WO2012052832A3 - Electroless nickel plating bath and electroless nickel plating method using same - Google Patents

Electroless nickel plating bath and electroless nickel plating method using same Download PDF

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Publication number
WO2012052832A3
WO2012052832A3 PCT/IB2011/002514 IB2011002514W WO2012052832A3 WO 2012052832 A3 WO2012052832 A3 WO 2012052832A3 IB 2011002514 W IB2011002514 W IB 2011002514W WO 2012052832 A3 WO2012052832 A3 WO 2012052832A3
Authority
WO
WIPO (PCT)
Prior art keywords
nickel plating
electroless nickel
same
plating bath
plating method
Prior art date
Application number
PCT/IB2011/002514
Other languages
French (fr)
Other versions
WO2012052832A2 (en
WO2012052832A8 (en
Inventor
Takeshi Bessho
Hideo Honma
Mitsuhiro Watanabe
Katsuhiko Tashiro
Original Assignee
Toyota Jidosha Kabushiki Kaisha
Kanto Gakuin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidosha Kabushiki Kaisha, Kanto Gakuin University filed Critical Toyota Jidosha Kabushiki Kaisha
Publication of WO2012052832A2 publication Critical patent/WO2012052832A2/en
Publication of WO2012052832A8 publication Critical patent/WO2012052832A8/en
Publication of WO2012052832A3 publication Critical patent/WO2012052832A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

An electroless nickel plating bath that contains a nickel salt, a reducing agent, a stabilizer that contains metal antimony or an antimony compound, and a complexing agent that contains succinic acid or one of malic acid and lactic acid at a chelate molar ratio of 25:75 to 75:25.
PCT/IB2011/002514 2010-10-21 2011-10-21 Electroless nickel plating bath and electroless nickel plating method using same WO2012052832A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-236378 2010-10-21
JP2010236378A JP2012087386A (en) 2010-10-21 2010-10-21 Electroless nickel plating bath and electroless nickel plating method using the same

Publications (3)

Publication Number Publication Date
WO2012052832A2 WO2012052832A2 (en) 2012-04-26
WO2012052832A8 WO2012052832A8 (en) 2012-06-21
WO2012052832A3 true WO2012052832A3 (en) 2012-11-15

Family

ID=45422318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/002514 WO2012052832A2 (en) 2010-10-21 2011-10-21 Electroless nickel plating bath and electroless nickel plating method using same

Country Status (2)

Country Link
JP (1) JP2012087386A (en)
WO (1) WO2012052832A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6326857B2 (en) * 2014-02-21 2018-05-23 三菱瓦斯化学株式会社 Electroless plating solution
CN104328395B (en) * 2014-10-17 2016-08-24 金川集团股份有限公司 Phosphorus chemistry nickel plating concentrated solution and plating technology in one
CN114059053B (en) * 2021-11-09 2023-10-10 苏州汉宜纳米新材料有限公司 Electroless Ni-W-P plating solution and preparation method thereof, ni-W-P plating layer and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005200707A (en) * 2004-01-16 2005-07-28 Noge Denki Kogyo:Kk Low stress electroless nickel plating
US20080196625A1 (en) * 2004-09-28 2008-08-21 Ahc Oberflachentechnik Gmbh & Co. Ohg Non-Galvanically Applied Nickel Alloy
EP2177646A1 (en) * 2008-10-17 2010-04-21 Atotech Deutschland Gmbh Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
WO2010045559A1 (en) * 2008-10-16 2010-04-22 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63179044A (en) * 1987-01-19 1988-07-23 Aisin Seiki Co Ltd Manufacture of sintered magnetic alloy by means of plating treatment
JP2757672B2 (en) * 1992-03-19 1998-05-25 上村工業株式会社 Electroless Ni-P-Mo plating method
JP3115095B2 (en) * 1992-04-20 2000-12-04 ディップソール株式会社 Electroless plating solution and plating method using the same
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
JP3866164B2 (en) * 2002-07-05 2007-01-10 京セラ株式会社 Wiring board
JP4832712B2 (en) * 2003-06-02 2011-12-07 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
JP4139347B2 (en) * 2004-03-22 2008-08-27 荏原ユージライト株式会社 Electroless nickel plating bath and electroless nickel alloy plating bath
JP5526440B2 (en) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 Printed wiring board formed using reduced deposition type electroless gold plating solution for palladium film
JP4645862B2 (en) * 2008-08-21 2011-03-09 上村工業株式会社 Electroless nickel plating bath and plating method using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005200707A (en) * 2004-01-16 2005-07-28 Noge Denki Kogyo:Kk Low stress electroless nickel plating
US20080196625A1 (en) * 2004-09-28 2008-08-21 Ahc Oberflachentechnik Gmbh & Co. Ohg Non-Galvanically Applied Nickel Alloy
WO2010045559A1 (en) * 2008-10-16 2010-04-22 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
EP2177646A1 (en) * 2008-10-17 2010-04-21 Atotech Deutschland Gmbh Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Also Published As

Publication number Publication date
WO2012052832A2 (en) 2012-04-26
JP2012087386A (en) 2012-05-10
WO2012052832A8 (en) 2012-06-21

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