WO2012056968A1 - Illumination device, and liquid crystal display device - Google Patents

Illumination device, and liquid crystal display device Download PDF

Info

Publication number
WO2012056968A1
WO2012056968A1 PCT/JP2011/074040 JP2011074040W WO2012056968A1 WO 2012056968 A1 WO2012056968 A1 WO 2012056968A1 JP 2011074040 W JP2011074040 W JP 2011074040W WO 2012056968 A1 WO2012056968 A1 WO 2012056968A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat radiating
heat
plate
lighting device
substrate
Prior art date
Application number
PCT/JP2011/074040
Other languages
French (fr)
Japanese (ja)
Inventor
達朗 黒田
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012056968A1 publication Critical patent/WO2012056968A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/13332—Front frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements

Definitions

  • the present invention relates to a lighting device and a liquid crystal display device. More specifically, the present invention relates to a lighting device and a liquid crystal display device that suppress deterioration in performance and lifetime due to heat generation of a light emitting diode element.
  • the illumination device is a device that emits light, and is used in a display device using a non-self-luminous display element. For example, it is used in a liquid crystal display device using a liquid crystal display element. Since the liquid crystal display element is a non-self-luminous display element, in the liquid crystal display device, it is necessary to irradiate the liquid crystal display element with illumination light from a lighting device (backlight). Such a liquid crystal display device is indispensable as a means for displaying information and images. For example, in recent years, portable information terminals represented by cellular phones and PDAs (Personal Digital Assistants). Devices are widely used, and liquid crystal panels having advantages such as thinness, light weight, and low power consumption are used as display panels.
  • a cold cathode tube In a backlight used in a conventional liquid crystal display device, a cold cathode tube has been used as a light source.
  • a light emitting diode hereinafter, “LED "or” LED element ”
  • FIG. 14 is a schematic cross-sectional view of an LED backlight according to Patent Document 1.
  • the LED light source 110 is provided on the wiring board 115, and a first heat radiator 122 is arranged on the back surface of the wiring board 115, Is provided with a second radiator 123.
  • the first radiator 122 and the second radiator 123 are arranged so as to contact the frame 124. Thereby, the heat generated from the LED light source 110 is efficiently transmitted to the radiators 122, 123 and the frame 124. As a result, the heat from the LED element can be efficiently radiated outside the LED backlight.
  • the present invention has been made in view of the above-described present situation, efficiently dissipating heat generated from an LED element, and a lighting device that suppresses deterioration of the life characteristics and emission efficiency of the LED element and a liquid crystal including the same.
  • the object is to provide a display device.
  • FIG. 15 is a schematic cross-sectional view of a lighting device including a conventional heat radiating plate (heat radiating body).
  • the heat radiating plate 112 heat radiating body
  • the heat radiating plate 112 is produced, for example, by cutting a metal plate having a high thermal conductivity.
  • a protrusion called a burr at the end of the heat radiating plate 112 is used. (Hereinafter also referred to as the protrusion 114).
  • the heat radiating plate 112 and the LED substrate fixing plate 113 cannot be sufficiently contacted, and a space is generated between the heat radiating plate 112 and the LED substrate fixing plate 113.
  • the heat from the LED element 110 transmitted to the heat radiating plate 112 is not sufficiently conducted to the frame, and the heat is not sufficiently released outside the lighting device.
  • the present inventor has found that the space generated between the heat radiating plate and the LED substrate fixing plate significantly reduces the heat conduction efficiency, and has further studied earnestly, in order to reliably remove the protrusions generated on the heat radiating plate. Then, the inventors came up with chamfering the end of the heat sink.
  • the heat radiating plate and the LED substrate fixing plate can be reliably and sufficiently brought into contact with each other, so that the heat generated from the LED element is efficiently released to the outside of the lighting device, and the life characteristics of the LED element are deteriorated and the light emission efficiency is lowered.
  • the present inventors have arrived at the present invention.
  • one aspect of the present invention is a lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate, and the substrate is attached to one surface of the heat radiating plate.
  • the heat radiating plate has a cutout portion with a chamfered end portion of the surface opposite to the surface on which the substrate is mounted, and the surface on the opposite side of the surface on which the substrate is mounted on the heat radiating plate.
  • the substrate fixing plate is also referred to as a first form.
  • the notch may be formed on a part of the surface of the heat radiating plate to be joined to the substrate fixing plate, or may be formed on the entire outer periphery. Moreover, the notch part may be formed also in surfaces other than the surface by which the board
  • the configuration of the lighting device of the first embodiment is not particularly limited by other components as long as such components are formed as essential.
  • the notch has a surface with an angle different from a joint surface of the heat radiating plate with the substrate fixing plate. According to this, since the heat radiating plate and the substrate fixing plate can be sufficiently brought into contact with each other, the heat generated from the light emitting element (for example, the LED element) is efficiently released outside the lighting device, and the life characteristics of the light emitting element are improved. Deterioration and reduction in luminous efficiency can be more reliably suppressed.
  • the light emitting element for example, the LED element
  • the cutout portion may have a stepped shape or a rounded shape. Even if it is these shapes, a heat sink and a board
  • the present inventor has found that the above problem can also be solved by arranging a heat radiating sheet between the heat radiating plate and the substrate fixing plate.
  • another aspect of the present invention is a lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate, and the substrate is attached to one surface of the heat radiating plate.
  • the lighting device further includes a heat radiating sheet disposed between the heat radiating plate and the substrate fixing plate, and joined to both the heat radiating plate and the substrate fixing plate.
  • the joint surface with the sheet is also a lighting device that is at least partially raised or depressed.
  • this form is also referred to as a second form.
  • the bonding surface of the heat radiating plate with the heat radiating sheet is raised or depressed, the adhesion between the heat radiating plate and the heat radiating sheet is improved and the bonding area is increased. And the substrate fixing plate can be sufficiently ensured, the heat generated from the light emitting element can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the light emitting element can be suppressed.
  • the configuration of the illumination device of the second embodiment is not particularly limited by other components as long as such components are formed as essential.
  • the degree of the bulge or depression of the joint surface of the heat radiating plate with the heat radiating sheet is larger toward the center of the joint surface.
  • the adhesion between the heat radiating plate and the heat radiating sheet is further improved, and the contact area between the heat radiating plate and the heat radiating sheet is further increased, so that the heat transmitted to the heat radiating plate can be more efficiently transmitted to the heat radiating sheet. . Therefore, the heat generated from the light emitting element can be efficiently released outside the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the light emitting element can be further suppressed.
  • the joint surface with the said heat radiating sheet of the said heat sink has several convex shape or concave shape.
  • the contact area between the heat sink and the heat sink increases further, and the heat transmitted to the heat sink can be more efficiently transferred to the heat sink. It emits well, and it is possible to further suppress the deterioration of the life characteristics of the light-emitting element and the reduction of the light emission efficiency.
  • the Asker C hardness of the said heat radiating sheet is 30 degree
  • the Asker C hardness is less than 30 degrees, the heat radiating sheet becomes too soft, so that it may be difficult to appropriately form the heat radiating sheet, and durability may be insufficient.
  • the heat dissipation sheet preferably has an Asker C hardness of 60 degrees or less. If the Asker C hardness is greater than 60 degrees, the adhesion between the heat dissipation sheet and the heat dissipation plate may be reduced, and the thermal conductivity between the heat dissipation plate and the substrate fixing plate may be reduced.
  • the adhesion between the heat dissipation sheet and the heat dissipation plate can be dramatically improved.
  • the heat dissipation sheet and the heat dissipation plate are sufficiently adhered, and the thermal conductivity between the heat dissipation plate and the substrate fixing plate is sufficient. Can be secured.
  • the Asker C hardness can be measured by an Asker C hardness meter (durometer (spring type hardness meter) defined in SRIS0101 (Japan Rubber Association Standard)).
  • the heat radiating sheet is disposed between the heat radiating plate and the substrate fixing plate.
  • the present inventor has conducted a study between the heat radiating plate and the substrate fixing plate.
  • the present inventors have found that the above problem can be solved also by disposing a heat radiating sheet between the support member that supports the member constituting the lighting device and the substrate fixing plate.
  • still another aspect of the present invention is a lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate, and the substrate is disposed on one surface of the heat radiating plate.
  • the board fixing plate is attached, and has a heat sink fixing surface to which a heat sink is attached, and a support member fixing surface attached to a support member that supports a member constituting the lighting device, and the lighting device further includes: A first heat dissipating sheet disposed between the heat dissipating plate and the heat dissipating plate fixing surface and joined to both the heat dissipating plate and the heat dissipating plate fixing surface; and the support member and the support member fixing surface.
  • this form is also referred to as a third form.
  • the configuration of the illumination device of the third embodiment is not particularly limited by other components as long as such components are formed as essential.
  • the first and second heat radiating sheets are integrally formed. This makes it possible to reduce the number of members and simplify the process of arranging the heat dissipation sheet, rather than arranging the first and second heat dissipation sheets separately.
  • the Asker C hardness of the said heat radiating sheet is 30 degree
  • the Asker C hardness is less than 30 degrees, the heat radiating sheet becomes too soft, so that it may be difficult to appropriately form the heat radiating sheet, and durability may be insufficient.
  • the Asker C hardness of the said heat radiating sheet is 60 degrees or less. If the Asker C hardness is greater than 60 degrees, the adhesion between the heat dissipation sheet and the heat dissipation plate may be reduced, and the thermal conductivity between the heat dissipation plate and the substrate fixing plate may be reduced.
  • the adhesion between the heat dissipation sheet and the heat dissipation plate can be dramatically improved.
  • the heat sink has a protrusion
  • the heat dissipation sheet and the heat sink are sufficiently adhered, and the heat conductivity between the heat sink and the substrate fixing plate is sufficient.
  • a protrusion may occur on the contact surface of the substrate fixing plate with the support member, as in the case of the heat radiating plate. Even in such a case, by arranging a heat radiating sheet rich in flexibility, The thermal conductivity between the substrate fixing plate and the support member can be sufficiently ensured.
  • Still another aspect of the present invention is a liquid crystal display device including a liquid crystal sealed between a pair of substrates arranged to face each other, and also a liquid crystal display device including the illumination device according to the present invention.
  • the heat sink and the substrate fixing plate can be sufficiently brought into contact with each other, and the heat generated from the light emitting element can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics of the light emitting element and the reduction of the light emitting efficiency can be suppressed.
  • the configuration of the liquid crystal display device is not particularly limited by other components as long as such components are essential.
  • the heat radiating plate and the substrate fixing plate can be sufficiently brought into contact with each other, and the heat generated from the LED element can be efficiently released to the outside of the lighting device, thereby deteriorating the life characteristics of the LED element and lowering the light emission efficiency. Can be obtained.
  • FIG. 1 is a schematic plan view of a liquid crystal display device according to Embodiment 1.
  • FIG. FIG. 2 is a schematic cross-sectional view of the liquid crystal display device taken along line A1-A2 shown in FIG. It is a cross-sectional schematic diagram of the structure of the heat sink with which the liquid crystal display device which concerns on Embodiment 1 is provided, and its periphery. It is a cross-sectional schematic diagram of the heat sink which concerns on the 1st modification of Embodiment 1, and its surrounding structure. It is a cross-sectional schematic diagram of the heat sink which concerns on the 2nd modification of Embodiment 1, and its surrounding structure.
  • FIG. 6 is a schematic plan view of a heat sink according to a first modification of Embodiment 2.
  • FIG. 10 is a schematic cross-sectional view of a heat sink according to a second modification of the second embodiment.
  • 6 is a schematic cross-sectional view of a heat sink according to a third modification of Embodiment 2.
  • FIG. 6 is a schematic cross-sectional view of a heat sink according to a fourth modification of Embodiment 2.
  • FIG. 1 It is a cross-sectional schematic diagram of the heat dissipation sheet with which the liquid crystal display device which concerns on Embodiment 3 is provided, and its periphery structure. It is a cross-sectional schematic diagram of the structure of the thermal radiation sheet concerning the 1st modification of Embodiment 3, and its periphery. It is a cross-sectional schematic diagram of the LED backlight which concerns on patent document 1.
  • FIG. It is a cross-sectional schematic diagram of the illuminating device provided with the conventional heat sink (heat radiator).
  • FIG. 1 is a schematic plan view of the liquid crystal display device according to Embodiment 1
  • FIG. 2 is a schematic cross-sectional view of the liquid crystal display device taken along line A1-A2 shown in FIG.
  • the illuminating device of Embodiment 1 includes a light guide plate 5, an optical sheet 6, a plurality of LED elements (light emitting elements) 10, an LED substrate 11, a heat radiating plate 12, an LED substrate fixing plate 13, screws 14, and screws 15.
  • the liquid crystal display device according to the first embodiment includes the lighting device, the support member 16, and the liquid crystal panel 30.
  • the plurality of LED elements 10 are mounted on an LED substrate 11, and a heat radiating plate 12 is attached to the back side of the LED substrate 11.
  • the LED board 11 includes a power connector 17 that connects wiring for connecting to a power source.
  • the LED board fixing plate 13, the heat radiating plate 12, and the LED board 11 are fixed by screws 14.
  • the LED substrate fixing plate 13 has two surfaces that are perpendicular to each other, and one of the two surfaces (hereinafter, also referred to as a heat dissipation plate fixing surface) and the heat dissipation plate 12 are joined.
  • the other surface (hereinafter also referred to as a support member fixing surface) is fixed to the support member 16 with screws 15.
  • the light guide plate 5 is mounted on the support member 16 so that the light incident surface is disposed at a position facing the plurality of LED elements 10.
  • An optical sheet 6 is disposed on the upper surface of the light exit surface of the light guide plate 5. Further, the liquid crystal panel 30 is attached on the optical sheet 6.
  • the LED element 10 that is a light source
  • a white LED element may be used, or LED elements of three colors of red, green, and blue may be appropriately combined and used.
  • the light guide plate 5 is a member that takes in light emitted from the LED element 10 as a light source from a light incident surface and emits light substantially uniformly from a light output surface having a larger area than the light incident surface. Light incident on the light incident surface of the light guide plate 5 repeats surface reflection in the light guide plate 5 and spreads in the light guide plate 5. When light hits a reflective dot (not shown) provided on the light guide plate 5, the light is scattered there and emitted from the light exit surface of the light guide plate.
  • the LED board 11 is a printed wiring board for fixing and wiring the LED element 10.
  • the heat radiating plate 12 is a member for radiating the heat generated from the LED element 10 and is made of a material having high thermal conductivity, for example, a metal material such as aluminum, copper, silver, or an alloy thereof, or aluminum nitride. Formed from a ceramic material.
  • the optical sheet 6 is a member for suppressing the occurrence of large luminance unevenness and color unevenness by mixing light traveling at different angles and reorienting the angle at the same point in the plane.
  • FIG. 3 is a schematic cross-sectional view of the heat sink and the surrounding structure provided in the liquid crystal display device according to the first embodiment.
  • region of the vicinity are scraped off, and it differs from the joint surface with the LED board fixing plate of a heat sink.
  • a notch 50 that is an angled surface is formed.
  • the edge of the surface and the area in the vicinity thereof are areas where protrusions are likely to occur when the metal plate is cut and the heat radiating plate 12 is formed.
  • spaces are generated by the protrusions. Can be effectively prevented, and a sufficient contact area between the radiator plate 12 and the LED substrate fixing plate 13 can be secured.
  • the heat sink 12 and the LED substrate fixing plate 13 can be sufficiently brought into contact with each other, and the LED element.
  • the heat generated from 10 can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the LED element 12 can be more reliably suppressed.
  • FIG. 4 is a schematic cross-sectional view of the heat sink according to the first modification of the first embodiment and the surrounding structure
  • FIG. 5 is a view of the heat sink according to the second modification of the first embodiment and the surrounding structure. It is a cross-sectional schematic diagram.
  • the notch 51 may have a stepped shape. Further, as shown in FIG. 5, the cutout portion 52 may have a rounded shape by fillet processing. Also in these modified examples, the same effect as in the first embodiment can be obtained.
  • Embodiment 2 In the first embodiment, one surface of the heat radiating plate and the heat radiating plate fixing surface of the LED substrate fixing plate are in direct contact, but in the second embodiment, one surface of the radiating plate and the heat radiating of the LED substrate fixing plate.
  • a heat radiating sheet is arranged between the plate fixing surfaces.
  • FIG. 6 is a schematic cross-sectional view of the heat sink and the surrounding structure provided in the liquid crystal display device according to the second embodiment.
  • a heat radiating sheet 60 is disposed between the heat radiating plate 12 and the heat radiating plate fixing surface 11 of the LED substrate fixing plate 13, and the heat radiating plate 12, the heat radiating sheet 60, and The LED substrate fixing plate 13 is bonded in this order and joined together.
  • the joint surface with the heat radiating sheet 60 of the heat sink 12 has protruded, and the degree of the protrusion of the joint surface becomes larger toward the center of the joint surface.
  • the heat radiating sheet 60 is preferably flexible (Asker C hardness 30 to 60 degrees) and high in thermal conductivity, and specifically, is preferably formed from silicone rubber, acrylic, or the like. Since the heat dissipation sheet is rich in flexibility, the adhesion between the heat dissipation sheet 60 and the heat dissipation plate 12 can be dramatically improved. Moreover, even if it is a heat sink which has a projection part (toothed) at the front-end
  • the heat conductivity between the heat radiating plate 12 and the substrate fixing plate 13 is sufficiently ensured through the heat radiating sheet 60. Therefore, the heat generated from the LED element 10 can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics of the LED element 10 and the decrease of the light emission efficiency can be suppressed.
  • the surface joined to the heat radiating sheet 60 of the heat radiating plate 12 is raised toward the center, the contact area between the heat radiating plate 12 and the heat radiating sheet 60 is increased, and the heat transmitted to the heat radiating plate 12 is dissipated. The sheet 60 can be efficiently transmitted. Therefore, the heat generated from the LED element 10 can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics of the LED element 12 and the decrease in the light emission efficiency can be suppressed.
  • FIG. 7 is a schematic cross-sectional view of the heat dissipation sheet according to the first modification of the second embodiment and the surrounding structure
  • FIG. 8 is a schematic plan view of the heat dissipation plate according to the first modification of the second embodiment.
  • . 9 is a schematic cross-sectional view of a heat dissipation plate according to a second modification of the second embodiment
  • FIG. 10 is a schematic cross-sectional view of a heat dissipation plate according to the third modification of the second embodiment.
  • the heat dissipation sheet 60 and the joint surface of the heat dissipation plate 12 have a plurality of convex shapes.
  • the heat transmitted from a heat sink can be more efficiently transmitted to a heat sink sheet.
  • the heat generated from the LED element can be more efficiently released to the outside of the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the LED element can be further suppressed.
  • the plurality of convex shapes are preferably formed so as to be arranged almost evenly on the surface of the heat radiating plate 12 joined to the heat radiating sheet.
  • the plurality of convex shapes may be formed so as to be evenly arranged on the surface.
  • the heat radiating plate 12 has a joint surface with the heat radiating sheet 60 raised toward the center, and is raised by, for example, grating processing.
  • a groove may be formed in a part of the portion.
  • the heat radiating plate 12 may have a joint surface with the heat radiating sheet 60 recessed toward the center.
  • a groove may be formed in a part of the plane by grating processing.
  • Embodiment 3 In the second embodiment, the heat radiating sheet is arranged between the heat radiating plate and the heat radiating plate fixing surface of the LED substrate fixing plate. However, in the third embodiment, the supporting member fixing surface and the supporting member of the LED substrate fixing plate are further supported. A heat dissipation sheet is also arranged between the members.
  • FIG. 12 is a schematic cross-sectional view of the heat dissipation sheet and the surrounding structure included in the liquid crystal display device according to Embodiment 3
  • FIG. 13 is a cross-sectional view of the heat dissipation sheet according to the first modification of Embodiment 3 and the surrounding structure. It is a schematic diagram.
  • a heat radiating sheet 61 (first heat radiating sheet) is disposed between the heat radiating plate 12 and the heat radiating plate fixing surface of the LED substrate fixing plate 13, and the heat radiating plate 12, the heat radiating sheet 61, and the LED The substrate fixing plate 13 is joined in this order.
  • a heat radiation sheet 61 (second heat radiation sheet) is also disposed between the support member (not shown) and the support member fixing surface of the LED board fixing plate 13, so that the support member, the heat dissipation The sheet 61 and the LED board fixing plate 13 are joined in this order.
  • the heat radiation sheet 61 affixed on the heat sink fixing surface and the support member fixing surface is integrally formed.
  • the heat transmitted to the heat dissipation sheet can be efficiently transmitted to the substrate fixing plate and further to the support member, and the heat generated from the LED element can be further efficiently released to the outside of the lighting device, and the lifetime of the LED element It is possible to further suppress deterioration of characteristics and a decrease in light emission efficiency.
  • the same heat dissipation sheet 61 (first heat dissipation sheet and second heat dissipation sheet) may be arranged on the heat sink fixing surface and the support member fixing surface using two heat dissipation sheets.
  • positioning the heat radiation sheet 61 reduces the number of members, and arrange
  • the heat dissipating sheet 61 is preferably flexible (Asker C hardness 30 to 60 degrees) and high in thermal conductivity. Specifically, the heat dissipating sheet 61 is preferably made of silicone rubber, acrylic or the like. Since the heat radiating sheet 61 is rich in flexibility, the adhesion between the heat radiating sheet 61 and the heat radiating plate 12 can be dramatically improved. Further, even if the protrusion of the radiator plate 12 has a protrusion (notch), by burying the protrusion in the radiator sheet 61, the radiator sheet 61 and the radiator plate 12 are sufficiently brought into close contact with each other. The thermal conductivity between the LED substrate fixing plates 13 can be sufficiently ensured.
  • the LED substrate fixing plate 13 can be provided by arranging the heat radiating sheet 61 having a high flexibility. And sufficient heat conductivity between the support member 16 can be secured.
  • Embodiment 3 for example, as shown in FIG. 13, the joint surface of the heat radiating plate 12 with the heat radiating sheet 61 is raised, and the degree of bulging of the joint surface is toward the center of the joint surface.
  • the features of the second embodiment can be appropriately incorporated into the third embodiment.
  • liquid crystal display device 5 light guide plate 6: optical sheet 10: LED element 11: LED substrate 12, 112: heat dissipation plate 13, 113: LED substrate fixing plate 14, 15: screw 16: support member 17: power connector 30: Liquid crystal panel 50, 51, 52: Notch 60, 61: Heat radiation sheet 110: LED light source 114: Protrusion (burr) 115: Wiring board 122: First radiator 123: Second radiator 124: Frame

Abstract

The present invention provides an illumination device which efficiently releases the heat generated from an LED element and prevents the life property of the LED element from deteriorating and the luminance efficiency from dropping; and a liquid crystal display device provided with said illumination device. The illumination device of the present invention is provided with: a substrate attached with a light-emitting element; a heat-releasing plate; and a substrate locking plate. The substrate is attached to one of the surfaces of the heat-releasing plate, the heat-releasing plate has a chamfered notch on the edge of the surface on the opposite side of the surface to which the substrate is attached, and the surface of the heat-releasing plate on the opposite side of the surface to which the substrate is attached is joined to the substrate locking plate.

Description

照明装置、及び、液晶表示装置Illumination device and liquid crystal display device
本発明は、照明装置、及び、液晶表示装置に関する。より詳しくは、発光ダイオード素子の発熱に起因する性能の低下及び寿命の悪化を抑制する照明装置、及び、液晶表示装置に関する。 The present invention relates to a lighting device and a liquid crystal display device. More specifically, the present invention relates to a lighting device and a liquid crystal display device that suppress deterioration in performance and lifetime due to heat generation of a light emitting diode element.
照明装置は、光を照射する装置であり、非自発光型表示素子を用いる表示装置等において用いられる。例えば、液晶表示素子を用いた液晶表示装置において用いられる。液晶表示素子は非自発光型表示素子であるため、液晶表示装置においては、照明装置（バックライト）から照明光を液晶表示素子に対して照射することが必要となる。このような液晶表示装置は、情報や映像の表示手段として欠かすことができないものとなっており、例えば、近年、携帯電話やＰＤＡ（Personal Digital Assistants；個人用情報端末）に代表される携帯情報端末機器が広く利用され、その表示パネルとして薄型、軽量、低消費電力といったメリットを持つ液晶パネルが用いられている。 The illumination device is a device that emits light, and is used in a display device using a non-self-luminous display element. For example, it is used in a liquid crystal display device using a liquid crystal display element. Since the liquid crystal display element is a non-self-luminous display element, in the liquid crystal display device, it is necessary to irradiate the liquid crystal display element with illumination light from a lighting device (backlight). Such a liquid crystal display device is indispensable as a means for displaying information and images. For example, in recent years, portable information terminals represented by cellular phones and PDAs (Personal Digital Assistants). Devices are widely used, and liquid crystal panels having advantages such as thinness, light weight, and low power consumption are used as display panels.
従来の液晶表示装置に用いられるバックライトにおいては、光源として、冷陰極管が用いられていたが、近年では、小型、低消費電力等の点で優れていることから、発光ダイオード（以下、「ＬＥＤ」又は「ＬＥＤ素子」ともいう）が主に用いられている。 In a backlight used in a conventional liquid crystal display device, a cold cathode tube has been used as a light source. However, in recent years, since it is excellent in terms of small size, low power consumption, etc., a light emitting diode (hereinafter, “ LED "or" LED element ") is mainly used.
ところで、ＬＥＤ素子を光源として用いる照明装置においては、ＬＥＤ素子からの発熱による温度上昇に伴い、ＬＥＤ素子の寿命特性が悪化すると共に、発光効率が低下し、必要な光量を確保し難くなるという問題が生じるおそれがある。特に、上記の液晶表示装置に用いられる照明装置においては、照明装置の薄型化及び小型化が求められるが、これにより、一層ＬＥＤ素子から発生した熱を放出するのが困難となり、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を招来するおそれがある。 By the way, in the illuminating device which uses a LED element as a light source, with the temperature rise by the heat_generation | fever from a LED element, while the lifetime characteristic of a LED element deteriorates, luminous efficiency falls and it becomes difficult to ensure required light quantity. May occur. In particular, in the illumination device used in the above-described liquid crystal display device, it is required to make the illumination device thinner and smaller, but this makes it difficult to further release the heat generated from the LED element, and the lifetime of the LED element. There is a risk of deteriorating characteristics and reducing luminous efficiency.
この点について、ＬＥＤ素子の温度上昇を抑制すべく、放熱性の良好な構造にすることが考えられ、具体的には、ＬＥＤ素子が実装された配線板の両面に熱伝導性が良好な放熱体が設けられ、更に該放熱体がフレームに直接接触するＬＥＤバックライトが提案されている（例えば、特許文献１参照。）。図１４は、特許文献１に係るＬＥＤバックライトの断面模式図である。図１４に示すように、ＬＥＤバックライトにおいて、ＬＥＤ光源１１０は、配線板１１５上に設けられるとともに、配線板１１５の裏面には、第１の放熱体１２２が配され、ＬＥＤ光源１１０の周囲には、第２の放熱体１２３が配される。第１の放熱体１２２、及び、第２の放熱体１２３は、フレーム１２４に接触するように配される。これにより、ＬＥＤ光源１１０から発生した熱が放熱体１２２、１２３及びフレーム１２４に効率よく伝わり、その結果、ＬＥＤ素子からの熱をＬＥＤバックライトの外に効率よく放熱することができる。 With regard to this point, it is conceivable to make a structure with good heat dissipation to suppress the temperature rise of the LED element, specifically, heat dissipation with good thermal conductivity on both sides of the wiring board on which the LED element is mounted. There has been proposed an LED backlight in which a body is provided and the radiator is in direct contact with the frame (see, for example, Patent Document 1). FIG. 14 is a schematic cross-sectional view of an LED backlight according to Patent Document 1. As shown in FIG. 14, in the LED backlight, the LED light source 110 is provided on the wiring board 115, and a first heat radiator 122 is arranged on the back surface of the wiring board 115, Is provided with a second radiator 123. The first radiator 122 and the second radiator 123 are arranged so as to contact the frame 124. Thereby, the heat generated from the LED light source 110 is efficiently transmitted to the radiators 122, 123 and the frame 124. As a result, the heat from the LED element can be efficiently radiated outside the LED backlight.
特開２００６－２１６２４４号公報JP 2006-216244 A
しかし、上記の特許文献１に係るＬＥＤバックライトであってもＬＥＤ素子から発生した熱を充分に放熱することができず、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を招来することがある点で改良の余地があった。 However, even the LED backlight according to Patent Document 1 described above cannot sufficiently dissipate the heat generated from the LED element, which may lead to deterioration in the life characteristics of the LED element and reduction in light emission efficiency. There was room for improvement.
本発明は、上記現状に鑑みてなされたものであり、ＬＥＤ素子から発生した熱を効率よく放熱し、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を抑制する照明装置及びそれを備えた液晶表示装置を提供することを目的とするものである。 The present invention has been made in view of the above-described present situation, efficiently dissipating heat generated from an LED element, and a lighting device that suppresses deterioration of the life characteristics and emission efficiency of the LED element and a liquid crystal including the same. The object is to provide a display device.
本発明者は、上記課題について鋭意検討を行ったところ、従来の放熱体を用いても、充分にＬＥＤ素子から発生した熱を放熱できない原因は、放熱体とフレームとが充分に接触していない点にあることを見出した。図１５は、従来の放熱板（放熱体）を備えた照明装置の断面模式図である。放熱板１１２（放熱体）は、例えば、熱伝導性の高い金属板を切断して作製されるが、金属板の切断面の端部、すなわち、放熱板１１２の端部にバリと呼ばれる突起状の構造（以下では、突起部１１４ともいう）ができることがある。この突起部１１４が生じると、図１５に示すように、放熱板１１２とＬＥＤ基板固定板１１３と充分に接触できず、放熱板１１２とＬＥＤ基板固定板１１３との間に空間が生じる。その結果、放熱板１１２に伝わってくるＬＥＤ素子１１０からの熱が、フレームへ充分に伝導しなくなり、熱が充分に照明装置外に放出されない。本発明者は、この放熱板とＬＥＤ基板固定板との間に生じる空間が熱伝導効率を著しく低下させることを見出し、更に鋭意検討を行ったところ、放熱板に生じる突起部を確実に除くために、放熱板の端部を面取りすることに想到した。これにより放熱板とＬＥＤ基板固定板とを確実かつ充分に接触させることができるため、ＬＥＤ素子から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を抑制できることを想到し、本発明に到達したものである。 As a result of intensive studies on the above problems, the present inventor cannot sufficiently dissipate the heat generated from the LED element even if a conventional heat radiator is used. The heat radiator and the frame are not sufficiently in contact with each other. I found out that there was a point. FIG. 15 is a schematic cross-sectional view of a lighting device including a conventional heat radiating plate (heat radiating body). The heat radiating plate 112 (heat radiating body) is produced, for example, by cutting a metal plate having a high thermal conductivity. However, the end of the cut surface of the metal plate, that is, a protrusion called a burr at the end of the heat radiating plate 112 is used. (Hereinafter also referred to as the protrusion 114). When the protrusion 114 is formed, as shown in FIG. 15, the heat radiating plate 112 and the LED substrate fixing plate 113 cannot be sufficiently contacted, and a space is generated between the heat radiating plate 112 and the LED substrate fixing plate 113. As a result, the heat from the LED element 110 transmitted to the heat radiating plate 112 is not sufficiently conducted to the frame, and the heat is not sufficiently released outside the lighting device. The present inventor has found that the space generated between the heat radiating plate and the LED substrate fixing plate significantly reduces the heat conduction efficiency, and has further studied earnestly, in order to reliably remove the protrusions generated on the heat radiating plate. Then, the inventors came up with chamfering the end of the heat sink. As a result, the heat radiating plate and the LED substrate fixing plate can be reliably and sufficiently brought into contact with each other, so that the heat generated from the LED element is efficiently released to the outside of the lighting device, and the life characteristics of the LED element are deteriorated and the light emission efficiency is lowered. The present inventors have arrived at the present invention.
すなわち、本発明の一側面は、発光素子が取り付けられた基板と、放熱板と、基板固定板とを備えた照明装置であって、前記放熱板の一つの面には、前記基板が取り付けられ、前記放熱板は、前記基板が取り付けられた面の逆側の面の端部が面取りされた切り欠き部を有しており、前記放熱板の前記基板が取り付けられた面の逆側の面と、前記基板固定板とが接合されている照明装置である。この形態を以下では、第１形態ともいう。 That is, one aspect of the present invention is a lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate, and the substrate is attached to one surface of the heat radiating plate. The heat radiating plate has a cutout portion with a chamfered end portion of the surface opposite to the surface on which the substrate is mounted, and the surface on the opposite side of the surface on which the substrate is mounted on the heat radiating plate. And the substrate fixing plate. Hereinafter, this form is also referred to as a first form.
また、従来、前記放熱板は裁断されたあと、面取り加工などを特に施すことがなかったため、前記放熱板の端部には突起部による細かなギザギザが残り、組み立ての際に手を切ったり、製品（フレームや他の組み立て部材）に傷がついてしまったりするおそれがあった。前記放熱板の端部を面取りすることで、突起部を確実に取り除き、安全性及び信頼性を高めることができる。 In addition, conventionally, after the heat sink was cut, there was no particular chamfering or the like, so the end of the heat sink left a fine jaggedness due to the protrusion, and cut hands during assembly, There was a risk that the product (frame or other assembly member) would be damaged. By chamfering the end portion of the heat radiating plate, the protruding portion can be reliably removed, and safety and reliability can be improved.
第１形態において、切り欠き部は、放熱板の基板固定板と接合される側の面の一部に形成されていてもよいし、外周の全体に形成されていてもよい。また、切り欠き部は、怪我や製品の傷付きを防止する観点からは、放熱板の基板固定板と接合される側の面以外の面にも形成されていてもよい。 In the first embodiment, the notch may be formed on a part of the surface of the heat radiating plate to be joined to the substrate fixing plate, or may be formed on the entire outer periphery. Moreover, the notch part may be formed also in surfaces other than the surface by which the board | substrate fixing plate of a heat sink is joined from a viewpoint of preventing an injury and the damage | wound of a product.
第１形態の照明装置の構成としては、このような構成要素を必須として形成されるものである限り、その他の構成要素によって特に限定されるものではない。 The configuration of the lighting device of the first embodiment is not particularly limited by other components as long as such components are formed as essential.
以下、第１形態の照明装置の好ましい形態について、更に詳しく説明する。 Hereinafter, the preferable form of the illuminating device of a 1st form is demonstrated in detail.
第１形態において、前記切り欠き部は、前記放熱板の前記基板固定板との接合面と異なる角度の面を有することが好ましい。これによれば、放熱板と基板固定板とを充分に接触させることができるため、発光素子（例えば、ＬＥＤ素子）から発生した熱を照明装置外に効率よく放出し、発光素子の寿命特性の悪化及び発光効率の低下をより確実に抑制できる。 In the first embodiment, it is preferable that the notch has a surface with an angle different from a joint surface of the heat radiating plate with the substrate fixing plate. According to this, since the heat radiating plate and the substrate fixing plate can be sufficiently brought into contact with each other, the heat generated from the light emitting element (for example, the LED element) is efficiently released outside the lighting device, and the life characteristics of the light emitting element are improved. Deterioration and reduction in luminous efficiency can be more reliably suppressed.
また、前記切り欠き部は、段差を有する形状であってもよいし、丸みを有する形状であってもよい。これらの形状であっても、放熱板と基板固定板とを充分に接触させることができる。 In addition, the cutout portion may have a stepped shape or a rounded shape. Even if it is these shapes, a heat sink and a board | substrate fixed plate can fully be made to contact.
本発明者は、更に、鋭意検討を行った結果、放熱板と基板固定板との間に放熱シートを配することによっても上記課題が解決されることを見出した。 As a result of further intensive studies, the present inventor has found that the above problem can also be solved by arranging a heat radiating sheet between the heat radiating plate and the substrate fixing plate.
すなわち、本発明の他の側面は、発光素子が取り付けられた基板と、放熱板と、基板固定板とを備えた照明装置であって、前記放熱板の一つの面には、前記基板が取り付けられ、前記照明装置は、更に、前記放熱板と前記基板固定板との間に配され、かつ前記放熱板及び前記基板固定板の両方と接合された放熱シートを備え、前記放熱板の前記放熱シートとの接合面は、少なくとも一部が隆起又は陥没している照明装置でもある。この形態を以下では、第２形態ともいう。 That is, another aspect of the present invention is a lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate, and the substrate is attached to one surface of the heat radiating plate. The lighting device further includes a heat radiating sheet disposed between the heat radiating plate and the substrate fixing plate, and joined to both the heat radiating plate and the substrate fixing plate. The joint surface with the sheet is also a lighting device that is at least partially raised or depressed. Hereinafter, this form is also referred to as a second form.
前記放熱板の前記放熱シートとの接合面が隆起又は陥没していることにより、放熱板と放熱シートとの密着性が向上するとともに、接合面積が増大するため、放熱シートを介して、放熱板と基板固定板間の熱伝導性を充分に確保することができ、発光素子から発生した熱を照明装置外に効率よく放出し、発光素子の寿命特性の悪化及び発光効率の低下を抑制できる。 Since the bonding surface of the heat radiating plate with the heat radiating sheet is raised or depressed, the adhesion between the heat radiating plate and the heat radiating sheet is improved and the bonding area is increased. And the substrate fixing plate can be sufficiently ensured, the heat generated from the light emitting element can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the light emitting element can be suppressed.
第２形態の照明装置の構成としては、このような構成要素を必須として形成されるものである限り、その他の構成要素によって特に限定されるものではない。 The configuration of the illumination device of the second embodiment is not particularly limited by other components as long as such components are formed as essential.
以下、第２形態の照明装置の好ましい形態について、更に詳しく説明する。 Hereinafter, the preferable form of the illuminating device of a 2nd form is demonstrated in detail.
第２形態において前記放熱板の前記放熱シートとの接合面の隆起又は陥没の度合いは、前記接合面の中央に向かうにつれより大きいことが好ましい。これにより、放熱板と放熱シートとの密着性がより向上するとともに、放熱板と放熱シートとの接触面積がより増えるため、放熱板に伝わってくる熱を放熱シートへより効率よく伝えることができる。したがって、発光素子から発生した熱を照明装置外により効率よく放出し、発光素子の寿命特性の悪化及び発光効率の低下をより抑制できる。 In the second embodiment, it is preferable that the degree of the bulge or depression of the joint surface of the heat radiating plate with the heat radiating sheet is larger toward the center of the joint surface. As a result, the adhesion between the heat radiating plate and the heat radiating sheet is further improved, and the contact area between the heat radiating plate and the heat radiating sheet is further increased, so that the heat transmitted to the heat radiating plate can be more efficiently transmitted to the heat radiating sheet. . Therefore, the heat generated from the light emitting element can be efficiently released outside the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the light emitting element can be further suppressed.
第２形態において、前記放熱板の前記放熱シートとの接合面は、複数の凸形状又は凹形状を有することが好ましい。これにより、放熱板と放熱シートとの接触面積が一層増え、放熱板に伝わってくる熱を放熱シートへ更に効率よく伝えることができるため、より一層発光素子から発生した熱を照明装置外に効率よく放出し、発光素子の寿命特性の悪化及び発光効率の低下を更に抑制できる。 2nd form WHEREIN: It is preferable that the joint surface with the said heat radiating sheet of the said heat sink has several convex shape or concave shape. As a result, the contact area between the heat sink and the heat sink increases further, and the heat transmitted to the heat sink can be more efficiently transferred to the heat sink. It emits well, and it is possible to further suppress the deterioration of the life characteristics of the light-emitting element and the reduction of the light emission efficiency.
第２形態において、前記放熱シートのアスカーＣ硬度は、３０度以上であることが好ましい。アスカーＣ硬度が３０度未満となると、放熱シートが柔らかくなりすぎるため、放熱シートを適切に形成するのが困難になるおそれがあり、また、耐久性が不充分となるおそれがある。 2nd form WHEREIN: It is preferable that the Asker C hardness of the said heat radiating sheet is 30 degree | times or more. When the Asker C hardness is less than 30 degrees, the heat radiating sheet becomes too soft, so that it may be difficult to appropriately form the heat radiating sheet, and durability may be insufficient.
第２形態において、前記放熱シートのアスカーＣ硬度は、６０度以下であることが好ましい。アスカーＣ硬度が６０度より大きくなると、放熱シートと放熱板間の密着性が低下し、放熱板と基板固定板間の熱伝導性が低下するおそれがある。 In the second embodiment, the heat dissipation sheet preferably has an Asker C hardness of 60 degrees or less. If the Asker C hardness is greater than 60 degrees, the adhesion between the heat dissipation sheet and the heat dissipation plate may be reduced, and the thermal conductivity between the heat dissipation plate and the substrate fixing plate may be reduced.
放熱シートが柔軟性に富むものであることにより、放熱シート及び放熱板間の密着性を飛躍的に向上させることができる。また、突起部を有する放熱板であっても、突起部を放熱シートに埋没させることにより、放熱シートと放熱板とを充分に密着させ、放熱板と基板固定板間の熱伝導性を充分に確保することができる。 Since the heat dissipation sheet is rich in flexibility, the adhesion between the heat dissipation sheet and the heat dissipation plate can be dramatically improved. In addition, even for a heat sink with protrusions, by burying the protrusions in the heat dissipation sheet, the heat dissipation sheet and the heat dissipation plate are sufficiently adhered, and the thermal conductivity between the heat dissipation plate and the substrate fixing plate is sufficient. Can be secured.
アスカーＣ硬度は、アスカーＣ硬度計（ＳＲＩＳ０１０１（日本ゴム協会標準規格）に規定されたデュロメータ（スプリング式硬度計））によって測定することができる。 The Asker C hardness can be measured by an Asker C hardness meter (durometer (spring type hardness meter) defined in SRIS0101 (Japan Rubber Association Standard)).
第２形態においては、放熱シートは、放熱板と基板固定板との間に配されていたが、本発明者は、更に、鋭意検討を行った結果、放熱板と基板固定板との間に加え、照明装置を構成する部材を支持する支持部材と基板固定板との間にも放熱シートを配することによっても上記課題が解決されることを見出した。 In the second embodiment, the heat radiating sheet is disposed between the heat radiating plate and the substrate fixing plate. However, as a result of further intensive studies, the present inventor has conducted a study between the heat radiating plate and the substrate fixing plate. In addition, the present inventors have found that the above problem can be solved also by disposing a heat radiating sheet between the support member that supports the member constituting the lighting device and the substrate fixing plate.
すなわち、本発明の更に他の側面は、発光素子が取り付けられた基板と、放熱板と、基板固定板とを備えた照明装置であって、前記放熱板の一つの面には、前記基板が取り付けられ、前記基板固定板は、放熱板が取り付けられる放熱板固定面と、照明装置を構成する部材を支持する支持部材に取り付けられる支持部材固定面とを有し、前記照明装置は、更に、前記放熱板と前記放熱板固定面との間に配され、かつ前記放熱板及び前記放熱板固定面の両方と接合された第１の放熱シートと、前記支持部材と前記支持部材固定面との間に配され、かつ前記支持部材及び前記支持部材固定面の両方と接合された第２の放熱シートとを備える照明装置でもある。この形態を以下では、第３形態ともいう。 That is, still another aspect of the present invention is a lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate, and the substrate is disposed on one surface of the heat radiating plate. The board fixing plate is attached, and has a heat sink fixing surface to which a heat sink is attached, and a support member fixing surface attached to a support member that supports a member constituting the lighting device, and the lighting device further includes: A first heat dissipating sheet disposed between the heat dissipating plate and the heat dissipating plate fixing surface and joined to both the heat dissipating plate and the heat dissipating plate fixing surface; and the support member and the support member fixing surface. It is also an illuminating device provided with the 2nd thermal radiation sheet | seat which was distribute | arranged between and was joined with both the said supporting member and the said supporting member fixing surface. Hereinafter, this form is also referred to as a third form.
これにより、放熱シートに伝えられた熱を基板固定板に効率よく伝えるともに、放熱シートに伝えられた熱を支持部材に効率よく伝えることも可能となり、より一層発光素子から発生した熱を照明装置外に効率よく放出し、発光素子の寿命特性の悪化及び発光効率の低下を一層抑制できる。 As a result, it is possible to efficiently transfer the heat transferred to the heat dissipation sheet to the substrate fixing plate, and also to efficiently transfer the heat transferred to the heat dissipation sheet to the support member. It can be efficiently discharged to the outside, and the deterioration of the life characteristics of the light emitting element and the decrease of the light emission efficiency can be further suppressed.
第３形態の照明装置の構成としては、このような構成要素を必須として形成されるものである限り、その他の構成要素によって特に限定されるものではない。 The configuration of the illumination device of the third embodiment is not particularly limited by other components as long as such components are formed as essential.
以下、第３形態の照明装置の好ましい形態について、更に詳しく説明する。 Hereinafter, the preferable form of the 3rd form illuminating device is demonstrated in detail.
第３形態において、前記第１及び第２の放熱シートは、一体的に形成されていることが好ましい。これにより、第１及び第２の放熱シートを別々に配するよりも、部材点数を減らし、放熱シートを配する工程を簡略化することが可能となる。 In the third embodiment, it is preferable that the first and second heat radiating sheets are integrally formed. This makes it possible to reduce the number of members and simplify the process of arranging the heat dissipation sheet, rather than arranging the first and second heat dissipation sheets separately.
第３形態において、前記放熱シートのアスカーＣ硬度は、３０度以上であることが好ましい。アスカーＣ硬度が３０度未満となると、放熱シートが柔らかくなりすぎるため、放熱シートを適切に形成するのが困難になるおそれがあり、また、耐久性が不充分となるおそれがある。 3rd form WHEREIN: It is preferable that the Asker C hardness of the said heat radiating sheet is 30 degree | times or more. When the Asker C hardness is less than 30 degrees, the heat radiating sheet becomes too soft, so that it may be difficult to appropriately form the heat radiating sheet, and durability may be insufficient.
第３形態において、前記放熱シートのアスカーＣ硬度は、６０度以下であることが好ましい。アスカーＣ硬度が６０度より大きくなると、放熱シートと放熱板間の密着性が低下し、放熱板と基板固定板間の熱伝導性が低下するおそれがある。 3rd form WHEREIN: It is preferable that the Asker C hardness of the said heat radiating sheet is 60 degrees or less. If the Asker C hardness is greater than 60 degrees, the adhesion between the heat dissipation sheet and the heat dissipation plate may be reduced, and the thermal conductivity between the heat dissipation plate and the substrate fixing plate may be reduced.
放熱シートが柔軟性に富むものであることにより、放熱シート及び放熱板間の密着性を飛躍的に向上させることができる。また、放熱板が突起部を有していても、突起部を放熱シートに埋没させることにより、放熱シートと放熱板とを充分に密着させ、放熱板と基板固定板間の熱伝導性を充分に確保することができる。更に、基板固定板の支持部材との接触面においても、放熱板と同様に、突起部が生じることがあるが、そのような場合であっても、柔軟性に富む放熱シートを配することにより、基板固定板と支持部材間の熱伝導性を充分に確保することができる。 Since the heat dissipation sheet is rich in flexibility, the adhesion between the heat dissipation sheet and the heat dissipation plate can be dramatically improved. In addition, even if the heat sink has a protrusion, by burying the protrusion in the heat dissipation sheet, the heat dissipation sheet and the heat sink are sufficiently adhered, and the heat conductivity between the heat sink and the substrate fixing plate is sufficient. Can be secured. In addition, a protrusion may occur on the contact surface of the substrate fixing plate with the support member, as in the case of the heat radiating plate. Even in such a case, by arranging a heat radiating sheet rich in flexibility, The thermal conductivity between the substrate fixing plate and the support member can be sufficiently ensured.
本発明の更に他の側面は、対向配置された一対の基板間に封止された液晶を備えた液晶表示装置であって、上記本発明に係る照明装置を有する液晶表示装置でもある。これにより、放熱板と基板固定板とを充分に接触させることができ、発光素子から発生した熱を照明装置外に効率よく放出し、発光素子の寿命特性の悪化及び発光効率の低下を抑制できる。 Still another aspect of the present invention is a liquid crystal display device including a liquid crystal sealed between a pair of substrates arranged to face each other, and also a liquid crystal display device including the illumination device according to the present invention. Thereby, the heat sink and the substrate fixing plate can be sufficiently brought into contact with each other, and the heat generated from the light emitting element can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics of the light emitting element and the reduction of the light emitting efficiency can be suppressed. .
前記液晶表示装置の構成としては、このような構成要素を必須として形成されるものである限り、その他の構成要素によって特に限定されるものではない。 The configuration of the liquid crystal display device is not particularly limited by other components as long as such components are essential.
本発明によれば、放熱板と基板固定板とを充分に接触させることができ、ＬＥＤ素子から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を抑制できる照明装置を得ることができる。 According to the present invention, the heat radiating plate and the substrate fixing plate can be sufficiently brought into contact with each other, and the heat generated from the LED element can be efficiently released to the outside of the lighting device, thereby deteriorating the life characteristics of the LED element and lowering the light emission efficiency. Can be obtained.
実施形態１に係る液晶表示装置の平面模式図である。1 is a schematic plan view of a liquid crystal display device according to Embodiment 1. FIG. 図１に示す線分Ａ１－Ａ２に沿った液晶表示装置の断面模式図である。FIG. 2 is a schematic cross-sectional view of the liquid crystal display device taken along line A1-A2 shown in FIG. 実施形態１に係る液晶表示装置が備える放熱板とその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the structure of the heat sink with which the liquid crystal display device which concerns on Embodiment 1 is provided, and its periphery. 実施形態１の第一の変形例に係る放熱板とその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the heat sink which concerns on the 1st modification of Embodiment 1, and its surrounding structure. 実施形態１の第二の変形例に係る放熱板とその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the heat sink which concerns on the 2nd modification of Embodiment 1, and its surrounding structure. 実施形態２に係る液晶表示装置が備える放熱板及びその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the structure of the heat sink with which the liquid crystal display device which concerns on Embodiment 2 is equipped, and its periphery. 実施形態２の第一の変形例に係る放熱シートとその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the heat dissipation sheet which concerns on the 1st modification of Embodiment 2, and its surrounding structure. 実施形態２の第一の変形例に係る放熱板の平面模式図である。6 is a schematic plan view of a heat sink according to a first modification of Embodiment 2. FIG. 実施形態２の第二の変形例に係る放熱板の断面模式図である。FIG. 10 is a schematic cross-sectional view of a heat sink according to a second modification of the second embodiment. 実施形態２の第三の変形例に係る放熱板の断面模式図である。6 is a schematic cross-sectional view of a heat sink according to a third modification of Embodiment 2. FIG. 実施形態２の第四の変形例に係る放熱板の断面模式図である。6 is a schematic cross-sectional view of a heat sink according to a fourth modification of Embodiment 2. FIG. 実施形態３に係る液晶表示装置が備える放熱シートとその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the heat dissipation sheet with which the liquid crystal display device which concerns on Embodiment 3 is provided, and its periphery structure. 実施形態３の第一の変形例に係る放熱シートとその周辺の構造の断面模式図である。It is a cross-sectional schematic diagram of the structure of the thermal radiation sheet concerning the 1st modification of Embodiment 3, and its periphery. 特許文献１に係るＬＥＤバックライトの断面模式図である。It is a cross-sectional schematic diagram of the LED backlight which concerns on patent document 1. FIG. 従来の放熱板（放熱体）を備えた照明装置の断面模式図である。It is a cross-sectional schematic diagram of the illuminating device provided with the conventional heat sink (heat radiator).
以下に実施形態を掲げ、本発明について図面を参照して更に詳細に説明するが、本発明はこれらの実施形態のみに限定されるものではない。 Embodiments will be described below, and the present invention will be described in more detail with reference to the drawings. However, the present invention is not limited to these embodiments.
実施形態１
以下、実施形態１に係る照明装置及び液晶表示装置について図１及び図２を用いて詳述する。図１は実施形態１に係る液晶表示装置の平面模式図であり、図２は図１に示す線分Ａ１－Ａ２に沿った液晶表示装置の断面模式図である。実施形態１の照明装置は、導光板５、光学シート６、複数のＬＥＤ素子（発光素子）１０、ＬＥＤ基板１１、放熱板１２、ＬＥＤ基板固定板１３、ネジ１４、及び、ネジ１５から構成される。実施形態１の液晶表示装置は、上記照明装置、支持部材１６及び、液晶パネル３０から構成される。複数のＬＥＤ素子１０は、ＬＥＤ基板１１上に取り付けられ、このＬＥＤ基板１１の裏側には放熱板１２が張り合わされる。ＬＥＤ基板１１は、電源と接続するための配線を繋ぐ電源コネクタ１７を備える。更に、ＬＥＤ基板固定板１３、放熱板１２、及び、ＬＥＤ基板１１がネジ１４によって固定される。ＬＥＤ基板固定板１３は、互いに垂直な２つの面を有し、この２つの面の一方の面（以下では、放熱板固定面ともいう）と放熱板１２とが接合される。他方の面（以下では、支持部材固定面ともいう）は、支持部材１６にネジ１５によって固定される。複数のＬＥＤ素子１０と対向する位置に入光面が配されるように導光板５が支持部材１６上に取り付けられる。導光板５の出光面の上面に光学シート６が配される。更に、光学シート６の上に液晶パネル３０が取り付けられる。 Embodiment 1
Hereinafter, the illumination device and the liquid crystal display device according to Embodiment 1 will be described in detail with reference to FIGS. 1 and 2. FIG. 1 is a schematic plan view of the liquid crystal display device according to Embodiment 1, and FIG. 2 is a schematic cross-sectional view of the liquid crystal display device taken along line A1-A2 shown in FIG. The illuminating device of Embodiment 1 includes a light guide plate 5, an optical sheet 6, a plurality of LED elements (light emitting elements) 10, an LED substrate 11, a heat radiating plate 12, an LED substrate fixing plate 13, screws 14, and screws 15. The The liquid crystal display device according to the first embodiment includes the lighting device, the support member 16, and the liquid crystal panel 30. The plurality of LED elements 10 are mounted on an LED substrate 11, and a heat radiating plate 12 is attached to the back side of the LED substrate 11. The LED board 11 includes a power connector 17 that connects wiring for connecting to a power source. Further, the LED board fixing plate 13, the heat radiating plate 12, and the LED board 11 are fixed by screws 14. The LED substrate fixing plate 13 has two surfaces that are perpendicular to each other, and one of the two surfaces (hereinafter, also referred to as a heat dissipation plate fixing surface) and the heat dissipation plate 12 are joined. The other surface (hereinafter also referred to as a support member fixing surface) is fixed to the support member 16 with screws 15. The light guide plate 5 is mounted on the support member 16 so that the light incident surface is disposed at a position facing the plurality of LED elements 10. An optical sheet 6 is disposed on the upper surface of the light exit surface of the light guide plate 5. Further, the liquid crystal panel 30 is attached on the optical sheet 6.
光源であるＬＥＤ素子１０として、白色ＬＥＤ素子が用いられてもよいし、赤、緑及び青の３色のＬＥＤ素子が適宜組み合わされて用いられてもよい。導光板５は、光源であるＬＥＤ素子１０から発せられた光を入光面から取り込み、入光面よりも広い面積を持つ出光面から略均一に出光する部材である。導光板５の入光面に入射した光は、導光板５内で表面反射を繰り返して導光板５内に広がる。導光板５に設けられた反射ドット（図示せず）に光が当たるとそこで光が散乱され、導光板の出光面から出光する。ＬＥＤ基板１１は、ＬＥＤ素子１０を固定して配線するためのプリント配線板である。放熱板１２は、ＬＥＤ素子１０から発生した熱を放熱するための部材であり、熱伝導性の高い材料、例えば、アルミニウム、銅、銀、又は、それらの合金等の金属材料や窒化アルミニウム等のセラミック材料から形成される。光学シート６は、面内の同一点において、異なる角度で進む光を混合して角度的に配向し直すことにより、大きな輝度ムラや色ムラが生じるのを抑えるための部材である。 As the LED element 10 that is a light source, a white LED element may be used, or LED elements of three colors of red, green, and blue may be appropriately combined and used. The light guide plate 5 is a member that takes in light emitted from the LED element 10 as a light source from a light incident surface and emits light substantially uniformly from a light output surface having a larger area than the light incident surface. Light incident on the light incident surface of the light guide plate 5 repeats surface reflection in the light guide plate 5 and spreads in the light guide plate 5. When light hits a reflective dot (not shown) provided on the light guide plate 5, the light is scattered there and emitted from the light exit surface of the light guide plate. The LED board 11 is a printed wiring board for fixing and wiring the LED element 10. The heat radiating plate 12 is a member for radiating the heat generated from the LED element 10 and is made of a material having high thermal conductivity, for example, a metal material such as aluminum, copper, silver, or an alloy thereof, or aluminum nitride. Formed from a ceramic material. The optical sheet 6 is a member for suppressing the occurrence of large luminance unevenness and color unevenness by mixing light traveling at different angles and reorienting the angle at the same point in the plane.
次に、図３を用いて、実施形態１に係る液晶表示装置における放熱板の構造について更に詳しく説明する。図３は実施形態１に係る液晶表示装置が備える放熱板とその周辺の構造の断面模式図である。 Next, the structure of the heat sink in the liquid crystal display device according to the first embodiment will be described in more detail with reference to FIG. FIG. 3 is a schematic cross-sectional view of the heat sink and the surrounding structure provided in the liquid crystal display device according to the first embodiment.
図３に示すように、放熱板１２のＬＥＤ基板固定板１３と接合される面においては、面の端部及びその近辺の領域が削り取られ、放熱板のＬＥＤ基板固定板との接合面と異なる角度の面である切り欠き部５０が形成されている。面の端部及びその付近の領域は、金属板を切断し、放熱板１２を形成する際に突起部が生じやすい領域であるが、切り欠き部５０を設けることにより、突起部によって空間が生じるのを効果的に防ぎ、放熱板１２とＬＥＤ基板固定板１３との接触面積を充分にとることができる。 As shown in FIG. 3, in the surface joined to the LED board fixing plate 13 of the heat sink 12, the edge part of the surface and the area | region of the vicinity are scraped off, and it differs from the joint surface with the LED board fixing plate of a heat sink. A notch 50 that is an angled surface is formed. The edge of the surface and the area in the vicinity thereof are areas where protrusions are likely to occur when the metal plate is cut and the heat radiating plate 12 is formed. However, by providing the notches 50, spaces are generated by the protrusions. Can be effectively prevented, and a sufficient contact area between the radiator plate 12 and the LED substrate fixing plate 13 can be secured.
実施形態１に係る液晶表示装置によれば、放熱板１２に生じ得る突起部を充分に取り除くことができるため、放熱板１２とＬＥＤ基板固定板１３とを充分に接触させることができ、ＬＥＤ素子１０から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子１２の寿命特性の悪化及び発光効率の低下をより確実に抑制できる。 According to the liquid crystal display device according to the first embodiment, since the protrusions that may be generated on the heat sink 12 can be sufficiently removed, the heat sink 12 and the LED substrate fixing plate 13 can be sufficiently brought into contact with each other, and the LED element. The heat generated from 10 can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the LED element 12 can be more reliably suppressed.
図４及び図５を用いて、実施形態１の放熱板の変形例について説明する。図４は実施形態１の第一の変形例に係る放熱板とその周辺の構造の断面模式図であり、図５は実施形態１の第二の変形例に係る放熱板とその周辺の構造の断面模式図である。 The modification of the heat sink of Embodiment 1 is demonstrated using FIG.4 and FIG.5. FIG. 4 is a schematic cross-sectional view of the heat sink according to the first modification of the first embodiment and the surrounding structure, and FIG. 5 is a view of the heat sink according to the second modification of the first embodiment and the surrounding structure. It is a cross-sectional schematic diagram.
図４に示すように、切り欠き部５１は、段差を有する形状であってもよい。また、図５に示すように、切り欠き部５２は、フィレット加工により、丸みを有する形状であってもよい。これらの変形例においても、実施形態１と同様の効果が得られる。 As illustrated in FIG. 4, the notch 51 may have a stepped shape. Further, as shown in FIG. 5, the cutout portion 52 may have a rounded shape by fillet processing. Also in these modified examples, the same effect as in the first embodiment can be obtained.
実施形態２
実施形態１においては、放熱板の一方の面とＬＥＤ基板固定板の放熱板固定面とが直接接触していたが、実施形態２においては、放熱板の一方の面とＬＥＤ基板固定板の放熱板固定面との間には、放熱シートが配される。 Embodiment 2
In the first embodiment, one surface of the heat radiating plate and the heat radiating plate fixing surface of the LED substrate fixing plate are in direct contact, but in the second embodiment, one surface of the radiating plate and the heat radiating of the LED substrate fixing plate. A heat radiating sheet is arranged between the plate fixing surfaces.
以下、実施形態２に係る照明装置及び液晶表示装置について詳述する。実施形態１と共通する事項については、ここでの説明を省略する。図６は実施形態２に係る液晶表示装置が備える放熱板及びその周辺の構造の断面模式図である。実施形態２においては、図６に示すように、放熱板１２と、ＬＥＤ基板固定板１３の放熱板固定面１１との間に、放熱シート６０が配され、放熱板１２、放熱シート６０、及び、ＬＥＤ基板固定板１３は、この順に貼り合わされて互いに接合される。また、放熱板１２の放熱シート６０との接合面は、隆起しており、接合面の隆起の度合いは、接合面の中央に向かうにつれより大きくなっている。 Hereinafter, the illumination device and the liquid crystal display device according to Embodiment 2 will be described in detail. Descriptions common to the first embodiment are omitted here. FIG. 6 is a schematic cross-sectional view of the heat sink and the surrounding structure provided in the liquid crystal display device according to the second embodiment. In the second embodiment, as shown in FIG. 6, a heat radiating sheet 60 is disposed between the heat radiating plate 12 and the heat radiating plate fixing surface 11 of the LED substrate fixing plate 13, and the heat radiating plate 12, the heat radiating sheet 60, and The LED substrate fixing plate 13 is bonded in this order and joined together. Moreover, the joint surface with the heat radiating sheet 60 of the heat sink 12 has protruded, and the degree of the protrusion of the joint surface becomes larger toward the center of the joint surface.
放熱シート６０は、柔軟性に富む（アスカーＣ硬度３０～６０度）とともに熱伝導性が高いものであることが好ましく、具体的には、シリコーンゴム、アクリル等から形成されることが好ましい。放熱シートが柔軟性に富むものであることによって、放熱シート６０及び放熱板１２間の密着性を飛躍的に向上させることができる。また、先端に突起部（ギザギザ）を有する放熱板であっても、突起部を放熱シート６０に埋没させることにより、放熱シート６０と放熱板１２とを充分に密着させ、放熱板１２とＬＥＤ基板固定板１３間の熱伝導性を充分に確保することができる。 The heat radiating sheet 60 is preferably flexible (Asker C hardness 30 to 60 degrees) and high in thermal conductivity, and specifically, is preferably formed from silicone rubber, acrylic, or the like. Since the heat dissipation sheet is rich in flexibility, the adhesion between the heat dissipation sheet 60 and the heat dissipation plate 12 can be dramatically improved. Moreover, even if it is a heat sink which has a projection part (toothed) at the front-end | tip, by burying a projection part in the heat sink sheet 60, the heat sink sheet 60 and the heat sink 12 are fully_contact | adhered, and the heat sink 12 and LED board The thermal conductivity between the fixed plates 13 can be sufficiently ensured.
実施形態２に係る液晶表示装置によれば、放熱板１２に突起部があったとしても、放熱シート６０を介して、放熱板１２と基板固定板間１３の熱伝導性を充分に確保することができるため、ＬＥＤ素子１０から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子１０の寿命特性の悪化及び発光効率の低下を抑制できる。また、放熱板１２の放熱シート６０と接合される面は、中央に向かって隆起しているため、放熱板１２と放熱シート６０との接触面積が増え、放熱板１２に伝わってくる熱を放熱シート６０へ効率よく伝えることができる。したがって、ＬＥＤ素子１０から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子１２の寿命特性の悪化及び発光効率の低下を抑制できる。 According to the liquid crystal display device according to the second embodiment, even if the heat radiating plate 12 has a protrusion, the heat conductivity between the heat radiating plate 12 and the substrate fixing plate 13 is sufficiently ensured through the heat radiating sheet 60. Therefore, the heat generated from the LED element 10 can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics of the LED element 10 and the decrease of the light emission efficiency can be suppressed. Moreover, since the surface joined to the heat radiating sheet 60 of the heat radiating plate 12 is raised toward the center, the contact area between the heat radiating plate 12 and the heat radiating sheet 60 is increased, and the heat transmitted to the heat radiating plate 12 is dissipated. The sheet 60 can be efficiently transmitted. Therefore, the heat generated from the LED element 10 can be efficiently released to the outside of the lighting device, and the deterioration of the life characteristics of the LED element 12 and the decrease in the light emission efficiency can be suppressed.
図７～図１１を用いて、実施形態２の放熱板及び放熱シート変形例について説明する。図７は実施形態２の第一の変形例に係る放熱シートとその周辺の構造の断面模式図であり、図８は実施形態２の第一の変形例に係る放熱板の平面模式図である。また、図９は実施形態２の第二の変形例に係る放熱板の断面模式図であり、図１０は実施形態２の第三の変形例に係る放熱板の断面模式図であり、図１１は実施形態２の第四の変形例に係る放熱板の断面模式図である。 With reference to FIGS. 7 to 11, modifications of the heat radiating plate and the heat radiating sheet of the second embodiment will be described. FIG. 7 is a schematic cross-sectional view of the heat dissipation sheet according to the first modification of the second embodiment and the surrounding structure, and FIG. 8 is a schematic plan view of the heat dissipation plate according to the first modification of the second embodiment. . 9 is a schematic cross-sectional view of a heat dissipation plate according to a second modification of the second embodiment, and FIG. 10 is a schematic cross-sectional view of a heat dissipation plate according to the third modification of the second embodiment. These are the cross-sectional schematic diagrams of the heat sink which concerns on the 4th modification of Embodiment 2. FIG.
実施形態２の第一の変形例においては、図７に示すように放熱板１２の放熱シート６０と接合面は、複数の凸形状を有する。これにより、放熱板と放熱シートとの接合面積が一層増えるため、放熱板から伝わってくる熱を放熱シートへ更に効率よく伝えることができる。その結果、より一層ＬＥＤ素子から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を更に抑制できる。複数の凸形状は、図８に示すように、放熱板１２の放熱シートと接合される面上におよそ満遍なく配置されるように形成されることが好ましい。また、複数の凸形状は、面上に均等に配置されるように形成されてもよい。 In the first modification of the second embodiment, as shown in FIG. 7, the heat dissipation sheet 60 and the joint surface of the heat dissipation plate 12 have a plurality of convex shapes. Thereby, since the joining area of a heat sink and a heat sink sheet increases further, the heat transmitted from a heat sink can be more efficiently transmitted to a heat sink sheet. As a result, the heat generated from the LED element can be more efficiently released to the outside of the lighting device, and the deterioration of the life characteristics and the light emission efficiency of the LED element can be further suppressed. As shown in FIG. 8, the plurality of convex shapes are preferably formed so as to be arranged almost evenly on the surface of the heat radiating plate 12 joined to the heat radiating sheet. The plurality of convex shapes may be formed so as to be evenly arranged on the surface.
実施形態２の第二の変形例においては、放熱板１２は、図９に示すように、放熱シート６０との接合面が中央に向かって隆起しているとともに、例えば、グレーティング加工により隆起している部分の一部に溝が形成されていてもよい。 In the second modification of the second embodiment, as shown in FIG. 9, the heat radiating plate 12 has a joint surface with the heat radiating sheet 60 raised toward the center, and is raised by, for example, grating processing. A groove may be formed in a part of the portion.
実施形態２の第三の変形例においては、放熱板１２は、図１０に示すように、放熱シート６０との接合面が中央に向かって陥没していてもよい。 In the third modification of the second embodiment, as shown in FIG. 10, the heat radiating plate 12 may have a joint surface with the heat radiating sheet 60 recessed toward the center.
実施形態２の第四の変形例においては、図１１に示すように、グレーティング加工によって平面の一部に溝が形成されていてもよい。 In the fourth modification of the second embodiment, as shown in FIG. 11, a groove may be formed in a part of the plane by grating processing.
これら実施形態２の変形例によっても放熱板と放熱シートとの接合面積が一層増えるため、実施形態２と同様の効果が得られる。 Even in the modified examples of the second embodiment, since the joint area between the heat radiating plate and the heat radiating sheet is further increased, the same effect as that of the second embodiment can be obtained.
実施形態３
実施形態２においては、放熱板とＬＥＤ基板固定板の放熱板固定面との間に放熱シートが配されていたが、実施形態３においては、更に、ＬＥＤ基板固定板の支持部材固定面と支持部材との間にも放熱シートが配される。 Embodiment 3
In the second embodiment, the heat radiating sheet is arranged between the heat radiating plate and the heat radiating plate fixing surface of the LED substrate fixing plate. However, in the third embodiment, the supporting member fixing surface and the supporting member of the LED substrate fixing plate are further supported. A heat dissipation sheet is also arranged between the members.
以下、実施形態３に係る照明装置及び液晶表示装置について詳述する。実施形態１又は２と共通する事項については、ここでの説明を省略する。図１２及び図１３を用いて、実施形態２の放熱シートの別の変形例について説明する。図１２は実施形態３に係る液晶表示装置が備える放熱シートとその周辺の構造の断面模式図であり、図１３は実施形態３の第一の変形例に係る放熱シートとその周辺の構造の断面模式図である。 Hereinafter, the illumination device and the liquid crystal display device according to Embodiment 3 will be described in detail. Description of matters common to the first or second embodiment is omitted here. Another modified example of the heat dissipation sheet of the second embodiment will be described with reference to FIGS. 12 and 13. FIG. 12 is a schematic cross-sectional view of the heat dissipation sheet and the surrounding structure included in the liquid crystal display device according to Embodiment 3, and FIG. 13 is a cross-sectional view of the heat dissipation sheet according to the first modification of Embodiment 3 and the surrounding structure. It is a schematic diagram.
実施形態３においては、放熱板１２とＬＥＤ基板固定板１３の放熱板固定面との間には放熱シート６１（第１の放熱シート）が配され、放熱板１２、放熱シート６１、及び、ＬＥＤ基板固定板１３は、この順に接合される。更に、図１２に示すように、支持部材（図示せず）とＬＥＤ基板固定板１３の支持部材固定面との間にも放熱シート６１（第２の放熱シート）が配され、支持部材、放熱シート６１、及び、ＬＥＤ基板固定板１３は、この順に接合される。また、放熱板固定面上、及び、支持部材固定面上に貼り付けられる放熱シート６１は、一体的に形成されている。 In the third embodiment, a heat radiating sheet 61 (first heat radiating sheet) is disposed between the heat radiating plate 12 and the heat radiating plate fixing surface of the LED substrate fixing plate 13, and the heat radiating plate 12, the heat radiating sheet 61, and the LED The substrate fixing plate 13 is joined in this order. Further, as shown in FIG. 12, a heat radiation sheet 61 (second heat radiation sheet) is also disposed between the support member (not shown) and the support member fixing surface of the LED board fixing plate 13, so that the support member, the heat dissipation The sheet 61 and the LED board fixing plate 13 are joined in this order. Moreover, the heat radiation sheet 61 affixed on the heat sink fixing surface and the support member fixing surface is integrally formed.
これにより、放熱シートに伝わってきた熱を基板固定板、更に、支持部材に効率よく伝えることも可能となり、より一層ＬＥＤ素子から発生した熱を照明装置外に効率よく放出し、ＬＥＤ素子の寿命特性の悪化及び発光効率の低下を一層抑制できる。 As a result, the heat transmitted to the heat dissipation sheet can be efficiently transmitted to the substrate fixing plate and further to the support member, and the heat generated from the LED element can be further efficiently released to the outside of the lighting device, and the lifetime of the LED element It is possible to further suppress deterioration of characteristics and a decrease in light emission efficiency.
なお、放熱シートを２枚用いて放熱板固定面上と、支持部材固定面上とにそれぞれ異なる放熱シート６１（第１の放熱シート、及び、第２の放熱シート）を配しても同様の効果が得られるが、一体的に形成された１枚の放熱シート６１を放熱板固定面上、及び、支持部材固定面上に配するほうが、部材点数を減らし、放熱シート６１を配する工程を簡略化することが可能となり、放熱シート６１の製造にかかる工賃も抑えることが可能となるため、より好ましい。 It is to be noted that the same heat dissipation sheet 61 (first heat dissipation sheet and second heat dissipation sheet) may be arranged on the heat sink fixing surface and the support member fixing surface using two heat dissipation sheets. Although an effect is acquired, the process of arrange | positioning the heat radiation sheet 61 reduces the number of members, and arrange | positions the one heat radiation sheet 61 formed integrally on a heat sink fixing surface and a support member fixing surface. Since it becomes possible to simplify and the labor cost concerning manufacture of the heat-radiation sheet 61 can also be suppressed, it is more preferable.
放熱シート６１は、柔軟性に富む（アスカーＣ硬度３０～６０度）とともに熱伝導性が高いものであることが好ましく、具体的には、シリコーンゴム、アクリル等から形成されることが好ましい。放熱シート６１が柔軟性に富むものであることによって、放熱シート６１及び放熱板１２間の密着性を飛躍的に向上させることができる。また、放熱板１２の先端に突起部（ギザギザ）を有していても、突起部を放熱シート６１に埋没させることにより、放熱シート６１と放熱板１２とを充分に密着させ、放熱板６１とＬＥＤ基板固定板１３間の熱伝導性を充分に確保することができる。更に、ＬＥＤ基板固定板１３の支持部材固定面において、放熱板１２と同様に、突起部（ギザギザ）が生じた場合も、柔軟性に富む放熱シート６１を配することにより、ＬＥＤ基板固定板１３と支持部材１６間の熱伝導性を充分に確保することができる。 The heat dissipating sheet 61 is preferably flexible (Asker C hardness 30 to 60 degrees) and high in thermal conductivity. Specifically, the heat dissipating sheet 61 is preferably made of silicone rubber, acrylic or the like. Since the heat radiating sheet 61 is rich in flexibility, the adhesion between the heat radiating sheet 61 and the heat radiating plate 12 can be dramatically improved. Further, even if the protrusion of the radiator plate 12 has a protrusion (notch), by burying the protrusion in the radiator sheet 61, the radiator sheet 61 and the radiator plate 12 are sufficiently brought into close contact with each other. The thermal conductivity between the LED substrate fixing plates 13 can be sufficiently ensured. Further, in the same manner as the heat radiating plate 12, even when a protrusion (jagged) occurs on the support member fixing surface of the LED substrate fixing plate 13, the LED substrate fixing plate 13 can be provided by arranging the heat radiating sheet 61 having a high flexibility. And sufficient heat conductivity between the support member 16 can be secured.
また、実施形態３においては、例えば、図１３に示すように、放熱板１２の放熱シート６１との接合面は隆起しているとともに、接合面の隆起の度合いは接合面の中央に向かうにつれ、より大きくなっていてもよく、実施形態２の特徴を実施形態３に対して適宜組み込むことができる。 In Embodiment 3, for example, as shown in FIG. 13, the joint surface of the heat radiating plate 12 with the heat radiating sheet 61 is raised, and the degree of bulging of the joint surface is toward the center of the joint surface. The features of the second embodiment can be appropriately incorporated into the third embodiment.
なお、本願は、２０１０年１０月２７日に出願された日本国特許出願２０１０－２４１０５３号を基礎として、パリ条約ないし移行する国における法規に基づく優先権を主張するものである。該出願の内容は、その全体が本願中に参照として組み込まれている。 The present application claims priority based on the Paris Convention or the laws and regulations in the country of transition based on Japanese Patent Application No. 2010-241053 filed on October 27, 2010. The contents of the application are hereby incorporated by reference in their entirety.
１：液晶表示装置
５：導光板
６：光学シート
１０：ＬＥＤ素子
１１：ＬＥＤ基板
１２、１１２：放熱板
１３、１１３：ＬＥＤ基板固定板
１４、１５：ネジ
１６：支持部材
１７：電源コネクタ
３０：液晶パネル
５０、５１、５２：切り欠き部
６０、６１：放熱シート
１１０：ＬＥＤ光源
１１４：突起部（バリ）
１１５：配線板
１２２：第１の放熱体
１２３：第２の放熱体
１２４：フレーム 1: liquid crystal display device 5: light guide plate 6: optical sheet 10: LED element 11: LED substrate 12, 112: heat dissipation plate 13, 113: LED substrate fixing plate 14, 15: screw 16: support member 17: power connector 30: Liquid crystal panel 50, 51, 52: Notch 60, 61: Heat radiation sheet 110: LED light source 114: Protrusion (burr)
115: Wiring board 122: First radiator 123: Second radiator 124: Frame

Claims (13)

  1. 発光素子が取り付けられた基板と、放熱板と、基板固定板とを備えた照明装置であって、
    前記放熱板の一つの面には、前記基板が取り付けられ、
    前記放熱板は、前記基板が取り付けられた面の逆側の面の端部が面取りされた切り欠き部を有しており、
    前記放熱板の前記基板が取り付けられた面の逆側の面と、前記基板固定板とが接合されている
    ことを特徴とする照明装置。     A lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate,
    The substrate is attached to one surface of the heat sink,
    The heat radiating plate has a notch in which the end of the surface opposite to the surface to which the substrate is attached is chamfered,
    A lighting device, wherein a surface of the heat radiating plate opposite to a surface on which the substrate is attached is joined to the substrate fixing plate.
  2. 前記切り欠き部は、前記放熱板の前記基板固定板との接合面と異なる角度の面を有することを特徴とする請求項１記載の照明装置。 The lighting device according to claim 1, wherein the notch has a surface having an angle different from a surface of the heat radiating plate joined to the substrate fixing plate.
  3. 発光素子が取り付けられた基板と、放熱板と、基板固定板とを備えた照明装置であって、
    前記放熱板の一つの面には、前記基板が取り付けられ、
    前記照明装置は、更に、前記放熱板と前記基板固定板との間に配され、かつ前記放熱板及び前記基板固定板の両方と接合された放熱シートを備え、
    前記放熱板の前記放熱シートとの接合面は、少なくとも一部が隆起又は陥没している
    ことを特徴とする照明装置。     A lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate,
    The substrate is attached to one surface of the heat sink,
    The lighting device further includes a heat radiating sheet disposed between the heat radiating plate and the substrate fixing plate, and joined to both the heat radiating plate and the substrate fixing plate.
    At least a part of the joint surface of the heat radiating plate with the heat radiating sheet is raised or depressed, and the lighting device is characterized in that:
  4. 前記放熱板の前記放熱シートとの接合面の隆起の度合いは、該接合面の中央に向かうにつれより大きいことを特徴とする請求項３記載の照明装置。 The lighting device according to claim 3, wherein the degree of protrusion of the joint surface of the heat radiating plate with the heat radiating sheet is larger as it goes toward the center of the joint surface.
  5. 前記放熱板の前記放熱シートとの接合面は、複数の凸形状を有することを特徴とする請求項３記載の照明装置。 The lighting device according to claim 3, wherein a joint surface of the heat radiating plate with the heat radiating sheet has a plurality of convex shapes.
  6. 前記放熱板の前記放熱シートとの接合面の陥没の度合いは、該接合面の中央に向かうにつれより大きいことを特徴とする請求項３記載の照明装置。 The lighting device according to claim 3, wherein a degree of depression of a joint surface of the heat radiating plate with the heat radiating sheet is larger as going to a center of the joint surface.
  7. 前記放熱板の前記放熱シートとの接合面は、複数の凹形状を有することを特徴とする請求項３記載の照明装置。 The lighting device according to claim 3, wherein a joint surface of the heat radiating plate with the heat radiating sheet has a plurality of concave shapes.
  8. 前記放熱シートのアスカーＣ硬度は、３０度以上、６０度以下であることを特徴とする請求項３～７のいずれかに記載の照明装置。 The lighting device according to any one of claims 3 to 7, wherein the heat dissipation sheet has an Asker C hardness of 30 degrees or more and 60 degrees or less.
  9. 発光素子が取り付けられた基板と、放熱板と、基板固定板とを備えた照明装置であって、
    前記放熱板の一つの面には、前記基板が取り付けられ、
    前記基板固定板は、放熱板が取り付けられる放熱板固定面と、照明装置を構成する部材を支持する支持部材に取り付けられる支持部材固定面とを有し、
    前記照明装置は、更に、前記放熱板と前記放熱板固定面との間に配され、かつ前記放熱板及び前記放熱板固定面の両方と接合された第１の放熱シートと、
    前記支持部材と前記支持部材固定面との間に配され、かつ前記支持部材及び前記支持部材固定面の両方と接合された第２の放熱シートとを備える
    ことを特徴とする照明装置。     A lighting device including a substrate to which a light emitting element is attached, a heat radiating plate, and a substrate fixing plate,
    The substrate is attached to one surface of the heat sink,
    The substrate fixing plate has a heat radiating plate fixing surface to which a heat radiating plate is attached, and a supporting member fixing surface attached to a supporting member that supports a member constituting the lighting device,
    The lighting device is further arranged between the heat radiating plate and the heat radiating plate fixing surface, and a first heat radiating sheet joined to both the heat radiating plate and the heat radiating plate fixing surface,
    An illumination device comprising: a second heat dissipating sheet that is disposed between the support member and the support member fixing surface and joined to both the support member and the support member fixing surface.
  10. 前記第１及び第２の放熱シートは、一体的に形成されていることを特徴とする請求項９記載の照明装置。 The lighting device according to claim 9, wherein the first and second heat dissipating sheets are integrally formed.
  11. 前記放熱シートのアスカーＣ硬度は、３０度以上であることを特徴とする請求項９又は１０記載の照明装置。 The lighting device according to claim 9 or 10, wherein the heat dissipation sheet has an Asker C hardness of 30 degrees or more.
  12. 前記放熱シートのアスカーＣ硬度は、６０度以下であることを特徴とする請求項９～１１のいずれかに記載の照明装置。 The lighting device according to any one of claims 9 to 11, wherein the heat dissipation sheet has an Asker C hardness of 60 degrees or less.
  13. 対向配置された一対の基板間に封止された液晶を備えた液晶表示装置であって、
    請求項１～１２のいずれかに記載された照明装置を有することを特徴とする液晶表示装置。     A liquid crystal display device comprising a liquid crystal sealed between a pair of opposed substrates,
    A liquid crystal display device comprising the illumination device according to any one of claims 1 to 12.
PCT/JP2011/074040 2010-10-27 2011-10-19 Illumination device, and liquid crystal display device WO2012056968A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-241053 2010-10-27
JP2010241053 2010-10-27

Publications (1)

Publication Number Publication Date
WO2012056968A1 true WO2012056968A1 (en) 2012-05-03

Family

ID=45993681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/074040 WO2012056968A1 (en) 2010-10-27 2011-10-19 Illumination device, and liquid crystal display device

Country Status (1)

Country Link
WO (1) WO2012056968A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160312A (en) * 1999-12-01 2001-06-12 Mitsubishi Electric Corp Plane-illuminating device
JP2004271734A (en) * 2003-03-06 2004-09-30 Sankyo Alum Ind Co Ltd Glazing channel
JP2005038771A (en) * 2003-07-17 2005-02-10 Mitsubishi Electric Corp Surface light source, display device and guiding light device
JP2007287463A (en) * 2006-04-17 2007-11-01 Sharp Corp Lighting system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160312A (en) * 1999-12-01 2001-06-12 Mitsubishi Electric Corp Plane-illuminating device
JP2004271734A (en) * 2003-03-06 2004-09-30 Sankyo Alum Ind Co Ltd Glazing channel
JP2005038771A (en) * 2003-07-17 2005-02-10 Mitsubishi Electric Corp Surface light source, display device and guiding light device
JP2007287463A (en) * 2006-04-17 2007-11-01 Sharp Corp Lighting system

Similar Documents

Publication Publication Date Title
JP4968666B2 (en) Backlight device and liquid crystal display device
JP4352038B2 (en) Backlight unit and liquid crystal display device
TWI422918B (en) Light guide member, flat light source device, and display device
JP5285153B2 (en) Liquid crystal display
KR101472131B1 (en) backlight unit
US8194208B2 (en) Backlight module with a heat conductive block
JP2007335371A (en) Surface lighting device
JP2008020557A (en) Liquid crystal display module
JP2011216270A (en) Backlight unit and liquid crystal display
JP4610312B2 (en) Light source device and display device having the same
JP4726456B2 (en) Liquid crystal display
JP2007193946A (en) Light-emitting device
US8708540B2 (en) Backlight module with heat dissipation structure
WO2012063666A1 (en) Liquid crystal display device
JP4534897B2 (en) Illumination light source device
JP2008117886A (en) Led package, and lighting device
WO2012073750A1 (en) Illumination device, display device, and television reception device
JP4828253B2 (en) Light emitting unit used as light source for backlight for liquid crystal
JP5040194B2 (en) LCD module
JP2010231964A (en) Lighting device
JP2009169204A (en) Liquid crystal display
JP4912844B2 (en) LIGHT EMITTING DEVICE AND DISPLAY DEVICE USING THE SAME
WO2012056968A1 (en) Illumination device, and liquid crystal display device
JP2008216406A5 (en)
JP2008216406A (en) Heat radiation structure and liquid crystal display device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11836104

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11836104

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP