WO2012036460A3 - 표면 탄성파 기반 마이크로 센서를 이용한 무선측정장치 및 그 방법 - Google Patents
표면 탄성파 기반 마이크로 센서를 이용한 무선측정장치 및 그 방법 Download PDFInfo
- Publication number
- WO2012036460A3 WO2012036460A3 PCT/KR2011/006775 KR2011006775W WO2012036460A3 WO 2012036460 A3 WO2012036460 A3 WO 2012036460A3 KR 2011006775 W KR2011006775 W KR 2011006775W WO 2012036460 A3 WO2012036460 A3 WO 2012036460A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pulse signals
- saw
- micro sensor
- based micro
- measurement apparatus
- Prior art date
Links
- 238000010897 surface acoustic wave method Methods 0.000 title abstract 10
- 238000005259 measurement Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 230000007613 environmental effect Effects 0.000 abstract 4
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
- G01L1/162—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
- G01L1/165—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators with acoustic surface waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
- G01L9/0025—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element with acoustic surface waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
- G01N29/022—Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2481—Wireless probes, e.g. with transponders or radio links
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
- G06K19/0675—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks the resonating marks being of the surface acoustic wave [SAW] kind
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0717—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0256—Adsorption, desorption, surface mass change, e.g. on biosensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
표면 탄성파 기반 마이크로 센서를 이용한 무선측정장치 및 그 방법이 개시된다. 본 발명의 실시예에 따른 표면 탄성파 기반 마이크로 센서를 이용한 무선측정장치는, 무선으로 수신되는 펄스 신호를 표면 탄성파(SAW : Surface Acoustic Wave)로 변환하고 환경 요소의 변화를 측정하기 위해서 변환된 표면 탄성파를 반사시켜 복수의 펄스 신호들을 발생해서 무선으로 송신하는 SAW 기반 마이크로 센서; 와 환경 요소의 변화를 측정하기 펄스 신호를 발생하여 무선으로 상기 SAW 기반 마이크로 센서로 송신하고, 송신된 펄스 신호가 SAW 마이크로 센서에서 반사되어 수신되는 복수의 펄스 신호들간의 간격이, 설정된 환경 요소의 펄스 신호들간의 간격에 해당될 때마다 펄스 신호를 발생해서 무선으로 SAW 기반 마이크로 센서로 송신하고 일정 시간 동안 펄스 신호의 발생횟수를 카운트하여, 환경 요소의 변화를 측정하는 리더기를 포함한다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/824,005 US9116034B2 (en) | 2010-09-17 | 2011-09-14 | Wireless measurement device using surface acoustic wave (SAW)-based micro sensor and method of using the saw-based micro sensor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100092034A KR101202878B1 (ko) | 2010-09-17 | 2010-09-17 | 표면 탄성파 기반 마이크로 센서를 이용한 무선측정장치 및 그 방법 |
KR10-2010-0092034 | 2010-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012036460A2 WO2012036460A2 (ko) | 2012-03-22 |
WO2012036460A3 true WO2012036460A3 (ko) | 2012-05-18 |
Family
ID=45832096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/006775 WO2012036460A2 (ko) | 2010-09-17 | 2011-09-14 | 표면 탄성파 기반 마이크로 센서를 이용한 무선측정장치 및 그 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9116034B2 (ko) |
KR (1) | KR101202878B1 (ko) |
WO (1) | WO2012036460A2 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101396545B1 (ko) * | 2013-12-27 | 2014-05-20 | (주)서전기전 | 다중온도센서 센싱 시스템을 구비한 배전반 |
KR101371419B1 (ko) * | 2013-12-27 | 2014-03-07 | (주)서전기전 | Saw 온도 센서를 활용한 온도 센싱 시스템 |
KR102238114B1 (ko) * | 2014-07-16 | 2021-04-08 | 아주대학교산학협력단 | 니오브산 리튬을 이용한 표면탄성파 바이오센서 |
KR101654367B1 (ko) | 2016-02-17 | 2016-09-05 | 지투파워 (주) | 표면탄성파 검출에 의한 배전반(고압배전반, 저압배전반, 분전반, 모터제어반)의 무선 온도감지 시스템 |
KR101648803B1 (ko) | 2016-02-17 | 2016-08-17 | 삼덕전기 주식회사 | 배전반(고압배전반, 저압배전반, 분전반, 모터제어반)의 무선 온도검출 시스템 |
WO2017200117A1 (ko) * | 2016-05-17 | 2017-11-23 | 한빛이디에스(주) | Saw소자를 이용한 무선 온도 측정 장치 |
IT201600079657A1 (it) * | 2016-07-28 | 2018-01-28 | Agenzia Naz Per Le Nuove Tecnologie Lenergia E Lo Sviluppo Economico Sostenibile Enea | Dispositivo e sistema di misura |
KR101831426B1 (ko) | 2017-12-06 | 2018-02-22 | (주)서전기전 | 부분 방전 및 온도를 하나의 센서로 측정하는 시스템을 갖춘 배전반 |
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JP2008204234A (ja) * | 2007-02-21 | 2008-09-04 | Teruya:Kk | Rfidタグ内蔵型sawセンサ及び計測システム |
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2010
- 2010-09-17 KR KR1020100092034A patent/KR101202878B1/ko active IP Right Grant
-
2011
- 2011-09-14 US US13/824,005 patent/US9116034B2/en active Active
- 2011-09-14 WO PCT/KR2011/006775 patent/WO2012036460A2/ko active Application Filing
Patent Citations (4)
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JP2004320319A (ja) * | 2003-04-15 | 2004-11-11 | Sony Corp | 無線通信システムおよび方法、無線通信装置および方法、並びに、プログラム |
JP2005121498A (ja) * | 2003-10-17 | 2005-05-12 | Sony Corp | 弾性表面波センシングシステム |
KR20070096217A (ko) * | 2006-03-21 | 2007-10-02 | 엘지전자 주식회사 | Rfid 태그 및 그 제조방법 |
JP2008204234A (ja) * | 2007-02-21 | 2008-09-04 | Teruya:Kk | Rfidタグ内蔵型sawセンサ及び計測システム |
Also Published As
Publication number | Publication date |
---|---|
US20130174662A1 (en) | 2013-07-11 |
KR20120029906A (ko) | 2012-03-27 |
WO2012036460A2 (ko) | 2012-03-22 |
US9116034B2 (en) | 2015-08-25 |
KR101202878B1 (ko) | 2012-11-19 |
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