WO2012046125A1 - Holding device for high power electronic components - Google Patents
Holding device for high power electronic components Download PDFInfo
- Publication number
- WO2012046125A1 WO2012046125A1 PCT/IB2011/002340 IB2011002340W WO2012046125A1 WO 2012046125 A1 WO2012046125 A1 WO 2012046125A1 IB 2011002340 W IB2011002340 W IB 2011002340W WO 2012046125 A1 WO2012046125 A1 WO 2012046125A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wedge
- holding device
- clamp
- clamp element
- designed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Definitions
- the present invention relates to a holding device for high power electronic components according to the preamble of claim 1 .
- High power electronic components for instance in the form of thyristors or transistors, generate a lot of heat and therefore have to be cooled in an efficient manner.
- an efficient cooling is sometimes difficult to achieve, for instance when the high power electronic components are to be located in a space inside a sealed subsea canister or the similar.
- the object of the present invention is to provide a simple manner of installing high power electronic components in a space inside a structural element, while making possible a simple and efficient cooling thereof.
- the holding device of the present invention is intended to be mounted in a space inside a structural element and comprises:
- first clamp element to which one or more high power electronic components are mounted or intended to be mounted and which has an outer side designed to bear against a first wall surface in said space, the first clamp element or a part thereof being of heat conducting material to be capable of conducting heat from said one or more high power electronic components to the structural element;
- a second clamp element having an outer side designed to bear against a second wall surface in said space opposite said first wall surface, and an opposite inner side facing an inner side of the first clamp element; - a first wedge member extending between the clamp elements and designed for engagement with inclined guide surfaces on the inner sides of the clamp elements;
- the wedge members are configured to force the clamp elements outwards away from each other by engagement with said guide surfaces of the clamp elements when the wedge members are displaced in the direction towards each other under the effect of the tightening means so as to push the clamp elements against said wall surfaces and thereby secure the holding device in said space.
- the distance between the clamp elements will increase by a displacement of the wedge members towards each other, and the clamp elements are thereby gradually pressed against the wall surfaces in the space in which the holding device is received until the clamp elements are clamped between said wall surfaces.
- This clamping is achieved by tightening of the tightening means, which implies that the holding device can be secured in the intended space in a quick and simple manner.
- the heat generated by the high power electronic components mounted to the first clamp element is conducted to the structural element through the heat conducting material included in the first clamp element.
- the required cooling of the high power elec- tronic components is achieved in a very simple manner without requiring any additional cooling equipment.
- FIG. 1 is a schematic perspective view from above of a holding device according to an embodiment of the present invention, as seen when mounted in the internal space of a tubular structural element, is a schematic perspective view from below of the holding device according to Fig 1 , is a schematic longitudinal section through the holding device according to Fig 1 , is a schematic planar view from above of the holding device according to Fig 1 , and is a schematic planar view from below of the holding device according to Fig 1 .
- a holding device 1 according to an embodiment of the present invention is illustrated in Figs 1 -5.
- the holding device 1 is to hold one or more high power electronic components 2, for instance in the form of thyristors and/or transistors.
- the holding device 1 is intended to be mounted in a space 3 inside a structural element 4, to thereby secure said one or more high power electronic components 2 to the structural element.
- the holding device 1 is mounted in a cylindrical space 3 in- side a structural element 4 of tubular shape.
- a holding device 1 according to the present invention may be mounted in a space between two opposite wall surfaces of any type of structural element.
- the holding device 1 comprises a first clamp element 10, to which one or more high power electronic components 2 are mounted or intended to be mounted.
- the first clamp ele- ment 10 is designed to carry at least one high power electronic component 2.
- the first clamp element 10 has an outer side 1 1 designed to bear against a first lateral wall 5 surface in the space 3 inside the structural element 4, and an opposite inner side 12.
- the holding device 1 also comprises a second clamp element 20, which has an outer side 21 designed to bear against a second lateral wall surface 6 in said space opposite said first wall surface 5, and an opposite inner side 22 facing the inner side 12 of the first clamp element 10.
- four high power electronic components 2 are mounted to the first clamp element 10 on an inner side 12 thereof.
- the shape of the outer side 1 1 , 21 of the respective clamp element 10, 20 is adapted to the shape of the space 3 intended to receive the holding device 1 .
- the shape of the outer side 1 1 , 21 of the respective clamp element 10, 20 depends on the shape of said space 3.
- the holding device 1 is designed to be mounted in a cylindrical space 3 having a circular cross-sectional shape.
- the outer side 1 1 , 21 of the respective clamp element 10, 20 is arc-shaped so as to conform to the cylindrical shape of the space 3.
- the first clamp element 10 or at least a part thereof is of heat conducting material to be capable of conducting heat from said one or more high power electronic components 2 to the structural element 4.
- the second clamp element 20 may also be designed to carry one or more high power electronic components. In the latter case, also the second clamp element 20 or at least a part thereof is of heat conducting material to be capable of conducting heat from said one or more high power electronic components to the structural element 4.
- Each clamp element 1 0, 20 is on its inner side 12, 22 provided with two inclined guide surfaces 13, 14, 23, 24, which are ar- ranged at a distance from each other and inclined in mutually opposite directions.
- a first inclined guide surface 1 3, 23 is arranged at the upper end of the respective clamp element 1 0, 20 and a second inclined guide surface 14, 24 is arranged at the lower end thereof.
- the inclined first guide surface 1 3, 23 of the respective clamp element 10, 20 extends up to an upper end surface 1 5, 25 of the clamp element, whereas the inclined second guide surface 14, 24 of the respective clamp element 10, 20 extends down to a lower end surface 16, 26 of the clamp element.
- a first wedge member 30 extends between the first and second clamp elements 10, 20 and is designed for engagement with the above-mentioned first guide surfaces 1 3, 23 of the clamp elements. Furthermore, a second wedge member 40 extends be- tween the clamp elements 10, 20 at a distance from the first wedge member 30 and is designed for engagement with the above-mentioned second guide surfaces 14, 24 of the clamp elements.
- the first wedge member 30 has an inclined first wedge surface 31 (see Fig 3) at a first end designed for engagement with the first guide surface 1 3 of the first clamp element 1 0 and an inclined second wedge surface 32 at the opposite end designed for engagement with the first guide surface 23 of the second clamp element 20. These two wedge surfaces 31 , 32 of the first wedge member 30 are inclined in mutually opposite directions.
- the second wedge member 40 has an inclined first wedge surface 41 at a first end designed for engagement with the second guide surface 14 of the first clamp element 10 and an inclined second wedge surface 42 at the opposite end designed for engagement with the second guide surface 24 of the second clamp element 20. These two wedge surfaces 41 , 42 of the second wedge member 40 are inclined in mutually opposite directions.
- the respective wedge surface 31 , 32, 41 , 42 of the wedge members is angled to mate with the associated guide surface 13, 23, 14, 24.
- the respective wedge member 30, 40 has the form of an elongated U-beam with two lateral walls 34, 35, 44, 45 and a bottom wall 36, 46 extending between the lateral walls.
- the above-mentioned wedge surfaces 31 , 32, 41 , 42 of the respective wedge member 30, 40 are formed by inclined edges at the ends of the U-beam.
- the first wedge surface 31 , 41 of the respective wedge member 30, 40 consists of a first surface section formed by an inclined edge of one lateral wall 34, 44 of the wedge member and a parallel second surface section formed by an inclined edge of the other lateral wall 35, 45 of the wedge member.
- the second wedge surface 32, 42 of the respective wedge member 30, 40 consists of a first surface section formed by an inclined edge of one lateral wall 34, 44 of the wedge member and a parallel second surface section formed by an inclined edge of the other lateral wall 35, 45 of the wedge member.
- the clamp elements 10, 20 are connected to each other through the wedge members 30, 40 and are mutually displaceable in relation to each other in the longitudinal direction of the wedge members.
- the holding device 1 is provided with tightening means 50, by means of which the wedge members 30, 40 are displaceable in the direction towards each other.
- the wedge members 30, 40 are configured to force the clamp elements 10, 20 outwards away from each other by engagement with said guide surfaces 1 3, 23, 14, 24 of the clamp elements when the wedge members 30, 40 are displaced in the direction towards each other under the effect of the tightening means 50 so as to push the clamp elements 1 0, 20 against the wall surfaces 5, 6 of the structural element 4 and thereby secure the holding device 1 in the space 3 of the struc- tural element 4.
- the tightening means 50 comprise four elongated and mutually parallel screw members 51 .
- Each screw member 51 extends between the wedge members 30, 40 and is connected to the wedge members 30, 40 in such a manner that the wedge members are displaced in the direction towards each other when the screw member 51 or a nut 52 engaged with the screw member is rotated in its tightening direction .
- the respective screw member 51 comprises an elongated screw shaft 53 and a screw head 54 connected to the screw shaft at a first end thereof. At its opposite end, the screw shaft 53 is provided with an external thread which is in engagement with an internal thread of a nut 52.
- each wedge member 30, 40 comprises two openings 37a, 37b, 47a, 47b in the form of elongated slits extending in parallel with each other in the longitudinal direction of the wedge member. Two screw shafts 53 extend through each one of said slits.
- the holding device 1 When the holding device 1 is to be mounted in a space 3 inside a structural element 4, the holding device 1 is inserted into said space 3 with the clamp elements 1 0, 20 extending along two opposite wall surfaces 5, 6 in the space. Thereupon , the screw members 51 are tightened in order to displace the wedge mem- bers 30, 40 towards each other in the axial direction of the screw members. During this displacement of the wedge members 30, 40, the respective wedge surface 31 , 32, 41 , 42 of the wedge members slides along the associated guide surface 1 3, 23, 14, 24 of the clamp elements 10, 20 and the clamp elements are thereby forced outwards away from each other by the wedge members. Hereby, the clamp elements 10, 20 are pushed against the wall surfaces 5, 6 and the holding device 1 is thereby secured between the wall surfaces 5, 6.
- the heat generated by the high power electronic components 2 is conducted to the structural element 4 through the conducting material of the first clamp element 10 and the interface formed between the outer side 1 1 of the first clamp element and the adjacent wall surface 5 of the structural element.
- the holding device 1 When so needed , the holding device 1 can be released from the wall surfaces 5, 6 by untightening the screw members 51 .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A holding device (1 ) to be mounted in a space inside a structural element (4), comprising: - a first clamp element (10) intended to carry high power electronic components (2) and designed to bear against a first wall surface in said space, the first clamp element or a part thereof being of heat conducting material to be capable of conducting heat from said electronic components to the structural element; - a second clamp element (20) designed to bear against a second wall surface in said space; - first and second wedge members (30, 40); and - tightening means (50). The wedge members are configured to force the clamp elements outwards away from each other when the wedge members are displaced in the direction towards each other under the effect of the tightening means so as to push the clamp elements against said wall surfaces and thereby secure the holding device in said space.
Description
Holding device for high power electronic components
FIELD OF THE INVENTION AND PRIOR ART The present invention relates to a holding device for high power electronic components according to the preamble of claim 1 .
High power electronic components, for instance in the form of thyristors or transistors, generate a lot of heat and therefore have to be cooled in an efficient manner. However, an efficient cooling is sometimes difficult to achieve, for instance when the high power electronic components are to be located in a space inside a sealed subsea canister or the similar. SUMMARY OF THE INVENTION
The object of the present invention is to provide a simple manner of installing high power electronic components in a space inside a structural element, while making possible a simple and efficient cooling thereof.
According to the invention, this object is achieved by a holding device having the features defined in claim 1 . The holding device of the present invention is intended to be mounted in a space inside a structural element and comprises:
- a first clamp element, to which one or more high power electronic components are mounted or intended to be mounted and which has an outer side designed to bear against a first wall surface in said space, the first clamp element or a part thereof being of heat conducting material to be capable of conducting heat from said one or more high power electronic components to the structural element;
- a second clamp element having an outer side designed to bear against a second wall surface in said space opposite said first wall surface, and an opposite inner side facing an inner side of the first clamp element;
- a first wedge member extending between the clamp elements and designed for engagement with inclined guide surfaces on the inner sides of the clamp elements;
- a second wedge member extending between the clamp ele- ments at a distance from the first wedge member and designed for engagement with inclined guide surfaces on the inner sides of the clamp elements; and
- tightening means, by means of which the wedge members are displaceable in the direction towards each other.
The wedge members are configured to force the clamp elements outwards away from each other by engagement with said guide surfaces of the clamp elements when the wedge members are displaced in the direction towards each other under the effect of the tightening means so as to push the clamp elements against said wall surfaces and thereby secure the holding device in said space.
Thus, the distance between the clamp elements will increase by a displacement of the wedge members towards each other, and the clamp elements are thereby gradually pressed against the wall surfaces in the space in which the holding device is received until the clamp elements are clamped between said wall surfaces. This clamping is achieved by tightening of the tightening means, which implies that the holding device can be secured in the intended space in a quick and simple manner. The heat generated by the high power electronic components mounted to the first clamp element is conducted to the structural element through the heat conducting material included in the first clamp element. Hereby, the required cooling of the high power elec- tronic components is achieved in a very simple manner without requiring any additional cooling equipment.
Further advantages as well as advantageous features of the holding device according to the present invention will appear from the dependent claims and the following description.
BRIEF DESCRIPTION OF THE DRAWINGS
With reference to the appended drawings, a specific description of preferred embodiments of the invention cited as examples fol- lows below. In the drawings: is a schematic perspective view from above of a holding device according to an embodiment of the present invention, as seen when mounted in the internal space of a tubular structural element, is a schematic perspective view from below of the holding device according to Fig 1 , is a schematic longitudinal section through the holding device according to Fig 1 , is a schematic planar view from above of the holding device according to Fig 1 , and is a schematic planar view from below of the holding device according to Fig 1 .
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
A holding device 1 according to an embodiment of the present invention is illustrated in Figs 1 -5. The holding device 1 is to hold one or more high power electronic components 2, for instance in the form of thyristors and/or transistors. The holding device 1 is intended to be mounted in a space 3 inside a structural element 4, to thereby secure said one or more high power electronic components 2 to the structural element. In the illustrated example, the holding device 1 is mounted in a cylindrical space 3 in- side a structural element 4 of tubular shape. However, a holding device 1 according to the present invention may be mounted in a
space between two opposite wall surfaces of any type of structural element.
In Figs 1 and 2, only one half of the structural element 4 is shown for the sake of clarity.
The holding device 1 comprises a first clamp element 10, to which one or more high power electronic components 2 are mounted or intended to be mounted. Thus, the first clamp ele- ment 10 is designed to carry at least one high power electronic component 2. The first clamp element 10 has an outer side 1 1 designed to bear against a first lateral wall 5 surface in the space 3 inside the structural element 4, and an opposite inner side 12. The holding device 1 also comprises a second clamp element 20, which has an outer side 21 designed to bear against a second lateral wall surface 6 in said space opposite said first wall surface 5, and an opposite inner side 22 facing the inner side 12 of the first clamp element 10. In the illustrated example, four high power electronic components 2 are mounted to the first clamp element 10 on an inner side 12 thereof.
The shape of the outer side 1 1 , 21 of the respective clamp element 10, 20 is adapted to the shape of the space 3 intended to receive the holding device 1 . Thus, the shape of the outer side 1 1 , 21 of the respective clamp element 10, 20 depends on the shape of said space 3. In the illustrated example, the holding device 1 is designed to be mounted in a cylindrical space 3 having a circular cross-sectional shape. In this case, the outer side 1 1 , 21 of the respective clamp element 10, 20 is arc-shaped so as to conform to the cylindrical shape of the space 3.
The first clamp element 10 or at least a part thereof is of heat conducting material to be capable of conducting heat from said one or more high power electronic components 2 to the structural element 4.
The second clamp element 20 may also be designed to carry one or more high power electronic components. In the latter case, also the second clamp element 20 or at least a part thereof is of heat conducting material to be capable of conducting heat from said one or more high power electronic components to the structural element 4.
Each clamp element 1 0, 20 is on its inner side 12, 22 provided with two inclined guide surfaces 13, 14, 23, 24, which are ar- ranged at a distance from each other and inclined in mutually opposite directions. A first inclined guide surface 1 3, 23 is arranged at the upper end of the respective clamp element 1 0, 20 and a second inclined guide surface 14, 24 is arranged at the lower end thereof. In the illustrated example, the inclined first guide surface 1 3, 23 of the respective clamp element 10, 20 extends up to an upper end surface 1 5, 25 of the clamp element, whereas the inclined second guide surface 14, 24 of the respective clamp element 10, 20 extends down to a lower end surface 16, 26 of the clamp element.
A first wedge member 30 extends between the first and second clamp elements 10, 20 and is designed for engagement with the above-mentioned first guide surfaces 1 3, 23 of the clamp elements. Furthermore, a second wedge member 40 extends be- tween the clamp elements 10, 20 at a distance from the first wedge member 30 and is designed for engagement with the above-mentioned second guide surfaces 14, 24 of the clamp elements. The first wedge member 30 has an inclined first wedge surface 31 (see Fig 3) at a first end designed for engagement with the first guide surface 1 3 of the first clamp element 1 0 and an inclined second wedge surface 32 at the opposite end designed for engagement with the first guide surface 23 of the second clamp element 20. These two wedge surfaces 31 , 32 of the first wedge member 30 are inclined in mutually opposite directions. The second wedge member 40 has an inclined first wedge surface 41 at
a first end designed for engagement with the second guide surface 14 of the first clamp element 10 and an inclined second wedge surface 42 at the opposite end designed for engagement with the second guide surface 24 of the second clamp element 20. These two wedge surfaces 41 , 42 of the second wedge member 40 are inclined in mutually opposite directions. The respective wedge surface 31 , 32, 41 , 42 of the wedge members is angled to mate with the associated guide surface 13, 23, 14, 24.
In the illustrated embodiment, the respective wedge member 30, 40 has the form of an elongated U-beam with two lateral walls 34, 35, 44, 45 and a bottom wall 36, 46 extending between the lateral walls. The above-mentioned wedge surfaces 31 , 32, 41 , 42 of the respective wedge member 30, 40 are formed by inclined edges at the ends of the U-beam. The first wedge surface 31 , 41 of the respective wedge member 30, 40 consists of a first surface section formed by an inclined edge of one lateral wall 34, 44 of the wedge member and a parallel second surface section formed by an inclined edge of the other lateral wall 35, 45 of the wedge member. In the same manner, the second wedge surface 32, 42 of the respective wedge member 30, 40 consists of a first surface section formed by an inclined edge of one lateral wall 34, 44 of the wedge member and a parallel second surface section formed by an inclined edge of the other lateral wall 35, 45 of the wedge member.
The clamp elements 10, 20 are connected to each other through the wedge members 30, 40 and are mutually displaceable in relation to each other in the longitudinal direction of the wedge members.
The holding device 1 is provided with tightening means 50, by means of which the wedge members 30, 40 are displaceable in the direction towards each other. The wedge members 30, 40 are configured to force the clamp elements 10, 20 outwards away from each other by engagement with said guide surfaces 1 3, 23, 14, 24 of the clamp elements when the wedge members 30, 40
are displaced in the direction towards each other under the effect of the tightening means 50 so as to push the clamp elements 1 0, 20 against the wall surfaces 5, 6 of the structural element 4 and thereby secure the holding device 1 in the space 3 of the struc- tural element 4.
In the illustrated embodiment, the tightening means 50 comprise four elongated and mutually parallel screw members 51 . Each screw member 51 extends between the wedge members 30, 40 and is connected to the wedge members 30, 40 in such a manner that the wedge members are displaced in the direction towards each other when the screw member 51 or a nut 52 engaged with the screw member is rotated in its tightening direction . The respective screw member 51 comprises an elongated screw shaft 53 and a screw head 54 connected to the screw shaft at a first end thereof. At its opposite end, the screw shaft 53 is provided with an external thread which is in engagement with an internal thread of a nut 52. The screw shaft 53 extends through an opening 37a, 37b in the first wedge member 30 and an opening 47a, 47b in the second wedge member 40 with the screw head 54 and the nut 52 bearing against the bottom wall 36, 46 of a respective wedge member. Thus, the screw head 54 and the nut 52 are wider than said openings 37a, 37b, 47a, 47b. In the illustrated example, each wedge member 30, 40 comprises two openings 37a, 37b, 47a, 47b in the form of elongated slits extending in parallel with each other in the longitudinal direction of the wedge member. Two screw shafts 53 extend through each one of said slits. When the holding device 1 is to be mounted in a space 3 inside a structural element 4, the holding device 1 is inserted into said space 3 with the clamp elements 1 0, 20 extending along two opposite wall surfaces 5, 6 in the space. Thereupon , the screw members 51 are tightened in order to displace the wedge mem- bers 30, 40 towards each other in the axial direction of the screw members. During this displacement of the wedge members 30, 40, the respective wedge surface 31 , 32, 41 , 42 of the wedge
members slides along the associated guide surface 1 3, 23, 14, 24 of the clamp elements 10, 20 and the clamp elements are thereby forced outwards away from each other by the wedge members. Hereby, the clamp elements 10, 20 are pushed against the wall surfaces 5, 6 and the holding device 1 is thereby secured between the wall surfaces 5, 6.
The heat generated by the high power electronic components 2 is conducted to the structural element 4 through the conducting material of the first clamp element 10 and the interface formed between the outer side 1 1 of the first clamp element and the adjacent wall surface 5 of the structural element.
When so needed , the holding device 1 can be released from the wall surfaces 5, 6 by untightening the screw members 51 .
The invention is of course not in any way restricted to the embodiments described above. On the contrary, many possibilities to modifications thereof will be apparent to a person with ordi- nary skill in the art without departing from the basic idea of the invention such as defined in the appended claims.
Claims
A holding device for high power electronic components to be mounted in a space inside a structural element, characterized in that the holding device (1 ) comprises:
- a first clamp element ( 10), to which one or more high power electronic components (2) are mounted or intended to be mounted and which has an outer side (1 1 ) designed to bear against a first wall surface in said space, the first clamp element (10) or a part thereof being of heat conducting material to be capable of conducting heat from said one or more high power electronic components (2) to the structural element;
- a second clamp element (20) having an outer side (21 ) designed to bear against a second wall surface in said space opposite said first wall surface, and an opposite inner side (22) facing an inner side ( 12) of the first clamp element (1 0);
- a first wedge member (30) extending between the clamp elements (10, 20) and designed for engagement with inclined guide surfaces (1 3, 23) on the inner sides of the clamp elements;
- a second wedge member (40) extending between the clamp elements (10, 20) at a distance from the first wedge member (30) and designed for engagement with inclined guide surfaces ( 14, 24) on the inner sides of the clamp elements; and
- tightening means (50), by means of which the wedge members (30, 40) are displaceable in the direction towards each other, wherein the wedge members (30, 40) are configured to force the clamp elements ( 10, 20) outwards away from each other by engagement with said guide surfaces ( 13, 23, 14, 24) of the clamp elements when the wedge members (30, 40) are displaced in the direction towards each other under the effect of the tightening means (50) so as to push the clamp elements ( 10, 20) against said wall surfaces and thereby secure the holding device ( 1 ) in said space.
A holding device according to claim 1 , characterized in:
- that the first wedge member (30) has an inclined first wedge surface (31 ) at a first end designed for engagement with an inclined first guide surface (13) of the first clamp element ( 10) and an inclined second wedge surface (32) at the opposite end designed for engagement with an inclined first guide surface (23) of the second clamp element (20); and
- that the second wedge member (40) has an inclined first wedge surface (41 ) at a first end designed for engagement with an inclined second guide surface ( 14) of the first clamp element (10) and an inclined second wedge surface (42) at the opposite end designed for engagement with an inclined second guide surface (24) of the second clamp element (20).
A holding device according to claim 2, characterized in that the respective wedge member (30, 40) has the form of an elongated U-beam.
A holding device according to claim 3, characterized in that said first and second wedge surfaces (31 , 32, 41 , 42) of the respective wedge member (30, 40) are formed by inclined edges at the opposite ends of the U-beam.
A holding device according to any of claims 1 -4, characterized in that the tightening means (50) comprise at least one elongated screw member (51 ), which extends between the wedge members (30, 40) and which is connected to the wedge members in such a manner that the wedge members are displaced in the direction towards each other when the screw member (51 ) or a nut (52) engaged with the screw member is rotated in its tightening direction.
A holding device according to claim 5, characterized in that the tightening means (50) comprise two or more such screw members (51 ) extending in parallel with each other between the wedge members (30, 40).
A holding device according to claim 5 or 6, characterized in that the respective screw member (51 ) extends through an opening (37a, 37b) in the first wedge member (30) and an opening (47a, 47b) in the second wedge member (40).
A holding device according to any of claims 1 -7, characterized in that the inclined first guide surface (1 3, 23) of the respective clamp element ( 10, 20) extends up to an upper end surface ( 15, 25) of the clamp element, whereas the inclined second guide surface ( 14, 24) of the respective clamp element ( 1 0, 20) extends down to a lower end surface (16, 26) of the clamp element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO20101391 | 2010-10-07 | ||
| NO20101391A NO332285B1 (en) | 2010-10-07 | 2010-10-07 | Fastener for high-power electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012046125A1 true WO2012046125A1 (en) | 2012-04-12 |
Family
ID=45927278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2011/002340 WO2012046125A1 (en) | 2010-10-07 | 2011-10-05 | Holding device for high power electronic components |
Country Status (2)
| Country | Link |
|---|---|
| NO (1) | NO332285B1 (en) |
| WO (1) | WO2012046125A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017102603A1 (en) * | 2015-12-15 | 2017-06-22 | Onesubsea Ip Uk Limited | Gas filled subsea electronics housing with spring engaged heat sink |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400858A (en) * | 1981-01-30 | 1983-08-30 | Tele-Drill Inc, | Heat sink/retainer clip for a downhole electronics package of a measurements-while-drilling telemetry system |
| US4858068A (en) * | 1986-03-21 | 1989-08-15 | Alcatel Cit | Electronic circuit housing |
| WO2006019307A1 (en) * | 2004-08-19 | 2006-02-23 | Sicom As | Subsea electronic assembly |
-
2010
- 2010-10-07 NO NO20101391A patent/NO332285B1/en not_active IP Right Cessation
-
2011
- 2011-10-05 WO PCT/IB2011/002340 patent/WO2012046125A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400858A (en) * | 1981-01-30 | 1983-08-30 | Tele-Drill Inc, | Heat sink/retainer clip for a downhole electronics package of a measurements-while-drilling telemetry system |
| US4858068A (en) * | 1986-03-21 | 1989-08-15 | Alcatel Cit | Electronic circuit housing |
| WO2006019307A1 (en) * | 2004-08-19 | 2006-02-23 | Sicom As | Subsea electronic assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017102603A1 (en) * | 2015-12-15 | 2017-06-22 | Onesubsea Ip Uk Limited | Gas filled subsea electronics housing with spring engaged heat sink |
| US9806503B2 (en) | 2015-12-15 | 2017-10-31 | Onesubsea Ip Uk Limited | Gas filled subsea electronics housing with spring engaged heat sink |
| US10411443B2 (en) | 2015-12-15 | 2019-09-10 | Onesubsea Ip Uk Limited | Gas filled subsea electronics housing with spring engaged heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| NO332285B1 (en) | 2012-08-13 |
| NO20101391A1 (en) | 2012-04-09 |
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