WO2012084333A1 - Procédé de fabrication d'un ensemble capteur - Google Patents

Procédé de fabrication d'un ensemble capteur Download PDF

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Publication number
WO2012084333A1
WO2012084333A1 PCT/EP2011/069599 EP2011069599W WO2012084333A1 WO 2012084333 A1 WO2012084333 A1 WO 2012084333A1 EP 2011069599 W EP2011069599 W EP 2011069599W WO 2012084333 A1 WO2012084333 A1 WO 2012084333A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
region
conductor strand
mounting
encapsulation material
Prior art date
Application number
PCT/EP2011/069599
Other languages
German (de)
English (en)
Inventor
Christoph Schikora
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Publication of WO2012084333A1 publication Critical patent/WO2012084333A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors

Definitions

  • the present invention relates to a method for producing a sensor assembly according to the preamble of claim 1.
  • thermosets are generally used to encase the sensor components received at the pre-molded part, i.e. of the assembled mounting area, so that only the terminal contacts protrude from this.
  • Thermoplastics can not be used to cover the pre-molded part in this case, since the plastic does not bond to a subsequent extrusion coating with that of the pre-molded part. Otherwise, oil could penetrate the sensor assembly along the contact surfaces of the two materials and damage or render unusable the sensors mounted on the assembly area.
  • the encapsulation of the pre-molded part with thermosetting plastic resulting from the impermeability requirements is undesirable if it is necessary to form a carrier or connecting region of the sensor assembly, which filigree Structures required.
  • the sensor module by means of the connection area, the sensor module must allow contact with a mating connector, allow mounting on a sensor cluster or be attached to a mechatronic unit.
  • fastening methods in the form of screws, gluing, welding, etc. for example by means of flags or molded parts, which are to be sprayed onto the sensor module as a function of the respective application, are envisaged.
  • the use of thermoplastic is desirable.
  • a method for producing a particularly media-tight sensor module wherein the sensor module has a mounting area which accommodates the sensors of the sensor module, in particular a magnetic field sensor element and / or a magnet cooperating therewith, and a connection area which is provided for the application-specific connection of the sensor module, comprising the steps 1) providing a conductor strand, in particular one Lead frame; 2) encapsulating the conductor strand with a first encapsulation material, wherein a mounting region and a spatially spaced connection region are formed on the conductor strand; 3) installation of the sensors on the mounting area; 4) overmolding of the mounting area provided with the sensor system with a second encapsulation material.
  • the first encapsulation material is fed to the conductor strand exclusively in a first direction to form the mounting region and the connection region, the mounting region and the connection region being formed successively.
  • connecting webs are formed by means of the first overmoulding material, which connect the mounting area and the connecting area.
  • the connecting webs are removed before the fourth step, in particular before the third step.
  • a method is proposed, wherein in the second step the first encapsulation material in the first and a second direction is fed to the conductor strand to form the mounting region and the connection region, wherein the regions are formed, in particular, overlapping in time.
  • a method is also proposed, wherein a gap between the mounting region and the connection region is filled in by means of the second encapsulation material in the fourth step.
  • the assembly area in particular together with the sensors accommodated thereon, is encapsulated, in particular media-tight.
  • the first encapsulation material is a thermoplastic, in particular a polyamide material.
  • the second encapsulation material is a duroplastic material.
  • FIG. 2 shows by way of example a sensor module which can be obtained by the method according to the invention according to a possible embodiment of the invention.
  • the same elements or functions are provided with the same reference numerals.
  • the sensor module 2 according to the invention is intended in particular for use in a motor vehicle, in particular in a harsh operating environment such as e.g. a transmission oil sump.
  • the sensor module 2 is preferably formed so that oil or media density.
  • the sensor assembly 2 has a sensor 3, i. a sensor element 4 with the circuitry provided for its operation.
  • the sensor assembly 2 is e.g. for speed detection provided in a known per se, for which purpose it has a sensor 3 with a magnetic field sensor element 4 and a magnet 5 arranged adjacent thereto, Fig. 2, the magnetic field can be influenced by a sensor wheel.
  • the magnetic field change can be detected by the magnetic field sensor element 4, whereupon a signal can be output via a conductor strand 6, which is electrically conductively contacted to the magnetic field sensor element 4.
  • the sensor 3 is located on a side of the sensor assembly 2 intended for detection.
  • the conductor strand 6 according to the invention is a stamped grid, alternatively, e.g. a harness.
  • one end 6a of the conductor strand 6 is provided for contacting the sensor assembly 2 or for its connection and protrudes endwise out of the sensor assembly 2, i.e. in the form of connection contacts or pins.
  • the conductor strand 6 according to the invention consists of individual conductor elements, e.g. Flat conductors, which extend within the sensor assembly 2 substantially adjacent to each other.
  • the sensor module 2 according to the invention which is both media-tight and application-specific highly customized, in particular with filigree connection structures to a respective application environment, is provided to provide a conductor strand 6 as described above in a first step of the manufacturing method according to the invention, in particular in the form of a punched grid.
  • the conductor strand 6 serves in this case in particular e.g. also as support structure for subsequent process steps, is therefore preferably e.g. stiff.
  • the conductor strand 6 has a suitable shaping or is designed to be suitable for this purpose.
  • the conductor strand 6 has, in the first method step, e.g. Web elements (not shown) which connect the same conductor elements thereof for the purpose of stiffening the conductor strand 6, and which are intended to be broken in the course of the inventive method.
  • a mounting region 7 and a spatially spaced connection region 8 are formed on the same in a second step by encapsulation according to the invention, ie. the Voomrum mousseling 1, Fig. 1.
  • the regions 7 and 8 thus formed are in particular not connected to one another according to the invention.
  • the mounting region 7 corresponds to a first material region formed by means of the encapsulation material on the conductor strand 6, the connection region 8 to a second material region formed on the conductor strand 6 by means of the encapsulation material.
  • the mounting area 7 is provided according to the invention for receiving the sensor system 3 of the sensor module 2 to be formed, which is mounted on the mounting area 7 and in particular is electrically conductively contacted to the conductor line 6.
  • the mounting area 7 receives, for example, the sensor element 4, for example a Hall sensor element, as well as the magnet 5 interacting therewith.
  • the mounting region 7 formed in the second step is in this case formed with structures which allow the design of the sensor 3 in the intended manner, For example, with recordings for their components, target intervention points for breaking through the webs of the conductor strand 6, etc., ie in particular filigree structures.
  • connection area 8 which is furthermore formed in the course of the formation of the pre-molded part 1 in the second step, serves to mechanically and in particular electrically connect the sensor module 2 formed by means of the method according to the invention, the connection area 8 being connected to the respective sensor module application, i. the installation or application environment of the sensor assembly 2, is tuned.
  • the connection region 8 is insofar an interface region for the electrical and mechanical contacting of the sensor module 2.
  • filigree structures in the course of the formation of the connection region 8 is provided, which correspond to the application environment in an application-specific manner.
  • Such structures are e.g. Connector housing, crush ribs, locking elements, connecting lugs, stiffening elements, etc.
  • first coating material 9 in the form of a thermoplastic, in particular a polyamide material.
  • This first encapsulation material 9 advantageously enables the desired formation of both the mounting region 7 and the connection region 8, each with fine structures.
  • it is also provided to electrically contact the sensor system 3, for example the sensor element 4, with the conductor strand 6.
  • connecting pins of the sensor system 3 or of the sensor element 4 are welded to the conductor strand 6, in particular laser-welded.
  • predetermined breaking points of the webs between the conductor elements of the conductor strand 6 or stiffening elements can be opened.
  • a fourth step is provided, in which the mounting area 7 now provided with the sensor system 3 is encapsulated with a second encapsulation material 10, FIG. 2.
  • the encapsulation of the mounting area 7 is provided such that the sensor system 3 of the second encapsulation material 10 is surrounded, for example completely encapsulated, in particular media-tight.
  • the sensor system 3 can be permanently protected against aggressive media, in particular oil. It is conceivable, e.g. also not to completely encapsulate individual elements of the sensor 3, e.g. to at least partially save the sensor element 4 from an encapsulation.
  • the second encapsulation material 10 according to the invention is in particular a plastic, for.
  • a plastic for.
  • thermoset which allows media-tight encapsulation of the mounting area 7 and the sensor 3.
  • Duroplast unlike thermoplastic, e.g. a significantly better adhesion to metal surfaces, so that even at interfaces to the conductor strand 6 a media density can be achieved.
  • the second encapsulation material 10 is in particular connected to the attachment region 8 or its first encapsulation material 9, in particular as a material fit and furthermore in particular permanently.
  • the conductor strand 6, which extends between the mounting region 7 and the connection region 8 is encapsulated and thus encapsulated in a medium-tight and preferably electrically insulated manner.
  • a continuous housing 12 can be provided for the sensor arrangement 2, within the scope of which the connection area 8 is allowed to form and provide application-specific structures or interfaces, i. here, e.g. no encapsulation with a second encapsulation material 10.
  • the pre-molded part 1 or the mounting region 7 as well as the connection region 8 in the course of a single encapsulation process, also known as insert molding.
  • it is provided to supply the first encapsulation material 9 from only one direction, ie a first direction, to the conductor strand 6 or to introduce it into an injection mold, arrow A in FIG. 1.
  • the molds for forming each of the mounting 7 and the connection region 8 are fluidly connected to each other, for example by channels, such that the encapsulation 7 penetrates after flowing through the first mold via the channels in the second mold.
  • Webs 13 are hereby e.g. not formed. It should be noted here that in the latter described type of encapsulation of the mounting area 7 and the connection area 8 overlapping in time, in particular can be formed simultaneously, so that a streamlining of the process time is possible.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

Le procédé concerne la fabrication d'un ensemble capteur 2, en particulier étanche aux fluides, l'ensemble capteur (2) présentant une zone de montage (7), qui reçoit le capteur (3) de l'ensemble capteur (2), en particulier un élément capteur de champ magnétique (4) et/ou un aimant (5) coopérant avec celui-ci, et une zone de rattachement (8), qui est prévue pour le rattachement spécifique à l'application de l'ensemble capteur (2), présentant les étapes consistant à : 1) mettre à disposition une branche de conducteur (6), en particulier une grille d'estampage ; 2) enrober la branche de conducteur (6) avec un premier matériau d'enrobage (9), une zone de montage (7) et une zone de rattachement (8) disposée à distance de celle-ci étant formées sur la branche de conducteur (6) ; 3) monter le capteur (3) sur la zone de montage (7) ; 4) enrober la zone de montage (7) dotée du capteur (3) avec un second matériau d'enrobage (10).
PCT/EP2011/069599 2010-12-21 2011-11-08 Procédé de fabrication d'un ensemble capteur WO2012084333A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010063614.2 2010-12-21
DE102010063614.2A DE102010063614B4 (de) 2010-12-21 2010-12-21 Verfahren zur Herstellung einer Sensorbaugruppe

Publications (1)

Publication Number Publication Date
WO2012084333A1 true WO2012084333A1 (fr) 2012-06-28

Family

ID=44999751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/069599 WO2012084333A1 (fr) 2010-12-21 2011-11-08 Procédé de fabrication d'un ensemble capteur

Country Status (2)

Country Link
DE (1) DE102010063614B4 (fr)
WO (1) WO2012084333A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014180624A1 (fr) * 2013-05-08 2014-11-13 Robert Bosch Gmbh Procédé permettant de fabriquer une unité modulaire électronique et machine de moulage par injection
WO2020101706A1 (fr) * 2018-11-16 2020-05-22 Hewlett-Packard Development Company, L.P. Moulage en deux étapes pour une grille de connexion

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013226045A1 (de) * 2013-12-16 2015-06-18 Continental Teves Ag & Co. Ohg Mechanisch überbestimmt verbauter Drehzahlsensor mit elastischer Umspritzung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4436523A1 (de) * 1994-10-13 1996-04-18 Vdo Schindling Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung
EP0740365A2 (fr) * 1995-04-28 1996-10-30 TEMIC TELEFUNKEN microelectronic GmbH Module de commande pour automobile
DE102007050988A1 (de) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Sensor, insbesondere zur Drehzahlerfassung, und Verfahren zur Herstellung desselben
DE102008018199A1 (de) 2008-04-10 2009-10-15 Continental Teves Ag & Co. Ohg Elektrische Baugruppe mit einem Stanzgitter, elektrischen Bauelementen und einer Füllmasse

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10111657A1 (de) 2001-03-09 2003-01-02 Heraeus Electro Nite Int Verfahren zur Herstellung eines Gehäuses für Sensorelemente, sowie Sensor, insbesondere Temperatur-Sensor
DE102005027767A1 (de) * 2005-06-15 2006-12-28 Infineon Technologies Ag Integriertes magnetisches Sensorbauteil
US7375406B2 (en) 2005-12-20 2008-05-20 Honeywell International Inc. Thermoplastic overmolding for small package turbocharger speed sensor
DE102008064047A1 (de) * 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Sensorelement und Trägerelement zur Herstellung eines Sensors
DE102009000428A1 (de) * 2009-01-27 2010-07-29 Robert Bosch Gmbh Verfahren zur Herstellung eines Sensors
DE102010039329A1 (de) 2010-08-13 2012-02-16 Robert Bosch Gmbh Umspritzverfahren für eine Sensorvorrichtung und Sensorvorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4436523A1 (de) * 1994-10-13 1996-04-18 Vdo Schindling Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung
EP0740365A2 (fr) * 1995-04-28 1996-10-30 TEMIC TELEFUNKEN microelectronic GmbH Module de commande pour automobile
DE102007050988A1 (de) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Sensor, insbesondere zur Drehzahlerfassung, und Verfahren zur Herstellung desselben
DE102008018199A1 (de) 2008-04-10 2009-10-15 Continental Teves Ag & Co. Ohg Elektrische Baugruppe mit einem Stanzgitter, elektrischen Bauelementen und einer Füllmasse

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014180624A1 (fr) * 2013-05-08 2014-11-13 Robert Bosch Gmbh Procédé permettant de fabriquer une unité modulaire électronique et machine de moulage par injection
WO2020101706A1 (fr) * 2018-11-16 2020-05-22 Hewlett-Packard Development Company, L.P. Moulage en deux étapes pour une grille de connexion
US11227807B2 (en) 2018-11-16 2022-01-18 Hewlett-Packard Development Company, L.P. Two-step molding for a lead frame

Also Published As

Publication number Publication date
DE102010063614B4 (de) 2024-05-08
DE102010063614A1 (de) 2012-06-21

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