WO2012083542A1

WO2012083542A1 - Device for repairing alignment layer and method for repairing alignment layer

Info

Publication number: WO2012083542A1
Application number: PCT/CN2010/080173
Authority: WO
Inventors: 施翔尹; 贺成明
Original assignee: 深圳市华星光电技术有限公司
Priority date: 2010-12-23
Filing date: 2010-12-23
Publication date: 2012-06-28

Abstract

A device for repairing alignment layer and a method for repairing alignment layer are provided. The device for repairing alignment layer comprises a detection device (100) and a plasma device (200). The detection device detects the edge areas of the alignment layer to define at least one defect area, and the plasma device generates plasma at the at least one defect area of the alignment layer so that the at least one defect area is removed. The method for repairing alignment layer includes detecting the edge areas of the alignment layer to define at least one defect area by the detection device, and generating plasma at the at least one defect area of the alignment layer by the plasma device so that the at least one defect area is removed. The present device and method can remove alignment layer locally and efficiently.

Description

Orientation film repairing device and repairing method thereof

Technical field

The present invention relates to an alignment film repairing device and a repairing method thereof, and more particularly to an alignment film repairing device suitable for a liquid crystal display panel and a repairing method thereof.

Background technique

The alignment film is used for aligning the liquid crystal molecules in the alignment direction, so that the liquid crystal molecules in the liquid crystal display panel have a uniform directivity or an alignment. When the electric field drives the liquid crystal molecules to operate, all or part of the liquid crystal molecules need to have synchronized and consistent actions, so that the display action can be fast and consistent.

A new generation of alignment film coating technology uses inkjet (Inkjet) printing to cover polyimide film (PI) liquid on a thin film transistor substrate or a color filter substrate, and diffuse to achieve film formation. . The biggest process problem with this filming technique comes from the poor state of PI when it is diffused at the edge. At the edge of the PI liquid will flow to the place where there is no coating, so that the PI droplets are not linear after fusion, and it is easy to appear wavy (Edge Wave). The existing improved Edge Wave method is based on the size of the droplets. DPI (dots per inch) as a measure, DPI (dots per The higher the inch, the higher the linearity achieved. Specifically, a smaller PI droplet is used and a higher DPI is achieved in a denser arrangement. Actually, it still needs to be different depending on the condition of the edge droplet diffusion. The influencing factors include droplet discharge size, substrate surface condition and environment. Temperature and humidity, etc., it is difficult to effectively control.

In addition, due to the different drying speed of the edge, an uneven film thickness is formed at the edge, which is called Halo area or Edge. Area. If this Halo area is located in the display area (Active Area), there will be a noticeable whiteness at the edge of the picture at 25% gray level, so it is judged as the scrap level. Since the above phenomenon is closely related to the viscosity of the PI material, the higher the viscosity, the more the Halo can be suppressed. However, on the contrary, it is easy to cause the discharge of the ink jet head and the disadvantage of uneven diffusion of the PI droplets.

After the above phenomenon is baked and heated, it is inspected in the alignment film inspection device. When the inspection device determines that the required specifications are not met, the substrates are discharged and a comprehensive film peeling step is performed. In the film peeling step, the thin film transistor substrate or the color filter substrate containing the alignment film is sent to an alignment film stripping device, and the alignment film is washed away with a stripping solution. Finally, an inkjet printing method is repeated to recoat an alignment film on the substrate.

However, in the aforementioned method, the manner in which the alignment film is first removed and then recoated once is quite time consuming, and causes more material and energy loss or waste, resulting in an increase in cost.

technical problem

SUMMARY OF THE INVENTION It is an object of the present invention to provide an alignment film repairing apparatus which solves the above problems by partially removing a peripheral region of an alignment film by a detecting device in cooperation with a plasma device.

Another object of the present invention is to provide an alignment film repairing method which utilizes the alignment film repairing apparatus of the present invention to perform partial repair of an alignment film and to improve an existing repairing process.

Technical solution

In order to achieve the above object, the present invention adopts the following technical solutions. That is, the alignment film repairing device of the present invention comprises a detecting device and a plasma device. The detecting device is configured to detect an edge region of an alignment film to define at least one defect region. The plasma device is configured to generate a plasma reaction to the at least one defect region of the alignment film to remove the at least one defect region. Specifically, the plasma device includes a reactive gas supply device and a plasma showerhead. The reactive gas supply device is configured to supply a reactive gas, and the plasma showerhead is configured to eject the reactive gas on the at least one defect region of the alignment film.

Further, the plasma showerhead includes a plasma ejection port and a frame. The plasma ejection port is used to eject the reaction gas. The frame is for defining the plasma ejection port and limiting a discharge range of the reaction gas. Further, the discharge range of the reaction gas is set corresponding to the size of the defect region. Further, the size of the ejection range may be set according to a distance between the plasma shower head and the alignment film. Preferably, the ejection range is a rectangle, and the ejection range has a size ranging from 0.1 square millimeter to 100 square millimeters.

In a preferred embodiment, the plasma device includes an endpoint detection device for stopping the plasma reaction.

In a preferred embodiment, the plasma device is disposed on the detection device.

In order to achieve the above other object, the present invention further provides an alignment film repairing method. The alignment film repair method is used to repair an edge region of an alignment film. The method comprises the following steps:

(A) detecting an edge region of the alignment film by a detecting device to determine whether there is a defect, if any, defining at least one defect region; and (B) using the plasma device to the at least one of the alignment films A defect region generates a plasma reaction to remove the at least one defect region.

In another preferred embodiment of the present invention, after the step (B), the method further comprises the step (C) of determining whether the repaired alignment film is acceptable, and if so, performing post-baking to the alignment film. Curing, if not, washing the alignment film with a stripping solution.

Beneficial effect

According to the alignment film repairing device and the repairing method thereof, the detecting device cooperates with the plasma device to partially remove at least one defect region of the alignment film, and solves the problem that the existing alignment film process can only wash the entire alignment film through the stripping liquid. , the problem of partial patching is not possible. In addition, the plasma device may be installed on the detecting device, and the at least one defect region may be removed by using the plasma device during the detecting process, thereby improving the existing repairing process.

DRAWINGS

1 is a schematic view showing the repair of an alignment film repairing device according to a preferred embodiment of the present invention.

Figure 2 is a schematic plan view of the alignment film repair of Figure 1.

3 is a schematic cross-sectional view of the plasma showerhead of FIG. 2 taken along line AB.

4 is a flow chart of a method for repairing an alignment film according to a preferred embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The present specification provides various embodiments to illustrate the technical features of various embodiments of the present invention. The configuration of the components in the embodiments is for the purpose of clearly illustrating the disclosure and is not intended to limit the invention. The portions of the drawings in the different embodiments are repeated for the purpose of simplifying the description and are not intended to relate to the different embodiments.

Please refer to FIG. 1. FIG. 1 is a schematic view showing the repair of an alignment film repairing device according to a preferred embodiment of the present invention. The alignment film repairing apparatus of the preferred embodiment includes a detecting device 100 and a plasma device 200. The solution of the alignment film 300 is printed by inkjet (Inkjet) to cover the droplets on a thin film transistor substrate or a color filter substrate, and is diffused to achieve a film formation effect. The solution of the alignment film 300 is preferably polyimide (PI). In the preferred embodiment, the alignment film 300 is covered on a thin film transistor substrate 400. The thin film transistor substrate 400 includes a glass substrate 420 and a thin film transistor layer 440.

1 and 2, FIG. 2 is a schematic plan view of the alignment film repair of FIG. 1. The alignment film repairing device of the present invention is used to repair an edge region of an alignment film 300, such as Edge. Wave (shown in Figure 2), Halo area (shown in Figure 1), or both.

The detecting device 100 is preferably an inspection machine, and includes an image sensor 120 and a pair of bit devices 140. The image sensor 120 is mounted on the alignment device 140 for detecting defects of the alignment film. In the present embodiment, the detecting device 100 is configured to detect an edge region of the alignment film 300 to define at least one defect region 320 (as shown in FIG. 2). The image sensor is preferably a CCD image sensor or a CMOS image sensor. The alignment device 140 is preferably a cross-alignment machine for moving the image sensor 120 to a desired position for detection.

The plasma device 200 is configured to generate a plasma reaction to the at least one defect region 320 of the alignment film 300 to remove the at least one defect region 320. Specifically, the plasma device 200 includes a reactive gas supply device (not shown) and a plasma showerhead 250. The reaction gas supply device is for providing a reaction gas including O2, SF6, N2, He, and the like. The plasma showerhead 250 is configured to eject the reactive gas on the at least one defect region 320 of the alignment film 300 (shown as the ejection range 322 of FIG. 2) to the at least one The defect region 320 is plasma etched/ashed. The plasma device 200 is preferably disposed on the detecting device 100 and is repaired immediately after inspection. Accordingly, the plasma showerhead 250 can also cooperate with the movement of the alignment device 140 to remove the at least one defect region 320 at the edge of the alignment film 300. However, the present invention does not limit the plasma device 200 to be disposed on the detecting device 100, and may be separately provided.

Additionally, the plasma device 200 also has a radio frequency power (RF) that is well known to those skilled in the art. The Power system (not shown) functions to decompose the PI material of the alignment film 300 by controlling the RF power and the type of the reaction gas. The PI polymer segment is interrupted by a plasma to form some volatile by-products, and the alignment film 300 located in the ejection range 322 is removed by the above mechanism.

Please refer to FIG. 2 and FIG. 3. FIG. 3 is a schematic cross-sectional view of the plasma showerhead of FIG. 2 along the line AB. The plasma showerhead 250 includes a plasma ejection port 252 and a frame 254. The plasma ejection port 252 is for discharging the reaction gas. The frame 254 is used to define the plasma ejection port and to limit the ejection range 322 of the reactive gas. In short, the geometry of the plasma ejection port 252 is the same as the geometry of the ejection range 322 of the reactive gas. For example, the plasma ejection port 252 is rectangular, and the reaction gas ejection range 322 is also rectangular. However, the present invention is not limited to the rectangular discharge port 252 of the frame 254 being rectangular, and may be any geometric shape for the purpose of facilitating the removal of the edge defect region 320.

The discharge range 322 of the reaction gas is set corresponding to the size of the defect region 320. Further, the size of the ejection range 322 can be set according to the distance between the plasma shower head 250 and the alignment film 300. The shorter the distance, the smaller the size of the ejection range 322, and the longer the distance, the larger the size of the ejection range 322. The size of the ejection range 322 is preferably between 0.1 square millimeters and 100 square millimeters, so that the defective region 320 partially localized to the alignment film 300 can be repaired without peeling off the entire alignment film 300.

In another embodiment, the plasma device 200 further includes an end point detection device (End Point Detector, EPD) (not shown) for automatically detecting the concentration of the volatile by-product to stop the plasma reaction. Taking the thin film transistor substrate 400 as an example, after the plasma etching/ashing action removes the PI material of the alignment film 300, the ITO layer (not shown) on the surface of the thin film transistor layer 440 is exposed and located in the contact hole. (Contact Protective layer of hole (not shown). Therefore, volatile by-products different from PI are produced. When the endpoint detecting device detects a change in the concentration of volatile byproducts different from PI, the reaction of the plasma is stopped to protect the thin film transistor layer 440. Similarly, the end point detecting device can also be used to protect the ITO layer, the color filter film (CF), the black matrix (BM), and the like on the color filter substrate.

The alignment film repairing method using the preferred embodiment of the present invention will be described in detail below. In the preferred embodiment, the repair method is carried out using the alignment film repairing apparatus of the preferred embodiment described above. Please refer to FIG. 1 , FIG. 2 and FIG. 4 together. FIG. 4 is a flow chart of a method for repairing an alignment film according to a preferred embodiment of the present invention. The method begins in step S10.

In step S10, an edge region of the alignment film 300 is detected by a detecting device 100 to determine whether there is a defect, and if so, step S20 is performed, and if not, the next predetermined production program, step S50, is executed. It should be noted that this step is performed after the prebake procedure after inkjet coating.

In step S20, the detecting device 100 defines at least one defective area (as shown in FIG. 2), and then performs step S30.

In step S30, a plasma reaction is performed on the at least one defect region 320 of the alignment film 300 by using a plasma device 200 to remove the at least one defect region 320, and then step S40 is performed. The details can be referred to the foregoing, and will not be described herein.

In step S40, it is judged whether or not the repaired alignment film 300 is acceptable. If yes, a predetermined production process is performed, that is, step S50, and if no, step S60 is performed.

In step S50, post-baking is performed to cure the alignment film 300.

In step S60, the alignment film 300 is washed away with a stripping solution, that is, a film peeling process is performed to facilitate recoating.

According to the alignment film repairing device and the repairing method thereof, the detecting device 100 cooperates with the plasma device 200 to partially remove at least one defect region of the alignment film 300, thereby solving the problem that the existing alignment film process can only be washed by the stripping liquid. The entire alignment film cannot be partially repaired. In addition, the plasma device 200 can also be disposed on the detecting device 100, and the at least one defect region 320 can be removed by the plasma device 200 during the detecting process, and the existing alignment film capable of being defective only is improved. Do the entire stripping process, which reduces costs and time.

While the invention has been described above in terms of the preferred embodiments of the present invention, it is intended to be The scope of protection of the present invention is defined by the scope of the appended claims.

Embodiments of the invention

Industrial applicability

Sequence table free content

Claims

An alignment film repairing device, comprising:

a detecting device for detecting an edge region of an alignment film to define at least one defect region, wherein the detecting device comprises an image sensor for detecting the alignment film; and a pair of bit devices for moving the device Image sensor; and

a plasma device for generating a plasma reaction on the at least one defect region of the alignment film to remove the at least one defect region.
The alignment film repairing apparatus according to claim 1, wherein said plasma device comprises:

a reaction gas supply device for supplying a reactive gas;

a plasma showerhead for ejecting the reactive gas on the at least one defect region of the alignment film.
The alignment film repairing apparatus according to claim 2, wherein the plasma shower head comprises:

a plasma ejection outlet for ejecting the reactive gas;

a frame for restricting a discharge range of the reaction gas by the plasma discharge port.
The alignment film repairing apparatus according to claim 3, wherein a discharge range of the reaction gas is set corresponding to a size of the at least one defective region.
The alignment film repairing apparatus according to claim 3, wherein the size of the discharge range is set according to a distance between the plasma shower head and the alignment film.
The alignment film repairing apparatus according to claim 3, wherein the discharge range has a size of between 0.1 mm 2 and 100 mm 2 .
The alignment film repairing apparatus according to claim 2, wherein the plasma device comprises an end point detecting means for automatically detecting the concentration of a volatile by-product to stop the plasma reaction.
The alignment film repairing apparatus according to claim 1, wherein said plasma device is disposed on said detecting means.
An alignment film repairing device, comprising:

a detecting device for detecting an edge region of an alignment film to define at least one defect region;

a plasma device for generating a plasma reaction on the at least one defect region of the alignment film to remove the at least one defect region.
The alignment film repairing apparatus according to claim 9, wherein said plasma device comprises:

a reaction gas supply device for supplying a reactive gas;

a plasma showerhead for ejecting the reactive gas on the at least one defect region of the alignment film.
The alignment film repairing apparatus according to claim 10, wherein the plasma shower head comprises:

a plasma ejection outlet for ejecting the reactive gas;

a frame for restricting a discharge range of the reaction gas by the plasma discharge port.
The alignment film repairing apparatus according to claim 11, wherein a discharge range of the reaction gas is set corresponding to a size of the at least one defective region.
The alignment film repairing apparatus according to claim 11, wherein the size of the discharge range is set according to a distance between the plasma shower head and the alignment film.
The alignment film repairing apparatus according to claim 11, wherein the discharge range has a size of between 0.1 mm 2 and 100 mm 2 .
The alignment film repairing apparatus according to claim 10, wherein said plasma means comprises an end point detecting means for automatically detecting the concentration of a volatile by-product to stop the plasma reaction.
The alignment film repairing apparatus according to claim 9, wherein said plasma device is disposed on said detecting means.
An alignment film repairing method for repairing an edge region of an alignment film, comprising the steps of:

(A) Detecting an edge region of the alignment film by using a detecting device to determine whether there is a defect, and if so, defining at least one defect region;

(B) generating a plasma reaction on the at least one defect region of the alignment film by using a plasma device to remove the at least one defect region.
The alignment film repairing method according to claim 17, wherein after the step (B), the method further comprises the steps of:

(C) determining whether the repaired alignment film is acceptable, and if so, performing post-baking to cure the alignment film, and if not, washing the alignment film with a stripping solution.