WO2012033076A1 - 樹脂組成物及びその成形体 - Google Patents
樹脂組成物及びその成形体 Download PDFInfo
- Publication number
- WO2012033076A1 WO2012033076A1 PCT/JP2011/070221 JP2011070221W WO2012033076A1 WO 2012033076 A1 WO2012033076 A1 WO 2012033076A1 JP 2011070221 W JP2011070221 W JP 2011070221W WO 2012033076 A1 WO2012033076 A1 WO 2012033076A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- resin composition
- cyclic olefin
- ring
- opening polymer
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 48
- -1 hydrogenated cyclic olefin Chemical group 0.000 claims abstract description 118
- 229920000642 polymer Polymers 0.000 claims abstract description 97
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims abstract description 75
- 238000007142 ring opening reaction Methods 0.000 claims abstract description 72
- 239000000178 monomer Substances 0.000 claims abstract description 45
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims abstract description 25
- 125000003367 polycyclic group Chemical group 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims abstract description 21
- 239000002667 nucleating agent Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 229910052623 talc Inorganic materials 0.000 claims description 17
- 150000002430 hydrocarbons Chemical group 0.000 claims description 16
- 239000000454 talc Substances 0.000 claims description 16
- 229930195733 hydrocarbon Natural products 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 8
- 239000004215 Carbon black (E152) Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000007423 decrease Effects 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 61
- 150000002736 metal compounds Chemical class 0.000 description 45
- 125000001424 substituent group Chemical group 0.000 description 37
- 238000005984 hydrogenation reaction Methods 0.000 description 35
- 239000001993 wax Substances 0.000 description 28
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 22
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 18
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 17
- 125000000217 alkyl group Chemical group 0.000 description 16
- 238000002156 mixing Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 238000006116 polymerization reaction Methods 0.000 description 16
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 13
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000002425 crystallisation Methods 0.000 description 12
- 230000008025 crystallization Effects 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 125000005843 halogen group Chemical group 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical class OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000003963 antioxidant agent Substances 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 239000002685 polymerization catalyst Substances 0.000 description 10
- 239000012463 white pigment Substances 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- 239000003365 glass fiber Substances 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 9
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 7
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000002170 ethers Chemical class 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 125000002524 organometallic group Chemical group 0.000 description 6
- 125000004430 oxygen atom Chemical group O* 0.000 description 6
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 5
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 238000001579 optical reflectometry Methods 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- 239000005909 Kieselgur Substances 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 4
- 125000005103 alkyl silyl group Chemical group 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 125000001309 chloro group Chemical group Cl* 0.000 description 4
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 239000002530 phenolic antioxidant Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 235000010755 mineral Nutrition 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 230000037048 polymerization activity Effects 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- ZHROMWXOTYBIMF-UHFFFAOYSA-M sodium;1,3,7,9-tetratert-butyl-11-oxido-5h-benzo[d][1,3,2]benzodioxaphosphocine 11-oxide Chemical compound [Na+].C1C2=CC(C(C)(C)C)=CC(C(C)(C)C)=C2OP([O-])(=O)OC2=C1C=C(C(C)(C)C)C=C2C(C)(C)C ZHROMWXOTYBIMF-UHFFFAOYSA-M 0.000 description 3
- 238000013112 stability test Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000003624 transition metals Chemical group 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- MEBONNVPKOBPEA-UHFFFAOYSA-N 1,1,2-trimethylcyclohexane Chemical compound CC1CCCCC1(C)C MEBONNVPKOBPEA-UHFFFAOYSA-N 0.000 description 2
- QEGNUYASOUJEHD-UHFFFAOYSA-N 1,1-dimethylcyclohexane Chemical compound CC1(C)CCCCC1 QEGNUYASOUJEHD-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- GCPCLEKQVMKXJM-UHFFFAOYSA-N ethoxy(diethyl)alumane Chemical compound CCO[Al](CC)CC GCPCLEKQVMKXJM-UHFFFAOYSA-N 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N hexanedioic acid Natural products OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000002815 homogeneous catalyst Substances 0.000 description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-UHFFFAOYSA-N norbornene Chemical class C1C2CCC1C=C2 JFNLZVQOOSMTJK-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000002894 organic compounds Chemical group 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 235000019271 petrolatum Nutrition 0.000 description 2
- 239000012169 petroleum derived wax Substances 0.000 description 2
- 235000019381 petroleum wax Nutrition 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- VIHDTGHDWPVSMM-UHFFFAOYSA-N ruthenium;triphenylphosphane Chemical compound [Ru].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 VIHDTGHDWPVSMM-UHFFFAOYSA-N 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 2
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 2
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 2
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical compound CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 description 1
- XCPFSALHURPPJE-UHFFFAOYSA-N (3,5-ditert-butyl-4-hydroxyphenyl) propanoate Chemical compound CCC(=O)OC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 XCPFSALHURPPJE-UHFFFAOYSA-N 0.000 description 1
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- GCYUJISWSVALJD-UHFFFAOYSA-N 1,1-diethylcyclohexane Chemical compound CCC1(CC)CCCCC1 GCYUJISWSVALJD-UHFFFAOYSA-N 0.000 description 1
- FMZITCJWMYHQFG-UHFFFAOYSA-N 1,2,3,4,4a,5,8,8a-octahydro-2-methyl-1,4:5,8-dimethanonaphthalene Chemical compound C1C(C23)C=CC1C3C1CC2CC1C FMZITCJWMYHQFG-UHFFFAOYSA-N 0.000 description 1
- FPRWVAMPWKGTNV-UHFFFAOYSA-N 1,2,3,4,5,6-hexahydroanthracene Chemical compound C1=CCCC2=C1C=C1CCCCC1=C2 FPRWVAMPWKGTNV-UHFFFAOYSA-N 0.000 description 1
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical compound C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 1
- GWYPDXLJACEENP-UHFFFAOYSA-N 1,3-cycloheptadiene Chemical compound C1CC=CC=CC1 GWYPDXLJACEENP-UHFFFAOYSA-N 0.000 description 1
- RCJMVGJKROQDCB-UHFFFAOYSA-N 1,3-dimethyl-1,3-butadiene Natural products CC=CC(C)=C RCJMVGJKROQDCB-UHFFFAOYSA-N 0.000 description 1
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- OUCVDOATPNXMDH-UHFFFAOYSA-N 1-oxacycloheptadec-16-ene Chemical class O1C=CCCCCCCCCCCCCCC1 OUCVDOATPNXMDH-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- 125000000530 1-propynyl group Chemical group [H]C([H])([H])C#C* 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AOIYTIDHFMNVOO-UHFFFAOYSA-N 2,3,3a,4,5,6-hexahydro-1h-indene Chemical compound C1CCC=C2CCCC21 AOIYTIDHFMNVOO-UHFFFAOYSA-N 0.000 description 1
- DSAYAFZWRDYBQY-UHFFFAOYSA-N 2,5-dimethylhexa-1,5-diene Chemical compound CC(=C)CCC(C)=C DSAYAFZWRDYBQY-UHFFFAOYSA-N 0.000 description 1
- GNLSVPVTNJCZKO-UHFFFAOYSA-N 2,6-ditert-butyl-4-[(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)methyl]phenol phosphorous acid Chemical class OP(O)O.CC(C)(C)c1cc(CP2(=O)Oc3ccccc3-c3ccccc23)cc(c1O)C(C)(C)C GNLSVPVTNJCZKO-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- CMAOLVNGLTWICC-UHFFFAOYSA-N 2-fluoro-5-methylbenzonitrile Chemical compound CC1=CC=C(F)C(C#N)=C1 CMAOLVNGLTWICC-UHFFFAOYSA-N 0.000 description 1
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2-methyl-5-methylpyridine Natural products CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 1
- DRWYRROCDFQZQF-UHFFFAOYSA-N 2-methylpenta-1,4-diene Chemical compound CC(=C)CC=C DRWYRROCDFQZQF-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- UUIMDJFBHNDZOW-UHFFFAOYSA-N 2-tert-butylpyridine Chemical compound CC(C)(C)C1=CC=CC=N1 UUIMDJFBHNDZOW-UHFFFAOYSA-N 0.000 description 1
- 125000004362 3,4,5-trichlorophenyl group Chemical group [H]C1=C(Cl)C(Cl)=C(Cl)C([H])=C1* 0.000 description 1
- HRECPBLGWOTTIT-UHFFFAOYSA-N 3,9-bis(2-dodecylsulfanylethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane Chemical compound C1OC(CCSCCCCCCCCCCCC)OCC21COC(CCSCCCCCCCCCCCC)OC2 HRECPBLGWOTTIT-UHFFFAOYSA-N 0.000 description 1
- 125000000474 3-butynyl group Chemical group [H]C#CC([H])([H])C([H])([H])* 0.000 description 1
- JYZKYCYHXBQTCY-UHFFFAOYSA-N 3-methoxycarbonylbicyclo[2.2.1]hept-5-ene-2-carboxylic acid Chemical compound C1C2C=CC1C(C(=O)OC)C2C(O)=O JYZKYCYHXBQTCY-UHFFFAOYSA-N 0.000 description 1
- 125000004207 3-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(OC([H])([H])[H])=C1[H] 0.000 description 1
- XUFPYLQWLKKGDQ-UHFFFAOYSA-N 4,4a,9,9a-tetrahydro-1,4-methano-1h-fluorene Chemical compound C12CC3=CC=CC=C3C1C1C=CC2C1 XUFPYLQWLKKGDQ-UHFFFAOYSA-N 0.000 description 1
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical class CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- NMLSKYOPDGYLLU-UHFFFAOYSA-N 4-[[2,3-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]phenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C(=C(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C=CC=2)CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 NMLSKYOPDGYLLU-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- KSEUIMCJKBBLJV-UHFFFAOYSA-N 4-propylbicyclo[2.2.1]hept-5-en-2-ol Chemical compound C1C(O)C2C=CC1(CCC)C2 KSEUIMCJKBBLJV-UHFFFAOYSA-N 0.000 description 1
- JGLIHSMBVDZMSA-UHFFFAOYSA-N 5-(cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene Chemical compound C1=CC2CC1CC2C1=CCCCC1 JGLIHSMBVDZMSA-UHFFFAOYSA-N 0.000 description 1
- LUMNWCHHXDUKFI-UHFFFAOYSA-N 5-bicyclo[2.2.1]hept-2-enylmethanol Chemical compound C1C2C(CO)CC1C=C2 LUMNWCHHXDUKFI-UHFFFAOYSA-N 0.000 description 1
- YSWATWCBYRBYBO-UHFFFAOYSA-N 5-butylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCC)CC1C=C2 YSWATWCBYRBYBO-UHFFFAOYSA-N 0.000 description 1
- VTWPBVSOSWNXAX-UHFFFAOYSA-N 5-decylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCCCCCCCC)CC1C=C2 VTWPBVSOSWNXAX-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- QHJIJNGGGLNBNJ-UHFFFAOYSA-N 5-ethylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CC)CC1C=C2 QHJIJNGGGLNBNJ-UHFFFAOYSA-N 0.000 description 1
- WMWDGZLDLRCDRG-UHFFFAOYSA-N 5-hexylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCCCC)CC1C=C2 WMWDGZLDLRCDRG-UHFFFAOYSA-N 0.000 description 1
- PCBPVYHMZBWMAZ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)CC1C=C2 PCBPVYHMZBWMAZ-UHFFFAOYSA-N 0.000 description 1
- PGNNHYNYFLXKDZ-UHFFFAOYSA-N 5-phenylbicyclo[2.2.1]hept-2-ene Chemical compound C1=CC2CC1CC2C1=CC=CC=C1 PGNNHYNYFLXKDZ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- VLPUSWKKMASBGV-UHFFFAOYSA-N C(C)(C)(C)C1=CC=C(C(=C1)C(C)(C)C)[Na] Chemical compound C(C)(C)(C)C1=CC=C(C(=C1)C(C)(C)C)[Na] VLPUSWKKMASBGV-UHFFFAOYSA-N 0.000 description 1
- FUJFLYMVTFURNX-UHFFFAOYSA-N C=CCCCCCCCC.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O Chemical compound C=CCCCCCCCC.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O.C1(CCCCCC1)=O FUJFLYMVTFURNX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- QXKHYNVANLEOEG-UHFFFAOYSA-N Methoxsalen Chemical group C1=CC(=O)OC2=C1C=C1C=COC1=C2OC QXKHYNVANLEOEG-UHFFFAOYSA-N 0.000 description 1
- 239000005641 Methyl octanoate Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004264 Petrolatum Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- IORUEKDKNHHQAL-UHFFFAOYSA-N [2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl] prop-2-enoate Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)OC(=O)C=C)=C1O IORUEKDKNHHQAL-UHFFFAOYSA-N 0.000 description 1
- DKWWWNAJHCKBST-UHFFFAOYSA-N [O].CC(O)=O Chemical compound [O].CC(O)=O DKWWWNAJHCKBST-UHFFFAOYSA-N 0.000 description 1
- NLSHOVBRUATWKO-UHFFFAOYSA-N acetonitrile;benzonitrile Chemical compound CC#N.N#CC1=CC=CC=C1 NLSHOVBRUATWKO-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 125000004450 alkenylene group Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 125000004419 alkynylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- KOKLYLSZOGGBHE-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-4-carbonitrile Chemical compound C1CC2C=CC1(C#N)C2 KOKLYLSZOGGBHE-UHFFFAOYSA-N 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- FLPKSBDJMLUTEX-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) 2-butyl-2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]propanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)(CCCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 FLPKSBDJMLUTEX-UHFFFAOYSA-N 0.000 description 1
- UWZMEXHSCJBWCM-UHFFFAOYSA-N bis(2-methylpropoxy)-(2-methylpropyl)alumane Chemical compound CC(C)C[O-].CC(C)C[O-].CC(C)C[Al+2] UWZMEXHSCJBWCM-UHFFFAOYSA-N 0.000 description 1
- ICEQTWAHBIDMIH-UHFFFAOYSA-N bis(2-methylpropyl)alumanylium;2-methylpropan-1-olate Chemical compound CC(C)C[O-].CC(C)C[Al+]CC(C)C ICEQTWAHBIDMIH-UHFFFAOYSA-N 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- YNHIGQDRGKUECZ-UHFFFAOYSA-L bis(triphenylphosphine)palladium(ii) dichloride Chemical compound [Cl-].[Cl-].[Pd+2].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 YNHIGQDRGKUECZ-UHFFFAOYSA-L 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- QXDMQSPYEZFLGF-UHFFFAOYSA-L calcium oxalate Chemical compound [Ca+2].[O-]C(=O)C([O-])=O QXDMQSPYEZFLGF-UHFFFAOYSA-L 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- GBAOBIBJACZTNA-UHFFFAOYSA-L calcium sulfite Chemical compound [Ca+2].[O-]S([O-])=O GBAOBIBJACZTNA-UHFFFAOYSA-L 0.000 description 1
- 235000010261 calcium sulphite Nutrition 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 150000001925 cycloalkenes Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- HYPABJGVBDSCIT-UPHRSURJSA-N cyclododecene Chemical compound C1CCCCC\C=C/CCCC1 HYPABJGVBDSCIT-UPHRSURJSA-N 0.000 description 1
- JQOPPJNZQUKFHB-OWOJBTEDSA-N cycloheptadecene Chemical compound C1CCCCCCC\C=C\CCCCCCC1 JQOPPJNZQUKFHB-OWOJBTEDSA-N 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical compound C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- MKNXBRLZBFVUPV-UHFFFAOYSA-L cyclopenta-1,3-diene;dichlorotitanium Chemical compound Cl[Ti]Cl.C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 MKNXBRLZBFVUPV-UHFFFAOYSA-L 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- YKNMBTZOEVIJCM-UHFFFAOYSA-N dec-2-ene Chemical compound CCCCCCCC=CC YKNMBTZOEVIJCM-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- DLRHRQTUCJTIIV-UHFFFAOYSA-N diethoxy(ethyl)alumane Chemical compound CC[O-].CC[O-].CC[Al+2] DLRHRQTUCJTIIV-UHFFFAOYSA-N 0.000 description 1
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical class OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 1
- KZLUHGRPVSRSHI-UHFFFAOYSA-N dimethylmagnesium Chemical compound C[Mg]C KZLUHGRPVSRSHI-UHFFFAOYSA-N 0.000 description 1
- HPYNZHMRTTWQTB-UHFFFAOYSA-N dimethylpyridine Natural products CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 1
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- MKRVHLWAVKJBFN-UHFFFAOYSA-N diphenylzinc Chemical compound C=1C=CC=CC=1[Zn]C1=CC=CC=C1 MKRVHLWAVKJBFN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- GNGHYFMQCBTLSA-UHFFFAOYSA-N ethyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC)(C)CC1C=C2 GNGHYFMQCBTLSA-UHFFFAOYSA-N 0.000 description 1
- FCCGTJAGEHZPBF-UHFFFAOYSA-N ethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC)CC1C=C2 FCCGTJAGEHZPBF-UHFFFAOYSA-N 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- GEAWFZNTIFJMHR-UHFFFAOYSA-N hepta-1,6-diene Chemical compound C=CCCCC=C GEAWFZNTIFJMHR-UHFFFAOYSA-N 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002638 heterogeneous catalyst Substances 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- QUXHCILOWRXCEO-UHFFFAOYSA-M magnesium;butane;chloride Chemical compound [Mg+2].[Cl-].CCC[CH2-] QUXHCILOWRXCEO-UHFFFAOYSA-M 0.000 description 1
- YHNWUQFTJNJVNU-UHFFFAOYSA-N magnesium;butane;ethane Chemical compound [Mg+2].[CH2-]C.CCC[CH2-] YHNWUQFTJNJVNU-UHFFFAOYSA-N 0.000 description 1
- KXDANLFHGCWFRQ-UHFFFAOYSA-N magnesium;butane;octane Chemical compound [Mg+2].CCC[CH2-].CCCCCCC[CH2-] KXDANLFHGCWFRQ-UHFFFAOYSA-N 0.000 description 1
- YCCXQARVHOPWFJ-UHFFFAOYSA-M magnesium;ethane;chloride Chemical compound [Mg+2].[Cl-].[CH2-]C YCCXQARVHOPWFJ-UHFFFAOYSA-M 0.000 description 1
- RVOYYLUVELMWJF-UHFFFAOYSA-N magnesium;hexane Chemical compound [Mg+2].CCCCC[CH2-].CCCCC[CH2-] RVOYYLUVELMWJF-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- DQEUYIQDSMINEY-UHFFFAOYSA-M magnesium;prop-1-ene;bromide Chemical compound [Mg+2].[Br-].[CH2-]C=C DQEUYIQDSMINEY-UHFFFAOYSA-M 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- RMAZRAQKPTXZNL-UHFFFAOYSA-N methyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC)CC1C=C2 RMAZRAQKPTXZNL-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 238000000520 microinjection Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002848 norbornenes Chemical class 0.000 description 1
- XKIVKIIBCJIWNU-UHFFFAOYSA-N o-[3-pentadecanethioyloxy-2,2-bis(pentadecanethioyloxymethyl)propyl] pentadecanethioate Chemical compound CCCCCCCCCCCCCCC(=S)OCC(COC(=S)CCCCCCCCCCCCCC)(COC(=S)CCCCCCCCCCCCCC)COC(=S)CCCCCCCCCCCCCC XKIVKIIBCJIWNU-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 125000001979 organolithium group Chemical group 0.000 description 1
- 125000002734 organomagnesium group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- QYZLKGVUSQXAMU-UHFFFAOYSA-N penta-1,4-diene Chemical compound C=CCC=C QYZLKGVUSQXAMU-UHFFFAOYSA-N 0.000 description 1
- OHVKVVAUWQFKQY-UHFFFAOYSA-N pentadeca-2,7,9,11-tetraene Chemical compound CCCC=CC=CC=CCCCC=CC OHVKVVAUWQFKQY-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000005981 pentynyl group Chemical group 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229940066842 petrolatum Drugs 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical class O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- NHKJPPKXDNZFBJ-UHFFFAOYSA-N phenyllithium Chemical compound [Li]C1=CC=CC=C1 NHKJPPKXDNZFBJ-UHFFFAOYSA-N 0.000 description 1
- MRSDSBMESKXSNZ-UHFFFAOYSA-N phosphane;tricyclohexylphosphane Chemical class P.C1CCCCC1P(C1CCCCC1)C1CCCCC1 MRSDSBMESKXSNZ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical group C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 235000010235 potassium benzoate Nutrition 0.000 description 1
- 239000004300 potassium benzoate Substances 0.000 description 1
- 229940103091 potassium benzoate Drugs 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- SBYHFKPVCBCYGV-UHFFFAOYSA-N quinuclidine Chemical compound C1CC2CCN1CC2 SBYHFKPVCBCYGV-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- PVJHFVMRMWVWAX-UHFFFAOYSA-N tetradeca-2,7,9,11-tetraene Chemical compound CCC=CC=CC=CCCCC=CC PVJHFVMRMWVWAX-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- VXKWYPOMXBVZSJ-UHFFFAOYSA-N tetramethyltin Chemical compound C[Sn](C)(C)C VXKWYPOMXBVZSJ-UHFFFAOYSA-N 0.000 description 1
- CRHIAMBJMSSNNM-UHFFFAOYSA-N tetraphenylstannane Chemical compound C1=CC=CC=C1[Sn](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 CRHIAMBJMSSNNM-UHFFFAOYSA-N 0.000 description 1
- 238000001757 thermogravimetry curve Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 description 1
- IGNTWNVBGLNYDV-UHFFFAOYSA-N triisopropylphosphine Chemical compound CC(C)P(C(C)C)C(C)C IGNTWNVBGLNYDV-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- WRSPWQHUHVRNFV-UHFFFAOYSA-N tris[3,5-di(nonyl)phenyl] phosphite Chemical compound CCCCCCCCCC1=CC(CCCCCCCCC)=CC(OP(OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)=C1 WRSPWQHUHVRNFV-UHFFFAOYSA-N 0.000 description 1
- 150000003658 tungsten compounds Chemical class 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- QMBQEXOLIRBNPN-UHFFFAOYSA-L zirconocene dichloride Chemical compound [Cl-].[Cl-].[Zr+4].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 QMBQEXOLIRBNPN-UHFFFAOYSA-L 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0083—Nucleating agents promoting the crystallisation of the polymer matrix
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/06—Waxes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/33—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain
- C08G2261/332—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing only carbon atoms
- C08G2261/3325—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing only carbon atoms derived from other polycyclic systems
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/70—Post-treatment
- C08G2261/72—Derivatisation
- C08G2261/724—Hydrogenation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the present invention relates to a resin composition capable of giving a molded body that is sufficiently crystallized and hardly deforms due to the influence of heat even when injection molding is performed at a relatively low mold temperature, and the molded body. .
- Patent Document 1 A film obtained from a composition in which a nucleating agent is blended with a crystalline cyclic olefin polymer hydride obtained by ring-opening polymerization of a monomer having 2-norbornene as a main component and hydrogenation is more It is known to realize low water vapor permeability (Patent Document 2).
- the aliphatic polyester resin is a crystalline resin
- the crystallization speed is very slow, there is a problem that it takes a high temperature and a long time to obtain a molded body by injection molding using a mold.
- LED Light Emitting Diode
- LED Light Emitting Diode
- LED emits light by directly converting electrical energy into light, so it has good energy efficiency, and has a long life and small size and light weight compared to incandescent bulbs and fluorescent lamps.
- It is a light source having a feature that it can be made into a light source. Therefore, in recent years, it has been used as a general lighting fixture in place of an electronic device such as a mobile phone, a light source of a backlight of a large-sized liquid crystal display device, a light source of a road traffic display board, an incandescent bulb and a fluorescent lamp.
- the LED is generally composed of a semiconductor chip that is a light-emitting element, a sealing material that protects the semiconductor chip, and a light reflector for adjusting the direction of light.
- the light reflector is used for the purpose of reflecting the light emitted from the semiconductor chip and collecting the light in a necessary direction, and is an important member for improving the brightness of the LED.
- High light reflectance is required for the light reflector (LED light reflector) constituting the LED.
- the LED light reflector is further heated during molding (heating for melt molding), manufacturing (heating and soldering for sealing material curing), and during use (heat dissipation of the semiconductor chip). Affected by. Therefore, as a material for the LED light reflector, a composition obtained by blending a white pigment such as titanium oxide with a polyamide resin excellent in heat resistance is widely used (Patent Documents 4, 5, etc.).
- LED light reflectors composed of the compositions described in Patent Documents 4 and 5 cannot be said to have sufficient heat resistance, and the light reflectivity may decrease due to heat received during molding or the like.
- a composition obtained by blending a white pigment such as titanium oxide with a polyamide resin requires a high temperature for molding, and since the viscosity at the time of melting is high, it is suitable for molding into a light reflector. There was also a problem with difficulty. For this reason, there is a strong demand for the development of a molding material for an LED light reflector that can provide a light reflector with good moldability and that is less likely to cause a decrease in light reflectance due to the influence of heat.
- the present invention has been made in view of the above-described prior art, and a molded body in which crystallization sufficiently proceeds and deformation due to the influence of heat hardly occurs even when injection molding is performed at a relatively low mold temperature. It is an object to provide a resin composition that can be provided, and a molded body thereof. Furthermore, an object of the present invention is to provide an LED light reflector that can be imparted with good moldability by the resin composition and is less likely to cause a decrease in light reflectance due to the influence of heat.
- the following resin compositions (1) to (5) and molded articles (6) and (7) are provided.
- a crystalline cyclic olefin ring-opening polymer hydrogenated product having a repeating unit derived from a polycyclic norbornene-based monomer, 1 to 4 parts by weight of wax, and a nucleus with respect to 100 parts by weight of the hydrogenated product A resin composition comprising an agent.
- the molded product according to (6) which is an LED light reflector.
- the resin composition of the present invention it is possible to obtain a molded body in which crystallization sufficiently proceeds and deformation due to the influence of heat hardly occurs even when injection molding is performed at a relatively low mold temperature.
- an LED light reflector that has excellent light reflectivity and that maintains the excellent light reflectivity for a long period of time without decreasing even under high temperature conditions, has good moldability. Can be obtained at The molded body of the present invention is hardly deformed by the influence of heat.
- the resin composition of the present invention has a crystalline cyclic olefin ring-opening polymer hydrogenated product (hereinafter simply referred to as “crystalline cyclic olefin ring-opening”) having a repeating unit derived from a polycyclic norbornene monomer.
- Polymeric hydrogenated product ") 1 to 4 parts by weight of wax and nucleating agent with respect to 100 parts by weight of the hydrogenated product.
- the crystalline cyclic olefin ring-opening polymer hydrogenated product used in the present invention is obtained by ring-opening polymerization of a monomer containing at least a polycyclic norbornene monomer, and the main chain double chain of the obtained ring-opening polymer. It is obtained by hydrogenating the bond and has crystallinity.
- the method for obtaining the crystalline cyclic olefin ring-opened polymer hydrogenated product is not particularly limited, and examples thereof include a method described in JP-A-2006-52333. According to this method, a cyclic olefin ring-opening polymer having syndiotactic stereoregularity is obtained, and hydrogenation thereof can be used to efficiently obtain the target cyclic olefin ring-opening polymer hydrogenated product. it can.
- the cyclic olefin ring-opening polymer used in the present invention can be obtained by using a polycyclic norbornene-based monomer having three or more rings as at least a part of the monomer.
- the polycyclic norbornene monomer may be a norbornene compound having a norbornene skeleton and one or more ring structures condensed to the norbornene skeleton in the molecule.
- a compound represented by the following formula (1) or (2) is particularly preferable as the polycyclic norbornene-based monomer.
- R 1 , R 2 , R 4 to R 7 are each independently a hydrogen atom; a halogen atom; a hydrocarbon group having 1 to 20 carbon atoms which may have a substituent. Or a substituent containing a silicon atom, an oxygen atom or a nitrogen atom.
- R 1 and R 2 , R 4 and R 6 may be bonded to each other to form a ring.
- R 3 is an optionally substituted divalent hydrocarbon group having 1 to 20 carbon atoms.
- m is 1 or 2.
- Examples of the halogen atom for R 1 , R 2 , R 4 to R 7 include a fluorine atom, a chlorine atom, and a bromine atom.
- Examples of the hydrocarbon group having 1 to 20 carbon atoms which may have a substituent include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert- Alkyl groups such as butyl group, pentyl group, isopentyl group, hexyl group, heptyl group, octyl group, nonyl group and decyl group; cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group and cycloheptyl group; Alkenyl groups such as vinyl group, 1-propenyl group, allyl group, 1-butenyl group, 2-butenyl group, penten
- substituents include halogen atoms such as fluorine atom and chlorine atom; alkoxy groups such as methoxy group and ethoxy group;
- the divalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent of R 3 includes an alkylene group such as a methylene group or an ethylene group; an alkenylene such as a vinylene group; Groups; alkynylene groups such as ethynylene groups; arylene groups such as phenylene groups; combinations thereof; and the like.
- Examples of the substituent include those exemplified as the substituents for the hydrocarbon groups of R 1 , R 2 and R 4 to R 7 .
- polycyclic norbornene monomer represented by the formula (1) examples include dicyclopentadiene, methyldicyclopentadiene, tricyclo [5.2.1.0 2,6 ] dec-8-ene, tetracyclo [9.2.1.0 2,10. 0 3,8 ] tetradeca-3,5,7,12-tetraene (also referred to as 1,4-methano-1,4,4a, 9a-tetrahydro-9H-fluorene), tetracyclo [10.2.1.0 2 , 11 . 0 4,9] pentadeca -4,6,8,13- tetraene (1,4-methano -1,4,4a, 9, 9a, also referred to as 10-hexa hydro anthracene) can be mentioned.
- tetracyclododecenes include tetracyclododecene, 8-methyltetracyclododecene, 8-ethyltetracyclododecene, 8-cyclohexyltetracyclododecene, and 8-cyclopentyltetracyclododecene.
- Tetracyclododecenes having a substituted or alkyl group 8-methylidenetetracyclododecene, 8-ethylidenetetracyclododecene, 8-vinyltetracyclododecene, 8-propenyltetracyclododecene, 8-cyclohexenyltetra Tetracyclododecenes having a double bond outside the ring such as cyclododecene and 8-cyclopentenyltetracyclododecene; tetracyclododecenes having an aromatic ring such as 8-phenyltetracyclododecene; 8-methoxy Carbonyltetracyclododecene, 8-methyl-8 Methoxycarbonyltetracyclododecene, 8-hydroxymethyltetracyclododecene, 8-carboxytetracyclod
- Tetracyclododecenes having substituents containing oxygen atoms Tetracyclododecenes having substituents containing nitrogen atoms such as 8-cyanotetracyclododecene and tetracyclododecene-8,9-dicarboxylic imide
- Tetracyclododecenes having a substituent containing a halogen atom such as 8-chlorotetracyclododecene
- tetracyclododecenes having a substituent containing a silicon atom such as 8-trimethoxysilyltetracyclododecene; Can be mentioned.
- hexacycloheptadecenes include hexacycloheptadecene, 12-methylhexacycloheptadecene, 12-ethylhexacycloheptadecene, 12-cyclohexylhexacycloheptadecene, 12-cyclopentylhexacycloheptadecene and the like.
- Hexacycloheptadecenes having a substituted or alkyl group 12-methylidenehexacycloheptadecene, 12-ethylidenehexacycloheptadecene, 12-vinylhexacycloheptadecene, 12-propenylhexacycloheptadecene, 12-cyclohexenylhexa Hexacycloheptadecenes having a double bond outside the ring such as cycloheptadecene and 12-cyclopentenylhexacycloheptadecene; having aromatic rings such as 12-phenylhexacycloheptadecene Oxacycloheptadecenes; 12-methoxycarbonylhexacycloheptadecene, 12-methyl-12-methoxycarbonylhexacycloheptadecene, 12-hydroxymethylhexacycloheptadecene, 12-carboxyhex
- polycyclic norbornene monomers can be used singly or in combination of two or more.
- it is 50% by weight based on the entire polycyclic norbornene-based monomer. It is preferable to use those containing at least% of dicyclopentadiene, and it is particularly preferable to use dicyclopentadiene alone.
- polycyclic norbornene monomers include endo isomers and exo isomers, both of which can be used as monomers, and one isomer can be used alone.
- an isomer mixture in which endo and exo isomers are present in an arbitrary ratio can be used.
- the ratio of one stereoisomer For example, the ratio of endo-form or exo-form is preferably 80% or more, more preferably 90% or more, and particularly preferably 95% or more.
- the stereoisomer which makes a ratio high is an end body from a viewpoint of synthetic
- a monomer other than the polycyclic norbornene monomer is copolymerized with the polycyclic norbornene monomer within a range that gives a polymer having crystallinity. Also good.
- Monomers that can be copolymerized with polycyclic norbornene monomers include bicyclic norbornene compounds, monocyclic olefins, cyclic dienes, and derivatives thereof that do not have a ring structure condensed to a norbornene skeleton. .
- bicyclic norbornene compound having no ring structure condensed to the norbornene skeleton include norbornene, 5-methylnorbornene, 5-ethylnorbornene, 5-butylnorbornene, 5-hexylnorbornene, 5-decylnorbornene, 5 -Norbornenes having an unsubstituted or alkyl group such as cyclohexyl norbornene and 5-cyclopentyl norbornene; Alkenyl groups such as 5-ethylidene norbornene, 5-vinyl norbornene, 5-propenyl norbornene, 5-cyclohexenyl norbornene and 5-cyclopentenyl norbornene Norbornenes having an aromatic ring such as 5-phenylnorbornene; 5-methoxycarbonylnorbornene, 5-ethoxycarbonylnorbornene, 5-methyl-5- Toxylcarbonylnorbornene, 5-
- the monocyclic olefin examples include cyclohexene, cycloheptene, and cyclooctene.
- Specific examples of the cyclic diene include cyclohexadiene and cycloheptadiene.
- the monomer it is preferable that 80% by weight or more of the polycyclic norbornene monomer is included with respect to the whole monomer used, and the monomer used is substantially only the polycyclic norbornene monomer. It is particularly preferred that
- Such a ring-opening polymerization catalyst is not particularly limited as long as it can give syndiotactic stereoregularity to the cyclic olefin ring-opening polymer, but a metal compound represented by the following formula (3) , which may be referred to as “metal compound (3)”).
- M is a metal atom selected from Group 6 transition metal atoms in the periodic table
- R 8 is a phenyl group optionally having a substituent at at least one of the 3, 4, and 5 positions.
- R 9 is a group selected from an optionally substituted alkyl group and an optionally substituted aryl group
- X is A group selected from a halogen atom, an alkyl group, an aryl group and an alkylsilyl group
- L is an electron-donating neutral ligand
- a is 0 or 1
- b is an integer of 0-2 is there.
- R 10 is a group selected from a hydrogen atom, an alkyl group which may have a substituent, and an aryl group which may have a substituent.
- the metal atom (M) constituting the metal compound (3) is selected from group 6 transition metal atoms (chromium, molybdenum, tungsten) in the periodic table. Among these, molybdenum or tungsten is preferably used, and tungsten is particularly preferably used.
- the metal compound (3) comprises a metal imide bond.
- R 8 is a substituent on the nitrogen atom constituting the metal imide bond.
- the substituent that the phenyl group which may have a substituent at at least one of the 3, 4, and 5 positions may include an alkyl group such as a methyl group or an ethyl group; a fluorine atom, a chlorine atom, or a bromine atom A halogen atom such as methoxy group, ethoxy group, isopropoxy group or the like; and further, substituents present in at least two positions of 3,4,5 are bonded to each other. Also good.
- phenyl group which may have a substituent at at least one of the 3, 4, and 5 positions include a phenyl group; a 4-methylphenyl group, a 4-chlorophenyl group, a 3-methoxyphenyl group, 4 -Monosubstituted phenyl groups such as cyclohexylphenyl group and 4-methoxyphenyl group; two groups such as 3,5-dimethylphenyl group, 3,5-dichlorophenyl group, 3,4-dimethylphenyl group and 3,5-dimethoxyphenyl group; Substituted phenyl group; trisubstituted phenyl group such as 3,4,5-trimethylphenyl group, 3,4,5-trichlorophenyl group; 2-naphthyl group, 3-methyl-2-naphthyl group, 4-methyl-2- And 2-naphthyl group which may have a substituent such as naphthyl group.
- Metal compound (3) substituents on the nitrogen atom may be used as (R 8 in the formula (3)), the R 10 in the group represented by -CH 2 R 10, optionally substituted
- the number of carbon atoms of the alkyl group that may be used is not particularly limited, but is usually 1 to 20, preferably 1 to 10.
- the alkyl group may be linear or branched.
- the substituent that this alkyl group may have is not particularly limited, and examples thereof include a phenyl group that may have a substituent such as a phenyl group and a 4-methylphenyl group; an alkoxyl group such as a methoxy group and an ethoxy group; Is mentioned.
- Examples of the aryl group that may have a substituent of R 10 include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, and the like.
- the substituent of the aryl group is not particularly limited, and examples thereof include a phenyl group which may have a substituent such as a phenyl group and a 4-methylphenyl group; an alkoxyl group such as a methoxy group and an ethoxy group; Can be mentioned.
- R 10 is an alkyl group having 1 to 20 carbon atoms, such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, t-butyl group, pentyl group, hexyl group, octyl group, decyl group, etc. Is preferred.
- the metal compound (3) has 3 or 4 groups selected from a halogen atom, an alkyl group, an aryl group, and an alkylsilyl group. That is, in the formula (3), X represents a group selected from a halogen atom, an alkyl group, an aryl group, and an alkylsilyl group. In addition, when there are two or more groups represented by X in the metal compound (3), these groups may be bonded to each other.
- Examples of the halogen atom that can be a group represented by X include a chlorine atom, a bromine atom, and an iodine atom.
- Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, a neopentyl group, a benzyl group, and a neophyll group.
- Examples of the aryl group include a phenyl group, a 4-methylphenyl group, a 2,6-dimethylphenyl group, a 1-naphthyl group, and a 2-naphthyl group.
- Examples of the alkylsilyl group include a trimethylsilyl group, a triethylsilyl group, a t-butyldimethylsilyl group, and the like.
- the metal compound (3) may have one metal alkoxide bond or one metal aryloxide bond.
- the substituent on the oxygen atom constituting this metal alkoxide bond or metal aryloxide bond (R 9 in formula (3)) may have an alkyl group which may have a substituent and a substituent. It is a group selected from good aryl groups.
- the alkyl group which may have a substituent and the aryl group which may have a substituent which can be the group represented by R 9 are the same as those in the group represented by R 10 described above. Can be used.
- the metal compound (3) may have one or two electron-donating neutral ligands.
- this electron-donating neutral ligand (L in Formula (3)) for example, an electron-donating compound containing an atom of Group 14 or Group 15 of the Periodic Table can be mentioned.
- Specific examples thereof include phosphines such as trimethylphosphine, triisopropylphosphine, tricyclohexylphosphine, and triphenylphosphine; ethers such as diethyl ether, dibutyl ether, 1,2-dimethoxyethane, and tetrahydrofuran; trimethylamine, triethylamine, pyridine, And amines such as lutidine.
- ethers are particularly preferably used.
- the metal compound (3) particularly preferably used as a ring-opening polymerization catalyst for obtaining a cyclic olefin ring-opening polymer having syndiotactic stereoregularity is a tungsten compound having a phenylimide group (in the formula (3)) , M is a tungsten atom, and R 8 is a phenyl group), among which tetrachlorotungstenphenylimide (tetrahydrofuran) is particularly preferable.
- the metal compound (3) is an oxyhalide of a Group 6 transition metal and phenyl isocyanates which may have a substituent at at least one of the 3, 4, and 5 positions, or a monosubstituted methyl isocyanate And an electron-donating neutral ligand (L) and, if necessary, an alcohol, a metal alkoxide, a metal aryloxide, etc. (for example, a method described in JP-A-5-345817) ) Can be synthesized.
- the synthesized metal compound (3) may be purified and isolated by crystallization or the like, or the catalyst synthesis solution can be used as it is as a ring-opening polymerization catalyst without purification.
- the amount of the metal compound (3) used as the ring-opening polymerization catalyst is usually 1: 100 to 1: 2,000,000, preferably 1 in terms of a molar ratio of (metal compound (3): whole monomer used). : 500 to 1: 1,000,000, more preferably 1: 1,000 to 1: 500,000. If the amount of catalyst is too large, it may be difficult to remove the catalyst. If the amount is too small, sufficient polymerization activity may not be obtained.
- the metal compound (3) can be used alone, but an organic metal reducing agent is used in combination with the metal compound (3) from the viewpoint of increasing the polymerization activity. It is preferable to do.
- organometallic reducing agents used include Groups 1, 2, 12, 13, and 14 of the periodic table having a hydrocarbon group having 1 to 20 carbon atoms.
- organolithium, organomagnesium, organozinc, organoaluminum, or organotin are preferably used, and organoaluminum or organotin are particularly preferably used.
- Organic lithium includes n-butyllithium, methyllithium, phenyllithium and the like.
- the organic magnesium include butylethylmagnesium, butyloctylmagnesium, dihexylmagnesium, ethylmagnesium chloride, n-butylmagnesium chloride, allylmagnesium bromide and the like.
- the organic zinc include dimethyl zinc, diethyl zinc, and diphenyl zinc.
- organic aluminum examples include trimethylaluminum, triethylaluminum, triisobutylaluminum, diethylaluminum chloride, ethylaluminum sesquichloride, ethylaluminum dichloride, diethylaluminum ethoxide, diisobutylaluminum isobutoxide, ethylaluminum diethoxide, isobutylaluminum diisobutoxide, etc. Is mentioned.
- organic tin examples include tetramethyltin, tetra (n-butyl) tin, and tetraphenyltin.
- the amount of the organometallic reducing agent used is preferably 0.1 to 100 moles, more preferably 0.2 to 50 moles, and particularly preferably 0.5 to 20 moles, relative to the metal compound (3). If the amount used is too small, the polymerization activity may not be improved, and if it is too much, side reactions may easily occur.
- the polymerization reaction for obtaining a crystalline cyclic olefin ring-opened polymer is usually carried out in an organic solvent.
- the organic solvent to be used is not particularly limited as long as the target ring-opening polymer or a hydrogenated product thereof can be dissolved or dispersed under predetermined conditions and does not inhibit the polymerization reaction or the hydrogenation reaction.
- organic solvent examples include aliphatic hydrocarbons such as pentane, hexane, and heptane; cyclopentane, cyclohexane, methylcyclohexane, dimethylcyclohexane, trimethylcyclohexane, ethylcyclohexane, diethylcyclohexane, decahydronaphthalene, bicycloheptane, and tricyclodecane.
- aliphatic hydrocarbons such as pentane, hexane, and heptane
- cyclopentane cyclohexane
- methylcyclohexane dimethylcyclohexane
- trimethylcyclohexane ethylcyclohexane
- diethylcyclohexane diethylcyclohexane
- decahydronaphthalene bicycloheptane
- tricyclodecane examples include ali
- Alicyclic hydrocarbons such as hexahydroindene and cyclooctane; aromatic hydrocarbons such as benzene, toluene and xylene; halogenated aliphatic hydrocarbons such as dichloromethane, chloroform and 1,2-dichloroethane; chlorobenzene and dichlorobenzene Halogen-containing aromatic hydrocarbons; nitrogen-containing hydrocarbon solvents such as nitromethane, nitrobenzene, and acetonitrile; ethers such as diethyl ether and tetrahydrofuran; or a mixture thereof Solvents.
- aromatic hydrocarbons, aliphatic hydrocarbons, alicyclic hydrocarbons, and ethers are preferably used.
- the ring-opening polymerization reaction can be initiated by mixing the monomer, the metal compound (3), and, if necessary, an organometallic reducing agent.
- the order in which these components are added is not particularly limited.
- a mixture of the metal compound (3) and the organometallic reducing agent may be added to the monomer and mixed, or a mixture of the monomer and the metal compound (3) may be added to the organometallic reducing agent.
- the metal compound (3) may be added to and mixed with the mixture of the monomer and the organometallic reducing agent.
- the total amount of each component may be added at once, or may be added in multiple portions, and added continuously over a relatively long time (for example, 1 minute or more).
- the monomer or metal compound (3) is divided into a plurality of times. It is preferable to add them continuously or continuously, and it is particularly preferable to add the monomers in a plurality of times or continuously.
- the concentration of the monomer during the polymerization reaction in the organic solvent is not particularly limited, but is preferably 1 to 50% by weight, more preferably 2 to 45% by weight, particularly 3 to 40% by weight. preferable. If the monomer concentration is too low, the productivity of the polymer may be deteriorated. If it is too high, the solution viscosity after polymerization is too high, and the subsequent hydrogenation reaction may be difficult.
- An activity regulator may be added to the polymerization reaction system.
- the activity adjusting agent can be used for the purpose of stabilizing the ring-opening polymerization catalyst, adjusting the polymerization reaction rate and the molecular weight distribution of the polymer.
- the activity regulator is not particularly limited as long as it is an organic compound having a functional group, but is preferably an oxygen-containing, nitrogen-containing, or phosphorus-containing organic compound.
- ethers such as diethyl ether, diisopropyl ether, dibutyl ether, anisole, furan and tetrahydrofuran; ketones such as acetone, benzophenone and cyclohexanone; esters such as ethyl acetate; nitriles such as acetonitrile benzonitrile; triethylamine , Amines such as triisopropylamine, quinuclidine, N, N-diethylaniline; pyridines such as pyridine, 2,4-lutidine, 2,6-lutidine, 2-t-butylpyridine; triphenylphosphine, tricyclohexylphosphine Phosphines such as trimethyl phosphate and triphenyl phosphate; phosphine oxides such as triphenyl phosphine oxide; and the like.
- These activity regulators can be used singly or in combination of two or more. The amount of
- a molecular weight modifier may be added to the polymerization reaction system in order to adjust the molecular weight of the ring-opening polymer.
- molecular weight regulators include ⁇ -olefins such as 1-butene, 1-pentene, 1-hexene and 1-octene; aromatic vinyl compounds such as styrene and vinyltoluene; ethyl vinyl ether, isobutyl vinyl ether, allyl glycidyl ether, acetic acid Oxygen-containing vinyl compounds such as allyl, allyl alcohol, and glycidyl methacrylate; halogen-containing vinyl compounds such as allyl chloride; nitrogen-containing vinyl compounds such as acrylamide; 1,4-pentadiene, 1,4-hexadiene, 1,5-hexadiene, 1 , 6-heptadiene, 2-methyl-1,4-pentadiene, 2,5-dimethyl-1,5-hexadiene, and the like
- the polymerization temperature is not particularly limited, but is usually in the range of ⁇ 78 ° C. to + 200 ° C., and preferably in the range of ⁇ 30 ° C. to + 180 ° C.
- the polymerization time is not particularly limited and depends on the reaction scale, but is usually in the range of 1 minute to 1000 hours.
- the ring-opening polymerization reaction of the monomer containing the polycyclic norbornene-based monomer under the conditions as described above is performed.
- a cyclic olefin ring-opening polymer having tic stereoregularity can be obtained.
- the ratio of racemo dyad in the cyclic olefin ring-opening polymer subjected to the hydrogenation reaction is not particularly limited, but is usually 60% or more, preferably 65% or more, more preferably 70 to 99%.
- the ratio of racemo dyad (degree of syndiotactic stereoregularity) in the cyclic olefin ring-opening polymer can be adjusted by selecting the kind of the ring-opening polymerization catalyst.
- the weight average molecular weight (Mw) measured by gel permeation chromatography of the cyclic olefin ring-opening polymer subjected to the hydrogenation reaction is not particularly limited, but is preferably 10,000 to 100,000 in terms of polyisoprene, More preferably, it is 15,000 to 80,000.
- Use of a cyclic olefin ring-opened polymer hydrogenated product obtained from a cyclic olefin ring-opened polymer having such a weight average molecular weight is preferable in terms of excellent moldability and excellent heat resistance of the obtained molded body.
- the weight average molecular weight of the cyclic olefin ring-opening polymer can be adjusted by adjusting the addition amount of the molecular weight modifier used at the time of polymerization.
- the molecular weight distribution of the cyclic olefin ring-opened polymer to be subjected to the hydrogenation reaction is not particularly limited, Usually, it is 1.5 to 4.0, preferably 1.6 to 3.5.
- Use of a cyclic olefin ring-opened polymer hydrogenated product obtained from a cyclic olefin ring-opened polymer having such a molecular weight distribution is preferred in terms of excellent moldability.
- the molecular weight distribution of the cyclic olefin ring-opening polymer hydrogenated product can be adjusted by the monomer addition method and the monomer concentration during the ring-opening polymerization reaction.
- the hydrogenation reaction of the cyclic olefin ring-opening polymer can be performed by supplying hydrogen into the reaction system in the presence of a hydrogenation catalyst.
- Any hydrogenation catalyst can be used as long as it is generally used in the hydrogenation of olefin compounds, and is not particularly limited. Examples thereof include the following.
- Homogeneous catalysts include catalyst systems composed of combinations of transition metal compounds and alkali metal compounds, such as cobalt acetate / triethylaluminum, nickel acetylacetonate / triisobutylaluminum, titanocene dichloride / n-butyllithium, zirconocene dichloride / sec- Combinations of butyl lithium, tetrabutoxy titanate / dimethyl magnesium and the like can be mentioned.
- transition metal compounds and alkali metal compounds such as cobalt acetate / triethylaluminum, nickel acetylacetonate / triisobutylaluminum, titanocene dichloride / n-butyllithium, zirconocene dichloride / sec- Combinations of butyl lithium, tetrabutoxy titanate / dimethyl magnesium and the like can be mentioned.
- noble metal complex catalysts such as dichlorobis (triphenylphosphine) palladium, chlorohydridocarbonyltris (triphenylphosphine) ruthenium, bis (tricyclohexylphosphine) benzilidineruthenium (IV) dichloride, chlorotris (triphenylphosphine) rhodium. .
- the catalyst system include diatomaceous earth, nickel / alumina, palladium / carbon, palladium / silica, palladium / diatomaceous earth, and palladium / alumina.
- the hydrogenation reaction is usually performed in an inert organic solvent.
- inert organic solvents include aromatic hydrocarbons such as benzene and toluene; aliphatic hydrocarbons such as pentane and hexane; alicyclic hydrocarbons such as cyclohexane and decahydronaphthalene; tetrahydrofuran, ethylene glycol dimethyl ether, and the like. Ethers; and the like.
- the inert organic solvent is usually the same as the solvent used in the polymerization reaction, and the hydrogenation catalyst may be added to the polymerization reaction solution as it is and reacted.
- the suitable conditions for the hydrogenation reaction vary depending on the hydrogenation catalyst system used, but the reaction temperature is usually -20 ° C to + 250 ° C, preferably -10 ° C to + 220 ° C, more preferably 0 ° C to 200 ° C. . If the hydrogenation temperature is too low, the reaction rate may be too slow, and if it is too high, side reactions may occur.
- the hydrogen pressure is usually from 0.01 to 20 MPa, preferably from 0.05 to 15 MPa, more preferably from 0.1 to 10 MPa. If the hydrogen pressure is too low, the hydrogenation rate may be too slow, and if it is too high, there will be restrictions on the apparatus in that a high pressure reactor is required.
- the reaction time is not particularly limited as long as the desired hydrogenation rate can be obtained, but is usually 0.1 to 10 hours.
- the hydrogenation rate (ratio of hydrogenated main chain double bonds) in the hydrogenation reaction of the cyclic olefin ring-opening polymer is not particularly limited, but is preferably 70% or more, more preferably 80% or more, and particularly preferably 90% or more, most preferably 99% or more.
- the hydrogenated crystalline cyclic olefin ring-opened polymer obtained as described above is a repeating unit derived from a polycyclic norbornene-based monomer represented by the following formula (4) or formula (5): It is what has.
- R 1 and R 2 each independently include a hydrogen atom; a halogen atom; an optionally substituted hydrocarbon group having 1 to 20 carbon atoms; or a silicon atom, an oxygen atom or a nitrogen atom
- R 1 and R 2 may be bonded to form a ring
- R 3 is a divalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent.
- the ratio of racemo dyad in the crystalline cyclic olefin ring-opening polymer hydrogenated product used in the present invention is not particularly limited as long as the hydrogenated product has crystallinity, but usually 55% or more, preferably 60% or more, More preferably, it is 65 to 99%.
- the tacticity of the polymer does not change in the hydrogenation reaction, it is based on having syndiotactic stereoregularity by subjecting the cyclic olefin ring-opening polymer having syndiotactic stereoregularity to the hydrogenation reaction.
- a crystalline cyclic olefin ring-opening polymer hydrogenated product having a repeating unit derived from a polycyclic norbornene monomer having crystallinity can be obtained.
- the resulting resin composition can give a molded product that is hardly deformed by the influence of heat.
- the ratio of the racemo dyad of the crystalline cyclic olefin ring-opening polymer hydrogenated product depends on the ratio of the racemo dyad of the cyclic olefin ring-opening polymer subjected to the hydrogenation reaction.
- the ratio of racemo dyad in the crystalline cyclic olefin ring-opened polymer hydrogenated product can be quantified based on the spectral data obtained by measuring a 13 C-NMR spectrum.
- the quantification method varies depending on the polymer. For example, in the case of a hydrogenated ring-opened polymer of dicyclopentadiene, 13 C-NMR measurement is performed at 150 ° C. using orthodichlorobenzene-d4 as a solvent, and meso-dyad.
- the ratio of racemo dyad can be determined from the intensity ratio of the 43.35 ppm signal from the origin and the 43.43 ppm signal from the racemo dyad.
- the crystalline cyclic olefin ring-opening polymer hydrogenated product used for constituting the resin composition of the present invention is not particularly limited as long as it has crystallinity, but has a melting point of 200 ° C. or higher. It is preferable to have a melting point of 230 to 290 ° C. By using a crystalline cyclic olefin ring-opening polymer hydrogenated product having such a melting point, it is possible to obtain a resin composition particularly excellent in balance between moldability and heat resistance.
- the melting point of the crystalline cyclic olefin ring-opening polymer hydrogenated product can be adjusted by adjusting the degree of syndiotactic stereoregularity (racemo dyad ratio), selecting the type of monomer used, etc. Can be adjusted.
- the wax blended in the resin composition of the present invention may be a natural wax or a synthetic wax.
- oily substances having a high melting point such as esters of higher fatty acids and monohydric or dihydric higher alcohols, neutral fats, higher fatty acids, hydrocarbons and the like exhibiting properties similar to these.
- Wax is usually a soft and smooth solid at room temperature, its melting point is usually 25 to 120 ° C., and gas burns well.
- waxes obtained from animals, plants, and minerals waxes obtained from animals, plants, and minerals, petroleum waxes (paraffin wax, microcrystalline wax, solid hydrocarbons at room temperature, mainly composed of hydrocarbons extracted during the distillation of crude oil) Or petrolatum), hydrocarbon wax synthesized by Fischer-Tropsch method (Fischer-Tropsch wax), and polyalkylene wax.
- hydrocarbon waxes represented by C n H 2n + 2 such as petroleum wax, Fischer-Tropsch wax and polyalkylene wax, are preferable because of the high transparency of the obtained molded product, and Fischer-Tropsch wax is preferred. More preferred.
- the hydrocarbon wax contains 95% by weight or more of a linear or branched saturated hydrocarbon.
- the blending amount of the wax is selected in the range of 1 to 4 parts by weight, preferably 1 to 3 parts by weight with respect to 100 parts by weight of the crystalline cyclic olefin ring-opening polymer hydrogenated product.
- the amount is too small, crystallization at a low mold temperature does not proceed sufficiently, and when the amount is too large, the heat resistance is low, which is not preferable.
- nucleating agent mix blended with the resin composition of this invention.
- examples thereof include sorbitol compounds, metal salts of organic phosphoric acid, metal salts of organic carboxylic acids, hindered amine compounds, hindered phenol compounds, kaolin and talc.
- sorbitol-based compound examples include dibenzylidene sorbitol, diparamethyldibenzylidene sorbitol, and the like.
- metal salts of organic phosphoric acid include sodium 2,2′-methylenebis (4,6-di-tert-butylphenyl) phosphate, bis (2,4,8,10-tetra-tert-butyl-6-hydroxy) -12H-dibenzo [d, g] [1,2,3] dioxaphosphocin-6-oxide) aluminum hydroxide salt and the like.
- metal salts of organic carboxylic acids examples include sodium benzoate, calcium oxalate, magnesium stearate, potassium benzoate and the like.
- hindered amine compounds include bis (1,2,2,6,6-pentamethyl-4-piperidyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] butyl malonate. Etc.
- hindered phenol compound examples include triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,3,5-tris [(4-tert-butyl- 3-hydroxy-2,6-xylyl) methyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-trimethyl-2,4,6- And tris (3 ′, 5′-di-t-butyl-4-hydroxybenzyl) benzene.
- a metal salt of organic phosphoric acid and talc are preferable.
- the metal salt of organic phosphoric acid sodium 2,2′-methylenebis (4,6-di-tert-butylphenyl) phosphate is particularly preferable.
- talc examples include a powder obtained by pulverizing a mineral generally called talc.
- the talc which is a raw material, contains hydrous magnesium silicate (3MgO ⁇ 4SiO 2 ⁇ H 2 O) as a main component and contains Al 2 O 3 , Fe 2 O 3 , CaO, K 2 O, Na 2 O and the like as subcomponents. Is a natural mineral.
- the whiteness of talc used in the present invention is usually 90% or more, preferably 90 to 97%, more preferably 93 to 97%.
- talc is available from Nippon Talc and Hayashi Kasei.
- the whiteness is influenced by the composition of talc, and when it is in the above range, a molded article having excellent heat resistance can be obtained without being colored even by melt molding.
- the whiteness is measured according to JIS P 8123.
- the average particle diameter (D50) of talc is not particularly limited as long as it is commercially available, but is preferably 25 ⁇ m or less, more preferably 20 ⁇ m or less, and particularly preferably 15 ⁇ m or less.
- the average particle diameter (D50) is measured by a laser diffraction method.
- the amount of the nucleating agent is not particularly limited, but is usually in the range of 0.001 to 5 parts by weight, preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the crystalline cyclic olefin ring-opening polymer hydrogenated product. Selected.
- talc may be blended when hydrogenating a cyclic olefin ring-opening polymer with a homogeneous catalyst. it can.
- the resin composition of the present invention may be composed of only a crystalline cyclic olefin ring-opening polymer hydrogenated product, a wax and a nucleating agent, or may be composed of other components.
- Other components include white pigments, glass fibers, antioxidants, fillers, colorants, flame retardants, flame retardant aids, antistatic agents, plasticizers, ultraviolet absorbers, light stabilizers, near infrared absorbers, Examples include a lubricant and a polymer material other than the crystalline cyclic olefin ring-opening polymer hydrogenated product.
- the white pigment is not particularly limited, but for example, silica, alumina, titanium oxide, magnesium oxide, magnesium carbonate, basic magnesium carbonate, calcium oxide, calcium carbonate, calcium sulfate, precipitated calcium carbonate, calcium sulfite, potassium titanate Lead titanate, barium sulfate, barium carbonate, barium sulfate, white lead, zinc white, basic lead sulfate, lithopone, zinc sulfide, zirconium oxide, barite, chalk, clay, talc powder, diatomaceous earth, etc. . These may be used alone or in combination of two or more.
- the shape of the white pigment may be any shape such as plate, granule, sphere, fiber, or indefinite shape. Among these, it is preferable to use titanium oxide as a white pigment.
- the kind of titanium oxide is not particularly limited, and any of rutile type titanium oxide and anatase type titanium oxide can be used. However, it is particularly preferable to use rutile type titanium oxide from the viewpoint of thermal stability.
- the shape of the titanium oxide is not particularly limited, and may be any of a spherical shape, a scale shape, an amorphous shape, and the like.
- the average particle diameter of titanium oxide is usually 0.05 to 5 ⁇ m, preferably 0.05 to 1 ⁇ m, and more preferably 0.1 to 1 ⁇ m. By using titanium oxide having such an average particle size, it is possible to obtain a composition capable of molding an LED light reflector that is particularly excellent in the reflectance of visible light.
- the particle diameter of titanium oxide indicates the diameter in the case of a spherical shape, and the longest distance between both ends in other cases. Moreover, an average particle diameter is the value which measured several single particle diameters with the electron microscope (Transmission type (TEM) or scanning type (SEM)), and averaged.
- TEM Transmission type
- SEM scanning type
- the amount of the white pigment may be determined in consideration of the balance between the light reflectance of the resulting composition, heat resistance, and moldability, and is not particularly limited. Is usually selected in the range of 20 to 200 parts by weight, preferably 25 to 100 parts by weight, per 100 parts by weight of the crystalline cyclic olefin ring-opening polymer hydrogenated product.
- glass fibers include glass fibers, glass flakes, glass beads, calcium silicate, montmorillonite, bentonite, graphite, aluminum powder, molybdenum sulfide, and the like. These may be used alone or in combination of two or more.
- the LED light reflector When the LED light reflector is molded, it is preferable to use glass fiber and / or titanium oxide, and it is particularly preferable to use glass fiber and titanium oxide from the viewpoint of heat resistance.
- the total amount of both is usually selected in the range of 21 to 200 parts by weight, preferably 45 to 190 parts by weight, more preferably 50 to 180 parts by weight.
- antioxidant when the LED light reflector is molded, it is also preferable to add an antioxidant. It does not specifically limit as antioxidant, For example, a phenolic antioxidant, phosphorus antioxidant, and sulfur type antioxidant can be used. Among these, it is preferable to use a phenolic antioxidant.
- phenolic antioxidant conventionally known ones can be used, for example, 2-t-butyl-6- (3-t-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl acrylate, 2 , 4-di-t-amyl-6- (1- (3,5-di-t-amyl-2-hydroxyphenyl) ethyl) phenyl acrylate and the like, and JP-A 63-179953 and JP-A 1-168643.
- Alkyl-substituted phenol compounds 6- (4-hydroxy-3,5-di-t-butylanilino) -2,4-bisoctylthio-1,3,5-triazine, 4-bisoctylthio-1,3 5-triazine, 2-octylthio-4,6-bis- (3,5-di-t-butyl-4-oxyanilino) -1,3,5-triazine Triazine group-containing phenol compound of;., Etc.
- alkyl-substituted phenolic antioxidants are particularly preferably used.
- phosphorus antioxidants include triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris (nonylphenyl) phosphite, tris (dinonylphenyl) phosphite, and tris (2,4-diphenyl).
- -T-butylphenyl) phosphite 10- (3,5-di-t-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide Phosphite compounds; 4,4′-butylidene-bis (3-methyl-6-tert-butylphenyl-di-tridecyl phosphite), 4,4′isopropylidene-bis (phenyl-di-alkyl phosphite) Examples thereof include diphosphite compounds such as (the alkyl moiety having 12 to 15 carbon atoms).
- sulfur-based antioxidant examples include dilauryl 3,3-thiodipropionate, dimyristyl 3,3′-thiodipropionate, distearyl 3,3-thiodipropionate, lauryl stearyl 3,3-thiodipro Pionate, pentaerythritol-tetrakis- ( ⁇ -lauryl-thio-propionate), 3,9-bis (2-dodecylthioethyl) -2,4,8,10-tetraoxaspiro [5.5] undecane, etc. Can be mentioned.
- the amount of the antioxidant is not particularly limited, but is usually 0.001 to 5 parts by weight, preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of the crystalline cyclic olefin ring-opening polymer hydrogenated product. It is selected in the range of 3 parts by weight.
- the resin composition of the present invention can be prepared by blending a crystalline cyclic olefin ring-opened polymer hydrogenated product with a wax, a nucleating agent, and other components as required, and mixing them according to a conventional method.
- the mixing method is not particularly limited.
- the mixing may be performed by melt kneading using a single-screw kneader, a twin-screw kneader, or the like, or dry blending using a mixer or the like.
- LED light reflector molding in addition to the crystalline cyclic olefin ring-opening polymer hydrogenated product, wax, and nucleating agent, white pigment and glass fiber, and other components (for example, oxidation) It is preferable to prepare the resin composition by blending and mixing an inhibitor). By using such a resin composition, an LED light reflector that is more excellent in light reflectivity and that maintains its excellent light reflectivity for a long period of time without deterioration even under high temperature conditions can be obtained. It can be obtained by moldability.
- the light reflectance of the LED light reflector molding resin composition (spectral reflectance at a wavelength of 450 nm, before deterioration) is not particularly limited, but is preferably 80% or more, more preferably 85 to 95%. .
- the light reflectance of the LED light reflector molding resin composition can be adjusted by the type and blending amount of the white pigment.
- the melt flow rate (280 ° C., 2.16 kgf) of the LED light reflector molding resin composition is not particularly limited, but is preferably 5 to 150 g / 10 minutes, and preferably 10 to 100 g / 10 minutes. More preferred.
- the melt flow rate of the LED light reflector molding resin composition can be adjusted by the molecular weight of the crystalline cyclic olefin ring-opening polymer hydrogenated product used and the type and blending amount of the white pigment.
- the resin composition of the present invention even when injection molding is performed at a relatively low mold temperature, crystallization can proceed sufficiently, and a molded body that hardly undergoes deformation due to the influence of heat can be provided.
- the molded article of the present invention is obtained by melt-molding the resin composition of the present invention.
- the melt molding method include injection molding, extrusion molding, press molding, blow molding, and calendar molding.
- the melt molding method may be selected according to the target shape and the like, but since the resin composition of the present invention has excellent moldability (melt moldability), an injection molding method with excellent mass productivity should be applied. Is preferred.
- the shape of the molded body is not particularly limited.
- Examples of the molded body include electronic components such as connectors, relays, capacitors, sensors, antennas, IC trays, chassis, coil seals, motor cases, power supply boxes, etc .; LED light reflectors; reflectors for vehicle lamps; Automotive parts such as cases, sensor cases, module parts cases; optical lens barrels; flexible printed circuit boards; release films for laminated printed wiring boards; solar cell boards; microwave ovens, rice cookers, electric jar pots, drying washing machines, Home appliance parts such as dishwashers and air conditioners; packaging and packaging films; food sheets and trays; LED mold materials; pump casings, impellers, pipe joints, bathroom panels and other residential parts.
- the molded article of the present invention is preferably an LED light reflector.
- an LED light reflector for example, a light source of a backlight of a large liquid crystal display device, a light source of a backlight of a liquid crystal display of a small electronic device such as a luminaire, a mobile phone, or a light source of an electric display panel such as a road traffic display board Examples thereof include a light reflector of the LED used.
- the shape of the LED light reflector may be determined as appropriate according to the application and the like, and the LED light reflector may be configured in combination with other materials as necessary. According to a conventional method, an LED can be configured by combining a semiconductor chip or a sealing material with the obtained LED light reflector.
- the solidified polymer was recovered by filtration.
- the obtained ring-opening polymer was dried at 40 ° C. under reduced pressure for 20 hours.
- the number average molecular weight (Mn) and the weight average molecular weight (Mw) of this polymer are 10,100 and 17,200, respectively, and the molecular weight distribution (Mw / Mn) obtained therefrom is 1.70. It was.
- the hydrogenation rate of the crystalline cyclic olefin ring-opening polymer hydrogenated product A was 99% or more, the ratio of racemo dyad was 79%, and the melting point was 260 ° C.
- the amount of 1-hexene used in the polymerization reaction, the number average molecular weight (Mn), the weight average molecular weight (Mw) and the molecular weight distribution (Mw / Mn) of the obtained ring-opening polymer, and the resulting ring-opening polymer hydrogen The hydrogenation rate and melting point of the additive are summarized in Table 1 below.
- Example 1 Crystalline cyclic olefin ring-opening polymer hydrogenated product A 100 parts, wax (melting point 69 ° C., trade name “LUVAX 1266”, manufactured by Nippon Seiki Co., Ltd.), antioxidant (tetrakis [methylene-3- (3 ′, 5′-di-tert-butyl-4′-hydroxyphenyl) propionate] methane, trade name “Irganox (registered trademark) 1010” (manufactured by BASF Japan) 0.8 part, and nucleating agent (phosphoric acid 2,2 After mixing 0.8 parts of '-methylenebis (4,6-di-tert-butylphenyl) sodium, trade name “ADEKA STAB (registered trademark) NA-11” (manufactured by ADEKA), a small kneader (Micro15 Compounder, DSM Xplore) And kneaded for 2 minutes under the conditions of 290 ° C.
- wax melting point
- Examples 2 to 5 and Comparative Examples 1 to 5 Except having changed the compounding quantity (weight part) of the composition as shown in following Table 2 in Example 1, it obtained the molded object similarly to Example 1, and evaluated it. The evaluation results are shown in Table 2.
- talc used as a nucleating agent is a trade name “MS” (whiteness 93%, average particle diameter (D50) 14 ⁇ m, manufactured by Nippon Talc Co., Ltd.), and glass fiber of inorganic filler is a product.
- CSG 3PA-830 manufactured by Nittobo Co., Ltd.
- the titanium oxide are trade names “FTR-700” (rutile titanium oxide having an average particle size of 0.2 ⁇ m, manufactured by Sakai Chemical Industry Co., Ltd.).
- Adipic acid ester used as the plasticizer was di-2-ethylhexyl adipate (DOA), and phthalic acid ester was di-2-ethylhexyl phthalate (DOP).
- DOA di-2-ethylhexyl adipate
- DOP di-2-ethylhexyl phthalate
- the resin compositions of the present invention have a good moldability, and progress in crystallization even at a low mold temperature, so that a molded product having excellent heat resistance can be obtained. It was. On the other hand, when the amount of wax is small, the progress of crystallization hardly occurs, and the obtained molded article has insufficient long-term heat resistance (Comparative Examples 1 and 2). On the other hand, when the amount of wax is large, crystallization proceeds, but the long-term heat resistance of the molded product is inferior due to the low heat resistance of the wax (Comparative Example 3). In addition, when a plasticizer was used instead of wax, crystallization at low temperature was insufficient, and the resulting molded article was largely deformed after a heat-resistant long-term stability test and had insufficient heat resistance. (Comparative Examples 4 and 5).
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
また、2-ノルボルネンを主成分とする単量体を開環重合し、水素添加して得られた結晶性の環状オレフィン重合体水素化物に核剤を配合した組成物から得られるフィルムは、より低い水蒸気透過性を実現することが知られている(特許文献2)。
また、この樹脂組成物を用いることにより、熱の影響による光反射率の低下が起こり難いLED光反射体を良好な成形性で得られることを見出し、本発明を完成するに至った。
(1)多環式ノルボルネン系単量体由来の繰返し単位を有する結晶性の環状オレフィン開環重合体水素添加物、当該水素添加物100重量部に対して1~4重量部のワックス、及び核剤を含有することを特徴とする樹脂組成物。
(2)前記環状オレフィン開環重合体水素添加物が、シンジオタクチック立体規則性を有する環状オレフィン開環重合体の水素添加物である(1)に記載の樹脂組成物。
(3)前記ワックスが炭化水素系ワックスである(1)に記載の樹脂組成物。
(4)前記核剤が、タルク又は有機リン酸の金属塩である(1)に記載の樹脂組成物。
(5)前記核剤の含有量が、前記環状オレフィン開環重合体水素添加物100重量部に対して、0.001~5重量部である(1)に記載の樹脂組成物。
(7)LED光反射体である(6)に記載の成形体。
本発明の樹脂組成物によれば、光反射率に優れ、高温条件下であってもその優れた光反射率が、低下することなく長期間維持されるLED光反射体を、良好な成形性で得ることができる。
本発明の成形体は、熱の影響による変形が起こり難いものである。
1)樹脂組成物
本発明の樹脂組成物は、多環式ノルボルネン系単量体由来の繰返し単位を有する結晶性の環状オレフィン開環重合体水素添加物(以下、単に「結晶性環状オレフィン開環重合体水素添加物」ということがある。)、当該水素添加物100重量部に対して1~4重量部のワックス、及び核剤を含有することを特徴とする。
本発明に用いる結晶性環状オレフィン開環重合体水素添加物は、多環式ノルボルネン系単量体を少なくとも含有する単量体を開環重合し、得られた開環重合体の主鎖二重結合を水素化することにより得られるものであって、かつ、結晶性を有するものである。
置換基を有していてもよい炭素数1~20の炭化水素基の炭化水素基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、sec-ブチル基、tert-ブチル基、ペンチル基、イソペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基等のアルキル基;シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基等のシクロアルキル基;ビニル基、1-プロペニル基、アリル基、1-ブテニル基、2-ブテニル基、ペンテニル基、ヘキセニル基、シクロヘキセニル基等のアルケニル基;エチニル基、1-プロピニル基、2-プロピニル(プロパルギル)基、3-ブチニル基、ペンチニル基、ヘキシニル基等のアルキニル基;フェニル基、トリル基、キシリル基、ビフェニリル基、1-ナフチル基、2-ナフチル基、アントリル基、フェナントリル基等のアリール基;ベンジル基、フェネチル基等のアラルキル基;等が挙げられる。
なかでも、環状オレフィン開環重合体水素添加物の結晶性を高め、得られる成形体の耐熱性を特に良好なものとする観点からは、多環式ノルボルネン系単量体全体に対して50重量%以上のジシクロペンタジエンを含むものを用いることが好ましく、ジシクロペンタジエンを単独で用いることが特に好ましい。
また、環状ジエンの具体例としては、シクロヘキサジエン、シクロヘプタジエンが挙げられる。
したがって、多環式ノルボルネン系単量体を開環重合するにあたっては、環状オレフィン開環重合体にシンジオタクチック立体規則性を与えることができる開環重合触媒を用いる必要がある。このような開環重合触媒としては、環状オレフィン開環重合体にシンジオタクチック立体規則性を与えることができるものであれば特に限定されないが、下記式(3)で表される金属化合物(以下、「金属化合物(3)」ということがある。)を含んでなる開環重合触媒が好適である。
3,4,5位の少なくとも1つの位置に置換基を有していてもよいフェニル基が有しうる置換基としては、メチル基、エチル基等のアルキル基;フッ素原子、塩素原子、臭素原子等のハロゲン原子;メトキシ基、エトキシ基、イソプロポキシ基等のアルコキシ基;等が挙げられ、さらに、3,4,5位の少なくとも2つの位置に存在する置換基が互いに結合したものであってもよい。
有機溶媒の具体例としては、ペンタン、ヘキサン、ヘプタン等の脂肪族炭化水素;シクロペンタン、シクロヘキサン、メチルシクロヘキサン、ジメチルシクロヘキサン、トリメチルシクロヘキサン、エチルシクロヘキサン、ジエチルシクロヘキサン、デカヒドロナフタレン、ビシクロヘプタン、トリシクロデカン、ヘキサヒドロインデン、シクロオクタン等の脂環族炭化水素;ベンゼン、トルエン、キシレン等の芳香族炭化水素;ジクロロメタン、クロロホルム、1,2-ジクロロエタン等のハロゲン系脂肪族炭化水素;クロロベンゼン、ジクロロベンゼン等のハロゲン系芳香族炭化水素;ニトロメタン、ニトロベンゼン、アセトニトリル等の含窒素炭化水素系溶媒;ジエチルエ-テル、テトラヒドロフラン等のエ-テル類;又はこれらの混合溶媒が挙げられる。これらの溶媒の中でも、芳香族炭化水素、脂肪族炭化水素、脂環族炭化水素、エーテル類が好ましく用いられる。
各成分を混合するにあたっては、それぞれの成分の全量を一度に添加してもよいし、複数回に分けて添加してもよく、比較的に長い時間(例えば1分間以上)にわたって連続的に添加することもできる。なかでも、重合温度や得られる開環重合体の分子量を制御して、特に成形性に優れた樹脂組成物を得る観点からは、単量体又は金属化合物(3)を、複数回に分けて、又は連続的に、添加することが好ましく、単量体を、複数回に分けて、又は連続的に、添加することが特に好ましい。
添加する分子量調整剤の量は目的とする分子量に応じて決定すればよいが、通常、用いる単量体に対して、0.1~50モル%の範囲で選択すればよい。
環状オレフィン開環重合体水素添加物の分子量分布は、開環重合反応時における単量体の添加方法や単量体の濃度により、調節することができる。
また、以上のようにして得られる結晶性環状オレフィン開環重合体水素添加物では、水素化反応に供した開環重合体が有するシンジオタクチック立体規則性が維持される。したがって、得られる環状オレフィン開環重合体水素添加物は、シンジオタクチック立体規則性を有する。本発明に用いる結晶性環状オレフィン開環重合体水素添加物におけるラセモ・ダイアッドの割合は、その水素添加物が結晶性を有する限りにおいて特に限定されないが、通常55%以上、好ましくは60%以上、より好ましくは65~99%である。
このようなシンジオタクチック立体規則性を有する結晶性環状オレフィン開環重合体水素添加物を用いることにより、得られる樹脂組成物が、熱の影響により変形が特に起こり難い成形体を与えることができるものとなる。なお、結晶性環状オレフィン開環重合体水素添加物のラセモ・ダイアッドの割合は、水素化反応に供する環状オレフィン開環重合体のラセモ・ダイアッドの割合に依存する。
本発明の樹脂組成物に配合するワックスは、天然ワックスでも合成ワックスであってもよい。例えば、高級脂肪酸と一価又は二価の高級アルコールとのエステル等の融点の高い油脂状の物質、これとよく似た性質を示す中性脂肪や高級脂肪酸、炭化水素等が挙げられる。
ワックスは、通常、室温では軟らかく滑らかな固体で、融点は通常25~120℃であり、気体はよく燃焼する。具体的には、動物、植物、及び鉱物から得られるロウ、原油の蒸留過程で取り出される炭化水素を主成分とする、常温で固体の炭化水素である石油系ワックス(パラフィンワックス、マイクロクリスタリンワックス、又はペトロラタム)、フィッシャートロプシュ法により合成される炭化水素系ワックス(フィッシャートロプシュワックス)、ポリアルキレンワックスが挙げられる。
これらの中でも、得られる成形品の透明性の高さから、石油系ワックスやフィッシャートロプシュワックスやポリアルキレンワックスのような、CnH2n+2で表される炭化水素系ワックスが好ましく、フィッシャートロプシュワックスがより好ましい。炭化水素系ワックスは、直鎖又は分岐の飽和炭化水素を95重量%以上含有するものである。
本発明の樹脂組成物に配合する核剤としては、従来公知のものが使用できる。例えば、ソルビトール系化合物、有機リン酸の金属塩、有機カルボン酸の金属塩、ヒンダードアミン系化合物、ヒンダードフェノール系化合物、カオリン及びタルク等が挙げられる。
有機リン酸の金属塩としては、リン酸2,2’-メチレンビス(4,6-ジ-tert-ブチルフェニル)ナトリウム、ビス(2,4,8,10-テトラ-tert-ブチル-6-ヒドロキシ-12H-ジベンゾ[d,g][1,2,3]ジオキサホスホシン-6-オキシド)水酸化アルミニウム塩等が挙げられる。
有機カルボン酸の金属塩としては、安息香酸ナトリウム、シュウ酸カルシウム、ステアリン酸マグネシウム、カリウムベンゾエート等が挙げられる。
ヒンダードアミン系化合物としては、ビス(1,2,2,6,6-ペンタメチル-4-ピペリジル)〔[3,5-ビス(1,1-ジメチルエチル)-4-ヒドロキシフェニル]メチル〕ブチルマロネート等が挙げられる。
ヒンダードフェノール系化合物としては、トリエチレングリコール-ビス[3-(3-t-ブチル-5-メチル-4-ヒドロキシフェニル)プロピオネート〕、1,3,5-トリス[(4-t-ブチル-3-ヒドロキシ-2,6-キシリル)メチル]-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、1,3,5-トリメチル-2,4,6-トリス(3’,5’-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン等が挙げられる。
有機リン酸の金属塩としては、リン酸2,2’-メチレンビス(4,6-ジ-tert-ブチルフェニル)ナトリウムが特に好ましい。
白色度はタルクの組成によって影響され、上記範囲であると、溶融成形によっても着色せずに、耐熱性に優れた成形体を得ることができる。なお、白色度はJIS P 8123に従って測定される。
核剤としてタルクを用いる場合、タルクを結晶性環状オレフィン開環重合体水素添加物に配合する以外に、環状オレフィン開環重合体を均一系触媒で水素化させる際に、タルクを配合することができる。
本発明の樹脂組成物は、結晶性環状オレフィン開環重合体水素添加物、ワックス及び核剤のみで構成してもよいし、さらに他の成分を配合して構成することもできる。
他の成分としては、白色顔料、ガラス繊維、酸化防止剤、充填剤、着色剤、難燃剤、難燃助剤、帯電防止剤、可塑剤、紫外線吸収剤、光安定剤、近赤外線吸収剤、滑剤、及び、結晶性環状オレフィン開環重合体水素添加物以外の高分子材料等を例示することができる。
白色顔料としては、特に制約されないが、例えば、シリカ、アルミナ、酸化チタン、酸化マグネシウム、炭酸マグネシウム、塩基性炭酸マグネシウム、酸化カルシウム、炭酸カルシウム、硫酸カルシウム、沈降性炭酸カルシウム、亜硫酸カルシウム、チタン酸カリウム、チタン酸鉛、硫酸バリウム、炭酸バリウム、硫酸バリウム、鉛白、亜鉛華、塩基性硫酸鉛、リトポン、硫化亜鉛、酸化ジルコニウム、バライト、白亜、石コウ、クレー、滑石粉、珪藻土等が挙げられる。
これらは、1種単独で、或いは2種以上を組み合わせて用いることができる。
白色顔料の形状は、板状、粒状、球状、繊維状、或いは不定形状等、いかなるものであってもよい。
これらの中でも、白色顔料として酸化チタンを用いるのが好ましい。
なお、酸化チタンの粒径とは、球状の場合は直径を指し、その他の場合は最長の両端間距離を指す。また、平均粒径は、電子顕微鏡(透過型(TEM)又は走査型(SEM))でいくつかの単一粒子径を測定し、平均した値である。
ガラス繊維及び酸化チタンを用いる場合の両者の合計配合量は、通常21~200重量部、好ましくは45~190重量部、より好ましくは50~180重量部の範囲で選択される。
本発明の成形体は、本発明の樹脂組成物を溶融成形してなることを特徴とする。
溶融成形する方法としては、射出成形、押出成形、プレス成形、ブロー成形、カレンダー成形等の方法が挙げられる。溶融成形法は目的とする形状等に応じて選択すればよいが、本発明の樹脂組成物は優れた成形性(溶融成形性)を有することから、量産性に優れる射出成形法を適用することが好ましい。
成形体としては、例えば、コネクター、リレー、コンデンサ、センサー、アンテナ、ICトレイ、シャーシ、コイル封止、モーターケース、電源ボックス等の電子部品;LED光反射体;車両用灯具のリフレクタ;自動車用モーターケース、センサケース、モジュール部品ケース等の自動車部品;光学レンズ鏡筒;フレキシブルプリント基板;プリント配線板積層用離型フィルム;太陽電池用基板;電子レンジ、炊飯器、電動ジャーポット、乾燥洗濯機、食器洗い機、エアコン等の家電部品;包装用、梱包用フィルム;食品用シート、トレイ;LEDモールド材;ポンプケーシング、インペラ、配管継ぎ手、浴室パネル等の住設部品等が挙げられる。
LED光反射体としては、例えば、大型液晶表示装置のバックライトの光源、照明器具、携帯電話等の小型電子機器の液晶ディスプレイのバックライトの光源、道路交通表示板等の電光表示板の光源として用いられるLEDの光反射体等が挙げられる。
LED光反射体の形状は、その用途等に応じて適宜決定すればよく、必要に応じて、他の材料と組み合わせてLED光反射体を構成することもできる。
得られるLED光反射体に、常法にしたがい、半導体チップや封止材を組み合わせることによりLEDを構成することができる。
(1)環状オレフィン開環重合体の分子量(重量平均分子量及び数平均分子量)
ゲル・パーミエーション・クロマトグラフィー(GPC)システム HLC-8220(東ソー社製)で、Hタイプカラム(東ソー社製)を用い、テトラヒドロフランを溶媒として40℃で測定し、ポリスチレン換算値として求めた。
(2)環状オレフィン開環重合体水素添加物における水素化率
1H-NMR測定により求めた。
(3)環状オレフィン開環重合体水素添加物の融点
示差走査熱量計を用いて、昇温温度:10℃/分で測定した。
オルトジクロロベンゼン-d4を溶媒として、150℃で13C-NMR測定を行い、メソ・ダイアッド由来の43.35ppmのシグナルと、ラセモ・ダイアッド由来の43.43ppmのシグナルの強度比に基づいて決定した。
示差走査熱量計を用いて、成形体10mgをJIS K 7122に準じて、加熱速度を10℃/分で昇温した時のサーモグラムから、結晶融解熱量ΔHm(J/g)と結晶化熱量ΔHc(J/g)を求め、算出した。
該数値の最大値は1.0であり、数値が大きいほど結晶化が進行していることを意味しており、0.9より小さいものでは、充分に結晶化が進行しておらず、寸法安定性が低下したり、はんだ耐熱性が不充分となり好ましくない。
ここで該数値が、0.9以上のものを○、0.6以上0.9未満のものを△、0.6より小さいものを×と評価した。
初期反射率を測定した平板について、オーブンを用いた200℃×10時間の熱処理を行った後、成形体の寸法変形を確認した。
変形のなかったものを○、0.2mm以上の反りが見られたものを△、0.5mm以上の反りが見られたものを×と評価した。
充分に乾燥した後、窒素置換したガラス製耐圧反応容器に、ジシクロペンタジエン(エンド体含有率99%以上)の75%シクロヘキサン溶液40部(ジシクロペンタジエンの量として30部)を仕込み、さらに、シクロヘキサン738部及び1-ヘキセン3.3部を加え、50℃に加温した。一方、テトラクロロタングステンフェニルイミド(テトラヒドロフラン)錯体1.1部を56部のトルエンに溶解した溶液に、19重量%のジエチルアルミニウムエトキシド/n-ヘキサン溶液4.6部を加えて10分間攪拌し、触媒溶液を調製した。この触媒溶液を反応器に加えて開環重合反応を開始させた。その後、50℃を保ちながら、5分毎に75%ジシクロペンタジエン/シクロヘキサン溶液40部を9回添加した後、2時間反応を継続した。ついで、少量のイソプロパノールを加えて、重合反応を停止させた後、重合反応溶液を多量のイソプロパノール中に注ぎ、開環重合体を凝固させた。
合成例1において、1-ヘキセンの量を下記表1に示す通りに変更したこと以外は、合成例1と同様にして、結晶性環状オレフィン開環重合体水素添加物B、Cを得た。得られた開環重合体の数平均分子量(Mn)、重量平均分子量(Mw)及び分子量分布(Mw/Mn)、並びに得られた開環重合体水素添加物の水素化率、ラセモ・ダイアッドの割合及び融点を、下記表1にまとめて示す。
結晶性環状オレフィン開環重合体水素添加物A 100部、ワックス(融点69℃、商品名「LUVAX1266」、日本精鑞社製)2部、酸化防止剤(テトラキス〔メチレン-3-(3’,5’-ジ-tert-ブチル-4’-ヒドロキシフェニル)プロピオネート〕メタン、商品名「イルガノックス(登録商標)1010」、BASFジャパン社製)0.8部、及び核剤(リン酸2,2’-メチレンビス(4,6-ジ-tert-ブチルフェニル)ナトリウム、商品名「アデカスタブ(登録商標)NA-11」、ADEKA社製)0.8部を混合後、小型混練機(Micro15Compounder、DSM Xplore製)を用い、290℃、100rpmの条件で2分間混練し、得られた混練物をペレット化した。その後、小型射出成形機(Micro Injection Moulding Machine 10cc、DSM Xplore社製)で成形温度290℃、射出圧力0.7MPa、金型内保持時間10秒で、それぞれ金型温度を100℃、120℃、150℃の条件で、縦70mm、横30mm、厚さ3mmの平板を成形した。それぞれの成形板の破片を示差走査熱量計を用いて(ΔHm-ΔHc)/ΔHmを求め、金型100℃で成形したものについて、耐熱長期安定性試験を行ない変形ないことを確認した。組成物の組成とそれぞれの評価結果を、下記表2にまとめて示す。
実施例1において、組成物の配合量(重量部)を下記表2に示す通りに変更したこと以外は、実施例1と同様にして、成形体を得て、その評価を行った。それぞれの評価結果は、表2にまとめて示した。なお、表2において、核剤として用いているタルクは、商品名「MS」(白色度93%、平均粒子径(D50)14μm、日本タルク社製)であり、無機充填剤のガラス繊維は商品名「CSG 3PA-830」(日東紡社製)、酸化チタンは商品名「FTR-700」(平均粒径0.2μmのルチル型酸化チタン、堺化学工業社製)である。可塑剤として用いるアジピン酸エステルは、アジピン酸ジ2-エチルヘキシル(DOA)、フタル酸エステルは、フタル酸ジ2-エチルヘキシル(DOP)を用いた。
Claims (7)
- 多環式ノルボルネン系単量体由来の繰返し単位を有する結晶性の環状オレフィン開環重合体水素添加物、当該水素添加物100重量部に対して1~4重量部のワックス、及び核剤を含有することを特徴とする樹脂組成物。
- 前記環状オレフィン開環重合体水素添加物が、シンジオタクチック立体規則性を有する環状オレフィン開環重合体の水素添加物である請求項1に記載の樹脂組成物。
- 前記ワックスが、炭化水素系ワックスである請求項1に記載の樹脂組成物。
- 前記核剤が、タルク又は有機リン酸の金属塩である請求項1に記載の樹脂組成物。
- 前記核剤の含有量が、前記環状オレフィン開環重合体水素添加物100重量部に対して、0.001~5重量部である請求項1に記載の樹脂組成物。
- 請求項1~5のいずれかに記載の樹脂組成物を、溶融成形して得られる成形体。
- LED光反射体である請求項6に記載の成形体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011554311A JP4973815B2 (ja) | 2010-09-07 | 2011-09-06 | 樹脂組成物及びその成形体 |
KR1020137005760A KR20130101008A (ko) | 2010-09-07 | 2011-09-06 | 수지 조성물 및 그 성형체 |
CN201180053111.3A CN103237843B (zh) | 2010-09-07 | 2011-09-06 | 树脂组合物及其成形体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-200353 | 2010-09-07 | ||
JP2010200353 | 2010-09-07 | ||
JP2010-275702 | 2010-12-10 | ||
JP2010275702 | 2010-12-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012033076A1 true WO2012033076A1 (ja) | 2012-03-15 |
Family
ID=45810674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/070221 WO2012033076A1 (ja) | 2010-09-07 | 2011-09-06 | 樹脂組成物及びその成形体 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4973815B2 (ja) |
KR (1) | KR20130101008A (ja) |
CN (1) | CN103237843B (ja) |
WO (1) | WO2012033076A1 (ja) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013235872A (ja) * | 2012-05-02 | 2013-11-21 | Dainippon Printing Co Ltd | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
JP2013256596A (ja) * | 2012-06-13 | 2013-12-26 | Nippon Zeon Co Ltd | 樹脂組成物及びその成形品 |
JP2014065756A (ja) * | 2012-09-24 | 2014-04-17 | Nippon Zeon Co Ltd | 樹脂組成物及びその成形体 |
JP2015054885A (ja) * | 2013-09-11 | 2015-03-23 | 日本ゼオン株式会社 | 結晶性樹脂組成物 |
JP2015163682A (ja) * | 2014-01-30 | 2015-09-10 | 日本ゼオン株式会社 | 重合体組成物及び成形体 |
JP2015178580A (ja) * | 2014-03-20 | 2015-10-08 | 日本ゼオン株式会社 | 樹脂組成物及びその利用 |
KR20150117265A (ko) * | 2013-02-12 | 2015-10-19 | 니폰 제온 가부시키가이샤 | 수지 조성물 및 그의 성형체 |
JP2016105518A (ja) * | 2016-03-03 | 2016-06-09 | 大日本印刷株式会社 | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
WO2018030105A1 (ja) * | 2016-08-08 | 2018-02-15 | 日本ゼオン株式会社 | 樹脂組成物及び樹脂成形体 |
WO2018174029A1 (ja) | 2017-03-21 | 2018-09-27 | 日本ゼオン株式会社 | 成形材料、樹脂成形体、化粧料容器、半導体容器、及び半導体容器の製造方法 |
US10233301B2 (en) | 2014-01-30 | 2019-03-19 | Zeon Corporation | Polymer composition and molded body |
WO2019167683A1 (ja) | 2018-02-28 | 2019-09-06 | 日本ゼオン株式会社 | 不織布およびフィルター |
WO2020017219A1 (ja) | 2018-07-19 | 2020-01-23 | 日本ゼオン株式会社 | 成形材料および成形体 |
US10767019B2 (en) | 2015-09-28 | 2020-09-08 | Zeon Corporation | Resin composition, microporous membrane, separator and secondary battery |
US10896827B2 (en) | 2016-06-28 | 2021-01-19 | Zeon Corporation | Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages |
US11046046B2 (en) | 2015-09-28 | 2021-06-29 | Zeon Corporation | Laminate, method for producing same, and flexible printed circuit board |
WO2021172192A1 (ja) | 2020-02-27 | 2021-09-02 | Mcppイノベーション合同会社 | 樹脂シート及びこれを用いた回路基板材料 |
WO2023008524A1 (ja) | 2021-07-28 | 2023-02-02 | 三菱ケミカル株式会社 | 樹脂組成物、樹脂シート、積層体、シート硬化物及び回路基板材料 |
WO2023053927A1 (ja) | 2021-09-30 | 2023-04-06 | 日本ゼオン株式会社 | 難燃性熱可塑性樹脂組成物、成形体および延伸フィルム |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102569041B1 (ko) * | 2015-05-27 | 2023-08-21 | 미츠비시 가스 가가쿠 가부시키가이샤 | 폴리에스터 수지 및 그의 제조 방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04170456A (ja) * | 1990-11-01 | 1992-06-18 | Mitsui Petrochem Ind Ltd | 環状オレフィン系樹脂組成物 |
JP2006052333A (ja) * | 2004-08-12 | 2006-02-23 | Nippon Zeon Co Ltd | ノルボルネン系開環重合体水素化物の製造方法およびノルボルネン系開環重合体水素化物 |
JP2008013604A (ja) * | 2006-07-03 | 2008-01-24 | Nippon Zeon Co Ltd | テトラシクロドデセン含有開環重合体水素化物、光学樹脂材料および光学成形体 |
JP2009084332A (ja) * | 2007-09-28 | 2009-04-23 | Nippon Zeon Co Ltd | フィルム |
JP2009138111A (ja) * | 2007-12-07 | 2009-06-25 | Nippon Zeon Co Ltd | 光学用射出成形体 |
JP2009197201A (ja) * | 2008-02-25 | 2009-09-03 | Nippon Zeon Co Ltd | プラスチック成形品 |
-
2011
- 2011-09-06 CN CN201180053111.3A patent/CN103237843B/zh not_active Expired - Fee Related
- 2011-09-06 WO PCT/JP2011/070221 patent/WO2012033076A1/ja active Application Filing
- 2011-09-06 KR KR1020137005760A patent/KR20130101008A/ko not_active Application Discontinuation
- 2011-09-06 JP JP2011554311A patent/JP4973815B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04170456A (ja) * | 1990-11-01 | 1992-06-18 | Mitsui Petrochem Ind Ltd | 環状オレフィン系樹脂組成物 |
JP2006052333A (ja) * | 2004-08-12 | 2006-02-23 | Nippon Zeon Co Ltd | ノルボルネン系開環重合体水素化物の製造方法およびノルボルネン系開環重合体水素化物 |
JP2008013604A (ja) * | 2006-07-03 | 2008-01-24 | Nippon Zeon Co Ltd | テトラシクロドデセン含有開環重合体水素化物、光学樹脂材料および光学成形体 |
JP2009084332A (ja) * | 2007-09-28 | 2009-04-23 | Nippon Zeon Co Ltd | フィルム |
JP2009138111A (ja) * | 2007-12-07 | 2009-06-25 | Nippon Zeon Co Ltd | 光学用射出成形体 |
JP2009197201A (ja) * | 2008-02-25 | 2009-09-03 | Nippon Zeon Co Ltd | プラスチック成形品 |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013235872A (ja) * | 2012-05-02 | 2013-11-21 | Dainippon Printing Co Ltd | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
JP2013256596A (ja) * | 2012-06-13 | 2013-12-26 | Nippon Zeon Co Ltd | 樹脂組成物及びその成形品 |
JP2014065756A (ja) * | 2012-09-24 | 2014-04-17 | Nippon Zeon Co Ltd | 樹脂組成物及びその成形体 |
KR102110151B1 (ko) * | 2013-02-12 | 2020-05-13 | 니폰 제온 가부시키가이샤 | 수지 조성물 및 그의 성형체 |
KR20150117265A (ko) * | 2013-02-12 | 2015-10-19 | 니폰 제온 가부시키가이샤 | 수지 조성물 및 그의 성형체 |
EP2957596A4 (en) * | 2013-02-12 | 2016-08-31 | Zeon Corp | RESIN COMPOSITION AND SHAPED PRODUCT THEREOF |
US9631083B2 (en) | 2013-02-12 | 2017-04-25 | Zeon Corporation | Resin composition and molded product thereof |
JP2015054885A (ja) * | 2013-09-11 | 2015-03-23 | 日本ゼオン株式会社 | 結晶性樹脂組成物 |
US10233301B2 (en) | 2014-01-30 | 2019-03-19 | Zeon Corporation | Polymer composition and molded body |
JP2015163682A (ja) * | 2014-01-30 | 2015-09-10 | 日本ゼオン株式会社 | 重合体組成物及び成形体 |
WO2016103778A1 (ja) * | 2014-01-30 | 2016-06-30 | 日本ゼオン株式会社 | 重合体組成物及び成形体 |
JP2015178580A (ja) * | 2014-03-20 | 2015-10-08 | 日本ゼオン株式会社 | 樹脂組成物及びその利用 |
US10767019B2 (en) | 2015-09-28 | 2020-09-08 | Zeon Corporation | Resin composition, microporous membrane, separator and secondary battery |
US11046046B2 (en) | 2015-09-28 | 2021-06-29 | Zeon Corporation | Laminate, method for producing same, and flexible printed circuit board |
JP2016105518A (ja) * | 2016-03-03 | 2016-06-09 | 大日本印刷株式会社 | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
US10896827B2 (en) | 2016-06-28 | 2021-01-19 | Zeon Corporation | Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages |
EP3498775A4 (en) * | 2016-08-08 | 2020-03-18 | Zeon Corporation | RESIN COMPOSITION, AND RESIN MOLDED BODY |
WO2018030105A1 (ja) * | 2016-08-08 | 2018-02-15 | 日本ゼオン株式会社 | 樹脂組成物及び樹脂成形体 |
US10844162B2 (en) | 2016-08-08 | 2020-11-24 | Zeon Corporation | Resin composition and molded resin object |
JPWO2018030105A1 (ja) * | 2016-08-08 | 2019-06-06 | 日本ゼオン株式会社 | 樹脂組成物及び樹脂成形体 |
WO2018174029A1 (ja) | 2017-03-21 | 2018-09-27 | 日本ゼオン株式会社 | 成形材料、樹脂成形体、化粧料容器、半導体容器、及び半導体容器の製造方法 |
US11325287B2 (en) | 2017-03-21 | 2022-05-10 | Zeon Corporation | Shaping material, resin shaped product, cosmetic container, semiconductor container, and method of producing semiconductor container |
WO2019167683A1 (ja) | 2018-02-28 | 2019-09-06 | 日本ゼオン株式会社 | 不織布およびフィルター |
WO2020017219A1 (ja) | 2018-07-19 | 2020-01-23 | 日本ゼオン株式会社 | 成形材料および成形体 |
WO2021172192A1 (ja) | 2020-02-27 | 2021-09-02 | Mcppイノベーション合同会社 | 樹脂シート及びこれを用いた回路基板材料 |
WO2023008524A1 (ja) | 2021-07-28 | 2023-02-02 | 三菱ケミカル株式会社 | 樹脂組成物、樹脂シート、積層体、シート硬化物及び回路基板材料 |
WO2023053927A1 (ja) | 2021-09-30 | 2023-04-06 | 日本ゼオン株式会社 | 難燃性熱可塑性樹脂組成物、成形体および延伸フィルム |
Also Published As
Publication number | Publication date |
---|---|
CN103237843A (zh) | 2013-08-07 |
JP4973815B2 (ja) | 2012-07-11 |
CN103237843B (zh) | 2015-08-05 |
JPWO2012033076A1 (ja) | 2014-01-20 |
KR20130101008A (ko) | 2013-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4973815B2 (ja) | 樹脂組成物及びその成形体 | |
JP6123596B2 (ja) | 結晶性樹脂組成物 | |
JP6428614B2 (ja) | 延伸フィルムの製造方法 | |
US10233301B2 (en) | Polymer composition and molded body | |
JP5862268B2 (ja) | 重合体、成形体及び重合体の製造方法 | |
US9631083B2 (en) | Resin composition and molded product thereof | |
JP6159054B2 (ja) | 重合体、複合体および重合体の製造方法 | |
JP2017149898A (ja) | 難燃性樹脂組成物及び樹脂成形体 | |
JP6724899B2 (ja) | 難燃性樹脂組成物及び樹脂成形体 | |
JP5949196B2 (ja) | 樹脂組成物及びその成形品 | |
JP5949388B2 (ja) | 樹脂組成物及びその成形体 | |
US10086588B2 (en) | Resin material and resin film | |
WO2017061440A1 (ja) | ポリエステル樹脂組成物、反射板の製造方法および発光ダイオード(led)素子の製造方法 | |
JP6402620B2 (ja) | 重合体組成物及び成形体 | |
JP2013056991A (ja) | 樹脂組成物、及びそれからなる成形体 | |
JP6287413B2 (ja) | 樹脂組成物及びその利用 | |
JP5742479B2 (ja) | 重合体、複合体および重合体の製造方法 | |
JP2012063428A (ja) | 光反射板用重合性組成物、及び光反射板 | |
JP2012131957A (ja) | 重合性組成物、及び成形体 | |
JP2017124520A (ja) | 成形材料の溶融方法、及び樹脂成形体の製造方法 | |
JP2010013659A (ja) | 樹脂組成物および樹脂成形品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2011554311 Country of ref document: JP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11823551 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20137005760 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11823551 Country of ref document: EP Kind code of ref document: A1 |