WO2012081219A1

WO2012081219A1 - Plasma display panel and method for manufacturing same

Info

Publication number: WO2012081219A1
Application number: PCT/JP2011/006916
Authority: WO
Inventors: 豊田　誠司; 博之安喰; 泰彦中田; 土居　由佳子
Original assignee: パナソニック株式会社
Priority date: 2010-12-16
Filing date: 2011-12-12
Publication date: 2012-06-21

Abstract

A plasma display panel is provided with a front surface plate and a back surface plate provided on the opposite side to the front surface plate. The front surface plate has display electrodes and a dielectric layer that covers the display electrodes. The dielectric layer includes a plurality of microparticles the main component of which is an inorganic oxide. At least some of the microparticles of the plurality of microparticles are at least one species selected from the group of B, Al, Mg, Ca, Sr, Ba, and Zn and are multi-component microparticles containing components that differ from the inorganic components constituting the inorganic oxide.

Description

Plasma display panel and manufacturing method thereof

The technology disclosed herein relates to a plasma display panel used for a display device or the like and a manufacturing method thereof.

Silver electrodes for ensuring conductivity are used for bus electrodes constituting display electrodes of a plasma display panel (hereinafter referred to as PDP). For the dielectric layer covering the bus electrode, low melting point glass mainly composed of lead oxide is used. In recent years, a dielectric layer not containing a lead component has been used in consideration of the environment (for example, see Patent Document 1).

In order to reduce the power consumption of the PDP, it is required to reduce the capacitance of the dielectric layer and reduce the reactive power. That is, it is required to reduce the dielectric constant of the dielectric layer. A proposal has been made to form a dielectric layer having a relative dielectric constant ε = 6 to 7 using zinc borate glass containing an alkali metal oxide instead of lead oxide or bismuth oxide (see, for example, Patent Document 1). ). In addition, a proposal has been made to form a dielectric layer of a front panel using a silicon resin having a siloxane bond with a relative dielectric constant ε = 2.8 to 3.0 (see, for example, Patent Document 2).

JP 09-278482 A International Publication No. 01/071761

The PDP according to the first disclosure includes a front plate and a back plate provided to face the front plate. The front plate has a display electrode and a dielectric layer covering the display electrode. The dielectric layer includes a plurality of fine particles mainly composed of an inorganic oxide. At least some of the plurality of fine particles are at least one selected from the group consisting of B, Al, Mg, Ca, Sr, Ba and Zn, and are different from the inorganic component constituting the inorganic oxide. Multi-component fine particles containing components.

A method of manufacturing a PDP according to the first disclosure includes forming a dielectric paste layer by applying a dielectric paste to a substrate, and then forming the dielectric layer by firing the dielectric paste layer. Providing. The dielectric paste includes a plurality of fine particles mainly composed of an inorganic oxide. At least some of the plurality of fine particles are at least one selected from the group consisting of B, Al, Mg, Ca, Sr, Ba and Zn, and are different from the inorganic component constituting the inorganic oxide. Multi-component fine particles containing components.

The PDP according to the second disclosure includes a front plate and a back plate provided to face the front plate. The front plate has a display electrode and a dielectric layer covering the display electrode. The dielectric layer includes a plurality of fine particles mainly composed of an inorganic oxide. At least some of the plurality of fine particles are at least one selected from the group consisting of B, Al, Mg, Ca, Sr, Ba and Zn, and are different from the inorganic component constituting the inorganic oxide. Multi-component coated fine particles coated with a film containing components.

A method of manufacturing a PDP according to the second disclosure is to form a dielectric paste layer by applying a dielectric paste to a substrate, and then form the dielectric layer by firing the dielectric paste layer. Providing. The dielectric paste includes a plurality of fine particles mainly composed of an inorganic oxide. At least some of the plurality of fine particles are at least one selected from the group consisting of B, Al, Mg, Ca, Sr, Ba and Zn, and are different from the inorganic component constituting the inorganic oxide. Multi-component coated fine particles coated with a film containing components.

FIG. 1 is a perspective view illustrating a schematic structure of a PDP according to an embodiment. FIG. 2 is a cross-sectional view illustrating the structure of the front plate according to the embodiment. FIG. 3 is a diagram illustrating a dielectric layer according to the first example. FIG. 4 is a diagram illustrating a dielectric layer according to the second embodiment.

[1. Configuration of PDP1]
The PDP 1 of the present embodiment is an AC surface discharge type PDP. As shown in FIG. 1, in the PDP 1, a front plate 2 made of a front glass substrate 3 and the like and a back plate 10 made of a back glass substrate 11 and the like are arranged to face each other. The outer peripheral portions of the front plate 2 and the back plate 10 are hermetically sealed with a sealing material made of glass frit or the like. The discharge space 16 inside the sealed PDP 1 is filled with a discharge gas such as Ne and Xe at a pressure of 55 kPa to 80 kPa.

On the front glass substrate 3, a pair of strip-shaped display electrodes 6 composed of scanning electrodes 4 and sustaining electrodes 5 and black stripes (light shielding layers) 7 are arranged in a plurality of rows in parallel with each other. A dielectric layer 8 serving as a capacitor is provided on the front glass substrate 3 so as to cover the display electrode 6 and the light shielding layer 7. Further, a protective layer 9 made of magnesium oxide (MgO) or the like is provided on the surface of the dielectric layer 8.

Further, on the rear glass substrate 11, a plurality of strip-like address electrodes 12 are arranged in parallel to each other in a direction orthogonal to the display electrodes 6 of the front plate 2. Further, a base dielectric layer 13 is provided so as to cover the address electrodes 12. Further, a partition wall 14 having a predetermined height is provided on the base dielectric layer 13 formed between the address electrodes 12 to divide the discharge space 16. Between the partition walls 14, a phosphor layer 15 that emits red light by ultraviolet rays, a phosphor layer 15 that emits blue light, and a phosphor layer 15 that emits green light are sequentially provided.

A discharge cell is provided at a position where the display electrode 6 and the address electrode 12 intersect. The pixel for color display includes a discharge cell having a phosphor layer 15 that emits red light, a discharge cell having a phosphor layer 15 that emits blue light, and a discharge cell having a phosphor layer 15 that emits green light. .

[2. Manufacturing method of PDP1]
[2-1. Manufacturing method of front plate 2]
FIG. 2 is referred to for the front plate 2. First, the scan electrode 4, the sustain electrode 5, and the light shielding layer 7 are formed on the front glass substrate 3. The display electrode 6 has a scan electrode 4 and a sustain electrode 5. Scan electrode 4 and sustain electrode 5 have

white electrodes

4b and 5b containing silver (Ag) for ensuring conductivity. Scan electrode 4 and sustain electrode 5 have

black electrodes

4a and 5a containing a black pigment in order to improve the contrast of the image display surface. The white electrode 4b is laminated on the black electrode 4a. The white electrode 5b is laminated on the black electrode 5a.

Specifically, a black paste layer (not shown) is formed by applying a black paste containing a black pigment to the front glass substrate 3 by a screen printing method or the like. Next, a black paste layer (not shown) is patterned by photolithography. Next, a white paste containing silver (Ag) is applied onto a black paste layer (not shown) by screen printing or the like, thereby forming a white paste layer (not shown). Next, a white paste layer (not shown) and a black paste layer (not shown) are patterned by photolithography. Thereafter, a black paste layer (not shown) and a white paste layer (not shown) are baked through a development step, whereby the

white electrodes

4b and 5b, the

black electrodes

4a and 5a, which are the display electrodes 6, and the light shielding. Layer 7 is formed.

Next, a dielectric layer 8 that covers the scan electrode 4, the sustain electrode 5, and the light shielding layer 7 is formed. The dielectric layer 8 will be described in detail later.

Next, a protective layer 9 made of magnesium oxide (MgO) or the like is formed on the dielectric layer 8 by a vacuum deposition method or the like.

The front plate 2 having the scanning electrode 4, the sustaining electrode 5, the light shielding layer 7, the dielectric layer 8, and the protective layer 9 on the front glass substrate 3 is completed through the above steps.

The front plate 2 may not have the light shielding layer 7.

[2-2. Manufacturing method of back plate 10]
For the back plate 10, reference is made to FIG. First, the address electrode 12 is formed on the rear glass substrate 11. Specifically, an address electrode paste layer (not shown) is formed by applying a paste containing silver (Ag) onto the rear glass substrate 11 by screen printing. Next, an address electrode paste layer (not shown) is patterned by a photolithography method to form a material layer (not shown) to be a component for the address electrode 12. Thereafter, the address layer 12 is formed by firing a material layer (not shown) at a predetermined temperature. Here, in addition to the method of screen printing the paste, a method of forming a metal film on the rear glass substrate 11 by a sputtering method, a vapor deposition method or the like is employed.

Next, a base dielectric paste layer (not shown) is formed by applying a base dielectric paste on the back glass substrate 11 on which the address electrodes 12 have been formed so as to cover the address electrodes 12 by a die coating method or the like. Is done. Thereafter, the base dielectric paste layer (not shown) is fired to form the base dielectric layer 13. The base dielectric paste is a paint containing a base dielectric material such as glass powder, a binder, and a solvent.

Next, a partition wall paste (not shown) is formed by applying a partition wall forming paste including a partition wall material on the base dielectric layer 13. A partition wall paste layer (not shown) is patterned by photolithography to form a structure (not shown) that becomes a material layer of the partition wall 14. Next, the partition 14 is formed by baking a structure (not shown). Here, as a method of patterning the barrier rib paste layer applied on the base dielectric layer 13, a sandblast method or the like is adopted in addition to the photolithography method.

Next, a phosphor paste containing a phosphor material is applied on the underlying dielectric layer 13 between the adjacent barrier ribs 14 and on the side surfaces of the barrier ribs 14. Next, the phosphor layer 15 is formed by firing the phosphor paste.

Through the above steps, the back plate 10 having the address electrodes 12, the base dielectric layer 13, the partition walls 14 and the phosphor layer 15 on the back glass substrate 11 is completed.

[2-3. Assembly method of front plate 2 and rear plate 10]
First, the front plate 2 and the back plate 10 are arranged to face each other so that the display electrodes 6 and the address electrodes 12 are orthogonal to each other. Next, the periphery of the front plate 2 and the back plate 10 is sealed with glass frit. Next, a discharge gas containing Ne, Xe or the like is sealed in the discharge space 16 to complete the PDP 1.

[3. Details of Dielectric Layer 8]
To reduce the dielectric constant of the dielectric layer 8, nanometer-sized fine particles made of silicon dioxide (hereinafter, referred to as SiO ₂ fine particles) is a technique for forming a dielectric layer 8 using. Specifically, a dielectric paste in which a plurality of SiO ₂ fine particles are dispersed is used. The dielectric paste is applied on the substrate. The applied dielectric paste is appropriately heat treated.

However, in the dielectric layer 8 composed of such SiO ₂ fine particles, the bonding force between the SiO ₂ fine particles may be reduced. That is, there is a problem that the mechanical strength of the dielectric layer 8 is lowered and cracks are generated in the dielectric layer 8.

The dielectric layer 8 is required to have a low relative dielectric constant, a high withstand voltage, and a high light transmittance. These characteristics greatly depend on the structure of the dielectric layer 8. Furthermore, cracks are likely to occur on the surface of the dielectric layer 8 due to the difference in thermal expansion coefficient between the dielectric layer 8 and the glass substrate due to dense SiO ₂ fine particles. Further, when heat treatment is performed using SiO ₂ fine particles at the firing temperature in the conventional manufacturing process, the bonding force between the SiO ₂ fine particles may be reduced. That is, many gaps are formed in the dielectric layer 8. Therefore, dielectric breakdown is likely to occur in the dielectric layer 8 when a voltage is applied to display an image of the PDP.

[3-1. Example 1]
As shown in FIG. 3, the dielectric layer 8 according to the example 1 is composed of multi-component fine particles 20 and inorganic fine particles 21 made of a single component such as SiO ₂ fine particles. The dielectric layer 8 has a gap 23. Here, the dielectric layer 8 may include only the multi-component fine particles 20 without including the inorganic fine particles 21. In the prior art, the dielectric layer is composed only of inorganic fine particles 21 made of a single component such as SiO ₂ fine particles.

The multicomponent fine particles 20 are multicomponent fine particles mainly composed of an inorganic oxide. As an example, the multi-component fine particles 20 are selected from the group consisting of silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), zinc oxide (ZnO), and gallium oxide (Ga ₂ O ₃ ). And at least one selected from the group consisting of boron (B), aluminum (Al), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba) and zinc (Zn) A multi-component alkoxide solution is prepared and produced by the addition of an alkaline catalyst.

The dielectric layer 8 according to the example 1 is not composed of only the inorganic fine particles 21 made of a single component such as SiO ₂ fine particles. The dielectric layer 8 according to the example 1 includes multi-component fine particles 20. Therefore, in the manufacturing process of the PDP 1, the surfaces of the multicomponent fine particles 20 are fused to the adjacent multicomponent fine particles 20. Further, the surface of the multi-component fine particle 20 is fused with the adjacent inorganic fine particle 21. Therefore, the dielectric layer 8 having higher mechanical strength and higher withstand voltage can be obtained.

The average particle size of the multi-component fine particles 20 and the inorganic fine particles 21 (hereinafter collectively referred to as dielectric glass fine particles) is preferably 10 nm or more and 150 nm or less. This is based on the following reason.

The air gap 23 in the dielectric layer 8 is an important factor that determines the relative permittivity and light transmittance. On the other hand, the size of the gap 23 is determined by the particle size of the dielectric glass fine particles constituting the dielectric layer 8.

In the present embodiment, the size of the gap 23 is preferably 100 nm or less, which corresponds to about a quarter of the shortest wavelength of visible light. This is because by suppressing the light scattering in the gap 23, a visible light transmittance of 75% or more can be obtained in the dielectric layer 8. The size of the gap 23 is more preferably 50 nm or less. Further, light scattering is suppressed.

As a result of investigations by the inventors, it has been found that the average particle size of the dielectric glass particles is preferably about 1.5 times the size of the gap 23. That is, the average particle size of the dielectric glass fine particles is preferably 150 nm or less. When the size of the void 23 is 50 nm or less, the average particle size of the dielectric glass fine particles is preferably 75 nm or less.

If the size of the gap 23 is too small, it is difficult to keep the relative dielectric constant of the dielectric layer 8 low. This is because the density of the dielectric layer 8 is increased. Therefore, in the present embodiment, in order to set the relative dielectric constant ε of the dielectric layer 8 to 2 or more and 4 or less, the average particle size of the dielectric glass particles is preferably 10 nm or more.

In the present embodiment, the average particle diameter is the volume cumulative average diameter (D50). In addition, a laser diffraction particle size distribution measuring device MT-3300 (manufactured by Nikkiso Co., Ltd.) was used for measuring the average particle size.

Further, the size of the void 23 was measured by observing the cross section of the dielectric layer 8 with a scanning electron microscope. In the cross section of the dielectric layer 8, if the gap 23 is substantially circular, the diameter is the size of the gap 23. If the gap 23 is not circular, a circle inscribed in the gap 23 is assumed, and the diameter of the inscribed circle is the size of the gap 23.

Conventionally, the dielectric glass used to form the dielectric layer 8 contained 20% by weight or more of lead oxide in order to enable firing at about 450 ° C. to 600 ° C. However, in Example 1, the dielectric glass particles do not contain lead oxide for environmental consideration. That is, the dielectric layer 8 according to Example 1 does not contain lead oxide.

[3-1-1. Production of dielectric paste]
The dielectric paste according to Example 1 is composed of a dielectric glass slurry in which multicomponent fine particles 20 and inorganic fine particles 21 are dispersed and a vehicle.

[3-1-2. Multicomponent fine particles 20 and inorganic fine particles 21]
As an example, the multi-component fine particle 20 includes one inorganic oxide selected from the group of SiO ₂ , Al ₂ O ₃ , ZnO, and Ga ₂ O ₃ , and B, Al, Mg, Ca, Sr, Ba, and Zn. A multi-component alkoxide solution containing at least one selected from the group is prepared and produced by adding an alkaline catalyst.

It is desirable that the concentration of the component in the multi-component alkoxide solution as an additive is 10 mol% or more and 20 mol% or less. In order for the surfaces of the dielectric glass particles to be fused to each other at a dielectric firing temperature of 600 ° C. or less, the additive is preferably 10 mol% or more. On the other hand, it is preferably 20 mol% or less in order to suppress the deterioration of the dielectric glass fine particles due to the aggregation of the dielectric glass fine particles or the decrease in water resistance in the dielectric paste or before the dielectric baking step. And the element of the component used as an additive needs to be a component different from said inorganic oxide. Further, the mixing ratio of the inorganic oxide and the multi-component alkoxide solution is appropriately blended so as to have the above-mentioned concentration.

As the alkaline catalyst, a diluted alkaline aqueous solution such as an aqueous sodium hydroxide solution or an aqueous ammonia solution is used. The addition amount of the alkaline catalyst is preferably 0.1 to 6% by weight of the whole solution.

The above-mentioned concentration range of inorganic oxide, multi-component alkoxide solution and alkaline catalyst are mixed and further stirred for a predetermined time. This creates a suspension. Fine particles are collected by filtering the suspension. By firing the fine particles, the multicomponent fine particles 20 are obtained.

The firing temperature of the fine particles is preferably 600 ° C. or higher as a temperature at which organic components around the fine particles can be removed by combustion and the fine particles do not fuse with each other. Furthermore, it is preferably below the softening point of the glass forming the multicomponent fine particles 20. The range of the firing temperature is approximately 600 ° C. to 1000 ° C.

The inorganic fine particles 21 are preferably SiO ₂ , Al ₂ O ₃ , ZnO, Ga ₂ O _{3 and the} like as inorganic materials. SiO ₂ is particularly preferred.

[3-1-3. Dielectric glass slurry]
The dielectric glass slurry is composed of 10% to 65% by weight of the dielectric glass fine particles and 35% to 90% by weight of the solvent. Examples of the solvent include alcohols, glycols, and water. In addition, a lubricant or a dispersant may be added to the dielectric glass slurry. The dielectric glass slurry having such a configuration improves dispersibility.

[3-1-4. Dielectric paste]
The dielectric paste includes a dielectric glass slurry manufactured as described above. In addition, a binder component such as a vehicle is mixed and dispersed in the dielectric paste as necessary. The binder component is terpineol or butyl carbitol acetate containing 1% to 20% by weight of ethyl cellulose or acrylic resin. In addition, dioctyl phthalate, dibutyl phthalate, triphenyl phosphate, and tributyl phosphate may be added to the dielectric paste as a plasticizer. In addition, you may select a binder component according to a solvent at the time of a glass particle grinding | pulverization. The timing for mixing and dispersing the binder component is not limited to this.

According to such a dielectric paste manufacturing method, the multi-component fine particles 20 and the inorganic fine particles 21 are uniformly dispersed in the dielectric paste.

[3-1-5. Method for Forming Dielectric Layer 8]
As a method for forming the dielectric layer 8, a screen printing method, a die coating method, or the like is used. First, a dielectric paste is applied on the front glass substrate 3 on which the display electrodes 6 are provided. The applied dielectric paste constitutes a dielectric paste layer. The film thickness of the dielectric paste layer is appropriately set in consideration of the rate of shrinkage due to firing. Next, the dielectric paste layer is dried in a temperature range of 100 ° C. to 200 ° C. Next, the dielectric paste layer is fired at a temperature range of 450 ° C. to 600 ° C. As a result, as shown in FIG. 3, the surfaces of the multi-component fine particles 20 are fused to the adjacent multi-component fine particles 20. Further, the surface of the multi-component fine particle 20 is fused with the adjacent inorganic fine particle 21. That is, the dielectric layer 8 according to the example 1 is composed of the multi-component fine particles 20 and the inorganic fine particles 21 made of a single component such as SiO ₂ fine particles. The dielectric layer 8 has a gap 23.

In addition to the above method, a sheet obtained by applying a dielectric paste on a film and drying it can be used. Specifically, the dielectric paste formed on the sheet is transferred to the front glass substrate 3. Also with this method, the dielectric layer 8 having the above-described configuration can be formed.

Note that the luminance of the PDP 1 is improved as the thickness of the dielectric layer 8 is reduced. Further, the discharge voltage of the PDP 1 decreases as the thickness of the dielectric layer 8 decreases. Therefore, it is preferable that the thickness of the dielectric layer 8 is as small as possible within a range where the withstand voltage does not decrease. In the present embodiment, as an example, the film thickness of the dielectric layer 8 is not less than 10 μm and not more than 20 μm from both the viewpoint of dielectric strength and the viewpoint of visible light transmittance.

[3-2. Example 2]
As shown in FIG. 4, the dielectric layer 8 according to the example 2 is composed of multi-component coated fine particles 22 and inorganic fine particles 21 made of a single component such as SiO ₂ fine particles. The dielectric layer 8 has a gap 23. Here, the dielectric layer 8 may include only the multi-component coated fine particles 22 without including the inorganic fine particles 21. In the prior art, the dielectric layer is composed only of inorganic fine particles composed of a single component such as SiO ₂ fine particles.

As an example, the multi-component coated fine particle 22 is selected from the group consisting of silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), zinc oxide (ZnO), and gallium oxide (Ga ₂ O ₃ ) 1 At least one selected from the group consisting of inorganic inorganic fine particles and boron (B), aluminum (Al), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba) and zinc (Zn) Multicomponent fine particles mainly composed of an inorganic oxide produced by a multicomponent alkoxide solution containing

The dielectric layer 8 according to the example 2 is not composed of only the inorganic fine particles 21 made of a single component such as SiO ₂ fine particles. The dielectric layer 8 according to the example 2 includes multi-component coated fine particles 22. Therefore, in the manufacturing process of the PDP 1, the surfaces of the multi-component coated fine particles 22 are fused with the adjacent multi-component coated fine particles 22. The multi-component coated fine particles 22 are fused to the adjacent inorganic fine particles 21 on the surfaces. Therefore, the dielectric layer 8 having higher mechanical strength and higher withstand voltage can be obtained.

Conventionally, the dielectric glass used to form the dielectric layer 8 contained 20% by weight or more of lead oxide in order to enable firing at about 450 ° C. to 600 ° C. However, in Example 1, the dielectric glass particles do not contain lead oxide for environmental consideration. That is, the dielectric layer 8 according to Example 2 does not contain lead oxide.

[3-2-1. Production of dielectric paste]
The dielectric paste according to Example 2 is composed of a dielectric glass slurry in which multi-component coated fine particles 22 and inorganic fine particles 21 are dispersed, and a vehicle.

[3-2-2. Multi-component coated fine particles 22 and inorganic fine particles 21]
The multi-component coated fine particles 22 are generated by the following procedure as an example. A multi-component alkoxide solution containing at least one selected from the group consisting of B, Al, Mg, Ca, Sr, Ba and Zn is prepared. As an example, fine particles of one kind of inorganic oxide selected from the group of SiO ₂ , Al ₂ O ₃ , ZnO and Ga ₂ O ₃ are added to the multicomponent alkoxide solution. Thereafter, the multi-component alkoxide solution is stirred for a predetermined time. By the stirring, a coating layer having components contained in the multi-component alkoxide solution is formed on the surface of the fine particles.

After completion of stirring, the fine particles dispersed in the multi-component alkoxide solution are filtered to collect the fine particles with the coating layer formed. Thereafter, the multi-component coated fine particles 22 are obtained by firing the fine particles on which the coating layer is formed.

The firing temperature of the fine particles on which the coat layer is formed is 600 ° C. or higher as the temperature at which the organic components contained in the coat layer and moisture can be removed and the fine particles on which the coat layer is formed are not fused together. Is preferred. Furthermore, it is preferable that it is below the softening point of the glass which forms a coating layer. The range of the firing temperature is approximately 600 ° C. to 1000 ° C.

Also, the thickness of the coating layer formed on the surface of the fine particles is preferably 5 nm or more so that the multi-component coated fine particles 22 can be fused at a temperature of 600 ° C. or lower when forming the dielectric layer. Furthermore, in order not to increase the relative dielectric constant of the dielectric layer 8, it is preferably 100 nm or less.

[3-2-3. Dielectric glass slurry]
The dielectric glass slurry is composed of 10% to 65% by weight of the dielectric glass fine particles and 35% to 90% by weight of the solvent. Examples of the solvent include alcohols, glycols, and water. In addition, a lubricant or a dispersant may be added to the dielectric glass slurry. The dielectric glass slurry having such a configuration improves dispersibility.

[3-2-4. Dielectric paste]
The dielectric paste includes a dielectric glass slurry manufactured as described above. In addition, a binder component such as a vehicle is mixed and dispersed in the dielectric paste as necessary. The binder component is terpineol or butyl carbitol acetate containing 1% to 20% by weight of ethyl cellulose or acrylic resin. In addition, dioctyl phthalate, dibutyl phthalate, triphenyl phosphate, and tributyl phosphate may be added to the dielectric paste as a plasticizer. In addition, you may select a binder component according to a solvent at the time of a glass particle grinding | pulverization. The timing for mixing and dispersing the binder component is not limited to this.

According to such a dielectric paste manufacturing method, the multi-component coated fine particles 22 and the inorganic fine particles 21 are uniformly dispersed in the dielectric paste.

[3-2-5. Method for Forming Dielectric Layer 8]
As a method for forming the dielectric layer 8, a screen printing method, a die coating method, or the like is used. First, a dielectric paste is applied on the front glass substrate 3 on which the display electrodes 6 are provided. The applied dielectric paste constitutes a dielectric paste layer. The film thickness of the dielectric paste layer is appropriately set in consideration of the rate of shrinkage due to firing. Next, the dielectric paste layer is dried in a temperature range of 100 ° C. to 200 ° C. Next, the dielectric paste layer is fired at a temperature range of 450 ° C. to 600 ° C. Thereby, as shown in FIG. 4, the surfaces of the multi-component coated fine particles 22 are fused to the adjacent multi-component coated fine particles 22. The multi-component coated fine particles 22 are fused to the adjacent inorganic fine particles 21 on the surfaces. That is, the dielectric layer 8 according to the example 2 is composed of the multi-component coated fine particles 22 and the inorganic fine particles 21 made of a single component such as SiO ₂ fine particles. The dielectric layer 8 has a gap 23.

[4. Summary]
The PDP 1 according to the present embodiment includes a front plate 2 and a back plate 10 provided to face the front plate 2. The front plate 2 has a display electrode 6 and a dielectric layer 8 that covers the display electrode 6. The dielectric layer 8 includes inorganic fine particles 21 and multi-component fine particles 20 which are a plurality of fine particles mainly composed of an oxide of an inorganic component. The multi-component fine particle 20 is at least one selected from the group of B, Al, Mg, Ca, Sr, Ba, and Zn, and includes a component different from the inorganic component of the inorganic fine particle 21.

The surface of the multi-component fine particle 20 is fused with the adjacent multi-component fine particle 20. Further, the multi-component fine particles 20 are fused with the adjacent inorganic fine particles 21 on the surfaces. Furthermore, the dielectric layer 8 has a gap 23.

According to such a configuration, the bonding force between the fine particles is maintained. In addition, the dielectric glass particles are not dissolved, and voids 23 remain between the fine particles. Therefore, the dielectric constant of the dielectric layer 8 can be reduced.

Further, the PDP 1 of the present embodiment includes a front plate 2 and a back plate 10 provided to face the front plate 2. The front plate 2 has a display electrode 6 and a dielectric layer 8 that covers the display electrode 6. The dielectric layer 8 includes inorganic fine particles 21 and multi-component coated fine particles 22 which are a plurality of fine particles mainly composed of an oxide of an inorganic component. The multi-component coated fine particles 22 are at least one selected from the group consisting of B, Al, Mg, Ca, Sr, Ba, and Zn, and are coated layers that are films containing components different from the inorganic components of the inorganic fine particles 21. It is covered.

The surfaces of the multi-component coated fine particles 22 are fused with the adjacent multi-component coated fine particles 22. The multi-component fine particles 20 are fused with the adjacent inorganic fine particles 21 on the surface. The dielectric layer 8 has a gap 23.

The technique disclosed here is useful for a display device with a large screen by realizing a PDP capable of suppressing the fluctuation of the discharge start voltage.

1 PDP
2 Front plate 3 Front glass substrate 4

Scan electrode

4a,

5a Black electrode

4b, 5b White electrode 5 Maintenance electrode 6 Display electrode 7 Black stripe (light shielding layer)
8 Dielectric layer 9 Protective layer 10 Back plate 11 Back glass substrate 12 Address electrode 13 Base dielectric layer 14 Partition 15 Phosphor layer 16 Discharge space 20 Multicomponent fine particles 21 Inorganic fine particles 22 Multicomponent coated fine particles

Claims

A front plate,
A back plate provided opposite to the front plate,
The front plate has a display electrode and a dielectric layer covering the display electrode,
The dielectric layer includes a plurality of fine particles mainly composed of an inorganic oxide,
At least some of the plurality of fine particles are at least one selected from the group of B, Al, Mg, Ca, Sr, Ba and Zn, and an inorganic component constituting the inorganic oxide; Are multi-component microparticles containing different components,
Plasma display panel.
The plasma display panel according to claim 1,
The multi-component fine particles have an average particle size of 10 nm or more and 150 nm or less.
Plasma display panel.
The plasma display panel according to any one of claims 1 and 2,
The multi-component fine particle is an alkoxide solution containing the inorganic oxide and at least one selected from the group of B, Al, Mg, Ca, Sr, Ba and Zn, and a component different from the inorganic component Formed by the
Plasma display panel.
Forming a dielectric paste layer by applying a dielectric paste to a substrate;
Next, forming the dielectric layer by firing the dielectric paste layer,
The dielectric paste includes a plurality of fine particles mainly composed of an inorganic oxide, and at least some of the plurality of fine particles are selected from the group of B, Al, Mg, Ca, Sr, Ba, and Zn. Multi-component fine particles containing at least one kind of component and a component different from the inorganic component constituting the inorganic oxide,
A method for manufacturing a plasma display panel.
It is a manufacturing method of the plasma display panel of Claim 4, Comprising:
The multi-component fine particle is an alkoxide solution containing the inorganic oxide and at least one selected from the group of B, Al, Mg, Ca, Sr, Ba and Zn, and a component different from the inorganic component Forming, including,
A method for manufacturing a plasma display panel.
A front plate,
A back plate provided opposite to the front plate,
The front plate has a display electrode and a dielectric layer covering the display electrode,
The dielectric layer includes a plurality of fine particles mainly composed of an inorganic oxide,
At least some of the plurality of fine particles are at least one selected from the group of B, Al, Mg, Ca, Sr, Ba and Zn, and an inorganic component constituting the inorganic oxide; Are multi-component coated microparticles coated with films containing different components,
Plasma display panel.
The plasma display panel according to claim 6,
The multi-component coated fine particles have an average particle size of 10 nm or more and 150 nm or less.
Plasma display panel.
The plasma display panel according to claim 6,
The thickness of the film is 5 nm or more and 100 nm or less.
Plasma display panel.
A plasma display panel according to any one of claims 7 and 8,
The multi-component coated fine particle is at least one selected from the group consisting of the inorganic oxide fine particles, B, Al, Mg, Ca, Sr, Ba and Zn, and a component different from the inorganic component. Formed by an alkoxide solution containing,
Plasma display panel.
Forming a dielectric paste layer by applying a dielectric paste to a substrate;
Next, forming the dielectric layer by firing the dielectric paste layer,
The dielectric paste includes a plurality of fine particles mainly composed of an inorganic oxide, and at least some of the plurality of fine particles are selected from the group of B, Al, Mg, Ca, Sr, Ba, and Zn. Multi-component coated fine particles coated with a film containing at least one kind and a component different from the inorganic component constituting the inorganic oxide,
A method for manufacturing a plasma display panel.
It is a manufacturing method of the plasma display panel according to claim 10,
The multi-component coated fine particle is at least one selected from the group consisting of the inorganic oxide fine particles, B, Al, Mg, Ca, Sr, Ba and Zn, and a component different from the inorganic component. Forming with an alkoxide solution containing
A method for manufacturing a plasma display panel.