12 are supplied to the corresponding power supply formed on the array board 11b of the liquid crystal panel 11 via the flexible board 13.
  • the voltage is supplied to the terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24, respectively.
  • the power supply terminal portion 22 has a first power supply terminal portion 25a constituting the power supply terminal portion 25, and the reference potential supply terminal portion 23 has a first ground terminal portion 26a constituting the ground terminal portion 26. Since the first input side terminal portion 27a constituting the input side terminal portion 27 is connected to the signal supply terminal portion 24 via the relay wiring, the driving power, the reference potential, and the input signal are respectively supplied thereto.
  • the first power supply terminal portion 25a, the first ground terminal portion 26a, and the first input terminal portion 27a are paired with each other, and the second power supply terminal portion 25b, the second ground terminal portion 26b, and the second input that are formed in the driver 21. Since it is indirectly in contact with the side terminal portion 27b via the conductive particles 30a of the ACF 30 (see FIG. 5), the driving power, the reference potential, and the input signal are respectively input thereto.
  • the drive circuit 21 a is activated by receiving the drive power and the reference potential, and the input signal is processed to generate an output signal.
  • the generated output signal is supplied from the drive circuit 21a to the first output side terminal portion 28a constituting the output side terminal portion 28.
  • the first output side terminal portion 28a is inductively coupled to the second output side terminal portion 28b, signal transmission is performed.
  • the supplied output signal is suitable for transmission by inductive coupling by the transmission control unit 31 and the transmission circuit 32 (see FIG. 7) provided in the drive circuit 21a. As shown in FIG. 7, when a primary current based on an output signal is supplied to the first output side terminal portion 28a having a coil shape, a magnetic flux is generated at the center thereof.
  • the generated magnetic flux induces a secondary current in the coil-like second output side terminal portion 28b which is opposed to the first output side terminal portion 28a and arranged concentrically.
  • This secondary current that is, the received signal is converted into an output signal suitable for driving the TFT 17 arranged in the display unit AA in the reception control unit 33 and the reception circuit 34 provided on the array substrate 11b side, and gate wiring 19 and the source wiring 20.
  • the drive of TFT17 can be controlled appropriately and a predetermined image can be displayed on display AA.
  • the ACF 30 swells due to moisture absorption, there is a possibility that the distance between the driver 21 and the array substrate 11b is increased.
  • the power supply terminal portion 25, the ground are grounded by the elasticity of the conductive particles 30a included in the ACF 30. The contact state between the pair of terminals 26 and input side terminals 27 is maintained.
  • the transmission of the output signal output from the driver 21 to the display unit AA of the liquid crystal panel 11 is performed by transmission in a non-contact state by inductive coupling, for example, the resolution of an image to be displayed is increased. Accordingly, even when the number of output signals is remarkably increased and further miniaturization of the output side terminal portion 28 is required, it is possible to easily cope with it. Specifically, when the pair of output side terminal portions are brought into contact with each other via the ACF as in the past, there is a concern that problems such as a short circuit and a decrease in insulation may occur with miniaturization, Furthermore, if the particle size of the conductive particles contained in the ACF is reduced to cope with this, there is a concern that the connection reliability deteriorates.
  • the output side terminal portion 28 has a pair of coils and is capable of transmitting an output signal by being inductively coupled to each other. It is possible to avoid the problem of mounting due to the miniaturization as described above.
  • the output side terminal portions 28 that form a pair are all coil-shaped, an extremely fine pattern can be formed by using a semiconductor wiring formation process such as a photolithography method, thereby facilitating the miniaturization. It can correspond to.
  • the output signal to be transmitted is less affected by parasitic capacitance, etc., which is suitable for increasing the transmission speed, reducing power consumption and manufacturing cost. It is also suitable for achieving the above.
  • the terminal width and the arrangement pitch are designed to be larger than those of the output side terminal portion 28. Even if the objects formed are contacted indirectly with each other by the ACF 30, adjacent ones are not short-circuited.
  • the power supply side terminal part 25 and the ground terminal part 26 since the thing which makes a pair is contacted indirectly by ACF30, supply of drive power and supply of a reference potential are aimed at, therefore, the power supply terminal part 25 , The driving power having a voltage value much larger than that of each signal can be reliably supplied, and the ground terminal 26 can stably supply the reference potential. Contributes to dynamic operation.
  • the power supply terminal portion 25, the ground terminal portion 26, and the input-side terminal portion 27 are all in a batch because each pair is indirectly contacted via a common ACF 30. Connection and mechanical holding can be achieved. That is, since the connection structure of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 can be made common, the input side terminal portion is signal-transmitted by inductive coupling in the same manner as the output side terminal portion 28 described above. As compared with the case where terminal portions having different connection structures are mixed, the degree of freedom of arrangement of the terminal portions 25 to 27 can be increased.
  • connection structure is different between the input side terminal portion, the power supply terminal portion, and the ground terminal portion as described above.
  • the input side terminal portion must be arranged symmetrically and the terminal portion group consisting of the power supply terminal portion and the ground terminal portion must be arranged symmetrically. If the connection structure of each of the terminal portions 25 to 27 is made common as in the present embodiment, the above-described restrictions do not occur, and the terminal portions 25 to 27 can be laid out freely.
  • the input side terminal unit is configured to transmit signals by inductive coupling, it is necessary to newly install an input transmission circuit on the liquid crystal panel 11 side and an input reception circuit on the driver 21 side. If this happens, it may be necessary to secure a new space in the frame portion of the liquid crystal panel 11. However, according to the present embodiment, this is not necessary, and thus the liquid crystal panel 11 is narrowed. It is suitable for planning. In addition, since the process, conditions, manufacturing equipment, and the like related to the connection can be made common, it is suitable for reducing the manufacturing cost.
  • the ACF 30 is arranged over the respective arrangement regions of the power supply terminal portion 25, the ground terminal portion 26, the input side terminal portion 27, and the output side terminal portion 28, the work related to the attachment of the ACF 30 to the array substrate 11b. However, it can be simplified and is more suitable for reducing the manufacturing cost. Furthermore, since the output side terminal portion 28 that performs signal transmission by inductive coupling does not have a bump shape like the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, the particles of the conductive particles 30a. Even if the ACF 30 having a large diameter is used, there is almost no possibility of causing a short circuit. Therefore, the connection reliability in the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 by the ACF 30 including the conductive particles 30a having a large particle size. Can be high.
  • the liquid crystal display device (display device) 10 is driven by the liquid crystal panel (display panel) 11 having the display unit AA capable of displaying an image and the control circuit board 12 serving as a power source.
  • the liquid crystal panel 11 operates based on the power and the reference potential and outputs an output signal generated by processing an input signal supplied from the control circuit board 12 as a signal supply source to the display unit AA.
  • a driver (drive circuit unit) 21 to be driven and a control circuit board 12 side that is a power source and a driver 21 side are provided in pairs, and driving power can be supplied by directly or indirectly contacting each other.
  • the power supply terminal portion 25, the control circuit board 12 side that is the power source, and the driver 21 side are provided in pairs, and the reference potential can be supplied by directly or indirectly contacting each other.
  • the ground terminal portion 26, the control circuit board 12 which is a signal supply source, and the driver 21 side are provided in pairs, and the input signal can be transmitted by directly or indirectly contacting each other.
  • the input side terminal portion 27, the driver 21 side, and the display portion AA side are provided in pairs, and each of them forms a coil and is inductively coupled to each other so that an output signal can be transmitted.
  • Output side terminal portion 28 is provided in pairs, and each of them forms a coil and is inductively coupled to each other so that an output signal can be transmitted.
  • the input signal supplied from the control circuit board 12 which is a signal supply source is transmitted to the driver 21 by the input side terminal portion 27 and input.
  • the driver 21 processes the input signal based on the driving power and the reference potential supplied from the control circuit board 12 that is a power source, generates an output signal, and outputs it.
  • the output signal is transmitted to the display unit AA of the liquid crystal panel 11 by the output side terminal unit 28. Thereby, the liquid crystal panel 11 is driven and an image is displayed on the display unit AA.
  • the output-side terminal unit 28 tends to handle more signals than the input-side terminal unit 27, for example, when the resolution of an image displayed on the display unit AA is increased. In addition, there is a tendency for finer arrangement pitches to be demanded. For this reason, there is a concern that problems such as short-circuiting and deterioration of insulation may occur when the pair of output side terminal portions are brought into contact with each other via the ACF as in the prior art. When the particle size of the conductive particles contained in the ACF is reduced, there is a concern that the connection reliability deteriorates. In that respect, according to the present embodiment, the output side terminal portion 28 has a pair of coils and is inductively coupled to each other so that an output signal can be transmitted.
  • the output side terminal portions 28 according to the present embodiment form a pair of coils, when forming the output side terminal portions 28, for example, a wiring formation process such as a semiconductor is used. And can be easily miniaturized.
  • the output terminal 28 is capable of transmitting an output signal by inductively coupling a pair of output terminals 28, the transmitted output signal is not easily affected by parasitic capacitance or the like. Therefore, it is suitable for increasing the transmission speed of the output signal, and further suitable for reducing the power consumption and the manufacturing cost.
  • the input side terminal portion 27 handles a relatively small number of signals even when the image has a higher resolution than the output side terminal portion 28, the paired ones are directly or Even in a connection structure that enables transmission of an input signal by indirect contact, a signal transmission function can be appropriately exhibited without causing a problem such as a short circuit.
  • the power supply terminal portion 25 and the ground terminal portion 26 are capable of supplying driving power and supplying a reference potential by directly or indirectly contacting each other in pairs.
  • the power terminal 25 can reliably supply driving power having a voltage value much larger than that of each signal, and the ground terminal 26 can stably supply a reference potential.
  • these power supply terminal part 25, the ground terminal part 26, and the input side terminal part 27 have what has a common connection structure that what makes each pair contact directly or indirectly.
  • the terminal portions 25 to 27 can be arranged more freely than the case where the terminal portions having different connection structures are mixed. The degree can be increased. That is, when designing the arrangement of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, the connection structure is different between the input side terminal portion, the power supply terminal portion, and the ground terminal portion as described above.
  • the input side terminal portion must be arranged symmetrically and the terminal portion group consisting of the power supply terminal portion and the ground terminal portion must be arranged symmetrically. If the connection structure of each of the terminal portions 25 to 27 is made common as in the present embodiment, the above-described restrictions do not occur, and the terminal portions 25 to 27 can be laid out freely. Furthermore, if the input side terminal portion is configured to perform signal transmission by inductive coupling, it may be necessary to newly install an input transmission circuit and an input reception circuit. According to that. In addition, the process for forming the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 and the steps related to the connection can be made common, which is suitable for reducing the manufacturing cost.
  • the output side terminal portions 28 are arranged so that the paired ones are opposed to each other. In this way, for example, the distance between the output side terminal portions 28 that form a pair by the thickness of the driver 21 is larger than that in the case where the driver 21 is interposed between the output side terminal portions 28 that form a pair. Since it can be shortened, it is more suitable for increasing the transmission speed of the output signal transmitted and received.
  • the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are arranged so that the paired ones are opposed to each other. If it does in this way, what makes the pair in the input side terminal part 27, the power supply terminal part 25, and the ground terminal part 26 can each be connected easily directly or indirectly.
  • the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are arranged on the outer edge side of the driver 21. In this way, for example, even when a pressure is required to connect the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26, it is possible to avoid the stress from acting on the center side of the driver 21. This is suitable for forming a circuit on the center side of the driver 21.
  • the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are arranged along the outer edge of the driver 21 at least on the side opposite to the display portion AA side, whereas the output side terminal portion 28. Are arranged along at least the outer edge of the driver 21 on the display section AA side. In this case, since the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are not arranged on the outer edge of the driver 21 on the display portion AA side, the output side terminal portion 28, the display portion AA, and the like. This is suitable for designing a wiring for connecting the two.
  • the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are fixed in contact with each other by an ACF 30 that is the same adhesive material. In this way, by using the same adhesive material ACF 30, the input side terminal portion 27, the power supply terminal portion 25 and the ground terminal portion 26 can be connected together, thereby reducing the manufacturing cost and the like. This is even more suitable.
  • the adhesive material is ACF30 which is an anisotropic conductive agent. If it does in this way, what makes the pair in the input side terminal part 27, the power supply terminal part 25, and the ground terminal part 26 will contact indirectly via ACF30 which is an anisotropic conductive agent.
  • the particle size of the conductive particles 30a included in the ACF 30 can be set to an appropriate size regardless of the terminal width and the arrangement pitch in the output-side terminal portion 28, thereby obtaining high connection reliability. Can do.
  • the output side terminal portions 28 are fixed together by an ACF 30 that is the same adhesive material as the input side terminal portion 27, the power supply terminal portion 25 and the ground terminal portion 26.
  • the output side terminal portion 28 can be connected in a lump, thereby reducing the manufacturing cost. Even more suitable.
  • the output side terminal portion 28 can transmit the output signal by inductive coupling. Therefore, a situation in which the paired members are short-circuited via the ACF 30 is extremely serious. It is difficult to occur.
  • the ACF 30 that is an adhesive material is disposed in a range that spans the arrangement regions of the input side terminal portion 27, the output side terminal portion 28, the power supply terminal portion 25, and the ground terminal portion 26. In this way, it is possible to shorten the tact time when the ACF 30 as the adhesive material is arranged, as compared with the case where the adhesive material is divided and arranged for each arrangement region.
  • a spacer 35 is provided for regulating the distance between the paired output side terminal portions 28. In this way, the distance between the output side terminal portions 28 paired by the spacer 35 is kept constant, so that the transmission speed of the output signal to be transmitted can be stabilized.
  • At least a pair of the spacers 35 are arranged at positions where the arrangement area of the output side terminal portion 28 is sandwiched in a plan view. In this way, the distance between the paired output side terminal portions 28 can be more reliably kept constant.
  • the driver 21 is mounted on the liquid crystal panel 11, and the input side terminal portion 27, the output side terminal portion 28, the power supply terminal portion 25, and the ground terminal portion 26 make a pair with the liquid crystal panel 11 and the driver 21. It is provided in shape. In this way, the input signal, the driving power, and the reference potential are transferred from the control circuit board 12 side that is the signal supply source and the power source to the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 on the liquid crystal panel 11 side. After being supplied, the driver 21 is operated by being transmitted to the input terminal portion 27, the power supply terminal portion 25 and the ground terminal portion 26 on the driver 21 side.
  • the output signal generated by the driver 21 is transmitted from the output side terminal section 28 on the driver 21 side to the output side terminal section 28 on the liquid crystal panel 11 side, and then output to the display section AA.
  • the driver 21 is directly mounted on the liquid crystal panel 11 as described above, it is suitable for performing so-called COG (Chip On Glass) mounting.
  • the input side terminal portion 27 is configured to transmit signals by making the paired members contact each other directly or indirectly, the input side terminal portion is assumed to be similar to the output side terminal portion 28.
  • the signal transmission is performed by inductive coupling, it may be necessary to newly provide an input transmission circuit in the liquid crystal panel 11 and an input reception circuit in the driver 21. However, according to the present embodiment, this is not necessary, and this is suitable for narrowing the frame of the liquid crystal panel 11.
  • the display panel is a liquid crystal panel 11 in which liquid crystal is sealed between a pair of substrates 11a and 11b. In this way, it can be applied to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
  • a backlight device 14 is provided which is opposed to the liquid crystal panel 11 and is disposed on the side opposite to the display side and capable of supplying light to the liquid crystal panel 11. In this way, it is possible to display an image on the display unit AA of the liquid crystal panel 11 using the light supplied from the backlight device 14. Thereby, the brightness
  • Embodiment 1 of this invention was shown, this invention is not restricted to the said embodiment, For example, the following modifications can also be included.
  • members similar to those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and illustration and description thereof may be omitted.
  • the output-side terminal portion 28-1 is provided on the center side of the driver 21-1 in addition to the outer edge portion of the driver 21-1 (mounting region on the array substrate 11b-1). It is also arranged in a space, and a so-called area array is arranged in a lattice shape as a whole. Specifically, a plurality of output side terminal portions 28-1 are arranged in parallel along the long side direction (X-axis direction, row direction) of the driver 21-1, and the row is short of the driver 21-1. By arranging a plurality in the side direction (Y-axis direction, column direction), they are arranged in parallel in a matrix.
  • the row of the output side terminal portion 28-1 includes the driver 21-1 on the display side (the side opposite to the upper side, the power supply terminal portion 25, the ground terminal portion 26 and the input side terminal portion 27 side shown in FIG. 9). And those located on the center side of the driver 21-1 are included, and a plurality of those located on the center side are included.
  • the row of the output side terminal portions 28-1 located on the center side is arranged closer to the center of the driver 21-1 than the power supply terminal portion 25, the ground terminal portion 26 and the input side terminal portion 27.
  • the output side terminal portions 28-1 arranged in a matrix are arranged at approximately equal intervals in the row direction and the column direction.
  • the interval between the adjacent output side terminal portions 28-1 is substantially equal to the interval between the output side terminal portion 28-1 and the adjacent power supply terminal portion 25, ground terminal portion 26 and input side terminal portion 27.
  • the two output side terminal portions 28b-1 are formed in the same planar arrangement.
  • the output-side terminal portion 28-1 is capable of transmitting signals by inductively coupling pairs to each other. Therefore, even if the ACF 30 is used, it is not necessary to pressurize the vicinity of the output side terminal portion 28-1 of the driver 21-1 with a large pressure. Therefore, even if the driver circuit is formed on the portion of the driver 21-1 that overlaps the output side terminal portion 28-1 in plan view, the driver circuit will not be pressurized at the time of connection. The situation of receiving is avoided.
  • the output side terminal portion 28-1 and the drive circuit are not limited by the arrangement region, and it is possible to adopt an arrangement in which the output side terminal portion 28-1 and the drive circuit overlap with each other in a plan view.
  • the arrangement area of the output side terminal portion 28-1 can be increased and the area array arrangement can be adopted, so that the terminal width and the arrangement pitch of the output side terminal portion 28-1 can be increased. Accordingly, the output side terminal portion 28-1 can be easily formed, and it is possible to suitably cope with an increase in the output signals and the output side terminal portion 28-1 as the resolution of the display image further increases.
  • the terminal width and arrangement pitch of the output side terminal portion 28-1 according to this modification are larger than those described in the first embodiment, and are, for example, about 150 ⁇ m.
  • the output side terminal portion 28-1 is closer to the center of the driver 21-1 than the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26. Includes what is being distributed. In this way, the output side terminal portion 28-1 does not necessarily need to be pressurized when connecting the paired ones. Therefore, even when the output side terminal portion 28-1 is arranged closer to the center of the driver 21-1, it is possible to avoid the stress from acting on the center side of the driver 21-1, and the circuit formed there. It is also possible to avoid a situation that adversely affects the environment. As a result, the space on the center side of the driver 21-1 can be used effectively, and even if the number of output side terminal portions 28-1 is increased as the resolution of the image is increased, it can be easily handled. can do.
  • the output side terminal portions 28-1 are arranged in parallel in a lattice shape when viewed in a plane. In this way, the output side terminal portion 28-1 can be efficiently arranged, which is more suitable for miniaturization.
  • the output side terminal portion 28-2 is arranged in an area array in a zigzag shape (zigzag shape) as a whole in the driver 21-2 (mounting region in the array substrate 11b-2). Yes. Specifically, the output side terminal portion 28-2 is arranged in the column direction with the output side terminal portions 28-2, which form rows arranged in parallel along the long side direction (X-axis direction, row direction) of the driver 21-2. The arrangement is shifted in the row direction with respect to each output-side terminal portion 28-2 forming a row adjacent in the (Y-axis direction). The amount of deviation in the row direction between adjacent rows in the column direction is about half of the arrangement pitch of the output side terminal portions 28-2 in the row direction.
  • an output side terminal portion 28-2 that forms a row adjacent in the column direction with respect to the output side terminal portion 28-2 that forms the row is arranged at an intermediate position between the output side terminal portions 28-2 that are adjacent in the row direction. Will be. Thereby, the space
  • the output-side terminal portions 28-2 are arranged in a staggered manner, so that one row of output-side terminal portions 28-2 is added to the output-side terminal portions 28-2. High-density arrangement of 28-2 is possible. Accordingly, it is possible to suitably cope with an increase in output signals and output-side terminal portions 28-2 accompanying further increase in resolution of a display image.
  • the output side terminal portions 28-2 are arranged in parallel in a zigzag manner when viewed in a plane. In this way, the output-side terminal portions 28-2 can be arranged at a higher density than when arranged in parallel in a grid, for example.
  • the input-side terminal portion 27-3 is along the two adjacent outer edge portions of the outer peripheral edge portion of the driver 21-3 (mounting region in the array substrate 11b-3). Are arranged in an L shape as a whole. Specifically, the input-side terminal portion 27-3 is located on the outer edge portion of the driver 21-3 opposite to the display portion side (the upper side shown in FIG. 11), and the long side direction (X-axis) of the driver 21-3. Of the driver 21-3 and the driver 21-3 located at the outer edge adjacent to the left outer edge shown in FIG. 11, that is, the outer edge on the opposite side to the display side. 3 parallel to each other along the short side direction (Y-axis direction).
  • the output-side terminal portion 28-3 is arranged on the outer edge portion (specifically, the outer edge portion on the display portion side and the right outer edge portion shown in FIG. 11) of the driver 21-3 where the input-side terminal portion 27-3 is not disposed.
  • an area array is arranged closer to the center of the driver 21-3 than that. With such an arrangement, the wiring width and arrangement pitch of the input side terminal portion 27-3 can be made relatively larger than those of the first modification.
  • the input side terminal portion 27-4 is along the outer edge portions of three adjacent sides of the outer peripheral edge portion of the driver 21-4 (mounting region in the array substrate 11b-4). Are arranged in a channel shape as a whole. Specifically, the input-side terminal portion 27-4 is located on the outer edge portion of the driver 21-4 opposite to the display portion side (the upper side shown in FIG. 12), and the long side direction (X-axis) of the driver 21-4. 11 and a pair of outer edge portions adjacent to the outer edge portions on both the left and right sides shown in FIG. 11 of the driver 21-4, that is, the outer edge portion on the opposite side to the display portion side.
  • the output side terminal portion 28-4 is arranged on the outer edge portion on the display portion side where the input side terminal portion 27-4 is not arranged in the driver 21-4, and in addition to that, the output side terminal portion 28-4 is closer to the center in the driver 21-4
  • An area array is also arranged. With such an arrangement, the wiring width and the arrangement pitch of the input side terminal portions 27-4 can be made relatively larger than those of the third modification.
  • Modification 5 of Embodiment 1 will be described with reference to FIG. Here, a modification in which the arrangement of the input side terminal portion 27-5 is further changed from the above-described modification example 4 is shown.
  • the input side terminal portion 27-5 according to the present modification is arranged in parallel along the entire circumference of the outer peripheral edge portion of the driver 21-5 (mounting region in the array substrate 11b-5), and as a whole It is arranged in a frame shape.
  • the output side terminal portion 28-5 is arranged in an area array in a space on the center side excluding the outer peripheral edge portion of the driver 21-5. With such an arrangement, the wiring width and the arrangement pitch of the input side terminal portions 27-5 can be made relatively larger than those of the third modification.
  • the driver 121 has a longer side dimension than that shown in the first embodiment.
  • the spacer 135 is also provided at the center.
  • the spacers 135 are arranged in pairs so as to sandwich the output-side terminal portion 128 group at both end positions in the parallel direction (X-axis direction), and are also arranged at the center position in the parallel direction.
  • the driver 121 is supported at three points.
  • the distance between the driver 121 and the array substrate 111b can be kept uniform over the entire area.
  • the distance between the first output side terminal portion 128a and the second output side terminal portion 128b that are opposed to each other is also constant and uniform, so that the transmission speed of the output signal can be kept uniform.
  • the problem caused by the increase in the size of the driver 121 can also occur when the driver is thinned, for example. Therefore, the configuration according to the present embodiment is also used when the thinned driver is used. While being able to use suitably, the effect similar to the above can be acquired.
  • the spacer 135 is also arranged on the central side in the arrangement region of the output side terminal portion 128 in a plan view.
  • the pair of spacers 135 disposed at the positions sandwiching the arrangement region of the output side terminal portion 128 and the spacer on the center side of the arrangement region 135 can suitably regulate the deformation of the driver 121, and the distance between the output-side terminal portions 128 that make a pair can be kept constant.
  • Embodiment 3 of the present invention will be described with reference to FIG.
  • an output side terminal portion 228 is covered with an insulating layer 36.
  • action, and effect as above-mentioned Embodiment 1 is abbreviate
  • the output side terminal portion 228 is covered with an insulating layer 36 as a pair. Specifically, the outer peripheral surfaces of the first output-side terminal portion 228a on the driver 221 side and the second output-side terminal portion 228b on the array substrate 211b side are respectively coated with an insulating layer 36 and exposed to the outside. Is avoided. Due to this insulating layer 36, the first output side terminal portion 228 a and the second output side terminal portion 228 b are short-circuited by the conductive particles 30 a included in the ACF 30 or the conductive foreign matter included in the ACF 30 unintentionally. Can be prevented.
  • the insulating layer 36 can also function as a protective part, for example, even when the first output side terminal part 228a and the second output side terminal part 228b are subjected to interference from other members in the manufacturing process, The insulating layer 36 can prevent the first output side terminal portion 228a and the second output side terminal portion 228b from being damaged.
  • At least one of the paired output-side terminal portions 228 is covered with the insulating layer 36. In this way, it is possible to prevent the output side terminal portions 228 making a pair from being short-circuited. In addition, since the situation covered with the insulating layer 36 is prevented from being damaged by the interference of foreign matters in the manufacturing process, the operation reliability is high.
  • the paired output terminal portions 228 are both covered with an insulating layer 36. In this way, it is possible to prevent the output side terminal portions 228 making a pair from being short-circuited. Since both the output side terminal portions 228 that make a pair are prevented from being damaged by interference of foreign matter or the like in the manufacturing process, the operation reliability is further improved.
  • FIGS. 4 A fourth embodiment of the present invention will be described with reference to FIGS.
  • a driver 321 mounted on a flexible substrate 37 is shown.
  • the driver 321 is mounted on a flexible substrate 37 having flexibility, and is mounted on a so-called COF (Chip On Film).
  • One end of the flexible substrate 37 is connected to the control circuit board 312 that is a power source and a signal supply source, while the other end is connected to the array substrate 311 b of the liquid crystal panel 311.
  • the flexible substrate 37 is formed with a wiring pattern made of a metal material such as copper extending from one end side to the other end side, and a mounting area for the driver 321 is secured in the middle of the wiring pattern. ing.
  • the terminal portions 325 to 328 are formed in a pair in the mounting area of the driver 321 on the flexible substrate 37 and the driver 321.
  • the power terminal portion 325, the ground terminal portion 326, and the input side terminal portion 327 are a first power terminal portion 325a, a first ground terminal portion 326a, and a first input side formed on the flexible substrate 37 side.
  • the terminal unit 327a includes a second power terminal unit 325b, a second ground terminal unit 326b, and a second input terminal unit 327b formed on the driver 321 side.
  • the second power supply terminal portion 325b, the second ground terminal portion 326b, and the second input side terminal portion 327b have projecting dimensions of the first power supply terminal portion 325a, the first ground terminal portion 326a, and the first input side terminal portion.
  • the bumps are larger than 327a and are in direct contact with the first power terminal portion 325a, the first ground terminal portion 326a, and the first input terminal portion 327a.
  • the driver 321 and the flexible substrate 37 are fixed by an NCF (Non (Conductive Film) 38.
  • the NCF 38 is made of a thermosetting resin material and has substantially the same configuration as that obtained by removing the conductive particles from the ACFs 29 and 30 (see FIGS. 5 and 6) shown in the first embodiment. Therefore, NCF 38 is less expensive in material cost than ACF 29,30.
  • the output-side terminal portion 328 includes a first output-side terminal portion 328a formed on the driver 321 side and a second output-side terminal portion 328b formed on the flexible substrate 37 side. Is done.
  • the first output side terminal portion 328a and the second output side terminal portion 328b are both inductively coupled by forming a coil shape and being opposed to each other.
  • the NCF 38 is arranged over the arrangement region of the output side terminal unit 328 in addition to the arrangement region of the power supply terminal unit 325, the ground terminal unit 326, and the input side terminal unit 327, and the first output side terminal unit 328a and the second output unit 328a.
  • the space between the side terminal portions 328b is also fixed.
  • an output signal output from the second output side terminal unit 328b is transmitted to the array substrate 311b via the flexible substrate 37, and thereafter, a reception control unit and a reception circuit (not shown) formed on the array substrate 311b. ) Is processed.
  • the flexible substrate 37 is provided in which one end side is connected to the control circuit board 312 side which is a signal supply source and a power source, whereas the other end side is connected to the liquid crystal panel 311.
  • the driver 321 is mounted on the flexible substrate 37, and the input side terminal portion 327, the output side terminal portion 328, the power supply terminal portion 325, and the ground terminal portion 326 form a pair with the driver 321 and the flexible substrate 37, respectively. It is equipped with. In this way, the input signal, the driving power, and the reference potential are supplied from the control circuit board 312 that is the signal supply source and the power source via the flexible board 37 to the input side terminal portion 327, the power supply terminal portion 325, and the ground terminal portion.
  • the driver 321 is operated by being transmitted to the driver 321 by 326.
  • the output signal generated by the driver 321 is transmitted to the flexible substrate 37 by the output side terminal unit 328, then supplied to the liquid crystal panel 311 and output to the display unit AA. Since the driver 321 is mounted on the flexible substrate 37 as described above, it is suitable for performing so-called COF (Chip On On Film) mounting.
  • COF Chip On On Film
  • a fifth embodiment of the present invention will be described with reference to FIG. 19 or FIG.
  • the fifth embodiment is also a modification of the fourth embodiment in which the above-described COF mounting is performed, and the power terminal portion 425, the ground terminal portion 426, the input side terminal portion 427, and the spacer 435 are formed by the solder bumps 39. Shows what In addition, the overlapping description about the same structure, an effect
  • the power terminal portion 425, the ground terminal portion 426, and the input side terminal portion 427 are formed with solder bumps 39 on one side of each pair.
  • the solder bump 39 is made of a solder material such as tin plating that can be melted by heating.
  • the spacer 435 is also formed by solder bumps 39 as shown in FIG. A dummy terminal is formed on the flexible substrate 437 side at a position facing the spacer 435 made of the solder bump 39.
  • the second power terminal portion 425b, the second ground terminal portion 426b, the second input side terminal portion 427b, and the solder that forms the spacer 435 are used.
  • the second power supply terminal portion 425b becomes the first power supply terminal portion 425a
  • the second ground terminal portion 426b becomes the first ground terminal portion 426a
  • the second input side terminal portion 427b becomes the second.
  • the spacer 435 can be directly bonded to the flexible substrate 437 to the 1-input-side terminal portion 427a.
  • the driver 421 can be firmly fixed to the flexible substrate 437 by performing a so-called underfill in which an adhesive material 40 made of a thermosetting resin or the like is poured between the driver 421 and the flexible substrate 437.
  • an adhesive material 40 made of a thermosetting resin or the like is poured between the driver 421 and the flexible substrate 437.
  • the input terminal portion 427, the power supply terminal portion 425, and the ground terminal portion 426 are provided with solder bumps 37 that are melted by heating.
  • the solder bump 39 is melted by heating, and the input side terminal portion 427, the power supply terminal portion 425, and the ground terminal portion 426 are joined, so that the connection reliability can be improved.
  • the driving power can be supplied more reliably by the power terminal portion 425, and the reference potential can be supplied more stably by the ground terminal portion 426.
  • FIGS. 6 A sixth embodiment of the present invention will be described with reference to FIGS.
  • a liquid crystal panel 511 provided with a gate drive unit 41 is shown.
  • the liquid crystal panel 511 is provided with a gate driving unit 41 that is connected to a gate wiring in the display unit AA and supplies a scanning signal to the gate wiring.
  • the gate driver 41 is disposed on the array substrate 511b in the liquid crystal panel 511, and is formed using a process for forming other structures (TFT, gate wiring, source wiring, etc.) on the array substrate 511b. Yes.
  • the driver 521 according to the present embodiment supplies only the data signal supplied to the source wiring as the output signal by the output side terminal unit 528.
  • the gate driving unit power supply terminal unit 42 and the gate driving unit ground terminal unit for supplying the gate driving unit 41 with driving power and a reference potential, respectively. 43 is provided.
  • the gate drive power supply terminal 42 and the gate drive ground terminal 43 are adjacent to the output terminal group 528 in the parallel direction (X-axis direction). It is arranged. Specifically, the gate drive unit power supply terminal unit 42 and the gate drive unit ground terminal unit 43 are arranged so as to sandwich the output-side terminal unit 528 group from both sides in the X-axis direction, and are arranged symmetrically as a whole. It is said that.
  • the gate drive unit power supply terminal unit 42 and the gate drive unit ground terminal unit 43 include a first gate drive unit power supply terminal unit 42a and a first gate drive unit ground terminal unit 43a formed in the driver 521, respectively, and an array.
  • the substrate 511b includes a second gate driver power supply terminal 42b and a second gate driver ground terminal 43b formed in the mounting region of the driver 521.
  • the first gate driver power terminal 42a and the second gate driver power terminal 42b, the first gate driver ground terminal 43a, and the second gate driver ground terminal 43b, which are paired, respectively. Are electrically and mechanically connected by the ACF 30 in a state of being opposed to each other. That is, the gate drive power supply terminal 42 and the gate drive ground terminal 43 have a common connection structure with the power supply terminal 25, the ground terminal 26, and the input terminal 27. As a result, the driving power and the reference potential can be stably and reliably supplied to the gate driving unit 41 shown in FIG.
  • the first gate driver power terminal 42a and the first gate driver ground terminal 43a formed in the driver 521 are a second power terminal 25b, a second ground terminal 26b, and a second input terminal.
  • the configuration is the same as that of the unit 27b (see FIG. 5).
  • the second gate driver power terminal 42b and the second gate driver ground terminal 43b formed on the array substrate 511b include the first power terminal 25a, the first ground terminal 26a, and the first input side.
  • the configuration is the same as that of the terminal portion 27a (see FIG. 5). Therefore, detailed description of these terminal portions 42a, 42b, 43a, 43b is omitted.
  • each terminal unit can be changed as appropriate.
  • a circular shape or an oval shape can be used in addition to a rectangular shape or a square shape.
  • the output side terminal portions arranged in a matrix or staggered pattern are shown arranged at almost equal intervals in the row direction and the column direction. It is also possible to arrange the output side terminal portions so that the arrangement pitch differs in the column direction.
  • the output terminal portion having a coil shape is formed by a photolithography method.
  • the output terminal portion having a coil shape is formed by, for example, a damascene method. It is also possible to do.
  • thermosetting resin is used as a material of ACF (anisotropic conductive agent) or NCF (adhesive material not containing conductive particles) has been described. It is also possible to use a thermoplastic resin, a two-component room temperature curing resin, or the like as the material.
  • the terminal portions are fixed with the same adhesive material.
  • the type of the adhesive material may be different depending on the terminal portions.
  • an adhesive material having only an adhesive function other than ACF anisotropic conductive agent
  • an adhesive made of a thermoplastic resin or a two-part room temperature curable resin it is possible to use materials.
  • control circuit board is exemplified to have a configuration in which both the power supply and the signal supply source are used. What was done is also included in the present invention.
  • a transmissive liquid crystal display device including a backlight device that is an external light source is illustrated.
  • the present invention is applied to a reflective liquid crystal display device that performs display using external light.
  • the backlight device can be omitted.
  • a TFT is used as a switching element of a liquid crystal display device.
  • the present invention can also be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)).
  • a switching element other than TFT for example, a thin film diode (TFD)
  • the present invention can also be applied to a liquid crystal display device for monochrome display.
  • the liquid crystal display device using a liquid crystal panel as the display panel has been exemplified.
  • the present invention is applicable to a display device using another type of display panel (PDP, organic EL panel, etc.). Applicable. In that case, the backlight device can be omitted.
  • the driver and the flexible substrate are connected to an ACF (anisotropic conductive agent) or an NCF (NCF). Needless to say, it may be fixed using an adhesive material that does not contain conductive particles.
  • ACF anisotropic conductive agent
  • NCF NCF
  • SYMBOLS 10 Liquid crystal display device (display apparatus) 11,311,511 ... Liquid crystal panel (display panel), 11a ... CF board
  • First power supply terminal power supply terminal
  • 25b, 325b, 425b ... Second power supply Terminal part power supply terminal part
  • 26, 326, 426 Ground terminal part, 26a, 326a, 426a ... First ground terminal part (ground terminal part), 26b, 26b, 426b ... 2nd ground terminal part (ground terminal part), 27, 327, 427 ... input side terminal part, 27a, 327a, 427a ... 1st input side terminal part (input side terminal part), 27b, 327b, 427b ... 2nd input side terminal part (input side terminal part), 28, 128, 228, 328, 528 ... Output side terminal part, 28a, 128a, 228a, 328a, 528a ...

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Abstract

This liquid crystal display device comprises: a liquid crystal panel having a display unit capable of displaying an image; a driver (21) for acting on the basis of a reference potential and drive power supplied from a control circuit substrate, the driver adapted for processing an input signal supplied from the control circuit substrate and outputting a generated output signal to the display unit to drive the liquid crystal panel; power source terminal parts, ground terminal parts, and input-side terminal parts individually provided in the form of a pair to the control circuit substrate side and the driver (21) side, the mutually corresponding terminal parts being in direct or indirect contact with one another; and output-side terminal parts (28) provided in the form of a pair to the driver (21) side and the display unit side, the output-side terminal parts describing a coil shape and being capable of transferring the output signal by being inductively coupled to each other.

Description

表示装置Display device
　本発明は、表示装置に関する。 The present invention relates to a display device.
　携帯電話、スマートフォン、ＰＤＡなどの携帯型の情報端末装置やコンピュータなどの電子機器には、液晶パネルなどの表示パネルを備えた表示装置が用いられている。このような表示装置は、画像を表示する表示部を有する表示パネルと、信号供給源から供給される入力信号を処理して生成した出力信号を表示部に供給することで表示パネルを駆動するＬＳＩとを備えている。上記のように一般的に中小型に分類される表示装置においては、ＬＳＩの実装方法として、ＬＳＩを表示パネルのうち表示部外の領域に直接実装する、ＣＯＧ（Chip On Glass）実装技術を用いるのが好ましい。なお、この種の表示装置の一例として下記特許文献１に記載されたものが知られている。 2. Description of the Related Art Display devices having a display panel such as a liquid crystal panel are used for portable information terminal devices such as mobile phones, smartphones, PDAs, and electronic devices such as computers. Such a display device includes a display panel having a display unit for displaying an image, and an LSI for driving the display panel by supplying an output signal generated by processing an input signal supplied from a signal supply source to the display unit. And. As described above, in a display device that is generally classified into a medium-to-small size, a COG (Chip On Glass) mounting technique that directly mounts an LSI in an area outside the display portion of the display panel is used as an LSI mounting method. Is preferred. In addition, what was described in following patent document 1 is known as an example of this kind of display apparatus.
特開２００６－１７１５３０号公報JP 2006-171530 A
（発明が解決しようとする課題）
　近年、表示装置においては表示部外の領域を小さくする狭額縁化が求められるとともに表示画像の高解像度化が求められる傾向にあり、それに伴ってＬＳＩの実装面積が小さくなるとともに配線数の増加が進行している。このため、表示パネル及びＬＳＩに形成される配線並びに端子部を微細化することが求められる傾向にある。ところが、従来では、ＣＯＧ実装を行うに際して表示パネルとＬＳＩとの接続には、ＡＣＦ（Anisotropic Conductive Film）が用いられているが、配線並びに端子部の微細化が進行すると導電性粒子によって隣り合う配線間が短絡されるという問題が生じていた。 (Problems to be solved by the invention)
In recent years, there has been a tendency for display devices to have a narrower frame that reduces the area outside the display area and to increase the resolution of the display image. With this trend, the LSI mounting area has decreased and the number of wires has increased. Progressing. For this reason, it tends to be required to miniaturize the wiring and terminal portions formed in the display panel and LSI. Conventionally, however, an ACF (Anisotropic Conductive Film) is used to connect the display panel and the LSI when performing COG mounting. However, as the wiring and terminal portions become finer, adjacent wirings are formed by conductive particles. There was a problem of short circuiting.
　本発明は上記のような事情に基づいて完成されたものであって、端子部の微細化に好適に対応することを目的とする。 The present invention has been completed based on the above situation, and an object thereof is to suitably cope with the miniaturization of the terminal portion.
（課題を解決するための手段）
　本発明の表示装置は、画像を表示可能な表示部を有する表示パネルと、電源から供給される駆動電力及び基準電位に基づいて作動するものであって、信号供給源から供給される入力信号を処理して生成した出力信号を前記表示部に出力することで前記表示パネルを駆動する駆動回路部と、前記電源側と前記駆動回路部側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで前記駆動電力の供給が可能とされる電源端子部と、前記電源側と前記駆動回路部側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで前記基準電位の供給が可能とされるグランド端子部と、前記信号供給源側と前記駆動回路部側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで前記入力信号の伝送が可能とされる入力側端子部と、前記駆動回路部側と前記表示部側とに対をなす形で備えられそれぞれがコイル状をなすとともに相互に誘導結合されることで前記出力信号の伝送が可能とされる出力側端子部とを備える。 (Means for solving problems)
The display device of the present invention operates based on a display panel having a display unit capable of displaying an image, drive power and a reference potential supplied from a power source, and receives an input signal supplied from a signal supply source. A drive circuit unit that drives the display panel by outputting an output signal generated by processing to the display unit and a pair formed on the power supply side and the drive circuit unit side are provided directly or mutually. A power supply terminal portion that can supply the driving power by being indirectly contacted, and a pair of the power supply side and the drive circuit portion side are provided and directly or indirectly contact each other By providing a ground terminal part capable of supplying the reference potential, a pair of the signal supply source side and the drive circuit part side, and directly or indirectly contacting each other. Transmission of input signals is possible The input side terminal portion, the drive circuit portion side and the display portion side are provided in a paired form, and each of them forms a coil shape and is inductively coupled to each other so that the output signal can be transmitted. Output side terminal portion.
　このようにすれば、信号供給源から供給される入力信号は、入力側端子部によって駆動回路部へと伝送されて入力される。駆動回路部は、電源から供給される駆動電力及び基準電位に基づいて入力信号を処理して出力信号を生成して出力する。出力信号は、出力側端子部によって表示パネルの表示部へと伝送される。これにより、表示パネルが駆動されて表示部に画像が表示される。 In this way, the input signal supplied from the signal supply source is transmitted to the drive circuit unit by the input side terminal unit and input. The drive circuit unit processes the input signal based on the drive power supplied from the power source and the reference potential to generate and output an output signal. The output signal is transmitted to the display unit of the display panel by the output side terminal unit. Thereby, the display panel is driven and an image is displayed on the display unit.
　ここで、出力側端子部は、入力側端子部に比べると、例えば表示部に表示される画像が高解像度化された場合などには、扱う信号数が多くなりがちで、端子幅や配列ピッチの微細化がより強く求められる傾向にある。このため、従来のように出力側端子部の対をなすもの同士を異方性導電剤を介して接触させた場合には、短絡や絶縁性の低下などの問題が生じることが懸念され、さらにそれに対応すべく異方性導電剤に含まれる導電性粒子の粒径を小さくすると、接続信頼性が悪化するといった問題が懸念される。その点、本発明によれば、出力側端子部は、対をなすものがそれぞれコイル状をなすとともに相互に誘導結合されることで出力信号の伝送が可能とされるものであるから、上記のような実装上の問題が生じるのを回避することができる。しかも、本発明に係る出力側端子部は、対をなすものがそれぞれコイル状をなしていることから、出力側端子部を形成するに際して例えば半導体などの配線形成プロセスなどを利用することができて容易に微細化を図ることが可能となっている。さらには、出力側端子部は、対をなすものが相互に誘導結合されることで出力信号の伝送を可能とされているので、伝送される出力信号が寄生容量などの影響を受け難くなり、もって出力信号の伝送速度を高速化する上で好適となり、さらには低消費電力化及び製造コストの低減を図る上でも好適となる。 Here, compared with the input side terminal unit, the output side terminal unit tends to handle more signals when the image displayed on the display unit has a higher resolution. There is a tendency that the miniaturization of is more strongly required. For this reason, there is a concern that problems such as a short circuit and a decrease in insulation may occur when the pair of output side terminal portions are brought into contact with each other via an anisotropic conductive agent as in the past. If the particle size of the conductive particles contained in the anisotropic conductive agent is reduced to cope with this, there is a concern that the connection reliability deteriorates. In that respect, according to the present invention, since the output side terminal portions are each formed in a coil shape and inductively coupled to each other, the output signal can be transmitted. Such mounting problems can be avoided. Moreover, since the output side terminal portions according to the present invention form a pair of coils, when forming the output side terminal portions, for example, a wiring formation process such as a semiconductor can be used. Miniaturization can be easily achieved. Furthermore, since the output terminal is capable of transmitting the output signal by inductively coupling the paired output terminals, the transmitted output signal is less susceptible to parasitic capacitance and the like, Therefore, it is suitable for increasing the transmission speed of the output signal, and further suitable for reducing power consumption and reducing manufacturing costs.
　その一方で、入力側端子部は、出力側端子部に比べると、画像が高解像度化されたとしても扱う信号数が相対的に少ないことから、対をなすもの同士が直接的にまたは間接的に接触することで入力信号の伝送を可能とする接続構造であっても、短絡などの問題が生じることなく適切に信号伝送機能を発揮することができる。さらには、電源端子部及びグランド端子部は、それぞれ対をなすもの同士が直接的にまたは間接的に接触することで駆動電力の供給及び基準電位の供給を可能とされていることから、電源端子部においては各信号に比べて遙かに大きな電圧値の駆動電力を確実に供給することができ、さらにはグランド端子部においては基準電位を安定的に供給することができる。そして、これら電源端子部、グランド端子部、及び入力側端子部は、それぞれ対をなすもの同士が直接的にまたは間接的に接触する、という共通する接続構造を有していることから、仮に入力側端子部について上記した出力側端子部と同様に誘導結合によって信号伝送を図る構成として異なる接続構造の端子部が混在する場合に比べると、各端子部の配置の自由度を高くすることができる。すなわち、電源端子部、グランド端子部、及び入力側端子部の配置を設計するに際して、仮に上記したように入力側端子部と電源端子部及びグランド端子部とで接続構造が異なっていると、接続作業の容易性や確実性などの観点から入力側端子部を対称に配置するとともに電源端子部及びグランド端子部からなる端子部群を対称に配置しなければならない、といった制約が生じるものの、本発明のように各端子部の接続構造を共通化すれば上記のような制約が生じなくなり、もって各端子部を自由にレイアウトすることができる。さらには、仮に入力側端子部が誘導結合によって信号伝送を図る構成とされると、新たに入力用の送信回路及び入力用の受信回路を設置する必要が生じる可能性があるが、本発明によればその必要がなくなる。また、電源端子部、グランド端子部、及び入力側端子部を形成するプロセスや接続に係る工程を共通化することが可能となり、もって製造コストの低減などを図る上で好適となる。 On the other hand, compared to the output side terminal part, the input side terminal part handles a relatively small number of signals even if the resolution of the image is increased. Even in a connection structure that enables transmission of an input signal by contacting the terminal, a signal transmission function can be appropriately exhibited without causing a problem such as a short circuit. Furthermore, since the power supply terminal portion and the ground terminal portion are capable of supplying drive power and reference potential by directly or indirectly contacting each other in pairs, the power supply terminal The drive power of a voltage value much larger than that of each signal can be reliably supplied to the section, and the reference potential can be stably supplied to the ground terminal section. And since these power supply terminal parts, ground terminal parts, and input-side terminal parts have a common connection structure in which the respective pairs make direct or indirect contact with each other, temporarily input As compared with the case where the terminal portions having different connection structures are mixed in the configuration in which signal transmission is performed by inductive coupling in the same manner as the output-side terminal portion described above, the degree of freedom of arrangement of each terminal portion can be increased. . That is, when designing the arrangement of the power terminal portion, the ground terminal portion, and the input terminal portion, if the connection structure is different between the input terminal portion, the power terminal portion, and the ground terminal portion as described above, the connection Although there is a restriction that the input side terminal portion must be arranged symmetrically and the terminal portion group consisting of the power supply terminal portion and the ground terminal portion must be arranged symmetrically from the viewpoint of workability and certainty, etc., the present invention If the connection structure of each terminal part is made common as described above, the above-described restriction does not occur, and each terminal part can be laid out freely. Furthermore, if the input side terminal unit is configured to transmit signals by inductive coupling, it may be necessary to newly install an input transmission circuit and an input reception circuit. According to that, it is not necessary. Further, the process for forming the power supply terminal portion, the ground terminal portion, and the input side terminal portion and the steps related to the connection can be made common, which is suitable for reducing the manufacturing cost.
　本発明の実施態様として、次の構成が好ましい。
（１）前記出力側端子部は、対をなすもの同士が対向状をなすよう配されている。このようにすれば、例えば対をなす出力側端子部の間に駆動回路部が介在する配置とした場合に比べると、駆動回路部の厚み分だけ対をなす出力側端子部の間の距離を短くすることができるから、送受信される出力信号の伝送速度を高速化する上で一層好適となる。 The following configuration is preferable as an embodiment of the present invention.
(1) The output side terminal portions are arranged so that a pair of the terminal portions are opposed to each other. In this way, for example, the distance between the output side terminal portions that are paired by the thickness of the drive circuit portion is larger than that in the case where the drive circuit portion is disposed between the pair of output side terminal portions. Since it can be shortened, it is more suitable for increasing the transmission speed of the output signal transmitted and received.
（２）前記入力側端子部、前記電源端子部及び前記グランド端子部は、それぞれ対をなすもの同士が対向状をなすよう配されている。このようにすれば、入力側端子部、電源端子部及びグランド端子部における対をなすもの同士をそれぞれ直接的または間接的に容易に接続することができる。 (2) The input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged so that each pair of the input side terminal portion, the power supply terminal portion, and the ground terminal portion are opposed to each other. If it does in this way, what makes the pair in an input side terminal part, a power supply terminal part, and a ground terminal part can each be connected easily directly or indirectly.
（３）前記入力側端子部、前記電源端子部及び前記グランド端子部は、前記駆動回路部における外縁側に配されている。このようにすれば、例えば入力側端子部、電源端子部及びグランド端子部の接続に加圧を要する場合でも、駆動回路部における中央側に応力が作用するのを回避することができる。これにより、駆動回路部における中央側に回路を形成する上で好適となる。 (3) The input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged on the outer edge side of the drive circuit portion. In this way, for example, even when pressure is required to connect the input side terminal portion, the power supply terminal portion, and the ground terminal portion, it is possible to avoid stress from acting on the center side of the drive circuit portion. Thereby, it becomes suitable when forming a circuit in the center side in a drive circuit part.
（４）前記入力側端子部、前記電源端子部及び前記グランド端子部は、前記駆動回路部のうち少なくとも前記表示部側とは反対側の外縁に沿って配されているのに対し、前記出力側端子部は、前記駆動回路部のうち少なくとも前記表示部側の外縁に沿って配されている。このようにすれば、駆動回路部のうち表示部側の外縁に入力側端子部、電源端子部及びグランド端子部が配されていないことから、出力側端子部と表示部とを接続する配線を設計する上で好適となる。 (4) The input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged along at least the outer edge of the drive circuit portion opposite to the display portion side, whereas the output side The side terminal portion is arranged along at least the outer edge of the drive circuit portion on the display portion side. In this way, since the input side terminal part, the power supply terminal part, and the ground terminal part are not arranged on the outer edge of the display part side in the drive circuit part, the wiring connecting the output side terminal part and the display part is provided. This is suitable for designing.
（５）前記出力側端子部には、前記入力側端子部、前記電源端子部及び前記グランド端子部よりも相対的に前記駆動回路部における中央寄りに配されるものが含まれている。このようにすれば、出力側端子部は、対をなすもの同士を接続するに際して必ずしも加圧を要することがない。従って、この出力側端子部を駆動回路部における中央寄りに配する設計としても、駆動回路部における中央側に応力が作用するのを回避することができてそこに形成した回路に悪影響が及ぶ事態も回避することができる。これにより、駆動回路部における中央側のスペースを有効に利用することができ、もって画像の高解像度化などに伴って出力側端子部の設置数が増加した場合でも、容易に対応することができる。 (5) The output side terminal portion includes a portion disposed relatively closer to the center of the drive circuit portion than the input side terminal portion, the power supply terminal portion, and the ground terminal portion. If it does in this way, when the output side terminal part connects what makes a pair, it does not necessarily require pressurization. Therefore, even when this output side terminal portion is arranged near the center of the drive circuit portion, it is possible to avoid the stress from acting on the center side of the drive circuit portion and adversely affect the circuit formed there. Can also be avoided. As a result, the space on the center side in the drive circuit unit can be used effectively, and even when the number of output side terminal units is increased as the resolution of an image increases, it can be easily handled. .
（６）前記出力側端子部は、平面に視て格子状に複数ずつ並列配置されている。このようにすれば、出力側端子部を効率的に配することができ、微細化に一層好適となる。 (6) A plurality of the output side terminal portions are arranged in parallel in a lattice shape when seen in a plan view. If it does in this way, an output side terminal part can be arranged efficiently and it becomes still more suitable for miniaturization.
（７）前記出力側端子部は、平面に視て千鳥状に複数ずつ並列配置されている。このようにすれば、例えば格子状に並列配置した場合に比べると、さらに出力側端子部を高密度に配置することができる。 (7) A plurality of the output side terminal portions are arranged in parallel in a staggered manner as viewed in a plane. In this way, the output side terminal portions can be arranged at a higher density than when arranged in parallel in a grid, for example.
（８）前記入力側端子部、前記電源端子部及び前記グランド端子部は、それぞれ対をなすもの同士が、同じ接着材料によって接触状態に固着されている。このようにすれば、同じ接着材料を用いることで、入力側端子部、電源端子部及びグランド端子部を一括して接続することができ、もって製造コストの低減などを図る上で一層好適となる。 (8) The input side terminal portion, the power supply terminal portion, and the ground terminal portion are fixed in contact with each other by the same adhesive material. In this way, by using the same adhesive material, the input side terminal portion, the power supply terminal portion, and the ground terminal portion can be connected together, which is more suitable for reducing the manufacturing cost. .
（９）前記接着材料は、異方性導電剤とされる。このようにすれば、入力側端子部、電源端子部及びグランド端子部における対をなすもの同士が異方性導電剤を介して間接的に接触される。また、異方性導電剤に含まれる導電性粒子の粒径について、出力側端子部における端子幅や配列ピッチとは関係なく、適切な大きさに設定することができるから、高い接続信頼性を得ることができる。 (9) The adhesive material is an anisotropic conductive agent. If it does in this way, what makes a pair in an input side terminal part, a power supply terminal part, and a ground terminal part will contact indirectly via an anisotropic conductive agent. In addition, the particle size of the conductive particles contained in the anisotropic conductive agent can be set to an appropriate size regardless of the terminal width and arrangement pitch in the output side terminal portion, so that high connection reliability is achieved. Obtainable.
（１０）前記出力側端子部は、対をなすもの同士が、前記入力側端子部、前記電源端子部及び前記グランド端子部と同じ前記接着材料によって固着されている。このようにすれば、入力側端子部、電源端子部及びグランド端子部に加えて出力側端子部についても一括して接続することができ、もって製造コストの低減などを図る上でより一層好適となる。なお、接着材料として異方性導電剤を用いた場合でも、出力側端子部が誘導結合により出力信号を伝送可能とされるものであるから、対をなすもの同士が異方性導電剤を介して短絡される事態が極めて生じ難いものとなっている。 (10) The output side terminal portions are fixed together by the same adhesive material as the input side terminal portion, the power supply terminal portion, and the ground terminal portion. In this way, it is possible to collectively connect the output side terminal portion in addition to the input side terminal portion, the power supply terminal portion, and the ground terminal portion, which is more preferable for reducing the manufacturing cost. Become. Even when an anisotropic conductive agent is used as the adhesive material, the output side terminal portion is capable of transmitting an output signal by inductive coupling. It is extremely unlikely that a short circuit will occur.
（１１）前記接着材料は、前記入力側端子部、前記出力側端子部、前記電源端子部及び前記グランド端子部の各配置領域に跨る範囲に配されている。このようにすれば、仮に各配置領域毎に接着材料を区分して配した場合に比べると、接着材料を配する際のタクトタイムの短縮化などを図ることができる。 (11) The adhesive material is disposed in a range extending over the respective arrangement regions of the input side terminal portion, the output side terminal portion, the power supply terminal portion, and the ground terminal portion. In this way, it is possible to shorten the tact time when the adhesive material is arranged, as compared with the case where the adhesive material is divided and arranged for each arrangement region.
（１２）前記入力側端子部、前記電源端子部及び前記グランド端子部には、加熱により溶融する半田バンプが設けられている。このようにすれば、半田バンプを加熱により溶融させることで、入力側端子部、電源端子部及びグランド端子部がそれぞれ接合されるから、接続信頼性を向上させることができる。特に電源端子部によって駆動電力をより確実に供給することができるとともに、グランド端子部によって基準電位をより安定的に供給することができる。 (12) The input side terminal portion, the power supply terminal portion, and the ground terminal portion are provided with solder bumps that melt by heating. If it does in this way, since an input side terminal part, a power terminal part, and a ground terminal part are joined by melting a solder bump by heating, connection reliability can be raised. In particular, the driving power can be supplied more reliably by the power terminal portion, and the reference potential can be supplied more stably by the ground terminal portion.
（１３）対をなす前記出力側端子部の間の距離を規制するためのスペーサが備えられている。このようにすれば、スペーサによって対をなす出力側端子部の間の距離が一定に保たれるから、伝送される出力信号の伝送速度の安定化を図ることができる。 (13) A spacer for regulating a distance between the pair of output side terminal portions is provided. In this way, since the distance between the output side terminal portions that are paired by the spacer is kept constant, the transmission speed of the transmitted output signal can be stabilized.
（１４）前記スペーサは、平面に視て前記出力側端子部の配置領域を挟み込む位置に少なくとも一対配されている。このようにすれば、対をなす出力側端子部の間の距離をより確実に一定に保つことができる。 (14) At least one pair of the spacers is disposed at a position sandwiching the arrangement region of the output side terminal portion in a plan view. In this way, the distance between the pair of output side terminal portions can be more reliably kept constant.
（１５）前記スペーサは、平面に視て前記出力側端子部の配置領域における中央側にも配されている。このようにすれば、駆動回路部が大型であった場合や薄型であった場合でも、出力側端子部の配置領域を挟み込む位置に配された一対のスペーサと、配置領域の中央側のスペーサとによって駆動回路部の変形を好適に規制することができ、もって対をなす出力側端子部の間の距離を一定に保つことができる。 (15) The spacer is also arranged on the center side in the arrangement region of the output side terminal portion in a plan view. In this way, even when the drive circuit unit is large or thin, the pair of spacers arranged at the positions sandwiching the arrangement region of the output side terminal unit, the spacer on the center side of the arrangement region, Thus, the deformation of the drive circuit section can be suitably restricted, and the distance between the pair of output side terminal sections can be kept constant.
（１６）対をなす前記出力側端子部の少なくともいずれか一方は、絶縁層によって覆われている。このようにすれば、対をなす出力側端子部同士が短絡されるのを防ぐことができる。また、絶縁層によって覆われたものは、製造過程において異物などの干渉によって損傷などを受ける事態が回避されるから、作動信頼性が高いものとされる。 (16) At least one of the paired output side terminal portions is covered with an insulating layer. If it does in this way, it can prevent that the output side terminal parts which make a pair are short-circuited. In addition, since the situation covered with the insulating layer is prevented from being damaged by the interference of foreign substances in the manufacturing process, the operation reliability is high.
（１７）対をなす前記出力側端子部は、共に前記絶縁層によって覆われている。このようにすれば、対をなす出力側端子部同士が短絡されるのを防ぐことができる。対をなす出力側端子部が、共に製造過程において異物などの干渉によって損傷などを受ける事態が回避されるから、作動信頼性が一層高いものとされる。 (17) Both the output side terminal portions forming a pair are covered with the insulating layer. If it does in this way, it can prevent that the output side terminal parts which make a pair are short-circuited. Since both the output side terminal portions forming a pair are prevented from being damaged due to interference of foreign matter or the like in the manufacturing process, the operation reliability is further improved.
（１８）前記駆動回路部は、前記表示パネルに実装されており、前記入力側端子部、前記出力側端子部、前記電源端子部及び前記グランド端子部は、前記表示パネルと前記駆動回路部とにそれぞれ対をなす形で備えられている。このようにすれば、入力信号、駆動電力及び基準電位は、信号供給源側及び電源側から表示パネル側の入力側端子部、電源端子部及びグランド端子部に供給されてから、駆動回路部側の入力側端子部、電源端子部及びグランド端子部に伝送されることで、駆動回路部を作動させる。駆動回路部にて生成された出力信号は、駆動回路部側の出力側端子部から表示パネル側の出力側端子部に伝送されてから表示部に出力される。上記のように駆動回路部を表示パネルに直接実装しているので、いわゆるＣＯＧ（Chip On Glass）実装を行う上で好適とされる。また、入力側端子部は、対をなすものが互いに直接的または間接的に接触することで信号伝送を図る構成とされているから、仮に入力側端子部について出力側端子部と同様に誘導結合によって信号伝送を図る構成とすると、新たに表示パネルに入力用の送信回路を、駆動回路部に入力用の受信回路をそれぞれ設ける必要が生じる可能性があり、そうなると表示パネルに入力用の送信回路の設置スペースを新たに確保する必要が生じる可能性があるが、本発明によればその必要がなく、もって表示パネルの狭額縁化を図る上で好適である。 (18) The drive circuit unit is mounted on the display panel, and the input side terminal unit, the output side terminal unit, the power supply terminal unit, and the ground terminal unit include the display panel, the drive circuit unit, and the like. Are provided in pairs. In this way, the input signal, the driving power and the reference potential are supplied from the signal supply source side and the power supply side to the input side terminal portion, the power supply terminal portion and the ground terminal portion on the display panel side, and then the drive circuit portion side. The drive circuit unit is operated by being transmitted to the input side terminal unit, the power supply terminal unit, and the ground terminal unit. The output signal generated in the drive circuit unit is transmitted from the output side terminal unit on the drive circuit unit side to the output side terminal unit on the display panel side, and then output to the display unit. As described above, since the drive circuit section is directly mounted on the display panel, it is suitable for performing so-called COG (Chip On Glass) mounting. In addition, since the input side terminal portion is configured to transmit signals by directly or indirectly contacting a pair of terminals, the input side terminal portion is inductively coupled in the same manner as the output side terminal portion. Therefore, it may be necessary to newly provide a transmission circuit for input on the display panel and a reception circuit for input on the drive circuit unit. Then, the transmission circuit for input on the display panel may be required. However, according to the present invention, there is no need to secure a new installation space, which is suitable for narrowing the display panel.
（１９）一端側が前記信号供給源側及び前記電源側に接続されるのに対して他端側が前記表示パネルに接続されるフレキシブル基板が備えられるとともに、前記駆動回路部が前記フレキシブル基板に実装されており、前記入力側端子部、前記出力側端子部、前記電源端子部及び前記グランド端子部は、前記駆動回路部と前記フレキシブル基板とにそれぞれ対をなす形で備えられている。このようにすれば、入力信号、駆動電力及び基準電位は、信号供給源側及び電源側からフレキシブル基板を介して、入力側端子部、電源端子部及びグランド端子部によって駆動回路部へと伝送されることで、駆動回路部を作動させる。駆動回路部にて生成された出力信号は、出力側端子部によってフレキシブル基板に伝送されてから表示パネルに供給され、表示部に出力される。上記のように駆動回路部をフレキシブル基板に実装しているので、いわゆるＣＯＦ（Chip On Film）実装を行う上で好適とされる。 (19) A flexible substrate is provided, one end of which is connected to the signal supply source side and the power supply side, while the other end is connected to the display panel, and the drive circuit unit is mounted on the flexible substrate. The input side terminal portion, the output side terminal portion, the power supply terminal portion, and the ground terminal portion are provided in pairs in the drive circuit portion and the flexible substrate, respectively. In this way, the input signal, the driving power, and the reference potential are transmitted from the signal supply source side and the power supply side to the drive circuit unit through the flexible substrate by the input side terminal unit, the power supply terminal unit, and the ground terminal unit. This activates the drive circuit unit. The output signal generated in the drive circuit unit is transmitted to the flexible substrate by the output side terminal unit, then supplied to the display panel, and output to the display unit. Since the drive circuit section is mounted on the flexible substrate as described above, it is suitable for performing so-called COF (Chip On On Film) mounting.
（２０）前記表示パネルは、一対の基板間に液晶を封入してなる液晶パネルとされる。このようにすれば、種々の用途、例えばテレビやパソコンのディスプレイ等に適用でき、特に大型画面用として好適である。 (20) The display panel is a liquid crystal panel in which liquid crystal is sealed between a pair of substrates. In this way, it can be applied to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
（２１）前記液晶パネルに対して対向状をなし且つ表示側とは反対側に配されるとともに前記液晶パネルに対して光を供給可能な照明装置を備える。このようにすれば、照明装置から供給される光を利用して、液晶パネルの表示部に画像を表示させることができる。これにより、表示される画像の輝度を高いものとすることができる。 (21) An illuminating device that is opposed to the liquid crystal panel and is disposed on a side opposite to the display side and capable of supplying light to the liquid crystal panel is provided. If it does in this way, an image can be displayed on the display part of a liquid crystal panel using the light supplied from an illuminating device. Thereby, the brightness | luminance of the image displayed can be made high.
（発明の効果）
　本発明によれば、端子部の微細化に好適に対応することができる。 (The invention's effect)
According to the present invention, it is possible to suitably cope with the miniaturization of the terminal portion.
本発明の実施形態１に係るドライバを実装した液晶パネルとフレキシブル基板と制御回路基板との接続構成を示す概略平面図1 is a schematic plan view showing a connection configuration of a liquid crystal panel, a flexible board, and a control circuit board on which a driver according to Embodiment 1 of the present invention is mounted. 液晶表示装置の長辺方向に沿った断面構成を示す断面図Sectional drawing which shows the cross-sectional structure along the long side direction of a liquid crystal display device 液晶パネルを構成するアレイ基板の平面構成を示す拡大平面図Enlarged plan view showing the planar configuration of the array substrate constituting the liquid crystal panel 液晶パネルを構成するアレイ基板におけるドライバ及びフレキシブル基板の実装領域を示す拡大平面図The enlarged plan view which shows the mounting area of the driver and flexible substrate in the array substrate which comprises a liquid crystal panel 図４のv-v線断面図V-v sectional view of FIG. 図４のvi-vi線断面図Vi-vi cross-sectional view of FIG. 出力側端子部による信号伝送の原理及び回路構成を説明するための概略斜視図Schematic perspective view for explaining the principle and circuit configuration of signal transmission by the output side terminal section 駆動電力、基準電位、入力信号及び出力信号の伝送経路を説明するためのブロック図Block diagram for explaining transmission paths of drive power, reference potential, input signal and output signal 実施形態１の変形例１に係るアレイ基板におけるドライバの実装領域を示す拡大平面図FIG. 4 is an enlarged plan view showing a driver mounting area on an array substrate according to a first modification of the first embodiment. 実施形態１の変形例２に係るアレイ基板におけるドライバの実装領域を示す拡大平面図FIG. 6 is an enlarged plan view showing a driver mounting area on an array substrate according to a second modification of the first embodiment. 実施形態１の変形例３に係るアレイ基板におけるドライバの実装領域を示す拡大平面図FIG. 6 is an enlarged plan view showing a driver mounting area on an array substrate according to a third modification of the first embodiment. 実施形態１の変形例４に係るアレイ基板におけるドライバの実装領域を示す拡大平面図FIG. 6 is an enlarged plan view showing a driver mounting area on an array substrate according to a fourth modification of the first embodiment. 実施形態１の変形例５に係るアレイ基板におけるドライバの実装領域を示す拡大平面図The enlarged plan view which shows the mounting area | region of the driver in the array substrate which concerns on the modification 5 of Embodiment 1. 本発明の実施形態２に係る出力側端子部及びスペーサの断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of the output side terminal part and spacer which concern on Embodiment 2 of this invention. 本発明の実施形態３に係る出力側端子部の断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of the output side terminal part which concerns on Embodiment 3 of this invention. 本発明の実施形態４に係る液晶パネルとドライバを実装したフレキシブル基板と制御回路基板との接続構成を示す概略平面図Schematic top view which shows the connection structure of the flexible substrate which mounted the liquid crystal panel and driver which concern on Embodiment 4 of this invention, and a control circuit board 電源端子部、グランド端子部及び入力側端子部の断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of a power supply terminal part, a ground terminal part, and an input side terminal part 出力側端子部の断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of the output side terminal part 本発明の実施形態５に係る電源端子部、グランド端子部及び入力側端子部の断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of the power supply terminal part which concerns on Embodiment 5 of this invention, a ground terminal part, and an input side terminal part スペーサの断面構成を示す断面図Sectional view showing the sectional structure of the spacer 本発明の実施形態６に係るゲート駆動部用の駆動電力及び基準電位と、出力信号との伝送経路を説明するためのブロック図FIG. 10 is a block diagram for explaining a transmission path for driving power and reference potential for a gate driving unit and an output signal according to a sixth embodiment of the present invention; アレイ基板におけるドライバの実装領域を示す拡大平面図Enlarged plan view showing the mounting area of the driver on the array board 図２２のxxiii-xxiii線断面図Xxiii-xxiii sectional view of FIG. 本発明の他の実施形態（１）に係る出力側端子部の断面構成を示す断面図Sectional drawing which shows the cross-sectional structure of the output side terminal part which concerns on other embodiment (1) of this invention.
　＜実施形態１＞
　本発明の実施形態１を図１から図８によって説明する。本実施形態では、液晶表示装置１０について例示する。なお、各図面の一部にはＸ軸、Ｙ軸及びＺ軸を示しており、各軸方向が各図面で示した方向となるように描かれている。また、上下方向については、図２などを基準とし、且つ同図上側を表側とするとともに同図下側を裏側とする。 <Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the liquid crystal display device 10 is illustrated. In addition, a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing. In addition, regarding the vertical direction, FIG. 2 and the like are used as a reference, and the upper side of the figure is the front side and the lower side of the figure is the back side.
　液晶表示装置１０は、図１及び図２に示すように、画像を表示可能な表示部ＡＡを有する液晶パネル（表示パネル、表示素子）１１と、液晶パネル１１を駆動するドライバ（駆動回路部）２１と、ドライバ２１に対して駆動電力、基準電位及び画像に係る入力信号を供給する制御回路基板（電源、信号供給源）１２と、液晶パネル１１と制御回路基板１２とを電気的に接続するフレキシブル基板（接続部品）１３と、液晶パネル１１に光を供給する外部光源であるバックライト装置（照明装置）１４とを備える。また、液晶表示装置１０は、相互に組み付けた液晶パネル１１及びバックライト装置１４を収容・保持するための表裏一対の外装部材１５，１６をも備えており、このうち表側の外装部材１５には、液晶パネル１１の表示部ＡＡを外部に露出させるための開口部１５ａが形成されている。本実施形態に係る液晶表示装置１０は、携帯型情報端末（電子ブックやＰＤＡなどを含む）、携帯電話（スマートフォンなどを含む）、ノートパソコン、デジタルフォトフレーム、携帯型ゲーム機などの各種電子機器（図示せず）に用いられるものである。このため、液晶表示装置１０を構成する液晶パネル１１の画面サイズは、例えば３．４インチなど、数インチ～１０数インチ程度とされ、一般的には小型または中小型に分類される大きさとされている。 As shown in FIGS. 1 and 2, the liquid crystal display device 10 includes a liquid crystal panel (display panel, display element) 11 having a display unit AA capable of displaying an image, and a driver (drive circuit unit) that drives the liquid crystal panel 11. 21, electrically connecting a control circuit board (power source, signal supply source) 12 that supplies driving power, a reference potential, and an input signal related to an image to the driver 21, and the liquid crystal panel 11 and the control circuit board 12. A flexible substrate (connection component) 13 and a backlight device (illumination device) 14 that is an external light source that supplies light to the liquid crystal panel 11 are provided. The liquid crystal display device 10 also includes a pair of front and back exterior members 15 and 16 for housing and holding the liquid crystal panel 11 and the backlight device 14 assembled to each other. An opening 15a for exposing the display portion AA of the liquid crystal panel 11 to the outside is formed. The liquid crystal display device 10 according to this embodiment includes various electronic devices such as portable information terminals (including electronic books and PDAs), mobile phones (including smartphones), notebook computers, digital photo frames, and portable game machines. (Not shown). For this reason, the screen size of the liquid crystal panel 11 constituting the liquid crystal display device 10 is about several inches to several tens of inches, such as 3.4 inches, and is generally a size classified as small or medium-sized. ing.
　先にバックライト装置１４について簡単に説明する。バックライト装置１４は、図２に示すように、表側（液晶パネル１１側）に向けて開口した略箱形をなすシャーシ１４ａと、シャーシ１４ａ内に配された図示しない光源（例えば冷陰極管やＬＥＤなど）と、シャーシ１４ａの開口部を覆う形で配される図示しない光学部材とを備える。光学部材は、光源から発せられる光を面状に変換するなどの機能を有するものである。 First, the backlight device 14 will be briefly described. As shown in FIG. 2, the backlight device 14 includes a chassis 14a having a substantially box shape that opens toward the front side (the liquid crystal panel 11 side), and a light source (not shown) such as a cold cathode tube or the like disposed in the chassis 14a. LED, etc.) and an optical member (not shown) arranged to cover the opening of the chassis 14a. The optical member has a function of converting light emitted from the light source into a planar shape.
　続いて、液晶パネル１１について説明する。液晶パネル１１は、図１に示すように、全体として縦長な方形状（矩形状）をなしており、その長辺方向における一方の端部側（図１に示す上側）に片寄った位置に表示部（アクティブエリア）ＡＡが配されるとともに、他方の端部側（図１に示す下側）に片寄った位置にドライバ２１及びフレキシブル基板１３がそれぞれ実装されている。この液晶パネル１１において表示部ＡＡ外の領域が非表示部（ノンアクティブエリア）ＮＡＡとされ、この非表示部ＮＡＡは、表示部ＡＡを取り囲む枠状の領域（後述するＣＦ基板１１ａにおける額縁部分）と、長辺方向の他方の端部側に確保された領域（後述するアレイ基板１１ｂのうちＣＦ基板１１ａとは重畳せずに露出する部分）とからなり、このうちの後者にドライバ２１及びフレキシブル基板１３の実装領域が含まれている。液晶パネル１１における長辺方向がＹ軸方向と一致し、短辺方向がＸ軸方向と一致している。 Subsequently, the liquid crystal panel 11 will be described. As shown in FIG. 1, the liquid crystal panel 11 has a vertically long rectangular shape (rectangular shape) as a whole, and is displayed at a position offset toward one end side (the upper side shown in FIG. 1) in the long side direction. A portion (active area) AA is arranged, and a driver 21 and a flexible substrate 13 are mounted at positions offset from the other end (lower side shown in FIG. 1). In the liquid crystal panel 11, an area outside the display portion AA is a non-display portion (non-active area) NAA, and the non-display portion NAA is a frame-like region (a frame portion in a CF substrate 11a described later) surrounding the display portion AA. And an area secured on the other end side in the long side direction (a portion of the array substrate 11b to be described later which is exposed without overlapping with the CF substrate 11a). A mounting area of the substrate 13 is included. The long side direction in the liquid crystal panel 11 coincides with the Y-axis direction, and the short side direction coincides with the X-axis direction.
　液晶パネル１１は、図２に示すように、一対の透明な（透光性を有する）ガラス製の基板１１ａ，１１ｂと、両基板１１ａ，１１ｂ間に介在し、電界印加に伴って光学特性が変化する物質である液晶分子を含む液晶層（図示せず）とを備え、両基板１１ａ，１１ｂが液晶層の厚さ分のギャップを維持した状態で図示しないシール剤によって貼り合わせられている。両基板１１ａ，１１ｂのうち表側（正面側）がＣＦ基板１１ａとされ、裏側（背面側）がアレイ基板１１ｂとされる。このうち、ＣＦ基板１１ａは、図１及び図２に示すように、アレイ基板１１ｂよりも長辺寸法が小さなものとされるとともに、アレイ基板１１ｂに対して長辺方向について一方の端部（図１に示す上側端部）を揃えた状態で貼り合わせられている。従って、アレイ基板１１ｂのうち長辺方向についての他方の端部（図１に示す下側端部）は、所定範囲にわたってＣＦ基板１１ａが重なり合うことがなく、表裏両板面が外部に露出した状態とされており、ここに後述するドライバ２１及びフレキシブル基板１３の実装領域（各端子部２５～２８の配置領域）が確保されている。なお、両基板１１ａ，１１ｂの内面側には、液晶層に含まれる液晶分子を配向させるための配向膜がそれぞれ形成されている。また、両基板１１ａ，１１ｂの外面側には、それぞれ図示しない偏光板が貼り付けられている。 As shown in FIG. 2, the liquid crystal panel 11 is interposed between a pair of transparent (translucent) glass substrates 11 a and 11 b and both the substrates 11 a and 11 b, and has an optical characteristic as the electric field is applied. And a liquid crystal layer (not shown) containing liquid crystal molecules which are changing substances, and both substrates 11a and 11b are bonded together by a sealing agent (not shown) while maintaining a gap corresponding to the thickness of the liquid crystal layer. Of both the substrates 11a and 11b, the front side (front side) is the CF substrate 11a, and the back side (back side) is the array substrate 11b. Among them, the CF substrate 11a has a longer side dimension smaller than that of the array substrate 11b as shown in FIGS. 1 and 2, and one end portion in the long side direction with respect to the array substrate 11b (see FIG. 1). The upper end portion shown in FIG. Therefore, the other end portion (the lower end portion shown in FIG. 1) of the array substrate 11b in the long side direction does not overlap the CF substrate 11a over a predetermined range, and both the front and back plate surfaces are exposed to the outside. A mounting area for the driver 21 and the flexible substrate 13 (arrangement area for the terminal portions 25 to 28), which will be described later, is secured here. An alignment film for aligning liquid crystal molecules contained in the liquid crystal layer is formed on the inner surfaces of both the substrates 11a and 11b. In addition, polarizing plates (not shown) are attached to the outer surface sides of both the substrates 11a and 11b.
　続いて、アレイ基板１１ｂ及びＣＦ基板１１ａにおける表示部ＡＡ内に存在する構成について順次に詳しく説明する。アレイ基板１１ｂの内面側（液晶層側、ＣＦ基板１１ａとの対向面側）には、図３に示すように、スイッチング素子であるＴＦＴ（Thin Film Transistor）１７及び画素電極１８が多数個並んで設けられるとともに、これらＴＦＴ１７及び画素電極１８の周りには、格子状をなすゲート配線１９及びソース配線２０が取り囲むようにして配設されている。ゲート配線１９とソース配線２０とがそれぞれＴＦＴ１７のゲート電極とソース電極とに接続され、画素電極１８がＴＦＴ１７のドレイン電極に接続されている。また、画素電極１８は、平面に視て縦長の方形状（矩形状）をなすとともに、ＩＴＯ（Indium Tin Oxide）或いはＺｎＯ（Zinc Oxide）といった透明電極材料からなる。一方、ＣＦ基板１１ａには、Ｒ（赤色），Ｇ（緑色），Ｂ（青色）等の各着色部が、アレイ基板１１ｂ側の各画素電極１８と平面に視て重畳するよう多数並列して配置されたカラーフィルタ（図示せず）が設けられている。カラーフィルタをなす各着色部間には、混色を防ぐための遮光層（ブラックマトリクス：図示せず）が形成されている。カラーフィルタ及び遮光層の表面には、アレイ基板１１ｂ側の画素電極１８と対向するベタ状の対向電極（図示せず）が設けられている。 Subsequently, the configuration existing in the display unit AA in the array substrate 11b and the CF substrate 11a will be sequentially described in detail. On the inner surface side of the array substrate 11b (the liquid crystal layer side, the surface facing the CF substrate 11a), as shown in FIG. 3, a large number of TFTs (Thin Film Transistors) 17 and pixel electrodes 18 which are switching elements are arranged. In addition to being provided, around the TFT 17 and the pixel electrode 18, a gate wiring 19 and a source wiring 20 having a lattice shape are disposed so as to surround the TFT 17 and the pixel electrode 18. The gate wiring 19 and the source wiring 20 are connected to the gate electrode and the source electrode of the TFT 17, respectively, and the pixel electrode 18 is connected to the drain electrode of the TFT 17. Further, the pixel electrode 18 has a vertically long rectangular shape (rectangular shape) when seen in a plan view, and is made of a transparent electrode material such as ITO (Indium Tin Oxide) or ZnO (Zinc Oxide). On the other hand, many colored portions such as R (red), G (green), and B (blue) are arranged in parallel on the CF substrate 11a so as to overlap each pixel electrode 18 on the array substrate 11b side in a plan view. Arranged color filters (not shown) are provided. A light shielding layer (black matrix: not shown) for preventing color mixture is formed between the colored portions constituting the color filter. A solid counter electrode (not shown) facing the pixel electrode 18 on the array substrate 11b side is provided on the surface of the color filter and the light shielding layer.
　制御回路基板１２は、図１及び図２に示すように、バックライト装置１４におけるシャーシ１４ａの裏面（液晶パネル１１側とは反対側の外面）にネジなどにより取り付けられている。この制御回路基板１２は、紙フェノールないしはガラスエポキシ樹脂製の基板上に、ドライバ２１に駆動電力及び基準電位を供給する電源部品や液晶パネル１１への画像に係る入力信号の伝送を制御する電子部品（コントロール回路）が実装されるとともに、図示しない所定のパターンの配線（導電路）が配索形成されている。この制御回路基板１２には、フレキシブル基板１３の一方の端部（一端側）が図示しないＡＣＦ（Anisotropic Conductive Film）を介して電気的に且つ機械的に接続されている。 As shown in FIGS. 1 and 2, the control circuit board 12 is attached to the rear surface of the chassis 14a (the outer surface opposite to the liquid crystal panel 11 side) of the backlight device 14 with screws or the like. The control circuit board 12 is a paper phenol or glass epoxy resin board, a power supply part that supplies driving power and a reference potential to the driver 21, and an electronic part that controls transmission of an input signal relating to an image to the liquid crystal panel 11. (Control circuit) is mounted, and wiring (conductive path) having a predetermined pattern (not shown) is routed. One end (one end side) of the flexible substrate 13 is electrically and mechanically connected to the control circuit board 12 via an ACF (Anisotropic Conductive Film) (not shown).
　フレキシブル基板（ＦＰＣ基板）１３は、図２に示すように、絶縁性及び可撓性を有する合成樹脂材料（例えばポリイミド系樹脂等）からなる基材を備え、その基材上に多数本の配線パターン（図示せず）を有しており、一方の端部が既述した通りシャーシ１４ａの裏面側に配された制御回路基板１２に接続されるのに対し、他方の端部（他端側）が液晶パネル１１におけるアレイ基板１１ｂに接続されているため、液晶表示装置１０内では断面形状が略チャンネル型となるよう屈曲されている。フレキシブル基板１３の両端部においては、配線パターンが外部に露出して端子部（図示せず）を構成しており、これらの端子部がそれぞれ制御回路基板１２及びアレイ基板１１ｂに対して電気的に接続されている。これにより、制御回路基板１２側から供給される駆動電力、基準電位及び画像に係る入力信号を液晶パネル１１側に伝送することが可能とされている。 As shown in FIG. 2, the flexible substrate (FPC substrate) 13 includes a base material made of a synthetic resin material (for example, polyimide resin) having insulating properties and flexibility, and a large number of wirings are provided on the base material. It has a pattern (not shown), and one end is connected to the control circuit board 12 arranged on the back side of the chassis 14a as described above, whereas the other end (the other end) ) Is connected to the array substrate 11 b in the liquid crystal panel 11, the cross-sectional shape is bent so as to be a substantially channel type in the liquid crystal display device 10. At both ends of the flexible substrate 13, the wiring pattern is exposed to the outside to form terminal portions (not shown), and these terminal portions are electrically connected to the control circuit substrate 12 and the array substrate 11b, respectively. It is connected. Accordingly, it is possible to transmit the driving power, the reference potential, and the input signal related to the image supplied from the control circuit board 12 side to the liquid crystal panel 11 side.
　ドライバ２１は、図１に示すように、内部に駆動回路２１ａを有するＬＳＩチップからなるものとされ、電源である制御回路基板１２から供給される駆動電力及び基準電位に基づいて作動することで、信号供給源である制御回路基板１２から供給される画像に係る入力信号を処理して出力信号を生成し、その出力信号を液晶パネル１１の表示部ＡＡへと出力するものとされる。このドライバ２１は、平面に視て横長の方形状をなすとともに、液晶パネル１１のアレイ基板１１ｂに対して直接実装され、つまりＣＯＧ（Chip On Glass）実装されている。なお、ドライバ２１の長辺方向がＸ軸方向と一致し、同短辺方向がＹ軸方向と一致している。 As shown in FIG. 1, the driver 21 is composed of an LSI chip having a drive circuit 21a therein, and operates based on drive power and a reference potential supplied from the control circuit board 12 as a power source. An input signal related to an image supplied from the control circuit board 12 that is a signal supply source is processed to generate an output signal, and the output signal is output to the display unit AA of the liquid crystal panel 11. The driver 21 has a horizontally long rectangular shape when seen in a plan view, and is directly mounted on the array substrate 11b of the liquid crystal panel 11, that is, COG (Chip On Glass). The long side direction of the driver 21 coincides with the X-axis direction, and the short side direction coincides with the Y-axis direction.
　次に、液晶パネル１１におけるアレイ基板１１ｂと、フレキシブル基板１３及びドライバ２１との接続構造について詳細に説明する。アレイ基板１１ｂのうちＣＦ基板１１ａとは重畳しない非重畳部分には、図１に示すように、ドライバ２１がＣＯＧ実装されるとともに、そのドライバ２１に隣り合う位置にフレキシブル基板１３の端部が接続されている。フレキシブル基板１３の端部は、アレイ基板１１ｂのうち長辺方向について表示部ＡＡ側とは反対側の端縁部に接続されるのに対し、ドライバ２１は、アレイ基板１１ｂのうち接続されたフレキシブル基板１３の端部と表示部ＡＡとの間の位置に実装されている。そして、アレイ基板１１ｂにおけるフレキシブル基板１３の実装領域には、図４に示すように、フレキシブル基板１３側から駆動電力、基準電位及び入力信号の供給を受ける駆動電力供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４が形成されている。その一方、アレイ基板１１ｂにおけるドライバ２１の実装領域及びドライバ２１には、駆動電力、基準電位、入力信号及び出力信号の伝送を図るための電源端子部２５、グランド端子部２６、入力側端子部２７及び出力側端子部２８がそれぞれ対をなす形で形成されている。 Next, the connection structure between the array substrate 11b, the flexible substrate 13 and the driver 21 in the liquid crystal panel 11 will be described in detail. As shown in FIG. 1, the driver 21 is COG mounted on the non-overlapping portion of the array substrate 11 b that does not overlap with the CF substrate 11 a, and the end of the flexible substrate 13 is connected to a position adjacent to the driver 21. Has been. The end of the flexible substrate 13 is connected to the end edge of the array substrate 11b opposite to the display unit AA in the long side direction, whereas the driver 21 is connected to the flexible substrate connected to the array substrate 11b. It is mounted at a position between the end portion of the substrate 13 and the display portion AA. In the mounting area of the flexible substrate 13 on the array substrate 11b, as shown in FIG. 4, a drive power supply terminal unit 22 that receives supply of drive power, a reference potential, and an input signal from the flexible substrate 13 side, a reference potential supply terminal A portion 23 and a signal supply terminal portion 24 are formed. On the other hand, the mounting area of the driver 21 on the array substrate 11b and the driver 21 include a power terminal 25, a ground terminal 26, and an input terminal 27 for transmitting drive power, reference potential, input signal, and output signal. The output side terminal portions 28 are formed in pairs.
　駆動電力供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４について詳しく説明する。駆動電力供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４は、図４に示すように、いずれもゲート配線１９またはソース配線２０と同じ金属材料からなるとともにその表面が画素電極１８と同じＩＴＯ或いはＺｎＯといった透明電極材料により被覆されており、製造工程においてゲート配線１９またはソース配線２０や画素電極１８をパターニングする際に既知のフォトリソグラフィー法によりこれらと同時にアレイ基板１１ｂ上にパターニングされている。駆動電力供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４は、設置されたアレイ基板１１ｂの端縁部の辺（短辺方向、Ｘ軸方向）に沿ってほぼ等間隔に並列して配されている。このうち信号供給端子部２４については、複数備えられている。これら駆動電力供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４は、ＡＣＦ（異方性導電剤）２９を介してフレキシブル基板１３のうち制御回路基板１２側とは反対側の端部に形成された対応する各端子部（図示しない）に電気的に且つ機械的に接続される。これにより、駆動電力供給端子部２２は、図８に示すように、フレキシブル基板１３から駆動電力の供給を受けることが可能とされ、基準電位供給端子部２３は、フレキシブル基板１３から基準電位の供給を受けることが可能とされ、さらには信号供給端子部２４は、フレキシブル基板１３から画像に係る入力信号の供給を受けることが可能とされる。なお、図８では、画像に係る入力信号及び出力信号の伝送経路については左端に配した矢線により示し、駆動電力の伝送経路については中央に配した矢線により示し、基準電位の伝送経路については右端に配した矢線により示している。 The drive power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 will be described in detail. As shown in FIG. 4, the drive power supply terminal portion 22, the reference potential supply terminal portion 23, and the signal supply terminal portion 24 are all made of the same metal material as that of the gate wiring 19 or the source wiring 20, and the surface thereof is the pixel electrode 18. Is coated with a transparent electrode material such as ITO or ZnO, and is patterned on the array substrate 11b at the same time by a known photolithography method when patterning the gate wiring 19 or the source wiring 20 or the pixel electrode 18 in the manufacturing process. ing. The drive power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 are arranged in parallel at substantially equal intervals along the side (short side direction, X-axis direction) of the edge portion of the installed array substrate 11b. It is arranged. Of these, a plurality of signal supply terminal portions 24 are provided. The drive power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 are connected to an end of the flexible substrate 13 opposite to the control circuit substrate 12 side through an ACF (anisotropic conductive agent) 29. It is electrically and mechanically connected to each corresponding terminal part (not shown) formed in the part. As a result, the drive power supply terminal unit 22 can receive drive power from the flexible substrate 13 as shown in FIG. 8, and the reference potential supply terminal unit 23 can supply the reference potential from the flexible substrate 13. In addition, the signal supply terminal unit 24 can receive an input signal related to an image from the flexible substrate 13. In FIG. 8, the transmission path of the input signal and output signal related to the image is indicated by an arrow line arranged at the left end, the transmission path of the driving power is indicated by an arrow line arranged in the center, and the transmission path of the reference potential is shown. Is indicated by an arrow line at the right end.
　続いて、電源端子部２５、グランド端子部２６、入力側端子部２７及び出力側端子部２８について詳しく説明する。電源端子部２５、グランド端子部２６及び入力側端子部２７は、図４に示すように、アレイ基板１１ｂにおけるドライバ２１の実装領域及びドライバ２１のうち上記した各供給端子部２２～２４側、つまり表示部ＡＡ側とは反対側にそれぞれ配されているのに対し、出力側端子部２８は、アレイ基板１１ｂにおけるドライバ２１の実装領域及びドライバ２１のうち各供給端子部２２～２４側とは反対側、つまり表示部ＡＡ側に配されている。このように、各端子部２５～２８は、いずれもドライバ２１における外周縁部に位置する、いわゆるペリフェラル配置とされている。そして、電源端子部２５、グランド端子部２６、入力側端子部２７及び出力側端子部２８は、アレイ基板１１ｂ側とドライバ２１側とでそれぞれ対をなす形で配されるとともに対応するもの同士が電気的に接続されることで、駆動電力、基準電位及び入力信号をアレイ基板１１ｂ（電源及び信号供給源である駆動制御基板１２）側からドライバ２１側へ、出力信号をドライバ２１側からアレイ基板１１ｂ（表示部ＡＡ）側へそれぞれ伝送することが可能とされる（図８を参照）。 Subsequently, the power terminal 25, the ground terminal 26, the input terminal 27, and the output terminal 28 will be described in detail. As shown in FIG. 4, the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are mounted on the array substrate 11b and on the supply terminal portions 22 to 24 side of the driver 21, that is, on the supply terminal portions 22 to 24 side. Whereas the output side terminal portion 28 is disposed on the opposite side to the display portion AA side, the output side terminal portion 28 is opposite to the mounting region of the driver 21 on the array substrate 11b and the supply terminal portions 22 to 24 side of the driver 21. Is arranged on the display unit AA side. As described above, each of the terminal portions 25 to 28 has a so-called peripheral arrangement located at the outer peripheral edge portion of the driver 21. The power supply terminal unit 25, the ground terminal unit 26, the input side terminal unit 27, and the output side terminal unit 28 are arranged in pairs on the array substrate 11b side and the driver 21 side, and corresponding ones are arranged. By being electrically connected, the drive power, the reference potential, and the input signal are transferred from the array substrate 11b (drive control substrate 12 that is a power source and a signal supply source) to the driver 21 side, and the output signal is transferred from the driver 21 side to the array substrate. 11b (display section AA) can be transmitted (see FIG. 8).
　電源端子部２５、グランド端子部２６及び入力側端子部２７は、図５に示すように、ドライバ２１の長辺方向（Ｘ軸方向）に沿ってほぼ等間隔に並列するとともに、ドライバ２１及びその実装領域のうち表示部ＡＡ側とは反対側の外縁部に位置して配されている。このうち入力側端子部２７については、複数備えられている。なお、電源端子部２５、グランド端子部２６及び入力側端子部２７の幅寸法及び配列ピッチは、いずれも出力側端子部２８よりも大きなものとされる。電源端子部２５、グランド端子部２６及び入力側端子部２７は、それぞれアレイ基板１１ｂにおけるドライバ２１の実装領域に形成された第１電源端子部２５ａ、第１グランド端子部２６ａ及び第１入力側端子部２７ａと、ドライバ２１に形成された第２電源端子部２５ｂ、第２グランド端子部２６ｂ及び第２入力側端子部２７ｂとから構成されている。このうち、アレイ基板１１ｂ側に形成された第１電源端子部２５ａ、第１グランド端子部２６ａ及び第１入力側端子部２７ａは、図４及び図５に示すようにいずれも既述した各供給端子部２２～２４と同様に、ゲート配線１９またはソース配線２０と同じ金属材料からなるとともにその表面が画素電極１８と同じＩＴＯ或いはＺｎＯといった透明電極材料により被覆されており、製造工程においてゲート配線１９またはソース配線２０や画素電極１８をパターニングする際に既知のフォトリソグラフィー法によりこれらと同時にアレイ基板１１ｂ上にパターニングされている。第１電源端子部２５ａは、駆動電力供給端子部２２に、第１グランド端子部２６ａは、基準電位供給端子部２３に、第１入力側端子部２７ａは、信号供給端子部２４にそれぞれ対応して図示しない中継配線を介して接続されており、それぞれ駆動電力、基準電位及び入力信号の供給を受けるものとされる。なお、この中継配線については、透明電極材料による被覆が除去されている点を除いては上記した各端子部２２～２４，２５ａ～２７ａと同様の構成であり、ゲート配線１９またはソース配線２０と同じ金属材料からなる。 As shown in FIG. 5, the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are arranged in parallel at substantially equal intervals along the long side direction (X-axis direction) of the driver 21. In the mounting area, it is located on the outer edge portion on the opposite side to the display portion AA side. Among these, a plurality of input side terminal portions 27 are provided. Note that the width dimension and the arrangement pitch of the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are all larger than those of the output side terminal portion 28. The power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 are respectively a first power supply terminal portion 25a, a first ground terminal portion 26a, and a first input side terminal formed in the mounting area of the driver 21 on the array substrate 11b. And a second power terminal portion 25b, a second ground terminal portion 26b, and a second input terminal portion 27b formed in the driver 21. Among these, the first power supply terminal portion 25a, the first ground terminal portion 26a, and the first input side terminal portion 27a formed on the array substrate 11b side are each supplied as described above as shown in FIGS. Like the terminal portions 22 to 24, the gate wiring 19 or the source wiring 20 is made of the same metal material, and the surface thereof is covered with the same transparent electrode material such as ITO or ZnO as the pixel electrode 18. In the manufacturing process, the gate wiring 19 Alternatively, the source wiring 20 and the pixel electrode 18 are patterned on the array substrate 11b at the same time by a known photolithography method when patterning. The first power terminal 25a corresponds to the drive power supply terminal 22, the first ground terminal 26a corresponds to the reference potential supply terminal 23, and the first input terminal 27a corresponds to the signal supply terminal 24. Are connected via a relay wiring (not shown) and are supplied with driving power, reference potential and input signal, respectively. The relay wiring has the same configuration as each of the terminal portions 22 to 24 and 25a to 27a except that the covering with the transparent electrode material is removed. Made of the same metallic material.
　一方、第２電源端子部２５ｂ、第２グランド端子部２６ｂ及び第２入力側端子部２７ｂは、図５に示すように、ドライバ２１のうち底面、つまりアレイ基板１１ｂとの対向面にそれぞれ形成されている。従って、このドライバ２１は、アレイ基板１１ｂに対してフェイスダウン実装されることになる。第２電源端子部２５ｂ、第２グランド端子部２６ｂ及び第２入力側端子部２７ｂは、金などの導電性に優れた金属膜からなるとともにドライバ２１の底面から突出するバンプ状をなしており、その突出寸法はアレイ基板１１ｂからの第１電源端子部２５ａ、第１グランド端子部２６ａ及び第１入力側端子部２７ａの各突出寸法よりも相対的に大きなものとされる。なお、各端子部２５ｂ～２７ｂを除いたドライバ２１内の配線に関しては、銅やアルミニウムなどの材料からなる。そして、それぞれ対をなす第１電源端子部２５ａ及び第２電源端子部２５ｂと、第１グランド端子部２６ａ及び第２グランド端子部２６ｂと、第１入力側端子部２７ａ及び第２入力側端子部２７ｂとは、互いに対向状をなした状態でＡＣＦ（異方性導電剤）３０を介して電気的に且つ機械的に接続されている。このＡＣＦ３０は、熱硬化性樹脂からなる接着材料中に導電性粒子３０ａを分散配合してなるものであり、含有される導電性粒子３０ａは合成樹脂製のビーズ（プラスチックビーズ）の周面に導電膜をコーティングしてなるとともに弾性を有している。このＡＣＦ３０をアレイ基板１１ｂにおける実装領域に貼り付けた状態でドライバ２１を実装すると、互いに対向状をなす第１電源端子部２５ａ及び第２電源端子部２５ｂと、第１グランド端子部２６ａ及び第２グランド端子部２６ｂと、第１入力側端子部２７ａ及び第２入力側端子部２７ｂとがそれぞれ導電性粒子３０ａを介して間接的に接触されて電気的な接続が図られるとともに接着材料が硬化することで機械的な保持が図られる。なお、導電性粒子３０ａは、その外径寸法が例えば３μｍ～５μｍ程度とされる。 On the other hand, the second power terminal portion 25b, the second ground terminal portion 26b, and the second input side terminal portion 27b are respectively formed on the bottom surface of the driver 21, that is, the surface facing the array substrate 11b, as shown in FIG. ing. Therefore, the driver 21 is mounted face down on the array substrate 11b. The second power supply terminal portion 25b, the second ground terminal portion 26b, and the second input side terminal portion 27b are made of a metal film excellent in conductivity such as gold and have a bump shape protruding from the bottom surface of the driver 21, The projecting dimensions are relatively larger than the projecting dimensions of the first power supply terminal portion 25a, the first ground terminal portion 26a, and the first input side terminal portion 27a from the array substrate 11b. The wiring in the driver 21 excluding the terminal portions 25b to 27b is made of a material such as copper or aluminum. The first power terminal portion 25a and the second power terminal portion 25b, the first ground terminal portion 26a and the second ground terminal portion 26b, the first input side terminal portion 27a, and the second input side terminal portion, respectively, are paired. 27b is electrically and mechanically connected through an ACF (anisotropic conductive agent) 30 in a state of being opposed to each other. The ACF 30 is obtained by dispersing and blending conductive particles 30a in an adhesive material made of a thermosetting resin, and the conductive particles 30a contained are conductive on the peripheral surface of synthetic resin beads (plastic beads). The film is coated and has elasticity. When the driver 21 is mounted with the ACF 30 attached to the mounting area of the array substrate 11b, the first power terminal portion 25a and the second power terminal portion 25b, the first ground terminal portion 26a, and the second power terminal portion 25b that face each other. The ground terminal portion 26b, the first input side terminal portion 27a, and the second input side terminal portion 27b are indirectly contacted via the conductive particles 30a to achieve electrical connection and the adhesive material is cured. Thus, mechanical holding is achieved. The outer diameter of the conductive particles 30a is, for example, about 3 μm to 5 μm.
　出力側端子部２８は、図６に示すように、ドライバ２１の長辺方向（Ｘ軸方向）に沿って複数がほぼ等間隔に並列するとともに、ドライバ２１及びその実装領域のうち表示部ＡＡ側の外縁部に位置して配されている。出力側端子部２８の設置数は、入力側端子部２７よりも相対的に多いものとされ、表示部ＡＡに表示される画像が高解像度化されるほど多くなる傾向にある。出力側端子部２８は、ドライバ２１に形成された第１出力側端子部２８ａと、アレイ基板１１ｂにおけるドライバ２１の実装領域に形成された第２出力側端子部２８ｂとから構成されている。このうち、アレイ基板１１ｂ側に形成された第２出力側端子部２８ｂは、図４及び図６に示すように、いずれも既述した各供給端子部２２～２４、第１電源端子部２５ａ、第１グランド端子部２６ａ及び第１入力側端子部２７ａと同様に、ゲート配線１９またはソース配線２０と同じ金属材料からなるとともにその表面が画素電極１８と同じＩＴＯ或いはＺｎＯといった透明電極材料により被覆されており、製造工程においてゲート配線１９またはソース配線２０や画素電極１８をパターニングする際に既知のフォトリソグラフィー法によりこれらと同時にアレイ基板１１ｂ上にパターニングされている。この第２出力側端子部２８ｂには、表示部ＡＡに配されたゲート配線１９及びソース配線２０から引き廻された引廻配線部（図示せず）が接続されており、それにより第２出力側端子部２８ｂに伝送された出力信号を表示部ＡＡのゲート配線１９及びソース配線２０を介してＴＦＴ１７に供給することが可能とされる。なお、出力信号には、ゲート配線１９に供給される走査信号と、ソース配線２０に供給されるデータ信号とが含まれる。 As shown in FIG. 6, a plurality of output side terminal portions 28 are arranged in parallel at substantially equal intervals along the long side direction (X-axis direction) of the driver 21, and the driver 21 and its mounting area on the display unit AA side. It is located at the outer edge of the. The number of the output side terminal portions 28 installed is relatively larger than that of the input side terminal portion 27, and tends to increase as the resolution of the image displayed on the display portion AA increases. The output side terminal portion 28 includes a first output side terminal portion 28a formed in the driver 21 and a second output side terminal portion 28b formed in the mounting area of the driver 21 on the array substrate 11b. Among these, as shown in FIGS. 4 and 6, the second output side terminal portion 28b formed on the array substrate 11b side has the supply terminal portions 22 to 24, the first power supply terminal portion 25a, Similar to the first ground terminal portion 26a and the first input side terminal portion 27a, the gate wiring 19 or the source wiring 20 is made of the same metal material and the surface thereof is covered with the same transparent electrode material such as ITO or ZnO as the pixel electrode 18. When the gate wiring 19 or the source wiring 20 and the pixel electrode 18 are patterned in the manufacturing process, they are simultaneously patterned on the array substrate 11b by a known photolithography method. The second output side terminal portion 28b is connected with a routing wiring portion (not shown) routed from the gate wiring 19 and the source wiring 20 arranged in the display portion AA, thereby the second output. The output signal transmitted to the side terminal portion 28b can be supplied to the TFT 17 via the gate wiring 19 and the source wiring 20 of the display portion AA. Note that the output signal includes a scanning signal supplied to the gate wiring 19 and a data signal supplied to the source wiring 20.
　一方、第１出力側端子部２８ａは、図６に示すように、第２電源端子部２５ｂ、第２グランド端子部２６ｂ及び第２入力側端子部２７ｂと同様に、金属材料からなるとともにドライバ２１のうち底面、つまりアレイ基板１１ｂとの対向面に形成されている。従って、ドライバ２１がアレイ基板１１ｂに対してフェイスダウン実装されると、第１出力側端子部２８ａは、第２出力側端子部２８ｂに対して対向状に配されることになる。そして、第１出力側端子部２８ａ及び第２出力側端子部２８ｂは、共にコイル状をなすとともに相互に誘導結合されることで出力信号の伝送が可能とされている。つまり、出力側端子部２８においては、接触（有線方式）による伝送を図る電源端子部２５、グランド端子部２６及び入力側端子部２７とは異なり、非接触（無線方式）での信号伝送を実現している。詳しくは、第２出力側端子部２８ｂは、図７に示すように、アレイ基板１１ｂの板面上において金属膜を渦巻き状にパターニングすることで形成されている。第１出力側端子部２８ａは、ドライバ２１の底面において金属膜を渦巻き状にパターニングすることで形成されている。つまり、第１出力側端子部２８ａ及び第２出力側端子部２８ｂは、既知の半導体の配線形成プロセスで用いられるフォトリソグラフィー法によって形成されるので、容易に微細化を図ることが可能とされるのに加え、その膜厚がＡＣＦ３０によって接続が図られるためにバンプ状をなす電源端子部２５、グランド端子部２６及び入力側端子部２７に比べると、極めて薄いものとされる。なお、出力側端子部２８の幅寸法及び配列ピッチは、共に電源端子部２５、グランド端子部２６及び入力側端子部２７よりも小さなものとされ、例えば１５μｍ～３０μｍ程度とされる。これら第１出力側端子部２８ａ及び第２出力側端子部２８ｂは、互いにほぼ同心状をなしつつ対向配置されている。このうち、第１出力側端子部２８ａに駆動回路２１ａから一次電流が供給されると、磁束が発生し、その磁束によって第２出力側端子部２８ｂに二次電流が誘導され、もって出力信号が表示部ＡＡ側に伝送されるようになっている。なお、ドライバ２１側には、出力信号の送信を制御するための送信制御部３１及び送信回路３２が備えられるのに対し、アレイ基板１１ｂ側には、出力信号を受信するための受信制御部３３及び受信回路３４が備えられている。 On the other hand, as shown in FIG. 6, the first output-side terminal portion 28a is made of a metal material and the driver 21 like the second power supply terminal portion 25b, the second ground terminal portion 26b, and the second input-side terminal portion 27b. Are formed on the bottom surface, that is, the surface facing the array substrate 11b. Therefore, when the driver 21 is mounted face-down on the array substrate 11b, the first output-side terminal portion 28a is arranged to face the second output-side terminal portion 28b. The first output-side terminal portion 28a and the second output-side terminal portion 28b are both coiled and inductively coupled to each other so that an output signal can be transmitted. In other words, in the output side terminal unit 28, unlike the power terminal unit 25, the ground terminal unit 26, and the input side terminal unit 27, which perform contact (wired) transmission, non-contact (wireless) signal transmission is realized. is doing. Specifically, as shown in FIG. 7, the second output side terminal portion 28b is formed by patterning a metal film spirally on the plate surface of the array substrate 11b. The first output-side terminal portion 28a is formed by patterning a metal film in a spiral shape on the bottom surface of the driver 21. That is, since the first output side terminal portion 28a and the second output side terminal portion 28b are formed by a photolithography method used in a known semiconductor wiring formation process, the first output side terminal portion 28a and the second output side terminal portion 28b can be easily miniaturized. In addition, since the film thickness is connected by the ACF 30, the film thickness is extremely thin compared to the power supply terminal portion 25, the ground terminal portion 26, and the input-side terminal portion 27 that form bumps. The width dimension and arrangement pitch of the output side terminal portions 28 are all smaller than those of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, and are, for example, about 15 μm to 30 μm. The first output side terminal portion 28a and the second output side terminal portion 28b are opposed to each other while being substantially concentric with each other. Among these, when a primary current is supplied from the drive circuit 21a to the first output side terminal portion 28a, a magnetic flux is generated, and a secondary current is induced to the second output side terminal portion 28b by the magnetic flux, so that an output signal is generated. It is transmitted to the display unit AA side. The driver 21 is provided with a transmission control unit 31 and a transmission circuit 32 for controlling transmission of output signals, whereas the array substrate 11b is provided with a reception control unit 33 for receiving output signals. And a receiving circuit 34 is provided.
　互いに対向状をなす第１出力側端子部２８ａ及び第２出力側端子部２８ｂは、図６に示すように、電源端子部２５、グランド端子部２６及び入力側端子部２７と同じ、ＡＣＦ３０によって接着されることで機械的な保持が図られている。すなわち、ＡＣＦ３０は、アレイ基板１１ｂにおいてドライバ２１の実装領域のほぼ全域にわたって配され、言い換えると第１電源端子部２５ａ、第１グランド端子部２６ａ、第１入力側端子部２７ａ及び第２出力側端子部２８ｂの各配置領域に跨る範囲に配されている。ＡＣＦ３０には、導電性粒子３０ａが含有されているものの、次述するスペーサ３５によって互いに対向状をなす第１出力側端子部２８ａと第２出力側端子部２８ｂとの間には、十分な間隔が空けられているので、両者２８ａ，２８ｂが導電性粒子３０ａによって短絡される事態が生じるのが防がれている。スペーサ３５は、並列配置された出力側端子部２８群をその並列方向（Ｘ軸方向）の両側から挟み込む位置に一対配されている。スペーサ３５は、ドライバ２１の底面から突出するバンプ状をなしており、その突出先端部が直接的にまたは導電性粒子３０ａを介して間接的にアレイ基板１１ｂに当接されることで、ドライバ２１とアレイ基板２１との間の間隔（ギャップ）、つまり第１入力側端子部２７ａと第２出力側端子部２８ｂとの間の距離を一定の大きさに規制することが可能とされる。 The first output side terminal portion 28a and the second output side terminal portion 28b, which are opposed to each other, are bonded to each other by the ACF 30, as shown in FIG. 6, similar to the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27. As a result, mechanical holding is achieved. That is, the ACF 30 is arranged over almost the entire mounting area of the driver 21 on the array substrate 11b. In other words, the first power terminal portion 25a, the first ground terminal portion 26a, the first input terminal portion 27a, and the second output terminal. It arrange | positions in the range over each arrangement | positioning area | region of the part 28b. Although the ACF 30 contains the conductive particles 30a, a sufficient distance is provided between the first output side terminal portion 28a and the second output side terminal portion 28b that are opposed to each other by the spacer 35 described below. Therefore, it is possible to prevent a situation in which both the conductors 28a and 28b are short-circuited by the conductive particles 30a. A pair of spacers 35 are arranged at positions that sandwich the output-side terminal portions 28 arranged in parallel from both sides in the parallel direction (X-axis direction). The spacer 35 has a bump shape protruding from the bottom surface of the driver 21, and the protruding tip is directly or indirectly contacted with the array substrate 11 b via the conductive particles 30 a, thereby the driver 21. It is possible to regulate the distance (gap) between the first input side terminal portion 27a and the second output side terminal portion 28b to a certain size.
　本実施形態は以上のような構造であり、続いてその作用を説明する。液晶表示装置１０の製造方法について説明する。既知の製造方法を経て得られた液晶パネル１１のうちアレイ基板１１ｂにおけるフレキシブル基板１３及びドライバ２１の各実装領域にそれぞれＡＣＦ２９，３０を貼り付ける。続いて、アレイ基板１１ｂに対してドライバ２１を搭載するとともに、ドライバ２１のうち表示部ＡＡ側とは反対側の外縁部、つまり電源端子部２５、グランド端子部２６及び入力側端子部２７の配置領域を加圧しつつ加熱することで、図５に示すように、それぞれ対をなす電源端子部２５、グランド端子部２６及び入力側端子部２７の電気的な接続を図るとともに、ドライバ２１をアレイ基板１１ｂに対して機械的に固着する。このとき、それぞれ対をなす電源端子部２５、グランド端子部２６及び入力側端子部２７は、対応するもの同士がＡＣＦ３０に含まれる導電性粒子３０ａを介して間接的に接触される。一方、出力側端子部２８については、図６に示すように、スペーサ３５がアレイ基板１１ｂに当接されることで、対をなすもの間の距離が一定に規制されることもあって、対をなすもの同士が導電性粒子３０ａによって短絡されることなく、互いに非接触状態で対向状に保たれる。そもそも出力側端子部２８は、ＡＣＦ３０によって接続が図られるためにバンプ状をなす電源端子部２５、グランド端子部２６及び入力側端子部２７に比べると、膜厚が極めて薄いものとされているので、本来的にＡＣＦ３０の導電性粒子３０ａによって対向状をなすもの同士や隣り合うもの同士が短絡する事態が極めて生じ難いものとされる。このように、ドライバ２１側の各端子部２５ｂ～２７ｂ，２８ａとアレイ基板１１ｂ側の各端子部２５ａ～２７ａ，２８ｂとが同一の接着材料であるＡＣＦ３０によって機械的に接続されることから、接続に係る工程、条件、製造設備などを全て共通化することができ、もってタクトタイムの短縮化や製造コストの低廉化などを図ることができる。 This embodiment has the structure as described above, and its operation will be described next. A method for manufacturing the liquid crystal display device 10 will be described. In the liquid crystal panel 11 obtained through a known manufacturing method, the ACFs 29 and 30 are respectively attached to the mounting regions of the flexible substrate 13 and the driver 21 in the array substrate 11b. Subsequently, the driver 21 is mounted on the array substrate 11b, and the outer edge portion of the driver 21 opposite to the display portion AA side, that is, the arrangement of the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 is arranged. By heating the region while applying pressure, as shown in FIG. 5, the power supply terminal portion 25, the ground terminal portion 26, and the input-side terminal portion 27 that make a pair are electrically connected, and the driver 21 is connected to the array substrate. It adheres mechanically to 11b. At this time, the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 that make a pair are indirectly in contact with each other via the conductive particles 30 a included in the ACF 30. On the other hand, as shown in FIG. 6, with respect to the output side terminal portion 28, the spacer 35 is brought into contact with the array substrate 11b. Are not short-circuited by the conductive particles 30a and are kept in contact with each other in a non-contact state. In the first place, since the output side terminal portion 28 is connected by the ACF 30, the film thickness is extremely thin compared to the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 which are in the form of bumps. It is considered that it is extremely difficult to cause a situation in which the opposing particles by the conductive particles 30a of the ACF 30 or adjacent ones are short-circuited. In this way, the terminal portions 25b to 27b, 28a on the driver 21 side and the terminal portions 25a to 27a, 28b on the array substrate 11b side are mechanically connected by the ACF 30 that is the same adhesive material, so that the connection The processes, conditions, manufacturing facilities, and the like related to the above can be made common, and thus the tact time can be shortened and the manufacturing cost can be reduced.
　上記のようにしてドライバ２１の実装を行う一方で、図４に示すように、フレキシブル基板１３の端部をアレイ基板１１ｂにおける実装領域上に載せるとともに、加圧しつつ加熱することでＡＣＦ２９を介して電気的な接続及び機械的な保持が図られる。これにより、フレキシブル基板１３からアレイ基板１１ｂの駆動電力供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４に対して駆動電力、基準電位及び入力信号の供給が可能とされる。なお、フレキシブル基板１３におけるもう一方の端部については、制御回路基板１２に対して上記と同様にＡＣＦを介して接続される。上記のようにして相互に接続された液晶パネル１１、制御回路基板１２及びフレキシブル基板１３がバックライト装置１４に組み付けられた後、それらが外装部材１５，１６内に収容されることで、図２に示すように、液晶表示装置１０が得られる。なお、上記した製造手順に関しては、順番を適宜に変更することが可能であり、例えば液晶パネル１１及び制御回路基板１２を予めバックライト装置１２に組み付けた状態でフレキシブル基板１２の接続を行うようにしても構わない。 While the driver 21 is mounted as described above, as shown in FIG. 4, the end of the flexible substrate 13 is placed on the mounting region of the array substrate 11b and heated while being pressed via the ACF 29. Electrical connection and mechanical retention are achieved. Accordingly, the driving power, the reference potential, and the input signal can be supplied from the flexible substrate 13 to the driving power supply terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24 of the array substrate 11b. Note that the other end of the flexible substrate 13 is connected to the control circuit substrate 12 through the ACF in the same manner as described above. After the liquid crystal panel 11, the control circuit board 12, and the flexible board 13 connected to each other as described above are assembled in the backlight device 14, they are accommodated in the exterior members 15 and 16, so that FIG. As shown, the liquid crystal display device 10 is obtained. In addition, regarding the above-described manufacturing procedure, the order can be appropriately changed. For example, the flexible substrate 12 is connected in a state where the liquid crystal panel 11 and the control circuit substrate 12 are assembled in the backlight device 12 in advance. It doesn't matter.
　上記のようにして製造された液晶表示装置１０の電源をＯＮすると、制御回路基板１２からフレキシブル基板１３を介して画像信号が液晶パネル１１に供給されるとともに、バックライト装置１４における光源からの光が液晶パネル１１に照射されることで、液晶パネル１１の表示部ＡＡに所定の画像が表示されるようになっている。以下では、液晶パネル１１に供給される画像信号などの伝送経路に関して詳しく説明する。 When the power supply of the liquid crystal display device 10 manufactured as described above is turned on, an image signal is supplied from the control circuit board 12 to the liquid crystal panel 11 via the flexible substrate 13 and light from the light source in the backlight device 14 is also supplied. Is irradiated onto the liquid crystal panel 11 so that a predetermined image is displayed on the display unit AA of the liquid crystal panel 11. Hereinafter, a transmission path for image signals and the like supplied to the liquid crystal panel 11 will be described in detail.
　制御回路基板１２にて生成された駆動電力、基準電位及びドライバ２１に対する入力信号は、図８に示すように、フレキシブル基板１３を介して液晶パネル１１のアレイ基板１１ｂに形成された対応する電源供給端子部２２、基準電位供給端子部２３及び信号供給端子部２４にそれぞれ供給される。アレイ基板１１ｂ上において、電源供給端子部２２には電源端子部２５を構成する第１電源端子部２５ａが、基準電位供給端子部２３にはグランド端子部２６を構成する第１グランド端子部２６ａが、信号供給端子部２４には入力側端子部２７を構成する第１入力側端子部２７ａがそれぞれ中継配線を介して接続されているので、これらに駆動電力、基準電位及び入力信号がそれぞれ供給される。第１電源端子部２５ａ、第１グランド端子部２６ａ及び第１入力端子部２７ａは、それぞれ対をなすとともにドライバ２１に形成された第２電源端子部２５ｂ、第２グランド端子部２６ｂ及び第２入力側端子部２７ｂに、ＡＣＦ３０の導電性粒子３０ａを介して間接的に接触されていることから（図５を参照）、これらに駆動電力、基準電位及び入力信号がそれぞれ入力される。 As shown in FIG. 8, the driving power, the reference potential and the input signal to the driver 21 generated by the control circuit board 12 are supplied to the corresponding power supply formed on the array board 11b of the liquid crystal panel 11 via the flexible board 13. The voltage is supplied to the terminal unit 22, the reference potential supply terminal unit 23, and the signal supply terminal unit 24, respectively. On the array substrate 11b, the power supply terminal portion 22 has a first power supply terminal portion 25a constituting the power supply terminal portion 25, and the reference potential supply terminal portion 23 has a first ground terminal portion 26a constituting the ground terminal portion 26. Since the first input side terminal portion 27a constituting the input side terminal portion 27 is connected to the signal supply terminal portion 24 via the relay wiring, the driving power, the reference potential, and the input signal are respectively supplied thereto. The The first power supply terminal portion 25a, the first ground terminal portion 26a, and the first input terminal portion 27a are paired with each other, and the second power supply terminal portion 25b, the second ground terminal portion 26b, and the second input that are formed in the driver 21. Since it is indirectly in contact with the side terminal portion 27b via the conductive particles 30a of the ACF 30 (see FIG. 5), the driving power, the reference potential, and the input signal are respectively input thereto.
　ドライバ２１では、駆動電力及び基準電位の供給を受けて駆動回路２１ａが作動し、入力された入力信号が処理されて出力信号が生成される。生成された出力信号は、駆動回路２１ａから出力側端子部２８を構成する第１出力側端子部２８ａに供給される。本実施形態においては、この第１出力側端子部２８ａが第２出力側端子部２８ｂに対して誘導結合されることで信号伝送を図るようにしていることから、第１出力側端子部２８ａに供給される出力信号は、駆動回路２１ａに備えられる送信制御部３１及び送信回路３２（図７を参照）によって誘導結合による伝送に適したものとなっている。図７に示すように、コイル状をなす第１出力側端子部２８ａに出力信号に基づいた一次電流が供給されると、その中心に磁束が発生する。発生した磁束は、第１出力側端子部２８ａに対して対向状をなし且つ同心状に配されたコイル状の第２出力側端子部２８ｂに二次電流を誘導させる。この二次電流、つまり受信信号を、アレイ基板１１ｂ側に備えられた受信制御部３３及び受信回路３４では表示部ＡＡに配されたＴＦＴ１７を駆動するのに適した出力信号に変換してゲート配線１９及びソース配線２０に出力する。これにより、ＴＦＴ１７の駆動を適切に制御して表示部ＡＡに所定の画像を表示させることができる。なお、ＡＣＦ３０が吸湿によって膨潤した場合、ドライバ２１とアレイ基板１１ｂとの間の距離が増加するよう変位する可能性があるが、ＡＣＦ３０に含まれる導電性粒子３０ａの弾性によって電源端子部２５、グランド端子部２６及び入力側端子部２７における対をなすもの同士の接触状態が維持される。 In the driver 21, the drive circuit 21 a is activated by receiving the drive power and the reference potential, and the input signal is processed to generate an output signal. The generated output signal is supplied from the drive circuit 21a to the first output side terminal portion 28a constituting the output side terminal portion 28. In the present embodiment, since the first output side terminal portion 28a is inductively coupled to the second output side terminal portion 28b, signal transmission is performed. The supplied output signal is suitable for transmission by inductive coupling by the transmission control unit 31 and the transmission circuit 32 (see FIG. 7) provided in the drive circuit 21a. As shown in FIG. 7, when a primary current based on an output signal is supplied to the first output side terminal portion 28a having a coil shape, a magnetic flux is generated at the center thereof. The generated magnetic flux induces a secondary current in the coil-like second output side terminal portion 28b which is opposed to the first output side terminal portion 28a and arranged concentrically. This secondary current, that is, the received signal is converted into an output signal suitable for driving the TFT 17 arranged in the display unit AA in the reception control unit 33 and the reception circuit 34 provided on the array substrate 11b side, and gate wiring 19 and the source wiring 20. Thereby, the drive of TFT17 can be controlled appropriately and a predetermined image can be displayed on display AA. When the ACF 30 swells due to moisture absorption, there is a possibility that the distance between the driver 21 and the array substrate 11b is increased. However, the power supply terminal portion 25, the ground are grounded by the elasticity of the conductive particles 30a included in the ACF 30. The contact state between the pair of terminals 26 and input side terminals 27 is maintained.
　以上のように、ドライバ２１から液晶パネル１１の表示部ＡＡに出力される出力信号の伝送を、誘導結合による非接触状態での伝送により行うようにしているから、例えば表示する画像の高解像度化に伴って出力信号の数が著しく増加して出力側端子部２８の微細化が一層求められた場合でも、容易に対応することが可能とされる。詳しくは、従来のように出力側端子部の対をなすもの同士をＡＣＦを介して接触させた場合には、微細化に伴って短絡や絶縁性の低下などの問題が生じることが懸念され、さらにそれに対応すべくＡＣＦに含まれる導電性粒子の粒径を小さくすると、接続信頼性が悪化するといった問題が懸念される。その点、本実施形態によれば、出力側端子部２８は、対をなすものがそれぞれコイル状をなすとともに相互に誘導結合されることで出力信号の伝送が可能とされるものであるから、上記のような微細化に伴う実装上の問題が生じるのを回避することができる。しかも、対をなす出力側端子部２８がいずれもコイル状をなしているので、フォトリソグラフィー法などの半導体の配線形成プロセスを用いて極めて微細なパターンを形成することができ、もって微細化に容易に対応することができる。その上で、誘導結合による信号伝送を図ることで、伝送される出力信号が寄生容量などの影響を受け難くなって伝送速度の高速化に好適であるとともに、低消費電力化及び製造コストの低減を図る上でも好適とされる。一方、入力側端子部２７については、本来的に出力側端子部２８よりも扱う信号数が少ないことから、端子幅や配列ピッチが出力側端子部２８よりも大きな設計とされており、対をなすもの同士をＡＣＦ３０によって間接的に接触しても隣り合うもの同士が短絡することはない。電源側端子部２５及びグランド端子部２６については、対をなすもの同士がＡＣＦ３０によって間接的に接触されることで、駆動電力の供給及び基準電位の供給が図られているから、電源端子部２５においては各信号に比べて遙かに大きな電圧値である駆動電力を確実に供給することができ、グランド端子部２６においては基準電位を安定的に供給することができ、いずれもドライバ２１の安定的な動作に資する。 As described above, since the transmission of the output signal output from the driver 21 to the display unit AA of the liquid crystal panel 11 is performed by transmission in a non-contact state by inductive coupling, for example, the resolution of an image to be displayed is increased. Accordingly, even when the number of output signals is remarkably increased and further miniaturization of the output side terminal portion 28 is required, it is possible to easily cope with it. Specifically, when the pair of output side terminal portions are brought into contact with each other via the ACF as in the past, there is a concern that problems such as a short circuit and a decrease in insulation may occur with miniaturization, Furthermore, if the particle size of the conductive particles contained in the ACF is reduced to cope with this, there is a concern that the connection reliability deteriorates. In that respect, according to the present embodiment, the output side terminal portion 28 has a pair of coils and is capable of transmitting an output signal by being inductively coupled to each other. It is possible to avoid the problem of mounting due to the miniaturization as described above. In addition, since the output side terminal portions 28 that form a pair are all coil-shaped, an extremely fine pattern can be formed by using a semiconductor wiring formation process such as a photolithography method, thereby facilitating the miniaturization. It can correspond to. In addition, by conducting signal transmission by inductive coupling, the output signal to be transmitted is less affected by parasitic capacitance, etc., which is suitable for increasing the transmission speed, reducing power consumption and manufacturing cost. It is also suitable for achieving the above. On the other hand, since the input side terminal portion 27 inherently has a smaller number of signals than the output side terminal portion 28, the terminal width and the arrangement pitch are designed to be larger than those of the output side terminal portion 28. Even if the objects formed are contacted indirectly with each other by the ACF 30, adjacent ones are not short-circuited. About the power supply side terminal part 25 and the ground terminal part 26, since the thing which makes a pair is contacted indirectly by ACF30, supply of drive power and supply of a reference potential are aimed at, therefore, the power supply terminal part 25 , The driving power having a voltage value much larger than that of each signal can be reliably supplied, and the ground terminal 26 can stably supply the reference potential. Contributes to dynamic operation.
　そして、電源端子部２５、グランド端子部２６及び入力側端子部２７は、それぞれ対をなしているもの同士が共通のＡＣＦ３０を介して間接的に接触されていることから、全て一括して電気的な接続及び機械的な保持を図ることができるものとされる。つまり、電源端子部２５、グランド端子部２６及び入力側端子部２７の接続構造を共通化することができるから、仮に入力側端子部について上記した出力側端子部２８と同様に誘導結合によって信号伝送を図る構成として異なる接続構造の端子部が混在する場合に比べると、各端子部２５～２７の配置の自由度を高くすることができる。すなわち、電源端子部２５、グランド端子部２６、及び入力側端子部２７の配置を設計するに際して、仮に上記したように入力側端子部と電源端子部及びグランド端子部とで接続構造が異なっていると、接続作業の容易性や確実性などの観点から入力側端子部を対称に配置するとともに電源端子部及びグランド端子部からなる端子部群を対称に配置しなければならない、といった制約が生じるものの、本実施形態のように各端子部２５～２７の接続構造を共通化すれば上記のような制約が生じなくなり、もって各端子部２５～２７を自由にレイアウトすることができる。さらには、仮に入力側端子部が誘導結合によって信号伝送を図る構成とされると、新たに液晶パネル１１側に入力用の送信回路を、ドライバ２１側に入力用の受信回路を設置する必要が生じる可能性があって、そうなると液晶パネル１１の額縁部分に新たなスペースを確保する必要が生じる可能性があるが、本実施形態によればその必要がなく、もって液晶パネル１１の狭額縁化を図る上で好適である。しかも、接続に係る工程、条件、製造設備などを共通化することができるので、製造コストの低減などを図る上で好適とされる。しかも、ＡＣＦ３０は、電源端子部２５、グランド端子部２６、入力側端子部２７及び出力側端子部２８の各配置領域にわたって配されていることから、ＡＣＦ３０をアレイ基板１１ｂに対する貼り付けに係る作業に関しても簡略化を図ることができて製造コストの低減などを図る上でより好適とされる。さらには、誘導結合により信号伝送を行う出力側端子部２８が、電源端子部２５、グランド端子部２６及び入力側端子部２７のようなバンプ状をなしていないことから、導電性粒子３０ａの粒径が大きなＡＣＦ３０を使用しても短絡が生じるおそれがが殆どないので、粒径が大きな導電性粒子３０ａを含むＡＣＦ３０によって電源端子部２５、グランド端子部２６及び入力側端子部２７における接続信頼性を高いものとすることができる。 The power supply terminal portion 25, the ground terminal portion 26, and the input-side terminal portion 27 are all in a batch because each pair is indirectly contacted via a common ACF 30. Connection and mechanical holding can be achieved. That is, since the connection structure of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 can be made common, the input side terminal portion is signal-transmitted by inductive coupling in the same manner as the output side terminal portion 28 described above. As compared with the case where terminal portions having different connection structures are mixed, the degree of freedom of arrangement of the terminal portions 25 to 27 can be increased. That is, when designing the arrangement of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, the connection structure is different between the input side terminal portion, the power supply terminal portion, and the ground terminal portion as described above. However, from the viewpoint of ease of connection work and certainty, there is a restriction that the input side terminal portion must be arranged symmetrically and the terminal portion group consisting of the power supply terminal portion and the ground terminal portion must be arranged symmetrically. If the connection structure of each of the terminal portions 25 to 27 is made common as in the present embodiment, the above-described restrictions do not occur, and the terminal portions 25 to 27 can be laid out freely. Furthermore, if the input side terminal unit is configured to transmit signals by inductive coupling, it is necessary to newly install an input transmission circuit on the liquid crystal panel 11 side and an input reception circuit on the driver 21 side. If this happens, it may be necessary to secure a new space in the frame portion of the liquid crystal panel 11. However, according to the present embodiment, this is not necessary, and thus the liquid crystal panel 11 is narrowed. It is suitable for planning. In addition, since the process, conditions, manufacturing equipment, and the like related to the connection can be made common, it is suitable for reducing the manufacturing cost. Moreover, since the ACF 30 is arranged over the respective arrangement regions of the power supply terminal portion 25, the ground terminal portion 26, the input side terminal portion 27, and the output side terminal portion 28, the work related to the attachment of the ACF 30 to the array substrate 11b. However, it can be simplified and is more suitable for reducing the manufacturing cost. Furthermore, since the output side terminal portion 28 that performs signal transmission by inductive coupling does not have a bump shape like the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, the particles of the conductive particles 30a. Even if the ACF 30 having a large diameter is used, there is almost no possibility of causing a short circuit. Therefore, the connection reliability in the power terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 by the ACF 30 including the conductive particles 30a having a large particle size. Can be high.
　以上説明したように本実施形態の液晶表示装置（表示装置）１０は、画像を表示可能な表示部ＡＡを有する液晶パネル（表示パネル）１１と、電源である制御回路基板１２から供給される駆動電力及び基準電位に基づいて作動するものであって、信号供給源である制御回路基板１２から供給される入力信号を処理して生成した出力信号を表示部ＡＡに出力することで液晶パネル１１を駆動するドライバ（駆動回路部）２１と、電源である制御回路基板１２側とドライバ２１側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで駆動電力の供給が可能とされる電源端子部２５と、電源である制御回路基板１２側とドライバ２１側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで基準電位の供給が可能とされるグランド端子部２６と、信号供給源である制御回路基板１２側とドライバ２１側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで入力信号の伝送が可能とされる入力側端子部２７と、ドライバ２１側と表示部ＡＡ側とに対をなす形で備えられそれぞれがコイル状をなすとともに相互に誘導結合されることで出力信号の伝送が可能とされる出力側端子部２８とを備える。 As described above, the liquid crystal display device (display device) 10 according to the present embodiment is driven by the liquid crystal panel (display panel) 11 having the display unit AA capable of displaying an image and the control circuit board 12 serving as a power source. The liquid crystal panel 11 operates based on the power and the reference potential and outputs an output signal generated by processing an input signal supplied from the control circuit board 12 as a signal supply source to the display unit AA. A driver (drive circuit unit) 21 to be driven and a control circuit board 12 side that is a power source and a driver 21 side are provided in pairs, and driving power can be supplied by directly or indirectly contacting each other. The power supply terminal portion 25, the control circuit board 12 side that is the power source, and the driver 21 side are provided in pairs, and the reference potential can be supplied by directly or indirectly contacting each other. The ground terminal portion 26, the control circuit board 12 which is a signal supply source, and the driver 21 side are provided in pairs, and the input signal can be transmitted by directly or indirectly contacting each other. The input side terminal portion 27, the driver 21 side, and the display portion AA side are provided in pairs, and each of them forms a coil and is inductively coupled to each other so that an output signal can be transmitted. Output side terminal portion 28.
　このようにすれば、信号供給源である制御回路基板１２から供給される入力信号は、入力側端子部２７によってドライバ２１へと伝送されて入力される。ドライバ２１は、電源である制御回路基板１２から供給される駆動電力及び基準電位に基づいて入力信号を処理して出力信号を生成して出力する。出力信号は、出力側端子部２８によって液晶パネル１１の表示部ＡＡへと伝送される。これにより、液晶パネル１１が駆動されて表示部ＡＡに画像が表示される。 In this way, the input signal supplied from the control circuit board 12 which is a signal supply source is transmitted to the driver 21 by the input side terminal portion 27 and input. The driver 21 processes the input signal based on the driving power and the reference potential supplied from the control circuit board 12 that is a power source, generates an output signal, and outputs it. The output signal is transmitted to the display unit AA of the liquid crystal panel 11 by the output side terminal unit 28. Thereby, the liquid crystal panel 11 is driven and an image is displayed on the display unit AA.
　ここで、出力側端子部２８は、入力側端子部２７に比べると、例えば表示部ＡＡに表示される画像が高解像度化された場合などには、扱う信号数が多くなりがちで、端子幅や配列ピッチの微細化がより強く求められる傾向にある。このため、従来のように出力側端子部の対をなすもの同士をＡＣＦを介して接触させた場合には、短絡や絶縁性の低下などの問題が生じることが懸念され、さらにそれに対応すべくＡＣＦに含まれる導電性粒子の粒径を小さくすると、接続信頼性が悪化するといった問題が懸念される。その点、本実施形態によれば、出力側端子部２８は、対をなすものがそれぞれコイル状をなすとともに相互に誘導結合されることで出力信号の伝送が可能とされるものであるから、上記のような実装上の問題が生じるのを回避することができる。しかも、本実施形態に係る出力側端子部２８は、対をなすものがそれぞれコイル状をなしていることから、出力側端子部２８を形成するに際して例えば半導体などの配線形成プロセスなどを利用することができて容易に微細化を図ることが可能となっている。さらには、出力側端子部２８は、対をなすものが相互に誘導結合されることで出力信号の伝送を可能とされているので、伝送される出力信号が寄生容量などの影響を受け難くなり、もって出力信号の伝送速度を高速化する上で好適となり、さらには低消費電力化及び製造コストの低減を図る上でも好適となる。 Here, the output-side terminal unit 28 tends to handle more signals than the input-side terminal unit 27, for example, when the resolution of an image displayed on the display unit AA is increased. In addition, there is a tendency for finer arrangement pitches to be demanded. For this reason, there is a concern that problems such as short-circuiting and deterioration of insulation may occur when the pair of output side terminal portions are brought into contact with each other via the ACF as in the prior art. When the particle size of the conductive particles contained in the ACF is reduced, there is a concern that the connection reliability deteriorates. In that respect, according to the present embodiment, the output side terminal portion 28 has a pair of coils and is inductively coupled to each other so that an output signal can be transmitted. It is possible to avoid the above-described mounting problems. In addition, since the output side terminal portions 28 according to the present embodiment form a pair of coils, when forming the output side terminal portions 28, for example, a wiring formation process such as a semiconductor is used. And can be easily miniaturized. In addition, since the output terminal 28 is capable of transmitting an output signal by inductively coupling a pair of output terminals 28, the transmitted output signal is not easily affected by parasitic capacitance or the like. Therefore, it is suitable for increasing the transmission speed of the output signal, and further suitable for reducing the power consumption and the manufacturing cost.
　その一方で、入力側端子部２７は、出力側端子部２８に比べると、画像が高解像度化されたとしても扱う信号数が相対的に少ないことから、対をなすもの同士が直接的にまたは間接的に接触することで入力信号の伝送を可能とする接続構造であっても、短絡などの問題が生じることなく適切に信号伝送機能を発揮することができる。さらには、電源端子部２５及びグランド端子部２６は、それぞれ対をなすもの同士が直接的にまたは間接的に接触することで駆動電力の供給及び基準電位の供給を可能とされていることから、電源端子部２５においては各信号に比べて遙かに大きな電圧値の駆動電力を確実に供給することができ、さらにはグランド端子部２６においては基準電位を安定的に供給することができる。そして、これら電源端子部２５、グランド端子部２６、及び入力側端子部２７は、それぞれ対をなすもの同士が直接的にまたは間接的に接触する、という共通する接続構造を有していることから、仮に入力側端子部について上記した出力側端子部２８と同様に誘導結合によって信号伝送を図る構成として異なる接続構造の端子部が混在する場合に比べると、各端子部２５～２７の配置の自由度を高くすることができる。すなわち、電源端子部２５、グランド端子部２６、及び入力側端子部２７の配置を設計するに際して、仮に上記したように入力側端子部と電源端子部及びグランド端子部とで接続構造が異なっていると、接続作業の容易性や確実性などの観点から入力側端子部を対称に配置するとともに電源端子部及びグランド端子部からなる端子部群を対称に配置しなければならない、といった制約が生じるものの、本実施形態のように各端子部２５～２７の接続構造を共通化すれば上記のような制約が生じなくなり、もって各端子部２５～２７を自由にレイアウトすることができる。さらには、仮に入力側端子部が誘導結合によって信号伝送を図る構成とされると、新たに入力用の送信回路及び入力用の受信回路を設置する必要が生じる可能性があるが、本実施形態によればその必要がなくなる。また、電源端子部２５、グランド端子部２６、及び入力側端子部２７を形成するプロセスや接続に係る工程を共通化することが可能となり、もって製造コストの低減などを図る上で好適となる。 On the other hand, since the input side terminal portion 27 handles a relatively small number of signals even when the image has a higher resolution than the output side terminal portion 28, the paired ones are directly or Even in a connection structure that enables transmission of an input signal by indirect contact, a signal transmission function can be appropriately exhibited without causing a problem such as a short circuit. Furthermore, the power supply terminal portion 25 and the ground terminal portion 26 are capable of supplying driving power and supplying a reference potential by directly or indirectly contacting each other in pairs. The power terminal 25 can reliably supply driving power having a voltage value much larger than that of each signal, and the ground terminal 26 can stably supply a reference potential. And since these power supply terminal part 25, the ground terminal part 26, and the input side terminal part 27 have what has a common connection structure that what makes each pair contact directly or indirectly. As compared with the case where the terminal portions having different connection structures are mixed in the input side terminal portion as in the case of the output side terminal portion 28 as described above, the terminal portions 25 to 27 can be arranged more freely than the case where the terminal portions having different connection structures are mixed. The degree can be increased. That is, when designing the arrangement of the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27, the connection structure is different between the input side terminal portion, the power supply terminal portion, and the ground terminal portion as described above. However, from the viewpoint of ease of connection work and certainty, there is a restriction that the input side terminal portion must be arranged symmetrically and the terminal portion group consisting of the power supply terminal portion and the ground terminal portion must be arranged symmetrically. If the connection structure of each of the terminal portions 25 to 27 is made common as in the present embodiment, the above-described restrictions do not occur, and the terminal portions 25 to 27 can be laid out freely. Furthermore, if the input side terminal portion is configured to perform signal transmission by inductive coupling, it may be necessary to newly install an input transmission circuit and an input reception circuit. According to that. In addition, the process for forming the power supply terminal portion 25, the ground terminal portion 26, and the input side terminal portion 27 and the steps related to the connection can be made common, which is suitable for reducing the manufacturing cost.
　また、出力側端子部２８は、対をなすもの同士が対向状をなすよう配されている。このようにすれば、例えば対をなす出力側端子部２８の間にドライバ２１が介在する配置とした場合に比べると、ドライバ２１の厚み分だけ対をなす出力側端子部２８の間の距離を短くすることができるから、送受信される出力信号の伝送速度を高速化する上で一層好適となる。 Further, the output side terminal portions 28 are arranged so that the paired ones are opposed to each other. In this way, for example, the distance between the output side terminal portions 28 that form a pair by the thickness of the driver 21 is larger than that in the case where the driver 21 is interposed between the output side terminal portions 28 that form a pair. Since it can be shortened, it is more suitable for increasing the transmission speed of the output signal transmitted and received.
　また、入力側端子部２７、電源端子部２５及びグランド端子部２６は、それぞれ対をなすもの同士が対向状をなすよう配されている。このようにすれば、入力側端子部２７、電源端子部２５及びグランド端子部２６における対をなすもの同士をそれぞれ直接的または間接的に容易に接続することができる。 In addition, the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are arranged so that the paired ones are opposed to each other. If it does in this way, what makes the pair in the input side terminal part 27, the power supply terminal part 25, and the ground terminal part 26 can each be connected easily directly or indirectly.
　また、入力側端子部２７、電源端子部２５及びグランド端子部２６は、ドライバ２１における外縁側に配されている。このようにすれば、例えば入力側端子部２７、電源端子部２５及びグランド端子部２６の接続に加圧を要する場合でも、ドライバ２１における中央側に応力が作用するのを回避することができる。これにより、ドライバ２１における中央側に回路を形成する上で好適となる。 Further, the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are arranged on the outer edge side of the driver 21. In this way, for example, even when a pressure is required to connect the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26, it is possible to avoid the stress from acting on the center side of the driver 21. This is suitable for forming a circuit on the center side of the driver 21.
　また、入力側端子部２７、電源端子部２５及びグランド端子部２６は、ドライバ２１のうち少なくとも表示部ＡＡ側とは反対側の外縁に沿って配されているのに対し、出力側端子部２８は、ドライバ２１のうち少なくとも表示部ＡＡ側の外縁に沿って配されている。このようにすれば、ドライバ２１のうち表示部ＡＡ側の外縁に入力側端子部２７、電源端子部２５及びグランド端子部２６が配されていないことから、出力側端子部２８と表示部ＡＡとを接続する配線を設計する上で好適となる。 The input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are arranged along the outer edge of the driver 21 at least on the side opposite to the display portion AA side, whereas the output side terminal portion 28. Are arranged along at least the outer edge of the driver 21 on the display section AA side. In this case, since the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are not arranged on the outer edge of the driver 21 on the display portion AA side, the output side terminal portion 28, the display portion AA, and the like. This is suitable for designing a wiring for connecting the two.
　また、入力側端子部２７、電源端子部２５及びグランド端子部２６は、それぞれ対をなすもの同士が、同じ接着材料であるＡＣＦ３０によって接触状態に固着されている。このようにすれば、同じ接着材料であるＡＣＦ３０を用いることで、入力側端子部２７、電源端子部２５及びグランド端子部２６を一括して接続することができ、もって製造コストの低減などを図る上で一層好適となる。 Further, the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 are fixed in contact with each other by an ACF 30 that is the same adhesive material. In this way, by using the same adhesive material ACF 30, the input side terminal portion 27, the power supply terminal portion 25 and the ground terminal portion 26 can be connected together, thereby reducing the manufacturing cost and the like. This is even more suitable.
　また、接着材料は、異方性導電剤であるＡＣＦ３０とされる。このようにすれば、入力側端子部２７、電源端子部２５及びグランド端子部２６における対をなすもの同士が異方性導電剤であるＡＣＦ３０を介して間接的に接触される。また、ＡＣＦ３０に含まれる導電性粒子３０ａの粒径について、出力側端子部２８における端子幅や配列ピッチとは関係なく、適切な大きさに設定することができるから、高い接続信頼性を得ることができる。 Also, the adhesive material is ACF30 which is an anisotropic conductive agent. If it does in this way, what makes the pair in the input side terminal part 27, the power supply terminal part 25, and the ground terminal part 26 will contact indirectly via ACF30 which is an anisotropic conductive agent. In addition, the particle size of the conductive particles 30a included in the ACF 30 can be set to an appropriate size regardless of the terminal width and the arrangement pitch in the output-side terminal portion 28, thereby obtaining high connection reliability. Can do.
　また、出力側端子部２８は、対をなすもの同士が、入力側端子部２７、電源端子部２５及びグランド端子部２６と同じ接着材料であるＡＣＦ３０によって固着されている。このようにすれば、入力側端子部２７、電源端子部２５及びグランド端子部２６に加えて出力側端子部２８についても一括して接続することができ、もって製造コストの低減などを図る上でより一層好適となる。なお、接着材料としてＡＣＦ３０を用いた場合でも、出力側端子部２８が誘導結合により出力信号を伝送可能とされるものであるから、対をなすもの同士がＡＣＦ３０を介して短絡される事態が極めて生じ難いものとなっている。 Also, the output side terminal portions 28 are fixed together by an ACF 30 that is the same adhesive material as the input side terminal portion 27, the power supply terminal portion 25 and the ground terminal portion 26. In this way, in addition to the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26, the output side terminal portion 28 can be connected in a lump, thereby reducing the manufacturing cost. Even more suitable. Even when the ACF 30 is used as the adhesive material, the output side terminal portion 28 can transmit the output signal by inductive coupling. Therefore, a situation in which the paired members are short-circuited via the ACF 30 is extremely serious. It is difficult to occur.
　また、接着材料であるＡＣＦ３０は、入力側端子部２７、出力側端子部２８、電源端子部２５及びグランド端子部２６の各配置領域に跨る範囲に配されている。このようにすれば、仮に各配置領域毎に接着材料を区分して配した場合に比べると、接着材料であるＡＣＦ３０を配する際のタクトタイムの短縮化などを図ることができる。 Further, the ACF 30 that is an adhesive material is disposed in a range that spans the arrangement regions of the input side terminal portion 27, the output side terminal portion 28, the power supply terminal portion 25, and the ground terminal portion 26. In this way, it is possible to shorten the tact time when the ACF 30 as the adhesive material is arranged, as compared with the case where the adhesive material is divided and arranged for each arrangement region.
　また、対をなす出力側端子部２８の間の距離を規制するためのスペーサ３５が備えられている。このようにすれば、スペーサ３５によって対をなす出力側端子部２８の間の距離が一定に保たれるから、伝送される出力信号の伝送速度の安定化を図ることができる。 Also, a spacer 35 is provided for regulating the distance between the paired output side terminal portions 28. In this way, the distance between the output side terminal portions 28 paired by the spacer 35 is kept constant, so that the transmission speed of the output signal to be transmitted can be stabilized.
　また、スペーサ３５は、平面に視て出力側端子部２８の配置領域を挟み込む位置に少なくとも一対配されている。このようにすれば、対をなす出力側端子部２８の間の距離をより確実に一定に保つことができる。 Further, at least a pair of the spacers 35 are arranged at positions where the arrangement area of the output side terminal portion 28 is sandwiched in a plan view. In this way, the distance between the paired output side terminal portions 28 can be more reliably kept constant.
　また、ドライバ２１は、液晶パネル１１に実装されており、入力側端子部２７、出力側端子部２８、電源端子部２５及びグランド端子部２６は、液晶パネル１１とドライバ２１とにそれぞれ対をなす形で備えられている。このようにすれば、入力信号、駆動電力及び基準電位は、信号供給源及び電源である制御回路基板１２側から液晶パネル１１側の入力側端子部２７、電源端子部２５及びグランド端子部２６に供給されてから、ドライバ２１側の入力側端子部２７、電源端子部２５及びグランド端子部２６に伝送されることで、ドライバ２１を作動させる。ドライバ２１にて生成された出力信号は、ドライバ２１側の出力側端子部２８から液晶パネル１１側の出力側端子部２８に伝送されてから表示部ＡＡに出力される。上記のようにドライバ２１を液晶パネル１１に直接実装しているので、いわゆるＣＯＧ（Chip On Glass）実装を行う上で好適とされる。また、入力側端子部２７は、対をなすものが互いに直接的または間接的に接触することで信号伝送を図る構成とされているから、仮に入力側端子部について出力側端子部２８と同様に誘導結合によって信号伝送を図る構成とすると、新たに液晶パネル１１に入力用の送信回路を、ドライバ２１に入力用の受信回路をそれぞれ設ける必要が生じる可能性があり、そうなると液晶パネル１１に入力用の送信回路の設置スペースを新たに確保する必要が生じる可能性があるが、本実施形態によればその必要がなく、もって液晶パネル１１の狭額縁化を図る上で好適である。 The driver 21 is mounted on the liquid crystal panel 11, and the input side terminal portion 27, the output side terminal portion 28, the power supply terminal portion 25, and the ground terminal portion 26 make a pair with the liquid crystal panel 11 and the driver 21. It is provided in shape. In this way, the input signal, the driving power, and the reference potential are transferred from the control circuit board 12 side that is the signal supply source and the power source to the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26 on the liquid crystal panel 11 side. After being supplied, the driver 21 is operated by being transmitted to the input terminal portion 27, the power supply terminal portion 25 and the ground terminal portion 26 on the driver 21 side. The output signal generated by the driver 21 is transmitted from the output side terminal section 28 on the driver 21 side to the output side terminal section 28 on the liquid crystal panel 11 side, and then output to the display section AA. Since the driver 21 is directly mounted on the liquid crystal panel 11 as described above, it is suitable for performing so-called COG (Chip On Glass) mounting. Further, since the input side terminal portion 27 is configured to transmit signals by making the paired members contact each other directly or indirectly, the input side terminal portion is assumed to be similar to the output side terminal portion 28. When the signal transmission is performed by inductive coupling, it may be necessary to newly provide an input transmission circuit in the liquid crystal panel 11 and an input reception circuit in the driver 21. However, according to the present embodiment, this is not necessary, and this is suitable for narrowing the frame of the liquid crystal panel 11.
　また、表示パネルは、一対の基板１１ａ，１１ｂ間に液晶を封入してなる液晶パネル１１とされる。このようにすれば、種々の用途、例えばテレビやパソコンのディスプレイ等に適用でき、特に大型画面用として好適である。 The display panel is a liquid crystal panel 11 in which liquid crystal is sealed between a pair of substrates 11a and 11b. In this way, it can be applied to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
　また、液晶パネル１１に対して対向状をなし且つ表示側とは反対側に配されるとともに液晶パネル１１に対して光を供給可能なバックライト装置１４を備える。このようにすれば、バックライト装置１４から供給される光を利用して、液晶パネル１１の表示部ＡＡに画像を表示させることができる。これにより、表示される画像の輝度を高いものとすることができる。 Further, a backlight device 14 is provided which is opposed to the liquid crystal panel 11 and is disposed on the side opposite to the display side and capable of supplying light to the liquid crystal panel 11. In this way, it is possible to display an image on the display unit AA of the liquid crystal panel 11 using the light supplied from the backlight device 14. Thereby, the brightness | luminance of the image displayed can be made high.
　以上、本発明の実施形態１を示したが、本発明は上記実施の形態に限られるものではなく、例えば以下のような変形例を含むこともできる。なお、以下の各変形例において、上記実施形態と同様の部材には、上記実施形態と同符号を付して図示及び説明を省略するものもある。 As mentioned above, although Embodiment 1 of this invention was shown, this invention is not restricted to the said embodiment, For example, the following modifications can also be included. In the following modifications, members similar to those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and illustration and description thereof may be omitted.
［実施形態１の変形例１］
　実施形態１の変形例１について図９を用いて説明する。ここでは、出力側端子部２８‐１の配列を変更したものを示す。 [Modification 1 of Embodiment 1]
A first modification of the first embodiment will be described with reference to FIG. Here, the arrangement of the output side terminal portion 28-1 is changed.
　本変形例に係る出力側端子部２８‐１は、図９に示すように、ドライバ２１‐１（アレイ基板１１ｂ‐１における実装領域）の外縁部に加えて、ドライバ２１‐１の中央側のスペースにも配されており、全体として格子状に、いわゆるエリアアレイ配置されている。詳しくは、出力側端子部２８‐１は、ドライバ２１‐１の長辺方向（Ｘ軸方向、行方向）に沿って複数が並列して配されるとともに、その行がドライバ２１‐１の短辺方向（Ｙ軸方向、列方向）に複数並んで配されることで、行列状に並列配置されている。この出力側端子部２８‐１の行には、ドライバ２１‐１のうち表示部側（図９に示す上側、電源端子部２５、グランド端子部２６及び入力側端子部２７側とは反対側）の外縁部に位置するものと、それよりもドライバ２１‐１の中央側に位置するものとが含まれており、中央側に位置するものが複数とされている。中央側に位置する出力側端子部２８‐１の行は、電源端子部２５、グランド端子部２６及び入力側端子部２７よりもドライバ２１‐１の中央寄りに配されている。行列状に配された出力側端子部２８‐１は、行方向及び列方向について概ね等間隔に配されている。隣り合う出力側端子部２８‐１間の間隔は、出力側端子部２８‐１と隣り合う電源端子部２５、グランド端子部２６及び入力側端子部２７との間の間隔とほぼ等しいものとされる。なお、図９では、第２出力側端子部２８ｂ‐１のみを図示しており、第１出力側端子部の図示を省略しているが、第１出力側端子部もドライバ２１‐１において第２出力側端子部２８ｂ‐１と同様の平面配置でもって形成されている。 As shown in FIG. 9, the output-side terminal portion 28-1 according to the present modified example is provided on the center side of the driver 21-1 in addition to the outer edge portion of the driver 21-1 (mounting region on the array substrate 11b-1). It is also arranged in a space, and a so-called area array is arranged in a lattice shape as a whole. Specifically, a plurality of output side terminal portions 28-1 are arranged in parallel along the long side direction (X-axis direction, row direction) of the driver 21-1, and the row is short of the driver 21-1. By arranging a plurality in the side direction (Y-axis direction, column direction), they are arranged in parallel in a matrix. The row of the output side terminal portion 28-1 includes the driver 21-1 on the display side (the side opposite to the upper side, the power supply terminal portion 25, the ground terminal portion 26 and the input side terminal portion 27 side shown in FIG. 9). And those located on the center side of the driver 21-1 are included, and a plurality of those located on the center side are included. The row of the output side terminal portions 28-1 located on the center side is arranged closer to the center of the driver 21-1 than the power supply terminal portion 25, the ground terminal portion 26 and the input side terminal portion 27. The output side terminal portions 28-1 arranged in a matrix are arranged at approximately equal intervals in the row direction and the column direction. The interval between the adjacent output side terminal portions 28-1 is substantially equal to the interval between the output side terminal portion 28-1 and the adjacent power supply terminal portion 25, ground terminal portion 26 and input side terminal portion 27. The In FIG. 9, only the second output-side terminal portion 28b-1 is shown and the first output-side terminal portion is not shown, but the first output-side terminal portion is also the first in the driver 21-1. The two output side terminal portions 28b-1 are formed in the same planar arrangement.
　出力側端子部２８‐１は、上記した実施形態１にて説明した通り、対をなすもの同士が誘導結合されることで信号伝送が可能とされていることから、対をなすもの同士を固着するためにＡＣＦ３０を用いても、ドライバ２１‐１のうち出力側端子部２８‐１の付近を大きな圧力でもって加圧する必要性がない。従って、ドライバ２１‐１のうち出力側端子部２８‐１と平面に視て重畳する部分に駆動回路を形成しても、そこが接続時に加圧されることがないから、駆動回路がダメージを受ける事態が回避される。つまり、出力側端子部２８‐１及び駆動回路が互いに配置領域の制限を受けることがなく、平面に視て互いに重畳する配置を採用することが可能とされ、出力側端子部２８‐１及び駆動回路の配置の自由度が双方共に高いものとなっている。これにより、出力側端子部２８‐１の配置領域を増加させてエリアアレイ配置を採ることができるから、出力側端子部２８‐１の端子幅及び配列ピッチを大きなものとすることができる。もって、出力側端子部２８‐１を容易に形成することができ、さらなる表示画像の高解像度化に伴う出力信号並びに出力側端子部２８‐１の増加にも好適に対応することができる。なお、本変形例に係る出力側端子部２８‐１の端子幅及び配列ピッチは、実施形態１に記載したものよりも大きく、例えば１５０μｍ程度とされる。 As described in the first embodiment, the output-side terminal portion 28-1 is capable of transmitting signals by inductively coupling pairs to each other. Therefore, even if the ACF 30 is used, it is not necessary to pressurize the vicinity of the output side terminal portion 28-1 of the driver 21-1 with a large pressure. Therefore, even if the driver circuit is formed on the portion of the driver 21-1 that overlaps the output side terminal portion 28-1 in plan view, the driver circuit will not be pressurized at the time of connection. The situation of receiving is avoided. In other words, the output side terminal portion 28-1 and the drive circuit are not limited by the arrangement region, and it is possible to adopt an arrangement in which the output side terminal portion 28-1 and the drive circuit overlap with each other in a plan view. Both of the degrees of freedom of circuit arrangement are high. As a result, the arrangement area of the output side terminal portion 28-1 can be increased and the area array arrangement can be adopted, so that the terminal width and the arrangement pitch of the output side terminal portion 28-1 can be increased. Accordingly, the output side terminal portion 28-1 can be easily formed, and it is possible to suitably cope with an increase in the output signals and the output side terminal portion 28-1 as the resolution of the display image further increases. In addition, the terminal width and arrangement pitch of the output side terminal portion 28-1 according to this modification are larger than those described in the first embodiment, and are, for example, about 150 μm.
　以上説明したように本変形例によれば、出力側端子部２８‐１には、入力側端子部２７、電源端子部２５及びグランド端子部２６よりも相対的にドライバ２１‐１における中央寄りに配されるものが含まれている。このようにすれば、出力側端子部２８‐１は、対をなすもの同士を接続するに際して必ずしも加圧を要することがない。従って、この出力側端子部２８‐１をドライバ２１‐１における中央寄りに配する設計としても、ドライバ２１‐１における中央側に応力が作用するのを回避することができてそこに形成した回路に悪影響が及ぶ事態も回避することができる。これにより、ドライバ２１‐１における中央側のスペースを有効に利用することができ、もって画像の高解像度化などに伴って出力側端子部２８‐１の設置数が増加した場合でも、容易に対応することができる。 As described above, according to this modification, the output side terminal portion 28-1 is closer to the center of the driver 21-1 than the input side terminal portion 27, the power supply terminal portion 25, and the ground terminal portion 26. Includes what is being distributed. In this way, the output side terminal portion 28-1 does not necessarily need to be pressurized when connecting the paired ones. Therefore, even when the output side terminal portion 28-1 is arranged closer to the center of the driver 21-1, it is possible to avoid the stress from acting on the center side of the driver 21-1, and the circuit formed there. It is also possible to avoid a situation that adversely affects the environment. As a result, the space on the center side of the driver 21-1 can be used effectively, and even if the number of output side terminal portions 28-1 is increased as the resolution of the image is increased, it can be easily handled. can do.
　また、出力側端子部２８‐１は、平面に視て格子状に複数ずつ並列配置されている。このようにすれば、出力側端子部２８‐１を効率的に配することができ、微細化に一層好適となる。 Further, the output side terminal portions 28-1 are arranged in parallel in a lattice shape when viewed in a plane. In this way, the output side terminal portion 28-1 can be efficiently arranged, which is more suitable for miniaturization.
［実施形態１の変形例２］
　実施形態１の変形例２について図１０を用いて説明する。ここでは、上記した変形例１から出力側端子部２８‐２の配列をさらに変更したものを示す。 [Modification 2 of Embodiment 1]
A second modification of the first embodiment will be described with reference to FIG. Here, a modification in which the arrangement of the output-side terminal portion 28-2 is further changed from the above-described modification example 1 is shown.
　本変形例に係る出力側端子部２８‐２は、図１０に示すように、ドライバ２１‐２（アレイ基板１１ｂ‐２における実装領域）において全体として千鳥状（ジグザグ状）にエリアアレイ配置されている。詳しくは、出力側端子部２８‐２は、ドライバ２１‐２の長辺方向（Ｘ軸方向、行方向）に沿って並列してなる行をなす各出力側端子部２８‐２が、列方向（Ｙ軸方向）に隣り合う行をなす各出力側端子部２８‐２に対して行方向についてずれた配置とされている。列方向について隣り合う行同士の、行方向についてのずれ量は、行方向についての出力側端子部２８‐２の配列ピッチの約半分程度とされる。従って、行方向について隣り合う出力側端子部２８‐２の中間位置に、その行をなす出力側端子部２８‐２に対して列方向について隣り合う行をなす出力側端子部２８‐２が配されることになる。これにより、隣接する出力側端子部２８‐２間の間隔を最大限に且つ一定に確保することができる。このように本変形例では、出力側端子部２８‐２を千鳥状に配置することで、変形例１よりも出力側端子部２８‐２の行が１つ多くなっており、出力側端子部２８‐２の高密度配置が可能とされている。これにより、さらなる表示画像の高解像度化に伴う出力信号並びに出力側端子部２８‐２の増加にも好適に対応することができる。 As shown in FIG. 10, the output side terminal portion 28-2 according to this modification is arranged in an area array in a zigzag shape (zigzag shape) as a whole in the driver 21-2 (mounting region in the array substrate 11b-2). Yes. Specifically, the output side terminal portion 28-2 is arranged in the column direction with the output side terminal portions 28-2, which form rows arranged in parallel along the long side direction (X-axis direction, row direction) of the driver 21-2. The arrangement is shifted in the row direction with respect to each output-side terminal portion 28-2 forming a row adjacent in the (Y-axis direction). The amount of deviation in the row direction between adjacent rows in the column direction is about half of the arrangement pitch of the output side terminal portions 28-2 in the row direction. Accordingly, an output side terminal portion 28-2 that forms a row adjacent in the column direction with respect to the output side terminal portion 28-2 that forms the row is arranged at an intermediate position between the output side terminal portions 28-2 that are adjacent in the row direction. Will be. Thereby, the space | interval between the adjacent output side terminal parts 28-2 can be ensured to the maximum and constant. As described above, in the present modification, the output-side terminal portions 28-2 are arranged in a staggered manner, so that one row of output-side terminal portions 28-2 is added to the output-side terminal portions 28-2. High-density arrangement of 28-2 is possible. Accordingly, it is possible to suitably cope with an increase in output signals and output-side terminal portions 28-2 accompanying further increase in resolution of a display image.
　以上説明したように本変形例によれば、出力側端子部２８‐２は、平面に視て千鳥状に複数ずつ並列配置されている。このようにすれば、例えば格子状に並列配置した場合に比べると、さらに出力側端子部２８‐２を高密度に配置することができる。 As described above, according to this modification, the output side terminal portions 28-2 are arranged in parallel in a zigzag manner when viewed in a plane. In this way, the output-side terminal portions 28-2 can be arranged at a higher density than when arranged in parallel in a grid, for example.
［実施形態１の変形例３］
　実施形態１の変形例３について図１１を用いて説明する。ここでは、上記した変形例１から入力側端子部２７‐３の配列を変更したものを示す。 [Modification 3 of Embodiment 1]
A third modification of the first embodiment will be described with reference to FIG. Here, what changed the arrangement | sequence of the input side terminal part 27-3 from the above-mentioned modification 1 is shown.
　本変形例に係る入力側端子部２７‐３は、図１１に示すように、ドライバ２１‐３（アレイ基板１１ｂ‐３における実装領域）の外周縁部のうち隣接する２辺の外縁部に沿って並列され、全体としてＬ字型に配置されている。詳しくは、入力側端子部２７‐３は、ドライバ２１‐３のうち表示部側（図１１に示す上側）とは反対側の外縁部に位置するとともにドライバ２１‐３の長辺方向（Ｘ軸方向）に沿って並列するものと、ドライバ２１‐３のうち図１１に示す左側の外縁部、つまり表示部側とは反対側の外縁部に対して隣接する外縁部に位置するとともにドライバ２１‐３の短辺方向（Ｙ軸方向）に沿って並列するものとから構成される。出力側端子部２８‐３は、ドライバ２１‐３のうち入力側端子部２７‐３が配置されない外縁部（具体的には、表示部側の外縁部及び図１１に示す右側の外縁部）に配されるのに加えて、それよりもドライバ２１‐３における中央寄りにもエリアアレイ配置されている。このような配置とすれば、入力側端子部２７‐３の配線幅や配列ピッチを変形例１よりも相対的に大きなものとすることができる。 As shown in FIG. 11, the input-side terminal portion 27-3 according to the present modification is along the two adjacent outer edge portions of the outer peripheral edge portion of the driver 21-3 (mounting region in the array substrate 11b-3). Are arranged in an L shape as a whole. Specifically, the input-side terminal portion 27-3 is located on the outer edge portion of the driver 21-3 opposite to the display portion side (the upper side shown in FIG. 11), and the long side direction (X-axis) of the driver 21-3. Of the driver 21-3 and the driver 21-3 located at the outer edge adjacent to the left outer edge shown in FIG. 11, that is, the outer edge on the opposite side to the display side. 3 parallel to each other along the short side direction (Y-axis direction). The output-side terminal portion 28-3 is arranged on the outer edge portion (specifically, the outer edge portion on the display portion side and the right outer edge portion shown in FIG. 11) of the driver 21-3 where the input-side terminal portion 27-3 is not disposed. In addition to being arranged, an area array is arranged closer to the center of the driver 21-3 than that. With such an arrangement, the wiring width and arrangement pitch of the input side terminal portion 27-3 can be made relatively larger than those of the first modification.
［実施形態１の変形例４］
　実施形態１の変形例４について図１２を用いて説明する。ここでは、上記した変形例３から入力側端子部２７‐４の配列をさらに変更したものを示す。 [Modification 4 of Embodiment 1]
A fourth modification of the first embodiment will be described with reference to FIG. Here, a modification in which the arrangement of the input side terminal portion 27-4 is further changed from the above-described modification example 3 is shown.
　本変形例に係る入力側端子部２７‐４は、図１２に示すように、ドライバ２１‐４（アレイ基板１１ｂ‐４における実装領域）の外周縁部のうち隣接する３辺の外縁部に沿って並列され、全体としてチャンネル型に配置されている。詳しくは、入力側端子部２７‐４は、ドライバ２１‐４のうち表示部側（図１２に示す上側）とは反対側の外縁部に位置するとともにドライバ２１‐４の長辺方向（Ｘ軸方向）に沿って並列するものと、ドライバ２１‐４のうち図１１に示す左右両側の外縁部、つまり表示部側とは反対側の外縁部に対して隣接する一対の外縁部に位置するとともにドライバ２１‐４の短辺方向（Ｙ軸方向）に沿って並列するものとから構成される。出力側端子部２８‐４は、ドライバ２１‐４のうち入力側端子部２７‐４が配置されない表示部側の外縁部に配されるのに加えて、それよりもドライバ２１‐４における中央寄りにもエリアアレイ配置されている。このような配置とすれば、入力側端子部２７‐４の配線幅や配列ピッチを変形例３よりも相対的に大きなものとすることができる。 As shown in FIG. 12, the input side terminal portion 27-4 according to the present modification is along the outer edge portions of three adjacent sides of the outer peripheral edge portion of the driver 21-4 (mounting region in the array substrate 11b-4). Are arranged in a channel shape as a whole. Specifically, the input-side terminal portion 27-4 is located on the outer edge portion of the driver 21-4 opposite to the display portion side (the upper side shown in FIG. 12), and the long side direction (X-axis) of the driver 21-4. 11 and a pair of outer edge portions adjacent to the outer edge portions on both the left and right sides shown in FIG. 11 of the driver 21-4, that is, the outer edge portion on the opposite side to the display portion side. It is comprised from what is parallel along the short side direction (Y-axis direction) of the driver 21-4. The output side terminal portion 28-4 is arranged on the outer edge portion on the display portion side where the input side terminal portion 27-4 is not arranged in the driver 21-4, and in addition to that, the output side terminal portion 28-4 is closer to the center in the driver 21-4 An area array is also arranged. With such an arrangement, the wiring width and the arrangement pitch of the input side terminal portions 27-4 can be made relatively larger than those of the third modification.
［実施形態１の変形例５］
　実施形態１の変形例５について図１３を用いて説明する。ここでは、上記した変形例４から入力側端子部２７‐５の配列をさらに変更したものを示す。 [Modification 5 of Embodiment 1]
Modification 5 of Embodiment 1 will be described with reference to FIG. Here, a modification in which the arrangement of the input side terminal portion 27-5 is further changed from the above-described modification example 4 is shown.
　本変形例に係る入力側端子部２７‐５は、図１３に示すように、ドライバ２１‐５（アレイ基板１１ｂ‐５における実装領域）の外周縁部の全周に沿って並列され、全体として枠状に配置されている。出力側端子部２８‐５は、ドライバ２１‐５のうち外周縁部を除いた中央側のスペースにエリアアレイ配置されている。このような配置とすれば、入力側端子部２７‐５の配線幅や配列ピッチを変形例３よりも相対的に大きなものとすることができる。 As shown in FIG. 13, the input side terminal portion 27-5 according to the present modification is arranged in parallel along the entire circumference of the outer peripheral edge portion of the driver 21-5 (mounting region in the array substrate 11b-5), and as a whole It is arranged in a frame shape. The output side terminal portion 28-5 is arranged in an area array in a space on the center side excluding the outer peripheral edge portion of the driver 21-5. With such an arrangement, the wiring width and the arrangement pitch of the input side terminal portions 27-5 can be made relatively larger than those of the third modification.
　＜実施形態２＞
　本発明の実施形態２を図１４によって説明する。この実施形態２では、スペーサ１３５の配置などを変更したものを示す。なお、上記した実施形態１と同様の構造、作用及び効果について重複する説明は省略する。 <Embodiment 2>
A second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the arrangement of the spacers 135 is changed. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
　本実施形態に係るドライバ１２１は、図１４に示すように、上記した実施形態１にて示したものよりも長辺寸法が大きなものとなっている。ドライバ１２１が大型化されると、実装時にアレイ基板１１１ｂとの間の間隔（ギャップ）を全域にわたって一定に保つのが難しくなる傾向にある。これに対処すべく本実施形態では、ドライバ１２１における長辺方向（Ｘ軸方向）の両端部に加えて中央部にもスペーサ１３５を設けるようにしている。詳しくは、スペーサ１３５は、出力側端子部１２８群をその並列方向（Ｘ軸方向）の両端位置にて挟み込むようにして一対配されているのに加えて、並列方向の中央位置にも配されており、ドライバ１２１を３点支持する構造となっている。このようにすれば、ドライバ１２１が大型化されても、ドライバ１２１とアレイ基板１１１ｂとの間の間隔を全域にわたって均一に保つことができる。これにより、互いに対向状をなす第１出力側端子部１２８ａと第２出力側端子部１２８ｂとの間の距離についても一定で且つ均一になり、もって出力信号の伝送速度を均一に保つことができる。 As shown in FIG. 14, the driver 121 according to the present embodiment has a longer side dimension than that shown in the first embodiment. When the size of the driver 121 is increased, it tends to be difficult to keep the gap (gap) between the array substrate 111b and the entire area constant during mounting. In order to cope with this, in the present embodiment, in addition to both ends of the driver 121 in the long side direction (X-axis direction), the spacer 135 is also provided at the center. Specifically, the spacers 135 are arranged in pairs so as to sandwich the output-side terminal portion 128 group at both end positions in the parallel direction (X-axis direction), and are also arranged at the center position in the parallel direction. Thus, the driver 121 is supported at three points. In this way, even if the driver 121 is enlarged, the distance between the driver 121 and the array substrate 111b can be kept uniform over the entire area. As a result, the distance between the first output side terminal portion 128a and the second output side terminal portion 128b that are opposed to each other is also constant and uniform, so that the transmission speed of the output signal can be kept uniform. .
　なお、上記したドライバ１２１の大型化に伴って生じる問題は、例えばドライバが薄型化された場合にも同様に生じ得ることから、本実施形態に係る構成は薄型化されたドライバを用いる場合にも好適に使用することができるとともに、上記と同様の効果を得ることができる。 Note that the problem caused by the increase in the size of the driver 121 can also occur when the driver is thinned, for example. Therefore, the configuration according to the present embodiment is also used when the thinned driver is used. While being able to use suitably, the effect similar to the above can be acquired.
　以上説明したように本実施形態によれば、スペーサ１３５は、平面に視て出力側端子部１２８の配置領域における中央側にも配されている。このようにすれば、ドライバ１２１が大型であった場合や薄型であった場合でも、出力側端子部１２８の配置領域を挟み込む位置に配された一対のスペーサ１３５と、配置領域の中央側のスペーサ１３５とによってドライバ１２１の変形を好適に規制することができ、もって対をなす出力側端子部１２８の間の距離を一定に保つことができる。 As described above, according to the present embodiment, the spacer 135 is also arranged on the central side in the arrangement region of the output side terminal portion 128 in a plan view. In this way, even when the driver 121 is large or thin, the pair of spacers 135 disposed at the positions sandwiching the arrangement region of the output side terminal portion 128 and the spacer on the center side of the arrangement region 135 can suitably regulate the deformation of the driver 121, and the distance between the output-side terminal portions 128 that make a pair can be kept constant.
　＜実施形態３＞
　本発明の実施形態３を図１５によって説明する。この実施形態３では、出力側端子部２２８を絶縁層３６によって覆うようにしたものを示す。なお、上記した実施形態１と同様の構造、作用及び効果について重複する説明は省略する。 <Embodiment 3>
Embodiment 3 of the present invention will be described with reference to FIG. In the third embodiment, an output side terminal portion 228 is covered with an insulating layer 36. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
　本実施形態に係る出力側端子部２２８は、図１５に示すように、対をなすものがいずれも絶縁層３６によって覆われている。詳しくは、ドライバ２２１側の第１出力側端子部２２８ａ及びアレイ基板２１１ｂ側の第２出力側端子部２２８ｂにおける外周面には、それぞれ絶縁層３６が全域にわたってコーティングされており、外部に露出することが避けられている。この絶縁層３６により、第１出力側端子部２２８ａと第２出力側端子部２２８ｂとがＡＣＦ３０に含まれる導電性粒子３０ａや、意図せずＡＣＦ３０に含有された導電性異物によって短絡される事態を防ぐことができる。それに加え、絶縁層３６は保護部としても機能し得るものとされ、例えば第１出力側端子部２２８ａ及び第２出力側端子部２２８ｂが製造過程において他の部材などの干渉を受けた場合でも、絶縁層３６によって第１出力側端子部２２８ａ及び第２出力側端子部２２８ｂが損傷する事態を防ぐことができる。 As shown in FIG. 15, the output side terminal portion 228 according to the present embodiment is covered with an insulating layer 36 as a pair. Specifically, the outer peripheral surfaces of the first output-side terminal portion 228a on the driver 221 side and the second output-side terminal portion 228b on the array substrate 211b side are respectively coated with an insulating layer 36 and exposed to the outside. Is avoided. Due to this insulating layer 36, the first output side terminal portion 228 a and the second output side terminal portion 228 b are short-circuited by the conductive particles 30 a included in the ACF 30 or the conductive foreign matter included in the ACF 30 unintentionally. Can be prevented. In addition, the insulating layer 36 can also function as a protective part, for example, even when the first output side terminal part 228a and the second output side terminal part 228b are subjected to interference from other members in the manufacturing process, The insulating layer 36 can prevent the first output side terminal portion 228a and the second output side terminal portion 228b from being damaged.
　以上説明したように本実施形態によれば、対をなす出力側端子部２２８の少なくともいずれか一方は、絶縁層３６によって覆われている。このようにすれば、対をなす出力側端子部２２８同士が短絡されるのを防ぐことができる。また、絶縁層３６によって覆われたものは、製造過程において異物などの干渉によって損傷などを受ける事態が回避されるから、作動信頼性が高いものとされる。 As described above, according to this embodiment, at least one of the paired output-side terminal portions 228 is covered with the insulating layer 36. In this way, it is possible to prevent the output side terminal portions 228 making a pair from being short-circuited. In addition, since the situation covered with the insulating layer 36 is prevented from being damaged by the interference of foreign matters in the manufacturing process, the operation reliability is high.
　また、対をなす出力側端子部２２８は、共に絶縁層３６によって覆われている。このようにすれば、対をなす出力側端子部２２８同士が短絡されるのを防ぐことができる。対をなす出力側端子部２２８が、共に製造過程において異物などの干渉によって損傷などを受ける事態が回避されるから、作動信頼性が一層高いものとされる。 The paired output terminal portions 228 are both covered with an insulating layer 36. In this way, it is possible to prevent the output side terminal portions 228 making a pair from being short-circuited. Since both the output side terminal portions 228 that make a pair are prevented from being damaged by interference of foreign matter or the like in the manufacturing process, the operation reliability is further improved.
　＜実施形態４＞
　本発明の実施形態４を図１６から図１８によって説明する。この実施形態４では、ドライバ３２１をフレキシブル基板３７上に実装したものを示す。なお、上記した実施形態１と同様の構造、作用及び効果について重複する説明は省略する。 <Embodiment 4>
A fourth embodiment of the present invention will be described with reference to FIGS. In the fourth embodiment, a driver 321 mounted on a flexible substrate 37 is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
　本実施形態に係るドライバ３２１は、図１６に示すように、可撓性を有するフレキシブル基板３７上に実装されており、いわゆるＣＯＦ（Chip On Film）実装されている。このフレキシブル基板３７は、一端側が電源及び信号供給源である制御回路基板３１２に接続されるのに対して、他端側が液晶パネル３１１のアレイ基板３１１ｂに接続されている。フレキシブル基板３７は、銅などの金属材料からなる配線パターンが一端側から他端側に向けて延在する形で配索形成されており、その配線パターンの途中にドライバ３２１の実装領域が確保されている。そして、フレキシブル基板３７におけるドライバ３２１の実装領域とドライバ３２１とに、対をなす形で各端子部３２５～３２８が形成されている。 As shown in FIG. 16, the driver 321 according to the present embodiment is mounted on a flexible substrate 37 having flexibility, and is mounted on a so-called COF (Chip On Film). One end of the flexible substrate 37 is connected to the control circuit board 312 that is a power source and a signal supply source, while the other end is connected to the array substrate 311 b of the liquid crystal panel 311. The flexible substrate 37 is formed with a wiring pattern made of a metal material such as copper extending from one end side to the other end side, and a mounting area for the driver 321 is secured in the middle of the wiring pattern. ing. The terminal portions 325 to 328 are formed in a pair in the mounting area of the driver 321 on the flexible substrate 37 and the driver 321.
　電源端子部３２５、グランド端子部３２６及び入力側端子部３２７は、図１７に示すように、フレキシブル基板３７側に形成された第１電源端子部３２５ａ、第１グランド端子部３２６ａ及び第１入力側端子部３２７ａと、ドライバ３２１側に形成された第２電源端子部３２５ｂ、第２グランド端子部３２６ｂ及び第２入力側端子部３２７ｂとからそれぞれ構成される。このうち、第２電源端子部３２５ｂ、第２グランド端子部３２６ｂ及び第２入力側端子部３２７ｂは、その突出寸法が第１電源端子部３２５ａ、第１グランド端子部３２６ａ及び第１入力側端子部３２７ａよりも大きなバンプ状をなすとともに、第１電源端子部３２５ａ、第１グランド端子部３２６ａ及び第１入力側端子部３２７ａに対してそれぞれ直接的に接触されている。本実施形態では、ドライバ３２１とフレキシブル基板３７との間をＮＣＦ（Non Conductive Film）３８によって固着している。ＮＣＦ３８は、熱硬化性樹脂材料からなるものであり、実施形態１にて示したＡＣＦ２９，３０（図５及び図６を参照）から導電性粒子を除いたものとほぼ同じ構成とされる。従って、ＮＣＦ３８は、ＡＣＦ２９，３０よりも材料費において低廉である。 As shown in FIG. 17, the power terminal portion 325, the ground terminal portion 326, and the input side terminal portion 327 are a first power terminal portion 325a, a first ground terminal portion 326a, and a first input side formed on the flexible substrate 37 side. The terminal unit 327a includes a second power terminal unit 325b, a second ground terminal unit 326b, and a second input terminal unit 327b formed on the driver 321 side. Among these, the second power supply terminal portion 325b, the second ground terminal portion 326b, and the second input side terminal portion 327b have projecting dimensions of the first power supply terminal portion 325a, the first ground terminal portion 326a, and the first input side terminal portion. The bumps are larger than 327a and are in direct contact with the first power terminal portion 325a, the first ground terminal portion 326a, and the first input terminal portion 327a. In the present embodiment, the driver 321 and the flexible substrate 37 are fixed by an NCF (Non （Conductive Film) 38. The NCF 38 is made of a thermosetting resin material and has substantially the same configuration as that obtained by removing the conductive particles from the ACFs 29 and 30 (see FIGS. 5 and 6) shown in the first embodiment. Therefore, NCF 38 is less expensive in material cost than ACF 29,30.
　一方、出力側端子部３２８は、図１８に示すように、ドライバ３２１側に形成された第１出力側端子部３２８ａと、フレキシブル基板３７側に形成された第２出力側端子部３２８ｂとから構成される。第１出力側端子部３２８ａ及び第２出力側端子部３２８ｂは、共にコイル状をなすとともに互いに対向状に配されることで、誘導結合されている。ＮＣＦ３８は、電源端子部３２５、グランド端子部３２６及び入力側端子部３２７の配置領域に加えて、出力側端子部３２８の配置領域にわたって配されており、第１出力側端子部３２８ａ及び第２出力側端子部３２８ｂの間をも固着している。このようにドライバ３２１とフレキシブル基板３７とを固着するための接着材料を共通化することで、製造コストの低減などを図ることができる。なお、第２出力側端子部３２８ｂから出力された出力信号は、フレキシブル基板３７を介してアレイ基板３１１ｂに伝送された後、アレイ基板３１１ｂ上に形成された受信制御部及び受信回路（図示せず）にて処理される。 On the other hand, as shown in FIG. 18, the output-side terminal portion 328 includes a first output-side terminal portion 328a formed on the driver 321 side and a second output-side terminal portion 328b formed on the flexible substrate 37 side. Is done. The first output side terminal portion 328a and the second output side terminal portion 328b are both inductively coupled by forming a coil shape and being opposed to each other. The NCF 38 is arranged over the arrangement region of the output side terminal unit 328 in addition to the arrangement region of the power supply terminal unit 325, the ground terminal unit 326, and the input side terminal unit 327, and the first output side terminal unit 328a and the second output unit 328a. The space between the side terminal portions 328b is also fixed. In this way, by using a common adhesive material for fixing the driver 321 and the flexible substrate 37, the manufacturing cost can be reduced. Note that an output signal output from the second output side terminal unit 328b is transmitted to the array substrate 311b via the flexible substrate 37, and thereafter, a reception control unit and a reception circuit (not shown) formed on the array substrate 311b. ) Is processed.
　以上説明したように本実施形態によれば、一端側が信号供給源及び電源である制御回路基板３１２側に接続されるのに対して他端側が液晶パネル３１１に接続されるフレキシブル基板３７が備えられるとともに、ドライバ３２１がフレキシブル基板３７に実装されており、入力側端子部３２７、出力側端子部３２８、電源端子部３２５及びグランド端子部３２６は、ドライバ３２１とフレキシブル基板３７とにそれぞれ対をなす形で備えられている。このようにすれば、入力信号、駆動電力及び基準電位は、信号供給源及び電源である制御回路基板３１２側からフレキシブル基板３７を介して、入力側端子部３２７、電源端子部３２５及びグランド端子部３２６によってドライバ３２１へと伝送されることで、ドライバ３２１を作動させる。ドライバ３２１にて生成された出力信号は、出力側端子部３２８によってフレキシブル基板３７に伝送されてから液晶パネル３１１に供給され、表示部ＡＡに出力される。上記のようにドライバ３２１をフレキシブル基板３７に実装しているので、いわゆるＣＯＦ（Chip On Film）実装を行う上で好適とされる。 As described above, according to the present embodiment, the flexible substrate 37 is provided in which one end side is connected to the control circuit board 312 side which is a signal supply source and a power source, whereas the other end side is connected to the liquid crystal panel 311. In addition, the driver 321 is mounted on the flexible substrate 37, and the input side terminal portion 327, the output side terminal portion 328, the power supply terminal portion 325, and the ground terminal portion 326 form a pair with the driver 321 and the flexible substrate 37, respectively. It is equipped with. In this way, the input signal, the driving power, and the reference potential are supplied from the control circuit board 312 that is the signal supply source and the power source via the flexible board 37 to the input side terminal portion 327, the power supply terminal portion 325, and the ground terminal portion. The driver 321 is operated by being transmitted to the driver 321 by 326. The output signal generated by the driver 321 is transmitted to the flexible substrate 37 by the output side terminal unit 328, then supplied to the liquid crystal panel 311 and output to the display unit AA. Since the driver 321 is mounted on the flexible substrate 37 as described above, it is suitable for performing so-called COF (Chip On On Film) mounting.
　＜実施形態５＞
　本発明の実施形態５を図１９または図２０によって説明する。この実施形態５は、上記したＣＯＦ実装を行う実施形態４の変形例とも言うべきものであって、電源端子部４２５、グランド端子部４２６、入力側端子部４２７及びスペーサ４３５を半田バンプ３９によって形成したものを示す。なお、上記した実施形態４と同様の構造、作用及び効果について重複する説明は省略する。 <Embodiment 5>
A fifth embodiment of the present invention will be described with reference to FIG. 19 or FIG. The fifth embodiment is also a modification of the fourth embodiment in which the above-described COF mounting is performed, and the power terminal portion 425, the ground terminal portion 426, the input side terminal portion 427, and the spacer 435 are formed by the solder bumps 39. Shows what In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 4 is abbreviate | omitted.
　本実施形態に係る電源端子部４２５、グランド端子部４２６及び入力側端子部４２７は、図１９に示すように、それぞれ対をなすもののうちの一方側が半田バンプ３９によって形成されている。詳しくは、電源端子部４２５、グランド端子部４２６及び入力側端子部４２７のうち、ドライバ４２１側に配された第２電源端子部４２５ｂ、第２グランド端子部４２６ｂ及び第２入力側端子部４２７ｂは、加熱によって溶融することが可能な錫メッキなど半田材料からなる半田バンプ３９によって形成されている。同様に、スペーサ４３５についても、図２０に示すように、半田バンプ３９によって形成されている。なお、フレキシブル基板４３７側には半田バンプ３９からなるスペーサ４３５と対向する位置にダミー端子が形成されている。 As shown in FIG. 19, the power terminal portion 425, the ground terminal portion 426, and the input side terminal portion 427 according to the present embodiment are formed with solder bumps 39 on one side of each pair. Specifically, among the power terminal portion 425, the ground terminal portion 426, and the input side terminal portion 427, the second power terminal portion 425b, the second ground terminal portion 426b, and the second input side terminal portion 427b arranged on the driver 421 side are The solder bump 39 is made of a solder material such as tin plating that can be melted by heating. Similarly, the spacer 435 is also formed by solder bumps 39 as shown in FIG. A dummy terminal is formed on the flexible substrate 437 side at a position facing the spacer 435 made of the solder bump 39.
　ドライバ４２１をフレキシブル基板４３７に実装する際には、図１９及び図２０に示すように、第２電源端子部４２５ｂ、第２グランド端子部４２６ｂ、第２入力側端子部４２７ｂ及びスペーサ４３５をなす半田バンプ３９を加熱して溶融させることで、第２電源端子部４２５ｂを第１電源端子部４２５ａに、第２グランド端子部４２６ｂを第１グランド端子部４２６ａに、第２入力側端子部４２７ｂを第１入力側端子部４２７ａに、スペーサ４３５をフレキシブル基板４３７にそれぞれ直接的に接合させることができる。その後、ドライバ４２１とフレキシブル基板４３７との間に熱硬化性樹脂などからなる接着材料４０を流し込む、いわゆるアンダーフィルを行うことで、ドライバ４２１をフレキシブル基板４３７に対して強固に固定することができる。これにより、各端子部４２５～４２７の接続信頼性に一層優れるなどの効果が得られる。 When the driver 421 is mounted on the flexible substrate 437, as shown in FIGS. 19 and 20, the second power terminal portion 425b, the second ground terminal portion 426b, the second input side terminal portion 427b, and the solder that forms the spacer 435 are used. By heating and melting the bumps 39, the second power supply terminal portion 425b becomes the first power supply terminal portion 425a, the second ground terminal portion 426b becomes the first ground terminal portion 426a, and the second input side terminal portion 427b becomes the second. The spacer 435 can be directly bonded to the flexible substrate 437 to the 1-input-side terminal portion 427a. Thereafter, the driver 421 can be firmly fixed to the flexible substrate 437 by performing a so-called underfill in which an adhesive material 40 made of a thermosetting resin or the like is poured between the driver 421 and the flexible substrate 437. As a result, effects such as better connection reliability of the terminal portions 425 to 427 can be obtained.
　以上説明したように本実施形態によれば、入力側端子部４２７、電源端子部４２５及びグランド端子部４２６には、加熱により溶融する半田バンプ３７が設けられている。このようにすれば、半田バンプ３９を加熱により溶融させることで、入力側端子部４２７、電源端子部４２５及びグランド端子部４２６がそれぞれ接合されるから、接続信頼性を向上させることができる。特に電源端子部４２５によって駆動電力をより確実に供給することができるとともに、グランド端子部４２６によって基準電位をより安定的に供給することができる。 As described above, according to the present embodiment, the input terminal portion 427, the power supply terminal portion 425, and the ground terminal portion 426 are provided with solder bumps 37 that are melted by heating. By doing so, the solder bump 39 is melted by heating, and the input side terminal portion 427, the power supply terminal portion 425, and the ground terminal portion 426 are joined, so that the connection reliability can be improved. In particular, the driving power can be supplied more reliably by the power terminal portion 425, and the reference potential can be supplied more stably by the ground terminal portion 426.
　＜実施形態６＞
　本発明の実施形態６を図２１から図２３によって説明する。この実施形態６では、液晶パネル５１１側にゲート駆動部４１を設けたものを示す。なお、上記した実施形態１と同様の構造、作用及び効果について重複する説明は省略する。 <Embodiment 6>
A sixth embodiment of the present invention will be described with reference to FIGS. In the sixth embodiment, a liquid crystal panel 511 provided with a gate drive unit 41 is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.
　本実施形態に係る液晶パネル５１１には、図２１に示すように、表示部ＡＡ内のゲート配線に接続されるとともにゲート配線に走査信号を供給するゲート駆動部４１が設けられている。ゲート駆動部４１は、液晶パネル５１１におけるアレイ基板５１１ｂ上に配されており、アレイ基板５１１ｂ上の他の構造物（ＴＦＴ、ゲート配線、ソース配線など）を形成するプロセスを利用して形成されている。このため、本実施形態に係るドライバ５２１は、出力信号としてソース配線に供給するデータ信号のみを出力側端子部５２８によって供給するものとされる。そして、本実施形態に係る液晶パネル５１１及びドライバ５２１には、上記したゲート駆動部４１に駆動電力及び基準電位をそれぞれ供給するためのゲート駆動部用電源端子部４２及びゲート駆動部用グランド端子部４３が設けられている。 As shown in FIG. 21, the liquid crystal panel 511 according to the present embodiment is provided with a gate driving unit 41 that is connected to a gate wiring in the display unit AA and supplies a scanning signal to the gate wiring. The gate driver 41 is disposed on the array substrate 511b in the liquid crystal panel 511, and is formed using a process for forming other structures (TFT, gate wiring, source wiring, etc.) on the array substrate 511b. Yes. For this reason, the driver 521 according to the present embodiment supplies only the data signal supplied to the source wiring as the output signal by the output side terminal unit 528. In the liquid crystal panel 511 and the driver 521 according to the present embodiment, the gate driving unit power supply terminal unit 42 and the gate driving unit ground terminal unit for supplying the gate driving unit 41 with driving power and a reference potential, respectively. 43 is provided.
　ゲート駆動部用電源端子部４２及びゲート駆動部用グランド端子部４３は、図２２及び図２３に示すように、出力側端子部５２８群に対してその並列方向（Ｘ軸方向）について隣り合うよう配されている。詳しくは、ゲート駆動部用電源端子部４２及びゲート駆動部用グランド端子部４３は、出力側端子部５２８群をＸ軸方向について両側から挟み込むようにして配されていて、全体として左右対称の配置とされている。ゲート駆動部用電源端子部４２及びゲート駆動部用グランド端子部４３は、それぞれドライバ５２１に形成された第１ゲート駆動部用電源端子部４２ａ及び第１ゲート駆動部用グランド端子部４３ａと、アレイ基板５１１ｂにおけるドライバ５２１の実装領域に形成された第２ゲート駆動部用電源端子部４２ｂ及び第２ゲート駆動部用グランド端子部４３ｂとから構成されている。そして、それぞれ対をなす第１ゲート駆動部用電源端子部４２ａ及び第２ゲート駆動部用電源端子部４２ｂと、第１ゲート駆動部用グランド端子部４３ａ及び第２ゲート駆動部用グランド端子部４３ｂとは、互いに対向状をなした状態でＡＣＦ３０によって電気的に且つ機械的に接続されている。つまり、ゲート駆動部用電源端子部４２及びゲート駆動部用グランド端子部４３は、電源端子部２５、グランド端子部２６及び入力側端子部２７と共通の接続構造を有している。これにより、図２１に示すゲート駆動部４１に対して駆動電力及び基準電位を安定的に且つ確実に供給することができるものとされる。 As shown in FIGS. 22 and 23, the gate drive power supply terminal 42 and the gate drive ground terminal 43 are adjacent to the output terminal group 528 in the parallel direction (X-axis direction). It is arranged. Specifically, the gate drive unit power supply terminal unit 42 and the gate drive unit ground terminal unit 43 are arranged so as to sandwich the output-side terminal unit 528 group from both sides in the X-axis direction, and are arranged symmetrically as a whole. It is said that. The gate drive unit power supply terminal unit 42 and the gate drive unit ground terminal unit 43 include a first gate drive unit power supply terminal unit 42a and a first gate drive unit ground terminal unit 43a formed in the driver 521, respectively, and an array. The substrate 511b includes a second gate driver power supply terminal 42b and a second gate driver ground terminal 43b formed in the mounting region of the driver 521. The first gate driver power terminal 42a and the second gate driver power terminal 42b, the first gate driver ground terminal 43a, and the second gate driver ground terminal 43b, which are paired, respectively. Are electrically and mechanically connected by the ACF 30 in a state of being opposed to each other. That is, the gate drive power supply terminal 42 and the gate drive ground terminal 43 have a common connection structure with the power supply terminal 25, the ground terminal 26, and the input terminal 27. As a result, the driving power and the reference potential can be stably and reliably supplied to the gate driving unit 41 shown in FIG.
　なお、ドライバ５２１に形成された第１ゲート駆動部用電源端子部４２ａ及び第１ゲート駆動部用グランド端子部４３ａは、第２電源端子部２５ｂ、第２グランド端子部２６ｂ及び第２入力側端子部２７ｂ（図５を参照）と同様の構成とされる。一方、アレイ基板５１１ｂに形成された第２ゲート駆動部用電源端子部４２ｂ及び第２ゲート駆動部用グランド端子部４３ｂは、第１電源端子部２５ａ、第１グランド端子部２６ａ及び第１入力側端子部２７ａ（図５を参照）と同様の構成とされる。従って、これら各端子部４２ａ，４２ｂ，４３ａ，４３ｂの詳しい説明は省略する。 The first gate driver power terminal 42a and the first gate driver ground terminal 43a formed in the driver 521 are a second power terminal 25b, a second ground terminal 26b, and a second input terminal. The configuration is the same as that of the unit 27b (see FIG. 5). On the other hand, the second gate driver power terminal 42b and the second gate driver ground terminal 43b formed on the array substrate 511b include the first power terminal 25a, the first ground terminal 26a, and the first input side. The configuration is the same as that of the terminal portion 27a (see FIG. 5). Therefore, detailed description of these terminal portions 42a, 42b, 43a, 43b is omitted.
　＜他の実施形態＞
　本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
　（１）上記した実施形態３のさらなる変形例として、図２４に示すように、並列する複数の第１出力側端子部２２８ａ‐１が絶縁層３６‐１により一括して覆われるとともに、並列する複数の第２出力側端子部２２８ｂ‐１が絶縁層３６‐１により一括して覆われる構成とすることも可能である。このようにすれば、絶縁層３６‐１の形成に係るコストを低減することができる。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) As a further modification of the above-described third embodiment, as shown in FIG. 24, a plurality of first output side terminal portions 228a-1 arranged in parallel are collectively covered with an insulating layer 36-1 and arranged in parallel. A plurality of second output terminal portions 228b-1 may be covered by the insulating layer 36-1 at a time. In this way, the cost for forming the insulating layer 36-1 can be reduced.
　（２）上記した各実施形態以外にも、各端子部の具体的な配置、形状、設置数、大きさなどは、適宜に変更可能である。特に各端子部の平面形状に関しては、長方形や正方形以外にも、円形や楕円形などとすることも可能である。 (2) In addition to the above-described embodiments, the specific arrangement, shape, number of installations, size, and the like of each terminal unit can be changed as appropriate. In particular, regarding the planar shape of each terminal portion, a circular shape or an oval shape can be used in addition to a rectangular shape or a square shape.
　（３）上記した実施形態１の各変形例では、行列状または千鳥状に配列された出力側端子部が行方向及び列方向についてほぼ等間隔に配列された場合を示したが、行方向と列方向とで配列ピッチが異なるよう出力側端子部を配置することも可能である。 (3) In each of the modifications of the first embodiment described above, the output side terminal portions arranged in a matrix or staggered pattern are shown arranged at almost equal intervals in the row direction and the column direction. It is also possible to arrange the output side terminal portions so that the arrangement pitch differs in the column direction.
　（４）上記した各実施形態では、コイル状をなす出力側端子部をフォトリソグラフィー法により形成した場合を示したが、それ以外にも例えばダマシン法などによりコイル状をなす出力側端子部を形成することも可能である。 (4) In each of the above-described embodiments, the case where the output terminal portion having a coil shape is formed by a photolithography method is shown. However, the output terminal portion having a coil shape is formed by, for example, a damascene method. It is also possible to do.
　（５）上記した実施形態１～３，６では、ドライバをアレイ基板に固着する接着材料（異方性導電剤）としてフィルム状をなすＡＣＦを用いた場合を示したが、ペースト状のＡＣＰ（Anisotropic Conductive Paste）を用いることも勿論可能である。 (5) In the above first to third and sixth embodiments, the case where an ACF in the form of a film is used as an adhesive material (anisotropic conductive agent) for fixing the driver to the array substrate has been described. Of course, it is also possible to use Anisotropic (Conductive (Paste)).
　（６）上記した実施形態４では、ドライバをフレキシブル基板に固着する接着材料（導電性粒子を含有しない接着材料）としてフィルム状をなすＮＣＦを用いた場合を示したが、ペースト状のＮＣＰ（Non Conductive Paste）を用いることも勿論可能である。 (6) In Embodiment 4 described above, the case where NCF in the form of a film is used as an adhesive material (adhesive material not containing conductive particles) for fixing the driver to the flexible substrate is shown. Of course, it is also possible to use Conductive® Paste.
　（７）上記した各実施形態では、ＡＣＦ（異方性導電剤）やＮＣＦ（導電性粒子を含有しない接着材料）の材料として熱硬化性樹脂を用いた場合を示したが、ＡＣＦやＮＣＦの材料に熱可塑性樹脂、２液常温硬化樹脂などを用いることも可能である。 (7) In each of the above-described embodiments, the case where a thermosetting resin is used as a material of ACF (anisotropic conductive agent) or NCF (adhesive material not containing conductive particles) has been described. It is also possible to use a thermoplastic resin, a two-component room temperature curing resin, or the like as the material.
　（８）上記した各実施形態では、各端子部を同一の接着材料によって固着するようにしたものを示したが、端子部によって接着材料の種類を異ならせることも可能である。その場合、出力側端子部に関しては、ＡＣＦ（異方性導電剤）以外の接着機能のみを有する接着材料を用いることができ、具体的には熱可塑性樹脂や２液常温硬化樹脂などからなる接着材料を用いることが可能である。 (8) In the above-described embodiments, the terminal portions are fixed with the same adhesive material. However, the type of the adhesive material may be different depending on the terminal portions. In that case, for the output side terminal part, an adhesive material having only an adhesive function other than ACF (anisotropic conductive agent) can be used, and specifically, an adhesive made of a thermoplastic resin or a two-part room temperature curable resin. It is possible to use materials.
　（９）上記した実施形態４では、ドライバをフレキシブル基板に対して導電性粒子を含まない接着材料であるＮＣＦを用いて接続した場合を示したが、ＮＣＦに代えて導電性粒子を含むＡＣＦ（異方性導電剤）を用いることも勿論可能である。 (9) In Embodiment 4 described above, the case where the driver is connected to the flexible substrate using NCF, which is an adhesive material that does not include conductive particles, is shown. However, the ACF that includes conductive particles instead of NCF ( Of course, it is also possible to use an anisotropic conductive agent).
　（１０）上記した各実施形態では、制御回路基板が電源及び信号供給源を兼用する構成のものを例示したが、電源をなす電源基板と、信号供給源をなす信号供給基板とをそれぞれ設置するようにしたものも本発明に含まれる。 (10) In each of the embodiments described above, the control circuit board is exemplified to have a configuration in which both the power supply and the signal supply source are used. What was done is also included in the present invention.
　（１１）上記した各実施形態では、外部光源であるバックライト装置を備えた透過型の液晶表示装置を例示したが、本発明は、外光を利用して表示を行う反射型液晶表示装置にも適用可能であり、その場合はバックライト装置を省略することができる。 (11) In each of the above-described embodiments, a transmissive liquid crystal display device including a backlight device that is an external light source is illustrated. However, the present invention is applied to a reflective liquid crystal display device that performs display using external light. In this case, the backlight device can be omitted.
　（１２）上記した各実施形態では、液晶表示装置のスイッチング素子としてＴＦＴを用いたが、ＴＦＴ以外のスイッチング素子（例えば薄膜ダイオード（ＴＦＤ））を用いた液晶表示装置にも適用可能であり、カラー表示する液晶表示装置以外にも、白黒表示する液晶表示装置にも適用可能である。 (12) In each of the embodiments described above, a TFT is used as a switching element of a liquid crystal display device. However, the present invention can also be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)). In addition to the liquid crystal display device for display, the present invention can also be applied to a liquid crystal display device for monochrome display.
　（１３）上記した各実施形態では、表示パネルとして液晶パネルを用いた液晶表示装置を例示したが、他の種類の表示パネル（ＰＤＰや有機ＥＬパネルなど）を用いた表示装置にも本発明は適用可能である。その場合、バックライト装置を省略することも可能である。 (13) In each of the above-described embodiments, the liquid crystal display device using a liquid crystal panel as the display panel has been exemplified. However, the present invention is applicable to a display device using another type of display panel (PDP, organic EL panel, etc.). Applicable. In that case, the backlight device can be omitted.
　（１４）上記した実施形態２～６に、実施形態１の変形例１～５に記載した各端子部の配列構造をそれぞれ適用することも可能である。特に、ＣＯＦ実装を行う実施形態４，５に実施形態１の変形例１～５を適用した場合には、入力側端子部、電源端子部及びグランド端子部については半田バンプによって接続し、その後にドライバとフレキシブル基板との間に接着材料を流し込む（アンダーフィルを行う）ことで、フレキシブル基板に対してドライバの固着を図るようにするのが好ましい。このようにすれば、フレキシブル基板に対するドライバの実装に際してドライバを加圧する必要がないため、出力側端子部の配置の自由度が高く、エリアアレイ配置する上で好適とされる。これにより、ドライバのサイズを小さくすることができるので、コストを抑制する上で効果的である。なお、実施形態４，５に、実施形態１の変形例１～５に記載した各端子部の配列構造をそれぞれ適用するに際して、ドライバとフレキシブル基板とをＡＣＦ（異方性導電剤）やＮＣＦ（導電性粒子を含有しない接着材料）を用いて固着するようにしても勿論構わない。 (14) The arrangement structures of the terminal portions described in the first to fifth modifications of the first embodiment can be applied to the second to sixth embodiments. In particular, when Modifications 1 to 5 of Embodiment 1 are applied to Embodiments 4 and 5 in which COF mounting is performed, the input side terminal portion, the power supply terminal portion, and the ground terminal portion are connected by solder bumps, and thereafter It is preferable to fix the driver to the flexible board by pouring an adhesive material between the driver and the flexible board (performing underfill). In this way, it is not necessary to press the driver when mounting the driver on the flexible substrate, so that the degree of freedom in arranging the output side terminal portion is high, which is suitable for the area array arrangement. As a result, the size of the driver can be reduced, which is effective in reducing the cost. In addition, when the arrangement structure of each terminal portion described in the first to fifth modifications of the first embodiment is applied to the fourth and fifth embodiments, the driver and the flexible substrate are connected to an ACF (anisotropic conductive agent) or an NCF (NCF). Needless to say, it may be fixed using an adhesive material that does not contain conductive particles.
　１０…液晶表示装置（表示装置）、１１，３１１，５１１…液晶パネル（表示パネル）、１１ａ…ＣＦ基板（基板）、１１ｂ，１１１ｂ，２１１ｂ，４１１ｂ，５１１ｂ…アレイ基板（基板）、１２，３１２…制御回路基板（電源、信号供給源）、１４…バックライト装置（照明装置）、２１，１２１，２２１，３２１，４２１，５２１…ドライバ（駆動回路部）、２２…駆動電力供給端子部、２３…基準電位供給端子部、２４…信号供給端子部、２５，３２５，４２５…電源端子部、２５ａ，３２５ａ，４２５ａ…第１電源端子部（電源端子部）、２５ｂ，３２５ｂ，４２５ｂ…第２電源端子部（電源端子部）、２６，３２６，４２６…グランド端子部、２６ａ，３２６ａ，４２６ａ…第１グランド端子部（グランド端子部）、２６ｂ，３２６ｂ，４２６ｂ…第２グランド端子部（グランド端子部）、２７，３２７，４２７…入力側端子部、２７ａ，３２７ａ，４２７ａ…第１入力側端子部（入力側端子部）、２７ｂ，３２７ｂ，４２７ｂ…第２入力側端子部（入力側端子部）、２８，１２８，２２８，３２８，５２８…出力側端子部、２８ａ，１２８ａ，２２８ａ，３２８ａ，５２８ａ…第１出力側端子部（出力側端子部）、２８ｂ，１２８ｂ，２２８ｂ，３２８ｂ，５２８ｂ…第２出力側端子部（出力側端子部）、３０…ＡＣＦ（接着材料、異方性導電剤）、３５，１３５，４３５…スペーサ、３６…絶縁層、３７…フレキシブル基板、３８…ＮＣＦ（接着材料）、３９…半田バンプ、４０…接着材料、ＡＡ…表示部 DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display device (display apparatus) 11,311,511 ... Liquid crystal panel (display panel), 11a ... CF board | substrate (board | substrate), 11b, 111b, 211b, 411b, 511b ... Array board | substrate (board | substrate), 12,312 ... Control circuit board (power supply, signal supply source), 14 ... Backlight device (illumination device), 21, 121, 221, 321, 421, 521 ... Driver (drive circuit unit), 22 ... Drive power supply terminal unit, 23 Reference potential supply terminal, 24 ... Signal supply terminal, 25, 325, 425 ... Power supply terminal, 25a, 325a, 425a ... First power supply terminal (power supply terminal), 25b, 325b, 425b ... Second power supply Terminal part (power supply terminal part), 26, 326, 426 ... Ground terminal part, 26a, 326a, 426a ... First ground terminal part (ground terminal part), 26b, 26b, 426b ... 2nd ground terminal part (ground terminal part), 27, 327, 427 ... input side terminal part, 27a, 327a, 427a ... 1st input side terminal part (input side terminal part), 27b, 327b, 427b ... 2nd input side terminal part (input side terminal part), 28, 128, 228, 328, 528 ... Output side terminal part, 28a, 128a, 228a, 328a, 528a ... 1st output side terminal part (output side terminal part) ), 28b, 128b, 228b, 328b, 528b ... second output side terminal portion (output side terminal portion), 30 ... ACF (adhesive material, anisotropic conductive agent), 35,135,435 ... spacer, 36 ... insulation Layers 37... Flexible substrate 38. NCF (adhesive material) 39. Solder bumps 40. Adhesive material AA.

Claims (22)

  1. 　画像を表示可能な表示部を有する表示パネルと、
    　電源から供給される駆動電力及び基準電位に基づいて作動するものであって、信号供給源から供給される入力信号を処理して生成した出力信号を前記表示部に出力することで前記表示パネルを駆動する駆動回路部と、
    　前記電源側と前記駆動回路部側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで前記駆動電力の供給が可能とされる電源端子部と、
    　前記電源側と前記駆動回路部側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで前記基準電位の供給が可能とされるグランド端子部と、
    　前記信号供給源側と前記駆動回路部側とに対をなす形で備えられ互いに直接的にまたは間接的に接触することで前記入力信号の伝送が可能とされる入力側端子部と、
    　前記駆動回路部側と前記表示部側とに対をなす形で備えられそれぞれがコイル状をなすとともに相互に誘導結合されることで前記出力信号の伝送が可能とされる出力側端子部とを備える表示装置。     A display panel having a display unit capable of displaying an image;
    The display panel operates based on driving power and a reference potential supplied from a power source, and outputs an output signal generated by processing an input signal supplied from a signal supply source to the display unit. A drive circuit unit for driving;
    A power supply terminal portion that is provided in a paired manner on the power supply side and the drive circuit portion side and that can supply the drive power by directly or indirectly contacting each other;
    A ground terminal portion that is provided in a paired form on the power supply side and the drive circuit portion side, and is capable of supplying the reference potential by directly or indirectly contacting each other;
    An input-side terminal unit that is provided in a paired manner on the signal supply source side and the drive circuit unit side, and capable of transmitting the input signal by directly or indirectly contacting each other;
    An output side terminal portion that is provided in a paired form on the drive circuit side and the display side, and that each forms a coil and is inductively coupled to each other to enable transmission of the output signal. A display device provided.
  2. 　前記出力側端子部は、対をなすもの同士が対向状をなすよう配されている請求項１記載の表示装置。 The display device according to claim 1, wherein the output side terminal portions are arranged so that pairs of the output side terminal portions face each other.
  3. 　前記入力側端子部、前記電源端子部及び前記グランド端子部は、それぞれ対をなすもの同士が対向状をなすよう配されている請求項２記載の表示装置。 The display device according to claim 2, wherein the input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged so that a pair of each of the input side terminal portion, the power supply terminal portion, and the ground terminal portion are opposed to each other.
  4. 　前記入力側端子部、前記電源端子部及び前記グランド端子部は、前記駆動回路部における外縁側に配されている請求項３記載の表示装置。 4. The display device according to claim 3, wherein the input side terminal portion, the power supply terminal portion, and the ground terminal portion are arranged on an outer edge side of the drive circuit portion.
  5. 　前記入力側端子部、前記電源端子部及び前記グランド端子部は、前記駆動回路部のうち少なくとも前記表示部側とは反対側の外縁に沿って配されているのに対し、
    　前記出力側端子部は、前記駆動回路部のうち少なくとも前記表示部側の外縁に沿って配されている請求項４記載の表示装置。     Whereas the input side terminal portion, the power supply terminal portion and the ground terminal portion are arranged along the outer edge of the drive circuit portion on the opposite side to at least the display portion side,
    The display device according to claim 4, wherein the output side terminal portion is arranged along at least an outer edge of the drive circuit portion on the display portion side.
  6. 　前記出力側端子部には、前記入力側端子部、前記電源端子部及び前記グランド端子部よりも相対的に前記駆動回路部における中央寄りに配されるものが含まれている請求項４または請求項５記載の表示装置。 5. The output side terminal portion includes one that is disposed closer to the center of the drive circuit portion than the input side terminal portion, the power supply terminal portion, and the ground terminal portion. Item 6. The display device according to Item 5.
  7. 　前記出力側端子部は、平面に視て格子状に複数ずつ並列配置されている請求項６記載の表示装置。 The display device according to claim 6, wherein a plurality of the output side terminal portions are arranged in parallel in a lattice shape when seen in a plan view.
  8. 　前記出力側端子部は、平面に視て千鳥状に複数ずつ並列配置されている請求項６記載の表示装置。 The display device according to claim 6, wherein a plurality of the output side terminal portions are arranged in parallel in a zigzag shape when viewed in a plan view.
  9. 　前記入力側端子部、前記電源端子部及び前記グランド端子部は、それぞれ対をなすもの同士が、同じ接着材料によって接触状態に固着されている請求項３から請求項８のいずれか１項に記載の表示装置。 The said input side terminal part, the said power supply terminal part, and the said ground terminal part are what adhere | attaches each, and are firmly fixed to the contact state with the same adhesive material. Display device.
  10. 　前記接着材料は、異方性導電剤とされる請求項９記載の表示装置。 10. The display device according to claim 9, wherein the adhesive material is an anisotropic conductive agent.
  11. 　前記出力側端子部は、対をなすもの同士が、前記入力側端子部、前記電源端子部及び前記グランド端子部と同じ前記接着材料によって固着されている請求項９または請求項１０記載の表示装置。 11. The display device according to claim 9, wherein a pair of the output side terminal portions are fixed to each other by the same adhesive material as the input side terminal portion, the power supply terminal portion, and the ground terminal portion. .
  12. 　前記接着材料は、前記入力側端子部、前記出力側端子部、前記電源端子部及び前記グランド端子部の各配置領域に跨る範囲に配されている請求項１１記載の表示装置。 The display device according to claim 11, wherein the adhesive material is disposed in a range extending over the arrangement regions of the input terminal portion, the output terminal portion, the power supply terminal portion, and the ground terminal portion.
  13. 　前記入力側端子部、前記電源端子部及び前記グランド端子部には、加熱により溶融する半田バンプが設けられている請求項３から請求項１２のいずれか１項に記載の表示装置。 The display device according to any one of claims 3 to 12, wherein the input side terminal portion, the power supply terminal portion, and the ground terminal portion are provided with solder bumps that are melted by heating.
  14. 　対をなす前記出力側端子部の間の距離を規制するためのスペーサが備えられている請求項１から請求項１３のいずれか１項に記載の表示装置。 The display device according to any one of claims 1 to 13, further comprising a spacer for regulating a distance between the pair of output-side terminal portions.
  15. 　前記スペーサは、平面に視て前記出力側端子部の配置領域を挟み込む位置に少なくとも一対配されている請求項１４記載の表示装置。 The display device according to claim 14, wherein at least a pair of the spacers are arranged at a position sandwiching an arrangement region of the output side terminal portion in a plan view.
  16. 　前記スペーサは、平面に視て前記出力側端子部の配置領域における中央側にも配されている請求項１５記載の表示装置。 The display device according to claim 15, wherein the spacer is also arranged on a central side in an arrangement region of the output side terminal portion in a plan view.
  17. 　対をなす前記出力側端子部の少なくともいずれか一方は、絶縁層によって覆われている請求項１から請求項１６のいずれか１項に記載の表示装置。 The display device according to any one of claims 1 to 16, wherein at least one of the output-side terminal portions forming a pair is covered with an insulating layer.
  18. 　対をなす前記出力側端子部は、共に前記絶縁層によって覆われている請求項１から請求項１７のいずれか１項に記載の表示装置。 18. The display device according to claim 1, wherein both of the paired output side terminal portions are covered with the insulating layer.
  19. 　前記駆動回路部は、前記表示パネルに実装されており、
    　前記入力側端子部、前記出力側端子部、前記電源端子部及び前記グランド端子部は、前記表示パネルと前記駆動回路部とにそれぞれ対をなす形で備えられている請求項１から請求項１８のいずれか１項に記載の表示装置。     The drive circuit unit is mounted on the display panel,
    The input side terminal portion, the output side terminal portion, the power supply terminal portion, and the ground terminal portion are provided in pairs in the display panel and the drive circuit portion, respectively. The display device according to any one of the above.
  20. 　一端側が前記信号供給源側及び前記電源側に接続されるのに対して他端側が前記表示パネルに接続されるフレキシブル基板が備えられるとともに、前記駆動回路部が前記フレキシブル基板に実装されており、
    　前記入力側端子部、前記出力側端子部、前記電源端子部及び前記グランド端子部は、前記駆動回路部と前記フレキシブル基板とにそれぞれ対をなす形で備えられている請求項１から請求項１８のいずれか１項に記載の表示装置。     A flexible substrate is provided with one end side connected to the signal supply source side and the power supply side, whereas the other end side is connected to the display panel, and the drive circuit unit is mounted on the flexible substrate,
    The input side terminal portion, the output side terminal portion, the power supply terminal portion, and the ground terminal portion are provided in pairs in the drive circuit portion and the flexible substrate, respectively. The display device according to any one of the above.
  21. 　前記表示パネルは、一対の基板間に液晶を封入してなる液晶パネルとされる請求項１から請求項２０のいずれか１項に記載の表示装置。 The display device according to any one of claims 1 to 20, wherein the display panel is a liquid crystal panel in which liquid crystal is sealed between a pair of substrates.
  22. 　前記液晶パネルに対して対向状をなし且つ表示側とは反対側に配されるとともに前記液晶パネルに対して光を供給可能な照明装置を備える請求項２１記載の表示装置。 The display device according to claim 21, further comprising an illumination device that is opposed to the liquid crystal panel and is disposed on a side opposite to the display side and capable of supplying light to the liquid crystal panel.
PCT/JP2012/053801 2011-02-25 2012-02-17 Display device WO2012115001A1 (en)

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