WO2012069519A3 - Led module with prefabricated wavelength conversion element - Google Patents

Led module with prefabricated wavelength conversion element Download PDF

Info

Publication number
WO2012069519A3
WO2012069519A3 PCT/EP2011/070770 EP2011070770W WO2012069519A3 WO 2012069519 A3 WO2012069519 A3 WO 2012069519A3 EP 2011070770 W EP2011070770 W EP 2011070770W WO 2012069519 A3 WO2012069519 A3 WO 2012069519A3
Authority
WO
WIPO (PCT)
Prior art keywords
region
led chip
led module
gradient
conversion element
Prior art date
Application number
PCT/EP2011/070770
Other languages
German (de)
French (fr)
Other versions
WO2012069519A2 (en
Inventor
Peter Pachler
Franz Schrank
Original Assignee
Tridonic Jennersdorf Gmbh
Lumitech Produktion Und Entwicklung Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic Jennersdorf Gmbh, Lumitech Produktion Und Entwicklung Gmbh filed Critical Tridonic Jennersdorf Gmbh
Publication of WO2012069519A2 publication Critical patent/WO2012069519A2/en
Publication of WO2012069519A3 publication Critical patent/WO2012069519A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an LED module, comprising: - at least one LED chip (1) on a carrier (5), and - a prefabricated element (3) applied on the light emission surface of the LED chip (1), wherein scattering particles and colour conversion particles different therefrom in a matrix are accommodated in the element (3), wherein the concentration of the scattering particles decreases with a substantially constant first gradient from that side of the element (3) which faces the LED chip, and wherein the concentration of the colour conversion particles - in a first region, facing the LED chip, is substantially constant, in such a way that the colour conversion particles are packed in the densest possible fashion in this region, and - in a second region, adjoining the first region, falls abruptly with a second gradient, which is significantly greater than the first gradient of the scattering particles.
PCT/EP2011/070770 2010-11-24 2011-11-23 Led module with prefabricated element WO2012069519A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010061848.9 2010-11-24
DE102010061848.9A DE102010061848B4 (en) 2010-11-24 2010-11-24 LED module with prefabricated element

Publications (2)

Publication Number Publication Date
WO2012069519A2 WO2012069519A2 (en) 2012-05-31
WO2012069519A3 true WO2012069519A3 (en) 2012-07-19

Family

ID=45218676

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/070770 WO2012069519A2 (en) 2010-11-24 2011-11-23 Led module with prefabricated element

Country Status (2)

Country Link
DE (1) DE102010061848B4 (en)
WO (1) WO2012069519A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012206955B4 (en) * 2012-04-26 2016-09-22 Osram Oled Gmbh Method for producing a scattering layer for electromagnetic radiation
DE102012107290A1 (en) 2012-08-08 2014-02-13 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device, conversion agent platelets and method of making a conversion agent platelet
DE202015105428U1 (en) * 2015-04-29 2016-08-01 Tridonic Jennersdorf Gmbh LED module with improved heat dissipation
DE102017117488A1 (en) 2017-08-02 2019-02-07 Osram Opto Semiconductors Gmbh Optoelectronic component

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1906462A2 (en) * 2006-09-29 2008-04-02 OSRAM Opto Semiconductors GmbH Optoelectronic component with a luminescence conversion layer
WO2008043519A1 (en) * 2006-10-10 2008-04-17 Lexedis Lighting Gmbh Phosphor-converted light emitting diode
US20080116467A1 (en) * 2006-11-20 2008-05-22 Philips Lumileds Lighting Company, Llc Light Emitting Device Including Luminescent Ceramic and Light-Scattering Material
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
DE102009018087A1 (en) * 2008-04-30 2009-12-17 Ledon Lighting Jennersdorf Gmbh Light emitting device i.e. industrial light emitting device such as traffic signal, has wavelengths converting material surrounding LED, and including filler particles whose concentration is lowest in areas where color conversion is smaller
DE102008030253A1 (en) * 2008-06-25 2009-12-31 Osram Opto Semiconductors Gmbh Conversion element and light source
WO2010010484A1 (en) * 2008-07-22 2010-01-28 Koninklijke Philips Electronics N.V. An optical element for a light emitting device and a method of manufacturing thereof
WO2010038097A1 (en) * 2008-10-01 2010-04-08 Koninklijke Philips Electronics N.V. Led with particles in encapsulant for increased light extraction and non-yellow off-state color
US20100291313A1 (en) * 2009-05-15 2010-11-18 Peiching Ling Methods and apparatus for forming uniform particle layers of phosphor material on a surface

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080049011A (en) * 2005-08-05 2008-06-03 마쯔시다덴기산교 가부시키가이샤 Semiconductor light-emitting device
DE102006054330A1 (en) * 2006-11-17 2008-05-21 Merck Patent Gmbh Phosphor plates for LEDs made of structured foils

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1906462A2 (en) * 2006-09-29 2008-04-02 OSRAM Opto Semiconductors GmbH Optoelectronic component with a luminescence conversion layer
WO2008043519A1 (en) * 2006-10-10 2008-04-17 Lexedis Lighting Gmbh Phosphor-converted light emitting diode
US20080116467A1 (en) * 2006-11-20 2008-05-22 Philips Lumileds Lighting Company, Llc Light Emitting Device Including Luminescent Ceramic and Light-Scattering Material
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
DE102009018087A1 (en) * 2008-04-30 2009-12-17 Ledon Lighting Jennersdorf Gmbh Light emitting device i.e. industrial light emitting device such as traffic signal, has wavelengths converting material surrounding LED, and including filler particles whose concentration is lowest in areas where color conversion is smaller
DE102008030253A1 (en) * 2008-06-25 2009-12-31 Osram Opto Semiconductors Gmbh Conversion element and light source
WO2010010484A1 (en) * 2008-07-22 2010-01-28 Koninklijke Philips Electronics N.V. An optical element for a light emitting device and a method of manufacturing thereof
WO2010038097A1 (en) * 2008-10-01 2010-04-08 Koninklijke Philips Electronics N.V. Led with particles in encapsulant for increased light extraction and non-yellow off-state color
US20100291313A1 (en) * 2009-05-15 2010-11-18 Peiching Ling Methods and apparatus for forming uniform particle layers of phosphor material on a surface

Also Published As

Publication number Publication date
WO2012069519A2 (en) 2012-05-31
DE102010061848B4 (en) 2022-11-03
DE102010061848A1 (en) 2012-05-24

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