JP2011095844A - Noncontact electronic device - Google Patents

Noncontact electronic device Download PDF

Info

Publication number
JP2011095844A
JP2011095844A JP2009246793A JP2009246793A JP2011095844A JP 2011095844 A JP2011095844 A JP 2011095844A JP 2009246793 A JP2009246793 A JP 2009246793A JP 2009246793 A JP2009246793 A JP 2009246793A JP 2011095844 A JP2011095844 A JP 2011095844A
Authority
JP
Japan
Prior art keywords
antenna
matching
portion
electronic device
spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009246793A
Other languages
Japanese (ja)
Inventor
Hiroaki Ozaki
Kazuki Watanabe
太亮 尾崎
一希 渡邊
Original Assignee
Hitachi Ltd
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, 株式会社日立製作所 filed Critical Hitachi Ltd
Priority to JP2009246793A priority Critical patent/JP2011095844A/en
Publication of JP2011095844A publication Critical patent/JP2011095844A/en
Application status is Pending legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact electronic device (IC tag) which is small and capable of long-distance communication. <P>SOLUTION: A noncontact electronic device includes a dipole antenna 3a which is constituted of two spiral inductors and two conductors 5a and 5b connected to the two spiral inductors respectively; and a slot part (matching part, matching circuit) 3b which is constituted of the two conductors 5a and 5b shared by the dipole antenna 3a, and a matching conductor whose both ends are connected to the two conductors 5a and 5b respectively, wherein the two conductors 5a and 5b are connected to two antenna terminals 4a and 4b of a semiconductor integrated circuit device 2 respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a non-contact electronic device (hereinafter referred to as an IC (Integrated Circuit) tag) composed of a semiconductor integrated circuit device that records data and an antenna that transmits and receives radio waves, and is particularly applied to the structure of an antenna. And effective technology.

  The IC tag exchanges information with the reader / writer device. This information exchange is realized, for example, by transmitting the data held by the IC tag to the reader / writer device or by receiving and holding the data transmitted from the reader / writer device. By attaching or incorporating a tag to various articles, it is possible to manage and recognize a person or an article.

  Communication between the IC tag and the reader / writer device is performed via an electromagnetic field (radio wave). Specifically, the antenna mounted on the IC tag receives the carrier signal transmitted from the reader / writer device, supplies the carrier signal to the semiconductor integrated circuit device mounted on the IC tag, and the semiconductor integrated circuit device. The above communication is performed by transmitting the data superimposed on the carrier signal to the reader / writer device.

  For example, in Japanese Patent Application Laid-Open No. 2007-81632 (Patent Document 1), in a wireless IC tag in which an IC chip and an antenna conductor connected to the IC chip are mounted on a mounting substrate, the antenna conductor shape is changed to a meander (Meander, A technique for miniaturizing the outer shape of the mounting board by adopting a bellows shape has been disclosed.

  Japanese Patent Laid-Open No. 2007-228437 (Patent Document 2) discloses an antenna composed of a dipole-shaped conductor pattern connected to an IC chip for RFID (Radio Frequency Identification), and a predetermined form for the conductor pattern of the antenna. There is disclosed an RFID tag that includes one or a plurality of matching patterns connected with each other and includes a matching portion for matching antenna characteristics and a marking portion that indicates the contents of matching operation in the matching portion. .

  Japanese Patent Laid-Open No. 2009-20835 (Patent Document 3) describes that an electromagnetic coupling module is configured by a power feeding circuit board and a wireless IC chip mounted thereon, and the electromagnetic coupling module is connected to a spiral conductor via a power feeding conductor. Thus, a technique for reducing the size of the wireless IC device and improving the radiation characteristics is disclosed.

JP 2007-81632 A JP 2007-228437 A JP 2009-20835 A

  The IC tag is equipped with a semiconductor integrated circuit device, an antenna, and a matching circuit for achieving good impedance matching between the antenna and the semiconductor integrated circuit device. The matching circuit is mounted as a part of the antenna, and is a resonance circuit such as a loop element. By using a resonance circuit such as a loop element for the matching circuit, the communication characteristics can be widened. In addition, the UHF band (860 to 960 MHz) is mainly used for the frequency of the carrier signal because of radio wave propagation characteristics and sneak characteristics such as obstacles.

  An IC tag is used by being affixed to various articles, but there are cases where the size of the IC tag is limited depending on the object to be attached and the usage situation. Depending on the application, an IC tag having a length of 5 to 7 cm or less is required.

  The dimensions of the IC tag are generally determined by the length of the antenna mounted on the IC tag. The length of the antenna mounted on the IC tag depends on the wavelength of the carrier signal used for communication. Currently, a dipole antenna or a loop antenna is mainly used as an antenna mounted on an IC tag, and the dipole antenna or loop antenna is usually about 1/4 to 1/2 of the wavelength of a carrier signal used for communication. It has a length. In an IC tag equipped with such a dipole antenna or loop antenna, a communication distance of about several meters can be obtained, depending on the reader / writer device or the radio wave propagation environment.

  However, even if the UHF band (860 to 960 MHz) is used for the frequency of the carrier signal, the wavelength of the carrier signal is about 30 to 40 cm. Therefore, even if a dipole antenna or a loop antenna having a quarter of the wavelength of the carrier signal (hereinafter sometimes referred to as a quarter wavelength) is used, the length of the IC tag is 7.5 cm or more, which is required. In some cases, an IC tag having a size cannot be realized.

  When the length of the dipole antenna or loop antenna is ¼ wavelength or less, the antenna gain is reduced. Furthermore, the impedance of the desired dipole antenna or loop antenna cannot be obtained, and impedance matching between the semiconductor integrated circuit device and the dipole antenna or loop antenna is also reduced. For this reason, a sufficient communication distance cannot be obtained. Therefore, it is difficult to realize an IC tag that is small in size and enables long-distance communication.

  Therefore, for example, as described in Patent Documents 1, 2, and 3, the antenna radiating portion has a meander shape or a spiral shape, so that the length of the antenna is increased and the radiation efficiency is not lowered. In addition, techniques for realizing miniaturization of IC tags have been proposed. However, as a result of investigations by the present inventors, there are various technical problems described below for an IC tag on which a meander-shaped dipole antenna is mounted.

  The meander-shaped dipole antenna has an advantage that there is no decrease in antenna gain. However, since the semiconductor integrated circuit device generally has a capacitive reactance and the meander-shaped dipole antenna also has a capacitive reactance, impedance matching between the semiconductor integrated circuit device and the meander-shaped dipole antenna is lowered. Impedance matching can be improved by adding a matching part to the meander-shaped dipole antenna, but the impedance of the added matching part is smaller than the impedance of the radiating part of the meander-shaped dipole antenna. The flowing current is suppressed, and the antenna gain of the meander-shaped dipole antenna is reduced.

  An object of the present invention is to provide a non-contact electronic device (IC tag) that is small in size and enables long-distance communication.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, an embodiment of a representative one will be briefly described as follows.

  This embodiment is a non-contact electronic device including a semiconductor integrated circuit device and an antenna. The semiconductor integrated circuit device has two antenna terminals connected to the antenna, and the antenna includes a dipole antenna unit and a matching unit. The dipole antenna part is composed of two spiral-shaped dipole antennas and two conductor parts connected to one end of each of the two spiral-shaped dipole antennas, and the matching part includes a dipole antenna part and The two conductor portions are shared, and the matching conductor portion is connected to the two conductor portions at both ends. The two conductor portions are respectively connected to the two antenna terminals.

  In addition, this embodiment is a non-contact electronic device including a semiconductor integrated circuit device and an antenna, the semiconductor integrated circuit device has two antenna terminals connected to the antenna, and the antenna includes a dipole antenna unit and The dipole antenna part is composed of two spiral-shaped dipole antennas, the matching part is composed of a matching conductor part, and one end of each of the two spiral-shaped dipole antennas is connected to two antenna terminals. The both ends of the matching conductor portion are connected to the two antenna terminals, respectively.

  Among the inventions disclosed in the present application, effects obtained by one embodiment of a representative one will be briefly described as follows.

  It is possible to provide a non-contact electronic device (IC tag) that is small and enables long-distance communication.

It is a principal part top view which shows an example of the IC tag by Embodiment 1 of this invention. It is a principal part top view which shows an example of the semiconductor integrated circuit device mounted in the IC tag by Embodiment 1 of this invention. It is a principal part top view which shows an example of the dipole antenna part which comprises the antenna mounted in the IC tag by Embodiment 1 of this invention. It is a principal part top view which shows an example of the slot part which comprises the antenna mounted in the IC tag by Embodiment 1 of this invention. It is a graph which shows an example of the relationship between the impedance of the antenna mounted in the IC tag by Embodiment 1 of this invention, and carrier frequency. It is a graph which shows an example of the antenna gain characteristic of the IC tag by Embodiment 1 of this invention. It is a principal part top view which shows an example of the IC tag by Embodiment 2 of this invention. It is a principal part top view which shows an example of the dipole antenna part which comprises the antenna mounted in the IC tag by Embodiment 2 of this invention. It is a principal part top view which shows an example of the IC tag by Embodiment 3 of this invention. It is a principal part top view which shows an example of the dipole antenna part which comprises the antenna mounted in the IC tag by Embodiment 3 of this invention. It is a principal part top view which shows an example of the slot part which comprises the antenna mounted in the IC tag by Embodiment 3 of this invention. It is a principal part top view which shows an example of the IC tag by Embodiment 4 of this invention. It is a principal part top view which shows an example of the slot part which comprises the antenna mounted in the IC tag by Embodiment 4 of this invention.

  In the following embodiments, when necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other, and one is the other. There are some or all of the modifications, details, supplementary explanations, and the like.

  Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number. Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  Further, in the drawings used in the following embodiments, hatching may be added to make the drawings easy to see even if they are plan views. In all the drawings for explaining the following embodiments, components having the same function are denoted by the same reference numerals in principle, and repeated description thereof is omitted. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
The structure of the IC tag according to the first embodiment will be described with reference to FIGS. FIG. 1 is a plan view of an essential part showing an example of an IC tag, FIG. 2 is a plan view of an essential part showing an example of a semiconductor integrated circuit device mounted on the IC tag, and FIG. 3 is a dipole constituting an antenna mounted on the IC tag. FIG. 4 is a plan view of a main part showing an example of a slot part constituting an antenna mounted on an IC tag.

  As shown in FIG. 1, an IC tag 1 includes a semiconductor integrated circuit device 2 and an antenna 3. The antenna 3 includes a dipole antenna portion (radiating portion, radiator) 3a and a slot portion (matching portion, matching circuit). ) 3b. The antenna 3 has a length of ¼ or less of the wavelength of the carrier signal. The slot portion 3b is provided for impedance matching between the semiconductor integrated circuit device 2 and the dipole antenna portion 3a. The IC tag 1 has a length of, for example, 5.6 cm and a width of, for example, 3.4 mm. The frequency of the carrier signal transmitted and received by the IC tag 1 is, for example, the UHF band (860 to 960 MHz).

  The semiconductor integrated circuit device 2 is connected to the antenna 3 via antenna terminals 4a and 4b. The dipole antenna portion 3a and the slot portion 3b constituting the antenna 3 share the conductor portions 5a and 5b (the hatched portions in the figure), and the conductor portion 5a is connected to the antenna terminal 4a. The conductor portion 5b is connected to the antenna terminal 4b. Since the dipole antenna portion 3a and the slot portion 3b share the conductor portions 5a and 5b, the small antenna 3 can be designed.

  As shown in FIG. 2, when a carrier signal is input to the antenna terminals 4a and 4b of the semiconductor integrated circuit device 2, the carrier signal is transmitted to the power supply circuit 6 (PWR) and the signal processing circuit 7 (SP). The power supply circuit 6 generates a voltage and a current for operating the signal processing circuit 7 from the carrier signal, and supplies them to the signal processing circuit 7. The signal processing circuit 7 demodulates the carrier signal supplied from the antenna terminals 4a and 4b into data via a transmission / reception circuit 8 (TR) provided therein, or the antenna via the transmission / reception circuit 8 described above. By modulating the signals supplied to the terminals 4a and 4b, the data held therein are transmitted.

  As shown in FIG. 3, the dipole antenna portion 3a includes two conductor portions 5a and 5b (hatched portions in the figure) and two spiral inductor portions 9a and 9b having a spiral shape. ing. One spiral inductor portion 9a is connected to the antenna terminal 4a via the conductor portion 5a, and the other spiral inductor portion 9b is connected to the antenna terminal 4b via the conductor portion 5b. At this time, it is desirable to design the spiral inductor portion 9a and the spiral inductor portion 9b so as to be symmetric with respect to the symmetry axis M1 located in the middle thereof.

  The total length of the conductor portion of the dipole antenna portion 3a is set to be about ½ of the wavelength of the carrier signal to be used. However, the total length of the conductor portion of the dipole antenna unit 3a may be adjusted so that the resistance component thereof is equal to the resistance component of the impedance of the semiconductor integrated circuit device 2 at the frequency of the carrier signal. The total length of the conductor portion of the dipole antenna portion 3a is preferably adjusted by changing the number of loops or the dimensions of the spiral inductor portions 9a and 9b.

  As shown in FIG. 4, the slot portion 3b has a T shape. The slot portion 3b includes conductor portions 5a and 5b (shaded portions in the figure) shared with the dipole antenna portion 3a, and a matching conductor portion 10 that connects the conductor portion 5a and the conductor portion 5b. Yes.

  The dimension of the slot portion 3b is adjusted so that the impedance matching between the semiconductor integrated circuit device 2 and the slot portion 3b is best. The adjustment of the slot portion 3b is desirably performed by changing the conductor portions 5a and 5b so that only the value of the slot dimension D1 shown in FIG. 4 is changed. At this time, it is desirable that the conductor portion 5a and the conductor portion 5b are designed so as to be symmetric with respect to the symmetry axis M1 located between them.

  In the first embodiment, the dipole antenna portion 3a is configured by a spiral dipole antenna (spiral inductor portions 9a and 9b), thereby suppressing a decrease in radiation efficiency, that is, a decrease in antenna gain. For example, when the wavelength of the carrier signal is 30 to 40 cm, the length of the antenna is 7.5 cm or more in a conventional straight dipole antenna or loop antenna. On the other hand, in the spiral dipole antenna according to the first embodiment, the length of the antenna can be made shorter than 7.5 cm, so that the IC tag 1 can be downsized. Furthermore, since the slot portion 3b is added to the dipole antenna portion 3a, impedance matching between the semiconductor integrated circuit device and the spiral dipole antenna (spiral inductor portions 9a and 9b) can be satisfactorily achieved.

  For example, in Patent Documents 1 and 2 described above, the antenna radiating portion is formed of a meander-shaped dipole antenna, and the matching portion is added to the antenna radiating portion, thereby matching the impedance between the semiconductor integrated circuit device and the antenna. An improved wireless IC tag is described. However, as described above, in this antenna, since the impedance of the added matching portion is smaller than the impedance of the radiating portion of the antenna, the current flowing to the radiating portion is suppressed by adding the matching portion, The antenna gain of the meander-shaped dipole antenna is reduced.

  However, in the antenna 3 according to the first embodiment, a decrease in antenna gain can be suppressed even if such a matching unit is added. Hereinafter, the difference in effect obtained by adding a matching portion between the spiral-shaped dipole antenna and the meander-shaped dipole antenna will be described in detail.

The impedance Zc of the semiconductor integrated circuit device is expressed as Zc = Rc−jXc (Formula 1)
In general, Xc is a positive value.

Further, the impedance Za of the antenna is set to Za = Ra + jXa (Formula 2)
In the case of resistance Ra = Rc and reactance Xc = Xa, the impedance matching is most achieved, and power transmission / reception between the semiconductor integrated circuit device and the antenna is most efficiently performed.

Moreover, the antenna is comprised from the radiation | emission part and the matching part, and impedance Zp of a radiation | emission part is set to Zp = Rp + jXp (Formula 3)
The impedance Zm of the matching part is expressed as Zm = Rm + jXm (Formula 4)
If the radiation part and the matching part are connected in parallel, the impedance Za of the antenna is
Za = (Zp × Zm) / (Zp + Zm) (Formula 5)
= ((Rp 2 Rm + RpRm 2 + RpXm 2 + RmXp 2 ) + j (Rp 2 Xm +
Rm 2 Xp + Xp 2 Xm + XpXm 2 ) / ((Rp + Rm) 2 + (Xp + Xm) 2 )
(Formula 6)
It is expressed.

  When a meander-shaped dipole antenna is applied to the radiating part, the antenna gain is almost the same as that of a half-wave dipole, but in a narrow region, the linear conductor part is bent several times, so the radiating part Resistance Rp increases due to conductor loss. Further, the reactance Xp of the radiating portion becomes a negative value due to capacitive coupling between the adjacent linear conductor portions. The matching section needs to be selected so that the resistance Rm of the matching section is small and the reactance Xm of the matching section is large so that the reactance Xa of the antenna becomes a positive value. A matching portion is preferred. However, by adding the matching portion, since the resistance Rm of the matching portion is smaller than the resistance Rp of the radiating portion, the current flowing through the radiating portion is suppressed, and sufficient antenna gain cannot be obtained.

  On the other hand, when a spiral-shaped dipole antenna is applied to the radiating portion, the antenna gain is lower than that of the half-wave dipole, but the number of times of bending of the linear conductor portion is smaller than that of the meander-shaped dipole antenna. An increase in resistance Rp due to a conductor loss can be suppressed. Furthermore, compared to the meander-shaped dipole antenna, the number of times of bending of the linear conductor portion is small, so that capacitive coupling between adjacent linear conductor portions is also reduced, and the reactance Xp of the radiating portion is set to a positive value. It can be. Thereby, even if a matching part is added, sufficient antenna gain can be obtained.

  FIG. 5 is a graph showing an example of the relationship between the impedance of the antenna 3 and the frequency of the carrier signal according to the first embodiment obtained by simulation. FIG. 5A shows resistance, and FIG. 5B shows reactance. As shown in FIGS. 5A and 5B, a self-resonance point due to the dipole antenna portion 3a exists at the point P1, and is conjugate-matched with the semiconductor integrated circuit device 2 at the point P2.

  FIG. 6 is a graph showing an example of the antenna gain characteristic of the IC tag 1 according to the first embodiment obtained by simulation. As shown in FIG. 6, even when the slot 3b is connected to the spiral inductor portions 9a and 9b, a sufficient antenna gain is obtained.

  As described above, according to the first embodiment, the dipole antenna portion 3a is configured by the spiral-shaped dipole antenna (spiral inductor portions 9a and 9b), so that a decrease in antenna gain can be suppressed. Further, by adding the slot portion 3b to the dipole antenna portion 3a, good impedance matching between the semiconductor integrated circuit device and the spiral-shaped dipole antenna (spiral inductor portions 9a and 9b) can be obtained without reducing the antenna gain. Can do. Thereby, for example, in order to obtain a high antenna gain, even if an antenna longer than ¼ wavelength is provided, a small IC tag having a length of ¼ wavelength or less with good impedance matching can be realized.

(Embodiment 2)
The structure of the IC tag according to the second embodiment will be described with reference to FIGS. FIG. 7 is a main part plan view showing an example of an IC tag, and FIG. 8 is a main part plan view showing an example of a dipole antenna part constituting an antenna mounted on the IC tag.

  The IC tag 21 according to the second embodiment is a modification of the IC tag 1 according to the first embodiment described above. The IC tag 21 according to the second embodiment is different from the above-described IC tag 1 according to the first embodiment in the shape of the dipole antenna portion 3 a constituting the antenna 3.

  That is, in the above-described IC tag 1 according to the first embodiment, the dipole antenna portion 3a is configured with a spiral-shaped (spiral shape) dipole antenna provided with a plurality of corner portions bent at 90 degrees. The IC tag 21 is formed of a spiral (spiral) dipole antenna without a corner portion bent by 90 degrees in the dipole antenna portion 3a.

  As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained even when a spiral-shaped dipole antenna without a corner portion bent at 90 degrees is used.

(Embodiment 3)
The structure of the IC tag according to the third embodiment will be described with reference to FIGS. FIG. 9 is a plan view of an essential part showing an example of an IC tag, FIG. 10 is a plan view of an essential part showing an example of a dipole antenna part constituting an antenna mounted on the IC tag, and FIG. 11 is a plan view showing an antenna mounted on the IC tag. It is a principal part top view which shows an example of the slot part to comprise.

  The IC tag 31 according to the third embodiment is a modification of the IC tag 1 according to the first embodiment described above. The IC tag 31 according to the third embodiment is different from the IC tag 1 according to the first embodiment described above in the presence or absence of conductor portions 5a and 5b shared by the dipole antenna 3a and the slot portion 3b.

  That is, in the first embodiment described above, the terminal of the dipole antenna portion 3a and the terminal of the slot portion 3b are once connected to the conductor portion 5a or the conductor portion 5b, and the conductor portion 5a is connected to the antenna terminal 4a. 5b is connected to the antenna terminal 4b. On the other hand, in the third embodiment, without providing the conductor portions 5a and 5b, the terminal of the dipole antenna portion 3a and the terminal of the slot portion 3b are directly connected to the antenna terminal 4a or the antenna terminal 4b, respectively. Yes.

  In the third embodiment, the dipole antenna portion 3a is configured by a spiral-shaped (spiral shape) dipole antenna provided with a plurality of corner portions bent at 90 degrees. However, the IC tag 21 according to the second embodiment described above is provided. As described above, the dipole antenna portion 3a may be formed of a spiral (spiral) dipole antenna having no corners bent by 90 degrees.

  Thus, according to the third embodiment, the terminals of the dipole antenna portion 3a and the terminals of the slot portion 3b are directly connected to the antenna terminal 4a or the antenna terminal 4b, respectively, without providing the conductor portions 5a and 5b. However, the same effects as those of the first embodiment can be obtained.

(Embodiment 4)
The structure of the IC tag according to the fourth embodiment will be described with reference to FIGS. FIG. 12 is a main part plan view showing an example of an IC tag, and FIG. 13 is a main part plan view showing an example of a slot part constituting an antenna mounted on the IC tag.

  The IC tag 41 according to the fourth embodiment is a modification of the IC tag 1 according to the first embodiment described above. The IC tag 41 according to the fourth embodiment is different from the IC tag 1 according to the first embodiment described above in that there are conductor portions 5a and 5b shared by the dipole antenna 3a and the slot portion 3b, and the slot portion 3b. Shape.

  That is, in the first embodiment described above, the terminal of the dipole antenna portion 3a and the terminal of the slot portion 3b are once connected to the conductor portion 5a or the conductor portion 5b, and the conductor portion 5a is connected to the antenna terminal 4a. 5b is connected to the antenna terminal 4b. The slot portion 3b has a T shape. In contrast, in the fourth embodiment, without providing the conductor portions 5a and 5b, the terminal of the dipole antenna portion 3a and the terminal of the slot portion 3b are directly connected to the antenna terminal 4a or the antenna terminal 4b, respectively. Yes. The slot portion 3b includes a ring-shaped conductor portion 3b1 with a part cut and a linear conductor portion 3b2 connected to the two cut portions, and the two linear conductor portions 3b2 are the antenna terminal 4a and the antenna. Each is directly connected to the terminal 4b. The adjustment of the slot portion 3b is performed so that only the value of the slot dimension D2 shown in FIG. 13 is changed.

  As described above, according to the fourth embodiment, without providing the conductor portions 5a and 5b, the terminal of the dipole antenna portion 3a and the terminal of the slot portion 3b are directly connected to the antenna terminal 4a or the antenna terminal 4b, respectively. Even if the slot portion 3b has a ring shape, the same effects as those of the first embodiment described above can be obtained.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The present invention can be applied to non-contact electronic devices, so-called wireless IC tags.

DESCRIPTION OF SYMBOLS 1 IC tag 2 Semiconductor integrated circuit device 3 Antenna 3a Dipole antenna part (radiation part, radiator)
3b Slot part (matching part, matching circuit)
3b1, 3b2 Conductor parts 4a, 4b Antenna terminals 5a, 5b Conductor part 6 Power supply circuit 7 Signal processing circuit 8 Transmission / reception circuits 9a, 9b Spiral inductor part 10 Matching conductor parts 21, 31, 41 IC tag D1, D2 Slot dimension M1 Axis of symmetry

Claims (10)

  1. A non-contact electronic device comprising a semiconductor integrated circuit device and an antenna,
    The semiconductor integrated circuit device has two antenna terminals connected to the antenna,
    The antenna has a dipole antenna part and a matching part,
    The dipole antenna part is composed of two spiral-shaped dipole antennas and two conductor parts respectively connected to one ends of the two spiral-shaped dipole antennas,
    The matching portion is composed of the two conductor portions shared with the dipole antenna portion, and a matching conductor portion having both ends connected to the two conductor portions,
    The contactless electronic device, wherein the two conductor portions are connected to the two antenna terminals, respectively.
  2. A non-contact electronic device comprising a semiconductor integrated circuit device and an antenna,
    The semiconductor integrated circuit device has two antenna terminals connected to the antenna,
    The antenna has a dipole antenna part and a matching part,
    The dipole antenna part is composed of two spiral-shaped dipole antennas,
    The matching portion is composed of a matching conductor portion,
    One end of each of the two spiral-shaped dipole antennas is connected to the two antenna terminals, and both ends of the matching conductor portion are connected to the two antenna terminals, respectively.
  3.   3. The non-contact electronic device according to claim 1, wherein a length of the antenna is shorter than ¼ of a wavelength of an electromagnetic wave transmitted and received by the antenna.
  4.   4. The non-contact electronic device according to claim 3, wherein the frequency of the electromagnetic wave is 860 to 960 MHz.
  5.   3. The non-contact electronic device according to claim 1, wherein the two spiral dipole antennas have a spiral shape having a plurality of corner portions bent at 90 degrees.
  6.   3. The non-contact electronic device according to claim 1, wherein the two spiral-shaped dipole antennas have a spiral shape without a corner portion bent at 90 degrees.
  7.   3. The non-contact electronic device according to claim 1, wherein the matching portion is T-shaped.
  8.   3. The non-contact electronic device according to claim 2, wherein the matching conductor portion constituting the matching portion has a ring shape with a part cut.
  9.   3. The non-contact electronic device according to claim 1, wherein the two spiral-shaped dipole antennas are arranged so as to be symmetric with respect to an axis of symmetry located between them. apparatus.
  10.   2. The non-contact electronic device according to claim 1, wherein the two conductor portions are arranged so as to be symmetric with respect to an axis of symmetry located between them.
JP2009246793A 2009-10-27 2009-10-27 Noncontact electronic device Pending JP2011095844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009246793A JP2011095844A (en) 2009-10-27 2009-10-27 Noncontact electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009246793A JP2011095844A (en) 2009-10-27 2009-10-27 Noncontact electronic device

Publications (1)

Publication Number Publication Date
JP2011095844A true JP2011095844A (en) 2011-05-12

Family

ID=44112704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009246793A Pending JP2011095844A (en) 2009-10-27 2009-10-27 Noncontact electronic device

Country Status (1)

Country Link
JP (1) JP2011095844A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015165724A (en) * 2012-07-25 2015-09-17 高橋 康文 antenna device
JPWO2017018117A1 (en) * 2015-07-27 2018-01-11 株式会社村田製作所 RFID tag for wireless communication device and laundry
WO2018155382A1 (en) * 2017-02-21 2018-08-30 株式会社村田製作所 Rfid tag

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007295395A (en) * 2006-04-26 2007-11-08 Fujitsu Ltd Antenna for tag, and tag using the same
WO2008012688A2 (en) * 2006-07-26 2008-01-31 Dymo Tape printing apparatus and tape cassette
WO2009064402A1 (en) * 2007-11-14 2009-05-22 Sensormatic Electronics Corporation Combination eas and rfid label or tag using a hybrid rfid antenna
JP2009524363A (en) * 2006-01-19 2009-06-25 トランスパシフィック・テクノロジーズ,リミテッド・ライアビリティ・カンパニー RFID antenna
JP2010114526A (en) * 2008-11-04 2010-05-20 Fujitsu Ltd Antenna for tag, and radio tag equipped with it

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009524363A (en) * 2006-01-19 2009-06-25 トランスパシフィック・テクノロジーズ,リミテッド・ライアビリティ・カンパニー RFID antenna
JP2007295395A (en) * 2006-04-26 2007-11-08 Fujitsu Ltd Antenna for tag, and tag using the same
WO2008012688A2 (en) * 2006-07-26 2008-01-31 Dymo Tape printing apparatus and tape cassette
WO2009064402A1 (en) * 2007-11-14 2009-05-22 Sensormatic Electronics Corporation Combination eas and rfid label or tag using a hybrid rfid antenna
JP2010114526A (en) * 2008-11-04 2010-05-20 Fujitsu Ltd Antenna for tag, and radio tag equipped with it

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015165724A (en) * 2012-07-25 2015-09-17 高橋 康文 antenna device
JPWO2017018117A1 (en) * 2015-07-27 2018-01-11 株式会社村田製作所 RFID tag for wireless communication device and laundry
WO2018155382A1 (en) * 2017-02-21 2018-08-30 株式会社村田製作所 Rfid tag
JPWO2018155382A1 (en) * 2017-02-21 2019-06-27 株式会社村田製作所 RFID tag

Similar Documents

Publication Publication Date Title
JP5896065B2 (en) Wireless IC device and component for wireless IC device
EP2928015B1 (en) Radio frequency ic device and electronic apparatus
US7589675B2 (en) Broadband antenna
JP5482824B2 (en) Wireless IC device
JP4174801B2 (en) Identification tag reader / writer antenna
US7183994B2 (en) Compact antenna with directed radiation pattern
JP5522227B2 (en) Mobile communication terminal
JPWO2009110381A1 (en) Wireless IC device and wireless communication system
EP1772927B1 (en) Antenna unit and noncontact IC tag
JP4498364B2 (en) Antenna and contactless tag
JP2009112062A (en) Rfid reader/writer and structure of antenna
EP1887653B1 (en) RFID tag and manufacturing method thereof
EP2377200B1 (en) Rfid antenna circuit
US8177138B2 (en) Radio IC device
CN101960665B (en) Radio IC device
US7055754B2 (en) Self-compensating antennas for substrates having differing dielectric constant values
US9117157B2 (en) Wireless IC device and electromagnetic coupling module
JP5521686B2 (en) Antenna apparatus and wireless communication device
EP2264831A1 (en) Radio ic device, electronic device, and method for adjusting resonance frequency of radio ic device
JP2007228326A (en) Loop antenna and rfid tag
US7764928B2 (en) Wireless IC device and component for wireless IC device
US7446729B2 (en) Loop antenna unit and radio communication medium processor
US8009101B2 (en) Wireless IC device
US9024827B2 (en) Antenna apparatus and communication terminal
JP2007249620A (en) Wireless tag

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120622

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130228

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130426

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130521