WO2012103203A2 - Frid transponder and method for connecting semiconductor die to antenna - Google Patents

Frid transponder and method for connecting semiconductor die to antenna Download PDF

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Publication number
WO2012103203A2
WO2012103203A2 PCT/US2012/022532 US2012022532W WO2012103203A2 WO 2012103203 A2 WO2012103203 A2 WO 2012103203A2 US 2012022532 W US2012022532 W US 2012022532W WO 2012103203 A2 WO2012103203 A2 WO 2012103203A2
Authority
WO
WIPO (PCT)
Prior art keywords
winding wire
die
contact area
soldering
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/022532
Other languages
French (fr)
Other versions
WO2012103203A3 (en
Inventor
Johann Gross
Bernhard Lange
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Deutschland GmbH
Texas Instruments Japan Ltd
Texas Instruments Inc
Original Assignee
Texas Instruments Deutschland GmbH
Texas Instruments Japan Ltd
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Deutschland GmbH, Texas Instruments Japan Ltd, Texas Instruments Inc filed Critical Texas Instruments Deutschland GmbH
Priority to CN2012800063442A priority Critical patent/CN103339644A/en
Priority to JP2013551306A priority patent/JP2014505309A/en
Publication of WO2012103203A2 publication Critical patent/WO2012103203A2/en
Publication of WO2012103203A3 publication Critical patent/WO2012103203A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Definitions

  • This relates to an RFID (radio frequency identification) transponder, comprising a
  • the invention relates to a method for connecting a semiconductor die to an antenna winding wire.
  • An RFID transponder comprising a semiconductor die and an antenna made from a winding wire is provided. Also provided is a method for connecting a semiconductor die to the winding wire of an antenna that offers reduced mechanical stress for the connection of the antenna to the die.
  • an RFID transponder comprising a semiconductor die has a solderable contact area and an antenna made from a winding wire.
  • the winding wire is soldered to the die at a contact area made from a nickel based alloy.
  • the solderable contact area comprises a plating made from the nickel based alloy that may be a nickel gold alloy (NiAu) or a nickel tin alloy (NiSn).
  • the solder contact between the winding wire and the contact area is realized with the help of laser soldering, hot stamping soldering or ultrasonic compression welding.
  • the solder material is preferably lead and flux free.
  • the disclosed implementation may avoid the thermocompression bonding process that is presently established in the art.
  • a solderable contact area without gold (Au) may be applied and the soldering process may become much more economic with respect to the material (gold) itself, as well as with respect to processing.
  • a nickel based material is applied for providing the solderable contact area or contact pads, respectively.
  • thermocompression bonding induces mechanical stress in the connecting area.
  • Connecting techniques like hot stamping soldering, ultrasonic compression welding and laser soldering significantly reduce the appearance of intrinsic stress.
  • a reliable connection between the winding wire of an antenna and the die may be provided.
  • Mechanical stress in the connecting area is significantly reduced.
  • the expensive gold layer in the contact area may be omitted which leads to more than 70% of cost savings.
  • High temperatures of up to 700°C, that are typically known from the soldering process when using a gold thermocompression connecting process do not occur when applying the aforementioned techniques.
  • the solderable contact area comprises a tin (Sn) finish.
  • Sn tin
  • the antenna's winding wire insulation is stripped off using a laser.
  • the stripping of the wire's insulation has been identified as a further source for thermal stress.
  • the contact between the winding wire and the solderable contact area is performed by using a lead and flux free solder material. Especially in combination with laser soldering, a flux free solder connection may be realized.
  • a method for connecting a semiconductor die to a winding wire of an antenna has a solderable contact area made from a nickel based alloy.
  • the step of soldering the winding wire to the solderable contact area is performed by using a hot stamping solder process or by ultrasonic compression welding.
  • the step of soldering the winding wire to the solderable contact area is performed by using a contact free connecting method, preferably by laser soldering.
  • the step of stripping the antenna winding wire insulation is performed by also using the laser, preferably the same laser already in use for soldering is applied.
  • the step of positioning the die and the antenna winding wire relative to each other is performed with the help of a positioning stage.
  • the die may be picked by a usual die picker and set to a suitable sample jig that is mounted to the positioning stage.
  • a plurality of different dies may be soldered by using solely one positioning stage since the latter is positionable.
  • the positioning step is performed automatically.
  • the die is mounted to the positioning stage with the help of a vacuum holder.
  • the method comprises the step of heating the positioning stage. This supports the soldering process made by, i.e., a laser.
  • a preferable solder alloy for the method according to the invention is lead and flux free.
  • FIG.l is a simplified perspective view illustrating a method for connecting an antenna wire to a semiconductor die according to an example embodiment
  • FIG. 2 illustrates an RFID transponder having a semiconductor die that is connected to an antenna wire, according to an example embodiment.
  • FIG. 1 shows a system for connecting the winding wire 2 of an antenna 4 to a die 6.
  • the winding wire 2 of the antenna 4 is located on a suitable core 8, which may be a ferrite core.
  • the principles of connecting the antenna's winding wire 2 to the die 6 are not limited to an antenna 4 having the depicted structure. Other winding wires 2 may be connected to the die 6 in the same way.
  • the semiconductor die 6 is located on a positioning stage 10 for positioning the die 6 relative to the antenna 4 and a connecting end of the winding wire 2.
  • the die 6 comprises solderable contact areas 12, preferably a metal plating made from a nickel based alloy, e.g., a NiAu or a NiSn alloy.
  • the solderable contact areas are positioned underneath the soldering end of the winding wire 2 of the antenna 4 with the help of the positioning stage 6. This is preferably done automatically.
  • a suitable solder material preferably a lead and flux free solder alloy, may be placed on top of the solderable contact areas 12.
  • the antenna 4 is held by a suitable holder 14 and the die 6 is positioned relative to it. Also, the other way round, the antenna 4 may be positioned by a suitable positioning stage and the die 6 may be fixed in a suitable jig.
  • soldering is performed with the help of a laser 18, e.g., a fiber laser.
  • a laser e.g., a fiber laser.
  • Optics for guiding and forming an emitted laser radiation 16 are also present but omitted for clarity.
  • the laser radiation 16 is coupled to the soldering area and the necessary heat for soldering the die 6 to the winding wire 2 is transferred.
  • Other connecting techniques that do not provide the necessary heat input by plastic mechanical deformation onto the solderable contact area 12 or the antenna's winding wire 2, i.e., its soldering end, are also applicable. Due to empirical analysis, it has been found that hot stamping soldering or ultrasonic compression welding techniques are also suitable.
  • the die 6 may be attached to the positioning stage 10 with the help of a vacuum holder that is preferably integrated in the positioning stage 10.
  • a vacuum holder that is preferably integrated in the positioning stage 10.
  • the die will be placed by a die picker onto the positioning stage 10 and held by a vacuum holder in position.
  • the die 6 may be aligned automatically.
  • the die can be placed very easily and further aligned automatically underneath the winding wire 2 of the antenna 4 which leads to a fast process.
  • the positioning stage may be heatable. This may be advantageous in combination with the hot stamping solder process.
  • ultrasonic compression welding may be used to connect the winding wire with the solderable contact area 12 of the die 6.
  • the insulation of the winding wire 2 needs to be stripped off. This may be done with the help of the laser. Stripping the wire's insulation, with the help of the laser's radiation, significantly reduces the stress to the soldering end of the winding wire 2. Residual stress in this part of the winding wire may also lead to stress in the connecting area. By reducing the stress to the winding wire 2, the risk of further stress impact to the soldering area between the winding wire 2 and the solderable contact area 12 of the die 6 may be minimized.
  • FIG. 2 shows an RFID transponder 20 having an antenna 22 that is connected to a die 6 with the help of the method according to an embodiment of the invention.
  • the RFID transponder 20 has a higher reliability due a reliable electrical connection between the antenna 22 and the die 6.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Details Of Aerials (AREA)
  • Wire Processing (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

An RFID (radio frequency identification) transponder having a semiconductor die (6) with a solderable contact area (12) and an antenna made from a winding wire (2), wherein the winding wire is soldered to the contact area (12) and the solderable contact area (12) is made from a nickel based alloy.

Description

RFID TRANSPONDER AND METHOD FOR
CONNECTING SEMICONDUCTOR DIE TO ANTENNA
This relates to an RFID (radio frequency identification) transponder, comprising a
semiconductor die and an antenna made from a winding wire. Further, the invention relates to a method for connecting a semiconductor die to an antenna winding wire.
BACKGROUND
[0001] Current wafers for transponder chips, especially for RFID HDX (half duplex) transponders, need expensive gold layers for contacting the same to a winding wire of an antenna. Further, the antenna's winding wire needs to be soldered manually which causes a long process time and additional costs. Soldering is typically performed by a thermocompression process that is known to create high thermal and mechanical stress to the respective material in the soldering area. Intrinsic stress may lead to degradation of the material properties in the connecting area. In the worst case, mechanic stress leads to cracks in the connection, and therefore, causes problems with respect to reliability of the electrical connection. An example of a typical fixing process is described in US Patent No. 5,572,410. SUMMARY
[0002] An RFID transponder comprising a semiconductor die and an antenna made from a winding wire is provided. Also provided is a method for connecting a semiconductor die to the winding wire of an antenna that offers reduced mechanical stress for the connection of the antenna to the die.
[0003] In a described example embodiment, an RFID transponder comprising a semiconductor die has a solderable contact area and an antenna made from a winding wire. The winding wire is soldered to the die at a contact area made from a nickel based alloy. Preferably, the solderable contact area comprises a plating made from the nickel based alloy that may be a nickel gold alloy (NiAu) or a nickel tin alloy (NiSn). Also preferably, the solder contact between the winding wire and the contact area is realized with the help of laser soldering, hot stamping soldering or ultrasonic compression welding. The solder material is preferably lead and flux free.
[0004] The disclosed implementation may avoid the thermocompression bonding process that is presently established in the art. A solderable contact area without gold (Au) may be applied and the soldering process may become much more economic with respect to the material (gold) itself, as well as with respect to processing. Instead of the conventional gold plating, a nickel based material is applied for providing the solderable contact area or contact pads, respectively.
[0005] Due to empirical analysis, it has been discovered that thermocompression bonding induces mechanical stress in the connecting area. Connecting techniques like hot stamping soldering, ultrasonic compression welding and laser soldering significantly reduce the appearance of intrinsic stress. In combination with a nickel based solderable contact area, a reliable connection between the winding wire of an antenna and the die may be provided. Mechanical stress in the connecting area is significantly reduced. The expensive gold layer in the contact area may be omitted which leads to more than 70% of cost savings. High temperatures of up to 700°C, that are typically known from the soldering process when using a gold thermocompression connecting process, do not occur when applying the aforementioned techniques.
[0006] According to another aspect, the solderable contact area comprises a tin (Sn) finish. This leads to further reduction of thermal and mechanical stress. In combination with the hot stamping solder process, empirical analysis showed that the tin finish provides a significant reduction of thermal and mechanical stress.
[0007] For ultrasonic compression welding, it was discovered that the thermal and mechanical stress to the die is more than 20% reduced compared to the gold thermocompression process known in the Art.
[0008] According to a further embodiment, the antenna's winding wire insulation is stripped off using a laser. The stripping of the wire's insulation has been identified as a further source for thermal stress. By stripping the wire insulation with the laser, the introduction of further thermal stress can be avoided. [0009] In another embodiment, the contact between the winding wire and the solderable contact area is performed by using a lead and flux free solder material. Especially in combination with laser soldering, a flux free solder connection may be realized.
[0010] According to another aspect, a method for connecting a semiconductor die to a winding wire of an antenna is provided. The die has a solderable contact area made from a nickel based alloy. The step of soldering the winding wire to the solderable contact area is performed by using a hot stamping solder process or by ultrasonic compression welding. According to another aspect, the step of soldering the winding wire to the solderable contact area is performed by using a contact free connecting method, preferably by laser soldering.
[0011] Due to empirical analysis, it has been discovered that the aforementioned connecting techniques significantly reduce the appearance of intrinsic stress. Preferably, a thermocompression process may be avoided.
[0012] Preferably, if a laser is used for soldering, the step of stripping the antenna winding wire insulation is performed by also using the laser, preferably the same laser already in use for soldering is applied.
[0013] According to another aspect, the step of positioning the die and the antenna winding wire relative to each other is performed with the help of a positioning stage. The die may be picked by a usual die picker and set to a suitable sample jig that is mounted to the positioning stage. A plurality of different dies may be soldered by using solely one positioning stage since the latter is positionable. The positioning step is performed automatically.
[0014] In another embodiment, the die is mounted to the positioning stage with the help of a vacuum holder. This allows a very flexible fixation of the die. Further preferably, the method comprises the step of heating the positioning stage. This supports the soldering process made by, i.e., a laser. A preferable solder alloy for the method according to the invention is lead and flux free.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG.l is a simplified perspective view illustrating a method for connecting an antenna wire to a semiconductor die according to an example embodiment; and
[0016] FIG. 2 illustrates an RFID transponder having a semiconductor die that is connected to an antenna wire, according to an example embodiment. DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
[0017] FIG. 1 shows a system for connecting the winding wire 2 of an antenna 4 to a die 6. The winding wire 2 of the antenna 4 is located on a suitable core 8, which may be a ferrite core. The principles of connecting the antenna's winding wire 2 to the die 6 are not limited to an antenna 4 having the depicted structure. Other winding wires 2 may be connected to the die 6 in the same way.
[0018] The semiconductor die 6 is located on a positioning stage 10 for positioning the die 6 relative to the antenna 4 and a connecting end of the winding wire 2. The die 6 comprises solderable contact areas 12, preferably a metal plating made from a nickel based alloy, e.g., a NiAu or a NiSn alloy. The solderable contact areas are positioned underneath the soldering end of the winding wire 2 of the antenna 4 with the help of the positioning stage 6. This is preferably done automatically. A suitable solder material, preferably a lead and flux free solder alloy, may be placed on top of the solderable contact areas 12. The antenna 4 is held by a suitable holder 14 and the die 6 is positioned relative to it. Also, the other way round, the antenna 4 may be positioned by a suitable positioning stage and the die 6 may be fixed in a suitable jig.
[0019] According to the embodiment of FIG. 1, soldering is performed with the help of a laser 18, e.g., a fiber laser. Optics for guiding and forming an emitted laser radiation 16 are also present but omitted for clarity. The laser radiation 16 is coupled to the soldering area and the necessary heat for soldering the die 6 to the winding wire 2 is transferred. Other connecting techniques that do not provide the necessary heat input by plastic mechanical deformation onto the solderable contact area 12 or the antenna's winding wire 2, i.e., its soldering end, are also applicable. Due to empirical analysis, it has been found that hot stamping soldering or ultrasonic compression welding techniques are also suitable.
[0020] The die 6 may be attached to the positioning stage 10 with the help of a vacuum holder that is preferably integrated in the positioning stage 10. For connecting the winding wire 2 to the solderable contact area 12 of the die 6, the die will be placed by a die picker onto the positioning stage 10 and held by a vacuum holder in position. Preferably the die 6 may be aligned automatically. The die can be placed very easily and further aligned automatically underneath the winding wire 2 of the antenna 4 which leads to a fast process. [0021] For support of the soldering process, the positioning stage may be heatable. This may be advantageous in combination with the hot stamping solder process. According to another alternative embodiment, ultrasonic compression welding may be used to connect the winding wire with the solderable contact area 12 of the die 6.
[0022] Prior to the soldering process, the insulation of the winding wire 2 needs to be stripped off. This may be done with the help of the laser. Stripping the wire's insulation, with the help of the laser's radiation, significantly reduces the stress to the soldering end of the winding wire 2. Residual stress in this part of the winding wire may also lead to stress in the connecting area. By reducing the stress to the winding wire 2, the risk of further stress impact to the soldering area between the winding wire 2 and the solderable contact area 12 of the die 6 may be minimized.
[0023] FIG. 2 shows an RFID transponder 20 having an antenna 22 that is connected to a die 6 with the help of the method according to an embodiment of the invention. The RFID transponder 20 has a higher reliability due a reliable electrical connection between the antenna 22 and the die 6.
[0024] It will be understood that various modifications may be made to the described emboidiments, and that many other embodiments are possible, without departing from the scope of the claimed invention.

Claims

CLAIMS What is claimed is:
1. An RFID transponder, comprising:
a semiconductor die having a solderable contact area; and
an antenna made from a winding wire, wherein the winding wire is soldered to the contact area and the solderable contact area is made from a nickel based alloy.
2. The transponder of claim 1 , wherein the nickel based alloy is NiAu or NiSn.
3. The transponder of claim 2, wherein the solder contact between the winding wire and the solderable contact area is made by laser soldering, hot stamping soldering or ultrasonic compression welding.
4. The transponder of claim 1, wherein the solder contact between the winding wire and the solderable contact area is made by laser soldering, hot stamping soldering or ultrasonic compression welding.
5. The transponder of claim 4, wherein the solderable contact area comprises a Sn finish.
6. The transponder of claim 1, wherein the solderable contact area comprises a Sn finish.
7. A method for connecting a semiconductor die to a winding wire of an antenna comprising:
providing a solderable contact area on the die made from a nickel based alloy;
soldering the winding wire to the solderable contact area by using a hot stamping solder process or by ultrasonic compression welding.
8. The method of claim 7, further comprising positioning the die and the winding wire relative to each other with a positioning stage, wherein the die is fixed to the positioning stage with the help of a vacuum holder.
9. The method of claim 8, further comprising the step of using a laser to strip insulation off the winding wire.
10. The method of claim 7, further comprising the step of stripping insulation off the winding wire with a laser.
11. A method for connecting a semiconductor die to a winding wire of an antenna comprising:
providing a solderable contact area on the die made from a nickel based alloy;
soldering the winding wire to the solderable contact area by using a contact free connecting method.
12. The method of claim 11, wherein the step of soldering is performed by laser soldering.
13. The method of claim 12, further comprising the step of stripping insulation off the winding wire with the laser.
14. The method of claim 13, further comprising positioning the die and the winding wire relative to each other with a positioning stage, wherein the die is fixed to the positioning stage with the help of a vacuum holder.
15. The method of claim 11, further comprising the step of stripping insulation off the winding wire with the laser.
16. The method of claim 11, further comprising positioning the die and the winding wire relative to each other with a positioning stage, wherein the die is fixed to the positioning stage with the help of a vacuum holder.
PCT/US2012/022532 2011-01-27 2012-01-25 Frid transponder and method for connecting semiconductor die to antenna Ceased WO2012103203A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2012800063442A CN103339644A (en) 2011-01-27 2012-01-25 RFID transponder and method of connecting semiconductor die to antenna
JP2013551306A JP2014505309A (en) 2011-01-27 2012-01-25 RFID transponder and method for connecting a semiconductor die to an antenna

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE1020110095772 2011-01-27
DE102011009577A DE102011009577A1 (en) 2011-01-27 2011-01-27 RFID transponder and method for connecting a semiconductor die to an antenna
US13/351,104 US20120193801A1 (en) 2011-01-27 2012-01-16 Rfid transponder and method for connecting a semiconductor die to an antenna
US13/351,104 2012-01-16

Publications (2)

Publication Number Publication Date
WO2012103203A2 true WO2012103203A2 (en) 2012-08-02
WO2012103203A3 WO2012103203A3 (en) 2012-11-01

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US (1) US20120193801A1 (en)
JP (1) JP2014505309A (en)
CN (1) CN103339644A (en)
DE (1) DE102011009577A1 (en)
WO (1) WO2012103203A2 (en)

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JP2014505309A (en) 2014-02-27
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US20120193801A1 (en) 2012-08-02
CN103339644A (en) 2013-10-02

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