WO2012079434A1 - Smd型led短节距引线框架 - Google Patents

Smd型led短节距引线框架 Download PDF

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Publication number
WO2012079434A1
WO2012079434A1 PCT/CN2011/081843 CN2011081843W WO2012079434A1 WO 2012079434 A1 WO2012079434 A1 WO 2012079434A1 CN 2011081843 W CN2011081843 W CN 2011081843W WO 2012079434 A1 WO2012079434 A1 WO 2012079434A1
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WO
WIPO (PCT)
Prior art keywords
lead frame
pitch
type led
smd
less
Prior art date
Application number
PCT/CN2011/081843
Other languages
English (en)
French (fr)
Inventor
彭会银
李胜刚
Original Assignee
湖北匡通电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 湖北匡通电子有限公司 filed Critical 湖北匡通电子有限公司
Publication of WO2012079434A1 publication Critical patent/WO2012079434A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to a component for producing a surface mount type SMD type LED, in particular to an SMD type LED short pitch lead frame.
  • the surface mount type SMD type LED light emitting diode belongs to a green environmental protection light source, and is a novel surface mount type semiconductor light emitting device, which has low energy consumption, high luminous efficiency, small volume, large scattering angle, good uniformity of light emission, high reliability, etc. advantage. Its illuminating colors include full color, various monochromatic and white light, mainly used in various electronic products, large-size LED backlight, decoration, landscape, lighting, car lights, etc., and will gradually replace traditional lighting.
  • the general-purpose lead frame of the mounted SMD type LED package has a length of 144.00 mm, a pitch of 12.00 mm, a row spacing of 7.80 mm, a process side width of 5.96 mm, and a precision copper alloy strip of 0.20 mm.
  • the pitch, the row spacing and the process side are both large, and the consumption of the precision copper alloy strip or the precision steel strip is increased, and the product cost is high.
  • the object of the present invention is to provide an SMD type LED short pitch lead frame, which solves the problems of high cost and large material consumption of the SMD type LED lead frame in the prior art.
  • the pitch is reduced, the consumables of the SMD type LED lead frame are reduced, and the production cost and material consumption are reduced.
  • an SMD type LED short pitch lead frame comprising a plurality of lead frame unit brackets, a plurality of process side units on both sides of the bracket, and a process side unit.
  • the positioning hole is provided, the distance a between adjacent two positioning holes is less than 12.0 mm, and the row distance e of the lead frame unit is less than 8.0 mm.
  • the edge width b of the process side unit is less than 5.96 mm
  • the width of the adjacent two lead frame unit functional areas is less than 1.96 mm
  • the width d of the connecting rib is less than 3.0 mm.
  • FIG. 1 is a schematic view showing the structure of the present invention.
  • Figure 2 is a schematic view showing the structure of a lead frame unit of the present invention.
  • the utility model relates to an SMD type LED short pitch lead frame, comprising a bracket formed by a plurality of lead frame units 1, a plurality of process side units 2 on two sides of the bracket, and positioning holes 3 provided on the process side unit 2, and two adjacent positioning holes 3
  • the pitch a is less than 12.0 mm
  • the row distance e of the lead frame unit 1 is less than 8.0 mm.
  • the side width b of the process side unit 2 is less than 5.96 mm
  • the width ⁇ of the functional area of the adjacent two lead frame unit 1 is less than 1.96 mm
  • the width d of the connecting rib is less than 3.0 mm.
  • the total length L of the lead frame in the present invention is 144.00 mm, which is the same as the length of the conventional lead frame, and the width process is adjusted accordingly.
  • the spacing a between adjacent two positioning holes 3 is the pitch a of the lead frame unit 1.
  • the lead frame unit 1 has a pitch a of less than 12.00 mm, and the lead frame unit 1 has a row pitch of less than 8.0 mm, which is 9.0 mm and 6.7 mm, respectively.
  • the lead frame unit 1 has a pitch a of less than 12.00 mm, and the lead frame unit 1 has a row pitch of less than 8.0 mm, which is 9.6 mm and 7.0 mm, respectively.
  • the pitch a and the row spacing e should be shortened as much as possible to save material usage and increase productivity.
  • the invention relates to an SMD type LED short pitch lead frame, which shortens the pitch and the spacing between adjacent two center lines on a single SMD type LED lead frame, and uses a conventional lead frame of 72 pieces per bracket. More SMD type LED leads can be placed.
  • the SMD type LED lead frame has a pitch of 9.00 mm and a row spacing of 6.7 mm.
  • the lead frame has a pitch of 12.00 mm and a row spacing of 8.00 mm.
  • the SMD type LED lead frame material consumption is saved by 35.71%, which reduces material consumption and production cost, and the production efficiency is greatly improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Description

SMD 型LED短节距引线框架 技术领域
本发明涉及一种生产表面贴装式SMD型LED的部件，具体涉及一种SMD型LED短节距引线框架。
背景技术
表面贴装式SMD型LED发光二极管属于绿色环保光源，是一种新型表面贴装式半导体发光器件，具有能耗低、发光效率高、体积小、散射角度大、发光均匀性好、可靠性高等优点。其发光颜色包括全彩、各种单色及白光，主要用于各种电子产品、大尺寸led背光、装饰、景观、照明、汽车灯等方面的运用，并将逐步取代传统照明。
目前贴装式SMD型LED封装通用引线框架尺寸长度为144.00mm，节距为12.00mm，排距为7.80mm，工艺边宽为5.96mm，精密铜合金带为0.20mm。节距、排距、工艺边均较大，增加精密铜合金带或精密钢带消耗量，产品成本较高。
发明内容
本发明的目的是提供一种SMD型LED短节距引线框架，解决现有技术中SMD型LED引线框架成本高，物料消耗大的问题。在保障表面贴装表面贴装式SMD型LED质量及功能有效区的基础上，减少节距，降低SMD型LED引线框架的耗材，降低生产成本及物料消耗。
为解决上述技术问题，本发明的目的是这样实现的：一种SMD型LED短节距引线框架，包括多个引线框架单元构成的支架、支架两边的多个工艺边单元、以及工艺边单元上设有的定位孔，相邻两定位孔间距a小于12.0mm，引线框架单元的排距e小于8.0mm。
工艺边单元的边宽度b小于5.96mm，相邻两引线框架单元功能区卡筋宽度c小于1.96mm、连接筋宽度d小于3.0mm。
附图概述
图 1 是本发明的结构示意图 。
图 2 是本发明的引线框架单元结构示意图 。
实施方式
一种SMD型LED短节距引线框架，包括多个引线框架单元1构成的支架、支架两边的多个工艺边单元2、以及工艺边单元2上设有的定位孔3，相邻两定位孔3间距a小于12.0mm，引线框架单元1的排距e小于8.0mm。工艺边单元2的边宽度b小于5.96mm，相邻两引线框架单元1功能区卡筋宽度c小于1.96mm、连接筋宽度d小于3.0mm。
如图1所示：本发明中引线框架总长度L为144.00mm，与传统引线框架长度相同，其宽度工艺作相应调整。相邻两定位孔3间距a，即为引线框架单元1节距a。
方案1：
引线框架单元1节距a小于12.00mm，引线框架单元1的排距小于8.0mm，分别为9.0mm和6.7mm。
方案2：
引线框架单元1节距a小于12.00mm，引线框架单元1的排距小于8.0mm，分别为9.6mm和7.0mm。
在满足工艺条件前提下尽量缩短节距a和排距e，以节省材料用量及提高产能效率。
工业实用性
本发明一种SMD型LED短节距引线框架，缩短了单只SMD型LED引线框架上相邻两个中心线之间的节距和排距，使用传统的每条支架为72粒的引线框架可以布置更多的SMD型LED引线。如：SMD型LED引线框架节距为9.00mm，排距为6.7mm，引线框架比传统引线框架节距为12.00mm，排距为8.00mm SMD型LED引线框架材料用量节约35.71%，降低物料消耗及生产成本，同时生产效率大大提高。

Claims (2)

  1. 一种SMD型LED短节距引线框架，包括多个引线框架单元（1）构成的支架、支架两边的多个工艺边单元（2）、以及工艺边单元（2）上设有的定位孔（3），其特征在于：
    相邻两定位孔（3）间距a小于12.0mm，引线框架单元（1）的排距e小于8.0mm。
  2. 根据权利要求1所述的一种SMD型LED短节距引线框架，其特征在于：工艺边单元（2）的边宽度b小于5.96mm，相邻两引线框架单元（1）功能区卡筋宽度c小于1.96mm、连接筋宽度d小于3.0mm。
PCT/CN2011/081843 2010-12-18 2011-11-06 Smd型led短节距引线框架 WO2012079434A1 (zh)

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CN201010594197.8A CN102544339B (zh) 2010-12-18 2010-12-18 Smd型led短节距引线框架
CN201010594197.8 2010-12-18

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201265825Y (zh) * 2008-09-03 2009-07-01 湖北匡通电子有限公司 短节距薄型led引线框架
CN201608182U (zh) * 2010-02-05 2010-10-13 东莞市胤腾光电科技有限公司 Led灯支架
CN201877464U (zh) * 2010-12-18 2011-06-22 湖北匡通电子有限公司 Smd型led短节距引线框架

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2686020Y (zh) * 2004-01-19 2005-03-16 上海三思科技发展有限公司 一种高亮区比例的led点阵显示模块
EP2128689A1 (en) * 2008-05-27 2009-12-02 Barco NV A display panel with improved reflectivity
CN101344236B (zh) * 2008-09-03 2010-06-02 湖北匡通电子有限公司 短节距薄型led引线框架

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201265825Y (zh) * 2008-09-03 2009-07-01 湖北匡通电子有限公司 短节距薄型led引线框架
CN201608182U (zh) * 2010-02-05 2010-10-13 东莞市胤腾光电科技有限公司 Led灯支架
CN201877464U (zh) * 2010-12-18 2011-06-22 湖北匡通电子有限公司 Smd型led短节距引线框架

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