WO2012006834A1 - Module de rétroéclairage et structure d'encapsulation d'une source de lumière - Google Patents

Module de rétroéclairage et structure d'encapsulation d'une source de lumière Download PDF

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Publication number
WO2012006834A1
WO2012006834A1 PCT/CN2010/078145 CN2010078145W WO2012006834A1 WO 2012006834 A1 WO2012006834 A1 WO 2012006834A1 CN 2010078145 W CN2010078145 W CN 2010078145W WO 2012006834 A1 WO2012006834 A1 WO 2012006834A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
heat sink
backlight module
heat dissipating
post
Prior art date
Application number
PCT/CN2010/078145
Other languages
English (en)
Chinese (zh)
Inventor
周革革
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US12/996,290 priority Critical patent/US8288782B2/en
Publication of WO2012006834A1 publication Critical patent/WO2012006834A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a backlight module and a light source packaging structure thereof, and more particularly to a light source that utilizes a heat dissipating fixing member to firmly bond an illumination source package structure to a fixing plate and dissipates heat by using heat dissipation fins.
  • a package structure and a backlight module having the light source package structure.
  • a liquid crystal display is a flat panel display (FPD) that uses the characteristics of a liquid crystal material to display an image, which is lighter, lower, and lower in driving voltage than other display devices. And low power consumption, etc., has become the mainstream product in the entire consumer market.
  • the liquid crystal material of the liquid crystal display cannot emit light by itself, and the light source must be externally provided. Therefore, a backlight module is additionally provided in the liquid crystal display to provide a desired light source.
  • the backlight module can be divided into two types: a side backlight module and a bottom backlight module.
  • the backlight module mainly uses a cold cathode fluorescent tube (CCFL), a hot cathode fluorescent tube (HCFL) and a semiconductor light emitting component as a light source
  • the semiconductor light emitting component mainly uses a light emitting diode (LED) to emit light, which is compared with the cathode.
  • the fluorescent tube is more energy-saving, longer in service life, and lighter in volume, so there is a tendency to gradually replace the cathode fluorescent tube.
  • the light-emitting diode will be the main light source of the backlight module of the liquid crystal display in the future.
  • the light-emitting diodes are mostly packaged in the form of chips for use as a light-emitting diode package structure, and finally joined to the fixing plate of the backlight module.
  • the LED package structure has the disadvantage that the temperature during its operation is extremely high. If the fixing plate of the backlight module cannot take away the heat energy generated by the LED package structure in time, the temperature near the LED package structure will rise significantly. High, causing uneven temperature of each display block of the liquid crystal display, and it is also possible that the display block of the liquid crystal display panel near the light emitting diode package structure is reddish due to excessive temperature, so Will affect the imaging quality of the liquid crystal display.
  • the LED itself is very susceptible to its luminous efficiency and operational stability due to the temperature rise of the working process, so it may also be degraded due to its long-term high temperature.
  • the LED package structure is simply adhered to the fixing plate by an adhesive or only by a screw lock on the fixing plate, since the LED package structure and the fixing plate are not directly in thermal contact, or two There is an insulating adhesive between the two or the surface between the two is not closely attached, so it will affect the heat dissipation efficiency to some extent.
  • the adhesive may deteriorate and lose the viscosity, causing the LED package structure to be separated from the fixed plate. If the thermal energy of the LED package structure cannot be taken away by the fixed plate in real time, the LED package structure will be There is a potential risk of overheating and burning.
  • the main purpose of the present invention is to provide a backlight module and a light source packaging structure thereof, including a heat sink, a chip and a heat dissipating fixing member, wherein the heat sink further has a coupling hole, and the heat dissipating fixing member further comprises a binding post and an abutting surface.
  • the heat dissipating fins can firmly bond the heat dissipating fixing member and the heat dissipating seat to the two sides of the fixing plate of the backlight module through the bonding column and the bonding hole, and the abutting surface can ensure the close bonding relationship with the fixing plate and improve the assembly reliability.
  • the heat-dissipating fixing member can additionally increase the heat-dissipating effect by the heat-dissipating fins of the heat-dissipating fixing member, so that the chip can be surely reduced in temperature and the working efficiency of the chip is reduced, so that the chip can be stably operated and extended. life.
  • a secondary object of the present invention is to provide a backlight module and a light source package structure thereof, wherein the first surface of the heat sink of the light source package structure has a coupling hole, and the heat sink fixing member has a thread or a spring, and the heat sink has a heat sink.
  • the binding post is fixed in the coupling hole of the heat sink by means of a thread or a spring, which is advantageous for increasing the assembly strength of the bonding post and the bonding hole.
  • Another object of the present invention is to provide a backlight module and a light source packaging structure thereof, wherein
  • the bonding holes of the heat-dissipating fixing member of the light source package structure and the heat-dissipating joint have a recess or a protrusion respectively, and the corresponding fitting of the recess and the bump facilitates the assembly strength of the joint column and the joint hole.
  • the present invention provides a backlight module, the backlight module comprising: at least one light source packaging structure, each comprising: a heat sink having a coupling hole; and a heat sink fixing member having a combination a post and a heat dissipating fin having an abutting surface; and a fixing plate having at least one through hole; wherein the bonding post of the heat dissipating fixing member passes through the through hole of the fixing plate and the bonding hole The abutting surface of the heat dissipating fin abuts on the fixing plate, so that the heat dissipating seat and the heat dissipating fixing member are firmly coupled on both sides of the fixing plate.
  • the present invention provides another illumination source package structure, the illumination source package structure comprising: a carrier plate having a through hole; a heat dissipation seat embedded in the insertion hole of the carrier plate
  • the heat sink has a first surface, a second surface and a bonding hole, wherein the bonding hole is opened on the first surface; at least one chip is disposed on the second surface of the heat sink, and Electrically connected to the carrier plate; and a heat dissipating fixing member, a bonding post and a heat dissipating fin having an abutting surface, wherein the bonding post is combined with the bonding hole, the abutting surface and the There is an assembly pitch between the heat sinks.
  • the at least one light source package structure further includes: a carrier plate having a through hole, wherein the heat sink is disposed in the through hole of the carrier; and A chip is electrically connected to the carrier.
  • the binding post of the heat dissipating fixture further has a thread or a spring to engage the coupling post in the coupling hole of the heat sink.
  • the binding post of the heat dissipating fixing member further has at least one protrusion
  • the coupling hole further has a corresponding at least one recess, wherein the at least one bump and the phase Corresponding at least one recess is fitted to each other such that the binding post is incorporated in the coupling hole of the heat sink.
  • the bonding hole of the heat sink further has at least one bump.
  • the binding post further has a corresponding at least one recess, wherein the at least one bump and the corresponding at least one recess are fitted to each other, so that the binding post is coupled to the heat sink Said in the combination of pores.
  • the bump is a bump, a convex ring or a convex arc segment, and the corresponding recess is a concave point, a concave ring groove or a concave arc groove.
  • the fixing plate is a back plate or a light source base.
  • the chip is a light emitting diode chip.
  • the second surface of the heat sink further includes a recess, and the chip is disposed on the recess.
  • the carrier board is a circuit substrate or a lead frame, and the chip is electrically connected to the carrier board through a plurality of leads or a plurality of bumps.
  • the backlight module of the present invention and the illumination source package structure thereof are configured to stably fix the illumination source package structure on the fixing plate by using a coupling hole of the heat dissipation fixing member and a coupling hole of the heat dissipation seat. It not only simplifies the assembly of the light source packaging structure and improves the assembly reliability, but also the heat sink can transfer heat energy to the heat dissipation fins of the heat dissipation fixture by means of heat conduction, and the heat dissipation fins help the chip to dissipate heat, so as to avoid the work efficiency of the chip being overheated. Helps to stabilize the chip and delay
  • FIG. 1 is a light source packaging structure of a backlight module according to a first preferred embodiment of the present invention:
  • Fig. 2 is a schematic view showing a package structure of a light source according to a second preferred embodiment of the present invention.
  • Fig. 3 is a schematic view showing a package structure of a light-emitting source according to a third preferred embodiment of the present invention.
  • Fig. 4 is a schematic view showing a package structure of a light-emitting source according to a fourth preferred embodiment of the present invention.
  • Fig. 5 is a schematic view showing a package structure of a light-emitting source according to a fifth preferred embodiment of the present invention.
  • Fig. 6 is a schematic view showing a package structure of a light-emitting source according to a sixth preferred embodiment of the present invention. detailed description
  • the backlight module 10 of the first preferred embodiment of the present invention is mainly applied to the field of liquid crystal displays (LCDs).
  • the backlight module 10 mainly includes at least one light source package structure 100 and a fixing plate 200.
  • the light source package structure 100 further includes a carrier 110, a heat sink 120, a chip 130, and a heat sink. 140.
  • At least two leads 150 and an encapsulant 160 will be described in detail below with reference to the present invention.
  • the backlight module 10 of the first preferred embodiment of the present invention generally mounts the at least one light source package structure 100 on the fixed plate 200 of a specific shape, wherein the light source package structure 100
  • the carrier 110 may be a circuit substrate (PCB) or a lead frame, and the carrier 110 has a through hole 111.
  • the heat sink 120 is made of a material having good thermal conductivity, such as various metals or alloys, particularly aluminum or aluminum alloy.
  • the heat sink 120 is embedded in the through hole 111 of the carrier 110. If the carrier 110 is selected from the lead frame, the embedded hole 111 and the heat sink 120 may be further disposed. Fill the insulation.
  • the heat sink 120 further has a first surface 121, a second surface 122 and a coupling hole 123, wherein the coupling hole 123 is opened on the first surface 121, and the at least one chip 130 is disposed on the second surface 122 for emitting a light beam according to a driving signal (not shown).
  • the second surface 122 of the heat sink 120 further includes a recess 124.
  • the at least one chip 130 is disposed on the recess 124, and the chip 130 is preferably a light emitting diode chip.
  • the fixing plate 200 is preferably a back plate or a light source base, but is not limited thereto. Referring again to FIG.
  • the heat dissipating fixture 140 is made of a material having good thermal conductivity, such as various metals or alloys, particularly aluminum or aluminum alloy.
  • the heat dissipating fixing member 140 has a coupling post 141 and a heat dissipating fin 142 , and the heat dissipating fin 142 further includes a plurality of fins 1421 and an abutting surface 1422 .
  • the fins 1421 are formed on a side of the heat dissipating fins 142 away from the heat sink 120 for tight fitting with the bonding holes 123, or by a small amount of adhesive thermal grease to increase the bonding. strength.
  • the abutting surface 1422 is formed on a side of the heat dissipation fin 142 adjacent to the heat sink 120 and the fixing plate 200.
  • the at least two leads 150 are used to electrically connect the carrier 110 to the at least one chip 130, but when the chip 130 is a flip chip type LED chip, The chip 130 is electrically connected to the carrier 110 by a plurality of bumps (not shown).
  • the encapsulant 160 is a transparent resin material for encapsulating the chip 130, the lead 150, the second surface 122 of the heat sink 120, and a portion of the upper surface of the carrier 110.
  • the fixing plate 200 is usually made of a material having good thermal conductivity, such as various metals or alloys, particularly aluminum or aluminum alloy.
  • the fixing plate 200 has at least one through hole 201 through which the coupling post 141 is passed to be coupled in the coupling hole 123. There is an assembly distance between the abutting surface 1422 and the heat sink 120 for interposing the fixing plate 200, and the abutting surface 1422 can closely abut the fixing plate 200.
  • the second to sixth preferred embodiments of the present invention are similar to the illumination source package structure 100 of the first preferred embodiment of the present invention, and generally follow the same component name. And the figure number, but the difference between the second to sixth preferred embodiments is that: the light source package structure 100 of the second to sixth preferred embodiments further improves the heat dissipation fixture 140, and the present invention will be described below. Detailed description.
  • FIG. 2 is a schematic diagram of a light source package structure 100 according to a second preferred embodiment of the present invention.
  • the light source package structure 100 of the second embodiment mainly includes a carrier 110 and a heat sink 120. At least one chip 130, a heat sink fixture 140, at least two leads 150, and a package
  • the coupling post 141 further includes an external thread 1411
  • the coupling hole 123 further includes an internal thread 1231.
  • the assembly post 141 of the heat dissipation fixture 140 can be stabilized by the screwing of the external thread 1411 and the internal thread 1231 to stabilize the heat dissipation fixture 140 and the heat sink 120. Positioned on both sides of the fixed plate 200.
  • the coupling post 141 is tightly coupled to the coupling hole 123 of the heat sink 120 by the external thread 1411 and the internal thread 1231, thermal contact between the heat sink 120 and the heat dissipation fixture 140 can be ensured. It is advantageous to conduct the heat energy generated by the chip 130 to a plurality of fins 1421 of the heat dissipation fins 142 for heat dissipation by means of heat conduction.
  • FIG. 3 is a schematic diagram of a light source package structure 100 according to a third preferred embodiment of the present invention.
  • the light source package structure 100 of the third embodiment mainly includes a carrier 110 and a heat sink 120.
  • the at least one chip 130, the heat dissipating fixture 140, the at least two leads 150, and the encapsulant 160 are different in the third embodiment: the hole wall of the coupling hole 123 is provided with at least one pair of recesses (not labeled), and
  • the binding post 141 is correspondingly provided with at least one hole, and the heat dissipating fixing member 140 further comprises at least one spring 143.
  • the spring 143 is disposed in the hole of the coupling post 141, and the two ends of the spring 143 are slightly elastically protruded out of the hole.
  • the assembly post 141 of the heat dissipation fixture 140 can be clamped in the recess of the coupling hole 123 by the two ends of the at least one spring 143 to ensure the coupling post 141 and the coupling hole 123.
  • the assembly reliability and strength are such that the heat dissipation fixture 140 and the heat sink 120 are stably positioned on both sides of the fixing plate 200.
  • the at least one spring 143 can also ensure the thermal contact between the heat sink 120 and the heat dissipation fixture 140, and facilitate the conduction of thermal energy generated by the chip 130 to the heat dissipation fins 142 via heat conduction.
  • a plurality of fins 1421 are used for heat dissipation.
  • FIG. 4 is a schematic diagram of a light source package structure 100 according to a fourth preferred embodiment of the present invention.
  • the light source package structure 100 of the fourth embodiment mainly includes a carrier 110 and a heat sink 120. At least one chip 130, a heat dissipating fixture 140, at least two leads 150, and an encapsulant 160, the fourth embodiment is characterized in that: the binding post 141 further comprises at least one bump 1412, and the bonding hole 123 further has a corresponding at least one recess 1232.
  • the at least one bump 1412 and the corresponding at least one recess 1232 can be fitted to each other such that the binding post 141 is coupled into the coupling hole 123 of the heat sink 120, and
  • the heat dissipation fixture 140 and the heat dissipation seat 120 are stably positioned on both sides of the fixing plate 200.
  • the heat dissipating fixing member 140 may be a hollow rivet, that is, the front end of the coupling post 141 has a hollow portion 1413, and the hollow portion 1413 provides an elastic deformation space for assembling.
  • the bump 1412 can be moderately elastically deformed through the front section of the coupling hole 123 and then snapped into the pocket 1232.
  • the at least one bump 1412 on the binding post 141 is preferably a bump, a convex ring or a convex arc segment, and the corresponding recess 1232 is a concave point, a concave ring groove or a concave arc groove. But it is not limited to this.
  • FIG. 5 is a schematic diagram of a light source package structure 100 according to a fifth embodiment of the present invention.
  • the light source package structure 100 of the fifth embodiment mainly includes a carrier 110 and a heat dissipation.
  • the first embodiment of the fifth embodiment is characterized in that: the binding post 141 further comprises at least one bump 1414, and the heat dissipation is performed.
  • the socket 120 further includes at least one chip 150 and an encapsulant 160.
  • the coupling hole 123 of the seat 120 further includes at least one recess 1233, and the at least one protrusion 1414 is disposed corresponding to the at least one recess 1233.
  • the protrusions 1414 of the coupling post 141 of the heat dissipating fixing member 140 and the recesses 1233 of the coupling hole 123 are engaged with each other such that the coupling post 141 is incorporated in the coupling hole 123.
  • the heat dissipation fixture 140 and the heat dissipation seat 120 are stably positioned on both sides of the fixing plate 200.
  • the protrusion 1414 on the binding post 141 is preferably a bump, a convex ring or a convex arc segment
  • the recess 1233 on the coupling hole 123 is preferably a concave point, a concave ring groove or a concave arc groove. , but not limited to this.
  • FIG. 6 is a schematic diagram of a light source package structure 100 according to a sixth preferred embodiment of the present invention.
  • the light source package structure 100 of the sixth embodiment mainly includes a carrier 110 and a heat sink. 120. At least one chip 130, a heat dissipating fixture 140, at least two leads 150, and an encapsulant 160.
  • the binding post 141 is further included to
  • the plurality of recesses 1415 further include at least one protrusion 1234, and the at least one recess 1415 is disposed corresponding to the at least one protrusion 1234.
  • the recess 1415 of the coupling post 141 of the heat dissipating fixing member 140 and the protrusion 1234 of the coupling hole 123 are engaged with each other, so that the coupling post 141 is incorporated in the coupling hole 140, and The heat dissipation fixture 140 and the heat dissipation seat 120 are stably positioned on both sides of the fixing plate 200.
  • the recess 1415 on the binding post 141 is preferably a concave point, a concave ring or a concave arc segment, and the corresponding protrusions 1234 on the coupling hole 123 are preferably bumps, convex ring segments or convex arc segments, but Not limited to this.
  • the above features of the first to sixth preferred embodiments of the present invention are advantageous in that: the heat dissipating fixing member 140 is respectively coupled by means of a tight fit, the internal thread 1231 And the external thread 141 1 , the spring 143 , the protrusion 1412 and the recess 1232 , the protrusion 1414 and the recess 1233 , or the recess 1415 and the protrusion 1234 are combined to make the combination
  • the heat dissipation fixture 140 and the heat dissipation seat 120 are stably positioned on both sides of the fixing plate 200, and the heat dissipation seat 120 and the heat dissipation fixture 140 are fixed. Direct thermal contact.
  • the heat dissipating fixing member 140 can not only utilize the abutting surface 1422 to ensure a close bonding relationship with the fixing plate 200 to improve assembly reliability, but also utilize the heat dissipating fin 142 to additionally The heat dissipation effect is increased, and the temperature of the chip 130 can be surely reduced. Therefore, the working efficiency of the chip 130 is further prevented from being lowered, which is advantageous for increasing the working stability of the chip 130 and prolonging the service life.

Abstract

La présente invention concerne un module de rétroéclairage (10) et une structure d'encapsulation d'une source de lumière (100) qui comprend une base de dissipation thermique (120), au moins une puce (130) et un élément de fixation à dissipation thermique (140). Ladite base (120) comprend un trou de couplage (123). L'élément de fixation à dissipation thermique (140) comprend un pilier de fixation (141) et une ailette de dissipation thermique (142) dotée d'une surface de butée. Le pilier de couplage (142) est combiné au trou de couplage (123) au moyen d'un trou traversant (201) d'une plaque de fixation (140), de façon à amener la surface de butée de l'ailette de dissipation (142) à venir buter contre la plaque de fixation (140).
PCT/CN2010/078145 2010-07-14 2010-10-27 Module de rétroéclairage et structure d'encapsulation d'une source de lumière WO2012006834A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/996,290 US8288782B2 (en) 2010-07-14 2010-10-27 Backlight module and light-emitting source package structure thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010102307872A CN101943356B (zh) 2010-07-14 2010-07-14 背光模块及其发光源封装构造
CN201010230787.2 2010-07-14

Publications (1)

Publication Number Publication Date
WO2012006834A1 true WO2012006834A1 (fr) 2012-01-19

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WO (1) WO2012006834A1 (fr)

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CN102563454B (zh) * 2011-10-12 2014-05-14 深圳市华星光电技术有限公司 Led背光模组及液晶显示装置
CN102563459B (zh) * 2011-12-13 2014-06-11 深圳市华星光电技术有限公司 背光模组及液晶显示装置
US10094549B2 (en) * 2012-08-22 2018-10-09 Flex-N-Gate Advanced Product Development, Llc Micro-channel heat sink for LED headlamp
TWI571598B (zh) * 2015-01-15 2017-02-21 旭德科技股份有限公司 照明裝置
WO2017059575A1 (fr) * 2015-10-09 2017-04-13 魏晓敏 Diode électroluminescente (led) et module

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