WO2012058837A1 - 发光源散热构造及背光模块 - Google Patents

发光源散热构造及背光模块 Download PDF

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Publication number
WO2012058837A1
WO2012058837A1 PCT/CN2010/079485 CN2010079485W WO2012058837A1 WO 2012058837 A1 WO2012058837 A1 WO 2012058837A1 CN 2010079485 W CN2010079485 W CN 2010079485W WO 2012058837 A1 WO2012058837 A1 WO 2012058837A1
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Prior art keywords
heat dissipation
bearing surface
heat sink
carrier
dissipation structure
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PCT/CN2010/079485
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English (en)
French (fr)
Inventor
张彦学
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深圳市华星光电技术有限公司
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Publication of WO2012058837A1 publication Critical patent/WO2012058837A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light source heat dissipation structure and a backlight module, and more particularly to a light source heat dissipation structure in which a heat sink and a light emitting diode package structure are in direct contact, and the light emitting diode package structure is directly radiated by a heat sink. And backlight module.
  • Liquid crystal display Display LCD
  • LCD Liquid crystal display Display
  • FPD Fluorescence Deformation
  • the liquid crystal material of the liquid crystal display cannot be self-illuminated, and it is necessary to provide a light source externally. Therefore, a backlight module is required in the liquid crystal display to provide a desired light source.
  • the backlight module can be divided into a side-in type backlight module and a direct-lit backlight module.
  • the existing backlight module mainly uses a cold cathode fluorescent lamp (CCFL), a hot cathode fluorescent lamp (HCFL) and a semiconductor light emitting component as a light source, and the semiconductor light emitting component mainly uses a light emitting diode (LED) to emit light, which is compared with the cathode.
  • CCFL cold cathode fluorescent lamp
  • HCFL hot cathode fluorescent lamp
  • LED light emitting diode
  • Fluorescent tubes are more energy efficient, longer lasting, and lighter in size, so there is a tendency to gradually replace cathode fluorescent tubes. LEDs will be the main source of backlights for liquid crystal displays in the future.
  • the light-emitting diodes are mostly disposed on the heat sink in the form of chips, and are packaged in a semiconductor package as an LED package structure, and then sequentially fixed on a long strip of circuit substrate and a long strip of aluminum profile to form A light-bar (LB), and the back side of the last light bar is joined to the aluminum heat sink of the backlight module to form a light source heat dissipation structure.
  • the above-mentioned light source heat dissipation structure has the disadvantage that the temperature of the light emitting diode chip in the light emitting diode package structure is extremely high, but the light emitting diode package structure can only transfer heat energy through the heat sink, the circuit substrate and the aluminum profile.
  • Aluminum heat sink is the disadvantage that the temperature of the light emitting diode chip in the light emitting diode package structure is extremely high, but the light emitting diode package structure can only transfer heat energy through the heat sink, the circuit substrate and the aluminum profile.
  • Aluminum heat sink is the disadvantage that the temperature of the light emit
  • the light-emitting diode itself is also very susceptible to its luminous efficiency and working stability due to the temperature rise of the working process. In severe cases, it may also be degraded due to long-term high temperature.
  • the light bar is simply adhered to the aluminum heat sink by an adhesive or only by a screw lock on the aluminum heat sink, there is insulation between the aluminum profile of the light bar and the aluminum heat sink.
  • the adhesive which causes the surface between the two to be neither directly in thermal contact nor in close contact, will affect the heat dissipation efficiency to some extent, and will increase the thickness of the overall structure, which is not conducive to thin and light design trends. .
  • the adhesive may deteriorate and lose the viscosity, causing the light strip to be detached from the aluminum heat sink. If the thermal energy of the LED package structure cannot be taken away by the aluminum heat sink, the light emitting diode package Construction will have the potential risk of overheating and burning.
  • a main object of the present invention is to provide a light source heat dissipation structure including at least one carrier, at least one LED package structure, and a heat sink.
  • the at least one LED package structure is electrically connected to the at least one carrier.
  • the heat sink has a first bearing surface and at least one second bearing surface, wherein the at least one LED package structure is in thermal contact with the first bearing surface of the heat sink, and the at least one carrier Provided on the at least one second bearing surface of the heat sink, respectively, so that the at least one light emitting diode package structure directly conducts heat dissipation by means of the good heat dissipation characteristics of the heat sink, and can Heat dissipation efficiency and service life of at least one LED package construction.
  • a secondary object of the present invention is to provide a light source heat dissipation structure, wherein the at least one light emitting diode package structure, the at least one carrier plate, and the heat sink are in contact with each other, and thus the heat sink is supported by the first
  • the bearing surface and the at least one second bearing surface are respectively in direct contact with a bottom surface of the at least one LED package structure and a lower surface of the at least one carrier board, and no need to indirectly rely on an aluminum profile, thereby reducing assembly
  • the process also reduces man-hours and helps reduce the chances of poor assembly.
  • Another object of the present invention is to provide a heat dissipation structure for a light source, comprising at least one light bar and a heat sink, each of the at least one light bar comprising at least one light emitting diode package structure and at least one carrier, wherein the heat sink The first bearing surface and the at least one groove-shaped second bearing surface, the at least one LED package structure of the at least one light bar is attached to the first bearing surface of the heat sink, and The at least one carrier of the at least one light bar is respectively received in the at least one groove-shaped second bearing surface of the heat sink, and thus the at least one LED package structure and the at least one carrier
  • the board is in direct thermal contact with the heat sink, so that the at least one LED package structure and the at least one carrier board directly conduct heat dissipation by the good heat dissipation characteristics of the heat sink, and the relative heat dissipation can be relatively improved. Heat dissipation efficiency and service life of at least one LED package construction.
  • the present invention provides a light source heat dissipation structure, comprising: at least one light bar, each comprising: at least one light emitting diode package structure, each having at least two pins disposed on the light emitting diode package structure At least two sides; and at least one carrier electrically connected to the at least two pins of the LED package structure; and a heat sink having a first bearing surface and at least one second bearing surface at least two
  • the light-emitting diode package structure of the light bar is in thermal contact with the first bearing surface of the heat sink, and the at least one carrier of the light bar is respectively received in the heat sink Two bearing surfaces.
  • the present invention provides another light source heat dissipation structure, wherein the light source heat dissipation structure comprises: at least one carrier; at least one LED package structure electrically connected to the at least one carrier; a heat sink having a first bearing surface and at least one second bearing surface; wherein the LED package structure is in thermal contact with the first bearing surface of the heat sink, and the at least one carrier is disposed respectively The second bearing surface of the heat sink.
  • the present invention further provides a backlight module for a heat dissipation structure of a light source, wherein the backlight module includes a light source heat dissipation structure including: at least one carrier; at least one LED package structure, electrically connected The at least one carrier; and a heat sink having a first bearing surface and at least one second bearing surface; wherein the LED package structure is in thermal contact with the first bearing surface of the heat sink, and The at least one carrier is respectively disposed on the second bearing surface of the heat sink.
  • a light source heat dissipation structure including: at least one carrier; at least one LED package structure, electrically connected The at least one carrier; and a heat sink having a first bearing surface and at least one second bearing surface; wherein the LED package structure is in thermal contact with the first bearing surface of the heat sink, and The at least one carrier is respectively disposed on the second bearing surface of the heat sink.
  • the height of the second bearing surface is lower than the height of the first bearing surface.
  • the second bearing surface of the heat sink is in the shape of a groove.
  • the at least one LED package structure each further comprises at least one LED chip.
  • the at least one carrier is a printed circuit board, and an upper surface of the at least one carrier has a height equal to a height of the first bearing surface.
  • the heat sink has at least two second bearing surfaces
  • the at least one LED package structure includes at least two pins disposed on at least two sides of the LED package structure. They are electrically connected to at least two of the carrier plates respectively.
  • the heat sink is a heat sink aluminum extrusion.
  • the heat sink of the light source heat dissipation structure of the present invention can be directly combined with at least one light emitting diode package structure and the at least one carrier board, without having to resort to an aluminum profile,
  • An LED package structure, the at least one carrier and the heat sink are directly coupled to each other and in thermal contact, which facilitates good conduction of the at least one LED package structure and the at least one carrier via the heat sink
  • the heat dissipation characteristic directly conducts heat dissipation, so that the heat dissipation efficiency and the service life of the at least one light emitting diode package structure can be relatively improved.
  • the heat sink of the light source heat dissipation structure of the present invention can be directly combined with at least one light emitting diode package structure and the at least one carrier board, without the need of an aluminum profile, and the at least one light emitting diode package structure and the The at least one carrier and the heat sink are directly coupled to each other and in thermal contact, which facilitates direct conduction and heat dissipation of the at least one LED package structure and the at least one carrier through the good conduction and heat dissipation characteristics of the heat sink. Therefore, the heat dissipation efficiency and the service life of the at least one LED package structure can be relatively improved.
  • Fig. 1A is a schematic view showing a heat dissipation structure of a light source according to a first embodiment of the present invention.
  • Fig. 1B is a side view showing a heat radiation source heat dissipation structure according to a first embodiment of the present invention.
  • Fig. 2 is a side view showing a heat radiation source heat dissipation structure according to a second embodiment of the present invention.
  • Fig. 3 is a side view showing a heat radiation source heat dissipation structure according to a third embodiment of the present invention.
  • FIG. 1A a schematic diagram of a light source heat dissipation structure 10 according to a first embodiment of the present invention is disclosed.
  • the light source heat dissipation structure 10 of the first embodiment of the present invention is mainly applied to the field of illumination or liquid crystal display, especially liquid crystal.
  • the light source heat dissipation structure 10 mainly includes at least one light bar 11 and a heat sink 12, and the above components will be described in detail below.
  • the illuminating source heat dissipating structure 10 of the first embodiment of the present invention is a illuminating source heat dissipating structure of the one-side type backlight module
  • the at least one light bar 11 is a light bar of a light emitting diode.
  • the at least one light bar 11 can be assembled on at least one side of the optical film of the backlight module to serve as a backlight of the edge-lit backlight module, but is not limited thereto.
  • the at least one light bar 11 can be It is assembled directly under an optical film of a backlight module to serve as a backlight for the direct-lit backlight module.
  • the at least one light bar 11 includes at least one LED package structure 111 and a carrier 112.
  • Each of the at least one LED package structures 111 has a bottom surface 1111, at least two pins 1112, and a heat sink 1113.
  • the carrier board 112 has an upper surface 1121 and a lower surface 1122. The upper surface 1121 of the carrier board 112 is electrically connected to the at least two pins 1112 of the at least one LED package structure 111, and the LED package structure 111 refers to a complete LED package.
  • the device itself includes a package colloid, at least one LED chip, the heat sink 1113, and a lead frame or a circuit substrate, wherein the lead frame or the circuit substrate is provided with the at least two pins. 1112, the at least two pins 1112 are exposed from the LED package structure 111 for electrically connecting with a circuit (not shown) of the upper surface 1121 of the carrier 112, so that the LED package is
  • the configuration 111 is introduced into the external power source through the carrier board 112 to produce light of a particular color.
  • the heat sink 12 of the first embodiment of the present invention has a first bearing surface 121 and a second bearing surface 122, wherein the height of the second bearing surface 122 can be lower than the first a height of a bearing surface 121 such that when the carrier 112 is disposed on the second bearing surface 122 of the heat sink 12, the height of the upper surface 1121 of the carrier 112 is equal to the first bearing surface
  • the height of 121, and the lower surface 1122 of the carrier 112 directly adheres to the second bearing surface 122, that is, in a flush arrangement.
  • the heat sink 1113 of the at least one LED package structure 111 is exposed from the bottom surface 1111 , and the bottom surface 1111 is fixedly attached to the first bearing surface 121 of the heat sink 12 .
  • the heat sink 1113 is in direct thermal contact with the heat sink 12 to increase the thermal conductivity of the at least one LED package structure 111.
  • the heat sink 12 is made of a heat-dissipating material having good heat dissipation efficiency, such as various metals or alloys, especially a metal heat sink made of aluminum, aluminum alloy or aluminum material, heat-dissipating aluminum extrusion or alloy heat sink.
  • the heat sink 1113 and the carrier 112 of the at least one LED package structure 111 are in direct thermal contact with the heat sink 12 to conduct heat dissipation by the good heat dissipation characteristics of the heat sink 12 . Therefore, it is helpful to improve the heat dissipation efficiency of the light source heat dissipation structure 10 to achieve the goal of rapid temperature drop.
  • the bottom surface 1111 of the at least one LED package structure 111 and the portion of the heat sink 1113 that directly contacts the first bearing surface 121 of the heat sink 12 may be coated with an appropriate amount of thermal conductive adhesive ( Not shown, the heat sink 1113 of the at least one LED package structure 111 and the heat sink 12 have better conduction heat dissipation efficiency.
  • the carrier board 112 of the first embodiment of the present invention is disposed on the second bearing surface 122 of the heat sink 12, and the at least one LED package structure 111 is simultaneously
  • the bottom surface 1111 and the heat sink 1113 are attached to the first bearing surface 121 of the heat sink 12, and are electrically connected to the upper surface 1121 of the carrier 112 by the at least two pins 1112.
  • the upper surface 1121 of the carrier 112 and the first bearing surface of the heat sink 12 may be disposed when the carrier 112 is disposed on the second bearing surface 122 of the heat sink 12
  • the 121 contour is flush, but is not limited thereto, and the carrier 112 may be a printed circuit board, an anodized aluminum substrate, or other substrate capable of providing a surface circuit pattern.
  • the second to third preferred embodiments of the present invention are similar to the light source heat dissipation structure 10 of the first embodiment of the present invention, and generally use the same component name and figure number, but the second to The difference between the three preferred embodiments is that the illuminating source heat dissipating structures 20, 30 of the second to third preferred embodiments further improve the heat sink 12, which will be described in detail below.
  • FIG. 2 is a side view of the light source cooling structure 20 of the second preferred embodiment of the present invention.
  • the light source heat dissipation structure 20 mainly includes at least one light bar 11 and a heat sink 12 .
  • the heat sink 12 has a plurality of second bearing surfaces 122
  • the at least one light bar 11 each includes a plurality of carrier plates 112, wherein the plurality of carrier plates 112 are respectively disposed on
  • the plurality of second bearing surfaces 122 of the heat sink 12 have, for example, two carrier plates 112 and two second bearing surfaces 122.
  • the at least two pins 1112 of the at least one LED package structure 111 are disposed on at least two sides of the LED package structure 111, and are electrically connected to the plurality of carriers 112, respectively.
  • the heat sink 1113 and the plurality of carrier plates 112 of the at least one LED package structure 111 are in direct contact with the heat sink 12 to directly conduct heat dissipation by the good conduction heat dissipation characteristics of the heat sink 12 .
  • FIG. 3 is a side view of the light source heat dissipation structure 30 according to a third preferred embodiment of the present invention.
  • the light source heat dissipation structure 30 mainly includes at least one light bar 11 and a heat sink 12 .
  • the difference between the third embodiment is that the heat sink 12 has at least one groove-shaped second bearing surface 123, and the groove-shaped second bearing surface 123 has a lower height than the first bearing surface 121.
  • the height of the at least one light bar 11 includes at least one carrier plate 112, wherein the at least one carrier plate 112 is respectively received in the at least one groove-shaped second bearing surface 123 of the heat sink 12
  • the at least two pins 1112 of the at least one LED package structure 111 are simultaneously electrically connected to the at least one carrier 112, and thus the heat sink 1113 and the at least one LED package structure 111
  • the at least one carrier 112 is in direct thermal contact with the heat sink 12 for direct conduction heat dissipation by the good conduction heat dissipation characteristics of the heat sink 12.
  • the above features of the first, second and third embodiments of the present invention are advantageous in that the at least one LED package structure 111, the at least one carrier 112 and the heat sink 12 in combination with each other, wherein the heat sink 12 directly carries and thermally contacts the bottom surface 1111 of the at least one LED package structure 111 and the heat sink 1113 and the at least one carrier 112, thereby facilitating the The heat sink 1113 and the at least one carrier 112 of the at least one LED package structure 111 are directly conductively dissipated by the good heat dissipation characteristics of the heat sink 12, and the at least one LED package structure 111 can be relatively lifted. Heat dissipation efficiency and service life.
  • the at least two pins 1112 of the at least one LED package structure 111 are directly electrically connected to the at least one carrier 112, and the heat sink 1113 is directly in thermal contact with the heat sink 12. Therefore, it is not necessary to resort to an aluminum profile, which not only simplifies the construction and assembly process, but also shortens the working hours, thereby helping to reduce the probability of assembly failure.
  • the first bearing surface 121 of the heat sink 12 and the at least one second bearing surface 122 or the at least one groove-shaped second bearing surface 123 are integrally formed, instead of the existing aluminum profile. The component cost can also be saved, so that the production time and overall cost of the light source heat dissipation structures 10, 20, and 30 can be reduced and the assembly yield can be improved to achieve the goal of low cost of the product.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Description

发光源散热构造及背光模块 技术领域
本发明是有关于一种发光源散热构造及背光模块，特别是有关于一种让散热座与发光二极管封装构造直接接触，使发光二极管封装构造直接借助通过散热座进行传导散热的发光源散热构造及背光模块。
 背景技术
液晶显示器(liquid crystal display，LCD)是利用液晶材料的特性来显示图像的一种平板显示装置(flat panel display，FPD)，其相较于其他显示装置而言更具轻薄、低驱动电压及低功耗等优点，已经成为整个消费市场上的主流产品。然而，液晶显示器的液晶材料无法自主发光，必需借助外在提供光源，因此液晶显示器中需设有背光模块以提供所需的光源。
一般而言，背光模块可分为侧入式背光模块和直下式背光模块两种形式。现有背光模块主要是以冷阴极荧光灯管（CCFL）、热阴极荧光灯管（HCFL）及半导体发光组件作为光源，而半导体发光组件主要又是利用发光二极管（LED）进行发光，其相较于阴极荧光灯管更为省电节能、使用寿命更长，且体积更为轻薄，因而有逐渐取代阴极荧光灯管的趋势，发光二极管将是液晶显示器的背光模块未来的主要光源。
现今，发光二极管多以芯片的形式设置于热沉上，并进行半导体封装，以作为发光二极管封装构造，接着依序固定在一长条状的电路基板及一长条状的铝型材上以构成一灯条(light-bar，LB)，最后灯条的背面再与背光模块的铝材散热板接合，而形成一发光源散热构造。然而，上述发光源散热构造的缺点在于：发光二极管封装构造中的发光二极管芯片工作过程中的温度极高，然而发光二极管封装构造却仅能间接通过热沉、电路基板及铝型材将热能传递至铝材散热板。由于设置在发光二极管封装构造与铝型材之间的印刷电路板(print circuit board，PCB)是使用热阻高的材料所制成，无法协助发光二极管封装构造及时将热能传递至铝型材及铝材散热板，将导致发光二极管封装构造附近的温度明显升高，造成液晶显示器各显示区块温度不均而出现泛红现象，进而影响液晶显示器的成像质量。
再者，发光二极管本身也极易因为工作过程的温升而影响其发光效率及工作稳定度，严重时也可能因长期处于高温的状态而降低其使用寿命。另外，若灯条仅是简单利用黏着剂黏固在铝材散热板上或仅是利用螺丝锁付在铝材散热板上，则由于灯条的铝型材与铝材散热板之间存在了绝缘的黏着剂，造成两者之间的表面既非直接热性接触又未紧密贴合，也将会在某程度上影响其散热效率，更会增加整体构造的厚度而不利于轻薄化的设计趋势。此外，长期处于高温的状态下，黏着剂也可能变质劣化而失去黏性，造成灯条脱离铝材散热板，若发光二极管封装构造的热能无法被铝材散热板即时带走，则发光二极管封装构造将存在过热烧毁的潜在风险。
故，确实有必要对背光模块的发光二极管提供一种发光源散热构造，以解决现有技术所存在的散热问题。
 技术问题
本发明的目的是提供一种发光源散热构造，即对发光二极管提供一种发光源散热构造，以解决现有技术所存在的散热问题。
本发明的主要目的在于提供一种发光源散热构造，包含至少一载板、至少一发光二极管封装构造及一散热座，所述至少一发光二极管封装构造电性连接于所述至少一载板，所述散热座具有一第一承载面及至少一第二承载面，其中所述至少一发光二极管封装构造热性接触于所述散热座的所述第一承载面，且所述至少一载板分别设置于所述散热座的所述至少一第二承载面上，故有利于所述至少一发光二极管封装构造借助所述散热座的良好传导散热特性直接进行传导散热，进而能相对提升所述至少一发光二极管封装构造的散热效率及使用寿命。
本发明的次要目的在于提供一种发光源散热构造，其中所述至少一发光二极管封装构造、所述至少一载板及所述散热座相互接触结合，因此所述散热座借助所述第一承载面及所述至少一第二承载面分别与所述至少一发光二极管封装构造的一底面及所述至少一载板的一下表面直接接触，而不必再间接借助一铝型材，不但可减少组装流程还可缩短工时，有助于降低组装不良的机率。
本发明的另一目的在于提供一种发光源散热构造，包含至少一灯条及一散热座，所述至少一灯条各包含至少一发光二极管封装构造及至少一载板，其中所述散热座具有一第一承载面及至少一凹槽状的第二承载面，所述至少一灯条的所述至少一发光二极管封装构造与所述散热座的所述第一承载面贴合，且所述至少一灯条的所述至少一载板分别容置于所述散热座的所述至少一凹槽状的第二承载面内，因而所述至少一发光二极管封装构造及所述至少一载板与所述散热座直接热性接触，故有利于所述至少一发光二极管封装构造及所述至少一载板借助所述散热座的良好传导散热特性进行直接传导散热，进而能相对提升所述至少一发光二极管封装构造的散热效率及使用寿命。
 技术解决方案
为达成本发明的前述目的，本发明提供一种发光源散热构造，包含：至少一灯条，各包含：至少一发光二极管封装构造，各具至少二引脚，设于所述发光二极管封装构造的至少二侧；及至少一载板，与所述发光二极管封装构造的所述至少二引脚电性连接；以及一散热座，具有一第一承载面及至少一第二承载面至少二第二承载面；其中所述灯条的发光二极管封装构造热性接触于所述散热座的第一承载面，且所述灯条的所述至少一载板分别容置于所述散热座的第二承载面上。
再者，本发明提供另一种发光源散热构造，其特征在于：所述发光源散热构造包含：至少一载板；至少一发光二极管封装构造，电性连接于所述至少一载板；及一散热座，具有一第一承载面及至少一第二承载面；其中所述发光二极管封装构造热性接触于所述散热座的第一承载面，且所述至少一载板分别设置于所述散热座的第二承载面上。
另外，本发明还提供另一种发光源散热构造的背光模块，其特征在于：所述背光模块包含一发光源散热构造：其包含：至少一载板；至少一发光二极管封装构造，电性连接于所述至少一载板；及一散热座，具有一第一承载面及至少一第二承载面；其中所述发光二极管封装构造热性接触于所述散热座的第一承载面，且所述至少一载板分别设置于所述散热座的第二承载面上。
在本发明的一实施例中，所述第二承载面的高度低于所述第一承载面的高度。
在本发明的一实施例中，所述散热座的第二承载面是呈凹槽状。
在本发明的一实施例中，所述至少一发光二极管封装构造各另包含至少一发光二极管芯片。
在本发明的一实施例中，所述至少一载板是一印刷电路板，所述至少一载板的一上表面的高度等于所述第一承载面的高度。
在本发明的一实施例中，所述散热座具有至少二所述第二承载面，所述至少一发光二极管封装构造包含至少二引脚，设于所述发光二极管封装构造的至少二侧，分别与至少二个所述载板电性连接。
在本发明的一实施例中，所述散热座是散热铝挤。
与现有技术相比较，本发明的发光源散热构造的所述散热座可同时与至少一发光二极管封装构造及所述至少一载板直接结合，而不必再借助一铝型材，将所述至少一发光二极管封装构造、所述至少一载板及所述散热座直接相互结合及热性接触，有利于所述至少一发光二极管封装构造及所述至少一载板借助所述散热座的良好传导散热特性进行直接传导散热，故能相对提升所述至少一发光二极管封装构造的散热效率及使用寿命。
 有益效果
本发明的发光源散热构造的所述散热座可同时与至少一发光二极管封装构造及所述至少一载板直接结合，而不必再借助一铝型材，将所述至少一发光二极管封装构造、所述至少一载板及所述散热座直接相互结合及热性接触，有利于所述至少一发光二极管封装构造及所述至少一载板借助所述散热座的良好传导散热特性进行直接传导散热，故能相对提升所述至少一发光二极管封装构造的散热效率及使用寿命。
 附图说明
图1A是本发明第一实施例的发光源散热构造的示意图。
图1B是本发明第一实施例的发光源散热构造的侧视图。
图2是本发明第二实施例的发光源散热构造的侧视图。
图3是本发明第三实施例的发光源散热构造的侧视图。
 本发明的最佳实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明如下。再者，本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1A所示，其揭示本发明第一实施例的发光源散热构造10的示意图，其中本发明第一实施例的发光源散热构造10主要应用在照明领域或液晶显示器领域，特别是液晶显示器的背光模块领域。所述发光源散热构造10主要包含至少一灯条11及一散热座12，本发明将于下文详细说明上述各组件。
请参照图1B所示，其揭示本发明第一实施例图1A的发光源散热构造10的侧视图。本发明第一实施例的发光源散热构造10是一侧入式背光模块的发光源散热构造，且所述至少一灯条11是一发光二极管的灯条。所述至少一灯条11可以组装在一背光模块的光学膜片的至少一侧边，用以作为侧入式背光模块的背光源，但并不限于此，例如所述至少一灯条11可以组装在一背光模块的一光学膜片的正下方，用以作为直下式背光模块的背光源。再者，所述至少一灯条11各包含至少一发光二极管封装构造111及一载板112，所述至少一发光二极管封装构造111各具有一底面1111、至少二引脚1112及一热沉1113，所述载板112具有一上表面1121及一下表面1122。所述载板112的所述上表面1121与所述至少一发光二极管封装构造111的所述至少二引脚1112电性连接，且所述发光二极管封装构造111是指一完整的发光二极管封装体，其本身由上而下依序包含一封装胶体、至少一发光二极管芯片、所述热沉1113及一导线架或电路基板，其中所述导线架或电路基板并设有所述至少二引脚1112，所述至少二引脚1112自所述发光二极管封装构造111露出，用以与所述载板112的所述上表面1121的电路（未绘示）电性连接，使所述发光二极管封装构造111通过所述载板112导入外部电源，以产生特定颜色的光。
请再参照图1B，本发明第一实施例的所述散热座12具有一第一承载面121及一第二承载面122，其中，所述第二承载面122的高度可以低于所述第一承载面121的高度，以使所述载板112设置于所述散热座12的所述第二承载面122上时，所述载板112的上表面1121的高度等于所述第一承载面121的高度，且所述载板112的所述下表面1122直接贴合于所述第二承载面122，也就是呈平齐排列关系。再者，所述至少一发光二极管封装构造111的所述热沉1113自所述底面1111露出，且所述底面1111是固定地贴合在所述散热座12的所述第一承载面121上，使所述热沉1113与所述散热座12直接热性接触，以提高所述至少一发光二极管封装构造111的热传导率。所述散热座12是由散热效率良好导热性材料所制成，例如各种金属或合金，特别是利用铝、铝合金或含有铝材料所制成的金属散热板、散热铝挤或合金散热板，有利于所述至少一发光二极管封装构造111的所述热沉1113及所述载板112与所述散热座12直接热性接触，以借助所述散热座12的良好传导散热特性进行传导散热，故有助于提高所述发光源散热构造10的散热效率，以达到快速降温的目标。必要时，所述至少一发光二极管封装构造111的所述底面1111及所述热沉1113与所述散热座12的所述第一承载面121直接接触的部分更可涂上适量的导热胶（未绘示），使所述至少一发光二极管封装构造111的所述热沉1113与所述散热座12之间有更佳的传导散热效率。
请再参照图1B所示，本发明第一实施例的所述载板112是设置在所述散热座12的所述第二承载面122上，所述至少一发光二极管封装构造111同时借助所述底面1111及所述热沉1113与所述散热座12的所述第一承载面121贴合，并借助所述至少二引脚1112与所述载板112的所述上表面1121电性连接。其中当所述载板112设置在所述散热座12的所述第二承载面122上时，所述载板112的所述上表面1121可与所述散热座12的所述第一承载面121等高平齐，但并不限于此，且所述载板112可以是印刷电路板、阳极氧化铝基板或其他能设置表面电路图案的基板。
请依序参照图2及3所示，本发明第二至三较佳实施例相似于本发明第一实施例的发光源散热构造10，并大致沿用相同组件名称及图号，但第二至三较佳实施例的差异特征在于：所述第二至三较佳实施例的发光源散热构造20、30进一步对所述散热座12进行改良，本发明将于下文详细说明。
请参照图2所示，图2揭示本发明第二较佳实施例的所述发光源散热构造20的侧视图。在本发明第二实施例中，所述发光源散热构造20主要包含至少一灯条11及一散热座12。第二实施例的差异特征在于：所述散热座12具有多个第二承载面122，且所述至少一灯条11各包含多个载板112，其中所述多个载板112分别设置于所述散热座12的所述多个第二承载面122上，例如具有二个载板112及二个第二承载面122。再者，所述至少一发光二极管封装构造111的所述至少二引脚1112设于所述发光二极管封装构造111的至少二侧，分别与所述多个载板112电性连接，因此所述至少一发光二极管封装构造111的所述热沉1113及所述多个载板112与所述散热座12直接接触，以借助所述散热座12的良好传导散热特性进行直接传导散热。
请参照图3所示，图3揭示本发明第三较佳实施例的所述发光源散热构造30的侧视图。在本发明第三实施例中，所述发光源散热构造30主要包含至少一灯条11及一散热座12。第三实施例的差异特征在于：所述散热座12具有至少一凹槽状的第二承载面123，所述凹槽状的第二承载面123的高度低于所述第一承载面121的高度，且所述至少一灯条11各包含至少一载板112，其中所述至少一载板112分别容置于所述散热座12的所述至少一凹槽状的第二承载面123内，而所述至少一发光二极管封装构造111的所述至少二引脚1112同时与所述至少一载板112电性连接，因此所述至少一发光二极管封装构造111的所述热沉1113及所述至少一载板112与所述散热座12直接热性接触，以借助所述散热座12的良好传导散热特性进行直接传导散热。
如图1B、2及3所示，本发明第一、第二及第三实施例上述特征的优点在于：所述至少一发光二极管封装构造111、所述至少一载板112及所述散热座12相互结合，其中所述散热座12直接承载及热性接触所述至少一发光二极管封装构造111的所述底面1111及所述热沉1113以及所述至少一载板112，故有利于所述至少一发光二极管封装构造111的所述热沉1113及所述至少一载板112借助所述散热座12的良好传导散热特性进行直接传导散热，进而能相对提升所述至少一发光二极管封装构造111的散热效率及使用寿命。再者，所述至少一发光二极管封装构造111的所述至少二引脚1112直接与所述至少一载板112电性连接，且所述热沉1113直接与所述散热座12热性接触贴合，因而不必再借助一铝型材，不但可简化构造及组装流程，还可缩短工时，故有助于降低组装不良的机率。另外，所述散热座12的所述第一承载面121及所述至少一第二承载面122或至少一凹槽状的第二承载面123是一体成形，取代了现有的所述铝型材，也可节省组件成本，故有助于降低所述发光源散热构造10、20、30的生产时间及整体成本并提高组装良率，以达到产品低成本的目标。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反的，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
 本发明的实施方式
工业实用性
序列表自由内容

Claims (17)

  1. 一种发光源散热构造，其特征在于：所述发光源散热构造包含：
    至少一灯条，各包含：
    至少一发光二极管封装构造，各具至少二引脚，设于所述发光二极管封装构造的至少二侧；及
    至少一载板，与所述发光二极管封装构造的所述至少二引脚电性连接；以及
    一散热座，具有一第一承载面及至少二第二承载面；
    其中所述灯条的发光二极管封装构造热性接触于所述散热座的第一承载面，且所述灯条的所述至少一载板分别容置于所述散热座的第二承载面上。
  2. 如权利要求1所述的发光源散热构造，其特征在于：所述第二承载面的高度低于所述第一承载面的高度。
  3. 如权利要求2所述的发光源散热构造，其特征在于：所述散热座的第二承载面是呈凹槽状。
  4. 如权利要求2所述的发光源散热构造，其特征在于：所述至少一载板是一印刷电路板，且所述至少一载板的一上表面的高度等于所述第一承载面的高度。
  5. 如权利要求1所述的发光源散热构造，其特征在于：所述散热座是散热铝挤。
  6. 一种发光源散热构造，其特征在于：所述发光源散热构造包含：
    至少一载板；
    至少一发光二极管封装构造，电性连接于所述至少一载板；及
    一散热座，具有一第一承载面及至少一第二承载面；
    其中所述发光二极管封装构造热性接触于所述散热座的第一承载面，且所述至少一载板分别设置于所述散热座的第二承载面上。
  7. 如权利要求6所述的发光源散热构造，其特征在于：所述第二承载面的高度低于所述第一承载面的高度。
  8. 如权利要求7所述的发光源散热构造，其特征在于：所述散热座的第二承载面是呈凹槽状。
  9. 如权利要求7所述的发光源散热构造，其特征在于：所述至少一载板是一印刷电路板，且所述至少一载板的一上表面的高度等于所述第一承载面的高度。
  10. 如权利要求7所述的发光源散热构造，其特征在于：所述散热座具有至少二所述第二承载面，所述至少一发光二极管封装构造包含至少二引脚，设于所述发光二极管封装构造的至少二侧，分别与至少二个所述载板电性连接。
  11. 如权利要求6所述的发光源散热构造，其特征在于：所述散热座是散热铝挤。
  12. 一种发光源散热构造的背光模块，其特征在于：所述背光模块包含一发光源散热构造：其包含：
    至少一载板；
    至少一发光二极管封装构造，电性连接于所述至少一载板；及
    一散热座，具有一第一承载面及至少一第二承载面；
    其中所述发光二极管封装构造热性接触于所述散热座的第一承载面，且所述至少一载板分别设置于所述散热座的第二承载面上。
  13. 如权利要求12所述的发光源散热构造的背光模块，其特征在于：所述第二承载面的高度低于所述第一承载面的高度。
  14. 如权利要求13所述的发光源散热构造的背光模块，其特征在于：所述散热座的第二承载面是呈凹槽状。
  15. 如权利要求13所述的发光源散热构造的背光模块，其特征在于：所述至少一载板是一印刷电路板，且所述至少一载板的一上表面的高度等于所述第一承载面的高度。
  16. 如权利要求13所述的发光源散热构造的背光模块，其特征在于：所述散热座具有至少二所述第二承载面，所述至少一发光二极管封装构造包含至少二引脚，设于所述发光二极管封装构造的至少二侧，分别与至少二个所述载板电性连接。
  17. 如权利要求12所述的发光源散热构造的背光模块，其特征在于：所述散热座是散热铝挤。
PCT/CN2010/079485 2010-11-01 2010-12-06 发光源散热构造及背光模块 WO2012058837A1 (zh)

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