WO2012005069A1 - Electronic component and process for producing same - Google Patents

Electronic component and process for producing same Download PDF

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Publication number
WO2012005069A1
WO2012005069A1 PCT/JP2011/062501 JP2011062501W WO2012005069A1 WO 2012005069 A1 WO2012005069 A1 WO 2012005069A1 JP 2011062501 W JP2011062501 W JP 2011062501W WO 2012005069 A1 WO2012005069 A1 WO 2012005069A1
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WIPO (PCT)
Prior art keywords
magnetic
electronic component
layer
glass
magnetic material
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PCT/JP2011/062501
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French (fr)
Japanese (ja)
Inventor
敬実 工藤
博道 徳田
茂 宮崎
季 松永
祐 石渡
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株式会社村田製作所
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Publication of WO2012005069A1 publication Critical patent/WO2012005069A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core

Definitions

  • the present invention relates to an electronic component and a method for manufacturing the same, and more specifically, to an electronic component including a laminated body in which a magnetic layer and a nonmagnetic layer are stacked and a method for manufacturing the same.
  • a laminated common mode choke coil described in Patent Document 1 As a conventional electronic component, for example, a laminated common mode choke coil described in Patent Document 1 is known.
  • the laminated common mode choke coil magnetic material layers are provided above and below the nonmagnetic insulating material layer. And between the nonmagnetic insulating material layer and the magnetic material layer, a low magnetic permeability material layer having a shrinkage rate and a relative magnetic permeability higher than that of the nonmagnetic insulating material layer and lower than that of the magnetic material layer is provided.
  • the shrinkage ratio gradually decreases toward the nonmagnetic insulating material layer, so that the difference in shrinkage ratio between adjacent layers becomes smaller, and the difference in shrinkage ratio between each magnetic material and nonmagnetic insulating material when fired.
  • Can prevent delamination hereinafter referred to as delamination).
  • the magnetic material layer is mainly composed of Ni—Cu—Zn ferrite
  • the low magnetic permeability material layer is composed mainly of a glass material and Ni—Cu—Zn ferrite. Is a minor component.
  • the material composition of the magnetic material layer and the material composition of the low permeability material layer are greatly different. For this reason, the adhesion between the magnetic material layer and the low magnetic permeability material layer is poor. As a result, when the magnetic material layer and the low magnetic permeability material layer are fired simultaneously, delamination is likely to occur between the magnetic material layer and the low magnetic permeability material layer.
  • an object of the present invention is to provide an electronic component capable of suppressing the occurrence of delamination when a magnetic layer and a nonmagnetic layer are simultaneously fired, and a method for manufacturing the same.
  • the electronic component according to the present invention includes a non-magnetic material layer that does not contain a magnetic material component and that includes glass and a magnetic material layer that is a mixture of at least glass and a magnetic material. And a circuit element built in the laminated body.
  • the electronic component manufacturing method includes a non-magnetic layer containing glass and a non-magnetic layer including glass, and a laminate formed by laminating at least a magnetic layer formed by mixing glass and a magnetic material. A step of producing a body, and a step of firing the laminate.
  • the present invention it is possible to suppress the occurrence of delamination when the magnetic layer and the nonmagnetic layer are fired simultaneously.
  • FIG. 1 is an external perspective view of the electronic component 10.
  • FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10.
  • the stacking direction of the electronic components 10 is defined as the z-axis direction, and the direction in which the long side extends when the electronic component 10 is viewed in plan from the z-axis direction is defined as the x-axis direction.
  • the direction in which the short side extends when viewed in plan from the z-axis direction is defined as the y-axis direction.
  • the electronic component 10 includes a laminate 12, external electrodes 14 (14a to 14d), and coils (circuit elements) L1 and L2.
  • the laminate 12 has a rectangular parallelepiped shape as shown in FIG. 1, and as shown in FIG. 2, the magnetic layers 16 (16a, 16b), 20 (20a to 20e) and the nonmagnetic layer 18 (18a). To 18e).
  • the laminated body 12 is configured by laminating a magnetic layer 16a, nonmagnetic layers 18a to 18e, and a magnetic layer 16b so that they are arranged in this order from the positive direction side to the negative direction side in the z-axis direction.
  • the coils L1 and L2 are incorporated.
  • the magnetic layers 20a to 20e are provided so as to penetrate the nonmagnetic layers 18a to 18e in the z-axis direction in predetermined regions of the nonmagnetic layers 18a to 18e, respectively.
  • the predetermined regions of the nonmagnetic layers 18a to 18e are regions near the center (near the intersection of diagonal lines) of the nonmagnetic layers 18a to 18e.
  • the magnetic layers 16 and 20 are configured by mixing the same glass and ferrite powder (magnetic material) as the glass constituting the nonmagnetic layer 18.
  • the magnetic layers 16 and 20 have a structure (composite structure) in which ferrite powder is dispersed in glass.
  • the magnetic layers 16 and 20 are composed only of glass and ferrite powder, and contain glass at a ratio of 15% by volume or more.
  • the ferrite powder is, for example, a Ni—Zn ferrite powder having an average particle diameter D50 of 1 ⁇ m or more and 100 ⁇ m or less, and is a completely spineled sintered ferrite powder.
  • the coils L ⁇ b> 1 and L ⁇ b> 2 are provided in the laminated body 12 so as to be aligned in the z-axis direction, and constitute a common mode choke coil by magnetic coupling with each other.
  • the coil L1 is provided closer to the positive direction side in the z-axis direction than the coil L2.
  • the coil conductor 22b is a spiral linear conductor that is provided on the nonmagnetic layer 18c and rotates around the magnetic layer 20c.
  • the coil conductor 22b has a shape that approaches the center while turning clockwise when viewed from the positive side in the z-axis direction.
  • One end of the coil conductor 22b is drawn to the long side of the nonmagnetic layer 18c on the negative direction side in the y-axis direction.
  • the other end of the coil conductor 22b is located on the positive side in the x-axis direction with respect to the magnetic layer 20c.
  • the other end of the coil conductor 22b overlaps the other end of the coil conductor 22a when viewed in plan from the z-axis direction.
  • the coil L2 includes a coil conductor 24 (24a, 24b) and a via-hole conductor v2, and has a spiral shape.
  • the coil conductor 24a is a spiral linear conductor that is provided on the nonmagnetic layer 18d and rotates around the magnetic layer 20d.
  • the coil conductor 24a has a shape that approaches the center while turning clockwise when viewed from the positive side in the z-axis direction.
  • One end of the coil conductor 24a is drawn to the long side on the negative direction side in the y-axis direction of the nonmagnetic layer 18d.
  • the other end of the coil conductor 24a is located on the positive direction side in the x-axis direction with respect to the magnetic layer 20d.
  • One end of the coil conductor 24a is located closer to the negative side in the x-axis direction than one end of the coil conductor 22b.
  • the coil conductor 24b is provided on the nonmagnetic material layer 18e. One end of the coil conductor 24b is drawn to the long side on the positive direction side in the y-axis direction of the nonmagnetic layer 18e. One end of the coil conductor 24b is located closer to the negative side in the x-axis direction than one end of the coil conductor 22a. The other end of the coil conductor 24b is located on the positive direction side in the x-axis direction with respect to the magnetic layer 20e. The other end of the coil conductor 24b overlaps the other end of the coil conductor 24a when viewed in plan from the z-axis direction.
  • the via-hole conductor v2 passes through the nonmagnetic layer 18d in the z-axis direction, and connects the other end of the coil conductor 24a and the other end of the coil conductor 24b.
  • the coil L2 is provided on the nonmagnetic layers 18d and 18e and is not in contact with the magnetic layers 16 and 20.
  • the magnetic layer 16b is provided on the negative direction side in the z-axis direction from the coil L2.
  • the external electrodes 14c and 14d are provided on the side surface on the positive direction side in the y-axis direction of the multilayer body 12, as shown in FIG.
  • the external electrode 14c is provided on the positive side in the x-axis direction with respect to the external electrode 14d.
  • the external electrode 14c is connected to one end of the coil conductor 22a.
  • the external electrode 14d is connected to one end of the coil conductor 24b.
  • the coil L1 is connected between the external electrodes 14a and 14c, and the coil L2 is connected between the external electrodes 14b and 14d.
  • the magnetic layers 20a to 20e extend in the z-axis direction so as to penetrate the nonmagnetic layers 18a to 18e in a predetermined region.
  • the predetermined regions that is, the magnetic layers 20a to 20e
  • the coil conductors 22a, 22b, 24a, and 24b when viewed in plan from the z-axis direction. That is, the magnetic layers 20a to 20e pass through the centers of the coils L1 and L2 in the z-axis direction.
  • the magnetic flux generated by the coil L1 passes through the magnetic layers 20a to 20e and passes through the coil L2, and the magnetic flux generated by the coil L2 passes through the magnetic layers 20a to 20e and passes through the coil L1.
  • the coil L1 and the coil L2 are magnetically coupled, and the coils L1 and L2 constitute a common mode choke coil.
  • 3 to 6 are process cross-sectional views when the electronic component 10 is manufactured.
  • 3 to 6 show process cross-sectional views at the time of manufacturing one electronic component 10, but actually, the mother laminate is cut to form a plurality of laminates 12 at the same time.
  • 3 to 6 are schematic diagrams, and are described at a ratio different from the actual thickness of each layer.
  • a magnetic layer 16b having a thickness of 150 ⁇ m to 300 ⁇ m is formed.
  • a ferrite raw material for example, Ni—Zn-based ferrite
  • a ferrite raw material that becomes a ferrite powder is completely sintered at 1100 ° C. or more to be completely spineled. Fe 2 O 3 does not remain in the completely sintered ferrite raw material.
  • the sintered ferrite raw material is pulverized by a mill into ferrite powder having an average particle diameter D50 of 1 ⁇ m or more and 100 ⁇ m or less.
  • glass powder for example, Si-based glass
  • ferrite powder that is a powdered magnetic material, and an organic component such as a binder are mixed to prepare a magnetic paste.
  • a magnetic paste is applied on a sheet (not shown) by a die coater.
  • the magnetic paste may be applied by a screen printing method. Thereby, the magnetic layer 16b shown in FIG. 3A is formed.
  • the magnetic layer 16b formed as shown in FIG. 3A is preliminarily dried at 85 ° C. and then thermally cured at 140 ° C. Thereby, the magnetic body layer 16b can ensure the tolerance to the alkali developing solution used after this process.
  • a non-magnetic layer 18e having a via hole H1 and having a thickness of 10 ⁇ m to 20 ⁇ m is formed on the magnetic layer 16b.
  • a non-magnetic paste is prepared by mixing glass powder (for example, Si-based glass), a filler (for example, non-magnetic filler such as alumina) and an organic component such as a binder.
  • a non-magnetic paste is applied on the magnetic layer 16b by screen printing.
  • a magnetic layer 20e is formed in the via hole H1. Specifically, the same magnetic paste as that of the magnetic layer 16b is filled into the via hole H1 through a metal mask.
  • the coil conductor 24b is formed on the nonmagnetic layer 18e.
  • a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 ⁇ m to 15 ⁇ m. And it exposes through a photomask and develops with an alkali developing solution.
  • a nonmagnetic layer 18d having via holes H2 and h2 and having a thickness of 10 ⁇ m to 20 ⁇ m is formed on the nonmagnetic layer 18e.
  • a nonmagnetic paste is applied to the nonmagnetic layer 18e by screen printing.
  • a magnetic layer 20d is formed in the via hole H2. Specifically, a magnetic paste is filled into the via hole H2 through a metal mask.
  • a via hole conductor v2 is formed in the via hole h2, and a coil conductor 24a is formed on the nonmagnetic layer 18d.
  • a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 ⁇ m to 15 ⁇ m. And it exposes through a photomask and develops with an alkali developing solution.
  • a nonmagnetic material layer 18c having a via hole H3 and having a thickness of 10 ⁇ m to 20 ⁇ m is formed on the nonmagnetic material layer 18d.
  • a nonmagnetic paste is applied to the nonmagnetic layer 18d by screen printing.
  • a magnetic layer 20c is formed in the via hole H3. Specifically, the magnetic paste is filled into the via hole H3 through a metal mask.
  • the coil conductor 22b is formed on the nonmagnetic layer 18c.
  • a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 ⁇ m to 15 ⁇ m. It exposes through a photomask and develops with an alkali developing solution.
  • a nonmagnetic layer 18b having a thickness of 10 ⁇ m to 20 ⁇ m having via holes H4 and h1 is formed on the nonmagnetic layer 18c.
  • a nonmagnetic paste is applied to the nonmagnetic layer 18c by screen printing.
  • a magnetic layer 20b is formed in the via hole H4. Specifically, the magnetic paste is filled into the via hole H4 through a metal mask.
  • a via hole conductor v1 is formed in the via hole h1, and a coil conductor 22a is formed on the nonmagnetic layer 18b.
  • a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 ⁇ m to 15 ⁇ m. And it exposes through a photomask and develops with an alkali developing solution.
  • a non-magnetic layer 18a having a via hole H5 and having a thickness of 10 ⁇ m to 20 ⁇ m is formed on the non-magnetic layer 18b.
  • a nonmagnetic paste is applied to the nonmagnetic layer 18b by screen printing.
  • a magnetic layer 20a is formed in the via hole H5. Specifically, a magnetic paste is filled into the via hole H5 through a metal mask.
  • a magnetic layer 16a having a thickness of 150 ⁇ m to 300 ⁇ m is formed by a die coater. Further, the magnetic layer 16a formed as shown in FIG. 6B is preliminarily dried at 85 ° C. and then thermally cured at 140 ° C. Through the above steps, a mother laminate including the magnetic layers 16 and 20 and the nonmagnetic layer 18 is obtained.
  • the mother laminate is cut into a predetermined size by a dicer to obtain an unfired laminate 12.
  • the width of the cut groove formed in the mother laminate at the time of cutting is about 10 ⁇ m to 100 ⁇ m.
  • the unfired laminate 12 is fired under conditions of 800 to 900 ° C. and 30 to 60 minutes. After firing, the laminated body 12 is subjected to barrel polishing to chamfer.
  • a silver electrode to be the external electrode 14 is formed on the surface of the laminate 12 by applying and baking an electrode paste whose main component is silver by a method such as dipping.
  • the external electrode 14 is formed by performing Ni plating / Sn plating on the surface of the silver electrode to be the external electrode 14.
  • the magnetic layers 16 and 20 are formed using a magnetic paste in which glass powder, ferrite powder, and an organic component such as a binder are mixed, and the nonmagnetic layer 18 is It is formed using a non-magnetic paste in which glass powder, a filler such as alumina, and an organic component such as a binder are mixed. Therefore, the magnetic layers 16 and 20 and the nonmagnetic layer 18 contain glass having the same composition.
  • the glass powder is melted at the interface between the magnetic layers 16 and 20 and the nonmagnetic layer 18, and the glasses are fused together.
  • the body layer 18 is firmly bonded. As a result, it is possible to suppress the occurrence of delamination when the magnetic layers 16 and 20 and the nonmagnetic layer 18 are simultaneously fired.
  • the magnetic layers 16 and 20 and the nonmagnetic layer 18 contain glass having the same composition. Therefore, the shrinkage rate of the magnetic layers 16 and 20 and the shrinkage rate of the nonmagnetic layer 18 at the time of firing the laminate 12 are relatively close. Therefore, due to the difference between the shrinkage rate of the magnetic layers 16 and 20 and the shrinkage rate of the nonmagnetic layer 18, delamination is caused in the laminate 12 when the magnetic layers 16 and 20 and the nonmagnetic layer 18 are simultaneously fired. Occurrence is suppressed.
  • the magnetic layers 16 and 20 have a structure in which ferrite powder is dispersed in glass. Therefore, the magnetic layers 16 and 20 have a composite structure in which ferrite powder is dispersed in glass.
  • the inductance values of the coils L1 and L2 are smaller than when the magnetic layer not having the composite structure is used, and the coils L1 and L2 The self-resonant frequency is increased. As a result, the high frequency characteristics of the common mode choke coil including the coils L1 and L2 are improved.
  • the magnetic paste and the non-magnetic paste contain glass. Therefore, the laminate 12 cannot be fired at a temperature higher than the firing temperature of the glass. However, the sintering temperature of the ferrite powder is higher than the melting temperature of the glass. Therefore, in the electronic component 10 and the manufacturing method thereof, the ferrite body and the glass that are completely sintered in advance are mixed with the magnetic paste, so that the laminate formed using the magnetic paste is mixed at the melting temperature of the glass. What is necessary is just to calcinate and can make a calcination temperature low compared with the magnetic body layer which does not contain glass.
  • the laminated body 12 including the ferrite powder in a completely sintered state can be obtained.
  • the magnetic layers 16 and 20 of the electronic component 10 can obtain high magnetic permeability.
  • the ferrite powder is in a completely sintered state, it is possible to suppress the diffusion of components (for example, Fe, Cu, or Ni) in the ferrite powder to the non-magnetic layer 18 when the laminate is fired. As a result, the components in the ferrite powder are diffused into the nonmagnetic layer 18 and the insulation between the coils L1 and L2 is prevented from being broken.
  • components for example, Fe, Cu, or Ni
  • the magnetic layers 16 and 20 and the nonmagnetic layer 18 each contain glass at a ratio of 15% by volume or more.
  • the glass content of the magnetic layers 16 and 20 and the nonmagnetic layer 18 is 15% by volume or more, the ratio of ferrite powder and filler in the magnetic paste and the nonmagnetic paste decreases.
  • the viscosity of the magnetic paste and the nonmagnetic paste becomes low, and it becomes easy to form the magnetic layers 16 and 20 and the nonmagnetic layer 18.
  • the glass content of the magnetic layers 16 and 20 and the nonmagnetic layer 18 is preferably 15% by volume or more.
  • the electronic component 10 has an average particle diameter D50 of the ferrite powder.
  • the thickness is preferably 1 ⁇ m or more and 100 ⁇ m or less.
  • FIG. 7 is a graph showing the relationship between the average particle diameter of the ferrite powder and the magnetic permeability of the magnetic layer. The horizontal axis represents the average particle diameter of the ferrite powder, and the vertical axis represents the magnetic permeability of the magnetic layer. In the experiment conducted to obtain the graph of FIG. 7, an epoxy resin was used instead of the glass powder.
  • a method for measuring the average particle diameter will be described.
  • a ferrite particle size is measured under the following conditions using a laser analysis / scattering particle size distribution measuring device (device number: LA-920, manufactured by Horiba, Ltd.). Measurement conditions: Relative refractive index 1.80 Ultrasonic vibration 3 minutes Transmittance 70% -80% Solvent: 0.1% NaHMP (sodium hexametaphosphate)
  • the permeability of the magnetic layer increases as the average particle size of the ferrite powder increases. Therefore, in the electronic component 10, in order to increase the magnetic permeability of the magnetic layers 16 and 20, it is preferable to increase the average particle diameter of the ferrite powder.
  • the average particle diameter D50 of the ferrite powder is 100 ⁇ m or less so that the ferrite powder does not protrude from the magnetic layers 16 and 20.
  • the average particle diameter D50 of the ferrite powder is 1 ⁇ m or more
  • the magnetic layers 16 and 20 have high magnetic permeability and the viscosity of the magnetic paste becomes an appropriate value to form the magnetic layers 16 and 20. Becomes easy. Therefore, in the present embodiment, it is preferable that the average particle diameter D50 of the ferrite powder is 1 ⁇ m or more.
  • FIG. 8 is a cross-sectional structure diagram of the electronic component 10a according to the first modification.
  • the protective layer 30a is provided on the most positive side (uppermost layer) in the z-axis direction
  • the protective layer 30b is provided on the most negative direction side (lowermost layer) in the z-axis direction.
  • the protective layers 30a and 30b are made of a magnetic material in which glass powder and ferrite powder are mixed.
  • the ferrite powder content in the protective layers 30a and 30b is smaller than the ferrite powder content in the magnetic layers 16a and 16b.
  • the protective layers 30a and 30b do not need to contain ferrite powder.
  • FIG. 9 is a sectional structural view of an electronic component 10b according to a second modification.
  • the magnetic layer 20 is not provided. According to the electronic component 10b having such a configuration, similarly to the electronic component 10, it is possible to suppress the occurrence of delamination when the magnetic layer 16 and the nonmagnetic layer 18 are simultaneously fired. Furthermore, in the electronic component 10b, the manufacturing process can be simplified as compared with the electronic component 10a.
  • FIG. 10 is a cross-sectional structure diagram of an electronic component 10c according to a third modification.
  • the periphery of the nonmagnetic layer 18 is surrounded by the magnetic layers 16 and 20. More specifically, the magnetic layer 20 is provided on both sides of the nonmagnetic layer 18 in the x-axis direction. Thereby, the magnetic flux generated in the coils L1 and L2 forms a closed magnetic path by the magnetic layers 16 and 20.
  • the electronic component 10 may incorporate a circuit element other than the coil.
  • the glass composition contained in the magnetic layers 16, 20 and the glass composition contained in the nonmagnetic layer 18 may be different.
  • the present invention is useful for an electronic component and a method for manufacturing the same, and particularly excellent in that delamination can be suppressed when the magnetic layer and the nonmagnetic layer are fired simultaneously. .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Provided is an electronic component which can be produced through simultaneous burning of a magnetic material layer and a non-magnetic material layer while preventing delamination. Also provided is a process for producing the electronic component. The layered product (12) comprises a non-magnetic material layer (18) containing no magnetic material ingredients and comprising a glass and a magnetic material layer (16) comprising a mixture of a glass and a ferrite powder, the layer (18) and the layer (16) having been laminated together. The layered product (12) includes built-in coils (L1 and L2).

Description

電子部品及びその製造方法Electronic component and manufacturing method thereof
　本発明は、電子部品及びその製造方法に関し、より特定的には、磁性体層及び非磁性体層が積層されてなる積層体を備えた電子部品及びその製造方法に関する。 The present invention relates to an electronic component and a method for manufacturing the same, and more specifically, to an electronic component including a laminated body in which a magnetic layer and a nonmagnetic layer are stacked and a method for manufacturing the same.
　従来の電子部品としては、例えば、特許文献１に記載の積層型コモンモードチョークコイルが知られている。該積層型コモンモードチョークコイルでは、非磁性絶縁材料層の上下に磁性材料層が設けられている。そして、非磁性絶縁材料層と磁性材料層との間には、収縮率及び比透磁率が非磁性絶縁材料層よりも高く磁性材料層よりも低い低透磁率材料層が設けられている。これにより、非磁性絶縁材料層に向かって徐々に収縮比が小さくなるので、隣接する層間の収縮比の差が小さくなり、焼成させた際に各磁性材料及び非磁性絶縁材料の収縮比の差による層間剥がれ（以下、デラミネーションと称す）を抑制できる。 As a conventional electronic component, for example, a laminated common mode choke coil described in Patent Document 1 is known. In the laminated common mode choke coil, magnetic material layers are provided above and below the nonmagnetic insulating material layer. And between the nonmagnetic insulating material layer and the magnetic material layer, a low magnetic permeability material layer having a shrinkage rate and a relative magnetic permeability higher than that of the nonmagnetic insulating material layer and lower than that of the magnetic material layer is provided. As a result, the shrinkage ratio gradually decreases toward the nonmagnetic insulating material layer, so that the difference in shrinkage ratio between adjacent layers becomes smaller, and the difference in shrinkage ratio between each magnetic material and nonmagnetic insulating material when fired. Can prevent delamination (hereinafter referred to as delamination).
　しかしながら、特許文献１に記載の積層型コモンモードチョークコイルでは、十分にデラミネーションの発生を抑制することが困難である。より詳細には、該積層型コモンモードチョークコイルでは、磁性材料層は、Ｎｉ－Ｃｕ－Ｚｎフェライトを主成分としており、低透磁率材料層は、ガラス材料を主成分としＮｉ－Ｃｕ－Ｚｎフェライトを副成分としている。このように、磁性材料層にはガラスが含まれておらず低透磁率材料層にはガラスが含まれているので、磁性材料層の材料組成と低透磁率材料層の材料組成とが大きく異なるため、磁性材料層と低透磁率材料層との密着性が悪い。その結果、磁性材料層と低透磁率材料層とが同時に焼成されると、磁性材料層と低透磁率材料層との間においてデラミネーションが発生しやすい。 However, with the laminated common mode choke coil described in Patent Document 1, it is difficult to sufficiently suppress the occurrence of delamination. More specifically, in the laminated common mode choke coil, the magnetic material layer is mainly composed of Ni—Cu—Zn ferrite, and the low magnetic permeability material layer is composed mainly of a glass material and Ni—Cu—Zn ferrite. Is a minor component. Thus, since the magnetic material layer does not contain glass and the low permeability material layer contains glass, the material composition of the magnetic material layer and the material composition of the low permeability material layer are greatly different. For this reason, the adhesion between the magnetic material layer and the low magnetic permeability material layer is poor. As a result, when the magnetic material layer and the low magnetic permeability material layer are fired simultaneously, delamination is likely to occur between the magnetic material layer and the low magnetic permeability material layer.
特開２００５－５０９５７号公報JP 2005-50957 A
　そこで、本発明の目的は、磁性体層及び非磁性体層を同時に焼成した際にデラミネーションが発生することを抑制できる電子部品及びその製造方法を提供することである。 Therefore, an object of the present invention is to provide an electronic component capable of suppressing the occurrence of delamination when a magnetic layer and a nonmagnetic layer are simultaneously fired, and a method for manufacturing the same.
　本発明に係る電子部品は、磁性体成分を含有しておらず、かつ、ガラスを含む非磁性体層、及び、少なくともガラス及び磁性体材料が混合されてなる磁性体層が積層されてなる積層体と、前記積層体に内蔵されている回路素子と、を備えていること、を特徴とする。 The electronic component according to the present invention includes a non-magnetic material layer that does not contain a magnetic material component and that includes glass and a magnetic material layer that is a mixture of at least glass and a magnetic material. And a circuit element built in the laminated body.
　前記電子部品の製造方法は、磁性体成分を含有しておらず、かつ、ガラスを含む非磁性体層、及び、少なくともガラス及び磁性体材料が混合されてなる磁性体層が積層されてなる積層体を作製する工程と、前記積層体を焼成する工程と、を備えていること、を特徴とする。 The electronic component manufacturing method includes a non-magnetic layer containing glass and a non-magnetic layer including glass, and a laminate formed by laminating at least a magnetic layer formed by mixing glass and a magnetic material. A step of producing a body, and a step of firing the laminate.
　本発明によれば、磁性体層及び非磁性体層を同時に焼成した際にデラミネーションが発生することを抑制できる。 According to the present invention, it is possible to suppress the occurrence of delamination when the magnetic layer and the nonmagnetic layer are fired simultaneously.
電子部品の外観斜視図である。It is an external appearance perspective view of an electronic component. 電子部品の積層体の分解斜視図である。It is a disassembled perspective view of the laminated body of an electronic component. 電子部品の製造時における工程断面図である。It is process sectional drawing at the time of manufacture of an electronic component. 電子部品の製造時において図３に示した工程の後に実施される工程を示す断面図である。It is sectional drawing which shows the process implemented after the process shown in FIG. 3 at the time of manufacture of an electronic component. 電子部品の製造時において図４に示した工程の後に実施される工程を示す断面図である。It is sectional drawing which shows the process implemented after the process shown in FIG. 4 at the time of manufacture of an electronic component. 電子部品の製造時において図５に示した工程の後に実施される工程を示す断面図である。It is sectional drawing which shows the process implemented after the process shown in FIG. 5 at the time of manufacture of an electronic component. フェライト粉末の平均粒径と磁性体層の透磁率との関係を示したグラフである。It is the graph which showed the relationship between the average particle diameter of ferrite powder, and the magnetic permeability of a magnetic body layer. 第１の変形例に係る電子部品の断面構造図である。It is a cross-section figure of the electronic component which concerns on a 1st modification. 第２の変形例に係る電子部品の断面構造図である。It is sectional structure drawing of the electronic component which concerns on a 2nd modification. 第３の変形例に係る電子部品の断面構造図である。It is sectional structure drawing of the electronic component which concerns on a 3rd modification.
　以下に、本発明の一実施形態に係る電子部品及びその製造方法について図面を参照しながら説明する。 Hereinafter, an electronic component and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.
（電子部品の構成）
　以下に、電子部品１０の構成について図面を参照しながら説明する。図１は、電子部品１０の外観斜視図である。図２は、電子部品１０の積層体１２の分解斜視図である。以下では、電子部品１０の積層方向をｚ軸方向と定義し、電子部品１０をｚ軸方向から平面視したときに長辺が延在している方向をｘ軸方向と定義し、電子部品１０をｚ軸方向から平面視したときに短辺が延在している方向をｙ軸方向と定義する。 (Configuration of electronic parts)
Below, the structure of the electronic component 10 is demonstrated, referring drawings. FIG. 1 is an external perspective view of the electronic component 10. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10. Hereinafter, the stacking direction of the electronic components 10 is defined as the z-axis direction, and the direction in which the long side extends when the electronic component 10 is viewed in plan from the z-axis direction is defined as the x-axis direction. The direction in which the short side extends when viewed in plan from the z-axis direction is defined as the y-axis direction.
　電子部品１０は、図１及び図２に示すように、積層体１２、外部電極１４（１４ａ～１４ｄ）及びコイル（回路素子）Ｌ１，Ｌ２を備えている。積層体１２は、図１に示すように、直方体状をなしており、図２に示すように、磁性体層１６（１６ａ，１６ｂ），２０（２０ａ～２０ｅ）及び非磁性体層１８（１８ａ～１８ｅ）により構成されている。 As shown in FIGS. 1 and 2, the electronic component 10 includes a laminate 12, external electrodes 14 (14a to 14d), and coils (circuit elements) L1 and L2. The laminate 12 has a rectangular parallelepiped shape as shown in FIG. 1, and as shown in FIG. 2, the magnetic layers 16 (16a, 16b), 20 (20a to 20e) and the nonmagnetic layer 18 (18a). To 18e).
　積層体１２は、磁性体層１６ａ、非磁性体層１８ａ～１８ｅ及び磁性体層１６ｂがｚ軸方向の正方向側から負方向側へとこの順に並ぶように積層されることにより構成されており、コイルＬ１，Ｌ２を内蔵している。更に、磁性体層２０ａ～２０ｅはそれぞれ、非磁性体層１８ａ～１８ｅの所定領域において、非磁性体層１８ａ～１８ｅをｚ軸方向に貫通するように設けられている。非磁性体層１８ａ～１８ｅの所定領域とは、非磁性体層１８ａ～１８ｅの中心近傍（対角線の交点近傍）の領域である。 The laminated body 12 is configured by laminating a magnetic layer 16a, nonmagnetic layers 18a to 18e, and a magnetic layer 16b so that they are arranged in this order from the positive direction side to the negative direction side in the z-axis direction. The coils L1 and L2 are incorporated. Further, the magnetic layers 20a to 20e are provided so as to penetrate the nonmagnetic layers 18a to 18e in the z-axis direction in predetermined regions of the nonmagnetic layers 18a to 18e, respectively. The predetermined regions of the nonmagnetic layers 18a to 18e are regions near the center (near the intersection of diagonal lines) of the nonmagnetic layers 18a to 18e.
　非磁性体層１８は、Ｓｉ系のガラス及びフィラーが混合されて構成されている。そして、非磁性体層１８は、Ｃｕ、Ｆｅ、Ｎｉ等の磁性体成分を含有していない。本実施形態では、非磁性体層１８は、ガラス及びフィラーのみにより構成されており、ガラスを１５体積％以上の割合で含有している。 The nonmagnetic layer 18 is composed of a mixture of Si glass and filler. The nonmagnetic layer 18 does not contain a magnetic component such as Cu, Fe, or Ni. In the present embodiment, the nonmagnetic layer 18 is composed only of glass and filler, and contains glass at a ratio of 15% by volume or more.
　磁性体層１６，２０は、非磁性体層１８を構成しているガラスと同じガラス及びフェライト粉末（磁性体材料）が混合されて構成されている。また、磁性体層１６，２０は、ガラス中にフェライト粉末が分散された構造（コンポジット構造）をなしている。磁性体層１６，２０は、ガラス及びフェライト粉末のみにより構成されており、ガラスを１５体積％以上の割合で含有している。フェライト粉末は、例えば、平均粒径Ｄ５０が１μm以上１００μm以下であるＮｉ－Ｚｎ系のフェライト粉末であり、完全スピネル化した焼結フェライト粉末である。 The magnetic layers 16 and 20 are configured by mixing the same glass and ferrite powder (magnetic material) as the glass constituting the nonmagnetic layer 18. The magnetic layers 16 and 20 have a structure (composite structure) in which ferrite powder is dispersed in glass. The magnetic layers 16 and 20 are composed only of glass and ferrite powder, and contain glass at a ratio of 15% by volume or more. The ferrite powder is, for example, a Ni—Zn ferrite powder having an average particle diameter D50 of 1 μm or more and 100 μm or less, and is a completely spineled sintered ferrite powder.
　コイルＬ１，Ｌ２は、図２に示すように、積層体１２内において、ｚ軸方向に並ぶように設けられており、互いに磁気結合することによりコモンモードチョークコイルを構成している。本実施形態では、コイルＬ１は、コイルＬ２よりもｚ軸方向の正方向側に設けられている。 As shown in FIG. 2, the coils L <b> 1 and L <b> 2 are provided in the laminated body 12 so as to be aligned in the z-axis direction, and constitute a common mode choke coil by magnetic coupling with each other. In the present embodiment, the coil L1 is provided closer to the positive direction side in the z-axis direction than the coil L2.
　コイルＬ１は、図２に示すように、コイル導体２２（２２ａ，２２ｂ）及びビアホール導体ｖ１により構成されており、渦巻き状をなしている。コイル導体２２ａは、非磁性体層１８ｂ上に設けられており、磁性体層２０ｂよりもｘ軸方向の正方向側において、ｙ軸方向に延在している直線状の線状導体である。コイル導体２２ａの一端は、非磁性体層１８ｂのｙ軸方向の正方向側の長辺に引き出されている。コイル導体２２ａの他端は、磁性体層２０ｂよりもｘ軸方向の正方向側に位置している。 As shown in FIG. 2, the coil L1 includes a coil conductor 22 (22a, 22b) and a via-hole conductor v1, and has a spiral shape. The coil conductor 22a is a linear linear conductor that is provided on the nonmagnetic layer 18b and extends in the y-axis direction on the positive side in the x-axis direction from the magnetic layer 20b. One end of the coil conductor 22a is drawn to the long side on the positive direction side in the y-axis direction of the nonmagnetic layer 18b. The other end of the coil conductor 22a is located on the positive side in the x-axis direction with respect to the magnetic layer 20b.
　コイル導体２２ｂは、非磁性体層１８ｃ上に設けられており、磁性体層２０ｃの周囲を旋廻する渦巻き状の線状導体である。コイル導体２２ｂは、ｚ軸方向の正方向側から平面視したときに、時計回りに旋回しながら中心に近づく形状をなしている。そして、コイル導体２２ｂの一端は、非磁性体層１８ｃのｙ軸方向の負方向側の長辺に引き出されている。コイル導体２２ｂの他端は、磁性体層２０ｃよりもｘ軸方向の正方向側に位置している。コイル導体２２ｂの他端は、ｚ軸方向から平面視したときに、コイル導体２２ａの他端と重なっている。 The coil conductor 22b is a spiral linear conductor that is provided on the nonmagnetic layer 18c and rotates around the magnetic layer 20c. The coil conductor 22b has a shape that approaches the center while turning clockwise when viewed from the positive side in the z-axis direction. One end of the coil conductor 22b is drawn to the long side of the nonmagnetic layer 18c on the negative direction side in the y-axis direction. The other end of the coil conductor 22b is located on the positive side in the x-axis direction with respect to the magnetic layer 20c. The other end of the coil conductor 22b overlaps the other end of the coil conductor 22a when viewed in plan from the z-axis direction.
　ビアホール導体ｖ１は、非磁性体層１８ｂをｚ軸方向に貫通しており、コイル導体２２ａの他端とコイル導体２２ｂの他端とを接続している。このように、コイルＬ１は、非磁性体層１８ｂ，１８ｃに設けられており、磁性体層１６，２０には接していない。磁性体層１６ａは、コイルＬ１よりもｚ軸方向の正方向側に設けられている。 The via-hole conductor v1 passes through the nonmagnetic layer 18b in the z-axis direction, and connects the other end of the coil conductor 22a and the other end of the coil conductor 22b. As described above, the coil L1 is provided in the nonmagnetic layers 18b and 18c and is not in contact with the magnetic layers 16 and 20. The magnetic layer 16a is provided on the positive direction side in the z-axis direction from the coil L1.
　コイルＬ２は、図２に示すように、コイル導体２４（２４ａ，２４ｂ）及びビアホール導体ｖ２により構成されており、渦巻き状をなしている。コイル導体２４ａは、非磁性体層１８ｄ上に設けられており、磁性体層２０ｄの周囲を旋廻する渦巻き状の線状導体である。コイル導体２４ａは、ｚ軸方向の正方向側から平面視したときに、時計回りに旋回しながら中心に近づく形状をなしている。そして、コイル導体２４ａの一端は、非磁性体層１８ｄのｙ軸方向の負方向側の長辺に引き出されている。コイル導体２４ａの他端は、磁性体層２０ｄよりもｘ軸方向の正方向側に位置している。コイル導体２４ａの一端は、コイル導体２２ｂの一端よりもｘ軸方向の負方向側に位置している。 As shown in FIG. 2, the coil L2 includes a coil conductor 24 (24a, 24b) and a via-hole conductor v2, and has a spiral shape. The coil conductor 24a is a spiral linear conductor that is provided on the nonmagnetic layer 18d and rotates around the magnetic layer 20d. The coil conductor 24a has a shape that approaches the center while turning clockwise when viewed from the positive side in the z-axis direction. One end of the coil conductor 24a is drawn to the long side on the negative direction side in the y-axis direction of the nonmagnetic layer 18d. The other end of the coil conductor 24a is located on the positive direction side in the x-axis direction with respect to the magnetic layer 20d. One end of the coil conductor 24a is located closer to the negative side in the x-axis direction than one end of the coil conductor 22b.
　コイル導体２４ｂは、非磁性体層１８ｅ上に設けられている。コイル導体２４ｂの一端は、非磁性体層１８ｅのｙ軸方向の正方向側の長辺に引き出されている。コイル導体２４ｂの一端は、コイル導体２２ａの一端よりもｘ軸方向の負方向側に位置している。コイル導体２４ｂの他端は、磁性体層２０ｅよりもｘ軸方向の正方向側に位置している。コイル導体２４ｂの他端は、ｚ軸方向から平面視したときに、コイル導体２４ａの他端と重なっている。 The coil conductor 24b is provided on the nonmagnetic material layer 18e. One end of the coil conductor 24b is drawn to the long side on the positive direction side in the y-axis direction of the nonmagnetic layer 18e. One end of the coil conductor 24b is located closer to the negative side in the x-axis direction than one end of the coil conductor 22a. The other end of the coil conductor 24b is located on the positive direction side in the x-axis direction with respect to the magnetic layer 20e. The other end of the coil conductor 24b overlaps the other end of the coil conductor 24a when viewed in plan from the z-axis direction.
　ビアホール導体ｖ２は、非磁性体層１８ｄをｚ軸方向に貫通しており、コイル導体２４ａの他端とコイル導体２４ｂの他端とを接続している。このように、コイルＬ２は、非磁性体層１８ｄ，１８ｅに設けられており、磁性体層１６，２０には接していない。磁性体層１６ｂは、コイルＬ２よりもｚ軸方向の負方向側に設けられている。 The via-hole conductor v2 passes through the nonmagnetic layer 18d in the z-axis direction, and connects the other end of the coil conductor 24a and the other end of the coil conductor 24b. As described above, the coil L2 is provided on the nonmagnetic layers 18d and 18e and is not in contact with the magnetic layers 16 and 20. The magnetic layer 16b is provided on the negative direction side in the z-axis direction from the coil L2.
　外部電極１４ａ，１４ｂは、図１に示すように、積層体１２のｙ軸方向の負方向側の側面に設けられている。外部電極１４ａは、外部電極１４ｂよりもｘ軸方向の正方向側に設けられている。外部電極１４ａは、コイル導体２２ｂの一端に接続されている。外部電極１４ｂは、コイル導体２４ａの一端に接続されている。 External electrodes 14a and 14b are provided on the negative side surface of the laminate 12 in the y-axis direction, as shown in FIG. The external electrode 14a is provided on the positive side in the x-axis direction with respect to the external electrode 14b. The external electrode 14a is connected to one end of the coil conductor 22b. The external electrode 14b is connected to one end of the coil conductor 24a.
　外部電極１４ｃ，１４ｄは、図１に示すように、積層体１２のｙ軸方向の正方向側の側面に設けられている。外部電極１４ｃは、外部電極１４ｄよりもｘ軸方向の正方向側に設けられている。外部電極１４ｃは、コイル導体２２ａの一端に接続されている。外部電極１４ｄは、コイル導体２４ｂの一端に接続されている。 The external electrodes 14c and 14d are provided on the side surface on the positive direction side in the y-axis direction of the multilayer body 12, as shown in FIG. The external electrode 14c is provided on the positive side in the x-axis direction with respect to the external electrode 14d. The external electrode 14c is connected to one end of the coil conductor 22a. The external electrode 14d is connected to one end of the coil conductor 24b.
　以上のように、コイルＬ１は、外部電極１４ａ，１４ｃ間に接続されており、コイルＬ２は、外部電極１４ｂ，１４ｄ間に接続されている。 As described above, the coil L1 is connected between the external electrodes 14a and 14c, and the coil L2 is connected between the external electrodes 14b and 14d.
　以上のように構成された電子部品１０では、図２に示すように、磁性体層２０ａ～２０ｅは、所定領域において非磁性体層１８ａ～１８ｅを貫くようにｚ軸方向に延在している。そして、所定領域（すなわち、磁性体層２０ａ～２０ｅ）は、ｚ軸方向から平面視したときに、コイル導体２２ａ，２２ｂ，２４ａ，２４ｂにより囲まれている。すなわち、磁性体層２０ａ～２０ｅは、コイルＬ１，Ｌ２の中心をｚ軸方向に貫通している。これにより、コイルＬ１が発生した磁束が磁性体層２０ａ～２０ｅを通過してコイルＬ２を通過するようになり、コイルＬ２が発生した磁束が磁性体層２０ａ～２０ｅを通過してコイルＬ１を通過するようになる。したがって、コイルＬ１とコイルＬ２とが磁気結合するようになり、コイルＬ１，Ｌ２がコモンモードチョークコイルを構成するようになる。 In the electronic component 10 configured as described above, as shown in FIG. 2, the magnetic layers 20a to 20e extend in the z-axis direction so as to penetrate the nonmagnetic layers 18a to 18e in a predetermined region. . The predetermined regions (that is, the magnetic layers 20a to 20e) are surrounded by the coil conductors 22a, 22b, 24a, and 24b when viewed in plan from the z-axis direction. That is, the magnetic layers 20a to 20e pass through the centers of the coils L1 and L2 in the z-axis direction. Thereby, the magnetic flux generated by the coil L1 passes through the magnetic layers 20a to 20e and passes through the coil L2, and the magnetic flux generated by the coil L2 passes through the magnetic layers 20a to 20e and passes through the coil L1. To come. Therefore, the coil L1 and the coil L2 are magnetically coupled, and the coils L1 and L2 constitute a common mode choke coil.
（電子部品の製造方法）
　次に、電子部品１０の製造方法について図面を参照しながら説明する。図３ないし図６は、電子部品１０の製造時における工程断面図である。なお、図３ないし図６では、一つの電子部品１０の製造時の工程断面図が示されているが、実際には、マザー積層体をカットして複数の積層体１２を同時に形成する。また、図３ないし図６は模式図であるので、実際の各層の厚みとは異なる比率で記載されている。 (Method for manufacturing electronic parts)
Next, a method for manufacturing the electronic component 10 will be described with reference to the drawings. 3 to 6 are process cross-sectional views when the electronic component 10 is manufactured. 3 to 6 show process cross-sectional views at the time of manufacturing one electronic component 10, but actually, the mother laminate is cut to form a plurality of laminates 12 at the same time. 3 to 6 are schematic diagrams, and are described at a ratio different from the actual thickness of each layer.
　まず、図３（ａ）に示すように、厚み１５０μｍ～３００μｍの磁性体層１６ｂを形成する。具体的には、フェライト粉末となるフェライト原料（例えば、Ｎｉ－Ｚｎ系フェライト）を１１００℃以上で完全に焼結して、完全スピネル化する。完全に焼結されたフェライト原料には、Ｆｅ2Ｏ3が残留していない。更に、焼結したフェライト原料をミルにより、平均粒径Ｄ５０が１μｍ以上１００μｍ以下であるフェライト粉末に粉砕する。この後、ガラス粉末（例えば、Ｓｉ系ガラス）と、粉末状の磁性体材料であるフェライト粉末と、バインダー等の有機成分とを混合して磁性体ペーストを作製する。 First, as shown in FIG. 3A, a magnetic layer 16b having a thickness of 150 μm to 300 μm is formed. Specifically, a ferrite raw material (for example, Ni—Zn-based ferrite) that becomes a ferrite powder is completely sintered at 1100 ° C. or more to be completely spineled. Fe 2 O 3 does not remain in the completely sintered ferrite raw material. Further, the sintered ferrite raw material is pulverized by a mill into ferrite powder having an average particle diameter D50 of 1 μm or more and 100 μm or less. Thereafter, glass powder (for example, Si-based glass), ferrite powder that is a powdered magnetic material, and an organic component such as a binder are mixed to prepare a magnetic paste.
　次に、シート（図示せず）上に磁性体ペーストをダイコーターにより塗布する。なお、磁性体ペーストは、スクリーン印刷法により塗布されてもよい。これにより、図３（ａ）に示す磁性体層１６ｂが形成される。 Next, a magnetic paste is applied on a sheet (not shown) by a die coater. The magnetic paste may be applied by a screen printing method. Thereby, the magnetic layer 16b shown in FIG. 3A is formed.
　図３（ａ）に示すように形成した磁性体層１６ｂを８５℃で予備乾燥した後に、１４０℃で熱硬化する。これにより、磁性体層１６ｂは、本工程以降で使用するアルカリ現像液への耐性を確保できる。 3) The magnetic layer 16b formed as shown in FIG. 3A is preliminarily dried at 85 ° C. and then thermally cured at 140 ° C. Thereby, the magnetic body layer 16b can ensure the tolerance to the alkali developing solution used after this process.
　次に、図３（ｂ）に示すように、ビアホールＨ１を有する厚み１０μｍ～２０μｍの非磁性体層１８ｅを磁性体層１６ｂ上に形成する。具体的には、ガラス粉末（例えば、Ｓｉ系ガラス）と、フィラー（例えば、アルミナ等の非磁性のフィラー）と、バインダー等の有機成分とを混合して非磁性体ペーストを作製する。次に、磁性体層１６ｂ上に非磁性体ペーストをスクリーン印刷により塗布する。 Next, as shown in FIG. 3B, a non-magnetic layer 18e having a via hole H1 and having a thickness of 10 μm to 20 μm is formed on the magnetic layer 16b. Specifically, a non-magnetic paste is prepared by mixing glass powder (for example, Si-based glass), a filler (for example, non-magnetic filler such as alumina) and an organic component such as a binder. Next, a non-magnetic paste is applied on the magnetic layer 16b by screen printing.
　次に、図３（ｃ）に示すように、ビアホールＨ１内に磁性体層２０ｅを形成する。具体的には、磁性体層１６ｂと同じ磁性体ペーストをメタルマスクを介してビアホールＨ１内に充填する。 Next, as shown in FIG. 3C, a magnetic layer 20e is formed in the via hole H1. Specifically, the same magnetic paste as that of the magnetic layer 16b is filled into the via hole H1 through a metal mask.
　次に、図３（ｄ）に示すように、コイル導体２４ｂを非磁性体層１８ｅ上に形成する。具体的には、銀等の導電性材料を含有するネガ型の感光性導電性ペーストを７μｍ～１５μｍの厚さで塗布する。そして、フォトマスクを介して露光し、アルカリ現像液によって現像を行う。 Next, as shown in FIG. 3D, the coil conductor 24b is formed on the nonmagnetic layer 18e. Specifically, a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 μm to 15 μm. And it exposes through a photomask and develops with an alkali developing solution.
　次に、図３（ｅ）に示すように、ビアホールＨ２，ｈ２を有する厚み１０μｍ～２０μｍの非磁性体層１８ｄを非磁性体層１８ｅ上に形成する。具体的には、非磁性体層１８ｅに非磁性体ペーストをスクリーン印刷により塗布する。 Next, as shown in FIG. 3 (e), a nonmagnetic layer 18d having via holes H2 and h2 and having a thickness of 10 μm to 20 μm is formed on the nonmagnetic layer 18e. Specifically, a nonmagnetic paste is applied to the nonmagnetic layer 18e by screen printing.
　次に、図４（ａ）に示すように、ビアホールＨ２内に磁性体層２０ｄを形成する。具体的には、磁性体ペーストをメタルマスクを介してビアホールＨ２内に充填する。 Next, as shown in FIG. 4A, a magnetic layer 20d is formed in the via hole H2. Specifically, a magnetic paste is filled into the via hole H2 through a metal mask.
　次に、図４（ｂ）に示すように、ビアホールｈ２にビアホール導体ｖ２を形成すると共に、コイル導体２４ａを非磁性体層１８ｄ上に形成する。具体的には、銀等の導電性材料を含有するネガ型の感光性導電性ペーストを７μｍ～１５μｍの厚さで塗布する。そして、フォトマスクを介して露光し、アルカリ現像液によって現像を行う。 Next, as shown in FIG. 4B, a via hole conductor v2 is formed in the via hole h2, and a coil conductor 24a is formed on the nonmagnetic layer 18d. Specifically, a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 μm to 15 μm. And it exposes through a photomask and develops with an alkali developing solution.
　次に、図４（ｃ）に示すように、ビアホールＨ３を有する厚み１０μｍ～２０μｍの非磁性体層１８ｃを非磁性体層１８ｄ上に形成する。具体的には、非磁性体層１８ｄに非磁性体ペーストをスクリーン印刷により塗布する。 Next, as shown in FIG. 4C, a nonmagnetic material layer 18c having a via hole H3 and having a thickness of 10 μm to 20 μm is formed on the nonmagnetic material layer 18d. Specifically, a nonmagnetic paste is applied to the nonmagnetic layer 18d by screen printing.
　次に、図４（ｄ）に示すように、ビアホールＨ３内に磁性体層２０ｃを形成する。具体的には、磁性体ペーストをメタルマスクを介してビアホールＨ３内に充填する。 Next, as shown in FIG. 4D, a magnetic layer 20c is formed in the via hole H3. Specifically, the magnetic paste is filled into the via hole H3 through a metal mask.
　次に、図４（ｅ）に示すように、コイル導体２２ｂを非磁性体層１８ｃ上に形成する。具体的には、銀等の導電性材料を含有するネガ型の感光性導電性ペーストを７μｍ～１５μｍの厚さで塗布する。フォトマスクを介して露光し、アルカリ現像液によって現像を行う。 Next, as shown in FIG. 4E, the coil conductor 22b is formed on the nonmagnetic layer 18c. Specifically, a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 μm to 15 μm. It exposes through a photomask and develops with an alkali developing solution.
　次に、図５（ａ）に示すように、ビアホールＨ４，ｈ１を有する厚み１０μｍ～２０μｍの非磁性体層１８ｂを非磁性体層１８ｃ上に形成する。具体的には、非磁性体層１８ｃに非磁性体ペーストをスクリーン印刷により塗布する。 Next, as shown in FIG. 5A, a nonmagnetic layer 18b having a thickness of 10 μm to 20 μm having via holes H4 and h1 is formed on the nonmagnetic layer 18c. Specifically, a nonmagnetic paste is applied to the nonmagnetic layer 18c by screen printing.
　次に、図５（ｂ）に示すように、ビアホールＨ４内に磁性体層２０ｂを形成する。具体的には、磁性体ペーストをメタルマスクを介してビアホールＨ４内に充填する。 Next, as shown in FIG. 5B, a magnetic layer 20b is formed in the via hole H4. Specifically, the magnetic paste is filled into the via hole H4 through a metal mask.
　次に、図５（ｃ）に示すように、ビアホールｈ１にビアホール導体ｖ１を形成すると共に、コイル導体２２ａを非磁性体層１８ｂ上に形成する。具体的には、銀等の導電性材料を含有するネガ型の感光性導電性ペーストを７μｍ～１５μｍの厚さで塗布する。そして、フォトマスクを介して露光し、アルカリ現像液によって現像を行う。 Next, as shown in FIG. 5C, a via hole conductor v1 is formed in the via hole h1, and a coil conductor 22a is formed on the nonmagnetic layer 18b. Specifically, a negative photosensitive conductive paste containing a conductive material such as silver is applied in a thickness of 7 μm to 15 μm. And it exposes through a photomask and develops with an alkali developing solution.
　次に、図５（ｄ）に示すように、ビアホールＨ５を有する厚み１０μｍ～２０μｍの非磁性体層１８ａを非磁性体層１８ｂ上に形成する。具体的には、非磁性体層１８ｂに非磁性体ペーストをスクリーン印刷により塗布する。 Next, as shown in FIG. 5D, a non-magnetic layer 18a having a via hole H5 and having a thickness of 10 μm to 20 μm is formed on the non-magnetic layer 18b. Specifically, a nonmagnetic paste is applied to the nonmagnetic layer 18b by screen printing.
　次に、図６（ａ）に示すように、ビアホールＨ５内に磁性体層２０ａを形成する。具体的には、磁性体ペーストをメタルマスクを介してビアホールＨ５内に充填する。 Next, as shown in FIG. 6A, a magnetic layer 20a is formed in the via hole H5. Specifically, a magnetic paste is filled into the via hole H5 through a metal mask.
　次に、図６（ｂ）に示すように、厚み１５０μｍ～３００μｍの磁性体層１６ａをダイコーターにより形成する。更に、図６（ｂ）に示すように形成した磁性体層１６ａを８５℃で予備乾燥した後に、１４０℃で熱硬化する。以上の工程を経て、磁性体層１６，２０及び非磁性体層１８からなるマザー積層体を得る。 Next, as shown in FIG. 6B, a magnetic layer 16a having a thickness of 150 μm to 300 μm is formed by a die coater. Further, the magnetic layer 16a formed as shown in FIG. 6B is preliminarily dried at 85 ° C. and then thermally cured at 140 ° C. Through the above steps, a mother laminate including the magnetic layers 16 and 20 and the nonmagnetic layer 18 is obtained.
　次に、ダイサーによってマザー積層体を所定サイズにカットし、未焼成の積層体１２を得る。カットの際にマザー積層体に形成されるカット溝の幅は、１０μｍ～１００μｍ程度である。この後、未焼成の積層体１２を８００～９００℃、３０～６０分の条件で焼成する。焼成後、積層体１２に対してバレル研磨処理を施して、面取りを行う。 Next, the mother laminate is cut into a predetermined size by a dicer to obtain an unfired laminate 12. The width of the cut groove formed in the mother laminate at the time of cutting is about 10 μm to 100 μm. Thereafter, the unfired laminate 12 is fired under conditions of 800 to 900 ° C. and 30 to 60 minutes. After firing, the laminated body 12 is subjected to barrel polishing to chamfer.
　次に、積層体１２の表面に、例えば、浸漬法等の方法により主成分が銀である電極ペーストを塗布及び焼き付けすることにより、外部電極１４となるべき銀電極を形成する。 Next, a silver electrode to be the external electrode 14 is formed on the surface of the laminate 12 by applying and baking an electrode paste whose main component is silver by a method such as dipping.
　最後に、外部電極１４となるべき銀電極の表面に、Ｎｉめっき／Ｓｎめっきを施すことにより、外部電極１４を形成する。以上の工程を経て、図１に示すような電子部品１０が完成する。 Finally, the external electrode 14 is formed by performing Ni plating / Sn plating on the surface of the silver electrode to be the external electrode 14. Through the above steps, the electronic component 10 as shown in FIG. 1 is completed.
（効果）
　以上のような電子部品１０及びその製造方法によれば、磁性体層１６，２０及び非磁性体層１８を同時に焼成した際にデラミネーションが発生することを抑制できる。より詳細には、電子部品１０では、磁性体層１６，２０は、ガラス粉末とフェライト粉末とバインダー等の有機成分とが混合された磁性体ペーストを用いて形成され、非磁性体層１８は、ガラス粉末とアルミナ等のフィラーとバインダー等の有機成分とが混合された非磁性体ペーストを用いて形成されている。よって、磁性体層１６，２０及び非磁性体層１８は同じ組成のガラスを含有している。そのため、積層体１２の焼成時には、磁性体層１６，２０と非磁性体層１８との界面において、ガラス粉末が溶融し、ガラス同士が融着することで、磁性体層１６，２０と非磁性体層１８とが強固に結合する。その結果、磁性体層１６，２０及び非磁性体層１８を同時に焼成した際にデラミネーションが発生することを抑制できる。 (effect)
According to the electronic component 10 and the manufacturing method thereof as described above, it is possible to suppress the occurrence of delamination when the magnetic layers 16 and 20 and the nonmagnetic layer 18 are simultaneously fired. More specifically, in the electronic component 10, the magnetic layers 16 and 20 are formed using a magnetic paste in which glass powder, ferrite powder, and an organic component such as a binder are mixed, and the nonmagnetic layer 18 is It is formed using a non-magnetic paste in which glass powder, a filler such as alumina, and an organic component such as a binder are mixed. Therefore, the magnetic layers 16 and 20 and the nonmagnetic layer 18 contain glass having the same composition. Therefore, when the laminate 12 is fired, the glass powder is melted at the interface between the magnetic layers 16 and 20 and the nonmagnetic layer 18, and the glasses are fused together. The body layer 18 is firmly bonded. As a result, it is possible to suppress the occurrence of delamination when the magnetic layers 16 and 20 and the nonmagnetic layer 18 are simultaneously fired.
　磁性体層１６，２０と非磁性体層１８とは同じ組成のガラスを含有している。そのため、積層体１２の焼成時における磁性体層１６，２０の収縮率と非磁性体層１８の収縮率とは比較的に近い。そのため、磁性体層１６，２０の収縮率と非磁性体層１８の収縮率との差によって、磁性体層１６，２０及び非磁性体層１８を同時に焼成した際に積層体１２にデラミネーションが発生することが抑制される。 The magnetic layers 16 and 20 and the nonmagnetic layer 18 contain glass having the same composition. Therefore, the shrinkage rate of the magnetic layers 16 and 20 and the shrinkage rate of the nonmagnetic layer 18 at the time of firing the laminate 12 are relatively close. Therefore, due to the difference between the shrinkage rate of the magnetic layers 16 and 20 and the shrinkage rate of the nonmagnetic layer 18, delamination is caused in the laminate 12 when the magnetic layers 16 and 20 and the nonmagnetic layer 18 are simultaneously fired. Occurrence is suppressed.
　また、電子部品１０及びその製造方法では、磁性体層１６，２０では、ガラス中にフェライト粉末が分散された構造をなしている。そのため、磁性体層１６，２０は、フェライト粉末がガラス中に分散されたコンポジット構造をなしている。コンポジット構造をなす磁性体層１６，２０が用いられることにより、コンポジット構造をなしていない磁性体層が用いられた場合に比べて、コイルＬ１，Ｌ２のインダクタンス値が小さくなり、コイルＬ１，Ｌ２の自己共振周波数が高くなる。その結果、コイルＬ１，Ｌ２からなるコモンモードチョークコイルの高周波特性が向上する。 In the electronic component 10 and the manufacturing method thereof, the magnetic layers 16 and 20 have a structure in which ferrite powder is dispersed in glass. Therefore, the magnetic layers 16 and 20 have a composite structure in which ferrite powder is dispersed in glass. By using the magnetic layers 16 and 20 having the composite structure, the inductance values of the coils L1 and L2 are smaller than when the magnetic layer not having the composite structure is used, and the coils L1 and L2 The self-resonant frequency is increased. As a result, the high frequency characteristics of the common mode choke coil including the coils L1 and L2 are improved.
　また、電子部品１０及びその製造方法では、完全焼結したフェライト粉末を用いている。より詳細には、磁性体ペースト及び非磁性体ペーストは、ガラスを含んでいる。そのため、積層体１２をガラスの焼成温度以上の温度で焼成できない。しかしながら、フェライト粉末の焼結温度は、ガラスの溶融温度よりも高い。そこで、電子部品１０及びその製造方法では、予め完全焼結したフェライト粉末とガラスとを磁性体ペーストに混合しておくことで、この磁性体ペーストを用いて形成した積層体をガラスの溶融温度で焼成すればよく、ガラスを含まない磁性体層に比べて焼成温度を低くできる。これにより、ガラスが溶融する温度で積層体１２を焼成したとしても、完全に焼結した状態となっているフェライト粉末を含む積層体１２を得ることができる。その結果、電子部品１０の磁性体層１６，２０は、高い透磁率を得ることが可能となる。 Further, in the electronic component 10 and the manufacturing method thereof, completely sintered ferrite powder is used. More specifically, the magnetic paste and the non-magnetic paste contain glass. Therefore, the laminate 12 cannot be fired at a temperature higher than the firing temperature of the glass. However, the sintering temperature of the ferrite powder is higher than the melting temperature of the glass. Therefore, in the electronic component 10 and the manufacturing method thereof, the ferrite body and the glass that are completely sintered in advance are mixed with the magnetic paste, so that the laminate formed using the magnetic paste is mixed at the melting temperature of the glass. What is necessary is just to calcinate and can make a calcination temperature low compared with the magnetic body layer which does not contain glass. Thereby, even if the laminated body 12 is baked at a temperature at which the glass melts, the laminated body 12 including the ferrite powder in a completely sintered state can be obtained. As a result, the magnetic layers 16 and 20 of the electronic component 10 can obtain high magnetic permeability.
　また、フェライト粉末は完全焼結した状態なので、積層体を焼成する際にフェライト粉末中の成分（例えば、Ｆｅ、Ｃｕ又はＮｉ）が非磁性体層１８に拡散することを抑制できる。その結果、フェライト粉末中の成分が非磁性体層１８に拡散し、コイルＬ１，Ｌ２間の絶縁が破壊されることが抑制されるようになる。 Further, since the ferrite powder is in a completely sintered state, it is possible to suppress the diffusion of components (for example, Fe, Cu, or Ni) in the ferrite powder to the non-magnetic layer 18 when the laminate is fired. As a result, the components in the ferrite powder are diffused into the nonmagnetic layer 18 and the insulation between the coils L1 and L2 is prevented from being broken.
　また、電子部品１０では、磁性体層１６，２０及び非磁性体層１８はそれぞれ、１５体積％以上の割合でガラスを含有している。磁性体層１６，２０及び非磁性体層１８のガラスの含有率が１５体積％以上とすると、磁性体ペースト及び非磁性体ペースト中のフェライト粉末及びフィラーの割合が低くなる。その結果、磁性体ペースト及び非磁性体ペーストの粘度が低くなり、磁性体層１６，２０及び非磁性体層１８を形成することが容易となる。また、ガラスの含有率が１５体積％以上の磁性体ペースト及び非磁性体ペーストを用いて作製された積層体１２では、焼成時にガラス同士が結合し易くなり、積層体１２にクラック（すなわちデラミネーション）が発生しにくくなる。よって、電子部品１０では、磁性体層１６，２０及び非磁性体層１８のガラスの含有率が１５体積％以上が好ましい。 In the electronic component 10, the magnetic layers 16 and 20 and the nonmagnetic layer 18 each contain glass at a ratio of 15% by volume or more. When the glass content of the magnetic layers 16 and 20 and the nonmagnetic layer 18 is 15% by volume or more, the ratio of ferrite powder and filler in the magnetic paste and the nonmagnetic paste decreases. As a result, the viscosity of the magnetic paste and the nonmagnetic paste becomes low, and it becomes easy to form the magnetic layers 16 and 20 and the nonmagnetic layer 18. Further, in the laminate 12 produced using a magnetic paste and a non-magnetic paste having a glass content of 15% by volume or more, the glass is easily bonded to each other at the time of firing, and the laminate 12 is cracked (that is, delamination). ) Is less likely to occur. Therefore, in the electronic component 10, the glass content of the magnetic layers 16 and 20 and the nonmagnetic layer 18 is preferably 15% by volume or more.
　また、磁性体層１６，２０の透磁率を比較的高くすることと、電子部品１０の小型化を図ることとの両立を図るためには、電子部品１０では、フェライト粉末の平均粒径Ｄ５０を１μｍ以上かつ１００μm以下とすることが好ましい。図７は、フェライト粉末の平均粒径と磁性体層の透磁率との関係を示したグラフである。横軸はフェライト粉末の平均粒径を示し、縦軸は磁性体層の透磁率を示している。なお、図７のグラフを得るために行った実験では、ガラス粉末の代わりにエポキシ樹脂を用いた。 In order to achieve both a relatively high magnetic permeability of the magnetic layers 16 and 20 and a reduction in size of the electronic component 10, the electronic component 10 has an average particle diameter D50 of the ferrite powder. The thickness is preferably 1 μm or more and 100 μm or less. FIG. 7 is a graph showing the relationship between the average particle diameter of the ferrite powder and the magnetic permeability of the magnetic layer. The horizontal axis represents the average particle diameter of the ferrite powder, and the vertical axis represents the magnetic permeability of the magnetic layer. In the experiment conducted to obtain the graph of FIG. 7, an epoxy resin was used instead of the glass powder.
　平均粒径の測定方法について説明する。測定にはレーザー解析／散乱式粒子径分布測定装置（装置品番：ＬＡ－９２０　堀場製作所製）を用い、下記の条件の下、フェライト粒径を測定する。
測定条件：相対屈折率１．８０　超音波振動３分　透過率７０％～８０％
溶媒：０．１％ＮａＨMP（ヘキサメタリン酸ナトリウム） A method for measuring the average particle diameter will be described. For the measurement, a ferrite particle size is measured under the following conditions using a laser analysis / scattering particle size distribution measuring device (device number: LA-920, manufactured by Horiba, Ltd.).
Measurement conditions: Relative refractive index 1.80 Ultrasonic vibration 3 minutes Transmittance 70% -80%
Solvent: 0.1% NaHMP (sodium hexametaphosphate)
　図７に示すように、フェライト粉末の平均粒径が大きくなるにしたがって、磁性体層の透磁率が大きくなっていることがわかる。よって、電子部品１０において、磁性体層１６，２０の透磁率を高くするためには、フェライト粉末の平均粒径を大きくすることが好ましい。 As shown in FIG. 7, it can be seen that the permeability of the magnetic layer increases as the average particle size of the ferrite powder increases. Therefore, in the electronic component 10, in order to increase the magnetic permeability of the magnetic layers 16 and 20, it is preferable to increase the average particle diameter of the ferrite powder.
　しかしながら、フェライト粉末の平均粒径を大きくすると、磁性体層１６，２０からフェライト粉末が突出することを防止するために、磁性体層１６，２０の厚みを大きくする必要がある。その結果、電子部品１０の小型化が妨げられてしまう。 However, when the average particle diameter of the ferrite powder is increased, it is necessary to increase the thickness of the magnetic layers 16 and 20 in order to prevent the ferrite powder from protruding from the magnetic layers 16 and 20. As a result, downsizing of the electronic component 10 is hindered.
　そこで、本実施形態では、磁性体層１６，２０の厚みが１５０μｍ～３００μｍであっても、フェライト粉末が磁性体層１６，２０から突出しないように、フェライト粉末の平均粒径Ｄ５０が１００μｍ以下であることが好ましいとした。 Therefore, in the present embodiment, even if the thickness of the magnetic layers 16 and 20 is 150 μm to 300 μm, the average particle diameter D50 of the ferrite powder is 100 μm or less so that the ferrite powder does not protrude from the magnetic layers 16 and 20. Some preferred.
　一方、フェライト粉末の平均粒径Ｄ５０を１μｍ以上にすると、磁性体層１６，２０の透磁率が高くなると共に、磁性体ペーストの粘度が適当な値となり、磁性体層１６，２０を形成することが容易となる。そこで、本実施形態では、フェライト粉末の平均粒径Ｄ５０が１μｍ以上であることが好ましいとした。 On the other hand, when the average particle diameter D50 of the ferrite powder is 1 μm or more, the magnetic layers 16 and 20 have high magnetic permeability and the viscosity of the magnetic paste becomes an appropriate value to form the magnetic layers 16 and 20. Becomes easy. Therefore, in the present embodiment, it is preferable that the average particle diameter D50 of the ferrite powder is 1 μm or more.
（変形例）
　以下に、第１の変形例に係る電子部品１０ａについて図面を参照しながら説明する。図８は、第１の変形例に係る電子部品１０ａの断面構造図である。 (Modification)
Below, the electronic component 10a which concerns on a 1st modification is demonstrated, referring drawings. FIG. 8 is a cross-sectional structure diagram of the electronic component 10a according to the first modification.
　図８に示す電子部品１０ａは、ｚ軸方向の最も正方向側（最上層）に保護層３０ａが設けられており、ｚ軸方向の最も負方向側（最下層）に保護層３０ｂが設けられている。保護層３０ａ，３０ｂは、ガラス粉末とフェライト粉末とが混合された磁性体材料により構成されている。ただし、保護層３０ａ，３０ｂにおけるフェライト粉末の含有率は、磁性体層１６ａ，１６ｂにおけるフェライト粉末の含有率よりも小さい。これにより、フェライト粉末を多量に含有することにより脆くなった磁性体層１６が保護層３０により保護されるようになる。なお、保護層３０ａ，３０ｂは、フェライト粉末を含有していなくてもよい。 In the electronic component 10a shown in FIG. 8, the protective layer 30a is provided on the most positive side (uppermost layer) in the z-axis direction, and the protective layer 30b is provided on the most negative direction side (lowermost layer) in the z-axis direction. ing. The protective layers 30a and 30b are made of a magnetic material in which glass powder and ferrite powder are mixed. However, the ferrite powder content in the protective layers 30a and 30b is smaller than the ferrite powder content in the magnetic layers 16a and 16b. Thereby, the magnetic layer 16 made brittle by containing a large amount of ferrite powder is protected by the protective layer 30. In addition, the protective layers 30a and 30b do not need to contain ferrite powder.
　以下に、第２の変形例に係る電子部品１０ｂについて図面を参照しながら説明する。図９は、第２の変形例に係る電子部品１０ｂの断面構造図である。 Hereinafter, the electronic component 10b according to the second modification will be described with reference to the drawings. FIG. 9 is a sectional structural view of an electronic component 10b according to a second modification.
　図９に示す電子部品１０ｂでは、磁性体層２０が設けられていない。このような構成を有する電子部品１０ｂによれば、電子部品１０と同様に、磁性体層１６と非磁性体層１８とを同時に焼成した際にデラミネーションが発生することを抑制できる。更に、電子部品１０ｂでは、電子部品１０ａに比べて製造プロセスの簡略化を図ることができる。 In the electronic component 10b shown in FIG. 9, the magnetic layer 20 is not provided. According to the electronic component 10b having such a configuration, similarly to the electronic component 10, it is possible to suppress the occurrence of delamination when the magnetic layer 16 and the nonmagnetic layer 18 are simultaneously fired. Furthermore, in the electronic component 10b, the manufacturing process can be simplified as compared with the electronic component 10a.
　以下に，第３の変形例に係る電子部品１０ｃについて図面を参照しながら説明する。図１０は、第３の変形例に係る電子部品１０ｃの断面構造図である。 Hereinafter, an electronic component 10c according to a third modification will be described with reference to the drawings. FIG. 10 is a cross-sectional structure diagram of an electronic component 10c according to a third modification.
　図１０に示す電子部品１０ｃでは、非磁性体層１８の周囲が磁性体層１６，２０により囲まれている。より詳細には、非磁性体層１８のｘ軸方向の両側には磁性体層２０が設けられている。これにより、コイルＬ１，Ｌ２で発生した磁束は、磁性体層１６，２０によって閉磁路を形成するようになる。 In the electronic component 10 c shown in FIG. 10, the periphery of the nonmagnetic layer 18 is surrounded by the magnetic layers 16 and 20. More specifically, the magnetic layer 20 is provided on both sides of the nonmagnetic layer 18 in the x-axis direction. Thereby, the magnetic flux generated in the coils L1 and L2 forms a closed magnetic path by the magnetic layers 16 and 20.
　なお、電子部品１０は、コイル以外の回路素子を内蔵していてもよい。 Note that the electronic component 10 may incorporate a circuit element other than the coil.
　なお、電子部品１０，１０ａ～１０ｃにおいて、磁性体層１６，２０が含有しているガラスの組成と非磁性体層１８が含有しているガラスの組成とは異なっていてもよい。 In the electronic components 10, 10a to 10c, the glass composition contained in the magnetic layers 16, 20 and the glass composition contained in the nonmagnetic layer 18 may be different.
　以上のように、本発明は、電子部品及びその製造方法に有用であり、特に、磁性体層及び非磁性体層を同時に焼成した際にデラミネーションが発生することを抑制できる点において優れている。 As described above, the present invention is useful for an electronic component and a method for manufacturing the same, and particularly excellent in that delamination can be suppressed when the magnetic layer and the nonmagnetic layer are fired simultaneously. .
　Ｌ１，Ｌ２　コイル
　１０，１０ａ～１０ｃ　電子部品
　１２　積層体
　１４ａ～１４ｄ　外部電極
　１６ａ，１６ｂ，２０ａ～２０ｅ　磁性体層
　１８ａ～１８ｅ　非磁性体層
　２２ａ，２２ｂ，２４ａ，２４ｂ　コイル導体
　３０ａ，３０ｂ　保護層 L1, L2 Coils 10, 10a to 10c Electronic parts 12 Laminated bodies 14a to 14d External electrodes 16a, 16b, 20a to 20e Magnetic layers 18a to 18e Nonmagnetic layers 22a, 22b, 24a, 24b Coil conductors 30a, 30b Protective layers

Claims (15)

  1. 　磁性体成分を含有しておらず、かつ、ガラスを含む非磁性体層、及び、少なくともガラス及び磁性体材料が混合されてなる磁性体層が積層されてなる積層体と、
    　前記積層体に内蔵されている回路素子と、
    　を備えていること、
    　を特徴とする電子部品。     A non-magnetic layer containing glass and a non-magnetic layer containing glass, and a laminate in which a magnetic layer formed by mixing at least glass and a magnetic material is laminated;
    A circuit element incorporated in the laminate;
    Having
    Electronic parts characterized by
  2. 　前記非磁性体層に含まれているガラスの組成と前記磁性体層に含まれているガラスの組成とは同じであること、
    　を特徴とする請求項１に記載の電子部品。     The glass composition contained in the non-magnetic layer and the glass composition contained in the magnetic layer are the same;
    The electronic component according to claim 1.
  3. 　前記磁性体層は、前記ガラス中に粉末状の前記磁性体材料が分散された構造をなしていること、
    　を特徴とする請求項１又は請求項２のいずれかに記載の電子部品。     The magnetic layer has a structure in which the powdered magnetic material is dispersed in the glass;
    The electronic component according to claim 1, wherein:
  4. 　前記磁性体層は、前記ガラス及び前記磁性体材料のみからなり、かつ、該ガラスを１５体積％以上の割合で含有していること、
    　を特徴とする請求項１ないし請求項３のいずれかに記載の電子部品。     The magnetic layer is composed of only the glass and the magnetic material, and contains the glass in a proportion of 15% by volume or more.
    The electronic component according to any one of claims 1 to 3, wherein:
  5. 　前記非磁性体層は、前記ガラス及びフィラーが混合されてなること、
    　を特徴とする請求項１ないし請求項４のいずれかに記載の電子部品。     The nonmagnetic layer is a mixture of the glass and filler,
    The electronic component according to claim 1, wherein:
  6. 　前記非磁性体層は、前記ガラス及び前記フィラーのみからなり、かつ、該ガラスを１５体積％以上の割合で含有していること、
    　を特徴とする請求項５に記載の電子部品。     The nonmagnetic layer is composed of only the glass and the filler, and contains the glass in a proportion of 15% by volume or more.
    The electronic component according to claim 5.
  7. 　前記磁性体材料は、平均粒径Ｄ５０が１μｍ以上１００μｍ以下である粉末からなること、
    　を特徴とする請求項１ないし請求項６のいずれかに記載の電子部品。     The magnetic material is made of a powder having an average particle diameter D50 of 1 μm or more and 100 μm or less,
    The electronic component according to claim 1, wherein:
  8. 　前記磁性体材料は、完全スピネル化した焼結フェライト粉末であること
    　を特徴とする請求項１ないし請求項７のいずれかに記載の電子部品。     The electronic component according to any one of claims 1 to 7, wherein the magnetic material is a completely spineled sintered ferrite powder.
  9. 　前記積層体の最上層及び最下層に設けられ、かつ、前記磁性体層における前記磁性体材料の含有率よりも低い含有率で磁性体材料を含有している、又は、磁性体材料を含有していない保護層を、
    　更に備えていること、
    　を特徴とする請求項１ないし請求項８のいずれかに記載の電子部品。     It is provided in the uppermost layer and the lowermost layer of the laminate, and contains a magnetic material at a lower content than the content of the magnetic material in the magnetic layer, or contains a magnetic material. Not protective layer,
    More
    The electronic component according to claim 1, wherein:
  10. 　前記回路素子がコイルであること、
    　を特徴とする請求項１ないし請求項９のいずれかに記載の電子部品。     The circuit element is a coil;
    The electronic component according to claim 1, wherein:
  11. 　前記回路素子が、第１のコイル及び第２のコイルからなるコモンモードチョークコイルであること、
    　を特徴とする請求項１ないし請求項１０のいずれかに記載の電子部品。     The circuit element is a common mode choke coil including a first coil and a second coil;
    The electronic component according to claim 1, wherein:
  12. 　磁性体成分を含有しておらず、かつ、ガラスを含む非磁性体層、及び、少なくともガラス及び磁性体材料が混合されてなる磁性体層が積層されてなる積層体を作製する工程と、
    　前記積層体を焼成する工程と、
    　を備えていること、
    　を特徴とする電子部品の製造方法。     A step of producing a laminate in which a magnetic material component is not contained and a nonmagnetic material layer containing glass and a magnetic material layer in which at least glass and a magnetic material are mixed are laminated;
    Firing the laminate;
    Having
    A method of manufacturing an electronic component characterized by the above.
  13. 　前記非磁性体層に含まれているガラスの組成と前記磁性体層に含まれているガラスの組成とは同じであること、
    　を特徴とする請求項１２に記載の電子部品の製造方法。     The glass composition contained in the non-magnetic layer and the glass composition contained in the magnetic layer are the same;
    The method of manufacturing an electronic component according to claim 12.
  14. 　前記磁性体材料となる原料を、平均粒径Ｄ５０が１μｍ以上１００μｍ以下となるように粉砕して粉末状の該磁性体材料を作製する工程を、
    　更に備えており、
    　前記積層体を作製する工程では、粉末状の前記磁性体材料を用いて、前記磁性体層を作製すること、
    　を特徴とする請求項１２又は請求項１３のいずれかに記載の電子部品の製造方法。     Pulverizing the raw material to be the magnetic material so that the average particle diameter D50 is 1 μm or more and 100 μm or less, and producing the powdered magnetic material material,
    In addition,
    In the step of producing the laminate, the magnetic layer is produced using the powdered magnetic material,
    The method of manufacturing an electronic component according to claim 12, wherein the electronic component is manufactured as follows.
  15. 　前記磁性体材料となる原料を、焼成して完全スピネル化する工程を、
    　更に備えていること、
    　を特徴とする請求項１４に記載の電子部品の製造方法。     The step of firing the raw material to be the magnetic material into a complete spinel,
    More
    The method of manufacturing an electronic component according to claim 14.
PCT/JP2011/062501 2010-07-09 2011-05-31 Electronic component and process for producing same WO2012005069A1 (en)

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