WO2012033184A1 - High frequency module - Google Patents

High frequency module Download PDF

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Publication number
WO2012033184A1
WO2012033184A1 PCT/JP2011/070553 JP2011070553W WO2012033184A1 WO 2012033184 A1 WO2012033184 A1 WO 2012033184A1 JP 2011070553 W JP2011070553 W JP 2011070553W WO 2012033184 A1 WO2012033184 A1 WO 2012033184A1
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Prior art keywords
ground terminal
wiring board
printed wiring
transmission
frequency module
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PCT/JP2011/070553
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French (fr)
Japanese (ja)
Inventor
貴博 馬場
勉 家木
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株式会社村田製作所
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Priority to JP2012518329A priority Critical patent/JP5041109B2/en
Publication of WO2012033184A1 publication Critical patent/WO2012033184A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits

Definitions

  • the present invention relates to a high-frequency module, and more particularly to a high-frequency module used as a reader / writer of an RFID (Radio Frequency Identification) system.
  • RFID Radio Frequency Identification
  • Patent Document 1 discloses a loop antenna that supplies electric power and a transmission signal to a non-contact IC card by electromagnetic induction and acquires a reception signal from the non-contact IC card by load fluctuation, and for resonating the loop antenna at a desired frequency.
  • a resonance circuit unit, a radio transmission unit that supplies power and transmission data to the loop antenna via the resonance circuit unit, and a radio reception unit that acquires a reception signal from the loop antenna via the resonance circuit unit It is configured to demodulate data from a contactless IC card from a signal by a demodulation circuit, and a resonance circuit unit, a wireless transmission unit, and a wireless reception unit are coupled via any one of a directional coupler, a circulator, and an isolator.
  • a non-contact IC card reading / writing device is described.
  • the response signal is weak in the passive RFID tag.
  • the non-contact IC card reading / writing device if the isolation characteristic from transmission to reception by a coupler or the like is poor, transmission waves having the same frequency as the reception wave from the RFID tag overlap. There is a possibility that reception is not possible due to deterioration in the S / N ratio of the received wave that is input to the receiving unit. Further, since the current due to the transmission wave is large, the amount of heat generated by the terminating resistor such as a coupler increases. When this heat is transmitted to the entire apparatus (module), there is a possibility that the reading characteristic is deteriorated or the operation becomes unstable.
  • an object of the present invention is to provide a high-frequency module that can improve the isolation characteristics between the transmitter and the receiver. Another object of the present invention is to provide a high-frequency module capable of improving the heat dissipation efficiency of a termination resistor provided in a transmission / reception branching element.
  • the high-frequency module is A transmission / reception branch element having an input / output terminal connected to the antenna and a ground terminal connected to the ground; A printed wiring board on which the transmission / reception branching element is mounted; In high frequency module with A first ground terminal group arranged in a first direction on a perpendicular edge of the printed wiring board, and a second ground terminal group arranged in a second direction substantially orthogonal to the first direction, Is provided,
  • the transmission / reception branching element is mounted in the corner defined by the orthogonal edge of the printed wiring board in proximity to the first ground terminal group and the second ground terminal group, It is characterized by.
  • the ground terminal of the transmission / reception branch element is printed wiring. It can be arranged at a short distance on the ground terminal group of the board, or can be arranged so that the ground point of the shield case and the ground terminal of the transmitting / receiving branching element are shortest when the shield case is put on the printed wiring board.
  • the ground potential of the transmitting / receiving branching element is stabilized, the isolation characteristic is improved, and the S / N ratio of the received wave is improved. And communication performance becomes stable and communication distance becomes long.
  • the high-frequency module according to the second aspect of the present invention is A transmission / reception branch element having an input / output terminal connected to the antenna and a ground terminal connected to the ground; A printed wiring board on which the transmission / reception branching element is mounted; In high frequency module with A first ground terminal group arranged in a first direction on a perpendicular edge of the printed wiring board, and a second ground terminal group arranged in a second direction substantially orthogonal to the first direction, Is provided,
  • the transmission / reception branch element has a termination resistor, and the termination resistance is arranged on the edge side of the printed wiring board from the transmission / reception branch element, It is characterized by.
  • the terminating resistance of the transmission / reception branch element is arranged on the edge side of the printed wiring board with respect to the transmission / reception branch element, any ground terminal of the first or second ground terminal group The heat is directly radiated to the printed wiring board via the, thereby improving the heat radiation efficiency. As a result, the temperature rise of the module is suppressed, and the communication performance and operation are stabilized.
  • the isolation characteristic between the transmission unit and the reception unit is improved, or the heat dissipation efficiency of the termination resistor provided in the transmission / reception branching element is improved.
  • the isolation characteristic between the transmission unit and the reception unit is improved, or the heat dissipation efficiency of the termination resistor provided in the transmission / reception branching element is improved.
  • the high frequency module 1 includes a printed wiring board 10 and a metal case 100.
  • the printed wiring board 10 has a high-frequency signal processing circuit 20, a balun 21 on the transmission side, an amplifier 22, a band-pass filter 23, a balun 24 on the reception side, a transmission side and a reception side, and an antenna.
  • a coupler (directional coupler) 40, an oscillator 25, and a regulator 26 are connected.
  • the high-frequency signal processing circuit 20 processes a high-frequency signal used in the RFID system, and the high-frequency module 1 is configured as a reader / writer of the RFID system. Therefore, the antenna 30 communicates with the RFID tag 31 arranged at a short distance by a high frequency signal.
  • the high frequency signal processing circuit 20 is connected to a computer 36 via a bus 35.
  • Each of the mounted components constitutes the circuit shown in FIG. 3, and the circuit configuration itself and its operation are well known.
  • the transmission signal is output from the terminal TX of the processing circuit 20 and transmitted to the coupler 40 via the balun 21, the amplifier 22, and the band pass filter 23, and from the antenna 30 (ANT) via the coupler 40. Radiated.
  • the received signal input from the antenna 30 (ANT) is transmitted to the balun 24 through the coupler 40 and input to the processing circuit 20 from the terminal RX.
  • the metal case 100 functions as an electromagnetic shield member and has four legs 101a to 101d as shown in FIG. 1, and these legs 101a to 101d are edges of the printed wiring board 10 described below. Is connected to a ground terminal GND (see FIG. 4) provided in the section.
  • the printed wiring board 10 has a rectangular shape in plan view. As shown in FIG. 4, the four terminals are provided with an antenna terminal ANT, a ground terminal GND, power supply terminals VCC1 and VCC2, a control terminal CON, and an input / output terminal IF. Has been placed. At two edge portions 10x and 10y orthogonal to each other, the ground terminals GND of the edge portion 10x are arranged in the first direction X, and the ground terminals GND of the edge portion 10y are arranged in the second direction Y.
  • the printed wiring board 10 is composed of six layers 10a to 10f, and the various electronic components 20 to 26, 40 are mounted on the first layer 10a on the upper surface. Illustration of the pattern is omitted. Ground electrodes 51, 52, 53, 54a, 54b, 55 and necessary wiring patterns (all not shown) are formed on the second layer 10b to the sixth layer 10f, respectively. Each terminal is formed as a via-hole conductor in the state of a mother substrate in each of the layers 10a to 10f, and later cut along lines A and B.
  • the coupler 40 has various terminals 41 to 46 formed on the surface thereof, the input terminal 42 is connected to the transmission terminal TX of the high-frequency signal processing circuit 20, and the output terminal 43 is a high-frequency signal processing circuit.
  • the input / output terminal 44 is connected to the antenna terminal ANT.
  • the isolation terminal 41 is connected to a ground terminal GND1 provided on the printed wiring board 10 through a termination resistor R. Terminals 45 and 46 are ground terminals.
  • the coupler 40 has an equivalent circuit shown in FIG. 7, and the main line L1 and the sub-line L2 are constituted by loop-shaped conductors.
  • the ground electrode 51 is formed on the base material layer 47a
  • the line electrode L1 is formed on the base material layers 47b and 47c
  • the base material layers 47d and 47e are respectively formed.
  • the line electrode L2 was formed
  • the ground electrode 52 was formed on the base material layer 47f
  • the terminals 41 to 46 were formed on the two edges of the base material layer 47g and the respective edges of the base material layers 47a to 47f.
  • the base material layers 47a to 47g are made of ceramic green sheets.
  • the line electrode L1 is a main line, the input / output terminal 44 is connected to the antenna terminal ANT, and the input terminal 42 is connected to the transmission terminal TX.
  • the line electrode L2 is a sub line, the output terminal 43 is connected to the receiving terminal RX, and the isolation terminal 41 is connected to the ground terminal GND1 via the termination resistor R.
  • the length between the input / output terminal 44 and the input terminal 42 is the ( ⁇ / 4) length of the wavelength ⁇ of the operating frequency, and the length from the input terminal 42 to the output terminal 43 via the input / output terminal 44 is ( ⁇ / 2) Length
  • the length from the input / output terminal 44 to the isolation terminal 41 via the input terminal 42 is ( ⁇ / 2).
  • the signal reflected from the input terminal 42 to reach the isolation terminal 41 includes a path from the input / output terminal 44 to the input terminal 42 and an isolation terminal from the input terminal 42.
  • the paths up to 41 are opposite in phase with the same ( ⁇ / 4) length, so they cancel each other and do not reach the isolation terminal 41.
  • the signal reflected from the input / output terminal 44 and reaching the output terminal 43 is a path from the input terminal 42 to the input / output terminal 44 and the input / output terminal 44 to the output terminal 43.
  • the opposite paths are the same ( ⁇ / 4) length in the path up to, so they cancel each other and do not reach the output terminal 43.
  • the isolation terminal 41 On the other hand, from the input terminal 42 to the isolation terminal 41, it is distributed and output according to the coupling degree of the line in the coupler 40, but the impedance characteristic of the isolation terminal 41 is terminated with a predetermined value (usually 50 ⁇ ). Thus, no reflection from the isolation terminal 41 occurs. Therefore, it is important to accurately adjust the impedance characteristic of the isolation terminal 41 to a desired value.
  • the isolation terminal 41 and the termination resistor R connected thereto are connected to the ground terminal group GND of the printed wiring board 10 as much as possible. It is preferable to arrange in the vicinity.
  • the coupler 40 is mounted in the corner of the printed wiring board 10 in proximity to the ground terminal group GND arranged in the first direction X and the second direction Y. Therefore, the ground terminals 44 and 45 of the coupler 40 can be arranged at a short distance (see FIG. 6) in the ground terminal group of the printed wiring board 10.
  • the leg 101a provided on the metal case 100 is connected to the ground terminal GND1 to which the coupler 40 is connected at the shortest distance.
  • the ground terminals 44 and 45 of the coupler 40 are arranged at a short distance from the ground terminal group of the printed wiring board 10, or the ground point (leg portion 101 a) of the metal case 100 and the ground terminal 44 of the coupler 40 are shortest.
  • the ground potential of the coupler 40 is stabilized, the isolation characteristics are improved, and the S / N ratio of the received wave is improved. And communication performance becomes stable and communication distance becomes long.
  • the terminating resistor R of the coupler 40 is arranged on the edge side of the printed wiring board 10 with respect to the coupler 40 (see FIG. 6). Therefore, the heat generated by the termination resistor R is directly radiated to the printed wiring board 10 through the ground terminal GND1 located immediately in the vicinity, and the heat radiation efficiency is improved. As a result, the temperature rise of the high frequency module 1 is suppressed, and the communication performance and operation are stabilized. Further, in order to effectively dissipate the heat generated from the termination resistor R, the ground terminal of the printed wiring board 10 to which the legs 101a to 101d of the metal case 100 are connected or the ground terminal adjacent to the legs 101a to 101d is connected. It is preferable to connect a termination resistor R.
  • the high frequency module 2 uses a circulator 60 instead of the coupler 40 used in the first embodiment as a transmission / reception branching element.
  • the circulator 60 is inserted in the circuit shown in FIG. 3 in place of the coupler 40 (see FIG. 10), transmits a signal from the band-pass filter 23 on the transmission side to the antenna 30, and receives a signal from the antenna 30. To the balun 24 on the side.
  • each terminal of the circulator 60 is given the same reference numeral as that of the coupler 40 in FIG. That is, 42 is an input terminal connected to the transmission terminal TX, 43 is an output terminal connected to the reception terminal RX, and 44 is an input / output terminal connected to the antenna terminal ANT. 45 and 46 are ground terminals.
  • the terminal 41 is not connected in terms of circuit.
  • the ground terminals 45 and 46 can be disposed at a short distance on the ground terminal group of the printed wiring board 10. 60 ground potential is stabilized. Therefore, the isolation characteristics are improved and the S / N ratio of the received wave is improved. Further, the loss in the circulator 60 is caused by conductor loss and heat generation in the ferrite. Therefore, also in the circulator 60, by connecting the ground terminals 45 and 46 to an arbitrary ground terminal of the printed wiring board 10 at a short distance, the heat dissipation efficiency is improved as in the heat dissipation process of the termination resistor R of the coupler 40. The circulator 60 and the module are thermally stabilized.
  • the high frequency module which concerns on this invention is not limited to the said Example, It can change variously within the range of the summary.
  • the present invention is useful for a high-frequency module, and is excellent in that the isolation characteristic between the transmission unit and the reception unit is improved, and further, the heat dissipation efficiency of the termination resistor provided in the transmission / reception branching element is improved. Yes.

Abstract

Provided is a high frequency module wherein isolation characteristics between a transmitting unit and a receiving unit are improved or heat dissipation efficiency of a termination resistor provided in a transmission/reception branching element is improved. The high frequency module has a coupler (40) mounted on a printed wiring board (10), said coupler being provided with an input/output terminal (43) connected to an antenna (terminal ANT), and a grounding terminal (44) connected to ground (terminal GND1). On orthogonally intersecting edge portions (10x, 10y) of the printed wiring board (10), a ground terminal group (GND) arranged in the first direction (X), and a ground terminal group (GND) arranged in the second direction (Y) that substantially orthogonally intersects the first direction (X) are provided. The coupler (40) is mounted at a corner portion specified by the orthogonally intersecting edge portions (10x, 10y) of the printed wiring board (10) by being in proximity to the ground terminal group (GND). Furthermore, the coupler (40) has a termination resistor (R), and the termination resistor (R) is disposed further toward the edge portion (10x) side of the printed wring board (10) than the coupler (40).

Description

高周波モジュールHigh frequency module
　本発明は、高周波モジュール、特に、ＲＦＩＤ（Radio Frequency Identification）システムのリーダライタとして用いられる高周波モジュールに関する。 The present invention relates to a high-frequency module, and more particularly to a high-frequency module used as a reader / writer of an RFID (Radio Frequency Identification) system.
　近年、物品の情報管理システムとして、誘導磁界を発生するリーダライタと、物品に付されたＲＦＩＤタグとを電磁界を利用した非接触方式で通信し、所定の情報を伝達するＲＦＩＤシステムが実用化されている。 2. Description of the Related Art In recent years, an RFID information system that communicates predetermined information by communicating a reader / writer that generates an induced magnetic field and an RFID tag attached to an article in a non-contact manner using an electromagnetic field has been put to practical use as an article information management system. Has been.
　特許文献１には、非接触ＩＣカードに電磁誘導により電力と送信信号を供給し、非接触ＩＣカードから受信信号を負荷変動により取得するループアンテナと、このループアンテナを所望の周波数に共振させるための共振回路部と、共振回路部を介してループアンテナに電力と送信データを供給する無線送信部、及び、ループアンテナから共振回路部を介して受信信号を取得する無線受信部を設け、その受信信号から復調回路により非接触ＩＣカードからのデータを復調するように構成され、共振回路部と無線送信部と無線受信部を、方向性結合器、サーキュレータ、アイソレータのいずれか一つを介して結合した非接触ＩＣカード読取／書込装置が記載されている。 Patent Document 1 discloses a loop antenna that supplies electric power and a transmission signal to a non-contact IC card by electromagnetic induction and acquires a reception signal from the non-contact IC card by load fluctuation, and for resonating the loop antenna at a desired frequency. A resonance circuit unit, a radio transmission unit that supplies power and transmission data to the loop antenna via the resonance circuit unit, and a radio reception unit that acquires a reception signal from the loop antenna via the resonance circuit unit It is configured to demodulate data from a contactless IC card from a signal by a demodulation circuit, and a resonance circuit unit, a wireless transmission unit, and a wireless reception unit are coupled via any one of a directional coupler, a circulator, and an isolator. A non-contact IC card reading / writing device is described.
　ところで、パッシブ型のＲＦＩＤタグでは応答信号が微弱である。微弱な信号を受信する際、前記非接触ＩＣカード読取／書込装置では、カプラなどの送信から受信へのアイソレーション特性が悪いと、ＲＦＩＤタグからの受信波と同じ周波数の送信波が重なって受信部に入力され、受信波のＳ／Ｎ比が悪化することによって受信不能に陥るおそれがある。また、送信波による電流が大きいため、カプラなどの終端抵抗での発熱量が大きくなる。装置（モジュール）全体にこの熱が伝達されると、読取り特性が劣化したり、動作が不安定になるおそれも有している。 By the way, the response signal is weak in the passive RFID tag. When receiving a weak signal, in the non-contact IC card reading / writing device, if the isolation characteristic from transmission to reception by a coupler or the like is poor, transmission waves having the same frequency as the reception wave from the RFID tag overlap. There is a possibility that reception is not possible due to deterioration in the S / N ratio of the received wave that is input to the receiving unit. Further, since the current due to the transmission wave is large, the amount of heat generated by the terminating resistor such as a coupler increases. When this heat is transmitted to the entire apparatus (module), there is a possibility that the reading characteristic is deteriorated or the operation becomes unstable.
特開２００４－２０６２４５号公報JP 2004-206245 A
　そこで、本発明の目的は、送信部と受信部とのアイソレーション特性を向上させることのできる高周波モジュールを提供することにある。本発明の他の目的は、送受分岐素子に設けた終端抵抗の放熱効率を向上させることのできる高周波モジュールを提供することにある。 Therefore, an object of the present invention is to provide a high-frequency module that can improve the isolation characteristics between the transmitter and the receiver. Another object of the present invention is to provide a high-frequency module capable of improving the heat dissipation efficiency of a termination resistor provided in a transmission / reception branching element.
　本発明の第１の形態である高周波モジュールは、
　アンテナに接続される入出力端子及びグランドに接続されるグランド端子を備えた送受分岐素子と、
　前記送受分岐素子を搭載したプリント配線板と、
　を備えた高周波モジュールにおいて、
　前記プリント配線板の直交する縁部には、第１の方向に配列された第１グランド端子群と、第１の方向とは略直交する第２の方向に配列された第２グランド端子群とが設けられており、
　前記送受分岐素子は、プリント配線板の前記直交する縁部で規定された隅部に、第１グランド端子群及び第２グランド端子群に近接して搭載されていること、
　を特徴とする。 The high-frequency module according to the first aspect of the present invention is
A transmission / reception branch element having an input / output terminal connected to the antenna and a ground terminal connected to the ground;
A printed wiring board on which the transmission / reception branching element is mounted;
In high frequency module with
A first ground terminal group arranged in a first direction on a perpendicular edge of the printed wiring board, and a second ground terminal group arranged in a second direction substantially orthogonal to the first direction, Is provided,
The transmission / reception branching element is mounted in the corner defined by the orthogonal edge of the printed wiring board in proximity to the first ground terminal group and the second ground terminal group,
It is characterized by.
　第１の形態である高周波モジュールにおいて、送受分岐素子はプリント配線板の隅部に第１グランド端子群及び第２グランド端子群に近接して搭載されるため、送受分岐素子のグランド端子をプリント配線板のグランド端子群に短い距離で配置したり、また、プリント配線板にシールドケースを被せる際にシールドケースのグランドポイントと送受分岐素子のグランド端子とが最短になるように配置できる。その結果、送受分岐素子のグランド電位が安定してアイソレーション特性が改善され、受信波のＳ／Ｎ比が向上する。そして、通信性能が安定するとともに、通信距離が長くなる。 In the high-frequency module according to the first embodiment, since the transmission / reception branch element is mounted in the corner of the printed wiring board in the vicinity of the first ground terminal group and the second ground terminal group, the ground terminal of the transmission / reception branch element is printed wiring. It can be arranged at a short distance on the ground terminal group of the board, or can be arranged so that the ground point of the shield case and the ground terminal of the transmitting / receiving branching element are shortest when the shield case is put on the printed wiring board. As a result, the ground potential of the transmitting / receiving branching element is stabilized, the isolation characteristic is improved, and the S / N ratio of the received wave is improved. And communication performance becomes stable and communication distance becomes long.
　本発明の第２の形態である高周波モジュールは、
　アンテナに接続される入出力端子及びグランドに接続されるグランド端子を備えた送受分岐素子と、
　前記送受分岐素子を搭載したプリント配線板と、
　を備えた高周波モジュールにおいて、
　前記プリント配線板の直交する縁部には、第１の方向に配列された第１グランド端子群と、第１の方向とは略直交する第２の方向に配列された第２グランド端子群とが設けられており、
　前記送受分岐素子は終端抵抗を有し、該終端抵抗は前記送受分岐素子よりも前記プリント配線板の縁部側に配置されていること、
　を特徴とする。 The high-frequency module according to the second aspect of the present invention is
A transmission / reception branch element having an input / output terminal connected to the antenna and a ground terminal connected to the ground;
A printed wiring board on which the transmission / reception branching element is mounted;
In high frequency module with
A first ground terminal group arranged in a first direction on a perpendicular edge of the printed wiring board, and a second ground terminal group arranged in a second direction substantially orthogonal to the first direction, Is provided,
The transmission / reception branch element has a termination resistor, and the termination resistance is arranged on the edge side of the printed wiring board from the transmission / reception branch element,
It is characterized by.
　第２の形態である高周波モジュールにおいて、送受分岐素子の終端抵抗は該送受分岐素子よりもプリント配線板の縁部側に配置されているため、第１又は第２グランド端子群の任意のグランド端子を介して直接的にプリント配線板に放熱され、放熱効率が向上する。その結果、モジュールの温度上昇が抑制され、通信性能や動作が安定する。 In the high-frequency module according to the second aspect, since the terminating resistance of the transmission / reception branch element is arranged on the edge side of the printed wiring board with respect to the transmission / reception branch element, any ground terminal of the first or second ground terminal group The heat is directly radiated to the printed wiring board via the, thereby improving the heat radiation efficiency. As a result, the temperature rise of the module is suppressed, and the communication performance and operation are stabilized.
　本発明によれば、送信部と受信部とのアイソレーション特性が向上し、あるいは、送受分岐素子に設けた終端抵抗の放熱効率が向上する。その結果、通信性能や動作が安定するとともに、通信距離が長くなる。 According to the present invention, the isolation characteristic between the transmission unit and the reception unit is improved, or the heat dissipation efficiency of the termination resistor provided in the transmission / reception branching element is improved. As a result, communication performance and operation are stabilized, and the communication distance is increased.
第１実施例である高周波モジュールを示す斜視図である。It is a perspective view which shows the high frequency module which is 1st Example. 前記高周波モジュールのプリント配線板を示す平面図である。It is a top view which shows the printed wiring board of the said high frequency module. 前記高周波モジュールの回路図である。It is a circuit diagram of the high frequency module. 前記プリント配線板の端子群を示す平面図である。It is a top view which shows the terminal group of the said printed wiring board. 前記プリント配線板の各層を示す平面図である。It is a top view which shows each layer of the said printed wiring board. 前記プリント配線板上に搭載されているカプラとグランド端子群との関係を示す平面図である。It is a top view which shows the relationship between the coupler mounted on the said printed wiring board, and a ground terminal group. 前記カプラの等価回路図である。It is an equivalent circuit diagram of the coupler. 前記カプラの分解斜視図である。It is a disassembled perspective view of the coupler. 第２実施例である高周波モジュールのプリント配線板を示す平面図である。It is a top view which shows the printed wiring board of the high frequency module which is 2nd Example. サーキュレータの回路図である。It is a circuit diagram of a circulator. 前記プリント配線板上に搭載されているサーキュレータとグランド端子群との関係を示す平面図である。It is a top view which shows the relationship between the circulator mounted on the said printed wiring board, and a ground terminal group.
　以下、本発明に係る高周波モジュールの実施例について添付図面を参照して説明する。なお、各図において、共通する部品、部分は同じ符号を付し、重複する説明は省略する。 Hereinafter, embodiments of the high-frequency module according to the present invention will be described with reference to the accompanying drawings. In each figure, common parts and portions are denoted by the same reference numerals, and redundant description is omitted.
（第１実施例、図１～図８参照）
　図１に示すように、第１実施例である高周波モジュール１は、プリント配線板１０と金属ケース１００とから構成されている。プリント配線板１０は、図２に示すように、その表面に、高周波信号処理回路２０、送信側としてバラン２１、アンプ２２、バンドパスフィルタ２３、受信側としてバラン２４、送信側及び受信側とアンテナ３０とを接続するカプラ（方向性結合器）４０、発振器２５、レギュレータ２６を搭載している。高周波信号処理回路２０はＲＦＩＤシステムに使用される高周波信号を処理するもので、この高周波モジュール１はＲＦＩＤシステムのリーダライタとして構成されている。従って、アンテナ３０は近距離で配置されているＲＦＩＤタグ３１と高周波信号にて交信する。 (Refer to the first embodiment, FIGS. 1 to 8)
As shown in FIG. 1, the high frequency module 1 according to the first embodiment includes a printed wiring board 10 and a metal case 100. As shown in FIG. 2, the printed wiring board 10 has a high-frequency signal processing circuit 20, a balun 21 on the transmission side, an amplifier 22, a band-pass filter 23, a balun 24 on the reception side, a transmission side and a reception side, and an antenna. A coupler (directional coupler) 40, an oscillator 25, and a regulator 26 are connected. The high-frequency signal processing circuit 20 processes a high-frequency signal used in the RFID system, and the high-frequency module 1 is configured as a reader / writer of the RFID system. Therefore, the antenna 30 communicates with the RFID tag 31 arranged at a short distance by a high frequency signal.
　高周波信号処理回路２０はバス３５を介してコンピュータ３６と接続されている。また、前記搭載部品のそれぞれは図３に示す回路を構成しており、それぞれの回路構成自体及びその作用は周知である。概略的に説明すると、送信信号は、処理回路２０の端子ＴＸから出力されてバラン２１、アンプ２２、バンドパスフィルタ２３を介してカプラ４０に伝達され、カプラ４０を介してアンテナ３０（ＡＮＴ）から放射される。一方、アンテナ３０（ＡＮＴ）から入力された受信信号は、カプラ４０を介してバラン２４に伝達され、端子ＲＸから処理回路２０に入力される。 The high frequency signal processing circuit 20 is connected to a computer 36 via a bus 35. Each of the mounted components constitutes the circuit shown in FIG. 3, and the circuit configuration itself and its operation are well known. In brief, the transmission signal is output from the terminal TX of the processing circuit 20 and transmitted to the coupler 40 via the balun 21, the amplifier 22, and the band pass filter 23, and from the antenna 30 (ANT) via the coupler 40. Radiated. On the other hand, the received signal input from the antenna 30 (ANT) is transmitted to the balun 24 through the coupler 40 and input to the processing circuit 20 from the terminal RX.
　金属ケース１００は、電磁シールド部材として機能するもので、図１に示すように、四つの脚部１０１ａ～１０１ｄを有し、これらの脚部１０１ａ～１０１ｄは以下に説明するプリント配線板１０の縁部に設けたグランド端子ＧＮＤ（図４参照）に接続される。 The metal case 100 functions as an electromagnetic shield member and has four legs 101a to 101d as shown in FIG. 1, and these legs 101a to 101d are edges of the printed wiring board 10 described below. Is connected to a ground terminal GND (see FIG. 4) provided in the section.
　プリント配線板１０は平面視で長方形状をなし、図４に示すように、四つの縁部には、アンテナ端子ＡＮＴ、グランド端子ＧＮＤ、電源端子ＶＣＣ１，ＶＣＣ２、コントロール端子ＣＯＮ、入出力端子ＩＦが配置されている。直交する二つの縁部１０ｘ、１０ｙにおいて、縁部１０ｘのグランド端子ＧＮＤは第１の方向Ｘに配列され、縁部１０ｙのグランド端子ＧＮＤは第２の方向Ｙに配列されている。 The printed wiring board 10 has a rectangular shape in plan view. As shown in FIG. 4, the four terminals are provided with an antenna terminal ANT, a ground terminal GND, power supply terminals VCC1 and VCC2, a control terminal CON, and an input / output terminal IF. Has been placed. At two edge portions 10x and 10y orthogonal to each other, the ground terminals GND of the edge portion 10x are arranged in the first direction X, and the ground terminals GND of the edge portion 10y are arranged in the second direction Y.
　プリント配線板１０は、図５に示すように、六つの層１０ａ～１０ｆからなり、上面の第１層１０ａには前記各種電子部品２０～２６，４０が搭載されており、各端子との配線パターンの図示は省略されている。第２層１０ｂ～第６層１０ｆにはそれぞれグランド電極５１，５２，５３，５４ａ，５４ｂ，５５や必要な配線パターン（全ては図示せず）が形成されている。各端子は、各層１０ａ～１０ｆにマザー基板の状態でビアホール導体として形成され、後にラインＡ，Ｂでカットされる。 As shown in FIG. 5, the printed wiring board 10 is composed of six layers 10a to 10f, and the various electronic components 20 to 26, 40 are mounted on the first layer 10a on the upper surface. Illustration of the pattern is omitted. Ground electrodes 51, 52, 53, 54a, 54b, 55 and necessary wiring patterns (all not shown) are formed on the second layer 10b to the sixth layer 10f, respectively. Each terminal is formed as a via-hole conductor in the state of a mother substrate in each of the layers 10a to 10f, and later cut along lines A and B.
　カプラ４０は、図６に示すように、その表面に各種端子４１～４６が形成されており、入力端子４２は高周波信号処理回路２０の送信端子ＴＸに接続され、出力端子４３は高周波信号処理回路２０の受信端子ＲＸに接続され、入出力端子４４はアンテナ端子ＡＮＴに接続されている。アイソレーション端子４１は終端抵抗Ｒを介してプリント配線板１０に設けたグランド端子ＧＮＤ１に接続されている。端子４５，４６はグランド端子である。 As shown in FIG. 6, the coupler 40 has various terminals 41 to 46 formed on the surface thereof, the input terminal 42 is connected to the transmission terminal TX of the high-frequency signal processing circuit 20, and the output terminal 43 is a high-frequency signal processing circuit. The input / output terminal 44 is connected to the antenna terminal ANT. The isolation terminal 41 is connected to a ground terminal GND1 provided on the printed wiring board 10 through a termination resistor R. Terminals 45 and 46 are ground terminals.
　カプラ４０は図７に示す等価回路を有し、主線路Ｌ１及び副線路Ｌ２はループ状導体から構成されている。具体的には、図８に示すように、基材層４７ａ上にグランド電極５１を形成し、基材層４７ｂ，４７ｃ上にそれぞれ線路電極Ｌ１を形成し、基材層４７ｄ，４７ｅ上にそれぞれ線路電極Ｌ２を形成し、基材層４７ｆ上にグランド電極５２を形成し、基材層４７ｇの二つの縁部及び前記基材層４７ａ～４７ｆのそれぞれの縁部に端子４１～４６を形成したものである。基材層４７ａ～４７ｇはセラミックグリーンシートからなる。 The coupler 40 has an equivalent circuit shown in FIG. 7, and the main line L1 and the sub-line L2 are constituted by loop-shaped conductors. Specifically, as shown in FIG. 8, the ground electrode 51 is formed on the base material layer 47a, the line electrode L1 is formed on the base material layers 47b and 47c, and the base material layers 47d and 47e are respectively formed. The line electrode L2 was formed, the ground electrode 52 was formed on the base material layer 47f, and the terminals 41 to 46 were formed on the two edges of the base material layer 47g and the respective edges of the base material layers 47a to 47f. Is. The base material layers 47a to 47g are made of ceramic green sheets.
　線路電極Ｌ１が主線路であり、入出力端子４４はアンテナ端子ＡＮＴに接続され、入力端子４２は送信端子ＴＸに接続される。線路電極Ｌ２が副線路であり、出力端子４３は受信端子ＲＸに接続され、アイソレーション端子４１は終端抵抗Ｒを介してグランド端子ＧＮＤ１に接続される。 The line electrode L1 is a main line, the input / output terminal 44 is connected to the antenna terminal ANT, and the input terminal 42 is connected to the transmission terminal TX. The line electrode L2 is a sub line, the output terminal 43 is connected to the receiving terminal RX, and the isolation terminal 41 is connected to the ground terminal GND1 via the termination resistor R.
　入出力端子４４と入力端子４２との間の長さを使用周波数の波長λの（λ／４）長、入力端子４２から入出力端子４４を介して出力端子４３に至る長さを（λ／２）長、入出力端子４４から入力端子４２を介してアイソレーション端子４１に至る長さを（λ／２）としている。入出力端子４４から入力された受信信号のうち、入力端子４２から反射してアイソレーション端子４１に至ろうとする信号は、入出力端子４４から入力端子４２までの経路と入力端子４２からアイソレーション端子４１までの経路で同じ（λ／４）長の逆相となるので互いに打ち消し合い、アイソレーション端子４１に至らない。入力端子４２から入力された送信信号のうち、入出力端子４４から反射して出力端子４３に至ろうとする信号は、入力端子４２から入出力端子４４までの経路と入出力端子４４から出力端子４３までの経路で同じ（λ／４）長の逆相となるので互いに打ち消し合い、出力端子４３に至らない。 The length between the input / output terminal 44 and the input terminal 42 is the (λ / 4) length of the wavelength λ of the operating frequency, and the length from the input terminal 42 to the output terminal 43 via the input / output terminal 44 is (λ / 2) Length The length from the input / output terminal 44 to the isolation terminal 41 via the input terminal 42 is (λ / 2). Of the received signals input from the input / output terminal 44, the signal reflected from the input terminal 42 to reach the isolation terminal 41 includes a path from the input / output terminal 44 to the input terminal 42 and an isolation terminal from the input terminal 42. The paths up to 41 are opposite in phase with the same (λ / 4) length, so they cancel each other and do not reach the isolation terminal 41. Of the transmission signal input from the input terminal 42, the signal reflected from the input / output terminal 44 and reaching the output terminal 43 is a path from the input terminal 42 to the input / output terminal 44 and the input / output terminal 44 to the output terminal 43. The opposite paths are the same (λ / 4) length in the path up to, so they cancel each other and do not reach the output terminal 43.
　一方、入力端子４２からアイソレーション端子４１には、カプラ４０内の線路の結合度に応じて分配されて出力されるが、アイソレーション端子４１のインピーダンス特性を所定の値（通常５０Ω）で終端することで、アイソレーション端子４１からの反射を生じない。従って、アイソレーション端子４１のインピーダンス特性を所望の値に精度よく調整することが重要であり、そのためにアイソレーション端子４１及びこれに接続される終端抵抗Ｒをできるだけプリント配線板１０のグランド端子群ＧＮＤに近接して配置することが好ましい。 On the other hand, from the input terminal 42 to the isolation terminal 41, it is distributed and output according to the coupling degree of the line in the coupler 40, but the impedance characteristic of the isolation terminal 41 is terminated with a predetermined value (usually 50Ω). Thus, no reflection from the isolation terminal 41 occurs. Therefore, it is important to accurately adjust the impedance characteristic of the isolation terminal 41 to a desired value. For this purpose, the isolation terminal 41 and the termination resistor R connected thereto are connected to the ground terminal group GND of the printed wiring board 10 as much as possible. It is preferable to arrange in the vicinity.
　以上の構成からなる高周波モジュール１において、カプラ４０はプリント配線板１０の隅部に第１の方向Ｘ及び第２の方向Ｙに配列されたグランド端子群ＧＮＤに近接して搭載されている。それゆえ、カプラ４０のグランド端子４４，４５をプリント配線板１０のグランド端子群に短い距離（図６参照）で配置することができる。また、金属ケース１００に設けた脚部１０１ａはカプラ４０が接続されるグランド端子ＧＮＤ１に最短距離で接続される。このように、カプラ４０のグランド端子４４，４５をプリント配線板１０のグランド端子群に短い距離で配置したり、金属ケース１００のグランドポイント（脚部１０１ａ）とカプラ４０のグランド端子４４とが最短になるように配置することにより、カプラ４０のグランド電位が安定してアイソレーション特性が改善され、受信波のＳ／Ｎ比が向上する。そして、通信性能が安定するとともに、通信距離が長くなる。 In the high-frequency module 1 having the above configuration, the coupler 40 is mounted in the corner of the printed wiring board 10 in proximity to the ground terminal group GND arranged in the first direction X and the second direction Y. Therefore, the ground terminals 44 and 45 of the coupler 40 can be arranged at a short distance (see FIG. 6) in the ground terminal group of the printed wiring board 10. In addition, the leg 101a provided on the metal case 100 is connected to the ground terminal GND1 to which the coupler 40 is connected at the shortest distance. As described above, the ground terminals 44 and 45 of the coupler 40 are arranged at a short distance from the ground terminal group of the printed wiring board 10, or the ground point (leg portion 101 a) of the metal case 100 and the ground terminal 44 of the coupler 40 are shortest. As a result, the ground potential of the coupler 40 is stabilized, the isolation characteristics are improved, and the S / N ratio of the received wave is improved. And communication performance becomes stable and communication distance becomes long.
　また、カプラ４０の終端抵抗Ｒは該カプラ４０よりもプリント配線板１０の縁部側に配置されている（図６参照）。それゆえ、終端抵抗Ｒの発熱は直近に位置するグランド端子ＧＮＤ１を介して直接的にプリント配線板１０に放熱され、放熱効率が向上する。その結果、高周波モジュール１の温度上昇が抑制され、通信性能や動作が安定する。さらに、終端抵抗Ｒからの発熱を効果的に放熱するために、金属ケース１００の脚部１０１ａ～１０１ｄが接続されているプリント配線板１０のグランド端子又は脚部１０１ａ～１０１ｄに隣接するグランド端子に終端抵抗Ｒを接続することが好ましい。 Further, the terminating resistor R of the coupler 40 is arranged on the edge side of the printed wiring board 10 with respect to the coupler 40 (see FIG. 6). Therefore, the heat generated by the termination resistor R is directly radiated to the printed wiring board 10 through the ground terminal GND1 located immediately in the vicinity, and the heat radiation efficiency is improved. As a result, the temperature rise of the high frequency module 1 is suppressed, and the communication performance and operation are stabilized. Further, in order to effectively dissipate the heat generated from the termination resistor R, the ground terminal of the printed wiring board 10 to which the legs 101a to 101d of the metal case 100 are connected or the ground terminal adjacent to the legs 101a to 101d is connected. It is preferable to connect a termination resistor R.
　（第２実施例、図９～図１１参照）
　図９に示すように、第２実施例である高周波モジュール２は、送受分岐素子として、前記第１実施例で用いたカプラ４０に代えて、サーキュレータ６０を用いたものである。サーキュレータ６０は、図３に示した回路中に前記カプラ４０に代えて挿入され（図１０参照）、送信側のバンドパスフィルタ２３からの信号をアンテナ３０に伝達し、アンテナ３０からの信号を受信側のバラン２４に伝達する。 (Refer to the second embodiment, FIGS. 9 to 11)
As shown in FIG. 9, the high frequency module 2 according to the second embodiment uses a circulator 60 instead of the coupler 40 used in the first embodiment as a transmission / reception branching element. The circulator 60 is inserted in the circuit shown in FIG. 3 in place of the coupler 40 (see FIG. 10), transmits a signal from the band-pass filter 23 on the transmission side to the antenna 30, and receives a signal from the antenna 30. To the balun 24 on the side.
　サーキュレータ６０のプリント配線板１０上での配置は図１１に示すとおりであり、前記カプラ４０と同様に、プリント配線板１０の隅部に第１の方向Ｘ及び第２の方向Ｙに配列されたグランド端子群ＧＮＤに近接して搭載されている。ちなみに、サーキュレータ６０の各端子は図１１において前記カプラ４０と同じ符号を付している。即ち、４２は入力端子であって送信端子ＴＸに接続され、４３は出力端子であって受信端子ＲＸに接続され、４４は入出力端子であってアンテナ端子ＡＮＴに接続されている。４５，４６はグランド端子である。端子４１は回路的には接続されていない。 The arrangement of the circulator 60 on the printed wiring board 10 is as shown in FIG. 11. Like the coupler 40, the circulator 60 is arranged at the corner of the printed wiring board 10 in the first direction X and the second direction Y. It is mounted close to the ground terminal group GND. Incidentally, each terminal of the circulator 60 is given the same reference numeral as that of the coupler 40 in FIG. That is, 42 is an input terminal connected to the transmission terminal TX, 43 is an output terminal connected to the reception terminal RX, and 44 is an input / output terminal connected to the antenna terminal ANT. 45 and 46 are ground terminals. The terminal 41 is not connected in terms of circuit.
　本第２実施例においても、サーキュレータ６０はプリント配線板１０の隅部に搭載されているため、グランド端子４５，４６をプリント配線板１０のグランド端子群に短い距離で配置することができ、サーキュレータ６０のグランド電位が安定する。それゆえ、アイソレーション特性が改善され、受信波のＳ／Ｎ比が向上する。また、サーキュレータ６０での損失は、導体損、フェライトでの発熱によって生じる。そこで、サーキュレータ６０においても、グランド端子４５，４６をプリント配線板１０の任意のグランド端子に短い距離で接続することにより、前記カプラ４０の終端抵抗Ｒの放熱処理と同様に、放熱効率が向上し、サーキュレータ６０やモジュールが熱的に安定する。 Also in the second embodiment, since the circulator 60 is mounted at the corner of the printed wiring board 10, the ground terminals 45 and 46 can be disposed at a short distance on the ground terminal group of the printed wiring board 10. 60 ground potential is stabilized. Therefore, the isolation characteristics are improved and the S / N ratio of the received wave is improved. Further, the loss in the circulator 60 is caused by conductor loss and heat generation in the ferrite. Therefore, also in the circulator 60, by connecting the ground terminals 45 and 46 to an arbitrary ground terminal of the printed wiring board 10 at a short distance, the heat dissipation efficiency is improved as in the heat dissipation process of the termination resistor R of the coupler 40. The circulator 60 and the module are thermally stabilized.
　（他の実施例）
　なお、本発明に係る高周波モジュールは前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。 (Other examples)
In addition, the high frequency module which concerns on this invention is not limited to the said Example, It can change variously within the range of the summary.
　以上のように、本発明は、高周波モジュールに有用であり、送信部と受信部とのアイソレーション特性が向上し、さらに、送受分岐素子に設けた終端抵抗の放熱効率が向上する点で優れている。 As described above, the present invention is useful for a high-frequency module, and is excellent in that the isolation characteristic between the transmission unit and the reception unit is improved, and further, the heat dissipation efficiency of the termination resistor provided in the transmission / reception branching element is improved. Yes.
　１，２…高周波モジュール
　１０…プリント配線板
　２０…高周波信号処理回路
　３０…アンテナ
　４０…カプラ（方向性結合器）
　４１…アイソレーション端子
　４２…入力端子
　４３…出力端子
　４４…入出力端子
　６０…サーキュレータ
　１００…金属ケース
　１０１ａ～１０１ｄ…脚部
　ＧＮＤ…グランド端子
　ＡＮＴ…アンテナ端子
　Ｒ…終端抵抗
　Ｌ１，Ｌ２…線路電極 DESCRIPTION OF SYMBOLS 1, 2 ... High frequency module 10 ... Printed wiring board 20 ... High frequency signal processing circuit 30 ... Antenna 40 ... Coupler (directional coupler)
DESCRIPTION OF SYMBOLS 41 ... Isolation terminal 42 ... Input terminal 43 ... Output terminal 44 ... Input / output terminal 60 ... Circulator 100 ... Metal case 101a-101d ... Leg part GND ... Ground terminal ANT ... Antenna terminal R ... Termination resistance L1, L2 ... Line electrode

Claims (7)

  1. 　アンテナに接続される入出力端子及びグランドに接続されるグランド端子を備えた送受分岐素子と、
    　前記送受分岐素子を搭載したプリント配線板と、
    　を備えた高周波モジュールにおいて、
    　前記プリント配線板の直交する縁部には、第１の方向に配列された第１グランド端子群と、第１の方向とは略直交する第２の方向に配列された第２グランド端子群とが設けられており、
    　前記送受分岐素子は、プリント配線板の前記直交する縁部で規定された隅部に、第１グランド端子群及び第２グランド端子群に近接して搭載されていること、
    　を特徴とする高周波モジュール。     A transmission / reception branch element having an input / output terminal connected to the antenna and a ground terminal connected to the ground;
    A printed wiring board on which the transmission / reception branching element is mounted;
    In high frequency module with
    A first ground terminal group arranged in a first direction on a perpendicular edge of the printed wiring board, and a second ground terminal group arranged in a second direction substantially orthogonal to the first direction, Is provided,
    The transmission / reception branching element is mounted in the corner defined by the orthogonal edge of the printed wiring board in proximity to the first ground terminal group and the second ground terminal group,
    High frequency module characterized by
  2. 　アンテナに接続される入出力端子及びグランドに接続されるグランド端子を備えた送受分岐素子と、
    　前記送受分岐素子を搭載したプリント配線板と、
    　を備えた高周波モジュールにおいて、
    　前記プリント配線板の直交する縁部には、第１の方向に配列された第１グランド端子群と、第１の方向とは略直交する第２の方向に配列された第２グランド端子群とが設けられており、
    　前記送受分岐素子は終端抵抗を有し、該終端抵抗は前記送受分岐素子よりも前記プリント配線板の縁部側に配置されていること、
    　を特徴とする高周波モジュール。     A transmission / reception branch element having an input / output terminal connected to the antenna and a ground terminal connected to the ground;
    A printed wiring board on which the transmission / reception branching element is mounted;
    In high frequency module with
    A first ground terminal group arranged in a first direction on a perpendicular edge of the printed wiring board, and a second ground terminal group arranged in a second direction substantially orthogonal to the first direction, Is provided,
    The transmission / reception branch element has a termination resistor, and the termination resistance is arranged on the edge side of the printed wiring board from the transmission / reception branch element,
    High frequency module characterized by
  3. 　前記終端抵抗は前記第１及び第２グランド端子群のうち少なくとも一つのグランド端子に接続されていること、を特徴とする請求項２に記載の高周波モジュール。 3. The high frequency module according to claim 2, wherein the terminating resistor is connected to at least one ground terminal of the first and second ground terminal groups.
  4. 　前記送受分岐素子は、ループ状導体からなる主線路及び副線路を有し、前記ループ状導体の巻回軸は前記第１の方向及び前記第２の方向に対して略垂直方向に配置されていること、を特徴とする請求項１ないし請求項３のいずれかに記載の高周波モジュール。 The transmission / reception branch element has a main line and a sub line made of a loop-shaped conductor, and a winding axis of the loop-shaped conductor is arranged in a direction substantially perpendicular to the first direction and the second direction. The high frequency module according to claim 1, wherein the high frequency module is provided.
  5. 　さらに、前記プリント配線板に設けた金属ケースを備え、
    　前記金属ケースに設けた脚部が第１グランド端子群及び第２グランド端子群のうち少なくとも一つのグランド端子に接続、固定されていること、
    　を特徴とする請求項１ないし請求項４のいずれかに記載の高周波モジュール。     Furthermore, a metal case provided on the printed wiring board is provided,
    The legs provided on the metal case are connected and fixed to at least one ground terminal of the first ground terminal group and the second ground terminal group;
    The high-frequency module according to any one of claims 1 to 4, wherein
  6. 　前記送受分岐素子はカプラ又はサーキュレータであることを特徴とする請求項１ないし請求項５のいずれかに記載の高周波モジュール。 The high-frequency module according to any one of claims 1 to 5, wherein the transmission / reception branching element is a coupler or a circulator.
  7. 　前記プリント配線板上には前記送受分岐素子と接続された高周波信号処理回路が搭載され、ＲＦＩＤシステムのリーダライタモジュールとして構成されていること、を特徴とする請求項１ないし請求項６のいずれかに記載の高周波モジュール。 The high frequency signal processing circuit connected with the said transmission / reception branch element is mounted on the said printed wiring board, and is comprised as a reader-writer module of RFID system, The one of Claim 1 thru | or 6 characterized by the above-mentioned. The high frequency module described in 1.
PCT/JP2011/070553 2010-09-10 2011-09-09 High frequency module WO2012033184A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162774A (en) * 1995-12-07 1997-06-20 Murata Mfg Co Ltd Transmitter-receiver
JP2002171193A (en) * 2000-11-30 2002-06-14 Kyocera Corp High-frequency module substrate
JP2004297456A (en) * 2003-03-27 2004-10-21 Kyocera Corp High frequency module
JP2005064732A (en) * 2003-08-08 2005-03-10 Hitachi Metals Ltd High frequency module and communication device using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162774A (en) * 1995-12-07 1997-06-20 Murata Mfg Co Ltd Transmitter-receiver
JP2002171193A (en) * 2000-11-30 2002-06-14 Kyocera Corp High-frequency module substrate
JP2004297456A (en) * 2003-03-27 2004-10-21 Kyocera Corp High frequency module
JP2005064732A (en) * 2003-08-08 2005-03-10 Hitachi Metals Ltd High frequency module and communication device using same

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JPWO2012033184A1 (en) 2014-01-20

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