WO2012035172A3 - Assembly and method for influencing the kinetics of chemical reactions by means of acoustic surface waves - Google Patents
Assembly and method for influencing the kinetics of chemical reactions by means of acoustic surface waves Download PDFInfo
- Publication number
- WO2012035172A3 WO2012035172A3 PCT/EP2011/066251 EP2011066251W WO2012035172A3 WO 2012035172 A3 WO2012035172 A3 WO 2012035172A3 EP 2011066251 W EP2011066251 W EP 2011066251W WO 2012035172 A3 WO2012035172 A3 WO 2012035172A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- waves
- kinetics
- influencing
- surface waves
- assembly
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention relates to an assembly for carrying out a chemical reaction, comprising a reaction vessel (8) in which at least one active surface (11) is arranged, which is in contact with a fluid (31) at least in some sections, means (4) for generating acoustic surface waves (6) in the at least one active surface (11), wherein at least some of the surface waves (6) excited in the at least one active surface (11) are converted into volume sound waves (7) within the fluid (31) such that a chemical reaction taking place at the at least one active surface (11), or a preceding physical event, is influenced, in particular accelerated, by the surface waves (6) in the at least one active surface (11) and/or by the volume sound waves (7) in the fluid (31). The invention further relates to methods for influencing the kinetics of chemical reactions by means of acoustic surface waves.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11771050.9A EP2616572B1 (en) | 2010-09-17 | 2011-09-19 | Assembly and method for influencing the kinetics of chemical reactions by means of acoustic surface waves |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010040996 | 2010-09-17 | ||
DE102010040996.0 | 2010-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012035172A2 WO2012035172A2 (en) | 2012-03-22 |
WO2012035172A3 true WO2012035172A3 (en) | 2012-12-27 |
Family
ID=44897705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/066251 WO2012035172A2 (en) | 2010-09-17 | 2011-09-19 | Assembly and method for influencing the kinetics of chemical reactions by means of acoustic surface waves |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2616572B1 (en) |
WO (1) | WO2012035172A2 (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0890658A2 (en) * | 1997-06-11 | 1999-01-13 | Reynolds Tech Fabricators, Incorporated | Megasonic plating system |
US6368482B1 (en) * | 2000-09-19 | 2002-04-09 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) | Plating processes utilizing high intensity acoustic beams |
US20030064586A1 (en) * | 2001-09-28 | 2003-04-03 | Merchant Sailesh Mansinh | Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface |
US20040022957A1 (en) * | 2000-07-13 | 2004-02-05 | Thompson G Alan | Process for deposition of metal on a surface |
US20040168706A1 (en) * | 2003-02-28 | 2004-09-02 | Lam Research Corporation | Method and apparatus for megasonic cleaning with reflected acoustic waves |
US20050227488A1 (en) * | 2004-03-31 | 2005-10-13 | O'brien Kevin P | Capping of copper structures in hydrophobic ILD using aqueous electro-less bath |
DE102007043563A1 (en) * | 2007-09-13 | 2009-03-19 | Bell, Guido, Dr. | Etching, galvanizing, cleaning and photoresist developing of a substrate with megasonic support, comprise carrying out megasonic excitation by standard megasonic-oscillation of cool bar- and atomizer application |
RU2353713C1 (en) * | 2008-02-21 | 2009-04-27 | Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") | Cadmium-plating electrolyte and method of cadmic coatings plating on metal products |
-
2011
- 2011-09-19 WO PCT/EP2011/066251 patent/WO2012035172A2/en active Application Filing
- 2011-09-19 EP EP11771050.9A patent/EP2616572B1/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0890658A2 (en) * | 1997-06-11 | 1999-01-13 | Reynolds Tech Fabricators, Incorporated | Megasonic plating system |
US20040022957A1 (en) * | 2000-07-13 | 2004-02-05 | Thompson G Alan | Process for deposition of metal on a surface |
US6368482B1 (en) * | 2000-09-19 | 2002-04-09 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) | Plating processes utilizing high intensity acoustic beams |
US20030064586A1 (en) * | 2001-09-28 | 2003-04-03 | Merchant Sailesh Mansinh | Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface |
US20040168706A1 (en) * | 2003-02-28 | 2004-09-02 | Lam Research Corporation | Method and apparatus for megasonic cleaning with reflected acoustic waves |
US20050227488A1 (en) * | 2004-03-31 | 2005-10-13 | O'brien Kevin P | Capping of copper structures in hydrophobic ILD using aqueous electro-less bath |
DE102007043563A1 (en) * | 2007-09-13 | 2009-03-19 | Bell, Guido, Dr. | Etching, galvanizing, cleaning and photoresist developing of a substrate with megasonic support, comprise carrying out megasonic excitation by standard megasonic-oscillation of cool bar- and atomizer application |
RU2353713C1 (en) * | 2008-02-21 | 2009-04-27 | Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") | Cadmium-plating electrolyte and method of cadmic coatings plating on metal products |
Non-Patent Citations (1)
Title |
---|
JENS GEORG KAUFMANN ET AL: "Megasonic agitation for enhanced electrodeposition of copper", MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER, BERLIN, DE, vol. 15, no. 8, 2 June 2009 (2009-06-02), pages 1245 - 1254, XP019719778, ISSN: 1432-1858 * |
Also Published As
Publication number | Publication date |
---|---|
EP2616572A2 (en) | 2013-07-24 |
EP2616572B1 (en) | 2019-07-10 |
WO2012035172A2 (en) | 2012-03-22 |
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