WO2012093840A3 - 열대류 열전도 복합 방식의 전자기기용 히트싱크 장치 - Google Patents

열대류 열전도 복합 방식의 전자기기용 히트싱크 장치 Download PDF

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Publication number
WO2012093840A3
WO2012093840A3 PCT/KR2012/000062 KR2012000062W WO2012093840A3 WO 2012093840 A3 WO2012093840 A3 WO 2012093840A3 KR 2012000062 W KR2012000062 W KR 2012000062W WO 2012093840 A3 WO2012093840 A3 WO 2012093840A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
electronic device
plate
dissipating
main board
Prior art date
Application number
PCT/KR2012/000062
Other languages
English (en)
French (fr)
Other versions
WO2012093840A2 (ko
Inventor
김철민
오웅
류태철
Original Assignee
가온미디어 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가온미디어 주식회사 filed Critical 가온미디어 주식회사
Publication of WO2012093840A2 publication Critical patent/WO2012093840A2/ko
Publication of WO2012093840A3 publication Critical patent/WO2012093840A3/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

본 발명은 제작이 간편하고 경제적으로 유리하며 전자기기 내부의 열을 효과적으로 방열할 수 있는 열대류 열전도 복합 방식의 전자기기용 히트싱크 장치에 관한 것이다. 본 발명은 상판(1a)과 하판(1b)으로 구성된 전자기기(1)의 하판(1b) 상면에 안착된 메인보드(2) 및 이 메인보드(2)의 상면에 안착된 CPU(3)로부터 발생되는 열을 전자기기(1)의 외부로 방열하는 히트싱크 장치에 관한 것으로, 메인보드(2)의 상면과 밀착되는 플레이트 형태의 베이스(11)와, 이 베이스(11)의 상면으로부터 연직상방으로 연장돌출되는 복수 개의 방열핀(12)으로 이루어진 방열판(10); 방열판(10)의 상단부와 일정거리 이격되게 전자기기(1)의 상판(1a) 하면에 부착됨으로써 메인보드(2)로부터 방열핀(12)을 따라 전도되어 연직상방으로 이동한 열을 대류에 의해 흡입한 후 자체 전도로 전자기기(1)의 외부로 방열하는 플레이트 형태의 열전도판(20);을 포함하여 구성된다.
PCT/KR2012/000062 2011-01-07 2012-01-04 열대류 열전도 복합 방식의 전자기기용 히트싱크 장치 WO2012093840A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0001609 2011-01-07
KR1020110001609A KR20120080271A (ko) 2011-01-07 2011-01-07 열대류 및 열전도 방식의 전자기기용 히트싱크 구조

Publications (2)

Publication Number Publication Date
WO2012093840A2 WO2012093840A2 (ko) 2012-07-12
WO2012093840A3 true WO2012093840A3 (ko) 2012-11-08

Family

ID=46457835

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/000062 WO2012093840A2 (ko) 2011-01-07 2012-01-04 열대류 열전도 복합 방식의 전자기기용 히트싱크 장치

Country Status (2)

Country Link
KR (1) KR20120080271A (ko)
WO (1) WO2012093840A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9933189B2 (en) * 2014-06-13 2018-04-03 Lockheed Martin Corporation Cooling a target using electrons
KR102566057B1 (ko) 2020-10-28 2023-08-09 송예환 와인을 가미한 동굴숙성 멸치액젓의 제조방법
CN112687438A (zh) * 2020-12-29 2021-04-20 麻城辅创科技有限公司 一种多通道受控高精度电阻箱

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020001492A (ko) * 2000-06-24 2002-01-09 이형도 히트싱크
JP2007088368A (ja) * 2005-09-26 2007-04-05 Fujikura Ltd 発熱部材の冷却構造
JP2009099753A (ja) * 2007-10-17 2009-05-07 Cosmo Tec:Kk ヒートシンク
KR20100067705A (ko) * 2008-12-12 2010-06-22 주식회사 모뉴엘 케이스 방열 구조를 갖는 컴퓨터

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020001492A (ko) * 2000-06-24 2002-01-09 이형도 히트싱크
JP2007088368A (ja) * 2005-09-26 2007-04-05 Fujikura Ltd 発熱部材の冷却構造
JP2009099753A (ja) * 2007-10-17 2009-05-07 Cosmo Tec:Kk ヒートシンク
KR20100067705A (ko) * 2008-12-12 2010-06-22 주식회사 모뉴엘 케이스 방열 구조를 갖는 컴퓨터

Also Published As

Publication number Publication date
KR20120080271A (ko) 2012-07-17
WO2012093840A2 (ko) 2012-07-12

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