WO2011159727A1 - Method, system and apparatus for making short run radio frequency identification tags and labels - Google Patents
Method, system and apparatus for making short run radio frequency identification tags and labels Download PDFInfo
- Publication number
- WO2011159727A1 WO2011159727A1 PCT/US2011/040391 US2011040391W WO2011159727A1 WO 2011159727 A1 WO2011159727 A1 WO 2011159727A1 US 2011040391 W US2011040391 W US 2011040391W WO 2011159727 A1 WO2011159727 A1 WO 2011159727A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- supply
- adhesive
- information
- cutting
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/10—Fibres of continuous length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/00—Metal working
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/5317—Laminated device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
Definitions
- the present invention is found in the field of manufacturing radio frequency identification (“RFID”) devices. More particularly the present invention relates to a method, system and apparatus for producing RFID tags, labels, tickets, brochures and other printed materials in short production runs.
- RFID radio frequency identification
- RFID devices can be produced in a number of different methods and commonly include some sort of chip attachment to an antenna which is then used to make an RFID device.
- the chip can be attached either through the use of a strap or may be applied directly to the antenna.
- the antenna is a conductive material which may be produced by etching, die cutting or printing of conductive ink on a substrate.
- Conductive laminates such as foil laminates are used in a number of applications, ranging from containers for microwave packages to smart cards. Such laminates have regularly been created by die cutting, stamping, and other mechanical processes that generally lend themselves well to high speed situations in which a relatively simple shape or pattern can be created.
- This method includes the steps of providing a reinforced metal foil laminate, having a metal foil layer bonded to a reinforcement layer, and a carrier layer bonded to the metal foil laminate.
- the method includes the step of using a rotary die cutter to cut an antenna pattern through the metal foil laminate to the carrier layer.
- the method concludes by removing an undesired matrix portion of the reinforced metal foil laminate to provide a metal foil laminate antenna disposed on the carrier layer.
- a rotary die cutter has been used to produce various structures because it is both fast and inexpensive.
- rotary die cutters have poor resolution and are currently limited to having a minimum distance between cut lines of about 1 mm.
- An additional problem with using a rotary die cutter to cut a construction requiring high precision and tolerance is that the cylindrical die used by the rotary die cutter cannot be quickly or easily changed. Accordingly, the design is not readily changeable, and thus it is often not economically feasible to produce small batches of a particular design because of the need to constantly change out die heads.
- any change in design would require a large lead-time, as a new cylindrical die must be manufactured each time the design is changed. This can create a large inventory of die heads, the storage of which can occupy valuable factory floor space.
- the present invention provides a method, system and apparatus for producing RFID devices in small batches or a short run format and in a collocated environment with a consumer goods production facility.
- a method for producing a ready to use RFID device for consumer goods includes the steps of providing a substrate, with the substrate having first and second faces. Then applying a pattern of adhesive to the first face of the substrate and laminating a conductive foil to the pattern of adhesive. Next, the conductive foil is cut to form to form a plurality of antenna patterns. A chip is applied to each of the antenna patterns. Then, printing is applied on the second face of the substrate to create distinct printed areas. Each of the chips is encoded and placed on each of the antenna patterns. Each of the distinct printed areas is read and the information is matched with each of the distinct printed areas to information encoded in each of the chips. Finally, each of the distinct printed areas are separated from the substrate.
- an apparatus for producing a ready to use RFID device for consumer goods includes a supply of material and a supply of conductive material.
- An adhesive coating station for applying a pattern of adhesive to the supply of material.
- a laminating station for laminating the supply of conductive material to the pattern of adhesive.
- a first cutting device for cutting an antenna pattern in the conductive material.
- a first printing device for printing human and or machine readable indicia on the supply of material.
- a chip placement device for placing a chip on the antenna pattern to form an RFID device and an encoding station for encoding information on to the chip.
- the apparatus also includes a computer for comparing the information the encoded information with the human and/or machine readable indicia.
- an intermediate assembly of a plurality of ready to use RFID devices for consumer goods includes a substrate that has a plurality of distinct antenna patterns, with each antenna pattern including a conductive foil formed by one of laser cutting or cold foil processing.
- a pattern of adhesive is coextensive with the antenna pattern and a substrate on which the adhesive pattern and antenna pattern are disposed.
- a plurality of chips with each of the chips being encoded with information and each of the chips is connected to one of the plurality of antenna patterns.
- a plurality of printed areas provided on the substrate, each of the printed areas in association with one of the plurality of antenna patterns forming an RFID device. The printed indicia matches the information encoded on each of the plurality of chips.
- Each of the RFID devices is removable from the substrate to form a plurality of ready to use RFID devices.
- a system for producing ready to use RFID devices includes a manufacturing location for producing consumer goods.
- a computer for determining types of consumer goods being produced and for providing instructions for creating and encoding RFID devices for use in association with the consumer goods.
- an RFID production unit is provide for use with the system, the RFID production unit including a supply of material and a supply of conductive material.
- An adhesive coating station for providing an adhesive pattern.
- a laminating station for laminating the conductive material to the adhesive pattern.
- a cutting station for cutting an antenna pattern to substantially match the adhesive pattern.
- a chip attaching station for attaching the chip to the antenna pattern.
- a printing station for printing human and or machine readable indicia on the supply of material.
- a reader for reading information encoded on the chip and for matching the information to the human and or machine readable indicia.
- the RFID production unit and manufacturing location are collocated with one another.
- FIGURE 1 depicts a front view of an exemplary intermediate assembly produced in accordance with the method and system of the present invention
- FIGURE 2 provides a schematic of an exemplary apparatus used in connection with practicing the present invention
- FIGURE 3 shows a schematic of an exemplary system used in connection with practicing the present invention.
- FIGURE 4 illustrates a block diagram setting forth an exemplary method of practicing the present invention.
- the present invention provides for the production of small batches of RFID devices, that can be produced in short runs, production runs ranging from one RFID device to perhaps a thousand separate units.
- the method, apparatus and system of the present invention can be used to create a plurality of individual RFID devices that can either change device configuration from device to device or may produce a specific number of a particular unit, then change configurations to complete a particular order requested by an end user. For example, a customer may request fifty units of a first type of RFID device and then 100 units of a second type of RFID device.
- FIGURE 1 of the present invention shows an intermediate 10.
- the term intermediate refers to a product that undergoes one or more processing steps in order to provide a finished product.
- a plurality of discrete or distinct printed areas 12, 20 and 30 that include RFID devices are provided on a sheet 11 which may subsequently be severed or otherwise removed from the sheet.
- Certain RFID devices, such as 20 which is a label may have an adhesive coating (not shown) applied prior to being used.
- RFID device 12 may undergo a folding step along fold line 18 and then an attaching step to connect the device 12 to a consumer good.
- the discrete or distinct printed areas distinct printed areas 12, 20 and 30 are selected from a group including tags, labels, hang tags, badges, shelf talkers, flyers, brochures, marketing collateral, tickets, cards and combinations thereof.
- Sheet 11 has a front face which is shown in FIGURE 1 and a rear face which is not shown.
- the sheet 11 is provided with indicia and in this example includes machine readable information 40 and an RFID device 42.
- the indicia 40 and RFID device 42 can be used to help track a particular job or production order or to provide instructions to the apparatus to produce the particular order being contemplated.
- the code and RFID device can be read by machine such as a bar code scanner or RFID reader.
- the intermediate 10, still referring to FIGURE 1, as previously indicated includes the sheet 11 and several distinct printed areas 12, 20 and 30 to be used for a particular application.
- First area, or hang tag intermediate 12 in this example shows human readable indicia 14 and machine readable indicia 15 (bar code) on a first side and a RFID antenna 16 and chip 17 on the second side.
- the human and machine readable indicia as shown may relate to retailer information, brand information, pricing or any information that the particular customer requires.
- the two sides are separated by a fold line 18.
- Tag 12 is held to the sheet 11 by a series of ties 19 which are created when the sheet 11 is perforated around the perimeter of the tag.
- the perforations 19 are shown extending around the perimeter and can be easily broken so as to separate the tag 12 from the sheet 11 and then subject to further processing, e.g. folding and attaching to a consumer good.
- the next distinct printed area 20 shown in FIGURE 1 is depicted as a label intermediate.
- the label intermediate 20 again has human readable indicia 21 and machine readable indicia 22 which again can relate to any information that has been requested by the customer for whom the order is being created.
- the label intermediate 20 also has an RFID device 23. It should be pointed out that the RFID device 23 of label intermediate 20 is different than the RFID device 16/17 of hang tag intermediate 12 further illustrating the flexibility of the present invention. That is, one intermediate assembly can have a first RFID device design and another intermediate assembly can have a different RFID device design.
- the label intermediate 20 is also held in place in the sheet 11 by a series of ties 24 which again allow for the label intermediate 20 to be readily and easily separated from the sheet 11 when required for use or further processing.
- the final intermediate assembly 30 shown on sheet 11 of FIGURE 1, provides a high frequency (HF) RFID label. This is further distinct from the RFID devices shown in connection with distinct printed areas 12 and 20, which for example may be ultra high frequency labels (UHF).
- the HF device includes a plurality of coil windings 31 and a chip/bridge 32 connecting each end of the coil to complete the circuit.
- FIGURE 2 Reference is now directed to FIGURE 2 of the presently described invention.
- the schematic starts with a supply of material 50.
- the supply of material 50 may be selected from one of paper, woven fabric, non-woven fabric or plastic. While the supply of material 50 has been depicted as a continuous roll of material, it should be understood that the supply may consist of one or more pre- cut sheets and, the invention may be practiced in a sheet feed configuration.
- the supply of material or web 50 is fed to an adhesive applicator 52.
- the adhesive which may be a pressure sensitive or other suitable adhesive, can be applied in a pattern that will be in the shape or form of the antenna used for the FID device that will be formed as seen in connection with FIGURE 1 of the intermediate sheet or may be full or flood coated on to the supply 50 which will then later undergo a curing process to create tacky and non-tacky areas, with the tacky areas corresponding to the antenna patterns that are to be created.
- the curing can be done by UV energy or other suitable process.
- the adhesive may include optical brighteners.
- the optical brighteners are a fluorescent powder that is approximately 1% by weight of the adhesive and more preferably about .5% by weight of the adhesive.
- Other triggers or signals can be used to initiate the laser and register the patterns to be formed in the web such as cuts or slits in the web, taggant inks, printing inks and the like.
- the optical brighteners may be provided in the area where the cutting of at least one pattern for a foil or conductive laminate is to occur in the foil laminate layer.
- the optical brighteners may be printed on top of the adhesive layer rather than mixed within the adhesive layer. Additionally, it is contemplated by the present invention that the optical brighteners may be printed on top of the substrate as opposed to mixed or on top of the adhesive layer. In this embodiment, it is preferred that the adhesive layer is clear or transparent so that the optical brighteners may be seen through the adhesive layer.
- optical brighteners may be printed in the shape of the foil or conductive laminates that are going to be constructed out of the foil or conductive layer or material.
- a supply of conductive material 54 such as a foil, alloy or conductive ink on a transfer sheet is passed to be in juxtaposition with the first supply 50.
- the conductive material 54 is then laminated in part to the supply 50 by laminating station 56.
- the partial lamination occurs only the in the areas of the adhesive pattern or the tacky portions of the adhesive pattern.
- the foil creates a 100% fully recyclable material when removed as the foil is not contaminated with adhesive or has portions of the substrate connected to the foil.
- the combined web 57 is then fed to a cutting or antenna forming station 58.
- the cutting or forming may be accomplished by one of die cutting, laser cutting or cold foil processing.
- the cutting or forming station may also have multiple elements, such as a first die cutting or cold foil process and then laser cutting.
- an exemplary cold foil process refers to printing an adhesive or other curable pattern onto a substrate then applying a foil layer over the pattern, laminating the foil to the pattern so that the foil sticks to the pattern and then stripping away the foil, leaving the pattern on the substrate covered with the foil layer.
- the remaining matrix of material is rewound at station 60.
- the now partially laminated web 57 partially laminated as it has the conductive patterns of material adhered to the supply 50, but the remaining amount of material has been removed.
- the web 57 then moves the chip or strap placement station 62 where a chip or strap is placed on the antenna to complete the assembly of the RFID device.
- the RFID device (chip or strap) is encoded at station 64 with information relating to the product to which the discrete printed area (see FIGURE 1) is to be associated (attached, adhered, etc.)
- the web 57 then travels to a printing station 66 where human and or machine readable indicia is provided on the web (see FIGURE 1).
- the indicia is printed in each of the discrete areas and may also be printed on the margins of the web.
- the encoded RFID devices and indicia are read and/or scanned, respectively at station 68.
- the discrete printed area is discarded into discard area 70. This may be accomplished by punching out the discrete printed area such as by a rotary punch, plunger or other suitable device.
- Each of the discrete areas are then collected at station 74 and may then be shipped or otherwise delivered to the end user that requested the particular order.
- the system 100 includes a first location 110, such as a customer location, which may be a company headquarters, distribution or procurement location or other site where ordering and processing products is performed.
- the first location 110 is connected via a global communications network 120 to a second location 130, which may include for example assets for producing consumer products 150 and an RFID production unit 140.
- a second location 130 which may include for example assets for producing consumer products 150 and an RFID production unit 140.
- both the RFID production unit 140 and the consumer products manufacturing assets 150 are collocated, but it should be understood that the two units 140 and 150 may be at distinct physical locations but connected by a communications systems to allow the units to easily and readily communicate with one another.
- the system 100 of the present invention will start with an order for consumer goods or other products emanating the first location or customer location 110.
- the order will be sent the global communications network 120 to the second location 130 that houses, in this example, both the RFID production unit 140 and the assets 150 that are used in the manufacturing the product that is the subject of the order generated by the first location 110.
- the order will be received by the second location 130 which will commence a sequence of generation of intermediates as provided in FIGURE 1, as well as the production of consumer goods or other products.
- the discrete printed areas of FIGURE 1 are separated and attached to the consumer goods or other products.
- the attachment includes the removal of each of the discrete printed areas that are held by ties as discussed above in the sheet of the intermediate, and then connected to the consumer goods such as by adhering, affixing, or otherwise attaching.
- the goods can then be shipped to the first location 110 or to another location that has been designated in the order that initiated the sequence.
- FIGURE 4 a block diagram showing an exemplary method of producing a finished RFID device or intermediate (as shown in FIGURE 1) is provided.
- the process commences for example at step 210 in which a supply of material is provided.
- the supply of material can be provided in either a continuous format, such as a roll of material, or in a cut sheet format, where a stack of sheets are provided to the apparatus to provide the supply.
- the supply of material may have a plurality of antennas for use in forming the RFID devices.
- the antennas that are provided may have a generic pattern that will need to be further cut or modified in order to produce the final antenna pattern that is sought.
- a supply of blank material can be provided and conductive material then subsequently adhered and attached to the substrate to make the antenna supply.
- antenna structure can be further modified such as by cutting with a laser cutter or mechanical die cutter.
- a large pre-formed stock can be created that can be tailored to meet a number of applications thereby meeting the needs of a large number of customer applications.
- the assembly created using the apparatus of FIGURE 2 can be fed into the process of FIGURE 4 and further modified as described above by laser cutting.
- FIGURE 4 provides for the processing of a particular supply of material and that the apparatus used in connection with the forming of the intermediates, including the steps of applying an adhesive, creating a pattern, laminating a foil layer to the adhesive pattern, cutting of the pattern and other associated steps are intended to be included in the present method and that for the sake of brevity the steps are not necessarily repeated herein.
- a first printing of fixed indicia can occur.
- this printing can include such things as the name of the retailer, or other information that does not change from tag to tag.
- variable information is provided to the material.
- the variable information may for example be a size, color, price or such other information that may change from tag to tag.
- the information contained in the variable information 230 is verified by scanning, or other reading of the information.
- the information can be both human and machine readable indicia.
- the printing that is provided can be accomplished by any number of suitable printing methods, such as non-impact, e.g. ink jet, ion deposition, laser printing, impact printing, thermal transfer or such other process as may be requested by the consumer or may lend itself to the production of intermediates and tags/labels as required herein.
- suitable printing methods such as non-impact, e.g. ink jet, ion deposition, laser printing, impact printing, thermal transfer or such other process as may be requested by the consumer or may lend itself to the production of intermediates and tags/labels as required herein.
- step 240 RFID chips which may also be provided in a strap configuration are fed to the supply of material. Then each of the chips or chips with straps are encoded at step 245 with information that corresponds to the variably printed information and, when required also the fixed information provided earlier in the process. That is, as each discrete portion of the supply as shown in FIGURE 1 is provided with unique indicia, the chips are also encoded with unique indicia relating to the products with which the RFID chips are to be associated.
- the chips or chips in a strap format are provided to the supply of material and attached at step 250.
- the chips/straps are attached in registry with the chip attachment point of the antenna.
- the supply of material is plow folded or sealed at step 255. That is, with respect to plow folding, one panel is folded over on top of the other so as to create a closure assembly.
- an adhesive may be applied to the web and sealed to the web.
- the adhesive may be applied as part of a transfer tape construction, adhesive and liner. In a transfer tape configuration, the adhesive will have a greater affinity for the supply of material as opposed to the liner such that the adhesive will remain with the supply of material and not the liner when the adhesive is needed for use.
- the final format of the discrete areas to be created is done at step 260, and an area around the FID device and printing is created to facilitate separation later as shown in FIGURE 1.
- the encoding of the RFID chips and printing is verified to ensure that the RFID chips and printing correspond to one another. If there is no match between the encoded information on the chips and the information printed on the tags, the tags or discrete printed areas can be removed from the supply of material or alternatively can be marked so show that the tag is defective so that it will not be used at a later time.
- step 270 the discrete printed areas or now tags or labels are collected so that they can be shipped or delivered at step 275 to the manufacturing location where the consumer goods and the RFID production device are located.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Credit Cards Or The Like (AREA)
- Making Paper Articles (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Radar Systems Or Details Thereof (AREA)
- Circuits Of Receivers In General (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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ES11739207T ES2735236T3 (en) | 2010-06-14 | 2011-06-14 | Method and apparatus of manufacturing labels and radiofrequency identification tags in short runs |
EP11739207.6A EP2580715B1 (en) | 2010-06-14 | 2011-06-14 | Method, system and apparatus for making short run radio frequency identification tags and labels |
CN201180029487.0A CN102939610B (en) | 2010-06-14 | 2011-06-14 | RFID tags and the mthods, systems and devices of label is manufactured for small lot |
BR112012032009A BR112012032009B8 (en) | 2010-06-14 | 2011-06-14 | METHOD FOR PRODUCING AN RFID DEVICE, APPARATUS FOR THE PRODUCTION OF AN RFID DEVICE, INTERMEDIATE SET OF RFID DEVICES, INTERMEDIATE AND SYSTEM FOR THE PRODUCTION OF RFID DEVICES |
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PCT/US2011/040386 WO2011159722A2 (en) | 2010-06-14 | 2011-06-14 | Method of manufacturing conductive structures |
PCT/US2011/040383 WO2011159720A1 (en) | 2010-06-14 | 2011-06-14 | Foil laminate intermediate and method of manufacturing |
PCT/US2011/040391 WO2011159727A1 (en) | 2010-06-14 | 2011-06-14 | Method, system and apparatus for making short run radio frequency identification tags and labels |
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PCT/US2011/040386 WO2011159722A2 (en) | 2010-06-14 | 2011-06-14 | Method of manufacturing conductive structures |
PCT/US2011/040383 WO2011159720A1 (en) | 2010-06-14 | 2011-06-14 | Foil laminate intermediate and method of manufacturing |
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US (9) | US8981936B2 (en) |
EP (5) | EP2711173B1 (en) |
CN (5) | CN102939610B (en) |
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